WO2021174861A1 - Packaging structure and method for fingerprint recognition chip - Google Patents

Packaging structure and method for fingerprint recognition chip Download PDF

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Publication number
WO2021174861A1
WO2021174861A1 PCT/CN2020/120855 CN2020120855W WO2021174861A1 WO 2021174861 A1 WO2021174861 A1 WO 2021174861A1 CN 2020120855 W CN2020120855 W CN 2020120855W WO 2021174861 A1 WO2021174861 A1 WO 2021174861A1
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WIPO (PCT)
Prior art keywords
light
fingerprint identification
identification chip
transmitting
layer
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PCT/CN2020/120855
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French (fr)
Chinese (zh)
Inventor
王凯厚
杨剑宏
Original Assignee
苏州晶方半导体科技股份有限公司
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Publication of WO2021174861A1 publication Critical patent/WO2021174861A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0216—Coatings
    • H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
    • H01L31/02164—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors for shielding light, e.g. light blocking layers, cold shields for infrared detectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0216—Coatings
    • H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
    • H01L31/02165—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors using interference filters, e.g. multilayer dielectric filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention belongs to the field of semiconductor technology, and specifically relates to a fingerprint identification chip packaging structure and packaging method.
  • fingerprint identification technology Due to the uniqueness and immutability of fingerprints, fingerprint identification technology has many advantages such as good security, high reliability, and simple use. Therefore, fingerprint recognition technology has become the mainstream technology for identity verification of various electronic devices.
  • the optical fingerprint recognition chip is one of the commonly used fingerprint recognition chips in existing electronic devices. It collects the user's fingerprint information through a large number of photosensitive pixels (pixels) in the fingerprint recognition area, and each photosensitive pixel serves as a detection. Specifically, during fingerprint recognition, light is irradiated on the fingerprint surface of the user and reflected to the photosensitive pixel through the fingerprint surface. The photosensitive pixel converts the optical signal of the fingerprint into an electrical signal, and fingerprint information can be obtained based on the electrical signal converted by all pixels.
  • a transparent cover is generally directly arranged on the photosensitive side.
  • the transparent cover plate is completely light-transmissive, it will cause crosstalk of the sensing results of different photosensitive pixels, which affects the accuracy of fingerprint recognition.
  • Chinese patent application CN108022904A discloses a method for packaging a fingerprint identification chip, which fixes a cover plate with a through-hole structure on the side of the wafer facing the pixels to avoid crosstalk problems.
  • the existing problems include at least: the through holes on the cover plate need to be formed in advance, and then the cover plate with the through holes is bonded to the chip surface, but this takes a long time for the operation process, and it also requires the position of the through holes and the pixel points to be calibrated. Errors are easy to occur; if the through hole is made after the cover plate and the chip are combined, there is no obstruction between the cover plate and the chip, and it is easy to cause damage to the pixels located under the through hole.
  • An embodiment of the present invention provides a fingerprint identification chip packaging structure and method, which are used to solve the technical problems of long processing time and easy pixel damage in the existing technology, including:
  • a method for packaging a fingerprint identification chip including:
  • the fingerprint identification chip has opposite front and back sides, and the front side has a plurality of pixels for collecting fingerprint information;
  • the first light-transmitting layer and the light-shielding layer are sequentially fabricated on the front side of the fingerprint identification chip;
  • the first light-transmitting layer is used as a barrier to etch the light-shielding layer to form a plurality of light-transmitting holes, and each of the light-transmitting holes corresponds to one pixel point.
  • the first light-transmitting layer is a light filter.
  • it further includes fabricating a second light-transmitting layer
  • the second light-transmitting layer is located between the fingerprint identification chip and the first light-transmitting layer.
  • it further includes forming a third light-transmitting layer on the surface of the light-shielding layer,
  • the third light-transmitting layer covers the light-transmitting hole.
  • it further includes fabricating a condenser lens on the surface of the third light-transmitting layer,
  • the condenser lens corresponds to the light transmission hole.
  • the light shielding layer is made of monocrystalline silicon, or polycrystalline silicon, or amorphous silicon, or silicon germanium, or silicon carbide.
  • the first light-transmitting layer and the light-shielding layer are glued together.
  • the fingerprint identification chip is an optical fingerprint identification chip.
  • a method for packaging a fingerprint identification chip including:
  • the fingerprint identification chip has opposite front and back sides, and the front side has a plurality of pixels for collecting fingerprint information;
  • the first light-transmitting layer and the light-shielding layer are sequentially fabricated on the front side of the fingerprint identification chip;
  • the first light-transmitting layer as a barrier to etch the light-shielding layer to form a plurality of light-transmitting holes, each of the light-transmitting holes corresponding to one of the pixel points;
  • the wafer is cut to form a plurality of single-chip package structures.
  • a packaging structure of a fingerprint identification chip including:
  • the fingerprint identification chip has opposite front and back sides, and the front side has multiple pixels for collecting fingerprint information;
  • the second light-transmitting layer, the light filter and the light-shielding layer are sequentially formed on the front surface of the fingerprint identification chip.
  • a plurality of light-transmitting holes are formed on the light-shielding layer, and each light-transmitting hole corresponds to one pixel point.
  • it further includes a third light-transmitting layer covering the light-transmitting hole.
  • it further includes a condenser lens formed on the surface of the third light-transmitting layer,
  • the condenser lens corresponds to the light transmission hole.
  • the light shielding layer is made of monocrystalline silicon, or polycrystalline silicon, or amorphous silicon, or silicon germanium, or silicon carbide.
  • the first light-transmitting layer and the light-shielding layer are glued together.
  • the fingerprint identification chip is an optical fingerprint identification chip.
  • the present invention uses a filter as a barrier layer to make light-transmitting holes in the light-shielding layer.
  • the formed cylindrical light-shielding body better shields and absorbs excess oblique light, so that the object can form an image. Clearer; on the other hand, the filter can filter out stray light outside the detection light band; on the other hand, it can improve the processing efficiency and is suitable for wafer-level packaging.
  • FIG. 1 is a cross-sectional view of the package structure in Embodiment 1 of the present application.
  • FIGS. 2 to 9 are schematic diagrams of intermediate structures formed by the package structure in Embodiment 1 of the present application.
  • the packaging structure 10 includes a fingerprint identification chip 11 and a cover plate 12.
  • the fingerprint identification chip 11 has a front side 111 and a back side 112 opposite to each other, and the front side has a plurality of pixels 113 for collecting fingerprint information.
  • the cover plate 12 covers the front surface 111 of the fingerprint identification chip 11.
  • the fingerprint identification chip 11 is an optical fingerprint identification chip.
  • the cover 12 includes a light-transmitting layer 121, a filter 124, a light-shielding layer 122 and a light-transmitting layer 123 sequentially covering the front surface 111 of the fingerprint identification chip 11.
  • the light-transmitting layer 121 covers the front surface 111 of the fingerprint recognition chip 11 and is used to protect the front surface of the fingerprint recognition chip 11 to be packaged. Since light is required to pass through the light-transmitting layer 121 to reach the pixel points 113, the light-transmitting layer 121 has a relatively high light-transmitting property and is a light-transmitting material. Both surfaces of the light-transmitting layer 121 are flat and smooth, and will not scatter or diffuse the incident light.
  • the material of the light-transmitting layer 121 may be dry film, inorganic glass, organic glass, or other light-transmitting materials with specific strength.
  • the light-transmitting layer 121 and the front surface 111 of the fingerprint identification chip 11 are fixed by glue.
  • the thickness of the light-transmitting layer 121 is preferably 5-20 ⁇ m.
  • the filter 124 is used to filter out stray light outside the detection light band, so as to reduce the interference of stray light and improve the accuracy of fingerprint recognition.
  • the filter 124 may only cover the upper portion corresponding to the pixel point 113, or may cover the entire surface of the light-transmitting layer 121.
