WO2021192766A1 - Dispositif de communication - Google Patents

Dispositif de communication Download PDF

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Publication number
WO2021192766A1
WO2021192766A1 PCT/JP2021/006458 JP2021006458W WO2021192766A1 WO 2021192766 A1 WO2021192766 A1 WO 2021192766A1 JP 2021006458 W JP2021006458 W JP 2021006458W WO 2021192766 A1 WO2021192766 A1 WO 2021192766A1
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WO
WIPO (PCT)
Prior art keywords
antenna module
feeding element
communication device
housing
conductor
Prior art date
Application number
PCT/JP2021/006458
Other languages
English (en)
Japanese (ja)
Inventor
英樹 上田
隆賢 水沼
川端　一也
雅司 大室
靖久 山本
田中　聡
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2021192766A1 publication Critical patent/WO2021192766A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/08—Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them

Definitions

  • the present invention relates to a communication device.
  • the antenna module is housed in the housing of a mobile communication terminal such as a smartphone.
  • the radio wave radiated from the radiating element of the antenna module passes through the housing and is radiated to the outside. Therefore, the radiation characteristics of radio waves are affected by the housing.
  • Patent Document 1 discloses an antenna device having a predetermined directivity by devising the shape of a radome through which radio waves radiated from a patch antenna pass.
  • the radio waves radiated from the radiating element are reflected by the sudden change in the dielectric constant on the inner surface of the housing. This reflection affects the radiation characteristics of radio waves to the outside of the housing.
  • the influence of the housing on the radiation characteristics of radio waves also varies.
  • An object of the present invention is to provide a communication device capable of suppressing variations in radio wave radiation characteristics due to a housing.
  • An antenna module including a substrate provided with a radiating element, and A housing that houses the antenna module and Provided is a communication device having a gel-like first member arranged between a surface of the antenna module facing the bore site direction and an inner surface of the housing and contacting both the antenna module and the housing.
  • the size of the discontinuity of the dielectric constant on the inner surface of the housing is reduced.
  • the reflected wave of the radio wave on the inner surface of the housing is reduced.
  • variations in the radiation characteristics of radio waves caused by the housing are suppressed.
  • FIG. 1A is a perspective view of an antenna module mounted on the communication device according to the first embodiment
  • FIG. 1B is a cross-sectional view of a part of the communication device according to the first embodiment
  • FIG. 2 is a cross-sectional view of the communication device according to the first embodiment
  • FIG. 3A is a cross-sectional view of a simulation target having the structure of the communication device according to the first embodiment
  • FIGS. 3B and 3C are perspective views and plan views of one radiation element to be simulated, respectively
  • FIG. 3D is a plan view.
  • FIG. 3C is a cross-sectional view taken along the alternate long and short dash line 3D-3D.
  • FIG. 4A is a graph showing the simulation result of the return loss of the simulation target (FIGS.
  • FIG. 4B is a simulation of the return loss of the simulation target having the structure of the communication device according to the comparative example.
  • FIG. 4C is a graph showing the results
  • FIG. 4C is a graph showing the simulation results of the return loss of only the antenna module having no housing.
  • FIG. 5A is a graph showing the simulation result of the bore sight gain of the simulation target according to the first embodiment
  • FIG. 5B is a graph showing the simulation result of the gain of the simulation target according to the comparative example
  • FIG. 5C is a housing. It is a graph which shows the simulation result of the gain of only the antenna module which does not have.
  • FIG. 5A is a graph showing the simulation result of the bore sight gain of the simulation target according to the first embodiment
  • FIG. 5B is a graph showing the simulation result of the gain of the simulation target according to the comparative example
  • FIG. 5C is a housing. It is a graph which shows the simulation result of the gain of only the antenna module which does not have.
  • FIG. 5A
  • FIG. 6 is a cross-sectional view of a communication device according to a modified example of the first embodiment.
  • FIG. 7A is a cross-sectional view of the communication device according to the second embodiment, and
  • FIG. 7B is a cross-sectional view of the communication device according to the modified example of the second embodiment.
  • FIG. 8 is a cross-sectional view of the communication device according to the third embodiment.
  • FIG. 1A is a perspective view of the antenna module 10 mounted on the communication device according to the first embodiment.
  • FIG. 1B is a cross-sectional view of a part of the communication device according to the first embodiment, and corresponds to the cross section of the alternate long and short dash line 1B-1B of FIG. 1A.
  • the antenna module 10 is housed in the housing 50. In FIG. 1A, the housing 50 is not shown.
  • a first ground conductor 21, a second ground conductor 22, and a plurality of radiating elements 11 are arranged on a substrate 20 made of a dielectric material.
  • the first ground conductor 21 is arranged on the inner layer of the substrate 20, and the second ground conductor 22 is arranged on one surface of the substrate 20.
