WO2021174861A1 - Structure d'encapsulation et procédé pour puce de reconnaissance d'empreintes digitales - Google Patents

Structure d'encapsulation et procédé pour puce de reconnaissance d'empreintes digitales Download PDF

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Publication number
WO2021174861A1
WO2021174861A1 PCT/CN2020/120855 CN2020120855W WO2021174861A1 WO 2021174861 A1 WO2021174861 A1 WO 2021174861A1 CN 2020120855 W CN2020120855 W CN 2020120855W WO 2021174861 A1 WO2021174861 A1 WO 2021174861A1
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WIPO (PCT)
Prior art keywords
light
fingerprint identification
identification chip
transmitting
layer
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PCT/CN2020/120855
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English (en)
Chinese (zh)
Inventor
王凯厚
杨剑宏
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苏州晶方半导体科技股份有限公司
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Publication of WO2021174861A1 publication Critical patent/WO2021174861A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0216—Coatings
    • H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
    • H01L31/02164—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors for shielding light, e.g. light blocking layers, cold shields for infrared detectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0216—Coatings
    • H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
    • H01L31/02165—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors using interference filters, e.g. multilayer dielectric filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention belongs to the field of semiconductor technology, and specifically relates to a fingerprint identification chip packaging structure and packaging method.
  • fingerprint identification technology Due to the uniqueness and immutability of fingerprints, fingerprint identification technology has many advantages such as good security, high reliability, and simple use. Therefore, fingerprint recognition technology has become the mainstream technology for identity verification of various electronic devices.
  • the optical fingerprint recognition chip is one of the commonly used fingerprint recognition chips in existing electronic devices. It collects the user's fingerprint information through a large number of photosensitive pixels (pixels) in the fingerprint recognition area, and each photosensitive pixel serves as a detection. Specifically, during fingerprint recognition, light is irradiated on the fingerprint surface of the user and reflected to the photosensitive pixel through the fingerprint surface. The photosensitive pixel converts the optical signal of the fingerprint into an electrical signal, and fingerprint information can be obtained based on the electrical signal converted by all pixels.
  • a transparent cover is generally directly arranged on the photosensitive side.
  • the transparent cover plate is completely light-transmissive, it will cause crosstalk of the sensing results of different photosensitive pixels, which affects the accuracy of fingerprint recognition.
  • Chinese patent application CN108022904A discloses a method for packaging a fingerprint identification chip, which fixes a cover plate with a through-hole structure on the side of the wafer facing the pixels to avoid crosstalk problems.
  • the existing problems include at least: the through holes on the cover plate need to be formed in advance, and then the cover plate with the through holes is bonded to the chip surface, but this takes a long time for the operation process, and it also requires the position of the through holes and the pixel points to be calibrated. Errors are easy to occur; if the through hole is made after the cover plate and the chip are combined, there is no obstruction between the cover plate and the chip, and it is easy to cause damage to the pixels located under the through hole.
  • An embodiment of the present invention provides a fingerprint identification chip packaging structure and method, which are used to solve the technical problems of long processing time and easy pixel damage in the existing technology, including:
  • a method for packaging a fingerprint identification chip including:
  • the fingerprint identification chip has opposite front and back sides, and the front side has a plurality of pixels for collecting fingerprint information;
  • the first light-transmitting layer and the light-shielding layer are sequentially fabricated on the front side of the fingerprint identification chip;
  • the first light-transmitting layer is used as a barrier to etch the light-shielding layer to form a plurality of light-transmitting holes, and each of the light-transmitting holes corresponds to one pixel point.
  • the first light-transmitting layer is a light filter.
  • it further includes fabricating a second light-transmitting layer
  • the second light-transmitting layer is located between the fingerprint identification chip and the first light-transmitting layer.
  • it further includes forming a third light-transmitting layer on the surface of the light-shielding layer,
  • the third light-transmitting layer covers the light-transmitting hole.
  • it further includes fabricating a condenser lens on the surface of the third light-transmitting layer,
  • the condenser lens corresponds to the light transmission hole.
  • the light shielding layer is made of monocrystalline silicon, or polycrystalline silicon, or amorphous silicon, or silicon germanium, or silicon carbide.
