WO2021103109A1

WO2021103109A1 - Packaging structure for biometric identification chip

Info

Publication number: WO2021103109A1
Application number: PCT/CN2019/123633
Authority: WO
Inventors: 王凯厚; 杨剑宏
Original assignee: 苏州晶方半导体科技股份有限公司
Priority date: 2019-11-28
Filing date: 2019-12-06
Publication date: 2021-06-03
Also published as: CN110970454B; CN110970454A

Abstract

A packaging structure for a biometric identification chip (10). The packaging structure comprises: a biometric identification chip (10), the biometric identification chip (10) having a first surface (100) and a second surface (101) provided opposite to the first surface (100), the first surface (100) of the biometric identification chip (10) being provided with a photosensitive region (A1), the photosensitive region (A1) being provided with a plurality of photosensitive pixels (11) arranged in an array; and a first light-transmitting layer (20) located on the first surface (100) of the biometric identification chip (10), a third surface (200) of the first light-transmitting layer (20) being provided with a plurality of grooves (21), the grooves (21) being filled with a light-shielding material (22), a part or all region of one photosensitive pixel (11) being exposed in a gap between any two adjacent grooves (21), and a ratio of the depth (L1) of the grooves (21) to the thickness (L2) of the first light-transmitting layer (20) being greater than or equal to 2/3.

Description

Package structure of biometric identification chip

This disclosure claims the priority of a Chinese patent application filed with the Chinese Patent Office with an application number of 201911189393.4 on November 28, 2019, and the entire content of the above application is incorporated into this disclosure by reference.

Technical field

This application relates to the field of packaging technology, for example, to a packaging structure of a biometric identification chip.

Background technique

With the advancement of science and technology, biometric identification technology has become more and more widely used in personal identification and personal information security due to its high security, high reliability, and simple and convenient use.

The relevant biometric identification device extracts the user's biometrics and converts the user's finger biometrics into signal output to obtain the user's biometrics information.

Optical biometric identification chip is a commonly used biometric identification chip in related biometric identification devices. When performing biometric identification, light is irradiated to the user’s biometric surface and reflected to the photosensitive pixel. The photosensitive pixel converts the biometric light signal into The electrical signal is output to obtain the user's biometric information, but the related biometric recognition chip has the problem of low recognition accuracy.

Summary of the invention

In view of this, the present application provides a packaging structure of a biometric identification chip, which solves the problem of low recognition accuracy of the biometric identification chip in related technologies.

The embodiment of the present application provides a packaging structure of a biometric identification chip, including:

A biometric recognition chip, the biometric recognition chip having a first surface and a second surface disposed opposite to the first surface, the first surface of the biometric recognition chip is provided with a photosensitive area and surrounding the photosensitive area Non-photosensitive area, the photosensitive area is provided with a plurality of photosensitive pixels arranged in an array, and the non-photosensitive area is provided with a plurality of pads, which are electrically connected to the photosensitive pixels;

The first light-transmitting layer is located on the first surface of the biometric recognition chip. The first light-transmitting layer has a third surface and a fourth surface opposite to the third surface. The third surface In order to be close to the surface of the first surface of the biometric recognition chip, the third surface of the first light-transmitting layer is provided with a plurality of grooves, and the grooves are filled with light-shielding material, and any two adjacent grooves are arranged in the grooves. The gap between the grooves exposes a part or all of the photosensitive pixel, and the ratio of the depth of the groove to the thickness of the first light-transmitting layer is greater than or equal to 2/3.

The ratio of the depth of the groove to the thickness of the first transparent layer is less than or equal to 3/4.

It also includes a prism layer located on the fourth surface of the first light-transmitting layer.

The prism layer includes a plurality of prisms arranged in an array, and the prisms are arranged in a one-to-one correspondence with the photosensitive pixels.

It also includes a transparent cover plate, which is located on the surface of the prism layer away from the first light-transmitting layer.

It also includes a second light-transmitting layer located between the biometric identification chip and the first light-transmitting layer.

It also includes a light filter layer located between the first light transmitting layer and the second light transmitting layer, and/or between the first light transmitting layer and the prism layer.

The light-shielding material includes chromium or black organic matter.

The light transmittance of the first light-transmitting layer is greater than or equal to 92%.

The light transmittance of the second light-transmitting layer is greater than or equal to 92%.

The biometric recognition chip includes one or more of an optical fingerprint recognition chip, an iris recognition chip, or a face recognition chip.

