CN108807446A - A kind of encapsulating structure and packaging method of optical finger print chip - Google Patents
A kind of encapsulating structure and packaging method of optical finger print chip Download PDFInfo
- Publication number
- CN108807446A CN108807446A CN201810869265.3A CN201810869265A CN108807446A CN 108807446 A CN108807446 A CN 108807446A CN 201810869265 A CN201810869265 A CN 201810869265A CN 108807446 A CN108807446 A CN 108807446A
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- cover board
- finger print
- silicon cover
- optical finger
- print chip
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- 230000003287 optical effect Effects 0.000 title claims abstract description 144
- 238000000034 method Methods 0.000 title claims abstract description 85
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 59
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 124
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 124
- 239000010703 silicon Substances 0.000 claims abstract description 124
- 238000005538 encapsulation Methods 0.000 claims description 36
- 238000005520 cutting process Methods 0.000 claims description 33
- 239000004568 cement Substances 0.000 claims description 22
- 230000002093 peripheral effect Effects 0.000 claims description 20
- 230000009467 reduction Effects 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims description 2
- 238000001914 filtration Methods 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000010586 diagram Methods 0.000 description 11
- 239000010410 layer Substances 0.000 description 10
- 239000011241 protective layer Substances 0.000 description 5
- 230000006870 function Effects 0.000 description 4
- 238000009832 plasma treatment Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14687—Wafer level processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The invention discloses a kind of encapsulating structure and packaging method of optical finger print chip, the encapsulating structure includes：Optical finger print chip, it includes multiple photosensitive pixels and the weld pad that is electrically connected with the photosensitive pixel that the optical finger print chip, which has opposite first surface and second surface, the first surface,；Silicon cover board, the silicon cover board are bonded fixation with the first surface, and the silicon cover board has multiple through-holes being oppositely arranged one by one with the photosensitive pixel；Wherein, the photosensitive pixel of the optical finger print chip is used to be formed the reference position of the through-hole as the silicon cover board.The encapsulating structure uses the silicon cover board with through-hole as collimator, which is fixed on the optical finger print chip, can be using the optical finger print chip as contraposition reference standard, and alignment process is simple, reduces the production cost.
Description
Technical field
The present invention relates to chip encapsulation technology fields, more specifically, being related to a kind of encapsulating structure of optical finger print chip
And packaging method.
Background technology
With the continuous development of science and technology, more and more electronic equipments are widely used in daily life
And in work, huge facility is brought for daily life and work, it is indispensable to become current people
Important tool.
Currently, the function of electronic equipment is increasingly diversified, the personal information for storing user is more and more, in order to ensure user
The safety of personal information, electronic equipment identity recognition function become a critical function of current electronic equipment.Fingerprint recognition
With uniqueness, it is safe and easy to operate many advantages, such as current electronic device carry out identification main side
Formula.
Integrated optics fingerprint chip in the electronic device is a kind of side that current electronic equipment realizes fingerprint identification function
Formula.In the encapsulating structure of existing optical finger print chip, the alignment process of optical finger print chip and collimator is complicated, cost of manufacture
It is higher.
Invention content
To solve the above-mentioned problems, technical solution of the present invention provides a kind of encapsulating structure and envelope of optical finger print chip
The silicon cover board is fixed on the optical finger print chip by dress method using the silicon cover board with through-hole as collimator, can be with
Using the optical finger print chip as contraposition reference standard, alignment process is simple, reduces the production cost.
To achieve the goals above, the present invention provides the following technical solutions：
A kind of encapsulating structure of optical finger print chip, the encapsulating structure include：
Optical finger print chip, the optical finger print chip have opposite first surface and second surface, described first
Surface includes multiple photosensitive pixels and the weld pad that is electrically connected with the photosensitive pixel；
Silicon cover board, the silicon cover board fitting is fixed on the first surface, and the silicon cover board has the multiple and sense
The through-hole that light pixel is oppositely arranged one by one；
Wherein, the photosensitive pixel of the optical finger print chip is used to be formed the reference position of the through-hole as the silicon cover board
It sets.
Preferably, in above-mentioned encapsulating structure, the first surface includes photosensitive region and the encirclement photosensitive region
Peripheral region, be provided with the pixel in the photosensitive region, the weld pad be provided in the peripheral region；
The silicon cover board at least covers the photosensitive region.
Preferably, in above-mentioned encapsulating structure, further include：Setting deviates from the optical finger print chip one in the silicon cover board
The infrared fileter of side surface；
The silicon cover board is directly bonded fixation with the first surface.
Preferably, in above-mentioned encapsulating structure, the silicon cover board covers the photosensitive region, and exposes the external zones
Domain, to expose the weld pad；
The weld pad is electrically connected by conducting wire with external circuit.
Preferably, in above-mentioned encapsulating structure, the second surface of the optical finger print chip is fixed with circuit board, the electricity
Road plate with external circuit for connecting；
The conducting wire is connect with the circuit board.
