TW202145433A - Substrate holder having an elastic substrate support - Google Patents

Abstract

The invention relates to a substrate holder (2) for use in a substrate handling apparatus (1), having a top side (2') which can be temperature-controlled by the supply or discharge of heat, which top side carries a substrate (7) during substrate handling, the rear side (8) of which substrate extends in a plane parallel to the top side (2') and points toward the top side (2'), wherein the surface of the rear side (8) has at least one zone (8') which is uneven or which bulges out of a plane, and an apparatus for carrying out a substrate handling process by means of such a substrate holder (2). In order to ensure uniform heating of the substrate (7), a resiliently deformable substrate support (10) arranged on the top side (2') is provided which, as a result of a resilient deformation, comes into contact with the surface of the rear side (8, 8'). The substrate support (10) can be formed by a plurality of resilient structural elements (11, 12, 13, 14, 15).

Description

Substrate Rack with Flexible Substrate Holder

The invention relates to a substrate rack for use in a substrate processing apparatus, having a top side that can be tempered by heating or cooling, which carries substrates in a plane parallel to the top side during substrate processing The extended backside faces the topside, wherein the surface of the backside has at least one region that is uneven or arched from a plane.

The present invention also relates to a substrate processing process, wherein a substrate is provided on the top side of a substrate holder, and the temperature of the substrate is regulated by the substrate holder. The substrate can be cooled or heated. During this process, a sequence of layers or a single layer may be deposited on the chamber-facing surface of the substrate. This can be done by feeding steam or gas into the process chamber, for which gas inlet means are provided. Areas of the surface of the layer or substrate can also be removed, eg by feeding an etching gas into the process chamber. The substrate processing process is in particular a method for producing the layers required for OLEDs on substrates, especially glass substrates. Layer deposition is also a polymerization process.

The present invention also relates to a substrate processing apparatus in which a substrate is provided on the top side of a substrate holder. The substrate rack may have a temperature regulating device, eg a heating device or a cooling device, for heating or cooling the top side of the substrate rack carrying the substrates. A process chamber extends between the top side of the substrate rack and the gas inlet member through which steam or gas can be fed into the process chamber. The gas inlet member may have the shape of a shower head. The carrier gas can deliver the vapor or reaction gas into the process chamber through a plurality of exhaust channels provided in the exhaust surface of the gas inlet member. The substrate processing apparatus may also have a gas outlet member, at least the carrier gas can be discharged from the process chamber through the gas outlet member.

DE 10 2011 078 673 A1 discloses a method and an apparatus for the vacuum treatment of substrates, in which a plurality of layers protrude from the substrate, which carry the substrate.

US 5,605,574 A describes a substrate holder on which a plurality of pleated bellows-like spacer elements are provided, which carry the substrates.

JP 2003-239070 A describes a substrate holder supported on elastic structural elements.

A device is described in JP 2006-190805, which includes a holding device for holding a substrate on a substrate holder. US 5,199,483 discloses a device for holding a substrate by means of which the substrate is cooled.

WO 2006/036992 A1 describes a method for cooling a substrate resting on the top side of a substrate holder.

WO 2006/061784A1 and US 2010/0247804A1 also disclose devices for holding substrates on cooled substrate holders.

US 2016/0376697A1 also belongs to the prior art. In DE 10 2015 118 765 A1 an apparatus for depositing OLEDs using a shower head and a cooled substrate holder is described.

In the case of the conventional substrate processing methods described, for example, in the last-mentioned DE 10 2015 118 765 A1, the substrate to be processed, which may be a glass substrate or a plastic substrate, rests with its rear side against the cooled substrate holder. on the top side. Through the heated gas inlet member, the vapor previously generated, for example by evaporating the supplied aerosol, is fed into the process chamber of the processing device. The temperature of the gas inlet member is higher than the condensation temperature of the steam. The top side of the carrier substrate is cooled to a temperature well below the condensation temperature of the vapor by means of a cooling device located in the substrate holder. By continuously dissipating heat through the gap between the backside of the substrate and the top side of the substrate frame, the front side of the substrate facing the process chamber is adjusted to a temperature at which the vapor condenses on the front side, thereby depositing layers, particularly is the organic layer. Several layers can be deposited successively, which have mutually different layer compositions. This operation can be structured through a mask. The backside of the substrate resting on the top side of the substrate holder extends substantially in a plane. But at least in some areas, the surface of the backside differs from the exact mathematical plane. These deviations are due on the one hand to the natural roughness of the surface of the backside, but also to manufacturing tolerances on the other hand. The unevenness of the surface on the back side may also be an area that is arched from the plane. If such a substrate rests on the top side of the substrate holder, which is also only approximately flat, only point contact occurs between the backside of the substrate and the top side of the substrate holder. Heat transport occurs directly through the contact of the two solids only at these contact points. In the region between the contact points, heat transport occurs either by radiation or by thermal conduction through the gas existing in the space between the backside of the substrate and the topside of the substrate holder. The heat flow through this space is affected by the pressure of the gas, the height of the gap, and the molar mass of the gas. Among them, the relevant parameter is the mean free path of gas molecules or the Knudsen number. The front side of the substrate to be coated has a non-uniform lateral temperature profile due to local differences in the heat flow from the substrate to the substrate holder.

