WO2021259360A1 - 卡套及电子设备 - Google Patents

卡套及电子设备 Download PDF

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Publication number
WO2021259360A1
WO2021259360A1 PCT/CN2021/102101 CN2021102101W WO2021259360A1 WO 2021259360 A1 WO2021259360 A1 WO 2021259360A1 CN 2021102101 W CN2021102101 W CN 2021102101W WO 2021259360 A1 WO2021259360 A1 WO 2021259360A1
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WO
WIPO (PCT)
Prior art keywords
board
plug
connection
connection point
boards
Prior art date
Application number
PCT/CN2021/102101
Other languages
English (en)
French (fr)
Inventor
朱志峰
刘兆恒
么东升
Original Assignee
中兴通讯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Priority to US17/928,378 priority Critical patent/US20230225089A1/en
Priority to EP21829318.1A priority patent/EP4145968A4/en
Publication of WO2021259360A1 publication Critical patent/WO2021259360A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554—Forced ventilation of a gaseous coolant
    • H05K7/20563—Forced ventilation of a gaseous coolant within sub-racks for removing heat from electronic boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q1/00—Details of selecting apparatus or arrangements
    • H04Q1/02—Constructional details
    • H04Q1/025—Cabinets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q1/00—Details of selecting apparatus or arrangements
    • H04Q1/02—Constructional details
    • H04Q1/035—Cooling of active equipments, e.g. air ducts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1461—Slidable card holders; Card stiffeners; Control or display means therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554—Forced ventilation of a gaseous coolant
    • H05K7/20572—Forced ventilation of a gaseous coolant within cabinets for removing heat from sub-racks, e.g. plenum
    • H05K7/20581—Cabinets including a drawer for fans

Definitions

  • the present disclosure relates to the field of communication technology, and in particular to card sleeves and electronic equipment.
  • the orthogonal architecture derives that the air duct form of the architecture is front and rear air ducts.
  • the air ducts of the previously developed boards are adapted to the air ducts of the system at that time, and most of the air ducts of the boards are left and right air ducts.
  • downward compatibility of boards is almost a strong demand.
  • the left and right air duct form cards are not compatible with the air ducts applied to the orthogonal architecture without changing the heat dissipation measures.
  • the embodiments of the present disclosure provide a ferrule adapted to a board card, the board having a first tuyere and a second tuyere; the ferrule includes:
  • a substrate having a first side and a second side that are oppositely arranged, and a third side and a fourth side that are connected between the first side and the second side and are oppositely arranged;
  • the first side plate and the second side plate are separately provided on the first side and the second side of the substrate; and both the first side plate and the second side plate have hollow patterns;
  • connection backplane is arranged on the fourth side of the substrate.
  • At least one plug-in board is arranged on the substrate, and the extension direction of the plug-in board intersects with the extension direction of the third side of the substrate.
  • an embodiment of the present disclosure provides an electronic device, which includes the above-mentioned ferrule and a board; the board is fixed on the ferrule.
  • Fig. 1 is a top view of an exemplary electronic device
  • Figure 2 is a schematic diagram of an exemplary board
  • FIG. 3 is a schematic diagram of the structure of the ferrule of the embodiment of the disclosure.
  • FIG. 4 is a top view of the substrate of the ferrule according to the embodiment of the disclosure.
  • FIG. 5 is a top view of an example of the ferrule of the embodiment of the disclosure.
  • Figure 6 is a top view of an electronic device using the card sleeve of Figure 5;
  • FIG. 7 is a top view of an example of the ferrule of the embodiment of the disclosure.
  • FIG. 8 is a top view of an electronic device using the card sleeve of FIG. 7;
  • FIG. 9 is a top view of an example of the ferrule of the embodiment of the disclosure.
  • FIG. 10 is a top view of an electronic device using the card sleeve of FIG. 9;
  • FIG. 11 is a schematic diagram of an example of an electronic device according to an embodiment of the disclosure.
  • FIG. 12 is a schematic diagram of an example of an electronic device according to an embodiment of the disclosure.
  • FIG. 13 is a schematic diagram of an example of an electronic device according to an embodiment of the disclosure.
  • FIG. 14 is a schematic diagram of an example of an electronic device according to an embodiment of the disclosure.
  • FIG. 15 is a schematic diagram of an example of an electronic device according to an embodiment of the disclosure.
  • Exemplary electronic devices include, but are not limited to, switches.
  • the electronic device is a switch as an example for description.
  • the switch includes a chassis 00, a connector 20 arranged in the chassis 00, a board 10 (may be a service line board) and a network board 30 respectively located on the front side and the rear side of the connection backplane.
  • the board 10 and the net board 30 are arranged in an orthogonal structure, and the board 10 and the net board 30 are connected by a connector 20.
  • a fan 40 is also provided in the chassis 00, and the fan 40 is located on the side of the net board 30 away from the board card 10.
