WO2021220376A1 - 多層基板、プローブユニット、及び超音波内視鏡 - Google Patents

多層基板、プローブユニット、及び超音波内視鏡 Download PDF

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Publication number
WO2021220376A1
WO2021220376A1 PCT/JP2020/018047 JP2020018047W WO2021220376A1 WO 2021220376 A1 WO2021220376 A1 WO 2021220376A1 JP 2020018047 W JP2020018047 W JP 2020018047W WO 2021220376 A1 WO2021220376 A1 WO 2021220376A1
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WIPO (PCT)
Prior art keywords
surface side
side layer
signal line
layer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/JP2020/018047
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English (en)
French (fr)
Japanese (ja)
Inventor
智之 畠山
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Olympus Corp
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Olympus Corp
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Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Priority to CN202080100227.7A priority Critical patent/CN115460991B/zh
Priority to JP2022518466A priority patent/JP7271790B2/ja
Priority to PCT/JP2020/018047 priority patent/WO2021220376A1/ja
Publication of WO2021220376A1 publication Critical patent/WO2021220376A1/ja
Priority to US17/969,943 priority patent/US12569883B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/12—Diagnosis using ultrasonic, sonic or infrasonic waves in body cavities or body tracts, e.g. by using catheters
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/56—Details of data transmission or power supply
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0207—Driving circuits
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
    • B06B2201/20—Application to multi-element transducer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
    • B06B2201/50—Application to a particular transducer type
    • B06B2201/55—Piezoelectric transducer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
    • B06B2201/70—Specific application
    • B06B2201/76—Medical, dental

Definitions

  • the present invention relates to a multilayer substrate, a probe unit, and an ultrasonic endoscope.
  • An ultrasonic endoscope for medical use is provided with an ultrasonic vibrator at the tip of an insertion portion inserted into a subject such as a patient, and acquires an in-vivo image of the subject by ultrasonic waves.
  • the tip of the insertion portion is reduced in diameter by connecting the flexible substrate connected to the ultrasonic vibrator by shifting the cable in the length direction.
  • the length of the tip rigid portion (hereinafter, referred to as the tip rigid length) including the connection portion between the flexible substrate and the cable could not be shortened.
  • the present invention has been made in view of the above, and an object of the present invention is to provide a multilayer substrate, a probe unit, and an ultrasonic endoscope having a short tip rigid length.
  • the multilayer substrate according to one aspect of the present invention has a front side layer, an intermediate layer, and a back surface side layer which are laminated along the stacking direction.
  • a multilayer substrate in which an ultrasonic transducer is electrically connected to one end side in the longitudinal direction in a direction orthogonal to the stacking direction, and ground wires of a plurality of shielded wires connected to the multilayer substrate are connected.
  • a plurality of signal lines which are ground terminals, and on the other end side in the longitudinal direction, a ground terminal forming a part of the front surface side layer and the back surface side layer and the signal lines of the plurality of shielded wires are connected to each other.
  • a plurality of signal line connection terminal rows having connection terminals, forming a part of the front surface side layer and the back surface side layer in the vicinity of the ground terminal in the longitudinal direction, and arranged along the longitudinal direction. And a wiring having thermal conductivity and extending to the other end of the intermediate layer.
  • the wiring differs from the wiring provided in the front surface side layer and the back surface side layer in the wiring pattern along the stacking direction.
  • the multilayer substrate according to one aspect of the present invention has thermal conductivity, and has a thermal conductive portion provided between the front surface side layer and the back surface side layer and the intermediate layer.
  • both ends of the ground terminal and the signal line connection terminal row are 0 from the end portion of the multilayer board. It is located in a region of .005 mm or more and 0.2 mm or less.
  • the multilayer substrate according to one aspect of the present invention is located near the end portion in the longitudinal direction, and electrically connects the ground terminal of the front surface side layer and the ground terminal of the back surface side layer. Equipped with vias.
  • the via is provided at a position where the via overlaps the ground terminal along the stacking direction.
  • the multilayer substrate according to one aspect of the present invention has a plurality of element connection terminals to which each of the plurality of piezoelectric elements of the ultrasonic vibrator is connected, and is provided on one end side in the longitudinal direction. It includes a plurality of element connection terminal rows arranged along the longitudinal direction.
  • the width of the signal line connection terminal is larger than the width of the element connection terminal in the arrangement direction of the signal line connection terminal.
  • the width of the signal line connection terminal row is larger than the width of the element connection terminal row in the arrangement direction of the signal line connection terminals.
  • the width between the signal line connection terminals and the width between the element connection terminals are larger than the width of the wiring provided on the front surface side layer and the back surface side layer. Is also small.
  • the element connection terminal row forms a part of the front surface side layer or the back surface side layer.
