CN107910344A - A kind of encapsulating structure and method for packing of optical finger print identification chip - Google Patents
A kind of encapsulating structure and method for packing of optical finger print identification chip Download PDFInfo
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- CN107910344A CN107910344A CN201711364625.6A CN201711364625A CN107910344A CN 107910344 A CN107910344 A CN 107910344A CN 201711364625 A CN201711364625 A CN 201711364625A CN 107910344 A CN107910344 A CN 107910344A
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- finger print
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- optical finger
- print identification
- identification chip
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- 230000003287 optical effect Effects 0.000 title claims abstract description 162
- 238000000034 method Methods 0.000 title claims abstract description 60
- 238000012856 packing Methods 0.000 title claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 119
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 53
- 229910052710 silicon Inorganic materials 0.000 claims description 53
- 239000010703 silicon Substances 0.000 claims description 53
- 239000011521 glass Substances 0.000 claims description 44
- 238000003384 imaging method Methods 0.000 claims description 23
- 229910000679 solder Inorganic materials 0.000 claims description 15
- 229920002120 photoresistant polymer Polymers 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 13
- 238000005520 cutting process Methods 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 5
- 230000004313 glare Effects 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 18
- 238000005538 encapsulation Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 7
- 238000001914 filtration Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000011514 reflex Effects 0.000 description 3
- 239000005357 flat glass Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000000750 progressive effect Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000003325 tomography Methods 0.000 description 1
- 238000010200 validation analysis Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14623—Optical shielding
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1324—Sensors therefor by using geometrical optics, e.g. using prisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1463—Pixel isolation structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14687—Wafer level processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Human Computer Interaction (AREA)
- Theoretical Computer Science (AREA)
- Multimedia (AREA)
- Optics & Photonics (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
The invention discloses a kind of encapsulating structure and method for packing of optical finger print identification chip, in the encapsulating structure and method for packing of the optical finger print identification chip that technical solution of the present invention provides, in the front of optical finger print identification chip, cover board is set, the substrate includes substrate and light shield layer, the light shield layer is set away from a side surface of the optical finger print identification chip in substrate, the substrate has the first through hole of multiple photosensitive pixels for being used to expose the optical finger print identification chip, the light shield layer has and one-to-one second through hole of the first through hole, when carrying out fingerprint recognition, the light subregion that finger can be reflected by the one-to-one first through hole and second through hole, crosstalk is produced to reduce the sensing result of different photosensitive pixels, improve the precision of fingerprint recognition.
Description
Technical field
The present invention relates to chip encapsulation technology field, more specifically, being related to a kind of encapsulation of optical finger print identification chip
Structure and method for packing.
Background technology
It is continuous progressive with science and technology, more and more electronic equipments be widely used in daily life with
And among work, huge facility is brought for daily life and work, becomes the indispensable weight of current people
Want instrument.And being continuously increased with electronic functionalities, the important information of electronic equipment storage are also more and more, electronic equipment
Identity validation technology become current electronic equipment research and development a Main way.
Since fingerprint has uniqueness and consistency so that fingerprint identification technology have that security is good, reliability is high and
Using it is simple many advantages, such as.Therefore, fingerprint identification technology becomes the mainstream skill that various electronic equipments instantly carry out authentication
Art.
At present, optical finger print identification chip is one of common fingerprint recognition chip of existing electronic equipment, it passes through fingerprint
A large amount of photosensitive pixels (pixel) of cog region gather the finger print information of user, and each photosensitive pixel is as a detection.Tool
Body, when carrying out fingerprint recognition, light exposes to the fingerprint face of user and reflexes to photosensitive pixel, light-sensitive image by fingerprint face
The optical signal of fingerprint is converted to electric signal by element, and finger print information can be obtained according to the electric signal that all pixels are changed.
Existing optical finger print identification chip generally directly directly sets transparent cover plate in encapsulation in photosensitive side.But
What it is due to transparent cover plate is complete printing opacity, and the sensing result of different photosensitive pixels can be caused to produce crosstalk, influence fingerprint recognition
Precision.
The content of the invention
To solve the above-mentioned problems, technical solution of the present invention provide a kind of encapsulating structure of optical finger print identification chip with
And method for packing, the sensing result for solving the problems, such as different photosensitive pixels produce crosstalk, improve the precision of fingerprint recognition.
To achieve these goals, the present invention provides following technical solution：
A kind of encapsulating structure of optical finger print identification chip, the encapsulating structure include：
Optical finger print identification chip, has opposite front and the back side, its front has fingerprint identification area and encirclement
The external zones of the fingerprint identification area, the fingerprint identification area have multiple photosensitive pixels, and the external zones has and the sense
The weld pad that light pixel is electrically connected；
The cover board being oppositely arranged with the front of the optical finger print identification chip；
The cover board includes substrate and light shield layer；The substrate, which has, multiple is used to expose the first logical of the photosensitive pixel
Hole；The light shield layer be located at the substrate deviate from the optical finger print identification chip side, the light shield layer have it is multiple with
The first through hole opposite the second through hole one by one.
Preferably, have in above-mentioned encapsulating structure, between the cover board and the optical finger print identification chip default
Spacing, the image distance of pinhole imaging system is carried out for adjusting the cover board.
Preferably, in above-mentioned encapsulating structure, there is optical filter between the cover board and the optical finger print identification chip
Glass, for filtering out the veiling glare outside detection optical band.
Preferably, in above-mentioned encapsulating structure, the cover board is set away from a side surface of the optical finger print identification chip
Glass of color filter is equipped with, for filtering out the veiling glare outside detection optical band.
Preferably, in above-mentioned encapsulating structure, the periphery of the periphery of the cover board and the optical finger print identification chip it
Between have preset thickness distance piece.
