WO2021174426A1 - 天线及其制作方法、电子设备 - Google Patents

天线及其制作方法、电子设备 Download PDF

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Publication number
WO2021174426A1
WO2021174426A1 PCT/CN2020/077656 CN2020077656W WO2021174426A1 WO 2021174426 A1 WO2021174426 A1 WO 2021174426A1 CN 2020077656 W CN2020077656 W CN 2020077656W WO 2021174426 A1 WO2021174426 A1 WO 2021174426A1
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WIPO (PCT)
Prior art keywords
conductive layer
antenna
photoresist layer
transparent substrate
trench
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PCT/CN2020/077656
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English (en)
French (fr)
Inventor
唐根初
陈禄禄
杨伟庆
熊超
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安徽精卓光显技术有限责任公司
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Priority to PCT/CN2020/077656 priority Critical patent/WO2021174426A1/zh
Publication of WO2021174426A1 publication Critical patent/WO2021174426A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support

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  • the present invention relates to the field of antennas, in particular to an antenna, a manufacturing method thereof, and electronic equipment.
  • wireless communication technology has developed from 2G/3G to the widely used 4G; 4G and previous communication technologies require a single antenna to send and receive radio signals, and realize multimedia such as audio and video.
  • 5G network communication is to realize the real-time transmission of clearer, larger data volume video signals.
  • the transmission of wireless electrical signals if the antenna structure is not changed, in order to achieve greater data transmission, it can only be improved by increasing the frequency of the radio signal and increasing the compression rate of the signal encoding. Based on the development of this method, high-frequency signals The transmission distance is short and the penetration is poor.
  • the 5G network needs to lay dozens of times the base station of the 4G network to increase the signal coverage area, which is unacceptable in terms of technical cost and environmental compatibility. Therefore, the technical core of 5G network, on the basis of not changing the existing 4G network technology base station scheme, increase the number of antennas on terminal equipment (mobile phones, bracelets, electronic watches, tablet computers, etc.), with a single antenna Change to an array composed of multiple antennas to realize the reception and transmission of network signals, increase the rate of signal transmission, and become a more feasible 5G network core solution.
  • the existing 4G single antenna taking the mobile phone as an example, is arranged under the black frame of the front cover or the upper and lower parts of the back cover of the mobile phone.
  • the space left for antennas is getting smaller and smaller. If the antenna is changed from a single antenna to a 5G antenna array, the space where the antenna can be arranged will be smaller.
  • an electronic device is also provided.
  • the photoresist layer is away from the conductive layer on the surface of the transparent substrate and the photoresist layer is removed to form an antenna pattern.
  • An electronic device includes the above-mentioned antenna.
  • FIG. 1 is a schematic flowchart of a method for manufacturing an antenna according to an embodiment of the present invention
  • Fig. 2 is a flow chart of manufacturing an antenna according to an embodiment of the present invention.
  • FIG. 3 is a schematic diagram of an antenna pattern according to an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of a transparent metal mesh antenna formed by an embodiment of the present invention.
  • Fig. 1 is a schematic flow chart of a manufacturing method according to an embodiment of the present invention. It should be understood that although the various steps in the flowchart of FIG. 1 are displayed in sequence as indicated by the arrows, these steps are not necessarily performed in sequence in the order indicated by the arrows. Unless there is a clear description in this article, the execution of these steps is not executed in a strict order, and they can be executed in other orders. Moreover, at least part of the steps in FIG. 1 may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily executed at the same time, but can be executed at different times, and the order of execution is not necessarily sequential. Instead, it may be executed alternately or alternately with at least a part of other steps or sub-steps or stages of other steps.
  • an antenna manufacturing method can manufacture an antenna 100 with high transparency and low impedance.
  • the antenna 100 can be set on the surface of the electronic device, as an antenna, to realize the transmission and reception of radio signals.
  • the manufacturing method of the antenna 100 includes the following steps S110 to S160:
  • the antenna formed by using the transparent substrate 110 has the characteristics of light transparency; the transparent substrate 110 has two opposite surfaces, one of which is the mounting surface 111.
  • the material of the transparent substrate 110 may be glass, PC board, PET, COP, PMMA board, composite board of PC and PMMA, TPU, POL, etc.
  • the transparent substrate 110 selected from the above materials is all optical Materials with excellent performance have higher strength and surface effects, and are more suitable for large-size touch panels; the transparent substrate 110 can be a cover plate, and the specific shape of the transparent substrate 110 is not particularly limited, such as a 3D circle For the arc shell, those skilled in the art can design the shape of the transparent substrate 110 according to actual needs.
  • a photoresist layer 120 is provided on the mounting surface 111 of the transparent substrate 110, and the photoresist layer 120 completely covers the mounting surface 111; specifically, the coated photoresist can be a positive photoresist or a negative photoresist as required, and the coated photoresist To coat uniformly, use positive photoresist, and the exposed part is removed by the developer in the development step; use negative photoresist, and the unexposed part is removed by the developer in the development step; in one specific example, the mounting surface A layer of negative photoresist is coated on 111 to form a photoresist layer 120.
