CN111405414A

CN111405414A - Electronic device

Info

Publication number: CN111405414A
Application number: CN202010234157.6A
Authority: CN
Inventors: 梁源标
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2020-03-27
Filing date: 2020-03-27
Publication date: 2020-07-10
Anticipated expiration: 2040-03-27
Also published as: WO2021190198A1; CN111405414B

Abstract

The invention discloses electronic equipment which comprises a shell, a first functional module and a second functional module, wherein the second functional module is arranged in the shell and comprises an acoustic device, a sound guide channel is formed in the shell, at least part of the first functional module protrudes out of the outer surface of the shell, an assembly gap is formed between the outer surface of the shell and the side wall of the first functional module, and the acoustic device is communicated with the assembly gap through the sound guide channel. Above-mentioned scheme can utilize the assembly gap transmission sound information between first function module and the casing to make and need not to set up on the casing and lead the sound hole, thereby reduced the trompil quantity of casing, and then improved the integrality of casing, thereby strengthened the outward appearance uniformity of casing, simultaneously, the assembly gap is narrower for leading the sound hole, thereby can alleviate steam and dust in the environment effectively and get into the casing, and then improved electronic equipment's waterproof performance and dust resistance.

Description

Electronic device

Technical Field

The present invention relates to the field of communications technologies, and in particular, to an electronic device.

Background

Electronic devices such as smart phones and tablet computers have become indispensable products in modern life. Acoustic devices, such as receivers, microphones, speakers, etc., are typically provided in electronic devices, and enable the acoustic performance of the electronic devices.

In the related art, the acoustic device is disposed in a casing of the electronic device, a sound guide hole is formed in the casing of the electronic device, and sound information emitted by a user can be transmitted to the acoustic device through the sound guide hole, or the sound information emitted by the acoustic device is transmitted to the user through the hole, so that interaction between the user and the sound information of the electronic device is achieved.

However, in the above solution, the casing needs to be provided with the sound guide hole for transmitting the sound information, at this time, the sound guide hole destroys the integrity of the casing, and simultaneously, the waterproof property and the dustproof property of the electronic device are also low, thereby resulting in poor safety and reliability of the electronic device.

Disclosure of Invention

The invention discloses electronic equipment, which aims to solve the problems of low appearance consistency and low safety and reliability of the electronic equipment.

In order to solve the technical problem, the invention is realized as follows:

in a first aspect, an embodiment of the present invention discloses an electronic device, including a housing, a first functional module and a second functional module, where the second functional module is disposed in the housing, the second functional module includes an acoustic device, a sound guide channel is disposed in the housing, the first functional module at least partially protrudes out of an outer surface of the housing, an assembly gap is formed between the outer surface of the housing and a side wall of the first functional module, and the acoustic device is communicated with the assembly gap through the sound guide channel.

The technical scheme adopted by the invention can achieve the following beneficial effects:

in the embodiment of the invention, an assembly gap is formed between the outer surface of the shell and the side wall of the first module, and the acoustic device is communicated with the assembly gap through the sound guide channel. When a user sends out sound information, the sound information enters the shell through the assembling gap, and the assembling gap is transmitted to the acoustic device through the sound guide channel; or when the acoustic device emits the sound information, the sound information is transmitted to the assembly gap through the sound guide channel and then transmitted to the user through the assembly gap, so that the interaction between the user and the sound information of the electronic equipment is realized. In this scheme, the casing has the assembly gap after assembling with first function module, consequently can utilize the assembly gap transmission sound information between first function module and the casing, thereby make and need not to set up on the casing and lead the sound hole, thereby the trompil quantity of casing has been reduced, and then the outward appearance uniformity of casing has been improved, thereby make the outward appearance feel of casing better, user experience has been improved, and simultaneously, the assembly gap is narrower for leading the sound hole, thereby can alleviate steam and dust in the environment and get into the casing effectively, and then electronic equipment's waterproof performance and dustproof performance have been improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments or the background art of the present invention, the drawings used in the description of the embodiments or the background art will be briefly described below, and it is obvious for those skilled in the art to obtain other drawings without any inventive exercise.

Fig. 1 is a schematic partial structure diagram of an electronic device according to an embodiment of the disclosure;

FIG. 2 is an enlarged view of a portion of FIG. 1;

fig. 3 is a cross-sectional view of an electronic device disclosed in an embodiment of the invention.

