WO2020114021A1 - 具有平行背板的电子设备及存储设备 - Google Patents

具有平行背板的电子设备及存储设备 Download PDF

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Publication number
WO2020114021A1
WO2020114021A1 PCT/CN2019/103308 CN2019103308W WO2020114021A1 WO 2020114021 A1 WO2020114021 A1 WO 2020114021A1 CN 2019103308 W CN2019103308 W CN 2019103308W WO 2020114021 A1 WO2020114021 A1 WO 2020114021A1
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WO
WIPO (PCT)
Prior art keywords
backplane
module
parallel
backplanes
electronic device
Prior art date
Application number
PCT/CN2019/103308
Other languages
English (en)
French (fr)
Inventor
王娜
陈灿
唐银中
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to JP2021531785A priority Critical patent/JP7185043B2/ja
Priority to EP19892730.3A priority patent/EP3869927A4/en
Publication of WO2020114021A1 publication Critical patent/WO2020114021A1/zh
Priority to US17/331,964 priority patent/US11869544B2/en

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Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
    • G11B33/125—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules the apparatus comprising a plurality of recording/reproducing devices, e.g. modular arrangements, arrays of disc drives
    • G11B33/127—Mounting arrangements of constructional parts onto a chassis
    • G11B33/128—Mounting arrangements of constructional parts onto a chassis of the plurality of recording/reproducing devices, e.g. disk drives, onto a chassis
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1439—Back panel mother boards
    • H05K7/1445—Back panel mother boards with double-sided connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/026—Multiple connections subassemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1424—Card cages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1439—Back panel mother boards
    • H05K7/1444—Complex or three-dimensional-arrangements; Stepped or dual mother boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1462—Mounting supporting structure in casing or on frame or rack for programmable logic controllers [PLC] for automation or industrial process control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/044—Details of backplane or midplane for mounting orthogonal PCBs

Definitions

  • the present application relates to the field of electronic devices, and in particular to an electronic device and a storage device with parallel backplanes.
  • electronic systems of electronic devices with parallel backplanes such as memory, servers, routers, and switches
  • backplanes such as memory, servers, routers, and switches
  • Most of the functional circuits are deployed and integrated in On a specific module, different modules are connected to the backplane, and electrical connections between the functional circuits are realized through the backplane.
  • the electronic equipment In order to avoid damage to the electronic components inside the electronic equipment due to excessive temperature, and to ensure the normal operation of the electronic equipment, it is required that the electronic equipment has a good heat dissipation effect.
  • the present application aims to provide an electronic device with parallel backplanes to achieve good heat dissipation inside the electronic device.
  • the electronic device includes a backplane module, a front insert module, and a rear insert module.
  • the backplane module connects the front insert module and the rear insert module.
  • the group includes a plurality of backplanes arranged in parallel and spaced apart, and a spaced channel is formed between adjacent backplanes;
  • the front plug-in module includes a plurality of first units arranged in parallel and spaced apart The arrangement direction is the same as the arrangement direction of the backplane, and the first unit is connected to one side of the backplane;
  • the rear plug-in module includes a plurality of second units arranged in parallel and spaced apart, the second The arrangement direction of the units intersects the arrangement direction of the backplane, and each of the second units is connected to a side of the backplane facing away from the first unit, so that the first unit and The connection of the second unit.
  • the side where the first unit is connected to the backplane specifically refers to the communication connection between the first unit and the backplane, so that signals such as data signals and/or control signals can be connected to the first Transmission between the unit and the backplane.
  • the connection between the second unit and the backplane also refers to the communication connection between the second unit and the backplane, so that signals such as data signals and/or control signals can be connected between the second unit and the backplane Between them. Therefore, the connection between the first unit and the second unit through the backplane refers to the transmission of signals between the first unit and the second unit through the backplane.
  • the backplane includes a substrate and a connection line provided on the substrate.
  • the communication connection between the first unit and the second unit through the backplane refers to the connection between the first unit and the second unit.
  • the connection line of the backplane is connected, the second unit is connected to the connection line of the backplane, and signals such as data signals and/or control signals are transmitted between the first unit, the connection line, and the second unit .
  • the connection line can transmit electrical signals or optical signals.
  • the connection line may be a metal trace; when the transmission between the first unit and the backplane is an optical signal
  • the connection trace may be formed of a material such as an optical fiber for transmitting optical signals.
  • the “parallel spaced arrangement” mentioned in the present application means that multiple structures are arranged side by side, and there is a certain distance between adjacent structures.
  • a plurality of backplanes are arranged in parallel and spaced apart
  • a plurality of the first units are arranged in parallel and spaced apart means that the plurality of the first units are arranged side by side with a certain spacing between adjacent first units;
  • a plurality of the second units are spaced in parallel
  • Arrangement means that the multiple second units are arranged side by side, and there is a certain distance between adjacent second units.
  • the arrangement direction of the plurality of second units intersects the arrangement direction of the plurality of backboards refers to the arrangement direction of the second units and the arrangement of the backboards The directions are not arranged in the same direction, but at a certain angle.
  • the backplane module By configuring the backplane module as a structure having a plurality of backplanes arranged in parallel and spaced apart, a space channel is formed between adjacent backplanes, so that the airflow on both sides of the backplane module can easily pass through the space
  • the channels circulate to prevent the backplane module from blocking the air circulation, so that the electronic equipment has a good heat dissipation effect.
  • the parallel spacing direction of the backplane is the same as the parallel spacing direction of the first unit, and the first unit and the second unit are respectively connected to opposite sides of the backplane, therefore, no Position avoidance is needed to increase the density of the first unit and/or the second unit in the electronic device, that is, the first unit and the second unit can be connected more through the backplane module than in the prior art To improve the working ability of the electronic device.
  • each of the first units is connected to one side of one backplane, and each of the second units is connected to all of the backplanes, so that each of the second units can All the first units are connected through the backplane.
  • the electronic device is a memory
  • the first unit is a storage unit such as a hard disk
  • the second unit is a controller, and each controller can access all hard disks.
  • each backplane is connected to all the second units. Therefore, all the second units can be connected to each of the first units through the backplane.
  • the electronic device is a memory
  • the first unit is a storage unit such as a hard disk
  • the second unit is a controller, and all of the controllers can access the same hard disk, thereby enabling multiple storage of the memory Control sharing.
  • the first units connected to the adjacent backplanes are staggered in the height direction of the backplane.
  • the first units connected to the adjacent backplanes are staggered in the height direction of the backplane, so that the distance between adjacent backplanes can be as small as possible, thereby reducing the Describe the area occupied by the backplane module.
  • Electronic components are provided on the backplane, and the electronic components may be micro switches or memory chips, etc., to expand the functions of the backplane.
  • the backplane includes a first side and a second side opposite to the first side, the front insertion module is connected to the first side, and the rear insertion The module is connected to the second side. Since the back plate is plate-shaped, the front plug-in module is connected to the first side and the rear plug-in module is connected to the second side. Describe the density of the first unit and/or the second unit in the electronic device.
  • each first side is provided with a first connector
  • the second side is provided with a second connector
  • the first unit is provided with a first connection port on the side facing the backplane
  • the first connection port is detachably connected to the first connector
  • the side of the second unit facing the backplane is provided with a second connection port, the second connection port and the second connector Removable connection.
  • the first connector is detachably connected to the first unit, so that the first unit can be easily detachably connected to the backplane, thereby facilitating replacement and maintenance of the first unit.
  • the second connector is detachably connected to the second unit, so that the second unit can be easily detachably connected to the backplane, thereby facilitating replacement and maintenance of the second unit, and
  • Each of the second units is connected to all backplanes.
  • both the first connector and the second connector are mounted on the backplane through the board.
  • through-board installation means that both the pins of the first connector and the second connector need to penetrate the backplane for installation, so that the first connector and the second connector can Stably fixed on the back plate.
  • the backplane module further includes fixed frames with openings on both sides, the openings respectively face the front insertion module and the rear insertion module, and the backplane is detachably fixed to Inside the fixed frame.
  • the inner wall of the fixed frame is provided with a plurality of spaced card slots, and the edge of each back plate is held in the corresponding card slot.
  • the clamping slot enables the backplane to be stably fixed at a fixed position in the fixing frame, and ensures a relatively stable position between the backplanes.
  • a buffer member is provided between the inner wall of the clamping slot and the back plate.
  • the buffer member can provide a buffer for the backplane to avoid a large force between the backplane and the fixing frame to cause damage to the backplane .
  • the fixing frame may be made of a flexible material, so that when the electronic device is subjected to an external force, the fixing frame can provide a buffer for the backplane to avoid damage to the backplane.
  • the backplane may be provided with openings, and the adjacent openings communicate with each other, so that the airflow between the backplanes can circulate with each other to realize the backplane mold Even heat dissipation in all positions of the group.
  • the projections of the openings on the adjacent backplanes on a plane parallel to any of the backplanes coincide, that is, the openings on each backplane are connected in the arrangement direction of the backplanes, to The airflow between the backplanes can be more smoothly.
  • the electronic device further includes a chassis, and the backplane module, front plug-in module, and rear plug-in module are all contained in the chassis.
  • the chassis is used to protect the backplane module, the front plug-in module and the rear plug-in module.
  • the fixing frame is fixed in the chassis, so as to stably set the backplane in the chassis.
  • a heat dissipation fan is provided on the wall of the chassis, the heat dissipation fan is located on one side of the rear plug-in module, and the airflow generated by the heat dissipation fan sequentially passes through the rear plug-in module and the backplane Module to the front plug-in module. Through the cooling fan, a better cooling effect can be achieved.
  • the present application also provides a storage device with parallel backplanes to achieve good heat dissipation inside the storage device.
  • the storage device is a specific embodiment of the electronic device.
  • the storage device may include multiple backplanes arranged in parallel intervals, multiple interface cards arranged in parallel intervals, and multiple controllers arranged in parallel intervals; adjacent backplanes Spaced channels are formed between them; the direction of arrangement of the plurality of interface cards is the same as the direction of arrangement of the backplane, and the interface card is connected to one side of the backplane, the interface card is used for Connect the hard disk; the arrangement direction of the multiple controllers intersects the arrangement direction of the multiple backplanes, and each controller is connected to the side of the backplane facing away from the interface card to pass through The backplane realizes the connection between the hard disk connected to the interface card and the controller.
  • the airflow can easily circulate through the spaced channels, avoiding the backplane from blocking the air circulation, so that storage
  • the device has a good heat dissipation effect.
  • the parallel spacing direction of the backplane is the same as the parallel spacing direction of the hard disk, and the hard disk and the controller are respectively connected to opposite sides of the backboard, so there is no need to avoid position avoidance.
  • the density of the hard disk and/or the controller in the electronic device can be improved.
  • the backplane can be more connected to the hard disk and the controller to improve the working capacity of the storage device.
  • each controller is connected to all the backplanes, that is, each controller can access any one hard disk through the backplane and the interface card connected to the backplane.
  • each backplane can be connected to all controllers, that is, multiple controllers can access the same hard disk through the backplane and the interface card connected to the backplane, so as to realize multi-controller sharing.
  • the interface cards connected to the adjacent backplanes are staggered in the height direction of the backplane, so that the distance between adjacent backplanes can be as small as possible, In turn, the area occupied by the backplane is reduced.
  • electronic components are provided on the backplane, and the electronic components may be micro switches or memory chips, etc., to expand the functions of the backplane.
