CN111192941A - Packaging structure and method of fingerprint identification chip - Google Patents
Packaging structure and method of fingerprint identification chip Download PDFInfo
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- CN111192941A CN111192941A CN202010135510.5A CN202010135510A CN111192941A CN 111192941 A CN111192941 A CN 111192941A CN 202010135510 A CN202010135510 A CN 202010135510A CN 111192941 A CN111192941 A CN 111192941A
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- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 30
- 230000003287 optical effect Effects 0.000 claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 claims abstract description 7
- 230000004888 barrier function Effects 0.000 claims abstract description 6
- 238000005530 etching Methods 0.000 claims abstract description 5
- 238000005520 cutting process Methods 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 11
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims description 5
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 claims description 5
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 5
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 5
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 5
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 4
- 238000001514 detection method Methods 0.000 abstract description 6
- 230000000903 blocking effect Effects 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 86
- 239000000463 material Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000002210 silicon-based material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005289 physical deposition Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
- H01L31/02164—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors for shielding light, e.g. light blocking layers, cold shields for infrared detectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
- H01L31/02165—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors using interference filters, e.g. multilayer dielectric filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention discloses a packaging structure and a packaging method, wherein the packaging method comprises the following steps: providing a fingerprint identification chip, wherein the fingerprint identification chip is provided with a front surface and a back surface which are opposite, and the front surface is provided with a plurality of pixel points for collecting fingerprint information; sequentially manufacturing a first light-transmitting layer and a light shielding layer on the front side of the fingerprint identification chip; and etching the light shielding layer by taking the first light transmitting layer as a barrier to form a plurality of light transmitting holes, wherein each light transmitting hole corresponds to one pixel point respectively. The light filter is used as the blocking layer, and the light holes are formed in the light shading layer, so that on one hand, the formed columnar light shading body can better shade and absorb redundant oblique light, and the formed image of the object is clearer; on the other hand, the optical filter can filter out stray light outside the detection light band; on the other hand, the method can improve the processing efficiency and is suitable for wafer-level packaging.
Description
Technical Field
The invention belongs to the technical field of semiconductors, and particularly relates to a fingerprint identification chip packaging structure and a fingerprint identification chip packaging method.
Background
With the continuous progress of science and technology, more and more electronic devices are widely applied to the daily life and work of people, bring great convenience to the daily life and work of people, and become an indispensable important tool for people at present. With the increasing functions of electronic devices, the electronic devices store more and more important information, and the authentication technology of electronic devices becomes a main direction for the research and development of electronic devices.
The fingerprint has uniqueness and invariance, so that the fingerprint identification technology has the advantages of good safety, high reliability, simplicity in use and the like. Therefore, fingerprint identification technology is the mainstream technology for authentication of various electronic devices.
At present, an optical fingerprint identification chip is one of fingerprint identification chips commonly used in existing electronic devices, and collects fingerprint information of a user through a large number of photosensitive pixels (pixels) in a fingerprint identification area, and each photosensitive pixel is used as a detection. Specifically, when fingerprint identification is carried out, light irradiates to the fingerprint surface of a user and is reflected to photosensitive pixels through the fingerprint surface, the photosensitive pixels convert optical signals of fingerprints into electric signals, and fingerprint information can be acquired according to the electric signals converted by all the pixels.
When the existing optical fingerprint identification chip is packaged, a transparent cover plate is generally directly arranged on the photosensitive side. However, the transparent cover plate is completely transparent, which may cause crosstalk in the sensing results of different photosensitive pixels, and affect the fingerprint identification accuracy.
To solve the technical problem, chinese patent application CN 108022904A discloses a method for packaging a fingerprint identification chip, in which a cover plate having a through hole structure is fixed on a side of a wafer facing a pixel point to avoid the crosstalk problem. The problems that exist at least include: through holes on the cover plate need to be formed in advance, and then the cover plate with the through holes is combined on the surface of the chip, but the operation process time is long, and the through holes and pixel points need to be subjected to position calibration, so that errors are easy to generate; if the through hole is manufactured after the cover plate is combined with the chip, no barrier exists between the cover plate and the chip, and pixel points below the through hole are easily damaged.
