WO2021157714A1 - 弾性波装置 - Google Patents

弾性波装置 Download PDF

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Publication number
WO2021157714A1
WO2021157714A1 PCT/JP2021/004392 JP2021004392W WO2021157714A1 WO 2021157714 A1 WO2021157714 A1 WO 2021157714A1 JP 2021004392 W JP2021004392 W JP 2021004392W WO 2021157714 A1 WO2021157714 A1 WO 2021157714A1
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WIPO (PCT)
Prior art keywords
elastic wave
support substrate
wave device
piezoelectric layer
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/JP2021/004392
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English (en)
French (fr)
Japanese (ja)
Inventor
英樹 岩本
克也 大門
木村　哲也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Priority to JP2021576191A priority Critical patent/JPWO2021157714A1/ja
Priority to CN202180011353.XA priority patent/CN115023896A/zh
Publication of WO2021157714A1 publication Critical patent/WO2021157714A1/ja
Priority to US17/875,496 priority patent/US12191839B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02228—Guided bulk acoustic wave devices or Lamb wave devices having interdigital transducers situated in parallel planes on either side of a piezoelectric layer
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02015—Characteristics of piezoelectric layers, e.g. cutting angles
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14538—Formation
    • H03H9/14541—Multilayer finger or busbar electrode
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02834—Means for compensation or elimination of undesirable effects of temperature influence

