WO2021196797A1 - 通信装置、介质波导滤波器及其电容耦合调节方法 - Google Patents

通信装置、介质波导滤波器及其电容耦合调节方法 Download PDF

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WO2021196797A1
WO2021196797A1 PCT/CN2020/141802 CN2020141802W WO2021196797A1 WO 2021196797 A1 WO2021196797 A1 WO 2021196797A1 CN 2020141802 W CN2020141802 W CN 2020141802W WO 2021196797 A1 WO2021196797 A1 WO 2021196797A1
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Prior art keywords
capacitive coupling
blind groove
hole
dielectric waveguide
waveguide filter
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PCT/CN2020/141802
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English (en)
French (fr)
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欧阳洲
黄友胜
丁海
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京信通信技术(广州)有限公司
京信射频技术(广州)有限公司
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Publication of WO2021196797A1 publication Critical patent/WO2021196797A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/007—Manufacturing frequency-selective devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/2002—Dielectric waveguide filters

Definitions

  • the present invention relates to the technical field of communication devices, in particular to a communication device, a dielectric waveguide filter and a capacitive coupling adjustment method thereof.
  • Dielectric waveguide filters are also the key to the miniaturization of 5G equipment.
  • the dielectric waveguide filter improves the air filling form of the traditional waveguide filter into a high dielectric constant ceramic material filling.
  • the ceramic dielectric material plays a role in signal transmission and structural support.
  • the metal material is attached to the surface of the ceramic dielectric material and acts as an electric wall. To electromagnetic shielding effect.
  • a dielectric waveguide filter includes: a dielectric block, the dielectric block includes a first surface and a second surface disposed oppositely, the first surface is provided with a blind groove, The bottom wall of the blind groove is provided with a capacitive coupling through hole, the capacitive coupling through hole extends from the bottom wall of the blind groove to the second surface; and a metal layer, the metal layer is provided on the The outer surface of the dielectric block, the groove wall of the blind groove and the hole wall of the capacitive coupling through hole; the metal layer of the capacitive coupling through hole hole wall is provided with a blocking ring, or the second surface The metal layer is provided with a blocking ring around the periphery of the capacitive coupling through hole.
  • the blind slot and the capacitive coupling through hole are combined to replace the traditional straight-through capacitive coupling through hole.
  • the notch of the blind slot can be adjusted
  • the size (including the width of the blind groove and the length of the blind groove) or the depth of the blind groove can be adjusted to adjust the capacitive coupling accordingly.
  • Limited by the impact of the machining accuracy of the partition ring it can reduce the difficulty of processing, facilitate production and manufacture, facilitate debugging, and achieve mass production; on the other hand, the partition ring only plays the role of capacitive coupling and is not used to adjust the capacity.
  • the size of the isolation ring can be relatively reduced, without increasing the size of the isolation ring, so as to avoid a large amount of signal leakage and serious signal crosstalk due to the large opening at the isolation ring, and the isolation ring can be realized. There is only less signal leakage, and the mutual interference of dielectric waveguide filters is greatly reduced.
  • a communication device includes the dielectric waveguide filter.
  • the capacity can be adjusted accordingly by adjusting the size of the blind slot (including the width of the blind slot and the length of the blind slot) or by adjusting the depth of the blind slot.
  • the amount of coupling without the need to adjust the amount of capacitive coupling by adjusting the size of the partition ring, that is, it is no longer limited to the impact of the processing accuracy of the partition ring, which can reduce the difficulty of processing, facilitate manufacturing, facilitate debugging, and achieve Mass production; on the other hand, the isolation ring only plays the role of capacitive coupling, and is not used to adjust the amount of capacitive coupling.
  • the size of the isolation ring can be relatively reduced without increasing the size of the isolation ring, so that it can Avoid large amounts of signal leakage and serious signal crosstalk due to the large opening at the isolation ring, and achieve less signal leakage at the isolation ring, and the mutual interference of dielectric waveguide filters is greatly reduced.
  • a method for adjusting the capacitive coupling of the dielectric waveguide filter includes the following steps: when the amount of capacitive coupling needs to be adjusted, by adjusting the depth of the blind groove, and/or adjusting the length of the blind groove, and/or Adjust the width of the blind groove to make corresponding adjustments.
  • the size of the blind slot can be adjusted (including the width of the blind slot and the length of the blind slot) or by adjusting the size of the blind slot.
  • the amount of capacitive coupling can be adjusted correspondingly by the depth size, instead of adjusting the amount of capacitive coupling by adjusting the size of the partition ring, that is, it is no longer limited to the impact of the processing accuracy of the partition ring, which can reduce the difficulty of processing and facilitate manufacturing , It is easy to debug and can realize mass production; on the other hand, the isolation ring only plays the role of capacitive coupling, and is not used to adjust the amount of capacitive coupling.
  • the size of the isolation ring can be relatively reduced without increasing
  • the size of the isolation ring can avoid a large amount of signal leakage and serious signal crosstalk due to the large opening at the isolation ring, and can achieve less signal leakage at the isolation ring, and the mutual interference of dielectric waveguide filters is greatly reduced.
  • FIG. 1 is a schematic structural diagram of a first surface of a dielectric waveguide filter according to an embodiment of the present invention
  • Figure 2 is a cross-sectional view of Figure 1 at A-A;
  • FIG. 3 is a schematic diagram of the structure of the second surface of the dielectric waveguide filter according to an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of the structure of the first surface of the dielectric waveguide filter according to another embodiment of the present invention.
  • Figure 5 is a cross-sectional view of Figure 4 at B-B;
  • FIG. 6 is a schematic diagram of the structure of the first surface of the dielectric waveguide filter according to another embodiment of the present invention.
