DE102020201674A1 - Leiterplattenanordnung und Verfahren zum Herstellen einer Leiterplattenanordnung - Google Patents

Leiterplattenanordnung und Verfahren zum Herstellen einer Leiterplattenanordnung Download PDF

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Publication number
DE102020201674A1
DE102020201674A1 DE102020201674.7A DE102020201674A DE102020201674A1 DE 102020201674 A1 DE102020201674 A1 DE 102020201674A1 DE 102020201674 A DE102020201674 A DE 102020201674A DE 102020201674 A1 DE102020201674 A1 DE 102020201674A1
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DE
Germany
Prior art keywords
area
circuit board
fluid
designed
support element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE102020201674.7A
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German (de)
English (en)
Inventor
Karl-Friedrich Pfeiffer
Henning Grotevent
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vitesco Technologies Germany GmbH
Original Assignee
Vitesco Technologies Germany GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vitesco Technologies Germany GmbH filed Critical Vitesco Technologies Germany GmbH
Priority to DE102020201674.7A priority Critical patent/DE102020201674A1/de
Priority to CN202180014119.2A priority patent/CN115038940A/zh
Priority to EP21709346.7A priority patent/EP4103915A1/fr
Priority to PCT/EP2021/053138 priority patent/WO2021160639A1/fr
Publication of DE102020201674A1 publication Critical patent/DE102020201674A1/de
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
    • G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
    • G01F23/28—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring the variations of parameters of electromagnetic or acoustic waves applied directly to the liquid or fluent solid material
    • G01F23/296—Acoustic waves
    • G01F23/2962—Measuring transit time of reflected waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
    • G01F23/80—Arrangements for signal processing
    • G01F23/802—Particular electronic circuits for digital processing equipment
    • G01F23/804—Particular electronic circuits for digital processing equipment containing circuits handling parameters other than liquid level
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/02—Analysing fluids
    • G01N29/024—Analysing fluids by measuring propagation velocity or propagation time of acoustic waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/222—Constructional or flow details for analysing fluids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/223—Supports, positioning or alignment in fixed situation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2437—Piezoelectric probes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/022—Liquids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/022—Liquids
    • G01N2291/0226—Oils, e.g. engine oils
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/025—Change of phase or condition
    • G01N2291/0258—Structural degradation, e.g. fatigue of composites, ageing of oils
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/028—Material parameters
    • G01N2291/02809—Concentration of a compound, e.g. measured by a surface mass change
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/028—Material parameters
    • G01N2291/02818—Density, viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/046—Planar parts of folded PCBs making an angle relative to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Biochemistry (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Fluid Mechanics (AREA)
  • Signal Processing (AREA)
  • Thermal Sciences (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
DE102020201674.7A 2020-02-11 2020-02-11 Leiterplattenanordnung und Verfahren zum Herstellen einer Leiterplattenanordnung Pending DE102020201674A1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE102020201674.7A DE102020201674A1 (de) 2020-02-11 2020-02-11 Leiterplattenanordnung und Verfahren zum Herstellen einer Leiterplattenanordnung
CN202180014119.2A CN115038940A (zh) 2020-02-11 2021-02-10 印刷电路板装置和用于制造印刷电路板装置的方法
EP21709346.7A EP4103915A1 (fr) 2020-02-11 2021-02-10 Système de carte de circuits imprimés et procédé de fabrication d'un système de carte de circuits imprimés
PCT/EP2021/053138 WO2021160639A1 (fr) 2020-02-11 2021-02-10 Système de carte de circuits imprimés et procédé de fabrication d'un système de carte de circuits imprimés

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102020201674.7A DE102020201674A1 (de) 2020-02-11 2020-02-11 Leiterplattenanordnung und Verfahren zum Herstellen einer Leiterplattenanordnung

Publications (1)

Publication Number Publication Date
DE102020201674A1 true DE102020201674A1 (de) 2021-08-12

Family

ID=74853613

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102020201674.7A Pending DE102020201674A1 (de) 2020-02-11 2020-02-11 Leiterplattenanordnung und Verfahren zum Herstellen einer Leiterplattenanordnung

Country Status (4)

Country Link
EP (1) EP4103915A1 (fr)
CN (1) CN115038940A (fr)
DE (1) DE102020201674A1 (fr)
WO (1) WO2021160639A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006004321A1 (de) 2006-01-31 2007-08-16 Häusermann GmbH Biegbare Leiterplatte mit zusätzlichem funktionalem Element und einer Kerbfräsung und Herstellverfahren und Anwendung
DE102012014307A1 (de) 2012-07-19 2014-01-23 Volkswagen Aktiengesellschaft Verfahren und Sensoreinrichtung zum Erfassen eines Flüssigkeitsstands für ein Fahrzeug
DE102016119006A1 (de) 2015-10-06 2017-04-06 Sound Solutions International Co., Ltd. Elektroakustischer Transducer mit biegsamer Spulendrahtverbindung
US9706645B2 (en) 2014-11-27 2017-07-11 Shenzhen China Star Optoelectronics Technology Co., Ltd L-bending PCB
DE102016205240B3 (de) 2016-03-30 2017-07-13 Continental Automotive Gmbh Verfahren zum Herstellen eines Ultraschallsensors und Ultraschallensor
US10168200B2 (en) 2016-08-10 2019-01-01 Ssi Technologies, Inc. Systems and methods for power management in ultrasonic sensors

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19851213C1 (de) * 1998-11-06 2000-06-08 Daimler Chrysler Ag Kapazitive Sensoranordnung für ein als Dielektrikum wirkendes flüssiges oder gasförmiges Medium
US20160041024A1 (en) * 2014-08-11 2016-02-11 Ssi Technologies, Inc. Through-wall tank ultrasonic transducer

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006004321A1 (de) 2006-01-31 2007-08-16 Häusermann GmbH Biegbare Leiterplatte mit zusätzlichem funktionalem Element und einer Kerbfräsung und Herstellverfahren und Anwendung
DE102012014307A1 (de) 2012-07-19 2014-01-23 Volkswagen Aktiengesellschaft Verfahren und Sensoreinrichtung zum Erfassen eines Flüssigkeitsstands für ein Fahrzeug
US9706645B2 (en) 2014-11-27 2017-07-11 Shenzhen China Star Optoelectronics Technology Co., Ltd L-bending PCB
DE102016119006A1 (de) 2015-10-06 2017-04-06 Sound Solutions International Co., Ltd. Elektroakustischer Transducer mit biegsamer Spulendrahtverbindung
DE102016205240B3 (de) 2016-03-30 2017-07-13 Continental Automotive Gmbh Verfahren zum Herstellen eines Ultraschallsensors und Ultraschallensor
US10168200B2 (en) 2016-08-10 2019-01-01 Ssi Technologies, Inc. Systems and methods for power management in ultrasonic sensors

Also Published As

Publication number Publication date
EP4103915A1 (fr) 2022-12-21
WO2021160639A1 (fr) 2021-08-19
CN115038940A (zh) 2022-09-09

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Owner name: VITESCO TECHNOLOGIES GERMANY GMBH, DE

Free format text: FORMER OWNER: VITESCO TECHNOLOGIES GERMANY GMBH, 30165 HANNOVER, DE