CN207651485U - A kind of encapsulating structure of optical finger print identification chip - Google Patents
A kind of encapsulating structure of optical finger print identification chip Download PDFInfo
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- CN207651485U CN207651485U CN201721773041.XU CN201721773041U CN207651485U CN 207651485 U CN207651485 U CN 207651485U CN 201721773041 U CN201721773041 U CN 201721773041U CN 207651485 U CN207651485 U CN 207651485U
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- finger print
- optical finger
- encapsulating structure
- identification chip
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Abstract
The utility model discloses a kind of encapsulating structures of optical finger print identification chip, in the encapsulating structure for the optical finger print identification chip that technical solutions of the utility model provide, in the front setting cover board of optical finger print identification chip, the substrate includes substrate and light shield layer, the light shield layer is set away from a side surface of the optical finger print identification chip in substrate, the substrate has multiple first through hole for exposing the photosensitive pixel of the optical finger print identification chip, the light shield layer has and one-to-one second through-hole of the first through hole, when carrying out fingerprint recognition, the light subregion that finger can be reflected by the one-to-one first through hole and second through-hole, sensing result to reduce different photosensitive pixels generates crosstalk, improve the precision of fingerprint recognition.
Description
Technical field
The utility model is related to chip encapsulation technology fields, more specifically, being related to a kind of optical finger print identification chip
Encapsulating structure.
Background technology
With science and technology be constantly progressive, more and more electronic equipments be widely used in daily life with
And in work, huge facility is brought for daily life and work, becomes the indispensable weight of current people
Want tool.And being continuously increased with electronic functionalities, the important information of electronic equipment storage are also more and more, electronic equipment
Identity validation technology become current electronic equipment research and development a Main way.
Since fingerprint has uniqueness and invariance so that fingerprint identification technology have that safety is good, reliability is high and
Using it is simple many advantages, such as.Therefore, fingerprint identification technology becomes the mainstream skill that various electronic equipments instantly carry out authentication
Art.
Currently, optical finger print identification chip is one of common fingerprint recognition chip of existing electronic equipment, pass through fingerprint
A large amount of photosensitive pixels (pixel) of cog region acquire the finger print information of user, and each photosensitive pixel detects as one.Tool
Body, when carrying out fingerprint recognition, light exposes to the fingerprint face of user and reflexes to photosensitive pixel, light-sensitive image by fingerprint face
The optical signal of fingerprint is converted to electric signal by element, and the electric signal converted according to all pixels can obtain finger print information.
When packaged, transparent cover plate is directly directly generally arranged in photosensitive side in existing optical finger print identification chip.But
What it is due to transparent cover plate is complete light transmission, and the sensing result of different photosensitive pixels can be caused to generate crosstalk, influence fingerprint recognition
Precision.
Utility model content
To solve the above-mentioned problems, technical solutions of the utility model provide a kind of encapsulation knot of optical finger print identification chip
Structure solves the problems, such as that the sensing result of different photosensitive pixels generates crosstalk, improves the precision of fingerprint recognition.
To achieve the goals above, the utility model provides the following technical solutions：
A kind of encapsulating structure of optical finger print identification chip, the encapsulating structure include：
There is optical finger print identification chip opposite front and the back side, front to have fingerprint identification area and encirclement
There are multiple photosensitive pixels, the external zones to have and the sense for the external zones of the fingerprint identification area, the fingerprint identification area
The weld pad that light pixel is electrically connected；
The cover board being oppositely arranged with the front of the optical finger print identification chip；
The cover board includes substrate and light shield layer；The substrate has multiple first logical for exposing the photosensitive pixel
Hole；The light shield layer be located at the substrate deviate from the optical finger print identification chip side, the light shield layer have it is multiple with
The first through hole opposite the second through-hole one by one.
Preferably, have in above-mentioned encapsulating structure, between the cover board and the optical finger print identification chip preset
Spacing carries out the image distance of pinhole imaging system for adjusting the cover board.
Preferably, in above-mentioned encapsulating structure, there is optical filter between the cover board and the optical finger print identification chip
Glass, for filtering out the veiling glare except detection optical band.
Preferably, in above-mentioned encapsulating structure, the cover board is set away from a side surface of the optical finger print identification chip
It is equipped with glass of color filter, for filtering out the veiling glare except detection optical band.
Preferably, in above-mentioned encapsulating structure, the periphery of the periphery of the cover board and the optical finger print identification chip it
Between with preset thickness spacer.
Preferably, in above-mentioned encapsulating structure, the position that the substrate corresponds to the weld pad has for exposing the weldering
First opening of pad；
The position that the light shield layer corresponds to first opening has for exposing described first the second opening being open；
The weld pad is used to be open by described first and second opening is electrically connected with a metal wire, to pass through
The pad of the metal wire and a backboard is electrically connected.