  • an air duct adapted to the fan 40 is formed on the board 10 and the net board 30. It is found through research that in the electronic device of the orthogonal architecture, the board 10 and the net board 30 both adopt front and rear air ducts, so that the fan 40 can guide the wind and dissipate the electronic device. In related products, some boards 10 use left and right air ducts. As shown in Figure 2, when this type of board 10 is applied to a switch, the air duct direction of the board 10 is different from that of the fan 40, resulting in The board 10 cannot effectively dissipate heat.
  • an embodiment of the present disclosure provides a ferrule 50, the ferrule 50 is adapted to the board 10, and the board 10 has a first air port and a second air port that are arranged oppositely; One of the first air port and the second air port is an air inlet, the other is an air outlet, and the air inlet and the air outlet form an air duct.
  • the ferrule 50 in the embodiment of the present disclosure includes: a base plate 51, a first side plate 52, a second side plate 53, which is connected to a back plate 54, and at least one plug-in plate.
  • the substrate 51 is a rectangular substrate 51, which includes a first side 511 and a second side 512 disposed oppositely, and a third side connected between the first side 511 and the second side 512 and disposed oppositely. Side 513 and fourth side 514.
  • the connection point between the first side 511 and the third side 513 is the first connection point a
  • the connection point between the first side 511 and the fourth side 514 is the second connection point b
  • the connection point between the second side 512 and the third side 513 It is the third connection point c
  • the connection point between the second side 512 and the fourth side 514 is the fourth connection point d.
  • Both the first side plate 52 and the second side plate 53 have a hollow pattern, and they are respectively disposed on the first side 511 and the second side 512 of the substrate 51.
  • the hollow patterns on the first side plate 52 and the second side plate 53 may be square openings, and the hollow patterns on the first side plate 52 and the second side plate 53 may be the same as the hollow patterns on the first side plate 52 and the second side plate 53 when the card 10 is installed on the ferrule 50.
  • the first tuyere and the second tuyere on the board 10 correspond to each other.
  • connection back plate 54 is connected to the fourth side 514 of the base plate 51 for connecting the board 10 and the net plate 30.
  • the interposer is disposed on the substrate 51, and the extension direction of the interposer intersects the extension direction of the third side 513 of the substrate 51, and the interposer is arranged obliquely with respect to the substrate 51.
  • the first side 511 and the second side 512 of the base plate 51 are respectively provided with clamping parts.
  • the clamping sleeve 50 is inserted into the chassis 00,
  • the clamping part on the base plate 51 is matched with the fixing part on the side wall of the chassis 00 so that the board card 10 is fixed in the chassis 00.
  • the fixing part on the side wall of the chassis 00 may be a sliding groove, and the clamping part is fixed in the sliding groove, so that the board card 10 is fixed in the chassis 00.
  • the ferrule 50 in the embodiment of the present disclosure is compatible with the board card 10 of the left and right air ducts, and the ferrule 50 is provided with an insert board, and the inserting and pulling are arranged obliquely with respect to the base plate 51 (with the extension direction of the insert board and The extending directions of the first side 511 and the third side 513 of the base plate 51 intersect as an example). Therefore, when the board 10 is inserted into the chassis 00 through the card sleeve 50, after the fan 40 on the rear side of the chassis 00 is turned on, the fan 40 Under the action of, the wind enters from the front side of the chassis 00 and blows to the insert plate.
  • the first air outlet on the board 10 is used as an air inlet, and the second air outlet is used as an air outlet.
  • the first air outlet on the board 10 is used as an air inlet
  • the second air outlet is used as an air outlet.
  • FIG. 5 there are multiple insert boards in the card sleeve 50.
  • One insert board is the first insert board 551, and the remaining insert boards are the second insert boards 552; the number of the second insert boards 552 can be one, or It can be more than one.
  • connection back plate 54 on the ferrule 50 is connected to the fourth side 514 of the base plate 51, and the first end of the connection back plate 54 is connected to the second connection point b, and there is a certain distance between the second end and the fourth connection point d , And an opening is provided on the connection back plate 54.
  • the connector on the board 10 is connected to the connection backplane 54.
  • the first connection end of the first plug-in board 551 is connected to the third connection point c
  • the second connection end of the second plug-in board 552 is connected to the fourth side 514 of the base plate 51 and is correspondingly connected to the second end of the back plate 54.
  • Each second plug-in board 552 is arranged at intervals, and the first end of each second plug-in board 552 is connected to the third side 513 of the substrate 51, and there is a certain distance between the first connection point a and the third connection point c
  • the second end of each second plug-in board 552 is connected to the first side 511 of the base plate 51; the second end of the second plug-in board 552 closest to the first plug-in board 551 can be connected to the second connection point b.
  • the wind direction changes from the first air inlet (air inlet) of the board 10 to the second air outlet (air outlet) to dissipate heat from the board 10 on the side wall of the chassis 00.
  • a part of the wind discharged from the second air outlet of the board 10 is discharged between the first inserting plate 551 and the second side plate 53, and between the second side plate 53 and the side plate of the chassis 00 disposed opposite thereto.
  • the dotted arrows shown in FIGS. 5 to 10 all refer to the wind direction passing through the ferrule 50; while the solid arrows refer to the wind direction in the board 10 and the screen 30.
  • the board 10 is inserted into the chassis 00 through the ferrule 50.
