WO2021241532A1 - 発光シート、並びに、それを用いた表示装置および殺菌装置 - Google Patents

発光シート、並びに、それを用いた表示装置および殺菌装置 Download PDF

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Publication number
WO2021241532A1
WO2021241532A1 PCT/JP2021/019699 JP2021019699W WO2021241532A1 WO 2021241532 A1 WO2021241532 A1 WO 2021241532A1 JP 2021019699 W JP2021019699 W JP 2021019699W WO 2021241532 A1 WO2021241532 A1 WO 2021241532A1
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WIPO (PCT)
Prior art keywords
light emitting
resin
emitting sheet
layer
sheet according
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Ceased
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PCT/JP2021/019699
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English (en)
French (fr)
Japanese (ja)
Inventor
朋寛 深尾
知昭 澤田
恭佑 道上
一仁 宮崎
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Priority to JP2022526551A priority Critical patent/JPWO2021241532A1/ja
Publication of WO2021241532A1 publication Critical patent/WO2021241532A1/ja
Anticipated expiration legal-status Critical
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    • A—HUMAN NECESSITIES
    • A41—WEARING APPAREL
    • A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
    • A41D31/00—Materials specially adapted for outerwear
    • A—HUMAN NECESSITIES
    • A41—WEARING APPAREL
    • A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
    • A41D31/00—Materials specially adapted for outerwear
    • A41D31/02—Layered materials
    • A—HUMAN NECESSITIES
    • A41—WEARING APPAREL
    • A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
    • A41D31/00—Materials specially adapted for outerwear
    • A41D31/04—Materials specially adapted for outerwear characterised by special function or use
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/023—Optical properties
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Definitions

  • the present invention relates to a light emitting device that can be used in various situations, a light emitting sheet that can be used as a display device, and a display device, a sterilizer, clothing, clothing, etc. using the same.
  • Patent Document 1 a display configured by arranging a plurality of pixel display units having an LED and a control circuit for controlling light emission thereof on the first base board on the second base board.
  • a large screen display comprising a unit, which may further have a third substrate made of a transmissive material (thin glass, insulating material, cloth, etc.).
  • Patent Document 2 a flexible printed wiring board, a contact trace, an LED, and a flexible light array including a control circuit are enclosed in a flexible pocket and fixed to clothing to display an image on clothing. The system to do is disclosed.
  • the present invention has been made in view of such circumstances, and an object of the present invention is to provide a light emitting sheet having excellent elasticity, durability, etc., which can be used for various purposes.
  • the light emitting sheet includes a base material sheet, a conductor layer, an LED element, and an LED control means, and the base material sheet is on one surface of the fiber layer and the fiber layer. It contains a resin layer formed on at least a part of the surface and can be stretched by 5% or more at 25 ° C., and the conductor layer is formed on the surface or inside of the resin layer, and the LED.
  • the element is electrically connected to the conductor layer, and the LED control means is laid on the base material sheet so as to be communicable with the LED element.
  • the present invention also includes a display device, an ultraviolet irradiation device, clothing, an ultraviolet irradiation device, and the like provided with the above-mentioned light emitting sheet.
  • FIG. 1 is a schematic cross-sectional view showing the configuration of a light emitting sheet according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view showing the configuration of a light emitting sheet according to another embodiment of the present invention.
  • FIG. 3 is a schematic cross-sectional view showing the configuration of a light emitting sheet according to still another embodiment of the present invention.
  • FIG. 4 is a schematic view showing an example of an ultraviolet irradiation device using the light emitting sheet of the present invention.
  • FIG. 5 is a schematic view showing a usage example of the ultraviolet irradiation device shown in FIG.
  • FIG. 6 is a schematic view showing still another example of the ultraviolet irradiation device using the light emitting sheet of the present invention.
  • each reference numeral is 1 base sheet, 2 fiber layer, 3 resin layer, 4 conductor layer, 5 LED element, 6 LED control means, 7, 7'vent, 8 power supply means, 9 radio. Indicates a communication means.
  • the light emitting sheet of the present embodiment includes a base sheet (fiber sheet) 1, a conductor layer 4, an LED element 5, and an LED control means 6.
  • the base material sheet contains a fiber layer and a resin layer formed on at least a part of the surface on one surface of the fiber layer, and can be stretched by 5% or more at 25 ° C.
  • the conductor layer is formed on the surface or inside of the resin layer, the LED element is electrically connected to the conductor layer, and the LED control means communicates with the LED element on the base material sheet. It is laid as possible.
  • the present embodiment it is possible to provide a light emitting sheet having excellent elasticity and durability that can be used for various purposes.
  • the light emitting sheet of the present invention is flexible, resistant to deformation, lightweight, yet has strength and durability, and can be integrated with the fabric without impairing the characteristics of the fabric or the like constituting the base sheet. Therefore, by using the light emitting sheet of the present invention, it is possible to provide an excellent display device, a sterilizer, clothing capable of displaying an image, etc., which have high durability against expansion and contraction.
  • the base material sheet 1 includes a fiber layer and a resin layer formed on at least a part of the surface on one surface of the fiber layer, and is 5% or more at 25 ° C. Elongation is possible.
  • the resin layer is not formed on the entire fiber layer, but is formed on at least a part of either the front or back surface of the fiber layer.
  • the fact that the base sheet 1 according to the present embodiment can be stretched by 5% at 25 ° C. means that when the base sheet 1 according to the present embodiment is stretched in one direction, the base sheet is not broken until it is stretched by at least 5%. It is possible to measure by cutting to a predetermined size and calculating the elongation rate until it breaks when pulled at a constant moving speed.
  • the base sheet capable of stretching by 5% can be integrated with the fabric without impairing the texture of the fabric, and can provide an electronic board or a circuit board having high durability against expansion and contraction. Further, the upper limit of extendability is not particularly limited, but 100% is sufficient.
  • the base sheet preferably has an initial tensile elastic modulus of 1 MPa or more and 10 GMPa or less at the portion where the resin layer is formed. Even if the initial tensile elastic modulus of the fiber layer contained in the base material sheet is less than 1 MPa, the initial tensile elastic modulus of the base material sheet can be set to 1 MPa or more by forming the resin layer.