  • the probe unit has a plurality of shielded wires, a front surface side layer, an intermediate layer, and a back surface side layer laminated along the stacking direction, and is in a direction orthogonal to the stacking direction.
  • a probe unit including a multilayer substrate to which an ultrasonic transducer is electrically connected to one end side in the longitudinal direction, wherein the multilayer substrate is a ground of a plurality of shielded wires connected to the multilayer substrate.
  • a ground terminal to which wires are connected, and a ground terminal forming a part of the front surface side layer and the back surface side layer and signal lines of the plurality of shielded wires are connected to each other on the other end side in the longitudinal direction.
  • a plurality of signal line connection terminals which form a part of the front surface side layer and the back surface side layer in the vicinity of the ground terminal in the longitudinal direction, and are arranged along the longitudinal direction. It has a signal line connection terminal row and a wiring that has thermal conductivity and extends to the other end of the intermediate layer.
  • the ultrasonic endoscope includes an ultrasonic vibrator that transmits and receives ultrasonic waves, a plurality of shielded wires, a surface side layer, an intermediate layer, and a layer that are laminated along the stacking direction.
  • An ultrasonic endoscope having a back surface side layer and a multilayer substrate to which the ultrasonic vibrator is electrically connected to one end side in the longitudinal direction in a direction orthogonal to the stacking direction.
  • the multilayer substrate is a ground terminal to which ground wires of a plurality of shielded wires connected to the multilayer substrate are connected, and is a part of the front surface side layer and the back surface side layer on the other end side in the longitudinal direction.
  • It has a ground terminal forming a ground terminal and a plurality of signal line connection terminals to which the signal lines of the plurality of shielded wires are connected, and in the vicinity of the ground terminal in the longitudinal direction, the front surface side layer and the back surface side layer It has a plurality of signal line connection terminal rows which are partially formed and arranged along the longitudinal direction, and a wiring which has thermal conductivity and extends to the other end in the intermediate layer. ..
  • the present invention it is possible to realize a multilayer substrate, a probe unit, and an ultrasonic endoscope having a short tip rigid length.
  • FIG. 1 is a diagram schematically showing an entire endoscope system including a multilayer substrate according to a first embodiment.
  • FIG. 2 is a perspective view schematically showing the tip configuration of the insertion portion of the ultrasonic endoscope shown in FIG.
  • FIG. 3 is an exploded perspective view schematically showing the tip configuration of the insertion portion of the ultrasonic endoscope shown in FIG.
  • FIG. 4 is a diagram showing a state in which a cable group is connected to a flexible substrate.
  • FIG. 5 is a perspective view of the flexible substrate.
  • FIG. 6 is an enlarged view of the substrate.
  • FIG. 7 is an enlarged view of the substrate.
  • FIG. 8 is an enlarged view of the substrate.
  • FIG. 9 is an enlarged view of the substrate.
  • FIG. 10 is a partial projection drawing of the flexible substrate.
  • FIG. 11 is a partial projection drawing of the flexible substrate.
  • FIG. 12 is a partial projection drawing of the flexible substrate.
  • FIG. 13 is an enlarged view of a connection portion between the cable group and the flexible substrate.
  • FIG. 14 is an enlarged view of a connection portion between the cable group and the flexible substrate.
  • FIG. 15 is a notched view showing the internal configuration of the tip portion of the ultrasonic endoscope.
  • FIG. 16 is a diagram showing a state of wiring of the first substrate and the second substrate.
  • FIG. 17 is a partially enlarged view of the first substrate.
  • FIG. 18 is a partially enlarged view of the first substrate.
  • FIG. 19 is a partial cross-sectional view of the multilayer substrate according to the second embodiment.
  • FIG. 20 is a side view of the tip of the ultrasonic endoscope.
  • FIG. 21 is a notched view showing the internal configuration of the tip portion of the ultrasonic endoscope.
  • FIG. 22 is a cross-sectional view of the multilayer substrate according to the fourth embodiment.
  • FIG. 23 is a notched view showing the internal configuration of the tip portion of the ultrasonic endoscope.
  • FIG. 1 is a diagram schematically showing an entire endoscope system including a multilayer substrate according to a first embodiment.
  • the endoscopic system 1 is a system for performing ultrasonic diagnosis in a subject such as a person using an ultrasonic endoscope.
  • the endoscope system 1 includes an ultrasonic endoscope 2, an ultrasonic observation device 3, an endoscope observation device 4, a display device 5, and a light source device 6. ..
  • the ultrasonic endoscope 2 converts an electrical pulse signal received from the ultrasonic observation device 3 into an ultrasonic pulse (acoustic pulse) and irradiates the subject with the tip thereof, and is reflected by the subject.
  • the ultrasonic echo is converted into an electrical echo signal expressed by a voltage change and output.
