WO2021186669A1 - Module optique de type boîtier de conditionnement - Google Patents

Module optique de type boîtier de conditionnement Download PDF

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Publication number
WO2021186669A1
WO2021186669A1 PCT/JP2020/012291 JP2020012291W WO2021186669A1 WO 2021186669 A1 WO2021186669 A1 WO 2021186669A1 JP 2020012291 W JP2020012291 W JP 2020012291W WO 2021186669 A1 WO2021186669 A1 WO 2021186669A1
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WO
WIPO (PCT)
Prior art keywords
stem
flexible substrate
optical module
type optical
package type
Prior art date
Application number
PCT/JP2020/012291
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English (en)
Japanese (ja)
Inventor
諒太 藤原
瑞基 白尾
誠希 中村
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to PCT/JP2020/012291 priority Critical patent/WO2021186669A1/fr
Priority to JP2020554556A priority patent/JP6825756B1/ja
Publication of WO2021186669A1 publication Critical patent/WO2021186669A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings

Definitions

  • This disclosure relates to a CAN package type optical joule used for optical communication and the like.
  • Patent Document 1 In the optical module, it is necessary to secure high frequency characteristics in order to transmit the high frequency signal to the optical semiconductor. Therefore, good frequency characteristics have been realized by bringing the ground wiring portion of the flexible substrate into close contact with the stem.
  • the ground conductor of the flexible substrate can be brought into close contact with the stem by pressing the flexible substrate against the stem with a reinforcing plate.
  • the CAN package type optical module is composed of a stem having a first surface having a protrusion at a position connected to the flexible substrate and a second surface opposite to the first surface, and a stem from the first surface of the stem.
  • a signal pin that penetrates toward the second surface and protrudes from the first surface, an insulating material enclosed between the stem and the signal pin, an optical semiconductor that connects the signal pin and the stem on the second surface side, and a second It is provided with a ground pin provided on the surface of 1.
  • the ground conductor of the flexible board can be brought into close contact with the stem, and high frequency characteristics can be ensured.
  • FIG. 1 It is sectional drawing of the CAN package type optical module 100 which concerns on Embodiment 1.
  • FIG. It is a perspective view of the vicinity of the stem 1 of the CAN package type optical module 100 which concerns on Embodiment 1.
  • FIG. It is sectional drawing around the stem 1 of the CAN package type optical module 100 which concerns on Embodiment 1.
  • FIG. It is a perspective view of the flexible substrate 20 of the CAN package type optical module 100 which concerns on Embodiment 1.
  • FIG. It is a perspective view of the vicinity of the stem 1a of the CAN package type optical module 100 which concerns on Embodiment 1.
  • FIG. It is a perspective view of the vicinity of the stem 1b of the CAN package type optical module 100 which concerns on Embodiment 1.
  • FIG. 1 It is sectional drawing around the stem 1 of the CAN package type optical module 101 which concerns on modification 1 of Embodiment 1.
  • FIG. It is sectional drawing around the stem 41 of the CAN package type optical module 102 which concerns on modification 2 of Embodiment 1.
  • FIG. It is a perspective view of the flexible substrate 22 of the CAN package type optical module 102 which concerns on the modification 2 of Embodiment 1.
  • Embodiment 1 the CAN package type optical module 100 according to the first embodiment will be described in detail with reference to the drawings.
  • the following first embodiment shows a specific example. Therefore, the shape, arrangement, material, etc. of each component are examples and are not intended to be limited. Moreover, each figure is a schematic view and is not exactly illustrated. Further, in each figure, the same components are designated by the same reference numerals.
  • FIG. 1 is a cross-sectional view of the CAN package type optical module 100 according to the first embodiment.
  • FIG. 2 is a perspective view of the vicinity of the stem 1 of the CAN package type optical module 100 according to the first embodiment.
  • FIG. 2 shows the stem 1 of FIG. 1 turned upside down.
  • FIG. 3 is a cross-sectional view of the CAN package type optical module 100 according to the first embodiment in the vicinity of the stem 1.
  • FIG. 4 is a perspective view of the flexible substrate 20 of the CAN package type optical module 100 according to the first embodiment.
  • the cross-sectional views of FIGS. 1 and 3 are cross-sectional views including the signal pin 2 and the ground pin 4 so that the arrangement state of the signal pin 2 and the ground pin 4 can be easily understood. Therefore, the cross section is not flat.
  • the CAN package type optical module 100 includes a stem 1, a signal pin 2, and a ground pin 4.
  • the CAN package type optical module 100 includes an insulating material 3, an optical semiconductor 5, a submount 6, a pedestal 7, a thermoelectric cooler 8, a dielectric substrate 9, a gold wire 10, a lens 11, a lens holder 12, a receptacle 13, a ferrule 14, and a receptacle.
  • the holder 15, the solder 16, and the flexible substrate 20 may be provided.
