WO2021160639A1

WO2021160639A1 - Circuit board arrangement and method for producing a circuit board arrangement

Info

Publication number: WO2021160639A1
Application number: PCT/EP2021/053138
Authority: WO
Inventors: Karl-Friedrich Pfeiffer; Henning Grotevent
Original assignee: Vitesco Technologies Germany Gmbh
Priority date: 2020-02-11
Filing date: 2021-02-10
Publication date: 2021-08-19
Also published as: CN115038940A; DE102020201674A1; EP4103915A1

Abstract

The present invention relates to a circuit board arrangement (100) and to a method for producing a circuit board arrangement (100) for a device for ascertaining the fill level and/or the quality and the temperature of a fluid (12) of an internal combustion engine. The circuit board arrangement (100) has a first region (110), to which electronics (112) of the device are attached, a plate-like second region (120), which is arranged at a predetermined angle (150) with respect to the first region (110) and to which a temperature sensor (122) for ascertaining the temperature of the fluid (12) is attached, and a support element (140), which is connected to the first region (110) and to the second region (120) and which is designed to fix the first region (110) and the second region (120) at the predetermined angle (150) with respect to one another.

Description

description

Printed circuit board assembly and method of manufacturing a printed circuit board assembly

The present invention relates to a method for producing an ultrasonic sensor and an ultrasonic sensor, in particular a method for producing an ultrasonic sensor for determining the fill level and / or the temperature of a fluid used in an internal combustion engine, such as an engine oil or an aqueous urea solution.

Ultrasonic sensors are used, for example, to determine the fill level and / or quality and the temperature of an oil within an oil pan of an internal combustion engine. Ultrasonic waves are emitted by the ultrasonic sensor to detect the fill level and the fill level is determined on the basis of the sound waves reflected on the oil surface and their transit time. For this purpose, an ultrasonic sensor has an ultrasonic transmitter and receiver. Furthermore, a temperature sensor is provided for determining the temperature of the oil so that the speed of sound can be related to the fluid quality.

The electronics of the ultrasonic transducer, which for example comprise a piezo element and an integrated circuit, for example an ASIC, are usually arranged in a hollow housing after the electrical connection and are fixed in place there, for example by means of an adhesive. In alternative embodiments, it is known that these electronics are placed in another fixed location within the housing by means of a suitable device, for example by clipping or screwing.

In addition, DE 10 2012 014 307 A1 discloses a method and a sensor device for detecting a liquid level for a vehicle. The sensor device disclosed therein comprises a liquid level sensor and a position sensor. The liquid level sensor and the position sensor are arranged in the sensor device in such a way that the The liquid level sensor and the position sensor have a defined spatial relationship so that a position detected by the position sensor also determines the position of the liquid level sensor. The sensor device is designed to take into account the spatial relationship when determining the liquid level.

DE 10 2006 004 321 A1 relates to a multifunctional circuit board for use as a rigid-flexible or semi-flexible circuit board in the form of a plated-through circuit board or a multilayer board or a flexible circuit board. In this case, at least one additional functional element is fastened flatly on a copper foil by means of ultrasound or friction welding, at least in parts, by forming an intermetallic connection. A notch milling is made in this area and in this way the circuit board can be bent in the sense of a rigid-flexible or semi-flexible circuit board. If two notches are made, the circuit board can be bent by about 45 ° twice for a total of 90 °.

Further circuit boards are known from DE 102016 119006 A1, US 9 706645 B2 and US 10 168200 B2.

DE 10 2016 205 240 B3 discloses a method for producing an ultrasonic sensor and an ultrasonic sensor which is designed to determine the fill level and / or the temperature of a fluid in an internal combustion engine. The method known therefrom comprises providing electronics of the ultrasonic sensor, arranging the electronics of the ultrasonic sensor in an injection molding tool, and overmolding the electronics with plastic to form a housing for the electronics. The housing comprises at least one functional section which is designed to fulfill a predetermined function.

The present invention is based on the object of providing a printed circuit board arrangement, which is improved in terms of manufacturing costs and measurement quality, for a device for determining the fill level and / or the quality and temperature of a fluid of an internal combustion engine arranged in a fluid container specify, wherein the circuit board arrangement is also robust with respect to the service life.

This object is achieved with a printed circuit board arrangement according to claim 1 and a method for producing a printed circuit board arrangement according to claim 9. Preferred refinements are given in the subclaims.

