WO2021223608A1 - 显示模组及显示面板 - Google Patents

显示模组及显示面板 Download PDF

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Publication number
WO2021223608A1
WO2021223608A1 PCT/CN2021/089514 CN2021089514W WO2021223608A1 WO 2021223608 A1 WO2021223608 A1 WO 2021223608A1 CN 2021089514 W CN2021089514 W CN 2021089514W WO 2021223608 A1 WO2021223608 A1 WO 2021223608A1
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Prior art keywords
light
display module
layer
semiconductor layer
electrical connection
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PCT/CN2021/089514
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English (en)
French (fr)
Inventor
刁鸿浩
黄玲溪
Original Assignee
北京芯海视界三维科技有限公司
视觉技术创投私人有限公司
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Publication of WO2021223608A1 publication Critical patent/WO2021223608A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/04—Structural and physical details of display devices
    • G09G2300/0421—Structural details of the set of electrodes
    • G09G2300/0426—Layout of electrodes and connections

Definitions

  • This application relates to the field of optical technology, for example, to a display module and a display panel.
  • the size of the light emitting unit in the display panel is getting smaller and smaller, such as Mini LED, micro LED (Micro Light Emitting Diode, micro light emitting diode) and so on.
  • each light-emitting unit needs to be connected to the driving unit.
  • the embodiments of the present disclosure provide a display module and a display panel to solve the technical problem that the layout of the conductive traces of the electrodes of the light-emitting unit is not flexible enough.
  • a display module which includes a light emitting device layer and at least two electrical connection layers.
  • the light emitting device layer includes a light emitting surface and a backlight surface, and the electrical connection layer is disposed on the backlight surface of the light emitting device layer;
  • the light emitting device layer includes a plurality of light emitting units arranged in an array, the light emitting unit includes at least two electrodes, and the at least two electrodes are arranged on the backlight surface of the light emitting device layer;
  • Each electrical connection layer includes at least one conductive trace, at least two electrodes include a first electrode and a second electrode, and the first electrode and the second electrode are respectively connected to different electrical connection layers;
  • the first electrodes of part or all of the light-emitting units located in the same row are connected to the same conductive trace in the same electrical connection layer;
  • the second electrodes of part or all of the light-emitting units located in the same column are connected to the same conductive trace in the same electrical connection layer.
  • an insulating layer is provided between adjacent electrical connection layers
  • An insulating layer may be provided between the electrical connection layer and the light emitting device layer.
  • the first electrodes of part or all of the light-emitting units located in the same row may be connected to the same conductive trace in the same electrical connection layer through the first conductive structure.
  • the first conductive structure may include a first conductive via and a conductive material disposed in the first conductive via.
  • the second electrodes of part or all of the light-emitting units located in the same column may be connected to the same conductive trace in the same electrical connection layer through the second conductive structure.
  • the second conductive structure may include a second conductive via and a conductive material disposed in the second conductive via.
  • the first electrodes of part or all of the light-emitting units in at least one row may be connected to the same conductive trace in the same electrical connection layer.
  • the second electrodes of part or all of the light-emitting units in at least one column may be connected to the same conductive trace in the same electrical connection layer.
  • an isolation layer may be provided between adjacent light-emitting units.
  • the isolation layer includes at least one of an insulating light reflecting material and an insulating light absorbing material.
  • the light-emitting unit may include a first semiconductor layer, an active layer, and a second semiconductor layer.
  • One surface of the first semiconductor layer serves as a light-emitting surface, and the other surface may be sequentially provided with an active layer and a second semiconductor layer;
  • the longitudinal projection of the second semiconductor layer covers part of the first semiconductor layer and does not extend beyond the edge of the first semiconductor layer;
  • the first electrode may be arranged on a part of the first semiconductor layer that is not covered by the longitudinal projection of the second semiconductor layer;
  • the second electrode may be disposed on a side of the second semiconductor layer away from the first semiconductor layer.
  • the longitudinal projection of the second electrode does not extend beyond the edge of the second semiconductor layer.
  • the portion of the first semiconductor layer that is not covered by the longitudinal projection of the second semiconductor layer may be located at the edge or inside of the first semiconductor layer.
  • the portion of the first semiconductor layer that is not covered by the longitudinal projection of the second semiconductor layer may be located at the edge of the first semiconductor layer.
  • the first semiconductor layer, the active layer, and the second semiconductor layer may collectively form a Mesa step.
  • the slope of the Mesa step may be 40 degrees to 90 degrees.
  • the portion of the first semiconductor layer that is not covered by the longitudinal projection of the second semiconductor layer may be located inside the first semiconductor layer, and the light emitting unit may further include a hole that penetrates the active layer and the second semiconductor layer from the first semiconductor layer. Two semiconductor layers.
  • the first electrode may be disposed in the hole.
  • an insulating material may be filled between the first electrode and the sidewall of the hole.
  • the sidewall and the bottom surface of the hole may be perpendicular or inclined.
  • the area of the side of the first electrode close to the backlight surface may be larger than the area of the side away from the backlight surface.
  • the cross section of the first electrode along the light-emitting direction of the light-emitting unit is a trapezoid, and the upper base of the trapezoid is close to the light-emitting surface.
  • the light-emitting surface may also be provided with a light conversion layer.
  • the light conversion layer may at least include a light conversion material and a dispersion medium of the light conversion material.
  • a display panel including the above-mentioned display module.
  • the clever and flexible wiring method realizes the connection with the drive unit and realizes the image display, which can reduce the pins of the drive unit connection wiring to a certain extent, and is especially suitable for small-sized light-emitting units.
  • FIG. 1 is a schematic diagram of a cross-sectional structure of a display module provided by an embodiment of the present disclosure
  • FIG. 2 is a schematic diagram of the arrangement of light-emitting units in a display module provided by an embodiment of the present disclosure
  • FIG. 3 is another schematic cross-sectional structure diagram of a display module provided by an embodiment of the present disclosure.
  • FIG. 4 is a schematic diagram of another cross-sectional structure of a display module provided by an embodiment of the present disclosure.
  • FIG. 5 is a schematic structural diagram of conductive traces in a display module provided by an embodiment of the present disclosure
  • FIG. 6 is another schematic diagram of the conductive wiring in the display module provided by an embodiment of the present disclosure.
  • FIG. 7 is another schematic diagram of the conductive wiring in the display module provided by an embodiment of the present disclosure.
  • FIG. 8 is a schematic diagram of another cross-sectional structure of a display module provided by an embodiment of the present disclosure.
  • FIG. 9 is a schematic diagram of another cross-sectional structure of a display module provided by an embodiment of the present disclosure.