  • FIG. 7 is a schematic diagram of the structure of the first surface of the dielectric waveguide filter according to still another embodiment of the present invention.
  • Fig. 8 is an S parameter diagram of a dielectric waveguide filter according to an embodiment of the present invention.
  • the capacitive coupling hole is illustrated by taking the through hole as an example. It is necessary to set a blocking ring around the through hole on the metal layer on the surface of the dielectric block, and the blocking ring can realize the effect of capacitive coupling. However, it is generally necessary to adjust the amount of capacitive coupling by adjusting the size and shape of the partition ring. Because the energy near the partition ring is concentrated, the partition ring requires high dimensional accuracy and the coupling amount is very sensitive, which is not conducive to mass production; in addition, , The part of the partition ring is directly exposed to the air environment, so the energy near the partition ring is very concentrated. The larger the area of the partition ring, the more serious the signal leakage. In practical applications, the signal crosstalk is more serious.
  • FIG. 1 shows a schematic structural diagram of the first surface of the dielectric waveguide filter according to an embodiment of the present invention
  • FIG. 2 shows a cross-sectional view of FIG. 1 at AA
  • 3 shows a schematic structural diagram of the second surface of the dielectric waveguide filter according to an embodiment of the present invention.
  • the dielectric waveguide filter provided by an embodiment of the present invention includes a dielectric block 10 and a metal layer 20.
  • the dielectric block 10 includes a first surface and a second surface that are opposed to each other.
  • the first surface is provided with a blind groove 11, the bottom wall of the blind groove 11 is provided with a capacitive coupling through hole 12, and the capacitive coupling through hole 12 extends from the bottom wall of the blind groove 11 to the The second surface.
  • two frequency holes 13 spaced apart are also provided on the first surface.
  • the blind slot 11 and the capacitive coupling through hole 12 are located between the two frequency holes 13.
  • the frequency hole 13 is a blind hole.
  • the metal layer 20 is provided on the outer surface of the dielectric block 10, the groove wall of the blind groove 11, the hole wall of the capacitive coupling through hole 12 and the hole wall of the frequency hole 13.
  • the metal layer 20 on the wall of the capacitive coupling through hole 12 is provided with a blocking ring 21, or the metal layer 20 on the second surface is provided with a blocking ring around the periphery of the capacitive coupling through hole 12 twenty one.
  • one side of the blind slot 11 and the capacitive coupling through hole 12 is one of the resonant cavities, that is, one of the frequency holes 13 is provided on one of the resonant cavities, and is used to adjust one of the resonant cavities.
  • the other side area of the blind slot 11 and the capacitive coupling through hole 12 is another resonant cavity, that is, the first other frequency hole 13 is set on the other resonant cavity to adjust the frequency of the other resonant cavity.
  • the combination of the blind groove 11 and the capacitive coupling through hole 12 replaces the traditional straight-through capacitive coupling through hole 12.
  • the size of the blind groove 11 can be adjusted (including The width of the blind groove 11 and the length of the blind groove 11) or by adjusting the depth of the blind groove 11 to adjust the capacitive coupling accordingly, instead of adjusting the size of the partition ring 21 to adjust the capacitive coupling, that is No longer limited by the influence of the processing accuracy of the partition ring 21, it can reduce the processing difficulty, facilitate production and manufacture, facilitate debugging, and realize mass production; on the other hand, the partition ring 21 only plays the role of capacitive coupling, without To adjust the amount of capacitive coupling, when designing the isolating ring 21, the size of the isolating ring 21 can be relatively reduced without increasing the size of the isolating ring 21, so as to avoid a large amount of signal leakage and signal leakage due to the large opening at the isolating ring 21 The crosstalk is serious, and only less signal leakage can be realized at the isolation ring 21, and the mutual interference of the dielectric waveguide filters is
  • the diameter of the capacitive coupling through hole 12 is 1 mm to 3 mm.
  • the ring width of the partition ring 21 is 0.5 mm to 1 mm.
  • the diameter of the capacitive coupling through hole 12 is 2 mm.
  • the ring width of the partition ring 21 is 0.5 mm to 0.7 mm. In this way, the ring width of the partition ring 21 is relatively small, which can avoid a large amount of signal leakage and serious signal crosstalk due to the large opening at the partition ring 21, and can achieve less signal leakage at the partition ring 21.
  • the dielectric waveguide filter Mutual interference is greatly reduced.
  • the metal layer 20 at the partition ring 21 there is no metal layer 20 at the partition ring 21.
  • the metal layer 20 on the wall of the capacitive coupling via 12 and the metal layer 20 at the edge of the capacitive coupling via 12 are still connected to each other, and the metal layer 20 at the edge of the capacitive coupling via 12 is connected to each other.
  • the metal layer 20 in the remaining area on the second surface is separated by a partition ring 21.
  • the partition ring 21 plays a role of capacitive coupling.
  • the amount of capacitive coupling can be adjusted accordingly when the width of the annular hollow area is adjusted.
  • this embodiment is not limited to this method. Adjust the amount of capacitive coupling.
  • the shape of the partition ring 21 is not limited, and may be a circular ring, an elliptical ring, or other irregular shapes, which is not limited here.
  • the partition ring 21 is not covered with the metal layer 20 and the wall surface of the dielectric block 10 is exposed. Specifically, the metal layer 20 at the partition ring 21 is exposed to the wall surface by means of removal. Of course, the wall surface of the dielectric block 10 corresponding to the partition ring 21 may not be electroplated or sprayed with the metal layer 20, so that the wall surface of the dielectric block 10 is exposed.