  • the first light-transmitting layer and the light-shielding layer are glued together.
  • the fingerprint identification chip is an optical fingerprint identification chip.
  • a method for packaging a fingerprint identification chip including:
  • the fingerprint identification chip has opposite front and back sides, and the front side has a plurality of pixels for collecting fingerprint information;
  • the first light-transmitting layer and the light-shielding layer are sequentially fabricated on the front side of the fingerprint identification chip;
  • the first light-transmitting layer as a barrier to etch the light-shielding layer to form a plurality of light-transmitting holes, each of the light-transmitting holes corresponding to one of the pixel points;
  • the wafer is cut to form a plurality of single-chip package structures.
  • a packaging structure of a fingerprint identification chip including:
  • the fingerprint identification chip has opposite front and back sides, and the front side has multiple pixels for collecting fingerprint information;
  • the second light-transmitting layer, the light filter and the light-shielding layer are sequentially formed on the front surface of the fingerprint identification chip.
  • a plurality of light-transmitting holes are formed on the light-shielding layer, and each light-transmitting hole corresponds to one pixel point.
  • it further includes a third light-transmitting layer covering the light-transmitting hole.
  • it further includes a condenser lens formed on the surface of the third light-transmitting layer,
  • the condenser lens corresponds to the light transmission hole.
  • the light shielding layer is made of monocrystalline silicon, or polycrystalline silicon, or amorphous silicon, or silicon germanium, or silicon carbide.
  • the first light-transmitting layer and the light-shielding layer are glued together.
  • the fingerprint identification chip is an optical fingerprint identification chip.
  • the present invention uses a filter as a barrier layer to make light-transmitting holes in the light-shielding layer.
  • the formed cylindrical light-shielding body better shields and absorbs excess oblique light, so that the object can form an image. Clearer; on the other hand, the filter can filter out stray light outside the detection light band; on the other hand, it can improve the processing efficiency and is suitable for wafer-level packaging.
  • FIG. 1 is a cross-sectional view of the package structure in Embodiment 1 of the present application.
  • FIGS. 2 to 9 are schematic diagrams of intermediate structures formed by the package structure in Embodiment 1 of the present application.
  • the packaging structure 10 includes a fingerprint identification chip 11 and a cover plate 12.
  • the fingerprint identification chip 11 has a front side 111 and a back side 112 opposite to each other, and the front side has a plurality of pixels 113 for collecting fingerprint information.
  • the cover plate 12 covers the front surface 111 of the fingerprint identification chip 11.
  • the fingerprint identification chip 11 is an optical fingerprint identification chip.
  • the cover 12 includes a light-transmitting layer 121, a filter 124, a light-shielding layer 122 and a light-transmitting layer 123 sequentially covering the front surface 111 of the fingerprint identification chip 11.
  • the light-transmitting layer 121 covers the front surface 111 of the fingerprint recognition chip 11 and is used to protect the front surface of the fingerprint recognition chip 11 to be packaged. Since light is required to pass through the light-transmitting layer 121 to reach the pixel points 113, the light-transmitting layer 121 has a relatively high light-transmitting property and is a light-transmitting material. Both surfaces of the light-transmitting layer 121 are flat and smooth, and will not scatter or diffuse the incident light.
  • the material of the light-transmitting layer 121 may be dry film, inorganic glass, organic glass, or other light-transmitting materials with specific strength.
  • the light-transmitting layer 121 and the front surface 111 of the fingerprint identification chip 11 are fixed by glue.
  • the thickness of the light-transmitting layer 121 is preferably 5-20 ⁇ m.
  • the filter 124 is used to filter out stray light outside the detection light band, so as to reduce the interference of stray light and improve the accuracy of fingerprint recognition.
  • the filter 124 may only cover the upper portion corresponding to the pixel point 113, or may cover the entire surface of the light-transmitting layer 121.
  • the filter 124 and the light-transmitting layer 121 are bonded and fixed by a DAF film.
  • the light-shielding layer 122 is provided with a plurality of light-transmitting holes 1221 communicating up and down.
  • Each light-transmitting hole 1221 corresponds to a pixel 113.
  • the axis of the light-transmitting hole 1221 coincides with the center of the pixel 113.