  • the thickness of the photoresist layer 120 is 1.5 ⁇ m-10 ⁇ m, specifically, the thickness of the photoresist layer 120 is 1.5 ⁇ m, 3.5 ⁇ m, 5 ⁇ m, 6 ⁇ m, 7.5 ⁇ m, or 10 ⁇ m.
  • the setting of this thickness facilitates the subsequent electroplating of the conductive layer of the photoresist layer, and facilitates stripping to form an antenna with low impedance; the photoresist layer 120 is too thin, and then the conductive layer is plated to ensure that the conductive layer is thinner than the photoresist layer, otherwise
  • the first conductive layer on the photoresist layer 120 will be connected to the second conductive layer in the trench. Subsequent peeling will cause the second conductive layer in the trench to be peeled off together, and the line impedance is too thin, and too thick will cause photoresist The layer collapses, affecting subsequent trench production.
  • the photoresist layer is coated on the mounting surface 111 of the transparent substrate 110 by a coating method, and the coating method is commonly used in the art.
  • the coating may be electrostatic spraying, spin coating, or the like, so as to uniformly cover the photoresist layer 120 on the transparent substrate 110.
  • the trench 121 is formed in the photoresist layer 120 through an exposure and development process; the exposure and development process can be implemented by a process commonly used in the art.
  • the step of forming the groove 121 in the photoresist layer 120 includes: when the mounting surface 111 is coated with a negative photoresist, a mask with an antenna pattern is used to form the same size as the antenna pattern.
  • the light-transmitting hole when performing exposure, aim the light-transmitting hole on the side of the photoresist layer away from the transparent substrate. The light passes through the light-transmitting hole to the side of the photoresist layer away from the transparent substrate to transfer the antenna pattern to the photoresist layer. Then, the unexposed photoresist layer 120 is removed by a developing solution, the transparent substrate 110 is exposed, and the groove 121 is formed.
  • the size of the non-transmissive area of the photomask used at this time is the same as the size of the antenna pattern, and the non-transparent area of the photomask is used for exposure.
  • the area covers the side of the photoresist layer away from the transparent substrate.
  • the antenna pattern can be transferred to the photoresist layer 120 where light is not irradiated, and then the exposed photoresist layer 120 is removed by a developer to expose the transparent substrate 110, a trench 121 is formed.
  • the trench 121 is a micro-nano mesh trench, and the width of the trench 121 is 1.5 ⁇ m-10 ⁇ m.
  • the setting of such a width can form an antenna with a lower impedance and facilitate subsequent electroplating of the conductive layer.
  • the width of the trench 121 may be 1.5 m, 3.5 m, 5 m, 6 m, 7.5 m, or 10 m.
  • the shape of the grid may be a polygonal shape such as a rectangle, a rhombus, a hexagon, and an irregular quadrilateral.
  • S140 forming a conductive layer through an electroplating process on the surface of the photoresist layer away from the transparent substrate and the groove;
  • the conductive layer includes a first conductive layer 130 and a second conductive layer 131, wherein the first conductive layer is disposed on the surface of the photoresist layer 120 away from the transparent substrate 110 and the bottom end of the trench 121, namely On the exposed surface of the transparent substrate 110 at the trench 121, the thickness of the first conductive layer is 150 nm or less. In a specific example, the thickness of the first conductive layer may be 100 nm, 110 nm, or 120 nm.
  • the second conductive layer 131 is provided on the surface of the first conductive layer 130 at the trench, and the thickness of the second conductive layer 131 is 0.5 ⁇ m-10 ⁇ m; the thickness of the conductive layer is selected within the above range to obtain an antenna with lower impedance.
  • the thickness of the second conductive layer can be 0.5 ⁇ m, 1 ⁇ m , 1.5 ⁇ m, 3.5 ⁇ m, 5 ⁇ m, 6 ⁇ m, 7.5 ⁇ m or 10 ⁇ m.
  • the conductive layer is formed by first forming a thinner first conductive layer 130 through an evaporation process, and then forming a thicker second conductive layer 131 through vacuum plating, water plating, sputtering or PVD, so as to reduce the surface resistance of the transparent circuit and improve the conductivity . And compared to directly forming a conductive layer by vapor deposition, this embodiment first vaporizes to form a thin conductive layer to form a energization, and then uses an efficient electroplating method to form the second conductive layer, which can reduce the overall electroplating time and improve Efficiency; In addition, it can avoid the direct evaporation that is too thick, which may cause the conductive layer to wrinkle.
  • the material of the conductive layer can be a metal or a synthetic metal with excellent electrical conductivity, such as Cu, Cu-Ni alloy, Ag, Cu-ITO, Au, Ni, Al, etc.
  • a metal or a synthetic metal with excellent electrical conductivity such as Cu, Cu-Ni alloy, Ag, Cu-ITO, Au, Ni, Al, etc.
  • the conductive layer formed by the electroplating process is flatter and uniform, so that the manufactured antenna has higher quality and better surface flatness.
  • the photoresist layer 120 is removed away from the first conductive layer 130 on the surface of the transparent substrate 110, leaving only the first conductive layer and the second conductive layer at the trenches to form a transparent conductive metal grid ; Cut the conductive metal grid by laser and other methods to form the antenna pattern.