In the packaging structure of a biometric identification chip provided in the present application, light is irradiated to the user’s biometric surface and reflected to the photosensitive pixel through the gap between any two adjacent grooves of the first light-transmitting layer. When the user’s biological feature surface is reflected by the first light-transmitting layer, the ratio of the depth of the groove to the thickness of the first light-transmitting layer is greater than or equal to 2/3, and the groove is filled with light-shielding material. A light-transmitting layer whose thickness ratio is greater than or equal to 2/3 is filled with light-shielding material in the groove, which can absorb and block light whose propagation direction is not perpendicular to the first surface, so as to reflect the light whose propagation direction is perpendicular to the first surface. To the photosensitive pixel, to avoid the light whose propagation direction is not perpendicular to the first surface is reflected to the photosensitive pixel, that is, the adjustment and control of the light path to the photosensitive pixel is completed, so that the light of a specific incident angle illuminates the corresponding photosensitive pixel to avoid different photosensitive pixels. The problem of crosstalk between pixels improves the recognition accuracy of the optical biometric recognition chip.

Description of the drawings

FIG. 1 is a schematic structural diagram of a packaging structure of a biometric identification chip provided by an embodiment of the application;

2 is a schematic structural diagram of another package structure of a biometric identification chip provided by an embodiment of the application;

FIG. 3 is a schematic structural diagram of another packaging structure of a biometric identification chip provided by an embodiment of the application;

4 is a schematic structural diagram of yet another biometric identification chip packaging structure provided by an embodiment of the application;

FIG. 5 is a schematic flowchart of a method for packaging a biometric identification chip according to an embodiment of the application;

FIGS. 6-7 are cross-sectional views corresponding to the steps of a method for packaging a biometric identification chip according to an embodiment of the application;

FIG. 8 is a schematic flowchart of another method for packaging a biometric identification chip according to an embodiment of the application;

9-12 are cross-sectional views corresponding to the steps of another method for packaging a biometric identification chip according to an embodiment of the application;

FIG. 13 is a schematic flowchart of yet another method for packaging a biometric identification chip according to an embodiment of the application;

14-16 are cross-sectional views corresponding to each step of another method for packaging a biometric identification chip provided by an embodiment of the application;

FIG. 17 is a schematic flowchart of yet another method for packaging a biometric chip according to an embodiment of the application.

Detailed ways

The application will be further described in detail below with reference to the drawings and embodiments. FIG. 1 is a schematic structural diagram of a package structure of a biometric identification chip provided by an embodiment of the application. 1, the package structure of the biometric recognition chip includes: a biometric recognition chip 10, the biometric recognition chip 10 has a first surface 100 and a second surface 101 disposed opposite to the first surface 100, the biometric recognition chip 10 The first surface 100 is provided with a photosensitive area A1 and a non-photosensitive area A2 surrounding the photosensitive area A1. The photosensitive area A1 is provided with a plurality of photosensitive pixels 11 arranged in an array, and the non-photosensitive area A2 is provided with a plurality of pads 12 and photosensitive pixels. 11 is electrically connected; the first light-transmitting layer 20 is located on the first surface 100 of the biometric identification chip 10, the first light-transmitting layer 20 has a third surface 200 and a fourth surface 201 opposite to the third surface 200, The third surface 200 is a surface close to the first surface 100 of the biometric identification chip 10, and the third surface 200 of the first light-transmitting layer 20 is provided with a plurality of grooves 21, and the grooves 21 are filled with light-shielding materials 22. The gap between two adjacent grooves 21 exposes part or all of a photosensitive pixel 11, and the ratio of the depth L1 of the groove 21 to the thickness L2 of the first transparent layer 20 is greater than or equal to 2/3.

The relevant biometric identification device extracts the user's biometrics and converts the user's finger biometrics into signal output to obtain the user's biometrics information. Optical biometric identification chip is a commonly used biometric identification chip in related biometric identification devices. When performing biometric identification, light irradiates the user's biometric surface and is reflected to the photosensitive pixel. The photosensitive pixel converts the biometric light signal The electrical signal is output via the pad.

In the current packaging structure of the optical biometric recognition chip, there is a problem of optical crosstalk between different photosensitive pixels, which leads to the problem of low recognition accuracy in the related optical biometric recognition chip.