  • the controller includes a processor, a memory, and a power supply module; the processor is used to implement business data of a hard disk connected to the interface card; the memory is signally connected to the processor, as The processor provides a cache; the power module is electrically connected to the processor and the interface card, and provides an operating voltage for the processor and the hard disk connected to the interface card.
  • the hard disk includes a power conversion module, an internal control module, and a data storage module.
  • the data storage module is used for data storage;
  • the internal control module is used to process signals of the controller and manage the hard disk;
  • the power conversion module is electrically connected to the power supply module, the internal control module, and A data storage module to convert and supply the voltage of the power supply module to the internal control module and the data storage module.
  • the storage device may also include multiple backplanes arranged in parallel intervals, multiple hard disks arranged in parallel intervals, and multiple controllers arranged in parallel intervals; adjacent backplanes Spaced channels are formed between the boards; a plurality of hard disks are arranged in the same direction as the backboard, and the hard disks are directly connected to one side of the backboard; a plurality of the controllers
  • the arrangement direction of the device intersects the arrangement direction of the plurality of backplanes, and each controller is connected to the side of the backplane facing away from the hard disk, so as to realize Describe the connection of the controller.
  • the present application does not have the interface card in the storage device of the foregoing embodiment, but directly connects the hard disk to the backplane.
  • the arrangement of multiple hard disks, the position in the storage device and the connection relationship with the backplane, etc. and the arrangement of the multiple interface cards in the storage device of the above embodiment, the position and position in the storage device The connection relationship with the backplane is the same.
  • FIG. 1 is a partial structural schematic diagram of an electronic device with parallel backplanes provided by an embodiment of the present application
  • FIG. 2 is a left side view of an electronic device with a parallel backplane provided by an embodiment of the present application
  • FIG. 3 is a left side view of an electronic device with parallel backplanes provided by another embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of a backplane and a fixed frame in an electronic device with parallel backplanes provided by an embodiment of the present application;
  • FIG. 5 is a schematic cross-sectional view of an electronic device with parallel backplanes according to another embodiment of the present application, taking the parallel plane of the second unit plane as a cross section, where the arrows indicate that the airflow flows in the electronic device with parallel backplanes
  • FIG. 6 is a schematic structural diagram of a backplane and a fixed frame in an electronic device with parallel backplanes provided by another embodiment of the present application;
  • FIG. 7 is a partial structural diagram of a storage device provided by an embodiment of the present application.
  • FIG. 8 is a schematic diagram of an application scenario provided by a storage device according to an embodiment of the present application.
  • FIG. 9 is a schematic diagram of another application scenario provided by the storage device according to an embodiment of the present application.
  • FIG. 10 is an architecture diagram of a storage device according to an embodiment of the present application.
  • FIG. 11 is an architectural diagram of a storage device according to another embodiment of this application.
  • FIG. 12 is a structural diagram of the storage device of the embodiment described in FIG. 11;
  • FIG. 13 is a schematic structural diagram of a controller and a second connector of a storage device according to an embodiment of the present application
  • FIG. 14 is a schematic structural diagram of a hard disk and a first connector of a storage device according to an embodiment of the present application.
  • the terms “installation” and “connection” should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or a whole Ground connection; it can be a mechanical connection, an electrical connection or can communicate with each other; it can be directly connected or indirectly connected through an intermediary, it can be the internal connection of two components or the interaction between two components.
  • installation and “connection” should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or a whole Ground connection; it can be a mechanical connection, an electrical connection or can communicate with each other; it can be directly connected or indirectly connected through an intermediary, it can be the internal connection of two components or the interaction between two components.
  • the present application provides an electronic device with a parallel backplane.
  • the electronic device includes a backplane module 10, a front plug-in module 20 and a rear plug-in module 30.
  • the front insertion module 20 and the rear insertion module 30 are respectively located on opposite sides of the backplane module 10.
  • the backplane module 10 connects the front plug-in module 20 and the rear plug-in module 30 to realize the transmission of data signals and/or control signals between the front plug-in module 20 and the rear plug-in module 30.
  • the backplane module 10 includes a plurality of backplanes 11 arranged in parallel and spaced apart.
  • the back plate 11 is in the shape of a flat plate, and a plurality of back plates 11 are arranged in parallel.
  • the arrangement direction of the back plates 11 is at an angle to the plane where the back plates 11 are located.
  • the arrangement direction of the plurality of backplanes 11 is perpendicular to the plane where the backplane 11 is located, that is, the line connecting the centers of the plurality of backplanes 11 is perpendicular to the plane where the backplane 11 is located.
  • the plurality of backplanes 11 are arranged in parallel and spaced apart, that is, the plurality of backplanes 11 are arranged side by side, and there is a certain distance between adjacent backplanes 11, and an interval channel 12 is formed between adjacent backplanes 11.
  • the front plug-in module 20 and the rear plug-in module 30 are respectively located at two ends of the air flow direction in the space channel 12.
  • the backplane 11 includes a substrate and a connection line provided on the substrate, so as to realize the connection between the front insertion module 20 and the rear insertion module 30 through the connection line.
  • the connection between the front plug-in module 20 and the rear plug-in module 30 is a communication connection, that is, between the front plug-in module 20 and the rear plug-in module 30 via the connection line
  • the front insertion module 20 and the rear insertion module 30 can transmit data information and/or control information through the transmission line.
  • connection line may be a metal trace to transmit electrical signals carrying information such as data information and/or control information; in some embodiments, the connection line may also be used to transmit optical signals Optical fiber, etc., to transmit optical signals carrying information such as data information and/or control information.
  • the backplane 11 is a rectangular PCB board, and the connection circuit may be a metal trace. It can be understood that the back plate 11 in this application may also have any shape, which is not limited herein. In some embodiments of the present application, various electronic components may also be provided on the outer surface of the backplane 11 to expand the functions of the backplane 11.
  • the electronic component may be provided with a micro switch to control the connection or disconnection of the connection line where the micro switch is located; or, the electronic component may also be a micro memory chip, etc., which is stored in the memory chip The manufacturing information of the backplane 11 where it is located, so as to facilitate subsequent maintenance and replacement.
  • the backplane 11 includes a first side 111 and a second side 112 opposite to the first side 111, the front plug-in module 20 is connected to the first side 111, and the rear plug-in module 30 is connected to the second side 112 side.
  • the front plug-in module 20 and the rear plug-in module 30 are generally connected to the backplane 11 through a connector, and the connector and the backplane 11 are generally installed through the board, that is, the pins of the connector need to penetrate the Backplane.
  • the front insertion module 20 and the rear insertion module 30 are generally fixed on both sides in the thickness direction of the backplane 11.
  • the connection between the front insertion module 20 and the rear insertion module 30 and the backplane 11 in the prior art needs to be avoided.
  • the front plug-in module 20 and the rear plug-in module 30 are located on both sides of the back plate 11 in the non-thickness direction, the front plug-in module 20 and the rear plug-in module 30 do not need to be avoided, and can be increased.
  • a first connector 13 and a second connector 14 are connected to the backplane 11. Specifically, the first connector 13 is connected to the first side 111 side, and the second connector 12 is connected to the second side 112 side.
  • Each backplane 11 can be connected with one or more spaced first connectors 13 and one or more spaced second connectors 14.
  • the plurality of first connectors 13 are spaced apart along the extending direction of the first side 111, and the plurality of second connectors 14 are spaced apart along the extending direction of the second side 112.
  • the first connectors 13 on the adjacent backplanes 11 are staggered in the extending direction of the first side 111, that is, the The orthographic projections of the first connectors 13 in the arrangement direction of the back plate 11 do not overlap. It can be understood that, in some embodiments of the present application, the first connectors 13 on adjacent backplanes 11 may also be arranged adjacently, that is, the first connectors 13 on the adjacent backplanes 11 are on the backplane The orthographic projections in the arrangement direction of 11 can also coincide.
  • the front plug-in module 20 includes a plurality of first units 21 arranged in parallel and spaced apart.
  • the arrangement direction of the first units 21 is the same as the arrangement direction of the back plate 11, and each of the first units 21 is connected to one back plate 11.
  • the side where the first unit 21 is connected to the backboard 11 specifically means that the first unit 21 is in communication connection with the backboard 11 to enable signals to be communicated between the first unit 21 and all
  • the backplane 11 transmits data.
  • the first unit 21 is plate-shaped, and each side of the first unit 21 facing the back plate is provided with a first connection port, the first connection port and the first connector 13 The detachable connection is performed, so that the first unit 21 can be easily detachably connected with the back plate 11, thereby facilitating replacement and maintenance of the first unit 21.
  • the first units 21 connected to the adjacent back plates 11 are staggered in the extending direction of the first side 111. Specifically, the first units 21 connected to the adjacent back plates 11 are staggered in the height direction of the back plate 11 so that the distance between the adjacent back plates 11 can be as small as possible, Therefore, the area occupied by the backplane module 10 is reduced.
  • the height direction of the back plate 11 is the extending direction of the first side 111 and the second side 112. Since the first connectors 13 on the adjacent back plates 11 are staggered, the first units 21 connected on the two adjacent back plates 11 are staggered. In this embodiment, one first connector 13 is connected to each backplane 11, so that only one first unit 21 is connected to each backplane 11. It can be understood that, in other embodiments of the present application, when multiple first connectors 13 arranged at intervals are connected to each backplane 11, multiple first units 21 may be connected to each backplane 11 And the first units 21 are spaced apart so that there is a gap between adjacent first units 21, and airflow can flow between the gaps to achieve better heat dissipation.
  • the rear insertion module 30 includes a plurality of second units 31 arranged in parallel and spaced apart. Specifically, the arrangement direction of the plurality of second units 31 crosses the arrangement direction of the plurality of back plates 11, that is, the arrangement direction of the plurality of second units 31 and the arrangement direction of the plurality of back plates 11 form a certain angle . In an embodiment of the present application, the arrangement direction of the plurality of second units 31 is perpendicular to the arrangement direction of the plurality of back plates 11. Each second unit 31 is connected to a side of the back plate 11 facing away from the first unit 21.
  • connection between the second unit 31 and the side of the backboard 11 facing away from the first unit 21 specifically means that the second unit 31 is in communication connection with the backboard 11 so that the signal can
  • the second unit 31 and the backplane 11 perform transmission.
  • data signals including but not limited to and And/or signals such as control signals.
  • the second unit 31 is plate-shaped, and the second unit 31 is provided with a second connection port on a side facing the back plate 11, the second connection port and the second The connector 14 is detachably connected, so that the second unit 31 can be easily detachably connected with the back plate 11, thereby facilitating replacement and maintenance of the second unit 31.
  • each backplane 11 is connected with a plurality of second connectors 14 arranged at intervals, so that each backplane 11 can be connected to the plurality of second units 31 through the second connector 14, and
  • the second units 31 are spaced apart so that there is a gap between adjacent second units 31, and airflow can flow between the gaps to achieve better heat dissipation.
  • each of the first units 21 is connected to one side of one backplane 11, and each of the second units 31 is connected to all of the backplanes 11, so that each The second unit 31 can be connected to all the first units 21 through the back plate 11.
  • the first unit 21 may be a storage unit such as a hard disk
  • the second unit 31 may be a controller, each of which can access all hard disks .
  • the hard disk may be various types of hard disks such as solid state drives (Solid State Drives, SSD), hybrid hard drives (Hybrid Hard Drive, HHD), traditional hard drives (Hard Disk Drive, HDD) and the like.
