WO2022004070A1 - 圧電振動子 - Google Patents

圧電振動子 Download PDF

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Publication number
WO2022004070A1
WO2022004070A1 PCT/JP2021/010854 JP2021010854W WO2022004070A1 WO 2022004070 A1 WO2022004070 A1 WO 2022004070A1 JP 2021010854 W JP2021010854 W JP 2021010854W WO 2022004070 A1 WO2022004070 A1 WO 2022004070A1
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WO
WIPO (PCT)
Prior art keywords
electrode
base member
lid member
conductive
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/010854
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English (en)
French (fr)
Japanese (ja)
Inventor
威哉 松村
慎介 河森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to CN202180038875.9A priority Critical patent/CN115699571B/zh
Priority to JP2022533686A priority patent/JP7416248B2/ja
Publication of WO2022004070A1 publication Critical patent/WO2022004070A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals

Definitions

  • the present invention relates to a piezoelectric vibrator.
  • Oscillators are used in various electronic devices such as mobile communication terminals, communication base stations, and home appliances for applications such as timing devices, sensors, and oscillators. With the increasing functionality of electronic devices, inexpensive and high-performance vibrating elements are required.
  • Patent Document 1 a base member and a metal lid member are joined via a conductive adhesive, and the lid member is electrically connected to the grounding electrode of the base member by this conductive adhesive to generate electromagnetic waves.
  • a crystal transducer that suppresses noise due to entering and exiting is disclosed.
  • the crystal vibrating element and the lid member may be short-circuited due to misalignment or bleeding of the conductive adhesive.
  • the present invention has been made in view of such circumstances, and an object of the present invention is to provide a piezoelectric vibrator capable of suppressing the generation of defective products while suppressing noise.
  • the piezoelectric vibrator according to one aspect of the present invention is joined by sandwiching a conductive adhesive joining member between the piezoelectric vibrating element, the base member on which the piezoelectric vibrating element is mounted, and the base member, and is joined to the base member.
  • a lid member made of a conductive material that forms an internal space in which a piezoelectric vibrating element is arranged is provided, and the lid member includes a top wall portion and a side wall portion extending from the outer edge of the top wall portion toward the base member.
  • the side wall portion has a facing surface facing the base member, and the base member is provided with a feeding electrode to which a piezoelectric vibration element is connected and a grounding electrode used for grounding.
  • the electrodes are electrically connected to the lid member via the joining member, and the conductive adhesive has a resin-based adhesive and a conductive filler dispersed in the resin-based adhesive, and is conductive.
  • the ratio of the volume of the conductive filler to the total volume of the adhesive is 3 vol% or more and 18 vol% or less.
  • the piezoelectric vibrator according to one aspect of the present invention is joined by sandwiching a conductive adhesive joining member between the piezoelectric vibrating element, the base member on which the piezoelectric vibrating element is mounted, and the base member, and is joined to the base member.
  • a lid member of a conductive material forming an internal space in which a piezoelectric vibrating element is arranged is provided, and the lid member includes a top wall portion and a side wall portion extending from an outer edge of the top wall portion toward a base member.
  • the side wall portion has a facing surface facing the base member, and the base member is provided with a feeding electrode to which a piezoelectric vibration element is connected and a grounding electrode used for grounding.
  • the electrode is electrically connected to the lid member via the joining member, and the conductive adhesive has a resin-based adhesive and a conductive filler dispersed in the resin-based adhesive, and the base member.
  • the conductive adhesive has a resin-based adhesive and a conductive filler dispersed in the resin-based adhesive, and the base member.
  • the gap G2 between the protective film and the facing surface and the particle size R of the conductive filler satisfy the relationship of G1 ⁇ R ⁇ G2.
  • FIG. 1 is an exploded perspective view schematically showing the configuration of a crystal oscillator according to an embodiment.
  • FIG. 2 is a plan view schematically showing the configuration of the crystal oscillator according to the embodiment.
  • FIG. 3 is a cross-sectional view schematically showing the configuration of the crystal oscillator according to the embodiment.
  • FIG. 4 is a plan view schematically showing the configurations of the base member and the crystal vibrating element. Note that FIG. 3 is a cross-sectional view taken along the line III-III of the crystal oscillator 1 shown in FIG.
  • Each drawing is provided with a Cartesian coordinate system consisting of X-axis, Y'axis and Z'axis for convenience to clarify the relationship between each drawing and to help understand the positional relationship of each member.
  • the X-axis, Y'axis and Z'axis correspond to each other in the drawings.
  • the X-axis, Y'axis, and Z'axis are each related to the crystallographic axes of the crystal piece 11 described later.
  • the X-axis corresponds to the electric axis (polar axis) of the quartz crystal
  • the Y-axis corresponds to the mechanical axis of the quartz crystal
  • the Z-axis corresponds to the optical axis of the quartz crystal.
  • the Y'axis and the Z'axis are axes obtained by rotating the Y axis and the Z axis around the X axis in the direction of the Y axis to the Z axis by 35 degrees 15 minutes ⁇ 1 minute 30 seconds, respectively.
  • the direction parallel to the X-axis is referred to as "X-axis direction”
  • the direction parallel to the Y'axis is referred to as “Y'axis direction”
  • the direction parallel to the Z'axis is referred to as "Z'axis direction”.