Disclosure of Invention
An embodiment of the present invention provides a packaging structure and a method for a fingerprint identification chip, which are used to solve the technical problems in the prior art that the processing time is long and the pixel points are easily damaged, and include:
a packaging method of a fingerprint identification chip comprises the following steps:
providing a fingerprint identification chip, wherein the fingerprint identification chip is provided with a front surface and a back surface which are opposite, and the front surface is provided with a plurality of pixel points for collecting fingerprint information;
sequentially manufacturing a first light-transmitting layer and a light shielding layer on the front side of the fingerprint identification chip;
and etching the light shielding layer by taking the first light transmitting layer as a barrier to form a plurality of light transmitting holes, wherein each light transmitting hole corresponds to one pixel point respectively.
In one embodiment, the first transparent layer is a filter.
In one embodiment, the method further comprises forming a second transparent layer,
the second light-transmitting layer is positioned between the fingerprint identification chip and the first light-transmitting layer.
In one embodiment, the method further includes forming a third transparent layer on the surface of the light-shielding layer,
the third euphotic layer covers the euphotic hole.
In one embodiment, the method further comprises fabricating a condensing lens on the surface of the third transparent layer,
the condensing lens corresponds to the light transmission hole.
In one embodiment, the light shielding layer is made of monocrystalline silicon, polycrystalline silicon, amorphous silicon, silicon germanium, or silicon carbide.
In one embodiment, the first transparent layer and the light-shielding layer are fixed by adhesive.
In one embodiment, the fingerprint identification chip is an optical fingerprint identification chip.
A packaging method of a fingerprint identification chip comprises the following steps:
providing a wafer, wherein the wafer is provided with a plurality of fingerprint identification chips, the fingerprint identification chips are provided with a front surface and a back surface which are opposite, and the front surface is provided with a plurality of pixel points for collecting fingerprint information;
sequentially manufacturing a first light-transmitting layer and a light shielding layer on the front side of the fingerprint identification chip;
etching the light shielding layer by taking the first light transmitting layer as a barrier to form a plurality of light transmitting holes, wherein each light transmitting hole corresponds to one pixel point;
and cutting the wafer through a cutting process to form a plurality of single-grain packaging structures.
A packaging structure of a fingerprint identification chip comprises:
the fingerprint identification chip is provided with a front surface and a back surface which are opposite, and the front surface of the fingerprint identification chip is provided with a plurality of pixel points for collecting fingerprint information;
the fingerprint identification chip comprises a second light-transmitting layer, a light filter and a light shielding layer which are sequentially formed on the front surface of the fingerprint identification chip, wherein a plurality of light-transmitting holes are formed in the light shielding layer, and each light-transmitting hole corresponds to one pixel point.
In one embodiment, the display device further comprises a third light-transmitting layer covering the light-transmitting hole.
In one embodiment, the display device further comprises a condensing lens formed on the surface of the third light-transmitting layer,
the condensing lens corresponds to the light transmission hole.
In one embodiment, the light shielding layer is made of monocrystalline silicon, polycrystalline silicon, amorphous silicon, silicon germanium, or silicon carbide.
In one embodiment, the first transparent layer and the light-shielding layer are fixed by adhesive.
In one embodiment, the fingerprint identification chip is an optical fingerprint identification chip.
Compared with the prior art, the light filter is used as the blocking layer, and the light holes are formed in the light shielding layer, so that on one hand, the formed columnar light shielding body can better shield and absorb redundant oblique light, and the formed image of the object is clearer; on the other hand, the optical filter can filter out stray light outside the detection light band; on the other hand, the method can improve the processing efficiency and is suitable for wafer-level packaging.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a sectional view of a package structure in embodiment 1 of the present application;
fig. 2 to 9 are schematic views of intermediate structures formed by the package structure in embodiment 1 of the present application.
Detailed Description
The present invention will be more fully understood from the following detailed description, which should be read in conjunction with the accompanying drawings. Detailed embodiments of the present invention are disclosed herein; however, it is to be understood that the disclosed embodiments are merely exemplary of the invention, which can be embodied in various forms. Therefore, specific functional details disclosed herein are not to be interpreted as limiting, but merely as a basis for the claims and as a representative basis for teaching one skilled in the art to variously employ the present invention in virtually any appropriately detailed embodiment.
The present embodiment provides a package structure 10, and referring to fig. 1, the package structure 10 includes a fingerprint identification chip 11 and a cover plate 12.