In the technical solution provided by this embodiment, light is irradiated to the user’s biological feature surface and is reflected to the photosensitive pixel 11 through the gap between any two adjacent grooves 21 of the first light-transmitting layer 20. When the light is irradiated to the user’s When the biological feature surface is reflected by the first light-transmitting layer 20, the ratio of the depth L1 of the groove 21 to the thickness L2 of the first light-transmitting layer 20 is greater than or equal to 2/3, and the groove 21 is filled with light-shielding material 22 , The ratio of the depth L1 to the thickness L2 of the first light-transmitting layer 20 is greater than or equal to 2/3, and the light-shielding material 22 filled in the groove 21 can absorb and block the light whose propagation direction is not perpendicular to the first surface, so as to spread The light whose direction is perpendicular to the first surface is reflected to the photosensitive pixel 11 to prevent the light whose propagation direction is not perpendicular to the first surface from being reflected to the photosensitive pixel 11. That is, the adjustment control of the light path to the photosensitive pixel 11 is completed, so that the specific incidence is The angle of light irradiates the corresponding photosensitive pixel 11 to avoid the problem of crosstalk between different photosensitive pixels 11 and improve the recognition accuracy of the optical biometric identification chip.

Wherein, when the ratio of the depth L1 of the groove 21 to the thickness L2 of the first light-transmitting layer 20 is less than 2/3, the effect of absorbing and blocking the light whose propagation direction is not perpendicular to the first surface is poor.

Optionally, on the basis of the above technical solution, referring to FIG. 1, the ratio of the depth L1 of the groove 21 to the thickness L2 of the first light-transmitting layer 20 is less than or equal to 3/4. The greater the ratio of the depth L1 of the groove 21 to the thickness L2 of the first light-transmitting layer 20, the better the effect of absorbing and blocking the light whose propagation direction is not perpendicular to the first surface, but when it is greater than 3/4, the etching Time and cost will also increase.

Optionally, based on the above technical solution, referring to FIG. 2, the packaging structure of the biometric identification chip further includes: a prism layer 30 located on the fourth surface 201 of the first light-transmitting layer 20. The prism layer 30 functions to change the propagation direction of light.

Optionally, based on the above technical solution, referring to FIG. 3, the prism layer 30 includes a plurality of prisms 31 arranged in an array, and the prisms 31 are arranged in a one-to-one correspondence with the photosensitive pixels 11. The prism 31 and the photosensitive pixels 11 are arranged in a one-to-one correspondence, precisely for each photosensitive pixel 11, changing the direction of light propagation, improving the recognition accuracy of the optical biometric recognition chip, reducing the production cost, and reducing the weight of the packaging structure .

Optionally, on the basis of the above technical solution, referring to FIG. 3, it further includes a transparent cover plate 40 located on the surface of the prism layer 30 away from the first light-transmitting layer 20. The transparent cover plate 40 functions to protect the prism layer 30.

Optionally, on the basis of the above technical solution, referring to FIG. 4, the packaging structure of the biometric identification chip further includes a second light-transmitting layer 50 located between the biometric identification chip 10 and the first light-transmitting layer 20. The second light-transmitting layer 50 can play a role in protecting the photosensitive pixels 11 on the first surface of the biometric identification chip 10.

Optionally, on the basis of the above technical solution, referring to FIG. 4, the packaging structure of the biometric identification chip further includes a filter layer 60 located between the first light-transmitting layer 20 and the second light-transmitting layer 50, and/ Or, it is located between the first light-transmitting layer 20 and the prism layer 30. It should be noted that FIG. 4 only shows the filter layer 60, the structure between the first light-transmitting layer 20 and the second light-transmitting layer 50, and the structure between the first light-transmitting layer 20 and the prism layer 30. Happening. The photosensitive pixel 11 can convert light of a specific wavelength band into an electrical signal, and the filter layer 60 only transmits the light of the specific wavelength band.

Optionally, based on the above technical solution, the light-shielding material 22 includes chromium or black organic matter. Chromium or black organic matter can absorb and block the light irradiated on it.

Optionally, based on the above technical solution, the light transmittance of the first light-transmitting layer 20 is greater than or equal to 92%. The light transmittance of the first light-transmitting layer 20 is greater than or equal to 92%, so that the light irradiates the user's biological feature surface and reflects through the gap between any two adjacent grooves 21 of the first light-transmitting layer 20 to the photosensitive Pixel 11.

