WO2021190198A1 - Electronic device - Google Patents

Electronic device Download PDF

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Publication number
WO2021190198A1
WO2021190198A1 PCT/CN2021/076446 CN2021076446W WO2021190198A1 WO 2021190198 A1 WO2021190198 A1 WO 2021190198A1 CN 2021076446 W CN2021076446 W CN 2021076446W WO 2021190198 A1 WO2021190198 A1 WO 2021190198A1
Authority
WO
WIPO (PCT)
Prior art keywords
sound guide
electronic device
functional module
housing
hole
Prior art date
Application number
PCT/CN2021/076446
Other languages
French (fr)
Chinese (zh)
Inventor
梁源标
Original Assignee
维沃移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Publication of WO2021190198A1 publication Critical patent/WO2021190198A1/en

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Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/20Arrangements for obtaining desired frequency or directional characteristics
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/03Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
    • H04M1/035Improving the acoustic characteristics by means of constructional features of the housing, e.g. ribs, walls, resonating chambers or cavities
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/18Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment

Definitions

  • the present invention relates to the field of communication technology, and in particular to an electronic device.
  • Electronic devices such as smart phones and tablet computers have become indispensable products in modern life.
  • Acoustic devices such as receivers, microphones, speakers, etc., are usually provided in electronic devices, and the acoustic devices can achieve the acoustic performance of the electronic devices.
  • the acoustic device is provided in the housing of the electronic device, and the housing of the electronic device is provided with a sound guide hole.
  • the sound information of the user can be transmitted to the acoustic device through the sound guide hole, or the sound information of the acoustic device can be transmitted to the acoustic device through the opening.
  • the user in order to realize the interaction between the user and the sound information of the electronic device.
  • the housing needs to be provided with a sound guide hole for transmitting sound information.
  • the sound guide hole destroys the integrity of the housing, and at the same time, it also causes the electronic equipment to have low waterproof and dustproof properties, thus As a result, the safety and reliability of electronic equipment is poor.
  • the invention discloses an electronic device to solve the problems of poor appearance consistency and low safety and reliability of the electronic device.
  • the present invention is implemented as follows:
  • an embodiment of the present invention discloses an electronic device, including a housing, a first functional module, and a second functional module.
  • the second functional module is disposed in the housing, and the The second functional module includes an acoustic device, a sound guide channel is opened in the housing, the first functional module at least partially protrudes from the outer surface of the housing, and the outer surface of the housing is connected to the first There is an assembly gap between the side walls of the functional module, and the acoustic device communicates with the assembly gap through the sound guide channel.
  • the acoustic device communicates with the assembly gap through the sound guide channel.
  • the sound information enters the housing through the assembly gap, and the assembly gap is transmitted to the acoustic device through the sound guide channel; or when the acoustic device emits sound information, the sound information is transmitted to the assembly gap through the sound guide channel, and then through The assembly gap is transmitted to the user, so as to realize the interaction between the user and the sound information of the electronic device.
  • the housing and the first functional module have an assembly gap after being assembled, so the assembly gap between the first functional module and the housing can be used to transmit sound information, so that there is no need to open a sound guide hole on the housing.
  • the number of openings of the casing is reduced, thereby improving the appearance consistency of the casing, so that the appearance of the casing is better and the user experience is improved.
  • the assembly gap is narrower than the sound guide hole, which can effectively alleviate the water vapor and dust in the environment from entering the housing, thereby improving the waterproof performance and dustproof performance of the electronic device.
  • FIG. 1 is a schematic diagram of a partial structure of an electronic device disclosed in an embodiment of the present invention
  • Figure 2 is a partial enlarged view of Figure 1;
  • Fig. 3 is a cross-sectional view of an electronic device disclosed in an embodiment of the present invention.
  • an embodiment of the present invention discloses an electronic device.
  • the electronic device includes a housing 100, a first functional module 200, and a second functional module.
  • the housing 100 provides an installation basis for other components of the electronic device.
  • the second functional module may be disposed in the housing 100, and the second functional module includes an acoustic device 300, which may include at least one of a microphone, a receiver, and a speaker.
  • a sound guide channel 400 is opened in the housing 100, and the sound guide channel 400 is used to transmit sound information.
  • the first functional module 200 at least partially protrudes from the outer surface of the housing 100, and the part of the first functional module 200 protruding from the outer surface of the housing 100 covers part of the outer surface of the housing 100.
  • the outer surface of the housing 100 There is an assembly gap 101 between it and the side wall of the first functional module 200. One port of the assembly gap 101 is exposed on the outer surface of the housing 100.
  • the channel 400 communicates with the assembly gap 101.
  • the housing 100 may include a front cover and a back cover.
  • the front cover may provide an installation basis for the display screen of the electronic device, and the back cover may be the battery cover of the electronic device.
  • the existing electronic devices are gradually developing towards a full screen.
  • Most of the functional modules set above have been cancelled. Therefore, the first functional module 200 can be installed on the back cover of the housing 100.
  • the first functional module 200 can be a rear camera module of an electronic device, or it can be The flash can also be a fingerprint module.
  • the first functional module 200 may also be other functional modules, which is not limited herein.
  • the housing 100 and the first functional module 200 have an assembly gap 101 after being assembled. Therefore, the assembly gap 101 between the first functional module 200 and the housing 100 can be used to transmit sound information, so that the housing There is no need to provide sound guide holes on the housing 100, thereby reducing the number of openings of the housing 100, thereby improving the integrity and appearance consistency of the housing 100, so that the housing 100 has a better appearance and texture, and the user experience is improved.
  • the assembly gap 101 is narrower than the sound guide hole, which can effectively prevent moisture and dust in the environment from entering the housing 100, thereby improving the waterproof performance and dustproof performance of the electronic device.
  • the assembly gap 101 between the housing 100 and the first functional module 200 is used to transmit sound information, and the housing 100 does not need to process additional sound guide holes, thereby optimizing the processing technology of the housing 100 and simplifying the processing steps of the housing 100 , Thereby reducing the manufacturing cost of electronic equipment.
  • the penetration direction of the assembly slit 101 may be parallel to the outer surface of the housing 100.
  • the assembly gap 101 penetrates laterally, and the first functional module 200 and the housing 100 form an edge of the assembly gap, which can prevent dust and moisture from floating into the assembly gap 101, further improving the waterproof and dustproof performance of the electronic device.
  • the assembly gap 101 may include a plurality of sub-slits arranged at intervals, the plurality of sub-slits are arranged at intervals, and the plurality of sub-slits all penetrate the outer surface of the electronic device, and each sub-slit passes through the sound conducting channel 400 It communicates with the acoustic device 300.
  • the length of the sub-slot can be set to be smaller, so that the sub-slot is more concealed.
  • the sub-slits arranged in different directions correspond to different pickup positions and sound emitting positions, so that the stereo effect of the electronic device can be realized, and the use performance of the electronic device can be improved.
  • a plurality of sub-slits may be arranged around the first functional module 200.
  • the electronic device disclosed in the embodiment of the present invention may further include a switching element.
  • the switching element has at least one conduction position. When the switching element is located in the conduction position, the at least one sub-slit is connected to the sound guide channel 400. Connected. When the switching element is in the conducting position, at least one sub-slit is connected to the acoustic device 300 through the sound conducting channel 400.
  • the switching element is connected to the sub-slits in different directions at different conduction positions, so that the directional sound pickup or directional sound generation of the electronic device can be realized, and the sound information can be transmitted to the designated position, thereby improving the performance of the electronic device. Use performance.
  • the switch piece can block the assembly gap 101, and the switch piece is not in the conducting position at this time, so that the waterproof performance and dustproof performance of the electronic device can be improved.
  • the switching element may be provided in the housing 100, the switching element is provided with a connecting hole, and the housing 100 is also provided with a driving mechanism.
  • the switching element is driven to rotate by manipulating the driving mechanism, so that the connecting holes on the switching element are connected with the sub-slits at different positions.
  • the first functional module 200 may include a first functional device 220 and a module bracket 210.
  • the first functional device 220 is mounted on the module bracket 210, and the module bracket 210 has a disc-shaped structure. At least part of the module support 210 protrudes from the outer surface of the housing 100, and an assembly gap 101 is formed between the outer surface of the housing 100 and the side wall of the module support 210.
  • the sound is not likely to affect the first functional device 220 during the transmission process.
  • water vapor and dust in the external environment cannot easily enter the first functional device 220, thereby improving the reliability of the electronic device.
  • the first functional module 200 when the first functional module 200 is a camera module, the first functional device 220 may be a camera and other electronic components, and the module bracket 210 provides an installation basis for the camera and other electronic components.
  • the switching element is driven by the driving mechanism.
  • the switching element rotates, it needs to consume electric energy, which increases the energy consumption of the electronic device.
  • the housing 100 also needs to reserve installation space for the driving mechanism, thereby causing the electronic device
  • the structure is complex.
  • the switching element is arranged around the edge of the module support 210, the switching element is rotatable relative to the module support 210 and the housing 100, the switching element is provided with a connecting hole, and the switching element is in the conducting position In the case of, the connecting hole communicates with at least one sub-slit.
  • the switch is arranged on the outside of the housing 100, and the user can manually drive the switch to rotate, thereby reducing the energy consumption of the electronic device.
  • the switching element can also be used as a decorative element of the first functional module 200, so that no additional decorative element is required, thereby making the structure of the electronic device simpler and the cost of the electronic device lower.