The fingerprint identification chip 11 has a front surface 111 and a back surface 112 opposite to each other, and the front surface has a plurality of pixel points 113 for collecting fingerprint information.
The cover 12 covers the front surface 111 of the fingerprint recognition chip 11.
In one embodiment, the fingerprint recognition chip 11 is an optical fingerprint recognition chip.
The cover plate 12 includes a transparent layer 121, an optical filter 124, a light-shielding layer 122 and a transparent layer 123 sequentially covering the front surface 111 of the fingerprint identification chip 11.
The light-transmitting layer 121 covers the front surface 111 of the fingerprint identification chip 11, and is used for protecting the front surface of the fingerprint identification chip 11 to be packaged. Since light is required to reach the pixel 113 through the transparent layer 121, the transparent layer 121 has high light transmittance and is a transparent material. Both surfaces of the transparent layer 121 are flat and smooth, and do not scatter or diffuse incident light.
Specifically, the material of the light-transmitting layer 121 may be a dry film, inorganic glass, organic glass, or other light-transmitting material with a specific strength.
In one embodiment, the transparent layer 121 and the front surface 111 of the fingerprint identification chip 11 are fixed by an adhesive.
In this embodiment, the thickness of the light-transmitting layer 121 is preferably 5 to 20 μm in consideration of both the optical properties and the adhesive properties of the light-transmitting layer 121.
The optical filter 124 is used for filtering stray light outside the detection light band, so as to reduce stray light interference and improve fingerprint identification accuracy.
The filter 124 may cover only the upper portion corresponding to the pixel 113, or may cover the entire surface of the transparent layer 121.
In one embodiment, the filter 124 and the transparent layer 121 are fixed by bonding through a DAF film.
The light-shielding layer 122 is provided with a plurality of light-transmitting holes 1221 which are vertically communicated, each light-transmitting hole 1221 corresponds to one pixel 113, and in a preferred embodiment, the axis of the light-transmitting hole 1221 coincides with the center of the pixel 113.
The light-shielding layer 122 has a low dielectric constant, and the material of the light-shielding layer 122 is preferably a silicon material, which may be monocrystalline silicon, polycrystalline silicon, amorphous silicon, silicon germanium, or silicon carbide. The light-shielding layer 122 may be formed on the surface of the light-transmitting layer 121 by physical deposition.
The light-shielding layer 122 preferably has a thickness of 4-20 μm, and when the light-transmitting holes are circular holes, the aperture is preferably 30-40 μm, and the aspect ratio is preferably 1:1 to 1.5: 1.
The light-shielding layer 122 is made of a silicon material, so that the crosstalk problem between the adjacent pixels 113 can be reduced. On the other hand, the mohs hardness of the light-shielding layer 122 made of silicon material is generally above 10, the hardness is high, the mechanical strength is high, and the thickness deformation cannot be generated when a finger presses the light-shielding layer, so that the accuracy of fingerprint identification cannot be influenced.
In a direction perpendicular to the front surface 111, a projection of the light-transmissive hole 1221 on the front surface 111 at least partially overlaps a projection of the corresponding pixel 113 on the front surface 111. In order to ensure the accuracy of fingerprint identification, the projection of the light hole 1221 on the front surface 111 may be set to completely cover the projection of the corresponding pixel 113 on the front surface 111. Optimally, the projection of the light hole 1221 on the front surface 111 may be completely overlapped with the projection of the corresponding pixel 113 on the front surface 111.
The front surface 111 includes a sensing area and a non-sensing area surrounding the sensing area. Wherein, the pixel point 113 is arranged in the sensing area; the non-sensing area is provided with a pad (not shown) electrically connected to the pixel 113, and the pad is used for electrically connecting to an external circuit.
If fingerprint identification chip 11 is the fingerprint identification chip of electric capacity type, when carrying out fingerprint identification, 113 detection capacitance values of pixel point convert the capacitance value into the signal of telecommunication, and external circuit can acquire fingerprint information according to this signal of telecommunication, carries out identity identification, and light trap 1221 is used for exposing the pixel point, light shield layer 122 has lower dielectric constant, can reduce the crosstalk problem between the adjacent pixel point, has improved fingerprint identification's accuracy.