  • the filter 124 and the light-transmitting layer 121 are bonded and fixed by a DAF film.
  • the light-shielding layer 122 is provided with a plurality of light-transmitting holes 1221 communicating up and down.
  • Each light-transmitting hole 1221 corresponds to a pixel 113.
  • the axis of the light-transmitting hole 1221 coincides with the center of the pixel 113.
  • the light-shielding layer 122 has a relatively low dielectric constant.
  • the material of the light-shielding layer 122 is preferably a silicon material, which can be monocrystalline silicon, or polycrystalline silicon, or amorphous silicon, or silicon germanium, or silicon carbide.
  • the light-shielding layer 122 may be formed on the surface of the light-transmitting layer 121 by physical deposition.
  • the thickness of the light-shielding layer 122 is preferably 4-20 ⁇ m, and when the light-transmitting hole is a circular hole, its aperture is preferably 30-40 ⁇ m, and the aspect ratio is preferably 1:1 to 1.5:1.
  • the light shielding layer 122 is made of silicon material, which can reduce the crosstalk problem between adjacent pixels 113 on the one hand.
  • the light-shielding layer 122 made of silicon material generally has a Mohs hardness of more than 10, with high hardness and high mechanical strength. When pressed by a finger, thickness deformation will not occur, and the accuracy of fingerprint recognition will not be affected.
  • the projection of the light-transmitting hole 1221 on the front 111 at least overlaps with the projection of the corresponding pixel 113 on the front 111.
  • the projection of the transparent hole 1221 on the front 111 can be set to completely cover the projection of the corresponding pixel 113 on the front 111.
  • the projection of the light-transmitting hole 1221 on the front side 111 can be set to completely coincide with the projection of the corresponding pixel point 113 on the front side 111.
  • the front surface 111 includes a sensing area and a non-sensing area surrounding the sensing area.
  • the pixel 113 is arranged in the sensing area; the non-sensing area is provided with a pad (not shown) electrically connected to the pixel 113, and the pad is used for electrical connection with an external circuit.
  • the fingerprint recognition chip 11 is a capacitive fingerprint recognition chip
  • the pixel 113 detects the capacitance value and converts the capacitance value into an electrical signal.
  • the external circuit can obtain fingerprint information according to the electrical signal, perform identity recognition, and transmit light.
  • the holes 1221 are used to expose the pixels, and the light-shielding layer 122 has a lower dielectric constant, which can reduce the problem of crosstalk between adjacent pixels and improve the accuracy of fingerprint recognition.
  • the fingerprint recognition chip 11 is an optical fingerprint recognition chip
  • the pixel 113 collects fingerprint information in a predetermined area opposite to the light transmission hole 1221 through the corresponding light transmission hole 1221. Since each pixel 113 collects the fingerprint information of its relative collection area through the corresponding light-transmitting hole 1221, the mutual crosstalk between the preset areas corresponding to different pixels is avoided, thereby avoiding the distortion of the fingerprint image, and further improving the fingerprint Accuracy of recognition.
  • the shape of the light transmission hole 1221 may be a circular through hole, a square through hole or a triangular through hole.
  • the shape of the transparent hole 1221 may be a circular hole with the same top and bottom, or a square hole with the same top and bottom, or a triangular hole with the same top and bottom, or a polygon with the same top and bottom of other structures.
  • the bottom of the light-transmitting hole 1221 is the opening of the light-transmitting hole 1221 close to the pixel point 113
  • the top of the light-transmitting hole 1221 is the opening of the light-transmitting hole 1221 away from the pixel point 113.
  • the shape of the light-transmitting hole 1221 can also be a round hole with a different top and bottom, a square hole with a different top and bottom, or a triangular hole with a different top and bottom, or the top of other structures. A polygon that is not the same as the bottom.
  • the top of the light-transmitting hole 1221 is larger than the bottom of the light-transmitting hole 1221.
  • the bottom of the light-transmitting hole 1221 is the opening of the light-transmitting hole 1221 close to the pixel point 113
  • the top of the light-transmitting hole 1221 is the opening of the light-transmitting hole 1221 away from the pixel point 113.
  • the light shielding layer 122 and the filter 124 are bonded and fixed by a DAF film.
  • the light-transmitting layer 123 covers the side of the light-shielding layer 122 facing away from the front surface 111 for shielding the opening of the light-transmitting hole 1221. Since light is required to pass through the light-transmitting layer 123 to reach the pixel points 113, the light-transmitting layer 123 has high light-transmitting properties and is a light-transmitting material. Both surfaces of the light-transmitting layer 123 are flat and smooth, and will not scatter or diffuse the incident light.
  • the material of the light-transmitting layer 123 may be dry film, inorganic glass, organic glass, or other light-transmitting materials with specific strength.
  • the thickness of the light-transmitting layer 123 is preferably 10-40 microns.
  • the light-transmitting layer 123 and the light-shielding layer 122 are fixed by glue.
  • a plurality of condensing lenses 125 are provided on the side of the light-transmitting layer 123 away from the front 111 of the fingerprint identification chip 11, and each condensing lens 125 corresponds to a light-transmitting hole 1221, and the condensing lens 125 is used to condense external light to the corresponding pixel. Point 113 on the surface.
  • the condensing lens 125 can be manufactured by photolithography and baking molding. In another embodiment, the condensing lens 125 can also be formed on the surface of the light-transmitting layer 123 by embossing.
  • FIGS. 2 to 9 are schematic diagrams of intermediate structures formed during the packaging process of the packaging method according to the embodiment of the present invention.
  • Step s1 Referring to FIGS. 2 and 3, provide a wafer to be packaged 100, wherein FIG. 2 is a schematic top view of the structure of the wafer to be packaged 100, and FIG. 3 is a cross-sectional view along A-A of FIG.
  • the wafer 100 to be packaged has a front surface 111 and a back surface 112 opposite to the front surface 111.
  • the wafer 100 includes a plurality of fingerprint recognition chips 11 arranged in an array.
  • Each adjacent fingerprint identification chip 11 has a plurality of pixels 13 for collecting fingerprint information.
  • the pixel 13 is located on the front side 111.
  • the first surface 111 includes a sensing area and a non-sensing area surrounding the sensing area.
  • the pixel point 113 is arranged in the sensing area, and a pad (not shown) is arranged in the non-sensing area.
  • the pad is electrically connected to the pixel point 113, and the pad is used for To be electrically connected to an external circuit.
  • the cutting channel 120 between two adjacent fingerprint identification chips 11 is only a blank area reserved between the two fingerprint identification chips 11 for cutting, and the cutting channel 120 is connected to the fingerprints on both sides. There is no actual boundary line between the identification chips 11.
  • Step s2 cover the light-transmitting layer 121 on the front surface 111 of the wafer 100 to be packaged.
  • the light-transmitting layer 121 is fixed on the surface of the wafer 100 to be packaged by glue.
  • Step s3 referring to FIG. 5, a filter 124 is covered on the surface of the light-transmitting layer 121.
  • Step s4 referring to FIG. 6, the light shielding layer 122 is covered on the surface of the filter 124.
  • the light shielding layer 122 is fixed on the surface of the filter 124 by glue.
  • an adhesive layer may be formed by spraying, spin coating or pasting, and then the filter 124 and the light shielding layer 122 is relatively pressed together and joined by an adhesive layer.
  • the adhesive layer can not only achieve the bonding effect, but also play the role of insulation and sealing.
  • the adhesive layer may be a polymer adhesive material, such as polymer materials such as silica gel, epoxy resin, and benzocyclobutene.
  • Step s5 referring to FIG. 7, the light-shielding layer 122 is etched to form a plurality of light-transmitting holes 1221 using the filter 124 as a blocking layer.
  • Step s6 referring to FIG. 8, the surface of the light-shielding layer 122 is covered with the light-transmitting layer 123.
  • the light-transmitting layer 123 is fixed on the surface of the light-shielding layer 122 by glue.