  • the surface on which the second ground conductor 22 is arranged is referred to as a lower surface, and the surface on the opposite side thereof is referred to as an upper surface.
  • the plurality of radiating elements 11 are arranged on the upper surface side when viewed from the first ground conductor 21. That is, the surface of the antenna module 10 facing the bore sight direction is the upper surface. Further, the plurality of radiating elements 11 are arranged in a matrix of 2 rows and 4 columns in a plan view.
  • Each of the radiating elements 11 includes a feeding element 12 and a non-feeding element 13 loaded on the feeding element 12.
  • the feeding element 12 is arranged on the inner layer of the substrate 20, and the non-feeding element 13 is arranged on the upper surface of the substrate 20. That is, the non-feeding element 13 is arranged at a position higher than the feeding element 12 with the first ground conductor 21 as a reference for the height.
  • a patch antenna is composed of the first ground conductor 21 and the radiating element 11.
  • the power feeding element 12 and the non-feeding element 13 each have a shape in which four corners of a square are cut out into a small square shape. Further, in the plan view, one side of the non-feeding element 13 and the feeding element 12 is parallel in the row direction, and the centers coincide with each other in the plan view.
  • the non-feeding element 13 is smaller than the feeding element 12, and the non-feeding element 13 is included in the feeding element 12 in a plan view.
  • the first ground conductor 21 and the second ground conductor 22 are connected to each other by a plurality of via conductors 23.
  • a high-frequency circuit component 40 and a connector 41 are mounted on the lower surface of the substrate 20.
  • Each of the feeding elements 12 is connected to the high frequency circuit component 40 via the feeding line 25 and the conductor column 26.
  • the feeder line 25 constitutes a strip line together with the first ground conductor 21 and the second ground conductor 22 arranged above and below the feed line 25.
  • the conductor column 26 connects the feeder line 25 and the feeder element 12.
  • the high-frequency circuit component 40 transmits and receives a high-frequency signal to the radiating element 11 via the feeder line 25 and the conductor column 26. It should be noted that only one of transmission and reception may be performed.
  • the high frequency circuit component 40 is connected to the connector 41 via a strip line provided on the substrate 20.
  • a coaxial connector, a multi-pole connector, or the like is used as the connector 41.
  • a baseband signal or an intermediate frequency signal is transmitted / received to / from the high frequency circuit component 40 through a cable connected to the connector 41. Further, a DC power supply and various control signals are supplied to the high frequency circuit component 40 through the cable.
  • the top surface of the high frequency circuit component 40 (the surface opposite to the surface facing the lower surface of the substrate 20) is fixed to the motherboard 51 by the fixing member 43.
  • the fixing member 43 for example, a double-sided tape, an adhesive or the like is used.
  • the upper surface of the antenna module 10 faces the inner surface of the housing 50.
  • a gel-like first member 45 is arranged between the upper surface of the antenna module 10 and the inner surface of the housing 50.
  • the first member 45 is in contact with both the upper surface of the antenna module 10 and the inner surface of the housing 50.
  • thermal paste can be used as the first member 45.
  • the "gel-like member” means a member in which a colloidal solution is solidified into a solid state.
  • An example of thermal paste is a mixture of a base oil such as silicone oil and a heat conductive filler.
  • thermally conductive fillers include fine powders of metals, metal oxides, silica and the like.
  • thermal paste having a viscosity at 25 ° C. of 100 Pa ⁇ s or more and 450 Pa ⁇ s or less and a thermal conductivity of 3 W / m ⁇ K or more and 7 W / m ⁇ K or less can be used.
  • FIG. 2 is a cross-sectional view of the communication device according to the first embodiment, and corresponds to the cross section of the alternate long and short dash line 2-2 of FIG. 1A.
  • the non-feeding element 13 is connected to the first ground conductor 21 by a conductor column 27.
  • the connection point between the non-feeding element 13 and the conductor column 27 is the geometric center of the non-feeding element 13 in a plan view.
  • the conductor pillar 27 passes through a clearance hole provided in the power feeding element 12 and is insulated from the power feeding element 12.
  • the radiation characteristics of the radiating element 11 differ depending on whether the first member 45 is arranged between the upper surface of the antenna module 10 and the inner surface of the housing 50 and the case where air is filled between the first member 45.
  • the antenna is premised on the arrangement of the first member 45. It is necessary to design the module.
  • FIG. 3A is a cross-sectional view of a simulation target having the structure of the communication device according to the first embodiment.
  • the first member 45 is arranged between the antenna module 10 and the housing 50.
  • the antenna module 10 includes a substrate 20, a plurality of radiating elements 11, a first ground conductor 21, a second ground conductor 22, and a feeder, similarly to the antenna module 10 (FIGS. 1A, 1B, and 2) according to the first embodiment. Includes wire 25. Since the conductor pillar 27 (FIG. 2) connected to the non-feeding element 13 of the antenna module 10 according to the first embodiment does not substantially affect the radiation characteristics, the conductor pillar 27 is arranged as a simulation target. Not.
