WO2021229669A1 - 樹脂成形体、タブリード及び電池 - Google Patents

樹脂成形体、タブリード及び電池 Download PDF

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Publication number
WO2021229669A1
WO2021229669A1 PCT/JP2020/018906 JP2020018906W WO2021229669A1 WO 2021229669 A1 WO2021229669 A1 WO 2021229669A1 JP 2020018906 W JP2020018906 W JP 2020018906W WO 2021229669 A1 WO2021229669 A1 WO 2021229669A1
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WIPO (PCT)
Prior art keywords
resin
main surface
lead conductor
mass
lead
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Ceased
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PCT/JP2020/018906
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English (en)
French (fr)
Japanese (ja)
Inventor
智之 岡田
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Sumitomo Electric Industries Ltd
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Sumitomo Electric Industries Ltd
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Priority to JP2021505431A priority Critical patent/JPWO2021229669A1/ja
Priority to PCT/JP2020/018906 priority patent/WO2021229669A1/ja
Publication of WO2021229669A1 publication Critical patent/WO2021229669A1/ja
Anticipated expiration legal-status Critical
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers

Definitions

  • This disclosure relates to resin molded products, tab leads and batteries.
  • Patent Document 1 and Patent Document 2 disclose a battery configuration applicable to a secondary battery.
  • This battery has a structure in which a positive electrode, a negative electrode, an electrolytic solution and the like are enclosed in an enclosed bag, and lead wires are connected to the positive electrode and the negative electrode, respectively. A part of the lead wire is taken out from the encapsulation bag.
  • This lead wire is called a tab lead, and has a structure in which a resin molded body (resin film or the like) is arranged in a part of a region of a lead conductor. The resin molded body is arranged so as to seal the gap generated between the encapsulation bag and the lead conductor.
  • the resin molded body of the present disclosure includes a resin component containing a polyolefin resin and insulating particles having a thermal conductivity of 50 W / (m ⁇ K) or more dispersed in the resin component.
  • FIG. 1 is a plan view showing a tab lead according to the first embodiment.
  • FIG. 2 is a cross-sectional view showing a tab lead according to the first embodiment.
  • FIG. 3 is a cross-sectional view showing a method of manufacturing a tab lead according to the first embodiment.
  • FIG. 4 is a diagram showing an example of the battery according to the second embodiment.
  • FIG. 5 is a schematic view showing the internal structure of the encapsulation bag.
  • FIG. 6 is a diagram showing a configuration example of the battery according to the second embodiment.
  • FIG. 7 is a schematic cross-sectional view showing the battery according to the second embodiment.
  • the resin molded body according to one aspect of the present disclosure contains a resin component containing a polyolefin resin and insulating particles having a thermal conductivity of 50 W / (m ⁇ K) or more dispersed in the resin component. include.
  • the resin molded body is heat-fused to a conductor such as a lead conductor by applying heat.
  • Insulating particles are dispersed in the resin component, and the thermal conductivity of the insulating particles is 50 W / (m ⁇ K) or more. Therefore, when heat is applied, the heat is transferred through the insulating particles, and the entire resin molded body is formed. The temperature of the particles rises rapidly. Therefore, heat fusion can be performed in a short time. In particular, when the resin molded body is thickly formed, the shortening of the heat fusion time becomes remarkable.
  • the insulating particles may contain aluminum nitride particles, silicon carbide particles, or both of them.
  • the aluminum nitride particles and the silicon carbide particles have excellent thermal conductivity, and the time for heat fusion can be shortened.
  • the particle size of the insulating particles may be 0.2 ⁇ m or more and 5.0 ⁇ m or less.
  • the particle size of the insulating particles is 0.2 ⁇ m or more and 5.0 ⁇ m or less, excellent dispersibility in the resin component can be obtained, and the thickness of the resin molded product can be easily controlled.
  • the insulating particles may be contained in an amount of 3.0 parts by mass or more and 20.0 parts by mass or less per 100 parts by mass of the resin component.