Description of reference numerals:

100-shell, 101-assembly gap,

200-first functional module, 210-module holder, 211-engagement channel, 220-first functional device,

300-acoustic device,

400-leading sound channel, 410-first leading sound segment, 420-second leading sound segment, 430-third leading sound segment,

510-a main board support, 511-a second groove, 520-a cover plate, 521-a first through hole, 530-a circuit board, 531-a second through hole,

610-first seal, 611-first relief hole, 620-second seal, 621-second relief hole, 630-dust guard.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely a few embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The technical solutions disclosed in the embodiments of the present invention are described in detail below with reference to the accompanying drawings.

As shown in fig. 1 to fig. 3, an embodiment of the invention discloses an electronic device, which includes a housing 100, a first functional module 200, and a second functional module.

The housing 100 provides a mounting base for other components of the electronic device. The second functional module may be disposed inside the casing 100, and the second functional module includes an acoustic device 300, and the acoustic device 300 may include at least one of a microphone, a receiver, and a speaker. The housing 100 has a sound guide channel 400 formed therein, and the sound guide channel 400 is used for transmitting sound information. The first functional module 200 at least partially protrudes from the outer surface of the housing 100, a portion of the first functional module 200 protruding from the outer surface of the housing 100 covers a portion of the outer surface of the housing 100, an assembly gap 101 is formed between the outer surface of the housing 100 and a sidewall of the first functional module 200, a port of the assembly gap 101 is exposed at the outer surface of the housing 100, the assembly gap 101 can be used for sound conduction of electronic equipment, and the acoustic device 300 is communicated with the assembly gap 101 through the sound conduction channel 400.

In a specific operation process, when a user makes a sound, the sound enters the casing 100 through the fitting slit 101, and the fitting slit 101 is transmitted to the acoustic device 300 through the sound guide channel 400. When the acoustic device 300 makes a sound, the sound is transmitted to the fitting slit 101 through the sound guide channel 400 and then transmitted to the user through the fitting slit 101. Optionally, the casing 100 may include a front cover and a rear cover, the front cover may provide an installation basis for a display screen of the electronic device, the rear cover may be a battery cover of the electronic device, the existing electronic device gradually develops toward a full screen, and most of the function modules arranged on the front cover are cancelled, so the first function module 200 may be installed on the rear cover of the casing 100, and the first function module 200 may be a rear camera module of the electronic device, may also be a flash lamp, and may also be a fingerprint module. Of course, the first functional module 200 may also be other functional modules, which is not limited herein.

In the embodiment of the present invention, the assembly gap 101 is formed after the housing 100 and the first functional module 200 are assembled, so that the assembly gap 101 between the first functional module 200 and the housing 100 can be utilized to transmit sound information, and thus, no sound guide hole needs to be formed in the housing 100, the number of holes formed in the housing 100 is reduced, and further, the integrity and the appearance consistency of the housing 100 are improved, so that the appearance texture of the housing 100 is better, and the user experience is improved, meanwhile, the assembly gap 101 is narrower than the sound guide hole, so that water vapor and dust in the environment can be effectively prevented from entering the housing 100, and further, the waterproof performance and the dustproof performance of the electronic device are improved.

In addition, the sound information is transmitted by using the assembly gap 101 between the housing 100 and the first functional module 200, and the housing 100 does not need to additionally process the sound guide hole, so that the processing process of the housing 100 is optimized, the processing step of the housing 100 is simplified, and the manufacturing cost of the electronic device is reduced.

In an alternative embodiment, the penetrating direction of the fitting slit 101 may be parallel to the outer surface of the housing 100. At this moment, the assembly gap 101 transversely penetrates, the edge of the assembly gap is formed between the first functional module 200 and the housing 100, dust and water vapor can be prevented from floating into the assembly gap 101, and the waterproof performance and the dustproof performance of the electronic device are further improved.