  • the light-transmitting layer 123 may only cover the top opening of the light-transmitting hole 1221, or may cover the entire surface of the light-shielding layer 122.
  • Step s7 Referring to FIG. 9, a plurality of condenser lenses 125 are fabricated on the surface of the light-transmitting layer 123, and each condenser lens 125 corresponds to a light-transmitting hole 1221.
  • Step s8 Divide the wafer 100, the light-transmitting layer 121, the light filter 124, the light-shielding layer 122, and the light-transmitting layer 123 through a dicing process, and perform cutting along the direction of the cutting channel 120 to form a plurality of fingerprints during cutting. Identify the package structure 10 of the chip 11.
  • the cutting can be cut with a slicing knife or laser cutting, and the slicing knife can be cut with a metal knife or a resin knife.
  • the entire packaging process it can also include wafer thinning, solder pad production, wiring layer production and other processes, which will not be repeated in this case.
  • the chip package structure obtained by subsequent cutting can be connected to an external circuit through external bumps (not shown).
  • the present invention uses a filter as a barrier layer to make light-transmitting holes on the light-shielding layer.
  • the formed cylindrical light-shielding body better shields and absorbs excess oblique light, making the image of the object clearer.
  • the filter can filter out the stray light outside the detection light band; on the other hand, it can improve the processing efficiency and is suitable for wafer-level packaging.
  • composition taught by the present invention is also basically The above is composed of or composed of the described components, and the process taught by the present invention is basically composed of the described process steps or a set of described process steps.
  • a single component may be replaced by multiple components and multiple components may be replaced by a single component to provide an element or structure or perform one or several given functions. This substitution is considered to be within the scope of the present invention except where it is substituted here that will not operate to practice the specific embodiments of the present invention.

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Abstract

Disclosed are a packaging structure and a packaging method. The packaging method comprises: providing a fingerprint recognition chip, the fingerprint recognition chip having a front face and a back face opposite to each other, the front face having a plurality of pixel points for acquiring fingerprint information; sequentially manufacturing a first light-transmitting layer and a light-shielding layer on the front face of the fingerprint recognition chip; and using the first light-transmitting layer as a block to etch the light-shielding layer, so as to form a plurality of light-transmitting holes, each of the light-transmitting holes corresponding to one of the pixel points. In the present invention, an optical filter is used as a blocking layer, and light-transmitting holed are manufactured on the light-shielding layer, so that a formed columnar light-shielding body better shields and absorbs unnecessary oblique light, making a formed image of an object clearer, the optical filter can filter out stray light outside a detection light band, and the processing efficiency of the process can be increased, being suitable for wafer-level packaging.

Description

指纹识别芯片的封装结构和方法Packaging structure and method of fingerprint identification chip 技术领域Technical field
本发明属于半导体技术领域，具体涉及一种指纹识别芯片封装结构和封装方法。The invention belongs to the field of semiconductor technology, and specifically relates to a fingerprint identification chip packaging structure and packaging method.
背景技术Background technique
随着科学技术的不断进步，越来越多的电子设备广泛的应用于人们的日常生活以及工作当中，为人们的日常生活以及工作带来了巨大的便利，成为当今人们不可或缺的重要工具。而随着电子设备功能的不断增加，电子设备存储的重要信息也越来越多，电子设备的身份验证技术成为目前电子设备研发的一个主要方向。With the continuous advancement of science and technology, more and more electronic devices are widely used in people's daily life and work, bringing great convenience to people's daily life and work, and becoming an indispensable tool for people today . With the continuous increase of the functions of electronic devices, more and more important information is stored in electronic devices, and the identification verification technology of electronic devices has become a main direction of electronic device research and development.
由于指纹具有唯一性和不变性，使得指纹识别技术具有安全性好、可靠性高以及使用简单等诸多优点。因此，指纹识别技术成为当下各种电子设备进行身份验证的主流技术。Due to the uniqueness and immutability of fingerprints, fingerprint identification technology has many advantages such as good security, high reliability, and simple use. Therefore, fingerprint recognition technology has become the mainstream technology for identity verification of various electronic devices.
目前，光学指纹识别芯片是现有电子设备常用的指纹识别芯片之一，其通过指纹识别区的大量感光像素(pixel)来采集使用者的指纹信息，每个感光像素作为一个检测。具体的，进行指纹识别时，光线照射至使用者的指纹面并经过指纹面反射至感光像素，感光像素将指纹的光信号转换为电信号，根据所有像素转换的电信号可以获取指纹信息。At present, the optical fingerprint recognition chip is one of the commonly used fingerprint recognition chips in existing electronic devices. It collects the user's fingerprint information through a large number of photosensitive pixels (pixels) in the fingerprint recognition area, and each photosensitive pixel serves as a detection. Specifically, during fingerprint recognition, light is irradiated on the fingerprint surface of the user and reflected to the photosensitive pixel through the fingerprint surface. The photosensitive pixel converts the optical signal of the fingerprint into an electrical signal, and fingerprint information can be obtained based on the electrical signal converted by all pixels.
现有的光学指纹识别芯片在封装时，一般直接在感光侧直接设置透明盖板。但是由于透明盖板的是完全透光的，会导致不同感光像素的感测结果产生串扰，影响指纹识别精度。When the existing optical fingerprint identification chip is packaged, a transparent cover is generally directly arranged on the photosensitive side. However, since the transparent cover plate is completely light-transmissive, it will cause crosstalk of the sensing results of different photosensitive pixels, which affects the accuracy of fingerprint recognition.
为了解决该技术问题，中国专利申请CN108022904A披露了一种指纹识别芯片的封装方法，其在晶圆朝向像素点的一侧固定具有通孔结构的盖板，用于避免串扰问题。其存在的问题至少包括：盖板上通孔需要预先形成，然后再将具有通孔的盖板结合在芯片表面，但是这样操作工艺时间长，而且还需要将通孔与像素点进行位置校准，容易产生误差；若盖板与芯片结合之后再进行制作通孔，盖板与芯片之间无任何阻挡，容易对位于通孔下方的像素点造成损害。In order to solve this technical problem, Chinese patent application CN108022904A discloses a method for packaging a fingerprint identification chip, which fixes a cover plate with a through-hole structure on the side of the wafer facing the pixels to avoid crosstalk problems. The existing problems include at least: the through holes on the cover plate need to be formed in advance, and then the cover plate with the through holes is bonded to the chip surface, but this takes a long time for the operation process, and it also requires the position of the through holes and the pixel points to be calibrated. Errors are easy to occur; if the through hole is made after the cover plate and the chip are combined, there is no obstruction between the cover plate and the chip, and it is easy to cause damage to the pixels located under the through hole.
发明内容Summary of the invention
本发明一实施例提供一种指纹识别芯片的封装结构和方法，用于解决现 有技术中加工工艺时间长、像素点容易受到损害的技术问题，包括：An embodiment of the present invention provides a fingerprint identification chip packaging structure and method, which are used to solve the technical problems of long processing time and easy pixel damage in the existing technology, including:
一种指纹识别芯片的封装方法，包括：A method for packaging a fingerprint identification chip, including:
提供一指纹识别芯片，指纹识别芯片具有相对的正面和背面，其正面具有多个用于采集指纹信息的像素点；Provide a fingerprint identification chip, the fingerprint identification chip has opposite front and back sides, and the front side has a plurality of pixels for collecting fingerprint information;
在指纹识别芯片的正面依次制作第一透光层和遮光层；The first light-transmitting layer and the light-shielding layer are sequentially fabricated on the front side of the fingerprint identification chip;
以所述第一透光层作为阻挡刻蚀所述遮光层，形成多个透光孔，每个所述透光孔分别对应于一个所述像素点。The first light-transmitting layer is used as a barrier to etch the light-shielding layer to form a plurality of light-transmitting holes, and each of the light-transmitting holes corresponds to one pixel point.
一实施例中，所述第一透光层为滤光片。In an embodiment, the first light-transmitting layer is a light filter.