  • 3.0 parts by mass or more and 20.0 parts by mass or less of insulating particles per 100 parts by mass of the resin component excellent thermal conductivity and moldability can be obtained.
  • the resin molded product can be heat-sealed in a short time, and can be particularly preferably used as a sealing material.
  • the tab lead according to another aspect of the present disclosure includes a lead conductor having a first main surface and a second main surface opposite to the first main surface, and the lead conductor. While exposing both ends in the first direction, between the two ends of the lead conductor, the first main surface, the second main surface, and the resin portion covering both side surfaces are formed.
  • the resin portion includes the resin molded product according to any one of [1] to [5].
  • One of the means for improving the insulating property of the resin part is to thicken the resin part.
  • the thicker the resin portion the longer the time required for heat fusion with the lead conductor.
  • the resin portion contains the above-mentioned resin molded body, it is possible to suppress the lengthening of the time required for heat fusion.
  • the tab lead according to another aspect of the present disclosure includes a lead conductor having a first main surface and a second main surface opposite to the first main surface, and the lead conductor. While exposing both ends in the first direction, between the both ends of the lead conductor, the first main surface, the second main surface, and the resin portion covering both side surfaces are formed.
  • the resin portion includes a resin component containing a polyolefin resin and aluminum nitride particles dispersed in the resin component.
  • the battery according to another aspect of the present disclosure is described in [6] or [7], wherein the battery is connected to a packaging material, a power generation element housed in the packaging material, and an electrode of the power generation element. It has a tab lead, and one end of the lead conductor and the resin portion in the first direction is arranged outside the packaging material.
  • the first embodiment relates to a resin molded product and a tab lead.
  • FIG. 1 is a plan view showing a tab lead according to the first embodiment.
  • FIG. 2 is a cross-sectional view showing a tab lead according to the first embodiment.
  • FIG. 2 corresponds to a cross-sectional view taken along the line I-I in FIG.
  • the tab lead 1 has a lead conductor 10 and a resin portion 20.
  • the lead conductor 10 includes a first main surface 10A and a second main surface 10B opposite to the first main surface 10A.
  • the lead conductor 10 has, for example, a rectangular planar shape.
  • the direction in which a set of sides parallel to each other extends is the X direction
  • the direction in which the other set of sides parallel to each other extends is the Y direction
  • the normal direction of 10A is the Z direction.
  • the dimension in the X direction may be larger or smaller than the dimension in the Y direction, and may be the same as the dimension in the Y direction.
  • the X direction is an example of the first direction
  • the Y direction is an example of the second direction.
  • the resin portion 20 covers the first main surface 10A, the second main surface 10B, and both side surfaces 10C between both ends of the lead conductor 10 while exposing both ends in the X direction.
  • the lead conductor 10 is formed of, for example, aluminum (Al), nickel (Ni), an aluminum alloy, a nickel alloy, nickel-plated copper, nickel-clad copper, or the like.
  • Al aluminum
  • Ni nickel
  • an aluminum alloy aluminum or an aluminum alloy is used for the lead conductor 10 on the positive electrode side
  • nickel, nickel alloy, or copper plated with nickel is used for the lead conductor on the negative electrode side. Will be done.
  • the lead conductor 10 may be surface-treated to enhance adhesiveness, or the surface may be untreated.
  • the resin molded body used for the resin portion 20 has sufficiently high adhesiveness to the surface-untreated aluminum conductor. Therefore, the lead conductor 10 may be a surface-untreated aluminum conductor. In this case, it is possible to obtain a tab lead 1 in which the resin portion 20 is arranged so that the resin portion 20 comes into direct contact with the metal (surface untreated aluminum conductor) constituting the lead conductor 10.
  • Examples of the surface treatment include chromate treatment.
  • the lead conductor 10 has a strip-shaped shape, and its dimensions are appropriately set as necessary.
  • the thickness of the lead conductor 10 is 0.05 mm or more and 1.0 mm or less
  • the length in the X direction is 1 mm or more and 100 mm or less
  • the length in the Y direction is 10 mm or more and 60 mm or less.