The present invention is essentially based on the idea of providing an at least partially curved circuit board in which a first area, on which an ultrasonic transducer can be arranged to determine the fill level and / or quality of the fluid, is designed to be essentially outside the To be arranged fluid container, and in which a second area, on which a temperature sensor for determining the temperature of the fluid and / or a further ultrasonic transducer for determining the quality of the fluid can be arranged, is designed to be arranged essentially within the fluid . The second area extends in a media-tight manner through a wall, for example the bottom, of the fluid container. In addition, the circuit board arrangement has a support element which is designed to support the bent circuit board, i. H. the angled to one another first and second regions of the circuit board arrangement to fix or hold in their position. In particular, the support element can ensure that the bent circuit board remains in its shape as desired even when the circuit board together with the support element is overmolded with plastic to form a media-tight housing.

According to a first aspect of the present invention, a circuit board arrangement for a device for determining the fill level and / or the quality and the temperature of a fluid of an internal combustion engine arranged in a fluid container is disclosed. The circuit board arrangement according to the invention comprises an essentially plate-shaped first area, on which at least some of the electronics of the device for determining the fill level and / or quality of the fluid are attached and which is designed to be arranged outside the fluid container, and an essentially plate-shaped area second area on which a temperature sensor for determining the temperature of the fluid and / or an ultrasonic transducer for determining the quality of the fluid is attached and which is designed to be arranged at least partially within the fluid located in the fluid container and at a predetermined angle to the first area angled to extend. The circuit board arrangement according to the invention furthermore has a support element which is connected to the first area and to the second area and is designed to fix the first area and the second area at the predetermined angle to one another.

The angled arrangement of the first area and the second area relative to one another can consequently ensure that the first area can be arranged outside the fluid container and the second area on which the temperature sensor for determining the temperature of the fluid and / or the sound transducer for determining the quality of the fluid is attached, can be arranged within the fluid in the fluid container. The second area thus extends at least partially through a wall, preferably through the bottom, of the fluid container. The support element can serve to fix the angled position of the first area relative to the second area.

In a preferred embodiment of the circuit board arrangement according to the invention, the first area is integrally connected to the second area via a transition area which is bent in such a way that the first area and the second area are angled to one another at the predetermined angle. The transition area is preferably a flexible circuit board area and is preferably integrally connected to the first area and the second area.

Preferably, the predetermined angle is in the range between about 45 ° and about 135 °, and more preferably is about 90 °.

In a further advantageous embodiment of the circuit board arrangement according to the invention, the support element has a first section that is connected to the connected to the first region and configured to support the first region, and a second portion connected to the second region and configured to support the second region.

In such an advantageous embodiment of the circuit board arrangement according to the invention, the first section of the support element is designed to at least partially encompass the first area such that the first section of the support element is positively and / or non-positively connected to the first area of the circuit board arrangement, and the second The section of the support element is preferably designed to at least partially encompass the second area in such a way that the second section of the support element is positively and / or non-positively connected to the second area.

In a preferred manner, the support element also has a transition section which is designed to support a transition region arranged between the first region and the second region. The transition section of the support element is designed to support the transition area on only one side. The transition section is preferably designed to support the transition area on the side of the truncated angle relative to the predetermined angle.

In a preferred embodiment, the circuit board arrangement according to the invention furthermore has a housing which at least partially surrounds the first area, completely the second area, and at least partially surrounds the support element in a fluid-tight manner. The housing is preferably a plastic housing produced by means of plastic injection molding or plastic injection molding, the support element being designed to fix the first area relative to the second area at the predetermined angle during the plastic injection molding process.

According to a further aspect of the present invention is a method for producing a circuit board arrangement for a device for determining the Disclosed fill level and / or the quality and the temperature of a fluid of an internal combustion engine arranged in a fluid container. The method according to the invention comprises providing a circuit board with a substantially plate-shaped first region and a substantially plate-shaped second region, bending the circuit board in such a way that the first region and the second region are arranged at an angle to one another at a predetermined angle, and arranging a Support element such that the support element is connected to the first region and the second region and is designed to position the first region and the second region relative to one another in such a way that the first region and the second region are arranged at an angle to one another at the predetermined angle.

In a preferred embodiment, the method according to the invention also has an at least partial overmolding of the circuit board arrangement with plastic for molding a housing of the circuit board arrangement. During the plastic injection molding process of the circuit board arrangement, the support element can thus fix and hold the first area relative to the second area at the predetermined angle.