  • the connector 21 on the board 10 and the connector 22 of the network board 30 are connected through the connection backplane 54 to form an orthogonal structure of electronics.
  • the device, a fan 40 arranged on the side of the net board 30 away from the board 10, exhausts the wind discharged from the board 10 into the front and rear air ducts of the net board 30 to complete the heat dissipation of the board 10 and the net board 30.
  • the difference is that the first air outlet of the board 10 to which the card sleeve 50 is adapted is an air outlet, and the second air outlet is an air inlet.
  • the first air outlet of the board 10 to which the card sleeve 50 is adapted is an air outlet
  • the second air outlet is an air inlet.
  • the first insert 551 there are multiple insert boards in the card sleeve 50, one of which is the second insert 552, and the other inserts are the first insert 551; the number of the first insert 551 can be one, or It can be more than one. In FIG. 7, the number of the first plug-in boards 551 is taken as an example for description.
  • connection back plate 54 on the ferrule 50 is connected to the fourth side 514 of the base plate 51, and the second end of the connection back plate 54 is connected to the fourth connection point d, and there is a certain distance between the first end and the second connection point b. Distance, and an opening 541 is provided on the connection back plate 54.
  • the connector on the board 10 is connected to the connection backplane 54.
  • the first connection end of the second plug-in board 552 is connected to the first connection point a, and the second connection end of the first plug-in board 551 is connected to the fourth side 514 of the base plate 51 and is correspondingly connected to the first end of the back plate 54.
  • Each first plug-in board 551 is arranged at intervals, and the first end of each first plug-in board 551 is connected to the third side 513 of the base plate 51, and there is a certain distance between the first connection point a and the third connection point c
  • the second end of each first plug-in board 551 is connected to the second side 512 of the base plate 51; the second end of the first plug-in board 551 closest to the second plug-in board 552 can be connected to the fourth connection point d.
  • the other part of the wind blows between two adjacent first insert plates 551 and between the first insert plate 551 and the second side plate 53 through the hollow pattern on the second side plate 53 to be opposite to the second side plate 53 Then, the wind direction changes from the first air inlet (air inlet) of the board 10 to the second air outlet (air outlet) to dissipate heat from the board 10 on the side wall of the chassis 00.
  • a part of the wind discharged from the second air outlet of the board 10 is discharged from between the second inserting plate 552 and the first side plate 52, and between the first side plate 52 and the side plate of the chassis 00 disposed opposite thereto.
  • the board 10 is inserted into the chassis 00 through the ferrule 50.
  • the connector 21 on the board 10 and the connector 22 of the network board 30 are connected through the connection backplane 54 to form an orthogonal electronic structure.
  • the device, a fan 40 arranged on the side of the net board 30 away from the board 10, exhausts the wind discharged from the board 10 into the front and rear air ducts of the net board 30 to complete the heat dissipation of the board 10 and the net board 30.
  • both the first air opening and the second air opening of the board 10 are air inlets.
  • the connection backplane 54 on the ferrule 50 includes a first sub-connection backplane 541 and a second sub-connection backplane 542 that are arranged at intervals; the first sub-connection backplane 541 and the second sub-connection backplane 542 Both are connected to the fourth side 514 of the substrate 51, the first end of the first sub-connection backplane 541 is connected to the second connection point b, and the second end of the second sub-connection backplane 542 is connected to the fourth connection point d.
  • the number of insert boards on the ferrule 50 is multiple, a part of the plurality of insert boards is the first insert board 551, and the remaining part is the second insert board 552.
  • the number of the first plug boards 551 and the second plug boards 552 can be different, and the first plug boards 551 and There may also be one second plug board 552, or three or more.
  • the number of the first plug board 551 and the second plug board 552 is not limited, and only the first plug board 551 and the second plug board 552 are used. Two boards 552 are described as an example.
  • the two first insert plates 551 are arranged at intervals, and the two second insert plates 552 are arranged at intervals; the first ends of the first insert plates 551 and the second insert plates 552 are both connected to the third side 513 of the base plate 51, and the second ends are both connected to the third side 513 of the base plate 51.
  • the distance from the second end of the second end to the second connection point b is greater than or equal to the distance from the second end of the second plug-in board 552 to the second connection point b.
  • first ends of the first and second interposing boards 551 and 552 that are arranged adjacently are connected to the same point on the third side 513 of the base plate 51, and the second end of the first interposing plate 551 is connected to the base plate.
  • the fourth side 514 of 51 corresponds to the first end of the second sub-connection back plate 542, and the second end of the second plug board 552 is connected to the fourth side 514 of the base plate 51 and corresponds to the second end of the first sub-connection back plate 541.
  • the connector 21 on the board card 10 and the connector 22 of the network board 30 are connected through the connection backplane 54 to form an electronic system of the orthogonal architecture.
  • the device, the fan 40 arranged on the side of the net board 30 away from the board 10, exhausts the wind discharged from the board 10 into the front and rear air ducts of the net board 30 to complete the heat dissipation of the board 10 and the net board 30.
  • an embodiment of the present disclosure provides an electronic device.