  • Such a lead conductor 10 can be manufactured, for example, by cutting a metal foil having a thickness of 0.05 mm or more and 1.0 mm or less into a predetermined size.
  • the resin portion 20 has, for example, a matrix 15 composed of resin components and insulating particles 16 dispersed in the matrix 15.
  • the resin portion 20 is arranged so as to cover the outer peripheral side of a part of the region in the X direction excluding the region including both ends in the X direction of the lead conductor 10. Since both ends of the lead conductor 10 in the X direction are electrically connected to conductive portions such as electrodes and terminals, the resin portion 20 is not formed and is exposed.
  • the resin portion 20 is arranged so as to cover the outer peripheral side thereof in a part of the region other than the both end portions.
  • the resin portion 20 has, for example, two resin films (corresponding to a resin molded body) 21 and 22 bonded to each other so as to sandwich the lead conductor 10.
  • the dimensions of the resin films 21 and 22 in the Y direction are larger than the dimensions of the lead conductor 10 in the Y direction, thereby improving the sealing property.
  • the thickness of the resin films 21 and 22 is 30 ⁇ m or more and 200 ⁇ m or less
  • the length in the X direction is 2 mm or more and 10 mm or less
  • the length in the Y direction is 3 mm or more and 110 mm or less.
  • the resin films 21 and 22 are, for example, a resin molded body made of a resin composition containing a resin component and insulating particles.
  • the form of the resin molded product does not necessarily have to be in the film state.
  • it may be a seamless resin portion formed by applying or extrusion molding a resin composition around the lead conductor 10.
  • a film it is also possible to wind a single film around the lead conductor 10 to form the resin portion 20.
  • the resin films 21 and 22 are shown in a single-layer structure, respectively, but instead of the single-layer resin film 21 and the resin film 22, a laminate containing a plurality of resin films is used. You may.
  • a first layer made of a polyolefin resin such as maleic anhydride-modified low density polyethylene (PE) and polypropylene (PP) and a second layer made of a polyolefin resin such as low density polyethylene are used.
  • PE maleic anhydride-modified low density polyethylene
  • PP polypropylene
  • a two-layer structure in which the above is bonded can be used.
  • the resin component contains a polyolefin resin.
  • An acid-containing group may be introduced into the polyolefin resin.
  • the polyolefin resin is a synthetic resin obtained by polymerizing or copolymerizing an olefin-based monomer having a radically polymerizable unsaturated double bond.
  • the olefin-based monomer is not particularly limited, and for example, ⁇ - such as ethylene, propylene, 1-butane, 1-pentene, 1-hexene, 1-heptene, 1-octene, 4-methyl-1-pentene and the like. Examples thereof include olefins and conjugated dienes such as butadiene and isoprene.
  • the olefin-based monomer may be used alone or in combination of two or more.
  • the polyolefin resin is not particularly limited, and is, for example, a homopolymer of ethylene (polyethylene), a polyethylene-based resin such as a copolymer of ethylene and an ⁇ -olefin other than ethylene, which contains more than 50% by mass of an ethylene component.
  • Examples thereof include homopolymers or copolymers of conjugated diene such as.
  • the acid group-containing polyolefin resin is not particularly limited, but an unsaturated carboxylic acid-modified polyolefin resin obtained by modifying the polyolefin resin with an unsaturated carboxylic acid is preferable.
  • the unsaturated carboxylic acid include acrylic acid, methacrylic acid, crotonic acid, maleic acid, silicic acid, itaconic acid, citraconic acid, and fumaric acid, as well as maleic anhydride, itaconic anhydride, and citraconic anhydride.
  • Examples include unsaturated carboxylic acid anhydrides. Of these, maleic acid or maleic anhydride is preferable from the viewpoint of adhesiveness between the lead conductor 10 and the resin portion 20.
  • the acid group-containing polyolefin resin may have a component containing a polar group other than the acidic group introduced by acid modification and a non-polar component.