  • the plurality of radiating elements 11 are arranged in a matrix of 2 rows and 4 columns in a plan view.
  • the length of the long side of the substrate 20 was 10 mm, and the length of the short side was 5 mm.
  • the thickness of the housing 50 was set to 0.5 mm. Simulations were performed for three types in which the distance G between the antenna module 10 and the housing 50 was 0.05 mm, 0.10 mm, and 0.15 mm.
  • the relative permittivity of the substrate 20 was 3.5, and the dielectric loss tangent was 0.005.
  • the relative permittivity of the first member 45 was 5.0, and the dielectric loss tangent was 0.02.
  • the relative permittivity of the housing 50 was 4.0, and the dielectric loss tangent was 0.02.
  • FIG. 3B and 3C are perspective views and plan views of one radiation element 11, respectively, and FIG. 3D is a cross-sectional view taken along the alternate long and short dash line 3D-3D of FIG. 3C.
  • the radiating element 11 is optimized so that the return loss is small in the frequency range of 55 GHz or more and 65 GHz or less.
  • the feeding element 12 and the non-feeding element 13 have a shape in which small square notches are provided at the four corners of the square in a plan view.
  • the lengths of one side of the square before the notches of the feeding element 12 and the non-feeding element 13 were set to 1.19 mm and 0.99 mm, respectively.
  • the length of one side of the square of the cutout portion was set to 50 ⁇ m.
  • the width of the feeder line 25 was set to 30 ⁇ m.
  • the diameter of the conductor column 26 connecting the feeder line 25 and the feeder element 12 was set to 60 ⁇ m.
  • a pad 28 having a diameter of 130 ⁇ m is arranged on the conductor layer in which each of the feeder line 25, the first ground conductor 21, and the feeder element 12 is arranged. In a plan view, the center of the conductor column 26 and the center of the pad 28 coincide with the midpoint of one side of the feeding element 12.
  • the thickness of the feeding element 12, the non-feeding element 13, the first ground conductor 21, the second ground conductor 22, and the feeding line 25 was set to 10 ⁇ m.
  • the distance between the first ground conductor 21 and the feeder line 25 and the distance between the second ground conductor 22 and the feeder line 25 were both set to 50 ⁇ m.
  • the distance between the first ground conductor 21 and the feeding element 12 and the distance between the feeding element 12 and the non-feeding element 13 were both set to 100 ⁇ m.
  • All eight radiating elements 11 were excited in the same phase to form a beam in the normal direction of the upper surface of the substrate 20.
  • FIG. 4A is a graph showing the simulation result of the return loss S (1,1) of the simulation target (FIGS. 3A to 3D) according to the first embodiment.
  • FIG. 4B is a graph showing the simulation results of the return loss S (1,1) of the simulation target having the structure of the communication device according to the comparative example.
  • the first member 45 (FIG. 3A) is not arranged, and the relative permittivity of the space between the antenna module 10 and the housing 50 is 1.
  • FIG. 4C is a graph showing the simulation result of the return loss of only the antenna module 10 having no housing 50. The horizontal axis of the graphs of FIGS.
  • FIGS. 4A, 4B, and 4C represents the frequency in the unit "GHz", and the vertical axis represents the return loss in the unit "dB".
  • the thin solid line, the broken line, and the thick solid line indicate the return loss when the intervals G (FIG. 3A) are 0.05 mm, 0.10 mm, and 0.15 mm, respectively.
  • the return loss (FIG. 4A) of the simulation target according to the first embodiment is the smallest.
  • a return loss of ⁇ 14 dB or less is realized in the frequency range of 55 GHz or more and 65 GHz or less.
  • the return loss is -13 dB or more in the frequency range of 55 GHz or more and 65 GHz or more.
  • the return loss (FIG. 4C) of the simulation target of only the antenna module 10 is -4 dB or more in the frequency range of 55 GHz or more and 65 GHz.
  • FIG. 5A is a graph showing the simulation result of the gain of the bore site to be simulated according to the first embodiment.
  • FIG. 5B is a graph showing the simulation result of the gain of the bore site to be simulated by the comparative example.
  • FIG. 5C is a graph showing a simulation result of the gain of the bore sight of only the antenna module 10 having no housing 50.
  • the horizontal axis of the graphs of FIGS. 5A, 5B, and 5C represents the frequency in the unit "GHz", and the vertical axis represents the gain in the unit "dBi".
  • the thin solid line, broken line, and thick solid line indicate the gains when the spacing G (FIG. 3A) is 0.05 mm, 0.10 mm, and 0.15 mm, respectively.
  • the gain of the simulation target according to the first embodiment is the largest.
  • a gain of 14 dBi is obtained at a frequency of 60 GHz.
  • the gain is almost unchanged even if the interval G (FIG. 3A) changes.
  • the gain is distributed in the range of about 12 dBi to 13 dBi at a frequency of 60 GHz. As the interval G changes, so does the gain.
  • the simulation target of only the antenna module 10 as shown in FIG.
  • the gain is about 10.6 dBi at a frequency of 60 GHz. Further, in the frequency range of 55 GHz or more and 65 GHz or less, the gain of the simulation target according to the first embodiment (FIG. 5A) is higher than the gain of other simulation targets (FIGS. 5B and 5C).