  • each second unit 31 is provided with a plurality of spaced second connection ports at a side facing the back plate 11, and each second connection port corresponds to one back plate 11 and is connected to the The second connector 14 on the backplane 11, so that each of the second units 31 is in communication with all the backplanes 11. It can be understood that, in other embodiments of the present application, each second unit 31 may also be connected to a part of the backplane 11 so that the second unit 31 can pass through the backplane 11 and the part The first unit 21 performs communication connection.
  • each side of the second unit 31 facing the backplane 11 is provided with a second connection port corresponding to the second connector 14 on the corresponding backplane 11 of the backplane module 10
  • Each second connection port is connected to a corresponding second connector 14 on the backplane 11, so that each second unit 31 is connected to several backplanes 11 in the backplane module 10.
  • each backplane 11 is connected to all the second units 31. Therefore, all the second units 31 can communicate with each of the first units 21 through the backplane 11 to transmit data signals and/or control signals.
  • the electronic device with parallel backplane is a memory
  • the first unit 21 is a storage unit such as a hard disk
  • the second unit 31 is a controller, and all the controllers can access the same hard disk, thereby Multi-control sharing of the memory can be realized.
  • the controller is a PCB board or a control chip with a control circuit.
  • the hard disk may be various types of hard disks such as solid state drives (Solid State Drives, SSD), hybrid hard drives (Hybrid Hard Drive, HHD), traditional hard drives (Hard Disk Drive, HDD) and the like.
  • the second unit 31 is orthogonal to the backplane 11, and the length of the second unit 31 is greater than or equal to the length of the backplane module 10 in the arrangement direction of the backplane 11, so that The second unit 31 intersects each backplane 11 and is connected at a position where the second unit 31 intersects the backplane 11 so that each backplane 11 and all the second Unit 31 is connected.
  • each side of the backboard 11 facing the second unit 31 is provided with a plurality of second connectors 14 at intervals along the extending direction of the first side 111.
  • the second unit 31 and the second The connectors 14 correspond one-to-one and are connected, so that each backplane 11 is connected to all the second units 31.
  • each backplane 11 may also be connected to several second units 31 in the rear insertion module 30, that is, each backplane 11 is not connected to the rear All the second units 31 in the module 30 are connected so that the second unit 31 can be connected to the corresponding first unit 21 through the back plate 11.
  • the three backplanes 11 are backplane A, backplane B, and backplane C, respectively, and the rear plug-in module 30 has three second units 31 ,
  • the three second units 31 are a second unit D, a second unit E, and a second unit F, respectively, the backplane A is connected to the second unit D, and the backplane B is connected to the second unit D and the first Two units E are connected, and the backplane C is connected to the second unit F and the second unit E.
  • the back plate 11 may be provided with an opening 113, and the openings 113 on the adjacent back plates 11 communicate with each other, so that between the back plates 11 The airflows can flow through each other to achieve uniform heat dissipation at various positions of the backplane module 10.
  • the projections of the openings 113 on the adjacent backplanes 11 on a plane parallel to any of the backplanes 11 coincide, that is, the openings 113 on each backplane 11 are on the backplane
  • the arrangement directions of the 11 are communicated so that the airflow between the back plates 11 can flow more smoothly.
  • the openings 113 on the adjacent back plates 11 are staggered in the arrangement direction of the back plates 11, that is, on the adjacent back plates 11
  • the projection of the opening 113 on a plane parallel to any of the back plates 11 does not coincide.
  • the backplane module 10 further includes fixed frames 40 that are open on both sides, and the openings respectively face the front insertion module 20 and the rear insertion module 30.
  • the back plate 11 is detachably fixed in the fixing frame 40.
  • the position between each back plate 11 can be relatively stable.
  • the back plate 11 can be detachably fixed in the fixing frame 40, it is convenient to take out the back plate 11 from the fixing frame 40, so as to facilitate subsequent maintenance of the back plate 11.
  • the fixed frame 40 is a rectangular parallelepiped frame.
  • the rectangular parallelepiped frame is a rectangular parallelepiped frame surrounded by four square plates.
  • two opposing inner wall surfaces 41 of the rectangular frame are provided with a plurality of spaced-apart locking slots 42, and the edge of each back plate 11 is held in the corresponding locking slot 42.
  • the clamping slot 42 enables the back plate 11 to be stably fixed at a fixed position in the fixing frame 40 to ensure a relatively stable position between the back plates 11.
  • the clamping slot 42 may be a sliding slot extending in the direction from the first side 111 to the second side 112, and the back plate 11 may be opened from one end of the fixing frame 40 Insert into the slot 42 along the slot 42. It can be understood that, in other embodiments of the present application, the clamping slot 42 may also be a groove provided on the inner wall 41 of the fixing frame 40, and the back plate 11 is provided with a corresponding protrusion. When the back plate 11 is fixed on the fixing frame 40, the protrusion on the back plate 11 is caught in the groove.
  • the fixing frame 40 can be made of various materials such as metal and plastic.
  • the fixing frame 40 may be made of a flexible material such as plastic, so that when the electronic device is subjected to an external force, the fixing frame 40 can provide a buffer for the back plate 11 to avoid back The board 11 is damaged.
  • a buffer 51 is provided between the inner wall of the clamping slot 42 and the back plate 11.
  • the gap between the back plate 11 and the inner wall of the clamping slot 42 is filled by the buffer member 51 to achieve a more stable connection effect between the back plate and the fixing frame 42.
  • the buffer member 51 can provide a buffer for the back plate 11 to avoid a large force generated between the back plate 11 and the fixing frame 40 The back plate 11 is damaged.
  • the buffer member 51 is a rubber member.
  • the electronic device with a parallel backplane further includes a chassis 50.
  • the front plug-in module 20, the rear plug-in module 30 and the backplane module 10 are all accommodated in the chassis 50.
  • the chassis 50 protects the front plug-in module 20, the rear plug-in module 30 and the backplane module 10 located therein.
  • the fixing frame 40 is fixed in the chassis 50 to facilitate the stable setting of the back plate 11 in the chassis 50.
  • a heat dissipation fan 60 is provided on the wall of the chassis 50 to achieve better heat dissipation effect through the heat dissipation fan 60.
  • the cooling fan 60 is located on the side of the rear plug-in module 30, and the airflow passes through the rear plug-in module 30, the backplane module 10, and the front plug-in module 20 in order as shown by the arrows in FIG. The heat dissipation of the plug-in module 30, the backplane module 10 and the front plug-in module 20.
  • the backplane module 10 as a plurality of backplanes 11 arranged in parallel and spaced between adjacent backplanes 11, a structure of spaced channels 12 is formed, so that the heat dissipation airflow can be easily separated in the spaced channels 12 to circulate in order to prevent the cooling airflow from being blocked by the backplane 11 and at the same time, it will not be affected by the density of the first unit 11 and/or the second unit 21 in the electronic device with parallel backplane, compared with the existing In the way that the electronic device in the technology is provided with a circulation hole on the back plate for heat dissipation, the air flow effect inside the electronic device is better, so that the inside of the electronic device has a better heat dissipation effect.
  • first unit 21 and the second unit 31 are respectively disposed on the first side 111 side and the second side 112 side of the backboard 11, so that the first The one unit 21 and the second unit 31 do not need to avoid position avoidance, so that the first unit 21 and the second unit 31 can be connected as much as possible through the backplane 11 module, improving the first The density of the unit 21 and/or the second unit 31, and there will be no increase in the density of the first unit 21 and/or the second unit 31 in the electronic device in the prior art to compress the heat dissipation on the back plate 11
  • the size of the hole makes the problem of poor heat dissipation inside the electronic device.
  • the electronic device may be a storage device, server, switch, router, or the like.
  • the electronic device will be described below with some specific embodiments.
  • the electronic device is a storage device, and the storage device includes a backplane 70, a hard disk 80, and a controller 90.
  • the backplane 70 is an embodiment of the backplane 11 in the electronic device shown in FIG. 1
  • the hard disk 80 is an embodiment of the first unit 21 in the electronic device shown in FIG. 1
  • the controller 90 is shown in FIG. An embodiment of the second unit 31 in the illustrated electronic device.
  • the hard disk 80 and the controller 90 are communicatively connected through the backplane 70 to realize the transmission of data signals and/or control signals between the hard disk 80 and the controller 90. For example, in the data reading and writing scenario shown in FIG.
  • the controller 90 when the client needs to obtain the data in the hard disk 80, it sends an instruction to read data to the controller 90.
  • the controller 90 Send the data acquisition instruction to the hard disk 80 through the backplane 70 to obtain the specified data from the hard disk 80, the instruction data information is sent to the controller 90 through the backplane 70, and then send the instruction data to the client through the controller 90;
  • the client needs to store data to enter the hard disk 80, it sends an instruction to write data to the controller 90.
  • the instruction to write data carries the data to be stored.
  • the controller 90 receives the instruction to write data, it sends the instruction to write data
  • the data to be stored is acquired in the process and sent to the hard disk 80 through the backplane 70 for storage.
  • the client sends an instruction to read data or an instruction to write data to the controller 90 through the cloud network.
  • the controller 90 receives the instruction to read the data through the cloud network and obtains the data from the corresponding hard disk 80, the data is sent to the client through the cloud network; when the controller 90 receives the write data instruction through the cloud network After the instruction, the data to be stored obtained from the instruction for writing data is stored in the corresponding hard disk 80.
  • a plurality of the back plates 70 are arranged in parallel and spaced apart, and space channels 71 are formed between adjacent back plates 70.
  • the plurality of hard disks 80 are arranged in parallel at intervals, and the arrangement direction thereof is the same as the arrangement direction of the back plate 70, and each hard disk 80 is connected to one side of the back plate 70.
  • the plurality of controllers 90 are arranged in parallel and spaced apart, and the arrangement direction thereof intersects with the arrangement direction of the backplane 70, which specifically means that the controller 90 and the backplane 70 are arranged orthogonally or at a certain angle.
  • each of the controllers 90 is connected to a side of the backplane 70 facing away from the hard disk 80, so as to realize the connection of the hard disk 80 and the controller 90 through the backplane 70.
  • the back plates 70 By arranging a plurality of the back plates 70 in parallel, space channels 71 are formed between adjacent back plates 70, so that airflow can easily circulate through the space channels, avoiding the back plate 70 from blocking the air circulation, So that the storage device has a good heat dissipation effect.
  • the parallel spacing direction of the back plate 70 is the same as the parallel spacing direction of the hard disk 80, and the hard disk 80 and the controller 90 are respectively connected to opposite sides of the back plate 70. Therefore, Position avoidance is required, which can increase the density of the hard disk 80 and/or the controller 90 in the electronic device.
  • the back plate 70 can connect the hard disk 80 and the controller 90 more Working capacity of the storage device.
  • each controller 90 is connected to all the backplanes 70, that is, each controller 90 can access any one hard disk 80 through the backplane 70.
  • each backplane 70 can be connected to all controllers 90, that is, multiple controllers 90 can access the same hard disk 80 to achieve multi-controller connection. Therefore, in this application, the controller 90 and the hard disk 80 may adopt a centralized storage architecture or a distributed storage architecture. When it is a centralized storage architecture, one piece of data is stored in one hard disk 80 among the multiple hard disks 80.
