WO2021184743A1

WO2021184743A1 - Fingerprint identification chip packaging structure and method

Info

Publication number: WO2021184743A1
Application number: PCT/CN2020/120859
Authority: WO
Inventors: 王凯厚; 王鑫琴; 杨剑宏; 喻琼
Original assignee: 苏州晶方半导体科技股份有限公司
Priority date: 2020-03-19
Filing date: 2020-10-14
Publication date: 2021-09-23
Also published as: CN111192931A

Abstract

A packaging structure and a packaging method. The packaging structure (10) comprises: a first light-transmitting layer (12) having opposite first and second surfaces; a first component (11) attached to the first surface of the first light-transmitting layer (12), the first component (11) comprising a fingerprint identification chip (111), and a plurality of pixel points (1111) for acquiring fingerprint information being provided on the surface of the fingerprint identification chip (111) close to the first light-transmitting layer (12); a second component (13) attached to the second surface of the first light-transmitting layer (12), the second component (13) comprising a first light-shielding layer (131) and a second light-transmitting layer (132), the first light-shielding layer (131) being formed between the second light-transmitting layer (132) and the first light-transmitting layer (12), a plurality of light-transmitting holes (1311) being formed in the first light-shielding layer (131), and each light-transmitting hole (1311) corresponding to a pixel point (1111). By making two important wafer components at first, and then bonding same to each other, the difficulty of processing is reduced, mass production is facilitated, and costs are reduced.

Description

Packaging structure and method of fingerprint identification chip

Technical field

The invention belongs to the field of semiconductor technology, and specifically relates to a fingerprint identification chip packaging structure and packaging method.

Background technique

With the continuous advancement of science and technology, more and more electronic devices are widely used in people's daily life and work, bringing great convenience to people's daily life and work, and becoming an indispensable tool for people today . With the continuous increase of the functions of electronic devices, more and more important information is stored in electronic devices, and the identification verification technology of electronic devices has become a main direction of electronic device research and development.

Due to the uniqueness and immutability of fingerprints, fingerprint identification technology has many advantages such as good security, high reliability, and simple use. Therefore, fingerprint recognition technology has become the mainstream technology for identity verification of various electronic devices.

At present, the optical fingerprint recognition chip is one of the commonly used fingerprint recognition chips in existing electronic devices. It collects the user's fingerprint information through a large number of photosensitive pixels (pixels) in the fingerprint recognition area, and each photosensitive pixel serves as a detection. Specifically, during fingerprint recognition, light is irradiated on the fingerprint surface of the user and reflected to the photosensitive pixel through the fingerprint surface. The photosensitive pixel converts the optical signal of the fingerprint into an electrical signal, and fingerprint information can be obtained based on the electrical signal converted by all pixels.

When the existing optical fingerprint identification chip is packaged, a transparent cover is generally directly arranged on the photosensitive side. However, since the transparent cover plate is completely light-transmissive, it will cause crosstalk of the sensing results of different photosensitive pixels, which affects the accuracy of fingerprint recognition.

In order to solve this technical problem, Chinese patent application CN108022904A discloses a method for packaging a fingerprint identification chip, which fixes a cover plate with a through-hole structure on the side of the wafer facing the pixels to avoid crosstalk problems. The existing problems include at least: the through holes on the cover plate need to be formed in advance, and then the cover plate with the through holes is bonded to the chip surface, but this takes a long time for the operation process, and it also requires the position of the through holes and the pixel points to be calibrated. Errors are easy to occur; if the through hole is made after the cover plate and the chip are combined, there is no obstruction between the cover plate and the chip, and it is easy to cause damage to the pixels located under the through hole.

In addition, the packaging structure of fingerprint recognition chips in the prior art generally uses wafer-level packaging to improve packaging efficiency. Wafer-level packaging is to directly perform most or all of the packaging and testing procedures on the wafer, and then perform dicing. (Singulation) is made into a single component. The problem is that when a certain packaging procedure or part of the packaging position is defective, the entire packaging structure is scrapped and the cost is high.