Preferably, in above-mentioned encapsulating structure, the encapsulating structure further includes the encapsulation glue-line for covering the peripheral region,
The encapsulation glue-line covers the conducting wire and the weld pad.
Preferably, in above-mentioned encapsulating structure, the encapsulation glue-line is contacted with the side of the silicon cover board, the silicon cover board
Deviate from the side table of the optical finger print chip without departing from the encapsulation glue-line away from a side surface of the optical finger print chip
Face.
Preferably, in above-mentioned encapsulating structure, the first surface is completely covered in the silicon cover board；
The second surface is provided with back side interconnection architecture, the optical finger print chip by the back side interconnection architecture with
External circuit is electrically connected.
Preferably, in above-mentioned encapsulating structure, the first surface fitting is fixed with infrared fileter；
The silicon cover board is bonded fixation with the infrared fileter away from a side surface of the optical finger print.
Preferably, in above-mentioned encapsulating structure, the first surface is completely covered in the infrared fileter；The infrared absorption filter
The periphery of mating plate is aligned with the periphery of the optical finger print chip with the periphery of the silicon cover board.
Preferably, in above-mentioned encapsulating structure, the silicon cover board fixes the first surface by transparent optical glue laminating
On.
The present invention also provides a kind of packaging method of optical finger print chip, the packaging method includes：
A wafer is provided, the wafer includes multiple optical finger print chips, has cutting between the optical finger print chip
Raceway groove；The optical finger print chip has opposite first surface and second surface, and the first surface includes multiple photosensitive
Pixel and the weld pad being electrically connected with the photosensitive pixel；
Fixed silicon cover board is bonded on the wafer, the silicon cover board covers the first table of all optical finger print chips
Face；
Using the photosensitive pixel of the optical finger print chip as reference position, the multiple and sense is formed on the silicon cover board
Light pixel opposite through-hole one by one；
Cutting process is carried out based on the cutting raceway groove, the wafer and the silicon cover board are cut, is formed more
The encapsulating structure of a optical finger print chip.
Preferably, in above-mentioned packaging method, after fixed silicon cover board is bonded on the wafer, formed the through-hole it
Before, the packaging method further includes：
Deviate from the side table of the silicon cover board away from a side surface of the wafer and the wafer to the silicon cover board
Face carries out reduction processing respectively.
Preferably, in above-mentioned packaging method, the first surface includes photosensitive region and the encirclement photosensitive region
Peripheral region, be provided with the pixel in the photosensitive region, the weld pad be provided in the peripheral region.
Preferably, in above-mentioned packaging method, the silicon cover board is directly bonded fixation with the surface of the wafer；
After forming the through-hole, before carrying out the cutting process, the packaging method further includes：
Processing is performed etching to the silicon cover board, exposes the weld pad.
Preferably, in above-mentioned packaging method, after carrying out the cutting process, the packaging method further includes：
In the silicon cover board away from the fixed infrared fileter of a side surface of optical finger print chip fitting.
Preferably, in above-mentioned packaging method, after carrying out the cutting process, the packaging method further includes：
The second surface of the optical finger print chip is bonded fixation with a circuit board, by the weld pad by conductor wire with
The circuit board electrical connection, the circuit board is used for and external circuit electrical connection.
Preferably, in above-mentioned packaging method, after carrying out the cutting process, the packaging method further includes：
Encapsulation glue-line is set in the peripheral region, the encapsulation glue-line covers the conducting wire and the weld pad.
Preferably, in above-mentioned packaging method, the encapsulation glue-line is contacted with the side of the silicon cover board, the silicon cover board
Deviate from the side table of the optical finger print chip without departing from the encapsulation glue-line away from a side surface of the optical finger print chip
Face.
Preferably, in above-mentioned packaging method, after carrying out the cutting process, in each encapsulating structure, the silicon
The first surface is completely covered in cover board；
Before carrying out the cutting process, the packaging method further includes：
The second surface formed back side interconnection architecture, the optical finger print chip by the back side interconnection architecture with
External circuit is electrically connected.
Preferably, in above-mentioned packaging method, before fixed silicon cover board, further include：
It is bonded fixed infrared fileter in the crystal column surface, the infrared fileter covers all optical finger print cores
Piece.
Preferably, in above-mentioned packaging method, the fixed silicon cover board of the fitting on the wafer includes：
The silicon cover board is bonded fixation with the wafer by transparent optical cement.
Preferably, in above-mentioned packaging method, before carrying out the cutting process, the packaging method further includes：
Remove the transparent optical cement in the through-hole.