  • the depth of the blind groove 11 is not greater than the depth of the frequency hole 13.
  • the amount of capacitive coupling is greater; when the depth of the blind groove 11 is smaller, the amount of capacitive coupling is smaller.
  • the blind groove 11 is a shallow blind groove 11 with a relatively shallow depth. In this way, the ceramic green body is pressed by a mold to form the blind groove 11, the frequency hole 13, and the capacitive coupling through hole 12, which is convenient for press molding and has high precision. The batch consistency of the capacitive coupling of the obtained product is good.
  • the shape of the notch of the blind groove 11 is not limited, and can be any shape, such as a square, a polygon, a circle, an ellipse, or a waist shape.
  • the side wall of the blind groove 11 can be arranged perpendicular to the first surface or the second surface, specifically, for example, a cylindrical groove with a constant opening diameter, and of course, it can also be arranged obliquely to the first surface or the second surface.
  • a specific example is a tapered groove with a gradually increasing or decreasing slot diameter.
  • the dielectric block 10 is a ceramic dielectric block 10;
  • the metal layer 20 is a metal silver layer, a metal copper layer, a metal platinum layer, or a metal layer that is plated, sprayed, or adhered to the dielectric block 10 Metal gold layer.
  • FIG. 4 shows a schematic structural diagram of the first surface of the dielectric waveguide filter according to another embodiment of the present invention
  • FIG. 5 shows a cross-sectional view of FIG. 4 at A-A.
  • the setting position of the ring 21 has also changed accordingly.
  • a dielectric waveguide filter includes a dielectric block 10 and a metal layer 20.
  • the dielectric block 10 includes a first surface and a second surface that are opposed to each other.
  • the second surface is provided with a blind groove 11, the bottom wall of the blind groove 11 is provided with a capacitive coupling through hole 12, and the capacitive coupling through hole 12 extends from the bottom wall of the blind groove 11 to the
  • the blind groove 11 and the capacitive coupling through hole 12 are located between the two frequency holes 13, and the frequency hole 13 is a blind hole.
  • the metal layer 20 is provided on the outer surface of the dielectric block 10, the groove wall of the blind groove 11, the hole wall of the capacitive coupling through hole 12 and the hole wall of the frequency hole 13.
  • the metal layer 20 on the wall of the capacitive coupling through hole 12 is provided with a blocking ring 21, or the metal layer 20 on the first surface is provided with a blocking ring around the periphery of the capacitive coupling through hole 12 twenty one.
  • one side of the blind slot 11 and the capacitive coupling through hole 12 is one of the resonant cavities, that is, one of the frequency holes 13 is provided on one of the resonant cavities, and is used to adjust one of the resonant cavities.
  • the other side area of the blind slot 11 and the capacitive coupling through hole 12 is another resonant cavity, that is, the first other frequency hole 13 is set on the other resonant cavity to adjust the frequency of the other resonant cavity.
  • the combination of the blind groove 11 and the capacitive coupling through hole 12 replaces the traditional straight-through capacitive coupling through hole 12.
  • the size of the blind groove 11 can be adjusted (including The width of the blind groove 11 and the length of the blind groove 11) or by adjusting the depth of the blind groove 11 to adjust the capacitive coupling accordingly, instead of adjusting the size of the partition ring 21 to adjust the capacitive coupling, that is No longer limited by the influence of the processing accuracy of the partition ring 21, it can reduce the processing difficulty, facilitate production and manufacture, facilitate debugging, and realize mass production; on the other hand, the partition ring 21 only plays the role of capacitive coupling, without To adjust the amount of capacitive coupling, when designing the isolating ring 21, the size of the isolating ring 21 can be relatively reduced without increasing the size of the isolating ring 21, so as to avoid a large amount of signal leakage and signal leakage due to the large opening at the isolating ring 21 The crosstalk is serious, and only less signal leakage can be realized at the isolation ring 21, and the mutual interference of the dielectric waveguide filters is
  • the dielectric waveguide filter illustrated in Figure 1, Figure 4, Figure 6 and Figure 7 is a six-cavity dielectric waveguide filter.
  • the six-cavity dielectric waveguide filter is provided with two frequency holes 13 and capacitive coupling through holes.
  • the dielectric waveguide filter illustrated in FIGS. 1, 4, 6 and 7 is also specifically provided with four frequency holes 14 for example.
  • a signal input port 15 and a signal output port 16 are also provided on the second surface. The signal input port 15 and the signal output port 16 can realize signal transmission with external devices.
  • the dielectric waveguide filter illustrated in FIG. 1, FIG. 4, FIG. 6 and FIG. 7 is also specifically provided with an inductive coupling blind hole 17, for example.
  • the inductive coupling blind hole 17 is used to increase the amount of inductive coupling between the two adjacent resonant cavities. Parameters such as the depth and aperture of the inductive coupling blind hole 17 can be adjusted. When the parameters such as the depth and aperture of the inductive coupling blind hole 17 are adjusted, the amount of inductive coupling between two adjacent resonant cavities is adjusted accordingly. When the depth of the inductive coupling blind hole 17 is specifically 0, it is equivalent to no need to provide the inductive coupling blind hole 17.
  • FIG. 8 schematically shows an S curve diagram of a dielectric waveguide filter according to an embodiment of the present invention. It can be seen from FIG. 8 that a zero point is generated, that is, the dielectric waveguide filter in the above-mentioned embodiment has a negative coupling structure.
  • a communication device includes the dielectric waveguide filter described in any of the above embodiments. It should be noted that the communication device may specifically be a 3G product, a 4G product, or a 5G product, which is not limited here. In addition, the communication device may specifically be a dielectric waveguide filter unit structure, a duplexer or a multiplexer, which is not limited here.