Preferably, in above-mentioned encapsulating structure, the position that the substrate corresponds to the weld pad has for exposing the weldering
First opening of pad；
The position that the light shield layer corresponds to first opening has the second opening for being used for exposing first opening；
The weld pad is used to be open by described first and second opening is electrically connected with a metal wire, to pass through
The pad of the metal wire and a backboard is electrically connected.
Preferably, in above-mentioned encapsulating structure, first opening includes the first groove and positioned at first groove
The second interior groove, first groove and second groove are used to expose the weld pad.
Preferably, in above-mentioned encapsulating structure, the back side of the optical finger print identification chip corresponds to the position of the weld pad
With silicon hole, the silicon hole is used to expose the weld pad；
The back side of the side wall of the silicon hole and the optical finger print identification chip is covered with insulating layer；
The surface of insulating layer is electrical by the silicon hole and the weld pad covered with wiring layer again, the wiring layer again
Connection, and extend to the outside of the silicon hole；
For the wiring layer again covered with solder mask, the solder mask is opposite with the back side of the optical finger print identification chip
Region has opening, and the opening is used to set solder-bump, is electrically connected with the pad by the solder-bump and a backboard
Connect.
Preferably, in above-mentioned encapsulating structure, the substrate is silicon substrate.
Preferably, in above-mentioned encapsulating structure, the light shield layer is photoresist dry film or photoresist wet film.
Preferably, in above-mentioned encapsulating structure, the depth-to-width ratio of the first through hole is not more than 6:1.
Preferably, in above-mentioned encapsulating structure, the depth-to-width ratio of second through hole is not more than 6:1.
Preferably, in above-mentioned encapsulating structure, the thickness of the substrate is not more than 200 μm.
Preferably, in above-mentioned encapsulating structure, the thickness of the light shield layer is not more than 200 μm.
Preferably, in above-mentioned encapsulating structure, the substrate is bonded solid with the optical finger print identification chip by DAF films
It is fixed.
Preferably, in above-mentioned encapsulating structure, the photosensitive pixel array is arranged, the first through hole and the pixel one
One corresponds to.
Present invention also offers a kind of method for packing, for making the encapsulating structure described in any of the above-described, the encapsulation
Method includes：
Wafer is provided, the wafer includes multiple optical finger print identification chips；The optical finger print identification chip has phase
To front and the back side, its front has fingerprint identification area and surrounds external zones of the fingerprint identification area, the fingerprint
Cog region has multiple photosensitive pixels, and the external zones has the weld pad being electrically connected with the photosensitive pixel；
The fixed substrate on the wafer；
In the substrate light shield layer is formed away from a side surface of the optical finger print identification chip；
The light shield layer is patterned, forms multiple the second through holes through the light shield layer；
Using the patterned light shield layer as mask layer, the substrate is patterned, is formed and led to through the first of the substrate
Hole；The first through hole is used to expose the weld pad, and is corresponded with second through hole；
By cutting technique, the wafer, the substrate and the light shield layer are cut, forms the encapsulation knot of multiple simple grains
Structure；
Wherein, the wafer is cut into multiple optical finger print identification chips；The substrate and the light shield layer are cut into
The multiple and one-to-one part of optical finger print identification chip.
Preferably, in above-mentioned method for packing, the fixed substrate on the wafer includes:
The substrate and the Wafer alignment are pressed, the positive predeterminable area of each optical finger print identification chip
Predeterminable area with the substrate is adhesively fixed；
Wherein, there is default spacing between the substrate and the optical finger print identification chip, for adjust cover board into
The image distance of row pinhole imaging system, the cover board include the substrate and the light shield layer.
Preferably, in above-mentioned method for packing, formed after the first through hole, further included：
The light shield layer away from the substrate a side surface be bonded glass of color filter, the glass of color filter with it is described
Optical finger print identification chip corresponds.
Preferably, in above-mentioned method for packing, have between the periphery of the substrate and the optical finger print identification chip
Distance piece, the thickness of the distance piece are equal to the spacing.
Preferably, in above-mentioned method for packing, the distance piece is used to the substrate and the optical finger print be adhesively fixed
Identification chip.
Preferably, in above-mentioned method for packing, the fixed substrate on the wafer includes:
In the front of each optical finger print identification chip, a glass of color filter is fixed in fitting；
The substrate is fixed on the glass of color filter surface, the substrate covers all glass of color filter；
Wherein, the thickness of the glass of color filter to have between the substrate and the optical finger print identification chip pre-
If spacing, the image distance of pinhole imaging system is carried out for adjusting cover board, the cover board includes the substrate and the light shield layer.
Preferably, in above-mentioned method for packing, the light shield layer is photoresist dry film or photoresist wet film, passes through exposure imaging
Technique is formed and one-to-one second through hole of the photosensitive pixel on the light shield layer；
The substrate is silicon substrate, and using the light shield layer as mask layer, the first through hole is formed using silicon etching process.
Preferably, in above-mentioned method for packing, while second through hole is formed, using exposure imaging technique in institute
State the second opening of position formation that light shield layer corresponds to the weld pad；Based on the described second opening, using etching technics in the base
The position that the weld pad is corresponded on plate forms the first opening, for exposing the weld pad；
Wherein, the weld pad is used to be open by described first and second opening is electrically connected with a metal wire,
To be electrically connected by the pad of the metal wire and a backboard.
