WO2022007422A1 - 一种具有大电流、低引线电阻封接电磁继电器外壳 - Google Patents

一种具有大电流、低引线电阻封接电磁继电器外壳 Download PDF

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WO2022007422A1
WO2022007422A1 PCT/CN2021/078394 CN2021078394W WO2022007422A1 WO 2022007422 A1 WO2022007422 A1 WO 2022007422A1 CN 2021078394 W CN2021078394 W CN 2021078394W WO 2022007422 A1 WO2022007422 A1 WO 2022007422A1
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lead
sealing
bottom plate
electromagnetic relay
auxiliary
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PCT/CN2021/078394
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English (en)
French (fr)
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郑学军
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青岛凯瑞电子有限公司
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Publication of WO2022007422A1 publication Critical patent/WO2022007422A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/02—Bases; Casings; Covers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/02—Bases; Casings; Covers
    • H01H50/023—Details concerning sealing, e.g. sealing casing with resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/12—Ventilating; Cooling; Heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/14—Terminal arrangements

Definitions

  • the invention relates to an electromagnetic relay casing, in particular to a sealed electromagnetic relay casing with large current and low lead resistance.
  • this type of shell is partially encapsulated in plastic, and the performance parameters cannot meet the national military standards. Some of them are sealed with glass, and the lead wires of Kovar have high resistivity and poor heat dissipation. For relays with large switching load currents, the lead wires need to be designed to have a large cross-sectional area to meet the electrical and thermal conductivity requirements of the relay.
  • the present invention presents a sealed electromagnetic relay housing with high current and low lead resistance.
  • An electromagnetic relay casing with high current and low lead resistance sealed comprising a ceramic base plate, a metal ring, a sealing cap, a main lead and an auxiliary lead, the ceramic base plate and the metal ring are connected by means of a vertical sealing structure, and the vertical sealing structure has Smaller sealing area, less sealing stress, plasma or laser welding of metal ring and cap; main lead and main lead through ceramic base plate sealing hole, Kovar collar brazing between main lead and ceramic The upper and lower end faces of the bottom plate, the contact segments are brazed and connected to the lower end of the main lead; the auxiliary lead passes through the auxiliary lead sealing hole of the ceramic bottom plate, and the edge of the auxiliary lead sealing hole is chamfered, and the chamfer can reduce the gap between the ceramic bottom plate and the auxiliary lead. Sealing stress, solder connection auxiliary lead and ceramic base plate.
  • the material of the ceramic bottom plate is a doped modified 94% alumina ceramic.
  • the main lead is made of oxygen-free copper material, which has good thermal conductivity and electrical conductivity. Since the linear expansion coefficient of oxygen-free copper is very different from that of ceramics, the oxygen-free copper used as the lead cannot be compared with the ceramic bottom plate. Direct sealing, can be transitioned to ceramic sealing with Kovar collars.
  • auxiliary lead adopts copper core Kovar.
  • the metal ring is made of 4J42 material.
  • solder for the brazing connection is AgCu28.
  • brazing material is filled into the chamfered 1/2 to 3/5 of the edge of the sealing hole of the auxiliary lead to form a tensile angle between the ceramic and the lead, so as to improve the sealing strength of the lead and the ceramic bottom plate.
  • the shell of the electromagnetic relay with high current and low lead resistance designed by the present invention conforms to the national military standard, adopts metal shell, has better heat dissipation performance and higher strength;