  • FIG. 10 is a schematic diagram of the distribution of the first electrode and the second electrode in the display module provided by an embodiment of the present disclosure
  • FIG. 11 is another schematic diagram of the distribution of the first electrode and the second electrode in the display module provided by an embodiment of the present disclosure.
  • FIG. 12 is another schematic diagram of the distribution of the first electrode and the second electrode in the display module provided by an embodiment of the present disclosure.
  • FIG. 13 is another schematic diagram of the distribution of the first electrode and the second electrode in the display module provided by an embodiment of the present disclosure
  • FIG. 14 is a schematic diagram of a cross-sectional structure of a light-emitting unit in a display module provided by an embodiment of the present disclosure
  • 15 is a schematic diagram of another cross-sectional structure of a light-emitting unit in a display module provided by an embodiment of the present disclosure.
  • 16 is another schematic cross-sectional structure diagram of a display module provided by an embodiment of the present disclosure.
  • FIG. 17 is another schematic cross-sectional structure diagram of a display module provided by an embodiment of the present disclosure.
  • FIG. 18 is a schematic diagram of another cross-sectional structure of the light-emitting unit in the display module provided by an embodiment of the present disclosure.
  • FIG. 19 is a schematic diagram of another cross-sectional structure of a light-emitting unit in a display module provided by an embodiment of the present disclosure.
  • FIG. 20 is a schematic diagram of another cross-sectional structure of a light-emitting unit in a display module provided by an embodiment of the present disclosure
  • FIG. 21 is a schematic diagram of another cross-sectional structure of a light-emitting unit in a display module provided by an embodiment of the present disclosure.
  • 22 is another schematic cross-sectional structure diagram of a display module provided by an embodiment of the present disclosure.
  • FIG. 23 is a schematic structural diagram of a display panel provided by an embodiment of the present disclosure.
  • 1 light-emitting device layer
  • 10 light-emitting unit
  • 2 electrical connection layer
  • 3 insulating layer
  • 41 first conductive via
  • 42 second conductive via
  • 5 isolation layer
  • 6 Mesa step
  • 7 hole;
  • 101 first electrode; 102: second electrode; 103: first semiconductor layer; 104: active layer; 105: second semiconductor layer;
  • 100 display module
  • 200 display panel
  • FIG. 1 is a schematic cross-sectional structure diagram of a display module provided by an embodiment of the present disclosure
  • FIG. 2 is a schematic diagram of an arrangement of light-emitting units in a display module provided by an embodiment of the present disclosure.
  • a display module 100 includes a light emitting device layer 1 and at least two electrical connection layers 2.
  • the light emitting device layer 1 includes a light emitting surface and a backlight surface, and the electrical connection layer 2 is disposed on the backlight surface of the light emitting device layer 1;
  • the light emitting device layer 1 includes a plurality of light emitting units 10 arranged in an array, the light emitting unit 10 includes at least two electrodes, and the at least two electrodes are arranged on the backlight surface of the light emitting device layer 1;
  • Each electrical connection layer 2 includes at least one conductive trace, at least two electrodes include a first electrode 101 and a second electrode 102, and the first electrode 101 and the second electrode 102 are respectively connected to different electrical connection layers;
  • Part or all of the first electrodes 101 of the light-emitting units 10 located in the same row are connected to the same conductive trace in the same electrical connection layer;
  • Part or all of the second electrodes 102 of the light-emitting units 10 located in the same column are connected to the same conductive trace in the same electrical connection layer.
  • the electrical connection layer 2 is formed on the light-emitting device layer 2 through a metal deposition process, including electroplating, physical vapor deposition (Physical Vapor Deposition, PVD), etc., rather than a mass transfer method.
  • the light-emitting unit is a continuous area on the same wafer.
  • FIG. 3 is a schematic cross-sectional structure diagram of some embodiments of the display module provided by the embodiments of the present disclosure.
  • it includes three electrical connection layers, which are the first electrical connection layer and the second electrical connection layer.
  • the first electrode 101 of a part of the light-emitting unit 10 in the same row is connected to the same first conductive trace 21 in the first electrical connection layer, and the other part of the light-emitting unit 10 in the same row
  • the first electrode 101 is connected to the same third conductive trace 23 in the third electrical connection layer, and the second electrodes 102 of all the light-emitting units 10 in the same column are connected to the same second electrical connection layer in the second electrical connection layer.
  • Conductive trace 22 is a schematic cross-sectional structure diagram of some embodiments of the display module provided by the embodiments of the present disclosure.
  • it includes three electrical connection layers, which are the first electrical connection layer and the second electrical connection layer.
  • the first electrode 101 of a part of the light-emitting unit 10 in the same row is connected to
  • FIG. 4 is a schematic cross-sectional structure diagram of some embodiments of the display module provided by the embodiments of the present disclosure.
  • it includes three electrical connection layers, which are the first electrical connection layer and the second electrical connection layer.
  • Layer and a third electrical connection layer where the first electrodes 101 of all the light-emitting units 10 located in the same row are connected to the same third conductive trace 23 in the third electrical connection layer, and some of the light-emitting units 10 located in the same column
  • the second electrode 102 is connected to the same first conductive trace 21 in the first electrical connection layer, and the second electrodes 102 of the other part of the light-emitting units 10 in the same column are connected to the same conductive trace 21 in the second electrical connection layer. Electric route 22.
  • FIG. 5 is a schematic structural diagram of some embodiments of conductive traces in a display module provided by an embodiment of the present disclosure.
  • it includes two electrical connection layers 2, which are respectively the first electrical connection.
  • Layer and a second electrical connection layer wherein the first electrodes 101 of all the light-emitting units 10 located in the same row are connected to the same first conductive trace 21 in the first electrical connection layer;
  • the second electrode 102 is connected to the same second conductive trace 22 in the second electrical connection layer.
  • an insulating layer 3 is provided between adjacent electrical connection layers 2;
  • An insulating layer 3 is provided between the electrical connection layer 2 and the light emitting device layer 1.
  • the first electrodes of part or all of the light-emitting units located in the same row are connected to the same conductive trace in the same electrical connection layer through the first conductive structure.
  • the first conductive structure includes a first conductive via 41 and a conductive material disposed in the first conductive via 41.
  • the first conductive via 41 penetrates through the insulating Layer 3.
  • the second electrodes of part or all of the light-emitting units located in the same column are connected to the same conductive trace in the same electrical connection layer through the second conductive structure.
  • the second conductive structure includes a second conductive via and a conductive material disposed in the second conductive via 42.
  • the second conductive via 42 penetrates the insulating layer 3.
  • the first electrodes of part or all of the light-emitting units in at least one row are connected to the same conductive trace in the same electrical connection layer.
  • FIG. 6 is another structural diagram of the conductive traces in the display module provided by the embodiments of the present disclosure.
