电子设备Electronic equipment
交叉引用cross reference
本发明要求在2020年03月27日提交中国专利局、申请号为202010234119.0、发明名称为“电子设备”的中国专利申请的优先权,该申请的全部内容通过引用结合在本发明中。The present invention claims the priority of a Chinese patent application filed with the Chinese Patent Office with an application number of 202010234119.0 and an invention title of "electronic equipment" on March 27, 2020. The entire content of the application is incorporated into the present invention by reference.
技术领域Technical field
本发明涉及通信技术领域,尤其涉及一种电子设备。The present invention relates to the field of communication technology, and in particular to an electronic device.
背景技术Background technique
智能手机、平板电脑等电子设备已经成为现代人生活中不可或缺的产品。电子设备中通常设置有声学器件,例如受话器、麦克风、扬声器等,声学器件能够实现电子设备的声学性能。Electronic devices such as smart phones and tablet computers have become indispensable products in modern life. Acoustic devices, such as receivers, microphones, speakers, etc., are usually provided in electronic devices, and the acoustic devices can achieve the acoustic performance of the electronic devices.
相关技术中,声学器件设置于电子设备的壳体内,电子设备的壳体上开设导音孔,用户发出声音信息可以通过导音孔传递至声学器件,或者声学器件发声音信息通过导音孔传递至用户,以实现用户与电子设备的声音信息的交互。In the related art, the acoustic device is arranged in the housing of the electronic device, and the housing of the electronic device is provided with a sound guide hole. The sound information emitted by the user can be transmitted to the acoustic device through the sound guide hole, or the sound information sent by the acoustic device is transmitted through the sound guide hole. To the user, in order to realize the interaction between the user and the sound information of the electronic device.
然而,上述方案中,壳体上需要开设传递声音信息的导音孔,此时,导音孔破坏了壳体的完整性,造成电子设备的外观一致性较低,同时,也导致电子设备的防水性和防尘性较低,从而造成电子设备的安全性和可靠性较差。However, in the above solution, the housing needs to be provided with a sound guide hole for transmitting sound information. At this time, the sound guide hole destroys the integrity of the housing, resulting in low appearance consistency of the electronic device, and at the same time, it also causes the electronic device to fail. Water and dust resistance is low, resulting in poor safety and reliability of electronic equipment.
发明内容Summary of the invention
本发明公开一种电子设备,以解决电子设备的外观一致性不高,安全性和可靠性较低的问题。The invention discloses an electronic device to solve the problems of poor appearance consistency and low safety and reliability of the electronic device.
为了解决上述技术问题,本发明是这样实现的:In order to solve the above technical problems, the present invention is implemented as follows:
第一方面,本发明实施例公开了一种电子设备,包括第一壳体、第一功能模组和第二功能模组;所述第一壳体与所述第一功能模组形成容纳空间,所述第二功能模组设置于所述容纳空间内,且第二功能模组包括声学器件,所述第一壳体和所述第一功能模组之间具有装配缝隙,所述第一壳体内设置有导音通道,所述声学器件通过所述导音通道与所述装配缝隙连通。In a first aspect, an embodiment of the present invention discloses an electronic device, including a first housing, a first functional module, and a second functional module; the first housing and the first functional module form an accommodating space , The second functional module is arranged in the accommodating space, and the second functional module includes an acoustic device, there is an assembly gap between the first housing and the first functional module, and the first A sound guide channel is provided in the housing, and the acoustic device communicates with the assembly gap through the sound guide channel.
本发明采用的技术方案能够达到以下有益效果:The technical scheme adopted by the present invention can achieve the following beneficial effects:
在本发明实施例中,第一壳体和第一功能模组围成容纳空间,声学器件位于容纳空间内,第一壳体内设置有导音通道,声学器件通过导音通道与装配缝隙连通。当用户发出声音信息时,声音信息经由装配缝隙进入壳体内,装配缝隙通过导音通道传递至声学器件;或者,当声学器件发声音信息时,声音信息通过导音通道传递至装配缝隙,再经由装配缝隙传递至用户,从而实现用户与电子设备的声音信息的交互。此方案中,第一壳体和第一功能模组装配后具有装配缝隙,因此可以利用第一壳体与第一功能模组之间的装配缝隙传递声音信息,从而使得壳体上无需开设导音孔,从而减少了壳体的开孔数量,进而提高了 壳体的外观一致性,从而使得壳体的外观质感较好,改善了用户体验。同时,装配缝隙相对于导音孔更窄,从而能够有效地缓解环境中的水汽和灰尘进入壳体,进而提高了电子设备的防水性能和防尘性能。In the embodiment of the present invention, the first housing and the first functional module enclose an accommodating space, the acoustic device is located in the accommodating space, a sound guide channel is arranged in the first housing, and the acoustic device communicates with the assembly gap through the sound guide channel. When the user sends out sound information, the sound information enters the housing through the assembly gap, and the assembly gap is transmitted to the acoustic device through the sound guide channel; or when the acoustic device emits sound information, the sound information is transmitted to the assembly gap through the sound guide channel, and then through The assembly gap is transmitted to the user, so as to realize the interaction between the user and the sound information of the electronic device. In this solution, the first housing and the first functional module have an assembly gap after being assembled. Therefore, the assembly gap between the first housing and the first functional module can be used to transmit sound information, thereby eliminating the need for a guide on the housing. The sound hole reduces the number of openings of the housing, thereby improving the consistency of the appearance of the housing, so that the appearance of the housing is better and the user experience is improved. At the same time, the assembly gap is narrower than the sound guide hole, which can effectively alleviate the water vapor and dust in the environment from entering the housing, thereby improving the waterproof performance and dustproof performance of the electronic device.
