WO2021228389A1 - Support pour un système de transport à rouleaux, système de transport à rouleaux et appareil de traitement sous vide doté de celui-ci - Google Patents

Support pour un système de transport à rouleaux, système de transport à rouleaux et appareil de traitement sous vide doté de celui-ci Download PDF

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Publication number
WO2021228389A1
WO2021228389A1 PCT/EP2020/063375 EP2020063375W WO2021228389A1 WO 2021228389 A1 WO2021228389 A1 WO 2021228389A1 EP 2020063375 W EP2020063375 W EP 2020063375W WO 2021228389 A1 WO2021228389 A1 WO 2021228389A1
Authority
WO
WIPO (PCT)
Prior art keywords
carrier
roller
transport
contact surface
roller contact
Prior art date
Application number
PCT/EP2020/063375
Other languages
English (en)
Inventor
Christian Wolfgang Ehmann
Oliver Heimel
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to CN202080096979.0A priority Critical patent/CN115103926A/zh
Priority to PCT/EP2020/063375 priority patent/WO2021228389A1/fr
Publication of WO2021228389A1 publication Critical patent/WO2021228389A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • C23C16/545—Apparatus specially adapted for continuous coating for coating elongated substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4587—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G54/00—Non-mechanical conveyors not otherwise provided for
    • B65G54/02—Non-mechanical conveyors not otherwise provided for electrostatic, electric, or magnetic

Definitions

  • a vacuum processing apparatus for depositing material onto a substrate.
  • the vacuum processing apparatus includes at least one vacuum processing chamber and a roller transport system according to aspects of the present disclosure for transporting a carrier according to aspects of the present disclosure into or out of the at least one vacuum processing chamber.
  • FIG. 1 shows a schematic side view of a roller transport system having no misaligned rollers
  • FIGS. 2A-2B show schematic side views of a roller transport system according to the prior art having misaligned rollers;
  • FIG. 1 shows a schematic side view of a roller transport system for transporting a carrier 100 typical of the prior art.
  • the roller transport system includes at least one roller transport track 200a, 200b, wherein roller transport track 200a, 200b includes a plurality of rollers 210a, 210b.
  • Carrier 100 is shown to be exemplarily supported by five rollers 210a of first roller transport track 200a, and due to the optimal alignment of each of the five rollers 210a supporting carrier 100 and the optimal flatness of roller contact surface 120, it follows that roller contact surface 120 contacts each of the five rollers 210a. Further, due to the optimal alignment of first roller transport track 200a and second roller transport track 200b and the optimal flatness of roller contact surface 120, carrier 100, which is about to contact roller 210b of second roller transport track 200b, will be efficiently transported across valve 300 and onto second roller track 200b. [0031] As a result of this optimal situation, reaction loads R are distributed across each of the respective rollers 210a, 210b which contact roller contact surface 120.
  • the reaction load Rb increases and the reaction load Ra decreases to a point where, when the center of gravity CoG of carrier 100 is above the first misaligned roller 210b, i.e. the distance b is zero, the supported weight W of carrier 100 is supported by a single roller.
  • carrier 100 will then be subjected to another pitching movement about the transverse axis until roller contact surface 120 contacts another roller 210b of second roller transport track 200b.
  • first roller contact surface 120a may be arranged such that a first end of first roller contact surface 120a is equal to or less than 100 mm, particularly equal to or less than 50 mm, more particularly equal to or less than 20 mm from the forward end of carrier 100.
  • a second end, opposite to the first end, of first roller contact surface 120a is the end at which the space is provided.
  • second roller contact surface 120b may be arranged such that a second end of second roller contact surface 120b is equal to or less than 100 mm, particularly equal to or less than 50 mm, more particularly equal to or less than 20 mm from the rearward end of carrier 100.
  • a first end, opposite to the second end, of second roller contact surface 120b is the end at which the space is provided.
  • the respective first end may be referred to as a forward end, while the respective second end may be referred to as a rearward end, when carrier 100 is transported in transport direction X.
  • FIG. 5 shows a cross-sectional front view of the roller transport system and carrier 100 for a vacuum processing apparatus according to embodiments described herein.
  • the roller transport system is provided with a roller transport track 200 according to embodiments described herein, and a carrier 100 for being transported by roller transport system in transport direction X.
  • roller transport track 200 may be arranged at the bottom of carrier 100, and carrier 100 may be oriented in a vertical or near-vertical orientation.
  • carrier 100 is provided with first and second roller contact surfaces 120a, 120b configured to contact a plurality of rollers 210 of roller transport track 200.
  • first and second roller contact surfaces 120a, 120b may be flat contact surfaces for contacting a cylindrical roller.
  • a cylindrical roller offers low friction, low wear and low cost.
  • additional means for guiding the carrier 100 in the transverse direction Z may be implemented.
  • the total pressure in the at least one vacuum processing chamber may range from about 10 4 mbar to about 10 7 mbar, especially in the case that a second component besides the evaporated material is present in the at least one vacuum processing chamber (such as a processing gas or the like).
  • the at least one vacuum processing chamber can be a “vacuum deposition chamber”, i.e. a vacuum processing chamber configured for vacuum deposition.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente divulgation concerne, selon un aspect, un support (100) destiné à être transporté dans une direction de transport (X) sur une piste de transport à rouleaux (200a, 200b). Le support (100) comprend une première surface de contact de rouleau (120a) conçue pour supporter le support (100) sur au moins un premier rouleau (210a) de la piste de transport à rouleaux (200a) et une seconde surface de contact de rouleau (120b) conçue pour supporter le support (100) sur au moins un second rouleau (210b) de la piste de transport à rouleaux (200b), la première surface de contact de rouleau (120a) et la seconde surface de contact de rouleau (120b) étant séparées dans la direction de transport (X) avec un espace entre elles. Selon d'autres aspects, l'invention concerne un système de transport à rouleaux et un appareil de traitement sous vide.
PCT/EP2020/063375 2020-05-13 2020-05-13 Support pour un système de transport à rouleaux, système de transport à rouleaux et appareil de traitement sous vide doté de celui-ci WO2021228389A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202080096979.0A CN115103926A (zh) 2020-05-13 2020-05-13 用于辊运输系统的载体、辊运输系统和具有辊运输系统的真空处理设备
PCT/EP2020/063375 WO2021228389A1 (fr) 2020-05-13 2020-05-13 Support pour un système de transport à rouleaux, système de transport à rouleaux et appareil de traitement sous vide doté de celui-ci