An object of the present invention is to provide means for uniformizing the lateral temperature profile of the front side of the substrate.

The object of the present invention is, in particular, to provide a device and a method for depositing OLEDs in which the layer quality has the greatest possible lateral uniformity.

The solution of the present invention to achieve the above object is the invention given in the scope of the patent application. The accessory is not only an advantageous improvement of the invention given in the concurrent claim, but also an independent solution to this purpose.

The invention proposes that the substrate is not directly on the top side of the substrate holder. A substrate holder is provided between the top side of the substrate holder and the back side of the substrate. The substrate holder is configured to abut against the surface of the backside in contact due to elastic deformation. Therefore, the substrate holder can be composed of one main body, but also several main bodies, which realize the heat flow between the substrate holder and the substrate, wherein the substrate holder is preferably a cooling body, and the heat flows from the substrate through the spaced area Heretofore, the cooling body, wherein the base plate holder is arranged in the spaced region. The following solution can be adopted: The substrate holder has one or several structural elements. These structural elements may be elastomers, which are capable of bending and/or compression. The structural elements can be arranged on the top side over the entire surface. However, the structural elements can also be arranged only partially on the top side. There may be spaces between the structural elements, which are filled with gas. But it is also possible to feed gas into these spaces. Furthermore, it is possible to use the solution that the structural elements are only arranged on the edge of the area of the top side which is covered by the substrate. Therefore, the following solution can be adopted: the structural elements only carry the edge of the substrate. If there are gaps or spaces between the structural elements, or if the structural elements are only arranged on the edges of the substrate, the temperature-controlling gas can be fed into this space starting from the substrate holder. In this case, especially in the region of the space, heat transport from the substrate to the substrate holder is achieved by heat conduction through the gas fed into the space. A gas delivery line may be provided which leads from the substrate holder into the space. Through this conveying line it is possible to feed the tempering gas into the space between the back side of the substrate, the top side of the substrate holder and the side walls of the structural element. The tempering gas may flow through the space, or may flow through several spaces. Structural elements arranged along the edge of the substrate can form a labyrinth seal with their spaces. The labyrinth seal thereby isolates the inner region from the surrounding environment. The tempering gas can be nitrogen, argon, neon, krypton, xenon, hydrogen or helium. The tempering gas can also be a mixture, wherein in particular the following solution is used: at least 90 percent of the mixture consists of one or more of the aforementioned gases. However, the structural elements can also be arranged uniformly distributed over the entire surface of the top side of the substrate holder. The structural elements may be arranged within the confines of the top side in a geometrically regular or statistically uniform manner. The structural elements may have uniform dimensions. The structural elements may also have a uniform configuration. For example, the structural elements may form elongated strips, ribs or cube-shaped blocks. The structural elements may have side walls extending parallel to each other. However, the structural elements can also have undercut side walls, so that the basic contour of the foot area of the structural element for fixing on the top side of the substrate holder is smaller than the head area forming the bearing surface, the back side of the substrate being supported on the support surface. The tempering gas can be fed into the space between the structural elements.