附图说明Description of the drawings
为了更清楚地说明本发明实施例或背景技术中的技术方案,下面将对实施例或背景技术描述中所需要使用的附图作简单的介绍,显而易见地,对于本领域普通技术人员而言,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。In order to more clearly describe the technical solutions in the embodiments of the present invention or the background art, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments or the background art. Obviously, for those of ordinary skill in the art, Other drawings can be obtained based on these drawings without creative labor.
图1为本发明实施例公开的电子设备的结构示意图;Fig. 1 is a schematic structural diagram of an electronic device disclosed in an embodiment of the present invention;
图2为本发明实施例公开的另一种电子设备的结构示意图;Figure 2 is a schematic structural diagram of another electronic device disclosed in an embodiment of the present invention;
图3为本发明实施例公开的电子设备的剖视图;FIG. 3 is a cross-sectional view of an electronic device disclosed in an embodiment of the present invention;
图4为本发明实施例公开的另一种电子设备的剖视图。Fig. 4 is a cross-sectional view of another electronic device disclosed in an embodiment of the present invention.
附图标记说明:Description of reference signs:
100-第一壳体、101-装配缝隙、102-衔接通道、110-第三凹槽、100-first housing, 101-assembly gap, 102-connection channel, 110-third groove,
200-导音通道、210-第一导音段、220-第二导音段、230-第三导音段、200-guidance channel, 210-first guidance segment, 220-second guidance segment, 230-third guidance segment,
300-声学器件、300-acoustic device,
400-盖板、400-cover plate,
500-密封件、510-避让孔、500-seal, 510-avoidance hole,
600-电路板、610-通孔、600-circuit board, 610-through hole,
700-防尘部、700-Dustproof Department,
800-屏蔽罩、800-shielding cover,
900-第一功能模组、910-第二壳体、920-显示模组。900-first functional module, 910-second housing, 920-display module.
具体实施方式Detailed ways
为使本发明的目的、技术方案和优点更加清楚,下面将结合本发明具体实施例及相应的附图对本发明技术方案进行清楚、完整地描述。显然,所描述的实施例仅是本发明的一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。In order to make the objectives, technical solutions, and advantages of the present invention clearer, the technical solutions of the present invention will be described clearly and completely below in conjunction with specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
以下结合附图,详细说明本发明各个实施例公开的技术方案。The technical solutions disclosed in the various embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
如图1~图4所示,本发明实施例公开一种电子设备,该电子设备包括第一壳体100、第一功能模组900和第二功能模组。As shown in FIGS. 1 to 4, an embodiment of the present invention discloses an electronic device. The electronic device includes a first housing 100, a first functional module 900, and a second functional module.
第一壳体100与第一功能模组900形成容纳空间,该容纳空间为电子设备的其他组成部件提供安装位置。第二功能模组设置于容纳空间内,并且第二功能模组包括声学器件300,该声学器件300可以包括麦克风、受话器和扬声器等器件中的至少一者。第一壳体100和第一功能模组900之间具有装配缝隙101,装配缝隙101的一个端口显露于电子设备的外表面,该装配缝隙101可以用于电子设备导音,第一壳体100内设置有导音通道200,声学器件300通过导音通道200与装配缝隙101连通。The first housing 100 and the first functional module 900 form an accommodating space, and the accommodating space provides an installation location for other components of the electronic device. The second functional module is disposed in the accommodation space, and the second functional module includes an acoustic device 300, which may include at least one of a microphone, a receiver, and a speaker. There is an assembling gap 101 between the first housing 100 and the first functional module 900. One port of the assembling gap 101 is exposed on the outer surface of the electronic device. The assembling gap 101 can be used to conduct sound of the electronic device. A sound guide channel 200 is provided inside, and the acoustic device 300 communicates with the assembly gap 101 through the sound guide channel 200.
在具体的操作过程中,当用户发出声音时,声音经由装配缝隙101进入壳体内,装配缝隙101通过导音通道200传递至声学器件300。当声学器件300发出声音时,声音通过 导音通道200传递至装配缝隙101,再经由装配缝隙101传递至用户。可选的,第一功能模组900可以包括显示模组920,第一壳体100可以是电子设备的中框或者后盖,在第一壳体100为中框的情况下,中框与显示模组920相连接,中框与显示模组920之间具有装配缝隙101。在第一壳体100为后盖的情况下,后盖与显示模组920相连接,后盖与显示模组920之间具有装配缝隙101。其中,后盖可以是电子设备的电池盖。In a specific operation process, when the user makes a sound, the sound enters the housing through the assembly gap 101, and the assembly gap 101 is transmitted to the acoustic device 300 through the sound guide channel 200. When the acoustic device 300 emits sound, the sound is transmitted to the assembly gap 101 through the sound guide channel 200, and then transmitted to the user through the assembly gap 101. Optionally, the first functional module 900 may include a display module 920, and the first housing 100 may be a middle frame or a back cover of an electronic device. When the first housing 100 is a middle frame, the middle frame and the display The modules 920 are connected, and there is an assembly gap 101 between the middle frame and the display module 920. When the first housing 100 is a back cover, the back cover is connected to the display module 920, and there is an assembly gap 101 between the back cover and the display module 920. Wherein, the back cover can be a battery cover of an electronic device.
