WO2021198355A2

WO2021198355A2 - Substrate holder having an elastic substrate support

Info

Publication number: WO2021198355A2
Application number: PCT/EP2021/058475
Authority: WO
Inventors: Dietmar Keiper
Original assignee: Apeva Se
Priority date: 2020-04-02
Filing date: 2021-03-31
Publication date: 2021-10-07
Also published as: TW202145433A; WO2021198355A3; DE102020109265A1

Abstract

The invention relates to a substrate holder (2) for use in a substrate handling apparatus (1), having a top side (2') which can be temperature-controlled by the supply or discharge of heat, which top side carries a substrate (7) during substrate handling, the rear side (8) of which substrate extends in a plane parallel to the top side (2') and points toward the top side (2'), wherein the surface of the rear side (8) has at least one zone (8') which is uneven or which bulges out of a plane, and an apparatus for carrying out a substrate handling process by means of such a substrate holder (2). In order to ensure uniform heating of the substrate (7), a resiliently deformable substrate support (10) arranged on the top side (2') is provided which, as a result of a resilient deformation, comes into contact with the surface of the rear side (8, 8'). The substrate support (10) can be formed by a plurality of resilient structural elements (11, 12, 13, 14, 15).

Description

description

Substrate holder with an elastic substrate support

Field of technology

[0001] The invention relates to a substrate holder for use in a substrate treating _V orrichtung, comprising a heatable by heat supply or heat dissipation top which carries a substrate at a substrate treatment, which itself has in a plane parallel to the top extending back to the top surface, wherein the surface the rear side has at least one uneven zone or zone bulging out of a plane.

The invention also relates to a substrate treatment process in which a substrate is arranged on an upper side of a substrate holder and is tempered by the substrate holder. The substrate can be cooled or heated. During the treatment process, a layer sequence or an individual layer can be deposited on a surface of the substrate facing a process chamber. This can be done by feeding a steam or a gas into the process chamber, for which purpose a gas inlet element is provided. Layers or areas of the surface of the substrate can also be removed, for example by feeding an etching gas into the process chamber. The substrate treatment process is in particular a method for producing the layers required for OLEDs on a substrate, in particular a glass substrate. The layer deposition is also a polymerisation process.

The invention also relates to a substrate treatment device in which a substrate is arranged on an upper side of a substrate holder. The substrate holder can have a temperature control device, for example a heating device or a cooling device, around which the sub- strat supporting top of the substrate holder to heat or cool. Between the top of the substrate holder and a gas inlet member, a process chamber extends into which a steam or a gas can be fed by means of the gas inlet member. The gas inlet element can have the shape of a showerhead. A carrier gas can convey the steam or a reactive gas into the process chamber through a multiplicity of gas outlet channels arranged in a gas outlet surface of the gas inlet element. The substrate treatment device can also have a gas outlet element through which at least the carrier gas can exit the process chamber.

PRIOR ART [0004] DE 102011078673 A1 discloses a method and a device for vacuum treatment of substrates in which lamellae originate from a substrate and carry the substrate.

US Pat. No. 5,605,574 A describes a substrate holder on which bellows-like spacer elements are arranged which carry a substrate. JP 2003-239070 A describes a substrate holder which is supported on elastic structural elements.

A device with a holding device for holding the substrate on a substrate carrier is described in JP 2006-190805. A device for holding a substrate, with which the substrate is cooled, is known from US Pat. No. 5,199,483.

[0008] WO 2006/036992 A1 describes a method with which a substrate lying on an upper side of a substrate holder can be cooled. A device for holding a substrate on a cooled substrate holder is also known from WO 2006 / 061784A1 and US 2010 / 0247804A1.

US 2016 / 0376697A1 also belongs to the prior art. A device for depositing OLEDs using a shower head and a cooled substrate holder is described in DE 102015118765 A1.

In a known substrate treatment process, as it is described for example in the last-mentioned DE 102015118765 A1, a substrate to be treated, which can be a glass substrate or a plastic substrate, lies with its back on an upper side of a cooled one Substrate holder. Through the heated gas inlet member, a vapor previously generated, for example, by evaporation of a provided aerosol, is fed into the process chamber of the treatment device. The temperature of the gas inlet element is greater than the condensation temperature of the steam. By means of a cooling device arranged in the substrate holder, the upper side, which carries the substrate, is cooled to a temperature which is far below the condensation temperature of the vapor. Constant heat dissipation through the joint between the back of the substrate and the top of the substrate holder brings the front side of the substrate facing the process chamber to a temperature at which the steam condenses on the front side in order to deposit a layer, in particular an organic layer. Several layers can be deposited one behind the other which have different layer compositions. This can be done in a structured manner using a mask. The back of the substrate lying on the top of the substrate holder extends essentially in one plane. The surface of the back deviates from at least in some areas an exact mathematical level. These deviations are due, on the one hand, to a natural roughness of the surface of the rear side, but also to manufacturing tolerances on the other. These unevenness of the surface of the rear side can also be zones curved out of the plane. If such a substrate rests on a likewise only essentially level top of the substrate holder, then there is only point contact between the back of the substrate and the top of the substrate holder. Only at the points of contact does heat conduction occur directly via the contact between two solid bodies. In the areas between the contact points, the heat is transported either via radiation or via heat conduction through a gas present in the space between the back of the substrate and the top of the substrate holder. The heat flow through this space is influenced by the pressure of the gas and the gap height, but also by the molar mass of the gas. A relevant parameter is the mean free path of the gas molecules or the Knudsen number. Due to the locally different heat flow from the substrate to the substrate holder, the front side of the substrate to be coated does not have a uniform lateral temperature profile.