  • the initial tensile elastic modulus means the elastic modulus when the sheet is stretched by 1%.
  • the initial tensile elastic modulus is less than 1 MPa, there is a problem that the restoring force is inferior and the original shape is not restored, which is not preferable. Further, if the initial tensile elastic modulus exceeds 10 GPa, the elasticity is inferior, and for example, when the light emitting sheet of the present embodiment is used for clothing or the like, there is a problem that it is not comfortable to wear, which is not preferable.
  • the initial tensile elastic modulus of the base sheet is 5 MPa or more and 1 GPa or less, more preferably 5 MPa or more and 500 MPa or less.
  • the initial tensile elastic modulus in the present embodiment is measured by a method of calculating the elastic modulus when the base sheet is cut to a predetermined size and pulled to 1% (elongation%) at a constant moving speed. Can be done. Specifically, the base sheet is cut to 50 mm * 100 mm and attached to a universal testing machine (AGS-X manufactured by Shimadzu Corporation). The test was performed at the initial grip distance: 50 mm and the tensile speed: 100 mm / min, and from all the stress ( ⁇ ) data corresponding to the strain (r) of 0 to 0.01, the least squares method was used to determine r- ⁇ . Calculate the slope and use it as the initial tensile elastic modulus.
  • Distortion (r) x / x0 (x is the moving distance of the gripping tool, x0 is the distance between the initial gripping tools)
  • Stress ( ⁇ ) F / (d ⁇ l) (F is the test force, d is the film thickness, l is the width of the test piece)
  • the elongation rate is calculated from the strain (r) when the base sheet is pulled until it breaks.
  • the resin layer in the base material sheet is not particularly limited as long as it is a resin layer in which the elongation of the base material sheet falls within the above range.
  • a thermosetting resin generally used as an elastic insulating layer of an electronic base material can be used as the resin layer of the present embodiment.
  • the resin layer in the present embodiment preferably contains a thermosetting resin, which is considered to be a resin layer that exhibits high heat resistance and suppresses melting and thermal decomposition even in a high temperature atmosphere. Since the resin layer has heat resistance, there is an advantage that various LED elements can be mounted by soldering. In addition, it is possible to suppress deformation and deterioration of the base sheet due to heat generation of the LED.
  • the resin layer 3 may be formed on the entire surface of one surface of the fiber layer 2, but one surface of the fiber layer 2 (either one). It suffices if it is formed on at least a part of the surface of the surface).
  • the resin layer 3 may be impregnated into the fiber layer 2. Further, not the entire resin layer 3 but a part thereof may be impregnated into at least a part of one side (any one side) of the fiber layer 2.
  • the thickness of the resin layer is not particularly limited and can be appropriately set depending on the intended use. For example, if the thickness is 50 ⁇ m to 5000 ⁇ m, the handleability is improved. It is preferable from the viewpoint of optical characteristics, wearability, and the like.
  • thermosetting resin of the present embodiment contains at least an epoxy resin. As a result, it is considered that heat resistance can be obtained more reliably.
  • thermosetting resin and the resin layer have a glass transition temperature of 60 ° C. or lower.
  • the base sheet can be further given flexibility. It is not necessary to set a lower limit for the glass transition temperature, but it is preferably ⁇ 40 ° C. or higher in order to avoid stickiness at room temperature.
  • the thermosetting resin can be stretched by 1% or more (at 25 ° C.). As a result, the base sheet can be stretched by 5% or more. Further, the thermosetting resin preferably has an initial tensile elastic modulus of 1 MPa or more and 10 GPa or less. As a result, the initial tensile elastic modulus at the portion where the resin layer of the base material sheet is formed can be set to 1 MPa or more and 10 GPa or less.
  • the resin composition used for the resin layer of the present embodiment is not particularly limited as long as it has the above-mentioned characteristics.
  • the resin composition of the present embodiment preferably contains a polyrotaxane resin or an epoxy resin as a thermosetting resin, and particularly preferably contains an epoxy resin. Further, it is preferable to contain a curing agent. As a result, it is possible to obtain a base material sheet having sufficient heat resistance and capable of withstanding the heat when mounting components in the reflow process. Further, by bonding the uncured resin composition to the fiber layer and then curing the resin composition, it becomes easy to integrate the resin layer with the fiber layer.
  • a resin composition containing a polyrotaxane (A), a thermosetting resin (B) and a curing agent (C) can be mentioned.
  • A polyrotaxane
  • B thermosetting resin
  • C curing agent
  • polyrotaxane (A) examples include polyrotaxane as described in Japanese Patent No. 4482633 or International Publication No. 2015/052853.
  • Commercially available products may be used, and specifically, CELM Super Polymer A1000 manufactured by Advanced Soft Materials Co., Ltd. can be used.
  • thermosetting resin (B) examples include thermosetting resins such as epoxy resin, phenol resin, polyimide resin, urea resin, melamine resin, unsaturated polyester, and urethane resin without particular limitation. Above all, it is preferable to use an epoxy resin.
  • the epoxy resin examples include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, aralkyl epoxy resin, phenol novolac type epoxy resin, alkylphenol novolak type epoxy resin, and biphenol type epoxy.
  • examples thereof include a resin, a naphthalene type epoxy resin, a dicyclopentadiene type epoxy resin, an epoxidized product of a condensate of phenols and an aromatic aldehyde having a phenolic hydroxyl group, triglycidyl isocyanurate, and an alicyclic epoxy resin. Depending on the situation, these may be used alone or in combination of two or more.
  • an epoxy resin containing two or more epoxy groups in one molecule and having a molecular weight of 500 or more is preferably exemplified.
  • an epoxy resin a commercially available one may be used, for example, JER1003 (manufactured by Mitsubishi Chemical Corporation, molecular weight 1300, bifunctional), EXA-4816 (manufactured by DIC, molecular weight 824, bifunctional), YP50 (Nippon Steel).