  • the main lead is made of oxygen-free copper material, and oxygen-free copper has Good thermal conductivity and electrical conductivity;
  • the ceramic bottom plate material is doped and modified 94% alumina ceramics, which has good conductivity, mechanical strength and high temperature resistance.
  • the electromagnetic relay shell designed by the invention has high current and low lead resistance.
  • the ceramic bottom plate and the metal ring are connected by vertical sealing structure by brazing.
  • the vertical sealing structure has a smaller sealing area and less sealing stress.
  • the edge of the auxiliary lead sealing hole is chamfered, and the chamfering can reduce the sealing stress between the ceramic bottom plate and the auxiliary lead.
  • Fig. 1 is a kind of half-section schematic diagram of sealing electromagnetic relay housing with high current and low lead resistance
  • Fig. 2 is an enlarged view of part A of the electromagnetic relay housing with high current and low lead resistance sealing;
  • Fig. 3 is an enlarged view of the main lead of a housing with a large current and low lead resistance sealing the electromagnetic relay;
  • FIG. 4 is an enlarged view of an auxiliary lead wire with a large current and low lead wire resistance sealing the electromagnetic relay casing.
  • Ceramic base plate 11. Metal ring; 12. Sealing cap; 13. Main lead sealing hole; 14. Auxiliary lead sealing hole; 2. Main lead; 21. Kovar collar; 22. Contact segment ; 23. Soldering points at the Kovar collar; 24. Soldering points at the contact segment; 3. Auxiliary leads; 31. Edge chamfering; 32. Edge chamfering 1/2 to 3/5.
  • a sealed electromagnetic relay housing with high current and low lead resistance includes a ceramic bottom plate 1, a metal ring 11, a sealing cap 12, a main lead 2 and an auxiliary lead 3.
  • the ceramic bottom plate 1 is connected to
  • the metal ring 11 is connected by brazing with a vertical sealing structure.
  • the vertical sealing structure has a smaller sealing area and less sealing stress.
  • the metal ring 11 and the sealing cap 12 are plasma or laser welded; the main lead 2 is connected to the ceramic bottom plate 1.
  • the main lead sealing hole 13, the Kovar collar 21 is brazed and connected to the upper and lower end surfaces of the main lead 2 and the ceramic bottom plate 1, the brazing point is 23, and the contact segment 22 is brazed and connected to the lower end of the main lead 2; auxiliary lead 3 Passing through the auxiliary lead sealing hole 14 of the ceramic base plate 1, the edge of the auxiliary lead sealing hole 14 is chamfered 31, the chamfering can reduce the sealing stress between the ceramic base plate 1 and the auxiliary lead 3, and the auxiliary lead 3 is connected by soldering and ceramic baseplate 1.
  • the material of the ceramic base plate 1 is doped modified 94% alumina ceramics.
  • the solder joints 23 at the Kovar collar, the solder joints 15 at the vertical sealing structure and the solder joints 24 at the contact segment all use AgCu28 as the solder.
  • the main lead 2 is made of oxygen-free copper material. Oxygen-free copper has good thermal conductivity and electrical conductivity. Because the linear expansion coefficient of oxygen-free copper is very different from that of ceramics, the oxygen-free copper used as the lead cannot be directly sealed with the ceramic bottom plate. It can be connected to the ceramic through the transition of the Kovar collar 21.
  • the auxiliary lead 3 adopts copper core Kovar.
  • the metal ring is made of 4J42 material.
  • the brazing solder is filled to 1/2 to 3/5 of the edge chamfer 32 of the auxiliary lead sealing hole 14, and a tensile angle is formed between the ceramic and the lead, and the sealing strength of the lead and the ceramic base plate is improved.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)