  • the direction of the tip of the arrow on the X-axis, Y'axis and Z'axis is called “+ (plus)”
  • the direction opposite to the arrow is called "-(minus)”.
  • the + Y'axis direction will be described as an upward direction
  • the ⁇ Y'axis direction will be described as a downward direction, but the vertical direction of the crystal oscillator 1 is not limited.
  • the crystal oscillator 1 includes a crystal vibrating element 10, a base member 30, a lid member 40, and a joining member 50.
  • the crystal vibrating element 10 is provided between the base member 30 and the lid member 40.
  • the base member 30 and the lid member 40 form a cage for accommodating the crystal vibrating element 10, and are overlapped along the Y'axis direction.
  • the crystal vibrating element 10 is mounted on the base member 30.
  • the crystal vibrating element 10 is a piezoelectric vibrating element that vibrates a crystal by a piezoelectric effect and converts electrical energy and mechanical energy.
  • the crystal vibrating element 10 includes a flaky crystal piece 11, a first excitation electrode 14a and a second excitation electrode 14b constituting a pair of excitation electrodes, and a first extraction electrode 15a and a second extraction electrode constituting the pair of extraction electrodes.
  • the electrode 15b is provided with a first connection electrode 16a and a second connection electrode 16b constituting the pair of connection electrodes.
  • the crystal piece 11 has an upper surface 11A and a lower surface 11B facing each other.
  • the upper surface 11A is located on the side opposite to the side facing the base member 30, that is, the side facing the top wall portion 41 of the lid member 40 described later.
  • the lower surface 11B is located on the side facing the base member 30.
  • the crystal piece 11 is, for example, an AT-cut type crystal crystal.
  • the AT-cut type crystal piece 11 is a plane parallel to a plane specified by the X-axis and the Z'axis in a Cartesian coordinate system consisting of an X-axis, a Y'axis, and a Z'axis that intersect each other (hereinafter, "XZ". It is called a'plane'. The same applies to a plane specified by another axis.) Is the main surface, and is formed so that the direction parallel to the Y'axis is the thickness.
  • the crystal vibrating element 10 using the AT-cut type crystal piece 11 has high frequency stability in a wide temperature range.
  • the thick slide vibration mode Thiickness Shear Vibration Mode
  • a different cut other than the AT cut may be applied to the crystal piece 11.
  • BT cut, GT cut, SC cut and the like may be applied.
  • the crystal vibrating element may be a tuning fork type crystal vibrating element using a crystal piece having a cut angle called a Z plate.
  • the crystal piece 11 is parallel to the long side direction in which the long side parallel to the X-axis direction extends, the short side direction in which the short side parallel to the Z'axis direction extends, and the Y'axis direction. It is a flat plate having a thickness direction in which the thickness extends.
  • the planar shape of the crystal piece 11 is rectangular.
  • the crystal piece 11 is not limited to a flat plate shape, and may have a mesa-type structure or an inverted mesa-type structure.
  • the crystal piece 11 has a taper shape in which the thickness changes continuously, a staircase shape in which the thickness changes discontinuously, a convex shape in which the amount of change in thickness continuously changes, or a convex shape in which the amount of change in thickness is discontinuous. It may have a changing bevel shape.
  • the first excitation electrode 14a is provided on the upper surface 11A of the crystal piece 11, and the second excitation electrode 14b is provided on the lower surface 11B of the crystal piece 11.
  • the first excitation electrode 14a and the second excitation electrode 14b face each other with the crystal piece 11 interposed therebetween.
  • the first excitation electrode 14a and the second excitation electrode 14b each have a rectangular shape, and are arranged so that substantially the entire surface of the crystal piece 11 overlaps with each other.
  • the first extraction electrode 15a is provided on the upper surface 11A of the crystal piece 11, and the second extraction electrode 15b is provided on the lower surface 11B of the crystal piece 11.
  • the first extraction electrode 15a electrically connects the first excitation electrode 14a and the first connection electrode 16a.
  • the second extraction electrode 15b electrically connects the second excitation electrode 14b and the second connection electrode 16b.
  • the first connection electrode 16a and the second connection electrode 16b are electrodes for electrically connecting the first excitation electrode 14a and the second excitation electrode 14b to the base member 30, respectively, and are provided on the lower surface 11B of the crystal piece 11. Has been done.
  • the excitation electrode, the extraction electrode, and the connection electrode are, for example, a laminated body composed of a base layer having good adhesion to the crystal piece 11 and a outermost layer having good chemical stability.
  • the materials constituting the excitation electrode, the extraction electrode and the connection electrode are, for example, chromium (Cr), gold (Au), titanium (Ti), molybdenum (Mo), aluminum (Al), nickel (Ni), and indium (In). , Palladium (Pd), silver (Ag), copper (Cu), tin (Sn), iron (Fe) and other metallic materials are suitably selected.
  • the excitation electrode, the extraction electrode, and the connection electrode may contain a conductive ceramic, a conductive resin, a semiconductor, or the like.
  • the base member 30 includes a flat plate-shaped substrate 31, a first electrode pad 33a and a second electrode pad 33b constituting a pair of electrode pads, a top electrode 33c, a first side electrode 34a, and a second side electrode 34b.
  • a third side electrode 34c, a fourth side electrode 34d, a first external electrode 35a, a second external electrode 35b, a third external electrode 35c, a fourth external electrode 35d, and a protective film 39 are provided. There is.