Summary of the invention

The invention is based on the object of specifying means with which the lateral temperature profile of the front side of the substrate is evened out.

The invention is based in particular on the object of specifying a device and a method for depositing OLEDs in which the layer quality has the greatest possible lateral homogeneity. The object is achieved by the invention specified in the claims. The subclaims not only represent advantageous developments of the invention specified in the independent claims, but also independent solutions to the problem.

It is provided that the substrate does not lie directly on the top of the substrate holder. A substrate support is provided between the top of the substrate holder and the back of the substrate. The substrate support is designed in such a way that it comes into contact with the surface of the rear side due to an elastic deformation. The substrate support can thus be formed by one, but also by several bodies that allow heat to flow between the substrate holder and substrate, the substrate holder preferably being a heat sink to which heat flows from the substrate through a spacing area, the substrate support being provided in the spacing area . It can be provided that the substrate support has one or more structural elements. The structural elements can be elastic bodies that can bend and / or that can be compressed. The structure elements can be arranged over the entire surface on the upper side. The structure elements can, however, also be arranged only in certain areas on the upper side. Gaps filled with a gas can exist between individual structural elements. However, a gas can also be fed into the interstices. It can further be provided that the structural elements are arranged only on one edge of a region of the upper side that is covered by the substrate. It can thus be provided that the structural elements only carry the edge of the substrate. If there are spaces or gaps between the structure elements or if the structure elements are only arranged at the edge of the substrate, a temperature control gas can be fed into the gap from the substrate holder. The heat transfer from the substrate to the substrate holder then takes place in particular in the area of the gap via heat conduction through the fed gas. Gas feed lines can be provided which open into the intermediate space from the substrate holder. A tempering gas can be fed through this feed line into the space between the rear side of the substrate, the upper side of the substrate holder and the side walls of the structural elements. The temperature control gas can flow through the intermediate space or several intermediate spaces. Structural elements that are arranged along the edge of the substrate can form a labyrinth seal with their interstices. They seal off an inner area from the surroundings. The temperature control gas can be nitrogen, argon, neon, krypton, xenon, hydrogen or helium. The temperature control gas can also be a mixture, it being provided in particular that the mixture consists of at least 90 percent of one or more of the aforementioned gases. The structural elements can, however, also be arranged distributed uniformly over the entire surface of the upper side of the substrate holder. They can be geometrically regularly or statistically evenly distributed over the top. The structural elements can have a uniform size. They can also have a uniform shape. For example, they can form elongated strips, ribs or cubic blocks. The structural elements can have side walls that run parallel to one another. The structural elements can, however, also have side walls that are undercut, so that a foot area of the structural element, with which the structural element is attached to the top of the substrate holder, has a smaller floor plan than a head area, which forms a support surface on which the rear side is located of the substrate. The temperature control gas can be fed into the spaces between the structural elements.