  • the first electrodes 101 of all the light-emitting units 10 in two rows are connected to the same layer of electrical
  • the first conductive traces 21 in the connection layer can also connect the first electrodes 101 of part of the light-emitting units 10 in two rows to the second conductive traces 22 in the same electrical connection layer.
  • the first electrodes of part or all of the light-emitting units in multiple rows can be connected to the same conductive trace in the same electrical connection layer, and two or more light-emitting units can emit light as a sub-pixel, which is suitable for Application scenarios that require greater light intensity.
  • the second electrodes of part or all of the light-emitting units in at least one column are connected to the same conductive trace in the same electrical connection layer.
  • FIG. 7 is another structural diagram of conductive traces in a display module provided by an embodiment of the present disclosure, which connects the first electrodes 101 of all the light-emitting units 10 in two rows to the same layer of electricity.
  • the first conductive traces 21 in the connection layer can also connect the first electrodes 101 of part of the light-emitting units 10 in two rows to the second conductive traces 22 in the same electrical connection layer.
  • the second electrodes of some or all of the light-emitting units in multiple columns can be connected to the same conductive trace in the same electrical connection layer.
  • Two or more light-emitting units can emit light as a sub-pixel, which is suitable for Application scenarios that require greater light intensity.
  • FIG. 8 is another cross-sectional structure diagram of a display module provided by an embodiment of the present disclosure, and an isolation layer 5 is provided between adjacent light-emitting units 10.
  • the isolation layer 5 includes at least one of an insulating light reflecting material and an insulating light absorbing material, which can be Si3N4, SiO2, etc., or an insulating light reflecting or insulating light absorbing material, or an insulating material.
  • an insulating light reflecting material and an insulating light absorbing material which can be Si3N4, SiO2, etc.
  • an insulating light reflecting or insulating light absorbing material or an insulating material.
  • FIG. 9 is another cross-sectional structure diagram of a display module provided by an embodiment of the present disclosure.
  • the light emitting unit 10 includes a first semiconductor layer 103, an active layer 104, and a second semiconductor layer 105.
  • One side of the first semiconductor layer 103 serves as a light-emitting surface, and the other side is provided with an active layer 104 and a second semiconductor layer 105 in sequence;
  • the longitudinal projection of the second semiconductor layer 105 covers part of the first semiconductor layer 101 and does not exceed the edge of the first semiconductor layer 103;
  • the first electrode 101 is arranged on the part of the first semiconductor layer 103 that is not covered by the longitudinal projection of the second semiconductor layer;
  • the second electrode 102 is disposed on a side of the second semiconductor layer 105 away from the first semiconductor layer 103.
  • the first semiconductor layer 103 is an N-type semiconductor layer
  • the second semiconductor layer 105 is a P-type semiconductor layer.
  • the first electrode 101 may have a layer shape, a column shape, a thread shape, a truncated cone shape, or other shapes.
  • the second electrode 102 may have a layer shape, a column shape, a thread shape, a truncated cone shape, or other shapes.
  • the longitudinal projection of the second electrode 102 does not extend beyond the edge of the second semiconductor layer 105.
  • FIG. 10 shows the first electrode and the second electrode in the display module provided by an embodiment of the present disclosure.
  • 11 is another schematic diagram of the distribution of the first electrode and the second electrode in the display module provided by an embodiment of the present disclosure; the longitudinal projection of the second electrode 102 is the same as the longitudinal projection of the second semiconductor layer; refer to FIG. 12 13 and FIG. 12 is another schematic diagram of the distribution of the first electrode and the second electrode in the display module provided by the embodiment of the present disclosure, and FIG. 13 is the first electrode and the second electrode in the display module provided by the embodiment of the present disclosure In another schematic diagram of the distribution, the longitudinal projection of the second electrode 102 does not completely cover the second semiconductor layer.
  • the portion of the first semiconductor layer 103 that is not covered by the longitudinal projection of the second semiconductor layer 105 is located at the edge or inside of the first semiconductor layer 103.
  • the portion of the first semiconductor layer 103 that is not covered by the longitudinal projection of the second semiconductor layer 105 is located at the edge of the first semiconductor layer 103.
  • FIG. 14 is a schematic cross-sectional structure diagram of a light-emitting unit in a display module provided by an embodiment of the present disclosure
  • FIG. 15 is another light-emitting unit in a display module provided by an embodiment of the present disclosure.
  • the slope of the Mesa step is 40 degrees to 90 degrees.
  • FIG. 14 is a schematic cross-sectional structure diagram of the light-emitting unit in the display module provided by the embodiment of the present disclosure.
  • the Mesa step 6 may be a vertical structure.
  • FIG. 15 FIG. Another cross-sectional structural diagram of the unit, the Mesa step 6 can be a slope.
  • the Mesa step 6 may be 65 degrees.
  • the portion of the first semiconductor layer 103 that is not covered by the longitudinal projection of the second semiconductor layer 105 is located inside the first semiconductor layer 103, and the light emitting unit 10 further includes a hole 7. , The hole 7 penetrates the active layer 104 and the second semiconductor layer 105 from the first semiconductor layer 103.
  • FIG. 16 is a schematic diagram of another cross-sectional structure of a display module provided by an embodiment of the present disclosure.
  • the first electrode 101 may have a columnar structure, and the first electrode 107 of the columnar structure is provided ⁇ 7 ⁇ In the hole 7.
  • an insulating material is filled between the first electrode 101 of the columnar structure and the sidewall of the hole 7.
  • FIG. 17 is a schematic diagram of another cross-sectional structure of a display module provided by an embodiment of the present disclosure.
  • the first electrode 101 may be a layered structure, and the first electrode of the layered structure 101 is disposed in the hole 7.
  • the first conductive via 41 extends into the hole 7, and an insulating material is filled between the first conductive via 41 and the sidewall of the hole 7.
  • FIG. 18 is another cross-sectional structural diagram of the light-emitting unit in the display module provided by the embodiment of the present disclosure
  • FIG. 19 is the light-emitting unit in the display module provided by the embodiment of the present disclosure.
  • Another cross-sectional structural diagram of the hole 7 is perpendicular or inclined to the bottom surface.
  • FIG. 20 is another cross-sectional structure diagram of the light-emitting unit in the display module provided by the embodiment of the present disclosure.
  • the sidewall of the hole 7 is perpendicular to the bottom surface, and the first electrode 101 is close to the backlight surface.
  • the area can be larger than the area away from the backlight surface.
  • the cross section of the first electrode 101 along the light-emitting direction of the light-emitting unit 10 is trapezoidal, and the upper and bottom sides of the trapezoid are close to the light-emitting surface.