  • Examples thereof include Sumitomo Metals Chemical Corporation, molecular weight of 60,000 to 80,000, bifunctional), PMS-14-67 (manufactured by Nagase ChemteX Corporation, molecular weight of 300,000, polyfunctional) and the like.
  • the epoxy resin has an alkylene oxide-modified modifying group having 2 to 3 carbon atoms, and the modifying group is contained in 1 mol molecule of the epoxy in an amount of 4 mol or more, and has an epoxy group of 2 mol or more.
  • the thermosetting resin (B) and the curing agent (C) which are epoxy resins having an epoxy equivalent of 450 eq / mol or more, are contained, the cured product has the extensibility and the tensile elasticity. It is possible to obtain a composition.
  • an epoxy resin examples include propylene oxide-added bisphenol A type epoxy resin (ADEKA EP4003S), ethylene oxide-added hydroxyphenylfluorene type epoxy resin (Osaka Gas Chemical Co., Ltd. EG-280), and the like. Be done.
  • a resin composition containing a single component of polyrotaxane (A) and a thermosetting resin (B) and a curing agent (C) may be used, but both components ((A) and (B)) may be used. It is preferable to prepare a resin composition containing the curing agent (C) because the cured product can easily obtain the resin composition having the extensibility and the tensile elastic modulus. Further, one type of epoxy resin as described above may be used alone, or two or more types may be used in combination.
  • the curing agent (C) is not particularly limited as long as it works as a curing agent for the thermosetting resin (B).
  • examples of the epoxy resin that can be preferably used as a curing agent include phenol resins, amine compounds, acid anhydrides, imidazole compounds, sulfide resins, and dicyandiamides.
  • a light / ultraviolet curing agent, a thermal cation curing agent, and the like can also be used. Depending on the situation, these may be used alone or in combination of two or more.
  • the resin composition may contain a curing accelerator, if necessary. Examples of the effect promoter include imidazole compounds and the like.
  • a cross-linking agent may be further added, and such a cross-linking agent may be the polyrotaxane. It can be used without particular limitation as long as it can form a structure that crosslinks with at least a part of the cyclic molecule (at least one reactive group of the cyclic molecule of polyrotaxane). Specific examples thereof include isocyanate and cyanuric chloride.
  • the ratio of each component in the resin composition is not particularly limited as long as the effect of the present invention can be exhibited, but for example, when the component (A), the component (B) and the component (C) are all contained, the above-mentioned
  • the total of the components (A) to (C) is 100 parts by mass
  • the polyrotaxane (A) is 10 to 80 parts by mass, more preferably about 30 to 50 parts by mass
  • the thermosetting resin (B) is 10 to 89.9 parts by mass.
  • the curing agent (C) is about 0.1 to 30 parts by mass, more preferably about 0.1 to 20 parts by mass.
  • the resin composition of the present embodiment contains an isocyanate resin as a cross-linking agent
  • 0 to 50 parts by mass of the isocyanate resin can be added to the polyrotaxane (A), and further, 10 to 40 parts by mass. It is preferable to add it.
  • the component (B) and the component (C) are contained and the component (A) is not contained, the total amount of the resin composition is 100 parts by mass, and the thermosetting resin (B) is 50 to 99 parts by mass, more preferably. About 60 to 80 parts by mass;
  • the curing agent (C) is about 1 to 50 parts by mass, more preferably about 1 to 40 parts by mass.
  • the resin composition according to the present embodiment has other additives such as a curing catalyst (curing accelerator), a flame retardant, a flame retardant aid, a leveling agent, and a coloring agent as long as the effects of the present invention are not impaired. Etc. may be contained as needed.
  • the method for preparing the resin composition of the present embodiment is not particularly limited, and for example, first, a polyrotaxane resin and / or an epoxy resin, a curing agent, a cross-linking agent, a thermosetting resin, or the like is mixed so as to be uniform.
  • the resin composition of the present embodiment can be obtained.
  • the solvent used is not particularly limited, and for example, toluene, xylene, methyl ethyl ketone, acetone and the like can be used. These solvents may be used alone or in combination of two or more. Further, if necessary, an organic solvent for adjusting the viscosity and various additives may be blended.
  • the fiber layer described later is immersed in the resin composition as described above, the resin composition is applied to the fiber layer, or the resin composition in the form of a film. It is formed by sticking an object to a fiber layer.
  • the method for applying the resin composition is not particularly limited, and examples thereof include a bar coater, a comma coater, a die coater, a roll coater, and a gravure coater.
  • the impregnation can be repeated multiple times as needed. Further, at this time, it is also possible to repeat impregnation using a plurality of resin varnishes having different compositions and concentrations to finally adjust the desired composition and amount of resin.
  • the organic solvent is volatilized from the resin layer (A stage) containing the resin composition before curing containing the organic solvent by heating to reduce or remove the organic solvent. Can be done.
  • the fiber layer coated or impregnated with the resin composition (resin varnish) is heated under desired heating conditions, for example, 80 to 120 ° C. for 1 to 120 minutes to reduce or remove the organic solvent in an uncured or semi-cured state.
  • the resin layer in the state (B stage) is obtained.
  • the B stage of the resin composition that is, the uncured state (uncured product) or the semi-cured state (semi-cured product) is a state in which the resin composition can be further cured.
  • the semi-curing state includes a state between the time when the viscosity starts to increase and the time before it is completely cured.
  • the resin layer can be cured by further heating.
  • the fiber layer coated or impregnated with the resin composition (resin varnish) is heated at a desired heating condition, for example, 80 to 200 ° C. for 1 to 120 minutes to obtain a cured resin layer (C stage).
  • the C stage of the resin composition that is, the cured state (cured product) is a state in which the curing reaction proceeds and the resin is crosslinked so that it does not melt even when heated. As expected.
  • the resin composition is previously applied to a desired plastic film, metal foil, or the like, and the resin composition before curing (A stage) containing an organic solvent is contained.