Preferably, in above-mentioned encapsulating structure, first opening includes the first groove and positioned at first groove
The second interior groove, first groove and second groove are for exposing the weld pad.
Preferably, in above-mentioned encapsulating structure, the back side of the optical finger print identification chip corresponds to the position of the weld pad
With silicon hole, the silicon hole is for exposing the weld pad；
The back side of the side wall of the silicon hole and the optical finger print identification chip is covered with insulating layer；
The surface of insulating layer is covered with wiring layer again, and the wiring layer again is electrical by the silicon hole and the weld pad
Connection, and extend to the outside of the silicon hole；
The wiring layer again is covered with solder mask, and the solder mask is opposite with the back side of optical finger print identification chip
There is opening, the opening electrically to be connected with the pad by the solder-bump and a backboard for solder-bump to be arranged in region
It connects.
Preferably, in above-mentioned encapsulating structure, the substrate is silicon substrate.
Preferably, in above-mentioned encapsulating structure, the light shield layer is photoresist dry film or photoresist wet film.
Preferably, in above-mentioned encapsulating structure, the depth-to-width ratio of the first through hole is not more than 6:1.
Preferably, in above-mentioned encapsulating structure, the depth-to-width ratio of second through-hole is not more than 6:1.
Preferably, in above-mentioned encapsulating structure, the thickness of the substrate is not more than 200 μm.
Preferably, in above-mentioned encapsulating structure, the thickness of the light shield layer is not more than 200 μm.
Preferably, in above-mentioned encapsulating structure, the substrate is bonded with the optical finger print identification chip by DAF films solid
It is fixed.
Preferably, in above-mentioned encapsulating structure, the photosensitive pixel array is arranged, the first through hole and the pixel one
One corresponds to.
By foregoing description it is found that the encapsulating structure for the optical finger print identification chip that technical solutions of the utility model provide
In, in the front setting cover board of optical finger print identification chip, the substrate includes substrate and light shield layer, deviates from the light in substrate
The light shield layer is arranged in the side surface for learning fingerprint recognition chip, and the substrate has multiple for exposing the optical finger print knowledge
The first through hole of the photosensitive pixel of other chip, the light shield layer have with one-to-one second through-hole of the first through hole, into
When row fingerprint recognition, the light that can be reflected finger by the one-to-one first through hole and second through-hole divides
Area, the sensing result to reduce different photosensitive pixels generate crosstalk, improve the precision of fingerprint recognition.
Description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is the embodiments of the present invention, for those of ordinary skill in the art, without creative efforts, also
Other attached drawings can be obtained according to the attached drawing of offer.
Fig. 1 a are a kind of structural representation of the encapsulating structure for optical finger print identification chip that the utility model embodiment provides
Figure；
Fig. 1 b are that the structure of the encapsulating structure for another optical finger print identification chip that the utility model embodiment provides is shown
It is intended to；
Fig. 2 a are the schematic diagram of the encapsulating structure for another optical finger print identification chip that the utility model embodiment provides；
Fig. 2 b are the schematic diagram of the encapsulating structure for another optical finger print identification chip that the utility model embodiment provides；
Fig. 3 a are the schematic diagram of the encapsulating structure for another optical finger print identification chip that the utility model embodiment provides；
Fig. 3 b are the schematic diagram of the encapsulating structure for another optical finger print identification chip that the utility model embodiment provides；
Fig. 4 a are the schematic diagram of the encapsulating structure for another optical finger print identification chip that the utility model embodiment provides；
Fig. 4 b are the schematic diagram of the encapsulating structure for another optical finger print identification chip that the utility model embodiment provides；
Fig. 5 a- Figure 10 is a kind of flow diagram for packaging method that the utility model embodiment provides；
Figure 11-Figure 14 is the flow diagram for another packaging method that utility model embodiment provides.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
To keep the above objects, features, and advantages of the utility model more obvious and easy to understand, below in conjunction with the accompanying drawings and have
Body embodiment is described in further detail the utility model.