Summary of the invention

An embodiment of the present invention provides a fingerprint recognition chip packaging structure and method, which are used to solve the technical problems of high processing cost and easy pixel damage in the prior art, including:

The embodiment of the present application provides a packaging structure of a fingerprint identification chip, including:

The first light-transmitting layer has a first surface and a second surface opposite to each other;

The first component is pasted on the first surface of the first light-transmitting layer, the first component includes a fingerprint recognition chip, and the surface of the fingerprint recognition chip close to the first light-transmitting layer has a plurality of pixels for collecting fingerprint information;

The second component is pasted on the second surface of the first light-transmitting layer. The second component includes a first light-shielding layer and a second light-transmitting layer. The first light-shielding layer is formed between the second light-transmitting layer and the first light-transmitting layer A plurality of light-transmitting holes are formed on the first light-shielding layer, and each of the light-transmitting holes corresponds to a pixel point.

Preferably, in the above-mentioned fingerprint identification chip packaging structure, the first component further includes a light filter formed between the fingerprint identification chip and the first light-transmitting layer.

Preferably, in the above-mentioned packaging structure of the fingerprint identification chip, the filter is attached to the surface of the fingerprint identification chip.

Preferably, in the above-mentioned fingerprint recognition chip packaging structure, the second component further includes a condenser lens formed on the surface of the second light-transmitting layer, and the condenser lens and the first light-shielding layer are located opposite to the second light-transmitting layer. Two surfaces,

Each of the condenser lenses corresponds to one of the light-transmitting holes.

Preferably, in the above-mentioned fingerprint recognition chip packaging structure, the material of the first light shielding layer is monocrystalline silicon, or polycrystalline silicon, or amorphous silicon, or silicon germanium, or silicon carbide.

Preferably, in the aforementioned fingerprint recognition chip packaging structure, the first light-transmitting layer and the second light-transmitting layer are selected from dry film, inorganic glass or organic glass.

Preferably, in the above-mentioned fingerprint recognition chip packaging structure, the second component includes a second light-shielding layer, and the second light-shielding layer and the first light-shielding layer are formed on two opposite surfaces of the second light-transmitting layer,

A plurality of windows are opened on the second light-shielding layer, and each window corresponds to a light-transmitting hole.

The embodiment of the application also discloses a packaging method of a fingerprint identification chip, which includes:

Providing a first packaging structure, the first packaging structure having a plurality of first components, and cutting the first packaging structure to obtain a plurality of single first components;

Providing a second packaging structure, the second packaging structure having a plurality of second components, and cutting the second packaging structure to obtain a plurality of single second components;

A first transparent layer is provided, and a single first component and a single second component are respectively pasted on two opposite surfaces of the first transparent layer.

Preferably, in the packaging method of the fingerprint identification chip described above, the manufacturing method of the first packaging structure includes:

Provide a wafer with a plurality of fingerprint identification chips;

A filter is made on the side of the fingerprint recognition chip with pixels.

Preferably, in the above-mentioned fingerprint identification chip packaging method, the manufacturing method of the second packaging structure includes:

Using the second light-transmitting layer as a support, fabricating a first light-shielding layer on one surface thereof;

The first light-shielding layer is etched to form a plurality of light-transmitting holes.

Providing a wafer-level first packaging structure, the first packaging structure having a plurality of first components;

Provide a wafer-level second packaging structure, the second packaging structure having a plurality of second components, and cutting the second packaging structure to obtain a plurality of single second components;

A first light-transmitting layer is provided, and a wafer-level first packaging structure and a single second component are respectively pasted on two opposite surfaces of the first light-transmitting layer.

The first package structure is cut to obtain a plurality of single package structures.

Compared with the prior art, the beneficial effects of the present invention include at least:

(1) The cylindrical light-shielding body formed by the present invention better shields and absorbs excess oblique light, so that the image of the object is clearer;

(2) The present invention first manufactures two important wafer-level components, and then attaches them to each other, which reduces the processing difficulty, is easy to mass produce, and has low cost.

Description of the drawings

In order to more clearly describe the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments described in this application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work.