  • the video data is written to the hard disk A, and the controller A, the controller B, and the controller C are all connected to the hard disk A through the backplane, so that the controller A, the controller B, or the controller C can read the video data information in hard disk A, that is, the user can obtain the video data in hard disk A through any one of controller A, controller B and controller C; when it is a distributed storage architecture
  • one piece of data can be divided into multiple small pieces, and a check code corresponding to each small piece of data can be generated, and each small piece of data and the corresponding check code can be stored in multiple hard disks.
  • each controller 90 can communicate with all the backplanes 70 to access any one hard disk 80 through the backplane 70, any controller 90 can fan out commands to multiple through the backplane 70 In the hard disk 80, to obtain small copies of data from multiple hard disks 80, and merge the small copies of data obtained from each hard disk 80 to obtain a complete data; or, one data can be divided into multiple copies and written separately Multiple hard drives 80.
  • the video data of user A is divided into video data 1, video data 2, and video data 3, and check codes corresponding to video data 1, video data 2, and video data 3 are generated, which are check code 1, respectively.
  • Check code 2 and check code 3 then store video data 1 and check code 1 in hard disk 1, store video data 2 and check code 2 in hard disk 2, store video data 3 and check code 3 Stored in hard disk 3.
  • a controller can send a command to read the data, and fan out the command to hard disk 1, hard disk 2, and hard disk 3 through the backplane to obtain video data 1 from the three hard disks.
  • Video data 2 and video data 3 and check code 1, check code 2 and check code 3 then the controller will video data 1, video data 2 and video data 3 and check code 1, check code 2 and The check code 3 is processed, for example, merged, and the video data is finally obtained.
  • the controller 90 is detachably connected to the backplane 70 through a fourth connector 74
  • the hard disk 80 is detachably connected to the backplane 70 through a third connector 73
  • the disassembly connection allows the user to flexibly configure the connection relationship between the hard disk 80 and the controller 90 according to usage requirements, thereby obtaining different storage architectures.
  • the third connector 73 is an embodiment of the first connector 12 in the electronic device
  • the fourth connector 74 is an embodiment of the second connector 13 in the electronic device shown in FIG. 1.
  • the fourth connector 74 and the controller 90 may be two independent devices or a part of the controller 90; the third connector 73 and the hard disk 80 may also be two independent devices, also It may be part of the hard disk 80.
  • the fourth connector 74 and the controller 90 can be two independent devices, that is, the fourth connector 74 and the controller 90 can also be detachably connected, so that when the fourth connector 74 is damaged, it can be easily replaced.
  • the third connector 73 and the hard disk 80 can be two independent devices, that is, the third connector 73 and the hard disk 80 can also be detachably connected, so that when the third connector 73 is damaged, it can be easily replaced.
  • one end of the third connector 73 and the fourth connector 74 is transparently mounted on the backplane 70, the other end has a plug interface, and the controller 90 has a plug connected to the fourth connector 74.
  • the plug corresponding to the interface is connected to the fourth connector 74 in a plug-in manner.
  • the hard disk 80 has a plug corresponding to the plug interface on the third connector 73, so as to be connected to the third connector 73 in a plug-in manner.
  • the fourth connector 74 and the controller 90 or the third connector 73 and the hard disk 80 may also be fixedly connected.
  • connection between the third connector 73 and the hard disk 80 may be a direct connection or an indirect connection through an intermediate medium.
  • the third connector 73 is directly connected to the hard disk 80, and signals can be directly transmitted from the hard disk 80 to the third connector 73.
  • FIGS. 11 and 12 The difference between the embodiment shown in FIGS. 11 and 12 and the embodiment shown in FIG. 10 is that the third connector 73 is indirectly connected to the hard disk 80.
  • an interface card 84 (IO Card) providing an input/output (Input/Output, I/O) interface is also connected between the third connector 73 and the hard disk 80, and the interface card 84 is directly connected to the third connector 73 to connect to the backplane 70 through the third connector 73, and then connect the hard disk 80 to the interface card 84 to indirectly connect to the third connector 73 through the interface card 84.
  • the interface card 84 is a specific embodiment of the first unit 21 of the electronic device described in FIG. 1.
  • the connection method and the like are the same as the position, arrangement, and connection method of the hard disk 80 in the storage device in the embodiment shown in FIG.
  • the interface card 84 is connected to the hard disk 80.
  • the hard disk 80 may be a part of the storage device.
  • the hard disk 80 may also be an external structure of the storage device, thereby facilitating replacement of the hard disk 80.
  • the storage device of this embodiment is connected to an external hard disk array, where the external hard disk array includes the hard disk 80 provided in the array.
  • the hard disk array is connected to the IO interface of the interface card 84 through a cable, so as to realize the connection between the external hard disk array and the storage device.
  • the cable connecting the hard disk array and the IO interface of the interface card 84 only needs to be unplugged from the IO interface and replaced with a new disk array.
  • the IO interface may be an optical fiber communication interface (Fiber Channel, FC), an Internet small computer system interface (Internet Small Computer System Interface, ISCSI), a wireless broadband (Infiniband, IB) and other interfaces that can be connected to the host server, and It can be a 6G/12G serial connection small computer interface (Serial Attached) and other interfaces for connecting the back-end hard disk 80.
  • FC optical fiber communication interface
  • ISCSI Internet Small Computer System Interface
  • IB Internet Small Computer System Interface
  • IB wireless broadband
  • 6G/12G serial connection small computer interface Serial Attached
  • other structures can be connected to the backplane 70 through the interface of the interface card 84 and communicate with the controller 90.
  • the third connector 73 is a Gen-Z 4C splint connector
  • the fourth connector 74 is an enterprise and a data center storage form (Enterprise Data Center SSD (Form SSD), EDSFF) orthogonal Bend mother.
  • both the third connector 73 and the fourth connector 74 are mounted through the back plate 70 with the through plate, so that the third connector 73 is stably fixed on the back plate 70.
  • the fourth connector 74 is an EDSFF orthogonal bending female.
  • controller 90 will be specifically described.
  • the controller 90 may include a processor 91, and the processor 91 is communicatively connected to the fourth connector 74.
  • the processor may be a central processing unit (Central Processing Unit, CPU), a digital signal processor, an application specific integrated circuit, a field programmable gate array (Field-Programmable Gate Array, FPGA), or other programmable logic devices, which is not used here limit.
  • the processor 91 is used to transmit service data with the hard disk 80 so as to obtain data stored in the hard disk 80 or store data to be stored in the hard disk 80.
  • the processor can also detect the connection status (connected or disconnected) of the hard disk 80 and the backplane 70, detect whether the hard disk 80 is faulty, detect the information of the hard disk 80, and control the power supply state or disconnection of the hard disk 80 Status etc.
  • the controller 90 may further include a memory 92 and a power module 93.
  • the memory 92 is connected to the processor 91, and is used to provide a cache function for the processor 91 during the communication between the processor 91 and the hard disk 80.
  • the power module 93 is electrically connected to the processor 91 and the fourth connector 74 to provide an operating voltage for the processor 91 and the hard disk 80 communicatively connected to the controller 90 through the fourth connector 74, the backplane 70 and the third connector 73 .
  • the hard disk 80 may include a power conversion module 81, an internal control module 82, and a data storage module 83.
  • the power conversion module 81 is electrically connected to the third connector 73, the internal control module 82, and the data storage module 83.
  • the power conversion module 81 is electrically connected to the third connector 73 to achieve electrical connection with the power module 93 in the controller 90, so as to convert the voltage provided by the power module 93 in the controller 90 to be suitable for internal use
  • the operating voltages of the control module 82 and the data storage module 83 supply power to the internal control module 82 and the data storage module 83.
  • the internal control module 82 is used for processing the signals of the controller 90 and managing the hard disk 80.
  • the data storage module 83 is used to store or read user data under the control of the internal control module 82.
  • the data storage module 83 may be a central processing unit (CPU), a digital signal processor, a special integrated circuit, a field programmable gate array (Field-Programmable Gate Array, FPGA), or Other programmable logic devices are not limited here.
  • the electronic device may also be a switch or a router.
  • the first unit 21 is a switching matrix card
  • the second unit 31 is a service line card.
  • the first unit 21 is a network board and an interface card
  • the second unit 31 is a main control board.
  • the heat dissipation airflow can be easily placed in the spaced channel 71 Circulate in the middle to prevent the heat flow from being blocked by the backplane 70, and at the same time, it will not be affected by the density of the controller 90 and/or hard disk 80 in the storage device.
  • the air flow effect inside the storage device is better, so that the inside of the storage device has better heat dissipation effect.
  • the controller 90 and the hard disk 80 are respectively disposed on opposite sides of the back plate 70 in the non-thickness direction, so that the hard disk 80 and the controller 90 on both sides of the back plate 70 need not be avoided.
  • the density of the hard disk 80 and/or the controller 90 in the storage device is increased, and there is no existing technology
  • the density of the hard disk 80 and/or the controller 90 in the storage device is increased to compress the size of the heat dissipation holes on the backplane 70, so that the internal heat dissipation effect of the storage device is not good.