  • the assembly gap 101 may be a slender strip, and the width of the assembly gap 101 can be reduced to make the assembly gap 101 more concealed.
  • the width is the first functional module 200 and the housing 100.
  • the extension direction of the assembly gap 101 is the length direction of the assembly gap 101. At this time, the length of the assembly gap 101 can be increased, so that the area of the assembly gap 101 can be increased, thereby meeting the sound conduction requirements of the acoustic device 300.
  • the assembly gap 101 can be a linear elongated strip structure, or can be an arc-shaped elongated strip structure.
  • the shape and structure of the assembly gap 101 can be determined by the shape and structure of the first functional module 200 and the second functional module.
  • the assembly gap 101 may have an arc structure, which is smoother than a linear structure without edges and corners, thereby making the electronic device more beautiful and further improving the user experience.
  • the side wall of the first functional module 200 may be provided with a notch, the notch is exposed outside the housing 100, and the notch and the housing 100 form an assembly gap 101 .
  • part of the material is removed from the edge of the side wall of the first functional module 200, so that the assembly gap 101 between the housing 100 and the first functional module 200 is larger, thereby increasing the area of the assembly gap 101.
  • the assembly gap 101 can transmit more sound information, improve the performance of the acoustic device 300, and make the sound quality of the electronic device better.
  • the notch can be in the shape of a slender strip, of course, it can also be in other shapes, which is not limited herein.
  • the sound guide channel 400 may include a first sound guide section 410, a second sound guide section 420, and a third sound guide section 430 connected in sequence.
  • the first sound guide section 410 In communication with the assembly gap 101, the acoustic device 300 is located at the end of the third sound guide section 430 away from the second sound guide section 420.
  • the central axis of the first sound guide section 410 intersects with the center axis of the second sound guide section 420.
  • the center axis of the sound segment 410 is parallel to the center axis of the third sound guide segment 430.
  • the sound guide channel 400 has a bent structure, so that the side walls of each sound guide section can block dust and water vapor; at the same time, the sound guide channel 400 has a longer path, so that most of the dust and water vapor can settle and adhere.
  • dust and water vapor cannot easily reach the installation position of the acoustic device 300, and the sound guide opening of the acoustic device 300 is not easily blocked, so that the sound quality of the acoustic device 300 is better.
  • the included angle between the center axis of the first sound guide section 410 and the center axis of the second sound guide section 420 may be 90°.
  • the central axis of 420 may be perpendicular.
  • the structure of the sound guide channel 400 is relatively compact, so that the space of the housing 100 occupied by the sound guide channel 400 is smaller.
  • the first functional module 200 is provided with a connecting channel 211, the assembly gap 101 and the first sound guide section 410 are connected through the connecting channel 211, and the central axis of the connecting channel 211 and the central axis of the first sound guide section 410 can intersect ,
  • the central axis of the assembly gap 101 and the central axis of the connecting channel 211 may be collinear.
  • the assembly gap 101 and the sound guide channel 400 are connected through the connecting channel 211, thereby extending the sound transmission path, so that water vapor and dust can adhere to the inner wall of the connecting channel 211, further improving the safety of the electronic device And reliability.
  • the connecting channel 211 is opened on the module bracket 210.
  • the module bracket may include a decorative ring.
  • the module bracket can not only play a role of decoration and protection, but also can be used to install the first functional device 220, thereby making the structure of the electronic device more compact .
  • the electronic device disclosed in the embodiment of the present invention may further include a motherboard bracket 510, the motherboard bracket 510 is used to install electronic components of the electronic device, the motherboard bracket 510 is provided in the housing 100, and the first sound guide section 410 may Set in the first functional module 200, the second sound guide section 420 and the third sound guide section 430 can be opened on the main board bracket 510, the first sound guide section 410, the third sound guide channel 400 and the second sound guide channel 400 have With a certain included angle, when the second sound guide segment 420 is made by pouring, the second sound guide segment 420 is located inside the motherboard bracket 510, and the motherboard bracket 510 is difficult to demold, which makes electronic equipment processing difficult and costly. high.
  • the electronic device disclosed in the embodiment of the present invention further includes a cover plate 520.
  • the cover plate 520 may be located in the housing 100.
  • the cover plate 520 and the first groove can form a second sound guide segment 420.
  • One end of the cover plate 520 may be provided with a first through hole 521, and the second sound conducting section 420 and the first sound conducting section 410 may communicate with each other through the first through hole 521.
  • the bottom wall of the first groove may be provided with a third sound guide section 430, and the first through holes 521 and the third sound guide section 430 are distributed in a staggered manner.
  • the main board bracket 510 can first be processed into the first groove by casting.
  • the main board bracket 510 is easier to demold, and then the cover plate 520 is covered on the notch of the first groove, thereby The second sound guide segment 420 is formed.
  • the second sound guide segment 420 is easy to process, so that the processing difficulty of the electronic device is small and the cost is low.
  • the cover plate 520 may be bonded to the main board bracket 510 by using double-sided adhesive.
  • the cover plate 520 may be a polyethylene terephthalate (PET) plate or a metal plate.
  • PET polyethylene terephthalate
  • the cover plate 520 can strengthen the rigidity of the main board bracket 510 , To enhance the overall rigidity of the motherboard bracket 510.
  • the first sound guide segment 410 can be arranged on the first functional module 200, and the second sound guide segment 420 can be arranged on the main board bracket 510. At this time, the first sound guide segment 410 and the second sound guide There is a gap between the segments 420, and sound can enter the gap, causing sound leakage of the electronic device, resulting in poor sound quality of the electronic device.
  • the electronic device disclosed in the embodiment of the present invention may further include a first sealing member 610, and the first functional module 200 and the cover plate 520 are hermetically connected through the first sealing member 610, and the first sealing member 610 A portion opposite to the first through hole 521 may be provided with a first escape hole 611, and the first sound guide segment 410 and the second sound guide segment 420 are communicated with the first through hole 521 through the first escape hole 611.
  • the first sealing member 610 can seal the gap between the first sound guide segment 410 and the second sound guide segment 420, thereby preventing the sound leakage of the electronic device, thereby making the sound quality of the electronic device better.
  • the first sealing member 610 can block dust and water vapor in the sound guide channel 400, thereby preventing the dust and water vapor from damaging the electronic components of the electronic device.
  • the first sealing member 610 may be made of materials such as silica gel or rubber.
  • the cover plate 520 is overlapped on the board surface of the main board bracket 510.
  • the stack height of the main board bracket 510 and the cover plate 520 is relatively large. Large, which makes the thickness of the electronic device larger, resulting in a poor user experience.
  • the side of the motherboard support 510 facing the first functional module 200 may further be provided with a second groove 511, the first groove may be opened on the bottom of the second groove 511, and the first groove 511 The notch of the groove is located at the bottom of the second groove 511, and the cover plate 520 overlaps the bottom of the second groove 511.
  • the first groove and the second groove 511 can form a sinker structure, at least part of the cover plate 520 is located in the second groove 511.
  • the cover plate 520 can be hidden in the second groove 511, so that the leakage volume of the cover plate 520 is reduced, and the stack height of the main board bracket 510 and the cover plate 520 is smaller.
  • the stacked structure of the board 520 occupies a small space in the housing 100, so that the thickness of the electronic device is small.
  • the electronic device disclosed in the embodiment of the present invention may further include a circuit board 530 for mounting electronic components of the electronic device.
  • the circuit board 530 can be arranged on the side of the main board support 510 away from the first functional module 200, the circuit board 530 can be provided with a second through hole 531, and the acoustic device 300 can be arranged on the side of the circuit board 530 away from the main board support 510.
  • the acoustic device 300 communicates with the third sound guide section 430 through the second through hole 531.
  • the acoustic device 300 may be disposed on the side of the circuit board 530 away from the main board bracket 510, so that the acoustic device 300 will not interfere with the main board bracket 510, thereby making the electronic device more reliable.
  • the circuit board 530 may be the main board of the electronic device, or the sub-board of the electronic device.
  • the circuit board 530 may be a rigid circuit board or a flexible circuit board.
  • the circuit board 530 may be a printed circuit board, or a flexible and rigid combination board, or the circuit board 530 may include a flexible circuit board and a reinforcing board that are attached to each other.
  • other structural forms can also be used, and this article does not restrict it.
  • the electronic device disclosed in the embodiment of the present invention may further include a second sealing member 620, and the circuit board 530 may pass through the second sealing member.
  • 620 is connected to the main board bracket 510 in a sealed manner, the second sealing member 620 is provided with a second escape hole 621 at a position opposite to the second through hole 531, and the third sound conducting section 430 and the second through hole 531 are in communication with each other through the second escape hole 621 .
  • the second sealing member 620 can block the gap between the third sound conducting section 430 and the second through hole 531, thereby preventing sound leakage of the electronic device, and further improving the sound quality of the electronic device.
  • the second sealing member 620 may be made of materials such as silica gel or rubber.
  • the side of the motherboard support 510 away from the first functional module 200 may also be provided with a third groove, and the second sealing member 620 is disposed in the third groove.
  • the second sealing member 620 It can be hidden in the third groove, so that the leakage volume of the second sealing member 620 is reduced, so that the stack height of the structure formed by the main board bracket 510, the second sealing member 620, and the circuit board 530 is small, and the main board bracket 510
  • the structure formed by the second sealing member 620 and the circuit board 530 occupies a small space in the housing 100, so that the thickness of the electronic device is small.