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2020/063375 WO2021228389A1 (fr) 2020-05-13 2020-05-13 Support pour un système de transport à rouleaux, système de transport à rouleaux et appareil de traitement sous vide doté de celui-ci

Publications (1)

Publication Number Publication Date
WO2021228389A1 true WO2021228389A1 (fr) 2021-11-18

Family

ID=70738543

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2020/063375 WO2021228389A1 (fr) 2020-05-13 2020-05-13 Support pour un système de transport à rouleaux, système de transport à rouleaux et appareil de traitement sous vide doté de celui-ci

Country Status (2)

Country Link
CN (1) CN115103926A (fr)
WO (1) WO2021228389A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5667065A (en) * 1992-12-19 1997-09-16 Fahrion; Otmar Stackable packaging unit
FR2757827A1 (fr) * 1996-12-26 1998-07-03 France Fil Container pour stockage et transport de bouteilles
WO2017050350A1 (fr) * 2015-09-21 2017-03-30 Applied Materials, Inc. Support de substrat, ainsi qu'appareil de dépôt par pulvérisation cathodique et procédé utilisant celui-ci
US20170244070A1 (en) * 2014-02-04 2017-08-24 Applied Materials, Inc. System for depositing one or more layers on a substrate supported by a carrier and method using the same
WO2019081010A1 (fr) * 2017-10-25 2019-05-02 Applied Materials, Inc. Support destiné à être utilisé dans une chambre sous vide, système pour tester un agencement de transport dans une chambre sous vide, système de traitement sous vide et procédé pour tester un agencement de transport dans une chambre sous vide

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1111613A (ja) * 1997-06-19 1999-01-19 Maki Seisakusho:Kk 搬送機構付きパレットラック
JP2006191039A (ja) * 2005-01-05 2006-07-20 Samsung Sdi Co Ltd トレイ移送装置
DE102008031782B4 (de) * 2008-07-04 2022-02-03 Linde Material Handling Gmbh Palette
AT508328A1 (de) * 2009-06-03 2010-12-15 Tgw Mechanics Gmbh Fördervorrichtung zum transport von stückgütern
CN106164331B (zh) * 2013-09-20 2018-11-23 应用材料公司 具有一体式静电夹盘的基板载体
WO2015096855A1 (fr) * 2013-12-23 2015-07-02 Applied Materials, Inc. Agencements de support destinés à des substrats
JP6499108B2 (ja) * 2016-03-28 2019-04-10 トヨタ自動車株式会社 移載装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5667065A (en) * 1992-12-19 1997-09-16 Fahrion; Otmar Stackable packaging unit
FR2757827A1 (fr) * 1996-12-26 1998-07-03 France Fil Container pour stockage et transport de bouteilles
US20170244070A1 (en) * 2014-02-04 2017-08-24 Applied Materials, Inc. System for depositing one or more layers on a substrate supported by a carrier and method using the same
WO2017050350A1 (fr) * 2015-09-21 2017-03-30 Applied Materials, Inc. Support de substrat, ainsi qu'appareil de dépôt par pulvérisation cathodique et procédé utilisant celui-ci
WO2019081010A1 (fr) * 2017-10-25 2019-05-02 Applied Materials, Inc. Support destiné à être utilisé dans une chambre sous vide, système pour tester un agencement de transport dans une chambre sous vide, système de traitement sous vide et procédé pour tester un agencement de transport dans une chambre sous vide

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