WO2022000582A1 - 耳机及其装配方法 - Google Patents

耳机及其装配方法 Download PDF

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Publication number
WO2022000582A1
WO2022000582A1 PCT/CN2020/102775 CN2020102775W WO2022000582A1 WO 2022000582 A1 WO2022000582 A1 WO 2022000582A1 CN 2020102775 W CN2020102775 W CN 2020102775W WO 2022000582 A1 WO2022000582 A1 WO 2022000582A1
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WO
WIPO (PCT)
Prior art keywords
upper cover
electrical connection
main board
lower cover
battery
Prior art date
Application number
PCT/CN2020/102775
Other languages
English (en)
French (fr)
Inventor
褚庆臣
张健
徐斌
岳月华
Original Assignee
瑞声声学科技(深圳)有限公司
瑞声科技(新加坡)有限公司
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Publication date
Application filed by 瑞声声学科技(深圳)有限公司, 瑞声科技(新加坡)有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Publication of WO2022000582A1 publication Critical patent/WO2022000582A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1025—Accumulators or arrangements for charging
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1033—Cables or cables storage, e.g. cable reels
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058—Manufacture or assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/10—Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups
    • H04R2201/105—Manufacture of mono- or stereophonic headphone components

Definitions

  • the present invention relates to the technical field of electro-acoustic conversion devices, in particular to an earphone.
  • TWS wireless earphones have been loved by consumers since their launch, and their demand has also increased significantly year by year.
  • the TWS wireless earphone includes a casing with a first accommodating space, a main board and a speaker box respectively fixed to the outer side of the casing with the battery element accommodated in the first accommodating space.
  • the components are electrically connected, the cables need to be welded with the solder joints of the motherboard, and the speaker module and the motherboard also need to be welded to form an electrical connection between the two.
  • the purpose of the present invention is to provide an earphone with few solder joints, simple circuit structure and high assembly efficiency.
  • the present invention provides a kind of earphone, which includes:
  • the battery module includes a housing having a first accommodating space and a battery element accommodated in the first accommodating space for power supply;
  • the loudspeaker module is fixedly connected to the side of the casing away from the first accommodation space and together with the casing forms a second accommodation space;
  • first electrical connection element extends from the first accommodating space through the casing to the second accommodating space, and one end of the first electrical connection element is connected to the battery element is electrically connected, and the other end extends into the second receiving space and is electrically connected to the motherboard;
  • a second electrical connection element is fixed on the main board and electrically connects the main board with the speaker module.
  • the first electrical connection element is fixed to the casing, and the first electrical connection element and the casing are integrally formed.
  • the casing includes an upper cover and a lower cover which is covered on the upper cover and together with the upper cover to enclose the first receiving space, and the speaker module is covered and fixed on the upper cover , the main board is fixed on the upper cover;
  • the first electrical connection element includes a first element fixed on the upper cover and a second element fixed on the lower cover, and the main board passes through the first element and the second element are respectively electrically connected to the positive electrode and the negative electrode of the battery element.
  • a side of the upper cover close to the main board is recessed to form an accommodating groove, the main board is accommodated in the accommodating groove, and the speaker module is covered in the accommodating groove.
  • the first element is a conductive elastic sheet or a spring thimble, and the first element and the upper cover form an integral molding structure through an injection molding process.
  • the second element is a conductive elastic sheet, and the second element forms an integral molding structure with the lower cover through an injection molding process.
  • the lower cover is made of laser direct molding plastic
  • the second element is a laser direct molding circuit
  • the second element is formed on the lower cover by a laser direct molding process.
  • the earphone further comprises an antenna element attached and fixed to the outer side of the casing, and a shielding element accommodated in the first accommodation space and fixed on the side of the casing close to the antenna element.
  • the shielding element is located between the battery element and the antenna element for shielding and protecting the antenna element.
  • the housing is made of laser direct molding plastic
  • the antenna element is a laser direct molding antenna
  • the antenna element is formed on the outside of the housing by a laser direct molding process.
  • the housing comprises a first snap structure arranged between the upper cover and the lower cover and a second snap structure arranged on the side of the upper cover close to the speaker module,
  • the upper cover and the lower cover are snap-fastened through the first snap-fit structure, and the speaker module is snap-fastened with the upper cover via the second snap-fit structure.
  • the housing further includes a sealing ring, and the sealing ring is pressed between the upper cover and the lower cover to achieve sealing between the upper cover and the lower cover.
  • the present invention provides a method for assembling an earphone, which comprises the following steps:
  • Step S1 providing an upper cover, a lower cover, a battery element, a main board and a speaker module; wherein, the upper cover is provided with a first element, the first element and the upper cover are integrally formed, and the lower cover A second element is provided, the second element and the lower cover are integrally formed, and the main board is provided with a second electrical connection element;
  • Step S2 the upper cover and the lower cover are fixedly connected, and the battery element is fixedly accommodated in the first accommodation space formed by the upper cover and the lower cover;
  • Step S3 fixing the mainboard on the upper cover, and making the mainboard electrically connect with the positive electrode and the negative electrode of the battery element through the first element and the second element respectively;
  • step S4 the speaker module is fixed on the upper cover, and the speaker module is electrically connected to the main board through the second electrical connection element.
