WO2021171599A1 - 高速光送受信装置 - Google Patents
高速光送受信装置 Download PDFInfo
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- WO2021171599A1 WO2021171599A1 PCT/JP2020/008469 JP2020008469W WO2021171599A1 WO 2021171599 A1 WO2021171599 A1 WO 2021171599A1 JP 2020008469 W JP2020008469 W JP 2020008469W WO 2021171599 A1 WO2021171599 A1 WO 2021171599A1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/80—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water
- H04B10/801—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water using optical interconnects, e.g. light coupled isolators, circuit board interconnections
- H04B10/803—Free space interconnects, e.g. between circuit boards or chips
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/25—Arrangements specific to fibre transmission
- H04B10/2575—Radio-over-fibre, e.g. radio frequency signal modulated onto an optical carrier
- H04B10/25752—Optical arrangements for wireless networks
- H04B10/25758—Optical arrangements for wireless networks between a central unit and a single remote unit by means of an optical fibre
- H04B10/25759—Details of the reception of RF signal or the optical conversion before the optical fibre
Definitions
- the present invention relates to an optical transmitter (optical modulator) equipped with a digital signal processing circuit and a high-speed optical transmitter / receiver equipped with an optical receiver.
- Digital signal processing technology including digital coherence
- backbone network transmission technology of 100 Gbps per wavelength has been established.
- speed has reached a practical level of 400 to 600 Gbps per wavelength. ing.
- each component (IC, optical IC (PIC)) is individually packaged, for example, each component is mounted on a printed circuit board (PCB). rice field.
- PCB printed circuit board
- a DSP package board 110 is mounted on a PCB board board 100, electrically connected by a BGA (ball grid array) 101, and a DSP-ASIC111 chip is mounted on the DSP-ASIC111 chip.
- BGA ball grid array
- the electrical input / output of the DSP package board 110 is connected to the driver / TIA 130 via the surface mount lead pin 102 by the printed wiring on the PCB board board 100, and is connected to the optical modulation (light receiving) module 120 via this.
- the optical modulation (light receiving) module 120 receives the modulated electric signal, performs optical modulation, outputs the modulated light to the optical fiber 140, and converts the signal light received from the optical fiber 140 into an electric signal to the DSP package substrate 110. Send, DSP-ASIC111 processes the received signal.
- CDM Coherent Driver Modulator
- ICR Integrated Coherent Receiver
- the DSP-ASIC that generates watt-class heat and the optical transmission / reception device are arranged close to each other on the same package substrate, the characteristics of the optical transmission / reception device have little fluctuation with respect to temperature change / rise (temperature). Those with less dependence) are desired.
- a semiconductor-based optical modulator is attracting attention from the viewpoint of miniaturization and cost reduction in place of the conventional lithium niobate (LN) optical modulator.
- compound semiconductors such as InP are mainly used, and research and development are concentrated on Si-based optical devices in systems where smaller size and lower cost are important. There is.
- Semiconductor optical modulators also have advantages and disadvantages peculiar to materials.
- InP optical modulators in order to control the band end absorption effect, it is considered that temperature controller control is indispensable during the modulation operation.
- the Si modulator has the advantage of not requiring temperature control, the electro-optical effect is smaller than that of other material systems, so it is necessary to lengthen the electro-optical interaction length, resulting in an increase in high-frequency loss. It may be invited, and there are many problems in further speeding up (widening the bandwidth).
- the co-packaged form of a plurality of chips such as those shown in FIGS. 2 and 3 having a higher degree of integration is more advantageous for speeding up than the individual package form shown in FIG.
- a DSP co-package form with a higher degree of integration has been studied for a Si-based optical modulator with a small temperature dependence, while an InP-based optical modulator with a large temperature dependence has a high degree of integration.
- a form for example, CDM
- driver IC high frequency amplification element
- the light modulation element is generally mounted on a temperature controller (TEC) and is temperature (constant) controlled.
- the mounting form of the conventional semiconductor optical modulator is mainly the CDM form shown in FIG. 2 (ICR on the receiver side, IC-TROSA in the case of a transmitter / receiver integrated package, Integrated Coherent Transmitter and Receiver Optical Sub- It is also roughly classified into the DSP co-package form shown in FIG. 3).