The temperature control gas can be fed into the intermediate space with an overpressure of, for example, 2 mbar, 5 mbar above the process chamber pressure. The overpressure is preferably less than 1 mbar. But it can also be less than 5 mbar. The process chamber pressure can be in the range between 1 mbar and 5 mbar. However, it can also be in the range between 0.5 mbar or 1 mbar. In particular, it can be less than 1 mbar or 0.5 mbar. In order to prevent the higher pressure in the intermediate area from causing the substrate to lift, holding means are provided. Such holding means can act mechanically, for example a mask can rest on the substrate, the weight of which provides the force. However, it is also provided that magnetic or electrostatic forces are used to hold the substrate. Instead of individual structural elements that are, for example, directly applied, for example glued, to a surface, in particular a metallic surface, of the substrate holder, the substrate support can also be formed by one or more bodies having a plurality of projections that are applied to the top of the substrate holder . In particular, it is provided that such a body is a mat which has projections facing away from the upper side. Before these jumps are elastically deformable, for example bendable and / or compressible. However, it is also provided that the substrate support is formed from one or more foam bodies or other compressible bodies. Such a body has two surfaces pointing away from one another, which can cling to either the surface of the upper side of the substrate holder or the surface of the rear side of the substrate over the entire area. It can be an open-cell foam. Glass, silicon, but also A1203 or aluminum, copper, titanium or another metal is used as the substrate. The substrate can also be a plastic, polyamide, in particular a transparent plastic. The substrate can have a surface area of more than 0.15 m ² . However, the substrate can also be larger than 1 m ² or larger than 2 m ² . The structural elements can also be fibers or thin columns that can bend. Such structural elements, such as hairs or bristles, protrude from the top of the substrate holder. Such flexible structural elements can bend when a force is applied in such a way that they carry the substrate with their side walls. The height of the structural elements is preferably only slightly larger than the extent of the greatest unevenness of the back of the substrate. The height of the structural elements can, however, also be greater. The height of the structural elements can be greater than 5 gm, greater than 10 gm, greater than 50 gm, greater than 100 gm or greater than 1 mm. The height of the structural elements should, however, be less than 5 mm. According to a preferred embodiment, the height of the structural elements is between 50 μm and 1 mm. The height is preferably around 50 gm to 100 gm. The lateral extension of a structural element can be smaller than its height. In particular, if the structural elements are designed as columns or fibers, such as hair or bristles, the diameter of their cross-sectional area equivalent to a circle is at least a factor of 10 smaller than their height. A typical lateral dimension of a structural element is less than 5 cm or less than 1 mm. However, a lateral dimension can also be greater than 5 cm. A structural element can, for example, have a length that is greater than 0.2 mm, greater than 0.5 mm, greater than 1 mm, greater than 2 mm or greater than 5 mm. It is especially provided that the maximum length of a structural element is 20 mm. The area that a structural element takes up can be smaller than 50 mm ² . The width of a structural element can be greater than 5 mm or less than 1 mm. The structural elements can also have a cavity. The structural elements can in particular be designed as cushions. Such a structural element has an elastic shell. A gas can be fed into the volume surrounded by the envelope, which gives the cushion elasticity. The gas fed into the volume can also be a temperature control gas, which gives the cushion a thermal conductivity. It can be provided that a temperature control gas flows through a cushion during a treatment process. The volume then has a supply line and a discharge line. However, a heat transfer liquid can also be fed into the volume. It is also envisaged that the volume will be completed. The cushion can be a gel cushion with a thermally conductive gel in its volume. It can be provided that the substrate is on a single cushion, for example gel cushion lies. In this case, the substrate support is formed by a gel cushion. However, it is also provided that the substrate support is formed by several cushions, in particular gel cushions. In particular, it can be provided that the top of the substrate holder is completely, ie 100 percent, provided with the substrate support and in particular with the structural elements formed by the substrate support. However, it can also be provided that at least a proportion of 90 percent, 10 percent,

3 percent or 1 percent is provided with structural elements.

The temperature control gas fed into the volume of the cushion or the temperature control gas fed into the spaces between the structural elements preferably has such a high thermal conductivity that it dominates the heat transport between the substrate and the substrate holder. With the structural elements according to the invention, it can be achieved that the heat transport does not take place for the most part via the contact areas of the rear surface of the substrate with the structural elements, but that the heat transport takes place essentially via the temperature control gas filling the gap. It can thus be provided that the structural elements and the temperature control gas have heat conducting properties such that a greater heat flow flows through the temperature control gas than through all the structural elements as a whole. The cross-sectional area of the structural elements and the cross-sectional area of the interspaces preferably have a ratio such that the cross-sectional area of the sum of all structural elements is significantly less than the cross-sectional area of the sum of all interspaces.

Brief description of the drawings

Embodiments of the invention are explained in detail below with the aid of attached drawings. Show it: 1 schematically shows a section through a substrate treatment device,

FIG. 2 enlarges the detail II in FIG. 1,

3 shows the detail according to FIG. 2, but in a constellation according to the prior art,

Fig. 4 shows the section along the line IV-IV in Figure 1, in the form of a

Top view of the substrate 7 resting on a substrate holder 2,

5 shows a plan view of the substrate holder 2 similar to FIG. 4, but with the substrate 7 of a first exemplary embodiment removed,

6 shows the section along the line VI-VI in FIG. 4,

Fig. 7 shows a representation according to Figure 5 of a second game Ausführungsbei,

8 is a perspective view of a detail of an upper side 2 'of a substrate holder 2 with structural elements 11 of a third exemplary embodiment,

Fig. 9 is a section similar to Figure 6 of a fourth game Ausführungsbei,

10 shows a perspective illustration similar to FIG. 8 of a fifth exemplary embodiment, 11 various structural elements 15a to 15f of the fifth exemplary embodiment,

12 shows a representation similar to FIG. 9 of a sixth embodiment, in which the structural elements 13 are in the form of threads, fibers or hairs,

13 shows an illustration according to FIG. 12, but with a substrate 7 carried by the structural elements 13,

14 shows a seventh embodiment of the invention in a representation similar to FIG. 9, in which the structural elements 14 are formed by protrusions of a mat 25,

15 shows an eighth exemplary embodiment in a sectional illustration similar to FIG. 9, in which the substrate support 10 is formed by a foam body 26 and

16 shows an illustration according to FIG. 15, in which the substrate support 10 is a gel body 27 in which a gel 29 is located in a volume of an envelope 28.