  • the electronic device disclosed in the embodiment of the present invention may further include a dust-proof part 630, and the dust-proof part 630 may be disposed between the third sound guide section 430 and the second through hole 531.
  • the dust-proof part 630 can block most of the dust in the third sound guide section 430, so that it is not easy for dust to enter the second through hole 531.
  • the dust in the second through hole 531 is relatively small, so it does not affect the acoustics.
  • the sound quality of the device 300 may further include a dust-proof part 630, and the dust-proof part 630 may be disposed between the third sound guide section 430 and the second through hole 531.
  • the dust-proof part 630 can block most of the dust in the third sound guide section 430, so that it is not easy for dust to enter the second through hole 531.
  • the dust in the second through hole 531 is relatively small, so it does not affect the acoustics.
  • the sound quality of the device 300 may further include a dust-proof part
  • the dust-proof part 630 may be sandwiched between the main board bracket 510 and the circuit board 530, so that the main board bracket 510 does not need to be equipped with a component for installing the dust-proof part 630, so that the installation operation of the dust-proof part 630 is simple and convenient.
  • the first functional module 200 may be a disc structure
  • the assembly gap 101 may be a ring structure
  • a part of the assembly gap 101 is communicated with the sound guide channel 400.
  • the assembly gap 101 may have a ring structure, which is relatively smooth and has no edges and corners, which makes the electronic device more beautiful and further improves the user experience.
  • the assembling slits 101 are all connected with the sound guide channel 400.
  • the assembling gap 101 of the ring structure can both pick up or emit sound from the electronic device, so as to realize the stereo sound channel of the electronic device.
  • the area of the assembling gap 101 is larger, so that the sound quality of the electronic device is better.
  • the electronic devices disclosed in the embodiments of the present invention may be devices such as smart phones, tablet computers, e-book readers, wearable devices (such as smart watches), and electronic game consoles.
  • the embodiments of the present invention do not limit the specific types of electronic devices.

Abstract

Disclosed is an electronic device, comprising a housing, a first functional module and a second functional module, wherein the second functional module is arranged inside the housing; the second functional module comprises an acoustic device; a sound guide channel is provided inside the housing; at least part of the first functional module protrudes from the outer surface of the housing; an assembly gap is provided between the outer surface of the housing and the side wall of the first functional module; and the acoustic device is in communication with the assembly gap by means of the sound guide channel.

Description

电子设备Electronic equipment
交叉引用cross reference
本发明要求在2020年03月27日提交中国专利局、申请号为202010234157.6、发明名称为“电子设备”的中国专利申请的优先权,该申请的全部内容通过引用结合在本发明中。The present invention claims the priority of a Chinese patent application filed with the Chinese Patent Office with an application number of 202010234157.6 and an invention title of "electronic equipment" on March 27, 2020. The entire content of the application is incorporated into the present invention by reference.
技术领域Technical field
本发明涉及通信技术领域,尤其涉及一种电子设备。The present invention relates to the field of communication technology, and in particular to an electronic device.
背景技术Background technique
智能手机、平板电脑等电子设备已经成为现代人生活中不可或缺的产品。电子设备中通常设置有声学器件,例如受话器、麦克风、扬声器等,声学器件能够实现电子设备的声学性能。Electronic devices such as smart phones and tablet computers have become indispensable products in modern life. Acoustic devices, such as receivers, microphones, speakers, etc., are usually provided in electronic devices, and the acoustic devices can achieve the acoustic performance of the electronic devices.
相关技术中,声学器件设置于电子设备的壳体内,电子设备的壳体上开设导音孔,用户发出声音信息可以通过导音孔传递至声学器件,或者声学器件发声音信息通过开孔传递至用户,以实现用户与电子设备的声音信息的交互。In the related art, the acoustic device is provided in the housing of the electronic device, and the housing of the electronic device is provided with a sound guide hole. The sound information of the user can be transmitted to the acoustic device through the sound guide hole, or the sound information of the acoustic device can be transmitted to the acoustic device through the opening. The user, in order to realize the interaction between the user and the sound information of the electronic device.
然而,上述方案中,壳体上需要开设传递声音信息的导音孔,此时,导音孔破坏了壳体的完整性,同时,也导致电子设备的防水性和防尘性较低,从而造成电子设备的安全性和可靠性较差。However, in the above solution, the housing needs to be provided with a sound guide hole for transmitting sound information. At this time, the sound guide hole destroys the integrity of the housing, and at the same time, it also causes the electronic equipment to have low waterproof and dustproof properties, thus As a result, the safety and reliability of electronic equipment is poor.
发明内容Summary of the invention
本发明公开一种电子设备,以解决电子设备的外观一致性不高,安全性和可靠性较低的问题。The invention discloses an electronic device to solve the problems of poor appearance consistency and low safety and reliability of the electronic device.
为了解决上述技术问题,本发明是这样实现的:In order to solve the above technical problems, the present invention is implemented as follows:
第一方面,本发明实施例公开了一种电子设备,包括壳体、第一功能模组和第二功能模组,所述第二功能模组设置于所述壳体之内,且所述第二功能模组包括声学器件,所述壳体内开设有导音通道,所述第一功能模组至少部分凸出所述壳体的外表面,所述壳体的外表面与所述第一功能模组的侧壁之间具有装配缝隙,所述声学器件通过所述导音通道与所述装配缝隙连通。In a first aspect, an embodiment of the present invention discloses an electronic device, including a housing, a first functional module, and a second functional module. The second functional module is disposed in the housing, and the The second functional module includes an acoustic device, a sound guide channel is opened in the housing, the first functional module at least partially protrudes from the outer surface of the housing, and the outer surface of the housing is connected to the first There is an assembly gap between the side walls of the functional module, and the acoustic device communicates with the assembly gap through the sound guide channel.
本发明采用的技术方案能够达到以下有益效果:The technical scheme adopted by the present invention can achieve the following beneficial effects:
在本发明实施例中,壳体的外表面与第一模组的侧壁之间具有装配缝隙,声学器件通过导音通道与装配缝隙连通。当用户发出声音信息时,声音信息经由装配缝隙进入壳体内,装配缝隙通过导音通道传递至声学器件;或者,当声学器件发声音信息时,声音信息通过导音通道传递至装配缝隙,再经由装配缝隙传递至用户,从而实现用户与电子设备的声音信息的交互。此方案中,壳体与第一功能模组装配后具有装配缝隙,因此可以利用第一功能模组和壳体之间的装配缝隙传递声音信息,从而使得壳体上无需开设导音孔,从而减少了壳体的开孔数量,进而提高了壳体的外观一致性,从而使得壳体的外观质感较好,改善 了用户体验。同时,装配缝隙相对于导音孔更窄,从而能够有效地缓解环境中的水汽和灰尘进入壳体,进而提高了电子设备的防水性能和防尘性能。In the embodiment of the present invention, there is an assembly gap between the outer surface of the housing and the side wall of the first module, and the acoustic device communicates with the assembly gap through the sound guide channel. When the user sends out sound information, the sound information enters the housing through the assembly gap, and the assembly gap is transmitted to the acoustic device through the sound guide channel; or when the acoustic device emits sound information, the sound information is transmitted to the assembly gap through the sound guide channel, and then through The assembly gap is transmitted to the user, so as to realize the interaction between the user and the sound information of the electronic device. In this solution, the housing and the first functional module have an assembly gap after being assembled, so the assembly gap between the first functional module and the housing can be used to transmit sound information, so that there is no need to open a sound guide hole on the housing. The number of openings of the casing is reduced, thereby improving the appearance consistency of the casing, so that the appearance of the casing is better and the user experience is improved. At the same time, the assembly gap is narrower than the sound guide hole, which can effectively alleviate the water vapor and dust in the environment from entering the housing, thereby improving the waterproof performance and dustproof performance of the electronic device.
附图说明Description of the drawings
为了更清楚地说明本发明实施例或背景技术中的技术方案,下面将对实施例或背景技术描述中所需要使用的附图作简单的介绍,显而易见地,对于本领域普通技术人员而言,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。In order to more clearly describe the technical solutions in the embodiments of the present invention or the background art, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments or the background art. Obviously, for those of ordinary skill in the art, Other drawings can be obtained based on these drawings without creative labor.
图1为本发明实施例公开的电子设备的局部结构示意图;FIG. 1 is a schematic diagram of a partial structure of an electronic device disclosed in an embodiment of the present invention;
图2为图1的局部放大图;Figure 2 is a partial enlarged view of Figure 1;
图3为本发明实施例公开的电子设备的剖视图。Fig. 3 is a cross-sectional view of an electronic device disclosed in an embodiment of the present invention.
附图标记说明:Description of reference signs:
100-壳体、101-装配缝隙、100-shell, 101-assembly gap,
200-第一功能模组、210-模组支架、211-衔接通道、220-第一功能器件、200-first functional module, 210-module bracket, 211-connection channel, 220-first functional device,
300-声学器件、300-acoustic device,
400-导音通道、410-第一导音段、420-第二导音段、430-第三导音段、400-guidance channel, 410-first guidance segment, 420-second guidance segment, 430-third guidance segment,
510-主板支架、511-第二凹槽、520-盖板、521-第一通孔、530-电路板、531-第二通孔、510-Motherboard bracket, 511-Second groove, 520-Cover plate, 521-First through hole, 530-Circuit board, 531-Second through hole,
610-第一密封件、611-第一避让孔、620-第二密封件、621-第二避让孔、630-防尘部。610-first sealing member, 611-first avoiding hole, 620-second sealing member, 621-second avoiding hole, 630-dust-proof part.