  • the above-mentioned communication device can be adjusted by adjusting the size of the slot of the blind slot 11 (including the width of the blind slot 11 and the length of the blind slot 11) or by adjusting the depth of the blind slot 11 during the production design process.
  • the amount of capacitive coupling is adjusted accordingly, without the need to adjust the amount of capacitive coupling by adjusting the size of the partition ring 21, that is, it is no longer limited to the influence of the processing accuracy of the partition ring 21, which can reduce the processing difficulty and facilitate production. It is easy to debug and can realize mass production.
  • the partition ring 21 only plays the role of capacitive coupling, and is not used to adjust the amount of capacitive coupling.
  • the size of the partition ring 21 can be relatively reduced without requiring Increase the size of the partition ring 21, so as to avoid a large amount of signal leakage and serious signal crosstalk due to the large opening at the partition ring 21, achieve less signal leakage at the partition ring 21, and greatly reduce the mutual interference of dielectric waveguide filters .
  • a method for adjusting capacitive coupling of a dielectric waveguide filter as described in any of the above embodiments includes the following steps: when the amount of capacitive coupling needs to be adjusted, by adjusting the depth of the blind groove 11, and /Or adjust the length of the blind groove 11, and/or adjust the width of the blind groove 11 for corresponding adjustment.
  • the size of the blind slot 11 can be adjusted (including the width of the blind slot 11 and the length of the blind slot 11) or by adjusting The depth of the blind groove 11 is used to adjust the capacitive coupling accordingly, without adjusting the size of the partition ring 21 to adjust the capacitive coupling, that is, it is no longer limited by the influence of the processing accuracy of the partition ring 21, and can reduce Difficulty in processing, easy to manufacture, easy to debug, and can achieve mass production; on the other hand, the partition ring 21 only plays a role of capacitive coupling, not used to adjust the amount of capacitive coupling, when the partition ring 21 is designed, it can be relatively reduced The size of the partition ring 21 does not need to increase the size of the partition ring 21, so as to avoid a large amount of signal leakage and serious signal crosstalk due to the large opening at the partition ring 21, and achieve less signal leakage at
  • the notch of the blind groove 11 is a circular opening, and the orifice of the capacitive coupling through hole 12 is located in the middle of the bottom wall of the blind groove 11.
  • the depth of the blind groove 11 is correspondingly increased, and/or the slot diameter of the blind groove 11 is increased; when the amount of capacitive coupling needs to be reduced, the amount of capacitive coupling is correspondingly reduced.
  • the depth of the blind groove 11, and/or the notch diameter of the blind groove 11 is reduced.
  • the notch of the blind groove 11 is a waist-shaped mouth.
  • the long side direction of the shaped mouth corresponds to the x-axis direction in Fig. 1, and the wide side direction of the waist-shaped mouth corresponds to the y-axis direction in Fig. 1.
  • the opening of the capacitive coupling through hole 12 is located in the middle of the bottom wall of the blind groove 11.
  • the depth of the blind groove 11 is correspondingly increased, and/or the notch length of the blind groove 11 is increased, and/or the notch of the blind groove 11 is increased
  • the depth of the blind groove 11 is correspondingly reduced, and/or the slot length of the blind groove 11 is reduced, and/or the blind groove 11 is reduced The width of the notch.
  • the notch of the blind groove 11 is a waist-shaped mouth
  • the long side direction of the waist-shaped mouth is perpendicular to the connecting direction of the centers of the two frequency holes 13, and the long side direction of the waist-shaped mouth
  • the wide side direction of the waist-shaped mouth corresponds to the x-axis direction in FIG. 7.
  • the opening of the capacitive coupling through hole 12 is located in the middle of the bottom wall of the blind groove 11.
  • the depth of the blind groove 11 is correspondingly increased, and/or the notch length of the blind groove 11 is reduced, and/or the notch of the blind groove 11 is reduced
  • the depth of the blind groove 11 is correspondingly reduced, and/or the slot length of the blind groove 11 is increased, and/or the blind groove 11 is increased The width of the notch.