  • the removal method adopts a conventional stripping process in the field, and the photoresist layer and the first conductive layer 130 on the photoresist layer are stripped together by chemical reagents to form a transparent grid line on the entire surface;
  • chemical reagents In one example, isopropyl alcohol is used as the peeling liquid, and the ultrasonic process is used for peeling. This method has high peeling efficiency and relatively thorough peeling.
  • the specific type of antenna pattern is not particularly limited, such as the circuit of the mobile phone antenna, the circuit loop of the NFC antenna, etc., and those skilled in the art can select and design accordingly according to the actual function of the antenna.
  • the antenna pattern is a transparent grid line.
  • the antenna pattern is cut and separated by a laser process to form an antenna area and an invalid area.
  • the method of manufacturing the antenna may also include other steps, specifically including cleaning the surface of the transparent substrate 110 to clean oxides, impurities, oils or water molecules on the surface of the transparent substrate 110. .
  • the antenna is manufactured as a metal mesh transparent antenna, which has the characteristics of low impedance and transparency.
  • the conductive layer formed by the electroplating process is flatter and uniform, so that the manufacturing
  • the finished antenna has higher quality and better surface flatness. It can be set on the surface of electronic equipment and used as an antenna to transmit and receive radio signals. It provides a wider optional placement area for the antenna of electronic products; the antenna can be arranged The space is larger, and the manufacturing method is simple to operate and simple in process.
  • the first conductive layer 130 is first provided with a thinner, and then the second conductive layer 131 is provided with a thicker thickness.
  • the thinner conductive layer is usually formed by an evaporation process. It takes a long time to thicken. If it is made more than N times thicker, and the thickness of the vapor-deposited conductive material is too thick, it will cause the material to wrinkle; other methods of electroplating (water plating) have high efficiency, but water plating needs to be connected to electricity, so It is necessary to vaporize a thinner conductive material first to turn on electricity; it can reduce the time used for water plating and improve efficiency; in addition, it can avoid direct vapor deposition that is too thick, which may cause the conductive layer to wrinkle.
  • the specific type of the antenna 100 manufactured by the manufacturing method of the foregoing embodiment is not particularly limited, such as 5G antennas, NFC antennas, etc., and those skilled in the art can select accordingly according to the actual use requirements of the antenna 100. This will not be repeated here.
  • the electronic device of an embodiment includes the antenna manufactured by the manufacturing method of the above-mentioned embodiment.
  • the specific type of the electronic device is not particularly limited, such as a mobile phone, a tablet computer, a smart watch, etc., and those skilled in the art can make a corresponding selection according to the specific use of the electronic device, which will not be repeated here.
  • the electronic device also includes other necessary components and structures. Taking a mobile phone as an example, specific examples include a display device, a processor, a memory, a battery, a circuit board, a camera, etc. Those skilled in the art can make corresponding designs and supplements according to the specific type of the electronic device, which will not be repeated here.
  • a transparent substrate 110 made of glass is provided; the transparent substrate 110 has two opposite surfaces, one of which is the mounting surface 111.
  • a square grid groove 121 with a width of 1.5 ⁇ m is developed by exposure and development, exposing the transparent substrate 110;
  • the first conductive layer is formed by evaporating copper on the surface of the photoresist layer away from the transparent substrate and the trench.
  • the thickness of the first conductive layer is 100 nm;
  • the thickness of the second conductive layer 131 and the second conductive layer 131 is 0.5 ⁇ m.
  • the photoresist layer and the first conductive layer on the photoresist layer are stripped together through the chemical reagent isopropanol and combined with the ultrasonic process, leaving only the first conductive layer 130 and the second conductive layer 131 at the groove, that is, the whole Transparent grid lines; cut conductive metal grids by laser and other methods to form antenna patterns.
  • the antenna pattern is cut and separated by a laser process to form an antenna area and an invalid area, and the invalid area is removed to form an antenna.
  • a transparent substrate 110 of a PMMA board is provided; the transparent substrate 110 has two opposite surfaces, one of which is the mounting surface 111.
  • a square grid groove 121 with a width of 3.5 ⁇ m is developed by exposure and development, exposing the transparent substrate 110;
  • the first conductive layer is formed by evaporating copper on the surface of the photoresist layer away from the transparent substrate and the trench, the thickness of the first conductive layer is 110nm; the surface of the first conductive layer 130 at the trench is then formed by copper plating with water The thickness of the second conductive layer 131 is 3.5 ⁇ m.
  • the photoresist layer and the first conductive layer on the photoresist layer are peeled off by the chemical reagent isopropanol and combined with the ultrasonic process, leaving only the first conductive layer and the second conductive layer at the groove, that is, the entire surface is transparent Grid line: Cut conductive metal grid by laser or other methods to form antenna pattern.
  • the antenna pattern is cut and separated by a laser process to form an antenna area and an invalid area, and the invalid area is removed to form an antenna.
  • a transparent substrate 110 of a PC and PMMA composite board is provided; the transparent substrate 110 has two opposite surfaces, one of which is the mounting surface 111.