With reference to figure 1a, Fig. 1 a are a kind of encapsulating structure for optical finger print identification chip that the utility model embodiment provides
Structural schematic diagram, the encapsulating structure include：Optical finger print identification chip 11 has opposite front 111 and the back side 112,
External zones of the front 111 with fingerprint identification area and the encirclement fingerprint identification area, the fingerprint identification area have multiple senses
Light pixel 113, the external zones have the weld pad 114 being electrically connected with the photosensitive pixel 113；It is identified with the optical finger print
The cover board that the front 111 of chip 11 is oppositely arranged, the cover board include substrate 12 and light shield layer 13, and the substrate 12 has more
A first through hole T1 for exposing the photosensitive pixel 113；The light shield layer 13 is located at the substrate 12 and deviates from the optics
The side of fingerprint recognition chip 11, the light shield layer 13 have multiple second through-holes opposite one by one with the first through hole T1
T2。
Optionally, the optical finger print identification chip 11 further includes transparent film layer, and the transparent film layer covers its front, uses
In to planarize its outer surface, to protect photosensitive pixel 113 and be pasted convenient for optical finger print identification chip 11 and other structures part
It closes and fixes.By using the transparent film layer with setting refractive index, the transparent film layer can also be multiplexed with antireflection layer increasing
Add light transmission rate.The transparent film layer covers the photosensitive pixel 113, and exposes the weld pad 114.
In encapsulating structure described in the utility model embodiment, the aperture of the first through hole T1 and the second through-hole T12
Aperture it is identical, or the aperture less than the second through-hole T2.The center of the first through hole T1 and the second through-hole T2
Face is arranged.
Have first through hole T1 opposite one by one with the second through-hole T2 in the cover board, the aperture of first through hole T1 is with second
The aperture of through-hole T2 is in the same order of magnitude with the size of the photosensitive pixel 113, and the aperture for also just having a talk about the two is smaller,
In this way so that the cover board has the function of pinhole imaging system by first through hole T1 with the second through-hole T2, the cover board by aperture at
As function opponent's digital reflex light regulates and controls, the cross-interference issue between different photosensitive pixels 113 is reduced, fingerprint recognition is improved
Precision.As shown in Figure 1a, there is preset spacing, for adjusting between the cover board and the optical finger print identification chip 11
The image distance that cover board carries out pinhole imaging system is stated, the image distance is set by setting the spacing, so that the fingerprint of photosensitive pixel 13
Picture quality is preferable, can be by specifically testing or testing the suitable spacing of effect selection, and then selects suitable image distance,
The utility model embodiment is not specifically limited the spacing.
The encapsulating structure further includes glass of color filter L, and the glass of color filter L is for filtering out except detection optical band
Veiling glare improves the precision of fingerprint recognition to reduce light disturbance.
In mode shown in Fig. 1 a, the cover board is provided with optical filtering away from a side surface of the optical finger print identification chip 11
Sheet glass L, the glass of color filter L only cover photosensitive pixel 113, expose the weld pad 114.At this point, the periphery of the cover board
The spacer J with preset thickness between the periphery of the optical finger print identification chip 11.The thickness of the spacer J is equal to
The spacing, the image distance that pinhole imaging system is carried out with the cover board match.The thickness which passes through the adjusting spacer J
It realizes and adjusts the image distance that the cover board carries out pinhole imaging system, in order to regulate and control light.In which, the spacer J is for gluing
The fixed substrate 12 of knot and the optical finger print identification chip 11.
Another way is as shown in Figure 1 b, and Fig. 1 b are that another optical finger print that the utility model embodiment provides identifies core
The structural schematic diagram of the encapsulating structure of piece in which, has institute between the cover board and the optical finger print identification chip 11
Glass of color filter L is stated, at this point, the thickness of the glass of color filter L is equal to the spacing, pinhole imaging system is carried out with the cover board
Image distance matches, and the picture for adjusting the cover board and carrying out pinhole imaging system can be realized by adjusting the thickness of glass of color filter L in which
Away from order to regulate and control light.
In mode shown in Fig. 1 a and Fig. 1 b, the substrate 12 corresponds to the position of the weld pad 114 with described for exposing
First opening K1 of weld pad 114；The light shield layer 13 corresponds to first opening K1 positions and has to be opened for exposing described first
The second opening K2 of mouth K1；The weld pad 114 is used for through the first opening K1 and second opening K2 and a metal
Line is electrically connected, to be electrically connected by the pad of the metal wire and a backboard.It, can be with when being electrically connected with the backboard
The metal wire, the first opening K1 and the second opening K2 are covered by plastic packaging layer.
In mode shown in Fig. 1 a and Fig. 1 b, the first opening K1 is including the first groove Ka and is located at first groove
The second groove Kb, the first groove Ka and the second groove Kb in Ka are for exposing the weld pad 114, and described second
The depth of groove Kb is less than the thickness of the substrate 12.
Optionally, the backboard is pcb board or ceramic substrate or glass substrate.The substrate 12 is silicon substrate.Institute
It is photoresist dry film or photoresist wet film to state light shield layer 13, the second through-hole T2 can be formed by photoetching process, while may be used also
To be multiplexed with the mask layer of the substrate 12, it is used to form the first through hole T1.