The tempering gas can be fed into the space at an overpressure of, for example, 2 mbar, 5 mbar above the process chamber pressure. The overpressure is preferably less than 1 mbar. However, it can also be less than 5 mbar. The process chamber pressure can fall in the range between 1 mbar and 5 mbar. But it can also fall in the range between 0.5 mbar and 1 mbar. In particular, the process chamber pressure can be less than 1 mbar or 0.5 mbar. In order to prevent the substrate from being lifted due to the higher pressure in the intermediate region, a holding member is provided. Such a holding member may act mechanically, for example, a mask may rest on the substrate, the weight of which provides the force. However, it is also possible to use a magnetic or electrostatic force to hold the substrate. However, as an alternative to the respective structural elements, eg directly applied (eg glued) to the surface of the substrate holder, especially the metal surface, the substrate holder can also consist of one or several bodies with several projections, which bodies are applied on the on the top side of the substrate holder. In particular, the following solution is used: such a body is a pad with a projection facing away from the top side. These protrusions are elastically deformable, eg bendable and/or compressible. However, the following solutions can also be adopted: the substrate support is composed of one or more foams or bodies that can be compressed in other ways. Such a main body has two surfaces facing away from each other, which can be in close contact with the surface of the top side of the substrate holder or the surface of the back side of the substrate. The body may be an open cell foam. Glass, silicon, but also aluminium oxide or aluminium, copper, titanium or another metal are used as substrates. The substrate can also be plastic, polyamide, especially transparent plastic. The substrate may have a planar extension in ^{excess of 0.15 m 2 .} The substrate can also be larger than 1 m ² or larger than 2 m ² . The structural elements can also be fibers or thin posts that can be bent. Such structural elements protrude from the top side of the substrate holder like fluff or bristles. A structural element with such flexibility is capable of bending under force to carry the substrate by its sidewalls. The height of these structural elements is preferably only slightly greater than the maximum unevenness of the backside of the substrate. However, the height of the structural elements can also be greater. The height of the structural elements may be greater than 5 μm, greater than 10 μm, greater than 50 μm, greater than 100 μm or greater than 1 mm. However, the height of structural elements should be less than 5 mm. According to a preferred technical solution, the height of the structural elements is between 50 μm and 1 mm. The height is preferably about 50 μm to 100 μm. The lateral extension of the structural element may be less than its height. In particular, when the structural elements are constructed as columns or fibers, such as fluff or bristles, the circle-equivalent diameter of their cross-section is at most one tenth of their height. Typical lateral dimensions of structural elements are less than 5 cm or less than 1 mm. However, the horizontal dimension can also be larger than 5 cm. The structural element may have a length of, for example, greater than 0.2 mm, greater than 0.5 mm, greater than 1 mm, greater than 2 mm or greater than 5 mm. In particular, the following scheme is used: the maximum length of the structural elements is 20 mm. The area occupied by the structural elements may be less than 50 mm ² . The width of the structural elements can be greater than 5 mm or less than 1 mm. These structural elements may also have cavities. These structural elements can in particular be constructed as mats. This structural element has an elastic wrap. A gas can be fed into the volume enclosed by the wrap, the gas imparting elasticity to the cushion. The gas fed into the volume can also be a tempering gas, which imparts thermal conductivity to the mat. The following approach may be employed: The tempering gas is allowed to flow through the mat during the treatment process. In this case, the volume has incoming and outgoing lines. However, a tempering liquid can also be fed into the volume. The following scheme can also be used: The volume is closed. The pad can also be a gel pad with a thermally conductive gel in its volume. The following scheme can be used: the substrate is on a single pad, eg a gel pad. In this case, the substrate holder consists of a gel pad. However, the following solution can also be used: the substrate holder is composed of several pads, especially gel pads. In particular, it is possible to use the solution that the top side of the substrate holder is completely, ie 100 percent, provided with the substrate holder, and in particular with the structural elements formed by the substrate holder. However, it is also possible to use the following scheme: at least 90%, 10%, 3% or 1% of the part is provided with structural elements.

The tempering gas fed into the volume of the mat or into the space between the structural elements preferably has a high thermal conductivity so as to dominate the heat transport between the substrate and the substrate holder. With the structural element of the present invention, it is possible to realize that most of the heat transport is not carried out through the contact surface between the backside surface of the substrate and the structural element, but substantially through the temperature-adjusting gas that fills the space. Therefore, the following solution can be adopted: the structural elements and the temperature-adjusting gas have specific thermal conductivity properties, so that the heat flow through the temperature-adjusting gas is greater than the total heat flow through all the structural elements. The cross-sections of the structural elements are preferably proportional to the cross-sections of the spaces such that the sum of the cross-sections of all the structural elements is much smaller than the sum of the cross-sections of all the spaces.

Figure 1 shows an OVPD reactor well known in the prior art. This OVPD reactor has a casing 1 which is airtight with respect to the outside. In the housing 1 there is provided a gas inlet member 3 which has the shape of a shower head. The gas inlet member 3 has a substantially rectangular basic profile and has several exhaust ports 3 ′ on the exhaust surface facing the process chamber 5 . The vapor of the organic starting material can be fed into the volume of the gas inlet member 3 through the gas delivery line 4 . This is done with carrier gas. The steam is generated in advance in an evaporator, not shown, by, for example, converting the organic powder sent to the evaporator as an aerosol into the form of steam by supplying heat in the evaporator. The exhaust side of the gas inlet member 3 is heated. The exhaust surface is heated to a temperature above the condensation temperature of the steam.

The bottom of the process chamber 5 is formed by the top side 2 ′ of the substrate rack 2 . The substrate holder 2 is generally constituted by a cooling body. The cooling body has cooling means 6, which can be cooling channels through which a liquid cooling medium can flow. The substrate to be coated is arranged on the top side 2 ′ of the substrate holder 2 . The substrate has a front side 9 which faces the process chamber 5 and which is coated with organic vapor by condensing the vapor on the front side 9 . For this, heat needs to be extracted from the substrate 7 . This is achieved by the substrate holder 2 .

According to the invention, between the back side 8 of the substrate 7 and the top side 2 ′ of the substrate holder 2 , a substrate holder, indicated by the reference numeral 10 in FIG. 2 , is provided. The function according to the invention of the substrate holder 10 will be explained with reference to FIG. 3 , which shows a device corresponding to FIG. 1 in which the back side 8 of the substrate 7 rests directly on the top side 2 ′ of the substrate holder 2 . The back side 8 extends approximately in a plane. However, it has unevenness, such as the dome 8'. These unevennesses result in only point contact of the backside with the also non-ideally planar topside 2'. The heat transport from the substrate 7 to the substrate holder 2 takes place by solid contact only at the contact points. In the intermediate region, the heat transport from the substrate to the substrate holder 2 is effected substantially by heat conduction by means of the gas located in the space.