  • a photoresist layer with a thickness of 5 ⁇ m is sprayed on one surface of the transparent substrate 110 by electrostatic spraying;
  • a rectangular grid groove 121 with a width of 6 ⁇ m is developed by exposure and development, exposing the transparent substrate 110;
  • the first conductive layer is formed by evaporating Cu-Ni alloy on the surface of the photoresist layer away from the transparent substrate and the groove, the thickness of the first conductive layer is 120nm; the surface of the first conductive layer 130 at the groove is sputtered
  • the second conductive layer 131 is formed by plating Cu-Ni alloy, and the thickness of the second conductive layer 131 is 5 ⁇ m.
  • the photoresist layer and the first conductive layer on the photoresist layer are stripped together through the chemical reagent isopropanol and combined with the ultrasonic process, leaving only the first conductive layer and the second conductive layer at the groove, that is, the entire surface is transparent Grid line: Cut conductive metal grid by laser or other methods to form antenna pattern.
  • the antenna pattern is cut and separated by a laser process to form an antenna area and an invalid area, and the invalid area is removed to form an antenna.
  • a transparent substrate 110 made of PET is provided; the transparent substrate 110 has two opposite surfaces, one of which is the mounting surface 111.
  • a rectangular grid groove 121 with a width of 6 ⁇ m is developed by exposure and development, exposing the transparent substrate 110;
  • the first conductive layer is formed by sputtering Ag on the surface of the photoresist layer away from the transparent substrate and the trench, the thickness of the first conductive layer is 110nm; Ag sputtering is performed on the surface of the first conductive layer 130 at the trench The thickness of the second conductive layer 131 is 7.5 ⁇ m.
  • the photoresist layer and the first conductive layer on the photoresist layer are stripped together through the chemical reagent isopropanol and combined with the ultrasonic process, leaving only the first conductive layer and the second conductive layer at the groove, that is, the entire surface is transparent Grid line: Cut conductive metal grid by laser or other methods to form antenna pattern.
  • the antenna pattern is cut and separated by a laser process to form an antenna area and an invalid area, and the invalid area is removed to form an antenna.
  • the transparent substrate 110 of the PMMA board is provided; the transparent substrate 110 has two opposite surfaces, one of which is the mounting surface 111.
  • a diamond-shaped grid groove 121 with a width of 10 ⁇ m is developed by exposure and development, exposing the transparent substrate 110;
  • the first conductive layer is formed by vacuum Ni plating on the surface of the photoresist layer away from the transparent substrate and on the trench.
  • the thickness of the first conductive layer is 110nm; the surface of the first conductive layer 130 at the trench is then vacuum plated by Ni.
  • the thickness of the second conductive layer 131 is 10 ⁇ m.
  • the photoresist layer and the first conductive layer on the photoresist layer are stripped together through the chemical reagent isopropanol and combined with the ultrasonic process, leaving only the first conductive layer and the second conductive layer at the groove, that is, the entire surface is transparent Grid line: Cut conductive metal grid by laser or other methods to form antenna pattern.
  • the antenna pattern is cut and separated by a laser process to form an antenna area and an invalid area, and the invalid area is removed to form an antenna.
  • Example 1 The difference between this comparative example and Example 1 is only that the thickness of the photoresist layer is 1 ⁇ m.
  • Example 2 The difference between this comparative example and Example 2 is only that the thickness of the second conductive layer is 0.25 ⁇ m.
  • an antenna is made of a transparent conductive film made of an existing ITO material.
  • the transmittance and square resistance of the antenna are measured by conventional methods.
  • the antenna produced by the present invention has the characteristics of low impedance and high transmittance; the thickness of the photoresist layer of Comparative Example 1 is lower than that of the present application, because the conductive layer is plated again, it is necessary to ensure that the conductive layer is higher than the photoresist The layer is thin, otherwise the first conductive layer on the photoresist layer will be connected to the second conductive layer in the trench, and subsequent peeling will cause the second conductive layer in the trench to be peeled off together.
  • Comparative example 3 uses the existing conductive film antenna, and it can be seen from the test results that its impedance is large and the performance is not as good as the antenna produced by the method of the present invention.