In encapsulating structure described in the utility model embodiment, the depth-to-width ratio of the first through hole T1 is not more than 6:1.Described
The depth-to-width ratio of two through-hole T2 is not more than 6:1.The thickness of the substrate 12 is not more than 200 μm.The thickness of the light shield layer 13 is little
In 200 μm.In this way, pinhole imaging system can be realized with the cover board of relatively small thickness.
Optionally, the substrate 12 is adhesively fixed with the optical finger print identification chip 11 by DAF films.Optical filter at this time
Glass is located at the side surface that light shield layer 13 deviates from the optical finger print identification chip 11.When glass of color filter is located at 12 He of substrate
When between optical finger print identification chip 11, the glass of color filter can be set and passed through with the optical finger print identification chip 11
DAF films are adhesively fixed, and substrate 12 is fitted in surface of the glass of color filter away from the side of the optical finger print identification chip 11.
113 array arrangement of the photosensitive pixel, in order to avoid the crosstalk between different photosensitive pixels 113 to ask to the greatest extent
Topic can be arranged the first through hole T1 and be corresponded with the pixel 113.
In mode shown in Fig. 1 a and Fig. 1 b, using conducting wire technique so that the weld pad 114 of the optical finger print identification chip 11
It is electrically connected with the pad of the backboard, in other embodiments, can also pass through TSV (silicon hole) technique so that the light
The pad of the weld pad 114 and the backboard of learning fingerprint recognition chip 11 is electrically connected.Since silicon hole is identified through optical finger print
Without forming the opening for exposing weld pad 114 on the cover board, therefore glass of color filter L and lid can be arranged in the back side of chip 11
Board size is identical, covers the front of entire optical finger print identification chip 11.At this point, the encapsulating structure can be such as Fig. 2 a- Fig. 4 b
It is shown.
With reference to figure 2a, Fig. 2 a are the encapsulating structure for another optical finger print identification chip that the utility model embodiment provides
Schematic diagram, in the embodiment, the position that the back side of the optical finger print identification chip 11 corresponds to the weld pad 114 has silicon
Through-hole GT, the silicon hole GT are for exposing the weld pad 114.The side wall of the silicon hole GT and optical finger print identification
The back side of chip is covered with insulating layer 21；21 surface of the insulating layer is covered with wiring layer 22 again, and the wiring layer again 22 passes through
The silicon hole GT is electrically connected with the weld pad 114, and extends to the outside of the silicon hole GT；The wiring layer again 21 covers
It is stamped solder mask 23, the region opposite with the back side 11 of the optical finger print identification chip 11 of the solder mask 23 has opening,
For solder-bump 24 to be arranged, to be electrically connected by the pad of the solder-bump 24 and a backboard.The solder-bump 24
It is electrically connected in the opening and the wiring layer again 22.The solder-bump 24 can be tin ball, with the pad solder.
In which, also there is glue-line, so that the two is adhesively fixed between the optical finger print identification chip 11 and the backboard.
In Fig. 2 a illustrated embodiments, optical finger print identification chip 11 and the back of the body are made by TSV (silicon hole) technique
Plate binding is electrically connected.In which, the silicon hole GT is double step through-hole, which includes：Positioned at the light
The groove GT1 at the back side 112 of fingerprint recognition chip 11 is learned, the depth of groove GT1 is less than the optical finger print identification chip 11
Thickness；And the through-hole GT2 in the groove GT1, through-hole GT2 run through the optical finger print identification chip 11, use
In exposing the weld pad 114.The corresponding groove GT1 of multiple through-hole GT2 of 11 the same side of optical finger print identification chip can be one
Body structure.
In the mode shown in Fig. 2 a, glass of color filter L is located at the side that cover board deviates from the optical finger print identification chip 11
Surface.At this point, having spacer J between cover board and optical finger print identification chip 11, the thickness by the way that spacer J is arranged adjusts lid
Plate carries out the image distance of pinhole imaging system.Which is double step silicon hole.
Pass through double step silicon hole so that the pad of the weld pad 114 and the backboard of the optical finger print identification chip 11
When electric connection, encapsulating structure can also be as shown in Figure 2 b, and Fig. 2 b are that another optics that the utility model embodiment provides refers to
The schematic diagram of the encapsulating structure of line identification chip, Fig. 2 b are glass of color filter L being arranged in cover board and optics with Fig. 2 a differences
Between fingerprint recognition chip 11, the thickness by the way that glass of color filter L is arranged adjusts the image distance that cover board carries out pinhole imaging system.