  • the substrate 31 has an upper surface 31A and a lower surface 31B facing each other.
  • the upper surface 31A and the lower surface 31B correspond to a pair of main surfaces of the substrate 31.
  • the upper surface 31A is located on the side facing the crystal vibrating element 10 and the lid member 40, and the lower surface 31B is located on the side facing the circuit board when the crystal oscillator 1 is mounted on an external circuit board, for example. is doing.
  • the substrate 31 is a sintered material such as insulating ceramic (alumina), but may be provided by quartz, silicon, or the like.
  • the substrate 31 When the upper surface 31A is viewed in a plan view, the substrate 31 has a pair of long sides extending in the X-axis direction and facing each other in the Z'axis direction, and a pair of short sides extending in the Z'axis direction and facing each other in the X-axis direction.
  • Have. Fan-shaped recesses are provided at the four corners of the substrate 31. This recess is a division of a through hole penetrating the substrate 31 from the upper surface 31A to the lower surface 31B.
  • the first electrode pad 33a and the second electrode pad 33b are provided on the upper surface 31A of the substrate 31.
  • the first electrode pad 33a and the second electrode pad 33b are terminals for electrically connecting the crystal vibrating element 10 to the base member 30.
  • the first electrode pad 33a and the second electrode pad 33b are surrounded by the joining member 50.
  • the top electrode 33c is an electrode that is electrically connected to the lid member 40.
  • the upper surface electrode 33c is provided at the corners of the base member 30 on the + X axis direction side and the ⁇ Z ′ axis direction side, and is located on the outermost surface of the base member 30 on the lid member 40 side.
  • the first side surface electrodes 34a to the fourth side surface electrodes 34d are provided on the side surface portion connecting the outermost edge of the upper surface 31A of the base member 30 and the outermost edge of the lower surface 31B. Specifically, it is provided from the end of the concave portion provided at the corner of the substrate 31 on the upper surface 31A side to the end on the lower surface 31B side and covers the concave portion of the substrate 31.
  • Each of the first side surface electrode 34a to the fourth side surface electrode 34d corresponds to a casting electrode.
  • the first side surface electrode 34a is provided in a recess provided at a corner portion of the base member 30 on the ⁇ X axis direction side and the + Z ′ axis direction side.
  • the second side surface electrode 34b is provided in a recess provided at a corner portion on the + X axis direction side and the ⁇ Z ′ axis direction side of the base member 30.
  • the third side surface electrode 34c is provided in a recess provided at a corner portion on the + X axis direction side and the + Z'axis direction side of the base member 30.
  • the fourth side surface electrode 34d is provided in a recess provided at a corner portion on the ⁇ X axis direction side and the ⁇ Z ′ axis direction side of the base member 30.
  • the first side surface electrode 34a is electrically connected to the first electrode pad 33a via the wiring electrode 37a provided on the upper surface 31A
  • the second side surface electrode 34b is connected to the second side surface electrode 34b via the wiring electrode 37b provided on the upper surface 31A. It is electrically connected to the second electrode pad 33b.
  • the third side surface electrode 34c is continuously provided from the top surface electrode 33c and is electrically connected to the top surface electrode 33c.
  • the first side surface electrode 34a, the first electrode pad 33a, and the wiring electrode 37a connecting them correspond to a feeding electrode to which the crystal vibrating element 10 is connected.
  • the second side surface electrode 34b, the second electrode pad 33b, and the wiring electrode 37b connecting them also correspond to the feeding electrode.
  • the third side surface electrode 34c and the top surface electrode 33c correspond to a grounding electrode used for grounding the lid member 40.
  • the power feeding electrode and the grounding electrode are, for example, a laminated body composed of a base layer having good adhesion to the substrate 31 and a surface layer having good chemical stability.
  • the materials constituting the power feeding electrode and the grounding electrode are, for example, chromium (Cr), gold (Au), titanium (Ti), molybdenum (Mo), aluminum (Al), nickel (Ni), indium (In), and the like. It is preferably selected from metallic materials such as palladium (Pd), silver (Ag), copper (Cu), tin (Sn), and iron (Fe).
  • the feeding electrode and the grounding electrode may contain a conductive ceramic, a conductive resin, a semiconductor, or the like.
  • the first external electrode 35a to the fourth external electrode 35d are electrodes for mounting the crystal oscillator 1 on an external circuit board by soldering or the like.
  • the first external electrode 35a to the fourth external electrode 35d are provided on the lower surface 31B of the substrate 31.
  • the first external electrode 35a is provided at a corner portion of the base member 30 on the ⁇ X axis direction side and the + Z ′ axis direction side, and is electrically connected to the first side surface electrode 34a.
  • the first external electrode 35a is provided at a corner portion of the base member 30 on the + X axis direction side and the ⁇ Z ′ axis direction side, and is electrically connected to the second side surface electrode 34b.
  • the third external electrode 35c is provided at a corner portion of the base member 30 on the + X axis direction side and the + Z'axis direction side, and is electrically connected to the third side surface electrode 34c.
  • the fourth external electrode 35d is provided at the corners of the base member 30 on the ⁇ X axis direction side and the ⁇ Z ′ axis direction side, and is electrically connected to the fourth side surface electrode 34d.
  • the first external electrode 35a and the second external electrode 35b are used to supply an electric signal to the pair of feeding electrodes.