FIG. 1 is a cross-sectional view of the package structure in Embodiment 1 of the present application;

2 to 7 are schematic diagrams of intermediate structures formed by the package structure in Embodiment 1 of the present application;

FIG. 8 is a schematic diagram of an intermediate structure formed by the package structure in Embodiment 2 of the present application.

Detailed ways

The present invention will be understood more completely through the following specific embodiments that should be read together with the accompanying drawings. Detailed embodiments of the present invention are disclosed herein; however, it should be understood that the disclosed embodiments are only exemplary of the present invention, and the present invention can be embodied in various forms. Therefore, the specific functional details disclosed herein should not be construed as restrictive, but merely construed as the basis of the claims and construed as teaching those skilled in the art to differ in any appropriate detailed embodiment. The method adopts the representative basis of the present invention.

This embodiment provides a packaging structure 10. Referring to FIG. 1, the packaging structure 10 includes a first component 11, a first light-transmitting layer 12, and a second component 13. The first component 11 and the second component 13 are attached to the first Two opposite surfaces of the light-transmitting layer 12.

The first component 11 includes a fingerprint recognition chip 111. The fingerprint recognition chip 111 has opposite front and back sides. The front of the fingerprint recognition chip 111 has a plurality of pixels 1111 for collecting fingerprint information.

The front side of the fingerprint identification chip 111 includes a sensing area and a non-sensing area surrounding the sensing area. Among them, the pixel point 1111 is arranged in the sensing area; the non-sensing area is provided with a pad (not shown) electrically connected to the pixel point 1111, and the pad is used for electrically connecting with an external circuit.

In one embodiment, the fingerprint identification chip 111 is an optical fingerprint identification chip.

In an embodiment, the first component 11 further includes a filter 112 that covers the surface of the fingerprint identification chip 111 with pixels.

The filter 112 is used to filter out stray light outside the detection light waveband, so as to reduce the interference of stray light and improve the accuracy of fingerprint recognition.

The filter 112 may only cover the upper portion corresponding to the pixel point 1111, or may cover the entire surface of the fingerprint identification chip 111.

The first light-transmitting layer 12 covers the side of the fingerprint identification chip 111 with the pixel points 1111, and is used to protect the front surface of the fingerprint identification chip 111 to be packaged. Since light is required to pass through the first light-transmitting layer 12 to reach the pixel points 1111, the light-transmitting layer 12 has a relatively high light-transmitting property and is a light-transmitting material. Both surfaces of the light-transmitting layer 12 are flat and smooth, and will not scatter or diffuse the incident light.

Specifically, the material of the first light-transmitting layer 12 may be dry film, inorganic glass, organic glass, or other light-transmitting materials with specific strength.

In this embodiment, considering the optical properties and adhesion properties of the first light-transmitting layer 12, the thickness of the first light-transmitting layer 12 is preferably 5-20 μm.

The second component 13 includes a light-shielding layer 131 and a second light-transmitting layer 132, and the light-shielding layer 131 is formed between the second light-transmitting layer 132 and the first light-transmitting layer 12.

The light-shielding layer 131 is provided with a plurality of light-transmitting holes 1311 communicating up and down. Each light-transmitting hole 1311 corresponds to a pixel 1111. In a preferred embodiment, the axis of the light-transmitting hole 1311 coincides with the center of the pixel 1111.

The light-shielding layer 131 has a relatively low dielectric constant. The material of the light-shielding layer 131 is preferably a silicon material, which can be monocrystalline silicon, or polycrystalline silicon, or amorphous silicon, or silicon germanium, or silicon carbide. The light-shielding layer 131 may be formed on the surface of the second light-transmitting layer 132 by physical deposition.

The thickness of the light-shielding layer 131 is preferably 4-20 μm, and the size of the light-transmitting hole can be adjusted according to needs. For example, when the light-transmitting hole is a circular hole, the aperture may be 30 μm, and the aspect ratio may be 1:1.