  • a component containing a polar group and a non-polar component may be copolymerized to form a main chain.
  • a component having a polar group may be grafted on a main chain consisting of a non-polar component.
  • the polar group-containing component and the non-polar component may be introduced regularly or irregularly.
  • the polar group is not particularly limited, and examples thereof include an alkoxy group, an epoxy group, a carboxyl group, a hydroxyl group, a maleic anhydride group, an isocyanate group, and an aldehyde group.
  • the acid group-containing polyolefin resin a (maleic) maleic acid-modified polyolefin resin is preferable.
  • the (maleic anhydride) modified polyolefin resin has adhesiveness to the lead conductor 10 and is excellent in sealing property.
  • the (maleic) maleic acid-modified polyolefin resin is obtained by graft-polymerizing (anhydrous) maleic anhydride on the polyolefin resin.
  • Examples of the (maleic) maleic acid-modified polyolefin resin include (anhydrous) maleic anhydride-modified polyethylene resin and (anhydrous) maleic acid-modified polypropylene resin.
  • the acid group-containing polyolefin resin preferably contains at least one of maleic anhydride-modified polypropylene and a combination of polypropylene and an ethylene-methacrylic acid copolymer.
  • the acid group-containing polyolefin resin may be used alone or in combination of two or more.
  • the resin component may contain both an acid group-containing polyolefin resin and an acid group-free unmodified polyolefin resin.
  • the resin component has an acid group-containing moiety of 0.05% by mass or more and 5% by mass or less.
  • the "acid group-containing site” includes a site in which a site containing an acid group is chemically bonded in the polymer chain of the resin, and a free acid such as a free carboxylic acid. From the viewpoint of enhancing the adhesiveness of the resin to the metal material, it is preferable that the site containing the acid group is chemically bonded in the polymer chain of the resin.
  • the "acid group” of the acid group-containing portion includes not only an acid group such as a carboxylic acid or a sulfonic acid but also an acid anhydride group such as a dicarboxylic acid anhydride.
  • the amount of the acid group-containing moiety can be calculated, for example, based on a known analytical method for nuclear magnetic resonance (NMR) spectra.
  • the amount of the acid group-containing portion can also be calculated from the amount of the acid blended for modification with respect to the total amount of the polyolefin resin.
  • NMR nuclear magnetic resonance
  • the ratio of maleic anhydride to the polyolefin portion can be calculated from the NMR spectrum.
  • the ratio of maleic anhydride should be quantitatively calculated based on the intensity of the peak derived from the carbonyl site detected in the vicinity of 1700 cm -1 by a Fourier transform infrared spectrometer (FT-IR). You can also.
  • FT-IR Fourier transform infrared spectrometer
  • the amount of the acid group-containing portion is the amount of the acid group-containing portion in the entire polyolefin resin including the unmodified polyolefin resin. It can be calculated as a ratio.
  • the ratio of the acid group-containing portion in the entire resin component is 0.05% by mass or more and 5% by mass or less.
  • the ratio of the acid group-containing portion in the entire resin component is 0.05% by mass or more, the adhesiveness of the resin component to the metal material can be maintained at a sufficient level.
  • the ratio of the acid group-containing portion in the entire resin component is 5% by mass or less, the deterioration of moldability can be suppressed.
  • the lower limit is more preferably 0.1% by mass, still more preferably 0.5% by mass.
  • the upper limit is more preferably 4% by mass, still more preferably 3% by mass.
  • the resin composition contains insulating particles having a thermal conductivity of 50 W / (m ⁇ K) or more.
  • Insulating particles include, for example, aluminum nitride particles, silicon carbide particles, or both. The insulating particles rapidly transfer heat applied from the outside to a part of the resin molded product, for example, one surface of the film-shaped resin molded product, to the entire resin molded product.