If the fingerprint identification chip 11 is an optical fingerprint identification chip, when fingerprint identification is performed, the pixel 113 collects fingerprint information of a preset area through the corresponding light hole 1221 and collects the fingerprint information of the preset area corresponding to the light hole 1221. Because every pixel 113 is all through corresponding light trap 1221 gather the fingerprint information of the collection region that self is relative, avoided different pixel to correspond the mutual crosstalk between the preset region, and then avoided fingerprint image's distortion, further improved fingerprint identification's accuracy.
The shape of the light-transmitting hole 1221 may be a circular through hole, a square through hole, or a triangular through hole. Specifically, the shape of the light-transmitting hole 1221 may be a circular hole with the same top and bottom, a square hole with the same top and bottom, a triangular hole with the same top and bottom, or a polygon with the same top and bottom in other structures. The bottom of light trap 1221 is the opening that light trap 1221 is close to pixel 113, and the top of light trap 1221 is the opening that light trap 1221 keeps away from pixel 113.
It is easy to think that the shape of the light-transmitting hole 1221 may be a circular hole with different top and bottom, a square hole with different top and bottom, a triangular hole with different top and bottom, or a polygon with different top and bottom. At this time, the top of the light-transmissive hole 1221 is larger than the bottom of the light-transmissive hole 1221. Similarly, the bottom of the light hole 1221 is an opening of the light hole 1221 close to the pixel 113, and the top of the light hole 1221 is an opening of the light hole 1221 far from the pixel 113.
In one embodiment, the light shielding layer 122 and the optical filter 124 are fixed by bonding via a DAF film.
The transparent layer 123 covers a surface of the light-shielding layer 122 away from the front surface 111, and is used for shielding an opening of the transparent hole 1221. Since light is required to reach the pixel 113 through the transparent layer 123, the transparent layer 123 has high light transmittance and is a transparent material. The two surfaces of the transparent layer 123 are flat and smooth, and do not scatter or diffuse the incident light.
Specifically, the material of the light-transmitting layer 123 may be a dry film, inorganic glass, organic glass, or other light-transmitting material with a specific strength.
In this embodiment, the thickness of the light-transmitting layer 123 is preferably 10 to 40 μm.
In one embodiment, the transparent layer 123 and the light-shielding layer 122 are fixed by an adhesive.
The side of the transparent layer 123 away from the front surface 111 of the fingerprint identification chip 11 is provided with a plurality of condensing lenses 125, each condensing lens 125 corresponds to one transparent hole 1221, and the condensing lenses 125 are used for condensing external light to the surfaces of the corresponding pixels 113.
In one embodiment, the condensing lens 125 may be formed by photolithography and baking, and in another embodiment, the condensing lens 125 may also be formed on the surface of the transparent layer 123 by stamping.
Correspondingly, the embodiment of the invention provides a packaging method for forming the packaging structure shown in fig. 1. Fig. 2 to 9 are schematic diagrams of intermediate structures formed in a packaging process of a packaging method according to an embodiment of the invention.
Step s 1: referring to fig. 2 and 3, a wafer 100 to be packaged is provided, wherein fig. 2 is a schematic top view of the wafer 100 to be packaged, and fig. 3 is a cross-sectional view taken along a-a in fig. 2.
The wafer 100 to be packaged has a front side 111 and a back side 112 opposite to the front side 111. The wafer 100 includes a plurality of fingerprint identification chips 11 arranged in an array. Each adjacent fingerprint identification chip 11 has a plurality of pixel points 13 for collecting fingerprint information. The pixel 13 is located on the front side 111. The adjacent fingerprint identification chips 11 have a cutting channel 120 therebetween to facilitate a cutting process in a subsequent cutting process.
The first surface 111 includes a sensing region and a non-sensing region surrounding the sensing region, the pixel 113 is disposed in the sensing region, and a pad (not shown) is disposed in the non-sensing region and electrically connected to the pixel 113, and the pad is used for electrically connecting to an external circuit.
It should be noted that the cutting channel 120 between two adjacent fingerprint identification chips 11 is only a margin area reserved between two fingerprint identification chips 11 for cutting, and there is no actual boundary line between the cutting channel 120 and the fingerprint identification chips 11 on both sides.