  • the third external electrode 35c is used to ground the grounding electrode.
  • the fourth external electrode 35d is a dummy electrode to which an electric signal or the like is not input / output.
  • the fourth external electrode 35d may be used for grounding the lid member 40 together with the third external electrode 35c, or may be omitted.
  • the protective film 39 is provided on the side of the base member 30 facing the lid member 40 and in a region in contact with the joining member 50.
  • the protective film 39 is provided with an insulating material.
  • the protective film 39 covers a part of the feeding electrode (the region facing the facing surface 43B of the lid member 40), and electrically insulates the feeding electrode and the lid member 40.
  • the protective film 39 covers at least a part of the wiring electrode 37a connecting the first side surface electrode 34a and the first electrode pad 33a, and connects the second side surface electrode 34b and the second electrode pad 33b. It covers at least a part of the wiring electrode 37b.
  • the protective film 39 is provided in the outer region of the upper surface electrode 33c, and the upper surface electrode 33c is exposed from the protective film 39.
  • the protective film 39 is, for example, a solder resist.
  • the protective film 39 may be omitted. In this case, even if the joining member 50 comes into contact with the feeding electrode, a short circuit between the crystal vibrating element 10 and the lid member 40 is unlikely to occur via the joining member 50.
  • the base member 30 includes a first conductive holding member 36a and a second conductive holding member 36b that form a pair of conductive holding members.
  • the first conductive holding member 36a and the second conductive holding member 36b hold the crystal vibrating element 10 at a distance from the base member 30 and the lid member 40.
  • the first conductive holding member 36a and the second conductive holding member 36b electrically connect the crystal vibrating element 10 and the base member 30.
  • the first conductive holding member 36a electrically connects the first electrode pad 33a and the first connecting electrode 16a
  • the second conductive holding member 36b electrically connects the second electrode pad 33b and the second connecting electrode. It is electrically connected to 16b.
  • the first conductive holding member 36a and the second conductive holding member 36b are cured products of a conductive adhesive containing, for example, a thermosetting resin and a photocurable resin.
  • the lid member 40 is joined to the base member 30.
  • the lid member 40 forms an internal space for accommodating the crystal vibrating element 10 with the base member 30.
  • the lid member 40 has a recess 49 that opens on the side of the base member 30, and the internal space in the present embodiment corresponds to the space inside the recess 49.
  • the recess 49 is liquidtightly sealed.
  • the material of the lid member 40 is a conductive material, and more preferably a highly airtight metal material. Since the lid member 40 is made of a conductive material, the lid member 40 is provided with an electromagnetic shield function that reduces the ingress and egress of electromagnetic waves into the internal space.
  • the material of the lid member 40 is preferably a material having a coefficient of thermal expansion close to that of the substrate 31, for example, the coefficient of thermal expansion near room temperature is in a wide temperature range with glass or ceramic. It is a matching Fe—Ni—Co based alloy.
  • the lid member 40 has a flat plate-shaped top wall portion 41 and a side wall portion 42 connected to the outer edge of the top wall portion 41.
  • the top wall portion 41 extends along the upper surface 31A of the substrate 31 and faces the base member 30 with the crystal vibrating element 10 interposed therebetween in the height direction.
  • the side wall portion 42 extends from the top wall portion 41 toward the base member 30, and surrounds the crystal vibrating element 10 in a direction parallel to the upper surface 31A of the substrate 31.
  • the lid member 40 may further have a flange portion that is connected to the tip of the side wall portion 42 on the base member 30 side and extends outward along the upper surface 31A of the substrate 31.
  • the lid member 40 has an inner surface located on the side of the recess 49 and an outer surface on the opposite side of the recess 49 and exposed to the outside.
  • the inner surface is the side of the top wall portion 41 and the side wall portion 42 facing the crystal vibrating element 10
  • the outer surface is the side opposite to the side of the top wall portion 41 and the side wall portion 42 facing the crystal vibrating element 10.
  • the lid member 40 further has a facing surface 43B facing the base member 30.
  • the facing surface 43B is a surface extending along the upper surface 31A of the substrate 31 at the tip of the side wall portion 42 of the base member 30.
  • the area of the facing surface 43B can be expanded by providing a flange portion.
  • the planar shape of the lid member 40 when viewed in a plan view from the normal direction of the main surface is, for example, a substantially rectangular shape.
  • the planar shape of the lid member 40 is not limited to the above, and may be a polygonal shape, a circular shape, an elliptical shape, or a combination thereof.
  • the joining member 50 joins the base member 30 and the lid member 40. Specifically, the joining member 50 joins the protective film 39 and the facing surface 43B, and joins the upper surface electrode 33c and the facing surface 43B. Further, the joining member 50 seals the recess 49 corresponding to the internal space. Specifically, the joining member 50 is provided over the entire circumference of each outer edge portion of the base member 30 and the lid member 40, and has a rectangular frame shape so as to surround the crystal vibrating element 10.
  • the joining member 50 is a conductive adhesive, and electrically connects the grounding electrode and the lid member 40.
  • the conductivity of the joining member 50 has anisotropy. Specifically, in the region between the upper surface electrode 33c and the facing surface 43B, the electrical resistance of the joining member 50 along the direction intersecting the upper surface 31A of the substrate 31 is low, and the upper surface electrode 33c and the facing surface 43B are joined. It is electrically connected via the member 50. On the other hand, the electrical resistance of the joining member 50 along the upper surface 31A of the substrate 31 is high, and even when the joining member 50 comes into contact with the feeding electrode, the feeding electrode and the lid member 40 are electrically insulated from each other. To.