By foregoing description it is found that the encapsulating structure for the optical finger print chip that technical solution of the present invention provides and encapsulation side
In method, the encapsulating structure includes：Optical finger print chip, the optical finger print chip have opposite first surface and second
Surface, the first surface include multiple photosensitive pixels and the weld pad that is electrically connected with the photosensitive pixel；Silicon cover board, the silicon
Cover board is bonded fixation with the first surface, and it is logical that there is the silicon cover board the multiple and photosensitive pixel to be oppositely arranged one by one
Hole；Wherein, the photosensitive pixel of the optical finger print chip is used to be formed the reference position of the through-hole as the silicon cover board.Institute
Stating encapsulating structure uses the silicon cover board with through-hole as collimator, which is fixed on the optical finger print chip,
Can be using the optical finger print chip as contraposition reference standard, alignment process is simple, reduces the production cost.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is a kind of structural schematic diagram of the encapsulating structure of common optical finger print chip；
Fig. 2 is a kind of schematic diagram of the encapsulating structure of optical finger print chip provided in an embodiment of the present invention；
Fig. 3 is the structural schematic diagram of sensitive chip in encapsulating structure shown in Fig. 2；
Fig. 4 is the schematic diagram of the encapsulating structure of another optical finger print chip provided in an embodiment of the present invention；
Fig. 5 is the structural schematic diagram of optical finger print chip in encapsulating structure shown in Fig. 4；
Fig. 6-Figure 15 is a kind of flow diagram of packaging method provided in an embodiment of the present invention；
Figure 16-Figure 24 is the flow diagram of another packaging method provided in an embodiment of the present invention.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
With reference to figure 1, Fig. 1 is a kind of structural schematic diagram of the encapsulating structure of common optical finger print chip, the encapsulation knot
Structure includes：Optical finger print chip 12, the optical finger print chip have opposite front and the back side, and the back side is fixed on circuit
The surface of plate 11, front have photosensitive region 121 and the weld pad 122 positioned at 121 both sides of photosensitive region, the photosensitive region
121 there are multiple photosensitive pixels, the photosensitive pixel to be connect with the weld pad 122.The weld pad 122 passes through conducting wire 15 and circuit
Interconnection circuit connection on plate 11, to be connect with external circuit by the interconnection circuit.
In order to reduce the cross-interference issue of photosensitive pixel 121, the incident side in optical finger print chip 12 is needed to fix collimator
13, collimator 13 has multiple one-to-one through-holes 141 with photosensitive pixel.In the prior art, collimator is bonded when general
With 14 surface of cover board, cover board is fixed on to the top of optical finger print chip 12 by holder setting.
Encapsulating structure shown in Fig. 1 is when collimator 13 and optical finger print chip 12 align, to range accuracy between the two
It is required that it is high, and since collimator 13 is integrally fixed on cover board 14, then be relatively fixed by holder and optical finger print chip 12, in
Between more fixation procedure can increase the aligning accuracy of collimator 13 and optical finger print chip 12, cause in encapsulation process to contraposition
Required precision is higher, needs to use high-precision alignment device, cost of manufacture higher.
To solve the above-mentioned problems, an embodiment of the present invention provides a kind of encapsulating structure of optical finger print chip and encapsulation
Method, the encapsulating structure use the silicon cover board with through-hole as collimator, which are fixed on the optical finger print
On chip, the silicon cover board, alignment process can be fixed without holder using the optical finger print chip as contraposition reference standard
Simply, it reduces the production cost.
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below in conjunction with the accompanying drawings and specific real
Applying mode, the present invention is described in further detail.
Referring to figs. 2 and 3, Fig. 2 is a kind of signal of the encapsulating structure of optical finger print chip provided in an embodiment of the present invention
Figure, Fig. 3 are the structural schematic diagram of sensitive chip in encapsulating structure shown in Fig. 2, which includes：Optical finger print chip 21,
The optical finger print chip 21 has opposite first surface and second surface, and the first surface includes multiple photosensitive pixels
And the weld pad 212 being electrically connected with the photosensitive pixel；Silicon cover board 23, the silicon cover board 23 are bonded solid with the first surface
Fixed, the silicon cover board 23 has multiple through-holes 231 being oppositely arranged one by one with the photosensitive pixel；Wherein, the optical finger print
The photosensitive pixel of chip 21 is used to be formed the reference position of the through-hole 231 as the silicon cover board 23.It is not shown in Fig. 2 described
Photosensitive pixel.
In mode shown in Fig. 2, the optical finger print chip 21 includes photosensitive region and the encirclement photosensitive region
Peripheral region is provided with the pixel in the photosensitive region, the weld pad 212 is provided in the peripheral region；It is described
Silicon cover board 23 at least covers the photosensitive region.
Optionally, described includes protective layer 300, and the protective layer 300 covers the photosensitive pixel.The silicon cover board 23 is set
It sets on the surface of the protective layer 300, fixation is bonded with the protective layer 300.The protective layer 300, which has, exposes the weld pad
212 opening, in order to which weld pad 212 is electrically connected with other component.The photosensitive pixel is not shown in Fig. 3.
In the mode described in Fig. 2, the encapsulating structure further includes：Setting deviates from the optical finger print in the silicon cover board 23
The infrared fileter 24 of 21 1 side surface of chip.The silicon cover board 23 is directly bonded fixation with the first surface.Silicon cover board is not
The position of through-hole 231, which is arranged, cannot be penetrated visible light by infrared light, therefore can be filtered out by the infrared fileter 24
Infrared light retains visible light, and then the visible light of low-angle incidence can be made to be incident on through-hole pair by the through-hole 231 again
The photosensitive pixel answered avoids the cross-interference issue between different photosensitive pixels.