  • a resin layer containing a substance or a resin layer in an uncured or semi-cured state (B stage) is obtained by heating at a desired heating condition, for example, 80 to 120 ° C. for 1 to 120 minutes. It is obtained by bonding this to the fiber layer and fixing it to the fiber layer by external energy such as pressure and heat. It may be a resin layer in an uncured or semi-cured state (B stage), or may be a resin layer in a cured state (C stage) by further curing the resin layer by heating.
  • the fiber layer in the base material sheet is not particularly limited, but is preferably a cloth or a fiber having properties similar to cloth, for example, a woven fabric, a knitted fabric, a braid, a non-woven fabric, or a fiber layer composed of a combination thereof. Can be used.
  • the fiber layer may be a unidirectionally arranged woven fabric. This has the advantage that a base sheet having elasticity only in a desired direction can be obtained.
  • the above-mentioned woven fabric, knitted fabric, braid or non-woven fabric is preferably composed of plant fiber, animal fiber, synthetic fiber, semi-synthetic fiber, regenerated fiber, inorganic fiber or a combination thereof. ..
  • the base material sheet of the present embodiment has elasticity
  • any fiber layer may be used as long as the base sheet can be stretched by 5% or more at 25 ° C.
  • the elastic modulus of the fiber layer is preferably about 0.01 MPa to 1 GPa
  • the elongation rate is preferably about 1% or more and 1000% or less, and more preferably 5% or more and 1000% or less. That is, the fiber layer of the present embodiment does not include a base material such as glass cloth having almost no extensibility.
  • examples of the fiber used for the fiber layer of the present embodiment include fibers generally used as a cloth. That is, examples of plant fibers include seed hair fibers such as cotton and kapok, bark fibers such as flax, timer, choma, jute, mitsumata, and mulberry, and leaf vein fibers such as Manila asa and sisal asa. Examples of animal fibers include wool, angora, cashmere, mohair, camels, alpaca, silk and the like. Animal fibers may contain leather, and include mammals such as cows, pigs, horses, sheep and goats, reptiles such as eels and snakes, birds such as ostriches, and fish such as sharks.
  • plant fibers include seed hair fibers such as cotton and kapok, bark fibers such as flax, timer, choma, jute, mitsumata, and mulberry, and leaf vein fibers such as Manila asa and sisal asa.
  • animal fibers include wool, angor
  • Synthetic fibers include nylon fiber, aramid fiber, vinylon fiber, polyvinylidene chloride synthetic fiber, polyvinyl chloride synthetic fiber, polyester synthetic fiber, polyacrylonitrile synthetic fiber, polyethylene synthetic fiber, polypropylene synthetic fiber, polyurethane. Examples include system synthetic fibers and polylactic acid fibers. Synthetic fibers may include artificial leather and synthetic leather. Examples of the semi-synthetic fiber include acetate fiber and the like. Examples of the regenerated fiber include viscose fiber and cuprammonium fiber. Examples of the inorganic fiber include glass fiber, carbon fiber, metal fiber and the like.
  • the cloth used for clothing can also be used as the fiber of the fiber layer.
  • it may be, for example, a fabric used for a tent, a truck bed, or the like. As a result, it is possible to integrate the fabric and various LED elements into the fabric used in various situations.
  • the thickness of the fiber layer is not particularly limited and can be appropriately set depending on the intended use. For example, if the thickness is 50 ⁇ m to 5000 ⁇ m, the elasticity is increased. It is preferable from the viewpoint of handleability.
  • the fiber layer of the present embodiment is provided with conductive wiring.
  • the conductive wiring contained in the fiber layer includes, for example, a thread-like metal wiring, a fiber obtained by kneading a conductive substance and spinning, a fiber obtained by plating the fiber with silver, copper, etc., and spattering. Examples thereof include fibers obtained by coating the fiber surface with a metal, fibers obtained by covering the above-mentioned thread-like metal wiring with a thread, and the like. Specific examples of the thread-like metal wiring include wiring made of copper, stainless steel, and aluminum.
  • the light emitting sheet of the present embodiment includes a conductor layer on the surface or inside of the resin layer.
  • the conductor layer 4 is provided on the surface (one side) of the resin layer 3 of the base material sheet 1, but the conductor layer 4 is provided on both sides or inside of the light emitting sheet. You can also.
  • Examples of the conductor layer include wiring formed of a metal foil or a conductive composition, an ultrathinly coated conductor layer, a conductive thread, a metal molded product, a liquid metal, and the like.
  • the conductor layer has a control circuit for sending a signal for controlling the LED element 5 described later from the LED control means 6, a voltage application circuit from the power supply means 8, and a wireless communication means 9. It plays a role as a transmission circuit of control information sent from a smartphone, a personal computer (PC), or the like.
  • the metal foil is not particularly limited, and examples thereof include copper foil (plating), aluminum foil, stainless steel foil, etc., and these metal foils are metal foils surface-treated with a silane coupling agent or the like. You may.
  • a double-sided metal foil-covered or single-sided metal foil-covered laminated body can be produced by heat-pressing molding and laminating and integrating.
  • one or more base sheet sheets are stacked, and a metal foil such as copper foil coated with a resin layer is layered on both upper and lower sides or a part or the entire surface thereof, and this is heat-press molded.
  • a double-sided metal foil-covered or single-sided metal foil-covered laminated body can be produced.
  • one or more fiber layers that do not contain a resin layer are layered, and a metal foil such as copper foil coated with a resin layer is layered on both upper and lower sides, a part of one side, or the entire surface thereof, and this is heated and pressed.
  • a metal foil such as copper foil coated with a resin layer
  • a conductor layer By molding and laminating and integrating, a double-sided metal foil-covered or single-sided metal foil-covered laminated body can be produced.
  • a conductor layer (wiring) can be provided as a circuit on the surface of the laminate including the base sheet as described above.
  • the metal foil is formed into a circuit by etching, it is preferable to mask the fiber layer so that it is not immersed in the etching solution.
  • a cover film a solvent-resistant plastic film such as polyimide is provided with an opening in a desired shape, and a resin layer covered with a single-sided metal foil is attached so as to cover the opening.
  • a resin layer covered with a single-sided metal foil is attached so as to cover the opening.