The light shielding layer 131 is made of silicon material, which can reduce the crosstalk problem between adjacent pixels 1111 on the one hand. On the other hand, the light-shielding layer 131 made of silicon material generally has a Mohs hardness above 10, which has a high hardness and high mechanical strength. When pressed by a finger, it will not produce thickness deformation and will not affect the accuracy of fingerprint recognition.

In the direction perpendicular to the front surface of the fingerprint identification chip 111, the projection of the light-transmitting hole 1311 on the front surface at least overlaps with the projection of the corresponding pixel point 1111 on the front surface. In order to ensure the accuracy of fingerprint recognition, the projection of the transparent hole 1311 on the front can be set to completely cover the projection of the corresponding pixel 1111 on the front. Optimally, the projection of the transparent hole 1311 on the front side can be set to completely coincide with the projection of the corresponding pixel point 1111 on the front side.

If the fingerprint recognition chip 111 is a capacitive fingerprint recognition chip, when fingerprint recognition is performed, the pixel point 1111 detects the capacitance value and converts the capacitance value into an electrical signal. The external circuit can obtain fingerprint information based on the electrical signal, perform identity recognition, and transmit light. The holes 1311 are used to expose the pixels, and the light-shielding layer 131 has a lower dielectric constant, which can reduce the problem of crosstalk between adjacent pixels and improve the accuracy of fingerprint recognition.

If the fingerprint identification chip 111 is an optical fingerprint identification chip, when fingerprint identification is performed, the pixel point 1111 collects the fingerprint information of the preset area opposite to the transparent hole 1311 through the corresponding transparent hole 1311. Since each pixel 1111 collects the fingerprint information of its own relative collection area through the corresponding light-transmitting hole 1311, the mutual crosstalk between the preset areas corresponding to different pixels is avoided, thereby avoiding the distortion of the fingerprint image, and further improving the fingerprint Accuracy of recognition.

The shape of the light transmission hole 1311 may be a circular through hole, a square through hole or a triangular through hole. Specifically, the shape of the transparent hole 1311 may be a circular hole with the same top and bottom, or a square hole with the same top and bottom, or a triangular hole with the same top and bottom, or a polygon with the same top and bottom of other structures. The bottom of the light transmission hole 1311 is an opening of the light transmission hole 1311 close to the pixel point 1111, and the top of the light transmission hole 1311 is an opening of the light transmission hole 1311 away from the pixel point 1111.

It is easy to think that the shape of the light-transmitting hole 1311 can also be a round hole with a different top and bottom, a square hole with a different top and bottom, or a triangular hole with a different top and bottom, or the top of other structures. A polygon that is not the same as the bottom. At this time, the top of the light-transmitting hole 1311 is larger than the bottom of the light-transmitting hole 1311. Similarly, the bottom of the light transmission hole 1311 is the opening of the light transmission hole 1311 close to the pixel point 1111, and the top of the light transmission hole 1311 is the opening of the light transmission hole 1311 away from the pixel point 1111.

In one embodiment, the light-shielding layer 131 and the first light-transmitting layer 12 are bonded and fixed by a DAF film.

The second light-transmitting layer 132 covers the side of the light-shielding layer 131 facing away from the fingerprint identification chip 111, and is used for shielding the opening of the light-transmitting hole 1311. Since light needs to pass through the second light-transmitting layer 132 to reach the pixel points 1111, the second light-transmitting layer 132 has a relatively high light-transmitting property and is a light-transmitting material. Both surfaces of the second light-transmitting layer 132 are flat and smooth, and will not scatter or diffuse the incident light.

Specifically, the material of the second light-transmitting layer 132 may be dry film, inorganic glass, organic glass, or other light-transmitting materials with specific strength.

In this embodiment, the thickness of the second light-transmitting layer 132 is preferably 10-40 microns.

In one embodiment, the second light-transmitting layer 132 and the light-shielding layer 131 are fixed by glue.

The second assembly 13 also includes a condenser lens 133, which is arranged on the side of the second light-transmitting layer 132 away from the fingerprint identification chip 111, each condenser lens 133 corresponds to a light-transmitting hole 1311, and the condenser lens 133 It is used to converge the external light to the surface of the corresponding pixel 1111.

