WO2021160639A1 - Système de carte de circuits imprimés et procédé de fabrication d'un système de carte de circuits imprimés - Google Patents

Système de carte de circuits imprimés et procédé de fabrication d'un système de carte de circuits imprimés Download PDF

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Publication number
WO2021160639A1
WO2021160639A1 PCT/EP2021/053138 EP2021053138W WO2021160639A1 WO 2021160639 A1 WO2021160639 A1 WO 2021160639A1 EP 2021053138 W EP2021053138 W EP 2021053138W WO 2021160639 A1 WO2021160639 A1 WO 2021160639A1
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WO
WIPO (PCT)
Prior art keywords
area
circuit board
region
fluid
designed
Prior art date
Application number
PCT/EP2021/053138
Other languages
German (de)
English (en)
Inventor
Karl-Friedrich Pfeiffer
Henning Grotevent
Original Assignee
Vitesco Technologies Germany Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vitesco Technologies Germany Gmbh filed Critical Vitesco Technologies Germany Gmbh
Priority to EP21709346.7A priority Critical patent/EP4103915A1/fr
Priority to CN202180014119.2A priority patent/CN115038940A/zh
Publication of WO2021160639A1 publication Critical patent/WO2021160639A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
    • G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
    • G01F23/28—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring the variations of parameters of electromagnetic or acoustic waves applied directly to the liquid or fluent solid material
    • G01F23/296—Acoustic waves
    • G01F23/2962—Measuring transit time of reflected waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
    • G01F23/80—Arrangements for signal processing
    • G01F23/802—Particular electronic circuits for digital processing equipment
    • G01F23/804—Particular electronic circuits for digital processing equipment containing circuits handling parameters other than liquid level
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/02—Analysing fluids
    • G01N29/024—Analysing fluids by measuring propagation velocity or propagation time of acoustic waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/222—Constructional or flow details for analysing fluids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/223—Supports, positioning or alignment in fixed situation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2437—Piezoelectric probes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/022—Liquids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/022—Liquids
    • G01N2291/0226—Oils, e.g. engine oils
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/025—Change of phase or condition
    • G01N2291/0258—Structural degradation, e.g. fatigue of composites, ageing of oils
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/028—Material parameters
    • G01N2291/02809—Concentration of a compound, e.g. measured by a surface mass change
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/028—Material parameters
    • G01N2291/02818—Density, viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/046—Planar parts of folded PCBs making an angle relative to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Definitions

  • the present invention relates to a method for producing an ultrasonic sensor and an ultrasonic sensor, in particular a method for producing an ultrasonic sensor for determining the fill level and / or the temperature of a fluid used in an internal combustion engine, such as an engine oil or an aqueous urea solution.
  • Ultrasonic sensors are used, for example, to determine the fill level and / or quality and the temperature of an oil within an oil pan of an internal combustion engine. Ultrasonic waves are emitted by the ultrasonic sensor to detect the fill level and the fill level is determined on the basis of the sound waves reflected on the oil surface and their transit time.
  • an ultrasonic sensor has an ultrasonic transmitter and receiver. Furthermore, a temperature sensor is provided for determining the temperature of the oil so that the speed of sound can be related to the fluid quality.
  • the electronics of the ultrasonic transducer which for example comprise a piezo element and an integrated circuit, for example an ASIC, are usually arranged in a hollow housing after the electrical connection and are fixed in place there, for example by means of an adhesive.
  • these electronics are placed in another fixed location within the housing by means of a suitable device, for example by clipping or screwing.
  • DE 10 2012 014 307 A1 discloses a method and a sensor device for detecting a liquid level for a vehicle.
  • the sensor device disclosed therein comprises a liquid level sensor and a position sensor.
  • the liquid level sensor and the position sensor are arranged in the sensor device in such a way that the The liquid level sensor and the position sensor have a defined spatial relationship so that a position detected by the position sensor also determines the position of the liquid level sensor.
  • the sensor device is designed to take into account the spatial relationship when determining the liquid level.
  • DE 10 2006 004 321 A1 relates to a multifunctional circuit board for use as a rigid-flexible or semi-flexible circuit board in the form of a plated-through circuit board or a multilayer board or a flexible circuit board.
  • at least one additional functional element is fastened flatly on a copper foil by means of ultrasound or friction welding, at least in parts, by forming an intermetallic connection.
  • a notch milling is made in this area and in this way the circuit board can be bent in the sense of a rigid-flexible or semi-flexible circuit board. If two notches are made, the circuit board can be bent by about 45 ° twice for a total of 90 °.