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Abstract

本申请提供一种具有平行背板的电子设备及存储设备。其中，存储设备为电子设备的一种具体实施例。电子设备包括前插模组、后插模组及连接前插模组及后插模组的背板模组。背板模组包括多块并行间隔排布的背板，前插模组包括多个排布方向与背板排布方向相同的第一单元，后插模组包括多个排布方向与背板相交的第二单元。通过将背板模组设置为具有多块并行间隔排布的背板，使得相邻的背板之间形成间隔通道的结构，使得气流能够在间隔通道内流通，使得电子设备实现良好的散热效果。并且，第一单元与第二单元分别连接于背板的相对两侧，不需要进行避位，从而能够提高电子设备中第一单元和/或第二单元的密度。

Description

具有平行背板的电子设备及存储设备 技术领域
本申请涉及电子设备领域，尤其涉及一种具有平行背板的电子设备及存储设备。
背景技术
目前，存储器、服务器、路由器、交换机等具有平行背板的电子设备的电子系统通常由若干相互连接、相互作用的基本电路组成的具有特定功能的电路整体，其中的功能电路部分大多部署、集成于特定的模块上面，不同的模块之间均连接于背板上，通过所述背板实现各功能电路之间的电性连接。为了避免温度过高对电子设备内部各电子元器件的损坏，以保证电子设备的正常工作，要求电子设备内部具有良好的散热效果。
发明内容
本申请旨在提供一种具有平行背板的电子设备，实现所述电子设备内部良好的散热。
所述电子设备包括背板模组、前插模组以及后插模组，所述背板模组连接所述前插模组与所述后插模组，其特征在于，所述背板模组包括多块并行间隔排布的的背板，相邻的所述背板之间形成间隔通道；所述前插模组包括多个并行间隔排布的第一单元，所述第一单元的排列方向与所述背板的排列方向相同，且所述第一单元连接于所述背板的一侧；所述后插模组包括多个并行间隔排布的第二单元，所述第二单元的排列方向与所述背板的排列方向相交，每个所述第二单元与所述背板背离所述第一单元的一侧连接，以通过所述背板实现所述第一单元与所述第二单元的连接。
其中，所述第一单元连接于所述背板的一侧具体是指所述第一单元与所述背板进行通信连接，以使数据信号和/或控制信号等信号能够在所述第一单元及所述背板之间进行传输。所述第二单元与所述背板连接也是指所述第二单元与所述背板进行通信连接，以使数据信号和/或控制信号等信号能够在所述第二单元及所述背板之间进行传输。因此，通过所述背板实现所述第一单元与所述第二单元的连接即是指通过所述背板实现信号在第一单元与第二单元之间的传输。
本申请一些实施例中，所述背板包括基板及设于所述基板上的连接线路，通过所述背板实现所述第一单元与第二单元通信连接即是指所述第一单元与所述背板的连接线路连接，所述第二单元与所述背板的连接线路连接，数据信号和/或控制信号等信号在所述第一单元、连接线路、第二单元之间进行传输。所述连接线路可以传输电信号或者光信号。当所述第一单元与所述背板之间的传输的信号为电信号时，所述连接线路可以为金属走线；当所述第一单元与所述背板之间的传输为光信号时，所述连接走线可以为光纤等用于传输光信号的材料形成。
其中，本申请所说的“并行间隔排布”是指多个结构并排设置，并且相邻的结构之间具有一定的间距。例如，“多块所述背板并行间隔排布”，即指多块所述背板并排设置，且相邻的所述背板之间有一定的间距。“多个所述第一单元并行间隔排布”，是指多个所述第一单元并排设置，且相邻的第一单元之间具有一定的间距；“多个所述第二单元并行间隔排 布”，是指多个所述第二单元并排设置，且相邻的第二单元之间具有一定的间距。
其中，本申请所说的“多个所述第二单元的排布方向与多个所述背板的排布方向相交”即是指所述第二单元的排列方向与所述背板的排列方向不是朝同一个方向排列，而是呈一定角度的。
通过将所述背板模组设置为具有多块并行间隔排布的背板的结构，相邻的背板之间形成间隔通道，使得背板模组两侧的气流能够容易的通过所述间隔通道进行流通，避免背板模组对空气流通的遮挡，以使得电子设备内部具有良好的散热效果。并且，所述背板的并行间隔方向与所述第一单元的并行间隔方向相同，并将所述第一单元与所述第二单元分别连接于所述背板相对的两侧，因此，不需要进行避位，能够提高电子设备中第一单元和/或第二单元的密度，即使得通过所述背板模组相对于现有技术能够更多的连接所述第一单元及第二单元，提高所述电子设备的工作能力。
本申请中，每个所述第一单元与一块所述背板的一侧连接，每个所述第二单元与所有的所述背板均连接，从而使得每个所述第二单元均能够通过所述背板与所有的所述第一单元进行连接。当所述电子设备为存储器时，所述第一单元为硬盘等存储单元，所述第二单元为控制器，每个所述控制器均能够访问所有的硬盘。
进一步的，本申请中，每块所述背板与所有的所述第二单元连接。因此，所有的所述第二单元均能够通过所述背板与每个所述第一单元进行连接。当所述电子设备为存储器时，所述第一单元为硬盘等存储单元，所述第二单元为控制器，所有的所述控制器均能够访问同一个硬盘，从而能够实现所述存储器的多控共享。
进一步的，本申请中，相邻的所述背板上连接的所述第一单元在所述背板的高度方向上交错设置。具体的，相邻的所述背板上连接的所述第一单元在所述背板的高度方向上错开设置，使得相邻的背板之间的距离能够尽可能的小，进而减小所述背板模组占用的面积。
所述背板上设有电子元器件，所述电子元器件可以为微型开关或者存储芯片等，以扩展所述背板的功能。
本申请一些实施例中，所述背板包括第一侧边及与所述第一侧边相对的第二侧边，所述前插模组连接于所述第一侧边，所述后插模组连接于所述第二侧边。由于所述背板为板状，所述前插模组连接于所述第一侧边侧，所述后插模组连接于所述第二侧边侧，不需要进行避位，以增加所述电子设备中第一单元和/或第二单元的密度。
其中，每个所述第一侧边设有第一连接器，所述第二侧边设有第二连接器，所述第一单元朝向所述背板的一侧设有第一连接端口，所述第一连接端口与所述第一连接器可拆卸连接；所述第二单元朝向所述背板的一侧设有第二连接端口，所述第二连接端口与所述第二连接器可拆卸连接。通过所述第一连接器与所述第一单元可拆卸连接，使得所述第一单元能够与所述背板容易的进行可拆卸连接，从而便于第一单元的更换维修。同样的，通过所述第二连接器与所述第二单元可拆卸连接，使得所述第二单元能够与所述背板容易的进行可拆卸连接，从而便于第二单元的更换维修，并能够实现每个所述第二单元均与所有的背板连接。
本申请一些实施例中，所述第一连接器与所述第二连接器均透板安装于所述背板上。其中，透板安装是指所述第一连接器与所述第二连接器的引脚均需要穿透所述背板进行安 装，以使得所述第一连接器与所述第二连接器能够稳定的固定于所述背板上。
本申请一些实施例中，所述背板模组还包括两侧开口的固定框，所述开口分别朝向所述前插模组及所述后插模组，所述背板可拆卸式固定于所述固定框内。通过将所述背板固定于所述固定框内，使得各个所述背板之间的位置能够相对稳固。并且，由于所述背板能够可拆卸式的固定于所述固定框内，使得能够方便将背板从所述固定框内取出，以便于后续对所述背板的维护。
本申请一些实施例中，所述固定框的内壁上设有多个间隔设置的卡槽，每块所述背板的边缘卡持于对应的所述卡槽内。通过所述卡槽使得所述背板能够稳定的固定于所述固定框内固定的位置，保证各背板之间位置的相对稳定。
进一步的，本申请一些实施例中，所述卡槽的内壁与所述背板之间设有缓冲件。当所述电子设备受到外力作用时，所述缓冲件能够为所述背板提供缓冲，以避免所述背板与所述固定框之间产生较大的作用力而造成所述背板的损坏。
本申请其它一些实施例中，所述固定框可以为柔性材料制得，以便在所述电子设备受到外力作用时，所述固定框能够为所述背板提供缓冲，避免背板的损坏。
进一步的，本申请的一些实施例中，所述背板上可以设有开孔，相邻的所述开孔连通，使得各个所述背板之间的气流能够互相流通，以实现背板模组各个位置的均匀散热。
一些实施例中，相邻的所述背板上的开孔在与任意所述背板平行的平面上的投影重合，即各个背板上的开孔在背板的排布方向上连通，以使得各个所述背板之间的气流的流通能够更加的顺畅。
所述电子设备还包括机箱，所述背板模组、前插模组以及后插模组均收容于所述机箱内。通过所述机箱保护位于其内的所述背板模组、所述前插模组以及所述后插模组。
本申请的一些实施例中，所述固定框固定于所述机箱内，以便于将所述背板稳定的设置于所述机箱内。
进一步的，所述机箱的箱壁上设有散热风扇，所述散热风扇位于所述后插模组的一侧，所述散热风扇产生的气流依次经过所述后插模组、所述背板模组至所述前插模组。通过散热风扇，能够实现更好的散热效果。
本申请还提供一种具有平行背板的存储设备，以实现所述存储设备内部良好的散热。所述存储设备为所述电子设备的一种具体的实施例。
本申请一些实施例中，所述存储设备可以包括多块并行间隔排布的背板、多个并行间隔排布的接口卡以及多个并行间隔排布的控制器；相邻的所述背板之间形成有间隔通道；多个所述接口卡的排布的方向与所述背板的排布方向相同，且所述接口卡连接于所述背板的一侧，所述接口卡用于连接硬盘；多个所述控制器的排布方向与多个所述背板的排布方向相交，每个所述控制器与所述背板背离所述接口卡的一侧连接，以通过所述背板实现与所述接口卡连接的硬盘与所述控制器的连接。
通过将多块所述背板并行间隔排布，使相邻的背板之间形成间隔通道，使得气流能够容易的通过所述间隔通道进行流通，避免背板对空气流通的遮挡，以使得存储设备内部具有良好的散热效果。并且，所述背板的并行间隔方向与所述硬盘的并行间隔方向相同，并将所述硬盘与所述控制器分别连接于所述背板的相对两侧，因此，不需要进行避位，能够 提高电子设备中硬盘和/或控制器的密度，相对于现有技术来说，通过所述背板能够更多的连接所述硬盘及控制器，提高所述存储设备的工作能力。
本申请一些实施例中，每个所述控制器与所有的所述背板均连接，即每个控制器均能够通过背板及与背板连接的接口卡访问任意的一个硬盘。
并且，一些实施例中，每个背板均能够与所有的控制器连接，即使得多个控制器能够通过背板及与背板连接的接口卡访问同一个硬盘，以实现多控共享。
本申请的一些实施例中，相邻的所述背板上连接的所述接口卡在所述背板的高度方向上交错设置，使得相邻的背板之间的距离能够尽可能的小，进而减小所述背板占用的面积。
本申请的一些实施例中，所述背板上设有电子元器件，所述电子元器件可以为微型开关或者存储芯片等，以扩展所述背板的功能。
本申请一些实施例中，所述控制器包括处理器、内存及电源模块；所述处理器用于实现与所述接口卡连接的硬盘的业务数据；所述内存与所述处理器信号连接，以为所述处理器提供缓存；所述电源模块电连接所述处理器及所述接口卡，为所述处理器及与所述接口卡连接的硬盘提供工作电压。
所述硬盘包括电源转换模块、内部控制模块以及数据存储模块。所述数据存储模块用于数据存储；所述内部控制模块用于对所述控制器的信号进行处理以及对所述硬盘的管理；所述电源转换模块电连接所述电源模块、内部控制模块以及数据存储模块，以将所述电源模块的电压进行转换并提供给所述内部控制模块以及数据存储模块。
本申请的其它一些实施例中，所述存储设备也可以包括多块并行间隔排布的背板、多个并行间隔排布硬盘以及多个并行间隔排布的控制器；相邻的所述背板之间形成有间隔通道；多个所述硬盘的排布的方向与所述背板的排布方向相同，且所述硬盘直接连接于所述背板的一侧；多个所述控制器的排布方向与多个所述背板的排布方向相交，每个所述控制器与所述背板背离所述硬盘的一侧连接，以通过所述背板实现与所述硬盘与所述控制器的连接。即相对于上述实施例的所述存储设备来说，本申请没有上述实施例的存储设备中的接口卡，而是将硬盘直接连接于背板上。其中，多个硬盘的排布方式、在所述存储设备中的位置及与背板的连接关系等和上述实施例的存储设备中的多个接口卡的排列方式、在存储设备中的位置及与背板的连接关系相同。