  • FIG. 5 is an enlarged cross-sectional view of a crystal oscillator including a grounding electrode.
  • FIG. 6 is an enlarged cross-sectional view of a crystal oscillator including a feeding electrode.
  • the conductive adhesive of the joining member 50 includes a resin-based adhesive 51, a plurality of conductive fillers 52 dispersed in the resin-based adhesive 51, and a plurality of insulating fillers 53 dispersed in the resin-based adhesive 51. is doing.
  • the resin-based adhesive 51 is, for example, an epoxy-based thermosetting resin.
  • the resin-based adhesive 51 may be an epoxy-based, vinyl-based, acrylic-based, urethane-based, imide-based, or silicone-based thermosetting resin.
  • the resin-based adhesive 51 may contain a photocurable resin.
  • the conductive filler 52 is, for example, a spherical filler in which a spherical resin core is covered with a metal film.
  • the conductive filler 52 is deformable, and the conductive filler 52 sandwiched between the top electrode 33c and the facing surface 43B is deformed into an ellipsoidal shape. With the deformation, the conductive filler 52 is surely in contact with both the upper surface electrode 33c and the facing surface 43B. As a result, the upper surface electrode 33c and the facing surface 43B are electrically connected via the conductive filler 52. Further, with the deformation, the contact area between the conductive filler 52 and the upper surface electrode 33c and the contact area between the conductive filler 52 and the facing surface 43B increase.
  • the material of the resin core is, for example, a styrene resin or an acrylic resin. According to this, the elastic modulus of the conductive filler 52 can be suitably designed.
  • the material of the metal film is, for example, Ni. According to this, it is possible to suppress the peeling of the metal film from the resin core, and it is possible to suppress the increase in electrical resistance.
  • the resin core is not limited to the styrene resin and the acrylic resin as long as it can be deformed.
  • the metal film is not limited to Ni, and may be formed of a metal material such as Au, Ag, Cu, Al, or Ti.
  • the metal film may be a multilayer film composed of a plurality of metal layers.
  • the conductive filler 52 may be a spherically processed conductive material such as Cu, Ni, C, or Si.
  • the insulating filler 53 adjusts the viscosity of the conductive adhesive before curing, and suppresses contact with the feeding electrode due to undesired wetting and spreading of the conductive adhesive before curing.
  • the material of the insulating filler 53 is, for example, spherical silica.
  • the material of the insulating filler 53 is not limited to the above, but is limited to organic compounds such as silicone, urethane, imide, epoxy, vinyl, amine, phenol, amino, acrylic and styrene, or titanium oxide, magnesium oxide and magnesium carbonate. , Magnesium hydroxide, alumina, boron nitride, aluminum nitride, glass fiber, graphite and the like.
  • volume ratio The ratio of the volume of the conductive filler 52 to the total volume of the conductive adhesive of the joining member 50 (hereinafter referred to as “volume ratio”) is 3 vol% or more and 18 vol% or less.
  • volume ratio is smaller than 3 vol%, the conductive filler 52 does not exist in the region between the upper surface electrode 33c and the facing surface 43B, and the electrical connection between the upper surface electrode 33c and the facing surface 43B cannot be obtained. There is. That is, when the volume ratio is 3 vol% or more, the occurrence rate of defective products in which the lid member 40 cannot be grounded can be reduced.
  • the conductive fillers 52 may approach or come into contact with each other, and the electric resistance of the joining member 50 along the upper surface 31A of the substrate 31 may decrease. That is, when the volume ratio is 18 vol% or less, the occurrence rate of defective products in which the crystal vibrating element 10 and the lid member 40 are short-circuited can be reduced. From the viewpoint of reducing the occurrence rate of defective products in which the lid member 40 cannot be grounded, it is desirable that the volume ratio is further satisfied to be 7 vol% or more. Further, from the viewpoint of reducing the occurrence rate of defective products in which the crystal vibrating element 10 and the lid member 40 are short-circuited, the volume ratio is more preferably 10 vol% or less.
  • the particle size R is an arithmetic mean particle size calculated from the particle size distribution obtained by the Coulter counter method of the resin core of the conductive filler 52.
  • the particle size of the resin core can be regarded as the particle size R of the conductive filler 52.
  • the thickness of the metal film of the conductive filler 52 is, for example, 10 nm or more and 500 nm or less. If the thickness of the metal film is smaller than 10 nm, the electrical resistance of the conductive filler 52 may increase. When the thickness of the metal film is larger than 500 m, the metal film may hinder the deformation of the conductive filler 52, or the metal film may peel off from the resin core. That is, when the thickness of the metal film is 10 nm or more and 500 nm or less, the occurrence rate of defective products in which the lid member 40 cannot be grounded can be reduced.
  • the width W of the facing surface 43B in the lateral direction and the particle size R of the conductive filler 52 satisfy the relationship of 4 ⁇ m ⁇ R ⁇ W / 2.
  • the conductive filler 52 sandwiched between the top electrode 33c and the facing surface 43B is pressurized in order to establish continuity between the grounding electrode and the lid member 40.