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Abstract

本发明涉及一种通信装置、介质波导滤波器及其电容耦合调节方法。介质波导滤波器包括介质块及金属层。一方面, 在生产设计过程中, 可以通过调整盲槽的槽口大小或通过调整盲槽的深度大小来相应调整容性耦合量, 而无需通过调整隔断环的尺寸大小来调整容性耦合量, 也就是不再受限于隔断环的加工精度的影响, 能实现降低加工难度, 便于生产制造, 便于进行调试, 能实现批量生产; 另一方面, 隔断环仅发挥容性耦合的作用, 不用于调整容性耦合量, 设计隔断环时, 可采用尺寸相对较小的隔断环, 无需增大隔断环尺寸, 从而能避免隔断环处因为开口较大而导致大量信号泄露及信号串扰严重, 能实现隔断环处只有较少的信号泄漏, 介质波导滤波器相互干扰大大降低。

Description

通信装置、介质波导滤波器及其电容耦合调节方法 技术领域
本发明涉及通信装置技术领域，特别是涉及一种通信装置、介质波导滤波器及其电容耦合调节方法。
背景技术
随着通信系统的高速发展进入到5G时代，器件的小型化是其通信设备发展的关键，而小型化、高性能、低功耗滤波器又是5G设备小型化的关键，介质波导滤波器同时具有5G设备小型化的所有特点，因此在5G通信设备中具有广泛的应用前景，介质波导滤波器的设计方法成为研究的热点。介质波导滤波器将传统波导滤波器的空气填充形式改进成高介电常数陶瓷材料填充，陶瓷介质材料起到传输信号和结构支撑的作用，金属材料附着在瓷介质材料表面，作为电壁，起到电磁屏蔽作用。
其中，传统的介质波导滤波器，实现电容耦合的几种方式包括：深盲孔方式、通孔方式及盲槽方式。这几种电容耦合方式的介质波导滤波器都存在加工难度大，调试不方便的问题，可批量性差，也为后续实行自动化调试加大了难度。
发明内容
基于此，有必要克服现有技术的缺陷，提供一种通信装置、介质波导滤波器及其电容耦合调节方法，它能够降低加工难度，便于生产制造，便于进行调试，能实现批量性生产。
其技术方案如下：一种介质波导滤波器，所述介质波导滤波器包括：介质 块，所述介质块包括相对设置的第一表面与第二表面，所述第一表面上设有盲槽，所述盲槽的底壁设有容性耦合通孔，所述容性耦合通孔从所述盲槽的底壁延伸到所述第二表面；及金属层，所述金属层设于所述介质块的外表面、所述盲槽的槽壁及所述容性耦合通孔的孔壁；所述容性耦合通孔孔壁的金属层上设有隔断环，或者，所述第二表面的金属层上设有绕设于所述容性耦合通孔外围的隔断环。
上述的介质波导滤波器，盲槽与容性耦合通孔相结合的形式，替换传统的直通状的容性耦合通孔，如此一方面，在生产设计过程中，可以通过调整盲槽的槽口大小(包括盲槽的宽度大小以及盲槽的长度大小)或通过调整盲槽的深度大小来相应调整容性耦合量，而无需通过调整隔断环的尺寸大小来调整容性耦合量，也就是不再受限于隔断环的加工精度的影响，能实现降低加工难度，便于生产制造，便于进行调试，能实现批量性生产；另一方面，隔断环仅发挥容性耦合的作用，不用于调整容性耦合量，设计隔断环时，可以相对减小隔断环的尺寸，无需增大隔断环的尺寸，从而能避免隔断环处因为开口较大而导致大量信号泄露及信号串扰严重，能实现隔断环处只有较少的信号泄漏，介质波导滤波器相互干扰大大降低。
一种通信装置，包括所述的介质波导滤波器。
上述的通信装置，一方面，在生产设计过程中，可以通过调整盲槽的槽口大小(包括盲槽的宽度大小以及盲槽的长度大小)或通过调整盲槽的深度大小来相应调整容性耦合量，而无需通过调整隔断环的尺寸大小来调整容性耦合量，也就是不再受限于隔断环的加工精度的影响，能实现降低加工难度，便于生产制造，便于进行调试，能实现批量性生产；另一方面，隔断环仅发挥容性耦合 的作用，不用于调整容性耦合量，设计隔断环时，可以相对减小隔断环的尺寸，无需增大隔断环的尺寸，从而能避免隔断环处因为开口较大而导致大量信号泄露及信号串扰严重，能实现隔断环处只有较少的信号泄漏，介质波导滤波器相互干扰大大降低。
一种所述的介质波导滤波器的电容耦合调节方法，包括如下步骤：当需要调整电容耦合量时，通过调整所述盲槽的深度，和/或调整所述盲槽的长度，和/或调整所述盲槽的宽度来进行相应调整。
上述的介质波导滤波器的电容耦合调节方法，一方面，在生产设计过程中，可以通过调整盲槽的槽口大小(包括盲槽的宽度大小以及盲槽的长度大小)或通过调整盲槽的深度大小来相应调整容性耦合量，而无需通过调整隔断环的尺寸大小来调整容性耦合量，也就是不再受限于隔断环的加工精度的影响，能实现降低加工难度，便于生产制造，便于进行调试，能实现批量性生产；另一方面，隔断环仅发挥容性耦合的作用，不用于调整容性耦合量，设计隔断环时，可以相对减小隔断环的尺寸，无需增大隔断环的尺寸，从而能避免隔断环处因为开口较大而导致大量信号泄露及信号串扰严重，能实现隔断环处只有较少的信号泄漏，介质波导滤波器相互干扰大大降低。
附图说明
图1为本发明一实施例所述的介质波导滤波器的第一表面的结构示意图；
图2为图1在A-A处的剖视图；
图3为本发明一实施例所述的介质波导滤波器的第二表面的结构示意图；
图4为本发明另一实施例所述的介质波导滤波器的第一表面的结构示意图；
图5为图4在B-B处的剖视图；