  • the electronic device includes the aforementioned ferrule 50, a board 10 arranged on the ferrule 50, and a board connected to the board 10
  • the net board 30; the board 10 and the net board 30 adopt an orthogonal architecture.
  • the connection backplane 54 of the board card 10 and the ferrule 50 is connected through the connector 21; the net board 30 is connected to the connection backplane 54 of the ferrule 50 through the connector 22.
  • the electronic device may be a router.
  • the ferrule 50 is adapted to the board card 10 of the left and right air ducts, and an insert board is provided on the ferrule 50, and the insertion and removal is inclined with respect to the substrate 51 Set (taking the extension direction of the plug-in board intersecting the extension direction of the first side 511 and the third side 513 of the base plate 51 as an example), therefore, when the board 10 is inserted into the chassis 00 through the card sleeve 50, the rear of the chassis 00 After the side fan 40 is turned on, under the action of the fan 40, the wind enters from the front side of the chassis 00 and blows to the plug-in board.
  • the wind blows from the hollow pattern on the first side plate 52 to the AND of the chassis 00. After the opposite side wall of the first side plate 52, the wind direction changes. At this time, the wind blows from the first air outlet of the board 10 to the second air outlet to dissipate the heat of the board 10. That is to say, after the boards 10 of the left and right air ducts are fixed on the ferrule 50, and then applied to the electronic device of the orthogonal architecture, good heat dissipation can also be achieved.
  • the electronic device further includes a fan 40 arranged in the chassis 00 to dissipate heat from the board 10 and the net board 30.
  • the number of fans 40 is multiple, and multiple fans 40 are arranged side by side on the side of the net plate 30 away from the board 10.
  • the number of fans 40 is large, which facilitates the heat dissipation of the board 10 and the net board 30, and the heat dissipation effect is better.
  • the energy consumption of the fan 40 can be considered, and the number of fans 40 and the installation area of the fans 40 can be set reasonably; the fans 40 can be installed in three areas.
  • a fan 40 is arranged in the middle area of the chassis 00.
  • the fans 40 are arranged in two areas, and the fans 40 in the two areas are respectively arranged on the side of the screen 30 away from the board 10 and are located at the corners of the chassis 00.