  • W / 2 ⁇ R the conductive filler 52 may be extruded from the region between the upper surface electrode 33c and the facing surface 43B. That is, when R ⁇ W / 2, it is possible to reduce the occurrence rate of defective products in which the lid member 40 cannot be grounded.
  • 4 ⁇ m ⁇ R as described above, the rate of defective products in which the lid member 40 cannot be grounded can be reduced.
  • the insulating filler 53 may act as a spacer to hinder the deformation of the conductive filler 52.
  • the particle size r is a median diameter D50 calculated from the particle size distribution obtained by the Microtrac method.
  • the particle size R and the particle size r satisfy the relationship of R / 20 ⁇ r ⁇ R ⁇ 8/10.
  • the insulating filler 53 may invade between the conductive filler 52 and the upper surface electrode 33c, and the contact between the conductive filler 52 and the upper surface electrode 33c may be hindered.
  • the contact between the conductive filler 52 and the facing surface 43B may be hindered. That is, when R / 20 ⁇ r, it is possible to reduce the occurrence rate of defective products in which the lid member 40 cannot be grounded.
  • the insulating filler 53 may act as a spacer in the region between the top electrode 33c and the facing surface 43B to hinder the deformation of the conductive filler 52. That is, when r ⁇ R ⁇ 8/10, it is possible to reduce the occurrence rate of defective products in which the lid member 40 cannot be grounded. From the viewpoint of reducing the occurrence rate of defective products in which the lid member 40 cannot be grounded, it is desirable that the particle size R and the particle size r further satisfy the relationship of R / 10 ⁇ r. Further, it is desirable to further satisfy the relationship of r ⁇ R / 2.
  • the gap G1 between the top electrode 33c and the facing surface 43B, the gap G2 between the protective film 39 and the facing surface 43B, and the particle size R of the conductive filler 52 satisfy the relationship of G1 ⁇ R ⁇ G2. ing.
  • R ⁇ G1 the conductive filler 52 may not come into contact with at least one of the upper surface electrode 33c and the facing surface 43B. That is, when G1 ⁇ R, the occurrence rate of defective products in which the lid member 40 cannot be grounded can be reduced.
  • G2 ⁇ R the conductive filler 52 sandwiched between the protective film 39 and the facing surface 43B is deformed.
  • the conductive filler 52 sandwiched between the upper surface electrode 33c and the facing surface 43B is deformed, a part of the conductive filler 52 is extruded from the region between the protective film 39 and the facing surface 43B. According to this, the conductive fillers 52 may approach each other in an undesired region, and the electric resistance of the joining member 50 in the direction along the upper surface 31A of the substrate 31 may decrease. That is, when R ⁇ G2, the occurrence rate of defective products in which the crystal vibrating element 10 and the lid member 40 are short-circuited can be reduced.
  • the gap G1 and the gap G2 satisfy the relationship of 0 ⁇ G2-G1 ⁇ 13 ⁇ m.
  • G2-G1 ⁇ 0 that is, G2 ⁇ G1
  • the conductive filler 52 located in the region between the protective film 39 and the facing surface 43B functions as a spacer, and in the region between the top electrode 33c and the facing surface 43B. Sufficient deformation of the conductive filler 52 may be hindered. That is, in the case of 0 ⁇ G2-G1, it is possible to reduce the occurrence rate of defective products in which the lid member 40 cannot be grounded.
  • 13 ⁇ m ⁇ G2-G1 the sealing property may decrease as the film thickness of the joining member 50 increases in the region between the protective film 39 and the facing surface 43B. That is, when G2-G1 ⁇ 13 ⁇ m, the occurrence rate of defective products whose frequency fluctuates due to leak defects can be reduced.
  • the gap G2 satisfies the relationship of 2 ⁇ m ⁇ G2 ⁇ 20 ⁇ m.
  • the gap G2 is limited by the particle size R. Therefore, in order to reduce the gap G2, it is necessary to reduce the particle size R.
  • G2 ⁇ 2 ⁇ m the particle size R is too small, and the conductive filler 52 may not come into contact with at least one of the upper surface electrode 33c and the facing surface 43B due to the fluctuation of the gap G1 caused by the waviness of the lid member 40. That is, when 2 ⁇ m ⁇ G2, the occurrence rate of defective products in which the lid member 40 cannot be grounded can be reduced.
  • the sealing property may decrease as the film thickness of the joining member 50 increases in the region between the protective film 39 and the facing surface 43B. That is, when G2 ⁇ 20 ⁇ m, the occurrence rate of defective products whose frequency fluctuates due to leak defects can be reduced.
  • FIG. 7 is a table summarizing examples and comparative examples.
  • the crystal oscillators according to Examples 1 to 3 and Comparative Examples 1 and 2 are the crystal oscillators 1 according to the embodiment, and the volume ratio of the conductive filler 52 is changed.
  • the "volume ratio of the conductive filler 52" is the ratio of the volume of the conductive filler 52 to the total volume of the conductive adhesive
  • the "addition ratio of the conductive filler 52" is the conductivity to the total weight of the conductive adhesive. It is a ratio of the weight of the sex filler 52.
  • the volume ratio of the conductive filler 52 is 7.3 vol%.
  • the particle size R of the conductive filler 52 is 5 ⁇ m, and the addition rate of the conductive filler 52 is 10 wt%.
  • Example 2 The volume ratio of the conductive filler 52 is 7.6 vol%.