Unlike the situation in the prior art as shown in FIG. 3 , according to the invention an elastic medium in the form of a substrate holder 10 is provided between the back side 8 and the top side 2 ′ of the substrate 7 . The unevenness 8' is compensated for by this elastic medium. This homogenizes the heat transport from the substrate 7 to the substrate rack 2 .

Reference numeral 30 denotes holding members, such as electrostatic or electromagnetic holding members, by means of which a force is applied to the substrate 7 , which force acts in the direction of the surface normal of the top side 2 ′ and is applied to the substrate 7 towards the substrate holder 2 force, so that the substrate holder 10 is deformed. In other embodiments, the holding member 30 also has the function of holding the substrate 7 against the pressure of the tempering gas fed into the chamber under the substrate 7 . Reference numeral 31 designates a mask, for example made of metal, which rests on the substrate in order to structure the substrate. Only the mask 31 is shown in FIG. 1 . Furthermore, the mask 31 provides the mass by means of which the substrate is forced towards the top side 2 ′, thereby realizing the gravitational force causing the deformation of the substrate holder 10 , but it is also located between the top side 2 ′ and the back side 8 against feeding The substrate 7 is maintained by the pressure of the temperature-adjusting gas in the space.

Figures 4, 5 and 6 show a first embodiment of the present invention, wherein the structural elements 11 are provided only along the edges of the area covered by the substrate 7 of the top side 2' of the substrate holder. The structural elements can be elongated elastomers, for example, made of plastic, but also of metal or another suitable material. The structural elements 11 are arranged along the edge such that a space 20 is left between adjacent structural elements 11 . The structural elements 11 are staggered with respect to each other with a gap, so as to form a labyrinth seal with respect to the inner cavity surrounded by the structural elements 11 . When the base plate 7 rests on the structural element, a cavity 17 is formed between the rear side 8 and the top side 2 ′. A tempered gas can be fed into this cavity 17 . For this purpose, a gas feed line 16 is provided, which communicates with the top side 2'. The tempering gas causes heat conduction from the substrate 7 to the substrate holder 2 . The distance between the backside 8 and the topside 2' may fall in the range between 5 μm and 1 mm.

In an embodiment not shown, the elongated structural elements 11 (whose length may be at most 5 cm and whose width may be at most 1 mm) may be arranged in a uniformly distributed manner over the entire top side 2' . The spaces between the structural elements 11 may communicate with the gas delivery line 16 . In order to hold the substrate against the temperature-conditioning gas pressure higher than the ambient pressure, the aforementioned holding member 30 can be used. The overpressure of the tempering gas can be from 0.5 mbar to 1 mbar.

In the second embodiment shown in FIG. 7 , the structural elements 11 have a substantially square basic contour and are arranged uniformly at least in the area of the top side 2 ′ of the substrate holder 2 covered by the substrate 7 . The structural elements 11 are uniformly distributed within the area of the top side 2' in a regular arrangement. However, it can also be distributed irregularly. However, it can also be distributed irregularly and statistically uniformly over the area of the top side 2'. Its basic outline can also be circular, oval or rectangular. The contour can also extend arbitrarily.

The third embodiment shown in FIG. 8 shows a gas delivery line 16 which communicates directly with the edge of the central free surface, which is delimited by structural elements 11 in a multi-row layout. The structural element 11 here has side walls 21 , 22 extending parallel to each other and has a width B which lies in the range between 1 mm and 5 mm. The structural elements have a length L, which falls in the range between 1 mm and 50 mm. The distance A between two adjacent structural elements 11 may be equal to the size of the height H. However, the distance A can also be larger or smaller than the height H. The dimensions of the support surface 23 on which the back side 8 of the base plate 7 is supported may be less than 50 mm ² . Here, the structural element 11 may be composed of elastic solids, which are made of rubber, plastic or another elastic material. The volume of the structural element is completely filled with the material.

FIG. 9 shows a fourth embodiment of the present invention, wherein the structural element 12 has a cavity 19 . The structural element 12 is constructed as a cushion and has a flexible wrap 18 . Wrap 18 forms side walls 21 , 22 and support surface 23 . In this embodiment, the cushion 12 is open towards the top side 2'. The wrapping is connected to the top side 2' with an edge, eg by an adhesive connection. The volume 19 of the wrap 18 is in communication with a gas delivery line 16 for feeding tempering gas into the wrap. In a not shown embodiment, the chamber 19 of the structural element 12 communicates not only with the gas supply line 16 but also with the exhaust line, so that the temperature-adjusting gas can flow through the chamber 19 . The width B, the height H, and the distance between the adjacent structural elements 12 may have the above-mentioned values. The structural elements 12 may also be arranged and/or constructed as shown in FIGS. 5-8 . The wrapping of the cushion 12, which also extends within the range of the top side 2', may consist of plastic, rubber or thin metal foil.