图6为本发明又一实施例所述的介质波导滤波器的第一表面的结构示意图；
图7为本发明再一实施例所述的介质波导滤波器的第一表面的结构示意图；
图8为本发明一实施例所述的介质波导滤波器的S参数图。
10、介质块；11、盲槽；12、容性耦合通孔；13、频率孔；14、频率孔；15、信号输入端口；16、信号输出端口；17、感性耦合盲孔；20、金属层；21、隔断环。
具体实施方式
传统的介质波导滤波器，其容性耦合孔以通孔为例进行说明，需要在介质块表面的金属层上绕通孔开设隔断环，隔断环能实现容性耦合的作用。然而，一般是需要通过调节隔断环的尺寸大小及形状来调整容性耦合量，由于隔断环附近能量较集中，隔断环对尺寸精度要求很高，耦合量很敏感，从而不利于批量生产；此外，隔断环所在部位是直接裸露于空气环境中，如此隔断环附近能量很集中，隔断环的面积越大时信号泄漏就越严重，实际应用时，信号串扰较严重。
基于此，参阅图1至图3，图1示出了本发明一实施例中所述的介质波导滤波器的第一表面的结构示意图，图2示出了图1在A-A处的剖视图，图3示出了本发明一实施例所述的介质波导滤波器的第二表面的结构示意图。本发明一实施例提供了的介质波导滤波器，包括介质块10及金属层20。所述介质块10包括相对设置的第一表面与第二表面。所述第一表面上设有盲槽11，所述盲槽11的底壁设有容性耦合通孔12，所述容性耦合通孔12从所述盲槽11的底壁延伸到所述第二表面。具体地，所述第一表面上还设有间隔的两个频率孔13。所述盲槽11与所述容性耦合通孔12位于两个所述频率孔13之间。所述频率孔 13为盲孔。所述金属层20设于所述介质块10的外表面、所述盲槽11的槽壁、所述容性耦合通孔12的孔壁及所述频率孔13的孔壁上。所述容性耦合通孔12孔壁的金属层20上设有隔断环21，或者，所述第二表面的金属层20上设有绕设于所述容性耦合通孔12外围的隔断环21。
上述的介质波导滤波器，盲槽11与容性耦合通孔12的其中一侧区域为其中一个谐振腔，也就是其中一个频率孔13设置于其中一个谐振腔上，用于调节其中一个谐振腔的频率；盲槽11与容性耦合通孔12的另一侧区域为另一个谐振腔，也就是第另一个频率孔13设置于另一个谐振腔上，用于调节另一个谐振腔的频率。盲槽11与容性耦合通孔12相结合的形式，替换传统的直通状的容性耦合通孔12，如此一方面，在生产设计过程中，可以通过调整盲槽11的槽口大小(包括盲槽11的宽度大小以及盲槽11的长度大小)或通过调整盲槽11的深度大小来相应调整容性耦合量，而无需通过调整隔断环21的尺寸大小来调整容性耦合量，也就是不再受限于隔断环21的加工精度的影响，能实现降低加工难度，便于生产制造，便于进行调试，能实现批量性生产；另一方面，隔断环21仅发挥容性耦合的作用，不用于调整容性耦合量，设计隔断环21时，可以相对减小隔断环21的尺寸，无需增大隔断环21的尺寸，从而能避免隔断环21处因为开口较大而导致大量信号泄露及信号串扰严重，能实现隔断环21处只有较少的信号泄漏，介质波导滤波器相互干扰大大降低。
在一个实施例中，所述容性耦合通孔12的直径为1mm～3mm。所述隔断环21的环宽为0.5mm～1mm。具体而言，所述容性耦合通孔12的直径为2mm。所述隔断环21的环宽为0.5mm～0.7mm。如此，隔断环21的环宽尺寸相对较小，能避免隔断环21处因为开口较大而导致大量信号泄露及信号串扰严重，能实现隔断环21处只有较少的信号泄漏，介质波导滤波器相互干扰大大降低。可以理解 的是，容性耦合通孔12的直径也可以是其它参数，不限于本实施例中限定的1mm～3mm；隔断环21的环宽也可以是其它参数，不限于本实施例中限定的0.5mm～1mm。
需要说明的是，隔断环21处无金属层20。如此，容性耦合通孔12的孔壁上的金属层20与容性耦合通孔12的孔缘处的金属层20依然相互连接，容性耦合通孔12的孔缘处的金属层20与第二表面上其余区域的金属层20通过隔断环21相隔离开。通过设置隔断环21，一方面，隔断环21起到容性耦合的作用，另一方面，调整环形镂空区的宽窄时能相应调整容性耦合量，但是本实施例中不限于采用该方式来调整容性耦合量。此外，隔断环21的形状不进行限制，可以为圆环形、椭圆环形、或其它不规则形状，在此不进行限制。
需要说明的是，隔断环21处没有覆盖金属层20并露出介质块10的壁面。具体而言，隔断环21处的金属层20通过移除的方式露出壁面。当然，介质块10对应于隔断环21的壁面也可以不进行电镀或喷涂金属层20，从而露出介质块10的壁面。
在一个实施例中，所述盲槽11的深度不大于所述频率孔13的深度。当盲槽11的深度越大时，容性耦合量越大；当盲槽11的深度越小时，容性耦合量越小。如此，盲槽11为深度相对较浅的浅盲槽11，这样陶瓷胚体采用模具压制形成盲槽11、频率孔13、容性耦合通孔12的过程中，便于压制成型，且精度高，得到的产品的容性耦合量批量一致性好。
在一个实施例中，所述盲槽11的槽口形状不进行限制，可以为任意形状，例如为方形、多边形、圆形、椭圆形或腰形。此外，盲槽11的侧壁可以与第一表面或第二表面相对垂直设置，具体例如为槽口口径保持不变的柱形槽，当然也可以与第一表面或第二表面相对倾斜设置，具体例如为槽口口径逐渐增大或 逐渐减小的锥形槽。
在一个实施例中，所述介质块10为陶瓷介质块10；所述金属层20为镀设、喷涂或粘设于所述介质块10上的金属银层、金属铜层、金属铂层或金属金层。