一实施例中，还包括制作第二透光层，In an embodiment, it further includes fabricating a second light-transmitting layer,
第二透光层位于指纹识别芯片和第一透光层之间。The second light-transmitting layer is located between the fingerprint identification chip and the first light-transmitting layer.
一实施例中，还包括在遮光层表面制作第三透光层，In one embodiment, it further includes forming a third light-transmitting layer on the surface of the light-shielding layer,
第三透光层覆盖于所述透光孔。The third light-transmitting layer covers the light-transmitting hole.
一实施例中，还包括在第三透光层表面制作聚光透镜，In an embodiment, it further includes fabricating a condenser lens on the surface of the third light-transmitting layer,
聚光透镜对应于所述透光孔。The condenser lens corresponds to the light transmission hole.
一实施例中，所述遮光层材质为单晶硅、或多晶硅、或非晶硅、或锗化硅、或碳化硅。In an embodiment, the light shielding layer is made of monocrystalline silicon, or polycrystalline silicon, or amorphous silicon, or silicon germanium, or silicon carbide.
一实施例中，第一透光层和遮光层之间黏胶固定。In one embodiment, the first light-transmitting layer and the light-shielding layer are glued together.
一实施例中，所述指纹识别芯片为光学型指纹识别芯片。In an embodiment, the fingerprint identification chip is an optical fingerprint identification chip.
一种指纹识别芯片的封装方法，包括：A method for packaging a fingerprint identification chip, including:
提供一晶圆，该晶圆具有多个指纹识别芯片，指纹识别芯片具有相对的正面和背面，其正面具有多个用于采集指纹信息的像素点；Provide a wafer with a plurality of fingerprint identification chips, the fingerprint identification chip has opposite front and back sides, and the front side has a plurality of pixels for collecting fingerprint information;
在指纹识别芯片的正面依次制作第一透光层和遮光层；The first light-transmitting layer and the light-shielding layer are sequentially fabricated on the front side of the fingerprint identification chip;
以所述第一透光层作为阻挡刻蚀所述遮光层，形成多个透光孔，每个所述透光孔分别对应于一个所述像素点；Using the first light-transmitting layer as a barrier to etch the light-shielding layer to form a plurality of light-transmitting holes, each of the light-transmitting holes corresponding to one of the pixel points;
通过切割工艺，切割所述晶圆，形成多个单粒的封装结构。Through the cutting process, the wafer is cut to form a plurality of single-chip package structures.
一种指纹识别芯片的封装结构，包括：A packaging structure of a fingerprint identification chip, including:
指纹识别芯片，指纹识别芯片具有相对的正面和背面，其正面具有多个用于采集指纹信息的像素点；Fingerprint identification chip. The fingerprint identification chip has opposite front and back sides, and the front side has multiple pixels for collecting fingerprint information;
依次形成于指纹识别芯片正面的第二透光层、滤光片和遮光层，所述遮光层上形成有多个透光孔，每个所述透光孔分别对应于一个所述像素点。The second light-transmitting layer, the light filter and the light-shielding layer are sequentially formed on the front surface of the fingerprint identification chip. A plurality of light-transmitting holes are formed on the light-shielding layer, and each light-transmitting hole corresponds to one pixel point.
一实施例中，还包括覆盖于所述透光孔的第三透光层。In an embodiment, it further includes a third light-transmitting layer covering the light-transmitting hole.
一实施例中，还包括形成于第三透光层表面的聚光透镜，In one embodiment, it further includes a condenser lens formed on the surface of the third light-transmitting layer,
聚光透镜对应于所述透光孔。The condenser lens corresponds to the light transmission hole.
一实施例中，所述遮光层材质为单晶硅、或多晶硅、或非晶硅、或锗化硅、或碳化硅。In an embodiment, the light shielding layer is made of monocrystalline silicon, or polycrystalline silicon, or amorphous silicon, or silicon germanium, or silicon carbide.
一实施例中，第一透光层和遮光层之间黏胶固定。In one embodiment, the first light-transmitting layer and the light-shielding layer are glued together.
一实施例中，所述指纹识别芯片为光学型指纹识别芯片。In an embodiment, the fingerprint identification chip is an optical fingerprint identification chip.
与现有技术相比，本发明以滤光片作为阻挡层，在遮光层上制作透光孔，一方面，形成的柱状体遮光体更好起到遮挡和吸收多余斜射光，使物体成型图像更清晰；另一方面，滤光片可以滤除检测光波段之外的杂光；再另一方 面，可以提高工艺加工效率，适用于晶圆级封装。Compared with the prior art, the present invention uses a filter as a barrier layer to make light-transmitting holes in the light-shielding layer. On the one hand, the formed cylindrical light-shielding body better shields and absorbs excess oblique light, so that the object can form an image. Clearer; on the other hand, the filter can filter out stray light outside the detection light band; on the other hand, it can improve the processing efficiency and is suitable for wafer-level packaging.
附图说明Description of the drawings
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请中记载的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly describe the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments described in this application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work.
图1是本申请实施方式1中封装结构的剖视图；FIG. 1 is a cross-sectional view of the package structure in Embodiment 1 of the present application;
图2至9是本申请实施方式1中封装结构所形成的中间结构的示意图。2 to 9 are schematic diagrams of intermediate structures formed by the package structure in Embodiment 1 of the present application.
具体实施方式Detailed ways
通过应连同所附图式一起阅读的以下具体实施方式将更完整地理解本发明。本文中揭示本发明的详细实施例；然而，应理解，所揭示的实施例仅具本发明的示范性，本发明可以各种形式来体现。因此，本文中所揭示的特定功能细节不应解释为具有限制性，而是仅解释为权利要求书的基础且解释为用于教示所属领域的技术人员在事实上任何适当详细实施例中以不同方式采用本发明的代表性基础。The present invention will be understood more completely through the following specific embodiments that should be read together with the accompanying drawings. Detailed embodiments of the present invention are disclosed herein; however, it should be understood that the disclosed embodiments are only exemplary of the present invention, and the present invention can be embodied in various forms. Therefore, the specific functional details disclosed herein should not be construed as restrictive, but merely construed as the basis of the claims and construed as teaching those skilled in the art to differ in any appropriate detailed embodiment. The method adopts the representative basis of the present invention.
本实施例提供了一种封装结构10，参考图1，封装结构10包括指纹识别芯片11和盖板12。This embodiment provides a packaging structure 10. Referring to FIG. 1, the packaging structure 10 includes a fingerprint identification chip 11 and a cover plate 12.
指纹识别芯片11具有相对的正面111和背面112，正面具有多个用于采集指纹信息的像素点113。The fingerprint identification chip 11 has a front side 111 and a back side 112 opposite to each other, and the front side has a plurality of pixels 113 for collecting fingerprint information.
盖板12覆盖在指纹识别芯片11的正面111。The cover plate 12 covers the front surface 111 of the fingerprint identification chip 11.
一实施例中，指纹识别芯片11为光学型指纹识别芯片。In one embodiment, the fingerprint identification chip 11 is an optical fingerprint identification chip.
盖板12包括依次覆盖于指纹识别芯片11正面111的透光层121、滤光片124、遮光层122和透光层123。The cover 12 includes a light-transmitting layer 121, a filter 124, a light-shielding layer 122 and a light-transmitting layer 123 sequentially covering the front surface 111 of the fingerprint identification chip 11.
透光层121覆盖指纹识别芯片11的正面111，用于对待封装指纹识别芯片11的正面进行保护。由于需要光线透过透光层121到达像素点113，因此，透光层121具有较高的透光性，为透光材料。透光层121两个表面均平整、光滑，不会对入射光线产生散射、漫反射等。The light-transmitting layer 121 covers the front surface 111 of the fingerprint recognition chip 11 and is used to protect the front surface of the fingerprint recognition chip 11 to be packaged. Since light is required to pass through the light-transmitting layer 121 to reach the pixel points 113, the light-transmitting layer 121 has a relatively high light-transmitting property and is a light-transmitting material. Both surfaces of the light-transmitting layer 121 are flat and smooth, and will not scatter or diffuse the incident light.