  • the light-shielding layer 122 has a relatively low dielectric constant.
  • the material of the light-shielding layer 122 is preferably a silicon material, which can be monocrystalline silicon, or polycrystalline silicon, or amorphous silicon, or silicon germanium, or silicon carbide.
  • the light-shielding layer 122 may be formed on the surface of the light-transmitting layer 121 by physical deposition.
  • the thickness of the light-shielding layer 122 is preferably 4-20 ⁇ m, and when the light-transmitting hole is a circular hole, its aperture is preferably 30-40 ⁇ m, and the aspect ratio is preferably 1:1 to 1.5:1.
  • the light shielding layer 122 is made of silicon material, which can reduce the crosstalk problem between adjacent pixels 113 on the one hand.
  • the light-shielding layer 122 made of silicon material generally has a Mohs hardness of more than 10, with high hardness and high mechanical strength. When pressed by a finger, thickness deformation will not occur, and the accuracy of fingerprint recognition will not be affected.
  • the projection of the light-transmitting hole 1221 on the front 111 at least overlaps with the projection of the corresponding pixel 113 on the front 111.
  • the projection of the transparent hole 1221 on the front 111 can be set to completely cover the projection of the corresponding pixel 113 on the front 111.
  • the projection of the light-transmitting hole 1221 on the front side 111 can be set to completely coincide with the projection of the corresponding pixel point 113 on the front side 111.
  • the front surface 111 includes a sensing area and a non-sensing area surrounding the sensing area.
  • the pixel 113 is arranged in the sensing area; the non-sensing area is provided with a pad (not shown) electrically connected to the pixel 113, and the pad is used for electrical connection with an external circuit.
  • the fingerprint recognition chip 11 is a capacitive fingerprint recognition chip
  • the pixel 113 detects the capacitance value and converts the capacitance value into an electrical signal.
  • the external circuit can obtain fingerprint information according to the electrical signal, perform identity recognition, and transmit light.
  • the holes 1221 are used to expose the pixels, and the light-shielding layer 122 has a lower dielectric constant, which can reduce the problem of crosstalk between adjacent pixels and improve the accuracy of fingerprint recognition.
  • the fingerprint recognition chip 11 is an optical fingerprint recognition chip
  • the pixel 113 collects fingerprint information in a predetermined area opposite to the light transmission hole 1221 through the corresponding light transmission hole 1221. Since each pixel 113 collects the fingerprint information of its relative collection area through the corresponding light-transmitting hole 1221, the mutual crosstalk between the preset areas corresponding to different pixels is avoided, thereby avoiding the distortion of the fingerprint image, and further improving the fingerprint Accuracy of recognition.
  • the shape of the light transmission hole 1221 may be a circular through hole, a square through hole or a triangular through hole.
  • the shape of the transparent hole 1221 may be a circular hole with the same top and bottom, or a square hole with the same top and bottom, or a triangular hole with the same top and bottom, or a polygon with the same top and bottom of other structures.
  • the bottom of the light-transmitting hole 1221 is the opening of the light-transmitting hole 1221 close to the pixel point 113
  • the top of the light-transmitting hole 1221 is the opening of the light-transmitting hole 1221 away from the pixel point 113.
  • the shape of the light-transmitting hole 1221 can also be a round hole with a different top and bottom, a square hole with a different top and bottom, or a triangular hole with a different top and bottom, or the top of other structures. A polygon that is not the same as the bottom.
  • the top of the light-transmitting hole 1221 is larger than the bottom of the light-transmitting hole 1221.
  • the bottom of the light-transmitting hole 1221 is the opening of the light-transmitting hole 1221 close to the pixel point 113
  • the top of the light-transmitting hole 1221 is the opening of the light-transmitting hole 1221 away from the pixel point 113.
  • the light shielding layer 122 and the filter 124 are bonded and fixed by a DAF film.
  • the light-transmitting layer 123 covers the side of the light-shielding layer 122 facing away from the front surface 111 for shielding the opening of the light-transmitting hole 1221. Since light is required to pass through the light-transmitting layer 123 to reach the pixel points 113, the light-transmitting layer 123 has high light-transmitting properties and is a light-transmitting material. Both surfaces of the light-transmitting layer 123 are flat and smooth, and will not scatter or diffuse the incident light.