  • the antenna module 10 designed with the structure in which the first member 45 is arranged is not suitable for incorporation into a communication device in which the first member 45 is not arranged.
  • the return loss is -10 dB or less in the entire operating frequency band of the antenna module 10 with the first member 45 arranged, and the return loss in a part of the operating frequency band without the first member 45 arranged.
  • the antenna module 10 is designed on the premise that the first member 45 is arranged.
  • the relative permittivity of the substrate 20 and the housing 50 is about 3 or more and 7 or less.
  • the relative permittivity of air is about 1. Therefore, when the space between the antenna module 10 and the housing 50 is filled with air, the dielectric constant of the propagation path of the radio wave radiated from the radiating element 11 changes abruptly on the inner surface of the housing 50. .. Since radio waves are reflected at the interface where the dielectric constant changes, the radiation characteristics of the antenna are affected by the housing 50. Further, if the distance between the antenna module 10 and the inner surface of the housing 50 varies, the influence of the housing 50 on the radiation characteristics also varies.
  • the distance between the antenna module 10 and the inner surface of the housing 50 varies within a certain range among individuals due to manufacturing variations of the housing 50 and the antenna module 10. Therefore, the radiation characteristics of the antenna vary among individuals.
  • the first member 45 is arranged between the antenna module 10 and the inner surface of the housing 50.
  • the permittivity of the first member 45 is larger than the permittivity of air.
  • the difference in the relative permittivity between the housing 50 and the first member 45 is smaller than the difference in the relative permittivity between the housing 50 and air.
  • the relative permittivity of general thermal paste is about 5. Therefore, the degree of discontinuity of the dielectric constant on the inner surface of the housing 50 is reduced. As the degree of dielectric constant discontinuity decreases, the reflected wave of radio waves from this interface is reduced. As a result, the change in the radiation characteristics of the antenna due to the variation in the distance between the antenna module 10 and the inner surface of the housing 50 becomes small. As a result, an excellent effect of reducing the variation between individuals in the radiation characteristics of the antenna can be obtained.
  • the gain (FIG. 5A) of the simulation target according to the first embodiment varies. Is smaller than the variation in the gain (FIG. 5B) of the simulation target according to the comparative example. From this simulation result, it can be seen that by arranging the first member 45 between the antenna module 10 and the housing 50, the variation in the radiation characteristics of the antenna among individuals is reduced.
  • the first member 45 functions as a heat transfer path from the high frequency circuit component 40 to the housing 50.
  • the ground terminal of the high frequency circuit component 40 (FIG. 2) is connected to the first member 45 via the second ground conductor 22, the via conductor 23, the first ground conductor 21, the conductor column 27, and the non-feeding element 13. ing. Since the conductor column 27 connecting the non-feeding element 13 and the first ground conductor 21 functions as a heat transfer path, the heat transfer path from the high frequency circuit component 40 to the housing 50 is compared with the configuration in which the conductor column 27 is not provided. Thermal resistance can be reduced. Therefore, the heat generated in the high frequency circuit component 40 can be efficiently dissipated to the housing 50. Even if the conductor column 27 is not provided, the potential at the geometric center of the non-feeding element 13 is approximately 0 V at high frequencies, so that the conductor column 27 substantially affects the high frequency signal excited by the non-feeding element 13. Do not give.
  • the first member 45 (FIG. 1B) is in the form of a gel, the adhesion between the first member 45 and the antenna module 10 and the adhesion between the first member 45 and the housing 50 can be improved. As a result, it is possible to prevent the thermal resistance of the heat transfer path from the antenna module 10 to the housing 50 from increasing due to insufficient adhesion.
  • FIG. 6 is a cross-sectional view of a communication device according to a modified example of the first embodiment.
  • the conductor column 27 is insulated from the feeding element 12.
  • the conductor column 27 is connected to the feeding element 12. The connection point between the two coincides with the geometric center of the feeding element 12 in a plan view.
  • the power feeding element 12 is short-circuited to the first ground conductor 21 in terms of direct current.
  • the configuration of the modified example shown in FIG. 6 can be adopted.
  • the feeder line 25, the conductor column 26, and the feeder element 12 are also used as heat transfer paths. Therefore, the thermal resistance of the heat transfer path from the high frequency circuit component 40 (FIG. 1B) to the housing 50 (FIG. 1B) can be further reduced.
  • each of the plurality of radiating elements 11 (FIGS. 1B and 2) is composed of the feeding element 12 and the non-feeding element 13 loaded therein, but the non-feeding element 13 is loaded.
  • the radiating element 11 may be configured only by the feeding element 12.
  • the power feeding element 12 is arranged on the upper surface of the substrate 20 (FIG. 1B), and the feeding element 12 comes into contact with the first member 45 (FIG. 1B).