The silicon cover board 23 covers the photosensitive region, and exposes the peripheral region, to expose the weld pad 212；Institute
Weld pad 212 is stated to be electrically connected with external circuit by conducting wire 26.For the ease of being connect with external circuit and to optical finger print chip
21 are packaged protection, and the second surface that the optical finger print chip 21 is arranged is fixed with circuit board 22, and the circuit board 22 is used
It is connected in external circuit；The conducting wire 26 is connect with the circuit board 22 so that the optical finger print chip 21 passes through described
Circuit board 22 is connect with the external circuit.
The encapsulating structure further includes the encapsulation glue-line 25 for covering the peripheral region, and the encapsulation glue-line 25 covers described
Conducting wire 26 and the weld pad 212.The conducting wire 26 and the weld pad 212 can be carried out by the encapsulation glue-line 25 close
Envelope protection, can also be sealed silicon cover board 23 and the intersection of optical finger print chip 21.
The encapsulation glue-line 25 is contacted with the side of the silicon cover board 23, and the silicon cover board 23 deviates from the optical finger print core
One side surface of piece 21 deviates from a side surface of the optical finger print chip 21 without departing from the encapsulation glue-line 25, in order at it
Infrared fileter 24 is fixed in upper surface.The upper surface that the encapsulation glue-line 25 can be arranged deviates from the light with the silicon cover board 23
The side surface for learning fingerprint chip 21 flushes.
When the second surface of optical finger print chip 21 is fixed with circuit board 22, the encapsulation glue-line 25 can also be to optics
Fingerprint chip 21 and the intersection of circuit board 22 are sealed, it is ensured that the leakproofness of entire encapsulating structure.
In mode shown in Fig. 2, the silicon cover board 23 is bonded with the optical finger print chip 21 by transparent optical cement 27 solid
It is fixed.After the silicon cover board 23 is adhesively fixed with the optical finger print chip 21 by transparent optical cement 27, the through-hole is re-formed
231.Transparent optical cement 27 in through-hole 231 can remove after forming the through-hole 231.
With reference to figure 4 and Fig. 5, Fig. 4 is showing for the encapsulating structure of another optical finger print chip provided in an embodiment of the present invention
It is intended to, Fig. 5 is the structural schematic diagram of optical finger print chip in encapsulating structure shown in Fig. 4, and which is with aforesaid way difference,
The first surface is completely covered in the silicon cover board 23；The second surface is provided with back side interconnection architecture, the optical finger print
Chip 21 is electrically connected by the back side interconnection architecture with external circuit.
In which, the second surface has through-hole 31, and the through-hole 31 can be formed by TSV techniques, described logical
Expose the weld pad 212 in hole 31.It is covered with insulating layer 32 in the second pellicle, insulating layer covers the side wall of through-hole 31.In insulating layer
32 surface is covered with wiring layer 33 again, then wiring layer 33 is connect in the bottom of through-hole 31 with weld pad 212, then 33 surface of wiring layer
It is covered with solder mask 34, solder mask 34 has opening.It is located at the part outside through-hole 31 in wiring layer 33 again and is connected with welding ends
213.The welding ends 213 is connect by the opening with wiring layer 33 again.
In mode shown in Fig. 4 and Fig. 5, the first surface fitting is fixed with the infrared fileter 24；The silicon cover board
23 are bonded fixation with the infrared fileter 24 away from a side surface of the optical finger print chip 21.
In mode shown in Fig. 4 and Fig. 5, the first surface is completely covered in the infrared fileter 24；The infrared filtering
The first surface is completely covered in piece 24；The periphery of the periphery of the infrared fileter 24 and the silicon cover board 23 with the light
Learn the periphery alignment of fingerprint chip 21.
In mode shown in Fig. 4, the silicon cover board 23 is adhesively fixed with the infrared fileter 24 by transparent optical cement.Institute
It states after silicon cover board 23 and the infrared fileter 24 be adhesively fixed by transparent optical cement 27, re-forms the through-hole 231.Through-hole
Transparent optical cement 27 in 231 can remove after forming the through-hole 231.
In encapsulating structure described in the embodiment of the present invention, the silicon cover board 23 passes through the fitting of transparent optical cement 27 fixed described the
On one surface.On the one hand, it can be preferably adhesively fixed with transparent optical cement 27, and flatness is preferable after solidification.Meanwhile it can
After forming through-hole 231, to remove the transparent optical cement 27 in through-hole 231 by plasma treatment mode, through-hole 231 avoided to deposit
Light is interfered when transparent optical cement 27 in residual.And transparent optical cement 27 has preferable translucency, if by
In process conditions cause through-hole 231 exist residual in transparent optical cement 27, preferable translucency it is also possible that its to through-hole
It is relatively low that interior light propagates interference.
It should be noted that covering can indicate that the covering of the contact on face direction can also table in the embodiment of the present invention
Show the intermediate contactless covering with other structures layer on face direction.