When making optical finger print identification chip 11 bind electric connection with the backboard using TSV techniques, the silicon is logical
The structure of hole GT can also be straight hole as shown in Figure 3a, and Fig. 3 a are another optical finger print that the utility model embodiment provides
The schematic diagram of the encapsulating structure of identification chip, the width of the straight hole in a first direction is constant, the first direction perpendicular to
The optical finger print identification chip 11 is directed toward optical finger print identification chip 11 by the front 111 of optical finger print identification chip 11
The back side 112.In which, glass of color filter is located at the side surface that cover board deviates from optical finger print identification chip 11.At this point, cover board
There is spacer J between optical finger print identification chip 11.
When the silicon hole GT is straight hole, as shown in Figure 3b, Fig. 3 b are another light that the utility model embodiment provides
The schematic diagram for learning the encapsulating structure of fingerprint recognition chip can also be arranged glass of color filter and be located at cover board and optical finger print identification core
Between piece 11.
When making optical finger print identification chip 11 bind electric connection with the backboard using TSV techniques, the silicon is logical
The structure of hole GT can also be trapezoidal hole as shown in fig. 4 a, and Fig. 4 a are that another optics that the utility model embodiment provides refers to
The schematic diagram of the encapsulating structure of line identification chip, the width of the trapezoidal hole in a first direction gradually increase, the first party
To perpendicular to the optical finger print identification chip 11, optical finger print identification is directed toward by the front 111 of optical finger print identification chip 11
The back side 112 of chip 11.In which, glass of color filter is located at the side surface that cover board deviates from optical finger print identification chip 11.
At this point, having spacer J between cover board and optical finger print identification chip 11.
When the silicon hole GT is trapezoidal hole, as shown in Figure 4 b, Fig. 4 b are another that the utility model embodiment provides
The schematic diagram of the encapsulating structure of optical finger print identification chip can also be arranged glass of color filter and be located at cover board and optical finger print identification
Between chip 11.
In encapsulating structure described in the utility model embodiment, it may be used described in the front openings exposing of setting on the cover board
Weld pad 114 as illustrated in figs. 1A and ib, can also be identified by setting in optical finger print in order to be electrically connected external circuit
The interconnection architecture at 11 back side of chip, for the interconnection architecture for being electrically connected external circuit, the interconnection architecture includes interconnection layer,
The interconnection layer includes the insulating layer 21, again wiring layer 22 and solder mask 23.
By foregoing description it is found that in encapsulating structure described in the utility model embodiment, in optical finger print identification chip 11
Front 111 setting with first through hole T1 substrate 12, substrate 12 deviate from the optical finger print identification chip 11 side
Surface be arranged light shield layer 13, the light shield layer 13 have with the one-to-one second through-hole T2 of the first through hole T1, pass through institute
First through hole T1 and the second through-hole T2 are stated, the light that special angle reflects can be made by cover board, into fingerprint identification area,
Opticpath is controlled, avoids crosstalk, first through hole T1 that from being corresponded with the photosensitive pixel 113, it can also be one first
Through-hole T1 corresponds to multiple photosensitive pixels 113.
It, can be by hand by the one-to-one first through hole T1 and the second through-hole T2 when carrying out fingerprint recognition
The light subregion of digital reflex, the sensing result to reduce different photosensitive pixels generate crosstalk, improve the precision of fingerprint recognition.
Based on above-mentioned encapsulating structure embodiment, another embodiment of the utility model additionally provides a kind of packaging method, is used for
Optical finger print identification chip is packaged, the encapsulating structure described in above-described embodiment, the packaging method such as Fig. 5 a- Figure 10 are formed
Shown, Fig. 5 a- Figure 10 is a kind of flow diagram for packaging method that the utility model embodiment provides, the packaging method packet
It includes：
Step S11：As shown in figure 5 a and 5b, wafer 10 is provided.
Fig. 5 a are that the wafer 10 corresponds to the optical finger print identification positive vertical view of core, and Fig. 5 b are wafer shown in Fig. 5 a in A-
The sectional drawing of A '.The wafer 10 includes multiple optical finger print identification chips 11.The optical finger print identification chip 11 has phase
To front 111 and the back side 112, front 111 is with fingerprint identification area and surrounds the external zones of the fingerprint identification area.
There are the fingerprint identification area multiple photosensitive pixels 113, the external zones to have the weldering being electrically connected with the photosensitive pixel 113
Pad 114；There is cutting raceway groove 20 between the adjacent optical finger print identification chip 11.
Step S12：As shown in fig. 6, the fixed substrate 12 on the wafer 10.
In the step, a kind of mode of the fixed substrate 10 on the wafer 10 is:By the substrate 12 with it is described
The positive predeterminable area of the contraposition pressing of wafer 10, each optical finger print identification chip 11 is default with the substrate 12
Area bonded is fixed, so that after cutting, in each encapsulating structure, each fingerprint recognition chip 11 of learning is and after corresponding segmentation
Cover board is adhesively fixed；Wherein, there is preset spacing, for adjusting between the substrate 12 and the optical finger print identification chip 11
The image distance that cover board carries out pinhole imaging system is saved, the cover board includes the substrate and following light shield layers.