  • the thermal conductivity of the polyolefin contained in the resin component is 0.10 W / (m ⁇ K) or more and 0.20 W / (m ⁇ K) or less. If the thermal conductivity of the insulating particles is less than 50 W / (m ⁇ K), heat may not be transferred quickly. Therefore, the thermal conductivity of the insulating particles is 50 W / (m ⁇ K) or more, preferably 100 W / (m ⁇ K) or more, and more preferably 150 W / (m ⁇ K) or more. In the present disclosure, the thermal conductivity is the thermal conductivity at 25 ° C.
  • the temperature of heat fusion is higher than 25 ° C., but if sufficient thermal conductivity is obtained at 25 ° C., sufficient thermal conductivity can be obtained even at the temperature of heat fusion.
  • the thermal conductivity of aluminum nitride is 180 W / (m ⁇ K) or more and 230 W / (m ⁇ K) or less
  • the thermal conductivity of silicon carbide is 100 W / (m ⁇ K) or more and 350 W / (m ⁇ K) or less. It is as follows.
  • the particle size of the insulating particles is preferably 0.2 ⁇ m or more and 5.0 ⁇ m or less.
  • the particle size of the insulating particles means the average particle size. If the particle size of the insulating particles is less than 0.2 ⁇ m, agglomeration of the insulating particles may easily occur. Therefore, the particle size of the insulating particles is preferably 0.2 ⁇ m or more, more preferably 0.5 ⁇ m or more, and further preferably 1.0 ⁇ m or more. If the particle size of the insulating particles exceeds 5.0 ⁇ m, it may be difficult to control the thickness of the resin films 21 and 22.
  • the particle size of the insulating particles is preferably 5.0 ⁇ m or less, more preferably 3.0 ⁇ m or less, and further preferably 2.0 ⁇ m or less.
  • the particle size of the insulating particles may be 0.5 ⁇ m or more and 3.0 ⁇ m or less, or 1.0 ⁇ m or more and 2.0 ⁇ m or less.
  • the particle size of the insulating particles can be obtained by measuring the particle size by a laser diffraction method and calculating the average value thereof.
  • the amount of insulating particles is preferably 3.0 parts by mass or more and 20.0 parts by mass or less per 100 parts by mass of the resin component. If the amount of insulating particles is less than 3.0 parts by mass per 100 parts by mass of the resin component, heat may not be transferred promptly. Therefore, the amount of the insulating particles is preferably 3.0 parts by mass or more, more preferably 5.0 parts by mass or more, and further preferably 7.0 parts by mass or more per 100 parts by mass of the resin component. If the amount of insulating particles exceeds 20.0 parts by mass per 100 parts by mass of the resin component, the moldability of the resin composition may deteriorate.
  • the amount of the insulating particles is preferably 20.0 parts by mass or less, more preferably 15.0 parts by mass or less, and further preferably 10.0 parts by mass or less per 100 parts by mass of the resin component.
  • the amount of insulating particles may be 5.0 parts by mass or more and 15.0 parts by mass or less, or 7.0 parts by mass or more and 10.0 parts by mass or less per 100 parts by mass of the resin component. ..
  • the resin composition for forming the resin films 21 and 22 is a dispersion in which the insulating particles 16 are dispersed in a matrix 15 composed of a resin component containing the acid group-containing polyolefin resin.
  • the resin composition is prepared by adding the insulating particles 16 to the uncured resin component and mixing them.
  • the method of adding the insulating particles 16 to the resin component serving as the base resin is not particularly limited. Examples include batch type (a method of adding and mixing insulating particles 16 to a base resin for each fixed amount of batch) or continuous type (a method of continuously adding and mixing a fixed amount of insulating particles 16 to a base resin). Method) and other addition methods can be mentioned.
  • the degree of dispersion of the insulating particles 16 with respect to the resin component for example, when 1.0 part by mass of the insulating particles 16 is added per 100 parts by mass of the resin component to form the resin films 21 and 22 having a thickness of 50 ⁇ m, visually. It can be determined that the insulating particles are transparent, and it is preferable that the degree of dispersion is such that the aggregated particles of the insulating particles 16 are not seen.