  • the light-emitting direction of the light-emitting unit 10 is as shown in FIG. 20 The arrow shows.
  • FIG. 21 is another cross-sectional structure diagram of the light-emitting unit in the display module provided by the embodiment of the present disclosure.
  • the sidewall and the bottom surface of the hole 7 are inclined, and the first electrode 101 is close to the backlight.
  • the area of the side surface may be larger than the area of the side away from the backlight surface.
  • the cross section of the first electrode 101 along the light emitting direction of the light emitting unit is a trapezoid, and the upper bottom of the trapezoid is close to the light emitting surface.
  • the light emitting direction of the light emitting unit 10 is shown in FIG. As shown by the arrow in.
  • FIG. 22 is another schematic cross-sectional structure diagram of a display module provided by an embodiment of the present disclosure, and the light-emitting surface is further provided with a light conversion layer 8.
  • the light conversion layer 8 at least includes a light conversion material and a dispersion medium of the light conversion material.
  • the light conversion layer 8 includes at least a light conversion material and a dispersion medium of the light conversion material, and may include a color filter structure.
  • the light conversion material can absorb the light emitted by the light-emitting unit and emit light of a different color from the absorbed light.
  • the light conversion material corresponding to each light emitting unit can emit monochromatic light.
  • the emitted light of the light conversion material corresponding to each light-emitting unit may also be multi-spectral multi-color light, or continuous spectrum covering the visible spectrum, and form monochromatic light after passing through the color filter.
  • the light emitted by the light conversion layer at the corresponding position of the multiple light-emitting units after passing through or without the color filter, forms a polygon containing the white balance point on the chromaticity diagram, or is in color with the light emitted by the light-emitting unit
  • the degree map jointly constitutes a polygon containing the white balance point.
  • the light-emitting unit includes at least one of a light-emitting diode, a mini LED, and a micro LED.
  • FIG. 23 is a schematic structural diagram of a display panel provided by an embodiment of the present disclosure.
  • a display panel 200 is provided, including the above-mentioned display module 100.
  • the display module and the display panel provided by the embodiments of the present disclosure realize the connection with the driving unit and realize the image display in a clever and flexible wiring manner, which can reduce the pins of the wiring of the driving unit to a certain extent, and is particularly suitable for size Smaller light-emitting unit.
  • the first element can be called the second element, and similarly, the second element can be called the first element, as long as all occurrences of the "first element” are renamed consistently and all occurrences "Second component” can be renamed consistently.
  • the first element and the second element are both elements, but they may not be the same element.
  • the terms used in this application are only used to describe the embodiments and are not used to limit the claims. As used in the description of the embodiments and claims, unless the context clearly indicates, the singular forms "a” (a), “an” (an) and “the” (the) are intended to also include plural forms .