具体地，透光层121的材料可以为干膜、无机玻璃、有机玻璃或者其他具有特定强度的透光材料。Specifically, the material of the light-transmitting layer 121 may be dry film, inorganic glass, organic glass, or other light-transmitting materials with specific strength.
在一实施例中，透光层121与指纹识别芯片11正面111之间通过黏胶进行固定。In one embodiment, the light-transmitting layer 121 and the front surface 111 of the fingerprint identification chip 11 are fixed by glue.
本实施例中，综合考虑透光层121的光学性能和粘粘性能，透光层121的厚度优选为5-20μm。In this embodiment, considering the optical properties and adhesion properties of the light-transmitting layer 121, the thickness of the light-transmitting layer 121 is preferably 5-20 μm.
滤光片124用于滤除检测光波段之外的杂光，以降低杂光干扰，提高指纹识别的精度。The filter 124 is used to filter out stray light outside the detection light band, so as to reduce the interference of stray light and improve the accuracy of fingerprint recognition.
滤光片124可以仅仅覆盖像素点113对应的上方，也可以覆盖于透光层121的整个表面。The filter 124 may only cover the upper portion corresponding to the pixel point 113, or may cover the entire surface of the light-transmitting layer 121.
在一实施例中，滤光片124与透光层121之间通过DAF膜粘结固定。In an embodiment, the filter 124 and the light-transmitting layer 121 are bonded and fixed by a DAF film.
遮光层122上开设有上下相通的多个透光孔1221，每个透光孔1221分别对应一个像素点113，在优选的实施例中，透光孔1221的轴线与像素点113 的中心重合。The light-shielding layer 122 is provided with a plurality of light-transmitting holes 1221 communicating up and down. Each light-transmitting hole 1221 corresponds to a pixel 113. In a preferred embodiment, the axis of the light-transmitting hole 1221 coincides with the center of the pixel 113.
遮光层122具有较低的介电常数，遮光层122材质优选为硅材料，可以为单晶硅、或多晶硅、或非晶硅、或锗化硅、或碳化硅。遮光层122可以通过物理沉积方式形成于透光层121表面。The light-shielding layer 122 has a relatively low dielectric constant. The material of the light-shielding layer 122 is preferably a silicon material, which can be monocrystalline silicon, or polycrystalline silicon, or amorphous silicon, or silicon germanium, or silicon carbide. The light-shielding layer 122 may be formed on the surface of the light-transmitting layer 121 by physical deposition.
遮光层122的厚度优选为4-20μm，透光孔为圆形孔时，其口径优选为30-40μm，深宽比优选为1:1至1.5:1。The thickness of the light-shielding layer 122 is preferably 4-20 μm, and when the light-transmitting hole is a circular hole, its aperture is preferably 30-40 μm, and the aspect ratio is preferably 1:1 to 1.5:1.
遮光层122采用硅材料，一方面能够降低邻像素点113之间的串扰问题。另一方面，硅材料制作的遮光层122的莫氏硬度一般在10以上，硬度较高，机械强度大，手指按压时，不会产生厚度形变，不会影响指纹识别的准确性。The light shielding layer 122 is made of silicon material, which can reduce the crosstalk problem between adjacent pixels 113 on the one hand. On the other hand, the light-shielding layer 122 made of silicon material generally has a Mohs hardness of more than 10, with high hardness and high mechanical strength. When pressed by a finger, thickness deformation will not occur, and the accuracy of fingerprint recognition will not be affected.
在垂直于的正面111的方向上，透光孔1221在正面111的投影至少与对应的像素点113在正面111的投影部分交叠。为了保证指纹识别的准确性，可以设置透光孔1221在正面111的投影完全覆盖对应的像素点113在正面111的投影。最优的，可以设置透光孔1221在正面111的投影与对应的像素点113在正面111的投影完全重合。In the direction perpendicular to the front 111, the projection of the light-transmitting hole 1221 on the front 111 at least overlaps with the projection of the corresponding pixel 113 on the front 111. In order to ensure the accuracy of fingerprint recognition, the projection of the transparent hole 1221 on the front 111 can be set to completely cover the projection of the corresponding pixel 113 on the front 111. Optimally, the projection of the light-transmitting hole 1221 on the front side 111 can be set to completely coincide with the projection of the corresponding pixel point 113 on the front side 111.
正面111包括感应区以及包围感应区的非感应区。其中，像素点113设置在感应区；非感应区设置有与像素点113电连接的焊盘(图未示)，焊盘用于与外部电路电连接。The front surface 111 includes a sensing area and a non-sensing area surrounding the sensing area. Among them, the pixel 113 is arranged in the sensing area; the non-sensing area is provided with a pad (not shown) electrically connected to the pixel 113, and the pad is used for electrical connection with an external circuit.
如果指纹识别芯片11为电容型的指纹识别芯片，进行指纹识别时，像素点113检测电容值，将电容值转换为电信号，外部电路根据该电信号可以获取指纹信息，进行身份识别，透光孔1221用于露出所述像素点，遮光层122具有较低的介电常数，可以降低相邻像素点之间的串扰问题，提高了指纹识别的准确性。If the fingerprint recognition chip 11 is a capacitive fingerprint recognition chip, when performing fingerprint recognition, the pixel 113 detects the capacitance value and converts the capacitance value into an electrical signal. The external circuit can obtain fingerprint information according to the electrical signal, perform identity recognition, and transmit light. The holes 1221 are used to expose the pixels, and the light-shielding layer 122 has a lower dielectric constant, which can reduce the problem of crosstalk between adjacent pixels and improve the accuracy of fingerprint recognition.
如果指纹识别芯片11为光学型的指纹识别芯片，进行指纹识别时，像素点113通过对应的透光孔1221采集与所述透光孔1221相对的采集预设区域的指纹信息。由于每个像素点113均通过对应透光孔1221采集自身相对的采集区域的指纹信息，避免了不同像素点对应预设区域之间的相互串扰，进而避免了指纹图像的失真，进一步提高了指纹识别的准确性。If the fingerprint recognition chip 11 is an optical fingerprint recognition chip, when performing fingerprint recognition, the pixel 113 collects fingerprint information in a predetermined area opposite to the light transmission hole 1221 through the corresponding light transmission hole 1221. Since each pixel 113 collects the fingerprint information of its relative collection area through the corresponding light-transmitting hole 1221, the mutual crosstalk between the preset areas corresponding to different pixels is avoided, thereby avoiding the distortion of the fingerprint image, and further improving the fingerprint Accuracy of recognition.
透光孔1221的形状可以为圆形通孔或者方形通孔或者三角形通孔。具体的，可以设置透光孔1221的形状为顶部与底部相同的圆孔、或顶部与底部相同的方孔、或顶部与底部相同的三角孔、或是其他结构的顶部与底部相同的多边形。透光孔1221的底部为透光孔1221靠近像素点113的开口，透光孔1221的顶部为透光孔1221远离像素点113的开口。The shape of the light transmission hole 1221 may be a circular through hole, a square through hole or a triangular through hole. Specifically, the shape of the transparent hole 1221 may be a circular hole with the same top and bottom, or a square hole with the same top and bottom, or a triangular hole with the same top and bottom, or a polygon with the same top and bottom of other structures. The bottom of the light-transmitting hole 1221 is the opening of the light-transmitting hole 1221 close to the pixel point 113, and the top of the light-transmitting hole 1221 is the opening of the light-transmitting hole 1221 away from the pixel point 113.