Preferably, in above-mentioned method for packing, further include：
Before cutting, silicon hole, the silicon are formed away from a side surface of the substrate in the optical finger print identification chip
Through hole is used to expose the weld pad；
Form the side wall for covering the silicon hole and the insulating layer at the optical finger print identification chip back side；
The wiring layer again for covering the insulating layer is formed, the wiring layer again is electrical by the silicon hole and the weld pad
Connection, and extend to the outside of the silicon hole；
Form the solder mask of wiring layer again described in covering, the back side phase of the solder mask and the optical finger print identification chip
To region there is opening, for setting solder-bump, the solder-bump is used for and the pad of a backboard is electrically connected.
The encapsulating structure and envelope of the optical finger print identification chip provided by foregoing description, technical solution of the present invention
In dress method, cover board is set in the front of optical finger print identification chip, the substrate includes substrate and light shield layer, deviates from substrate
One side surface of the optical finger print identification chip sets the light shield layer, and the substrate has multiple for exposing the optics
The first through hole of the photosensitive pixel of fingerprint recognition chip, the light shield layer have logical with the first through hole one-to-one second
Hole, when carrying out fingerprint recognition, can be reflected finger by the one-to-one first through hole and second through hole
Light subregion, produces crosstalk to reduce the sensing result of different photosensitive pixels, improves the precision of fingerprint recognition.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is attached drawing needed in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
The embodiment of invention, for those of ordinary skill in the art, without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 a are a kind of structure diagram of the encapsulating structure of optical finger print identification chip provided in an embodiment of the present invention；
Fig. 1 b are the structure diagram of the encapsulating structure of another optical finger print identification chip provided in an embodiment of the present invention；
Fig. 2 a are the schematic diagram of the encapsulating structure of another optical finger print identification chip provided in an embodiment of the present invention；
Fig. 2 b are the schematic diagram of the encapsulating structure of another optical finger print identification chip provided in an embodiment of the present invention；
Fig. 3 a are the schematic diagram of the encapsulating structure of another optical finger print identification chip provided in an embodiment of the present invention；
Fig. 3 b are the schematic diagram of the encapsulating structure of another optical finger print identification chip provided in an embodiment of the present invention；
Fig. 4 a are the schematic diagram of the encapsulating structure of another optical finger print identification chip provided in an embodiment of the present invention；
Fig. 4 b are the schematic diagram of the encapsulating structure of another optical finger print identification chip provided in an embodiment of the present invention；
Fig. 5 a- Figure 10 is a kind of flow diagram of method for packing provided in an embodiment of the present invention；
Figure 11-Figure 14 is the flow diagram for another method for packing that inventive embodiments provide.
Embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment, belongs to the scope of protection of the invention.
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, it is below in conjunction with the accompanying drawings and specific real
Applying mode, the present invention is described in further detail.
With reference to figure 1a, Fig. 1 a are a kind of structure of the encapsulating structure of optical finger print identification chip provided in an embodiment of the present invention
Schematic diagram, the encapsulating structure include：Optical finger print identification chip 11, has opposite front 111 and the back side 112, its front
111 have fingerprint identification area and surround the external zones of the fingerprint identification area, and the fingerprint identification area has multiple light-sensitive images
Element 113, the external zones have the weld pad 114 being electrically connected with the photosensitive pixel 113；With the optical finger print identification chip
The cover board that 11 front 111 is oppositely arranged, the cover board include substrate 12 and light shield layer 13, and the substrate 12 has multiple use
In the first through hole T1 for exposing the photosensitive pixel 113；The light shield layer 13 is located at the substrate 12 and deviates from the optical finger print
The side of identification chip 11, the light shield layer 13 have multiple second through hole T2 opposite one by one with the first through hole T1.
Optionally, the optical finger print identification chip 11 further includes transparent film layer, and the transparent film layer covers its front, uses
In to planarize its outer surface, to protect photosensitive pixel 113 and be pasted easy to optical finger print identification chip 11 and other structures part
Close and fix.By using the transparent film layer with setting refractive index, the transparent film layer can also be multiplexed with antireflection layer increasing
Add light transmission rate.The transparent film layer covers the photosensitive pixel 113, and exposes the weld pad 114.
In encapsulating structure described in the embodiment of the present invention, the aperture of the first through hole T1 and the hole of the second through hole T12
Footpath is identical, or the aperture less than the second through hole T2.The center face of the first through hole T1 and the second through hole T2
Set.
There is first through hole T1 opposite one by one with the second through hole T2 in the cover board, the aperture of first through hole T1 is with second
The aperture of through hole T2 is in the same order of magnitude with the size of the photosensitive pixel 113, and it is smaller also just to have a talk about the aperture of the two,
So so that the cover board has the function of pinhole imaging system by first through hole T1 with the second through hole T2, the cover board by aperture into
As function opponent's digital reflex light is regulated and controled, the cross-interference issue between different photosensitive pixels 113 is reduced, improves fingerprint recognition
Precision.As shown in Figure 1a, there is default spacing, for adjusting between the cover board and the optical finger print identification chip 11
The image distance that cover board carries out pinhole imaging system is stated, the image distance is set by setting the spacing, so that the fingerprint of photosensitive pixel 13
Picture quality is preferable, can be by specifically testing or testing the suitable spacing of effect selection, and then selects suitable image distance,
The embodiment of the present invention is not specifically limited the spacing.
The encapsulating structure further includes glass of color filter L, and the glass of color filter L, which is used to filter out, to be detected outside optical band
Veiling glare, to reduce light disturbance, improves the precision of fingerprint recognition.
In mode shown in Fig. 1 a, the cover board is provided with optical filtering away from a side surface of the optical finger print identification chip 11
Sheet glass L, the glass of color filter L only cover photosensitive pixel 113, expose the weld pad 114.At this time, the periphery of the cover board
There is the distance piece J of preset thickness between the periphery of the optical finger print identification chip 11.The thickness of the distance piece J is equal to
The spacing, the image distance that pinhole imaging system is carried out with the cover board match.Which is by adjusting the thickness of the distance piece J
Realize and adjust the image distance that the cover board carries out pinhole imaging system, in order to regulate and control light.In which, the distance piece J is used to glue
The fixed substrate 12 of knot and the optical finger print identification chip 11.