本发明实施例中,第一壳体100和第一功能模组900装配后具有装配缝隙101,因此可以利用第一壳体100与第一功能模组900之间的装配缝隙101传递声音信息,从而使得壳体上无需开设导音孔,从而减少了壳体的开孔数量,进而提高了壳体的完整性和外观一致性,从而使得壳体的外观质感较好,改善了用户体验。同时,装配缝隙101相对于导音孔更窄,从而能够有效地缓解环境中的水汽和灰尘进入壳体,进而提高了电子设备的防水性能和防尘性能。In the embodiment of the present invention, the first housing 100 and the first functional module 900 have an assembly gap 101 after being assembled. Therefore, the assembly gap 101 between the first housing 100 and the first functional module 900 can be used to transmit sound information. As a result, there is no need to provide sound guide holes on the housing, thereby reducing the number of openings of the housing, thereby improving the integrity and appearance consistency of the housing, so that the appearance and texture of the housing are better, and the user experience is improved. At the same time, the assembly gap 101 is narrower than the sound guide hole, which can effectively relieve the water vapor and dust in the environment from entering the housing, thereby improving the waterproof performance and dustproof performance of the electronic device.
另外,利用第一壳体100与第一功能模组900之间的装配缝隙101传递声音信息,第一壳体100或者功能模组上无需额外加工导音孔,从而优化了第一壳体100和第一功能模组900的加工工艺,使得第一壳体100和第一功能模组900加工步骤简化,从而降低了电子设备的制造成本。In addition, the assembly gap 101 between the first housing 100 and the first functional module 900 is used to transmit sound information, and there is no need to additionally process sound guide holes on the first housing 100 or the functional module, thereby optimizing the first housing 100 With the processing technology of the first functional module 900, the processing steps of the first housing 100 and the first functional module 900 are simplified, thereby reducing the manufacturing cost of the electronic device.
上述实施例中,第一功能模组900可以包括显示模组920,显示模组920可以与第一壳体100形成容纳空间,显示模组920与第一壳体100之间具有装配间隙。此方案使得电子设备组装简单、方便。In the above embodiment, the first functional module 900 may include a display module 920, the display module 920 may form an accommodation space with the first housing 100, and there is an assembly gap between the display module 920 and the first housing 100. This solution makes the assembly of electronic equipment simple and convenient.
上述实施例中,显示模组920与第一壳体100之间具有装配缝隙101,灰尘和水汽容易通过该缝隙进入显示模组920,从而容易影响显示模组920,一种可选的实施例中,第一功能模组900还可以包括显示模组920和第二壳体910,显示模组920与第二壳体910相连,第二壳体910与第一壳体100相连接,显示模组920、第二壳体910和第一壳体100之间形成容纳空间,第二壳体910与第一壳体100之间具有装配缝隙101。此方案中,声音在传递的过程中不容易对显示模组920造成影响,同时,外部环境中的水汽和灰尘也不容易进入显示模组920中,从而提高了电子设备的可靠性。该第二壳体910可以是电子设备的前盖,前盖可以为电子设备的显示模组920提供安装基础。第二壳体910还可以是电子设备的中框。第一壳体100和第二壳体910可以组成电子设备的壳体。在另一种可选的实施方式中,第二壳体910可以是中框,第一壳体100可以是后盖,第二壳体910与第一壳体100之间具有装配缝隙101。In the above embodiment, there is an assembly gap 101 between the display module 920 and the first housing 100. Dust and moisture can easily enter the display module 920 through the gap, thereby easily affecting the display module 920. An alternative embodiment The first functional module 900 may also include a display module 920 and a second housing 910, the display module 920 is connected to the second housing 910, the second housing 910 is connected to the first housing 100, and the display module An accommodation space is formed between the group 920, the second housing 910, and the first housing 100, and an assembly gap 101 is formed between the second housing 910 and the first housing 100. In this solution, the sound is not likely to affect the display module 920 during the transmission process, and at the same time, water vapor and dust in the external environment are not easy to enter the display module 920, thereby improving the reliability of the electronic device. The second housing 910 may be a front cover of the electronic device, and the front cover may provide an installation basis for the display module 920 of the electronic device. The second housing 910 may also be a middle frame of an electronic device. The first housing 100 and the second housing 910 may constitute a housing of an electronic device. In another alternative embodiment, the second housing 910 may be a middle frame, the first housing 100 may be a back cover, and there is an assembly gap 101 between the second housing 910 and the first housing 100.