  • the particle size R of the conductive filler 52 is 10 ⁇ m, and the addition rate of the conductive filler 52 is 10 wt%.
  • Example 3 The volume ratio of the conductive filler 52 is 9.4 vol%.
  • the particle size R of the conductive filler 52 is 20 ⁇ m, and the addition rate of the conductive filler 52 is 10 wt%.
  • Comparative Example 1 The volume ratio of the conductive filler 52 is 2.2 vol%.
  • the particle size R of the conductive filler 52 is 5 ⁇ m, and the addition rate of the conductive filler 52 is 3 wt%.
  • Comparative Example 2 The volume ratio of the conductive filler 52 is 18.9 vol%.
  • the particle size R of the conductive filler 52 is 20 ⁇ m, and the addition rate of the conductive filler is 20 wt%.
  • grounding failure rate the rate of occurrence of defective products in which the lid member 40 and the feeding electrode are not electrically connected
  • short-circuit defective rate The rate of occurrence of defective products short-circuited with 40. The number of each measurement sample is 20.
  • grounding defect rate a product having an electrical resistance between the grounding electrode and the lid member 40 of 10 ⁇ or less was determined to be a non-defective product, and a product having an electrical resistance of more than 10 ⁇ was determined to be a defective product.
  • the electric resistance is more than 10 9 Omega between the feeding electrode and the ground electrode was determined smaller than 10 9 Omega defective.
  • Those having a grounding defect rate and a short-circuit defect rate of less than 5% were evaluated as ⁇ , and those having a grounding defect rate of 5% or more were evaluated as x.
  • Comparative Example 1 In Comparative Example 1 in which the volume ratio of the conductive filler 52 was smaller than 3 vol%, the short-circuit defective rate was low, but the grounding defective rate was high, and the rate of defective products could not be sufficiently reduced. In Comparative Example 2 in which the volume ratio of the conductive filler 52 was larger than 18 vol%, the short-circuit defective rate was high although the grounding defect rate was low, and the occurrence rate of defective products could not be sufficiently reduced. In Examples 1 to 3 in which the volume ratio of the conductive filler 52 was 3 vol% or more and 18 vol% or less, both the grounding defect rate and the short circuit defect rate were low, and the occurrence rate of defective products could be reduced.
  • the volume ratio of the conductive filler 52 is 3 vol% or more and 18 vol% or less. According to this, it is possible to suppress the approach or contact between the conductive fillers 52 in the direction along the upper surface 31A of the substrate 31 while bringing the conductive filler 52 into contact with both the upper surface electrode 33c and the facing surface 43B. Therefore, while reducing the occurrence rate of defective products in which the lid member 40 cannot be grounded, the occurrence rate of defective products in which the crystal vibrating element 10 and the lid member 40 are short-circuited can also be reduced.
  • the relationship G1 ⁇ R ⁇ G2 is satisfied. According to this, while the conductive filler 52 is brought into contact with both the upper surface electrode 33c and the facing surface 43B, the approach or contact between the conductive fillers 52 outside the region between the upper surface electrode 33c and the facing surface 43B is suppressed. can. Therefore, while reducing the occurrence rate of defective products in which the lid member 40 is not grounded, the occurrence rate of defective products in which the crystal vibrating element 10 and the lid member 40 are short-circuited can also be reduced.
  • the particle size R and the particle size r satisfy the relationship of r ⁇ R. According to this, it is possible to suppress the inhibition of deformation of the conductive filler 52 by the insulating filler 53. Therefore, it is possible to reduce the occurrence rate of defective products in which the lid member 40 cannot be grounded.
  • the crystal vibrating element, the base member on which the crystal vibrating element is mounted, and the base member are joined by sandwiching a bonding member of a conductive adhesive between the base member and the base member.
  • a lid member of a conductive material forming an internal space in which a crystal vibrating element is arranged is provided, and the lid member has a top wall portion and a side wall portion extending from an outer edge of the top wall portion toward a base member.
  • the side wall portion has a facing surface facing the base member, and the base member is provided with a feeding electrode to which a crystal vibrating element is connected and a grounding electrode used for grounding.
  • the conductive adhesive has a resin-based adhesive and a conductive filler dispersed in the resin-based adhesive, and is a conductive adhesive.
  • a crystal transducer is provided in which the ratio of the volume of the conductive filler to the total volume is 3 vol% or more and 18 vol% or less. According to this, the noise caused by the inflow and outflow of electromagnetic waves can be reduced by the lid member that can impart the electromagnetic shield function by grounding. Further, it is possible to suppress the approach or contact between the conductive fillers while bringing the conductive fillers into contact with both the feeding electrode and the lid member. Therefore, it is possible to reduce the rate of defective products in which the lid member cannot be grounded, and at the same time, reduce the rate of defective products in which the crystal vibrating element and the lid member are short-circuited.
  • the base member is provided with a protective film of an insulating material that covers at least the region of the feeding electrode facing the facing surface, and the protective film is in contact with the joining member and is in contact with the grounding electrode and the facing surface.
  • the gap G1 between the two, the gap G2 between the protective film and the facing surface, and the particle size R of the conductive filler satisfy the relationship of G1 ⁇ R ⁇ G2.
  • the crystal vibrating element, the base member on which the crystal vibrating element is mounted, and the base member are joined by sandwiching a bonding member of a conductive adhesive between the base member and the base member.