  • the upper cover and the lower cover are provided with a first snap structure, and the first snap structure is used for snap fixing between the upper cover and the lower cover. .
  • a second buckle structure is provided on the side of the upper cover close to the speaker module, and the speaker module is locked with the upper cover through the second buckle structure. Buckle to secure.
  • the first electrical connection element extends from the first accommodating space through the housing to the second accommodating space, one end of the first electrical connection element is electrically connected to the battery element, and the other end is electrically connected to the battery element.
  • One end extends into the second accommodating space and is electrically connected to the main board; in the above structure, during actual assembly, the main board is installed in the second accommodating space, the main board directly contacts the first electrical connection element and realizes the electrical connection between the main board and the battery element , not only saves the process of winding the cable on the casing, effectively simplifies the circuit structure, but also reduces the solder joints between the main board and the battery module, and saves the electrical contact point between the main board and the battery module.
  • the electrical connection between the speaker module and the main board can be realized by making the speaker module contact with the second electrical connection element, and the speaker module and the second electrical connection element are also omitted.
  • the welding process of the electrical contact points between the electrical connection elements effectively improves the efficiency of assembly.
  • Fig. 1 is the structural representation of the earphone of the present invention
  • FIG. 2 is a schematic diagram of an assembling method of an earphone according to the present invention.
  • the present invention provides an earphone 100 , which includes a battery module 1 , a main board 2 , a first electrical connection element 3 , a speaker module 4 and a second electrical connection element 5 .
  • the battery module 1 includes a housing 11 having a first accommodating space 110 and a battery element 12 accommodated in the first accommodating space 110 for power supply.
  • the casing 11 includes an upper cover 111 and a lower cover 112 that is covered on the upper cover 111 and that together with the upper cover 111 encloses the first receiving space 110 ;
  • the battery element 12 is a button battery, which includes a positive electrode 121 and a negative electrode 122.
  • the internal cells Before the battery element 12 is packaged, the internal cells have been encapsulated by an aluminum-plastic film, which better protects the internal cells of the battery element 12. , to ensure its reliability.
  • the speaker module 4 is fixedly connected to the housing 11 and together with the housing 11 encloses the second accommodation space 40 ; the main board 2 is fixed to the outer side of the housing 11 and located in the second housing In the accommodating space 40 , the first electrical connecting element 3 extends from the first accommodating space 110 through the casing 11 to the second accommodating space 40 , and one end of the first electrical connecting element 3 is connected to the second accommodating space 40 .
  • the battery element 12 is electrically connected, and the other end extends into the second receiving space 40 for electrical connection with the main board 2 , and the second electrical connection element 5 is fixed on the main board 2 close to the upper speaker module 4 .
  • the speaker module 4 is electrically connected to the main board 2 through the second electrical connection element 5 .
  • the first electrical connection element 3 is integrated on the housing 11 . More specifically, the first electrical connection element 3 is fixed to the housing 11 .
  • the housing 11, the first electrical connection element 3 and the housing 11 are integrally formed.
  • the first electrical connection element 3 includes a first element 31 fixed to the upper cover 111 and electrically connected to the positive electrode 121 , and a first element 31 fixed to the lower cover 112 and electrically connected to the negative electrode 122 .
  • the speaker module 4 is covered and fixed on the upper cover 111 and is located on the side of the main board 2 away from the upper cover 111.
  • the bracket 41 of the upper cover 111 and the speaker 42 fixed on the side of the bracket 41 close to the main board 2, the speaker 42 is arranged opposite to the main board 2 and is connected to the main board through the second electrical connection element 5. 2 Make electrical connections.
  • a side of the upper cover 111 close to the main board 2 is recessed to form an accommodating groove 1110 , the main board 2 is accommodated in the accommodating groove 1110 , and the bracket 41 of the speaker module 4 is covered in the accommodating groove 1110, at this time, the accommodating groove 1110 serves as the second accommodating space 40, the first element 31 and the second element 32 extend into the accommodating groove 1110 respectively, and through the setting of the accommodating groove 1110,
  • the space utilization rate of the housing 11 is effectively improved, thereby reducing the overall size of the earphone 100 , which is more conducive to the miniaturized design of the earphone 100 .
  • the first element 31 is a conductive elastic sheet or a pogo pin (ie a pogopin), and the first element 31 and the upper cover 111 are formed into an integral molding structure through an injection molding process.