- each of the above-mentioned two conventional implementation forms has a problem of hindering wideband as follows.
- a high-speed analog electric signal output from a digital / analog conversion circuit (DAC) provided in a DSP-ASIC is propagated to an ASIC ⁇ DSP package board ⁇ PCB board board ⁇ optical modulation module and converted into an optical signal.
- DAC digital / analog conversion circuit
- NS optical modulation module
- For the electrical interface for example, surface mount SMT (Surface Mount Technology), FPC (Flexible printed circuits), flexible printed circuit boards, and flexible printed wiring boards are used.
- solder balls with a diameter of 100 to several hundred microns are used for connection, so when a high frequency signal of 50 GHz or higher is obtained, the solder balls Electrical reflection due to impedance mismatch at the connection point is a factor that greatly deteriorates the high frequency characteristics.
- the optical module terraces having different heights are shown in the side sectional view of an example in which the FPC is used in the conventional CDM mounting system of FIG.
- the FPC is connected on the PCB board, it is necessary to strongly bend the FPC 450 and mount it.
- Si-based modulators having a small temperature dependence are mainly used. Therefore, as described above, in further speeding up (wide band), the characteristics of the optical modulator itself are improved. Is a big issue.
- the InP modulator is DSP copackaged instead of the Si modulator, it is necessary to change the composition of the InP modulator core (reduce the band end absorption of the material). In that case, Since the modulation efficiency of the InP modulator itself decreases (quantum confinement Stark effect: decrease in QCSE), there is also a problem that SNR deteriorates.
- an InP optical modulator having excellent high speed is mounted on the optical modulation module, and a flexible substrate (FPC) is used as a high frequency interface for directly connecting the DSP package substrate and the optical modulation module.
- FPC flexible substrate
- the optical modulation module be equipped with a temperature controller (TEC). Further, in order to stabilize the optical characteristics for a long period of time, it is also desirable to ensure the airtightness inside the module and to enclose the inert gas.
- TEC temperature controller
- a mechanism for connecting the high frequency wiring pattern on the DSP package board and the FPC board is provided on the DSP package board having no metal lid, and the high frequency signal is transmitted to the optical transmission module via the FPC (not via the PCB board board).
- the structure is such that power is directly supplied.
- the present invention particularly provides an important framework for configuring a next-generation 800G, 1Tbps (per wavelength) system in which the required bandwidth of the optical transmitter / receiver is 50 GHz or higher (100 GB aud rate as the modulation baud rate (symbol rate)). Carry.
- the embodiment has, for example, the following configuration.
- (Structure 1) In an optical transmitter / receiver including at least one of a digital signal processing circuit and an optical modulation module in which a driver and an optical modulation element are integrated, or an optical receiver module in which a transimpedance amplifier and an optical light receiving element are at least integrated.
- a flexible substrate is used as a high-frequency interface between the optical modulation module and the optical receiver module.
- a mechanism for connecting a high-frequency wiring pattern to the flexible substrate is provided on the package substrate of the digital signal processing circuit.
- a high-speed optical transceiver wherein at least one of the package substrate and the optical modulation module or the optical receiving module is directly connected by the flexible substrate.
- (Structure 2) The high-speed optical transmission / reception device according to configuration 1, wherein the light modulation element mounted on the light modulation module is temperature-controlled by a temperature controller.
- (Structure 3) The high-speed optical transmitter / receiver according to configuration 1 or 2, wherein the optical modulation module is airtightly packaged.
- (Structure 4) The high-speed optical transmitter / receiver according to configuration 1, wherein an InP substrate is used for the light modulation element mounted on the light modulation module, and at least two or more Mach-Zehnder type optical interference waveguides are included. ..
- the package substrate of the digital signal processing circuit and the optical modulation / optical receiver module are flexibly substrate. It is possible to connect in a wide band while suppressing high frequency loss, and it is possible to realize a high-speed optical transmitter / receiver.
- FIG. 5 is a side sectional view of an optical transmitter / receiver showing an outline configuration of the present invention.