Abstract

本发明涉及电磁继电器外壳，具体涉及一种具有大电流、低引线电阻封接电磁继电器外壳，包括陶瓷底板、金属环、主引线和辅助引线，陶瓷底板与金属环采用立封结构钎焊连接，立封结构有更小的封接面积，较小的封接应力，金属环与封帽等离子或激光焊接；主引线与穿过陶瓷底板的主引线封接孔，可伐套环钎焊连接在主引线和陶瓷底板的上下端面，触点段钎焊连接在主引线下端；辅助引线穿过陶瓷底板的辅助引线封接孔，辅助引线封接孔的边缘倒角，倒角能减小陶瓷底板与辅助引线间封接应力，钎焊连接辅助引线和陶瓷底板。本发明设计符合国家军用标准，采用金属外壳，散热性能更好，强度更高；主引线采用无氧铜材料，无氧铜具备良好的导热、导电性能。

Description

一种具有大电流、低引线电阻封接电磁继电器外壳 技术领域
本发明涉及电磁继电器外壳，特别涉及一种具有大电流、低引线电阻封接电磁继电器外壳。
背景技术
目前，该类外壳部分采用塑料封装，各性能参数无法达到国家军用标准。部分采用玻璃封接，可伐引线的电阻率大、散热差，对于切换负载电流大的继电器，引线需要设计成截面积较大的状态才能满足继电器导电、导热的需求。
发明内容
为解决背景技术中提到的问题，本发明展示了一种具有大电流、低引线电阻封接电磁继电器外壳。
为实现上述目的，现提供技术方案如下：
一种具有大电流、低引线电阻封接电磁继电器外壳，包括陶瓷底板、金属环、封帽、主引线和辅助引线，所述陶瓷底板与金属环采用立封结构钎焊连接，立封结构有更小的封接面积，较小的封接应力，金属环与封帽等离子或激光焊接；主引线与穿过陶瓷底板的主引线封接孔，可伐套环钎焊连接在主引线和陶瓷底板的上下端面，触点段钎焊连接在主引线下端；辅助引线穿过陶瓷底板的辅助引线封接孔，辅助引线封接孔的边缘倒角，倒角能减小陶瓷底板与辅助引线间封接应力，钎焊连接辅助引线和陶瓷底板。
进一步的，陶瓷底板材料为掺杂改性94％氧化铝陶瓷。
进一步的，主引线采用无氧铜材料，无氧铜具备良好的导热、导电性能，由于无氧铜的线胀系数与陶瓷的线胀系数差别很大，作为引线的无氧铜不能与陶瓷底板直接封接，可通过可伐套环过渡与陶瓷封接。
进一步的，辅助引线采用铜芯可伐。
进一步的，金属环采用4J42材料。
进一步的，所述钎焊连接的焊料为AgCu28。
进一步的，钎焊焊料填充到辅助引线封接孔的边缘倒角1/2到3/5处，陶瓷与引线间形成抗拉角，提高引线与陶瓷底板的封接强度。
本发明的有益效果：
1、本发明设计的一种具有大电流、低引线电阻封接电磁继电器外壳符合国家军用标准，采用金属外壳，散热性能更好，强度更高；主引线采用无氧铜材料，无氧铜具备良好的导热、导电性能；陶瓷底板材料为掺杂改性94％氧化铝陶瓷，具有较好的传导性、机械强度和耐高温性。
2、本发明设计的种具有大电流、低引线电阻封接电磁继电器外壳，陶瓷底板与金属环采用立封结构钎焊连接，立封结构有更小的封接面积，较小的封接应力，辅助引线封接孔的边缘倒角，倒角能减小陶瓷底板与辅助引线间封接应力。
附图说明
图1为一种具有大电流、低引线电阻封接电磁继电器外壳的半剖示意图；
图2为一种具有大电流、低引线电阻封接电磁继电器外壳的A部放大图；
图3为一种具有大电流、低引线电阻封接电磁继电器外壳的主引线处放大图；
图4为一种具有大电流、低引线电阻封接电磁继电器外壳的辅助引线处放大图。
其中：1、陶瓷底板；11、金属环；12、封帽；13、主引线封接孔；14、辅助引线封接孔；2、主引线；21、可伐套环；22、触点段；23、可伐套环处的钎焊点；24、触点段处的钎焊点；3、辅助引线；31、边缘倒角；32、边缘倒角1/2到3/5处。
具体实施方式
为使本领域技术人员更加清楚和明确本发明技术方案，下面结合附图对本发明技术方案进行详细描述，但本发明的实施方式不限于此。
如图1-4所示，一种具有大电流、低引线电阻封接电磁继电器外壳，包括陶瓷底板1、金属环11、封帽12、主引线2和辅助引线3，所述陶瓷底板1与金属环11采用立封结构钎焊连接，立封结构有更小的封接面积，较小的封接应力，金属环11与封帽12等离子或激光焊接；主引线2与穿过陶瓷底板1的主引线封 接孔13，可伐套环21钎焊连接在主引线2和陶瓷底板1的上下端面,钎焊点为23，触点段22钎焊连接在主引线2的下端；辅助引线3穿过陶瓷底板1的辅助引线封接孔14，辅助引线封接孔14的边缘倒角31，倒角能减小陶瓷底板1与辅助引线3之间封接应力，钎焊连接辅助引线3和陶瓷底板1。陶瓷底板1材料为掺杂改性94％氧化铝陶瓷。可伐套环处的钎焊点23、立封结构处的钎焊15与触点段处的钎焊点24都使用焊料为AgCu28。主引线2采用无氧铜材料，无氧铜具备良好的导热、导电性能，由于无氧铜的线胀系数与陶瓷的线胀系数差别很大，作为引线的无氧铜不能与陶瓷底板直接封接，可通过可伐套环21过渡与陶瓷封接。辅助引线3采用铜芯可伐。金属环采用4J42材料。钎焊焊料填充到辅助引线封接孔14的边缘倒角1/2到3/5处32，陶瓷与引线间形成抗拉角，提高引线与陶瓷底板的封接强度。
以上所述，仅是本发明的的最佳实施例而已，并非对本发明的任何形式的限制，任何熟悉本领域的技术人员，在不脱离本发明技术方案范围的情况下利用上述揭示的方法和内容对本发明做出的许多可能的变动和修饰，均属于权利要求书保护的范围。