  • the ultrasonic endoscope 2 usually has an imaging optical system and an imaging element, and is inserted into the digestive tract (esophagus, stomach, duodenum, large intestine) or respiratory organ (trachea, bronchus) of a subject for digestion. It is possible to image the tube and respiratory organs. In addition, the surrounding organs (pancreas, gallbladder, bile duct, biliary tract, lymph nodes, mediastinal organs, blood vessels, etc.) can be imaged using ultrasound. Further, the ultrasonic endoscope 2 has a light guide that guides the illumination light to be applied to the subject at the time of optical imaging. The tip of the light guide reaches the tip of the insertion portion of the ultrasonic endoscope 2 into the subject, while the proximal end is connected to the light source device 6 that generates illumination light.
  • the ultrasonic endoscope 2 has a light guide that guides the illumination light to be applied to the subject at the time of optical imaging. The tip of the light guide
  • the ultrasonic endoscope 2 includes an insertion unit 21, an operation unit 22, a universal cord 23, and a connector 24.
  • the insertion portion 21 is a portion to be inserted into the subject.
  • the insertion portion 21 is provided on the tip end side and is connected to a rigid tip rigid portion 211 that holds an ultrasonic vibrator 7 for transmitting and receiving ultrasonic waves and a proximal end side of the tip rigid portion 211. It is provided with a curved portion 212 that can be curved and curved, and a flexible pipe portion 213 that is connected to the base end side of the curved portion 212 and has flexibility.
  • a light guide for transmitting the illumination light supplied from the light source device 6 and a plurality of signal cables for transmitting various signals are routed inside the insertion portion 21.
  • an insertion passage for the treatment tool for inserting the treatment tool is formed.
  • the ultrasonic vibrator 7 side of the insertion portion 21 is the tip end side
  • the side connected to the operation portion 22 is the base end side.
  • FIG. 2 is a perspective view schematically showing the tip configuration of the insertion portion of the ultrasonic endoscope according to the present embodiment.
  • FIG. 3 is an exploded perspective view schematically showing the tip configuration of the insertion portion of the ultrasonic endoscope according to the present embodiment.
  • the ultrasonic vibrator 7 is, for example, a convex vibrator, but may be a radial vibrator or a linear vibrator.
  • the ultrasonic endoscope 2 is provided with, for example, 128 piezoelectric elements as an ultrasonic vibrator 7 in an array, and electronically switches the piezoelectric elements involved in transmission and reception, and delays the transmission and reception of each piezoelectric element. By applying it, it is scanned electronically.
  • the number of piezoelectric elements is not particularly limited.
  • the hard tip portion 211 provides an ultrasonic function unit 211A provided with an ultrasonic transducer 7, an observation window 215a that injects light into an imaging optical system including an objective lens that takes in light from the outside, and illumination light. It includes an endoscope function unit 211B including a second housing 215 having an illumination window 215b which is a part of an illumination optical system that collects light and emits light to the outside.
  • the second housing 215 is formed with a treatment tool protrusion 215c that communicates with the treatment tool insertion passage formed in the insertion portion 21 and projects the treatment tool from the tip of the insertion portion 21.
  • the endoscope function unit 211B is detachably connected to the ultrasonic function unit 211A at one end and connected to the curved portion 212 at the other end.
  • the ultrasonic function unit 211A is formed by using a single resin having an insulating property, and is detachably connected to the endoscope function unit 211B as described above.
  • the ultrasonic function unit 211A includes an ultrasonic vibrator 7 and a first housing 214 that holds the ultrasonic vibrator 7.
  • the first housing 214 has a main body portion 214a that holds the ultrasonic vibrator 7, and a connecting portion 214b that protrudes from the main body portion 214a and connects to the endoscope function portion 211B.
  • the length of the first housing 214 along the longitudinal direction is referred to as the tip rigid length L1.
  • the second housing 215 of the endoscope function unit 211B is provided at the end on the side opposite to the side connected to the curved portion 212, and is a hole for connecting to the first housing 214. It has a part 215d.
  • the ultrasonic function unit 211A and the endoscope function unit 211B are connected by fitting the connection portion 214b into the hole portion 215d. At this time, both may be fixed by a known method such as adhesive or screwing.
  • the operation unit 22 is connected to the base end side of the insertion unit 21 and is a part that receives various operations from a doctor or the like. As shown in FIG. 1, the operation unit 22 includes a bending knob 221 for performing a bending operation on the bending portion 212, and a plurality of operating members 222 for performing various operations. Further, the operation unit 22 is formed with a treatment tool insertion port 223 that communicates with the treatment tool insertion passage and inserts the treatment tool into the treatment tool insertion passage.
  • the universal cord 23 is a cable that extends from the operation unit 22 and is provided with a plurality of signal cables for transmitting various signals, an optical fiber for transmitting illumination light supplied from the light source device 6, and the like.
  • the connector 24 is provided at the tip of the universal cord 23.