附图说明
为了更清楚地说明本申请的技术方案，下面将对实施方式中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以如这些附图获得其他的附图。
图1是本申请一种实施方式提供的具有平行背板的电子设备的部分结构示意图；
图2是本申请一种实施方式提供的具有平行背板的电子设备的左视图；
图3是本申请另一种实施方式提供的具有平行背板的电子设备的左视图；
图4是本申请一种实施方式提供的具有平行背板的电子设备中背板与固定框的结构示意图；
图5是本申请另一种实施方式提供的具有平行背板的电子设备的以第二单元平面的平 行的平面为截面的截面示意图，其中箭头表示气流流在具有平行背板的电子设备内流动的方向；
图6是本申请另一种实施方式提供的具有平行背板的电子设备中背板与固定框的结构示意图；
图7是本申请一种实施方式提供的存储设备的部分结构示意图；
图8为本申请实施例的存储设备提供的一种应用场景的示意图；
图9为本申请实施例的存储设备提供的另一种应用场景的示意图；
图10为本申请一种实施例的存储设备的架构图；
图11为本申请另一种实施例的存储设备的架构图；
图12为图11所述实施例的存储设备的结构图；
图13为本申请一种实施例的存储设备的控制器及第二连接器的结构示意图；
图14为本申请一种实施例的存储设备的硬盘及第一连接器的结构示意图。
具体实施方式
下面将结合本申请实施方式中的附图，对本申请实施方式中的技术方案进行清楚、完整地描述。图中箭头所表示的是气流流向的路线。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
如图1至图2所示，本申请提供一种具有平行背板的电子设备，电子设备包括背板模组10、前插模组20以及后插模组30。所述前插模组20及后插模组30分别位于所述背板模组10的相对两侧。背板模组10连接前插模组20与后插模组30，以实现前插模组20与后插模组30之间的数据信号和/或控制信号等信号的传输。
所述背板模组10包括多块并行间隔排布的背板11。所述背板11为平板状，多块背板11平行设置，背板11的排布方向与背板11所在平面呈角度。本申请一实施例中，多块背板11的排布方向与背板11所在的平面垂直，即多块所述背板11的中心的连线与所述背板11所在平面垂直。多块所述背板11并行间隔排布，即指多块背板11并排设置，且相邻的背板11之间有一定的间距，且相邻的背板11之间形成间隔通道12，所述前插模组20与所述后插模组30分别位于间隔通道12中气流流动方向的两端。通过在相邻的背板11之间形成间隔通道12，使所述背板模组10两侧的气流能够通过间隔通道12进行良好的流通，避免背板11遮挡气流流通，以使得电子设备内部具有良好的散热效果。相对于在背板11上设流通孔，以通过背板11上的流通孔实现背板11两侧的前插模组20与后插模组30之间的气流流通散热的方式来说，不需要在所述背板11上设置流通孔，减小背板11的制作难度。同时，不存在前插模组20和/或后插模组30中功能单元的数量增加而增加所述前插模组20和/或后插模组30与背板11连接时占用背板11面积较大，进而压缩背板11上的流通孔的大小，使得前插模组20与后插模组30之间的气流流通受背板11遮挡而不能良好散热 的问题。
所述背板11包括基板以及设置于基板上的连接线路，以通过所述连接线路实现前插模组20及后插模组30之间的连接。本申请中，所述前插模组20与所述后插模组30之间的连接为通信连接，即所述前插模组20与所述后插模组30之间通过所述连接线路连接后，所述前插模组20与后插模组30之间能够通过所述传输线路进行数据信息和/或控制信息等信息的传输。本申请中，所述连接线路可以为金属走线，以传输携带有数据信息和/或控制信息等信息的电信号；在一些实施例中，所述连接线路也可以为用于传输光信号的光纤等，以传输携带有数据信息和/或控制信息等信息的光信号。本实施例中，所述背板11为长方形的PCB板，所述连接线路可以为金属走线。可以理解的是，在本申请中的背板11也可以为任意形状，在此不进行限定。在本申请的一些实施例中，所述背板11的外表面上还可以设置各种电子元器件，以扩展所述背板11的功能。例如，所述电子元器件可以设置微型开关，以通过所述微型开关控制其所在连接线路的连通或断开；或者，所述电子元器件还可以为微型存储芯片等，所述存储芯片内存储其所在背板11的制造信息等，以便于后续的维修更换等。
所述背板11包括第一侧边111以及与第一侧边111相对的第二侧边112，所述前插模组20连接于所述第一侧边111侧，所述后插模组30连接于所述第二侧边112侧。前插模组20与后插模组30一般通过连接器与背板11进行连接，且所述连接器与背板11一般为透板安装，即所述连接器的引脚需要穿透所述背板。现有技术中，前插模组20及后插模组30一般固定于背板11的厚度方向上的两侧，因此，为了保证前插模组20与后插模组30在背板11上的稳定有效地安装，现有技术中的前插模组20及后插模组30与背板11的连接需要避位。而本申请中，由于前插模组20与后插模组30位于背板11非厚度方向上的两侧，因此，前插模组20与后插模组30不需要进行避位，能够增加所述电子设备中第一单元21和/或第二单元31的密度。
所述背板11上连接有第一连接器13以及第二连接器14。具体的，所述第一连接器13连接于所述第一侧边111侧，所述第二连接器12连接于所述第二侧边112侧。每块所述背板11上能够连接一个或者多个间隔设置的第一连接器13，以及一个或者多个间隔设置的第二连接器14。其中，多个第一连接器13沿所述第一侧边111的延伸方向间隔设置，多个第二连接器14沿第二侧边112的延伸方向间隔设置。
请再次参阅图1，本申请一些实施例中，相邻的背板11上的所述第一连接器13在第一侧边111的延伸方向上错开设置，即相邻的背板11上的第一连接器13在背板11的排布方向上的正投影不重合。可以理解的是，在本申请的一些实施例中，相邻的背板11上的第一连接器13也可以相邻设置，即相邻的背板11上的第一连接器13在背板11的排布方向上的正投影也可以重合。
请一并参阅图1及图2，所述前插模组20包括多个并行间隔排布的第一单元21。所述第一单元21的排布方向与所述背板11的排布方向相同，且每个所述第一单元21与一块所述背板11进行连接。其中，所述第一单元21连接于所述背板11的一侧具体是指所述第一单元21与所述背板11进行通信连接，以使信号能够在所述第一单元21及所述背板11之间进行传输。本实施例中，所述第一单元21为板状，每个所述第一单元21朝向所述背板 的一侧设有第一连接端口，所述第一连接端口与第一连接器13进行可拆卸连接，使得所述第一单元21能够与所述背板11容易进行可拆卸连接，从而便于第一单元21的更换维修。本申请一些实施例中，相邻的所述背板11上连接的所述第一单元21在所述第一侧边111的延伸方向上交错设置。具体的，相邻的所述背板11上连接的所述第一单元21在所述背板11的高度方向上错开设置，使得相邻的背板11之间的距离能够尽可能的小，进而减小所述背板模组10占用的面积。本申请一实施例中，所述背板11的高度方向为所述第一侧边111及第二侧边112的延伸方向。由于相邻的背板11上的第一连接器13交错设置，使得相邻的两个背板11上连接的所述第一单元21交错设置。本实施例中，每块所述背板11上连接有一个所述第一连接器13，以使得每块背板11上仅连接有一个所述第一单元21。可以理解的是，在本申请的其它实施例中，每块背板11上连接有多个间隔设置的第一连接器13时，每块背板11上可以连接多个所述第一单元21，且所述第一单元21间隔设置，以使得相邻的第一单元21之间具有空隙，气流能够在所述空隙之间流动，以实现较好的散热。
请一并参阅图1及图2，所述后插模组30包括多个并行间隔排布的第二单元31。具体的，多个第二单元31的排布方向与多个背板11的排布方向交叉，即多个第二单元31的排布方向与多个背板11的排布方向呈一定的角度。本申请一实施例中，所述多个第二单元31的排布方向与多个背板11的排布方向垂直。每个所述第二单元31与所述背板11背离所述第一单元21的一侧连接。其中，所述第二单元31与所述背板11背离所述第一单元21的一侧连接具体是指所述第二单元31与所述背板11进行通信连接，以使信号能够在所述第二单元31及所述背板11之间进行传输。以通过所述背板11连接所述第一单元21与所述第二单元31，以使所述第一单元21与第二单元31之间能够进行通信，以传输包括但不限于数据信号和/或控制信号等信号。本申请一实施例中，所述第二单元31为板状，所述第二单元31朝向所述背板11的一侧设有第二连接端口，所述第二连接端口与所述第二连接器14可拆卸连接，使得所述第二单元31能够与所述背板11容易进行可拆卸连接，从而便于第二单元31的更换维修。本申请中，每块背板11上连接有多个间隔设置的第二连接器14，使得每块背板11上可以通过所述第二连接器14连接多个所述第二单元31，且所述第二单元31间隔设置，以使得相邻的第二单元31之间具有空隙，气流能够在所述空隙之间流动，以实现较好的散热。
本申请一些实施例中，每个所述第一单元21与一块所述背板11的一侧连接，每个所述第二单元31与所有的所述背板11均连接，从而使得每个所述第二单元31均能够通过所述背板11与所有的所述第一单元21进行连接。当所述具有平行背板的电子设备为存储器时，所述第一单元21可以为硬盘等存储单元，所述第二单元31可以为控制器，每个所述控制器均能够访问所有的硬盘。其中，所述硬盘可以为固态硬盘(Solid State Drives，SSD)、混合硬盘(Hybrid Hard Drive，HHD)、传统硬盘(Hard Disk Drive，HDD)等各种类型的硬盘。具体的，每个所述第二单元31朝向所述背板11的一侧设有多个间隔设置的第二连接端口，每个第二连接端口与一个所述背板11对应并连接至所述背板11上的第二连接器14，从而实现每个所述第二单元31与所有的所述背板11均通信连接。可以理解的是，在本申请的其它实施例中，每个第二单元31也可以与部分的所述背板11通信连接，使得所述第二单元31均能够通过所述背板11与部分的所述第一单元21进行通信连接。具体的， 每个所述第二单元31朝向所述背板11的一侧设有与背板模组10中的对应的几块背板11上的第二连接器14对应的第二连接端口，每个第二连接端口与对应的一块所述背板11上的第二连接器14连接，从而实现每个所述第二单元31与背板模组10中的几块背板11连接。
进一步的，本申请中，每块所述背板11与所有的所述第二单元31连接。因此，所有的所述第二单元31均能够通过所述背板11与每个所述第一单元21进行通信连接，以传输数据信号和/或控制信号等。当所述具有平行背板的电子设备为存储器时，所述第一单元21为硬盘等存储单元，所述第二单元31为控制器，所有的所述控制器均能够访问同一个硬盘，从而能够实现所述存储器的多控共享。图1所示实施例中，所述控制器为四个，从而能够实现四控共享。其中，所述控制器为具有控制电路的PCB板或者控制芯片。所述硬盘可以为固态硬盘(Solid State Drives，SSD)、混合硬盘(Hybrid Hard Drive，HHD)、传统硬盘(Hard Disk Drive，HDD)等各种类型的硬盘。具体的，所述第二单元31与所述背板11正交，且所述第二单元31的长度大于等于所述背板模组10在背板11的排布方向上的长度，从而使得所述第二单元31与每块所述背板11均相交，并在所述第二单元31与背板11相交的位置连接，从而实现每块所述背板11与所有的所述第二单元31连接。本申请一实施例中，每块所述背板11朝向第二单元31的一侧沿第一侧边111的延伸方向间隔设有数个第二连接器14，所述第二单元31与第二连接器14一一对应并连接，从而实现每块所述背板11与所有的所述第二单元31连接。可以理解的是，本申请的一些实施例中，每块所述背板11也可以与后插模组30中的几个第二单元31连接，即每块所述背板11不与后插模组30中全部的第二单元31连接，以使得第二单元31能够通过背板11连接至对应的第一单元21。例如，所述背板模组10中有三块背板11，三块背板11分别为背板A、背板B及背板C，所述后插模组30中具有三个第二单元31，三个所述第二单元31分别为第二单元D、第二单元E及第二单元F，所述背板A与第二单元D连接，所述背板B与第二单元D及第二单元E连接，所述背板C与第二单元F及第二单元E连接。