  • the second element 32 is a conductive shrapnel or a laser direct forming circuit (ie LDS circuit, the full name of LDS in English is Laser Direct Structuring, Chinese called laser direct structuring technology), for example, in this embodiment, the lower cover 112 is made of laser direct structuring plastic (ie, LDS plastic), and the second component 32 is a laser direct structuring line, ie
  • the second element 32 is formed on the lower cover 112 by a laser direct molding process (ie, LDS process); of course, in other embodiments, the lower cover can also be a conductive elastic sheet, in this case, the second element is formed by an injection molding process. It forms an integral molding structure with the lower cover.
  • the second electrical connection element 5 is a conductive elastic sheet or a pogo pin.
  • the second electrical connection element 5 is a pogo pin, and the pogo pin adopts the SMT process (English full name Surface Mount Technology, that is, surface mount technology) is installed on the motherboard 2.
  • the first element 31 and the second element 32 are directly integrated on the upper cover 111 and the lower cover 112, respectively.
  • the main board 2 is directly connected to the first element 31 and the second element 32. Electrical connection, here, there is no need to provide additional cables to achieve electrical connection between the main board 2 and the battery module 1, which avoids the problems of redundant cables and complicated cable winding in the related art, and effectively simplifies the circuit structure.
  • the speaker 42 of the speaker module 4 is in contact with the second electrical connection element 5 to realize the electrical connection between the speaker 42 and the main board 2,
  • the welding process of the electrical contact point between the speaker 42 and the second electrical connection element 5 is also effectively omitted, and the assembly efficiency is effectively improved.
  • the housing 11 includes a first snap structure 1101 disposed between the upper cover 111 and the lower cover 112 and a first snap structure 1101 disposed on the upper cover 111 close to the
  • the second buckle structure 1102 on the side of the bracket 41 of the speaker module 4, the upper cover 111 and the lower cover 112 are buckled and fixed by the first buckle structure 1101, and the bracket 41 is fixed by the first buckle structure 1101.
  • the second snap structure 1102 and the upper cover 111 are snap-fastened, and the snap-fit arrangement described above saves the assembly process of gluing, so that the packaging of the battery module 1 and the speaker module 4
  • the assembly on the battery module 1 is faster and more convenient, the assembly process is simple, the assembly efficiency is effectively improved, and it is more conducive to automated production.
  • a sealing ring 7 may be added to the casing 11, and the sealing ring 7 is pressed between the upper cover 111 and the lower cover 112 so that the upper cover Sealing is achieved between 111 and the lower cover 112, that is, the battery element 12 is accommodated in a sealed cavity to prevent external water vapor or foreign matter from entering the first accommodating space 110, thereby causing damage to the battery element 12. adverse effects, improve the reliability of the battery element 12 .
  • the earphone 100 further includes an antenna element 6 attached and fixed to the outer side of the casing 11 and accommodated in the first accommodation space 110 and fixed to the casing 11 close to the antenna element 6 .
  • a shielding element 7 on one side, the shielding element 7 is located between the battery element 12 and the antenna element 6 for shielding and protecting the antenna element 6 .
  • the antenna element 6 is a laser direct molding antenna (ie, an LDS antenna), and the antenna element 6 is formed on the lower cover 112 of the housing 11 by a laser direct molding process (ie, an LDS process).
  • a laser direct molding process ie, an LDS process
  • the antenna element can also be attached and fixed on the casing by the SMT process.
  • the present invention provides a method for manufacturing the above-mentioned earphone 100, which includes the following steps:
  • Step S1 providing an upper cover 111, a lower cover 112, a battery element 12, a main board 2 and a speaker module 4; wherein, the upper cover 111 is provided with a first element 31, the first element 31 and the upper cover 111 As an integral molding structure, the lower cover 112 is provided with a second element 32 , the second element 32 and the lower cover 112 are integrally molded, and the main board 2 is provided with a second electrical connection element 5 .
  • step S2 the upper cover 111 and the lower cover 112 are fixedly connected to form the casing 11, and the battery element 12 is fixedly accommodated in the first accommodation space formed by the upper cover 111 and the lower cover 112. 110; here, the overall packaging process of the battery module 1 is realized after the casing 11 and the battery element 12 are assembled.
  • a first buckle structure 1101 is provided between the upper cover 111 and the lower cover 112, so the The upper cover 111 and the lower cover 112 are snap-fastened through the first snap-fit structure 1101 .
  • Step S3 the main board 2 is fixed on the upper cover 111, and the main board 2 is realized by the first element 31 and the second element 31 and the positive electrode 121 and the negative electrode 122 of the battery element 12 respectively. electrical connection.
  • Step S4 the bracket 41 of the speaker module 4 is covered and fixed on the upper cover 111, and the speaker 42 of the speaker module 4 is electrically connected to the motherboard 2 through the second electrical connection element 5. connect.
  • the upper cover 111 is provided with a second buckle structure 1102 on the side close to the speaker module 4. , the speaker module 4 is snap-fastened through the second snap-fit structure 1102 and the upper cover 111 .