  • the connector 24 includes first to third connector portions 241 to 243 to which the ultrasonic cable 31, the video cable 41, and the optical fiber cable 61 are connected, respectively.
  • the ultrasonic observation device 3 is electrically connected to the ultrasonic endoscope 2 via an ultrasonic cable 31 (see FIG. 1), and outputs a pulse signal to the ultrasonic endoscope 2 via the ultrasonic cable 31. At the same time, an echo signal is input from the ultrasonic endoscope 2. Then, the ultrasonic observation device 3 performs a predetermined process on the echo signal to generate an ultrasonic image.
  • the endoscope observation device 4 is electrically connected to the ultrasonic endoscope 2 via a video cable 41 (see FIG. 1), and an image signal from the ultrasonic endoscope 2 is input via the video cable 41. do. Then, the endoscope observation device 4 performs a predetermined process on the image signal to generate an endoscopic image.
  • the display device 5 is configured by using a liquid crystal display or an organic EL (Electroluminescence), a projector, a CRT (Cathode Ray Tube), or the like, and an ultrasonic image generated by the ultrasonic observation device 3 or an endoscopic observation device 4 Display the endoscopic image etc. generated in.
  • a liquid crystal display or an organic EL (Electroluminescence), a projector, a CRT (Cathode Ray Tube), or the like and an ultrasonic image generated by the ultrasonic observation device 3 or an endoscopic observation device 4 Display the endoscopic image etc. generated in.
  • the light source device 6 is connected to the ultrasonic endoscope 2 via the optical fiber cable 61 (see FIG. 1), and the illumination light that illuminates the inside of the subject via the optical fiber cable 61 is transmitted to the ultrasonic endoscope 2. Supply.
  • FIG. 4 is a diagram showing a state in which a cable group is connected to a flexible substrate.
  • the cable group 8 is divided into, for example, four shielded wires 81 to 84.
  • the number of shielded wires is not particularly limited.
  • the 32 signal lines 81b to 84b, which are inserted inside the ground wires 81a to 84a and the ground wires 81a to 84a, are connected to the substrates 91 to 94, respectively.
  • the total number of signal lines 81b to 84b (128 lines) is the same as the total number of piezoelectric elements (128 lines) of the ultrasonic vibrator 7, and one signal line included in the plurality of signal lines 81b to 84b is They are connected to one piezoelectric element of the ultrasonic vibrator 7 via the substrates 91 to 94, respectively.
  • the total number of signal lines 81b to 84b is not particularly limited, and may be the same as the number of piezoelectric elements.
  • FIG. 5 is a perspective view of the piezoelectric element of the ultrasonic vibrator 7 and the flexible substrate electrically connected to the plurality of signal lines 81b to 84b.
  • the flexible substrate 9 is a flexible multilayer substrate laminated along the stacking direction, and is composed of substrates 91 to 94. That is, the flexible substrate 9 shown in FIG. 5 is formed by laminating the substrates 91 to 94 shown in FIG. 4. However, the multilayer board does not have to have flexibility.
  • the shielded wires 81 to 84 of the cable group 8 are connected to one end (the left side in the longitudinal direction of the flexible substrate 9 in FIG.
  • the substrate 91 side will be the front surface side
  • the substrate 94 side will be the back surface side. That is, the front surface side layer is the substrate 91, the intermediate layer is the substrate 92 and the substrate 93, and the back surface side layer is the substrate 94.
  • FIG. 6 to 9 are enlarged views of the substrate.
  • FIG. 6 is a substrate 91
  • FIG. 7 is a substrate 92
  • FIG. 8 is a substrate 93
  • FIG. 9 is a substrate 94.
  • the number of each terminal and wiring will be illustrated, but the number thereof is not particularly limited and can be changed according to the number of ultrasonic vibrators 7.
  • the substrate 91 has a ground terminal 911G, 32 signal line connection terminals 912T and 913T (signal line connection terminal rows), and 32 element connection terminals 914T to 917T (element connection), respectively.
  • the terminal row) and the ground terminal 918G are formed.
  • the ground terminal 911G is provided at one end (left side in FIG. 6) in the longitudinal direction orthogonal to the stacking direction (direction orthogonal to the paper surface in FIG. 6), and ground wires 81a and 82a are connected to the ground terminal 911G.
  • the signal line connection terminal 912T is provided in the vicinity of the ground terminal 911G, and 32 signal lines 82b are connected to each other.
  • the signal line connection terminal 913T is provided adjacent to the signal line connection terminal 912T, and 32 signal lines 81b are connected to each other.
  • the signal line connection terminal 912T and the signal line connection terminal 913T are arranged so as to be displaced from each other along the longitudinal direction of the flexible substrate 9.