请参阅图4及图5，图4示出了本发明另一实施例中所述的介质波导滤波器的第一表面的结构示意图，图5示出了图4在A-A处的剖视图。图4及图5示意出的介质波导滤波器相对于图1至图3示意出的介质波导滤波器而言，区别在于容性耦合通孔12及盲槽11的设置方向发生了改变，以及隔断环21的设置位置也相应了发生了改变。在另一个实施例中，一种介质波导滤波器，所述介质波导滤波器包括介质块10及金属层20。所述介质块10包括相对设置的第一表面与第二表面。所述第二表面上设有盲槽11，所述盲槽11的底壁设有容性耦合通孔12，所述容性耦合通孔12从所述盲槽11的底壁延伸到所述第一表面，所述第一表面上还设有间隔的两个频率孔13，所述盲槽11与所述容性耦合通孔12位于两个所述频率孔13之间，所述频率孔13为盲孔。所述金属层20设于所述介质块10的外表面、所述盲槽11的槽壁、所述容性耦合通孔12的孔壁及所述频率孔13的孔壁上。所述容性耦合通孔12孔壁的金属层20上设有隔断环21，或者，所述第一表面的金属层20上设有绕设于所述容性耦合通孔12外围的隔断环21。
上述的介质波导滤波器，盲槽11与容性耦合通孔12的其中一侧区域为其中一个谐振腔，也就是其中一个频率孔13设置于其中一个谐振腔上，用于调节其中一个谐振腔的频率；盲槽11与容性耦合通孔12的另一侧区域为另一个谐振腔，也就是第另一个频率孔13设置于另一个谐振腔上，用于调节另一个谐振腔的频率。盲槽11与容性耦合通孔12相结合的形式，替换传统的直通状的容性耦合通孔12，如此一方面，在生产设计过程中，可以通过调整盲槽11的槽口 大小(包括盲槽11的宽度大小以及盲槽11的长度大小)或通过调整盲槽11的深度大小来相应调整容性耦合量，而无需通过调整隔断环21的尺寸大小来调整容性耦合量，也就是不再受限于隔断环21的加工精度的影响，能实现降低加工难度，便于生产制造，便于进行调试，能实现批量性生产；另一方面，隔断环21仅发挥容性耦合的作用，不用于调整容性耦合量，设计隔断环21时，可以相对减小隔断环21的尺寸，无需增大隔断环21的尺寸，从而能避免隔断环21处因为开口较大而导致大量信号泄露及信号串扰严重，能实现隔断环21处只会有较少的信号泄漏，介质波导滤波器相互干扰大大降低。
其中，图1、图4、图6及图7中示意出的介质波导滤波器为六腔介质波导滤波器，六腔介质波导滤波器上除了设置有两个频率孔13、容性耦合通孔12及盲槽11外，图1、图4、图6及图7中示意出的介质波导滤波器还具体例如设有四个频率孔14。此外，所述第二表面上还设有信号输入端口15与信号输出端口16。通过信号输入端口15与信号输出端口16能实现与外界装置进行信号传输。另外，图1、图4、图6及图7中示意出的介质波导滤波器还具体例如设置有一个感性耦合盲孔17。感性耦合盲孔17用于增强与其相邻的两个谐振腔之间的感性耦合量大小。感性耦合盲孔17的深度、孔径等等参数可以进行调整，当感性耦合盲孔17的深度、孔径等等参数调整时，相邻的两个谐振腔之间的感性耦合量相应调整。在感性耦合盲孔17的深度具体为0时，相当于无需设置感性耦合盲孔17。
请再参阅图8，图8示意出了为本发明一实施例所述的介质波导滤波器的S曲线图。从图8中可以看出有零点产生，即上述实施例中的介质波导滤波器为负耦合结构。
在一个实施例中，一种通信装置，包括上述任一实施例所述的介质波导滤 波器。需要说明的是，所述通信装置具体可以是3G产品、4G产品或5G产品，在此不进行限定。此外，通信装置具体可以是介质波导滤波器单体结构、双工器或多工器，在此也不进行限定。
上述的通信装置，一方面，在生产设计过程中，可以通过调整盲槽11的槽口大小(包括盲槽11的宽度大小以及盲槽11的长度大小)或通过调整盲槽11的深度大小来相应调整容性耦合量，而无需通过调整隔断环21的尺寸大小来调整容性耦合量，也就是不再受限于隔断环21的加工精度的影响，能实现降低加工难度，便于生产制造，便于进行调试，能实现批量性生产；另一方面，隔断环21仅发挥容性耦合的作用，不用于调整容性耦合量，设计隔断环21时，可以相对减小隔断环21的尺寸，无需增大隔断环21的尺寸，从而能避免隔断环21处因为开口较大而导致大量信号泄露及信号串扰严重，能实现隔断环21处只有较少的信号泄漏，介质波导滤波器相互干扰大大降低。
在一个实施例中，一种如上述任一实施例所述的介质波导滤波器的电容耦合调节方法，包括如下步骤：当需要调整电容耦合量时，通过调整所述盲槽11的深度，和/或调整所述盲槽11的长度，和/或调整所述盲槽11的宽度来进行相应调整。
上述的介质波导滤波器的电容耦合调节方法，一方面，在生产设计过程中，可以通过调整盲槽11的槽口大小(包括盲槽11的宽度大小以及盲槽11的长度大小)或通过调整盲槽11的深度大小来相应调整容性耦合量，而无需通过调整隔断环21的尺寸大小来调整容性耦合量，也就是不再受限于隔断环21的加工精度的影响，能实现降低加工难度，便于生产制造，便于进行调试，能实现批量性生产；另一方面，隔断环21仅发挥容性耦合的作用，不用于调整容性耦合量，设计隔断环21时，可以相对减小隔断环21的尺寸，无需增大隔断环21的 尺寸，从而能避免隔断环21处因为开口较大而导致大量信号泄露及信号串扰严重，能实现隔断环21处只有较少的信号泄漏，介质波导滤波器相互干扰大大降低。