In the above embodiment, when the length of the assembling slot 101 is long, the user can easily see the assembling slot, so that the appearance quality of the electronic device is low, and the user experience is poor. In an alternative embodiment, the assembly slit 101 may include a plurality of sub slits spaced apart from each other, and the plurality of sub slits may penetrate through to the outer surface of the electronic device, and each sub slit may communicate with the acoustic device 300 through the sound guide channel 400. In this scheme, the length in sub-gap can set up less to make the sub-gap more hidden, in addition, the sub-gap that different position set up corresponds different pickup position and sound production position, thereby can realize electronic equipment's stereo effect, and then improve electronic equipment's performance. Alternatively, a plurality of sub slits may be disposed around the first functional module 200.

In another embodiment, the electronic device disclosed in the embodiment of the present invention may further include a switch, where the switch has at least one conducting position, and when the switch is located at the conducting position, at least one sub slot is communicated with the sound guiding channel 400. When the switch is in the on position, at least one of the sub-slits communicates with the acoustic device 300 through the sound-guiding channel 400. In this scheme, the switching piece is linked together at the different sub-gaps that switch on position and different position to can realize electronic equipment's directional pickup or directional sound production, and then can make sound information transfer to the assigned position, and then improve electronic equipment's performance. In addition, when the acoustic device 300 does not work, the switching piece can block the assembling gap 101, and the switching piece is not located at the conducting position, so that the waterproof performance and the dustproof performance of the electronic equipment can be improved.

Optionally, the switching piece may be disposed in the casing 100, a connection hole is formed in the switching piece, and a driving mechanism is further disposed in the casing 100, so that in a specific use process, the switching piece is driven to rotate by controlling the driving mechanism, and the connection hole in the switching piece is communicated with the sub-gaps at different positions.

In an alternative embodiment, the first functional module 200 may include a first functional device 220 and a module holder 210, the first functional device 220 is mounted on the module holder 210, the module holder 210 has a disc-shaped structure, at least a portion of the module holder 210 protrudes from the outer surface of the housing 100, and a mounting gap 101 is formed between the outer surface of the housing 100 and the sidewall of the module holder 210. In this scheme, sound is difficult to cause the influence to first functional device 220 at the in-process of transmission, and simultaneously, during steam and the dust in the external environment also are difficult to get into first functional device to electronic equipment's reliability has been improved.

For example, when the first functional module 200 is a camera module, the first functional device 220 can be a camera and other electronic components, and the module bracket 210 provides an installation basis for the camera and other electronic components.

In the above embodiment, the switching element is driven by the driving mechanism, and the switching element needs to consume electric energy when rotating, so that the energy consumption of the electronic device is increased, and meanwhile, the installation space of the driving mechanism needs to be reserved inside the casing 100, so that the structure of the electronic device is complex. In another alternative embodiment, the switching member is disposed around the edge of the module bracket 210, the switching member can rotate relative to the module bracket 210 and the housing 100, the switching member is provided with a connecting hole, and the connecting hole is communicated with at least one sub-slit when the switching member is in the conducting position. In this scheme, the switching piece sets up in the outside of casing 100, and the user can rotate by the manual drive switching piece to make electronic equipment's energy consumption reduce, simultaneously, casing 100 is inside need not to reserve actuating mechanism's installation space, makes electronic equipment's simple structure. Optionally, the switching element may also be used as a decoration of the first functional module 200, so that no additional decoration needs to be installed, and the structure of the electronic device is simpler and the cost of the electronic device is lower.

In an alternative embodiment, the assembly gap 101 may be a slender strip, and the width of the assembly gap 101, which is the distance between the first functional module 200 and the portion of the housing 100 forming the assembly gap 101, may be reduced, so that the assembly gap 101 is more hidden, and at this time, the user may not easily see the assembly gap 101, so that the appearance of the electronic device has better texture and better appearance consistency. The extension direction of the fitting slit 101 is the length direction of the fitting slit 101, and at this time, the length of the fitting slit 101 can be increased, so that the area of the fitting slit 101 can be increased, and the sound guiding requirement of the acoustic device 300 can be further met. The assembly gap 101 may be a linear strip structure or an arc strip structure. The shape structure of the fitting slit 101 may be determined by the outer shape structures of the first functional module 200 and the second functional module.

In another embodiment, the assembly gap 101 may be an arc-shaped structure, and the arc-shaped structure is smoother and has no edges and corners compared to a straight-line structure, so that the electronic device is more attractive, and the user experience is further improved.