具体实施方式Detailed ways
为使本发明的目的、技术方案和优点更加清楚,下面将结合本发明具体实施例及相应的附图对本发明技术方案进行清楚、完整地描述。显然,所描述的实施例仅是本发明的一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。In order to make the objectives, technical solutions, and advantages of the present invention clearer, the technical solutions of the present invention will be described clearly and completely below in conjunction with specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
以下结合附图,详细说明本发明各个实施例公开的技术方案。The technical solutions disclosed in the various embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
如图1~图3所示,本发明实施例公开一种电子设备,该电子设备包括壳体100、第一功能模组200和第二功能模组。As shown in FIGS. 1 to 3, an embodiment of the present invention discloses an electronic device. The electronic device includes a housing 100, a first functional module 200, and a second functional module.
壳体100为电子设备的其它组成部件提供安装基础。第二功能模组可以设置于壳体100之内,并且第二功能模组包括声学器件300,该声学器件300可以包括麦克风、受话器和扬声器中的至少一者。壳体100内开设有导音通道400,该导音通道400用于传递声音信息。第一功能模组200至少部分凸出壳体100的外表面,第一功能模组200凸出于壳体100外表面的部分覆盖在壳体100的部分外表面上,壳体100的外表面与第一功能模组200的侧壁之间具有装配缝隙101,装配缝隙101的一个端口显露于壳体100的外表面,该装配缝隙101可以用于电子设备导音,声学器件300通过导音通道400与装配缝隙101连通。The housing 100 provides an installation basis for other components of the electronic device. The second functional module may be disposed in the housing 100, and the second functional module includes an acoustic device 300, which may include at least one of a microphone, a receiver, and a speaker. A sound guide channel 400 is opened in the housing 100, and the sound guide channel 400 is used to transmit sound information. The first functional module 200 at least partially protrudes from the outer surface of the housing 100, and the part of the first functional module 200 protruding from the outer surface of the housing 100 covers part of the outer surface of the housing 100. The outer surface of the housing 100 There is an assembly gap 101 between it and the side wall of the first functional module 200. One port of the assembly gap 101 is exposed on the outer surface of the housing 100. The channel 400 communicates with the assembly gap 101.
具体的操作过程中,当用户发出声音时,声音经由装配缝隙101进入壳体100内,装配缝隙101通过导音通道400传递至声学器件300。当声学器件300发声音时,声音通过导音通道400传递至装配缝隙101,再经由装配缝隙101传递至用户。可选的,壳体100可以包括前盖和后盖,前盖可以为电子设备的显示屏提供安装基础,后盖可以是电子设备的电池盖,现有电子设备逐渐向全面屏发展,前盖上设置的大部分功能模组都已取消,因 此第一功能模组200可以安装于壳体100的后盖上,第一功能模组200可以是电子设备的后置摄像头模组,也可以是闪光灯,还可以是指纹模组。当然,第一功能模组200还可以是其他功能模组,本文对此不作限制。In a specific operation process, when the user makes a sound, the sound enters the housing 100 through the assembly gap 101, and the assembly gap 101 is transmitted to the acoustic device 300 through the sound guide channel 400. When the acoustic device 300 emits sound, the sound is transmitted to the assembly gap 101 through the sound guide channel 400, and then transmitted to the user through the assembly gap 101. Optionally, the housing 100 may include a front cover and a back cover. The front cover may provide an installation basis for the display screen of the electronic device, and the back cover may be the battery cover of the electronic device. The existing electronic devices are gradually developing towards a full screen. Most of the functional modules set above have been cancelled. Therefore, the first functional module 200 can be installed on the back cover of the housing 100. The first functional module 200 can be a rear camera module of an electronic device, or it can be The flash can also be a fingerprint module. Of course, the first functional module 200 may also be other functional modules, which is not limited herein.
本发明实施例中,壳体100与第一功能模组200装配后具有装配缝隙101,因此可以利用第一功能模组200和壳体100之间的装配缝隙101传递声音信息,从而使得壳体100上无需开设导音孔,从而减少了壳体100的开孔数量,进而提高了壳体100的完整性和外观一致性,从而使得壳体100的外观质感较好,改善了用户体验。同时,装配缝隙101相对于导音孔更窄,从而能够有效地防止环境中的水汽和灰尘进入壳体100,进而提高了电子设备的防水性能和防尘性能。In the embodiment of the present invention, the housing 100 and the first functional module 200 have an assembly gap 101 after being assembled. Therefore, the assembly gap 101 between the first functional module 200 and the housing 100 can be used to transmit sound information, so that the housing There is no need to provide sound guide holes on the housing 100, thereby reducing the number of openings of the housing 100, thereby improving the integrity and appearance consistency of the housing 100, so that the housing 100 has a better appearance and texture, and the user experience is improved. At the same time, the assembly gap 101 is narrower than the sound guide hole, which can effectively prevent moisture and dust in the environment from entering the housing 100, thereby improving the waterproof performance and dustproof performance of the electronic device.
另外,利用壳体100与第一功能模组200之间的装配缝隙101传递声音信息,壳体100无需额外加工导音孔,从而优化了壳体100的加工工艺,使得壳体100加工步骤简化,从而降低了电子设备的制造成本。In addition, the assembly gap 101 between the housing 100 and the first functional module 200 is used to transmit sound information, and the housing 100 does not need to process additional sound guide holes, thereby optimizing the processing technology of the housing 100 and simplifying the processing steps of the housing 100 , Thereby reducing the manufacturing cost of electronic equipment.
一种可选的实施例中,装配缝隙101的贯穿方向可以与壳体100的外表面相平行。此时,装配缝隙101横向贯穿,第一功能模组200与壳体100形成装配间隙的边缘,能够阻挡灰尘和水汽飘入装配缝隙101内,进一步提高了电子设备的防水性能和防尘性能。In an optional embodiment, the penetration direction of the assembly slit 101 may be parallel to the outer surface of the housing 100. At this time, the assembly gap 101 penetrates laterally, and the first functional module 200 and the housing 100 form an edge of the assembly gap, which can prevent dust and moisture from floating into the assembly gap 101, further improving the waterproof and dustproof performance of the electronic device.
上述实施例中,装配缝隙101的长度较长时,用户容易看到,从而使得电子设备的外观质感较低,用户体验较差。一种可选的实施例中,装配缝隙101可以包括多个间隔设置的子缝隙,多个子缝隙间隔设置,且多个子缝隙均贯通至电子设备的外表面,每个子缝隙均通过导音通道400与声学器件300连通。此方案中,子缝隙的长度可以设置的较小,从而使得子缝隙更加隐蔽。另外,不同方位设置的子缝隙,对应不同的拾音位置和发声位置,从而可以实现电子设备的立体声效,进而提高电子设备的使用性能。可选的,多个子缝隙可以环绕第一功能模组200设置。In the above-mentioned embodiment, when the length of the assembly gap 101 is long, it is easy for the user to see, so that the appearance and texture of the electronic device are low, and the user experience is poor. In an optional embodiment, the assembly gap 101 may include a plurality of sub-slits arranged at intervals, the plurality of sub-slits are arranged at intervals, and the plurality of sub-slits all penetrate the outer surface of the electronic device, and each sub-slit passes through the sound conducting channel 400 It communicates with the acoustic device 300. In this solution, the length of the sub-slot can be set to be smaller, so that the sub-slot is more concealed. In addition, the sub-slits arranged in different directions correspond to different pickup positions and sound emitting positions, so that the stereo effect of the electronic device can be realized, and the use performance of the electronic device can be improved. Optionally, a plurality of sub-slits may be arranged around the first functional module 200.
另一种实施例中,本发明实施例公开的电子设备还可以包括切换件,切换件具有至少一个导通位置,在切换件位于导通位置的情况下,至少一个子缝隙与导音通道400相连通。当切换件位于导通位置时,至少一个子缝隙通过导音通道400与声学器件300相连通。此方案中,切换件在不同的导通位置与不同方位的子缝隙相连通,从而可以实现电子设备的定向拾音或者定向发声,进而可以使得声音信息传递到指定位置,进而提高了电子设备的使用性能。另外,当声学器件300不工作时,切换件可以封堵装配缝隙101,此时切换件没有处于导通位置,从而能够提高电子设备的防水性能和防尘性能。In another embodiment, the electronic device disclosed in the embodiment of the present invention may further include a switching element. The switching element has at least one conduction position. When the switching element is located in the conduction position, the at least one sub-slit is connected to the sound guide channel 400. Connected. When the switching element is in the conducting position, at least one sub-slit is connected to the acoustic device 300 through the sound conducting channel 400. In this solution, the switching element is connected to the sub-slits in different directions at different conduction positions, so that the directional sound pickup or directional sound generation of the electronic device can be realized, and the sound information can be transmitted to the designated position, thereby improving the performance of the electronic device. Use performance. In addition, when the acoustic device 300 is not working, the switch piece can block the assembly gap 101, and the switch piece is not in the conducting position at this time, so that the waterproof performance and dustproof performance of the electronic device can be improved.