  • Stem 1 is a substrate.
  • the shape of the stem 1 is based on, for example, a flat plate shape, a disk shape, a columnar shape, or the like, and has a partially protruding portion.
  • Stem 1 is made of metal.
  • Stem 1 has conductivity.
  • the stem 1 has a through hole in the thickness direction of the flat plate-shaped substrate. The protruding portion exists on the surface having the through hole.
  • the signal pin 2 is a rod-shaped metal conductor.
  • the signal pin 2 is a terminal for inputting or outputting an electric signal.
  • the signal pin 2 is arranged in the through hole of the stem 1.
  • the signal pin 2 protrudes from the surface of the stem 1 having the protruding portion.
  • the insulating material 3 is a non-conductive material.
  • the insulating material 3 is, for example, insulating glass.
  • the insulating material 3 is sealed between the through hole of the stem 1 and the signal pin 2.
  • the insulating material 3 seals the signal pin 2 into the through hole of the stem 1 without contacting the stem 1.
  • the ground pin 4 is a ground terminal.
  • the ground pin 4 is grounded. Further, the stem 1 is grounded via the ground pin 4.
  • the optical semiconductor 5 is an optical semiconductor element.
  • the optical semiconductor 5 is, for example, a semiconductor laser or the like. In this case, the optical semiconductor 5 emits light.
  • the optical semiconductor 5 is, for example, a light receiving element or the like. In this case, the optical semiconductor detects light.
  • Submant 6 is a substrate.
  • the submount 6 mounts the optical semiconductor 5.
  • the submount 6 includes a wiring pattern.
  • the optical semiconductor 5 is connected to the wiring pattern on the submount 6.
  • the pedestal 7 supports the submount 6.
  • the pedestal 7 is electrically conductive with the stem 1.
  • thermoelectric cooler 8 is an element for adjusting the temperature.
  • the thermoelectric cooler 8 has, for example, a Perche type temperature control mechanism.
  • the thermoelectric cooler 8 keeps the optical semiconductor 5 warm.
  • the thermoelectric cooler 8 can have not only a heat retaining function but also a cooling function.
  • the dielectric substrate 9 is a substrate.
  • the dielectric substrate 9 includes a wiring pattern.
  • the dielectric substrate 9 makes an electrical connection between the submount 6 and the signal pin 2.
  • the gold wire 10 is a conducting wire.
  • the gold wire 10 is, for example, a gold conductor.
  • the gold wire 10 electrically connects, for example, the wiring pattern of the optical semiconductor 5, the submount 6, and the wiring pattern of the dielectric substrate 9.
  • the lens 11 is a lens for collecting light.
  • the lens 3 collects the light emitted from the optical semiconductor 5.
  • the lens holder 12 supports the lens 11.
  • the lens holder 12 has, for example, a can shape.
  • the receptacle 13 is a connector.
  • the receptacle 13 is, for example, a connector for connecting to an optical fiber.
  • the ferrule 14 is a component for transmitting light to an optical fiber.
  • the ferrule 14 is, for example, a cylindrical ceramic component.
  • the receptacle holder 15 supports the receptacle 13.
  • the receptacle holder 15 is fixed to the lens holder 12.
  • solder 16 is a bonding medium.
  • the solder 16 connects the signal pin 2 and the flexible substrate 20.
  • the solder 16 connects the ground pin 4 and the flexible substrate 20.
  • the flexible substrate 20 is a flexible substrate.
  • the flexible substrate 20 can be repeatedly deformed with a weak force. If no force is applied to the flexible substrate 20, the flexible substrate 20 returns to its original shape.
  • the flexible substrate 20 includes a ground wiring 31, a signal wiring 32, and an insulating layer 33.
  • the flexible substrate 20 may include a protective film 34.
  • the ground wiring 31 is a wiring for grounding.
  • the ground wiring 31 is connected to the ground pin 4. As shown in FIG. 4, the ground wiring 31 is exposed on the upper surface of the flexible substrate 20.
  • the signal wiring 32 is wiring for signal transmission.
  • the signal wiring 32 is connected to the signal pin 2.
  • the signal wiring 32 is arranged so as not to be connected to the stem 1.
  • the insulating layer 33 is a non-conductive layer.
  • the insulating layer 33 insulates the ground wiring 31 and the signal wiring 32.
  • the protective film 34 is a film that protects the flexible substrate 20 from scratches, moisture, and the like.
  • the through holes 35 and 36 are holes made in the flexible substrate 20.
  • the through hole 35 is a hole through which the signal pin 2 passes.
  • the edge of the through hole 35 is connected to the signal wiring 32.
  • the edge of the through hole 35 is a signal wiring 32, an insulating layer 33, and a ground wiring 31 from the inside.
  • the through hole 36 is a hole through which the ground pin 4 passes.
  • the edge of the through hole 36 is connected to the ground wiring 31.
  • An electric signal is input to the signal wiring 32 of the flexible board 20.
  • the input electric signal is transmitted from the through hole 35 to the signal pin 2.
  • the ground wiring 31 of the flexible substrate 20 is grounded.
  • the ground wiring 31 grounds the ground pin 4 via the through hole 36.
  • the ground pin 4 grounds the stem 1.