  • the number of fans 40 is small, which can reduce power consumption while dissipating heat from the board 10 and the net board 30.
  • the fan 40 can also be arranged in one area.
  • the fan 40 is arranged on the side of the net board 30 away from the board 10 and is located at the corner of the chassis 00.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本公开实施例提供了一种卡套，与板卡相适配，所述板卡具有第一风口和第二风口；所述卡套包括：基板，其具有相对设置的第一侧和第二侧，以及连接在所述第一侧和所述第二侧之间，且相对设置的第三侧和第四侧；第一侧板、第二侧板，分设于所述基板的所述第一侧和所述第二侧；且所述第一侧板和所述第二侧板上均具有镂空图案；当所述板卡固定在所述卡套上时，所述第一侧板与所述板卡的第一风口相对，所述第二侧板与所述板卡的第二风口相对；连接背板，设置在所述基板的第四侧；至少一个插板，设置在所述基板上，且所述插板的延伸方向与所述基板的第三侧的延伸方向相交。本公开实施例还提供了一种包含上述卡套的电子设备。

Description

卡套及电子设备
相关申请的交叉引用
本申请要求于2020年6月24提交的中国专利申请NO.202010589070.0的优先权，该中国专利申请的内容通过引用的方式整体合并于此。
技术领域
本公开涉及通信技术领域，尤其涉及卡套及电子设备。
背景技术
在市场趋势对中大型路由交换设备高度敏感的引导下氤氲而生的正交架构，决定了该架构的风道形式为前后风道。而此前开发的板卡的风道为适应当时系统的风道，绝大多数板卡的风道形式为左右风道。面向市场大客户——运营商，板卡向下兼容几乎是强需求。很显然，左右风道形式板卡在不改变散热措施情况下，无法兼容应用于正交架构的风道。同时，随着系统业务量的不断提升，交换网板槽位数量的增加还会带来前后板卡的热级联问题。在存在热级联的情况下，左右风道形式的板卡在正交架构风道下如何兼顾风道下游交换网板的散热，也存在一定的问题。
公开内容
第一方面，本公开实施例提供一种卡套，与板卡相适配，所述板卡具有第一风口和第二风口；所述卡套包括：
基板，其具有相对设置的第一侧和第二侧，以及连接在所述第一侧和所述第二侧之间，且相对设置的第三侧和第四侧；
第一侧板、第二侧板，分设于所述基板的所述第一侧和所述第二侧；且所述第一侧板和所述第二侧板上均具有镂空图案；当所述板 卡固定在所述卡套上时，所述第一侧板与所述板卡的第一风口相对，所述第二侧板与所述板卡的第二风口相对；
连接背板，设置在所述基板的第四侧；以及
至少一个插板，设置在所述基板上，且所述插板的延伸方向与所述基板的第三侧的延伸方向相交。
第二方面，本公开实施例提供一种电子设备，其包括上述的卡套和板卡；板卡固定在卡套上。
附图说明
附图用来提供对本公开的进一步理解，并且构成说明书的一部分，与下面的具体实施方式一起用于解释本公开，但并不构成对本公开的限制。在附图中：
图1为一种示例性的电子设备的俯视图；
图2为一种示例性的板卡的示意图；
图3为本公开实施例的卡套的结构示意图；
图4为本公开实施例的卡套的基板俯视图；
图5为本公开实施例的卡套的示例的俯视图；
图6为应用图5的卡套的电子设备的俯视图；
图7为本公开实施例的卡套的示例的俯视图；
图8为应用图7的卡套的电子设备的俯视图；
图9为本公开实施例的卡套的示例的俯视图；
图10为应用图9的卡套的电子设备的俯视图；
图11为本公开实施例的电子设备的示例的示意图；
图12为本公开实施例的电子设备的示例的示意图；
图13为本公开实施例的电子设备的示例的示意图；
图14为本公开实施例的电子设备的示例的示意图；以及
图15为本公开实施例的电子设备的示例的示意图。
具体实施方式
应当理解，此处所描述的具体实施例仅仅用以解释本公开，并 不用于限定本公开。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“一个”、“一”或者“该”等类似词语也不表示数量限制，而是表示存在至少一个。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
示例性的电子设备包括但不限于交换机。在以下描述中以电子设备为交换机为例进行描述。如图1所示，该交换机包括机箱00、设置在机箱00内的连接器20、分别位于连接背板的前侧和后侧的板卡10(可以为业务线板)和网板30。板卡10和网板30以正交架构形式排布，板卡10和网板30通过连接器20连接。为实现散热，在机箱00内还设置有风扇40，该风扇40位于网板30的背离板卡10的一侧。相应的，板卡10和网板30上形成有与风扇40适配的风道。经研究发现，在正交架构形式的电子设备中，板卡10和网板30均采用前后风道，以便风扇40对风进行引流，对电子设备进行散热。而在相关产品中一些板卡10采用左右风道，如图2所示，将该类型的板卡10应用至交换机中则会出现板卡10的风道方向与风扇40的引流方向不同，造成板卡10无法有效的散热。
为使得左右风道的板卡10应用至正交架构的电子设备中也能够有效的散热，在本公开实施例中提供如下技术方案。
第一方面，如图3所示，本公开实施例提供一种卡套50，该卡套50与板卡10相适配，该板卡10具有相对设置的第一风口和第二风口；第一风口和第二风口中的一者为进风口，另一者为出风口，且 进风口与出风口形成风道。本公开实施例中的卡套50包括：基板51、第一侧板52、第二侧板53，连接背板54、至少一个插板。