By foregoing description it is found that in encapsulating structure provided in an embodiment of the present invention, using the silicon cover board with through-hole 231
23 are used as collimator, which is fixed on the optical finger print chip 21, can be with the optical finger print chip 21
As contraposition reference standard, the silicon cover board 23 is fixed without holder, alignment process is simple, reduces the production cost.
A kind of encapsulation side is additionally provided based on encapsulating structure, another embodiment of the present invention described in above-mentioned encapsulating structure embodiment
Method, for the packaging method as shown in Fig. 6-Figure 15, Fig. 6-Figure 15 is a kind of flow of packaging method provided in an embodiment of the present invention
Schematic diagram, for making encapsulating structure as shown in Figure 2, which includes the packaging method：
Step S11：As shown in Figure 6 and Figure 7, a wafer 400 is provided.
The wafer 400 includes multiple optical finger print chips 21, has cutting raceway groove between the optical finger print chip 21
10；The optical finger print chip 21 has opposite first surface and second surface, and the first surface includes multiple photosensitive
Pixel and the weld pad 212 being electrically connected with the photosensitive pixel.Wherein, Fig. 7 is sectional drawings of the Fig. 6 in the directions P-P '.
Step S12：As shown in figure 8, being bonded fixed silicon cover board 23 on the wafer 400, the silicon cover board 23 covers institute
There is the first surface of the optical finger print chip 21.
Step S13：As shown in figure 9, using the photosensitive pixel of the optical finger print chip 21 as reference position, in the silicon lid
Multiple through-holes 231 opposite one by one with the photosensitive pixel are formed on plate 23.
For the optical finger print chip 21, the first surface includes photosensitive region and the encirclement photosensitive region
Peripheral region is provided with the pixel in the photosensitive region, the weld pad is provided in the peripheral region；The silicon lid
Plate covers all optical finger print chips.
Should during, be reference position including directly with each light-sensitive image using the photosensitive pixel of the optical finger print chip 21
Element is that reference position is correspondingly formed each through-hole 231, can also be reference with photosensitive region 211, determine and be used in silicon cover board 23
The position for forming through-hole, since the layout type of photosensitive pixel in photosensitive region 211 is known, according to photosensitive region
211 can both obtain the placement position of photosensitive pixel, in order to form through-hole 231.
After being bonded fixed silicon cover board 23 on the wafer 400, before forming the through-hole 231, the packaging method
Further include：The silicon cover board 23 is deviated from away from a side surface of the wafer 400 and the wafer 400 to the silicon cover board 23
A side surface carry out reduction processing respectively.Due to the limitation of process conditions, individually wafer 400 or silicon cover board 23 are subtracted
Thin, in order to avoid fragment problems occur for wafer 400 and silicon cover board 23, the thickness that the latter two are thinned is still larger, and the application is implemented
In example, after being bonded fixed silicon cover board 23 on the wafer 400, overall structure thickness is larger, therefore is carrying out reduction processing
When, reduction processing by a larger margin can be carried out to the wafer 400 and the silicon cover board 23.
Step S14：As shown in Figure 10-Figure 15, cutting process is carried out based on the cutting raceway groove 10, by the wafer 400
And the silicon cover board 23 is cut, and the encapsulating structure of multiple optical finger print chips 21 is formed.Have in each encapsulating structure
One optical finger print chip 21.
In the step, first, as shown in Figure 10, after forming the through-hole 231, before carrying out the cutting process,
The packaging method further includes：Processing is performed etching to the silicon cover board 23, exposes the weld pad 212.It should go simultaneously in the process
Except the silicon cover board 23 of 10 position of cutting raceway groove.
In packaging method described in the embodiment of the present invention, the fixed silicon cover board 23 that is bonded on the wafer 400 includes：It is logical
It crosses transparent optical cement 27 and the silicon cover board 23 is bonded fixation with the wafer 400.
Then, as shown in figure 11, before carrying out the cutting process, the packaging method further includes：Remove the through-hole
The interior transparent optical cement 27.The transparent optical cement 27 in through-hole 23 can be removed by plasma treatment mode, removed simultaneously
The transparent optical cement 27 that peripheral region is exposed.
As shown in figure 12, the wafer 400 is cut based on cutting raceway groove 10, forms multiple encapsulating structures, it is each to encapsulate
There are one optical finger print chips for structure tool.
In above-mentioned packaging method, as shown in figure 13, after carrying out the cutting process, the packaging method further includes：
The second surface of the optical finger print chip 21 is bonded fixation with a circuit board 22, the weld pad 212 is passed through into conductor wire 26
It is electrically connected with the circuit board 22, the circuit board 22 is used for and external circuit electrical connection.
In above-mentioned packaging method, as shown in figure 14, after carrying out the cutting process, the packaging method is also wrapped
It includes：Encapsulation glue-line 25 is set in the peripheral region, the encapsulation glue-line 25 covers the conducting wire 26 and the weld pad 212.