Other objects and features of the present invention will become apparent to those skilled in the art by practicing the present teachings and reviewing the accompanying drawings, in which:

1 shows a schematic view of a device known from the prior art for determining the fill level and / or the quality and the temperature of a fluid in a fluid container,

Fig. 2 is a plan view of an exemplary embodiment of a

Shows circuit board assembly prior to a bending process according to the present invention, 3 shows a plan view of a further exemplary embodiment of a

Shows circuit board assembly prior to a bending process according to the present invention,

FIG. 4 is a side view of the exemplary embodiment of FIG

Shows the circuit board arrangement of Fig. 2 after a bending process,

5 shows a side view of an exemplary embodiment of a circuit board arrangement according to the invention with a support element,

6 shows a side view of a further exemplary embodiment of a circuit board arrangement according to the invention with a support element,

7 shows a plan view of a further exemplary embodiment of a

8 shows a side view of a further exemplary embodiment of a circuit board arrangement before a bending process,

FIG. 9 shows a side view of the circuit board arrangement according to the invention of FIG. 8 after a bending process,

10 shows a perspective view of an embodiment of a support element of a circuit board arrangement according to the invention,

11 is a perspective view of another embodiment of a

Shows support element of a printed circuit board assembly according to the invention, and

12 shows an exemplary flow chart of a method according to the invention for producing a circuit board arrangement according to the invention. Elements of the same construction or function are provided with the same reference symbols in all the figures.

In the context of the present disclosure, the term “fluid quality” describes a parameter that characterizes a fluid. For example, the speed of sound of the fluid, the density of the fluid, from which the chemical composition of the fluid can be derived, the electrical properties of the fluid and the damping properties of the fluid can be understood as parameters that characterize the fluid quality. For example, in an aqueous flare solution, such as. B. urea, the proportion of flarea in the water can be estimated by determining the temperature-dependent sound velocity of the aqueous flare solution.

In the context of the present disclosure, an angled or inclined position of the first area relative to the second area is characterized in that it is a predetermined angle other than 180 °. The plate-shaped first area and the plate-shaped second area thus extend in different planes which are not parallel to one another.

1 shows a schematic view of a device 10 known from the prior art for determining the fill level 11 and / or the quality and temperature of a fluid 12 in a fluid container 14. The fluid 12 can be, for example, a Act aqueous flare solution, which is designed to be injected into an exhaust tract of an internal combustion engine. The fluid 12 can also be an engine or transmission oil, a brake fluid or a liquid for window cleaning.

The device 10 of FIG. 1 has an essentially plate-shaped printed circuit board 20 on which electronics 22 for determining the fill level and / or quality of the fluid 12 are attached and which are designed to be arranged outside the fluid container 14. The electronics 22 are, for example, an ultrasonic transducer which is designed to transmit an ultrasonic signal 24 from the outside through the wall, preferably the base 15, of the fluid container 14 in couple the fluid 12 and again receive the ultrasonic signal 24 reflected on the surface 11 of the fluid 12. In addition, the electronics 22 can have capacitors, resistors, operational amplifiers or also an application-specific integrated circuit (ASIC, application-specific integrated circuit), which are necessary for proper operation of the device 10.

Furthermore, the device 10 of FIG. 1 known from the prior art comprises a temperature sensor 26 which is arranged within the fluid 12 and is electrically connected to the circuit board 20 via a corresponding electrical line 28. The electrical line 28 extends through the wall, preferably the bottom 15, of the fluid container 14 and must be correspondingly sealed.

The separate electrical connection 28 represents a not inconsiderable technical effort in production and, due to this individual, separately wired component, represents an increased risk of defects, such as a short circuit between the connecting wires or even a broken electrical connection 28.

2 shows a circuit board arrangement 100 according to the invention for a device for determining the fill level and / or the quality and the temperature of the fluid 12 of the internal combustion engine arranged in the fluid container 14. The circuit board arrangement 100 originally consists of a circuit board and has an essentially plate-shaped first region 110, on which the electronics 112 of the device for determining the fill level and / or quality of the fluid 12 is at least partially attached and which is designed to be essentially outside the Fluid container 14 to be arranged, and a substantially plate-shaped second region 120 on which a temperature sensor 122 for determining the temperature of the fluid 12 is attached and which is designed to be at least partially arranged within the fluid located in the fluid container 14. Preferably, as shown in FIG. 2, the circuit board assembly 100 comprises one between the first region 110 and the second area 120 arranged transition area 130 (in FIG. 2 delimited from first area 110 and second area 120 by means of dotted lines). The first area 110 can be a first printed circuit board and the second area 120 can be a second printed circuit board, which is integrally connected to the first printed circuit board by means of the transition area 130.