Figures 10 and 11 show a fifth embodiment of the present invention, wherein the structural element 15 has undercut side walls 21, 22. The surface 24 for fixing the structural element 15 on the top side 2 ′ is smaller than the bearing surface 23 on which the base plate 7 rests with its rear side 8 . The structural elements 15 can be constructed as ribs, the length of which is greater than the width. The width of the structural element 15 may be smaller than the height of the structural element 15 . In particular, the following solution is adopted: the width of the foot region 24 is smaller than the height of the structural element 15 .

The structural elements 15a, 15b, 15c, 15d, 15e and 15f shown in Fig. 11 have bearing surfaces 23 that do not extend parallel to the top side 2'. The structural elements 15a to 15f can be tilted due to their elasticity, so that the support surface 23 can be in surface contact with the rear side 8 . In addition, the structural element 15 may also have compressible properties. The structural elements 15 are elastically deformed so that they can resume their original shape after the substrate 7 is removed.

The sixth embodiment shown in Figures 12 and 13 shows structural elements 13 in the form of yarns, posts, bristles or fluff. The structural element 13 has an elongated shape. Its diameter is smaller than its length. The length of the defined height H of the structural element is preferably at least ten times the equivalent circle diameter of the cross-section of the structural element 13 . The structural element 13 preferably has a constant cross-section over its entire length extension. Similar to the structural elements shown in Figure 11, the bristle or fluff-like structural elements 13 can be bent. Bend in a way that resists elastic restoring forces. FIG. 12 shows the structural elements 13 in an unforced state, wherein the structural elements extend in a straight line substantially parallel to the surface normal of the top side 2 ′. If the base plate 7 is laid on these yarn-like structural elements 13 , the structural elements 13 respond like spring bars and bend, so that the surface area of the structural elements 13 adjoining the free end rests on the bottom side 8 .

In an embodiment not shown, the columnar structural elements 13 may also have an inclination relative to the surface normal of the top side 2 ′ from the beginning, ie, without applying force from the substrate 7 . Accordingly, the structural elements 13 may be rods extending obliquely with respect to the surface normals. The rods may extend parallel to each other. However, they can also be angled to each other, for example in pairs in the shape of a V. The rods can be connected to the top side 2' by means of an adhesive. However, it can also protrude from a fixing foil connected to the top side 2'. The following solution is also possible: the structural elements 13 extend over the entire extension of the top side 2'. However, the structural elements 13 can also extend only in the region of the edge of the carrier substrate 7 .

The aforementioned structural elements 11 , 13 , 15 are fixed directly and at a distance from each other on the top side 2 ′, while the seventh embodiment shown in FIG. 14 discloses a variant. These structural elements can also protrude from the base foil. Accordingly, these structural elements can protrude from the base foil as projections 14 and be connected in one piece with the base foil.

In the embodiment shown in FIG. 14 , the structural element 14 is constituted by a block-shaped protrusion, the size of which corresponds to the aforementioned structural element. The underside of the pad 25, which integrally forms the projection 14, is connected, for example glued, to the top side 2' in a suitable manner over its entire surface. Electrostatic connections can also be used. The space 20 between the two protrusions 14 can be in communication with the gas delivery line 16 for feeding the temperature-regulated gas into the space 20 .

In the aforementioned embodiment, the backside of the substrate 7 is subjected to 8-point force through the supporting surfaces 23 of the structural elements 11 , 13 , 14 , 15 which are spaced apart from each other. The structural elements 11 , 13 , 14 , 15 exert force on the back side 8 , in particular also in the arched region 8 ′, so that a solid contact for heat conduction is also produced there. In the space 20 between the structural elements 11 , 13 , 14 , 15 , heat transport takes place by heat conduction through the gas, which can be fed through the gas delivery line 16 or in the process chamber.

In an eighth embodiment of the invention, shown in FIG. 15 , the continuous surface of the substrate carrier 10 rests on the back side 8 , and in particular on the arched area 8 ′. The substrate holder 10 here consists of a foam 26 , in particular an open-cell foam 26 . The foam body 26 may be composed of an elastic material such as rubber or plastic. The foam can also consist of the same material as the aforementioned structural elements 11 , 13 , 14 , 15 , for example PET or PE. The difference is, however, that the foam 26 has a cavity, which is preferably open to the surrounding environment for gas exchange.

In the ninth embodiment of the invention, shown in FIG. 16 , the continuous surface of the base plate holder 10 likewise rests on the back side 8 of the base plate 7 and, in particular, rests flatly on the surface of the arched region 8 ′ . The substrate holder 10 here consists of a gel body 27 which is approximately a cushion. A wrap 28 composed of a flexible material such as plastic or rubber or metal foil surrounds the cavity, which is filled with gel 29 .

The foregoing embodiments are used to illustrate the inventions contained in the present application as a whole, and these inventions independently constitute improvements over the prior art through at least the following feature combinations, wherein two, several or all of these feature combinations Can also be combined with each other, namely:

A substrate holder is characterized by an elastically deformable substrate holder 10 disposed on the top side 2', which abuts against the surfaces of the back sides 8, 8' due to elastic deformation.