  • the term “and/or” as used in this application refers to any and all possible combinations that include one or more of the associated lists.
  • the term “comprise” and its variants “comprises” and/or including (comprising) and the like refer to the stated features, wholes, steps, operations, elements, and/or The existence of components does not exclude the existence or addition of one or more other features, wholes, steps, operations, elements, components, and/or groups of these. If there are no more restrictions, the element defined by the sentence “including a" does not exclude the existence of other same elements in the process, method, or device that includes the element.
  • each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referred to each other.
  • the relevant parts can be referred to the description of the method parts.
  • the disclosed methods and products can be implemented in other ways.
  • the device embodiments described above are merely illustrative.
  • the division of units may only be a logical function division, and there may be other divisions in actual implementation, for example, multiple units or components may be combined or may be Integrate into another system, or some features can be ignored or not implemented.
  • the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may be in electrical, mechanical or other forms.
  • the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the units may be selected according to actual needs to implement this embodiment.
  • the functional units in the embodiments of the present disclosure may be integrated into one processing unit, or each unit may exist alone physically, or two or more units may be integrated into one unit.

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Abstract

一种显示模组（100）及显示面板（200），显示模组（100）包括：发光器件层（1）和至少两层电连接层（2），发光器件层（1）包括出光面和背光面，电连接层（2）设置于发光器件层（1）的背光面；发光器件层（1）包括多个呈阵列排布的发光单元（10），发光单元（10）包括至少两个电极，至少两个电极设置于发光器件层（1）的背光面；每层电连接层（2）包括至少一条导电走线，至少两个电极包括第一电极（101）和第二电极（102），第一电极（101）和第二电极（102）分别连接至不同的电连接层（2）；位于同一行的部分或者全部发光单元（10）的第一电极（101）连接至同一层电连接层（2）中的同一条导电走线；位于同一列的部分或者全部发光单元（10）的第二电极（102）连接至同一层电连接层（2）中的同一条导电走线；巧妙灵活的走线方式，实现与驱动单元连接，实现图像显示。

Description

显示模组及显示面板
本申请要求在2020年05月06日提交中国知识产权局、申请号为202010371393.2、发明名称为“显示模组及显示面板”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及光学技术领域，例如涉及一种显示模组及显示面板。
背景技术
目前，显示面板中的发光单元尺寸越来越小，例如Mini LED、micro LED(Micro Light Emitting Diode，微型发光二极管)等。
在实现本公开实施例的过程中，发现相关技术中至少存在如下问题：
每个发光单元的电极均需要连接到驱动单元，发光单元尺寸越小，相同面积下的发光单元数量越多，则连接到驱动单元的导电走线越多，导电走线的布局不够灵活。
发明内容
为了对披露的实施例的一些方面有基本的理解，下面给出了简单的概括。该概括不是泛泛评述，也不是要确定关键/重要组成元素或描绘这些实施例的保护范围，而是作为后面的详细说明的序言。
本公开实施例提供了一种显示模组及显示面板，以解决发光单元电极的导电走线布局不够灵活的技术问题。
在一些实施例中，提供一种显示模组，包括发光器件层和至少两层电连接层，发光器件层包括出光面和背光面，电连接层设置于发光器件层的背光面；
发光器件层包括多个呈阵列排布的发光单元，发光单元包括至少两个电极，至少两个电极设置于发光器件层的背光面；
每层电连接层包括至少一条导电走线，至少两个电极包括第一电极和第二电极，第一电极和第二电极分别连接至不同的电连接层；
位于同一行的部分或者全部发光单元的第一电极连接至同一层电连接层中的同一条导电走线；
位于同一列的部分或者全部发光单元的第二电极连接至同一层电连接层中的同一条 导电走线。
在一些实施例中，相邻的电连接层之间设置有绝缘层；
电连接层与发光器件层之间可以设置有绝缘层。
在一些实施例中，位于同一行的部分或者全部发光单元的第一电极可以通过第一导电结构连接至同一层电连接层中的同一条导电走线。
在一些实施例中，第一导电结构可以包括第一导电通孔和设置在第一导电通孔里的导电材料。
在一些实施例中，位于同一列的部分或者全部发光单元的第二电极可以通过第二导电结构连接至同一层电连接层中的同一条导电走线。
在一些实施例中，第二导电结构可以包括第二导电通孔和设置在第二导电通孔里的导电材料。
在一些实施例中，至少一行的部分或者全部发光单元的第一电极可以连接至同一层电连接层中的同一条导电走线。
在一些实施例中，至少一列的部分或者全部发光单元的第二电极可以连接至同一层电连接层中的同一条导电走线。
在一些实施例中，相邻的发光单元之间可以设置有隔离层。
在一些实施例中，隔离层至少包括绝缘光反射材料和绝缘光吸收材料中的一种。
在一些实施例中，发光单元可以包括第一半导体层、有源层和第二半导体层，第一半导体层的一面作为出光面，另一面依次可以设置有有源层和第二半导体层；
第二半导体层的纵向投影覆盖部分第一半导体层，且不超出所述第一半导体层的边缘；
第一电极可以设置于第一半导体层上未被第二半导体层的纵向投影覆盖的部分；
第二电极可以设置于第二半导体层背离第一半导体层的一面。
在一些实施例中，第二电极的纵向投影不超出第二半导体层的边缘。
在一些实施例中，第一半导体层未被第二半导体层的纵向投影覆盖的部分可以位于第一半导体层的边缘或者内部。
在一些实施例中，第一半导体层未被第二半导体层的纵向投影覆盖的部分可以位于第一半导体层的边缘。
在一些实施例中，第一半导体层、有源层和第二半导体层可以共同构成Mesa台阶。
在一些实施例中，Mesa台阶的坡度可以为40度至90度。