一种可选的实施例中,装配缝隙101可以为条形,可以通过减小装配缝隙101的宽度,从而使得装配缝隙101更加隐蔽,该宽度为第一功能模组900和第一壳体100形成装配缝隙101的部分之间的距离,此时,用户不容易看到装配缝隙101,从而使得电子设备的外观质感更好。装配缝隙101的延伸方向为装配缝隙101的长度方向,此时可以通过增大装配缝隙101的长度,从而可以增大装配缝隙101的面积,进而满足声学器件300的导音需求。需要说明的是,装配缝隙101可以为直线型条形结构,也可以为弧形条状结构。当装配缝隙101为弧形条状结构时,装配缝隙101可以设置于电子设备边缘的拐角处,从而与电子设备的边缘相配合。装配缝隙101的形状结构可以由第一功能模组900和第一壳体100的外形结构决定。In an alternative embodiment, the assembling gap 101 may be strip-shaped, and the width of the assembling gap 101 can be reduced to make the assembling gap 101 more concealed. The width is the first functional module 900 and the first housing 100. The distance between the parts forming the assembling gap 101, at this time, it is not easy for the user to see the assembling gap 101, which makes the appearance and texture of the electronic device better. The extension direction of the assembly gap 101 is the length direction of the assembly gap 101. At this time, the length of the assembly gap 101 can be increased, so that the area of the assembly gap 101 can be increased, thereby meeting the sound conduction requirements of the acoustic device 300. It should be noted that the assembly gap 101 can be a linear strip structure or an arc strip structure. When the assembling gap 101 has an arc-shaped strip structure, the assembling gap 101 can be arranged at the corner of the edge of the electronic device so as to match the edge of the electronic device. The shape and structure of the assembly gap 101 may be determined by the shape and structure of the first functional module 900 and the first housing 100.
为了进一步提高声学器件300的性能,另一种实施例中,第一壳体100的边缘开设有 豁口,该豁口与第一功能模组900形成装配缝隙101。或者,第一功能模组900的边缘开设有豁口,该豁口与第一壳体100形成装配缝隙101。此方案中,第一功能模组900的边缘或者第一壳体100的边缘去除部分材料,从而使得第一壳体100和第一功能模组900之间的装配缝隙101更大,进而增大了装配缝隙101的面积,从而使得装配缝隙101能够传递更多的声音信息,提高了声学器件300的性能,使得电子设备的音质较好。可选的,豁口可以为细长条状,当然也可以为其他形状,本文对此不作限制。In order to further improve the performance of the acoustic device 300, in another embodiment, the edge of the first housing 100 is provided with a notch, and the notch and the first functional module 900 form an assembly gap 101. Alternatively, the edge of the first functional module 900 is provided with a notch, and the notch and the first housing 100 form an assembly gap 101. In this solution, part of the material is removed from the edge of the first functional module 900 or the edge of the first housing 100, so that the assembly gap 101 between the first housing 100 and the first functional module 900 is larger, thereby increasing The area of the assembly gap 101 is reduced, so that the assembly gap 101 can transmit more sound information, improve the performance of the acoustic device 300, and make the sound quality of the electronic device better. Optionally, the notch can be in the shape of a slender strip, of course, it can also be in other shapes, which is not limited herein.
上述实施例中,装配缝隙101的长度较长时,用户容易看到,从而使得电子设备的外观质感较低,用户体验较差。一种可选的实施例中,装配缝隙101可以包括多个间隔设置的子缝隙,多个子缝隙间隔设置,且多个子缝隙均贯通至电子设备的外表面,每个子缝隙均通过导音通道200与声学器件300连通。此方案中,子缝隙的长度可以设置的较小,从而使得子缝隙更加隐蔽。另外,不同方位设置的子缝隙,对应不同的采声和发声位置,从而可以实现电子设备的立体声效,进而能提高电子设备的使用性能。与此同时,将装配缝隙101分成多个间隔设置的子缝隙,从而能够避免较大粒径的异物的侵入。In the above-mentioned embodiment, when the length of the assembly gap 101 is long, it is easy for the user to see, so that the appearance and texture of the electronic device are low, and the user experience is poor. In an optional embodiment, the assembly gap 101 may include a plurality of sub-slits arranged at intervals, the plurality of sub-slits are arranged at intervals, and the plurality of sub-slits all penetrate the outer surface of the electronic device, and each sub-slit passes through the sound conducting channel 200 It communicates with the acoustic device 300. In this solution, the length of the sub-slot can be set to be smaller, so that the sub-slot is more concealed. In addition, the sub-slits arranged in different directions correspond to different sound collection and sound generation positions, so that the stereo effect of the electronic device can be realized, and the use performance of the electronic device can be improved. At the same time, the assembling gap 101 is divided into a plurality of sub-slits arranged at intervals, so as to avoid the intrusion of foreign matter with a larger particle size.