Description of the embodiments

Figure 1 shows an OVPD reactor, as it is basically known from the prior art. The OVPD reactor has a housing 1 which is gas-tight to the outside. In the housing 1 there is a gas inlet element 3 which has the shape of a shower head. The gas inlet element 3 has an essentially rectangular outline and a large number of gas outlet openings on a gas outlet surface facing a process chamber 5. gen 3 '. A vapor of an organic starting material can be fed into a volume of the gas inlet element 3 through a gas feed line 4. This is done by means of a carrier gas. The vapor is generated beforehand in an evaporator (not shown), for example in that an organic powder brought to an evaporator as an aerosol is converted into vapor form by the supply of heat in the evaporator. The gas outlet surface of the gas inlet organ 3 is heated. It is heated to a temperature that is greater than the condensation temperature of the steam.

The bottom of the process chamber 5 is formed by an upper side 2 ′ of a substrate holder 2. The substrate holder 2 is essentially formed by a heat sink. The heat sink has a cooling device 6, which can be cooling channels through which a liquid cooling medium can flow. The substrate to be coated is located on the upper side 2 'of the substrate holder 2. The substrate has a front side 9 which faces the process chamber 5 and which is coated with the organic vapor in that the steam condenses on the front side 9. For this purpose, heat must be withdrawn from the substrate 7. This is done by means of the substrate holder 2.

According to the invention, a substrate support designated by the reference number 10 in FIG. The inventive effect of the substrate support 10 is explained with reference to FIG. 3, which shows a device according to FIG. The back 8 extends essentially Chen in one plane. But it has bumps, for example bulges 8 '. These unevenness lead to the fact that the rear side only touches the top side 2 ', which is also not an ideal plane, only at certain points. The heat is transported from the substrate 7 to the substrate holder 2 only at the contact points via a solid contact. In the intermediate areas, the heat is transported from the substrate to the substrate holder 2 essentially via heat conduction through a gas located in the intermediate space.

In contrast to the situation in the prior art shown in Figure 3, according to the invention between the back 8 of the substrate 7 and the top 2 'is an elastic medium in the form of the substrate support 10. With this elastic medium, the unevenness 8' are compensated . This leads to a more uniform heat transport from the substrate 7 to the substrate holder 2.

The reference numeral 30 denotes holding means, for example electrostatic or electromagnetic holding means, with which a force is applied to the substrate 7, which acts in the direction of the surface normal of the top 2 'and which acts on the substrate 7 in the direction of the substrate holder 2 so that the substrate support 10 can deform. In other exemplary embodiments, the holding device 30 also has the function of holding the sub strate 7 against the pressure of a temperature gas fed into a space below the substrate 7. Reference numeral 31 denotes a mask, for example made of metal, which rests on the substrate in order to structure the sub strate. The mask 31 is only indicated in FIG. The mask 31 also provides a mass with which the substrate is acted upon in the direction of the upper side 2 ', so that a weight force is established which can deform the substrate support 10, but which the substrate 7 can also against the pressure of a space between the upper side 2 'and back 8 holds the fed temperature gas.

Figures 4, 5 and 6 show a first embodiment of the inven tion, in which only along one edge of an area of the top 2 ' of the substrate holder, which is covered by the substrate 7, structural elements 11 are arranged on. The structural elements can be elongated, elastic bodies, for example made of plastic, but also made of metal or another suitable material. The structural elements 11 are arranged along the edge in such a way that intermediate spaces 20 remain between adjacent structural elements 11. The structural elements 11 are arranged in such a way that they form a labyrinth seal with respect to an interior space surrounding the structural elements 11. If the substrate 7 rests on the structural elements, a cavity 17 is formed between the rear side 8 and the upper side 2 '. A temperature gas can be fed into this cavity 17. For this purpose, gas feed lines 16 are provided which open into the top 2 '. The temperature control gas causes heat to be conducted from the substrate 7 to the substrate holder 2. The distance between the rear side 8 and the upper side 2 'can be in the range between 5 μm and 1 mm.

In an exemplary embodiment not shown, the elongated structural elements 11, the length of which can be up to 5 cm and the width of which can be up to 1 mm, can be arranged evenly distributed over the entire top 2 '. Gas feed lines 16 can open into spaces between the individual structural elements 11. In order to hold the substrate against a temperature gas pressure which is higher than the ambient pressure, the holding means 30 described above can be used. The overpressure of the tem periergases can be 0.5 mbar to 1 mbar.

In the second exemplary embodiment shown in FIG. 7, the structural elements 11 have an essentially square outline and are arranged uniformly over at least the area of the upper side 2 ′ of the substrate holder 2 covered by the substrate 7. The structural elements 11 are evenly distributed over the top 2 'in a regular arrangement. she but can also be distributed irregularly. But they can also be distributed irregularly and statistically evenly over the top 2 '. Your floor plan can also be round, oval or rectangular. The outline contour can also run as desired.