The encapsulation glue-line 25 is contacted with the side of the silicon cover board 23, and the silicon cover board 23 deviates from the one of the optical finger print chip 21
Side surface deviates from a side surface of the optical finger print chip 21 without departing from the encapsulation glue-line 25.
In above-mentioned packaging method, the silicon cover board 23 is directly bonded fixation with the surface of the wafer 400；Such as Figure 15 institutes
Show, after carrying out the cutting process, the packaging method further includes：Deviate from the optical finger print core in the silicon cover board 23
Infrared fileter 24 is fixed in the side surface fitting of piece 21.
By mode shown in Fig. 6-Figure 15, encapsulating structure as shown in Figure 2 can be made.
With reference to the flow signal that figure 16- Figure 24, Figure 16-Figure 24 are another packaging method provided in an embodiment of the present invention
Figure, the packaging method is for making encapsulating structure as indicated at 4.In which, after carrying out the cutting process, each encapsulation
In structure, the first surface is completely covered in 23 plate of silicon lid；Before carrying out the cutting process, the packaging method is also wrapped
It includes：Back side interconnection architecture is formed in the second surface, the optical finger print chip 21 is by the back side interconnection architecture and outside
Portion's circuit electrical connection.
In which, before silicon cover board 23 is fixed on wafer 400, first as shown in figure 16, further include：In 400 table of wafer
Face paste closes fixed infrared fileter 24.The infrared fileter 24 covers all optical finger print chips 21.Then, such as Figure 17
Shown, by transparent optical cement 27, in infrared fileter 24, away from a side surface of wafer 400, silicon cover board 23 is fixed in fitting.Fitting
After fixed silicon cover board 23, in which, can equally significantly reduction processing be carried out to wafer 400 and silicon cover board 23.Again
As shown in figure 18, through-hole 231 is formed, then as shown in figure 19, removes the transparent optical cement 27 in through-hole 231.It again can be such as Figure 20-
Shown in Figure 23, layer process is connected up by TSV techniques and again, it is mutual to form the back side in the second surface of each optical finger print chip 21
It is coupled structure.Back side interconnection architecture is as described in above-described embodiment, and details are not described herein.It is last as shown in figure 24, by cutting technique,
Form multiple encapsulating structures as shown in Figure 4.
It in packaging method described in the embodiment of the present invention, can be used for preparing encapsulating structure described in above-described embodiment, make work
Skill is simple, is not necessarily to high-precision alignment process, low manufacture cost.
Each embodiment is described by the way of progressive in this specification, the highlights of each of the examples are with other
The difference of embodiment, just to refer each other for identical similar portion between each embodiment.For device disclosed in embodiment
For, since it is corresponded to the methods disclosed in the examples, so description is fairly simple, related place is said referring to method part
It is bright.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest range caused.
Claims (23)
1. a kind of encapsulating structure of optical finger print chip, which is characterized in that the encapsulating structure includes：
Optical finger print chip, the optical finger print chip have opposite first surface and second surface, the first surface
Including multiple photosensitive pixels and the weld pad being electrically connected with the photosensitive pixel；
Silicon cover board, the silicon cover board fitting is fixed on the first surface, and the silicon cover board has the multiple and light-sensitive image
The through-hole that element is oppositely arranged one by one；
Wherein, the photosensitive pixel of the optical finger print chip is used to be formed the reference position of the through-hole as the silicon cover board.
2. encapsulating structure according to claim 1, which is characterized in that the first surface includes photosensitive region and encirclement
The peripheral region of the photosensitive region, is provided with the pixel in the photosensitive region, and setting has been in the peripheral region
State weld pad；
The silicon cover board at least covers the photosensitive region.
3. encapsulating structure according to claim 2, which is characterized in that further include：Setting is in the silicon cover board away from described
The infrared fileter on optical finger print chip-side surface；
The silicon cover board is directly bonded fixation with the first surface.
4. encapsulating structure according to claim 2, which is characterized in that the silicon cover board covers the photosensitive region, and reveals
Go out the peripheral region, to expose the weld pad；
The weld pad is electrically connected by conducting wire with external circuit.
5. encapsulating structure according to claim 4, which is characterized in that the second surface of the optical finger print chip is fixed with
Circuit board, the circuit board with external circuit for connecting；
The conducting wire is connect with the circuit board.
6. encapsulating structure according to claim 4, which is characterized in that the encapsulating structure further includes the covering external zones
The encapsulation glue-line in domain, the encapsulation glue-line cover the conducting wire and the weld pad.
7. encapsulating structure according to claim 6, which is characterized in that the side of the encapsulation glue-line and the silicon cover board connects
It touches, the silicon cover board deviates from the optical finger print away from a side surface of the optical finger print chip without departing from the encapsulation glue-line
One side surface of chip.
8. encapsulating structure according to claim 2, which is characterized in that the first surface is completely covered in the silicon cover board；
The second surface is provided with back side interconnection architecture, and the optical finger print chip passes through the back side interconnection architecture and outside
Circuit is electrically connected.