可选的,切换件可以设置于壳体100内,切换件上开设有连接孔,壳体100内还设置有驱动机构。在具体的使用过程中,通过操控驱动机构驱动切换件转动,从而使得切换件上的连接孔与不同位置的子缝隙相连通。Optionally, the switching element may be provided in the housing 100, the switching element is provided with a connecting hole, and the housing 100 is also provided with a driving mechanism. In a specific process of use, the switching element is driven to rotate by manipulating the driving mechanism, so that the connecting holes on the switching element are connected with the sub-slits at different positions.
一种可选的实施例中,第一功能模组200可以包括第一功能器件220和模组支架210,第一功能器件220安装于模组支架210,且模组支架210为圆盘状结构,模组支架210的至少部分凸出壳体100的外表面,壳体100的外表面与模组支架210的侧壁之间形成装配缝隙101。此方案中,声音在传递的过程中不容易对第一功能器件220造成影响。同时,外部环境中的水汽和灰尘也不容易进入第一功能器件220中,从而提高了电子设备的可靠性。In an alternative embodiment, the first functional module 200 may include a first functional device 220 and a module bracket 210. The first functional device 220 is mounted on the module bracket 210, and the module bracket 210 has a disc-shaped structure. At least part of the module support 210 protrudes from the outer surface of the housing 100, and an assembly gap 101 is formed between the outer surface of the housing 100 and the side wall of the module support 210. In this solution, the sound is not likely to affect the first functional device 220 during the transmission process. At the same time, water vapor and dust in the external environment cannot easily enter the first functional device 220, thereby improving the reliability of the electronic device.
例如,当第一功能模组200为摄像头模组时,第一功能器件220可以为摄像头以及其 他电子元器件,模组支架210为摄像头以及其他电子元器件提供安装基础。For example, when the first functional module 200 is a camera module, the first functional device 220 may be a camera and other electronic components, and the module bracket 210 provides an installation basis for the camera and other electronic components.
上述实施例中,切换件通过驱动机构驱动,切换件转动时需要消耗电能,从而使得电子设备的耗能增大,同时,壳体100内部还需要预留驱动机构的安装空间,从而造成电子设备的结构复杂。另一种可选的实施例中,切换件环设于模组支架210的边缘,切换件可相对于模组支架210和壳体100转动,切换件开设有连接孔,切换件处于导通位置的情况下,连接孔与至少一个子缝隙相连通。此方案中,切换件设置于壳体100的外侧,用户可以手动驱动切换件转动,从而使得电子设备的能耗降低,同时,壳体100内部无需预留驱动机构的安装空间,使得电子设备的结构简单。可选的,该切换件也可以当作第一功能模组200的装饰件使用,从而无需额外安装装饰件,进而使得电子设备的结构更加简单,电子设备的成本较低。In the above-mentioned embodiment, the switching element is driven by the driving mechanism. When the switching element rotates, it needs to consume electric energy, which increases the energy consumption of the electronic device. At the same time, the housing 100 also needs to reserve installation space for the driving mechanism, thereby causing the electronic device The structure is complex. In another optional embodiment, the switching element is arranged around the edge of the module support 210, the switching element is rotatable relative to the module support 210 and the housing 100, the switching element is provided with a connecting hole, and the switching element is in the conducting position In the case of, the connecting hole communicates with at least one sub-slit. In this solution, the switch is arranged on the outside of the housing 100, and the user can manually drive the switch to rotate, thereby reducing the energy consumption of the electronic device. At the same time, there is no need to reserve installation space for the drive mechanism inside the housing 100, so that the electronic device Simple structure. Optionally, the switching element can also be used as a decorative element of the first functional module 200, so that no additional decorative element is required, thereby making the structure of the electronic device simpler and the cost of the electronic device lower.
一种可选的实施例中,装配缝隙101可以为细长条状,可以通过减小装配缝隙101的宽度,从而使得装配缝隙101更加隐蔽,该宽度为第一功能模组200和壳体100形成装配缝隙101的部分之间的距离,此时,用户不容易看到装配缝隙101,从而使得电子设备的外观质感更好,外观一致性更强。装配缝隙101的延伸方向为装配缝隙101的长度方向,此时可以通过增大装配缝隙101的长度,从而可以增大装配缝隙101的面积,进而满足声学器件300的导音需求。装配缝隙101可以为直线型细长条状结构,也可以为弧形细长条状结构。装配缝隙101的形状结构可以由第一功能模组200和第二功能模组的外形结构决定。In an alternative embodiment, the assembly gap 101 may be a slender strip, and the width of the assembly gap 101 can be reduced to make the assembly gap 101 more concealed. The width is the first functional module 200 and the housing 100. The distance between the parts forming the assembly gap 101, at this time, it is not easy for the user to see the assembly gap 101, so that the appearance texture of the electronic device is better and the appearance consistency is stronger. The extension direction of the assembly gap 101 is the length direction of the assembly gap 101. At this time, the length of the assembly gap 101 can be increased, so that the area of the assembly gap 101 can be increased, thereby meeting the sound conduction requirements of the acoustic device 300. The assembly gap 101 can be a linear elongated strip structure, or can be an arc-shaped elongated strip structure. The shape and structure of the assembly gap 101 can be determined by the shape and structure of the first functional module 200 and the second functional module.
另一种实施例中,装配缝隙101可以为弧形结构,弧形结构相对于直线型结构来说更加平滑,没有棱角,从而使得电子设备更加美观,进一步改善了用户体验。In another embodiment, the assembly gap 101 may have an arc structure, which is smoother than a linear structure without edges and corners, thereby making the electronic device more beautiful and further improving the user experience.
为了进一步提高声学器件300的性能,另一种实施例中,第一功能模组200的侧壁可以开设有豁口,该豁口显露于壳体100之外,且豁口与壳体100形成装配缝隙101。此方案中,第一功能模组200的侧壁边缘去除了部分材料,从而使得壳体100和第一功能模组200之间的装配缝隙101更大,进而增大了装配缝隙101的面积,从而使得装配缝隙101能够传递更多的声音信息,提高了声学器件300的性能,使得电子设备的音质较好。可选的,豁口可以为细长条状,当然也可以为其他形状,本文对此不作限制。In order to further improve the performance of the acoustic device 300, in another embodiment, the side wall of the first functional module 200 may be provided with a notch, the notch is exposed outside the housing 100, and the notch and the housing 100 form an assembly gap 101 . In this solution, part of the material is removed from the edge of the side wall of the first functional module 200, so that the assembly gap 101 between the housing 100 and the first functional module 200 is larger, thereby increasing the area of the assembly gap 101. As a result, the assembly gap 101 can transmit more sound information, improve the performance of the acoustic device 300, and make the sound quality of the electronic device better. Optionally, the notch can be in the shape of a slender strip, of course, it can also be in other shapes, which is not limited herein.
上述实施例中,外部环境中的灰尘和水汽可以沿着装配缝隙101进入壳体100内,从而有可能造成声学器件300的导音孔被堵塞或者声学器件300的电子元器件短路,致使声学器件300损坏,致使电子设备的安全性和可靠性较低。为了解决上述问题,一种可选的实施例中,导音通道400可以包括依次连通的第一导音段410、第二导音段420和第三导音段430,第一导音段410与装配缝隙101连通,声学器件300位于第三导音段430背离第二导音段420的一端,第一导音段410的中心轴线与第二导音段420的中心轴线相交,第一导音段410的中心轴线与第三导音段430的中心轴线相平行。此方案中,导音通道400为弯折结构,从而使得各个导音段的侧壁能够阻挡灰尘和水汽;同时,导音通道400的路径较长,从而可以使得大部分灰尘和水汽沉降,附着在各导音段的侧壁上,从而使得灰尘和水汽不容易到达声学器件300的安装位置,进而使得声学器件300的导音口不容易被堵塞,从而使得声学器件300的音质较好。In the above embodiment, dust and water vapor in the external environment can enter the housing 100 along the assembly gap 101, which may cause the sound guide hole of the acoustic device 300 to be blocked or the electronic components of the acoustic device 300 to short circuit, resulting in the acoustic device 300 is damaged, resulting in lower safety and reliability of electronic equipment. In order to solve the above problem, in an optional embodiment, the sound guide channel 400 may include a first sound guide section 410, a second sound guide section 420, and a third sound guide section 430 connected in sequence. The first sound guide section 410 In communication with the assembly gap 101, the acoustic device 300 is located at the end of the third sound guide section 430 away from the second sound guide section 420. The central axis of the first sound guide section 410 intersects with the center axis of the second sound guide section 420. The center axis of the sound segment 410 is parallel to the center axis of the third sound guide segment 430. In this solution, the sound guide channel 400 has a bent structure, so that the side walls of each sound guide section can block dust and water vapor; at the same time, the sound guide channel 400 has a longer path, so that most of the dust and water vapor can settle and adhere. On the side walls of each sound guide section, dust and water vapor cannot easily reach the installation position of the acoustic device 300, and the sound guide opening of the acoustic device 300 is not easily blocked, so that the sound quality of the acoustic device 300 is better.
可选的,第一导音段410的中心轴线与第二导音段420的中心轴线相的夹角可以为90°,此时,第一导音段410的中心轴线与第二导音段420的中心轴线可以相垂直。此时, 导音通道400的结构较为紧凑,从而使得导音通道400占用的壳体100空间较小。Optionally, the included angle between the center axis of the first sound guide section 410 and the center axis of the second sound guide section 420 may be 90°. At this time, the center axis of the first sound guide section 410 and the center axis of the second sound guide section The central axis of 420 may be perpendicular. At this time, the structure of the sound guide channel 400 is relatively compact, so that the space of the housing 100 occupied by the sound guide channel 400 is smaller.