The third embodiment shown in Figure 8 shows gas supply lines 16 which open directly at the edge of a central open area which is delimited by the structural elements 11 in a multi-row arrangement. The structural elements 11 here have side walls 21, 22 running parallel to one another and a width B which is in the range between 1 mm and 5 mm. They have a length L which is in a range between 1 mm and 50 mm. The distance A between two adjacent structural elements 11 can correspond to the dimension of the height H. The distance A can, however, also be greater or smaller than the height H. The dimension of a support surface 23 on which the rear side 8 of the substrate 7 is supported can be less than 50 mm ² . The structure elements 11 can be formed here by elastic solids that are made of rubber, plastic or another elastic material. Its volume is completely filled by the material.

FIG. 9 shows a fourth exemplary embodiment of the invention, in which the structural elements 12 have a cavity 19. The structural elements 12 are designed as cushions and have a flexible cover 18. The cover 18 forms the side walls 21, 22 and the support surface 23. In the exemplary embodiment, the cushion 12 is open to the top 2 '. The shell is connected to the top 2 'by an edge, for example by an adhesive connection. A gas feed line 16 opens into the volume 19 of the envelope 18 in order to feed a temperature control gas into the envelope. In an exemplary embodiment, not shown, not only a gas supply line 16 but also a gas discharge line opens into the cavity 19 of the structural element 12, so that the height treatment 19 a temperature gas can flow. The width B, the height H and the distance between adjacent structural elements 12 can have the above values. The structural elements 12 can also, as shown in FIGS. 5 to 8, be arranged and / or designed. The shell of the cushion 12, which can also extend over the top 2 ', can consist of plastic, rubber or a thin metal foil.

Figures 10 and 11 show a fifth embodiment of the invention, in which the structural elements 15 have undercut side walls 21, 22. The surface 24 with which the structural element 15 is attached to the upper side 2 'is smaller than the bearing surface 23 on which the substrate 7 with its rear side 8 rests. The structural elements 15 can be ausgebil det as ribs that have a length that is greater than the width. The width of the structural element 15 can be less than the height of the structural element 15. In particular, it is provided that the width of the foot region 24 is less than the height of the structural element 15.

The structural elements 15a, 15b, 15c, 15d, 15e and 15f shown in Figure 11 have bearing surfaces 23 which do not run parallel to the top 2 'ver. The structural elements 15a to 15f can tilt ver due to their elasticity, so that the bearing surfaces 23 can nestle against the back 8 in surface contact. The structural elements 15 s can also be compressible. The deformation of the structural elements 15 takes place elastically, so that they can deform back into their original shape after the substrate 7 has been removed.

The sixth embodiment shown in Figures 12 and 13 shows structural elements 13 in the form of threads, columns, bristles or hair. The structural elements 13 have an elongated shape. Their diameter is small shorter than their length. The length of the structural element, which defines the height H, is preferably at least ten times greater than a circle-equivalent diameter of a cross-section of the structural element 13. The structural elements 13 preferably have a constant cross-section over their entire length. Similar to the structural elements shown in FIG. 11, the bristle-like or hair-like structural elements 13 can bend. The bending takes place against an elastic restoring force. FIG. 12 shows the structural elements 13 in the unloaded state in that they essentially extend in a straight line parallel to the surface normal of the upper side 2 '. If a substrate 7 is placed on these thread-like structural elements 13, the structural elements 13 react like spring bars and bend so that the surface areas of the structural elements 13 adjoining the free ends nestle against the underside 8.

In embodiments not shown, the columnar structural elements 13 can also from the outset, d. H. in a state not acted upon by the substrate 7 have an inclination with respect to the surface normal of the upper side 2 '. The structural elements 13 can thus be bars extending obliquely to the surface normal. These bars can run parallel to one another. But you can also be at an angle to each other, for example, be designed in pairs V-shaped. They can be connected to the upper side 2 'via adhesives. But you can also protrude from a fastening film that is connected to the top 2 '. It can also be provided that these structural elements 13 extend over the entire extension surface of the upper side 2 '. The structural elements 13 can, however, also extend only over one edge of an area which carries the substrate 7.

While the structural elements 11, 13, 15 described above are attached directly and at a distance from one another on the top 2 ', this shows The seventh exemplary embodiment shown in FIG. 14 is a variant. The structural elements can also protrude from a base film. The structural elements can thus protrude as projections 14 from a base film and be connected to the base film in a uniform manner.

In the embodiment shown in Figure 14, the structural elements 14 are formed by knob-like projections, the dimensions of which correspond to those of the structural elements described above. The underside of a mat 25, of which the projections 14 are formed from the same material, is suitably connected, for example glued, to the upper side 2 'over its entire surface. An electrostatic connection can also be provided. A gas feed line 16 can open into spaces 20 between two projections 14 in order to feed a temperature gas into the spaces 20.