9. encapsulating structure according to claim 8, which is characterized in that the first surface fitting is fixed with infrared filtering
Piece；
The silicon cover board is bonded fixation with the infrared fileter away from a side surface of the optical finger print.
10. encapsulating structure according to claim 9, which is characterized in that the infrared fileter is completely covered described first
Surface；The periphery of the infrared fileter is aligned with the periphery of the optical finger print chip with the periphery of the silicon cover board.
11. according to claim 1-10 any one of them encapsulating structures, which is characterized in that the silicon cover board passes through transparent optical
Glue laminating is fixed on the first surface.
12. a kind of packaging method of optical finger print chip, which is characterized in that the packaging method includes：
A wafer is provided, the wafer includes multiple optical finger print chips, has cutting raceway groove between the optical finger print chip；
The optical finger print chip has opposite a first surface and second surface, the first surface include multiple photosensitive pixels with
And the weld pad being electrically connected with the photosensitive pixel；
Fixed silicon cover board is bonded on the wafer, the silicon cover board covers the first surface of all optical finger print chips；
Using the photosensitive pixel of the optical finger print chip as reference position, the multiple and light-sensitive image is formed on the silicon cover board
Element opposite through-hole one by one；
Cutting process is carried out based on the cutting raceway groove, the wafer and the silicon cover board are cut, multiple light are formed
Learn the encapsulating structure of fingerprint chip.
13. packaging method according to claim 12, which is characterized in that after being bonded fixed silicon cover board on the wafer,
Before forming the through-hole, the packaging method further includes：
To the silicon cover board away from a side surface of the wafer and the wafer away from a side surface of the silicon cover board point
Reduction processing is not carried out.
14. packaging method according to claim 12, which is characterized in that the first surface includes photosensitive region and packet
The peripheral region of the photosensitive region is enclosed, the pixel is provided in the photosensitive region, is provided in the peripheral region
The weld pad.
15. packaging method according to claim 14, which is characterized in that surface of the silicon cover board directly with the wafer
Fitting is fixed；
After forming the through-hole, before carrying out the cutting process, the packaging method further includes：
Processing is performed etching to the silicon cover board, exposes the weld pad.
16. packaging method according to claim 15, which is characterized in that after carrying out the cutting process, the envelope
Dress method further includes：
In the silicon cover board away from the fixed infrared fileter of a side surface of optical finger print chip fitting.
17. packaging method according to claim 16, which is characterized in that after carrying out the cutting process, the encapsulation
Method further includes：
The second surface of the optical finger print chip is bonded fixation with a circuit board, by the weld pad by conductor wire with it is described
Circuit board electrical connection, the circuit board is used for and external circuit electrical connection.
18. packaging method according to claim 16, which is characterized in that after carrying out the cutting process, the envelope
Dress method further includes：
Encapsulation glue-line is set in the peripheral region, the encapsulation glue-line covers the conducting wire and the weld pad.
19. packaging method according to claim 18, which is characterized in that the side of the encapsulation glue-line and the silicon cover board
Contact, the silicon cover board refer to without departing from the encapsulation glue-line away from the optics away from a side surface of the optical finger print chip
One side surface of line chip.
20. packaging method according to claim 14, which is characterized in that after carrying out the cutting process, each envelope
In assembling structure, the first surface is completely covered in the silicon cover board；
Before carrying out the cutting process, the packaging method further includes：
Back side interconnection architecture is formed in the second surface, the optical finger print chip passes through the back side interconnection architecture and outside
Circuit is electrically connected.
21. packaging method according to claim 20, which is characterized in that before fixed silicon cover board, further include：
It is bonded fixed infrared fileter in the crystal column surface, the infrared fileter covers all optical finger print chips.
22. according to claim 12-21 any one of them packaging methods, which is characterized in that described to be bonded on the wafer
Fixing silicon cover board includes：
The silicon cover board is bonded fixation with the wafer by transparent optical cement.
23. packaging method according to claim 22, which is characterized in that before carrying out the cutting process, the encapsulation
Method further includes：
Remove the transparent optical cement in the through-hole.