Optionally, based on the above technical solution, the light transmittance of the second light-transmitting layer 50 is greater than or equal to 92%. The light transmittance of the second light-transmitting layer 50 is greater than or equal to 92%, so that the light irradiates the biological feature surface of the user and passes through the gap between any two adjacent grooves 21 of the first light-transmitting layer 20 and the second The light-transmitting layer 50 is reflected on the photosensitive pixel 11.

Optionally, on the basis of the foregoing technical solution, the biometric identification chip includes one or more of an optical fingerprint identification chip, an iris identification chip, or a face identification chip.

When the biometric identification chip includes an optical fingerprint identification chip, the light irradiates the user's fingerprint surface and is reflected to the photosensitive pixel, and the photosensitive pixel converts the optical signal of the fingerprint into an electrical signal for output.

When the biometric recognition chip includes an iris recognition chip, the light irradiates the iris in the user's eye and is reflected to the photosensitive pixel, and the photosensitive pixel converts the light signal of the iris into an electrical signal for output.

When the biometric recognition chip includes a face recognition chip, the light irradiates the user's face and is reflected to the photosensitive pixel, and the photosensitive pixel converts the light signal of the human face into an electrical signal for output.

Based on the same inventive concept, an embodiment of the present invention also provides a method for packaging a biometric identification chip. FIG. 5 is a flowchart of a method for packaging a biometric identification chip according to an embodiment of the present invention. Referring to FIG. 5, the packaging method of the biometric identification chip includes:

Step 110: Provide a biometric recognition chip. The biometric recognition chip has a first surface and a second surface opposite to the first surface. The first surface of the biometric recognition chip is provided with a photosensitive area and a non-sensitive area surrounding the photosensitive area. The photosensitive area is provided with a plurality of photosensitive pixels arranged in an array, and the non-photosensitive area is provided with a plurality of pads, which are electrically connected to the photosensitive pixels.

Referring to FIG. 6, a biometric identification chip 10 is provided. The biometric identification chip 10 has a first surface 100 and a second surface 101 opposite to the first surface 100. The first surface 100 of the biometric identification chip 10 is provided with a photosensitive area A1. As well as the non-photosensitive area A2 surrounding the photosensitive area A1, the photosensitive area A1 is provided with a plurality of photosensitive pixels 11 arranged in an array, and the non-photosensitive area A2 is provided with a plurality of pads 12 which are electrically connected to the photosensitive pixels 11.

Step 120: A first light-transmitting layer is formed on the first surface of the biometric recognition chip. The first light-transmitting layer has a third surface and a fourth surface opposite to the third surface. The third surface is close to the biometric recognition. The surface of the first surface of the chip and the third surface of the first light-transmitting layer are provided with a plurality of grooves, and the grooves are filled with light-shielding material. The gap between any two adjacent grooves exposes a photosensitive pixel In part or all of the area, the ratio of the depth of the groove to the thickness of the first light-transmitting layer is greater than or equal to 2/3.

Referring to FIG. 7, a first light-transmitting layer 20 is formed on the first surface 100 of the biometric recognition chip 10. The first light-transmitting layer 20 has a third surface 200 and a fourth surface 201 disposed opposite to the third surface 200. The third surface 200 is a surface close to the first surface 100 of the biometric identification chip 10, and the third surface 200 of the first light-transmitting layer 20 is provided with a plurality of grooves 21, and the grooves 21 are filled with light-shielding materials 22. The gap between two adjacent grooves 21 exposes part or all of a photosensitive pixel 11, and the ratio of the depth L1 of the groove 21 to the thickness L2 of the first transparent layer 20 is greater than or equal to 2/3.

In the technical solution provided by this embodiment, light is irradiated to the user's biological feature surface and reflected to the photosensitive pixel through the gap between any two adjacent grooves of the first light-transmitting layer, and the light is irradiated to the user's biological feature surface. And during the reflection process of the first light-transmitting layer, the ratio of the depth of the groove to the thickness of the first light-transmitting layer is greater than or equal to 2/3, and the groove is filled with light-shielding material. The light-shielding material filled in the groove with a ratio greater than or equal to 2/3 can absorb and block the light whose propagation direction is not perpendicular to the first surface, so as to reflect the light whose propagation direction is perpendicular to the first surface to the photosensitive pixel and avoid propagation The light whose direction is not perpendicular to the first surface is reflected to the photosensitive pixel, that is, the adjustment control of the light path to the photosensitive pixel is completed, so that the light of a specific incident angle illuminates the corresponding photosensitive pixel, avoiding crosstalk between different photosensitive pixels , Improve the recognition accuracy of the optical biometric recognition chip.