- the DSP package board 510 connected by the BGA 501 is mounted on the upper left side of the PCB board board 500, and the DSP-ASIC511 is mounted on the DSP package board 510.
- the optical modulation (reception) module 525 on the right side has a height difference of 2 mm or less between the height of the package terrace of the module (the part having the shelf-like surface in the middle of the package) and the height of the upper surface of the DSP package substrate 510. It is installed in and is directly connected by a flexible substrate (FPC550) as a high frequency interface to supply power.
- FPC550 flexible substrate
- the height of the upper surface of the DSP package substrate 510 may be adjusted so that the height difference is 2 mm or less. In short, it suffices if the FPC550 can be securely connected without major bending.
- the FPC 550 exemplifies a structure having at least two layers of a base film (upper layer) and a copper foil (lower layer), but the present invention is not limited to this.
- FIG. 6 shows a plan view of the optical transmitter / receiver for digital coherent communication according to the first embodiment of the present invention.
- the DSP package board 610 on which the DSP-ASIC611 is mounted is mounted on the left side of the PCB board board 600, and the DSP package board 610 has a low-speed signal interface 603 at the left end or the upper and lower ends of the PCB board board 600. It is connected.
- the DSP-ASIC 611 converts the low-speed electric signal into a high-frequency signal, and the high-frequency signal is input / output from the expansion wiring 612 on the right side of the DSP-ASIC to the FPC interface 650 via the connection PAD 613.
- the connection PAD 613 may be an FPC connector.
- the FPC interface 650 is connected to the optical transmission module CDM626 and the optical reception module ICR625, and the optical transmission module CDM626 and the optical reception module ICR625 perform optical electrical conversion and transmit / receive an optical signal between the optical fiber 640 at the right end. ..
- the FPC connection may be a connection between the DSP package substrate 610 and at least one of the transmission (modulation) module CDM726 or the optical reception module ICR725. If necessary, a low-speed electric signal may be connected to the optical transmission module CDM and the optical reception module ICR.
- a polarization multiplex IQ optical modulation method is assumed, and the high frequency signals input / output to and from the DSP-ASIC611 have four channels, respectively.
- X-polarized I-channel / X-polarized Q-channel / Y-polarized I-channel / Y-polarized Q-channel Since each channel is generally treated as a differential pair of electrical signals, the number of signal lines for high-frequency wiring is 8 for each of optical transmission and reception (2 x 4 channels of differential pn), for a total of 16 lines. It propagates the FPC650 between the optical transmitter / receiver module (CDM626, ICR625) and the DSP-ASIC611.
- the propagation length and the offset length are determined in consideration of the mounting space of the optical transmission module (CDM626) and the optical reception module (ICR625).
- the wiring length of the FPC is set to 15 mm in consideration of the mounting workability of each component, but it is clear that the usefulness of the invention is not lost depending on the length. (Note that the high-frequency signal of each channel may be a single-phase signal instead of a differential signal.)
- FIG. 7 is a side sectional view of the optical transmission / reception device according to the first embodiment of the present invention on the side of the optical transmission (modulation) module CDM726. Since the optical receiving module ICR725 has almost the same structure, the description thereof will be omitted. At least one of the optical transmission (modulation) module CDM726 and the optical reception module ICR725 may be FPC-connected.
- the optical transmission (modulation) module CDM726 is mounted on a PCB substrate 700 and on a subcarrier (optical element base) 780 arranged on a temperature regulator (TEC) 760.
- An optical modulator PIC727, a chip condensing lens 781 (first lens) and a fiber condensing lens 782 (second lens) are arranged, and transmission light (modulated light) is output to the optical fiber 740.
- an InP-based IQ light modulation element having excellent wide bandability was adopted here.
- An InP substrate is used as the light modulation element, and includes at least two or more Mach-Zehnder type optical interference waveguides.
- a module wiring board base 770 and a module package wall surface 771 are arranged as the package left wall surface of the optical transmission (modulation) module CDM726.
- the module wiring board base 770 and the module package wall surface 771 are made of, for example, ceramics having different thicknesses, and the stepped portions having different thicknesses form the package terrace.
- the metal wiring pattern (lower layer) of the FPC 750 is connected to the high frequency wiring 753 on the upper surface of the module wiring board base 770.