  • the signal pin 2 is insulated from the grounded stem 1 by the insulating material 3.
  • the electric signal is transmitted from the signal pin 2 to the dielectric substrate 9.
  • the electric signal is further transmitted from the wiring pattern on the dielectric substrate 9 to the submount 6 via the gold wire 10.
  • An electric signal is input to the optical semiconductor 5 on the submount 6, and the optical semiconductor 5 emits light.
  • the light emitted from the optical semiconductor 5 is collected by the lens 11 and incident on the ferrule 14 in the receptacle 13.
  • the light propagating in the ferrule 14 is input to an optical fiber (not shown) connected to the ferrule 14.
  • the grounded stem 1 grounds the optical semiconductor 5 via the pedestal 7 and the submount 6.
  • the thermoelectric cooler 8 controls the temperature of the optical semiconductor 5.
  • the thermoelectric cooler 8 keeps the operating characteristics of the optical semiconductor 5 constant by keeping the temperature of the optical semiconductor 5 constant.
  • a high frequency electric signal is input to the optical semiconductor 5. If there is a gap between the stem 1 and the flexible substrate 20, resonance or multiple reflection occurs, and there is a possibility that a high frequency electric signal cannot be transmitted.
  • the stem 1 By providing the stem 1 with a protruding portion, the flexible substrate 20 is ensured to be in contact with the protruding portion.
  • a ground wiring 31 is provided on the upper surface of the flexible substrate 20.
  • the ground wiring 31 comes to the position of the protruding portion.
  • the flexible substrate 20 is pushed to the root position of the signal pin 2, the flexible substrate 20 is bent downward by the protruding portion of the stem 1. Since the flexible substrate 20 tries to return to its original shape, the bent portion of the flexible substrate 20 has an upward repulsive force. Due to this repulsive force, the ground wiring 31 of the flexible substrate 20 and the protruding portion of the stem 1 are brought into close contact with each other and are electrically connected to each other.
  • the ground wiring 31 of the flexible substrate 20 can be electrically connected to the stem 1. As a result, high frequency transmission characteristics can be ensured.
  • the ground wiring 31 of the flexible board 20 is electrically connected to the protruding portion of the stem 1. Even if the assembly accuracy at the time of assembly is lowered in this way, the ground wiring 31 is electrically connected to the stem 1.
  • the signal pin 2 and the through hole 35 are soldered, the signal pin 2 and the signal wiring 32 are electrically connected, and at the same time, the stem 1 and the ground wiring 31 are electrically connected. That is, it is not necessary to solder other than the signal pin 2. In this way, the efficiency of the assembly work can be improved.
  • the shape of the protruding portion does not matter as long as the flexible substrate 20 can be bent by the protruding portion of the stem 1.
  • the protruding portion has a surface angled with respect to the surface on which the ground pin 4 of the stem 1 protrudes so that the area in contact between the protruding portion and the ground wiring 31 of the flexible substrate 20 becomes large.
  • the protruding portion has a shape in which a right triangle has a thickness.
  • the thickness direction of the protruding portion is the width direction of the ground wiring 31 of the flexible substrate 30.
  • FIG. 5 is a perspective view of the CAN package type optical module 100 according to the first embodiment in the vicinity of the stem 1a.
  • the stem 1a has a different shape of the protruding portion from the stem 1.
  • the shape of the protruding portion of the stem 1a is a shape in which a quadrangular prism is added to the lower portion of the shape of the protruding portion of the stem 1.
  • FIG. 6 is a perspective view of the CAN package type optical module 100 according to the first embodiment in the vicinity of the stem 1b.
  • the stem 1b has a different shape of the protruding portion from the stem 1.
  • the shape of the protruding portion of the stem 1b is a flat shape in which the upper part of the rectangle is raised in a crescent shape and has a thickness.
  • the thickness direction of the protruding portion is the width direction of the ground wiring 31 of the flexible substrate 30.
  • the half-moon shaped portion has a shape that makes it easy to adhere to the ground wiring 31.
  • the CAN package type optical module 101 according to the first modification includes a leaf spring 37 on a flexible substrate 21.
  • FIG. 7 is a cross-sectional view of the CAN package type optical module 101 according to the first modification of the first embodiment in the vicinity of the stem 1.
  • the components common to the CAN package type optical module 100 are designated by the same reference numerals, and the description thereof will be omitted.
  • the cross-sectional view of FIG. 7 is a cross-sectional view including the signal pin 2 and the ground pin 4 so that the arrangement state of the signal pin 2 and the ground pin 4 can be easily understood. Therefore, the cross section is not flat.
  • the CAN package type optical module 101 includes a flexible substrate 21.
  • the flexible substrate 21 is a flexible substrate 20 to which a leaf spring 37 is added.