在一些实施例中，第一半导体层未被第二半导体层的纵向投影覆盖的部分可以位于第一半导体层的内部，发光单元可以还包括孔，孔从第一半导体层贯穿有源层和第二半导体 层。
在一些实施例中，第一电极可以设置于孔内。
在一些实施例中，第一电极与孔的侧壁之间可以填充有绝缘材料。
在一些实施例中，孔的侧壁与底面可以垂直或倾斜。
在一些实施例中，第一电极靠近背光面一面的面积可以大于远离背光面一面的面积。
在一些实施例中，第一电极沿发光单元的出光方向的截面为梯形，所述梯形的上底边靠近所述出光面。
在一些实施例中，出光面还可以设置有光转换层。
在一些实施例中，光转换层至少可以包括光转换材料以及光转换材料的分散介质。
在一些实施例中，提供一种显示面板，包括上述的显示模组。
本公开实施例提供的显示模组及显示面板，可以实现以下技术效果：
巧妙灵活的走线方式，实现与驱动单元连接，实现图像显示，在一定程度上能够减少驱动单元连接走线的管脚，特别适用于尺寸较小的发光单元。
以上的总体描述和下文中的描述仅是示例性和解释性的，不用于限制本申请。
附图说明
一个或多个实施例通过与之对应的附图进行示例性说明，这些示例性说明和附图并不构成对实施例的限定，附图中具有相同参考数字标号的元件示为类似的元件，附图不构成比例限制，并且其中：
图1是本公开实施例提供的显示模组的剖面结构示意图；
图2是本公开实施例提供的显示模组中发光单元的排列示意图；
图3是本公开实施例提供的显示模组的另一剖面结构示意图；
图4是本公开实施例提供的显示模组的另一剖面结构示意图；
图5是本公开实施例提供的显示模组中导电走线的结构示意图；
图6是本公开实施例提供的显示模组中导电走线的另一结构示意图；
图7是本公开实施例提供的显示模组中导电走线的另一结构示意图；
图8是本公开实施例提供的显示模组的另一剖面结构示意图；
图9是本公开实施例提供的显示模组的另一剖面结构示意图；
图10是本公开实施例提供的显示模组中第一电极和第二电极的分布示意图；
图11是本公开实施例提供的显示模组中第一电极和第二电极的另一分布示意图；
图12是本公开实施例提供的显示模组中第一电极和第二电极的另一分布示意图；
图13是本公开实施例提供的显示模组中第一电极和第二电极的另一分布示意图；
图14是本公开实施例提供的显示模组中发光单元的剖面结构示意图；
图15是本公开实施例提供的显示模组中发光单元的另一剖面结构示意图；
图16是本公开实施例提供的显示模组的另一剖面结构示意图；
图17是本公开实施例提供的显示模组的另一剖面结构示意图；
图18是本公开实施例提供的显示模组中发光单元的另一剖面结构示意图；
图19是本公开实施例提供的显示模组中发光单元的另一剖面结构示意图；
图20是本公开实施例提供的显示模组中发光单元的另一剖面结构示意图；
图21是本公开实施例提供的显示模组中发光单元的另一剖面结构示意图；
图22是本公开实施例提供的显示模组的另一剖面结构示意图；
图23是本公开实施例提供的显示面板的结构示意图。
附图标记：
1：发光器件层；10：发光单元；2：电连接层；3：绝缘层；41：第一导电通孔；42：第二导电通孔；5：隔离层；6：Mesa台阶；7：孔；
101：第一电极；102：第二电极；103：第一半导体层；104：有源层；105：第二半导体层；
100：显示模组；200：显示面板。
具体实施方式
为了能够更加详尽地了解本公开实施例的特点与技术内容，下面结合附图对本公开实施例的实现进行详细阐述，所附附图仅供参考说明之用，并非用来限定本公开实施例。在以下的技术描述中，为方便解释起见，通过多个细节以提供对所披露实施例的充分理解。然而，在没有这些细节的情况下，一个或多个实施例仍然可以实施。在其它情况下，为简化附图，熟知的结构和装置可以简化展示。
参考图1和图2，图1是本公开实施例提供的显示模组的剖面结构示意图，图2是本公开实施例提供的显示模组中发光单元的排列示意图，本公开实施例提供了一种显示模组100，包括发光器件层1和至少两层电连接层2，发光器件层1包括出光面和背光面，电连接层2设置于发光器件层1的背光面；
发光器件层1包括多个呈阵列排布的发光单元10，发光单元10包括至少两个电极，至少两个电极设置于发光器件层1的背光面；
每层电连接层2包括至少一条导电走线，至少两个电极包括第一电极101和第二电极 102，第一电极101和第二电极102分别连接至不同的电连接层；
位于同一行的部分或者全部发光单元10的第一电极101连接至同一层电连接层中的同一条导电走线；
位于同一列的部分或者全部发光单元10的第二电极102连接至同一层电连接层中的同一条导电走线。
本公开实施例中，电连接层2是通过金属沉积工艺形成在发光器件层2上，包括电镀、物理气相沉积(Physical Vapor Deposition，PVD)等方式，而不是以巨量转移的方式。其中发光单元是同一晶圆上的连续区域。
参考图3，图3是本公开实施例提供的显示模组一些实施例中的剖面结构示意图，在一些实施例中，包括三层电连接层，分别为第一电连接层、第二电连接层和第三电连接层，其中，位于同一行的一部分发光单元10的第一电极101连接至第一电连接层中的同一条第一导电走线21，该同一行的另外部分发光单元10的第一电极101连接至第三电连接层中的同一条第三条导电走线23，位于同一列的全部发光单元10的第二电极102连接至第二电连接层中的同一条第二导电走线22。
参考图4，图4是本公开实施例提供的显示模组一些实施例中的剖面结构示意图，在一些实施例中，包括三层电连接层，分别为第一电连接层、第二电连接层和第三电连接层，其中，位于同一行的全部发光单元10的第一电极101连接至第三电连接层中的同一条第三导电走线23，位于同一列的部分发光单元10的第二电极102连接至第一电连接层中的同一条第一导电走线21，该同一列的另外部分发光单元10的第二电极102连接至第二电连接层中的同一条导第二电走线22。
参考图1和图5，图5是本公开实施例提供的显示模组中导电走线一些实施例的结构示意图，在一些实施例中，包括两层电连接层2，分别为第一电连接层和第二电连接层，其中，位于同一行的全部发光单元10的第一电极101连接至第一电连接层中的同一条第一导电走线21；位于同一列的全部发光单元10的第二电极102连接至第二电连接层中的同一条第二导电走线22。
参考图1至图4，在一些实施例中，相邻的电连接层2之间设置有绝缘层3；
电连接层2与发光器件层1之间设置有绝缘层3。
在一些实施例中，位于同一行的部分或者全部发光单元的第一电极通过第一导电结构连接至同一层电连接层中的同一条导电走线。
在一些实施例中，参考图1至图4，第一导电结构包括第一导电通孔41和设置在第一导电通孔41里的导电材料，可选地，第一导电通孔41贯穿绝缘层3。
在一些实施例中，位于同一列的部分或者全部发光单元的第二电极通过第二导电结构连接至同一层电连接层中的同一条导电走线。
在一些实施例中，第二导电结构包括第二导电通孔和设置在第二导电通孔42里的导电材料。
第二导电通孔42贯穿绝缘层3。
在一些实施例中，至少一行的部分或者全部发光单元的第一电极连接至同一层电连接层中的同一条导电走线。
在一些实施例中，参考图6，图6是本公开实施例提供的显示模组中导电走线的另一结构示意图，将两行的全部发光单元10的第一电极101连接至同一层电连接层中的第一导电走线21，还可将两行的部分发光单元10的第一电极101连接至同一层电连接层中的第二导电走线22。
可根据实际需求，将多行的部分或者全部发光单元的第一电极连接至同一层电连接层中的同一条导电走线，两个或两个以上的发光单元作为一个子像素发光，适用于对光强要求较大的应用场景。
在一些实施例中，至少一列的部分或者全部发光单元的第二电极连接至同一层电连接层中的同一条导电走线。
在一些实施例中，参考图7，图7是本公开实施例提供的显示模组中导电走线的另一结构示意图，将两行的全部发光单元10的第一电极101连接至同一层电连接层中的第一导电走线21，还可将两行的部分发光单元10的第一电极101连接至同一层电连接层中的第二导电走线22。
可根据实际需求，将多列的部分或者全部发光单元的第二电极连接至同一层电连接层中的同一条导电走线，两个或两个以上的发光单元作为一个子像素发光，适用于对光强要求较大的应用场景。
在一些实施例中，参考图8，图8是本公开实施例提供的显示模组的另一剖面结构示意图，相邻的发光单元10之间设置有隔离层5。
在一些实施例中，隔离层5至少包括绝缘光反射材料和绝缘光吸收材料中的一种，可以是Si3N4、SiO2等，也可以是一种绝缘光反射或绝缘光吸收材料，也可以是绝缘材料与反射材料、绝缘材料与吸收材料的组合结构。间隔层的引入，避免了发光单元之间显示图像信号串扰的问题。