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Abstract

本发明涉及一种天线及其制作方法、电子设备，该天线制作方法包括以下步骤：提供透明基材；在透明基材的一个表面设置光阻层；在光阻层形成沟槽，沟槽底端露出透明基材；在光阻层远离透明基材的表面以及沟槽通过电镀工艺形成导电层；及将光阻层远离透明基材表面的导电层以及光阻层去除，形成天线图案；将天线图案分离成天线区域以及无效区域，以形成天线。

Description

天线及其制作方法、电子设备 技术领域
本发明涉及天线领域，特别是涉及一种天线及其制作方法、电子设备。
背景技术
随着网络技术的不断发展，无线通讯技术已有2G/3G发展到了目前广泛应用的4G；4G及其之前的通讯技术，对天线的要求为单支天线收发无线电信号，实现音频、视频等多媒体信号的实时传输，5G网络通信是要实现更加清晰的、数据量更大视频信号的实时传输。无限电信号的传输，如果不对天线结构做改变，为了实现更大数据量的传输，只能通过提高无线电信号的频率和提高信号编码的压缩率来提高，基于这种方式的发展，高频信号的传输距离短、穿透力差，5G网络需要铺设数十倍于4G网络的基站来提高信号覆盖区域，在技术成本和环境兼容性上是无法接受的。因此，5G网络的技术核心，在不改变现有4G网络技术基站方案的基础上，在终端设备上(手机、手环、电子手表、平板电脑等)，增加天线的个数，由单支天线变化为多支天线组成的阵列，实现对网络信号的接收和发送，提高信号传输的速率，成为更加可行的5G网络核心方案。
现有的4G单支天线，以手机为例，是设置在前盖板的黑框下方或者手机后盖上下部位的。但是随着全面屏和无线充电技术的应用，留给天线的空间越来越小，如果将天线由单支变化为5G天线阵列，天线可以布置的空间将更小。
发明内容
基于此，有必要提供一种低阻抗、透明的天线及其制作方法。
此外，还提供了一种电子设备。
一种制作天线的方法，其特征在于，包括以下步骤：
提供透明基材；
在所述透明基材的一个表面设置光阻层；
在所述光阻层形成沟槽，所述沟槽底端露出透明基材；
在所述光阻层远离透明基材的表面以及所述沟槽通过电镀工艺形成导电层；
将所述光阻层远离透明基材表面的导电层以及所述光阻层去除，形成天线图案。
一种天线，采用上述的方法制作而成。
一种电子设备，包括上述的天线。
本发明的一个或多个实施例的细节在下面的描述中提出。本发明的其它特征、目的和优点将从说明书、以及权利要求书变得明显。
附图说明
为了更好地描述和说明这里公开的那些发明的实施例和/或示例，可以参考一幅或多幅附图。用于描述附图的附加细节或示例不应当被认为是对所公开的发明、目前描述的实施例和/或示例以及目前理解的这些发明的最佳模式任何一者的范围的限制。
图1为本发明一实施方式的制作天线的方法流程示意图；
图2为本发明一实施方式的天线的制作流程图；
图3为本发明一实施方式的天线图案的示意图；
图4为本发明一实施方式形成的透明金属网格天线示意图。
具体实施方式
为了便于理解本发明，下面将参照相关附图对本发明进行更全面的描述。附图中给出了本发明的较佳的实施例。但是，本发明可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本发明的公开内容的理解更加透彻全面。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。
图1为本发明一个实施例的制作方法流程示意图。应当理解的是，虽然图1的流程图中的各个步骤按照箭头的指示依次显示，但是这些步骤并不是必然按照箭头指示的顺序依次执行。除非本文中有明确的说明，这些步骤的执行并没有严格的顺序执行，其可以以其它的顺序执行。而且，图1中的至少一部分步骤可以包括多个子步骤或多个阶段，这些子步骤或阶段并不必然在同一时刻执行完成，而是可以在不同的时刻执行，其执行顺序也不必然是依次执行，而是可以与其它步骤或其它步骤的子步骤或阶段的至少一部分轮流或者交替的执行。
如图1～4所示，一实施方式的一种天线的制作方法，能够制备透明度高、低阻抗的天线100。其中，天线100能够设置在电子设备表面，作为天线，实现对无线电信号的收发。具体地，请参阅图1、图2，天线100的制作方法包括如下步骤S110～S160：
S110：提供透明基材110；
具体地，选用透明基材110制作形成的天线具有光透明的特性；透明基材110具有两个相对的表面，其中一个表面为安装面111。
在其中一些实施例中，透明基材110的材质可采用玻璃、PC板、PET、COP、PMMA板、PC与PMMA的复合板、TPU、POL等，选用上述材质的透明基材110均为光学性能优异的材料，具有更高的强度和表面效果，更适用于大尺寸触控面板；透明基材110可以为盖板，透明基材110的具体形状也不受特别的限制，具体例如3D圆弧的外壳，本领域技术人员可根据实际需要设计透明基材110的形状。
S120：在透明基材的一个表面设置光阻层；