  • This laminate is attached to a plastic plate with tape or the like so that the fiber layer does not come into contact with the etching solution, and the etching process is performed.
  • a resin layer is provided in the shape of the opening, and a metal leaf circuit is formed on the surface thereof.
  • Examples of the method for forming a circuit include circuit formation by a semi-additive method (SAP: Semi Adaptive Process) and a modified semi-additive method (MSAP: Modified Semi Adaptive Process), in addition to the methods described above. Further, by laminating these with a resin layer in an uncured or semi-cured state, or a base sheet containing the resin layer, a laminated body containing a conductor layer can be produced.
  • SAP Semi Adaptive Process
  • MSAP Modified Semi Adaptive Process
  • a copper foil When a copper foil is further used as the conductor layer in the light emitting sheet of the present embodiment, it has heat resistance and the solder gets wet well, so that it becomes possible to mount a component (LED element) in the reflow process. It is possible to provide a fabric device or the like having high operation reliability. Further, the LED elements can be mounted on both sides by various means, or the mounted LED elements can be further included.
  • the conductor layer of the present embodiment may be formed of a conductive composition.
  • the conductive composition of the present embodiment is preferably a conductive composition having elasticity. As a result, it is possible to obtain a fabric device or the like that does not impair the extensibility and elasticity of the base material sheet and has excellent operation reliability.
  • the following is a specific example of a stretchable conductive composition.
  • the conductive composition contains a resin (D) serving as an elastic binder, a curing agent (E) that reacts with the resin (D), and a conductive filler (F), and the resin.
  • (D) has a functional group having a functional group equivalent of 400 g / eq or more and 10000 g / eq or less, and the cured product of the resin (D) and the conductive composition has a glass transition temperature (Tg) thereof.
  • Tg glass transition temperature
  • the softening point is 40 ° C or less, or the elastic modulus at 30 ° C is less than 1.0 GPa
  • the conductive filler (F) has an intrinsic volume resistivity at room temperature of 1 ⁇ 10 -4 ⁇ .
  • Examples thereof include a resin composition composed of a conductive substance having a size of cm or less.
  • Examples of the functional group include an epoxy group, a vinyl group, a (meth) acryloyl group, a hydroxyl group, a carboxyl group, an amino group, an alkoxy group, and a carbonyl group.
  • the component of the molecular structure of the resin (D) may be a single component, or a plurality of types may be used in combination at an arbitrary ratio. It is preferable that the molecular structure of the resin (D) is a molecular structure containing at least one selected from (meth) acrylic acid ester, styrene, and nitrile as a component. Specific examples thereof are preferably epoxy-modified (meth) acrylic acid ester, hydroxyl group-modified (meth) acrylic acid ester, carboxyl group-modified (meth) acrylic acid ester, and the like.
  • the resin (D) preferably has a weight average molecular weight of 50,000 or more.
  • the upper limit of the weight average molecular weight is not particularly limited, but if the molecular weight exceeds 3 million, the viscosity may increase and the handleability may decrease, so that the weight average molecular weight range of the resin (D) is preferable. Is 50,000 or more and 3 million or less, more preferably 100,000 or more and 1 million or less.
  • curing agent (E) various curing agents can be used without particular limitation as long as they have reactivity with the resin (D) as described above.
  • Specific examples of the curing agent (E) include imidazole compounds, amine compounds, phenol compounds, acid anhydride compounds, isocyanate compounds, mercapto compounds, onium salts, radical generators such as peroxides, and light. Examples include acid generators.
  • the conductive filler (F) is made of a conductive substance having an intrinsic volume resistivity of 1 ⁇ 10 -4 ⁇ ⁇ cm or less at room temperature.
  • the volume resistivity of the conductive composition is approximately 1 ⁇ 10 -3 ⁇ ⁇ , although it depends on the blending amount. It is cm to 1 x 10 -2 ⁇ ⁇ cm. Therefore, in the case of a circuit, the resistance value becomes high and the power loss becomes large.
  • Examples of the conductive substance include simple substances composed of metal elements such as silver, copper, and gold, and oxidation containing these elements. Examples include compounds such as substances, nitrides, carbides and alloys.
  • a conductive or semi-conductive conductive auxiliary agent may be added to the conductive composition for the purpose of further improving the conductivity.
  • a conductive or semi-conductive auxiliary agent a conductive polymer, an ionic liquid, carbon black, acetylene black, carbon nanotubes, an inorganic compound used as an antistatic agent, or the like can be used, and only one kind can be used. It may be used or two or more types may be used at the same time.
  • the conductive filler (F) preferably has a flat shape, and preferably has a thickness and an aspect ratio in the in-plane longitudinal direction of 10 or more.
  • the aspect ratio is 10 or more, the surface area of the conductive filler with respect to the mass ratio becomes large, and not only the efficiency of conductivity is improved, but also the adhesion with the resin component is improved and the elasticity is improved. ..
  • the aspect ratio is 1000 or less, it is preferably 10 or more and 1000 or less, and more preferably 20 or more and 500 or less, from the viewpoint of ensuring better conductivity and printability.
  • Examples of the conductive filler having such an aspect ratio include a conductive filler having a tap density of 6.0 g / cm 3 or less measured by the tap method. Further, when the tap density is 2.0 g / cm 3 or less, the aspect ratio is further increased, which is more preferable.
  • the blending ratio of the conductive filler (F) in the conductive composition is 40 to 95% by mass in terms of mass ratio. It is preferable in terms of conductivity, cost, and printability, and more preferably 60 to 85% by mass.
  • the particle size of the conductive filler (F) used in the present embodiment is not particularly limited, but it was measured by a laser light scattering method from the viewpoint of printability at the time of screen printing and an appropriate viscosity in kneading of the formulation.
  • the average particle size (particle size at a cumulative volume of 50%; D50) is preferably 0.5 ⁇ m or more and 30 ⁇ m or less, and more preferably 1.5 ⁇ m or more and 20 ⁇ m or less.
  • the conductive filler (F) is preferably a conductive filler whose surface is coupled.