In the exemplary embodiments described above, the rear side 8 of the substrate 7 is acted upon at points by the support surfaces 23 of structural elements 11, 13, 14, 15 which are spaced apart from one another. The structural elements 11, 13, 14, 15 act on the rear side 8, in particular also at the bulged zones 8 ', so that there is solid body contact for heat conduction there as well. In the spaces 20 between the structural elements 11, 13, 14, 15, the heat is transported by conduction through the gas, which can be fed in through the gas supply line 16 or which is already in the process chamber.

In the eighth exemplary embodiment of the invention shown in FIG. 15, a continuous surface of the substrate support 10 rests on the rear side 8 and in particular on the bulged zones 8 '. The substrate support 10 is here by a foam body 26, in particular by an open thin line foam body 26 formed. The foam body 26 can be made of an elastic material, for example a rubber or a plastic. It can consist of the same material as the structural elements 11, 13, 14, 15 described above, for example PET or PE. Unlike there, however, the foam body 26 has cavities which are preferably open to the environment so that a gas exchange can take place.

In the ninth embodiment of the invention shown in FIG. 16, a continuous surface of the substrate support 10 also rests flat against the rear side 8 of the substrate 7 and in particular against the surface of the bulged zone 8 '. The substrate support 10 is formed here by a gel body 27, which is essentially a cushion. A sleeve 28 made of a flexible material, for example a synthetic material or rubber or else a metal foil, surrounds a cavity which is filled with a gel 29.

The above explanations serve to explain the inventions covered by the application as a whole, which also develop the state of the art independently at least through the following combinations of features, whereby two, more or all of these combinations of features can also be combined, namely:

A substrate holder, which is characterized by an elastically deformable substrate support 10 which is arranged on the upper side 2 'and which comes into contact with the surface of the rear side 8, 8' due to an elastic deformation.

A substrate holder, which is characterized in that the substrate support 10 has structural elements 11, 12, 13, 14, 15 and / or that of the Structural elements 11, 12, 13, 14, 15 formed by substrate support 10 are arranged only on the edge of the area of top 2 'covered by substrate 7 and / or that structural elements 11, 12, formed by substrate support 10,

13, 14, 15 are distributed regularly and in a uniform arrangement over the upper side 2 ', so that the structural elements 11, 12, 13, 14, 15 essentially rest evenly on the entire rear side 8, 8' of the substrate 7 and / or that the Structural elements 11 to 15 are made of plastic, PET, PE or of metal, metal threads or thin metal foils and / or that the substrate support 10 is a one-part or multi-part body 25 extending over the entire surface of the upper side 2 ′ covered by the substrate 7 , 27 and / or that the substrate support 10 is formed by a mat 25 forming projections 14 or a foam body 26.

A substrate holder, which is characterized in that the structural elements 11, 12, 13, 14, 15 are spaced from one another and / or that a temperature gas passes through the intermediate spaces 20 between the structural elements 11, 12, 13, 14, 15 can and / or that at least one gas line 16 opens into at least one intermediate space 20 between structural elements 11, 12, 13, 14, 15 or in an area of the upper side 2 ′ surrounding by structural elements 11, 12, 13, 14, 15 and / or that the structural elements 11,

12. 13. 14. 15 are designed as columns, fibers 13 or webs 14, 15, which can bend due to their elasticity and / or due to their cross-sectional area and their height H measured in the direction of the surface normal of the substrate support surface, and / or the have a length L that is greater than 0.2 mm, greater than 0.5 mm, greater than 1 mm, greater than 2 mm, greater than 5 mm and less than 20 mm and / or that the length L of the structural elements

11. 12. 13. 14. 15 is in the range between 0.5 mm and 2 mm. A substrate holder, which is characterized in that at least some, preferably all of the structural elements 11, 12, 13, 14, 15 are designed as a cushion 12, the cushion 12 having a cover 18, 28 which has a volume 19, 27, which is filled with a liquid or gaseous medium and / or into which a liquid or gaseous medium can flow and / or through which a liquid or gaseous medium can flow.

A substrate holder, which is characterized in that holding means 30 are provided with which the substrate 7 is held mechanically, electrostatically, pneumatically and / or magnetically on the substrate holder 2 and / or that for holding the substrate 7 at least one on the The mask 31 resting on the edge of the substrate 7 is used and / or that the substrate holder 2 is a heat sink, wherein a cooling device 6 is provided which removes the heat carried away from the substrate 7.

A substrate holder, which is characterized in that the height H of the structural elements 11, 12, 13, 14, 15 measured in the direction of the surface normal to the upper side 2 'is greater than 5 μm, greater than 10 μm, greater than 50 gm, greater than 100 gm, greater than 1 mm but smaller than 5 mm and / or that the height H of the structural elements 11, 12, 13, 14, 15 is between 50 gm and 1 mm.