在透明基材110的安装面111设置光阻层120，光阻层120完全覆盖安装面111；具体地，涂布的光阻根据需要选用正光阻剂或负光阻剂，所涂的光阻要涂布均匀，采用正光阻剂，曝光的部分在显影步骤被显影液去除；采用负光阻， 未曝光的部分在显影步骤被显影液去除；在其中一个具体的示例中，所述安装面111上涂敷一层负光阻剂形成光阻层120。
在其中一些实施例中，光阻层120的厚度为1.5μm～10μm，具体地，光阻层120的厚度为1.5μm、3.5μm、5μm、6μm、7.5μm或者10μm。此种厚度的设置，利于光阻层后续进行电镀的导电层，以及便于剥离，形成阻抗小的天线；光阻层120过薄，再进行镀导电层需保证导电层比光阻层薄，否则光阻层120上第一导电层会与沟槽内的第二导电层相连，后续剥离会导致沟槽内的第二导电层一起剥离，且过薄线路阻抗比较大，太厚会导致光阻层坍塌，影响后续沟槽制作。
具体地，在所述透明基材的一个表面设置光阻层的步骤，采用涂布方式将光阻层涂布于透明基材110的安装面111处，涂布采用本领域常用的涂布方法，具体地，涂布可以为静电喷涂、旋转涂布等方式涂布，以将光阻层120均匀地覆盖于透明基材110上。
S130：在光阻层120形成沟槽121，沟槽121底端露出透明基材110；
在其中一个实施例中，通过曝光显影的工艺在光阻层120形成沟槽121；曝光显影的工艺可以采用本领域常用的工艺实现。
具体地，在所述光阻层120形成沟槽121的步骤包括：在所述的安装面111涂敷的为负光阻剂时，利用一具有天线图案光罩上形成与天线图案相同大小的透光孔，进行曝光时，将透光孔对准光阻层远离透明基材的一面，光线经过透光孔照到光阻层远离透明基材的一面，将天线图案转印至光阻层，然后利用显影液除掉未曝光的光阻层120，露出透明基材110，形成沟槽121。当在所述安装面111上涂敷一层正光阻剂时，此时所使用的光罩的非透光区域的尺寸与天线图案尺寸相同，在进行曝光时，利用此光罩的非透光区域遮住所述光阻层远离透明基材的一面，光线没有照射到的地方能够将天线图案转印至光阻层120，然后利用显影液除掉曝光的光阻层120，露出透明基材110，形成沟槽121。
在其中一个实施例中，沟槽121为微纳米网格沟槽，沟槽121宽度为1.5μm～10μm。此种宽度的设置，能够形成阻抗较小的天线，且便于后续电镀导电层。具体地，沟槽121宽度可以为1.5μm、3.5μm、5μm、6μm、7.5μm或者 10μm。
在其中一个实施例中，网格的形状可以为长方形、菱形、六边形、不规则四边形等多边形形状。
S140：在光阻层远离透明基材的表面以及沟槽处通过电镀工艺形成导电层；
在其中一个实施例中，导电层包括第一导电层130、第二导电层131，其中第一导电层设置在光阻层120远离透明基材110的表面，以及沟槽121的底端，即沟槽121处的露出的透明基材110的表面，第一导电层的厚度150nm以下，在具体的示例中，第一导电层的厚度可以为100nm、110nm、120nm。第二导电层131设置在沟槽处的第一导电层130的表面，第二导电层131的厚度为0.5μm～10μm；导电层的厚度选用在上述范围内，可获得阻抗较小的天线，到导电层过薄，导电性差，阻抗比较大；导电层过厚，容易引起导电层起皱，影响外观以及后续使用效果；在具体的示例中，第二导电层的厚度可以为0.5μm、1μm、1.5μm、3.5μm、5μm、6μm、7.5μm或者10μm。导电层通过先通过蒸镀工艺形成较薄的第一导电层130，再通过真空镀、水镀、溅镀或PVD形成较厚的第二导电层131，以便降低透明线路面阻，提高导电性。且相对于直接用蒸镀形成导电层，本实施方式先蒸镀形成一薄层的导电层，形成通电，再采用效率高的电镀方式形成第二导电层，可以减少整体电镀所用的时间，提升效率；另外，可避免直接蒸镀过厚易导致导电层起皱。
具体地，导电层的材质可以选用导电性能优异的金属或合成金属，具体例如Cu、Cu-Ni合金、Ag、Cu-ITO、Au、Ni、Al等。本领域技术人员可根据该天线所需要的发射和接收信号进行相应地选择。
采用电镀的工艺形成的导电层更平整、均匀，从而使得制成的天线质量更高和表面平整性更好。
S150：将光阻层120远离透明基材110表面的导电层以及光阻层去除，形成天线图案。
具体地，如图3所示，将光阻层120远离透明基材110表面的第一导电层130去除，只保留沟槽处的第一导电层和第二导电层，形成透明导电金属网格； 通过激光等方式切割导电金属网格，形成天线图案。
在其中一些实施例中，去除的方法采用本领域常规的剥离工艺，剥离通过化学试剂将光阻层和光阻层上的第一导电层130一起剥离即形成整面透明网格线路；在具体的一个示例中，剥离液采用异丙醇，并结合超声工艺进行剥离。该方法剥离效率高，且剥离比较彻底。
天线图案的具体种类不受特别的限制，具体例如手机天线的电路、NFC天线的电路回路等等，本领域技术人员可根据该天线的实际作用进行相应地选择和设计，在具体的示例中，天线图案为透明网格线路。
S160：将天线图案切割分离形成天线区域和无效区域，以形成天线。
具体地，通过采用镭射工艺工艺将天线图案切割分离形成天线区域和无效区域。
需要说明的是，制作天线的方法除了包括上述步骤以外，还可以包括其他步骤，具体例如包括清洗透明基材110的表面，以清洗透明基材110表面的氧化物、杂质、油质或水分子。