As shown in Figure 1 b, Fig. 1 b are another optical finger print identification chip provided in an embodiment of the present invention to another way
The structure diagram of encapsulating structure, in which, has the filter between the cover board and the optical finger print identification chip 11
Mating plate glass L, at this time, the thickness of the glass of color filter L are equal to the spacing, and the image distance of pinhole imaging system is carried out with the cover board
Matching, the image distance which can be achieved the adjustment cover board and carry out pinhole imaging system by adjusting the thickness of glass of color filter L, with
Easy to regulate and control light.
In mode shown in Fig. 1 a and Fig. 1 b, the position that the substrate 12 corresponds to the weld pad 114 is described with being used to expose
First opening K1 of weld pad 114；The light shield layer 13, which corresponds to the first opening K1 positions and has to be used to exposing described first, to be opened
The second opening K2 of mouth K1；The weld pad 114 is used for by the described first opening K1 and the second opening K2 and a metal
Line is electrically connected, to be electrically connected by the pad of the metal wire and a backboard., can be with when being electrically connected with the backboard
The metal wire, the first opening K1 and the second opening K2 are covered by plastic packaging layer.
In mode shown in Fig. 1 a and Fig. 1 b, the first opening K1 includes the first groove Ka and positioned at first groove
The second groove Kb, the first groove Ka and the second groove Kb in Ka are used to exposing the weld pad 114, and described second
The depth of groove Kb is less than the thickness of the substrate 12.
Optionally, the backboard is pcb board or ceramic substrate or glass substrate.The substrate 12 is silicon substrate.Institute
It is photoresist dry film or photoresist wet film to state light shield layer 13, the second through hole T2 can be formed by photoetching process, while may be used also
To be multiplexed with the mask layer of the substrate 12, for forming the first through hole T1.
In encapsulating structure described in the embodiment of the present invention, the depth-to-width ratio of the first through hole T1 is not more than 6:1.Described second is logical
The depth-to-width ratio of hole T2 is not more than 6:1.The thickness of the substrate 12 is not more than 200 μm.The thickness of the light shield layer 13 is not more than 200
μm.In this way, pinhole imaging system can be realized with the cover board of relatively small thickness.
Optionally, the substrate 12 is adhesively fixed with the optical finger print identification chip 11 by DAF films.Optical filter at this time
Glass is located at the side surface that light shield layer 13 deviates from the optical finger print identification chip 11.When glass of color filter is located at 12 He of substrate
When between optical finger print identification chip 11, the glass of color filter can be set to pass through with the optical finger print identification chip 11
DAF films are adhesively fixed, and substrate 12 is fitted in glass of color filter away from the surface of the side of the optical finger print identification chip 11.
113 array arrangement of photosensitive pixel, in order to farthest avoid the crosstalk between different photosensitive pixels 113 from asking
Topic, can set the first through hole T1 to be corresponded with the pixel 113.
In mode shown in Fig. 1 a and Fig. 1 b, using conducting wire technique so that the weld pad 114 of the optical finger print identification chip 11
It is electrically connected with the pad of the backboard, in other embodiments, can also passes through TSV (silicon hole) technique so that the light
The pad of the weld pad 114 and the backboard of learning fingerprint recognition chip 11 is electrically connected.Since silicon hole is through optical finger print identification
The back side of chip 11, without forming the opening for exposing weld pad 114 on the cover board, therefore can set glass of color filter L and lid
Board size is identical, covers the front of whole optical finger print identification chip 11.At this time, the encapsulating structure can be such as Fig. 2 a- Fig. 4 b
It is shown.
With reference to figure 2a, Fig. 2 a are showing for the encapsulating structure of another optical finger print identification chip provided in an embodiment of the present invention
It is intended to, in the embodiment, the position that the back side of the optical finger print identification chip 11 corresponds to the weld pad 114 has silicon hole
GT, the silicon hole GT are used to expose the weld pad 114.The side wall of the silicon hole GT and the optical finger print identification chip
The back side covered with insulating layer 21；21 surface of insulating layer is covered with wiring layer 22 again, and the wiring layer again 22 is by described
Silicon hole GT is electrically connected with the weld pad 114, and extends to the outside of the silicon hole GT；The wiring layer again 21 covered with
Solder mask 23, the solder mask 23 region opposite with the back side 11 of the optical finger print identification chip 11 have opening, are used for
Solder-bump 24 is set, to be electrically connected by the pad of 24 and one backboard of solder-bump.The solder-bump 24 is in institute
State opening and the wiring layer again 22 is electrically connected.The solder-bump 24 can be tin ball, with the pad solder.The party
In formula, also there is glue-line, so that the two is adhesively fixed between the optical finger print identification chip 11 and the backboard.
In Fig. 2 a illustrated embodiments, pass through TSV (silicon hole) technique optical finger print identification chip 11 and the back of the body
Plate binding is electrically connected.In which, the silicon hole GT is double step through hole, which includes：Positioned at the light
The groove GT1 at the back side 112 of fingerprint recognition chip 11 is learned, the depth of groove GT1 is less than the optical finger print identification chip 11
Thickness；And the through hole GT2 in the groove GT1, through hole GT2 run through the optical finger print identification chip 11, use
In exposing the weld pad 114.The corresponding groove GT1 of multiple through hole GT2 of 11 the same side of optical finger print identification chip can be one
Body structure.