In addition or as an alternative to the temperature sensor 122, an ultrasonic transducer can be provided on the second area 120, by means of which the quality of the fluid 12 can be detected. In particular, further electronic components of the device for determining the fill level and / or the quality and the temperature of the fluid 12 can be arranged on the second region 120.

The electronics 112 have an ultrasonic transducer which, as already explained above with regard to FIG. 1, is designed to couple ultrasonic signals 24 into the fluid 12 in the fluid container 14 and to receive them again as a reflection signal. The electronics 112 can also contain further electronic elements, such as capacitors, resistors, operational amplifiers or an application-specific integrated circuit (ASIC), which are necessary for proper operation of the device for determining the fill level and / or quality and the temperature of the fluid 12 are necessary.

As indicated in FIG. 2, the second area 120 is a section integrally connected to the first area 110 via the transition area 130 and is designed as a web-shaped element. The web-like shape of the second area can be defined, for example, in that its length L is significantly greater than its width B. For example, the length L is approximately four to six times the width B.

In FIG. 2, a dashed line 102 is also drawn in, which lies in the transition region 130 and indicates a possible bending line for bending the transition region 130 in such a way that, after a corresponding Bending process, the second area 120 extends essentially at an angle to the first area 110 (see also FIGS. 4, 5, 6 and 9).

FIG. 3 shows a further exemplary embodiment of the circuit board arrangement 100, the circuit board arrangement of FIG. 3 differing from the circuit board arrangement 100 of FIG. 2 in that the second region 120 extends in a different direction relative to the first region 110. In particular, FIG. 3 shows an embodiment in which the second area 120 can be obtained in that a cutout 101 is made in the originally rectangular printed circuit board of the printed circuit board arrangement 100 in order to obtain the separated second area 120, which in turn is connected to the first Area 110 can be integrally connected via the transition area 130. The manufacturing outlay for producing the circuit board arrangement 100 of FIG. 3 can thus be reduced compared with the circuit board arrangement 100 of FIG. 2.

4 shows a side view of the circuit board arrangement 100 according to the invention from FIG. 2. As already explained, it is according to the invention to bend the originally flat circuit board with the first area 110 and the second area 120 in the transition area 130 along the bending line 102 in such a way that after the bending process, the second area 120 extends at a predetermined angle 150 to the first area 110. In the example of FIG. 4, the predetermined angle is approximately 90 °. It goes without saying, however, that it is also according to the invention to provide a predetermined angle 150 which is not equal to 90 °, such as, for example, an angle in a range between approximately 45 ° and 135 °. In FIG. 4, the dashed line shows the circuit board arrangement 100 in a state before the bending.

5 shows a side view of an exemplary embodiment of a circuit board arrangement 100 according to the invention, such as the circuit board arrangement 100 of FIG connected and trained to the first Area 110 and the second area 120 to fix or hold at the predetermined angle 150 angled to one another. The configuration of the circuit board arrangement 100 according to FIG. 5 shows a configuration in which the support element 140 is located on a side on which the smaller angle between the first area 110 and the second area 120 is located, i.e. on the inside of the bend. According to the present disclosure, it is defined in such a way that the first area 110 and the second area 120 divide a full circle in such a way that there is a small angle (less than 180 °) and a large angle (greater than 180 °), the The sum of the small angle and the large angle corresponds to 360 °.

In an alternative embodiment, which is shown in FIG. 6, the support element 140 is located essentially on a side on which the large angle between the first area 110 and the second area 120 is arranged, that is to say on the outside of the bend .

FIG. 7 shows a top view of a further exemplary embodiment of a circuit board arrangement according to the invention, such as the circuit board arrangement according to FIG. 2, for example, before a bending process. The circuit board arrangement 100 of FIG. 7 differs from the circuit board arrangement 100 of FIG. 2 in that a recess 103 is provided in the transition region 130, which can simplify the bending of the transition region 130 due to less bending material.