  • the element connection terminals 914T to 917T are provided at one end in the longitudinal direction (right side in the longitudinal direction in FIG. 6) in the direction orthogonal to the stacking direction, and each piezoelectric element of the ultrasonic vibrator 7 is electrically connected. Connected to.
  • the element connection terminals 914T to 917T are provided on the surface layer side, and are arranged so as to be displaced along the longitudinal direction of the flexible substrate 9.
  • the ground terminal 918G is provided at one end in the longitudinal direction (right side in the longitudinal direction in FIG. 6) in the direction orthogonal to the stacking direction, and the ground wire of the ultrasonic vibrator 7 is connected to the ground terminal 918G.
  • the vias 951V to 958V conduct the ground terminal 911G to the ground terminal 918G and the substrate 92, respectively.
  • the wirings 912a to 917a connect the signal line connection terminals 912T to the element connection terminals 917T and the vias 952V to 957V, respectively.
  • the wiring 916b has thermal conductivity and extends from the element connection terminal 916T to the vertical end of the substrate 91.
  • the wiring 918a is connected to the ground wire of the ultrasonic vibrator 7.
  • the wirings 921a and 922a have thermal conductivity and extend to the end of the substrate 92.
  • the wiring 921b is connected to the via 952V and the via 955V.
  • the wiring 922b is connected to the via 953V and the via 954V.
  • the vias 971V to 975V are electrically connected to the substrate 94 (see FIG. 9), respectively.
  • the wiring 931a has thermal conductivity and extends from the via 972V to the end of the substrate 93.
  • the wiring 931b is connected to the via 972V and the via 973V.
  • the substrate 94 is formed with a ground terminal 941G and 32 signal line connection terminals 942T and 943T (signal line connection terminal rows), respectively.
  • the ground terminal 941G is provided at one end in the longitudinal direction (left side in the longitudinal direction in FIG. 9) in the direction orthogonal to the stacking direction (direction orthogonal to the paper surface in FIG. 9), and the ground wires 83a and 84a are provided. Be connected.
  • the signal line connection terminal 942T is provided in the vicinity of the ground terminal 941G, and 32 signal lines 83b are connected to each of the signal line connection terminals 942T.
  • the signal line connection terminal 943T is provided adjacent to the signal line connection terminal 942T, and 32 signal lines 84b are connected to each other.
  • the signal line connection terminal 942T and the signal line connection terminal 943T are arranged so as to be displaced from each other along the longitudinal direction of the flexible substrate 9.
  • the via 971V conducts the ground terminal 941G and the substrate 93.
  • the via 972V conducts the signal line connection terminal 942T and the substrate 93.
  • the via 973V conducts the substrate 94 and the substrate 93.
  • the via 974V conducts the substrate 94 and the substrate 91 via the vias 962V and 956V.
  • the via 975V conducts the substrate 94 and the substrate 91 via the vias 963V and 957V.
  • the wiring 942a connects the signal line connection terminal 942T and the via 972V.
  • the wiring 943a connects the signal line connection terminal 943T and the via 974V.
  • Wiring 944a connects the via 973V and the via 975V.
  • the wiring 946a has thermal conductivity and extends from the via 975V to the end of the substrate 94.
  • the ground terminal 911G, the signal line connection terminal 912T, the signal line connection terminal 913T, the ground terminal 941G, the signal line connection terminal 942T, and the signal line connection terminal 943T are preferably located in a region of 0.005 mm or more and 0.2 mm or less from the end portion of the flexible substrate 9. This is because the flexible substrate 9 is miniaturized and the tip of the insertion portion 21 is miniaturized. When inserting the ultrasonic endoscope 2 into the body, it is very important to reduce the size of the tip of the insertion portion 21 in order to further reduce the burden on the patient's body.
  • FIGS. 10 to 12 are partial projection views of the flexible substrate. Specifically, in FIGS. 10 to 12, when the flexible substrate 9 is viewed from the direction indicated by the arrow V in FIG. 5 (lower part of FIGS. 6 to 9), the terminals, wirings, vias, etc. are designated as arrows V. It is a projection drawing which projected in the direction along. Therefore, some terminals, wirings, and the like overlap each other, and there is a part shown integrally or a part shown only in part. Further, FIG. 10 is a diagram corresponding to the region A1 of FIG. 6, FIG. 11 is a diagram corresponding to the region A2 of FIG. 6, and FIG. 12 is a diagram corresponding to the region A3 of FIG.
  • Polyimide base materials 95 to 97 are arranged as an insulating layer between the substrates 91 to 94.
  • the polyimide base materials 95 to 97 have thermal conductivity, and heat is provided between the substrate 91 which is the front surface side layer and the substrate 94 which is the back surface side layer and the substrate 92 and the substrate 93 which are intermediate layers. Vias, which are conduction parts, are formed.
  • the front surface of the substrate 91 and the back surface of the substrate 94 are covered with resists 98 and 99, respectively.
