WO2021225066A1 - 半導体装置の製造装置および製造方法 - Google Patents
半導体装置の製造装置および製造方法 Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
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- B25J15/0675—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum of the ejector type
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- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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Abstract
Description
Claims (5)
- 基板が載置されるステージと、
前記ステージに対向する保持面でチップを吸引保持し、前記ステージに対して前記ステージの面方向および法線方向に相対的に移動可能なボンディングヘッドと、
前記ボンディングヘッドに設けられた倣い機構であって、凹状球面及び凸状球面の一方を含む固定部材と、凹状球面及び凸状球面の他方を含むとともに前記保持面とともに前記固定部材に対して揺動可能に設けられた可動部材と、を有する倣い機構と、
前記保持面に保持された前記チップの端面または前記保持面である対向面を、前記ステージで保持された基板平面または前記ステージ平面である基準面に倣わすことで、前記対向面を前記基準面に対して平行に調整する倣い処理を実行させるコントローラと、
を備え、前記倣い機構は、前記可動部材の揺動が可能なフリー状態と、前記可動部材の揺動が規制されたロック状態と、に切り替え可能であり、
前記コントローラは、前記倣い処理において、前記ボンディングヘッドの軸方向位置が規定の基準位置に達するまで、前記倣い機構を前記フリー状態で前記対向面を前記基準面に当接させたまま前記ボンディングヘッドを前記基準面の面方向に相対的に移動させ、前記軸方向位置が前記基準位置に達した際に前記倣い機構を前記ロック状態に切り替える、
ことを特徴とする半導体装置の製造装置。 - 請求項1に記載の半導体装置の製造装置であって、
前記コントローラは、前記倣い処理において、前記ボンディングヘッドを、少なくとも基準面に平行な四方向に移動させる、ことを特徴とする半導体装置の製造装置。 - 請求項1または2に記載の半導体装置の製造装置であって、
前記コントローラは、前記倣い処理において、前記ボンディングヘッドを予め規定した倣いルートに沿って移動させる過程で、前記軸方向位置が前記ステージに最も近づいたときの前記軸方向位置を前記基準位置として特定する、ことを特徴とする半導体装置の製造装置。 - 請求項1または2に記載の半導体装置の製造装置であって、
前記基準位置は、前記ボンディングヘッドおよびステージの配置、または、過去の倣い処理の結果に基づいて予め決定されている、ことを特徴とする半導体装置の製造装置。 - ステージに載置された基板に、倣い機構を有するボンディングヘッドの保持面で吸引保持したチップをボンディングすることで、半導体装置を製造する半導体装置の製造方法であって、
前記保持面に保持された前記チップの端面または前記保持面である対向面を、前記ステージで保持された基板平面またはステージ平面である基準面に倣わすことで、前記対向面を前記基準面に対して平行に調整する倣いステップを備えており、
前記倣い機構は、凹状球面及び凸状球面の一方を含む固定部材と、凹状球面及び凸状球面の他方を含むとともに前記保持面とともに前記固定部材に対して揺動可能に設けられた可動部材と、を有し、前記可動部材の揺動が可能なフリー状態と、前記可動部材の揺動が規制されたロック状態と、に切り替え可能であり、
前記倣いステップにおいて、前記ボンディングヘッドの軸方向位置が規定の基準位置に達するまで、前記倣い機構を前記フリー状態で前記対向面を前記基準面に当接させたまま前記ボンディングヘッドを前記基準面の面方向に相対的に移動させ、前記軸方向位置が前記基準位置に達した際に前記倣い機構を前記ロック状態に切り替える、
ことを特徴とする半導体装置の製造方法。
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CN202180004320.2A CN114080665A (zh) | 2020-05-08 | 2021-04-16 | 半导体装置的制造装置以及制造方法 |
US17/642,951 US20220336256A1 (en) | 2020-05-08 | 2021-04-16 | Semiconductor device manufacturing device and manufacturing method |
KR1020227042457A KR20230006000A (ko) | 2020-05-08 | 2021-04-16 | 반도체 장치의 제조 장치 및 제조 방법 |
JP2022519920A JP7145558B2 (ja) | 2020-05-08 | 2021-04-16 | 半導体装置の製造装置および製造方法 |
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JP2012084740A (ja) * | 2010-10-13 | 2012-04-26 | Toray Eng Co Ltd | 実装装置の平行度調整方法および平行度調整装置 |
JP2015126007A (ja) * | 2013-12-25 | 2015-07-06 | 日立オートモティブシステムズ株式会社 | 表面実装装置 |
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JPH053223A (ja) * | 1991-06-24 | 1993-01-08 | Toshiba Corp | 平行出し機構と平行出し方法及びこの平行出し機構或いは平行出し方法を用いたインナリ−ドボンデイング装置とインナリ−ドボンデイング方法 |
JP3400299B2 (ja) * | 1997-06-26 | 2003-04-28 | 株式会社新川 | ボンディング装置用ツール保持構造 |
JP3919684B2 (ja) | 2003-03-13 | 2007-05-30 | 松下電器産業株式会社 | 倣い装置およびそれを用いた接合装置 |
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- 2021-04-16 KR KR1020227042457A patent/KR20230006000A/ko not_active Application Discontinuation
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2012084740A (ja) * | 2010-10-13 | 2012-04-26 | Toray Eng Co Ltd | 実装装置の平行度調整方法および平行度調整装置 |
JP2015126007A (ja) * | 2013-12-25 | 2015-07-06 | 日立オートモティブシステムズ株式会社 | 表面実装装置 |
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JP7145558B2 (ja) | 2022-10-03 |
CN114080665A (zh) | 2022-02-22 |
JPWO2021225066A1 (ja) | 2021-11-11 |
TW202209529A (zh) | 2022-03-01 |
US20220336256A1 (en) | 2022-10-20 |
KR20230006000A (ko) | 2023-01-10 |
TWI793594B (zh) | 2023-02-21 |
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