请参阅图3，本申请的一些实施例中，所述背板11上可以设有开孔113，相邻的所述背板11上的开孔113连通，使得各个所述背板11之间的气流能够互相流通，以实现背板模组10各个位置的均匀散热。
进一步的，一些实施例中，相邻的所述背板11上的开孔113在与任意所述背板11平行的平面上的投影重合，即各个背板11上的开孔113在背板11的排布方向上连通，以使得各个所述背板11之间的气流的流通能够更加顺畅。可以理解的是，在本申请的其它实施例中，相邻的所述背板11上的开孔113在背板11的排布方向上错开设置，即相邻的所述背板11上的开孔113在与任意所述背板11平行的平面上的投影不重合。
请参阅图4及图5，本申请中，所述背板模组10还包括两侧开口的固定框40，所述开口分别朝向所述前插模组20及所述后插模组30，所述背板11可拆卸式固定于所述固定框40内。通过将所述背板11固定于所述固定框40内，使得各个所述背板11之间的位置能够相对稳固。并且，由于所述背板11能够可拆卸式的固定于所述固定框40内，使得能够方便将背板11从所述固定框40内取出，以便于后续对所述背板11的维护。
本申请一些实施例中，所述固定框40为长方体框。具体的，所述长方体框为四块方形 板围成的长方体框体。本实施例中，长方形框体的相对的两个内壁面41上设有多个间隔设置的卡槽42，每块所述背板11的边缘卡持于对应的所述卡槽42内。通过所述卡槽42使得所述背板11能够稳定的固定于所述固定框40内固定的位置，保证各背板11之间位置的相对稳定。本申请一些实施例中，所述卡槽42可以为沿所述第一侧边111至第二侧边112的方向延伸的滑槽，所述背板11能够从所述固定框40的一端开口沿所述卡槽42插入卡槽42中。可以理解的是，在本申请的其它实施例中，所述卡槽42也可以为设于所述固定框40内壁41上的凹槽，所述背板11上设有对应的凸起，所述背板11固定于所述固定框40上时，背板11上的凸起卡入凹槽内。
所述固定框40可以为金属、塑料等各种材料制成。本申请一些实施例中，所述固定框40可以为塑胶等柔性材料制成得到，以便在所述电子设备受到外力作用时，所述固定框40能够为所述背板11提供缓冲，避免背板11受到损坏。
进一步的，请参阅图6，本申请一些实施例中，所述卡槽42内壁与所述背板11之间设有缓冲件51。通过所述缓冲件51填充背板11与卡槽42内壁之间的空隙，以使背板与固定框42实现更加稳定的连接效果。并且，当所述电子设备受到外力作用时，所述缓冲件51能够为所述背板11提供缓冲，以避免所述背板11与所述固定框40之间产生较大的作用力而造成所述背板11的损坏。本实施例中，所述缓冲件51为橡胶件。
请重新参阅图5，所述具有平行背板的电子设备还包括机箱50，所述前插模组20、后插模组30及所述背板模组10均收容于所述机箱50内。通过所述机箱50保护位于其内的所述前插模组20、后插模组30及所述背板模组10。并且，本实施例中，通过将所述固定框40固定于所述机箱50中，以便于将所述背板11稳定的设置于所述机箱50内。
进一步的，所述机箱50壁上设有散热风扇60，以通过散热风扇60实现更好的散热效果。所述散热风扇60位于所述后插模组30一侧，气流如图5中箭头所示，依次经过后插模组30、背板模组10及所述前插模组20，以实现后插模组30、背板模组10及所述前插模组20的散热。
本申请中，通过将所述背板模组10设置为具有多块并行间隔排布的背板11，相邻的背板11之间形成间隔通道12的结构，使得散热气流能够容易在间隔通道12中进行流通，避免散热气流受到背板11的阻挡，同时也不会受到具有平行背板的电子设备内的第一单元11和/或第二单元21的密度的影响，相较于现有技术中的电子设备在背板上设置流通孔以进行散热的方式来说，所述电子设备内部的空气流动效果更好，使得所述电子设备的内部具有较好的散热效果。并且，所述第一单元21与所述第二单元31分别设置于所述背板11的第一侧边111一侧及第二侧边112一侧，使得背板11两侧的所述第一单元21及第二单元31不需要进行避位，从而能够使得通过所述背板11模块连接尽可能多的所述第一单元21及第二单元31，提高所述电子设备内的第一单元21和/或第二单元31的密度，且不会存在现有技术中的电子设备内的第一单元21和/或第二单元31的密度增加，以压缩所述背板11上的散热孔的大小，使得电子设备内部散热效果不好的问题。
所述电子设备可以为存储设备、服务器、交换机、路由器等。以下以一些具体实施例对所述电子设备进行说明。
请参阅图7，本申请一些实施例中，所述电子设备为存储设备，所述存储设备包括背 板70、硬盘80及控制器90。其中，背板70为图1所示电子设备中背板11的一种实施例，硬盘80为图1所示的电子设备中第一单元21的一种实施例，控制器90为图1所示的电子设备中第二单元31的一种实施例。所述硬盘80与控制器90通过背板70进行通信连接，以实现所述硬盘80与所述控制器90之间的数据信号和/或控制信号的传输。例如，在图8所示的数据读写场景中，当客户端需要获取硬盘80中的数据时，则向控制器90发送读取数据的指令，控制器90接收该读取数据的指令后，将获取数据的指令通过背板70发送至硬盘80以从硬盘80中获取指定数据，该指令数据信息通过背板70发送至控制器90，再通过控制器90将指令数据发送给客户端；当客户端需要存储数据进入硬盘80时，则向控制器90发送写数据的指令，该写数据的指令携带待存储的数据，控制器90接收该写数据的指令后，则从该写数据的指令中获取待存储的数据，并通过背板70发送至硬盘80中以进行存储。
请参阅图9，本申请另一实施例中，客户端是通过云网络向控制器90发送读数据的指令或者写数据的指令。当控制器90通过云网络接收该读数据的指令，并从对应的硬盘80中获取该数据后，则通过云网络将该数据发送给客户端；当控制器90通过云网络接收该写数据的指令后，则将从该写数据的指令中获取的待存储的数据存储在对应的硬盘80中。
需要说明的是，图8-图9所示的场景中，仅以一个客户端、一个控制器90和一个硬盘80之间的交互为例来进行介绍，不应对本申请实施例的应用场景造成限定。在实际的数据读写场景中，可以包括多个客户端、多个控制器90和多个硬盘80。例如，请参阅图7，本申请一些实施例中，所述存储设备内的控制器90、硬盘80及背板70的连接结构与图1中的第二单元31、第一单元21及背板11的连接结构相同，控制器90、背板70及硬盘80均可以为多个。多个所述背板70并行间隔排布，相邻的所述背板70之间形成间隔通道71。多个硬盘80并行间隔排布，其排布方向与背板70的排布方向相同，并且，每个硬盘80连接于背板70的一侧。多个控制器90并行间隔排布，且其排列方向与背板70的排列方向相交，具体是指所述控制器90与背板70正交设置或者呈一定的角度设置。并且，每个所述控制器90与所述背板70背离所述硬盘80的一侧连接，以通过背板70实现所述硬盘80与所述控制器90的连接。
通过将多块所述背板70并行间隔排布，使相邻的背板70之间形成间隔通道71，使得气流能够容易通过所述间隔通道进行流通，避免背板70对空气流通的遮挡，以使得存储设备内部具有良好的散热效果。并且，所述背板70的并行间隔方向与所述硬盘80的并行间隔方向相同，并将所述硬盘80与所述控制器90分别连接于所述背板70相对的两侧，因此，不需要进行避位，能够提高电子设备中硬盘80和/或控制器90的密度，相对于现有技术来说，通过所述背板70能够更多的连接所述硬盘80及控制器90，提高所述存储设备的工作能力。
进一步的，一些实施例中，每个所述控制器90与所有的所述背板70均连接，即每个控制器90均能够通过背板70访问任意的一个硬盘80。一些实施例中，每个背板70均能够与所有的控制器90连接，即使得多个控制器90能够访问同一个硬盘80，以实现多控连接。因此，本申请中，控制器90与硬盘80可以采用集中式存储架构，也可以采用分布式存储架构。当为集中式存储架构时，一份数据是存储在多个硬盘80中的一个硬盘80中。 本申请一实施例中，当将一份数据存储于一个硬盘80中时，由于多个控制器90能够访问同一个硬盘80，即与任意的控制器90通信的用户均能够获取同一硬盘80中的数据，或者向同一硬盘80中写入数据。例如，一实施例中，视频数据写入了硬盘A中，控制器A、控制器B及控制器C均通过背板连接至该硬盘A中，使得通过控制器A、控制器B或控制器C均能够读取硬盘A中的视频数据信息，即使得用户能够通过控制器A、控制器B及控制器C中任意一个控制器均能够获取硬盘A中的视频数据；当为分布式存储架构时，可以将一份数据分成多个小份，并生成与每小份数据对应的校验码，将每小份数据与对应的校验码分别存储在多个硬盘中。本申请中，由于每个控制器90均能够与所有的背板70通信连接，以通过背板70访问任意的一个硬盘80，使得任意一个控制器90能够通过背板70将指令扇出至多个硬盘80中，以从多个硬盘80中获取小份数据，并将从各个硬盘80中获取的小份数据合并得到一份完整的数据；或者，能够将一份数据分成多份并分别写入多个硬盘80中。例如，将用户A的视频数据分为视频数据1、视频数据2及视频数据3，并生成与视频数据1、视频数据2及视频数据3分别对应的校验码，分别为校验码1、校验码2及校验码3，然后将视频数据1和校验码1存储在硬盘1中，将视频数据2和校验码2存储在硬盘2中，将视频数据3和校验码3存储在硬盘3中。当某个控制器需要读取该视频数据时，可发送读数据的指令，通过背板将该指令扇出到硬盘1、硬盘2及硬盘3，以从该3个硬盘中获取视频数据1、视频数据2及视频数据3以及校验码1、校验码2及校验码3，然后该控制器将视频数据1、视频数据2及视频数据3以及校验码1、校验码2及校验码3进行处理，例如，合并处理，最终获取该视频数据。
请参阅图7及图10，本申请一些实例中，所述控制器90通过第四连接器74与背板70进行可拆卸连接，所述硬盘80通过第三连接器73与背板70进行可拆卸连接，使得用户能够根据使用需求，灵活的配置硬盘80与控制器90的连接关系，从而得到不同的存储架构。其中，所述第三连接器73为电子设备中第一连接器12的一种实施例，所述第四连接器74为图1所示电子设备中第二连接器13的一种实施例。其中，所述第四连接器74与控制器90可为两个独立的器件，也可以为控制器90的一部分；所述第三连接器73与硬盘80也可以为两个独立的器件，也可以为硬盘80的一部分。第四连接器74与控制器90可为两个独立的器件，即所述第四连接器74与控制器90也能够进行可拆卸连接，使得当第四连接器74损坏时，能够方便更换。第三连接器73与硬盘80可为两个独立的器件，即所述第三连接器73与硬盘80也能够进行可拆卸连接，使得当第三连接器73损坏时，能够方便更换。具体的，所述第三连接器73及第四连接器74一端透板安装于所述背板70上，另一端具有插接口，所述控制器90上具有与第四连接器74上的插接口对应的插头，以通过插接的方式与第四连接器74连接。同样的，所述硬盘80上具有与第三连接器73上的插接口对应的插头，以便于通过插接的方式与第三连接器73连接。可以理解的是，在本申请的其它实施例中，所述第四连接器74与控制器90或者所述第三连接器73与硬盘80也可以固定连接。