Step s 2: referring to fig. 4, a front surface 111 of the wafer 100 to be packaged is covered with a transparent layer 121. In this step, a transparent layer 121 is fixed on the surface of the wafer 100 to be packaged by adhesive.
Step s 3: referring to fig. 5, the surface of the light-transmitting layer 121 is covered with the optical filter 124.
Step s 4: referring to fig. 6, the light-shielding layer 122 is covered on the surface of the filter 124, and in this step, the light-shielding layer 122 is fixed on the surface of the filter 124 by adhesive. For example, an adhesive layer may be formed on the surface of the light shielding layer 122 facing the optical filter 124 and/or the optical filter 124 by a spraying, spin coating or pasting process, and then the optical filter 124 and the light shielding layer 122 are pressed together and bonded by the adhesive layer. The adhesive layer can realize the adhesive function and also can play the insulating and sealing functions. The adhesive layer may be a polymer adhesive material, such as a polymer material, e.g., silicone, epoxy, benzocyclobutene, etc.
Step s 5: referring to fig. 7, a plurality of light holes 1221 are etched in the light-shielding layer 122 using the optical filter 124 as a blocking layer.
Step s 6: referring to fig. 8, the light-transmitting layer 123 is covered on the surface of the light-shielding layer 122, and in this step, the light-transmitting layer 123 is fixed on the surface of the light-shielding layer 122 by an adhesive. The transparent layer 123 may cover only the top opening of the transparent hole 1221, or may cover the entire surface of the light-shielding layer 122.
Step s 7: referring to fig. 9, a plurality of condensing lenses 125 are formed on the surface of the transparent layer 123, and each condensing lens 125 corresponds to one transparent hole 1221.
Step s 8: the wafer 100, the light-transmitting layer 121, the optical filter 124, the light-shielding layer 122 and the light-transmitting layer 123 are divided by a cutting process, and when the wafer is cut, the wafer is cut along the direction of the cutting channels 120, so that the package structures 10 of the fingerprint identification chips 11 are formed. The cutting can be performed by a slicing knife or a laser cutting, and the slicing knife can be performed by a metal knife or a resin knife.
In the whole packaging process, the processes of wafer thinning, bonding pad manufacturing, wiring layer manufacturing and the like can be included, and the scheme is not repeated.
In addition, after the wafer 200 to be packaged is packaged, the chip package structure obtained by subsequent dicing can be connected to an external circuit through an external bump (not shown).
In summary, the optical filter is used as the blocking layer, and the light holes are made in the light shielding layer, so that on one hand, the formed cylindrical light shielding body can better shield and absorb the excessive oblique light, and the formed image of the object is clearer; on the other hand, the optical filter can filter out stray light outside the detection light band; on the other hand, the method can improve the processing efficiency and is suitable for wafer-level packaging.
The aspects, embodiments, features and examples of the present invention should be considered as illustrative in all respects and not intended to be limiting of the invention, the scope of which is defined only by the claims. Other embodiments, modifications, and uses will be apparent to those skilled in the art without departing from the spirit and scope of the claimed invention.
The use of headings and sections in this application is not meant to limit the invention; each section may apply to any aspect, embodiment, or feature of the disclosure.
Throughout this application, where a composition is described as having, containing, or comprising specific components or where a process is described as having, containing, or comprising specific process steps, it is contemplated that the composition of the present teachings also consist essentially of, or consist of, the recited components, and the process of the present teachings also consist essentially of, or consist of, the recited process steps.
In this application, where an element or component is referred to as being included in and/or selected from a list of recited elements or components, it is understood that the element or component can be any one of the recited elements or components and can be selected from a group consisting of two or more of the recited elements or components. Moreover, it should be understood that elements and/or features of the compositions, apparatus, or methods described herein may be combined in various ways, whether explicitly described or implicitly described herein, without departing from the spirit and scope of the present teachings.
Unless specifically stated otherwise, use of the terms "comprising", "including", "having" or "having" is generally to be understood as open-ended and not limiting.
The use of the singular herein includes the plural (and vice versa) unless specifically stated otherwise. Furthermore, the singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise. In addition, where the term "about" is used before a quantity, the present teachings also include the particular quantity itself unless specifically stated otherwise.
It should be understood that the order of steps or the order in which particular actions are performed is not critical, so long as the teachings of the invention remain operable. Further, two or more steps or actions may be performed simultaneously.