在一个实施例中，请参阅图6，所述盲槽11的槽口为圆形口，所述容性耦合通孔12的孔口位于所述盲槽11底壁的中部部位，当需要增大容性耦合量时，则相应增大所述盲槽11的深度，和/或增大所述盲槽11的槽口直径；当需要减小容性耦合量时，则相应减小所述盲槽11的深度，和/或减小所述盲槽11的槽口直径。
在一个实施例中，请再参阅图1，所述盲槽11的槽口为腰形口，所述腰形口的长边方向与两个所述频率孔13中心的连线方向一致，腰形口的长边方向对应于图1中x轴方向，腰形口的宽边方向对应于图1中y轴方向。所述容性耦合通孔12的孔口位于所述盲槽11底壁的中部部位。当需要增大容性耦合量时，则相应增大所述盲槽11的深度，和/或增大所述盲槽11的槽口长度，和/或增大所述盲槽11的槽口的宽度；当需要减小容性耦合量时，则相应减小所述盲槽11的深度，和/或减小所述盲槽11的槽口长度，和/或减小所述盲槽11的槽口的宽度。
请参阅图7，所述盲槽11的槽口为腰形口，所述腰形口的长边方向与两个所述频率孔13中心的连线方向相垂直，腰形口的长边方向对应于图7中y轴方向，腰形口的宽边方向对应于图7中x轴方向。所述容性耦合通孔12的孔口位于所述盲槽11底壁的中部部位。当需要增大容性耦合量时，则相应增大所述盲槽11的深度，和/或减小所述盲槽11的槽口长度，和/或减小所述盲槽11的槽口的宽度；当需要减小容性耦合量时，则相应减小所述盲槽11的深度，和/或增大所述盲槽11的槽口长度，和/或增大所述盲槽11的槽口的宽度。

Claims (12)

  1. 一种介质波导滤波器，其特征在于，所述介质波导滤波器包括：
    介质块，所述介质块包括相对设置的第一表面与第二表面，所述第一表面上设有盲槽，所述盲槽的底壁设有容性耦合通孔，所述容性耦合通孔从所述盲槽的底壁延伸到所述第二表面；及
    金属层，所述金属层设于所述介质块的外表面、所述盲槽的槽壁及所述容性耦合通孔的孔壁；所述容性耦合通孔孔壁的金属层上设有隔断环，或者，所述第二表面的金属层上设有绕设于所述容性耦合通孔外围的隔断环。
  2. 根据权利要求1所述的介质波导滤波器，其特征在于，所述容性耦合通孔的直径为1mm～3mm；所述隔断环的环宽为0.5mm～1mm。
  3. 根据权利要求2所述的介质波导滤波器，其特征在于，所述容性耦合通孔的直径为2mm；所述隔断环的环宽为0.5mm～0.7mm。
  4. 根据权利要求1所述的介质波导滤波器，其特征在于，所述第一表面上还设有间隔的两个频率孔，所述盲槽与所述容性耦合通孔位于两个所述频率孔之间，所述频率孔为盲孔，所述金属层还设于所述频率孔的孔壁上。
  5. 根据权利要求4所述的介质波导滤波器，其特征在于，所述盲槽的深度不大于所述频率孔的深度。
  6. 根据权利要求1所述的介质波导滤波器，其特征在于，所述盲槽的槽口形状为方形、多边形、圆形、椭圆形或腰形；或者，所述盲槽为锥形槽或柱形槽。
  7. 根据权利要求1至6任意一项所述的介质波导滤波器，其特征在于，所述介质块为陶瓷介质块；所述金属层为镀设、喷涂或粘设于所述介质块上的金属银层、金属铜层、金属铂层或金属金层。
  8. 一种通信装置，其特征在于，包括如权利要求1至7任意一项所述的介 质波导滤波器。
  9. 一种如权利要求1至7任意一项所述的介质波导滤波器的电容耦合调节方法，其特征在于，包括如下步骤：当需要调整电容耦合量时，通过调整所述盲槽的深度，和/或调整所述盲槽的长度，和/或调整所述盲槽的宽度来进行相应调整。
  10. 根据权利要9所述的介质波导滤波器的电容耦合调节方法，其特征在于，所述盲槽的槽口为圆形口，所述容性耦合通孔的孔口位于所述盲槽底壁的中部部位，当需要增大容性耦合量时，则相应增大所述盲槽的深度，和/或增大所述盲槽的槽口直径；当需要减小容性耦合量时，则相应减小所述盲槽的深度，和/或减小所述盲槽的槽口直径。
  11. 根据权利要求9所述的介质波导滤波器的电容耦合调节方法，其特征在于，所述盲槽的槽口为腰形口，所述腰形口的长边方向与两个所述频率孔中心的连线方向一致，所述容性耦合通孔的孔口位于所述盲槽底壁的中部部位，当需要增大容性耦合量时，则相应增大所述盲槽的深度和/或增大所述盲槽的槽口长度，和/或增大所述盲槽的槽口的宽度；当需要减小容性耦合量时，则相应减小所述盲槽的深度，和/或减小所述盲槽的槽口长度，和/或减小所述盲槽的槽口的宽度。
  12. 根据权利要求9所述的介质波导滤波器的电容耦合调节方法，其特征在于，所述盲槽的槽口为腰形口，所述腰形口的长边方向与两个所述频率孔中心的连线方向相垂直，所述容性耦合通孔的孔口位于所述盲槽底壁的中部部位，当需要增大容性耦合量时，则相应增大所述盲槽的深度，和/或减小所述盲槽的槽口长度，和/或减小所述盲槽的槽口的宽度；当需要减小容性耦合量时，则相应减小所述盲槽的深度，和/或增大所述盲槽的槽口长度，和/或增大所述盲槽 的槽口的宽度。
PCT/CN2020/141802 2020-04-03 2020-12-30 通信装置、介质波导滤波器及其电容耦合调节方法 WO2021196797A1 (zh)

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