  • the first electrical connection element extends from the first accommodating space through the housing to the second accommodating space, one end of the first electrical connection element is electrically connected to the battery element, and the other end is electrically connected to the battery element.
  • One end extends into the second accommodating space and is electrically connected to the main board; in the above structure, during actual assembly, the main board is installed in the second accommodating space, the main board directly contacts the first electrical connection element and realizes the electrical connection between the main board and the battery element , not only saves the process of winding the cable on the casing, effectively simplifies the circuit structure, but also reduces the solder joints between the main board and the battery module, and saves the electrical contact point between the main board and the battery module.
  • the electrical connection between the speaker module and the main board can be realized by making the speaker module contact with the second electrical connection element, and the speaker module and the second electrical connection element are also omitted.
  • the welding process of the electrical contact points between the electrical connection elements effectively improves the efficiency of assembly.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Battery Mounting, Suspending (AREA)
  • Headphones And Earphones (AREA)

Abstract

本发明提供了一种耳机及其装配方法，该耳机包括电池模块、主板、第一电连接元件、扬声器模块以及第二电连接元件；电池模块包括具有第一收容空间的壳体以及收容于第一收容空间内用于供电的电池元件；扬声器模块固定连接于壳体并与壳体共同围成第二收容空间，主板位于第二收容空间内；主板固定收容于第二收容空间内；第一电连接元件自第一收容空间穿过壳体延伸至第二收容空间内，该第一电连接元件的其中一端与电池元件电连接，另外一端延伸至第二收容空间内与主板电连接；第二电连接元件固定于主板并将主板与扬声器模块电连接。与相关技术相比，本发明的耳机焊点少、电路结构简单且装配效率高。

Description

耳机及其装配方法 技术领域
本发明涉及一种电声转换装置技术领域，尤其涉及一种耳机。
 背景技术
随着移动互联网时代的到来，智能移动设备的数量不断上升。其中，TWS无线耳机面世以来，得到广大消费者喜爱，其需求量也在逐年大幅增加。
相关技术中，TWS无线耳机包括具有第一收容空间的壳体、收容于第一收容空间的电池元件分别固定于壳体外侧的主板以及扬声器箱，主板靠绕制于壳体的线缆与电池元件形成电连接，线缆需要与主板的焊点焊接，而扬声器模组与主板之间也需要焊接以形成两者的电连接。
体积越来较小，功能越来越多，因此，各种电路连接和控制关系也更加复杂，进而带来线路板焊接更多，线缆绕线复杂，生产装配困难，有时需要胶水固定，进而造成产品一致性差，在使用过程中可靠性降低。
 技术问题
然而，相关技术的耳机中，由于各种电路连接和控制关系复杂，需要焊接的焊点多，且线缆绕线复杂，从而使得电路结构复杂；另外，在装配时，由于焊点过多，需要进行多次的焊接，严重影响了TWS无线耳机的装配生产效率。
因此，实有必须提供一种新的耳机解决上述技术问题。
 技术解决方案