上述实施例中,外部环境中的灰尘和水汽可以沿着装配缝隙101进入容纳空间内,从而有可能造成声学器件300的导音孔被堵塞或者声学器件300的电子元器件短路,致使声学器件300损坏,致使电子设备的安全性和可靠性较低。为了解决上述问题,一种可选的实施例中,导音通道200可以包括依次连通的第一导音段210、第二导音段220和第三导音段230,第一导音段210与装配缝隙101连通,声学器件300位于第三导音段230背离第二导音段220的一端,第一导音段210中心轴线与第二导音段220的中心轴线相交,第一导音段210的中心轴线与第三导音段230的中心轴线相平行。此方案中,导音通道200为弯折结构,从而使得各个导音段的侧壁能够阻挡灰尘和水汽。同时,导音通道200的路径较长,从而可以使得大部分灰尘和水汽沉降,附着在各个导音段的侧壁上,从而使得灰尘和水汽不容易到达声学器件300的安装位置,进而使得声学器件300的导音口不容易被堵塞,从而使得声学器件300的音质较好。In the above embodiment, dust and water vapor in the external environment can enter the accommodating space along the assembly gap 101, which may cause the sound hole of the acoustic device 300 to be blocked or the electronic components of the acoustic device 300 to short-circuit, resulting in the acoustic device 300 Damage, resulting in lower safety and reliability of electronic equipment. In order to solve the above problem, in an optional embodiment, the sound guide channel 200 may include a first sound guide section 210, a second sound guide section 220, and a third sound guide section 230 that are connected in sequence, and the first sound guide section 210 In communication with the assembly gap 101, the acoustic device 300 is located at the end of the third sound guide section 230 away from the second sound guide section 220. The central axis of the first sound guide section 210 intersects the center axis of the second sound guide section 220. The central axis of the segment 210 is parallel to the central axis of the third sound guide segment 230. In this solution, the sound guide channel 200 has a bent structure, so that the side walls of each sound guide section can block dust and water vapor. At the same time, the sound guide channel 200 has a long path, so that most of the dust and water vapor can settle and adhere to the side walls of each sound guide section, so that the dust and water vapor cannot easily reach the installation position of the acoustic device 300, thereby making the acoustics The sound guide port of the device 300 is not easily blocked, so that the sound quality of the acoustic device 300 is better.
可选的,当第一壳体包括中框时,导音通道200可以开设于中框上;当第一壳体包括主板支架时,导音通道200可以开设于主板支架上。导音通道的位置可以根据电子设备的具体结构进行设置。Optionally, when the first housing includes a middle frame, the sound guide channel 200 may be opened on the middle frame; when the first housing includes a main board support, the sound guide channel 200 may be opened on the main board support. The position of the sound guide channel can be set according to the specific structure of the electronic device.
优选地,第一导音段210的中心轴线与第二导音段220的中心轴线的夹角可以为90°,此时,第一导音段210的中心轴线与第二导音段220的中心轴线可以相垂直。此时,导音通道200的结构较为紧凑,从而使得导音通道200占用的壳体空间较小。Preferably, the included angle between the center axis of the first sound guide section 210 and the center axis of the second sound guide section 220 may be 90°. At this time, the center axis of the first sound guide section 210 and the center axis of the second sound guide section 220 The central axis can be perpendicular. At this time, the structure of the sound guide channel 200 is relatively compact, so that the sound guide channel 200 occupies a smaller housing space.
进一步的,第一壳体100可以开设有衔接通道102,第一导音段210与装配缝隙101可以错位设置,第一导音段210可以通过衔接通道102与装配缝隙101连通。此方案中,装配缝隙101与导音通道200可以通过衔接通道102相连通,从而延长了声音传递的路径,从而使得水汽和灰尘能够附着在衔接通道102的内壁上,进一步提高了电子设备的安全性和可靠性。Furthermore, the first housing 100 may be provided with a connecting channel 102, the first sound guide section 210 and the assembly gap 101 may be arranged in a staggered manner, and the first sound guide section 210 may communicate with the assembly gap 101 through the connecting channel 102. In this solution, the assembly gap 101 and the sound guide channel 200 can be connected through the connecting channel 102, thereby extending the sound transmission path, so that water vapor and dust can adhere to the inner wall of the connecting channel 102, further improving the safety of the electronic device Sex and reliability.
可选的,当第一壳体100包括中框时,衔接通道102可以开设于中框上。当第一壳体100包括主板支架时,衔接通道102可以开设于主板支架上,衔接通道102的设置位置可以根据电子设备的结构进行具体设置。Optionally, when the first housing 100 includes a middle frame, the connecting channel 102 may be opened on the middle frame. When the first housing 100 includes a motherboard bracket, the connecting channel 102 may be opened on the motherboard bracket, and the setting position of the connecting channel 102 may be specifically set according to the structure of the electronic device.
上述实施例中,第一壳体100的部分可以位于容纳空间内,第一导音段210、第二导 音段220和第三导音段230可以开设于第一壳体100,第一导音段210和第三导音通道200与第二导音通道200具有一定的夹角,当采用浇注的方式制作第二导音段220时,第二导音段220位于第一壳体100的内部,第一壳体100脱模难度大,从而造成电子设备加工难度大,成本较高。In the above embodiment, part of the first housing 100 may be located in the accommodating space, the first sound guide section 210, the second sound guide section 220, and the third sound guide section 230 may be opened in the first housing 100, and the first sound guide section The sound segment 210 and the third sound guide channel 200 have a certain angle with the second sound guide channel 200. When the second sound guide section 220 is made by casting, the second sound guide section 220 is located in the first housing 100 Internally, it is difficult to demold the first housing 100, which makes the processing of electronic equipment difficult and high in cost.