  • the conductive composition of the present embodiment may contain a coupling agent. This has the advantage that the adhesion between the binder resin and the conductive filler is further improved.
  • the coupling agent to be added to the conductive composition or for coupling the conductive filler can be used without particular limitation as long as it adsorbs to the filler surface or reacts with the filler surface.
  • Examples thereof include silane coupling agents, titanate-based coupling agents, aluminum-based coupling agents and the like.
  • the addition amount thereof is preferably about 1% by mass to 20% by mass with respect to the entire conductive composition.
  • the ratio of each component in the conductive composition is not particularly limited as long as the effect of the present invention can be exhibited, and the compounding ratio of the (F) resin: the (G) curing agent is the resin and the curing. Depending on the type of agent, it can be appropriately determined in consideration of the equivalent ratio and the like.
  • additives and the like can be added to the conductive composition depending on the purpose.
  • additives include elastomers, surfactants, dispersants, colorants, fragrances, plasticizers, pH adjusters, viscosity regulators, ultraviolet absorbers, antioxidants, lubricants and the like.
  • the method for preparing the conductive composition is not particularly limited as long as the conductive composition can be produced.
  • a method for preparing the conductive composition for example, the above-mentioned resin component, the conductive filler, a curing agent, a dispersant, or the like, if necessary, and a solvent are mixed and stirred so as to be uniform. Examples thereof include a method for obtaining a conductive composition.
  • the mixing / stirring method is not particularly limited, and a high shear dispersion device such as a rotation-revolution mixer or a three-roll mill is preferably used. Further, vacuum defoaming may be performed.
  • a -Conductor layer using the conductive composition By applying or printing the conductive composition of the present embodiment on the resin layer of the base material sheet as described above, a coating film of the conductive composition is formed. It is possible to form a conductor layer such as a desired wiring (conductive pattern).
  • the conductive pattern or the like formed by the wiring can be formed on the surface of the base material sheet by the following steps. That is, first, a coating film is formed by applying or printing the conductive composition of the present embodiment on the resin layer, and the volatile components contained in the coating film are removed by drying. The resin (D) and the curing agent (F) are cured by the subsequent curing steps such as heating, electron beam, and light irradiation, and the coupling agent and the conductive filler (F) are combined with the resin (D). By the step of reacting with the curing agent (F), a conductive pattern by elastic wiring can be formed. Each condition in the curing step and the reaction step is not particularly limited, and may be appropriately set depending on the type of resin, curing agent, filler, etc. and the desired form.
  • the step of applying the conductive composition of the present embodiment onto the substrate is not particularly limited, and is, for example, a coating method such as an applicator, a wire bar, a comma roll, or a gravure roll, a screen, a flat plate offset, a flexo, an inkjet, or a stamping. , Dispens, squeegee, etc. can be used.
  • the conductor layer may be formed inside the base material sheet.
  • a conductor layer or wiring may be formed by coating, printing, or the like on both sides or a part or the entire surface of the material sheet. Further, a plurality of conductor layers may be connected by sewing with a conductive thread. Further, a plurality of conductor layers may be connected by a metal molded product such as a rivet or a snap button.
  • liquid metal when a liquid metal is used, it is preferable to form a conductor layer made of the liquid metal by enclosing the liquid metal in a sealed passage formed in the base sheet.
  • liquid metal according to the present embodiment include liquid metals as described in US Patent Application Publication No. 2018/0315518 and US Patent Application Publication No. 2018/0247727.
  • the LED element used in the present embodiment is not particularly limited as long as it emits light, and an appropriate LED element can be appropriately selected depending on the application of the light emitting sheet.
  • the LED element of the present embodiment may be an LED element that emits at least one selected from visible light, ultraviolet rays, and infrared rays.
  • visible light when the light emitting sheet is used for a display device, visible light is used, when it is used for a sterilizing device, a deodorizing device, etc., ultraviolet light is used, and when it is used for a security system, a distance measuring device, a signal transmitting device, etc.
  • the type of light emitted by the LED element can be appropriately selected.
  • different types of LED elements such as displaying the ON / OFF of the invisible light LED with visible light may be combined.
  • the LED element 5 is electrically connected to the conductor layer 4. As shown in FIG. 1, in the present embodiment, the LED element 5 is arranged on the conductor layer 4, and emits light by, for example, a current flowing through the conductor layer 4 from a power supply means or the like described later. be able to.
  • the light emitting sheet of the present embodiment further includes an LED control means 6 for controlling light emission of the LED element.
  • the LED control means 6 is laid on the base material sheet 1 so as to be communicable with the LED element 5.
  • the LED control means 6 can be used by any means without particular limitation as long as it can control the above-mentioned LED element 5. For example, various LED drivers, various switches and the like can be mentioned.
  • the light emitting signal emitted from the LED control means makes it possible to operate (light up) or stop the LED element, and to adjust the brightness of the light emission. That is, when the desired signal data is input to the LED control means, processing corresponding to the signal protocol input by the LED control means is performed, a light emission signal is transmitted to the LED element, and the information of the light emission signal is struck.
  • the LED element emits light depending on the brightness.
  • the image to be displayed can be adjusted by the display signal sent from the LED control means.
  • the same light emitting signal may be repeatedly transmitted from the LED control means, and when the display image is a moving image, the light emitting signal may be sequentially changed and sent from the LED control means.
  • the signal data to be sent to the LED control means of the present embodiment may be sent by a wired communication means or may be sent by a wireless communication means. From the viewpoint of convenience, it is preferable that the light emitting sheet of the present embodiment has the wireless communication means 9 as shown in FIG.
  • Wired communication means include a method of providing a control switch in a control circuit in the form of a base sheet, a method of connecting to a smartphone or a PC with a cable via a connection means such as USB, and a method of connecting to a PC using a wired LAN cable.
  • various wireless communication protocols can be used, for example, close range wireless communication such as NFC, Bluetooth (registered trademark), WPAN such as IrDA, UWB, ZigBee, WLAN such as Wi-Fi, and the like.