In mode shown in Fig. 2 a, glass of color filter L is located at the side that cover board deviates from the optical finger print identification chip 11
Surface.At this time, there is distance piece J, the thickness by setting distance piece J adjusts lid between cover board and optical finger print identification chip 11
Plate carries out the image distance of pinhole imaging system.Which is double step silicon hole.
Pass through double step silicon hole so that the weld pad 114 of the optical finger print identification chip 11 and the pad of the backboard
During electric connection, encapsulating structure can also as shown in Figure 2 b, and Fig. 2 b know for another optical finger print provided in an embodiment of the present invention
The schematic diagram of the encapsulating structure of other chip, Fig. 2 b are glass of color filter L being arranged on cover board and optical finger print with Fig. 2 a differences
Between identification chip 11, by setting the thickness of glass of color filter L to adjust the image distance that cover board carries out pinhole imaging system.
When make it that optical finger print identification chip 11 binds electric connection with the backboard using TSV techniques, the silicon leads to
The structure of hole GT can also be straight hole as shown in Figure 3a, and Fig. 3 a identify for another optical finger print provided in an embodiment of the present invention
The schematic diagram of the encapsulating structure of chip, the width of the straight hole in a first direction is constant, and the first direction is perpendicular to described
Optical finger print identification chip 11, the back side of optical finger print identification chip 11 is directed toward by the front 111 of optical finger print identification chip 11
112.In which, glass of color filter is located at the side surface that cover board deviates from optical finger print identification chip 11.At this time, cover board and light
There is distance piece J between fingerprint recognition chip 11.
When the silicon hole GT is straight hole, as shown in Figure 3b, Fig. 3 b refer to for another optics provided in an embodiment of the present invention
The schematic diagram of the encapsulating structure of line identification chip, can also set glass of color filter to be located at cover board and optical finger print identification chip 11
Between.
When make it that optical finger print identification chip 11 binds electric connection with the backboard using TSV techniques, the silicon leads to
The structure of hole GT can also be trapezoidal hole as shown in fig. 4 a, and Fig. 4 a know for another optical finger print provided in an embodiment of the present invention
The schematic diagram of the encapsulating structure of other chip, the width of the trapezoidal hole in a first direction gradually increase, and the first direction hangs down
Directly in the optical finger print identification chip 11, optical finger print identification chip is directed toward by the front 111 of optical finger print identification chip 11
11 back side 112.In which, glass of color filter is located at the side surface that cover board deviates from optical finger print identification chip 11.At this time,
There is distance piece J between cover board and optical finger print identification chip 11.
When the silicon hole GT is trapezoidal hole, as shown in Figure 4 b, Fig. 4 b are another optics provided in an embodiment of the present invention
The schematic diagram of the encapsulating structure of fingerprint recognition chip, can also set glass of color filter to be located at cover board and optical finger print identification chip
Between 11.
In encapsulating structure described in the embodiment of the present invention, it can use and set front openings on the cover board to expose the weld pad
114, as illustrated in figs. 1A and ib, can also be by being arranged on optical finger print identification chip in order to be electrically connected external circuit
The interconnection architecture at 11 back sides, the interconnection architecture are used to be electrically connected external circuit, and the interconnection architecture includes interconnection layer, described
Interconnection layer includes the insulating layer 21, again wiring layer 22 and solder mask 23.
By foregoing description, in encapsulating structure described in the embodiment of the present invention, in optical finger print identification chip 11 just
Face 111 sets the substrate 12 with first through hole T1, deviates from a side surface of the optical finger print identification chip 11 in substrate 12
Light shield layer 13 is set, the light shield layer 13 have with the one-to-one second through hole T2 of the first through hole T1, pass through described the
One through hole T1 and the second through hole T2, can cause the light that special angle reflects by cover board, into fingerprint identification area, control
Opticpath, avoids crosstalk, and first through hole T1 can be corresponded with the photosensitive pixel 113, can also a first through hole
T1 corresponds to multiple photosensitive pixels 113.
, can be by hand by the one-to-one first through hole T1 and the second through hole T2 when carrying out fingerprint recognition
The light subregion of digital reflex, produces crosstalk to reduce the sensing result of different photosensitive pixels, improves the precision of fingerprint recognition.
Based on above-mentioned encapsulating structure embodiment, another embodiment of the present invention additionally provides a kind of method for packing, for light
Learn fingerprint recognition chip to be packaged, form the encapsulating structure described in above-described embodiment, the method for packing such as Fig. 5 a- Figure 10 institutes
Show, Fig. 5 a- Figure 10 is a kind of flow diagram of method for packing provided in an embodiment of the present invention, which includes：
Step S11：As shown in figure 5 a and 5b, there is provided wafer 10.
Fig. 5 a correspond to optical finger print for the wafer 10 and identify the positive top view of core, and Fig. 5 b are wafer shown in Fig. 5 a in A-
The sectional drawing of A '.The wafer 10 includes multiple optical finger print identification chips 11.The optical finger print identification chip 11 has phase
To front 111 and the back side 112, its front 111 has fingerprint identification area and surrounds external zones of the fingerprint identification area.
The fingerprint identification area has multiple photosensitive pixels 113, and the external zones has the weldering being electrically connected with the photosensitive pixel 113
Pad 114；There is cutting raceway groove 20 between the adjacent optical finger print identification chip 11.
Step S12：As shown in fig. 6, the fixed substrate 12 on the wafer 10.