一种可选的实施例中,本发明实施例公开的电子设备还包括盖板400,盖板400位于容纳空间内,第一壳体100朝向第一功能模组900的一侧开设有第一凹槽,盖板400覆盖第一凹槽的槽口,盖板400与第一凹槽形成第二导音段220,第一凹槽的底壁开设有第一导音段210和第三导音段230,第一导音段210和第三导音段230分别位于第一凹槽的两端。第一壳体100可以采用浇注的方式先加工出第一凹槽,由于第一凹槽为敞口,因此第一壳体100更容易脱模,然后将盖板400覆盖在第一凹槽的槽口,从而形成第二导音段220,此方案中,第二导音段220加工方便,从而使得电子设备的加工难度小,成本较低。In an optional embodiment, the electronic device disclosed in the embodiment of the present invention further includes a cover 400, the cover 400 is located in the accommodating space, and the first housing 100 is provided with a first housing 100 facing the side of the first functional module 900. A groove, the cover plate 400 covers the notch of the first groove, the cover plate 400 and the first groove form a second sound guide section 220, and the bottom wall of the first groove is provided with a first sound guide section 210 and a third guide section. The sound segment 230, the first sound guide segment 210 and the third sound guide segment 230 are respectively located at two ends of the first groove. The first housing 100 can be molded into the first groove first. Since the first groove is open, the first housing 100 is easier to demold, and then the cover plate 400 is covered on the first groove. The notch forms the second sound guide section 220. In this solution, the second sound guide section 220 is easy to process, so that the processing difficulty of the electronic device is small and the cost is low.
可选的,盖板400可以采用双面胶与第一壳体100粘接。盖板400可以是聚对苯二甲酸乙二酯(Polyethylene terephthalate,PET)板,还可以为金属板,当盖板400为金属板时,盖板400对第一壳体100还能起到补强刚度的作用,增强了第一壳体100的整体刚度。Optionally, the cover plate 400 may be bonded to the first housing 100 by using double-sided tape. The cover plate 400 may be a polyethylene terephthalate (PET) plate or a metal plate. When the cover plate 400 is a metal plate, the cover plate 400 can also complement the first housing 100. The effect of strong rigidity enhances the overall rigidity of the first shell 100.
上述实施例中,盖板400搭接在第一壳体100的板面上,此时第一壳体100与盖板400的堆叠高度较大,第一壳体100与盖板400的堆叠结构占据壳体空间较大,从而使得电子设备的厚度较大,致使用户体验较差。一种可选的实施例中,第一壳体100朝向第一功能模组900的一侧还可以开设有第二凹槽,第一凹槽可以开设于第二凹槽的槽底,第一凹槽可以与第二凹槽形成沉台结构,至少部分盖板400位于第二凹槽内。此方案中,至少部分盖板400可以隐藏于第二凹槽内,从而使得盖板400的外露体积减小,进而第一壳体100与盖板400的堆叠高度较小,第一壳体100与盖板400的堆叠结构占据壳体空间较小,使得电子设备的厚度较小。In the above embodiment, the cover plate 400 is overlapped on the plate surface of the first housing 100. At this time, the stack height of the first housing 100 and the cover plate 400 is relatively large, and the stack structure of the first housing 100 and the cover plate 400 It occupies a large space in the housing, which makes the thickness of the electronic device large, resulting in a poor user experience. In an alternative embodiment, the side of the first housing 100 facing the first functional module 900 may further be provided with a second groove, the first groove may be opened at the bottom of the second groove, and the first The groove and the second groove may form a sinker structure, and at least a part of the cover plate 400 is located in the second groove. In this solution, at least part of the cover plate 400 can be hidden in the second groove, so that the exposed volume of the cover plate 400 is reduced, and the stack height of the first housing 100 and the cover plate 400 is small, and the first housing 100 The stacked structure with the cover plate 400 occupies a small space in the housing, so that the thickness of the electronic device is small.
另一种实施例中,本发明实施例公开的电子设备还可以包括电路板600,声学器件300设置于电路板600背离第一功能模组900的一侧,电路板600与第一壳体100相连,电路板600开设有通孔610,声学器件300通过通孔610与第三导音段230连通。此方案中,声学器件300可以设置于电路板600背离第一功能模组900的一侧,从而使得声学器件300不容易与第一功能模组900发生干涉,进而使得电子设备的可靠性较高。In another embodiment, the electronic device disclosed in the embodiment of the present invention may further include a circuit board 600, the acoustic device 300 is disposed on the side of the circuit board 600 away from the first functional module 900, the circuit board 600 and the first housing 100 Connected, the circuit board 600 is provided with a through hole 610, and the acoustic device 300 is connected to the third sound conducting section 230 through the through hole 610. In this solution, the acoustic device 300 can be arranged on the side of the circuit board 600 away from the first functional module 900, so that the acoustic device 300 is not easy to interfere with the first functional module 900, thereby making the electronic device more reliable. .