  • DE 10 2016 205 240 B3 discloses a method for producing an ultrasonic sensor and an ultrasonic sensor which is designed to determine the fill level and / or the temperature of a fluid in an internal combustion engine.
  • the method known therefrom comprises providing electronics of the ultrasonic sensor, arranging the electronics of the ultrasonic sensor in an injection molding tool, and overmolding the electronics with plastic to form a housing for the electronics.
  • the housing comprises at least one functional section which is designed to fulfill a predetermined function.
  • the present invention is based on the object of providing a printed circuit board arrangement, which is improved in terms of manufacturing costs and measurement quality, for a device for determining the fill level and / or the quality and temperature of a fluid of an internal combustion engine arranged in a fluid container specify, wherein the circuit board arrangement is also robust with respect to the service life.
  • the present invention is essentially based on the idea of providing an at least partially curved circuit board in which a first area, on which an ultrasonic transducer can be arranged to determine the fill level and / or quality of the fluid, is designed to be essentially outside the To be arranged fluid container, and in which a second area, on which a temperature sensor for determining the temperature of the fluid and / or a further ultrasonic transducer for determining the quality of the fluid can be arranged, is designed to be arranged essentially within the fluid .
  • the second area extends in a media-tight manner through a wall, for example the bottom, of the fluid container.
  • the circuit board arrangement has a support element which is designed to support the bent circuit board, i. H.
  • the support element can ensure that the bent circuit board remains in its shape as desired even when the circuit board together with the support element is overmolded with plastic to form a media-tight housing.
  • a circuit board arrangement for a device for determining the fill level and / or the quality and the temperature of a fluid of an internal combustion engine arranged in a fluid container comprises an essentially plate-shaped first area, on which at least some of the electronics of the device for determining the fill level and / or quality of the fluid are attached and which is designed to be arranged outside the fluid container, and an essentially plate-shaped area second area on which a temperature sensor for determining the temperature of the fluid and / or an ultrasonic transducer for determining the quality of the fluid is attached and which is designed to be arranged at least partially within the fluid located in the fluid container and at a predetermined angle to the first area angled to extend.
  • the circuit board arrangement according to the invention furthermore has a support element which is connected to the first area and to the second area and is designed to fix the first area and the second area at the predetermined angle to one another.
  • the angled arrangement of the first area and the second area relative to one another can consequently ensure that the first area can be arranged outside the fluid container and the second area on which the temperature sensor for determining the temperature of the fluid and / or the sound transducer for determining the quality of the fluid is attached, can be arranged within the fluid in the fluid container.
  • the second area thus extends at least partially through a wall, preferably through the bottom, of the fluid container.
  • the support element can serve to fix the angled position of the first area relative to the second area.
  • the first area is integrally connected to the second area via a transition area which is bent in such a way that the first area and the second area are angled to one another at the predetermined angle.
  • the transition area is preferably a flexible circuit board area and is preferably integrally connected to the first area and the second area.
  • the predetermined angle is in the range between about 45 ° and about 135 °, and more preferably is about 90 °.
  • the support element has a first section that is connected to the connected to the first region and configured to support the first region, and a second portion connected to the second region and configured to support the second region.
  • the first section of the support element is designed to at least partially encompass the first area such that the first section of the support element is positively and / or non-positively connected to the first area of the circuit board arrangement
  • the second The section of the support element is preferably designed to at least partially encompass the second area in such a way that the second section of the support element is positively and / or non-positively connected to the second area.
  • the support element also has a transition section which is designed to support a transition region arranged between the first region and the second region.
  • the transition section of the support element is designed to support the transition area on only one side.
  • the transition section is preferably designed to support the transition area on the side of the truncated angle relative to the predetermined angle.
  • the circuit board arrangement according to the invention furthermore has a housing which at least partially surrounds the first area, completely the second area, and at least partially surrounds the support element in a fluid-tight manner.
  • the housing is preferably a plastic housing produced by means of plastic injection molding or plastic injection molding, the support element being designed to fix the first area relative to the second area at the predetermined angle during the plastic injection molding process.
  • a further aspect of the present invention is a method for producing a circuit board arrangement for a device for determining the Disclosed fill level and / or the quality and the temperature of a fluid of an internal combustion engine arranged in a fluid container.