  • the resin composition may contain, if necessary, an acid receiver, a flame retardant, an ultraviolet absorber, a light stabilizer, a heat stabilizer, a lubricant, a colorant and the like. Various additives may be mixed.
  • the acid receiving agent is, for example, an inorganic compound containing at least one of magnesium and calcium.
  • the acid acceptor, magnesium oxide, magnesium hydroxide, (as a typical composition, Mg 6 A l2 (OH) 16 CO 3 ⁇ 4H 2 O , etc.) hydrotalcite calcium compounds such as magnesium compounds and calcium carbonate such as And so on.
  • a weakly basic compound is preferable because it is easy to handle.
  • the particle size of the acid receiving agent particles is 5 ⁇ m or less.
  • the particle size of the acid receiving agent means the average particle size.
  • the particle size of the acid receiving agent is preferably 4 ⁇ m or less, more preferably 3 ⁇ m or less.
  • the particle size of the acid receiving agent can be obtained by measuring the particle size by a laser diffraction method and calculating the average value thereof.
  • the amount of the acid receiving agent is 1 part by mass or more and 20 parts by mass or less per 100 parts by mass of the resin component.
  • the amount of the acid receiving agent is 20 parts by mass or less per 100 parts by mass of the resin component, deterioration of the moldability of the resin composition can be suppressed.
  • the resin films 21 and 22 can be produced as follows. First, a resin composition is prepared by adding and mixing the insulating particles 16 and necessary additives with respect to the resin component to be the base resin. Mixing can be performed using a mixing device such as an open roll, a pressurized kneader, a single-screw mixer, or a twin-screw mixer. Resin films 21 and 22 are produced by molding the obtained resin composition into a desired thickness using a molding apparatus such as an extrusion molding machine. As shown in FIG. 2, the obtained resin films 21 and 22 have a structure in which the insulating particles 16 are evenly dispersed in the matrix 15 of the resin components.
  • FIG. 3 is a cross-sectional view showing a method of manufacturing the tab lead 1.
  • resin films 21 and 22 are prepared, and the resin films 21 and 22 are bonded to each other so as to sandwich the lead conductor 10.
  • the lead conductor 10 and the resin films 21 and 22 are sandwiched between the upper head 31 and the lower head 32 of the hot press machine, and hot pressing is performed.
  • heat is applied to the resin films 21 and 22 from the upper head 31 and the lower head 32.
  • the heat applied to the resin films 21 and 22 is transmitted through the matrix 15 and spreads throughout, and is also transferred through the insulating particles 16. Therefore, the temperature rises rapidly even at the interface between the resin film 21 and the resin film 22 separated from the upper head 31 and the lower head 32, and at the interface between the resin films 21 and 22 and the lead conductor 10. Therefore, the heat fusion can be completed in a short time.
  • the tab lead 1 including the lead conductor 10 and the resin portion 20 made of the resin films 21 and 22 is taken out from the hot press machine.
  • the tab lead 1 can be manufactured by such a method.
  • the tab lead 1 can be manufactured in a short time even when the thick resin films 21 and 22 are used. That is, it is possible to improve the productivity of the tab lead 1 provided with the resin portion 20 having a high insulating property. Further, the longer the heat fusion time, the more likely the resin films 21 and 22 are to be deformed unexpectedly. However, by shortening the heat fusion time, such deformation is suppressed to obtain excellent dimensional accuracy and appearance. Obtainable.
  • the tab lead 1 can be used, for example, as a material for sealing a power supply extraction portion of a battery.
  • the second embodiment relates to an enclosed bag type non-aqueous electrolyte battery using the tab lead 1 according to the first embodiment.
  • FIG. 4 is a diagram showing an example of the battery according to the second embodiment.
  • FIG. 5 is a schematic view showing the internal structure of the encapsulation bag.
  • FIG. 6 is a diagram showing a configuration example of the battery according to the second embodiment.
  • FIG. 7 is a schematic cross-sectional view showing the battery according to the second embodiment.
  • the positive electrode 105a and the negative electrode 105b are overlapped with the separator 106 interposed therebetween.