可选的,该电路板600可以是电子设备的主板,也可以是电子设备的副板。本发明实施例中,电路板600可以是刚性电路板,也可以是柔性电路板。例如,电路板600可以采用印刷电路板,也可以采用软硬结合板,或者电路板600包括贴合设置的柔性电路板和补强板。当然,还可以采用其他结构形式,本文对此不做限制。Optionally, the circuit board 600 may be the main board of the electronic device or the sub-board of the electronic device. In the embodiment of the present invention, the circuit board 600 may be a rigid circuit board or a flexible circuit board. For example, the circuit board 600 may be a printed circuit board, or a flexible and rigid combination board, or the circuit board 600 may include a flexible circuit board and a reinforcing board that are attached and arranged. Of course, other structural forms can also be used, and this article does not restrict it.
另一种可选的实施例中,第一壳体100朝向电路板600的一侧可以开设有第三凹槽110,至少部分电路板600可以位于第三凹槽110内。此时,至少部分电路板600隐藏于第三凹槽110内,从而使得第一壳体100与电路板600的堆叠高度较大,进而使得第一壳体100和电路板600的堆叠厚度较小,从而使得电子设备的厚度较小。In another alternative embodiment, the side of the first housing 100 facing the circuit board 600 may be provided with a third groove 110, and at least part of the circuit board 600 may be located in the third groove 110. At this time, at least part of the circuit board 600 is hidden in the third groove 110, so that the stack height of the first housing 100 and the circuit board 600 is relatively large, and the stack thickness of the first housing 100 and the circuit board 600 is relatively small. , So that the thickness of the electronic device is smaller.
为了防止通孔610与第三导音段230的连接处漏音,可选的,本发明实施例公开的电子设备还可以包括密封件500,电路板600可以与第一壳体100通过密封件500密封连接,密封件500可以开设有避让孔510,第三导音段230和通孔610可以通过避让孔510连通。此方案中,密封件500可以封堵第三导音段230和通孔610之间的间隙,从而防止电子设 备漏音,进一步提高了电子设备的音质。可选的,密封件500可以采用硅胶、橡胶等材料制作。In order to prevent sound leakage at the connection between the through hole 610 and the third sound guide section 230, optionally, the electronic device disclosed in the embodiment of the present invention may further include a sealing member 500, and the circuit board 600 may pass through the first housing 100 through the sealing member. 500 is connected in a sealed manner, the sealing member 500 may be provided with an escape hole 510, and the third sound guide section 230 and the through hole 610 may be communicated through the escape hole 510. In this solution, the sealing member 500 can block the gap between the third sound guide section 230 and the through hole 610, thereby preventing sound leakage of the electronic device, and further improving the sound quality of the electronic device. Optionally, the sealing member 500 may be made of materials such as silica gel or rubber.
一种可选的实施例中,本发明实施例公开的电子设备还可以包防尘部700,该防尘部700可以设置于第三导音段230和通孔610之间。此时,防尘部700能够将大部分灰尘阻挡在第三导音段230内,从而使得灰尘不容易进入通孔610内,通孔610内的灰尘较少,因此能够减低对声学器件300的音质的影响。另外,防尘部700可以夹设在第一壳体100与电路板600之间,从而使得第一壳体100无需设置用于安装防尘部700的结构,从而使防尘部700的安装操作简单、方便。In an optional embodiment, the electronic device disclosed in the embodiment of the present invention may further include a dust-proof part 700, and the dust-proof part 700 may be disposed between the third sound guide section 230 and the through hole 610. At this time, the dust-proof part 700 can block most of the dust in the third sound guide section 230, so that dust does not easily enter the through hole 610, and there is less dust in the through hole 610, thereby reducing the impact on the acoustic device 300. The impact of sound quality. In addition, the dust-proof part 700 may be sandwiched between the first housing 100 and the circuit board 600, so that the first housing 100 does not need to be provided with a structure for installing the dust-proof part 700, so that the installation operation of the dust-proof part 700 easy and convenient.
上述实施例中,声学器件300容易受到电子设备中的其他电子元器件的电磁干扰,为此,一种可选的实施例中,本发明实施例公开的电子设备还可以包括屏蔽罩800,屏蔽罩800设置在电路板600上,屏蔽罩800可以与电路板600围成屏蔽空间,声学器件300位于屏蔽空间内。此方案中,屏蔽罩800能够起到屏蔽电磁波的作用,从而使得声学器件300不容易受到电子设备中的其他电子元器件的电磁干扰,从而提高了声学器件300的使用性能,另外,屏蔽罩800还可以用于声学器件300的辅助散热,从而提高了声学器件300的散热性能。具体的,屏蔽罩800可以为不锈钢罩。In the foregoing embodiment, the acoustic device 300 is susceptible to electromagnetic interference from other electronic components in the electronic device. For this reason, in an optional embodiment, the electronic device disclosed in the embodiment of the present invention may further include a shielding cover 800. The cover 800 is disposed on the circuit board 600, the shielding cover 800 and the circuit board 600 may enclose a shielding space, and the acoustic device 300 is located in the shielding space. In this solution, the shielding cover 800 can play a role in shielding electromagnetic waves, so that the acoustic device 300 is not susceptible to electromagnetic interference from other electronic components in the electronic equipment, thereby improving the performance of the acoustic device 300. In addition, the shielding cover 800 It can also be used for auxiliary heat dissipation of the acoustic device 300, thereby improving the heat dissipation performance of the acoustic device 300. Specifically, the shielding cover 800 may be a stainless steel cover.