  • the material of the light-transmitting layer 123 may be dry film, inorganic glass, organic glass, or other light-transmitting materials with specific strength.
  • the thickness of the light-transmitting layer 123 is preferably 10-40 microns.
  • the light-transmitting layer 123 and the light-shielding layer 122 are fixed by glue.
  • a plurality of condensing lenses 125 are provided on the side of the light-transmitting layer 123 away from the front 111 of the fingerprint identification chip 11, and each condensing lens 125 corresponds to a light-transmitting hole 1221, and the condensing lens 125 is used to condense external light to the corresponding pixel. Point 113 on the surface.
  • the condensing lens 125 can be manufactured by photolithography and baking molding. In another embodiment, the condensing lens 125 can also be formed on the surface of the light-transmitting layer 123 by embossing.
  • FIGS. 2 to 9 are schematic diagrams of intermediate structures formed during the packaging process of the packaging method according to the embodiment of the present invention.
  • Step s1 Referring to FIGS. 2 and 3, provide a wafer to be packaged 100, wherein FIG. 2 is a schematic top view of the structure of the wafer to be packaged 100, and FIG. 3 is a cross-sectional view along A-A of FIG.
  • the wafer 100 to be packaged has a front surface 111 and a back surface 112 opposite to the front surface 111.
  • the wafer 100 includes a plurality of fingerprint recognition chips 11 arranged in an array.
  • Each adjacent fingerprint identification chip 11 has a plurality of pixels 13 for collecting fingerprint information.
  • the pixel 13 is located on the front side 111.
  • the first surface 111 includes a sensing area and a non-sensing area surrounding the sensing area.
  • the pixel point 113 is arranged in the sensing area, and a pad (not shown) is arranged in the non-sensing area.
  • the pad is electrically connected to the pixel point 113, and the pad is used for To be electrically connected to an external circuit.
  • the cutting channel 120 between two adjacent fingerprint identification chips 11 is only a blank area reserved between the two fingerprint identification chips 11 for cutting, and the cutting channel 120 is connected to the fingerprints on both sides. There is no actual boundary line between the identification chips 11.
  • Step s2 cover the light-transmitting layer 121 on the front surface 111 of the wafer 100 to be packaged.
  • the light-transmitting layer 121 is fixed on the surface of the wafer 100 to be packaged by glue.
  • Step s3 referring to FIG. 5, a filter 124 is covered on the surface of the light-transmitting layer 121.
  • Step s4 referring to FIG. 6, the light shielding layer 122 is covered on the surface of the filter 124.
  • the light shielding layer 122 is fixed on the surface of the filter 124 by glue.
  • an adhesive layer may be formed by spraying, spin coating or pasting, and then the filter 124 and the light shielding layer 122 is relatively pressed together and joined by an adhesive layer.
  • the adhesive layer can not only achieve the bonding effect, but also play the role of insulation and sealing.
  • the adhesive layer may be a polymer adhesive material, such as polymer materials such as silica gel, epoxy resin, and benzocyclobutene.
  • Step s5 referring to FIG. 7, the light-shielding layer 122 is etched to form a plurality of light-transmitting holes 1221 using the filter 124 as a blocking layer.
  • Step s6 referring to FIG. 8, the surface of the light-shielding layer 122 is covered with the light-transmitting layer 123.
  • the light-transmitting layer 123 is fixed on the surface of the light-shielding layer 122 by glue.
  • the light-transmitting layer 123 may only cover the top opening of the light-transmitting hole 1221, or may cover the entire surface of the light-shielding layer 122.
  • Step s7 Referring to FIG. 9, a plurality of condenser lenses 125 are fabricated on the surface of the light-transmitting layer 123, and each condenser lens 125 corresponds to a light-transmitting hole 1221.
  • Step s8 Divide the wafer 100, the light-transmitting layer 121, the light filter 124, the light-shielding layer 122, and the light-transmitting layer 123 through a dicing process, and perform cutting along the direction of the cutting channel 120 to form a plurality of fingerprints during cutting. Identify the package structure 10 of the chip 11.