In one embodiment, the condensing lens 133 can be manufactured by photolithography and baking molding. In another embodiment, the condensing lens 133 can also be formed on the surface of the second light-transmitting layer 132 by embossing.

The second component further includes a light-shielding layer 134. The light-shielding layer 134 and the light-shielding layer 131 are formed on two opposite surfaces of the second light-transmitting layer. Light hole. The condenser lens 133 is correspondingly arranged in the window.

The light shielding layer 134 is formed between the condenser lenses 133, so as to shield light interference from the surrounding light of the condenser lenses and optimize the imaging effect.

In this embodiment, the material of the light shielding layer 134 is a black photosensitive organic material or a metal that has undergone a blackening treatment, which has the characteristics of opacity or low light transmission. For example, the light-shielding layer 134 may be vinyl; the light-shielding layer 134 may also be blackened aluminum, so that the light cannot be specularly reflected on its surface, and the light-shielding performance is good.

Correspondingly, the embodiment of the present invention provides a packaging method for forming the packaging structure as shown in FIG. 1.

Please refer to FIGS. 2 to 7, which are schematic diagrams of intermediate structures formed in the packaging process of the packaging method according to the first embodiment of the present invention.

Step s1: Fabricate a first packaging structure at the wafer level.

2 and 3, a wafer to be packaged 100 is provided, wherein FIG. 2 is a schematic top view of the structure of the wafer to be packaged 100, and FIG. 3 is a cross-sectional view along A-A in FIG. 2.

The wafer 100 to be packaged has a front surface and a back surface opposite to the front surface. The wafer 100 includes a plurality of fingerprint recognition chips 111 arranged in an array. Each adjacent fingerprint identification chip 111 has a plurality of pixels 1111 for collecting fingerprint information. The pixel 1111 is located on the front side. There is a cutting channel 120 between adjacent fingerprint identification chips 111 to facilitate the cutting process in the subsequent cutting process.

It should be noted that the cutting channel 120 between two adjacent fingerprint identification chips 111 is only a blank area reserved between the two fingerprint identification chips 111 for cutting, and the cutting channel 120 is connected to the fingerprints on both sides. There is no actual boundary line between the identification chips 111.

Referring to FIG. 4, a filter 112 is covered on the front surface of the wafer 100 to be packaged, and the filter 112 covers the entire surface of the fingerprint identification chip 111 to obtain a first packaging structure.

Step s2: manufacturing a single first component 11.

The first package structure is cut along the cutting channel 120 to obtain a plurality of single first components 11. The cutting can be cut with a slicing knife or laser cutting, and the slicing knife can be cut with a metal knife or a resin knife.

Step s3: Fabricate a second packaging structure at the wafer level.

Referring to FIG. 5, a plurality of light-transmitting holes 1311 communicating up and down are opened on the light-shielding layer 131, and then the light-shielding layer 131 is pasted on the surface of the second light-transmitting layer 132.

Referring to FIG. 6, the light shielding layer 134 is formed on another surface of the second light transmitting layer 132, and a plurality of windows are formed on the light shielding layer 134 corresponding to the light transmitting holes.

Then, a condenser lens 133 is installed corresponding to the window, and each condenser lens 133 corresponds to a light transmission hole 1311, thereby obtaining a second packaging structure.

It should be noted that the manufacturing sequence of the light shielding layer 134 and the condenser lens 133 in this embodiment is not limited, and the manufacturing sequence of the light shielding layer 131 and the light shielding layer 134 is also not limited in this embodiment.

Step s4: making a single second component.

Through the cutting process, the second package structure is divided correspondingly along the cutting trench 120 to obtain a single second component 13. The cutting can be cut with a slicing knife or laser cutting, and the slicing knife can be cut with a metal knife or a resin knife.

Step s5: referring to FIG. 7, screening the first component and the second component that have passed the test, and sticking the single first component and the second component on the two opposite surfaces of the first light-transmitting layer, respectively.