  • the resists 98 and 99 expose only each terminal portion on the front surface of the substrate 91 and the back surface of the substrate 94, and protect the other portions.
  • the ground terminal 911G and the ground terminal 941G face each other in the stacking direction and form a part of the substrate 91 and the substrate 94.
  • the signal line connection terminal 912T and the signal line connection terminal 913T and the signal line connection terminal 942T and the signal line connection terminal 943T face each other in the stacking direction and form a part of the substrate 91 and the substrate 94.
  • the ground terminal 911G and the ground terminal 941G are connected by vias 951V, 961V, and 971V, and have the same potential.
  • the flexible substrate 9 has vias 951V, 961V, 971V which are located near the end portion in the longitudinal direction and electrically connect the ground terminal 911G of the front surface side layer and the ground terminal 941G of the back surface side layer. Be prepared.
  • the vias 951V, 961V, and 971V are provided at positions overlapping the ground terminal 911G and the ground terminal 941G in the stacking direction.
  • the via 971V and the via 964V are connected by the electrode 971a, and as shown in FIG. 12, the via 964V is connected to the ground terminal 918G via the via 958V.
  • the ground terminal 918G has the same potential as the ground terminal 911G and the ground terminal 941G.
  • the signal line connection terminal 912T is connected to the element connection terminal 915T via the wiring 912a, the via 952V, the wiring 921b, the via 955V, and the wiring 915a.
  • the signal line connection terminal 913T is connected to the element connection terminal 914T via the wiring 913a, via 953V, wiring 922b, via 954V, and wiring 914a.
  • the signal line connection terminal 942T is connected to the element connection terminal 917T via wiring 942a, via 972V, wiring 931b, via 973V, wiring 944a, via 975V, via 963V, via 957V, and wiring 917a.
  • the signal line connection terminal 943T is connected to the element connection terminal 916T via wiring 943a, via 974V, via 962V, via 956V, and wiring 916a.
  • FIG. 13 is an enlarged view of the connection portion between the cable group and the flexible substrate. As shown in FIG. 13, the shielded wires 81 to 84 of the cable group 8 are connected to the front surface side and the back surface side of the signal line connection terminals 912T, 913T, 942T, 943T of the flexible substrate 9.
  • FIG. 14 is an enlarged view of the connection portion between the cable group and the flexible substrate.
  • the ground wires 81a and 82a are connected to the ground terminal 911G of the substrate 91
  • the signal line 82b is connected to the signal line connection terminal 912T
  • the signal line 82b is connected to the signal line connection terminal 913T.
  • the signal line 81b is connected.
  • the ground wires 83a and 84a are connected to the ground terminal 941G of the substrate 94
  • the signal line 83b is connected to the signal line connection terminal 942T
  • the signal line 84b is connected to the signal line connection terminal 943T. Be connected.
  • FIG. 15 is a notched view showing the internal configuration of the tip of the ultrasonic endoscope.
  • the cable group 8 and the flexible substrate 9 connected to each other are connected to the piezoelectric element of the ultrasonic vibrator 7 and housed inside the first housing 214.
  • the tip rigid length L1 can be shortened by bending the flexible substrate 9 and accommodating it in the first housing 214.
  • the signal line connection terminal 912T, the signal line connection terminal 913T, the signal line connection terminal 942T, and the signal line connection terminal 943T of the flexible substrate 9 are the element connection terminal 915T, the element connection terminal 914T, and the element connection terminal, respectively. It is connected to the 917T and the element connection terminal 916T in this order, and connects the 128 signal lines of the cable group 8 and the 128 piezoelectric elements of the ultrasonic vibrator 7. According to the flexible substrate 9, since the cable group 8 can be connected to both sides of the flexible substrate 9 so as to face each other, the tip rigid length L1 can be shortened.
  • the signal lines 81b, 82b or the signal lines 83b, 84b are soldered to one of the signal line connection terminals 912T, 913T of the substrate 91 or the signal line connection terminals 942T, 943T of the substrate 94, and then soldered.
  • the flexible substrate 9 is inverted and the other is soldered.
  • the signal lines 81b and 82b are connected to the signal line connection terminals 912T and 913T of the board 91.
  • the intermediate layers, the substrates 92 and 93 reduce the heat transferred from the substrate 91 to the substrate 94, and the wirings 921a, 922a, 931a, 916a, and 946a dissipate heat from the end faces, so that the soldering is performed first. It is prevented that the solder of the attached substrate 94 is remelted by heat.
  • the substrate 94 is soldered after the substrate 91 is soldered, the substrates 92 and 93 are insulated, and the wirings 921a, 922a, 931a, 916a, and 946a dissipate heat from the end faces, and the substrate 91 is soldered. Is prevented from remelting.
  • FIG. 16 is a diagram showing a state of wiring of the first substrate and the second substrate.