- the high-frequency wiring 753 on the upper surface of the module wiring board base 770 penetrates the ceramic wall surface between the module wiring board base 770 and the module package wall surface 771 and inputs the modulated electrical signal to the optical modulator PIC727 via the gold wire wiring 751. doing.
- the module wiring board base 770 may be configured as a part of the FPC connector, and may be further configured as an integral or dual ceramic component connector together with the module package wall surface 771.
- a through hole through which the high frequency wiring 753 penetrates may be formed on the wall surface leading to the package terrace of the ceramic component connector, and the cross section of the through hole may be formed so that the upper part of the high frequency wiring 753 becomes a tunnel-shaped cavity.
- the height of this cavity may be formed from a height higher than the thickness of the FPC750 toward the inside of the module from the wall surface entrance of the through hole so as to be gradually lower (at least narrower than the thickness of the FPC750).
- an inert gas such as Ar or N 2 may be sealed in the module and airtightly sealed.
- Example 2 a driver IC integrated optical transmission module as shown in FIG. 8 may be used.
- the difference between the driver IC integrated optical transmission module 826 of FIG. 8 and the optical transmission module CDM726 of FIG. 7 is that the high frequency amplification IC 830 is arranged as a driver IC between the module wiring board base 870 and the optical modulator PIC 827. This is a point, and other explanations will be omitted.
- driver integration is that it can be expected to compensate for the loss of high-frequency electrical signals caused by wiring, modules, etc., and to increase the modulation efficiency due to signal gain, and the integrated mounting form of the InP modulator and driver IC is already wide. Another point is that it is recognized as a CDM (established as a technology).
- the module wiring board base 870 can be configured as a part of the FPC connector, and can be configured as an integral or two-body ceramic component connector together with the module package wall surface 871.
- differential signal line patterns high frequency wiring patterns, for example, GSSG / channels
- differential signal line patterns for example, GSSG / channels
- An unfolded wiring that converts the pitch of the high-frequency wiring pattern so as to match the pitch between the connection channels of the FPC is provided as the unfolding board.
- the connection between the FPC and the power supply pad pattern provided on the DSP package substrate is fixed with solder.
- connection mechanism such as an FPC connector for high-frequency transmission.
- the low-speed signal interface including the DC signal can be connected to the peripheral circuit via a higher density BGA or the like as before.
- BGA higher density BGA
- SMT serial to Physical Transport
- FPC field-programmable gate array
- BGA the optical transmission / reception module side
- the effectiveness of the present invention is not affected by the type of low-speed signal interface.
- FIG. 9 shows a configuration example in which the IC-TROSA module 925 in which optical transmission and optical reception are integrated (also equipped with a functional element such as a laser) is used as the optical transmission / reception module as the third embodiment of the present invention. ..
- the FPC connection between the DSP package board 910 and the IC-TROSA module 925 can also be connected by a pair of connectors.
- an optical transmitter optical modulator
- a package substrate of the digital signal processing circuit and an optical modulation / optical receiver module are provided.
- a flexible substrate can be used to connect in a wide band while suppressing high-frequency loss, enabling a high-speed optical transmitter / receiver.