如图4所示，基板51为一矩形基板51，其包括相对设置的第一侧511和第二侧512，以及连接在第一侧511和第二侧512之间，且相对设置的第三侧513和第四侧514。第一侧511和第三侧513的连接点为第一连接点a，第一侧511和第四侧514的连接点为第二连接点b，第二侧512和第三侧513的连接点为第三连接点c，第二侧512和第四侧514的连接点为第四连接点d。
第一侧板52和第二侧板53均具有镂空图案，其二者分别对应设置在基板51的第一侧511和第二侧512。第一侧板52和第二侧板53上的镂空图案可以为方形开口，且当板卡10安装在卡套50上时第一侧板52和第二侧板53上的镂空图案可以分别与板卡10上的第一风口和第二风口相对应。
连接背板54连接在基板51的第四侧514，用于将板卡10和网板30连接。
插板设置在基板51上,且插板的延伸方向与基板51的第三侧513的延伸方向相交，且插板相对于基板51倾斜设置。
在此需要说明的是，在基板51的第一侧511和第二侧512上还分别设置有卡接部，当板卡10安装在卡套50中后，将卡套50插入机箱00中，基板51上的卡接部与机箱00的侧壁上的固定部相适配，以使板卡10固定在机箱00内。作为一种示例，机箱00的侧壁上的固定部可以为滑槽，卡接部固定在滑槽中，以使板卡10固定在机箱00内。当卡套50固定在机箱00中后，卡套50的第一侧板52和第二侧板53分别和与之相应的机箱00的侧壁之间存在一定的间距。
由于本公开实施例中的卡套50与左右风道的板卡10相适配，且在卡套50上设置有插板，且插拔相对于基板51倾斜设置(以插板的延伸方向与基板51的第一侧511和第三侧513的延伸方向相交为例)，因此，当板卡10通过卡套50插设于机箱00中时，机箱00后侧风扇40开启后，在风扇40的作用下，风由机箱00前侧进入，吹至插板，在插板的作用下，风由第一侧板52上的镂空图案吹至机 箱00的与第一侧板52相对的侧壁后，风向改变，此时风由板卡10的第一风口吹向第二风口，对板卡10进行散热。也就是说，将左右风道的板卡10固定在卡套50上之后再应用至正交架构的电子设备中，也可以实现良好的散热。
在一个示例中，板卡10上的第一风口作为进风口，第二风口作为出风口。如图5所示，卡套50中插板为多个，其中一个插板为第一插板551，其余的插板为第二插板552；第二插板552的数量可以为一个，也可以为多个。在图5中以第二插板552为三个为例进行说明。卡套50上连接背板54连接在基板51的第四侧514，且连接背板54的第一端连接在第二连接点b，第二端与第四连接点d之间具有一定的距离，且在连接背板54上设置有开口。板卡10上的连接器与连接背板54连接。第一插板551的第一连接端连接在第三连接点c，第二插板552的第二连接端连接在基板51的第四侧514，且对应连接背板54的第二端。各个第二插板552间隔设置，各个第二插板552的第一端均连接在基板51的第三侧513，且与第一连接点a和第三连接点c之间均存在一定的间距，各个第二插板552的第二端均连接在基板51的第一侧511上；最靠近第一插板551的第二插板552的第二端可连接在第二连接点b上。
在上述情况下，当将板卡10固定在该种结构的卡套50上，将该板卡10通过卡套50插入机箱00中时，风由卡套50的前侧进入，部分风由第一插板551和最靠近第一插板551的第二插板552之间吹至连接背板54，再经由连接背板54上的开口541排出。另一部分风，经由两相邻的第二插板552之间，以及第二插板552与第一侧板52之间通过第一侧板52上的镂空图案吹向与第一侧板52相对的机箱00的侧壁，之后风向发生改变，由板卡10的第一风口(进风口)吹向第二风口(出风口)，对板卡10进行散热。由板卡10的第二风口排出的风一部分由第一插板551和第二侧板53之间，以及第二侧板53和与之相对设置的机箱00的侧板之间排出。在此需要说明的是，图5至10中所示的虚线箭头均是指经过卡套50的风向；而实线箭头则是指板卡10、网板30中的风向。
如图6所示，将板卡10通过卡套50插入机箱00中，此时板卡10上的连接器21与网板30的连接器22通过连接背板54连接，组成正交架构的电子设备，设置在网板30的背离板卡10一侧的风扇40，将由板卡10排入网板30的前后风道中的风排出，以完成对板卡10和网板30的散热。
在一个示例中，与上一个示例相似，区别在于，该卡套50所适配的板卡10的第一风口为出风口，第二风口为进风口。如图7所示，卡套50中插板为多个，其中一个插板为第二插板552，其余的插板为第一插板551；第一插板551的数量可以为一个，也可以为多个。在图7中以第一插板551为三个为例进行说明。卡套50上的连接背板54连接在基板51的第四侧514，且连接背板54的第二端连接在第四连接点d，第一端与第二连接点b之间具有一定的距离，且在连接背板54上设置有开口541。板卡10上的连接器与连接背板54连接。第二插板552的第一连接端连接在第一连接点a，第一插板551的第二连接端连接在基板51的第四侧514，且对应连接背板54的第一端。各个第一插板551间隔设置，各个第一插板551的第一端均连接在基板51的第三侧513，且与第一连接点a和第三连接点c之间均存在一定的间距，各个第一插板551的第二端均连接在基板51的第二侧512上；最靠近第二插板552的第一插板551的第二端可连接在第四连接点d上。
在上述情况下，当将板卡10固定在该种结构的卡套50上，将该板卡10通过卡套50插入机箱00中时，风由卡套50的前侧进入，部分风由第二插板552和最靠近第二插板552的第一插板551之间吹至连接背板54，再经由连接背板54上的开口排出。另一部分风，经由两相邻的第一插板551之间，以及第一插板551与第二侧板53之间通过第二侧板53上的镂空图案吹向与第二侧板53相对的机箱00的侧壁，之后风向发生改变，由板卡10的第一风口(进风口)吹向第二风口(出风口)，对板卡10进行散热。由板卡10的第二风口排出的风一部分由第二插板552和第一侧板52之间，以及第一侧板52和与之相对设置的机箱00的侧板之间排出。
如图8所示，将板卡10通过卡套50插入机箱00中，此时板卡10上的连接器21与网板30的连接器22通过连接背板54连接，组成正交架构的电子设备，设置在网板30的背离板卡10一侧的风扇40，将由板卡10排入网板30的前后风道中的风排出，以完成对板卡10和网板30的散热。