通过上述实施方式的天线制作方法中，如图4所示，将天线制作成金属网格透明天线，具备低阻抗、透明的特性，采用电镀的工艺形成的导电层更平整、均匀，从而使得制成的天线质量更高和表面平整性更好，可以设置在电子设备表面，作为天线，实现对无线电信号的收发，为电子产品的天线，提供了更宽的可选择放置的区域；天线可以布置的空间更大，且该制作方法操作简便、工艺简单。
通过上述实施方式的天线制作方法中，通过先设置有较薄的第一导电层130，再设置较厚的第二导电层131，较薄的导电层通常通过蒸镀的工艺形成，由于蒸镀加厚需很长时间，如做到更厚N倍以上的时间制作及蒸镀导电材料过厚易导致材料起皱；其它方式电镀(水镀)的效率高，但水镀需接电，故需先蒸镀一层较薄的导电材料通电；可以减少水镀所用的时间，提升效率；另外可避免直接蒸镀过厚易导致导电层起皱。
上述实施方式制作方法制作而成的天线100的具体种类不受特别的限制，具体例如5G天线、NFC天线，等等，本领域技术人员可根据该天线100的实际 使用要求进行相应地选择，在此不再赘述。
一实施方式的电子设备，包括上述实施方式的制作方法制作而成的天线。电子设备的具体类型不受特别的限制，具体例如手机、平板电脑、智能手表等，本领域技术人员可根据该电子设备的具体用途进行相应地选择，在此不再赘述。需要说明的是，该电子设备除了包括上述的天线100以外，还包括其他必要的部件和结构，以手机为例，具体例如显示装置、处理器、存储器、电池、电路板、摄像头等等，本领域技术人员可根据该电子设备的具体种类进行相应地设计和补充，在此不再赘述。
以下为具体实施例部分。
实施例1
本实施例的天线的制作方法，包括以下步骤：
提供玻璃材质的透明基材110；透明基材110具有两个相对的表面，其中一个表面为安装面111。
在透明基材110的一个表面通过旋转涂布一层厚度为1.5μm的光阻层；
通过曝光显影出宽度为1.5μm的正方形网格沟槽121，露出透明基材110；
在光阻层远离透明基材的表面以及沟槽通过蒸镀铜形成第一导电层，第一导电层的厚度为100nm；在沟槽处的第一导电层130的表面进行水镀铜形成第二导电层131，第二导电层131的厚度为0.5μm。
通过化学试剂异丙醇，并结合超声工艺进将光阻层以及光阻层上的第一导电层一起剥离，只保留沟槽处的第一导电层130和第二导电层131，即形成整面透明网格线路；通过激光等方式切割导电金属网格，形成天线图案。
最后通过镭射工艺将天线图案切割分离形成天线区域和无效区域，将无效区域去除，以形成天线。
实施例2
本实施例的天线的制作方法，包括以下步骤：
提供PMMA板的透明基材110；透明基材110具有两个相对的表面，其中 一个表面为安装面111。
在透明基材110的一个表面通过旋转涂布一层厚度为3.5μm的光阻层；
通过曝光显影出宽度为3.5μm的正方形网格沟槽121，露出透明基材110；
在光阻层远离透明基材的表面以及沟槽通过蒸镀铜形成第一导电层，第一导电层的厚度为110nm；在沟槽处的第一导电层130的表面再进行水镀铜形成第二导电层131，第二导电层131的厚度为3.5μm。
通过化学试剂异丙醇，并结合超声工艺进将光阻层以及光阻层上的第一导电层一起剥离，只保留沟槽处的第一导电层和第二导电层，即形成整面透明网格线路；通过激光等方式切割导电金属网格，形成天线图案。
最后通过镭射工艺将天线图案切割分离形成天线区域和无效区域，将无效区域去除，以形成天线。
实施例3
本实施例的天线的制作方法，包括以下步骤：
提供PC与PMMA复合板的透明基材110；透明基材110具有两个相对的表面，其中一个表面为安装面111。
在透明基材110的一个表面通过静电喷涂一层厚度为5μm的光阻层；
通过曝光显影出宽度为6μm的长方形网格沟槽121，露出透明基材110；
在光阻层远离透明基材的表面以及沟槽通过蒸镀Cu-Ni合金形成第一导电层，第一导电层的厚度为120nm；在沟槽处的第一导电层130的表面再进行溅镀Cu-Ni合金形成第二导电层131，第二导电层131的厚度为5μm。
通过化学试剂异丙醇，并结合超声工艺进将光阻层以及光阻层上的第一导电层一起剥离，只保留沟槽处的第一导电层和第二导电层，即形成整面透明网格线路；通过激光等方式切割导电金属网格，形成天线图案。
最后通过镭射工艺将天线图案切割分离形成天线区域和无效区域，将无效区域去除，以形成天线。
实施例4
本实施例的天线的制作方法，包括以下步骤：
提供PET材质的透明基材110；透明基材110具有两个相对的表面，其中 一个表面为安装面111。
在透明基材110的一个表面通过旋转涂布一层厚度为7.5μm的光阻层；
通过曝光显影出宽度为6μm的长方形网格沟槽121，露出透明基材110；
在光阻层远离透明基材的表面以及沟槽通过溅镀Ag形成第一导电层，第一导电层的厚度为110nm；在沟槽处的第一导电层130的表面再进行溅镀Ag形成第二导电层131，第二导电层131的厚度为7.5μm。
通过化学试剂异丙醇，并结合超声工艺进将光阻层以及光阻层上的第一导电层一起剥离，只保留沟槽处的第一导电层和第二导电层，即形成整面透明网格线路；通过激光等方式切割导电金属网格，形成天线图案。
最后通过镭射工艺将天线图案切割分离形成天线区域和无效区域，将无效区域去除，以形成天线。