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- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
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- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
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Abstract
Description
図1~3に示したような従来の光送受信器の更なる高速化を実現するためには、IC(例えばSi-CMOSなど)やPIC(例えば光変調素子、光受光素子など)の高速化のみならず、パッケージや高周波配線の高速化(低RF損失化)、及び各コンポーネント間の電気的接続の低損失化(低反射化)が重要である。即ち、実装上の高速化という観点では、図1に示した個別パッケージ形態よりも、集積度の高い図2、そして図3といった複数チップのコパッケージ形態が高速化に有利といえる。
例えばDSP-ASIC内に設けられたデジタル/アナログ変換回路(DAC)から出力される高速アナログ電気信号は、ASIC→DSPパッケージ基板→PCBボード基板→光変調モジュールへと伝搬されて光信号に変換される。電気インターフェースには例えば表面実装SMT(Surface Mount Technology)や、FPC(Flexible printed circuits:フレキシブルプリント回路基板、フレキシブルプリント配線板が用いられる。
上記課題を解決する方法として広く知られているのが、図3にも示したDSPコパッケージの実装形態である。当該形態においては、図3に示すように、パッケージ基板310の上にDSP-ASIC311だけでなく、ドライバ(TIA)330や光変調器(光受信機)のPIC325まで搭載し、高周波電気信号を半田ボールなどを介することなく、最短の配線で光変調器へ給電することが可能となる。
(構成1)
デジタル信号処理回路と、ドライバと光変調素子が少なくとも一体となった光変調モジュール、またはトランスインピーダンスアンプと光受光素子が少なくとも一体となった光受信モジュールの少なくともいずれかを含んだ光送受信装置において、
前記光変調モジュールおよび光受信モジュールの高周波インターフェースとしてフレキシブル基板を用い、
前記デジタル信号処理回路のパッケージ基板の上には、高周波配線パターンを前記フレキシブル基板と接続する機構が設けられており、
前記パッケージ基板と、前記光変調モジュールまたは光受信モジュールの少なくともいずれかが前記フレキシブル基板によって直接接続されている
ことを特徴とする高速光送受信装置。
(構成2)
前記光変調モジュールに搭載される光変調素子は温度コントローラによって温度制御されている
ことを特徴とする構成1記載の高速光送受信装置。
(構成3)
前記光変調モジュールは気密パッケージ化されている
ことを特徴とする構成1または2に記載の高速光送受信装置。
(構成4)
前記光変調モジュールに搭載される光変調素子にはInP基板が用いられ、少なくとも2つ以上のマッハ・ツェンダ型光干渉導波路を含んでいる
ことを特徴とする構成1に記載の高速光送受信装置。
(構成5)
前記光変調モジュールまたは光受信モジュールには光変調素子と光受光素子のほか、高周波増幅素子が搭載されている
ことを特徴とする構成1ないし4のいずれか1項に記載の高速光送受信装置。
(構成6)
前記光変調モジュールまたは光受信モジュールの3dB帯域は50GHz以上を有している
ことを特徴とする構成1ないし5のいずれか1項に記載の高速光送受信装置。
(構成7)
前記フレキシブル基板と接続する機構はコネクタ接続により構成されている
ことを特徴とする請求項1ないし6のいずれか1項に記載の高速光送受信装置。
(構成8)
前記光変調モジュールまたは光受信モジュールのパッケージテラスの高さと前記デジタル信号処理回路のパッケージ基板の上面の高さの高低差が2mm以下である
ことを特徴とする構成1ないし7のいずれか1項に記載の高速光送受信装置。
[発明の効果]
図6に、本発明の実施例1のデジタルコヒーレント通信用光送受信装置の平面図を示す。図6において、PCBボード基板600の左側にはDSP-ASIC611を搭載したDSPパッケージ基板610が搭載されており、DSPパッケージ基板610には、PCBボード基板600の左端または上下端において低速信号インターフェース603が接続されている。DSP-ASIC611により低速電気信号を高周波信号に変換し、DSP-ASIC右側の展開配線612から接続PAD613を介して高周波信号をFPCインタフェース650に入出力する。接続PAD613はFPCコネクタであってもよい。
1チャネルはそれぞれ一般に差動対の電気信号として取り扱われるため、高周波配線の信号線路本数は光送信/光受信でそれぞれ8本(差動pnの2本×4チャネル分)、計16本となり、光送受信モジュール(CDM626,ICR625)とDSP-ASIC611の間のFPC650を伝搬する。FPC650は、光送信モジュール(CDM626)と光受信モジュール(ICR625)の実装スペースを考慮して、伝搬長及びオフセット長が決定される。ここでは各部品の実装作業性を考慮してFPCの配線長を15mmとしたが、当該長さ如何によって発明の有用性が失われるものではないことは明らかである。(なお、各チャネルの高周波信号は、差動信号ではなく単相信号であることもできる。)