In order to further improve the performance of the acoustic device 300, in another embodiment, a notch may be formed on a side wall of the first functional module 200, the notch is exposed outside the casing 100, and the notch and the casing 100 form an assembly gap 101. In this scheme, partial material has been removed at the lateral wall edge of first function module 200 to make the assembly gap 101 between casing 100 and the first function module 200 bigger, and then increased the area of assembly gap 101, thereby make assembly gap 101 can transmit more sound information, improved the performance of acoustic device 300, make electronic equipment's tone quality better. Optionally, the gap may be a slender strip, but may also be in other shapes, which is not limited herein.

In the above embodiment, dust and moisture in the external environment may enter the casing 100 along the fitting slit 101, which may cause the sound guide hole of the acoustic device 300 to be blocked or the electronic components of the acoustic device 300 to be short-circuited, resulting in damage to the acoustic device 300 and poor safety and reliability of the electronic device. In order to solve the above problem, in an alternative embodiment, the sound guiding channel 400 may include a first sound guiding section 410, a second sound guiding section 420 and a third sound guiding section 430 which are sequentially connected, the first sound guiding section 410 is connected to the assembly slit 101, the acoustic device 300 is located at an end of the third sound guiding section 430 facing away from the second sound guiding section 420, a central axis of the first sound guiding section 410 intersects with a central axis of the second sound guiding section 420, and the central axis of the first sound guiding section 410 is parallel to the central axis of the third sound guiding section 430. In this scheme, sound guide channel 400 is the structure of buckling to make the lateral wall of each sound guide section can block dust and steam, and simultaneously, sound guide channel 400's route is longer, thereby can make most dust and steam subside, adhere to on the lateral wall of each sound guide section, thereby make dust and steam be difficult to reach acoustic device 300's mounted position, and then make acoustic device 300's sound guide mouth be difficult to be blockked up, thereby make acoustic device 300's tone quality better.

Optionally, the included angle between the central axis of the first sound guiding segment 410 and the central axis of the second sound guiding segment 420 may be 90 °, and in this case, the central axis of the first sound guiding segment 410 and the central axis of the second sound guiding segment 420 may be perpendicular. At this time, the sound guide channel 400 has a compact structure, so that the space of the housing 100 occupied by the sound guide channel 400 is small.

Further, the first functional module 200 is provided with a connecting channel 211, the assembling gap 101 is communicated with the first sound guiding section 410 through the connecting channel 211, the central axis of the connecting channel 211 can intersect with the central axis of the first sound guiding section 410, and the central axis of the assembling gap 101 and the central axis of the connecting channel 211 can be collinear. In this scheme, assembly gap 101 is linked together through linking passageway 211 with leading sound passageway 400 to prolonged the route of sound transmission, thereby make steam and dust can attach on linking the inner wall of passageway 211, further improved electronic equipment's security and reliability.

Optionally, when the first functional module 200 includes the first functional device 220 and the module holder 210, the engaging channel 211 is opened on the module holder 210.

In another embodiment, the module bracket may include a decorative ring, and at this time, the module bracket may perform both decorative and protective functions and may be used to mount the first functional device, so that the structure of the electronic apparatus is more compact.

In the above embodiment, the electronic device disclosed in the embodiment of the present invention may further include a motherboard bracket 510, the motherboard bracket 510 is used to mount electronic components of the electronic device, the motherboard bracket 510 is disposed in the casing 100, the first sound guiding section 410 may be disposed on the first functional module 200, the second sound guiding section 420 and the third sound guiding section 430 may be disposed on the motherboard bracket 510, a certain included angle is formed between the first sound guiding section 410 and the second sound guiding channel 400, when the second sound guiding section 420 is manufactured by a pouring method, the second sound guiding section 420 is located inside the motherboard bracket 510, and the motherboard bracket 510 has a large demolding difficulty, thereby causing a large processing difficulty and a high cost of the electronic device.