  • the method according to the invention comprises providing a circuit board with a substantially plate-shaped first region and a substantially plate-shaped second region, bending the circuit board in such a way that the first region and the second region are arranged at an angle to one another at a predetermined angle, and arranging a Support element such that the support element is connected to the first region and the second region and is designed to position the first region and the second region relative to one another in such a way that the first region and the second region are arranged at an angle to one another at the predetermined angle.
  • the method according to the invention also has an at least partial overmolding of the circuit board arrangement with plastic for molding a housing of the circuit board arrangement.
  • the support element can thus fix and hold the first area relative to the second area at the predetermined angle.
  • FIG. 1 shows a schematic view of a device known from the prior art for determining the fill level and / or the quality and the temperature of a fluid in a fluid container
  • Fig. 2 is a plan view of an exemplary embodiment of a
  • FIG. 3 shows a plan view of a further exemplary embodiment of a
  • FIG. 4 is a side view of the exemplary embodiment of FIG.
  • FIG. 5 shows a side view of an exemplary embodiment of a circuit board arrangement according to the invention with a support element
  • FIG. 6 shows a side view of a further exemplary embodiment of a circuit board arrangement according to the invention with a support element
  • FIG. 7 shows a plan view of a further exemplary embodiment of a
  • FIG. 8 shows a side view of a further exemplary embodiment of a circuit board arrangement before a bending process
  • FIG. 9 shows a side view of the circuit board arrangement according to the invention of FIG. 8 after a bending process
  • FIG. 10 shows a perspective view of an embodiment of a support element of a circuit board arrangement according to the invention
  • FIG. 11 is a perspective view of another embodiment of a
  • FIG. 12 shows an exemplary flow chart of a method according to the invention for producing a circuit board arrangement according to the invention. Elements of the same construction or function are provided with the same reference symbols in all the figures.
  • fluid quality describes a parameter that characterizes a fluid.
  • the speed of sound of the fluid, the density of the fluid, from which the chemical composition of the fluid can be derived, the electrical properties of the fluid and the damping properties of the fluid can be understood as parameters that characterize the fluid quality.
  • the proportion of flarea in the water can be estimated by determining the temperature-dependent sound velocity of the aqueous flare solution.
  • an angled or inclined position of the first area relative to the second area is characterized in that it is a predetermined angle other than 180 °.
  • the plate-shaped first area and the plate-shaped second area thus extend in different planes which are not parallel to one another.
  • the fluid 12 can be, for example, a Act aqueous flare solution, which is designed to be injected into an exhaust tract of an internal combustion engine.
  • the fluid 12 can also be an engine or transmission oil, a brake fluid or a liquid for window cleaning.
  • the device 10 of FIG. 1 has an essentially plate-shaped printed circuit board 20 on which electronics 22 for determining the fill level and / or quality of the fluid 12 are attached and which are designed to be arranged outside the fluid container 14.
  • the electronics 22 are, for example, an ultrasonic transducer which is designed to transmit an ultrasonic signal 24 from the outside through the wall, preferably the base 15, of the fluid container 14 in couple the fluid 12 and again receive the ultrasonic signal 24 reflected on the surface 11 of the fluid 12.
  • the electronics 22 can have capacitors, resistors, operational amplifiers or also an application-specific integrated circuit (ASIC, application-specific integrated circuit), which are necessary for proper operation of the device 10.
  • ASIC application-specific integrated circuit
  • the device 10 of FIG. 1 known from the prior art comprises a temperature sensor 26 which is arranged within the fluid 12 and is electrically connected to the circuit board 20 via a corresponding electrical line 28.
  • the electrical line 28 extends through the wall, preferably the bottom 15, of the fluid container 14 and must be correspondingly sealed.
  • the separate electrical connection 28 represents a not inconsiderable technical effort in production and, due to this individual, separately wired component, represents an increased risk of defects, such as a short circuit between the connecting wires or even a broken electrical connection 28.
  • the circuit board arrangement 100 originally consists of a circuit board and has an essentially plate-shaped first region 110, on which the electronics 112 of the device for determining the fill level and / or quality of the fluid 12 is at least partially attached and which is designed to be essentially outside the Fluid container 14 to be arranged, and a substantially plate-shaped second region 120 on which a temperature sensor 122 for determining the temperature of the fluid 12 is attached and which is designed to be at least partially arranged within the fluid located in the fluid container 14.
  • a temperature sensor 122 for determining the temperature of the fluid 12 is attached and which is designed to be at least partially arranged within the fluid located in the fluid container 14.
  • the circuit board assembly 100 comprises one between the first region 110 and the second area 120 arranged transition area 130 (in FIG. 2 delimited from first area 110 and second area 120 by means of dotted lines).