Which is directly bonded substrate 12 by spacer J with the positive periphery of each optical finger print identification chip 11
It is fixed.There is spacer, the thickness of the spacer between the periphery and the substrate 12 of the optical finger print identification chip 11
The image distance that pinhole imaging system is carried out with the cover board matches.In which, Fig. 6 cover plates directly and each optical finger print identification chip
11 positive periphery is adhesively fixed.
Optionally, the substrate 12 is silicon substrate.The substrate 12 is mask with the light shield layer 13 in subsequent step
Layer, the first through hole T1 is formed using silicon etching process.
Step S13：As shown in fig. 7, deviating from a side surface shape of the optical finger print identification chip 11 in the substrate 12
At light shield layer 13.
Optionally, the light shield layer 13 is photoresist dry film or photoresist wet film, in order to aobvious by exposing in subsequent step
Shadow technique is formed and the one-to-one second through-hole T2 of the photosensitive pixel 113 on the light shield layer 13.
Step S14：As shown in figure 8, pattern the light shield layer 13, multiple second leading to through the light shield layer 13 are formed
Hole T2.
Step S15：As shown in figure 9, being mask layer with the patterned light shield layer 13, the substrate 12, shape are patterned
At the first through hole T1 through the substrate 12.
The first through hole T1 is corresponded for exposing the weld pad 114, and with the second through-hole T2.
Step S16：As shown in Figure 10, by cutting technique, the wafer 10, the substrate 12 and the shading are cut
Layer 13, forms the encapsulating structure of multiple simple grains.
Wherein, the wafer 10 is cut into multiple optical finger print identification chips 11；The substrate 12 and the light shield layer 13
It is cut into multiple and 11 one-to-one part of the optical finger print identification chip.
It is formed after the first through hole T1, the packaging method further includes：Deviate from the substrate in the light shield layer 13
12 side surface is bonded glass of color filter L, and the encapsulating structure of formation is as shown in Figure 1a, the glass of color filter L and the light
Fingerprint recognition chip is learned to correspond.At this point it is possible to before being cut in 11 corresponding region of each optical finger print identification chip
It is bonded glass of color filter L, optical filter can also be bonded in 11 corresponding region of each optical finger print identification chip after dicing
Glass L.
In the packaging method shown in Fig. 5 a- Figure 10, the periphery of the substrate 12 and the optical finger print identification chip 11 it
Between with spacer J, the spacer J thickness be equal to the spacing.The spacer J is for being adhesively fixed the substrate 12
With the optical finger print identification chip 11.
In packaging method described in the utility model embodiment, the light shield layer 13 is photoresist dry film or photoresist wet film, is led to
Overexposure photo development processes are formed and the one-to-one second through-hole T2 of the photosensitive pixel 113 on the light shield layer 13；
The substrate 11 is silicon substrate, is mask layer with the light shield layer 13, the first through hole T1 is formed using silicon etching process.
In the packaging method shown in Fig. 5 a- Figure 10, while forming the second through-hole T2, using exposure imaging technique
The position that the weld pad 114 is corresponded in the light shield layer 13 forms the second opening K2；Based on the second opening K2, using etching
The position that technique corresponds to the weld pad on the substrate forms the first opening K1, for exposing the weld pad 114；Wherein, institute
Weld pad 114 is stated for being electrically connected by the first opening K1 and second opening K2 and a metal wire, to pass through
The pad for stating metal wire and a backboard is electrically connected.Wherein, the first opening is with the first groove Ka and positioned at described first recessed
The second groove Kb in slot Ka.The first opening K1 can be formed forming synchronizing for first through hole T1.
In other embodiments, each optics can also be corresponded to before 10 above-mentioned fixation of the wafer substrate 12
Fingerprint recognition chip 11 is bonded glass of color filter L, at this point, the fixed substrate 12 on the wafer 10 includes:In each institute
The front 111 for stating optical finger print identification chip 11 is bonded and fixes a glass of color filter L；It is solid on the surfaces the glass of color filter L
The fixed substrate 12, the substrate 12 cover all glass of color filter L；Wherein, the thickness of the glass of color filter L makes
There is preset spacing between the substrate 12 and the optical finger print identification chip 11, pinhole imaging system is carried out for adjusting cover board
Image distance, the same cover board includes the substrate 12 and the light shield layer 13, finally formed encapsulating structure such as Fig. 1 b institutes
Show.