  • a lid member made of a conductive material that forms an internal space in which a crystal vibrating element is arranged is provided, and the lid member has a top wall portion and a side wall portion extending from the outer edge of the top wall portion toward the base member.
  • the side wall portion has a facing surface facing the base member, and the base member is provided with a feeding electrode to which a crystal vibrating element is connected and a grounding electrode used for grounding, and the grounding electrode is provided.
  • the conductive adhesive has a resin-based adhesive and a conductive filler dispersed in the resin-based adhesive, and is used as a base member.
  • a crystal transducer is provided in which the gap G2 between the protective film and the facing surface and the particle size R of the conductive filler satisfy the relationship of G1 ⁇ R ⁇ G2. According to this, the noise caused by the inflow and outflow of electromagnetic waves can be reduced by the lid member that can impart the electromagnetic shield function by grounding.
  • the conductive filler has a spherical resin core and a metal film covering the resin core.
  • the resin core is a styrene resin or an acrylic resin
  • the metal film is nickel
  • the resin-based adhesive is an epoxy-based thermosetting resin.
  • the conductive adhesive further has an insulating filler dispersed in a resin-based adhesive, and the particle size R of the conductive filler and the particle size r of the insulating filler have a relationship of r ⁇ R. Fulfill. According to this, it is possible to suppress the inhibition of deformation of the conductive filler by the insulating filler. Therefore, it is possible to reduce the occurrence rate of defective products in which the lid member cannot be grounded.
  • the embodiment according to the present invention is not limited to the crystal oscillator, and can be applied to the piezoelectric oscillator.
  • An example of a piezoelectric resonator unit is a quartz crystal oscillator unit equipped with a quartz crystal oscillator unit.
  • the crystal vibrating element uses a crystal piece (Quartz Crystal Element) as a piezoelectric piece excited by the piezoelectric effect, and the piezoelectric piece is an arbitrary piece such as a piezoelectric single crystal, a piezoelectric ceramic, a piezoelectric thin film, or a piezoelectric polymer film. It may be formed by the piezoelectric material of.
  • the piezoelectric single crystal may be lithium niobate (LiNbO 3 ).
  • the piezoelectric ceramic is barium titanate (BaTiO 3), lead titanate (PbTiO 3), lead zirconate titanate (Pb (Zr x Ti 1- x) O3; PZT), aluminum nitride (AlN), niobium Lithium acid (LiNbO 3 ), lithium methaniobate (LiNb 2 O 6 ), bismuth titanate (Bi 4 Ti 3 O 12 ), lithium tantalate (LiTaO 3 ), lithium tetraborate (Li 2 B 4 O 7 ), Langasite (La 3 Ga 5 SiO 14 ), tantalum pentoxide (Ta 2 O 5 ), and the like can be mentioned.
  • Examples of the piezoelectric thin film include those obtained by forming the above-mentioned piezoelectric ceramic on a substrate such as quartz or sapphire by a sputtering method or the like.
  • Examples of the piezoelectric polymer membrane include polylactic acid (PLA), polyvinylidene fluoride (PVDF), vinylidene fluoride / ethylene trifluoride (VDF / TrFE) copolymer, and the like.
  • PVA polylactic acid
  • PVDF polyvinylidene fluoride
  • VDF / TrFE vinylidene fluoride / ethylene trifluoride copolymer
  • the embodiment of the present invention is appropriately applicable without limitation as long as it is a device that converts electromechanical energy by a piezoelectric effect, such as a timing device, a sounding device, an oscillator, and a load sensor.

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
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JPH0570750A (ja) * 1991-09-10 1993-03-23 Fujitsu Ltd 導電性接着剤
JP2015220749A (ja) * 2014-05-13 2015-12-07 日本電波工業株式会社 水晶振動子及びその製造方法
JP2019165252A (ja) * 2019-06-12 2019-09-26 藤森工業株式会社 Ｆｐｃ用導電性接着シート及びそれを用いたｆｐｃ
JP2019220683A (ja) * 2019-05-30 2019-12-26 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよびプリント配線板

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JP2002222833A (ja) * 2001-01-29 2002-08-09 Matsushita Electric Ind Co Ltd 導電性接着剤、電子部品実装体およびその製造方法
JP2005054157A (ja) * 2003-08-07 2005-03-03 Seiko Epson Corp 導電性接着剤及びそれを用いて圧電素子を実装した圧電デバイス
JP4542842B2 (ja) * 2004-07-12 2010-09-15 株式会社リコー 電極間接続構造
CN107615652B (zh) * 2015-05-27 2020-06-23 株式会社村田制作所 压电振动元件搭载用基板以及压电振子及其制造方法
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JPH04242946A (ja) * 1991-01-08 1992-08-31 Oki Electric Ind Co Ltd Ｉｃチップの実装方法
JPH0570750A (ja) * 1991-09-10 1993-03-23 Fujitsu Ltd 導電性接着剤
JP2015220749A (ja) * 2014-05-13 2015-12-07 日本電波工業株式会社 水晶振動子及びその製造方法
JP2019220683A (ja) * 2019-05-30 2019-12-26 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよびプリント配線板
JP2019165252A (ja) * 2019-06-12 2019-09-26 藤森工業株式会社 Ｆｐｃ用導電性接着シート及びそれを用いたｆｐｃ

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