易于想到的是，也可以设置透光孔1221的形状为顶部与底部不相同的圆孔、或顶部与底部不相同的方孔、或顶部与底部不相同的三角孔、或是其他结构的顶部与底部不相同的多边形。此时，透光孔1221的顶部大于透光孔1221的底部。同样，透光孔1221的底部为透光孔1221靠近像素点113的开口，透光孔1221的顶部为透光孔1221远离像素点113的开口。It is easily conceivable that the shape of the light-transmitting hole 1221 can also be a round hole with a different top and bottom, a square hole with a different top and bottom, or a triangular hole with a different top and bottom, or the top of other structures. A polygon that is not the same as the bottom. At this time, the top of the light-transmitting hole 1221 is larger than the bottom of the light-transmitting hole 1221. Similarly, the bottom of the light-transmitting hole 1221 is the opening of the light-transmitting hole 1221 close to the pixel point 113, and the top of the light-transmitting hole 1221 is the opening of the light-transmitting hole 1221 away from the pixel point 113.
在一实施例中，遮光层122与滤光片124之间通过DAF膜粘结固定。In one embodiment, the light shielding layer 122 and the filter 124 are bonded and fixed by a DAF film.
透光层123覆盖遮光层122背离正面111的一面，用于对透光孔1221的开口进行遮挡。由于需要光线透过透光层123到达像素点113，因此，透 光层123具有较高的透光性，为透光材料。透光层123两个表面均平整、光滑，不会对入射光线产生散射、漫反射等。The light-transmitting layer 123 covers the side of the light-shielding layer 122 facing away from the front surface 111 for shielding the opening of the light-transmitting hole 1221. Since light is required to pass through the light-transmitting layer 123 to reach the pixel points 113, the light-transmitting layer 123 has high light-transmitting properties and is a light-transmitting material. Both surfaces of the light-transmitting layer 123 are flat and smooth, and will not scatter or diffuse the incident light.
具体地，透光层123的材料可以为干膜、无机玻璃、有机玻璃或者其他具有特定强度的透光材料。Specifically, the material of the light-transmitting layer 123 may be dry film, inorganic glass, organic glass, or other light-transmitting materials with specific strength.
本实施例中，透光层123的厚度优选为10-40微米。In this embodiment, the thickness of the light-transmitting layer 123 is preferably 10-40 microns.
在一实施例中，透光层123与遮光层122之间通过黏胶进行固定。In an embodiment, the light-transmitting layer 123 and the light-shielding layer 122 are fixed by glue.
透光层123背离指纹识别芯片11正面111的一侧设置有多个聚光透镜125，每个聚光透镜125分别对应一个透光孔1221，聚光透镜125用以将外部光线汇聚至对应像素点113表面。A plurality of condensing lenses 125 are provided on the side of the light-transmitting layer 123 away from the front 111 of the fingerprint identification chip 11, and each condensing lens 125 corresponds to a light-transmitting hole 1221, and the condensing lens 125 is used to condense external light to the corresponding pixel. Point 113 on the surface.
一实施例中，聚光透镜125可以通过光刻和烘烤成型方式制作，另一实施例中，聚光透镜125也可以采用压印方式形成于透光层123表面。In one embodiment, the condensing lens 125 can be manufactured by photolithography and baking molding. In another embodiment, the condensing lens 125 can also be formed on the surface of the light-transmitting layer 123 by embossing.
对应地，本发明实施例提供了一种封装方法，用于形成如图1所示的封装结构。请参考图2至图9，为本发明实施例的封装方法的封装过程中形成的中间结构示意图。Correspondingly, the embodiment of the present invention provides a packaging method for forming the packaging structure as shown in FIG. 1. Please refer to FIGS. 2 to 9, which are schematic diagrams of intermediate structures formed during the packaging process of the packaging method according to the embodiment of the present invention.
步骤s1：参考图2和3，提供待封装晶圆100，其中，图2为待封装晶圆100的俯视结构示意图，图3为图2沿A-A的剖视图。Step s1: Referring to FIGS. 2 and 3, provide a wafer to be packaged 100, wherein FIG. 2 is a schematic top view of the structure of the wafer to be packaged 100, and FIG. 3 is a cross-sectional view along A-A of FIG.
待封装晶圆100具有正面111和与正面111相对的背面112。晶圆100包括多个阵列排布的指纹识别芯片11。每个相邻指纹识别芯片11具有多个用于采集指纹信息的像素点13。像素点13位于正面111。相邻指纹识别芯片11之间具有切割沟道120，以便于在后续切割工艺中进行切割处理。The wafer 100 to be packaged has a front surface 111 and a back surface 112 opposite to the front surface 111. The wafer 100 includes a plurality of fingerprint recognition chips 11 arranged in an array. Each adjacent fingerprint identification chip 11 has a plurality of pixels 13 for collecting fingerprint information. The pixel 13 is located on the front side 111. There is a cutting channel 120 between adjacent fingerprint identification chips 11 to facilitate the cutting process in the subsequent cutting process.
第一表面111包括感应区以及包围感应区的非感应区，像素点113设置在感应区，在非感应区设置有焊盘(图未示)，焊盘与像素点113电连接，焊盘用于与外部电路电连接。The first surface 111 includes a sensing area and a non-sensing area surrounding the sensing area. The pixel point 113 is arranged in the sensing area, and a pad (not shown) is arranged in the non-sensing area. The pad is electrically connected to the pixel point 113, and the pad is used for To be electrically connected to an external circuit.
需要说明的是，相邻两个指纹识别芯片11之间的切割沟道120仅为两个指纹识别芯片11之间预留的用于切割的留白区域，切割沟道120与两侧的指纹识别芯片11之间不具有实际的边界线。It should be noted that the cutting channel 120 between two adjacent fingerprint identification chips 11 is only a blank area reserved between the two fingerprint identification chips 11 for cutting, and the cutting channel 120 is connected to the fingerprints on both sides. There is no actual boundary line between the identification chips 11.
步骤s2：参考图4，在待封装晶圆100的正面111上覆盖透光层121。该步骤中，通过黏胶在待封装晶圆100的表面固定透光层121。Step s2: referring to FIG. 4, cover the light-transmitting layer 121 on the front surface 111 of the wafer 100 to be packaged. In this step, the light-transmitting layer 121 is fixed on the surface of the wafer 100 to be packaged by glue.
步骤s3：参考图5，在透光层121的表面覆盖滤光片124。Step s3: referring to FIG. 5, a filter 124 is covered on the surface of the light-transmitting layer 121.
步骤s4：参考图6，在滤光片124的表面覆盖遮光层122，该步骤中，通过黏胶在滤光片124的表面固定遮光层122。例如，可以在遮光层122面对滤光片124的表面上，和/或滤光片124上，通过喷涂、旋涂或者黏贴的工艺形成粘合层，再将滤光片124与遮光层122相对压合，通过粘合层结合。粘合层既可以实现粘接作用，又可以起到绝缘和密封作用。粘合层可以为高分子粘接材料，例如硅胶、环氧树脂、苯并环丁烯等聚合物材料。Step s4: referring to FIG. 6, the light shielding layer 122 is covered on the surface of the filter 124. In this step, the light shielding layer 122 is fixed on the surface of the filter 124 by glue. For example, on the surface of the light shielding layer 122 facing the filter 124, and/or on the filter 124, an adhesive layer may be formed by spraying, spin coating or pasting, and then the filter 124 and the light shielding layer 122 is relatively pressed together and joined by an adhesive layer. The adhesive layer can not only achieve the bonding effect, but also play the role of insulation and sealing. The adhesive layer may be a polymer adhesive material, such as polymer materials such as silica gel, epoxy resin, and benzocyclobutene.
步骤s5：参考图7，以滤光片124作为阻挡层，在遮光层122上刻蚀形成多个透光孔1221。Step s5: referring to FIG. 7, the light-shielding layer 122 is etched to form a plurality of light-transmitting holes 1221 using the filter 124 as a blocking layer.