The pasting can be sprayed, spin-coated or pasted to form an adhesive layer, and then the first component, the second component and the first light-transmitting layer are relatively pressed together, and the adhesive layer is combined. The adhesive layer can not only achieve the bonding effect, but also play the role of insulation and sealing. The adhesive layer may be a polymer adhesive material, such as polymer materials such as silica gel, epoxy resin, and benzocyclobutene.

In the entire packaging process, it can also include wafer thinning, solder pad production, wiring layer production and other processes, which will not be repeated in this case.

In addition, after the wafer to be packaged is packaged, the chip package structure obtained by subsequent cutting can be connected to an external circuit through external bumps (not shown).

Please refer to 8, which is a schematic diagram of an intermediate structure formed in the packaging process of the packaging method of the second embodiment of the present invention.

The difference from the first embodiment is that after the single second component 13 is cut, the second component is first bonded to the first package structure at the wafer level through the first light-transmitting layer 12; and then the first package structure is cut. The packaging structure obtains a packaging structure in which a single first component and a single second component are combined.

In the packaging method of the third embodiment, compared with the first embodiment, the wafer 100 to be packaged is first cut into a plurality of units, and then a filter 112 is plated on the surface of each unit to form a single first component 11. In the packaging method of the fourth embodiment, the first packaging structure at the wafer level and the second packaging structure at the wafer level may be manufactured first, and then the first packaging structure at the wafer level and the second packaging structure at the wafer level may be combined They are respectively pasted on the two opposite surfaces of the first light-transmitting layer, and finally cut to obtain a single package structure.

The aspects, embodiments, features, and examples of the present invention should be regarded as illustrative in all aspects and are not intended to limit the present invention. The scope of the present invention is only defined by the claims. Without departing from the spirit and scope of the claimed invention, those skilled in the art will understand other embodiments, modifications, and uses.

The use of titles and chapters in this application is not meant to limit the invention; each chapter can be applied to any aspect, embodiment or feature of the invention.

Throughout this application, where a composition is described as having, containing, or including specific components, or where a process is described as having, containing, or including specific process steps, it is expected that the composition taught by the present invention is also basically The above is composed of or composed of the described components, and the process taught by the present invention is basically composed of the described process steps or a set of described process steps.

In this application, where an element or component is referred to as being included in and/or selected from the list of recited elements or components, it should be understood that the element or component can be any of the recited elements or components and It can be selected from a group consisting of two or more of the described elements or components. In addition, it should be understood that, without departing from the spirit and scope of the teachings of the present invention, the elements and/or features of the compositions, devices or methods described herein can be combined in various ways, regardless of whether they are explicitly stated or implied herein. With instructions.

Unless specifically stated otherwise, the use of the terms "include, includes, including" and "have, has, or having" should generally be understood as open-ended and not restrictive.

Unless specifically stated otherwise, the use of the singular number herein includes the plural number (and vice versa). In addition, unless the context clearly dictates otherwise, the singular forms "a, an" and "the" include plural forms. In addition, where the term "about" is used before a quantity, unless specifically stated otherwise, the teachings of the present invention also include the specific quantity itself.

It should be understood that the order of the steps or the order of performing a particular action is not very important, as long as the teachings of the present invention remain operable. In addition, two or more steps or actions can be performed simultaneously.

It should be understood that the drawings and descriptions of the present invention have been simplified to illustrate elements related to a clear understanding of the present invention, while other elements are eliminated for clarity. However, those skilled in the art will recognize that these and other elements may be desirable. However, since such elements are well known in the art and since they do not promote a better understanding of the present invention, no discussion of such elements is provided herein. It should be understood that the figures are presented for illustrative purposes and not as construction drawings. The omitted details and modified or alternative embodiments are within the scope of those skilled in the art.

It can be understood that, in certain aspects of the present invention, a single component may be replaced by multiple components and multiple components may be replaced by a single component to provide an element or structure or perform one or several given functions. This substitution is considered to be within the scope of the present invention, except where it will not operate to practice the specific embodiments of the present invention.