在一些实施例中，参考图9，图9是本公开实施例提供的显示模组的另一剖面结构示意图，发光单元10包括第一半导体层103、有源层104和第二半导体层105，第一半导体 层103的一面作为出光面，另一面依次设置有有源层104和第二半导体层105；
第二半导体层105的纵向投影覆盖部分第一半导体层101，且不超出第一半导体层103的边缘；
第一电极101设置于第一半导体层103上未被第二半导体层的纵向投影覆盖的部分；
第二电极102设置于第二半导体层105背离第一半导体层103的一面。
在一些实施例中，第一半导体层103为N型半导体层，第二半导体层105为P型半导体层。
在一些实施例中，第一电极101可以为层状、柱状、螺纹状、圆台状或者其他形状。第二电极102可以为层状、柱状、螺纹状、圆台状或者其他形状。
在一些实施例中，第二电极102的纵向投影不超出第二半导体层105的边缘，参考图10和图11，图10是本公开实施例提供的显示模组中第一电极和第二电极的分布示意图，图11是本公开实施例提供的显示模组中第一电极和第二电极的另一分布示意图；第二电极102的纵向投影和第二半导体层的纵向投影相同；参考图12和图13，图12是本公开实施例提供的显示模组中第一电极和第二电极的另一分布示意图，图13是本公开实施例提供的显示模组中第一电极和第二电极的另一分布示意图，第二电极102的纵向投影未完全覆盖第二半导体层。
在一些实施例中，第一半导体层103未被第二半导体层105的纵向投影覆盖的部分位于第一半导体层103的边缘或者内部。
在一些实施例中，参考图9、图10和图12，第一半导体层103未被第二半导体层105的纵向投影覆盖的部分位于第一半导体层103的边缘。
在一些实施例中，参考图14和图15，图14是本公开实施例提供的显示模组中发光单元的剖面结构示意图，图15是本公开实施例提供的显示模组中发光单元的另一剖面结构示意图，第一半导体层103、有源层104和第二半导体层105共同构成Mesa台阶6。
在一些实施例中，Mesa台阶的坡度为40度至90度。
参考图14，图14是本公开实施例提供的显示模组中发光单元的剖面结构示意图，Mesa台阶6可以为垂直结构，参考图15，图15是本公开实施例提供的显示模组中发光单元的另一剖面结构示意图，Mesa台阶6可以为斜坡。
在一些实施例中，Mesa台阶6可以为65度。
在一些实施例中，参考图11、图13和图16，第一半导体层103未被第二半导体层105的纵向投影覆盖的部分位于第一半导体层103的内部，发光单元10还包括孔7，孔7从第一半导体层103贯穿有源层104和第二半导体层105。
在一些实施例中，参考图16，图16是本公开实施例提供的显示模组的另一剖面结构示意图，可选地，第一电极101可以为柱状结构，柱状结构的第一电极107设置于孔7内。
在一些实施例中，柱状结构的第一电极101与孔7的侧壁之间填充有绝缘材料。
在一些实施例中，参考图17，图17是本公开实施例提供的显示模组的另一剖面结构示意图，可选地，第一电极101可以为层状结构，层状结构的第一电极101设置于孔7内，第一电极101为层状结构时，第一导电通孔41延伸至孔7内，且第一导电通孔41和孔7的侧壁之间填充有绝缘材料。
在一些实施例中，参考图18和图19，图18是本公开实施例提供的显示模组中发光单元的另一剖面结构示意图，图19是本公开实施例提供的显示模组中发光单元的另一剖面结构示意图，孔7的侧壁与底面垂直或倾斜。
在一些实施例中，参考图20，图20是本公开实施例提供的显示模组中发光单元的另一剖面结构示意图，孔7的侧壁与底面垂直，第一电极101靠近背光面一面的面积可以大于远离背光面一面的面积，可选地，第一电极101沿发光单元10的出光方向的截面为梯形，梯形的上底边靠近出光面，发光单元10的出光方向如图20中的箭头所示。
在一些实施例中，参考图21，图21是本公开实施例提供的显示模组中发光单元的另一剖面结构示意图，孔7的侧壁与底面之间呈倾斜，第一电极101靠近背光面一面的面积可以大于远离背光面一面的面积，可选地，第一电极101沿发光单元的出光方向的截面为梯形，梯形的上底边靠近出光面，发光单元10的出光方向如图21中的箭头所示。
在一些实施例中，参考图22，图22是本公开实施例提供的显示模组的另一剖面结构示意图，出光面还设置有光转换层8。
在一些实施例中，光转换层8至少包括光转换材料以及光转换材料的分散介质。
光转换层8中至少包含光转换材料，以及光转换材料的分散介质，可以包含滤色片结构。光转换材料可以吸收发光单元发出的光，并发出与吸收光颜色不同的光。与每个发光单元对应的光转换材料可以发射单色光。与每个发光单元对应的光转换材料的发射光也可以是多光谱段的多色光，或是覆盖可见光谱段的连续光谱，经滤色片后形成单色光。无论哪种，多个发光单元对应位置的光转换层发出的光，经过或不经过滤色片后，在色度图上构成包含白平衡点的多边形，或是与发光单元发射的光在色度图上共同构成包含白平衡点的多边形。
本公开实施例中提供的显示模组中，发光单元包括发光二极管、mini LED、micro LED中的至少一种。
参考图23，图23是本公开实施例提供的显示面板的结构示意图，在一些实施例中， 提供一种显示面板200，包括上述的显示模组100。
本公开实施例提供的显示模组及显示面板，以巧妙灵活的走线方式，实现与驱动单元连接，实现图像显示，在一定程度上能够减少驱动单元连接走线的管脚，特别适用于尺寸较小的发光单元。
以上描述和附图充分地示出了本公开的实施例，以使本领域技术人员能够实践它们。其他实施例可以包括结构的、逻辑的、电气的、过程的以及其他的改变。实施例仅代表可能的变化。除非明确要求，否则单独的部件和功能是可选的，并且操作的顺序可以变化。一些实施例的部分和特征可以被包括在或替换其他实施例的部分和特征。本公开实施例的范围包括权利要求书的整个范围，以及权利要求书的所有可获得的等同物。当用于本申请中时，虽然术语“第一”、“第二”等可能会在本申请中使用以描述各元件，但这些元件不应受到这些术语的限制。这些术语仅用于将一个元件与另一个元件区别开。比如，在不改变描述的含义的情况下，第一元件可以叫做第二元件，并且同样地，第二元件可以叫做第一元件，只要所有出现的“第一元件”一致重命名并且所有出现的“第二元件”一致重命名即可。第一元件和第二元件都是元件，但可以不是相同的元件。而且，本申请中使用的用词仅用于描述实施例并且不用于限制权利要求。如在实施例以及权利要求的描述中使用的，除非上下文清楚地表明，否则单数形式的“一个”(a)、“一个”(an)和“所述”(the)旨在同样包括复数形式。类似地，如在本申请中所使用的术语“和/或”是指包含一个或一个以上相关联的列出的任何以及所有可能的组合。另外，当用于本申请中时，术语“包括”(comprise)及其变型“包括”(comprises)和/或包括(comprising)等指陈述的特征、整体、步骤、操作、元素，和/或组件的存在，但不排除一个或一个以上其它特征、整体、步骤、操作、元素、组件和/或这些的分组的存在或添加。在没有更多限制的情况下，由语句“包括一个…”限定的要素，并不排除在包括该要素的过程、方法或者设备中还存在另外的相同要素。本文中，每个实施例重点说明的可以是与其他实施例的不同之处，各个实施例之间相同相似部分可以互相参见。对于实施例公开的方法、产品等而言，如果其与实施例公开的方法部分相对应，那么相关之处可以参见方法部分的描述。
本领域技术人员可以意识到，结合本文中所公开的实施例描述的各示例的单元及算法步骤，能够以电子硬件、或者计算机软件和电子硬件的结合来实现。这些功能究竟以硬件还是软件方式来执行，可以取决于技术方案的特定应用和设计约束条件。本领域技术人员可以对每个特定的应用来使用不同方法以实现所描述的功能，但是这种实现不应认为超出本公开实施例的范围。本领域技术人员可以清楚地了解到，为描述的方便和简洁，上述描述的系统、装置和单元的工作过程，可以参考前述方法实施例中的对应过程，在此不再赘 述。
本文所披露的实施例中，所揭露的方法、产品(包括但不限于装置、设备等)，可以通过其它的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，单元的划分，可以仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个系统，或一些特征可以忽略，或不执行。另外，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口，装置或单元的间接耦合或通信连接，可以是电性，机械或其它的形式。作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例。另外，在本公开实施例中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以两个或两个以上单元集成在一个单元中。