  • the lead conductor 110a of the positive electrode tab lead 101a is joined to the positive electrode 105a by welding or the like.
  • the lead conductor 110b of the negative electrode tab lead 101b is joined to the negative electrode 105b by welding or the like.
  • the positive electrode 105a, the negative electrode 105b, and the separator 106 are arranged so that a part of the positive electrode tab lead 101a and the negative electrode tab lead 101b (a part on the opposite side of the positive electrode 105a and the negative electrode 105b) protrudes to the outside of the encapsulation bag 111.
  • the assembly 130 including the positive electrode tab lead 101a and the negative electrode tab lead 101b is housed in the sealing bag 111.
  • the encapsulation bag 111 is an example of a packaging material, and a positive electrode 105a, a negative electrode 105b, and a separator 106 are included in the power generation element.
  • the tab lead 1 described above is used for the tab leads 101a and 101b. That is, the tab lead 101a has a resin portion 120a corresponding to the resin portion 20, and the tab lead 101b has a resin portion 120b corresponding to the resin portion 20. As shown in FIG. 7, the resin portions 120a and 120b include the matrix 215 similar to the matrix 15 and the insulating particles 216 of the acid receiving agent similar to the insulating particles 16.
  • the electrolytic solution is injected into the encapsulation bag 111.
  • the opening of the encapsulation bag 111 is heat-sealed so as to sandwich the lead conductors 110a and 110b taken out to the outside and overlap with the resin portions 120a and 120b of the tab leads 101a and 101b arranged in the opening of the encapsulation bag 111. ..
  • One ends of the lead conductors 110a and 110b and the resin portions 120a and 120b in the X direction are arranged on the outside of the encapsulation bag 111.
  • the encapsulation bag 111 has a laminated structure of a metal layer 109 such as aluminum foil, an outer layer 107 on the outer side of the metal layer 109, and an inner layer 108 on the inner side of the metal layer 109.
  • the outer layer 107 is a resin layer and functions as a protective layer.
  • the inner layer 108 is a resin layer having a heat-sealing property.
  • a polyethylene terephthalate (PET) film is used for the outer layer 107
  • a thermoplastic film such as polyethylene is used for the inner layer 108.
  • the sealing bag 111 is sealed in the sealing portion 104.
  • the positive electrode 105a and the negative electrode 105b each have a plate-like shape. By forming the positive electrode 105a and the negative electrode 105b into a plate shape, the non-aqueous electrolyte battery 100 can be made thinner.
  • the positive electrode 105a and the negative electrode 105b have a structure in which an active material layer is formed on a metal base material such as a metal foil or an expanded metal called a current collector.
  • the method of joining the positive electrode tab lead 101a and the positive electrode 105a and the method of joining the negative electrode tab lead 101b and the negative electrode 105b are not particularly limited, but a method of joining by spot welding, ultrasonic welding or the like can be preferably used.
  • the material of the lead conductor 110a aluminum, titanium, or an alloy of these metals can be preferably used. In particular, aluminum or an aluminum alloy is preferable.
  • the lead conductor 110b is preferably made of a material that does not easily react with lithium and is difficult to dissolve at a high potential.
  • nickel, copper, or an alloy of these metals can be preferably used as the material of the lead conductor 110b. Nickel or nickel alloy is particularly preferable.
  • the resin portions 120a and 120b of the tab leads 101a and 101b are arranged at the openings of the encapsulation bag 111.
  • the resin portions 120a and 120b are made of the above-mentioned resin molded body.
  • the resin portions 120a and 120b are fused to the inner layer film of the encapsulation bag 111 to prevent deterioration of the sealing property, and electrically insulate between the metal layer 109 of the encapsulation bag 111 and the lead conductor 110a or the lead conductor 110b. It has a function.
  • the resin portion is composed of only a polypropylene matrix.
  • the resin portion is composed of a polypropylene matrix and aluminum nitride particles having a particle size of 0.2 ⁇ m, and the aluminum nitride particles are contained in an amount of 3.0 parts by mass with respect to 100 parts by mass of the resin component. Suppose you are.