实施例5
本实施例的天线的制作方法，包括以下步骤：
提供PMMA板的透明基材110；透明基材110具有两个相对的表面，其中一个表面为安装面111。
在透明基材110的一个表面通过旋转涂布一层厚度为10μm的光阻层；
通过曝光显影出宽度为10μm的菱形网格沟槽121，露出透明基材110；
在光阻层远离透明基材的表面以及沟槽通过真空镀Ni形成第一导电层，第一导电层的厚度为110nm；在沟槽处的第一导电层130的表面再进行真空镀Ni形成第二导电层131，第二导电层131的厚度为10μm。
通过化学试剂异丙醇，并结合超声工艺进将光阻层以及光阻层上的第一导电层一起剥离，只保留沟槽处的第一导电层和第二导电层，即形成整面透明网格线路；通过激光等方式切割导电金属网格，形成天线图案。
最后通过镭射工艺将天线图案切割分离形成天线区域和无效区域，将无效区域去除，以形成天线。
对比例1
本对比例与实施例1的区别仅在于，光阻层的厚度为1μm。
对比例2
本对比例与实施例2的区别仅在于，所述第二导电层的厚度为0.25μm。
对比例3
本对比例采用现有ITO材质制作的透明导电膜制作天线。
测试：
测定实施例1～5及对比例1～3制备而成的天线的透过率和方阻，测定结果详见表1。
其中，采用常规方法测定天线的透过率和方阻。
表1
  透过率(％) 方阻(Ω)
实施例1 96 4.5
实施例2 92 4.2
实施例3 90 3.3
实施例4 95 3.0
实施例5 92 2.1
对比例1 95 10
对比例2 92 7.8
对比例3 93 13
从表1可以看出，本发明制作得到的天线具备低阻抗、透过率高的特性；对比例1的光阻层厚度低于本申请，由于再进行镀导电层需保证导电层比光阻层薄，否则光阻层上第一导电层会与沟槽内的第二导电层相连，后续剥离会导致沟槽内的第二导电层一起剥离，需要制作薄的导电层，而过薄线路阻抗比较大；对比例2的方阻大于本申请，是由于导电层过薄，导电性差，阻抗比较大；
对比例3采用现有的导电薄膜天线，从测试结果可知，其阻抗大，性能不如本发明的方法制作得到的天线。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (15)

  1. 一种制作天线的方法，其特征在于，包括以下步骤：
    提供透明基材；
    在所述透明基材的一个表面设置光阻层；
    在所述光阻层形成沟槽，所述沟槽底端露出透明基材；
    在所述光阻层远离透明基材的表面以及所述沟槽通过电镀工艺形成导电层；
    将所述光阻层远离透明基材表面的导电层以及所述光阻层去除，形成天线图案。
  2. 根据权利要求1所述的方法，其特征在于，在所述光阻层远离所述透明基材的表面以及沟槽通过电镀工艺形成导电层的步骤包括：
    在所述光阻层远离透明基材的表面以及所述沟槽通过蒸镀工艺形成第一导电层；
    在所述沟槽处的第一导电层远离所述透明基材的表面通过蒸镀以外的电镀工艺形成第二导电层。
  3. 根据权利要求2所述的方法，其特征在于，所述第一导电层的厚度小于150nm，所述第二导电层的厚度为0.5μm～10μm。
  4. 根据权利要求2或3所述的方法，其特征在于，所述第一导电层与第二导电层的材料为Cu、Cu-Ni合金、Ag、Al、Cu-ITO、Au和Ni中的一种。
  5. 根据权利要求2或3所述的方法，其特征在于，第二导电层采用水镀或溅镀。
  6. 根据权利要求1所述的方法，其特征在于，所述透明基材的材料采用玻璃、PC板、PET、COP、PMMA板、PC与PMMA的复合板、TPU或POL。
  7. 根据权利要求1所述的方法，其特征在于，在所述透明基材的一个表面设置光阻层的步骤为采用涂布方式设置光阻层。
  8. 根据权利要求1所述的方法，其特征在于，所述光阻层的厚度为1.5μm～10μm。
  9. 根据权利要求1所述的方法，其特征在于，所述沟槽的宽度为1.5μm～10μm。
  10. 根据权利要求1所述的方法，其特征在于，所述沟槽为网格形状，进一步地，所述网格形状为多边形，优选地，多边形为长方形、菱形或六边形。
  11. 根据权利要求1所述的方法，其特征在于，在所述光阻层形成沟槽的步骤包括：
    对所述光阻层远离基材的表面进行曝光及显影制程，以使所述光阻层形成沟槽。
  12. 根据权利要求1所述的方法，其特征在于，所述将光阻层表面的导电层以及光阻层去除方式采用剥离工艺去除，进一步地，采用剥离液异丙醇与超声结合剥离去除光阻层表面的导电层以及光阻层。
  13. 根据权利要求1所述的方法，其特征在于，还包括采用镭射工艺将天线图案分离成天线区域以及无效区域，形成天线的步骤。
  14. 一种天线，其特征在于，采用权利要求1～13任一项所述的方法制作而成。
  15. 一种电子设备，其特征在于，包括权利要求14所述的天线。
PCT/CN2020/077656 2020-03-03 2020-03-03 天线及其制作方法、电子设备 WO2021174426A1 (zh)

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