在一个示例中，板卡10的第一风口和第二风口均为进风口。如图9所示，卡套50上的连接背板54包括间隔设置的第一子连接背板541和第二子连接背板542；第一子连接背板541和第二子连接背板542均连接在基板51的第四侧514，且第一子连接背板541的第一端连接第二连接点b，第二子连接背板542的第二端连接在第四连接点d。卡套50上的插板的数量为多个，多个插板中的部分为第一插板551，剩余部分为第二插板552。图9中，第一插板551和第二插板552均为两个，但在实际应用中，第一插板551和第二插板552的数量可以不等，且第一插板551和第二插板552也可以为一个，或者三个甚至更多个，在本公开实施例中不对第一插板551和第二插板552的数量进行限定，仅以第一插板551和第二插板552均为两个为例进行说明。两个第一插板551间隔设置，两个第二插板552间隔设置；第一插板551和第二插板552的第一端均连接在基板51的第三侧513，第二端均连接在第四侧514上；第一插板551的第一端到第一连接点a的距离大于等于第二插板552的第一端到第一连接点a的距离；第一插板551的第二端到第二连接点b的距离大于等于第二插板552的第二端到第二连接点b的距离。在一个示例中，相邻设置的第一插板551和第二插板552的第一端连接在基板51的第三侧513上的同一点，第一插板551的第二端连接在基板51的第四侧514对应第二子连接背板542的第一端，第二插板552的第二端连接在基板51的第四侧514对应第一子连接背板541的第二端。
在上述情况下，当将板卡10固定在该种结构的卡套50上，将该板卡10通过卡套50插入机箱00中时，风由卡套50的前侧进入，部分风吹至第一插板551后风向改变，由第二侧板53上的镂空图案排出，吹至与第二侧板53相对的机箱00的侧壁，风向改变后进入板 卡10的第二风口；另一部分风吹至第二插板552后风向改变，由第一侧板52上的镂空图案排出，吹至与第一侧板52相对的机箱00的侧壁，风向改变后进入板卡10的第一风口；由第一风口和第二风口进入的风对板卡10进行散热，之后通过第一子连接背板541和第二子连接背板542之间的间隙排出。
如图10所示，将板卡10通过卡套50插入机箱00中，此时板卡10上的连接器21与网板30的连接器22通过连接背板54连接，组成正交架构的电子设备，设置在网板30的背离板卡10一侧的风扇40，将由板卡10排入网板30的前后风道中的风排出，以完成对板卡10和网板30的散热。
第二方面，结合图11至15所示，本公开实施例提供一种电子设备，该电子设备包括上述的卡套50，设置在卡套50上的板卡10，以及与板卡10连接的网板30；板卡10与网板30采用正交架构。具体的，板卡10与卡套50的连接背板54通过连接器21连接；网板30通过连接器22与卡套50的连接背板54连接。在本公开实施例中，所述电子设备可以为路由器。
由于本公开实施例中的电子设备包括上述的卡套50，该卡套50与左右风道的板卡10相适配，且在卡套50上设置有插板，插拔相对于基板51倾斜设置(以插板的延伸方向与基板51的第一侧511和第三侧513的延伸方向相交为例)，因此，当板卡10通过卡套50插设于机箱00中时，机箱00后侧风扇40开启后，在风扇40的作用下，风由机箱00前侧进入，吹至插板，在插板的作用下，风由第一侧板52上的镂空图案吹至机箱00的与第一侧板52相对的侧壁后，风向改变，此时风由板卡10的第一风口吹向第二风口，对板卡10进行散热。也就是说，将左右风道的板卡10固定在卡套50上之后，再应用至正交架构的电子设备中，也可以实现良好的散热。
在一些实施方式中，该电子设备还包括设置在机箱00中的风扇40，用于对板卡10和网板30进行散热。
在一个示例中，如图11所示，风扇40的数量为多个，多个风扇40并排设置在网板30的背离板卡10的一侧。此种情况下，风扇 40的数量较多，这样有利于板卡10和网板30的散热，散热效果较佳。当然，可考虑风扇40的能耗，合理设置风扇40的数量，以及风扇40的设置区域；风扇40可以设置在三个区域，如图12所示，两个风扇40分别设置在网板30的背离板卡10的一侧，且位于机箱00的边角位置，一个风扇40设置在机箱00的中间区域。
在一个示例中，如图13所示，风扇40设置为两个区域，两区域的风扇40分别设置在网板30的背离板卡10的一侧，且位于机箱00的边角位置。此种情况下，风扇40的数量较少，在对板卡10和网板30进行散热的同时还可以减少功耗。当然，如图14和图15所示，风扇40也可以设置在一个区域，例如，风扇40设置在网板30的背离板卡10的一侧，且位于机箱00的边角位置。
以上参照附图说明了本公开的示例实施例，并非因此局限本公开的权利范围。本领域技术人员不脱离本公开的范围和实质内所作的任何修改、等同替换和改进，均落入本公开的权利范围之内。

Claims (12)

  1. 一种卡套，与板卡相适配，所述板卡具有第一风口和第二风口；所述卡套包括：
    基板，其具有相对设置的第一侧和第二侧，以及连接在所述第一侧和所述第二侧之间，且相对设置的第三侧和第四侧；
    第一侧板、第二侧板，分设于所述基板的所述第一侧和所述第二侧；且所述第一侧板和所述第二侧板上均具有镂空图案；当所述板卡固定在所述卡套上时，所述第一侧板与所述板卡的第一风口相对，所述第二侧板与所述板卡的第二风口相对；
    连接背板，设置在所述基板的第四侧；以及
    至少一个插板，设置在所述基板上，且所述插板的延伸方向与所述基板的第三侧的延伸方向相交。
  2. 根据权利要求1所述的卡套，其中，所述第一侧与所述第三侧的连接点为第一连接点；所述第一侧与所述第四侧的连接点为第二连接点；所述第二侧与所述第三侧的连接点为第三连接点；所述第二侧与所述第四侧的连接点为第四连接点；
    所述连接背板的第一端连接在第二连接点，所述连接背板的第二端与所述第四连接点之间具有一定的距离；