进一步地,第一功能模组200开设有衔接通道211,装配缝隙101与第一导音段410通过衔接通道211相连通,衔接通道211的中心轴线与第一导音段410的中心轴线可以相交,装配缝隙101的中心轴线与衔接通道211的中心轴线可以共线。此方案中,装配缝隙101与导音通道400通过衔接通道211相连通,从而延长了声音传递的路径,从而使得水汽和灰尘能够附着在衔接通道211的内壁上,进一步提高了电子设备的安全性和可靠性。Further, the first functional module 200 is provided with a connecting channel 211, the assembly gap 101 and the first sound guide section 410 are connected through the connecting channel 211, and the central axis of the connecting channel 211 and the central axis of the first sound guide section 410 can intersect , The central axis of the assembly gap 101 and the central axis of the connecting channel 211 may be collinear. In this solution, the assembly gap 101 and the sound guide channel 400 are connected through the connecting channel 211, thereby extending the sound transmission path, so that water vapor and dust can adhere to the inner wall of the connecting channel 211, further improving the safety of the electronic device And reliability.
可选的,当第一功能模组200包括上述第一功能器件220和模组支架210时,衔接通道211开设于模组支架210上。Optionally, when the first functional module 200 includes the above-mentioned first functional device 220 and the module bracket 210, the connecting channel 211 is opened on the module bracket 210.
另一种实施例中,模组支架可以包括装饰圈,此时,模组支架既可以起到装饰和防护的作用,又可以用于安装第一功能器件220,从而使得电子设备的结构更加紧凑。In another embodiment, the module bracket may include a decorative ring. In this case, the module bracket can not only play a role of decoration and protection, but also can be used to install the first functional device 220, thereby making the structure of the electronic device more compact .
上述实施例中,本发明实施例公开的电子设备还可以包括主板支架510,主板支架510用于安装电子设备的电子元器件,主板支架510设置于壳体100内,第一导音段410可以开设于第一功能模组200,第二导音段420和第三导音段430可以开设于主板支架510,第一导音段410和第三导音通道400与第二导音通道400具有一定的夹角,当采用浇筑的方式制作第二导音段420时,第二导音段420位于主板支架510的内部,主板支架510脱模难度大,从而造成电子设备加工难度大,成本较高。In the above embodiment, the electronic device disclosed in the embodiment of the present invention may further include a motherboard bracket 510, the motherboard bracket 510 is used to install electronic components of the electronic device, the motherboard bracket 510 is provided in the housing 100, and the first sound guide section 410 may Set in the first functional module 200, the second sound guide section 420 and the third sound guide section 430 can be opened on the main board bracket 510, the first sound guide section 410, the third sound guide channel 400 and the second sound guide channel 400 have With a certain included angle, when the second sound guide segment 420 is made by pouring, the second sound guide segment 420 is located inside the motherboard bracket 510, and the motherboard bracket 510 is difficult to demold, which makes electronic equipment processing difficult and costly. high.
一种可选的实施例中,本发明实施例公开的电子设备还包括盖板520,盖板520可以位于壳体100内,主板支架510朝向第一功能模组200的一侧可以开设有第一凹槽,盖板520覆盖第一凹槽的槽口,此时,盖板520可以与第一凹槽形成第二导音段420。盖板520的一端可以开设有第一通孔521,第二导音段420与第一导音段410可以通过第一通孔521连通。第一凹槽的底壁可以开设有第三导音段430,第一通孔521与第三导音段430错位分布。主板支架510可以采用浇注的方式先加工出第一凹槽,由于第一凹槽为敞口,因此主板支架510更容易脱模,然后将盖板520覆盖在第一凹槽的槽口,从而形成第二导音段420,此方案中,第二导音段420加工方便,从而使得电子设备的加工难度小,成本较低。In an optional embodiment, the electronic device disclosed in the embodiment of the present invention further includes a cover plate 520. The cover plate 520 may be located in the housing 100. A groove, and the cover plate 520 covers the notch of the first groove. At this time, the cover plate 520 and the first groove can form a second sound guide segment 420. One end of the cover plate 520 may be provided with a first through hole 521, and the second sound conducting section 420 and the first sound conducting section 410 may communicate with each other through the first through hole 521. The bottom wall of the first groove may be provided with a third sound guide section 430, and the first through holes 521 and the third sound guide section 430 are distributed in a staggered manner. The main board bracket 510 can first be processed into the first groove by casting. Since the first groove is open, the main board bracket 510 is easier to demold, and then the cover plate 520 is covered on the notch of the first groove, thereby The second sound guide segment 420 is formed. In this solution, the second sound guide segment 420 is easy to process, so that the processing difficulty of the electronic device is small and the cost is low.
可选的,盖板520可以采用双面胶与主板支架510粘接。盖板520可以是聚对苯二甲酸乙二酯(Polyethylene terephthalate,PET)板,还可以为金属板,当盖板520为金属板时,盖板520对主板支架510起到了补强刚度的作用,增强了主板支架510的整体刚度。Optionally, the cover plate 520 may be bonded to the main board bracket 510 by using double-sided adhesive. The cover plate 520 may be a polyethylene terephthalate (PET) plate or a metal plate. When the cover plate 520 is a metal plate, the cover plate 520 can strengthen the rigidity of the main board bracket 510 , To enhance the overall rigidity of the motherboard bracket 510.
上述实施例中,第一导音段410可以设置于第一功能模组200上,第二导音段420可以设置于主板支架510上,此时,第一导音段410和第二导音段420之间具有间隙,声音可以进入该间隙内,从而造成电子设备漏音,造成电子设备的音质较差。一种可选的实施例中,本发明实施例公开的电子设备还可以包括第一密封件610,第一功能模组200与盖板520通过第一密封件610密封连接,第一密封件610与第一通孔521相对的部位可以开设有第一避让孔611,第一导音段410与第二导音段420通过第一避让孔611和第一通孔521相连通。此时,第一密封件610可以封堵第一导音段410和第二导音段420之间的间隙,从而防止电子设备漏音,进而使得电子设备的音质较好。另外,第一密封件610可以将灰尘和水汽阻挡在导音通道400内,从而防止灰尘和水汽损坏电子设备的电子元器件。可选的,第一密封件610可以采用硅胶、橡胶等材料制作。In the above embodiment, the first sound guide segment 410 can be arranged on the first functional module 200, and the second sound guide segment 420 can be arranged on the main board bracket 510. At this time, the first sound guide segment 410 and the second sound guide There is a gap between the segments 420, and sound can enter the gap, causing sound leakage of the electronic device, resulting in poor sound quality of the electronic device. In an optional embodiment, the electronic device disclosed in the embodiment of the present invention may further include a first sealing member 610, and the first functional module 200 and the cover plate 520 are hermetically connected through the first sealing member 610, and the first sealing member 610 A portion opposite to the first through hole 521 may be provided with a first escape hole 611, and the first sound guide segment 410 and the second sound guide segment 420 are communicated with the first through hole 521 through the first escape hole 611. At this time, the first sealing member 610 can seal the gap between the first sound guide segment 410 and the second sound guide segment 420, thereby preventing the sound leakage of the electronic device, thereby making the sound quality of the electronic device better. In addition, the first sealing member 610 can block dust and water vapor in the sound guide channel 400, thereby preventing the dust and water vapor from damaging the electronic components of the electronic device. Optionally, the first sealing member 610 may be made of materials such as silica gel or rubber.
上述实施例中,盖板520搭接在主板支架510的板面上,此时主板支架510与盖板520的堆叠高度较大,主板支架510与盖板520的堆叠结构占据壳体100空间较大,从而 使得电子设备的厚度较大,致使用户体验较差。一种可选的实施例中,主板支架510朝向第一功能模组200的一侧还可以开设有第二凹槽511,第一凹槽可以开设于第二凹槽511的槽底,第一凹槽的槽口位于第二凹槽511的槽底,盖板520搭接在第二凹槽511的槽底,第一凹槽与第二凹槽511可以形成沉台结构,至少部分盖板520位于第二凹槽511内。此方案中,至少部分盖板520可以隐藏于第二凹槽511内,从而使得盖板520的外漏体积减小,进而主板支架510与盖板520的堆叠高度较小,主板支架510与盖板520的堆叠结构占据壳体100空间较小,使得电子设备的厚度较小。In the above embodiment, the cover plate 520 is overlapped on the board surface of the main board bracket 510. At this time, the stack height of the main board bracket 510 and the cover plate 520 is relatively large. Large, which makes the thickness of the electronic device larger, resulting in a poor user experience. In an optional embodiment, the side of the motherboard support 510 facing the first functional module 200 may further be provided with a second groove 511, the first groove may be opened on the bottom of the second groove 511, and the first groove 511 The notch of the groove is located at the bottom of the second groove 511, and the cover plate 520 overlaps the bottom of the second groove 511. The first groove and the second groove 511 can form a sinker structure, at least part of the cover plate 520 is located in the second groove 511. In this solution, at least a part of the cover plate 520 can be hidden in the second groove 511, so that the leakage volume of the cover plate 520 is reduced, and the stack height of the main board bracket 510 and the cover plate 520 is smaller. The stacked structure of the board 520 occupies a small space in the housing 100, so that the thickness of the electronic device is small.