A substrate holder, characterized in that the substrate holder 10 has structural elements 11, 12, 13, 14, 15, and/or the structural elements 11, 12, 13, 14, 15 formed by the substrate holder 10 are arranged only on the top side 2' on the edge of the area covered by the substrate 7 and/or the structural elements 11, 12, 13, 14, 15 formed by the substrate holder 10 are distributed regularly and in a uniform arrangement within the area of the top side 2' , so that the structural elements 11 , 12 , 13 , 14 , 15 are substantially evenly attached to the entire backside 8 , 8 ′ of the substrate 7 , and/or the structural elements 11 to 15 are made of plastic, PET, PE or made of metal, metal wire or thin metal foil, and/or the substrate holder 10 is a one-piece or separate body 25, 27 extending over the entire surface of the top side 2' covered by the substrate 7, and/or the substrate holder 10 It consists of a gasket 25 forming the protrusion 14 or a foam body 26 .

A substrate frame is characterized in that: the structural elements 11, 12, 13, 14, and 15 are spaced apart from each other by a certain distance, and/or the temperature-adjusting gas can pass through between the structural elements 11, 12, 13, 14, and 15. space 20, and/or, at least one space 20 between the structural elements 11, 12, 13, 14, 15 or the area of the top side 2' surrounded by the structural elements 11, 12, 13, 14, 15 and at least one The gas line 16 communicates and/or the structural elements 11, 12, 13, 14, 15 are constructed as posts, fibers 13 or spacers 14, 15, which are due to elasticity and/or due to their cross-section and their bearing surfaces along the substrate can be bent at a height H measured from the surface normal, and/or the structural element has a length L greater than 0.2 mm, greater than 0.5 mm, greater than 1 mm, greater than 2 mm, greater than 5 mm and less than 20 mm, and/or , the length L of the structural elements 11, 12, 13, 14, 15 falls within the range between 0.5 mm and 2 mm.

A substrate rack, characterized in that at least a part, preferably all of the structural elements 11, 12, 13, 14, 15 are constructed as a cushion 12, wherein the cushion 12 has wraps 18, 28, which define a volume 19, 27, The volume is filled with a liquid or gaseous medium and/or a liquid or gaseous medium can flow into the volume and/or the volume can be flowed through by a liquid or gaseous medium.

A substrate holder, characterized in that: there are holding members 30 by which the substrate 7 is mechanically, electrostatically, pneumatically and/or magnetically held on the substrate holder 2, and/or, in order to hold the substrate 7, A shield 31 is used which rests on at least the edge of the substrate 7 and/or the substrate holder 2 is a cooling body, wherein a cooling device 6 is provided which removes the heat dissipated from the substrate 7 .

A substrate frame is characterized in that: the height H of the structural elements 11, 12, 13, 14, 15 measured along the surface normal direction of the top side 2' is greater than 5 μm, greater than 10 μm, greater than 50 μm, greater than 100 μm , greater than 1 mm, but less than 5 mm, and/or the height H of the structural elements 11, 12, 13, 14, 15 is between 50 μm and 1 mm.

A substrate holder, characterized in that the structural elements 11, 12, 13, 14, 15 have a length L or a width B measured along the surface extension direction of the top side 2', which is greater than 50 mm, less than 5 mm or less than 1 mm , and/or the area of the structural elements 11 , 12 , 13 , 14 , 15 measured in the surface extension of the top side 2 ′ is less than 50 mm ² , and/or, at least one of the structural elements 15 along the top side 2 ′ The side walls 21 , 22 extending in the direction of the surface normal are undercut and/or the cross-section of the structural element 15 in the foot region 24 adjoining the top side 2 ′ is smaller than the back side 8 abutting the substrate 7 A cross-section of the head region 23 above.

A substrate processing process is characterized by using the substrate rack 2 constructed according to any one of the preceding claims.

A substrate processing process, characterized in that a temperature-adjusting gas is fed into the space 20 located between the structural elements 11, 12, 13, 14, 15, and/or a gaseous or liquid medium is fed into a space constructed as a cushion The volume 19 , 27 of the structural elements 11 , 12 , 13 , 14 , 15 , and/or the pressure of the tempering gas fed into the volume 19 , 27 of the pad or the space 20 is higher than above the front side 9 of the substrate 7 in the process chamber 5 air pressure.

A substrate processing process, characterized in that: the gas fed into the space 20 or into the volume of the pads 12, 27 is nitrogen, argon, neon, krypton, xenon, hydrogen or helium or at least 90 percent of the same. One or several of the gases are composed, and/or the substrate 7 is composed of glass, silicon, polyamide or plastic and the processing process is an OVPD process, and/or the substrate 7 has a size greater than 0.15 m ² , greater than 1 m ² or faces larger than 2 m ^2.

An apparatus characterized by the substrate holder 2 according to any one of claims 1 to 6.