Claims (7)

  1. 一种具有大电流、低引线电阻封接电磁继电器外壳，其特征在于：包括陶瓷底板、金属环、封帽、主引线和辅助引线，所述陶瓷底板与金属环采用立封结构钎焊连接，金属环与封帽等离子或激光焊接；主引线与穿过陶瓷底板的主引线封接孔，可伐套环钎焊连接在主引线和陶瓷底板的上下端面，触点段钎焊连接在主引线下端；辅助引线穿过陶瓷底板的辅助引线封接孔，辅助引线封接孔的边缘倒角，钎焊连接辅助引线和陶瓷底板。
  2. 根据权利要求1所述的一种具有大电流、低引线电阻封接电磁继电器外壳，其特征在于：陶瓷底板材料为掺杂改性94％氧化铝瓷。
  3. 根据权利要求1所述的一种具有大电流、低引线电阻封接电磁继电器外壳，其特征在于：主引线采用无氧铜材料。
  4. 根据权利要求1所述的一种具有大电流、低引线电阻封接电磁继电器外壳，其特征在于：辅助引线采用铜芯可伐。
  5. 根据权利要求1所述的一种具有大电流、低引线电阻封接电磁继电器外壳，其特征在于：金属环采用4J42材料。
  6. 根据权利要求1所述的一种具有大电流、低引线电阻封接电磁继电器外壳，其特征在于：所述钎焊连接的焊料为AgCu28。
  7. 根据权利要求1所述的一种具有大电流、低引线电阻封接电磁继电器外壳，其特征在于：钎焊焊料填充到辅助引线封接孔的边缘倒角1/2到3/5处。
PCT/CN2021/078394 2020-07-10 2021-03-01 一种具有大电流、低引线电阻封接电磁继电器外壳 WO2022007422A1 (zh)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4456896A (en) * 1982-12-30 1984-06-26 Trw Canada Limited Low cost relay
CN105185656A (zh) * 2014-06-18 2015-12-23 王颖 一种便于安装的抗裂继电器外壳
CN205542602U (zh) * 2016-04-14 2016-08-31 尼普顿电器（昆山）有限公司 小型高压直流继电器的密封结构
CN208027981U (zh) * 2017-12-28 2018-10-30 陕西群力电工有限责任公司 密封式高压直流磁保持接触器
CN111785570A (zh) * 2020-07-10 2020-10-16 青岛凯瑞电子有限公司 一种具有大电流、低引线电阻封接电磁继电器外壳

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203774185U (zh) * 2014-03-04 2014-08-13 青岛凯瑞电子有限公司 一种绝缘片不易产生裂纹的固体继电器外壳
CN104269383B (zh) * 2014-10-05 2017-10-17 青岛凯瑞电子有限公司 整流桥及其外壳、边框与底板的过渡焊接方法
CN104465539B (zh) * 2014-12-18 2017-11-21 中国电子科技集团公司第四十三研究所 金属封接用玻璃‑陶瓷复合密封结构及密封方法
CN208061963U (zh) * 2018-03-21 2018-11-06 天水二一三新能源电器有限公司 一种新型接触器灭弧罩
CN208767289U (zh) * 2018-08-17 2019-04-19 青岛凯瑞电子有限公司 一种高密封性引线贴片封接结构

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4456896A (en) * 1982-12-30 1984-06-26 Trw Canada Limited Low cost relay
CN105185656A (zh) * 2014-06-18 2015-12-23 王颖 一种便于安装的抗裂继电器外壳
CN205542602U (zh) * 2016-04-14 2016-08-31 尼普顿电器（昆山）有限公司 小型高压直流继电器的密封结构
CN208027981U (zh) * 2017-12-28 2018-10-30 陕西群力电工有限责任公司 密封式高压直流磁保持接触器
CN111785570A (zh) * 2020-07-10 2020-10-16 青岛凯瑞电子有限公司 一种具有大电流、低引线电阻封接电磁继电器外壳

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