A substrate holder, which is characterized in that the structural elements 11, 12, 13, 14, 15 have a length L or width B measured in the direction of the surface extension of the upper side 2 ', which is greater than 50 mm, smaller than 5 mm or less than 1 mm and / or that the area of the structural elements 11, 12, 13, 14, 15 measured in the area extension of the upper side 2 'is less than 50 mm ² and / or that at least one extends in the direction of the Area normal to the top 2 'extending side wall 21, 22 of a structure element 15 is undercut and / or that the structural elements 15 in egg nem foot area 24, where they adjoin the top 2 ', have a smaller cross-sectional area than in a head area 23, where they rest on the rear side 8 of the substrate 7.

A substrate treatment process, which is characterized in that a substrate holder 2 is used, which is designed according to one of the preceding claims.

A substrate treatment process, which is characterized in that a temperature control gas is fed into the spaces 20 between the structural elements 11, 12, 13, 14, 15 and / or that in the volumes 19, 27 of the structural elements 11, 12 , 13, 14, 15 a gaseous or liquid medium is fed in and / or that a into the volume 12,

29 of the cushions or the intermediate spaces 20 has temperature control gas fed in at a higher pressure than the gas pressure in a process chamber 5 above the front side 9 of the substrate 7.

A substrate treatment process, which is characterized in that the gas fed into the spaces 20 or into the volume of the cushions 12, 27 is nitrogen, argon, neon, krypton, xenon, hydrogen or helium or at least 90 percent of one or consists of several of these gases and / or that the substrate 7 is made of glass, silicon, polyamide or plastic and the treatment process is an OVPD process and / or that the substrates 7 have an area greater than 0.15 m ² , greater than 1 m ² or greater than 2 m ² .

A device which is characterized by a substrate holder 2 according to one of Claims 1 to 6. All the features disclosed are essential to the invention (individually, but also in combination with one another). In the disclosure of the application, the disclosure content of the associated / attached priority documents (copy of the previous application) is hereby fully included, also for the purpose of including features of these documents in the claims of the present application. The subclaims characterize, even without the features of a referenced claim, with their features independent inventive developments of the prior art, in particular in order to make divisional applications on the basis of these claims. The invention specified in each claim can additionally have one or more of the features provided in the above description, in particular provided with reference numbers and / or specified in the list of reference numbers. The invention also relates to design forms in which some of the features mentioned in the above description are not implemented, in particular if they are recognizable for the respective purpose or can be replaced by other technically equivalent means.

List of reference signs

1 substrate treatment device 17 cavity device, reactor 18 shell

2 substrate holders 19 volumes

2 'top 20 gap

3 gas inlet element 21 side wall

3 'gas outlet opening 22 side wall

4 gas supply line 23 support surface

5 process chamber 24 feet, foot area

6 cooling device 25 mat

7 substrate 26 foam body

8 back 27 volume, gel body

8 'bulged zone 28 envelope

9 front 29 gel

10 substrate support 30 holding means

11 structural element, elastic 31 mask

body

12 structural element, cushion

13 Structural element, fiber, column

14 structural element, protrusion

15 structural element, rib B width

15a structural element H height

15b structural element L length

15c structural element

15d structural element

15e structural element

15f structural element

16 gas supply line

Claims

Expectations

A method for treating a substrate (1) on a top side (2 ') that can be tempered by heat supply or heat dissipation, with a back surface (8) of the substrate (1) facing the top side (2') having at least one uneven or curved zone (8 ') and the rear surface (8) rests on elastically deformable structural elements (11, 12, 13, 14, 15) which arise from the upper side (2'), between which spaces (20) lie and which are in contact with the rear surface (8) rest, is supported, characterized in that a temperature control gas is fed into the spaces (20), which flows between the top (2 ') and the back surface (8) through the spaces (20) and heat between the back surface (8) and Top (2 ') transported.

A method according to claim 1, characterized in that the gas fed into the spaces (20) consists of nitrogen, argon, neon, krypton, xenon, hydrogen or helium or at least 90% of one of these gases and / or that this into the spaces (20) fed gas dominates the heat transport between the rear surface (8) and the upper side (2 ').

Substrate holder (2) for use in a substrate treatment device (1), for carrying out the method specified in claims 1 and 2, with an upper side (2 ') which can be tempered by supplying or dissipating heat, the elastically deformable structural elements (11, 12, 13, 14, 15), between which there are spaces (20) and on which the substrate (1) can be supported with its rear surface (8), characterized in that at least one gas line (16 ) opens, with which a temperature gas in such a way in the Interstices (20) can be fed in such that the temperature control gas flows through the interstices (20) in order to transport heat between the rear surface (8) and the upper side (2 ').

Substrate holder (2) with an upper side (2 ') which can be tem perated by heat supply or heat removal, on which an elastically deformable substrate support (10) is arranged, which due to an elastic deformation in touching contact with a non-planar rear surface of a substrate (1 ), characterized in that the substrate support (10) is formed by a mat (25) forming structural elements (14) or a foam body (26), the structural elements (14) being projections carrying the substrate, or that the substrate support ( 10) is designed as a cushion (12) which has a cover (18, 28) which defines a volume (19, 27) which is filled with a liquid or gaseous medium or can flow into the liquid or gaseous medium and / or through which a liquid or gaseous medium can flow.