Although the present invention has been described with reference to illustrative embodiments, those skilled in the art will understand that various other changes, omissions and/or additions can be made without departing from the spirit and scope of the invention, and the essence, etc. The effector replaces the elements of the described embodiment. In addition, many modifications may be made to adapt specific situations or materials to the teachings of the present invention without departing from the scope of the present invention. Therefore, this document does not intend to limit the present invention to the specific embodiments disclosed for implementing the present invention, but intends that the present invention will include all embodiments falling within the scope of the appended claims. In addition, unless specifically stated otherwise, any use of the terms first, second, etc. does not denote any order or importance, but rather uses the terms first, second, etc. to distinguish one element from another.

Claims

A packaging structure of a fingerprint identification chip, which is characterized in that it comprises:

The first light-transmitting layer has a first surface and a second surface opposite to each other;

The first component is pasted on the first surface of the first light-transmitting layer, the first component includes a fingerprint recognition chip, and the surface of the fingerprint recognition chip close to the first light-transmitting layer has a plurality of pixels for collecting fingerprint information;

The second component is pasted on the second surface of the first light-transmitting layer. The second component includes a first light-shielding layer and a second light-transmitting layer. The first light-shielding layer is formed between the second light-transmitting layer and the first light-transmitting layer A plurality of light-transmitting holes are formed on the first light-shielding layer, and each of the light-transmitting holes corresponds to a pixel point.
The fingerprint identification chip packaging structure according to claim 1, wherein the first component further comprises a filter formed between the fingerprint identification chip and the first light-transmitting layer.
The fingerprint identification chip packaging structure according to claim 1, wherein the filter is attached to the surface of the fingerprint identification chip.
The fingerprint identification chip packaging structure according to claim 1, wherein the second component further comprises a condenser lens formed on the surface of the second light-transmitting layer, and the condenser lens and the first light-shielding layer are respectively located in the second light-shielding layer. The two opposite surfaces of the light-transmitting layer,

Each of the condenser lenses corresponds to one of the light-transmitting holes.
The fingerprint recognition chip packaging structure according to claim 1, wherein the first light shielding layer is made of monocrystalline silicon, or polycrystalline silicon, or amorphous silicon, or silicon germanium, or silicon carbide.
The fingerprint identification chip packaging structure according to claim 1, wherein the first light-transmitting layer and the second light-transmitting layer are selected from dry film, inorganic glass, or organic glass.
The fingerprint recognition chip packaging structure according to claim 1, wherein the second component comprises a second light-shielding layer, and the second light-shielding layer and the first light-shielding layer are formed on two opposite surfaces of the second light-transmitting layer ,

A plurality of windows are opened on the second light-shielding layer, and each window corresponds to a light-transmitting hole.
The packaging method of the fingerprint identification chip according to any one of claims 1 to 7, characterized in that it comprises:

Provide a wafer-level first packaging structure, the first packaging structure having a plurality of first components, and cutting the first packaging structure to obtain a plurality of single first components;

Provide a wafer-level second packaging structure, the second packaging structure having a plurality of second components, and cutting the second packaging structure to obtain a plurality of single second components;

A first transparent layer is provided, and a single first component and a single second component are respectively pasted on two opposite surfaces of the first transparent layer.
According to the packaging method of the fingerprint identification chip according to claim 8, the manufacturing method of the second packaging structure comprises:

Fabricating a first light-shielding layer with a plurality of light-transmitting holes;

The first light-shielding layer is combined with one surface of the second light-transmitting layer, the first light-shielding layer and the first light-shielding layer.
The packaging method of the fingerprint identification chip according to any one of claims 1 to 7, characterized in that it comprises:

Providing a wafer-level first packaging structure, the first packaging structure having a plurality of first components;

Providing a wafer-level second packaging structure, the second packaging structure having a plurality of second components, and cutting the second packaging structure to obtain a plurality of single second components;

A first light-transmitting layer is provided, and a wafer-level first packaging structure and a single second component are respectively pasted on two opposite surfaces of the first light-transmitting layer.

The first package structure is cut to obtain a plurality of single package structures.