In packaging method described in the utility model embodiment, in the front 111 of optical finger print identification chip, setting has the
The substrate 12 of one through-hole T1 and light shield layer 13 with the second through-hole T2 can be avoided effectively between different photosensitive pixels 113
Cross-interference issue, improve fingerprint recognition precision.Meanwhile the light shield layer 13 is also used as the mask layer of substrate 12, simplifies work
Skill flow, reduces the production cost.
The packaging method further includes：Backboard is set away from the side of the substrate in the optical finger print identification chip,
The backboard includes metallic circuit layer and the pad that is electrically connected with the metallic circuit layer；Wherein, the weld pad with it is described
Pad is electrically connected, to be electrically connected by backboard and external circuit.The optical finger print identification chip can by conducting wire with
Backboard binding is electrically connected.
In other modes, can also by TSV techniques encapsulating structure the back side formed interconnection architecture, in order to backboard
Binding is electrically connected, with by backboard and external circuit electric connection, finally formed encapsulating structure is as shown in Fig. 2 a- Fig. 4 b.
As make the encapsulating structure as shown in Fig. 2 a- Fig. 4 a, the production method as shown in figures 11-14, when formation first
After through-hole T1 and the second through-hole T2, further include：
Step S21：As shown in figure 11, before cutting, deviate from the one of the substrate 12 in the optical finger print identification chip 11
Side surface forms silicon hole GT, the silicon hole GT for exposing the weld pad 114.
In the step, wafer 10 is caused so that cover board is arranged downward, in order to form the silicon hole GT.Figure 11 with
It is illustrated for double step through-hole, which includes：Positioned at the back side 112 of the optical finger print identification chip 11
The groove GT1 and through-hole GT2 in the groove GT1.
Step S22：As shown in figure 12, the side wall for covering the silicon hole GT and the optical finger print identification chip are formed
The insulating layer 21 at 11 back sides.
Step S23：As shown in figure 13, wiring layer 22 again for covering the insulating layer 21 are formed, the wiring layer again 22 is logical
It crosses the silicon hole GT to be electrically connected with the weld pad 114, and extends to the external of the silicon hole GT
Step S24：As shown in figure 14, the solder mask 23 of wiring layer 22 again described in covering, the solder mask 23 and institute are formed
The opposite region in the back side for stating optical finger print identification chip 11 has opening, for solder-bump 24, the solder-bump to be arranged
24 are electrically connected for the pad with a backboard.
After the back side of wafer forms back side interconnection architecture, the back side interconnection architecture of wafer is precut first, it will
Interconnection layer (including insulating layer, again wiring layer and solder mask) is divided.It can be described pre- along cutting raceway groove progress by laser
Cutting.It completes, with after cutting, then by cutter to cut backboard and wafer.Since the material of interconnection layer is more crisp, ductility with
And toughness is poor, is precut to back side interconnection layer using laser, can reduce the damage to interconnection layer, avoid its crack or
It is tomography, ensures the reliability of chip.The material hardness of wafer, substrate and light shield layer is same or similar, same to use cutter
The trace precut along laser is cut, it is ensured that the flatness for cutting end face avoids section from damaging.
After cutting, it is bonded glass of color filter L, the encapsulating structure of formation is as shown in Figure 2 a.For being encapsulated shown in Fig. 2 b- Fig. 4 b
Structure, difference lies in the shape of silicon hole GT difference and the position differences of glass of color filter, and forming process can refer to above-mentioned
Description, details are not described herein.
Packaging method described in the utility model embodiment can be used for making encapsulating structure described in above-described embodiment, technique letter
Single, low manufacture cost, the encapsulating structure of formation avoids the cross-interference issue between different photosensitive pixels, improves fingerprint recognition
Precision.
Each embodiment is described by the way of progressive in this specification, the highlights of each of the examples are with other
The difference of embodiment, just to refer each other for identical similar portion between each embodiment.For being encapsulated disclosed in embodiment
For method, since it is corresponding with encapsulating structure disclosed in embodiment, so description is fairly simple, related place is referring to envelope
Assembling structure part illustrates.
The foregoing description of the disclosed embodiments enables professional and technical personnel in the field to realize or use this practicality new
Type.Various modifications to these embodiments will be apparent to those skilled in the art, and determine herein
The General Principle of justice can be realized in other embodiments without departing from the spirit or scope of the present utility model.Cause
This, the utility model is not intended to be limited to the embodiments shown herein, and is to fit to and principles disclosed herein
The widest range consistent with features of novelty.
Claims (16)
1. a kind of encapsulating structure of optical finger print identification chip, which is characterized in that the encapsulating structure includes：
There is optical finger print identification chip opposite front and the back side, front to have described in fingerprint identification area and encirclement
There are multiple photosensitive pixels, the external zones to have and the light-sensitive image for the external zones of fingerprint identification area, the fingerprint identification area
The weld pad that element is electrically connected；
The cover board being oppositely arranged with the front of the optical finger print identification chip；
The cover board includes substrate and light shield layer；The substrate has multiple first through hole for exposing the photosensitive pixel；
The light shield layer be located at the substrate deviate from the optical finger print identification chip side, the light shield layer have it is multiple with it is described
First through hole opposite the second through-hole one by one.