  • WMAN such as WiMAX, WWAN such as LTE, and the like can be mentioned. Since the light emitting sheet as shown in FIG. 3 includes the wireless communication means 9, the LED control means 6 can be operated by wireless communication by, for example, a smartphone or the like via the wireless communication means 9.
  • the LED control means may also include a memory such as a flash memory, and can store a complicated display (still image, moving image) signal in the memory when used in a display device or the like. ..
  • the signal data or the like is transmitted by appropriately selecting and using a known transmitter / receiver depending on whether it is wireless communication or wired communication, and can be received by the LED control means.
  • the light emitting sheet of the present embodiment may further have the following configuration.
  • the light emitting sheet according to the present embodiment further includes ventilation holes 7 and 7'that can be ventilated in the thickness direction.
  • the ventilation holes 7 may penetrate from the opening formed on one surface of the base sheet 1 toward the opening formed on the other surface, and the opening may be opened. It may be a place where there is no resin layer 3 and only the fiber layer 2 like the ventilation hole 7'shown.
  • the penetrating opening may be reinforced with eyelets or the like.
  • the light emitting sheet according to the present embodiment can, for example, move the moisture (moisture) existing on one surface side to the other surface side through the ventilation holes 7 and 7'. That is, in the light emitting sheet of the present embodiment, since the ventilation holes 7 and 7'can allow moisture to escape, the air permeability is excellent and it is possible to prevent the moisture from remaining on one surface. As a result, when the light emitting sheet is applied to a wearable device that is used by attaching it to an object, especially a patch device that is used by directly attaching it to a human body or by attaching it to clothes, etc., it dissipates moisture such as sweat. Therefore, it is considered to be more useful.
  • the presence of such a vent may cause the light emitting sheet to break or be blown by the wind. It also has the advantage of being able to prevent it from being damaged. It can also contribute to cooling the LED element.
  • the number of ventilation holes formed in the light emitting sheet is not particularly limited, but it is preferable that a plurality of ventilation holes are formed in the light emitting sheet from the viewpoint of improving air permeability.
  • the shape of the opening of the ventilation hole is preferably a shape that is hard to break when the light emitting sheet is expanded and contracted in the plane direction, and more preferably a shape that is hard to close, that is, a shape that is easy to maintain a wide open state. .. Examples of such a shape include a circular shape, an elliptical shape, a polygonal shape, and the like as the shape of the light emitting sheet in the plane direction. When a plurality of ventilation holes are formed, the openings may all have the same shape, but may be a combination of different shapes.
  • the aperture ratio of the openings of the ventilation holes (the total area of the ventilation holes with respect to the total area in the surface direction of the light emitting sheet including the total area of the ventilation holes) is not particularly limited as long as the ventilation can be secured.
  • the aperture ratio is preferably 0.001 to 45%, more preferably 0.01 to 20%.
  • excellent air permeability can be exhibited while maintaining the strength of the light emitting sheet, so that more excellent air permeability can be exhibited.
  • the total area of the openings of the ventilation holes is the area obtained by adding all the areas of the openings of the plurality of ventilation holes formed in the surface direction of the light emitting sheet.
  • the size of the opening of the ventilation hole is not particularly limited as long as the ventilation hole has a size capable of ventilating in the thickness direction of the light emitting sheet, and can be appropriately selected depending on the use of the light emitting sheet.
  • the light emitting sheet of the present embodiment may further include a power supply means for supplying electric power to the LED element and the LED control means (further, if necessary, a wireless communication means).
  • the power supply means is not particularly limited, and in addition to a general battery (battery), various wireless power supply means such as electromagnetic induction, magnetic field resonance, electric field coupling, laser, ultrasonic wave, wired power supply means by a plug, etc. can be used. It is possible.
  • a direct current (DC) power source is generally used as the power source, but a higher voltage alternating current (AC) power source may be used. You may.
  • the light emitting sheet of the present embodiment may further include other electronic components in addition to the LED element.
  • the electronic components that can be mounted are not particularly limited, and are general passive elements, active elements, integrated circuits, displays, motors, speakers, piezoelectric elements, switches, fuses, antennas, heat sinks, acceleration sensors, temperature sensors, humidity sensors, and light. Examples include sensors, ultrasonic sensors, pH sensors, gas sensors, moving body sensors, angle sensors, magnetic sensors, gyro sensors, pressure sensors, orientation sensors, radiation sensors, sound sensors, GPS receivers and the like.
  • the light emitting sheet of the present embodiment is, for example, a film-like light-emitting sheet in which the fiber layer is immersed in a thermosetting resin composition constituting the resin layer as described above, the resin composition is applied to the fiber layer, or the fiber layer is coated with the resin composition. It is obtained by providing a conductor layer as described above, an LED element, and, if necessary, an LED control means on a base material sheet formed by bonding the resin composition to a fiber layer or the like.
  • thermosetting resin composition is not particularly limited, and examples thereof include a bar coater, a comma coater, a die coater, a roll coater, a gravure coater, and an inkjet.
  • the impregnation can be repeated multiple times as needed. Further, at this time, it is also possible to repeat impregnation using a plurality of resin varnishes having different compositions and concentrations to finally adjust the desired composition and amount of resin.
  • the organic solvent is volatilized from the resin layer (A stage) containing the resin composition before curing containing the organic solvent by heating to reduce or remove the organic solvent. Can be done.
  • the fiber layer coated or impregnated with the resin composition (resin varnish) is heated under desired heating conditions, for example, 80 to 120 ° C. for 1 to 120 minutes to reduce or remove the organic solvent in an uncured or semi-cured state.
  • the resin layer in the state (B stage) is obtained.
  • the B stage of the resin composition that is, the uncured state (uncured product) or the semi-cured state (semi-cured product) is a state in which the resin composition can be further cured.
  • the semi-curing state includes a state between the time when the viscosity starts to increase and the time before it is completely cured.
  • the resin layer can be cured by further heating.
  • the heat insulating layer coated or impregnated with the resin composition is heated at a desired heating condition, for example, 80 to 200 ° C. for 1 to 120 minutes to obtain a cured resin layer (C stage).