In the step, a kind of mode of the fixed substrate 10 on the wafer 10 is:By the substrate 12 with it is described
The contraposition pressing of wafer 10, the positive predeterminable area of each optical finger print identification chip 11 are default with the substrate 12
Area bonded is fixed, so that after cutting, in each encapsulating structure, each fingerprint recognition chip 11 of learning is and after corresponding segmentation
Cover board is adhesively fixed；Wherein, there is default spacing, for adjusting between the substrate 12 and the optical finger print identification chip 11
The image distance that cover board carries out pinhole imaging system is saved, the cover board includes the substrate and following light shield layers.
Which is bonded positive periphery of the substrate 12 directly with each optical finger print identification chip 11 by distance piece J
It is fixed.There is distance piece, the thickness of the distance piece between the periphery and the substrate 12 of the optical finger print identification chip 11
The image distance that pinhole imaging system is carried out with the cover board matches.In which, Fig. 6 cover plates directly and each optical finger print identification chip
11 positive periphery is adhesively fixed.
Optionally, the substrate 12 is silicon substrate.The substrate 12 is mask with the light shield layer 13 in subsequent step
Layer, the first through hole T1 is formed using silicon etching process.
Step S13：As shown in fig. 7, deviate from a side surface shape of the optical finger print identification chip 11 in the substrate 12
Into light shield layer 13.
Optionally, the light shield layer 13 is photoresist dry film or photoresist wet film, in order to aobvious by exposing in subsequent step
Shadow technique is formed and the one-to-one second through hole T2 of the photosensitive pixel 113 on the light shield layer 13.
Step S14：As shown in figure 8, pattern the light shield layer 13, multiple second leading to through the light shield layer 13 are formed
Hole T2.
Step S15：As shown in figure 9, being mask layer with the patterned light shield layer 13, the substrate 12, shape are patterned
Into the first through hole T1 through the substrate 12.
The first through hole T1 is used to expose the weld pad 114, and is corresponded with the second through hole T2.
Step S16：As shown in Figure 10, by cutting technique, the wafer 10, the substrate 12 and the shading are cut
Layer 13, forms the encapsulating structure of multiple simple grains.
Wherein, the wafer 10 is cut into multiple optical finger print identification chips 11；The substrate 12 and the light shield layer 13
It is cut into the multiple and 11 one-to-one part of optical finger print identification chip.
Formed after the first through hole T1, the method for packing further includes：Deviate from the substrate in the light shield layer 13
12 side surface fitting glass of color filter L, the encapsulating structure of formation as shown in Figure 1a, the glass of color filter L and the light
Fingerprint recognition chip is learned to correspond.At this point it is possible to before being cut in each 11 corresponding region of optical finger print identification chip
Glass of color filter L is bonded, optical filter can also be bonded in each 11 corresponding region of optical finger print identification chip after dicing
Glass L.
In method for packing shown in Fig. 5 a- Figure 10, the periphery of the substrate 12 and the optical finger print identification chip 11 it
Between with the thickness of distance piece J, the distance piece J be equal to the spacing.The distance piece J is used to the substrate 12 be adhesively fixed
With the optical finger print identification chip 11.
In method for packing described in the embodiment of the present invention, the light shield layer 13 is photoresist dry film or photoresist wet film, passes through exposure
Photo development processes are formed and the one-to-one second through hole T2 of the photosensitive pixel 113 on the light shield layer 13；It is described
Substrate 11 is silicon substrate, is mask layer with the light shield layer 13, and the first through hole T1 is formed using silicon etching process.
In method for packing shown in Fig. 5 a- Figure 10, while the second through hole T2 is formed, using exposure imaging technique
The position that the weld pad 114 is corresponded in the light shield layer 13 forms the second opening K2；Based on the described second opening K2, using etching
The position that technique corresponds to the weld pad on the substrate forms the first opening K1, for exposing the weld pad 114；Wherein, institute
State weld pad 114 to be used to pass through the described first opening K1 and the second opening K2 and metal wire electric connection, to pass through
The pad for stating metal wire and a backboard is electrically connected.Wherein, the first opening is with the first groove Ka and recessed positioned at described first
The second groove Kb in groove Ka.The first opening K1 can be formed in the synchronization for forming first through hole T1.
In other embodiments, each optics can also be corresponded to before the 10 above-mentioned fixation of the wafer substrate 12
Fingerprint recognition chip 11 is bonded glass of color filter L, and at this time, the fixed substrate 12 on the wafer 10 includes:In each institute
The front 111 for stating optical finger print identification chip 11 is bonded and fixes a glass of color filter L；Consolidate on the glass of color filter L surfaces
The fixed substrate 12, the substrate 12 cover all glass of color filter L；Wherein, the thickness of the glass of color filter L causes
There is default spacing between the substrate 12 and the optical finger print identification chip 11, pinhole imaging system is carried out for adjusting cover board
Image distance, the same cover board includes the substrate 12 and the light shield layer 13, finally formed encapsulating structure such as Fig. 1 b institutes
Show.
In method for packing described in the embodiment of the present invention, being set in the front 111 of optical finger print identification chip has first to lead to
The substrate 12 of hole T1 and the light shield layer 13 with the second through hole T2, can effectively avoid the string between different photosensitive pixels 113
Problem is disturbed, improves fingerprint recognition precision.Meanwhile the light shield layer 13 is also used as the mask layer of substrate 12, simplify technique stream
Journey, reduces cost of manufacture.
The method for packing further includes：Backboard is set away from the side of the substrate in the optical finger print identification chip,
The backboard includes metallic circuit layer and the pad being electrically connected with the metallic circuit layer；Wherein, the weld pad with it is described
Pad is electrically connected, to be electrically connected by backboard and external circuit.The optical finger print identification chip can by conducting wire with
Backboard binding is electrically connected.
In other modes, can also by TSV techniques encapsulating structure the back side formed interconnection architecture, in order to backboard
Binding is electrically connected, and to be electrically connected by backboard and external circuit, finally formed encapsulating structure is as shown in Fig. 2 a- Fig. 4 b.