  • the feeder line 25, the conductor column 26, and the feeder element 12 function as the main heat transfer paths.
  • the plurality of non-feeding elements 13 are in direct contact with the first member 45, but the upper surfaces of the non-feeding elements 13 and the substrate 20 may be covered with a protective film.
  • a protective film is interposed between the non-feeding element 13 and the first member 45. Even when the protective film is arranged, the protective film is generally sufficiently thin, so that a heat transfer path from the non-feeding element 13 to the first member 45 is secured through the protective film.
  • the number of radiating elements 11 are arranged in a matrix of 2 rows and 4 columns, but the number of radiating elements 11 may be other than 8. Further, the mode of the two-dimensional arrangement of the plurality of radiating elements 11 may be changed. Further, the shapes of the feeding element 12 and the non-feeding element 13 in a plan view are not limited to the shapes with the four corners cut out. For example, the shape in a plan view may be a square, a rectangle, a circle, an ellipse, or the like.
  • FIG. 7A is a cross-sectional view of the communication device according to the second embodiment.
  • the antenna module 10 of the communication device according to the second embodiment includes a plurality of conductor columns 30 in addition to the configuration of the antenna module 10 (FIG. 1B) of the communication device according to the first embodiment.
  • the plurality of conductor columns 30 are arranged at positions that do not overlap with the radiating element 11 in a plan view.
  • Each of the plurality of conductor columns 30 reaches from the first ground conductor 21 to the upper surface of the substrate 20.
  • the upper ends of each of the plurality of conductor columns 30 are in contact with the first member 45.
  • each of the plurality of conductor columns 30 is connected to the first member 45 via the protective film.
  • the plurality of conductor columns 30 function as a part of the heat transfer path from the high frequency circuit component 40 to the housing 50. Therefore, an excellent effect of lowering the thermal resistance of the heat transfer path can be obtained.
  • FIG. 7B is a cross-sectional view of a communication device according to a modified example of the second embodiment.
  • the antenna module 10 of the communication device according to this modification has a plurality of conductor patterns 31 arranged on the upper surface of the substrate 20 in addition to the configuration of the antenna module 10 of the communication device according to the second embodiment shown in FIG. 7A.
  • the plurality of conductor patterns 31 are arranged corresponding to the plurality of conductor columns 30, and each of the plurality of conductor patterns 31 is connected to the upper end of the corresponding conductor column 30.
  • the area of the interface between the first member 45 and the conductor pattern 31 is larger than the area of the interface between the first member 45 and the conductor column 30 in the second embodiment.
  • the area of the interface between different substances appearing in the heat transfer path is larger than that in the second embodiment, so that an excellent effect of lowering the thermal resistance of the heat transfer path can be obtained.
  • the conductor pattern 31 is connected to all the conductor columns 30, but the conductor pattern 31 is connected to only some of the conductor columns 30 among the plurality of conductor columns 30. You may.
  • FIG. 8 is a cross-sectional view of the communication device according to the third embodiment.
  • the communication device according to the third embodiment has a gel-like second member 46 in addition to the configuration of the communication device (FIG. 1B) according to the first embodiment.
  • the second member 46 reaches the first member 45 from the side surface of the high-frequency circuit component 40 via the end surface of the substrate 20. Further, the second member 46 reaches the housing 50.
  • Thermal paste can be used as the second member 46.
  • the same thermal paste may be used for the first member 45 and the second member 46. In this case, since the first member 45 and the second member 46 are integrated, it is not possible to clearly distinguish between them.
  • the second ground conductor 22 arranged on the lower surface of the substrate 20 is also in contact with the second member 46.
  • the end face of the first ground conductor 21 is exposed on the end face of the substrate 20, and the first ground conductor 21 is in contact with the second member 46 on the exposed end face.
  • the second member 46 functions as a heat transfer path from the high frequency circuit component 40 to the housing 50. Further, the high frequency circuit component 40 is connected to the second member 46 via the first ground conductor 21 and the second ground conductor 22. Therefore, a heat transfer path from the high frequency circuit component 40 to the second member 46 via the first ground conductor 21 and a heat transfer path to the second member 46 via the second ground conductor 22 are formed. Therefore, an excellent effect that the thermal resistance of the heat transfer path from the high frequency circuit component 40 to the housing 50 is further reduced can be obtained.
  • Antenna module 11 Radiating element 12 Feeding element 13 Non-feeding element 20 Board 21 First ground conductor 22 Second ground conductor 23 Via conductor 25 Feed line 26, 27 Conductor pillar 28 Pad 30 Conductor pillar 31 Conductor pattern 40 High frequency circuit component 41 Connector 43 Fixing member 45 First member 46 Second member 50 Housing 51 Mother