  • the first area 110 can be a first printed circuit board and the second area 120 can be a second printed circuit board, which is integrally connected to the first printed circuit board by means of the transition area 130.
  • an ultrasonic transducer can be provided on the second area 120, by means of which the quality of the fluid 12 can be detected.
  • further electronic components of the device for determining the fill level and / or the quality and the temperature of the fluid 12 can be arranged on the second region 120.
  • the electronics 112 have an ultrasonic transducer which, as already explained above with regard to FIG. 1, is designed to couple ultrasonic signals 24 into the fluid 12 in the fluid container 14 and to receive them again as a reflection signal.
  • the electronics 112 can also contain further electronic elements, such as capacitors, resistors, operational amplifiers or an application-specific integrated circuit (ASIC), which are necessary for proper operation of the device for determining the fill level and / or quality and the temperature of the fluid 12 are necessary.
  • ASIC application-specific integrated circuit
  • the second area 120 is a section integrally connected to the first area 110 via the transition area 130 and is designed as a web-shaped element.
  • the web-like shape of the second area can be defined, for example, in that its length L is significantly greater than its width B.
  • the length L is approximately four to six times the width B.
  • a dashed line 102 is also drawn in, which lies in the transition region 130 and indicates a possible bending line for bending the transition region 130 in such a way that, after a corresponding Bending process, the second area 120 extends essentially at an angle to the first area 110 (see also FIGS. 4, 5, 6 and 9).
  • FIG. 3 shows a further exemplary embodiment of the circuit board arrangement 100, the circuit board arrangement of FIG. 3 differing from the circuit board arrangement 100 of FIG. 2 in that the second region 120 extends in a different direction relative to the first region 110.
  • FIG. 3 shows an embodiment in which the second area 120 can be obtained in that a cutout 101 is made in the originally rectangular printed circuit board of the printed circuit board arrangement 100 in order to obtain the separated second area 120, which in turn is connected to the first Area 110 can be integrally connected via the transition area 130.
  • the manufacturing outlay for producing the circuit board arrangement 100 of FIG. 3 can thus be reduced compared with the circuit board arrangement 100 of FIG. 2.
  • FIG. 4 shows a side view of the circuit board arrangement 100 according to the invention from FIG. 2.
  • the predetermined angle is approximately 90 °.
  • the dashed line shows the circuit board arrangement 100 in a state before the bending.
  • FIG. 5 shows a side view of an exemplary embodiment of a circuit board arrangement 100 according to the invention, such as the circuit board arrangement 100 of FIG connected and trained to the first Area 110 and the second area 120 to fix or hold at the predetermined angle 150 angled to one another.
  • the configuration of the circuit board arrangement 100 according to FIG. 5 shows a configuration in which the support element 140 is located on a side on which the smaller angle between the first area 110 and the second area 120 is located, i.e. on the inside of the bend.
  • the first area 110 and the second area 120 divide a full circle in such a way that there is a small angle (less than 180 °) and a large angle (greater than 180 °), the The sum of the small angle and the large angle corresponds to 360 °.
  • the support element 140 is located essentially on a side on which the large angle between the first area 110 and the second area 120 is arranged, that is to say on the outside of the bend .
  • FIG. 7 shows a top view of a further exemplary embodiment of a circuit board arrangement according to the invention, such as the circuit board arrangement according to FIG. 2, for example, before a bending process.
  • the circuit board arrangement 100 of FIG. 7 differs from the circuit board arrangement 100 of FIG. 2 in that a recess 103 is provided in the transition region 130, which can simplify the bending of the transition region 130 due to less bending material.
  • connection lines 124, 126 which are shown schematically but interrupted by the recess 103 and electrically connect the temperature sensor 122 to the electronics 112 arranged in the first area 110, by means of electrical connection wires 125, 127 to reinforce, which extend over the recess 103. Consequently, during a bending process along the bending line 102, not only the transition region 130 or the two remaining webs 131, 133, but also the electrical connecting wires 125, 127 are bent. In this way, on the one hand, the electrical connection can be more robust than just simple Conductor tracks are executed on the circuit board.
  • FIG. 8 shows a side view of a further exemplary embodiment of a circuit board arrangement 100 according to the invention, such as the circuit board arrangement 100 of FIG. 2, before the bending process
  • FIG. 9 shows the circuit board arrangement according to the invention after a bending process and with the support element 140 mounted.