In an optional embodiment, the electronic device disclosed in the embodiment of the present invention further includes a cover plate 520, the cover plate 520 may be located in the housing 100, a first groove may be formed on a side of the main board bracket 510 facing the first function module 200, the cover plate 520 covers a notch of the first groove, and at this time, the cover plate 520 and the first groove may form the second sound guiding section 420. One end of the cover plate 520 may be formed with a first through hole 521, and the second sound guiding section 420 and the first sound guiding section 410 may be communicated through the first through hole 521. The bottom wall of the first groove may be provided with a third sound conducting section 430, and the first through hole 521 and the third sound conducting section 430 are distributed in a staggered manner. Mainboard support 510 can adopt the mode of pouring to process out first recess earlier, because first recess is uncovered, consequently mainboard support 510 is the easier drawing of patterns, then covers the notch at first recess with apron 520 to form second leading note section 420, in this scheme, second leading note section 420 processing is convenient, thereby makes electronic equipment's the processing degree of difficulty little, and the cost is lower.

Alternatively, the cover plate 520 may be bonded to the main plate holder 510 using a double-sided tape. The cover plate 520 may be a PET (Polyethylene terephthalate) plate or a metal plate, and when the cover plate 520 is a metal plate, the cover plate 520 reinforces the rigidity of the main plate bracket 510, thereby enhancing the overall rigidity of the main plate bracket 510.

In the above embodiment, the first sound guiding section 410 may be disposed on the first functional module 200, and the second sound guiding section 420 may be disposed on the main board support 510, at this time, a gap is formed between the first sound guiding section 410 and the second sound guiding section 420, and sound may enter the gap, so that sound leakage of the electronic device is caused, and the sound quality of the electronic device is poor. In an optional embodiment, the electronic device disclosed in the embodiment of the present invention may further include a first sealing member 610, the first functional module 200 is hermetically connected to the cover plate 520 through the first sealing member 610, a first avoidance hole 611 may be formed at a position of the first sealing member 610 opposite to the first through hole 521, and the first sound conducting section 410 and the second sound conducting section 420 are communicated with each other through the first avoidance hole 611 and the first through hole 521. At this time, the first sealing member 610 may seal the gap between the first sound guiding section 410 and the second sound guiding section 420, so as to prevent sound leakage of the electronic device, thereby improving the sound quality of the electronic device. In addition, the first sealing member 610 may block dust and moisture inside the sound guide channel 400, thereby preventing the dust and moisture from damaging electronic components of the electronic device. Alternatively, the first sealing member 610 may be made of silicon rubber, or the like.

In the above embodiment, the cover plate 520 is overlapped on the surface of the motherboard bracket 510, at this time, the stacking height of the motherboard bracket 510 and the cover plate 520 is larger, and the stacking structure of the motherboard bracket 510 and the cover plate 520 occupies a larger space of the housing 100, so that the thickness of the electronic device is larger, and the user experience is poorer. In an alternative embodiment, the main board support 510 may further include a second groove 511 on a side facing the first functional module 200, the first groove may be formed at a bottom of the second groove 511, a notch of the first groove is located at the bottom of the second groove 511, the cover plate 520 overlaps the bottom of the second groove 511, the first groove and the second groove 511 may form a sunken structure, and at least a portion of the cover plate 520 is located in the second groove 511. In this embodiment, at least a portion of the cover plate 520 may be hidden in the second groove 511, so that the leakage volume of the cover plate 520 is reduced, the stacking height of the motherboard bracket 510 and the cover plate 520 is smaller, and the space occupied by the stacking structure of the motherboard bracket 510 and the cover plate 520 in the housing 100 is smaller, so that the thickness of the electronic device is smaller.

In another embodiment, the electronic device disclosed in the embodiment of the present invention may further include a circuit board 530, where the circuit board 530 is used to mount electronic components of the electronic device. The circuit board 530 may be disposed on a side of the motherboard bracket 510 away from the first functional module 200, the circuit board 530 may be disposed with a second through hole 531, the acoustic device 300 may be disposed on a side of the circuit board 530 away from the motherboard bracket 510, and the acoustic device 300 is communicated with the third sound conducting segment 430 through the second through hole 531. In this scheme, the acoustic device 300 may be disposed on a side of the circuit board 530 away from the motherboard bracket 510, so that the acoustic device 300 does not interfere with the motherboard bracket 510, and the reliability of the electronic device is higher.

Optionally, the circuit board 530 may be a main board of the electronic device, or may be a sub-board of the electronic device. In the embodiment of the present invention, the circuit board 530 may be a rigid circuit board or a flexible circuit board. For example, the circuit board 530 may be a printed circuit board, a rigid-flex board, or a flexible circuit board and a stiffener that are attached to each other. Of course, other configurations may be used, and are not limited herein.