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Abstract

Des éléments rayonnants sont disposés sur un substrat d'un module d'antenne. Le module d'antenne est logé à l'intérieur d'un boîtier. Un premier élément sous la forme d'un gel est disposé entre une surface du module d'antenne faisant face à une direction de pointage et une surface intérieure du boîtier. Le premier élément est en contact avec le module d'antenne et le boîtier. Selon cette structure, il est possible de supprimer les variations des caractéristiques de rayonnement d'ondes radio dues au boîtier.
PCT/JP2021/006458 2020-03-26 2021-02-19 Dispositif de communication WO2021192766A1 (fr)

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JP2020-056001 2020-03-26
JP2020056001 2020-03-26

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023084981A1 (fr) * 2021-11-12 2023-05-19 パナソニックＩｐマネジメント株式会社 Dispositif électronique

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004106737A (ja) * 2002-09-19 2004-04-08 Honda Motor Co Ltd 船外機
WO2013161856A1 (fr) * 2012-04-26 2013-10-31 株式会社 日立製作所 Marqueur pour des dispositifs de communication mobile
JP2015215226A (ja) * 2014-05-09 2015-12-03 オムロン株式会社 状態検出装置
WO2016047005A1 (fr) * 2014-09-25 2016-03-31 日本電気株式会社 Système d'antenne
JP2018006437A (ja) * 2016-06-28 2018-01-11 株式会社村田製作所 複合デバイス

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004106737A (ja) * 2002-09-19 2004-04-08 Honda Motor Co Ltd 船外機
WO2013161856A1 (fr) * 2012-04-26 2013-10-31 株式会社 日立製作所 Marqueur pour des dispositifs de communication mobile
JP2015215226A (ja) * 2014-05-09 2015-12-03 オムロン株式会社 状態検出装置
WO2016047005A1 (fr) * 2014-09-25 2016-03-31 日本電気株式会社 Système d'antenne
JP2018006437A (ja) * 2016-06-28 2018-01-11 株式会社村田製作所 複合デバイス

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023084981A1 (fr) * 2021-11-12 2023-05-19 パナソニックＩｐマネジメント株式会社 Dispositif électronique

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