Claims (25)

  1. 一种显示模组，包括发光器件层和至少两层电连接层，所述发光器件层包括出光面和背光面，所述电连接层设置于所述发光器件层的背光面；
    所述发光器件层包括多个呈阵列排布的发光单元，所述发光单元包括至少两个电极，所述至少两个电极设置于所述发光器件层的背光面；
    每层电连接层包括至少一条导电走线，所述至少两个电极包括第一电极和第二电极，所述第一电极和第二电极分别连接至不同的电连接层；
    位于同一行的部分或者全部发光单元的第一电极连接至同一层电连接层中的同一条导电走线；
    位于同一列的部分或者全部发光单元的第二电极连接至同一层电连接层中的同一条导电走线。
  2. 根据权利要求1所述的显示模组，其中，相邻的电连接层之间设置有绝缘层；
    所述电连接层与发光器件层之间设置有绝缘层。
  3. 根据权利要求2所述的显示模组，其中，位于同一行的部分或者全部发光单元的第一电极通过第一导电结构连接至同一层电连接层中的同一条导电走线。
  4. 根据权利要求3所述的显示模组，其中，所述第一导电结构包括第一导电通孔和设置在所述第一导电通孔里的导电材料。
  5. 根据权利要求2所述的显示模组，其中，位于同一列的部分或者全部发光单元的第二电极通过第二导电结构连接至同一层电连接层中的同一条导电走线。
  6. 根据权利要求5所述的显示模组，其中，所述第二导电结构包括第二导电通孔和设置在所述第二导电通孔里的导电材料。
  7. 根据权利要求1所述的显示模组，其中，至少一行的部分或者全部发光单元的第一电极连接至同一层电连接层中的同一条导电走线。
  8. 根据权利要求1所述的显示模组，其中，至少一列的部分或者全部发光单元的第二电极连接至同一层电连接层中的同一条导电走线。
  9. 根据权利要求1所述的显示模组，其中，相邻的所述发光单元之间设置有隔离层。
  10. 根据权利要求9所述的显示模组，其中，所述隔离层至少包括绝缘光反射材料和绝缘光吸收材料中的一种。
  11. 根据权利要求1所述的显示模组，其中，所述发光单元包括第一半导体层、有源层和第二半导体层，所述第一半导体层的一面作为出光面，另一面依次设置有所述有源层和所述第二半导体层；
    所述第二半导体层的纵向投影覆盖部分所述第一半导体层，且不超出所述第一半导体层的边缘；
    所述第一电极设置于所述第一半导体层上未被所述第二半导体层的纵向投影覆盖的部分；
    所述第二电极设置于所述第二半导体层背离所述第一半导体层的一面。
  12. 根据权利要求11所述的显示模组，其中，所述第二电极的纵向投影不超出所述第二半导体层的边缘。
  13. 根据权利要求11所述的显示模组，其中，所述第一半导体层未被所述第二半导体层的纵向投影覆盖的部分位于所述第一半导体层的边缘或者内部。
  14. 根据权利要求13所述的显示模组，其中，所述第一半导体层未被所述第二半导体层的纵向投影覆盖的部分位于所述第一半导体层的边缘。
  15. 根据权利要求14所述的显示模组，其中，所述第一半导体层、有源层和所述第二半导体层共同构成Mesa台阶。
  16. 根据权利要求15所述的显示模组，其中，所述Mesa台阶的坡度为40度至90度。
  17. 根据权利要求13所述的显示模组，其中，所述第一半导体层未被所述第二半导体层的纵向投影覆盖的部分位于所述第一半导体层的内部，所述发光单元还包括孔，所述孔从所述第一半导体层贯穿所述有源层和所述第二半导体层。
  18. 根据权利要求17所述的显示模组，其中，所述第一电极设置于所述孔内。
  19. 根据权利要求18所述的显示模组，其中，所述第一电极与所述孔的侧壁之间填充有绝缘材料。
  20. 根据权利要求17所述的显示模组，其中，所述孔的侧壁与底面垂直或倾斜。
  21. 根据权利要求20所述的显示模组，其中，所述第一电极靠近背光面一面的面积大于远离背光面一面的面积。
  22. 根据权利要求21所述的显示模组，其中，所述第一电极沿发光单元的出光方向的截面为梯形，所述梯形的上底边靠近所述出光面。
  23. 根据权利要求1至22任一项所述的显示模组，其中，所述出光面还设置有光转换层。
  24. 根据权利要求23所述的显示模组，其中，所述光转换层至少包括光转换材料以及光转换材料的分散介质。
  25. 一种显示面板，包括如权利要求1至24任一项所述的显示模组。
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103490000A (zh) * 2012-06-13 2014-01-01 三星电子株式会社 半导体发光元件和发光装置
CN103594584A (zh) * 2012-08-14 2014-02-19 三星电子株式会社 半导体发光器件及其制造方法、和发光设备
US20190304346A1 (en) * 2016-09-22 2019-10-03 Lg Electronics Inc. Display apparatus using semiconductor light emitting device and manufacturing method therefor
CN110649059A (zh) * 2019-09-30 2020-01-03 京东方科技集团股份有限公司 背光源的显示方法及装置
CN212230428U (zh) * 2020-05-06 2020-12-25 北京芯海视界三维科技有限公司 显示模组及显示面板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017157724A (ja) * 2016-03-02 2017-09-07 デクセリアルズ株式会社 表示装置及びその製造方法、並びに発光装置及びその製造方法
KR102419272B1 (ko) * 2017-12-19 2022-07-11 엘지디스플레이 주식회사 발광 사운드 소자, 사운드 출력 장치 및 디스플레이 장치
US10756073B2 (en) * 2018-02-13 2020-08-25 Lumens Co., Ltd. Micro LED module with flexible multilayer circuit substrate
CN109545162A (zh) * 2018-12-29 2019-03-29 上海中航光电子有限公司 阵列基板及其驱动方法、显示面板和显示装置
CN109904295B (zh) * 2019-03-21 2020-06-09 京东方科技集团股份有限公司 一种led器件及其制作方法、显示面板
CN109887950A (zh) * 2019-04-19 2019-06-14 京东方科技集团股份有限公司 显示基板、led器件、显示面板、显示装置及制作方法
CN110707191B (zh) * 2019-10-22 2021-11-16 錼创显示科技股份有限公司 微型发光二极管晶粒及微型发光二极管晶圆

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103490000A (zh) * 2012-06-13 2014-01-01 三星电子株式会社 半导体发光元件和发光装置
CN103594584A (zh) * 2012-08-14 2014-02-19 三星电子株式会社 半导体发光器件及其制造方法、和发光设备
US20190304346A1 (en) * 2016-09-22 2019-10-03 Lg Electronics Inc. Display apparatus using semiconductor light emitting device and manufacturing method therefor
CN110649059A (zh) * 2019-09-30 2020-01-03 京东方科技集团股份有限公司 背光源的显示方法及装置
CN212230428U (zh) * 2020-05-06 2020-12-25 北京芯海视界三维科技有限公司 显示模组及显示面板

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