  • the circuit board arrangement 100 of FIG. 8 has a recess 132, such as a notch, a groove or the like, in the transition region 130, so that a subsequent bending process along the bending line 102 (extends perpendicular to the plane of the drawing in the view of FIG. 8) is simplified can be.
  • the recess 132 can locally thin the material of the transition region 130, as a result of which the bending process can be implemented more easily and with less effort.
  • FIG. 9 shows the circuit board arrangement 100 of FIG. 8 after a bending process. From FIG. 9 it can be seen that a free area has arisen from the recess 132, which can be supported by means of the support element 140 (see in particular FIG. 10), specifically with an adapted area (see transition section 146 of the support element 140). 10, an exemplary embodiment of a support element 140 according to the present invention is disclosed.
  • the support element 140 has, in particular, a first section 142, which can be connected to the first area 110 and is designed to support the first area 110, a second section 144, which is connectable to the second area 120 and is designed to support the second area 120, and a transition section 146 which is designed to support the transition region 130, in particular the recess 132 (see also FIG.
  • the first section 142 of the support element 140 is designed to at least partially encompass the first area 110 such that the first area 110 is positively and / or non-positively connected to the first section 142 .
  • This can be done, for example, by means of a press fit.
  • the second section 144 of the support element 140 is designed to at least partially encompass the second area 120 such that the second area 120 is connected to the second section 144 in a form-fitting and / or force-fitting manner. This can also take place, for example, by means of a press fit.
  • the transition section 146 can be designed according to the shape of the recess 132 after the bending process and thus additionally support the transition region 130 weakened by the recess 132.
  • FIG. 11 shows a further possible embodiment of the support element 140 and differs from the support element 140 of FIG. 10 in that the support element 140 of FIG. 11 does not have a transition section 146. Rather, the support element 140 in FIG. 11 comprises only the first section 142 and the second section 144. Nevertheless, a support element 140 designed and shaped in this way can be designed to support a transition region 130 with a recess 132.
  • the transition section 146 of FIG. 10 only has the advantage over the variant of FIG. 11 that the transition area 130 receives additional support.
  • FIG. 12 shows an exemplary flow chart of a method according to the invention for producing a circuit board arrangement 100 for a device for determining the fill level and / or the quality and the temperature of a fluid 12 of an internal combustion engine arranged in a fluid container.
  • the method according to the invention starts at step 200 and then arrives at step 210, in which a circuit board is provided with an essentially plate-shaped first area 110, an essentially plate-shaped second area 120 and a transition area 130 arranged between the first area 110 and the second area 120 will.
  • the printed circuit board is bent in the transition area 130 in such a way that the first area 110 and the second area 120 are arranged at an angle to one another at a predetermined angle 150.
  • a support element 140 is arranged on the bent printed circuit board, which is connected to the first area 110 and the second area 120 and is designed to position the first area 110 and the second area 120 relative to one another in such a way that the first Area 110 and the second area 120 are arranged angled to one another at the predetermined angle 150.
  • the printed circuit board arrangement 100 is at least partially embedded in plastic to form a housing of the printed circuit board arrangement 100.
  • the support element 140 is designed to make the first area 110 and the second area 120 angled to one another at the predetermined angle 150 during the embedding process to be fixed so that the temperature sensor 122 arranged in the second area 120 remains in the predetermined position or position. The method then ends at step 250.
  • the circuit board arrangement 100 according to the invention can then be connected to a fluid container 14 in such a way that the first area 110 is arranged outside the fluid container 14 and the second area 120 together with the temperature sensor attached to it extends through the wall, preferably the base 15 of the fluid container 14 extends into the fluid 12, so that the temperature of the fluid 12 can be detected by means of the temperature sensor 122. If the circuit board arrangement 100 according to the invention is completely enclosed by plastic at least on the front side and the material in which the circuit board arrangement 100 is at least partially embedded is chemically resistant to the fluid 12 to be measured, the entire device can also be in contact with the fluid and the ultrasonic measurement can be carried out directly in the fluid 12 instead of through the wall of the fluid container 14.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Fluid Mechanics (AREA)
  • Signal Processing (AREA)
  • Electromagnetism (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne un système de carte de circuits imprimés (100) et un procédé de fabrication d'un système de carte de circuits imprimés (100) pour un dispositif destiné à déterminer le niveau de remplissage et/ou la qualité et la température d'un fluide (12) d'un moteur à combustion interne. Le système de carte de circuits imprimés (100) présente : une première zone (110) sur laquelle est agencée la partie électronique (112) du dispositif ; une seconde zone (120) plate disposée en formant un angle prédéterminé (150) par rapport à la première zone (110) et sur laquelle est disposé un capteur de température (122) destiné à déterminer la température du fluide (12) ; et un élément d'appui (140) qui est relié à la première zone (110) et à la seconde zone (120) et qui est conçu pur bloquer l'une par rapport à l'autre la première zone (110) et la seconde zone (120) pour qu'elle forment l'angle prédéterminé (150) entre elles.