In order to prevent sound leakage at the joint of the second through hole 531 and the third sound conducting segment 430, optionally, the electronic device disclosed in the embodiment of the present invention may further include a second sealing element 620, the circuit board 530 may be hermetically connected to the motherboard bracket 510 through the second sealing element 620, a second avoiding hole 621 is formed in a position of the second sealing element 620 opposite to the second through hole 531, and the third sound conducting segment 430 is communicated with the second through hole 531 through the second avoiding hole 621. In this embodiment, the second sealing member 620 may seal a gap between the third sound guiding section 430 and the second through hole 531, so as to prevent sound leakage of the electronic device, and further improve the sound quality of the electronic device. Alternatively, the second sealing element 620 may be made of silicon rubber, or the like.

In another embodiment, a third groove may be further formed in a side of the motherboard bracket 510 away from the first functional module 200, the second sealing element 620 is disposed in the third groove, at this time, the second sealing element 620 may be hidden in the third groove, so that an outer leakage volume of the second sealing element 620 is reduced, a stacking height of a structure formed by the motherboard bracket 510, the second sealing element 620 and the circuit board 530 is smaller, a space occupied by the structure formed by the motherboard bracket 510, the second sealing element 620 and the circuit board 530 by the structure formed by the motherboard bracket 620, the second sealing element 620 and the circuit board 530 is smaller, and a thickness of the electronic device is smaller.

In an alternative embodiment, the electronic device disclosed in the embodiment of the present invention may further include a dust-proof portion 630, and the dust-proof portion 630 may be disposed between the third sound guiding section 430 and the second through hole 531. At this time, the dust-proof part 630 can block most of the dust in the third sound guiding section 430, so that the dust does not easily enter the second through hole 531, and the dust in the second through hole 531 is small, thereby not affecting the sound quality of the acoustic device 300. In addition, the dust-proof portion 630 may be interposed between the motherboard bracket 510 and the circuit board 530, so that the motherboard bracket 510 does not need to be provided with a component for mounting the dust-proof portion 630, and the mounting operation of the dust-proof portion 630 is simple and convenient.

In an alternative embodiment, the first functional module 200 may have a disk structure, the fitting slit 101 may have a ring structure, and a portion of the fitting slit 101 communicates with the sound guide channel 400. In this scheme, assembly gap 101 can be the loop configuration, and the loop configuration is comparatively level and smooth, does not have the edges and corners for electronic equipment is more pleasing to the eye, has further improved user experience.

In another embodiment, the fitting slits 101 are communicated with the sound guide passage 400. At this moment, the assembly gap 101 of the annular structure can realize sound collection or sound production of the electronic device, so that a stereo sound channel of the electronic device can be realized, and in addition, the area of the assembly gap 101 is large, so that the sound quality of the electronic device is good.

The electronic device disclosed in the embodiment of the present invention may be a smart phone, a tablet computer, an electronic book reader, a wearable device (e.g., a smart watch), an electronic game machine, or the like, and the specific type of the electronic device is not limited in the embodiment of the present invention.

In the above embodiments of the present invention, the difference between the embodiments is mainly described, and different optimization features between the embodiments can be combined to form a better embodiment as long as they are not contradictory, and further description is omitted here in view of brevity of the text.

The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims

1. The electronic equipment is characterized by comprising a shell (100), a first functional module (200) and a second functional module, wherein the second functional module is arranged in the shell (100) and comprises an acoustic device (300), a sound guide channel (400) is formed in the shell (100), at least part of the first functional module (200) protrudes out of the outer surface of the shell (100), an assembly gap (101) is formed between the outer surface of the shell (100) and the side wall of the first functional module (200), and the acoustic device (300) is communicated with the assembly gap (101) through the sound guide channel (400).

2. The electronic device according to claim 1, wherein a penetrating direction of the fitting slit (101) is parallel to an outer surface of the housing (100).

3. The electronic device according to claim 1, wherein the fitting slit (101) comprises a plurality of sub slits arranged at intervals, the plurality of sub slits are arranged at intervals and penetrate through to the outer surface of the electronic device, and each sub slit is communicated with the acoustic device (300) through a sound guide channel (400).

4. The electronic device of claim 3, further comprising a switch having at least one conducting position, wherein at least one of the sub-slots is in communication with the sound guiding channel (400) when the switch is in the conducting position.