  • the resin portion is composed of a polypropylene matrix and zinc oxide particles having a particle size of 50 ⁇ m, and the zinc oxide particles are contained in an amount of 30 parts by mass with respect to 100 parts by mass of the resin component. .. Except for the difference in the composition of the resin portion described above, other conditions are assumed to be the same among the first example, the second example and the third example.
  • the thermal conductivity of polypropylene is 0.17 W / (m ⁇ K)
  • the thermal conductivity of aluminum nitride is 180 W / (m ⁇ K) to 230 W / (m ⁇ K)
  • the thermal conductivity of zinc oxide is It is 25 W / (m ⁇ K). Therefore, assuming that the time required for heat fusion of the resin film in the first example is 10.0 seconds, the time required for heat fusion of the resin film in the second example is 6.7 seconds. In the example of 3, the time required for heat fusion of the resin film is 9.5 seconds.
  • the time required for heat fusion is the time required for the conductor and the resin film to adhere to each other without gaps and for the adhesive force at these interfaces to reach 10 N / cm.
  • the adhesive strength is measured by the 90 ° directional peeling method specified in JIS C6471: 1995 "Copper-clad laminate test method for flexible printed wiring boards".
  • the time required for heat fusion of the resin film can be shortened.
  • Tab lead 10 Lead conductor 10A: First main surface 10B: Second main surface 10C: Side surface 15: Matrix 16: Insulated particles 20: Resin parts 21, 22: Resin film 31: Upper head 32: Lower head 100: Non-aqueous electrolyte battery 101a: Positive electrode tab lead 101b: Negative electrode tab lead 104: Sealing part 105a: Positive electrode 105b: Negative electrode 106: Separator 107: Outer layer 108: Inner layer 109: Metal layer 110a, 110b: Lead conductor 111: Encapsulation bag 120a, 120b: Resin part 130: Assembly 215: Matrix 216: Insulating particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Sealing Battery Cases Or Jackets (AREA)
PCT/JP2020/018906 2020-05-12 2020-05-12 樹脂成形体、タブリード及び電池 Ceased WO2021229669A1 (ja)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024084025A (ja) * 2022-12-12 2024-06-24 トヨタ自動車株式会社 電池

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JPH10245720A (ja) * 1997-03-03 1998-09-14 Chisso Corp 分割型複合繊維及びそれを用いた布帛
JP2005210069A (ja) * 2003-10-29 2005-08-04 Showa Denko Kk 電解コンデンサ
JP2019052244A (ja) * 2017-09-15 2019-04-04 株式会社フジクラ 難燃性樹脂組成物、これを用いた絶縁電線、メタルケーブル、光ファイバケーブル及び成形品
JP2019220295A (ja) * 2018-06-18 2019-12-26 大倉工業株式会社 タブリード用フィルム、及びこれを用いたタブリード

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Publication number Priority date Publication date Assignee Title
JP6569282B2 (ja) * 2015-04-27 2019-09-04 住友電気工業株式会社 絶縁リード及び蓄電デバイス
CN105969271A (zh) * 2016-06-29 2016-09-28 哈尔滨永淇化工有限公司 一种基于正丁酯和糠醇酯的高弹性蓄电池密封胶及制作方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10245720A (ja) * 1997-03-03 1998-09-14 Chisso Corp 分割型複合繊維及びそれを用いた布帛
JP2005210069A (ja) * 2003-10-29 2005-08-04 Showa Denko Kk 電解コンデンサ
JP2019052244A (ja) * 2017-09-15 2019-04-04 株式会社フジクラ 難燃性樹脂組成物、これを用いた絶縁電線、メタルケーブル、光ファイバケーブル及び成形品
JP2019220295A (ja) * 2018-06-18 2019-12-26 大倉工業株式会社 タブリード用フィルム、及びこれを用いたタブリード

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024084025A (ja) * 2022-12-12 2024-06-24 トヨタ自動車株式会社 電池

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