As make as shown in Fig. 2 a- Fig. 4 a encapsulating structure, the production method as shown in figures 11-14, when formation first
After through hole T1 and the second through hole T2, further include：
Step S21：As shown in figure 11, before cutting, the one of the substrate 12 is deviated from the optical finger print identification chip 11
Side surface forms silicon hole GT, the silicon hole GT for exposing the weld pad 114.
In the step, wafer 10 is caused so that cover board is set downward, in order to form the silicon hole GT.Figure 11 with
Illustrated exemplified by double step through hole, which includes：Positioned at the back side 112 of the optical finger print identification chip 11
The groove GT1 and through hole GT2 in the groove GT1.
Step S22：As shown in figure 12, the side wall for covering the silicon hole GT and the optical finger print identification chip are formed
The insulating layer 21 at 11 back sides.
Step S23：As shown in figure 13, wiring layer 22 again for covering the insulating layer 21 are formed, the wiring layer again 22 is logical
Cross the silicon hole GT to be electrically connected with the weld pad 114, and extend to the exterior of the silicon hole GT
Step S24：As shown in figure 14, the solder mask 23 of wiring layer 22 again described in covering, the solder mask 23 and institute are formed
The opposite region in the back side for stating optical finger print identification chip 11 has opening, for setting solder-bump 24, the solder-bump
24 are used to be electrically connected with the pad of a backboard.
After forming back side interconnection architecture at the back side of wafer, the back side interconnection architecture of wafer is precut first, will
Interconnection layer (including insulating layer, again wiring layer and solder mask) is split.Can be described pre- along cutting raceway groove progress by laser
Cutting.Complete with after cutting, then by cutter being cut backboard and wafer.Since the material of interconnection layer is more crisp, ductility with
And toughness is poor, back side interconnection layer is precut using laser, the infringement to interconnection layer can be reduced, avoid its crack or
It is tomography, ensures the reliability of chip.The material hardness of wafer, substrate and light shield layer is same or like, same to use cutter
The trace precut along laser is cut, it is ensured that is cut the flatness of end face, is avoided section from damaging.
After cutting, glass of color filter L is bonded, the encapsulating structure of formation is as shown in Figure 2 a.For encapsulation shown in Fig. 2 b- Fig. 4 b
Structure, the shape difference lies in silicon hole GT is different, and the position of glass of color filter is different, and forming process may be referred to above-mentioned
Description, details are not described herein.
Method for packing described in the embodiment of the present invention can be used for making encapsulating structure described in above-described embodiment, and technique is simple,
Low manufacture cost, the encapsulating structure of formation avoid the cross-interference issue between different photosensitive pixels, improve the essence of fingerprint recognition
Degree.
Each embodiment is described by the way of progressive in this specification, what each embodiment stressed be and other
The difference of embodiment, between each embodiment identical similar portion mutually referring to.For encapsulation disclosed in embodiment
For method, due to its with embodiment disclosed in encapsulating structure it is corresponding, so description is fairly simple, related part is referring to envelope
Assembling structure part illustrates.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or use the present invention.
A variety of modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and the principles and novel features disclosed herein phase one
The most wide scope caused.
Claims (25)
1. a kind of encapsulating structure of optical finger print identification chip, it is characterised in that the encapsulating structure includes：
Optical finger print identification chip, has opposite front and the back side, its front has described in fingerprint identification area and encirclement
The external zones of fingerprint identification area, the fingerprint identification area have multiple photosensitive pixels, and the external zones has and the light-sensitive image
The weld pad that element is electrically connected；
The cover board being oppositely arranged with the front of the optical finger print identification chip；
The cover board includes substrate and light shield layer；The substrate has multiple first through hole for being used to expose the photosensitive pixel；
The light shield layer be located at the substrate deviate from the optical finger print identification chip side, the light shield layer have it is multiple with it is described
First through hole opposite the second through hole one by one.
2. encapsulating structure according to claim 1, it is characterised in that the cover board and the optical finger print identification chip it
Between there is default spacing, the image distance of pinhole imaging system is carried out for adjusting the cover board.
3. encapsulating structure according to claim 1, it is characterised in that the cover board and the optical finger print identification chip it
Between there is glass of color filter, for filter out detection optical band outside veiling glare.
4. encapsulating structure according to claim 1, it is characterised in that the cover board deviates from the optical finger print identification chip
A side surface be provided with glass of color filter, for filter out detection optical band outside veiling glare.
5. encapsulating structure according to claim 1, it is characterised in that the periphery of the cover board is identified with the optical finger print
There is the distance piece of preset thickness between the periphery of chip.
6. encapsulating structure according to claim 1, it is characterised in that the position that the substrate corresponds to the weld pad has use
In the first opening for exposing the weld pad；
The position that the light shield layer corresponds to first opening has the second opening for being used for exposing first opening；
The weld pad is used to be open by described first and second opening is electrically connected with a metal wire, with by described
The pad of metal wire and a backboard is electrically connected.
7. encapsulating structure according to claim 6, it is characterised in that first opening includes the first groove and is located at
The second groove in first groove, first groove and second groove are used to expose the weld pad.
8. encapsulating structure according to claim 1, it is characterised in that the back side of the optical finger print identification chip corresponds to institute
Stating the position of weld pad has silicon hole, and the silicon hole is used to expose the weld pad；
The back side of the side wall of the silicon hole and the optical finger print identification chip is covered with insulating layer；
The surface of insulating layer is electrically connected covered with wiring layer again, the wiring layer again by the silicon hole and the weld pad
Connect, and extend to the outside of the silicon hole；
The wiring layer again is covered with solder mask, the solder mask region opposite with the back side of the optical finger print identification chip
With opening, the opening is used to set solder-bump, to be electrically connected by the pad of the solder-bump and a backboard.