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109376726A (en) * | 2018-12-24 | 2019-02-22 | 苏州科阳光电科技有限公司 | Optical finger print chip-packaging structure under a kind of screen |
| CN110416237A (en) * | 2019-07-30 | 2019-11-05 | 业成科技（成都）有限公司 | Optical image device for identifying and preparation method thereof |
| CN110781804A (en) * | 2019-10-23 | 2020-02-11 | 业成科技（成都）有限公司 | Optical image recognition device and manufacturing method thereof |
| CN110956163A (en) * | 2019-12-27 | 2020-04-03 | 苏州科阳光电科技有限公司 | Fingerprint identification module, terminal equipment and preparation method of fingerprint identification module |
| CN111164607A (en) * | 2019-07-12 | 2020-05-15 | 深圳市汇顶科技股份有限公司 | Fingerprint detection device and electronic equipment |
| CN111611916A (en) * | 2020-05-20 | 2020-09-01 | 上海思立微电子科技有限公司 | Thin optical fingerprint chip module, manufacturing method thereof and electronic equipment |
| CN112764134A (en) * | 2021-01-12 | 2021-05-07 | 深圳市汇顶科技股份有限公司 | Optical film assembly, optical induction sensor, preparation method and electronic equipment |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107046008A (en) * | 2017-01-17 | 2017-08-15 | 苏州晶方半导体科技股份有限公司 | A kind of encapsulating structure and method for packing of fingerprint recognition chip |
| WO2018061481A1 (en) * | 2016-09-30 | 2018-04-05 | ソニーセミコンダクタソリューションズ株式会社 | Solid-state imaging element and imaging device |
| CN107910344A (en) * | 2017-12-18 | 2018-04-13 | 苏州晶方半导体科技股份有限公司 | A kind of encapsulating structure and method for packing of optical finger print identification chip |
| CN108010931A (en) * | 2017-12-28 | 2018-05-08 | 苏州晶方半导体科技股份有限公司 | A kind of encapsulating structure and method for packing of optical finger print chip |
| CN108022904A (en) * | 2017-01-17 | 2018-05-11 | 苏州晶方半导体科技股份有限公司 | A kind of encapsulating structure and method for packing of fingerprint recognition chip |
| US20180145102A1 (en) * | 2016-11-22 | 2018-05-24 | China Wafer Level Csp Co., Ltd. | Fingerprint sensing chip packaging method and fingerprint sensing chip package |
| CN208580745U (en) * | 2018-08-02 | 2019-03-05 | 苏州晶方半导体科技股份有限公司 | A kind of encapsulating structure of optical finger print chip |
-
2018
- 2018-08-02 CN CN201810869265.3A patent/CN108807446A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018061481A1 (en) * | 2016-09-30 | 2018-04-05 | ソニーセミコンダクタソリューションズ株式会社 | Solid-state imaging element and imaging device |
| US20180145102A1 (en) * | 2016-11-22 | 2018-05-24 | China Wafer Level Csp Co., Ltd. | Fingerprint sensing chip packaging method and fingerprint sensing chip package |
| CN107046008A (en) * | 2017-01-17 | 2017-08-15 | 苏州晶方半导体科技股份有限公司 | A kind of encapsulating structure and method for packing of fingerprint recognition chip |
| CN108022904A (en) * | 2017-01-17 | 2018-05-11 | 苏州晶方半导体科技股份有限公司 | A kind of encapsulating structure and method for packing of fingerprint recognition chip |
| CN107910344A (en) * | 2017-12-18 | 2018-04-13 | 苏州晶方半导体科技股份有限公司 | A kind of encapsulating structure and method for packing of optical finger print identification chip |
| CN108010931A (en) * | 2017-12-28 | 2018-05-08 | 苏州晶方半导体科技股份有限公司 | A kind of encapsulating structure and method for packing of optical finger print chip |
| CN208580745U (en) * | 2018-08-02 | 2019-03-05 | 苏州晶方半导体科技股份有限公司 | A kind of encapsulating structure of optical finger print chip |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109376726A (en) * | 2018-12-24 | 2019-02-22 | 苏州科阳光电科技有限公司 | Optical finger print chip-packaging structure under a kind of screen |
| CN109376726B (en) * | 2018-12-24 | 2024-04-02 | 苏州科阳半导体有限公司 | Under-screen optical fingerprint chip packaging structure |
| CN111164607A (en) * | 2019-07-12 | 2020-05-15 | 深圳市汇顶科技股份有限公司 | Fingerprint detection device and electronic equipment |
| CN111164607B (en) * | 2019-07-12 | 2023-08-22 | 深圳市汇顶科技股份有限公司 | Fingerprint detection device and electronic equipment |
| CN110416237A (en) * | 2019-07-30 | 2019-11-05 | 业成科技（成都）有限公司 | Optical image device for identifying and preparation method thereof |
| CN110781804A (en) * | 2019-10-23 | 2020-02-11 | 业成科技（成都）有限公司 | Optical image recognition device and manufacturing method thereof |
| CN110781804B (en) * | 2019-10-23 | 2023-06-02 | 业泓科技(成都)有限公司 | Manufacturing method of optical image identification device |
| CN110956163A (en) * | 2019-12-27 | 2020-04-03 | 苏州科阳光电科技有限公司 | Fingerprint identification module, terminal equipment and preparation method of fingerprint identification module |
| CN111611916A (en) * | 2020-05-20 | 2020-09-01 | 上海思立微电子科技有限公司 | Thin optical fingerprint chip module, manufacturing method thereof and electronic equipment |
| CN111611916B (en) * | 2020-05-20 | 2023-09-22 | 上海思立微电子科技有限公司 | Thin optical fingerprint chip module, manufacturing method thereof and electronic equipment |
| CN112764134A (en) * | 2021-01-12 | 2021-05-07 | 深圳市汇顶科技股份有限公司 | Optical film assembly, optical induction sensor, preparation method and electronic equipment |
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