本发明的目的在于提供一种焊点少、电路结构简单且装配效率高的耳机。
为了达到上述目的，本发明提供一种耳机，其包括：
电池模块，所述电池模块包括具有第一收容空间的壳体以及收容于所述第一收容空间内用于供电的电池元件；
扬声器模块，所述扬声器模块固定连接于所述壳体远离所述第一收容空间一侧并与所述壳体共同围成第二收容空间；
主板，所述主板固定收容于所述第二收容空间内；
第一电连接元件，所述第一电连接元件自所述第一收容空间穿过所述壳体延伸至所述第二收容空间内，该第一电连接元件的其中一端与所述电池元件电连接，另外一端延伸至所述第二收容空间内与所述主板电连接；以及，
第二电连接元件，所述第二电连接元件固定于所述主板并将所述主板与所述扬声器模块电连接。
优选的，所述第一电连接元件固定于所述壳体，所述第一电连接元件与所述壳体为一体成型结构。
优选的，所述壳体包括上盖以及盖设于所述上盖且与所述上盖共同围成所述第一收容空间的下盖，所述扬声器模组盖设固定于所述上盖，所述主板固定于所述上盖；所述第一电连接元件包括固定于所述上盖的第一元件和固定于所述下盖的第二元件，所述主板通过所述第一元件和所述第二元件分别与所述电池元件的正极和负极实现电连接。
优选的，所述上盖靠近所述主板一侧凹陷形成收容槽，所述主板收容于所述收容槽内，所述扬声器模组盖设于所述收容槽。
优选的，所述第一元件为导电弹片或为弹簧顶针，所述第一元件通过注塑工艺与所述上盖形成一体成型结构。
优选的，所述第二元件为导电弹片，所述第二元件通过注塑工艺与所述下盖形成一体成型结构。
优选的，所述下盖为激光直接成型塑料制成，所述第二元件为激光直接成型线路，所述第二元件通过激光直接成型工艺形成于所述下盖上。
优选的，所述耳机还包括贴设固定于所述壳体外侧的天线元件以及收容于所述第一收容空间内且固定于所述壳体靠近所述天线元件一侧的屏蔽元件，所述屏蔽元件位于所述电池元件与所述天线元件之间用于对所述天线元件进行屏蔽保护。
优选的，所述壳体为激光直接成型塑料制成，所述天线元件为激光直接成型天线，所述天线元件通过激光直接成型工艺形成于所述壳体外侧。
优选的，所述壳体包括设置于所所述上盖和所述下盖之间的第一卡扣结构和设置于所述上盖靠近所述扬声器模组一侧的第二卡扣结构，所述上盖和所述下盖之间通过所述第一卡扣结构实现卡扣固定，所述扬声器模组通过所述第二卡扣结构与所述上盖实现卡扣固定。
优选的，所述壳体还包括密封圈，所述密封圈压紧于所述上盖和所述下盖之间以使所述上盖和所述下盖之间实现密封。
本发明提供一种耳机的装配方法，其包括以下步骤：
步骤S1，提供上盖、下盖、电池元件、主板以及扬声器模组；其中，所述上盖设有第一元件，所述第一元件与所述上盖为一体成型结构，所述下盖设有第二元件，所述第二元件与所述下盖为一体成型结构，所述主板设有第二电连接元件；
步骤S2，将所述上盖与所述下盖固定连接，同时将所述电池元件固定收容于所述上盖和所述下盖形成的第一收容空间内；
步骤S3，将所述主板固定于所述上盖，并使所述主板通过所述第一元件和所述第二元件分别与所述电池元件的正极和负极实现电连接；
步骤S4，将所述扬声器模组固定于所述上盖，并使所述扬声器模组通过所述第二电连接元件与所述主板实现电连接。
优选的，在所述步骤S2中，所述上盖和所述下盖设有第一卡扣结构，所述上盖和所述下盖之间通过所述第一卡扣结构实现卡扣固定。
优选的，在所述步骤S4中，所述上盖靠近所述扬声器模组一侧设有第二卡扣结构，所述扬声器模组通过所述第二卡扣结构与所述上盖实现卡扣固定。
 有益效果
与相关技术相比，本发明的耳机中，第一电连接元件自第一收容空间穿过壳体延伸至第二收容空间内，该第一电连接元件的其中一端与电池元件电连接，另外一端延伸至第二收容空间内与主板电连接；上述结构中，在实际装配时，主板安装于第二收容空间内，主板直接第一电连接元件接触并实现主板与电池元件之间的电连接，不仅省去了在壳体上绕制线缆的工序，有效简化电路结构简单，还减少了主板与电池模组之间的焊点，省去了主板与电池模组之间的电接触点的焊接工序，另外，通过第二电连接元件的设置，使得扬声器模组与第二电连接元件接触即可实现扬声器模组与主板之间的电连接，也省去了扬声器模组与第二电连接元件之间的电接触点的焊接工序，有效提高了装配的效率。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图，其中：
图1为本发明耳机的结构示意图；
图2为本发明耳机的装配方法的意图。
 本发明的实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。
请同时参阅图1-2，本发明提供了一种耳机100，其包括电池模块1、主板2、第一电连接元件3、扬声器模组4以及第二电连接元件5。
所述电池模块1包括具有第一收容空间110的壳体11以及收容于所述第一收容空间110内用于供电的电池元件12。
在本实施方式中，所述壳体11包括上盖111以及盖设于所述上盖111且与所述上盖111共同围成所述第一收容空间110的下盖112；所述电池元件12为纽扣电池，其包括正极121和负极122，该电池元件12在封装之前已经由铝塑膜将内部电芯进行了一次封装，该设置更好地保护了所述电池元件12的内部电芯，保证其可靠性。