Substrate holder according to one of the preceding claims, characterized in that the structural elements (11, 12, 13, 14, 15) are arranged only on the edge of the area of the upper side (2 ') covered by the substrate (7).

Substrate holder according to one of the preceding claims, characterized in that structure elements (11, 12, 13, 14, 15) formed by the substrate support (10) are distributed regularly and in a uniform arrangement over the upper side (2 '), so that the structure elements (11, 12, 13, 14, 15) essentially rest evenly on the entire rear side (8, 8 ') of the substrate (7).

7. Substrate holder according to one of the preceding claims, characterized in that the structural elements (11 to 15) are made of plastic, PET, PE or of metal, metal threads or thin metal foils.

8. Substrate holder according to one of the preceding claims, characterized in that the structural elements (11, 12, 13, 14, 15) are designed as columns, fibers (13) or webs (14, 15), which are due to their Elasticity and / or can bend due to their cross-sectional area and their height (H) measured in the direction of the surface normal of the substrate support surface. 9. Substrate holder according to one of the preceding claims, characterized in that the structural elements (11, 12, 13, 14, 15) have a length (L) which is greater than 0.2 mm, greater than 0.5 mm, greater than 1 mm, larger than 2 mm, larger than 5 mm and smaller than 20 mm and / or that the length (L) of the structural elements (11, 12, 13, 14, 15) in the range between 0.5 mm and 2 mm.

10. Substrate holder according to one of the preceding claims, characterized in that holding means (30) are provided with which the sub strate (7) is held mechanically, electrostatically, pneumatically and / or magnetically on the substrate holder (2). 11. Substrate holder according to one of the preceding claims, characterized in that a mask (31) resting at least on the edge of the substrate (7) is used to hold the substrate (7).

12. Substrate holder according to one of the preceding claims, characterized in that the substrate holder (2) is a heat sink, wherein cooling device (6) is provided which transports the heat dissipated from the substrate (7).

13. Substrate holder according to one of the preceding claims, characterized in that the height (H) of the structural elements (11, 12, 13, 14, 15) measured in the direction of the surface normal to the upper side (2 ') is greater than

5 gm, greater than 10 gm, greater than 50 gm, greater than 100 gm, greater than 1 mm but less than 5 mm and / or that the height (H) of the structural elements (11, 12, 13, 14, 15) is between 50 gm and 1 mm.

14. Substrate holder according to one of the preceding claims, characterized in that the structural elements (11, 12, 13, 14, 15) have a catch (F) or width (B) measured in the direction of the surface extension of the upper side (2 ') which is larger than 50 mm, smaller than 5 mm or smaller than 1 mm and / or that the area of the structural elements (11, 12, 13, 14, 15) measured in the surface extension of the top (2 ') is smaller than 50 mm ² and / or that at least one side wall (21, 22) of a structural element (15) extending in the direction of the surfaces normal to the upper side (2 ') is undercut and / or that the structural elements (15) are in a foot area (24), where they adjoin the upper side (2 '), have a smaller cross-sectional area than in a head region (23), where they lie against the rear side (8) of the substrate (7).

15. A method for treating a substrate (1), in which an upper side (2 ') of a substrate holder (2), which carries a substrate (7) which is being treated, is tempered by supplying or dissipating heat in such a way that heat is exchanged between the substrate and substrate holder (2) takes place, the surface of the rear side (8) of the substrate (7) facing the upper side (2 ') and extending in a plane at least one uneven surface or has a zone (8 ') bulging out of the plane, characterized in that a substrate holder (2) is used which is designed according to one of claims 3 to 15.

16. The method for manufacturing OLEDs according to claim 1 or 15, characterized in that the substrate is larger than 1 m ² and the height of the

Structural elements between 50 gm and 1 mm or that the height of the structural elements is in a range between 50 gm and 100 gm.

17. The method according to claim 16, characterized in that a gaseous or liquid medium is fed into the volume (19, 27) of the structural elements (11, 12, 13, 14, 15) designed as cushions and / or that a into the Volume (12, 29) of the cushions or the spaces (20) fed temperature gas has a higher pressure than the gas pressure in a process chamber (5) on the front side (9) of the Substra tes (7). 18. The method according to any one of claims 1 or 15 to 17, characterized in that the in the spaces (20) or in the volume of the cushions (12, 27) fed gas nitrogen, argon, neon, krypton, xenon, hydrogen or Helium or at least 90 percent of one or more of these gases and / or that the substrate (7) consists of glass, silicon, polyamide or plastic and the treatment process is an OVPD process and / or that the substrates (7) are Has an area of greater than 0.15 m ² , greater than 1 m ² or greater than 2 m ² .

19. Device or method, characterized by one or more of the characterizing features of one of the preceding claims.