  • FIG. 16 is an enlarged view of the portion B1 of FIG. 6, and each wiring of the substrate 91 and each wiring of the substrate 92 are superimposed and shown.
  • the portion 9121 which is a part of the wiring 912a emphasized by hatching and the portion 9221 which is a part of the wiring 922a are arranged so that the overlapping area is as small as possible.
  • the wiring 922a of the substrate 92 which is the intermediate layer, differs from the wiring 912a provided on the substrate 91, which is the surface side layer, in the wiring pattern along the stacking direction (direction orthogonal to the paper surface of FIG. 16).
  • the distance between the wiring 912a and the wiring 922a can be increased as compared with the case where the wiring patterns along the stacking direction are the same, and the heat transferred from the wiring 912a to the wiring 922a when soldering is performed. Can be reduced.
  • the portion 9131 which is a part of the wiring 913a emphasized by hatching and the portion 9211 which is a part of the wiring 921b are arranged so that the overlapping area is as small as possible.
  • the wiring 921b of the substrate 92, which is the intermediate layer has a different wiring pattern along the stacking direction from the wiring 913a provided on the substrate 91, which is the surface side layer. As a result, when soldering, the heat transferred from the wiring 913a to the wiring 921b can be reduced.
  • the wiring of the substrate 92, which is the intermediate layer is different from the wiring provided on the substrate 91, which is the surface side layer, in the wiring pattern of the portion B1 along the stacking direction. It is preferable that the wiring of the substrate 92, which is the intermediate layer, differs from the wiring provided on the substrate 91, which is the surface side layer, in the wiring pattern along the stacking direction in the entire area. Further, it is preferable that the wiring of the substrate 93, which is the intermediate layer, is different from the wiring provided on the substrate 94, which is the back surface side layer, in the wiring pattern along the stacking direction. As a result, when soldering is performed in the entire area of the flexible substrate 9, the heat transferred from the wiring of the substrate 91 or the substrate 94 to the wiring of the substrate 92 or the substrate 93 can be reduced.
  • FIG. 17 and 18 are partially enlarged views of the first substrate. Specifically, FIG. 17 is an enlarged partially enlarged view of a portion B2 of FIG. 6, and FIG. 18 is an enlarged partially enlarged view of a portion B3 of FIG.
  • the width dSL in the arrangement direction of the signal line connection terminals 912T shown in FIG. 17 is larger than the width dSF in the arrangement direction of the element connection terminals 914T shown in FIG.
  • the width of the signal line connection terminals 912T, 913T, 942T, and 943T is larger than the width of the element connection terminals 914T to 917T in the arrangement direction.
  • the width of the signal line connection terminals 912T, 913T, 942T, and 943T is larger than the width of the element connection terminals 914T to 917T in the arrangement direction.
  • the width of the tip side (ultrasonic vibrator 7 side) of the flexible substrate 9 can be reduced, so that the insertion portion 21 can be miniaturized.
  • FIG. 19 is a partial cross-sectional view of the multilayer substrate according to the second embodiment.
  • the flexible substrate 9A includes a substrate 91A, a polyimide base material 101 to 103, a relay substrate 104, a heat insulating layer 105 having a high heat insulating property, and a relay substrate 106.
  • the substrate 92, the substrate 93, the substrate 94, the polyimide substrates 95 to 97, and the resist 99 may be the same as those in the first embodiment, and thus the description thereof will be omitted.
  • the board 91A is formed with a ground terminal 911G, a signal line connection terminal 912T, and a signal line connection terminal 913T.
  • the surface of the substrate 91A is protected by a resist 98A.
  • the ground terminal 911G is carried out via the via 1011V of the polyimide base material 101, the via 1021V of the polyimide base material 102, the via 1031V of the polyimide base material 103, the via 1051V of the heat insulating layer 105, and the relay terminal 1061 of the relay board 106. It has the same potential as the ground terminal 941G through the same path as in the first embodiment.
  • the signal line connection terminal 912T includes wiring 912a, a via 1012V of the polyimide base material 101, a via 1022V of the polyimide base material 102, a via 1032V of the polyimide base material 103, a via 1052V of the heat insulating layer 105, and a relay terminal 1062 of the relay board 106. It is connected to the element connection terminal 915T via the same route as in the first embodiment.
  • the signal line connection terminal 913T includes wiring 913a, a via 1013V of the polyimide base material 101, a via 1023V of the polyimide base material 102, a via 1033V of the polyimide base material 103, a via 1053V of the heat insulating layer 105, and a relay terminal 1063 of the relay board 106. It is connected to the element connection terminal 914T via the same route as in the first embodiment.