另一种实施例中,本发明实施例公开的电子设备还可以包括电路板530,该电路板530用于安装电子设备的电子元器件。该电路板530可以设置于主板支架510背离第一功能模组200的一侧,电路板530可以开设有第二通孔531,声学器件300可以设置于电路板530背离主板支架510的一侧,声学器件300通过第二通孔531与第三导音段430连通。此方案中,声学器件300可以设置于电路板530背离主板支架510的一侧,从而使得声学器件300不会与主板支架510发生干涉,进而使得电子设备的可靠性较高。In another embodiment, the electronic device disclosed in the embodiment of the present invention may further include a circuit board 530 for mounting electronic components of the electronic device. The circuit board 530 can be arranged on the side of the main board support 510 away from the first functional module 200, the circuit board 530 can be provided with a second through hole 531, and the acoustic device 300 can be arranged on the side of the circuit board 530 away from the main board support 510. The acoustic device 300 communicates with the third sound guide section 430 through the second through hole 531. In this solution, the acoustic device 300 may be disposed on the side of the circuit board 530 away from the main board bracket 510, so that the acoustic device 300 will not interfere with the main board bracket 510, thereby making the electronic device more reliable.
可选的,该电路板530可以是电子设备的主板,也可以是电子设备的副板。本发明实施例中,电路板530可以是刚性电路板,也可以是柔性电路板。例如,电路板530可以采用印刷电路板,也可以采用软硬结合板,或者电路板530包括贴合设置的柔性电路板和补强板。当然,还可以采用其他结构形式,本文对此不做限制。Optionally, the circuit board 530 may be the main board of the electronic device, or the sub-board of the electronic device. In the embodiment of the present invention, the circuit board 530 may be a rigid circuit board or a flexible circuit board. For example, the circuit board 530 may be a printed circuit board, or a flexible and rigid combination board, or the circuit board 530 may include a flexible circuit board and a reinforcing board that are attached to each other. Of course, other structural forms can also be used, and this article does not restrict it.
为了防止第二通孔531与第三导音段430的连接处漏音,可选的,本发明实施例公开的电子设备还可以包括第二密封件620,电路板530可以通过第二密封件620与主板支架510密封连接,第二密封件620与第二通孔531相对的部位开设有第二避让孔621,第三导音段430与第二通孔531通过第二避让孔621相连通。此方案中,第二密封件620可以封堵第三导音段430和第二通孔531之间的间隙,从而防止电子设备漏音,进一步提高了电子设备的音质。可选的,第二密封件620可以采用硅胶、橡胶等材料制作。In order to prevent sound leakage at the connection between the second through hole 531 and the third sound guide section 430, optionally, the electronic device disclosed in the embodiment of the present invention may further include a second sealing member 620, and the circuit board 530 may pass through the second sealing member. 620 is connected to the main board bracket 510 in a sealed manner, the second sealing member 620 is provided with a second escape hole 621 at a position opposite to the second through hole 531, and the third sound conducting section 430 and the second through hole 531 are in communication with each other through the second escape hole 621 . In this solution, the second sealing member 620 can block the gap between the third sound conducting section 430 and the second through hole 531, thereby preventing sound leakage of the electronic device, and further improving the sound quality of the electronic device. Optionally, the second sealing member 620 may be made of materials such as silica gel or rubber.
另一种实施例中,主板支架510背离第一功能模组200的一侧还可以开设有第三凹槽,第二密封件620设置于第三凹槽内,此时,第二密封件620可以隐藏于第三凹槽内,从而使得第二密封件620的外漏体积减小,进而使得主板支架510、第二密封件620和电路板530形成的结构的堆叠高度较小,主板支架510、第二密封件620和电路板530形成的结构占据壳体100空间较小,使得电子设备的厚度较小。In another embodiment, the side of the motherboard support 510 away from the first functional module 200 may also be provided with a third groove, and the second sealing member 620 is disposed in the third groove. At this time, the second sealing member 620 It can be hidden in the third groove, so that the leakage volume of the second sealing member 620 is reduced, so that the stack height of the structure formed by the main board bracket 510, the second sealing member 620, and the circuit board 530 is small, and the main board bracket 510 The structure formed by the second sealing member 620 and the circuit board 530 occupies a small space in the housing 100, so that the thickness of the electronic device is small.
一种可选的实施例中,本发明实施例公开的电子设备还可以包括防尘部630,该防尘部630可以设置于第三导音段430和第二通孔531之间。此时,防尘部630能够将大部分灰尘阻挡在第三导音段430内,从而使得灰尘不容易进入第二通孔531内,第二通孔531内的灰尘较小,因此不影响声学器件300的音质。另外,防尘部630可以夹设在主板支架510与电路板530之间,从而使得主板支架510无需设置用于安装防尘部630的部件,从而使防尘部630的安装操作简单、方便。In an optional embodiment, the electronic device disclosed in the embodiment of the present invention may further include a dust-proof part 630, and the dust-proof part 630 may be disposed between the third sound guide section 430 and the second through hole 531. At this time, the dust-proof part 630 can block most of the dust in the third sound guide section 430, so that it is not easy for dust to enter the second through hole 531. The dust in the second through hole 531 is relatively small, so it does not affect the acoustics. The sound quality of the device 300. In addition, the dust-proof part 630 may be sandwiched between the main board bracket 510 and the circuit board 530, so that the main board bracket 510 does not need to be equipped with a component for installing the dust-proof part 630, so that the installation operation of the dust-proof part 630 is simple and convenient.
一种可选的实施例中,第一功能模组200可以为圆盘结构,装配缝隙101可以为环形结构,装配缝隙101的部分与导音通道400相连通。此方案中,装配缝隙101可以为环形结构,环形结构较为平滑,没有棱角,使得电子设备更加美观,进一步改善了用户体验。In an alternative embodiment, the first functional module 200 may be a disc structure, the assembly gap 101 may be a ring structure, and a part of the assembly gap 101 is communicated with the sound guide channel 400. In this solution, the assembly gap 101 may have a ring structure, which is relatively smooth and has no edges and corners, which makes the electronic device more beautiful and further improves the user experience.
另一种实施例中,装配缝隙101均与导音通道400相连通。此时,环形结构的装配缝隙101均可以实现电子设备的拾声或者发声,从而能够实现电子设备的立体声道,另外, 装配缝隙101的面积较大,从而使得电子设备的音质较好。In another embodiment, the assembling slits 101 are all connected with the sound guide channel 400. At this time, the assembling gap 101 of the ring structure can both pick up or emit sound from the electronic device, so as to realize the stereo sound channel of the electronic device. In addition, the area of the assembling gap 101 is larger, so that the sound quality of the electronic device is better.
本发明实施例公开的电子设备可以是智能手机、平板电脑、电子书阅读器、可穿戴设备(例如智能手表)、电子游戏机等设备,本发明实施例不限制电子设备的具体种类。The electronic devices disclosed in the embodiments of the present invention may be devices such as smart phones, tablet computers, e-book readers, wearable devices (such as smart watches), and electronic game consoles. The embodiments of the present invention do not limit the specific types of electronic devices.
本发明上文实施例中重点描述的是各个实施例之间的不同,各个实施例之间不同的优化特征只要不矛盾,均可以组合形成更优的实施例,考虑到行文简洁,在此则不再赘述。The above embodiments of the present invention focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the conciseness of the text, here is No longer.
以上所述仅为本发明的实施例而已,并不用于限制本发明。对于本领域技术人员来说,本发明可以有各种更改和变化。凡在本发明的精神和原理之内所作的任何修改、等同替换、改进等,均应包含在本发明的权利要求范围之内。The foregoing descriptions are merely embodiments of the present invention, and are not intended to limit the present invention. For those skilled in the art, the present invention can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims (16)

  1. 一种电子设备,包括壳体(100)、第一功能模组(200)和第二功能模组,所述第二功能模组设置于所述壳体(100)之内,且所述第二功能模组包括声学器件(300),所述壳体(100)内开设有导音通道(400),所述第一功能模组(200)至少部分凸出所述壳体(100)的外表面,所述壳体(100)的外表面与所述第一功能模组(200)的侧壁之间具有装配缝隙(101),所述声学器件(300)通过所述导音通道(400)与所述装配缝隙(101)连通。An electronic device, comprising a housing (100), a first functional module (200) and a second functional module, the second functional module is arranged in the housing (100), and the first The second functional module includes an acoustic device (300), a sound guide channel (400) is opened in the housing (100), and the first functional module (200) at least partially protrudes from the housing (100) On the outer surface, there is an assembly gap (101) between the outer surface of the housing (100) and the side wall of the first functional module (200), and the acoustic device (300) passes through the sound guide channel ( 400) communicates with the assembly gap (101).
  2. 根据权利要求1所述的电子设备,其中,所述装配缝隙(101)的贯穿方向与所述壳体(100)的外表面相平行。The electronic device according to claim 1, wherein the penetration direction of the assembling slit (101) is parallel to the outer surface of the housing (100).
  3. 根据权利要求1所述的电子设备,其中,所述装配缝隙(101)包括多个间隔设置的子缝隙,多个所述子缝隙间隔设置,且均贯通至所述电子设备的外表面,每个所述子缝隙均通过导音通道(400)与所述声学器件(300)连通。The electronic device according to claim 1, wherein the assembling gap (101) comprises a plurality of sub-slits arranged at intervals, and a plurality of the sub-slits are arranged at intervals and all penetrate to the outer surface of the electronic device, each All of the sub-slits communicate with the acoustic device (300) through a sound guide channel (400).