All disclosed features (either as a single feature or as a combination of features) are essential to the invention. Therefore, the disclosure content of this application also includes all the content disclosed in the related/attached priority file (copy of the previous application), and the features described in these files are also included in the scope of the patent application of this application. The subordinate items describe the features of the improvement scheme of the present invention with respect to the prior art with its features (even if the features of the related claims are not included), and its purpose is mainly to file divisional applications on the basis of these claims. The invention given in each claim may further have one or more of the features given in the preceding description, in particular indicated by symbols and/or given in the description of symbols. The invention also relates to designs in which individual features mentioned in the preceding description are not implemented, in particular features which are not necessary for a specific application or which can be replaced by other technically equivalent components.

1: Substrate processing device, reactor 2: Substrate holder 2': top side 3: Gas inlet components 3': exhaust port 4: Gas delivery line 5: Process room 6: Cooling device 7: Substrate 8: back side 8': Arch area 9: Front side 10: Substrate bracket 11: Structural elements, elastomers 12: Structural elements, cushions 13: Structural elements, fibers, columns 14: Structural elements, protrusions 15: Structural elements, ribs 15a: Structural elements 15b: Structural elements 15c: Structural elements 15d: Structural elements 15e: Structural elements 15f: Structural elements 16: Gas delivery line 17: Cavity 18: Wrapping 19: Volume 20: Space 21: Sidewall 22: Sidewall 23: bearing surface 24: Foot, foot area 25: Padding 26: Foam 27: volume, gel 28: Wrapping 29: Gel 30: Keeping Components 31: Mask A: distance B: width H: height L: length

The embodiments of the present invention will be described in detail below with reference to the accompanying drawings. in: FIG. 1 is a schematic cross-sectional view of a substrate processing apparatus, Fig. 2 is an enlarged view of part II in Fig. 1, Fig. 3 is a partial view corresponding to Fig. 2, but with a configuration according to the prior art, FIG. 4 is a sectional view according to the line IV-IV in FIG. 1 in the form of a top view of the substrate 7 resting on the substrate holder 2, FIG. 5 is a top view similar to FIG. 4 of the substrate holder 2 of the first embodiment, but with the substrate 7 removed, Fig. 6 is a sectional view according to the line VI-VI in Fig. 4, Fig. 7 is a view corresponding to Fig. 5 of the second embodiment, FIG. 8 is a partial perspective view of the top side 2 ′ of the substrate frame 2 including the structural elements 11 according to the third embodiment, Fig. 9 is a sectional view similar to Fig. 6 of the fourth embodiment, Fig. 10 is a perspective view similar to Fig. 8 of the fifth embodiment, FIG. 11 shows different structural elements 15a to 15f of the fifth embodiment, Figure 12 is a view similar to Figure 9 of the sixth embodiment, wherein the structural elements 13 are in the form of yarns, fibers or fluff, Fig. 13 is a view corresponding to Fig. 12, but showing the substrate 7 carried by the structural element 13, FIG. 14 is a view similar to FIG. 9 of the seventh embodiment of the present invention, wherein the structural element 14 is formed by the protrusion of the pad 25, FIG. 15 is a cross-sectional view similar to FIG. 9 of the eighth embodiment, wherein the substrate holder 10 is formed of the foam body 26, and FIG. 16 is a view corresponding to FIG. 15 , wherein the substrate holder 10 is a gel body 27 with a gel 29 provided in the volume of the wrap 28 .

2: Substrate holder

2': top side

6: Cooling device

10: Substrate bracket

11: Structural elements, elastomers

16: Gas delivery line

20: Space

21: Sidewall

22: Sidewall

23: bearing surface

24: Foot, foot area

A: distance

B: width

H: height

L: length

Claims (18)