In the embodiment according to FIG. 7, it is intended to connect the electrical connection lines 124, 126, which are shown schematically but interrupted by the recess 103 and electrically connect the temperature sensor 122 to the electronics 112 arranged in the first area 110, by means of electrical connection wires 125, 127 to reinforce, which extend over the recess 103. Consequently, during a bending process along the bending line 102, not only the transition region 130 or the two remaining webs 131, 133, but also the electrical connecting wires 125, 127 are bent. In this way, on the one hand, the electrical connection can be more robust than just simple Conductor tracks are executed on the circuit board. On the other hand, only a little of the printed circuit board material, which tends to be brittle, has to be bent. In addition, it can be advantageous to provide the recess 103 in such a way that the two areas 110, 120 are completely separated from one another during the bending process (ie that there are no more webs 131, 133 or the webs 131, 133 are removed before the bending process) and are only connected to one another via the connecting wires 125, 127.

8 shows a side view of a further exemplary embodiment of a circuit board arrangement 100 according to the invention, such as the circuit board arrangement 100 of FIG. 2, before the bending process, whereas FIG. 9 shows the circuit board arrangement according to the invention after a bending process and with the support element 140 mounted.

The circuit board arrangement 100 of FIG. 8 has a recess 132, such as a notch, a groove or the like, in the transition region 130, so that a subsequent bending process along the bending line 102 (extends perpendicular to the plane of the drawing in the view of FIG. 8) is simplified can be. In particular, the recess 132 can locally thin the material of the transition region 130, as a result of which the bending process can be implemented more easily and with less effort.

In addition to the recess 132 in the transition region 130 of FIG. 8, it may be conceivable to also provide a recess (not shown) on the side of the transition region 130 opposite the recess 132 so that the bending can be simplified even further.

FIG. 9 shows the circuit board arrangement 100 of FIG. 8 after a bending process. From FIG. 9 it can be seen that a free area has arisen from the recess 132, which can be supported by means of the support element 140 (see in particular FIG. 10), specifically with an adapted area (see transition section 146 of the support element 140). 10, an exemplary embodiment of a support element 140 according to the present invention is disclosed. The support element 140 has, in particular, a first section 142, which can be connected to the first area 110 and is designed to support the first area 110, a second section 144, which is connectable to the second area 120 and is designed to support the second area 120, and a transition section 146 which is designed to support the transition region 130, in particular the recess 132 (see also FIG. 9). In particular, it can be seen from FIGS. 9 and 10 that the first section 142 of the support element 140 is designed to at least partially encompass the first area 110 such that the first area 110 is positively and / or non-positively connected to the first section 142 . This can be done, for example, by means of a press fit. Similarly, the second section 144 of the support element 140 is designed to at least partially encompass the second area 120 such that the second area 120 is connected to the second section 144 in a form-fitting and / or force-fitting manner. This can also take place, for example, by means of a press fit. The transition section 146 can be designed according to the shape of the recess 132 after the bending process and thus additionally support the transition region 130 weakened by the recess 132.

FIG. 11 shows a further possible embodiment of the support element 140 and differs from the support element 140 of FIG. 10 in that the support element 140 of FIG. 11 does not have a transition section 146. Rather, the support element 140 in FIG. 11 comprises only the first section 142 and the second section 144. Nevertheless, a support element 140 designed and shaped in this way can be designed to support a transition region 130 with a recess 132. The transition section 146 of FIG. 10 only has the advantage over the variant of FIG. 11 that the transition area 130 receives additional support.

FIG. 12 shows an exemplary flow chart of a method according to the invention for producing a circuit board arrangement 100 for a device for determining the fill level and / or the quality and the temperature of a fluid 12 of an internal combustion engine arranged in a fluid container.

The method according to the invention starts at step 200 and then arrives at step 210, in which a circuit board is provided with an essentially plate-shaped first area 110, an essentially plate-shaped second area 120 and a transition area 130 arranged between the first area 110 and the second area 120 will. In the subsequent step 220, the printed circuit board is bent in the transition area 130 in such a way that the first area 110 and the second area 120 are arranged at an angle to one another at a predetermined angle 150. In a subsequent step 230, a support element 140 is arranged on the bent printed circuit board, which is connected to the first area 110 and the second area 120 and is designed to position the first area 110 and the second area 120 relative to one another in such a way that the first Area 110 and the second area 120 are arranged angled to one another at the predetermined angle 150.

In a further process section 240, the printed circuit board arrangement 100 is at least partially embedded in plastic to form a housing of the printed circuit board arrangement 100. In particular, the support element 140 is designed to make the first area 110 and the second area 120 angled to one another at the predetermined angle 150 during the embedding process to be fixed so that the temperature sensor 122 arranged in the second area 120 remains in the predetermined position or position. The method then ends at step 250.