PCT/EP2021/053138 2020-02-11 2021-02-10 Système de carte de circuits imprimés et procédé de fabrication d'un système de carte de circuits imprimés WO2021160639A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP21709346.7A EP4103915A1 (fr) 2020-02-11 2021-02-10 Système de carte de circuits imprimés et procédé de fabrication d'un système de carte de circuits imprimés
CN202180014119.2A CN115038940A (zh) 2020-02-11 2021-02-10 印刷电路板装置和用于制造印刷电路板装置的方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102020201674.7A DE102020201674A1 (de) 2020-02-11 2020-02-11 Leiterplattenanordnung und Verfahren zum Herstellen einer Leiterplattenanordnung
DE102020201674.7 2020-02-11

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WO2021160639A1 true WO2021160639A1 (fr) 2021-08-19

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EP (1) EP4103915A1 (fr)
CN (1) CN115038940A (fr)
DE (1) DE102020201674A1 (fr)
WO (1) WO2021160639A1 (fr)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19851213C1 (de) * 1998-11-06 2000-06-08 Daimler Chrysler Ag Kapazitive Sensoranordnung für ein als Dielektrikum wirkendes flüssiges oder gasförmiges Medium
DE102006004321A1 (de) 2006-01-31 2007-08-16 Häusermann GmbH Biegbare Leiterplatte mit zusätzlichem funktionalem Element und einer Kerbfräsung und Herstellverfahren und Anwendung
DE102012014307A1 (de) 2012-07-19 2014-01-23 Volkswagen Aktiengesellschaft Verfahren und Sensoreinrichtung zum Erfassen eines Flüssigkeitsstands für ein Fahrzeug
US20160041024A1 (en) * 2014-08-11 2016-02-11 Ssi Technologies, Inc. Through-wall tank ultrasonic transducer
DE102016119006A1 (de) 2015-10-06 2017-04-06 Sound Solutions International Co., Ltd. Elektroakustischer Transducer mit biegsamer Spulendrahtverbindung
US9706645B2 (en) 2014-11-27 2017-07-11 Shenzhen China Star Optoelectronics Technology Co., Ltd L-bending PCB
DE102016205240B3 (de) 2016-03-30 2017-07-13 Continental Automotive Gmbh Verfahren zum Herstellen eines Ultraschallsensors und Ultraschallensor
US10168200B2 (en) 2016-08-10 2019-01-01 Ssi Technologies, Inc. Systems and methods for power management in ultrasonic sensors

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19851213C1 (de) * 1998-11-06 2000-06-08 Daimler Chrysler Ag Kapazitive Sensoranordnung für ein als Dielektrikum wirkendes flüssiges oder gasförmiges Medium
DE102006004321A1 (de) 2006-01-31 2007-08-16 Häusermann GmbH Biegbare Leiterplatte mit zusätzlichem funktionalem Element und einer Kerbfräsung und Herstellverfahren und Anwendung
DE102012014307A1 (de) 2012-07-19 2014-01-23 Volkswagen Aktiengesellschaft Verfahren und Sensoreinrichtung zum Erfassen eines Flüssigkeitsstands für ein Fahrzeug
US20160041024A1 (en) * 2014-08-11 2016-02-11 Ssi Technologies, Inc. Through-wall tank ultrasonic transducer
US9706645B2 (en) 2014-11-27 2017-07-11 Shenzhen China Star Optoelectronics Technology Co., Ltd L-bending PCB
DE102016119006A1 (de) 2015-10-06 2017-04-06 Sound Solutions International Co., Ltd. Elektroakustischer Transducer mit biegsamer Spulendrahtverbindung
DE102016205240B3 (de) 2016-03-30 2017-07-13 Continental Automotive Gmbh Verfahren zum Herstellen eines Ultraschallsensors und Ultraschallensor
US10168200B2 (en) 2016-08-10 2019-01-01 Ssi Technologies, Inc. Systems and methods for power management in ultrasonic sensors

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EP4103915A1 (fr) 2022-12-21
CN115038940A (zh) 2022-09-09

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