A method for processing a substrate (7) on a topside (2') that can be tempered by supplying or dissipating heat, wherein the substrate (7) faces the backside surface ( 8) having at least one uneven or arched area (8') from a plane, and the backside surface (8) is supported on elastically deformable structural elements (11, 12, 13, 14, 15) on the top side (2'), the structural elements extend out of the top side (2'), a plurality of spaces (20) are provided between the structural elements and the structural elements contact the backside surface (8), It is characterized in that: a temperature-adjusting gas can be fed into the spaces (20), and the temperature-adjusting gas flows between the top side (2') and the backside surface (8) through the spaces (20), And heat is transported between the backside surface (8) and the topside (2'). The method of claim 1, wherein the gas fed into the spaces (20) is nitrogen, argon, neon, krypton, xenon, hydrogen or helium, or at least 90% by one of these gases Formed, and/or, the gases fed into the spaces (20) dominate the heat transport between the backside surface (8) and the topside (2'). A substrate holder (2) for use in a substrate processing apparatus (1) for carrying out the method described in claims 1 and 2, having a top side (2' that can be temperature-regulated by supplying or dissipating heat) ), a plurality of elastically deformable structural elements (11, 12, 13, 14, 15) protrude from the top side, a plurality of spaces (20) are provided between the structural elements, and the base plate (7) can Supported on the structural elements by means of its backside surface (8), characterized in that the spaces (20) communicate with at least one gas line (16) through which the tempering gas can be passed through The spaces ( 20 ) are fed into the spaces ( 20 ) in a flowing manner, thereby transporting heat between the backside surface ( 8 ) and the top side ( 2 ′). A substrate holder (2) having a top side (2') through which heat supply or heat dissipation can be regulated in temperature, and an elastically deformable substrate holder (10) is arranged on the top side, which can be connected to a substrate (10) due to elastic deformation. 7) The uneven backside surface contact abutment is characterized in that: the substrate support (10) is composed of a gasket (25) forming a plurality of structural elements (14) or a foam (26), wherein , the structural elements (14) are protrusions that carry the substrate, or the substrate holder (10) is constructed as a cushion (12) having a wrap (18, 28) that defines a volume (19) , 27), the volume is filled with a liquid or gaseous medium, or a liquid or gaseous medium can flow into the volume, and/or a liquid or gaseous medium can flow through the volume. A substrate holder as claimed in claim 1, wherein the structural elements (11, 12, 13, 14, 15) are arranged only on the edges of the area of the top side (2') covered by the substrate (7). The substrate holder of claim 1, wherein the structural elements (11, 12, 13, 14, 15) formed by the substrate holder (10) are regularly and uniformly distributed on the top side (2' ), so that the structural elements (11, 12, 13, 14, 15) are approximately evenly abutted on the entire backside (8, 8') of the substrate (7). The substrate holder of claim 1, wherein the structural elements (11 to 15) are made of plastic, PET, PE, or made of metal, metal wire or thin metal foil. The substrate rack of claim 1, wherein the structural elements (11, 12, 13, 14, 15) are constructed as posts, fibers (13) or spacers (14, 15), which can be Curved due to its cross-section and its height (H) measured along the surface normal of the substrate support surface. The substrate rack of claim 1, wherein the structural elements (11, 12, 13, 14, 15) have a length (L) greater than 0.2 mm, greater than 0.5 mm, greater than 1 mm, greater than 2 mm, greater than 5 mm and less than 20 mm, and/or the length (L) of the structural elements (11, 12, 13, 14, 15) falls within the range between 0.5 mm and 2 mm. The substrate rack of claim 1, wherein a plurality of holding members (30) are provided, by means of which the substrate (7) is mechanically, electrostatically, pneumatically and/or magnetically held on the substrate rack (2). )superior. A substrate holder as claimed in claim 1, wherein, in order to hold the substrate (7), a mask (31) is used which at least rests on the edge of the substrate (7). The substrate rack according to claim 1, wherein the substrate rack (2) is a cooling body, wherein a cooling device (6) is provided to transport away the heat derived from the substrate (7). The substrate holder of claim 1, wherein the height (H) of the structural elements (11, 12, 13, 14, 15) measured along the surface normal direction of the top side (2') is greater than 5 μm, greater than 10 μm, greater than 50 μm, greater than 100 μm, greater than 1 mm, but less than 5 mm, and/or the height (H) of the structural elements (11, 12, 13, 14, 15) is between 50 μm and 1 mm between. A substrate holder as claimed in claim 1, wherein the structural elements (11, 12, 13, 14, 15) have a length (L) or a width (B) measured in the direction of extension of the face of the top side (2'), It is greater than 50 mm, less than 5 mm or less than 1 mm, and/or the area of these structural elements (11, 12, 13, 14, 15) measured in the face extension of the top side (2') is less than 50 mm ² , and/or, at least one side wall (21, 22) of these structural elements (15) extending in the direction of the surface normal of the top side (2') is undercut, and/or, these structural elements ( 15) The cross section in the foot region (24) adjoining the top side (2') is smaller than the cross section of the head region (23) resting on the back side (8) of the base plate (7). A method for processing a substrate (7), wherein the temperature of the top side (2') of the substrate holder (2) carrying the substrate (7) to be processed is regulated by heating or dissipating heat, so that the temperature between the substrate and the substrate holder (2) is adjusted. A heat exchange takes place between the substrates (7), wherein the surface of the substrate (7) extending in a plane facing the backside (8) of the top side (2') has at least one area (8') that is uneven or arched from the plane , characterized in that a substrate holder (2) constructed according to claim 3 is used. The method of manufacturing an OLED as claimed in claim 1 or 15, wherein the substrate is larger than 1 m ² and the height of the structural elements is between 50 μm and 1 mm, or the height of the structural elements falls between 50 μm and 1 mm. in the range between μm and 100 μm. A method as claimed in claim 16, wherein a gaseous or liquid medium is fed into the volumes (19, 27) of the structural elements (11, 12, 13, 14, 15) constructed as cushions, and/or in The volume (19, 27) of the pads or the pressure of the tempering gas fed into the spaces (20) is higher than the air pressure above the front side (9) of the substrate (7) in the process chamber (5). The method of claim 1, wherein the gas fed into the spaces (20) or into the volume of the cushions (12, 27) is nitrogen, argon, neon, krypton, xenon, hydrogen or helium, Or at least 90% consists of one or more of these gases, and/or the substrate (7) consists of glass, silicon, polyamide or plastic and the process is an OVPD process, and/or the substrate (7) 7) Have faces larger than 0.15 m ² , larger than 1 m ^{2 ,} or larger than 2 m ^{2 .}

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