所述扬声器模块4固定连接于所述壳体11并与所述壳体11共同围成所述第二收容空间40；所述主板2固定于所述壳体11的外侧并位于所述第二收容空间40内，所述第一电连接元件3自所述第一收容空间110穿过所述壳体11延伸至所述第二收容空间40内，该第一电连接元件3的其中一端与所述电池元件12电连接，另外一端延伸至所述第二收容空间40内所述主板2电连接，所述第二电连接元件5固定于所述主板2靠近所述上扬声器模模块4一侧，所述扬声器模块4通过所述第二电连接元件5与所述主板2实现电连接。
值得一提的是，为了方便装配，在本实施方式中，将所述第一电连接元件3集成在所述壳体11上，更具体的，所述第一电连接元件3固定于所述壳体11，所述第一电连接元件3与所述壳体11为一体成型结构。
进一步的，所述第一电连接元件3包括固定于所述上盖111并与所述正极121电连接的第一元件31和固定于所述下盖112并与所述负极122电连接的第二元件32；所述主板2固定于所述上盖111，所述主板2通过所述第一元件31和所述第二元件32分别与所述电池元件12的正极121和负极122实现电连接；所述扬声器模组4盖设固定于所述上盖111并位于所述主板2远离所述上盖111的一侧，更具体的，所述扬声器模块4包括固定盖设于定于所述上盖111的支架41以及固定于所述支架41靠近所述主板2一侧的扬声器42，所述扬声器42与所述主板2正对设置且通过所述第二电连接元件5与所述主板2实现电连接。
优选的，所述上盖111靠近所述主板2一侧凹陷形成收容槽1110，所述主板2收容于所述收容槽1110内，所述扬声器模组4的支架41盖设于所述收容槽1110，此时，所述收容槽1110充当所述第二收容空间40，所述第一元件31和所述第二元件32分别延伸至所述收容槽1110内，通过该收容槽1110的设置，有效地提高了壳体11的空间利用率，从而减小耳机100的整体尺寸，使得更有利于耳机100的小型化设计。
值得一提的是，所述第一元件31为导电弹片或为弹簧顶针（即pogopin针），所述第一元件31通过注塑工艺与所述上盖111形成一体成型结构。而所述第二元件32为导电弹片或激光直接成型线路（即LDS线路，LDS英文全称Laser Direct Structuring，中文称激光直接成型技术），比如，在本实施方式中，所述下盖112为激光直接成型塑料（即LDS塑料）制成，所述第二元件32为激光直接成型线线路，即所述第二元件32通过激光直接成型工艺（即LDS工艺）形成于所述下盖112上；当然，在其他实施方式中，下盖也可以为导电弹片，此时，第二元件通过注塑工艺与下盖形成一体成型结构。
而所述第二电连接元件5为导电弹片或为弹簧顶针，比如，在本实施方式中，所述第二电连接元件5为弹簧顶针，该弹簧顶针通过SMT工艺（英文全称Surface Mount Technology ，即表面贴装技术）装设于所述主板2上。
上述结构中，将第一元件31和第二元件32分别直接集成于上盖111和下盖112上，在实际装配时，将所述上盖111和所述下盖112组配在一起后，即使得内部的电池元件12分别与第一元件31和第二元件32电连接，然后将主板2组配在所述上盖111，主板2则直接与第一元件31和第二元件32实现了电连接，此处，无需另外设置线缆以使主板2与电池模组1之间实现电连接，避免了相关技术中设置多余的线缆和线缆绕线复杂的问题，有效简化电路结构简单，同时也有效地减少了主板2与电池模组1之间的焊点，使得在实际装配过程中，只需直接将各个模块进行组装即可，省去了主板2与电池模组1之间的电接触点的焊接工序，另外，通过第二电连接元件5的设置，使得扬声器模组4的扬声器42与第二电连接元件5接触即可实现扬声器42与主板2之间的电连接，也有效地省去了扬声器42与第二电连接元件5之间的电接触点的焊接工序，有效提高了装配的效率。
更优的，为了使装配更加便利，所述壳体11包括设置于所所述上盖111和所述下盖112之间的第一卡扣结构1101和设置于所述上盖111靠近所述扬声器模组4的支架41一侧的第二卡扣结构1102，所述上盖111和所述下盖112之间通过所述第一卡扣结构1101实现卡扣固定，所述支架41通过所述第二卡扣结构1102与所述上盖111实现卡扣固定，上述的卡扣设置，省去了装配是的打胶工序，使得所述电池模组1的封装和所述扬声器模组4装配在所述电池模组1上更加快捷便利，装配工序简单，有效提高装配效率，更有利于自动化生产。
为了保证所述壳体11内部的密封性，所述壳体11可以增设密封圈7，所述密封圈7压紧于所述上盖111和所述下盖112之间以使所述上盖111和所述下盖112之间实现密封，即将所述电池元件12收容于密封腔体内，以避免外部的水汽或异物进入到所述第一收容空间110内，从而对所述电池元件12造成不良影响，提高所述电池元件12的可靠性。
更优的，所述耳机100还包括贴设固定于所述壳体11的外侧的天线元件6以及收容于所述第一收容空间110内且固定于所述壳体11靠近所述天线元件6一侧的屏蔽元件7，所述屏蔽元件7位于所述电池元件12与所述天线元件6之间用于对所述天线元件6进行屏蔽保护。
值得一提的是，所述天线元件6为激光直接成型天线（即LDS天线），所述天线元件6通过激光直接成型工艺（即LDS工艺）形成于所述壳体11的下盖112上；当然，在其他实施方式中，天线元件也可以通过SMT工艺贴设固定于壳体上。
本发明提供一种上述耳机100的制造方法，其包括以下步骤：