  4. 根据权利要求3所述的电子设备,其中,所述电子设备还包括切换件,所述切换件具有至少一个导通位置,在所述切换件位于所述导通位置的情况下,至少一个所述子缝隙与所述导音通道(400)相连通。The electronic device according to claim 3, wherein the electronic device further comprises a switching element, the switching element has at least one conducting position, and when the switching element is located at the conducting position, the at least one switching element The sub-slit is communicated with the sound guide channel (400).
  5. 根据权利要求4所述的电子设备,其中,所述第一功能模组(200)包括第一功能器件(220)和模组支架(210),所述第一功能器件(220)安装于所述模组支架(210),且所述模组支架(210)为圆盘状结构,所述切换件环设于所述模组支架(210)的边缘,所述切换件可相对于所述模组支架(210)和所述壳体(100)转动,所述切换件开设有连接孔,所述切换件处于所述导通位置的情况下,所述连接孔与至少一个所述子缝隙相连通。The electronic device according to claim 4, wherein the first functional module (200) comprises a first functional device (220) and a module bracket (210), and the first functional device (220) is installed in the The module support (210), and the module support (210) is a disc-shaped structure, the switching element is arranged around the edge of the module support (210), and the switching element can be opposite to the The module bracket (210) and the housing (100) rotate, the switching element is provided with a connecting hole, and when the switching element is in the conducting position, the connecting hole is connected to at least one of the sub-slits Connected.
  6. 根据权利要求1所述的电子设备,其中,所述装配缝隙(101)为弧形结构。The electronic device according to claim 1, wherein the assembly gap (101) has an arc structure.
  7. 根据权利要求1所述的电子设备,其中,所述第一功能模组(200)的所述侧壁开设有豁口,所述豁口显露于所述壳体(100)之外,且所述豁口与所述壳体(100)形成所述装配缝隙(101)。The electronic device according to claim 1, wherein the side wall of the first functional module (200) is provided with a notch, the notch is exposed outside the housing (100), and the notch The assembly gap (101) is formed with the housing (100).
  8. 根据权利要求1所述的电子设备,其中,所述导音通道(400)包括依次连通的第一导音段(410)、第二导音段(420)和第三导音段(430),所述第一导音段(410)与所述装配缝隙(101)连通,所述声学器件(300)位于所述第三导音段(430)背离所述第二导音段(420)的一端,所述第一导音段(410)的中心轴线与所述第二导音段(420)的中心轴线相交,所述第一导音段(410)的中心轴线与所述第三导音段(430)的中心轴线相平行。The electronic device according to claim 1, wherein the sound guide channel (400) comprises a first sound guide section (410), a second sound guide section (420) and a third sound guide section (430) connected in sequence , The first sound guide segment (410) is in communication with the assembly gap (101), and the acoustic device (300) is located in the third sound guide segment (430) away from the second sound guide segment (420) The central axis of the first sound guide section (410) intersects the central axis of the second sound guide section (420), and the center axis of the first sound guide section (410) intersects the center axis of the third sound guide section (410). The central axes of the sound guide segment (430) are parallel.
  9. 根据权利要求8所述的电子设备,其中,所述第一功能模组(200)开设有衔接通道(211),所述装配缝隙(101)与所述第一导音段(410)通过所述衔接通道(211)相连通,所述衔接通道(211)的中心轴线与所述第一导音段(410)的中心轴线相交,所述装配缝隙(101)的中心轴线与所述衔接通道(211)的中心轴线共线。The electronic device according to claim 8, wherein the first functional module (200) is provided with a connecting channel (211), and the assembly gap (101) and the first sound guide segment (410) pass through the The connecting channel (211) is in communication, the central axis of the connecting channel (211) intersects the central axis of the first sound guide section (410), and the central axis of the assembly gap (101) is connected to the connecting channel The central axis of (211) is collinear.
  10. 根据权利要求8所述的电子设备,其中,所述电子设备还包括主板支架(510)和盖板(520),所述主板支架(510)和所述盖板(520)均位于所述壳体(100)内,所述主板支架(510)朝向所述第一功能模组(200)的一侧开设有第一凹槽,所述盖板(520)覆盖所述第一凹槽的槽口,所述盖板(520)与所述第一凹槽形成所述第二导音段(420),所述盖板(520)的一端开设有第一通孔(521),所述第二导音段(420)与所述第一导音段(410)通过所述第一通孔(521)连通,所述第一凹槽的底壁开设有所述第三导音段(430),所述第一通孔(521)与所述第三导音段(430)错位分布。The electronic device according to claim 8, wherein the electronic device further comprises a main board bracket (510) and a cover plate (520), the main board bracket (510) and the cover plate (520) are both located in the shell In the body (100), a first groove is opened on the side of the main board bracket (510) facing the first functional module (200), and the cover plate (520) covers the groove of the first groove The cover plate (520) and the first groove form the second sound conducting section (420), one end of the cover plate (520) is provided with a first through hole (521), and the The second sound guide section (420) is communicated with the first sound guide section (410) through the first through hole (521), and the bottom wall of the first groove is provided with the third sound guide section (430). ), the first through hole (521) and the third sound guide segment (430) are distributed in a misaligned manner.
  11. 根据权利要求10所述的电子设备,其中,还包括第一密封件(610),所述第一功能模组(200)与所述盖板(520)通过所述第一密封件(610)密封连接,所述第一密封件(610)与所述第一通孔(521)相对的部位开设有第一避让孔(611),所述第一导音段(410)与所述第二导音段(420)通过所述第一避让孔(611)和所述第一通孔(521)相连通。The electronic device according to claim 10, further comprising a first sealing element (610), and the first functional module (200) and the cover plate (520) pass through the first sealing element (610) In a sealed connection, a first escape hole (611) is provided at a position of the first sealing member (610) opposite to the first through hole (521), and the first sound guide segment (410) is connected to the second The sound guide segment (420) is communicated with the first through hole (521) through the first avoiding hole (611).
  12. 根据权利要求10所述的电子设备,其中,所述主板支架(510)朝向所述第一功能模组(200)的一侧还开设有第二凹槽(511),所述第一凹槽开设于所述第二凹槽(511)的槽底,所述第一凹槽与所述第二凹槽(511)形成沉台结构,至少部分所述盖板(520)位于所述第二凹槽(511)内。The electronic device according to claim 10, wherein the side of the motherboard bracket (510) facing the first functional module (200) is further provided with a second groove (511), and the first groove It is opened in the bottom of the second groove (511), the first groove and the second groove (511) form a countersunk structure, and at least part of the cover plate (520) is located in the second groove (511). In the groove (511).
  13. 根据权利要求10所述的电子设备,其中,所述电子设备还包括电路板(530),所述电路板(530)设置于所述主板支架(510)背离所述第一功能模组(200)的一侧,所述电路板(530)开设有第二通孔(531),所述声学器件(300)设置于所述电路板(530)背离所述主板支架(510)的一侧,所述声学器件(300)通过所述第二通孔(531)与所述第三导音段(430)连通。The electronic device according to claim 10, wherein the electronic device further comprises a circuit board (530), and the circuit board (530) is disposed on the main board bracket (510) away from the first functional module (200). ), the circuit board (530) is provided with a second through hole (531), and the acoustic device (300) is arranged on the side of the circuit board (530) away from the main board bracket (510), The acoustic device (300) communicates with the third sound guide segment (430) through the second through hole (531).
  14. 根据权利要求13所述的电子设备,其中,还包括第二密封件(620),所述主板支架(510)背离所述第一功能模组(200)的一侧开设有第三凹槽,所述第二密封件(620)设置于所述第三凹槽内,所述电路板(530)通过所述第二密封件(620)与所述主板支架(510)密封连接,所述第二密封件(620)与所述第二通孔(531)相对的部位开设有第二避让孔(621),所述第三导音段(430)与所述第二通孔(531)通过所述第二避让孔(621)相连通。The electronic device according to claim 13, further comprising a second sealing member (620), and a third groove is opened on the side of the main board bracket (510) away from the first functional module (200), The second sealing member (620) is arranged in the third groove, the circuit board (530) is connected to the main board bracket (510) in a sealed manner through the second sealing member (620), and the first A second escape hole (621) is opened at the position of the second sealing member (620) opposite to the second through hole (531), and the third sound guide segment (430) passes through the second through hole (531). The second escape hole (621) is connected.
  15. 根据权利要求13所述的电子设备,其中,所述电子设备还包括防尘部(630),所述防尘部(630)设置于所述第三导音段(430)和所述第二通孔(531)之间。The electronic device according to claim 13, wherein the electronic device further comprises a dust-proof part (630), the dust-proof part (630) is disposed on the third sound guide segment (430) and the second Between through holes (531).
  16. 根据权利要求1所述的电子设备,其中,所述第一功能模组(200)为圆盘状结构,所述装配缝隙(101)为环形结构,所述装配缝隙(101)的至少部分与所述导音通道(400)相连通。The electronic device according to claim 1, wherein the first functional module (200) is a disc-shaped structure, the assembly gap (101) is a ring structure, and at least part of the assembly gap (101) is connected to The sound guide channel (400) is connected.
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