步骤s6：参考图8，在遮光层122的表面覆盖透光层123，该步骤中，通过黏胶在遮光层122的表面固定透光层123。透光层123可以仅仅覆盖透光孔1221的顶端开口，也可以是覆盖于遮光层122的整个表面。Step s6: referring to FIG. 8, the surface of the light-shielding layer 122 is covered with the light-transmitting layer 123. In this step, the light-transmitting layer 123 is fixed on the surface of the light-shielding layer 122 by glue. The light-transmitting layer 123 may only cover the top opening of the light-transmitting hole 1221, or may cover the entire surface of the light-shielding layer 122.
步骤s7：参考图9，在透光层123的表面制作多个聚光透镜125，每个聚光透镜125分别对应一个透光孔1221。Step s7: Referring to FIG. 9, a plurality of condenser lenses 125 are fabricated on the surface of the light-transmitting layer 123, and each condenser lens 125 corresponds to a light-transmitting hole 1221.
步骤s8：通过切割工艺分割晶圆100、透光层121、滤光片124、遮光层122和透光层123，在进行切割时，沿着切割沟道120的方向进行切割，形成多个指纹识别芯片11的封装结构10。切割可以采用切片刀切割或者激光切割，切片刀切割可以采用金属刀或者树脂刀。Step s8: Divide the wafer 100, the light-transmitting layer 121, the light filter 124, the light-shielding layer 122, and the light-transmitting layer 123 through a dicing process, and perform cutting along the direction of the cutting channel 120 to form a plurality of fingerprints during cutting. Identify the package structure 10 of the chip 11. The cutting can be cut with a slicing knife or laser cutting, and the slicing knife can be cut with a metal knife or a resin knife.
在整个封装工艺中，还可以包括晶圆减薄、焊垫制作、布线层制作等工序，本案不再赘述。In the entire packaging process, it can also include wafer thinning, solder pad production, wiring layer production and other processes, which will not be repeated in this case.
另外，对待封装晶圆200进行封装处理后，可以使得后续切割获得的芯片封装结构通过外接凸起(图未示)与外部电路连接。In addition, after the wafer to be packaged 200 is packaged, the chip package structure obtained by subsequent cutting can be connected to an external circuit through external bumps (not shown).
综上所述，本发明以滤光片作为阻挡层，在遮光层上制作透光孔，一方面，形成的柱状体遮光体更好起到遮挡和吸收多余斜射光，使物体成型图像更清晰；另一方面，滤光片可以滤除检测光波段之外的杂光；再另一方面，可以提高工艺加工效率，适用于晶圆级封装。In summary, the present invention uses a filter as a barrier layer to make light-transmitting holes on the light-shielding layer. On the one hand, the formed cylindrical light-shielding body better shields and absorbs excess oblique light, making the image of the object clearer. ; On the other hand, the filter can filter out the stray light outside the detection light band; on the other hand, it can improve the processing efficiency and is suitable for wafer-level packaging.
本发明的各方面、实施例、特征及实例应视为在所有方面为说明性的且不打算限制本发明，本发明的范围仅由权利要求书界定。在不背离所主张的本发明的精神及范围的情况下，所属领域的技术人员将明了其它实施例、修改及使用。The aspects, embodiments, features, and examples of the present invention should be regarded as illustrative in all aspects and are not intended to limit the present invention. The scope of the present invention is only defined by the claims. Without departing from the spirit and scope of the claimed invention, those skilled in the art will understand other embodiments, modifications, and uses.
在本申请案中标题及章节的使用不意味着限制本发明；每一章节可应用于本发明的任何方面、实施例或特征。The use of titles and chapters in this application is not meant to limit the invention; each chapter can be applied to any aspect, embodiment or feature of the invention.
在本申请案通篇中，在将组合物描述为具有、包含或包括特定组份之处或者在将过程描述为具有、包含或包括特定过程步骤之处，预期本发明教示的组合物也基本上由所叙述组份组成或由所叙述组份组成，且本发明教示的过程也基本上由所叙述过程步骤组成或由所叙述过程步骤组组成。Throughout this application, where a composition is described as having, containing, or including specific components, or where a process is described as having, containing, or including specific process steps, it is expected that the composition taught by the present invention is also basically The above is composed of or composed of the described components, and the process taught by the present invention is basically composed of the described process steps or a set of described process steps.
在本申请案中，在将元件或组件称为包含于及/或选自所叙述元件或组件列表之处，应理解，所述元件或组件可为所叙述元件或组件中的任一者且可选自由所叙述元件或组件中的两者或两者以上组成的群组。此外，应理解，在不背离本发明教示的精神及范围的情况下，本文中所描述的组合物、设备或方法的元件及/或特征可以各种方式组合而无论本文中是明确说明还是隐含说明。In this application, where an element or component is referred to as being included in and/or selected from the list of recited elements or components, it should be understood that the element or component can be any of the recited elements or components and It can be selected from a group consisting of two or more of the described elements or components. In addition, it should be understood that, without departing from the spirit and scope of the teachings of the present invention, the elements and/or features of the compositions, devices or methods described herein can be combined in various ways, regardless of whether they are explicitly stated or implied herein. With instructions.
除非另外具体陈述，否则术语“包含(include、includes、including)”、“具有(have、has或having)”的使用通常应理解为开放式的且不具限制性。Unless specifically stated otherwise, the use of the terms "include, includes, including" and "have, has, or having" should generally be understood as open-ended and not restrictive.
除非另外具体陈述，否则本文中单数的使用包含复数(且反之亦然)。此外，除非上下文另外清楚地规定，否则单数形式“一(a、an)”及“所述(the)”包含复数形式。另外，在术语“约”的使用在量值之前之处，除非另外具体陈述，否则本发明教示还包括特定量值本身。Unless specifically stated otherwise, the use of the singular number herein includes the plural number (and vice versa). In addition, unless the context clearly dictates otherwise, the singular forms "a, an" and "the" include plural forms. In addition, where the term "about" is used before a quantity, unless specifically stated otherwise, the teachings of the present invention also include the specific quantity itself.
应理解，各步骤的次序或执行特定动作的次序并非十分重要，只要本发明教示保持可操作即可。此外，可同时进行两个或两个以上步骤或动作。It should be understood that the order of the steps or the order of performing a particular action is not very important, as long as the teachings of the present invention remain operable. In addition, two or more steps or actions can be performed simultaneously.
应理解，本发明的各图及说明已经简化以说明与对本发明的清楚理解有关的元件，而出于清晰性目的消除其它元件。然而，所属领域的技术人员将 认识到，这些及其它元件可为合意的。然而，由于此类元件为此项技术中众所周知的，且由于其不促进对本发明的更好理解，因此本文中不提供对此类元件的论述。应了解，各图是出于图解说明性目的而呈现且不作为构造图式。所省略细节及修改或替代实施例在所属领域的技术人员的范围内。It should be understood that the drawings and descriptions of the present invention have been simplified to illustrate elements related to a clear understanding of the present invention, while other elements are eliminated for clarity. However, those skilled in the art will recognize that these and other elements may be desirable. However, since such elements are well known in the art and since they do not promote a better understanding of the present invention, no discussion of such elements is provided herein. It should be understood that the figures are presented for illustrative purposes and not as construction drawings. The omitted details and modified or alternative embodiments are within the scope of those skilled in the art.
可了解，在本发明的特定方面中，可由多个组件替换单个组件且可由单个组件替换多个组件以提供一元件或结构或者执行一或若干给定功能。除了在此替代将不操作以实践本发明的特定实施例之处以外，将此替代视为在本发明的范围内。It can be understood that, in certain aspects of the present invention, a single component may be replaced by multiple components and multiple components may be replaced by a single component to provide an element or structure or perform one or several given functions. This substitution is considered to be within the scope of the present invention except where it is substituted here that will not operate to practice the specific embodiments of the present invention.