  • the position of the leaf spring 37 in the flexible substrate 21 may be any of the upper surface, the lower surface, and the inside of the flexible substrate 21.
  • the leaf spring 37 is arranged on the lower surface of the flexible substrate 21.
  • the leaf spring 37 is arranged so as to straddle both the protruding portion and the non-protruding portion of the stem 1. Further, it is desirable that the leaf spring 37 is arranged up to the periphery of the through hole 35.
  • the leaf spring 37 is a plate-shaped spring.
  • the leaf spring 37 is, for example, a thin leaf spring.
  • CAN package type optical module 101 Similar to the CAN package type optical module 100, the CAN package type optical module 101 inputs an electric signal from the flexible substrate 21 to cause the optical semiconductor 5 to emit light. At that time, the ground wiring 31 of the flexible substrate 21 is brought into close contact with the protruding portion of the stem 1 to ensure high frequency transmission characteristics.
  • the strength and repulsive force of the flexible substrate 21 are strengthened by adding the leaf spring 37 to the flexible substrate 21.
  • the flexible substrate 21 having increased strength can suppress the degree of sagging against gravity. Therefore, the ground wiring 31 of the flexible substrate 21 can be brought into close contact with the protruding portion of the stem 1.
  • the strength of the flexible substrate 21 is increased. Due to the increased strength, the ground wiring 31 of the flexible substrate 21 and the protruding portion of the stem 1 are in close contact with each other and are electrically connected to each other. As a result, high frequency transmission characteristics can be ensured.
  • FIG. 8 is a cross-sectional view of the CAN package type optical module 102 near the stem 41 according to the second modification of the first embodiment.
  • the components common to the CAN package type optical module 100 are designated by the same reference numerals, and the description thereof will be omitted.
  • the cross-sectional view of FIG. 8 is a cross-sectional view including the signal pin 2 and the ground pin 4 so that the arrangement state of the signal pin 2 and the ground pin 4 can be easily understood. Therefore, the cross section is not flat.
  • the CAN package type optical module 102 includes a stem 41 and a flexible substrate 22.
  • the CAN package type optical module 102 replaced the stem 1 and the flexible substrate 20 of the CAN package type optical module 100 with the stem 41 and the flexible substrate 22, respectively.
  • the stem 41 is obtained by removing the protruding portion from the stem 1.
  • the shape of the stem 41 is, for example, a flat plate shape, a disk shape, a columnar shape, or the like.
  • the stem 41 is made of metal.
  • the stem 41 has conductivity.
  • the stem 41 has a through hole in the thickness direction of the flat plate-shaped substrate.
  • FIG. 9 is a perspective view of the flexible substrate 22 of the CAN package type optical module 102 according to the second modification of the first embodiment.
  • the flexible substrate 22 is a flexible substrate 20 to which a conductor block 38 is added.
  • the conductor block 38 is a conductive block.
  • the conductor block 38 is arranged on the ground wiring 31 on the upper surface of the flexible substrate 22. It is desirable that the conductor block 38 is arranged near the through hole 35.
  • CAN package type optical module 102 Similar to the CAN package type optical module 100, the CAN package type optical module 102 inputs an electric signal from the flexible substrate 22 to cause the optical semiconductor 5 to emit light. At that time, the conductor block 38 of the flexible substrate 22 is brought into close contact with the stem 41 to ensure high frequency transmission characteristics.
  • the conductor block 38 on the ground wiring 31 of the flexible substrate 22 and the stem 41 are in close contact with each other and are electrically connected to each other. As a result, high frequency transmission characteristics can be ensured.
  • the shape of the conductor block 38 is, for example, the same shape as the protruding portion of the stem 1.
  • the shape of the conductor block 38 is, for example, a shape in which the side surface of the triangular prism is the bottom surface. Further, the shape of the conductor block 38 may be the same as the shape of the protruding portion of the stem 1a in FIG. Further, the shape of the conductor block 38 may be the same as the shape of the protruding portion of the stem 1b in FIG.
  • the leaf spring 37 used in the first modification is added to the flexible substrate 22, so that the conductor block 38 and the stem 41 on the ground wiring 31 of the flexible substrate 22 can be connected to each other. In close contact. As a result, high frequency transmission characteristics can be ensured.
  • 1,1a, 1b stem, 2 signal pin, 3 insulation material, 4 ground pin, 5 optical semiconductor, 6 submount, 7 pedestal, 8 thermoelectric cooler, 9 dielectric substrate, 10 gold wire, 11 lens, 12 lens holder, 13 receptacles, 14 ferrules, 15 receptacle holders, 16 solders, 20, 21, 22, flexible boards, 31 ground wirings, 32 signal wirings, 33 insulating layers, 34 protective films, 35, 36 through holes, 37 leaf springs, 38 conductor blocks. , 41 stem, 100, 101, 102 CAN package type optical module.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)