    所述插板中的至少一个第一连接端连接在所述第三侧上，且与所述第三连接点存在一定距离，第二连接端连接在所述第一侧上。
  3. 根据权利要求2所述的卡套，其中，所述插板的数量为多个，多个所述插板中的一个为第一插板，剩余所述插板为第二插板；
    所述第一插板的第一连接端连接在所述第三连接点，第二连接端连接所述连接背板的第二端；且所述连接背板上具有开口；
    所述第二插板的第一连接端连接在所述第三侧上，且与所述第三连接点存在一定距离，第二连接端连接在所述第一侧上。
  4. 根据权利要求3所述的卡套，其中，所述第二插板的数量为多个，多个所述第二插板间隔设置，且多个所述第二插板中的一个的第二连接端连接第二连接点。
  5. 根据权利要求1所述的卡套，其中，所述第一侧与所述第三侧的连接点为第一连接点；所述第一侧与所述第四侧的连接点为第二连接点为第二连接点；所述第二侧与所述第三侧的连接点为第三连接点；所述第二侧与所述第四侧的连接点为第四连接点；
    所述连接背板的第一端连接在第四连接点，所述连接背板的第二端与所述第二连接点之间具有一定的距离；
    所述插板中的至少一个第一连接端连接在所述第三侧上，且与所述第一连接点和所述第三连接点均存在一定的距离，第二连接端连接在所述第二侧上。
  6. 根据权利要求5所述的卡套，其中，所述插板的数量为多个，多个所述插板中的一个为第一插板，剩余所述插板为第二插板；
    所述第一插板的第一连接端连接在所述第一连接点，第二连接端连接所述连接背板的第二端；且所述连接背板上具有开口；
    所述第二插板的第一连接端连接在所述第三侧上，且与所述第一连接点和所述第三连接点均存在一定的距离，第二连接端连接在所述第二侧上。
  7. 根据权利要求6所述的卡套，其中，所述第二插板的数量为多个，多个所述第二插板间隔设置，且多个所述第二插板中的一个的第二连接端连接第四连接点。
  8. 根据权利要求1所述的卡套，其中，所述第一侧与所述第三侧的连接点为第一连接点；所述第一侧与所述第四侧的连接点为第二连接点为第二连接点；所述第二侧与所述第三侧的连接点为第三连接点；所述第二侧与所述第四侧的连接点为第四连接点；
    所述连接背板包括第一子连接背板和第二子连接背板，且所述第一子连接背板和所述第二子连接背板间隔设置，且均连接在所述基板的第四侧上；其中，
    所述第一子连接背板的第一端连接所述第二连接点；所述第二子连接背板的第二端连接所述第四连接点。
  9. 根据权利要求8所述的卡套，其中，所述插板为多个，多个所述插板中的部分为第一插板，另一部分为第二插板；其中，
    所述第一插板的第一端和第二插板的第一端均连接所述第三侧；所述第一插板的第二端和第二插板的第二端均连接所述第四侧；且所述第一插板的第一端到所述第一连接点的距离大于等于所述第二插板的第一端到所述第一连接点的距离；且所述第一插板的第二端到所述第二连接点的距离大于所述第二插板的第二端到所述第二连接点的距离；
    相邻设置的第一插板的第二端和第二插板的第二端之间的间隔与所述第一子连接背板和所述第二子连接背板之间的间隔相对。
  10. 一种电子设备，包括权利要求1至9中任一项所述的卡套和板卡；所述板卡固定在所述卡套上。
  11. 根据权利要求10所述的电子设备，还包括：网板，所述网板与所述板卡采用正交架构排布。
  12. 根据权利要求11所述的电子设备，其中，所述网板与所述板卡均设置在机箱中，在所述机箱的靠近所述网板的一侧设置有风扇。
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101516166A (zh) * 2008-02-22 2009-08-26 华为技术有限公司 一种横插框及通信机柜
US20100159816A1 (en) * 2008-12-23 2010-06-24 International Business Machines Corporation Converging segments cooling
CN103079386A (zh) * 2012-12-31 2013-05-01 迈普通信技术股份有限公司 一种机架式通信设备的散热结构
CN104602498A (zh) * 2015-01-27 2015-05-06 华为技术有限公司 横插框导风盒及通信机柜
CN206547232U (zh) * 2017-03-13 2017-10-10 新华三技术有限公司 电子设备

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6512672B1 (en) * 2000-12-29 2003-01-28 Cisco Technology, Inc. Modular air flow distribution system

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101516166A (zh) * 2008-02-22 2009-08-26 华为技术有限公司 一种横插框及通信机柜
US20100159816A1 (en) * 2008-12-23 2010-06-24 International Business Machines Corporation Converging segments cooling
CN103079386A (zh) * 2012-12-31 2013-05-01 迈普通信技术股份有限公司 一种机架式通信设备的散热结构
CN104602498A (zh) * 2015-01-27 2015-05-06 华为技术有限公司 横插框导风盒及通信机柜
CN206547232U (zh) * 2017-03-13 2017-10-10 新华三技术有限公司 电子设备

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4145968A4 *

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