尽管已参考说明性实施例描述了本发明，但所属领域的技术人员将理解，在不背离本发明的精神及范围的情况下可做出各种其它改变、省略及/或添加且可用实质等效物替代所述实施例的元件。另外，可在不背离本发明的范围的情况下做出许多修改以使特定情形或材料适应本发明的教示。因此，本文并不打算将本发明限制于用于执行本发明的所揭示特定实施例，而是打算使本发明将包含归属于所附权利要求书的范围内的所有实施例。此外，除非具体陈述，否则术语第一、第二等的任何使用不表示任何次序或重要性，而是使用术语第一、第二等来区分一个元素与另一元素。Although the present invention has been described with reference to illustrative embodiments, those skilled in the art will understand that various other changes, omissions and/or additions can be made without departing from the spirit and scope of the invention, and the essence, etc. The effector replaces the elements of the described embodiment. In addition, many modifications may be made to adapt specific situations or materials to the teachings of the present invention without departing from the scope of the present invention. Therefore, this document does not intend to limit the present invention to the specific embodiments disclosed for implementing the present invention, but intends that the present invention will include all embodiments falling within the scope of the appended claims. In addition, unless specifically stated otherwise, any use of the terms first, second, etc. does not denote any order or importance, but rather uses the terms first, second, etc. to distinguish one element from another.

Claims (15)

  1. 一种指纹识别芯片的封装方法，其特征在于，包括：A method for packaging a fingerprint identification chip, which is characterized in that it comprises:
    提供一指纹识别芯片，指纹识别芯片具有相对的正面和背面，其正面具有多个用于采集指纹信息的像素点；Provide a fingerprint identification chip, the fingerprint identification chip has opposite front and back sides, and the front side has a plurality of pixels for collecting fingerprint information;
    在指纹识别芯片的正面依次制作第一透光层和遮光层；The first light-transmitting layer and the light-shielding layer are sequentially fabricated on the front side of the fingerprint identification chip;
    以所述第一透光层作为阻挡刻蚀所述遮光层，形成多个透光孔，每个所述透光孔分别对应于一个所述像素点。The first light-transmitting layer is used as a barrier to etch the light-shielding layer to form a plurality of light-transmitting holes, and each of the light-transmitting holes corresponds to one pixel point.
  2. 根据权利要求1所述的指纹识别芯片的封装方法，其特征在于，所述第一透光层为滤光片。The method for packaging a fingerprint identification chip according to claim 1, wherein the first light-transmitting layer is a light filter.
  3. 根据权利要求1所述的指纹识别芯片的封装方法，其特征在于，还包括制作第二透光层，The method for packaging a fingerprint identification chip according to claim 1, further comprising making a second light-transmitting layer,
    第二透光层位于指纹识别芯片和第一透光层之间。The second light-transmitting layer is located between the fingerprint identification chip and the first light-transmitting layer.
  4. 根据权利要求1所述的指纹识别芯片的封装方法，其特征在于，还包括在遮光层表面制作第三透光层，The method for packaging a fingerprint identification chip according to claim 1, further comprising forming a third light-transmitting layer on the surface of the light-shielding layer,
    第三透光层覆盖于所述透光孔。The third light-transmitting layer covers the light-transmitting hole.
  5. 根据权利要求4所述的指纹识别芯片的封装方法，其特征在于，还包括在第三透光层表面制作聚光透镜，4. The fingerprint identification chip packaging method according to claim 4, further comprising fabricating a condensing lens on the surface of the third light-transmitting layer,
    聚光透镜对应于所述透光孔。The condenser lens corresponds to the light transmission hole.
  6. 根据权利要求1所述的指纹识别芯片的封装方法，其特征在于，所述遮光层材质为单晶硅、或多晶硅、或非晶硅、或锗化硅、或碳化硅。The fingerprint identification chip packaging method according to claim 1, wherein the light shielding layer is made of monocrystalline silicon, or polycrystalline silicon, or amorphous silicon, or silicon germanium, or silicon carbide.
  7. 根据权利要求1所述的指纹识别芯片的封装方法，其特征在于，第一透光层和遮光层之间黏胶固定。The method for packaging a fingerprint identification chip according to claim 1, wherein the first light-transmitting layer and the light-shielding layer are glued and fixed.
  8. 根据权利要求1所述的指纹识别芯片的封装方法，其特征在于，所述指纹识别芯片为光学型指纹识别芯片。The packaging method of a fingerprint identification chip according to claim 1, wherein the fingerprint identification chip is an optical fingerprint identification chip.
  9. 一种指纹识别芯片的封装方法，其特征在于，包括：A method for packaging a fingerprint identification chip, which is characterized in that it comprises:
    提供一晶圆，该晶圆具有多个指纹识别芯片，指纹识别芯片具有相对的正面和背面，其正面具有多个用于采集指纹信息的像素点；Provide a wafer with a plurality of fingerprint identification chips, the fingerprint identification chip has opposite front and back sides, and the front side has a plurality of pixels for collecting fingerprint information;
    在指纹识别芯片的正面依次制作第一透光层和遮光层；The first light-transmitting layer and the light-shielding layer are sequentially fabricated on the front side of the fingerprint identification chip;
    以所述第一透光层作为阻挡刻蚀所述遮光层，形成多个透光孔，每个所述透光孔分别对应于一个所述像素点；Using the first light-transmitting layer as a barrier to etch the light-shielding layer to form a plurality of light-transmitting holes, each of the light-transmitting holes corresponding to one of the pixel points;
    通过切割工艺，切割所述晶圆，形成多个单粒的封装结构。Through the cutting process, the wafer is cut to form a plurality of single-chip package structures.
  10. 一种指纹识别芯片的封装结构，其特征在于，包括：A packaging structure of a fingerprint identification chip, which is characterized in that it comprises:
    指纹识别芯片，指纹识别芯片具有相对的正面和背面，其正面具有多个用于采集指纹信息的像素点；Fingerprint identification chip. The fingerprint identification chip has opposite front and back sides, and the front side has multiple pixels for collecting fingerprint information;
    依次形成于指纹识别芯片正面的第二透光层、滤光片和遮光层，所述遮光层上形成有多个透光孔，每个所述透光孔分别对应于一个所述像素点。The second light-transmitting layer, the light filter and the light-shielding layer are sequentially formed on the front surface of the fingerprint identification chip. A plurality of light-transmitting holes are formed on the light-shielding layer, and each light-transmitting hole corresponds to one pixel point.
  11. 根据权利要求10所述的指纹识别芯片的封装结构，其特征在于，还包括覆盖于所述透光孔的第三透光层。10. The fingerprint identification chip packaging structure of claim 10, further comprising a third light-transmitting layer covering the light-transmitting hole.
  12. 根据权利要求11所述的指纹识别芯片的封装结构，其特征在于，还包括形成于第三透光层表面的聚光透镜，The fingerprint identification chip packaging structure according to claim 11, further comprising a condenser lens formed on the surface of the third light-transmitting layer,
    聚光透镜对应于所述透光孔。The condenser lens corresponds to the light transmission hole.
  13. 根据权利要求10所述的指纹识别芯片的封装结构，其特征在于，所述遮光层材质为单晶硅、或多晶硅、或非晶硅、或锗化硅、或碳化硅。The fingerprint identification chip packaging structure of claim 10, wherein the light shielding layer is made of monocrystalline silicon, or polycrystalline silicon, or amorphous silicon, or silicon germanium, or silicon carbide.
  14. 根据权利要求10所述的指纹识别芯片的封装结构，其特征在于，第一透光层和遮光层之间黏胶固定。10. The fingerprint recognition chip packaging structure of claim 10, wherein the first light-transmitting layer and the light-shielding layer are glued and fixed.
  15. 根据权利要求10所述的指纹识别芯片的封装结构，其特征在于，所述指纹识别芯片为光学型指纹识别芯片。10. The fingerprint identification chip packaging structure according to claim 10, wherein the fingerprint identification chip is an optical fingerprint identification chip.
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CN111192941A (en) * 2020-03-02 2020-05-22 苏州晶方半导体科技股份有限公司 Packaging structure and method of fingerprint identification chip
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