It is to be understood that the figures and descriptions of the present invention have been simplified to illustrate elements that are relevant for a clear understanding of the present invention, while eliminating, for purposes of clarity, other elements. However, those skilled in the art will recognize that these and other elements may be desirable. However, because such elements are well known in the art, and because they do not facilitate a better understanding of the present invention, a discussion of such elements is not provided herein. It should be understood that the figures are presented for illustrative purposes and not as construction diagrams. The omission of details and modifications or alternative embodiments is within the scope of one skilled in the art.
It is to be understood that in certain aspects of the invention, a single component may be replaced by multiple components and that multiple components may be replaced by a single component to provide an element or structure or to perform a given function or functions. Except where such substitution would not operate to practice a particular embodiment of the invention, such substitution is considered within the scope of the invention.
While the invention has been described with reference to illustrative embodiments, it will be understood by those skilled in the art that various other changes, omissions and/or additions may be made and substantial equivalents may be substituted for elements thereof without departing from the spirit and scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from its scope. Therefore, it is intended that the invention not be limited to the particular embodiment disclosed for carrying out this invention, but that the invention will include all embodiments falling within the scope of the appended claims. Moreover, unless specifically stated any use of the terms first, second, etc. do not denote any order or importance, but rather the terms first, second, etc. are used to distinguish one element from another.
Claims (15)
1. A packaging method of a fingerprint identification chip is characterized by comprising the following steps:
providing a fingerprint identification chip, wherein the fingerprint identification chip is provided with a front surface and a back surface which are opposite, and the front surface is provided with a plurality of pixel points for collecting fingerprint information;
sequentially manufacturing a first light-transmitting layer and a light shielding layer on the front side of the fingerprint identification chip;
and etching the light shielding layer by taking the first light transmitting layer as a barrier to form a plurality of light transmitting holes, wherein each light transmitting hole corresponds to one pixel point respectively.
2. The packaging method of the fingerprint identification chip of claim 1, wherein the first transparent layer is an optical filter.
3. The packaging method of the fingerprint identification chip of claim 1, further comprising forming a second transparent layer,
the second light-transmitting layer is positioned between the fingerprint identification chip and the first light-transmitting layer.
4. The packaging method of the fingerprint identification chip as claimed in claim 1, further comprising forming a third transparent layer on the surface of the light shielding layer,
the third euphotic layer covers the euphotic hole.
5. The packaging method of the fingerprint identification chip of claim 4, further comprising forming a condensing lens on the surface of the third transparent layer,
the condensing lens corresponds to the light transmission hole.
6. The packaging method of the fingerprint identification chip as claimed in claim 1, wherein the light shielding layer is made of monocrystalline silicon, or polycrystalline silicon, or amorphous silicon, or silicon germanium, or silicon carbide.
7. The packaging method of the fingerprint identification chip as claimed in claim 1, wherein the first transparent layer and the light shielding layer are fixed by adhesive.
8. The packaging method of the fingerprint identification chip of claim 1, wherein the fingerprint identification chip is an optical type fingerprint identification chip.
9. A packaging method of a fingerprint identification chip is characterized by comprising the following steps:
providing a wafer, wherein the wafer is provided with a plurality of fingerprint identification chips, the fingerprint identification chips are provided with a front surface and a back surface which are opposite, and the front surface is provided with a plurality of pixel points for collecting fingerprint information;
sequentially manufacturing a first light-transmitting layer and a light shielding layer on the front side of the fingerprint identification chip;
etching the light shielding layer by taking the first light transmitting layer as a barrier to form a plurality of light transmitting holes, wherein each light transmitting hole corresponds to one pixel point;
and cutting the wafer through a cutting process to form a plurality of single-grain packaging structures.
10. A packaging structure of a fingerprint identification chip is characterized by comprising:
the fingerprint identification chip is provided with a front surface and a back surface which are opposite, and the front surface of the fingerprint identification chip is provided with a plurality of pixel points for collecting fingerprint information;
the fingerprint identification chip comprises a second light-transmitting layer, a light filter and a light shielding layer which are sequentially formed on the front surface of the fingerprint identification chip, wherein a plurality of light-transmitting holes are formed in the light shielding layer, and each light-transmitting hole corresponds to one pixel point.