The circuit board arrangement 100 according to the invention, as shown for example in FIG. 6, can then be connected to a fluid container 14 in such a way that the first area 110 is arranged outside the fluid container 14 and the second area 120 together with the temperature sensor attached to it extends through the wall, preferably the base 15 of the fluid container 14 extends into the fluid 12, so that the temperature of the fluid 12 can be detected by means of the temperature sensor 122. If the circuit board arrangement 100 according to the invention is completely enclosed by plastic at least on the front side and the material in which the circuit board arrangement 100 is at least partially embedded is chemically resistant to the fluid 12 to be measured, the entire device can also be in contact with the fluid and the ultrasonic measurement can be carried out directly in the fluid 12 instead of through the wall of the fluid container 14.

All of the advantages of the device according to the invention mentioned here can also be used to provide an ultrasonic transducer instead of the temperature sensor or in addition to the temperature sensor, with which an ultrasonic measurement can then be carried out essentially perpendicular to the area 120.

Claims

1. A circuit board arrangement (100) for a device for determining the fill level and / or the quality and the temperature of a fluid (12) of an internal combustion engine arranged in a fluid container (14), the circuit board arrangement (100) having: a substantially plate-shaped first region (110), on which at least some of the electronics (112) of the device for determining the fill level and / or quality of the fluid (12) are attached and which is designed to be arranged outside the fluid container (14), a substantially plate-shaped second one Area (120) on which a temperature sensor (122) for determining the temperature of the fluid (12) and / or an ultrasonic transducer for determining the quality of the fluid (12) is attached and which is designed to be located at least partially within the in the fluid container ( 14) located fluids (12) to be arranged, wherein the first area (110) and the second area (120) at a predetermined angle (150) are arranged at an angle to one another, and a support element (140) which is connected to the first region (110) and the second region (120) and is designed to support the first region (110) and the second region (120) at the predetermined angle (150) to be fixed at an angle to each other.

2. Printed circuit board arrangement (100) according to claim 1, wherein the first region (110) is integrally connected to the second region (120) via a transition region (130), the transition region (130) being bent in such a way that the first region (110 ) and the second region (120) are arranged angled at the predetermined angle (150) to one another.

3. printed circuit board arrangement (100) according to any one of the preceding claims, wherein the predetermined angle (150) is in the range between approximately 45 ° and approximately 135 °, preferably approximately 90 °.

4. printed circuit board assembly (100) according to any one of the preceding claims, wherein the support element (140) comprises: a first portion (142), which is connected to the first region (110) and is designed to support the first region (110), and a second section (144) connected to the second area (120) and designed to support the second area (120).

5. Printed circuit board arrangement (100) according to claim 4, wherein the first section (142) of the support element (140) is designed to at least partially encompass the first region (110) in such a way that the first section (142) of the support element (140) is at least partially positively and / or non-positively connected to the first area (110), and the second section (144) of the support element (140) is designed to at least partially encompass the second area (120) in such a way that the second section (144) of the support element (140) is at least partially connected to the second area (120) in a form-fitting and / or force-fitting manner.

6. printed circuit board arrangement (100) according to any one of claims 4 and 5, wherein the support element (140) further comprises a transition section (146) which is designed to have a transition area arranged between the first area (110) and the second area (120) (130), wherein the transition section (146) of the support element (140) is designed to support the transition area (130) on only one side.

7. printed circuit board arrangement (100) according to claim 6, wherein the transition section (146) of the support element (140) is designed to support the transition region (130) on the side of the obtuse angle relative to the predetermined angle (150).

8. circuit board assembly (100) according to any one of the preceding claims, further comprising: a housing which at least partially surrounds the first area (110), completely the second area (120) and at least partially the support element (140) in a fluid-tight manner.

9. A method for producing a circuit board arrangement (100) for a device for determining the fill level and / or the quality and the temperature of a fluid (12) of an internal combustion engine arranged in a fluid container (14), the method comprising:

Providing a circuit board with an essentially plate-shaped first area (110) and an essentially plate-shaped second area (120),

Bending the circuit board in such a way that the first region (110) and the second region (120) are arranged at an angle to one another at a predetermined angle (150), and

Arranging a support element (140) which is connected to the first area (110) and to the second area (120) and is designed to position the first area (110) and the second area (120) relative to one another in such a way that the first Area (110) and the second area (120) at the predetermined angle (150) are angled to each other.

10. The method of claim 9, further comprising: at least partially embedding the circuit board assembly (100) in plastic to form a housing of the circuit board assembly (100).