5. The electronic apparatus according to claim 4, wherein the first functional module (200) comprises a first functional device (220) and a module holder (210), the first functional device (220) is mounted on the module holder (210), the module holder (210) has a disc-shaped structure, the switch is disposed around an edge of the module holder (210), the switch is rotatable relative to the module holder (210) and the housing (100), the switch has a connecting hole, and the connecting hole is in communication with at least one of the sub-gaps when the switch is in the conducting position.

6. The electronic device according to claim 1, wherein the assembly gap (101) is an arc-shaped structure.

7. The electronic device according to claim 1, wherein the side wall of the first functional module (200) is opened with a notch, the notch is exposed outside the housing (100), and the notch and the housing (100) form the assembling gap (101).

8. The electronic device of claim 1, wherein the sound guiding channel (400) comprises a first sound guiding segment (410), a second sound guiding segment (420) and a third sound guiding segment (430) which are communicated in sequence, the first sound guiding segment (410) is communicated with the assembly gap (101), the acoustic device (300) is positioned at one end of the third sound guiding segment (430) facing away from the second sound guiding segment (420), the central axis of the first sound guiding segment (410) is intersected with the central axis of the second sound guiding segment (420), and the central axis of the first sound guiding segment (410) is parallel with the central axis of the third sound guiding segment (430).

9. The electronic device according to claim 8, wherein the first functional module (200) defines an engaging channel (211), the fitting gap (101) and the first sound guiding section (410) are communicated through the engaging channel (211), a central axis of the engaging channel (211) intersects a central axis of the first sound guiding section (410), and a central axis of the fitting gap (101) is collinear with a central axis of the engaging channel (211).

10. The electronic device of claim 8, further comprising a motherboard bracket (510) and a cover plate (520), the main board support (510) and the cover plate (520) are both located within the housing (100), a first groove is arranged on one side of the mainboard support (510) facing the first functional module (200), the cover plate (520) covers the notch of the first groove, the cover plate (520) and the first groove form the second sound leading section (420), one end of the cover plate (520) is provided with a first through hole (521), the second sound conducting section (420) is communicated with the first sound conducting section (410) through the first through hole (521), the third sound conducting section (430) is formed in the bottom wall of the first groove, and the first through holes (521) and the third sound conducting section (430) are distributed in a staggered mode.

11. The electronic device of claim 10, further comprising a first sealing member (610), wherein the first functional module (200) and the cover plate (520) are hermetically connected through the first sealing member (610), a first avoidance hole (611) is formed in a position, opposite to the first through hole (521), of the first sealing member (610), and the first sound conduction section (410) and the second sound conduction section (420) are communicated through the first avoidance hole (611) and the first through hole (521).

12. The electronic device according to claim 10, wherein a second groove (511) is further opened on a side of the motherboard bracket (510) facing the first functional module (200), the first groove is opened at a bottom of the second groove (511), the first groove and the second groove (511) form a sunken structure, and at least a portion of the cover plate (520) is located in the second groove (511).

13. The electronic device of claim 10, further comprising a circuit board (530), wherein the circuit board (530) is disposed on a side of the main board support (510) away from the first functional module (200), the circuit board (530) is formed with a second through hole (531), the acoustic device (300) is disposed on a side of the circuit board (530) away from the main board support (510), and the acoustic device (300) is communicated with the third sound conducting section (430) through the second through hole (531).

14. The electronic device of claim 13, further comprising a second sealing element (620), wherein a third groove is formed in one side of the main board support (510) departing from the first functional module (200), the second sealing element (620) is disposed in the third groove, the circuit board (530) is hermetically connected to the main board support (510) through the second sealing element (620), a second avoiding hole (621) is formed in a position of the second sealing element (620) opposite to the second through hole (531), and the third sound conducting section (430) is communicated with the second through hole (531) through the second avoiding hole (621).

15. The electronic device of claim 13, further comprising a dust guard (630), wherein the dust guard (630) is disposed between the third sound conducting segment (430) and the second through hole (531).

16. The electronic device according to claim 1, wherein the first functional module (200) has a disc-shaped structure, the fitting slit (101) has an annular structure, and at least a portion of the fitting slit (101) is in communication with the sound guide channel (400).