步骤S1，提供上盖111、下盖112、电池元件12、主板2以及扬声器模组4；其中，所述上盖111设有第一元件31，所述第一元件31与所述上盖111为一体成型结构，所述下盖112设有第二元件32，所述第二元件32与所述下盖112为一体成型结构，所述主板2设有第二电连接元件5。
步骤S2，将所述上盖111与所述下盖112固定连接以形成壳体11，同时将所述电池元件12固定收容于所述上盖111和所述下盖112形成的第一收容空间110内；此处，所述壳体11和所述电池元件12组配后即实现了电池模组1的整体封装工序。
更优的，在所述步骤S2中，为了使上盖111和下盖112之间的装配更加便利，所述上盖111和所述下盖112之间设有第一卡扣结构1101，所述上盖111和所述下盖112之间通过所述第一卡扣结构1101实现卡扣固定。
步骤S3，将所述主板2固定于所述上盖111，并使所述主板2通过所述第一元件31和所述第二元件31分别与所述电池元件12的正极121和负极122实现电连接。
步骤S4，将所述扬声器模组4的支架41盖设固定于所述上盖111，并使所述扬声器模组4的扬声器42通过所述第二电连接元件5与所述主板2实现电连接。
更优的，在所述步骤S4中，为了使扬声器模组4和上盖111之间的装配更加便利，所述上盖111靠近所述扬声器模组4一侧设有第二卡扣结构1102，所述扬声器模组4通过所述第二卡扣结构1102与所述上盖111实现卡扣固定。
与相关技术相比，本发明的耳机中，第一电连接元件自第一收容空间穿过壳体延伸至第二收容空间内，该第一电连接元件的其中一端与电池元件电连接，另外一端延伸至第二收容空间内与主板电连接；上述结构中，在实际装配时，主板安装于第二收容空间内，主板直接第一电连接元件接触并实现主板与电池元件之间的电连接，不仅省去了在壳体上绕制线缆的工序，有效简化电路结构简单，还减少了主板与电池模组之间的焊点，省去了主板与电池模组之间的电接触点的焊接工序，另外，通过第二电连接元件的设置，使得扬声器模组与第二电连接元件接触即可实现扬声器模组与主板之间的电连接，也省去了扬声器模组与第二电连接元件之间的电接触点的焊接工序，有效提高了装配的效率。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其它相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (14)

  1. 一种耳机，其特征在于，其包括：
    电池模块，所述电池模块包括具有第一收容空间的壳体以及收容于所述第一收容空间内用于供电的电池元件；
    扬声器模块，所述扬声器模块固定连接于所述壳体远离所述第一收容空间一侧并与所述壳体共同围成第二收容空间；
    主板，所述主板固定收容于所述第二收容空间内；
    第一电连接元件，所述第一电连接元件自所述第一收容空间穿过所述壳体延伸至所述第二收容空间内，该第一电连接元件的其中一端与所述电池元件电连接，另外一端延伸至所述第二收容空间内与所述主板电连接；以及，
    第二电连接元件，所述第二电连接元件固定于所述主板并将所述主板与所述扬声器模块电连接。
  2. 根据权利要求1所述的耳机，其特征在于，所述第一电连接元件固定于所述壳体，所述第一电连接元件与所述壳体为一体成型结构。
  3. 根据权利要求2所述的耳机，其特征在于，所述壳体包括上盖以及盖设于所述上盖且与所述上盖共同围成所述第一收容空间的下盖，所述扬声器模组盖设固定于所述上盖，所述主板固定于所述上盖；所述第一电连接元件包括固定于所述上盖的第一元件和固定于所述下盖的第二元件，所述主板通过所述第一元件和所述第二元件分别与所述电池元件的正极和负极实现电连接。
  4. 根据权利要求3所述的耳机，其特征在于，所述上盖靠近所述主板一侧凹陷形成收容槽，所述主板收容于所述收容槽内，所述扬声器模组盖设于所述收容槽。
  5. 根据权利要求3所述的耳机，其特征在于，所述第一元件为导电弹片或为弹簧顶针，所述第一元件通过注塑工艺与所述上盖形成一体成型结构。
  6. 根据权利要求3所述的耳机，其特征在于，所述第二元件为导电弹片，所述第二元件通过注塑工艺与所述下盖形成一体成型结构。
  7. 根据权利要求3所述的耳机，其特征在于，所述下盖为激光直接成型塑料制成，所述第二元件为激光直接成型线路，所述第二元件通过激光直接成型工艺形成于所述下盖上。
  8. 根据权利要求1所述的耳机，其特征在于，所述耳机还包括贴设固定于所述壳体外侧的天线元件以及收容于所述第一收容空间内且固定于所述壳体靠近所述天线元件一侧的屏蔽元件，所述屏蔽元件位于所述电池元件与所述天线元件之间用于对所述天线元件进行屏蔽保护。
  9. 根据权利要求8所述的耳机，其特征在于，所述壳体为激光直接成型塑料制成，所述天线元件为激光直接成型天线，所述天线元件通过激光直接成型工艺形成于所述壳体外侧。
  10. 根据权利要求3所述的耳机，其特征在于，所述壳体包括设置于所所述上盖和所述下盖之间的第一卡扣结构和设置于所述上盖靠近所述扬声器模组一侧的第二卡扣结构，所述上盖和所述下盖之间通过所述第一卡扣结构实现卡扣固定，所述扬声器模组通过所述第二卡扣结构与所述上盖实现卡扣固定。
  11. 根据权利要求10所述的耳机，其特征在于，所述壳体还包括密封圈，所述密封圈压紧于所述上盖和所述下盖之间以使所述上盖和所述下盖之间实现密封。