11. The package structure of the fingerprint identification chip of claim 10, further comprising a third transparent layer covering the transparent hole.
12. The package structure of fingerprint identification chip of claim 11, further comprising a condensing lens formed on the surface of the third transparent layer,
the condensing lens corresponds to the light transmission hole.
13. The package structure of the fingerprint identification chip of claim 10, wherein the light shielding layer is made of monocrystalline silicon, polycrystalline silicon, amorphous silicon, silicon germanium, or silicon carbide.
14. The package structure of the fingerprint identification chip of claim 10, wherein the first transparent layer and the light shielding layer are fixed by adhesive.
15. The package structure of fingerprint identification chip of claim 10, wherein said fingerprint identification chip is an optical type fingerprint identification chip.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010135510.5A CN111192941A (en) | 2020-03-02 | 2020-03-02 | Packaging structure and method of fingerprint identification chip |
| PCT/CN2020/120855 WO2021174861A1 (en) | 2020-03-02 | 2020-10-14 | Packaging structure and method for fingerprint recognition chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010135510.5A CN111192941A (en) | 2020-03-02 | 2020-03-02 | Packaging structure and method of fingerprint identification chip |
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| CN111192941A true CN111192941A (en) | 2020-05-22 |
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| CN202010135510.5A Pending CN111192941A (en) | 2020-03-02 | 2020-03-02 | Packaging structure and method of fingerprint identification chip |
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| CN (1) | CN111192941A (en) |
| WO (1) | WO2021174861A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021174861A1 (en) * | 2020-03-02 | 2021-09-10 | 苏州晶方半导体科技股份有限公司 | Packaging structure and method for fingerprint recognition chip |
| CN113764440A (en) * | 2020-06-03 | 2021-12-07 | 格科微电子（上海）有限公司 | Method for manufacturing optical fingerprint device |
| WO2022041145A1 (en) * | 2020-08-28 | 2022-03-03 | 深圳市汇顶科技股份有限公司 | Fingerprint recognition apparatus and electronic device |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109255285A (en) * | 2017-07-13 | 2019-01-22 | 三星电子株式会社 | Based on optical fingerprint sensor, include its electronic device and its operating method |
| US10763296B2 (en) * | 2017-11-22 | 2020-09-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Biometric sensor and methods thereof |
| US10796128B2 (en) * | 2017-12-12 | 2020-10-06 | Fingerprint Cards Ab | Optical sensor with ambient light filter |
| CN107910344B (en) * | 2017-12-18 | 2021-02-23 | 苏州晶方半导体科技股份有限公司 | Packaging structure and packaging method of optical fingerprint identification chip |
| CN108321215A (en) * | 2018-03-07 | 2018-07-24 | 苏州晶方半导体科技股份有限公司 | The encapsulating structure and preparation method thereof of optical finger print identification chip |
| CN208902907U (en) * | 2018-11-15 | 2019-05-24 | 固安翌光科技有限公司 | Optical film, fingerprint identification device and lighting screen body |
| CN110770745B (en) * | 2019-06-05 | 2023-09-05 | 深圳市汇顶科技股份有限公司 | Optical fingerprint device and electronic equipment |
| CN211555920U (en) * | 2020-03-02 | 2020-09-22 | 苏州晶方半导体科技股份有限公司 | Packaging structure of fingerprint identification chip |
| CN111192941A (en) * | 2020-03-02 | 2020-05-22 | 苏州晶方半导体科技股份有限公司 | Packaging structure and method of fingerprint identification chip |
-
2020
- 2020-03-02 CN CN202010135510.5A patent/CN111192941A/en active Pending
- 2020-10-14 WO PCT/CN2020/120855 patent/WO2021174861A1/en active Application Filing
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021174861A1 (en) * | 2020-03-02 | 2021-09-10 | 苏州晶方半导体科技股份有限公司 | Packaging structure and method for fingerprint recognition chip |
| CN113764440A (en) * | 2020-06-03 | 2021-12-07 | 格科微电子（上海）有限公司 | Method for manufacturing optical fingerprint device |
| WO2022041145A1 (en) * | 2020-08-28 | 2022-03-03 | 深圳市汇顶科技股份有限公司 | Fingerprint recognition apparatus and electronic device |
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| WO2021174861A1 (en) | 2021-09-10 |
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