在本发明各个实施例公开的电子设备中,声学器件300可以至少为两个,其中,声学器件300可以包括受话器和麦克风,受话器和麦克风可以间隔设置于容纳空间内,导音通道200的数量可以至少为两个,至少两个导音通道200的其中一者与受话器相连通,该导音通道为出音通道,另一者与麦克风相连通,该导音通道为采音通道。麦克风可以通过采音通道与用于采音的装配缝隙101相连通。受话器可以通过出音通道与用于出音的装配缝隙101相连通。受话器和麦克风分别设置有对应的导音通道200和对应的装配缝隙101,此时,电子设备设置有两个用于导音的装配缝隙,使得电子设备的外观面的缝隙较多。In the electronic equipment disclosed in the various embodiments of the present invention, there may be at least two acoustic devices 300, where the acoustic device 300 may include a receiver and a microphone, the receiver and the microphone may be spaced apart in the accommodating space, and the number of the sound guide channels 200 may be There are at least two. One of the at least two sound guide channels 200 is connected to the receiver, the sound guide channel is a sound output channel, the other is connected to a microphone, and the sound guide channel is a sound collection channel. The microphone can communicate with the assembly gap 101 for sound collection through the sound collection channel. The receiver can communicate with the assembly slot 101 for sound out through the sound out channel. The receiver and the microphone are respectively provided with a corresponding sound guide channel 200 and a corresponding assembly gap 101. At this time, the electronic device is provided with two assembly gaps for sound conduction, so that the appearance of the electronic device has more gaps.
如图4所示,一种可选的实施例中,导音通道200的数量可以为两个,两个导音通道200的其中一者与受话器相连通,该导音通道200为出音通道,另一者与麦克风相连通,该导音通道200为采音通道,两个导音通道200均与装配缝隙101相连通。此时,受话器和麦克风通过对应的导音通道200与同一个装配缝隙101相连通,该装配缝隙101既可以用于采音又可以用于出音。此方案中,麦克风和受话器共用一个装配缝隙101导音,相比于采用两个装配缝隙101的导音方式而言,麦克风和受话器共用一个装配缝隙101的导音方式中,电子设备的外观面的缝隙数量较少,使得电子设备的防水性能和防尘性能更好。As shown in FIG. 4, in an optional embodiment, the number of sound guide channels 200 may be two, one of the two sound guide channels 200 is connected to the receiver, and the sound guide channel 200 is the sound output channel. , The other is connected to the microphone, the sound guiding channel 200 is a sound collecting channel, and the two sound guiding channels 200 are both connected to the assembly gap 101. At this time, the receiver and the microphone are in communication with the same assembly gap 101 through the corresponding sound guide channel 200, and the assembly gap 101 can be used for both sound collection and sound output. In this solution, the microphone and the receiver share one assembly slot 101 to conduct the sound. Compared with the sound guide method that uses two assembly slots 101, the microphone and receiver share one assembly slot 101. The appearance of the electronic device is The number of gaps is smaller, which makes the waterproof and dustproof performance of electronic equipment better.
在另一种可选的实施方式中,导音通道200的数量可以为一个,受话器和麦克风分别设置于导音通道200的不同位置,且受话器和麦克风通过导音通道200与同一个装配缝隙101相连通,该装配缝隙101既可以用于采音又可以用于出音。此方案中,麦克风和受话器共用一个导音通道200和一个装配缝隙101导音,相比于采用两个导音通道和两个装配缝隙101的导音方式而言,电子设备的外观面的缝隙数量较少,外观一致性更高,还能够使得电子设备的防水性能和防尘性能更好。In another alternative embodiment, the number of the sound guide channel 200 may be one, the receiver and the microphone are respectively arranged at different positions of the sound guide channel 200, and the receiver and the microphone pass through the sound guide channel 200 and the same assembly gap 101 In communication with each other, the assembly gap 101 can be used for both sound collection and sound production. In this solution, the microphone and receiver share a sound guide channel 200 and an assembly slot 101 for sound guidance. Compared with the sound guide method that uses two sound guide channels and two assembly slots 101, the appearance of the electronic device has a gap. The number is smaller, the appearance consistency is higher, and the waterproof performance and dustproof performance of electronic equipment can be better.
本发明实施例公开的电子设备可以是智能手机、平板电脑、电子书阅读器、可穿戴设备(例如智能手表)、电子游戏机等设备,本发明实施例不限制电子设备的具体种类。The electronic devices disclosed in the embodiments of the present invention may be devices such as smart phones, tablet computers, e-book readers, wearable devices (such as smart watches), and electronic game consoles. The embodiments of the present invention do not limit the specific types of electronic devices.
本发明上文实施例中重点描述的是各个实施例之间的不同,各个实施例之间不同的优化特征只要不矛盾,均可以组合形成更优的实施例,考虑到行文简洁,在此则不再赘述。The above embodiments of the present invention focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the conciseness of the text, here is No longer.
以上所述仅为本发明的实施例而已,并不用于限制本发明。对于本领域技术人员来说,本发明可以有各种更改和变化。凡在本发明的精神和原理之内所作的任何修改、等同替换、改进等,均应包含在本发明的权利要求范围之内。The foregoing descriptions are merely embodiments of the present invention, and are not intended to limit the present invention. For those skilled in the art, the present invention can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.