  12. 一种耳机的装配方法，其特征在于，其包括以下步骤：
    步骤S1，提供上盖、下盖、电池元件、主板以及扬声器模组；其中，所述上盖设有第一元件，所述第一元件与所述上盖为一体成型结构，所述下盖设有第二元件，所述第二元件与所述下盖为一体成型结构，所述主板设有第二电连接元件；
    步骤S2，将所述上盖与所述下盖固定连接，同时将所述电池元件固定收容于所述上盖和所述下盖形成的第一收容空间内；
    步骤S3，将所述主板固定于所述上盖，并使所述主板通过所述第一元件和所述第二元件分别与所述电池元件的正极和负极实现电连接；
    步骤S4，将所述扬声器模组固定于所述上盖，并使所述扬声器模组通过所述第二电连接元件与所述主板实现电连接。
  13. 根据权利要求12所述的耳机的装配方法，其特征在于，在所述步骤S2中，所述上盖和所述下盖设有第一卡扣结构，所述上盖和所述下盖之间通过所述第一卡扣结构实现卡扣固定。
  14. 根据权利要求12所述的耳机的装配方法，其特征在于，在所述步骤S4中，所述上盖靠近所述扬声器模组一侧设有第二卡扣结构，所述扬声器模组通过所述第二卡扣结构与所述上盖实现卡扣固定。
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CN113635053A (zh) * 2021-09-14 2021-11-12 东莞市猎声电子科技有限公司 一种耳机组装设备

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107889003A (zh) * 2016-09-30 2018-04-06 深圳市三诺声智联股份有限公司 一种无线耳机
CN208386867U (zh) * 2018-06-04 2019-01-15 Oppo广东移动通信有限公司 无线耳机
CN208707887U (zh) * 2018-09-11 2019-04-05 深圳市沃特沃德股份有限公司 蓝牙耳机的主板固定结构
CN208707890U (zh) * 2018-09-11 2019-04-05 深圳市沃特沃德股份有限公司 蓝牙耳机电池的固定结构
CN110198503A (zh) * 2019-04-25 2019-09-03 华为技术有限公司 一种无线耳机
CN110519671A (zh) * 2019-08-26 2019-11-29 华为技术有限公司 无线耳机
US20200204900A1 (en) * 2018-12-20 2020-06-25 Concraft Holding Co., Ltd. Inner module used in a wireless earphone

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9491880B2 (en) * 2014-08-12 2016-11-08 Google Technology Holdings LLC Circuit assembly for compact acoustic device
CN208724160U (zh) * 2018-09-11 2019-04-09 深圳市沃特沃德股份有限公司 蓝牙耳机
CN109660900A (zh) * 2018-12-31 2019-04-19 周利英 真无线蓝牙耳机
CN209419799U (zh) * 2019-03-25 2019-09-20 安克创新科技股份有限公司 一种蓝牙耳机
CN110049398A (zh) * 2019-05-23 2019-07-23 深圳市迈斯高科技有限公司 一种新型耳机结构及组装方法
CN210609609U (zh) * 2019-09-26 2020-05-22 中山市嵘鑫电子科技有限公司 一种蓝牙耳机内部模块无焊接连接结构

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107889003A (zh) * 2016-09-30 2018-04-06 深圳市三诺声智联股份有限公司 一种无线耳机
CN208386867U (zh) * 2018-06-04 2019-01-15 Oppo广东移动通信有限公司 无线耳机
CN208707887U (zh) * 2018-09-11 2019-04-05 深圳市沃特沃德股份有限公司 蓝牙耳机的主板固定结构
CN208707890U (zh) * 2018-09-11 2019-04-05 深圳市沃特沃德股份有限公司 蓝牙耳机电池的固定结构
US20200204900A1 (en) * 2018-12-20 2020-06-25 Concraft Holding Co., Ltd. Inner module used in a wireless earphone
CN110198503A (zh) * 2019-04-25 2019-09-03 华为技术有限公司 一种无线耳机
CN110519671A (zh) * 2019-08-26 2019-11-29 华为技术有限公司 无线耳机

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