Optionally, on the basis of the foregoing technical solution, referring to FIG. 8, step 120 forming a first light-transmitting layer on the first surface of the biometric recognition chip includes:

Step 1201: Provide a first light-transmitting layer. The first light-transmitting layer has a third surface and a fourth surface opposite to the third surface.

Referring to FIG. 9, a first light-transmitting layer 20 is provided. The first light-transmitting layer 20 has a third surface 200 and a fourth surface 201 opposite to the third surface 200. Wherein, optionally, the light transmittance of the first light-transmitting layer 20 is greater than or equal to 92%. The light transmittance of the first light-transmitting layer 20 is greater than or equal to 92%, so that the light irradiates the user's biological feature surface and reflects through the gap between any two adjacent grooves 21 of the first light-transmitting layer 20 to the photosensitive Pixel 11.

Step 1202, forming a plurality of grooves on the third surface of the first light-transmitting layer, the ratio of the depth of the grooves to the thickness of the first light-transmitting layer is greater than or equal to 2/3.

Referring to FIG. 10, a plurality of grooves 21 are formed on the third surface 200 of the first transparent layer 20, and the ratio of the depth of the grooves 21 to the thickness of the first transparent layer 20 is greater than or equal to 2/3. Wherein, when the ratio of the depth L1 of the groove 21 to the thickness L2 of the first light-transmitting layer 20 is less than 2/3, the effect of absorbing and blocking the light whose propagation direction is not perpendicular to the first surface is poor. Optionally, the ratio of the depth L1 of the groove 21 to the thickness L2 of the first light-transmitting layer 20 is less than or equal to 3/4. The greater the ratio of the depth L1 of the groove 21 to the thickness L2 of the first light-transmitting layer 20, the better the effect of absorbing and blocking the light whose propagation direction is not perpendicular to the first surface, but when it is greater than 3/4, the etching Time and cost will also increase.

Step 1203: Fill the groove with light-shielding material.

Referring to FIG. 11, the recess 21 is filled with a light-shielding material 22. The light-shielding material includes chromium or black organic matter. Chromium or black organic matter can absorb and block the light irradiated on it.

Step 1204, forming a first light-transmitting layer on the first surface of the biometric identification chip.

Referring to FIG. 12, the first light-transmitting layer 20 is formed on the first surface 100 of the biometric identification chip 10. Optionally, the first light-transmitting layer 20 can be attached to the first surface 100 of the biometric recognition chip 10.

Optionally, on the basis of the above technical solution, step 1202 forming a plurality of grooves on the third surface of the first light-transmitting layer includes: forming a plurality of grooves on the third surface of the first light-transmitting layer through an etching process. groove. The etching process may be dry etching or wet etching.

Optionally, on the basis of the above technical solution, referring to FIG. 13, step 120 further includes after forming the first light-transmitting layer on the first surface of the biometric recognition chip:

Step 130, forming a prism layer on the fourth surface of the first transparent layer.

Referring to FIG. 14, a prism layer 30 is formed on the fourth surface 201 of the first light-transmitting layer 20.

The prism layer 30 functions to change the propagation direction of light.

Optionally, on the basis of the foregoing technical solution, step 130 forming a prism layer on the fourth surface of the first light-transmitting layer includes: forming a plurality of prisms arranged in an array on the fourth surface of the first light-transmitting layer, The prism and the photosensitive pixel are arranged in one-to-one correspondence.

Referring to FIG. 15, a plurality of prisms 31 arranged in an array are formed on the fourth surface 201 of the first light-transmitting layer 20, and the prisms 31 are arranged in a one-to-one correspondence with the photosensitive pixels 11. The prism 31 and the photosensitive pixels 11 are arranged in a one-to-one correspondence, precisely for each photosensitive pixel 11, changing the direction of light propagation, improving the recognition accuracy of the optical biometric recognition chip, reducing the production cost, and reducing the weight of the packaging structure .

Optionally, on the basis of the foregoing technical solution, referring to FIG. 13, step 130 after forming a prism layer on the fourth surface of the first light-transmitting layer further includes:

Step 140, forming a transparent cover plate on the surface of the prism layer on the side away from the first light-transmitting layer.

Referring to FIG. 16, a transparent cover plate 40 is formed on the surface of the prism layer 30 away from the first light-transmitting layer 20. The transparent cover plate 40 functions to protect the prism layer 30.