本申请中，所述第三连接器73与硬盘80的连接可以为直接连接，也可以通过中间媒介间接相连。请参阅图10，所述第三连接器73与硬盘80为直接连接，则信号从所述硬盘80能够直接传输至所述第三连接器73中。请参阅图11及图12，图11及图12所示实施例与图10所示实施例的差别在于，第三连接器73与硬盘80之间为间接连接。具体的，第三 连接器73与硬盘80之间还连接有提供输入/输出(Input/Output，I/O)接口的接口卡84(IO Card)，所述接口卡84直接与第三连接器73连接，以通过第三连接器73连接至背板70，再将硬盘80与接口卡84连接，从而通过接口卡84间接与第三连接器73连接。本实施例中，接口卡84为图1中所述电子设备的第一单元21的一种具体实施例，多个接口卡84在所述存储设备中的位置、排布方式及与背板的连接方式等与图10所示的实施例中的硬盘80在存储设备中的位置、排布方式及与背板的连接方式相同。并且，本实施例中，接口卡84连接硬盘80。可以理解的是，本申请一些实施例中，硬盘80可以为所述存储设备的一部分。本申请另一些实施例中，硬盘80也可以为所述存储设备的外接结构，从而方便对硬盘80的更换。例如，本实施例的存储设备与外接的硬盘阵列进行连接，其中，外接的硬盘阵列中包括阵列设置的硬盘80。通过线缆将所述硬盘阵列与接口卡84的IO接口连接，从而实现外接的硬盘阵列与存储设备的连接。当需要更换硬盘80时，只需要将连接所述硬盘阵列与所述接口卡84的IO接口的线缆从所述IO接口上拔下并换上新的磁盘阵列即可。
其中，所述IO接口可以为光纤通信接口(Fiber Channel，FC)、互联网小型计算机系统接口(Internet Small Computer System Interface，ISCSI)、无线宽带(Infiniband，IB)等可以与主机服务器连接的接口，也可以为6G/12G串行连接小型计算机接口(Serial Attached SCSI)等连接后端硬盘80的接口。并且，在本申请的其它实施例中，根据实际需要，能够将其它的结构通过所述接口卡84的接口连接至所述背板70并与所述控制器90实现通信连接。本申请的一实施例中，所述第三连接器73为Gen-Z 4C夹板连接器，所述第四连接器74为企业与数据中心存储形式(Enterprise Data Center SSD Form Factor，EDSFF)正交弯母。其中，所述第三连接器73与第四连接器74均与所述背板70均为透板安装，以使所述第三连接器73稳定的固定于所述背板70上。所述第四连接器74为EDSFF正交弯母。
下面，对控制器90进行具体说明。
请参阅图13，控制器90可以包括处理器91，处理器91与第四连接器74通信连接。其中，处理器可以为中央处理器(Central Processing Unit，CPU)、数字信号处理器、专用集成电路、现场可编程门阵列(Field-Programmable Gate Array，FPGA)或者其他可编程逻辑器件，在此不作限制。所述处理器91用于实现与硬盘80的业务数据传输，以便获取硬盘80中存储的数据或者将待存储的数据存储于硬盘80中。进一步的，所述处理器还可以侦测硬盘80与背板70的连接状态(连接或断开)、侦测硬盘80是否故障以及侦测硬盘80的信息以及控制硬盘80的供电状态或者断开状态等。进一步的，控制器90还可以包括内存92及电源模块93。其中，内存92与处理器91连接，用于在处理器91与硬盘80的通信过程中，为处理器91提供缓存功能。电源模块93与处理器91以及第四连接器74进行电连接，以为处理器91以及通过第四连接器74、背板70及第三连接器73与控制器90通信连接的硬盘80提供工作电压。
下面，对硬盘80进行具体说明。
请参阅图14，硬盘80可以包括电源转换模块81、内部控制模块82以及数据存储模块83。其中，所述电源转换模块81与第三连接器73、内部控制模块82以及数据存储模块83电连接。其中，所述电源转换模块81与第三连接器73电连接，以实现与控制器90中的电源模块93进行电连接，从而将控制器90中的电源模块93提供的电压转换为适用于内部控 制模块82以及数据存储模块83的工作电压，以为内部控制模块82以及数据存储模块83供电。所述内部控制模块82用于实现对控制器90的信号的处理以及对硬盘80的管理功能。例如，接收控制器90对硬盘80的控制信号，以及提供对数据存储模块83中的数据进行读操作或者写操作的功能。本实施例中，硬盘80直接与第三连接器73连接。可以理解的是，在其它实施例中，由于硬盘80可以与第三连接器73间接连接。所述数据存储模块83用于在内部控制模块82的控制下，存储或读取用户数据。本申请一些实施例中，所述数据存储模块83可以是中央处理器(Central Processing Unit，CPU)、数字信号处理器、专用集成电路、现场可编程门阵列(Field-Programmable Gate Array，FPGA)或者其他可编程逻辑器件，在此不作限制。
本申请一些实施例中，所述电子设备还可以为交换机或者路由器。当所述电子设备为交换机时，所述第一单元21为交换矩阵卡，第二单元31为业务线卡。当所述具有平行背板的电子设备为路由器时，所述第一单元21为网板及接口卡，第二单元31为主控板。
本申请中提供的所述存储设备，通过将多块背板70并行间隔排布70，并使相邻的背板70之间形成间隔通道71的结构，使得散热气流能够容易的在间隔通道71中进行流通，避免散热气流受到背板70的阻挡，同时也不会受到存储设备内的控制器90和/或硬盘80的密度的影响，相较于现有技术中的存储设备在背板70上设置流通孔以进行散热的方式来说，所述存储设备内部的空气流动效果更好，使得所述存储设备的内部具有较好的散热效果。并且，所述控制器90与所述硬盘80分别设置于所述背板70的非厚度方向上的相对两侧，使得背板70两侧的所述硬盘80及控制器90不需要进行避位，从而能够使得通过所述背板70连接尽可能多的所述硬盘80及控制器90，提高所述存储设备内的硬盘80和/或控制器90的密度，且不会存在现有技术中的存储设备内的硬盘80和/或控制器90的密度增加，以压缩所述背板70上的散热孔的大小，使得存储设备内部散热效果不好的问题。
以上所述是本申请的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本申请的保护范围。

Claims (21)

  1. 一种具有平行背板的电子设备，包括背板模组、前插模组以及后插模组，所述背板模组连接所述前插模组与所述后插模组，其特征在于，所述背板模组包括多块并行间隔排布的背板，相邻的所述背板之间形成间隔通道；所述前插模组包括多个并行间隔排布的第一单元，所述第一单元的排布方向与所述背板的排布方向相同，且所述第一单元连接于所述背板的一侧；所述后插模组包括多个并行间隔排布的第二单元，多个所述第二单元的排布方向与多个所述背板的排布方向相交，每个所述第二单元与所述背板背离所述第一单元的一侧连接，以通过所述背板实现所述第一单元与所述第二单元的连接。
  2. 如权利要求1所述的具有平行背板的电子设备，其特征在于，每个所述第二单元与所有的所述背板均连接。
  3. 如权利要求1所述的具有平行背板的电子设备，其特征在于，每块所述背板与所有的所述第二单元均连接。
  4. 如权利要求1至3任一项所述的具有平行背板的电子设备，其特征在于，相邻的所述背板上连接的所述第一单元在所述背板的高度方向上交错设置。
  5. 如权利要求1至3任一项所述的具有平行背板的电子设备，其特征在于，所述背板上设有电子元器件。
  6. 如权利要求1至3任一项所述的具有平行背板的电子设备，其特征在于，所述背板包括第一侧边及与所述第一侧边相对的第二侧边，所述前插模组连接于所述第一侧边，所述后插模组连接于所述第二侧边。
  7. 如权利要求6所述的具有平行背板的电子设备，其特征在于，每个所述第一侧边设有第一连接器，所述第二侧边设有第二连接器，所述第一单元朝向所述背板的一侧设有第一连接端口，所述第一连接端口与所述第一连接器可拆卸连接；所述第二单元朝向所述背板的一侧设有第二连接端口，所述第二连接端口与所述第二连接器可拆卸连接。
  8. 如权利要求7所述的具有平行背板的电子设备，其特征在于，所述第一连接器与所述第二连接器均透板安装于所述背板上。
  9. 如权利要求1所述的具有平行背板的电子设备，其特征在于，所述背板模组还包括两侧开口的固定框，所述开口分别朝向所述前插模组及所述后插模组，所述背板可拆卸式固定于所述固定框内。
  10. 如权利要求9所述的具有平行背板的电子设备，其特征在于，所述固定框的内壁上设有多个间隔设置的卡槽，每块所述背板的边缘卡持于对应的所述卡槽内。
  11. 如权利要求9或10所述的具有平行背板的电子设备，其特征在于，所述卡槽的内壁与所述背板之间设有缓冲件。
  12. 如权利要求1所述的具有平行背板的电子设备，其特征在于，所述背板上设有开孔。
  13. 如权利要求12所述的具有平行背板的电子设备，其特征在于，相邻的所述开孔在与任意所述背板平行的平面上的投影重合。
  14. 如权利要求1所述的具有平行背板的电子设备，其特征在于，所述具有平行背板的电子设备还包括机箱，所述背板模组、所述前插模组以及所述后插模组均收容于所述机箱内。
  15. 如权利要求14所述的具有平行背板的电子设备，其特征在于，所述机箱的箱壁上 设有散热风扇，所述散热风扇位于所述后插模组的一侧，所述散热风扇产生的气流依次经过所述后插模组、所述背板模组和所述前插模组。
  16. 一种存储设备，其特征在于，包括：
    多块并行间隔排布的背板，相邻的所述背板之间形成有间隔通道；
    多个并行间隔排布的接口卡，多个所述接口卡的排布的方向与所述背板的排布方向相同，且所述接口卡连接于所述背板的一侧，所述接口卡用于连接硬盘；
    多个并行间隔排布的控制器，多个所述控制器的排布方向与多个所述背板的排布方向相交，每个所述控制器与所述背板背离所述接口卡的一侧连接，以实现与所述接口卡连接的硬盘与所述控制器的连接。
  17. 如权利要求16所述的存储设备，其特征在于，每个所述控制器与所有的所述背板均连接。
  18. 如权利要求16或17所述的存储设备，其特征在于，每块所述背板与所有的所述控制器均连接。
  19. 如权利要求16所述的存储设备，其特征在于，相邻的所述背板上连接的所述接口卡在所述背板的高度方向上交错设置。
  20. 如权利要求16所述的存储设备，其特征在于，所述背板上设有电子元器件。
  21. 如权利要求16所述的存储设备，其特征在于，所述控制器包括：
    处理器，用于实现与所述接口卡连接的硬盘的业务数据处理；
    内存，所述内存与所述处理器信号连接，为所述处理器提供缓存；
    电源模块，所述电源模块电连接所述处理器及所述接口卡，为所述处理器及与所述接口卡连接的硬盘提供工作电压。。
PCT/CN2019/103308 2018-12-04 2019-08-29 具有平行背板的电子设备及存储设备 WO2020114021A1 (zh)

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