  • the cutting can be cut with a slicing knife or laser cutting, and the slicing knife can be cut with a metal knife or a resin knife.
  • the entire packaging process it can also include wafer thinning, solder pad production, wiring layer production and other processes, which will not be repeated in this case.
  • the chip package structure obtained by subsequent cutting can be connected to an external circuit through external bumps (not shown).
  • the present invention uses a filter as a barrier layer to make light-transmitting holes on the light-shielding layer.
  • the formed cylindrical light-shielding body better shields and absorbs excess oblique light, making the image of the object clearer.
  • the filter can filter out the stray light outside the detection light band; on the other hand, it can improve the processing efficiency and is suitable for wafer-level packaging.
  • composition taught by the present invention is also basically The above is composed of or composed of the described components, and the process taught by the present invention is basically composed of the described process steps or a set of described process steps.
  • a single component may be replaced by multiple components and multiple components may be replaced by a single component to provide an element or structure or perform one or several given functions. This substitution is considered to be within the scope of the present invention except where it is substituted here that will not operate to practice the specific embodiments of the present invention.

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
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  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
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Abstract

L'invention concerne une structure d'encapsulation et un procédé d'encapsulation. Le procédé d'encapsulation consiste à : fournir une puce de reconnaissance d'empreinte digitale, la puce de reconnaissance d'empreinte digitale ayant une face avant et une face arrière opposées l'une à l'autre, la face avant ayant une pluralité de points de pixel pour acquérir des informations d'empreinte digitale ; fabriquer séquentiellement une première couche de transmission de lumière et une couche de protection contre la lumière sur la face avant de la puce de reconnaissance d'empreinte digitale ; et utiliser la première couche de transmission de lumière en tant que bloc pour graver la couche de protection contre la lumière, de manière à former une pluralité de trous de transmission de lumière, chacun des trous de transmission de lumière correspondant à l'un des points de pixel. Dans la présente invention, un filtre optique est utilisé comme couche de blocage, et des trous de transmission de lumière sont fabriqués sur la couche de protection contre la lumière, de telle sorte qu'un corps de protection contre la lumière en colonne formé protège mieux et absorbe la lumière oblique inutile, la fabrication d'une image formée d'un objet plus clair, le filtre optique peut filtrer la lumière parasite à l'extérieur d'une bande de lumière de détection, et l'efficacité de traitement du procédé peut être augmentée, étant appropriée pour une encapsulation de niveau tranche.
PCT/CN2020/120855 2020-03-02 2020-10-14 Structure d'encapsulation et procédé pour puce de reconnaissance d'empreintes digitales WO2021174861A1 (fr)

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CN202010135510.5A CN111192941A (zh) 2020-03-02 2020-03-02 指纹识别芯片的封装结构和方法

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CN111192941A (zh) * 2020-03-02 2020-05-22 苏州晶方半导体科技股份有限公司 指纹识别芯片的封装结构和方法
CN113764440A (zh) * 2020-06-03 2021-12-07 格科微电子（上海）有限公司 光学指纹器件的制造方法
WO2022041145A1 (fr) * 2020-08-28 2022-03-03 深圳市汇顶科技股份有限公司 Appareil de reconnaissance d'empreintes digitales et dispositif électronique

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CN107910344A (zh) * 2017-12-18 2018-04-13 苏州晶方半导体科技股份有限公司 一种光学指纹识别芯片的封装结构以及封装方法
CN108321215A (zh) * 2018-03-07 2018-07-24 苏州晶方半导体科技股份有限公司 光学指纹识别芯片的封装结构及其制作方法
CN208902907U (zh) * 2018-11-15 2019-05-24 固安翌光科技有限公司 光学膜、指纹识别装置和照明屏体
CN110770745A (zh) * 2019-06-05 2020-02-07 深圳市汇顶科技股份有限公司 光学指纹装置和电子设备
CN111192941A (zh) * 2020-03-02 2020-05-22 苏州晶方半导体科技股份有限公司 指纹识别芯片的封装结构和方法
CN211555920U (zh) * 2020-03-02 2020-09-22 苏州晶方半导体科技股份有限公司 指纹识别芯片的封装结构

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