Optionally, on the basis of the foregoing technical solution, referring to FIG. 17, step 120 before forming the first light-transmitting layer on the first surface of the biometric recognition chip further includes:

Step 1101, forming a second light-transmitting layer on the first surface of the biometric identification chip.

Taking FIG. 4 as an example for description, a second light-transmitting layer 50 is formed on the first surface 100 of the biometric identification chip 10. The light transmittance of the second light-transmitting layer 50 is greater than or equal to 92%. The light transmittance of the second light-transmitting layer 50 is greater than or equal to 92%, so that the light irradiates the biological feature surface of the user and passes through the gap between any two adjacent grooves 21 of the first light-transmitting layer 20 and the second The light-transmitting layer 50 is reflected on the photosensitive pixel 11.

Optionally, on the basis of the foregoing technical solution, step 120 further includes before forming the first light-transmitting layer on the surface of the second light-transmitting layer on the side far from the biometric recognition chip:

Step 1102: Form a light filter layer on the surface of the second light-transmitting layer that is away from the biometric identification chip.

Taking FIG. 4 as an example for description, a filter layer 60 is formed on the surface of the second light-transmitting layer 50 away from the biometric identification chip 10. Optionally, a filter layer 60 is attached to the surface of the second light-transmitting layer 50 away from the biometric identification chip 10.

Optionally, on the basis of the foregoing technical solution, step 130 before forming the prism layer on the fourth surface of the first light-transmitting layer further includes: forming a light filter layer on the fourth surface of the first light-transmitting layer.

Taking FIG. 4 as an example for description, a filter layer 60 is formed on the fourth surface 201 of the first light-transmitting layer 20. Optionally, a filter layer 60 is attached to the fourth surface 201 of the first transparent layer 20.

The photosensitive pixel 11 can convert light of a specific wavelength band into an electrical signal, and the filter layer 60 only transmits the light of the specific wavelength band.

Claims

A packaging structure of a biometric identification chip, including:

A biometric recognition chip, the biometric recognition chip having a first surface and a second surface disposed opposite to the first surface, and the first surface of the biometric recognition chip is provided with a photosensitive area and surrounding the photosensitive area Non-photosensitive area, the photosensitive area is provided with a plurality of photosensitive pixels arranged in an array, and the non-photosensitive area is provided with a plurality of pads, which are electrically connected to the photosensitive pixels;

The first light-transmitting layer is located on the first surface of the biometric recognition chip. The first light-transmitting layer has a third surface and a fourth surface opposite to the third surface. The third surface In order to be close to the surface of the first surface of the biometric recognition chip, the third surface of the first light-transmitting layer is provided with a plurality of grooves, and the grooves are filled with light-shielding material, and any two adjacent grooves The gap between the grooves exposes a part or all of the photosensitive pixel, and the ratio of the depth of the groove to the thickness of the first light-transmitting layer is greater than or equal to 2/3.
The biometric identification chip packaging structure according to claim 1, wherein the ratio of the depth of the groove to the thickness of the first light-transmitting layer is less than or equal to 3/4.
The biometric identification chip packaging structure according to claim 1, further comprising a prism layer located on the fourth surface of the first light-transmitting layer.
3. The biometric identification chip packaging structure according to claim 3, wherein the prism layer comprises a plurality of prisms arranged in an array, and the prisms are arranged in a one-to-one correspondence with the photosensitive pixels.
3. The biometric identification chip packaging structure according to claim 3, further comprising a transparent cover plate located on the surface of the prism layer away from the first light-transmitting layer.
The biometric identification chip packaging structure according to claim 3, further comprising a second light-transmitting layer located between the biometric identification chip and the first light-transmitting layer.
The biometric identification chip packaging structure according to claim 6, further comprising a filter layer, located between the first light transmitting layer and the second light transmitting layer, and/or, located on the first light transmitting layer Between the optical layer and the prism layer.
The package structure of the biometric identification chip according to claim 1, wherein the light-shielding material includes chromium or black organic matter.
The biometric identification chip packaging structure according to claim 1, wherein the light transmittance of the first light-transmitting layer is greater than or equal to 92%.
The biometric identification chip packaging structure according to claim 6, wherein the light transmittance of the second light-transmitting layer is greater than or equal to 92%.
The biometric identification chip packaging structure according to claim 1, wherein the biometric identification chip comprises one or more of an optical fingerprint identification chip, an iris identification chip, or a face identification chip.