  • the C stage of the resin composition that is, the cured state (cured product) is a state in which the curing reaction proceeds and the resin is crosslinked so that it does not melt even when heated. As expected.
  • the resin composition is previously applied to a desired plastic film, metal foil, or the like, and before curing (A stage) containing an organic solvent.
  • the resin layer containing the resin composition of the above, or a resin layer in an uncured or semi-cured state (B stage) is obtained by heating at a desired heating condition, for example, 80 to 120 ° C. for 1 to 120 minutes. It is obtained by bonding this to the fiber layer and fixing it to the heat insulating layer by external energy such as pressure and heat. Further, as a result, a heat insulating sheet having a surface roughness Rz within a specified range can be obtained. It may be a resin layer in an uncured or semi-cured state (B stage), or may be a resin layer in a cured state (C stage) by further curing the resin layer by heating.
  • a conductor layer As a conductor layer, a wiring formed of a metal foil or a conductive composition as described above, an ultrathinly coated conductive layer, or the like is provided.
  • the method of providing the conductor layer is as described above.
  • the LED element is installed on the conductor layer, but the mounting method thereof is not particularly limited.
  • a method using a soldering iron or various cream solders are printed and then mounted on various component mounting devices. Examples thereof include a method of mounting an LED element and mounting it by various reflow devices.
  • a means for heating only the metal portion by induction heating, microwaves, or the like.
  • the method for forming the ventilation holes is not particularly limited, and for example, the ventilation holes are formed on the base material sheet by using a drill, a laser, punching, or the like. How to do it, etc. Further, a method of adhering a resin layer having an opening in advance to the fiber layer may be used.
  • the light emitting sheet of the present embodiment can be used for various applications in which wearability, shape followability, and heat resistance are high. Specifically, it can be used, for example, in a display device, an ultraviolet irradiation device, an infrared irradiation device, a sterilizer, clothing, clothing, and the like.
  • display devices include digital signage, electronic paper, outdoor advertisement display devices, various flexible displays, lighting, and the like.
  • the display device such as digital signage using the light emitting sheet of the present embodiment is excellent in that it is flexible and light, it can be manufactured at a low price even when it has a large screen, and it can be attached to a cloth such as cloth. Has as an advantage.
  • the display device of the present embodiment includes a cloth and a display unit formed on the cloth, and at least a part of the display unit is formed by using a light emitting sheet as described above. ..
  • the cloth is not particularly limited, but a cloth such as a polyester-based synthetic fiber can be used.
  • the ultraviolet irradiation device using the light emitting sheet of the present embodiment includes a cloth and an ultraviolet irradiation portion formed on the cloth, and at least a part of the ultraviolet irradiation portion is formed by using the light emitting sheet as described above.
  • the ultraviolet irradiation device includes, for example, an ultraviolet irradiation glove (glove) as shown in FIG. 4, an ultraviolet irradiation sheet as shown in FIG. 6, and the like. Can be mentioned. A sterilization treatment or the like can be performed using such an ultraviolet irradiation device.
  • the ultraviolet irradiation (sterilization) glove is obtained by providing a wiring 4 as a conductor layer on a glove composed of a base material sheet 1 composed of, for example, a cloth, a synthetic fiber, or a resin layer, and the wiring 4 is provided on the glove.
  • a plurality of LED elements 5 can be mounted on the vehicle.
  • LED control means 6, wireless communication means 9, power supply means (battery) 8, and the like may be provided around the wrist of the glove.
  • the light emitted by the LED element included in the light emitting sheet is ultraviolet light (deep ultraviolet light).
  • a usage pattern of such a sterilizing glove for example, as shown in FIG.
  • the on / off of the LED element can be controlled only by grasping or opening the hand with the sterilizing glove. May be good.
  • the sterilization / sterilization treatment by ultraviolet rays deep ultraviolet rays
  • the sterilization / sterilization treatment by ultraviolet rays can be performed without touching the target to be sterilized / sterilized.
  • the light emitting sheet when used for the ultraviolet irradiation (sterilization) sheet, as shown in FIG. 6, a plurality of light emitting sheets are placed on the base sheet 1 via a conductor layer (not shown).
  • An LED element (ultraviolet ray) 5 can be mounted. It is considered that such a sterilization sheet can be easily sterilized in a wide range by covering it with bedding such as a bed, furniture, or the like.
  • the irradiation device an infrared irradiation device by changing the LED element to one that can irradiate infrared rays instead of ultraviolet rays.
  • the infrared irradiation device can be used for applications such as an infrared heater and an infrared communication means.
  • the light emitting sheet of the present embodiment to clothing or clothing, it is possible to display desired images, characters, moving images, etc. on the clothing or clothing.
  • the light emitting sheet it is possible to take in light at low cost into clothes and the like that are flexible and susceptible to wear.
  • the above-mentioned display device, ultraviolet irradiation device, infrared irradiation device, clothing, etc. can be manufactured by a known method using the above-mentioned light emitting sheet.
  • a desired display device, irradiation device, clothing, or the like can be formed by attaching a light emitting sheet as described above to the cloth or replacing a part of the cloth with the light emitting sheet as described above.
  • the light emitting sheet of this embodiment has heat resistance, it is possible to mount an LED element or the like by reflow as described above.
  • various heating means such as welding, soldering iron, induction heating, and microwave can be used. Even if it is a means capable of local heating, since the resin layer has heat resistance, it does not melt or thermally decompose. It can also be implemented by ACF or the like.
  • the resin layer has heat resistance, so that it does not melt or thermally decompose.
  • the present invention has a wide range of industrial applicability in the technical field relating to a light emitting sheet and various devices using the same.

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  • Physics & Mathematics (AREA)
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  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
PCT/JP2021/019699 2020-05-25 2021-05-25 発光シート、並びに、それを用いた表示装置および殺菌装置 Ceased WO2021241532A1 (ja)

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JP2012514498A (ja) * 2009-01-05 2012-06-28 プレクストロニクス インコーポレイテッド 有機発光ダイオード光線療法照明システム
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