  • the heat insulating layer 105 having high heat insulating properties is arranged between the substrate 91A and the substrate 94, the effect of reducing the heat transferred from the substrate 91A to the substrate 94 is high. Further, when the heat insulating layer 105 is an anisotropic conductive adhesive, the insulation in the layer direction is maintained while maintaining the conductivity in the stacking direction, and the effect of reducing the heat transferred from the substrate 91A to the substrate 94 is further enhanced. be able to.
  • FIG. 20 is a side view of the tip of the ultrasonic endoscope.
  • the ultrasonic vibrator 7B is a radial vibrator and is held in the first housing 214B.
  • the tip rigid length L2 is the length of the first housing 214B.
  • FIG. 21 is a notched view showing the internal configuration of the tip of the ultrasonic endoscope. As shown in FIG. 21, three flexible substrates 9B are connected to the ultrasonic transducer 7B, and three cable groups 8B are connected to the flexible substrate 9B. As described above, the plurality of substrates do not have to be laminated.
  • FIG. 22 is a cross-sectional view of the multilayer substrate according to the fourth embodiment.
  • the flexible substrate 9C comprises a polyimide base material 307, 308, 312, 313 arranged between the substrates 301 to 306 and the substrates 301 to 306, and a polyimide base material 308 and the substrate 303.
  • An adhesive layer 309 for adhering, an adhesive layer 311 for adhering the polyimide base material 312 and the substrate 304, and a heat insulating layer 310 are provided.
  • the front surface of the substrate 301 and the back surface of the substrate 306 are covered with resists 314 and 315, respectively.
  • the ground terminal 3011G of the substrate 301 and the ground terminal 3061G of the substrate 306 are provided so as to face each other in the stacking direction. Further, the signal line connection terminal 3012T and the signal line connection terminal 3013T of the substrate 301 and the signal line connection terminal 3062T and the signal line connection terminal 3063T of the substrate 306 are provided so as to face each other. Further, the element connection terminals 3014T to 3016T of the substrate 301 and the element connection terminals 3064T to 3066T of the substrate 306 are provided so as to face each other. Further, the ground terminal 3017G of the substrate 301 and the ground terminal 3067G of the substrate 306 are provided so as to face each other.
  • the ground terminal 3011G is connected to the ground terminal 3017G via via 3071V, via 3081V, wiring of substrate 303, via 3082V, wiring of substrate 302, wiring of via 3083V, wiring of substrate 303, via 3084V, and via 3076V. It is said to have the same potential.
  • the ground terminal 3061G is connected to the ground terminal 3067G via via 3131V, via 3121V, wiring of the board 304, via 3122V, wiring of the board 305, via 3123V, wiring of the board 304, via 3124V, and via 3136V. It is said that they have the same potential.
  • the signal line connection terminal 3012T is connected to the element connection terminal 3016T via the wiring 3012a, the via 3072V, the wiring of the board 302, the via 3075V, and the wiring 3016a.
  • the signal line connection terminal 3013T is connected to the element connection terminal 3015T via the wiring 3013a, the via 3073V, the wiring of the board 302, and the via 3074V. Further, the signal line connection terminal 3013T is connected to the element connection terminal 3064T via the wiring 3013b.
  • the signal line connection terminal 3062T is connected to the element connection terminal 3066T via the wiring 3062a, the via 3132V, the wiring of the board 305, the via 3135V, and the wiring 3066a.
  • the signal line connection terminal 3063T is connected to the element connection terminal 3065T via the wiring 3063a, the via 3133V, the wiring of the board 305, and the via 3134V. Further, the signal line connection terminal 3063T is connected to the element connection terminal 3014T via the wiring 3063b.
  • FIG. 23 is a notched view showing the internal configuration of the tip of the ultrasonic endoscope. As shown in FIG. 23, the tip end side of the flexible substrate 9C is bent in two directions facing each other at a substantially right angle, connected to the convex type ultrasonic vibrator 7C, and housed in the first housing 214C.
  • the heat insulating layer 310 having high heat insulating properties is arranged between the substrate 301 and the substrate 306, the effect of reducing the heat transferred from the substrate 301 to the substrate 306 is high. Further, since the ultrasonic vibrators 7C can be connected to both sides of the flexible substrate 9C whose tip is divided into two and bent, the length of the first housing 214C having a hard tip length L3 can be shortened. can.

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PCT/JP2020/018047 2020-04-27 2020-04-27 多層基板、プローブユニット、及び超音波内視鏡 Ceased WO2021220376A1 (ja)

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JP2022518466A JP7271790B2 (ja) 2020-04-27 2020-04-27 多層基板、プローブユニット、及び超音波内視鏡
PCT/JP2020/018047 WO2021220376A1 (ja) 2020-04-27 2020-04-27 多層基板、プローブユニット、及び超音波内視鏡
US17/969,943 US12569883B2 (en) 2020-04-27 2022-10-20 Multilayer board, probe unit, and ultrasound endoscope

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