9. encapsulating structure according to claim 1, it is characterised in that the substrate is silicon substrate.
10. encapsulating structure according to claim 1, it is characterised in that the light shield layer is that photoresist dry film or photoresist are wet
Film.
11. encapsulating structure according to claim 1, it is characterised in that the depth-to-width ratio of the first through hole is not more than 6:1.
12. encapsulating structure according to claim 1, it is characterised in that the depth-to-width ratio of second through hole is not more than 6:1.
13. encapsulating structure according to claim 1, it is characterised in that the thickness of the substrate is not more than 200 μm.
14. encapsulating structure according to claim 1, it is characterised in that the thickness of the light shield layer is not more than 200 μm.
15. encapsulating structure according to claim 1, it is characterised in that the substrate and the optical finger print identification chip
It is adhesively fixed by DAF films.
16. encapsulating structure according to claim 1, it is characterised in that the photosensitive pixel array arrangement, described first is logical
Hole is corresponded with the pixel.
A kind of 17. method for packing, for making such as claim 1-16 any one of them encapsulating structures, it is characterised in that institute
Stating method for packing includes：
Wafer is provided, the wafer includes multiple optical finger print identification chips；The optical finger print identification chip has opposite
Front and the back side, its front have fingerprint identification area and surround the external zones of the fingerprint identification area, the fingerprint recognition
Area has multiple photosensitive pixels, and the external zones has the weld pad being electrically connected with the photosensitive pixel；
The fixed substrate on the wafer；
In the substrate light shield layer is formed away from a side surface of the optical finger print identification chip；
The light shield layer is patterned, forms multiple the second through holes through the light shield layer；
Using the patterned light shield layer as mask layer, the substrate is patterned, forms the first through hole through the substrate；Institute
State first through hole to be used to expose the weld pad, and corresponded with second through hole；
By cutting technique, the wafer, the substrate and the light shield layer are cut, forms the encapsulating structure of multiple simple grains；
Wherein, the wafer is cut into multiple optical finger print identification chips；The substrate and the light shield layer are cut into multiple
With the one-to-one part of optical finger print identification chip.
18. method for packing according to claim 17, it is characterised in that the fixed substrate on the wafer includes:
The substrate and the Wafer alignment are pressed, the positive predeterminable area of each optical finger print identification chip with
The predeterminable area of the substrate is adhesively fixed；
Wherein, there is default spacing between the substrate and the optical finger print identification chip, it is small for adjusting cover board progress
The image distance of borescopic imaging, the cover board include the substrate and the light shield layer.
19. method for packing according to claim 18, it is characterised in that formed after the first through hole, further included：
In the light shield layer glass of color filter, the glass of color filter and the optics are bonded away from a side surface of the substrate
Fingerprint recognition chip corresponds.
20. method for packing according to claim 19, it is characterised in that the substrate and the optical finger print identification chip
Periphery between there is distance piece, the thickness of the distance piece is equal to the spacing.
21. method for packing according to claim 20, it is characterised in that the distance piece is used to the substrate be adhesively fixed
With the optical finger print identification chip.
22. method for packing according to claim 17, it is characterised in that the fixed substrate on the wafer includes:
In the front of each optical finger print identification chip, a glass of color filter is fixed in fitting；
The substrate is fixed on the glass of color filter surface, the substrate covers all glass of color filter；
Wherein, the thickness of the glass of color filter to have between the substrate and the optical finger print identification chip default
Spacing, the image distance of pinhole imaging system is carried out for adjusting cover board, and the cover board includes the substrate and the light shield layer.
23. method for packing according to claim 17, it is characterised in that the light shield layer is that photoresist dry film or photoresist are wet
Film, is formed and one-to-one second through hole of the photosensitive pixel by exposure imaging technique on the light shield layer；
The substrate is silicon substrate, and using the light shield layer as mask layer, the first through hole is formed using silicon etching process.
24. method for packing according to claim 23, it is characterised in that while second through hole is formed, use
The position that exposure imaging technique corresponds to the weld pad in the light shield layer forms the second opening；Based on the described second opening, use
The position that etching technics corresponds to the weld pad on the substrate forms the first opening, for exposing the weld pad；
Wherein, the weld pad is used to be open by described first and second opening is electrically connected with a metal wire, with logical
The pad for crossing the metal wire and a backboard is electrically connected.
25. method for packing according to claim 17, it is characterised in that further include：
Before cutting, silicon hole, the silicon hole are formed away from a side surface of the substrate in the optical finger print identification chip
For exposing the weld pad；
Form the side wall for covering the silicon hole and the insulating layer at the optical finger print identification chip back side；
The wiring layer again for covering the insulating layer is formed, the wiring layer again is electrically connected by the silicon hole and the weld pad
Connect, and extend to the outside of the silicon hole；
The solder mask of wiring layer, the solder mask are opposite with the back side of the optical finger print identification chip again described in formation covering
Region has opening, and for setting solder-bump, the solder-bump is used for and the pad of a backboard is electrically connected.
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| CN201711364625.6A CN107910344B (en) | 2017-12-18 | 2017-12-18 | Packaging structure and packaging method of optical fingerprint identification chip |
| US16/210,989 US10817700B2 (en) | 2017-12-18 | 2018-12-05 | Optical fingerprint recognition chip package and packaging method |
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| CN201711364625.6A CN107910344B (en) | 2017-12-18 | 2017-12-18 | Packaging structure and packaging method of optical fingerprint identification chip |
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