2. encapsulating structure according to claim 1, which is characterized in that the cover board and the optical finger print identification chip it
Between there is preset spacing, the image distance of pinhole imaging system is carried out for adjusting the cover board.
3. encapsulating structure according to claim 1, which is characterized in that the cover board and the optical finger print identification chip it
Between have glass of color filter, for filter out detection optical band except veiling glare.
4. encapsulating structure according to claim 1, which is characterized in that the cover board deviates from the optical finger print identification chip
A side surface be provided with glass of color filter, for filter out detection optical band except veiling glare.
5. encapsulating structure according to claim 1, which is characterized in that the periphery of the cover board is identified with the optical finger print
Spacer with preset thickness between the periphery of chip.
6. encapsulating structure according to claim 1, which is characterized in that the position that the substrate corresponds to the weld pad has use
In the first opening for exposing the weld pad；
The position that the light shield layer corresponds to first opening has for exposing described first the second opening being open；
The weld pad is used to be open by described first and second opening is electrically connected with a metal wire, described to pass through
The pad of metal wire and a backboard is electrically connected.
7. encapsulating structure according to claim 6, which is characterized in that first opening includes the first groove and is located at
The second groove in first groove, first groove and second groove are for exposing the weld pad.
8. encapsulating structure according to claim 1, which is characterized in that the back side of the optical finger print identification chip corresponds to institute
The position for stating weld pad has silicon hole, and the silicon hole is for exposing the weld pad；
The back side of the side wall of the silicon hole and the optical finger print identification chip is covered with insulating layer；
The surface of insulating layer is covered with wiring layer again, and the wiring layer again is electrically connected by the silicon hole and the weld pad
It connects, and extends to the outside of the silicon hole；
The wiring layer again is covered with solder mask, the solder mask region opposite with the back side of optical finger print identification chip
With opening, the opening is for being arranged solder-bump, to be electrically connected by the pad of the solder-bump and a backboard.
9. encapsulating structure according to claim 1, which is characterized in that the substrate is silicon substrate.
10. encapsulating structure according to claim 1, which is characterized in that the light shield layer is that photoresist dry film or photoresist are wet
Film.
11. encapsulating structure according to claim 1, which is characterized in that the depth-to-width ratio of the first through hole is not more than 6:1.
12. encapsulating structure according to claim 1, which is characterized in that the depth-to-width ratio of second through-hole is not more than 6:1.
13. encapsulating structure according to claim 1, which is characterized in that the thickness of the substrate is not more than 200 μm.
14. encapsulating structure according to claim 1, which is characterized in that the thickness of the light shield layer is not more than 200 μm.
15. encapsulating structure according to claim 1, which is characterized in that the substrate and the optical finger print identification chip
It is adhesively fixed by DAF films.
16. encapsulating structure according to claim 1, which is characterized in that the photosensitive pixel array arrangement, described first is logical
Hole is corresponded with the pixel.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721773041.XU CN207651485U (en) | 2017-12-18 | 2017-12-18 | A kind of encapsulating structure of optical finger print identification chip |
| US16/210,989 US10817700B2 (en) | 2017-12-18 | 2018-12-05 | Optical fingerprint recognition chip package and packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721773041.XU CN207651485U (en) | 2017-12-18 | 2017-12-18 | A kind of encapsulating structure of optical finger print identification chip |
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| CN207651485U true CN207651485U (en) | 2018-07-24 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107910344A (en) * | 2017-12-18 | 2018-04-13 | 苏州晶方半导体科技股份有限公司 | A kind of encapsulating structure and method for packing of optical finger print identification chip |
| US10817700B2 (en) | 2017-12-18 | 2020-10-27 | China Wafer Level Csp Co., Ltd. | Optical fingerprint recognition chip package and packaging method |
-
2017
- 2017-12-18 CN CN201721773041.XU patent/CN207651485U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107910344A (en) * | 2017-12-18 | 2018-04-13 | 苏州晶方半导体科技股份有限公司 | A kind of encapsulating structure and method for packing of optical finger print identification chip |
| US10817700B2 (en) | 2017-12-18 | 2020-10-27 | China Wafer Level Csp Co., Ltd. | Optical fingerprint recognition chip package and packaging method |
| CN107910344B (en) * | 2017-12-18 | 2021-02-23 | 苏州晶方半导体科技股份有限公司 | Packaging structure and packaging method of optical fingerprint identification chip |
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