DE102020201674A1 - Leiterplattenanordnung und Verfahren zum Herstellen einer Leiterplattenanordnung - Google Patents
Leiterplattenanordnung und Verfahren zum Herstellen einer Leiterplattenanordnung Download PDFInfo
- Publication number
- DE102020201674A1 DE102020201674A1 DE102020201674.7A DE102020201674A DE102020201674A1 DE 102020201674 A1 DE102020201674 A1 DE 102020201674A1 DE 102020201674 A DE102020201674 A DE 102020201674A DE 102020201674 A1 DE102020201674 A1 DE 102020201674A1
- Authority
- DE
- Germany
- Prior art keywords
- area
- circuit board
- fluid
- designed
- support element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
- G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
- G01F23/28—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring the variations of parameters of electromagnetic or acoustic waves applied directly to the liquid or fluent solid material
- G01F23/296—Acoustic waves
- G01F23/2962—Measuring transit time of reflected waves
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
- G01F23/80—Arrangements for signal processing
- G01F23/802—Particular electronic circuits for digital processing equipment
- G01F23/804—Particular electronic circuits for digital processing equipment containing circuits handling parameters other than liquid level
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/02—Analysing fluids
- G01N29/024—Analysing fluids by measuring propagation velocity or propagation time of acoustic waves
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/222—Constructional or flow details for analysing fluids
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/223—Supports, positioning or alignment in fixed situation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2437—Piezoelectric probes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/022—Liquids
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/022—Liquids
- G01N2291/0226—Oils, e.g. engine oils
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/025—Change of phase or condition
- G01N2291/0258—Structural degradation, e.g. fatigue of composites, ageing of oils
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/028—Material parameters
- G01N2291/02809—Concentration of a compound, e.g. measured by a surface mass change
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/028—Material parameters
- G01N2291/02818—Density, viscosity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/046—Planar parts of folded PCBs making an angle relative to each other
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Analytical Chemistry (AREA)
- Pathology (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Biochemistry (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Fluid Mechanics (AREA)
- Signal Processing (AREA)
- Thermal Sciences (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102020201674.7A DE102020201674A1 (de) | 2020-02-11 | 2020-02-11 | Leiterplattenanordnung und Verfahren zum Herstellen einer Leiterplattenanordnung |
CN202180014119.2A CN115038940A (zh) | 2020-02-11 | 2021-02-10 | 印刷电路板装置和用于制造印刷电路板装置的方法 |
EP21709346.7A EP4103915A1 (fr) | 2020-02-11 | 2021-02-10 | Système de carte de circuits imprimés et procédé de fabrication d'un système de carte de circuits imprimés |
PCT/EP2021/053138 WO2021160639A1 (fr) | 2020-02-11 | 2021-02-10 | Système de carte de circuits imprimés et procédé de fabrication d'un système de carte de circuits imprimés |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102020201674.7A DE102020201674A1 (de) | 2020-02-11 | 2020-02-11 | Leiterplattenanordnung und Verfahren zum Herstellen einer Leiterplattenanordnung |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102020201674A1 true DE102020201674A1 (de) | 2021-08-12 |
Family
ID=74853613
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102020201674.7A Pending DE102020201674A1 (de) | 2020-02-11 | 2020-02-11 | Leiterplattenanordnung und Verfahren zum Herstellen einer Leiterplattenanordnung |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP4103915A1 (fr) |
CN (1) | CN115038940A (fr) |
DE (1) | DE102020201674A1 (fr) |
WO (1) | WO2021160639A1 (fr) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006004321A1 (de) | 2006-01-31 | 2007-08-16 | Häusermann GmbH | Biegbare Leiterplatte mit zusätzlichem funktionalem Element und einer Kerbfräsung und Herstellverfahren und Anwendung |
DE102012014307A1 (de) | 2012-07-19 | 2014-01-23 | Volkswagen Aktiengesellschaft | Verfahren und Sensoreinrichtung zum Erfassen eines Flüssigkeitsstands für ein Fahrzeug |
DE102016119006A1 (de) | 2015-10-06 | 2017-04-06 | Sound Solutions International Co., Ltd. | Elektroakustischer Transducer mit biegsamer Spulendrahtverbindung |
US9706645B2 (en) | 2014-11-27 | 2017-07-11 | Shenzhen China Star Optoelectronics Technology Co., Ltd | L-bending PCB |
DE102016205240B3 (de) | 2016-03-30 | 2017-07-13 | Continental Automotive Gmbh | Verfahren zum Herstellen eines Ultraschallsensors und Ultraschallensor |
US10168200B2 (en) | 2016-08-10 | 2019-01-01 | Ssi Technologies, Inc. | Systems and methods for power management in ultrasonic sensors |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19851213C1 (de) * | 1998-11-06 | 2000-06-08 | Daimler Chrysler Ag | Kapazitive Sensoranordnung für ein als Dielektrikum wirkendes flüssiges oder gasförmiges Medium |
US20160041024A1 (en) * | 2014-08-11 | 2016-02-11 | Ssi Technologies, Inc. | Through-wall tank ultrasonic transducer |
-
2020
- 2020-02-11 DE DE102020201674.7A patent/DE102020201674A1/de active Pending
-
2021
- 2021-02-10 EP EP21709346.7A patent/EP4103915A1/fr active Pending
- 2021-02-10 CN CN202180014119.2A patent/CN115038940A/zh active Pending
- 2021-02-10 WO PCT/EP2021/053138 patent/WO2021160639A1/fr unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006004321A1 (de) | 2006-01-31 | 2007-08-16 | Häusermann GmbH | Biegbare Leiterplatte mit zusätzlichem funktionalem Element und einer Kerbfräsung und Herstellverfahren und Anwendung |
DE102012014307A1 (de) | 2012-07-19 | 2014-01-23 | Volkswagen Aktiengesellschaft | Verfahren und Sensoreinrichtung zum Erfassen eines Flüssigkeitsstands für ein Fahrzeug |
US9706645B2 (en) | 2014-11-27 | 2017-07-11 | Shenzhen China Star Optoelectronics Technology Co., Ltd | L-bending PCB |
DE102016119006A1 (de) | 2015-10-06 | 2017-04-06 | Sound Solutions International Co., Ltd. | Elektroakustischer Transducer mit biegsamer Spulendrahtverbindung |
DE102016205240B3 (de) | 2016-03-30 | 2017-07-13 | Continental Automotive Gmbh | Verfahren zum Herstellen eines Ultraschallsensors und Ultraschallensor |
US10168200B2 (en) | 2016-08-10 | 2019-01-01 | Ssi Technologies, Inc. | Systems and methods for power management in ultrasonic sensors |
Also Published As
Publication number | Publication date |
---|---|
EP4103915A1 (fr) | 2022-12-21 |
WO2021160639A1 (fr) | 2021-08-19 |
CN115038940A (zh) | 2022-09-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R012 | Request for examination validly filed | ||
R081 | Change of applicant/patentee |
Owner name: VITESCO TECHNOLOGIES GERMANY GMBH, DE Free format text: FORMER OWNER: VITESCO TECHNOLOGIES GERMANY GMBH, 30165 HANNOVER, DE |