Abstract

Afin de faire adhérer fermement un conducteur de masse d'une carte souple à une tige, le module optique de type boîtier de conditionnement selon la présente invention comporte : une tige ayant une première surface qui a une saillie au niveau d'une position pour une connexion à la carte souple et une seconde surface qui est une surface opposée à la première surface ; une broche de signal qui pénètre dans la tige de la première surface à la seconde surface et fait saillie à partir de la première surface ; un matériau isolant rempli entre la tige et la broche de signal ; un semi-conducteur optique connecté à la broche de signal sur le côté de seconde surface de la tige ; et une broche de mise à la terre disposée sur la première surface.
PCT/JP2020/012291 2020-03-19 2020-03-19 Module optique de type boîtier de conditionnement WO2021186669A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2020/012291 WO2021186669A1 (fr) 2020-03-19 2020-03-19 Module optique de type boîtier de conditionnement
JP2020554556A JP6825756B1 (ja) 2020-03-19 2020-03-19 Ｃａｎパッケージ型光モジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/012291 WO2021186669A1 (fr) 2020-03-19 2020-03-19 Module optique de type boîtier de conditionnement

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WO2021186669A1 true WO2021186669A1 (fr) 2021-09-23

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH058547U (ja) * 1991-07-17 1993-02-05 旭光学工業株式会社 フイルム情報読み取り装置
JP2009004460A (ja) * 2007-06-19 2009-01-08 Opnext Japan Inc 光通信モジュールおよび配線パタンの形成方法
JP2009130263A (ja) * 2007-11-27 2009-06-11 Mitsubishi Electric Corp 光モジュール
JP2009302438A (ja) * 2008-06-17 2009-12-24 Opnext Japan Inc 光半導体装置
JP2016018969A (ja) * 2014-07-11 2016-02-01 日本オクラロ株式会社 光モジュール、光送受信モジュール、及びフレキシブル基板
JP2018018995A (ja) * 2016-07-29 2018-02-01 株式会社ヨコオ 光モジュール

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH058547U (ja) * 1991-07-17 1993-02-05 旭光学工業株式会社 フイルム情報読み取り装置
JP2009004460A (ja) * 2007-06-19 2009-01-08 Opnext Japan Inc 光通信モジュールおよび配線パタンの形成方法
JP2009130263A (ja) * 2007-11-27 2009-06-11 Mitsubishi Electric Corp 光モジュール
JP2009302438A (ja) * 2008-06-17 2009-12-24 Opnext Japan Inc 光半導体装置
JP2016018969A (ja) * 2014-07-11 2016-02-01 日本オクラロ株式会社 光モジュール、光送受信モジュール、及びフレキシブル基板
JP2018018995A (ja) * 2016-07-29 2018-02-01 株式会社ヨコオ 光モジュール

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JP6825756B1 (ja) 2021-02-03

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