また本発明の実施例2として、図8に示すようなドライバIC一体型光送信モジュールを用いてもよい。図8のドライバIC一体型光送信モジュール826と図7の光送信モジュールCDM726との相違点は、モジュール配線基板土台870と光変調器PIC827との間に高周波増幅IC830がドライバICとして配置されている点であり、他の説明は省略する。
最後に図9に、本発明の実施例3として、光送信と光受信を一体化(レーザ等の機能素子も搭載)したIC-TROSAモジュール925を光送受信モジュールに用いた場合の構成例を示す。DSPパッケージ基板910とIC-TROSAモジュール925との間のFPC接続は、1対のコネクタにより接続することもできる。
101,401、501 BGA
102 表面実装リードピン
110、210、310,410,510,610 (DSP)パッケージ基板
111、211、311,411,511,611 DSP-ASIC
120 光変調(受光)モジュール
130,330 ドライバ/TIA
140,240、340,440,540,640,740,840 光ファイバ
225,525 (一体実装)光変調(光受信)モジュール
325,727,827 PIC
450,550,650,750,850 FPC(インタフェース)
603 低速信号インターフェース
612 展開配線
613 接続PAD
626,726 CDM
625,725 ICR
751,851、852 金ワイヤ配線
753.853 高周波配線
760,860 温度調整器(TEC)
780,880 サブキャリア(光学素子土台)
770,870 モジュール配線基板土台
771、871 モジュールパッケージ壁面
781,881 チップ集光レンズ(第1レンズ)
782,882 ファイバ集光レンズ(第2レンズ)
830 高周波増幅IC
925 IC-TROSAモジュール
Claims (8)
- デジタル信号処理回路と、ドライバと光変調素子が少なくとも一体となった光変調モジュール、またはトランスインピーダンスアンプと光受光素子が少なくとも一体となった光受信モジュールの少なくともいずれかを含んだ光送受信装置において、
前記光変調モジュールおよび光受信モジュールの高周波インターフェースとしてフレキシブル基板を用い、
前記デジタル信号処理回路のパッケージ基板の上には、高周波配線パターンを前記フレキシブル基板と接続する機構が設けられており、
前記パッケージ基板と、前記光変調モジュールまたは光受信モジュールの少なくともいずれかが前記フレキシブル基板によって直接接続されている
ことを特徴とする高速光送受信装置。 - 前記光変調モジュールに搭載される光変調素子は温度コントローラによって温度制御されている
ことを特徴とする請求項1記載の高速光送受信装置。 - 前記光変調モジュールは気密パッケージ化されている
ことを特徴とする請求項1または2に記載の高速光送受信装置。 - 前記光変調モジュールに搭載される光変調素子にはInP基板が用いられ、少なくとも2つ以上のマッハ・ツェンダ型光干渉導波路を含んでいる
ことを特徴とする請求項1に記載の高速光送受信装置。 - 前記光変調モジュールまたは光受信モジュールには光変調素子と光受光素子のほか、高周波増幅素子が搭載されている
ことを特徴とする請求項1ないし4のいずれか1項に記載の高速光送受信装置。 - 前記光変調モジュールまたは光受信モジュールの3dB帯域は50GHz以上を有している
ことを特徴とする請求項1ないし5のいずれか1項に記載の高速光送受信装置。 - 前記フレキシブル基板と接続する機構はコネクタ接続により構成されている
ことを特徴とする請求項1ないし6のいずれか1項に記載の高速光送受信装置。 - 前記光変調モジュールまたは光受信モジュールのパッケージテラスの高さと前記デジタル信号処理回路のパッケージ基板の上面の高さの高低差が2mm以下である
ことを特徴とする請求項1ないし7のいずれか1項に記載の高速光送受信装置。
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US17/793,768 US20230069120A1 (en) | 2020-02-28 | 2020-02-28 | High-Speed Optical Transceiver |
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CN114371537A (zh) * | 2022-02-17 | 2022-04-19 | Nano科技(北京)有限公司 | 一种分体式集成封装光模块 |
WO2023175746A1 (ja) * | 2022-03-15 | 2023-09-21 | 日本電信電話株式会社 | 光モジュール |
WO2024009388A1 (ja) * | 2022-07-05 | 2024-01-11 | 日本電信電話株式会社 | 光受信器 |
WO2024013827A1 (ja) * | 2022-07-11 | 2024-01-18 | 日本電信電話株式会社 | 高速光送受信装置 |
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