Definitions

  • the present invention generally relates to an elastic wave device, and more particularly to an elastic wave device including an IDT (Interdigital Transducer) electrode.
  • IDT Interdigital Transducer
  • Patent Document 1 describes a conventional elastic wave device.
  • the elastic wave device described in Patent Document 1 includes a hypersonic support substrate (support substrate), a piezoelectric film (piezoelectric layer), and an IDT electrode.
  • the IDT electrode is formed on one surface of the piezoelectric film.
  • the conventional elastic wave device described in Patent Document 1 has a problem that spurious in a higher-order mode may occur in a band on the higher frequency side than the excitation mode used for obtaining characteristics. This degrades the characteristics of the device.
  • the present invention has been made in view of the above points, and an object of the present invention is to reduce spurious in a higher-order mode generated in a band on the higher frequency side than the excitation mode used for obtaining characteristics.
  • the purpose is to provide a capable elastic wave device.
  • the elastic wave device includes a support substrate, a piezoelectric layer, and an IDT electrode.
  • the piezoelectric layer is provided on the support substrate in the thickness direction of the support substrate.
  • the IDT electrode is provided on the piezoelectric layer and has a plurality of electrode fingers. The crossing width of the plurality of electrode fingers is 5 ⁇ or less.
  • the elastic wave device According to the elastic wave device according to the above aspect of the present invention, it is possible to reduce the spurious of the higher-order mode generated in the band on the higher frequency side than the excitation mode used for obtaining the characteristics.
  • FIG. 1 is a front view of the elastic wave device according to the embodiment.
  • FIG. 2 is a cross-sectional view taken along the line X1-X1 of FIG. 1 in the elastic wave device of the same as above.
  • FIG. 3 is a graph showing the phase characteristics of the high-order mode of the elastic wave device of the above.
  • FIG. 4A is a graph showing the impedance characteristics when the cross width is 5 ⁇ in the elastic wave device of the same as above.
  • FIG. 4B is a graph showing the impedance characteristics when the cross width is 4 ⁇ in the elastic wave device of the same as above.
  • FIG. 4C is a graph showing the impedance characteristics when the cross width is 3 ⁇ in the elastic wave device of the same as above.
  • FIG. 5A is a graph showing the impedance characteristics when the cross width is 2 ⁇ in the elastic wave device of the same as above.
  • FIG. 5B is a graph showing the impedance characteristics when the cross width is 1 ⁇ in the elastic wave device of the same as above.
  • FIG. 6 is a cross-sectional view of the elastic wave device according to the first modification of the embodiment.
  • FIG. 7 is a cross-sectional view of the elastic wave device according to the second modification of the embodiment.
  • FIG. 8 is a graph showing the phase characteristics of the elastic wave device of the comparative example.
  • FIG. 9 is a graph showing the phase characteristics of the higher-order mode in the elastic wave device of the comparative example.
  • FIG. 10 is a graph showing impedance characteristics when the cross width is 6 ⁇ in the elastic wave device of the comparative example.
  • FIG. 1, FIG. 2, FIG. 6 and FIG. 7 referred to in the following embodiments and the like are schematic views, and the size and thickness ratios of the respective components in the drawings are not necessarily the actual dimensional ratios. It does not always reflect.
  • the elastic wave device 1 includes a support substrate 2, a piezoelectric layer 3, a low sound velocity film 4, a high sound velocity film 5, and an IDT (Interdigital Transducer) electrode 6. And. Further, the elastic wave device 1 further includes two reflectors 7, a wiring portion 8, and a protective film (not shown).
  • the elastic wave device 1 includes one IDT electrode 6, but the number of IDT electrodes 6 is not limited to one and may be plural.
  • the elastic wave device 1 includes a plurality of IDT electrodes 6, for example, a plurality of elastic surface wave resonators including the plurality of IDT electrodes 6 may be electrically connected to form a band-passing type filter. ..
  • the support substrate 2 has a first main surface 21 and a second main surface 22 facing each other.
  • the first main surface 21 and the second main surface 22 face each other in the thickness direction (first direction D1) of the support substrate 2.
  • the support substrate 2 has, for example, a rectangular shape.
  • the support substrate 2 is not limited to a rectangular shape, and may be, for example, a square shape.
  • the sound velocity of the bulk wave propagating in the support substrate 2 is faster than the sound velocity of the elastic wave propagating in the piezoelectric layer 3.
  • the bulk wave propagating on the support substrate 2 is the lowest sound velocity bulk wave among the plurality of bulk waves propagating on the support substrate 2.
  • the support substrate 2 is, for example, a silicon substrate.
  • the thickness of the support substrate 2 is preferably 10 ⁇ ( ⁇ : wavelength of elastic wave determined by the electrode finger pitch P1) or more and 180 ⁇ m or less, and as an example, it is 120 ⁇ m.
  • the plane orientation of the first main surface 21 of the support substrate 2 is, for example, the (100) plane, but is not limited to this, for example, the (110) plane, the (111) plane, and the like. It may be.
  • the propagation direction of the elastic wave can be set without being restricted by the surface direction of the first main surface 21 of the support substrate 2.
  • the material of the support substrate 2 is not limited to silicon.
  • the support substrate 2 is made of silicon, aluminum nitride, aluminum oxide, silicon carbide, silicon nitride, sapphire, lithium tantalate, lithium niobate, crystal, alumina, zirconia, cozilite, mulite, steatite, forsterite, magnesia and diamond. It suffices to contain at least one material selected from the group.
  • the piezoelectric layer 3 is provided on the support substrate 2 as shown in FIG. "The piezoelectric layer 3 is provided on the support substrate 2" means that the piezoelectric layer 3 is directly provided on the support substrate 2 without interposing another layer, and that the piezoelectric layer 3 is provided on the support substrate 2 via another layer.
  • the case where the piezoelectric layer 3 is indirectly provided on the support substrate 2 includes the case where the piezoelectric layer 3 is indirectly provided on the support substrate 2.
  • the piezoelectric layer 3 is indirectly provided on the support substrate 2. More specifically, the piezoelectric layer 3 is placed on the first main surface 21 side of the support substrate 2 via the low sound velocity film 4 and the high sound velocity film 5 in the thickness direction of the support substrate 2 (first direction D1). It is provided.
  • the piezoelectric layer 3 has a first main surface 31 and a second main surface 32. The first main surface 31 and the second main surface 32 face each other in the thickness direction (first direction D1) of the support substrate 2.
  • the piezoelectric layer 3 is formed of, for example, a ⁇ ° Y-cut X-propagated LiTaO 3 piezoelectric single crystal.
  • the ⁇ ° Y-cut X-propagation LiTaO 3 piezoelectric single crystal has the X-axis as the central axis in the direction from the Y-axis to the Z-axis when the three crystal axes of the LiTaO 3 piezoelectric single crystal are the X-axis, the Y-axis, and the Z-axis.
  • ⁇ and ⁇ ⁇ 180 ⁇ n are synonymous.
  • n is a natural number.
  • the piezoelectric layer 3 is not limited to the ⁇ ° Y-cut X-propagated LiTaO 3 piezoelectric single crystal, and may be, for example, ⁇ ° Y-cut X-propagated LiTaO 3 piezoelectric ceramics.
  • the thickness of the piezoelectric layer 3 is 3.5 ⁇ or less, for example, when the wavelength of the elastic wave determined by the electrode finger pitch P1 (see FIG. 1) of the IDT electrode 6 is ⁇ .
  • the Q value of the elastic wave device 1 becomes high.
  • the TCF Tempo Coefficient of Frequency
  • the thickness of the piezoelectric layer 3 is 1.5 ⁇ or less, the sound velocity of elastic waves can be easily adjusted.
  • the thickness of the piezoelectric layer 3 is 0.2 ⁇ (400 nm).
  • the thickness of the piezoelectric layer 3 is not limited to 3.5 ⁇ or less, and may be larger than 3.5 ⁇ .
  • the Q value becomes high as described above, but a higher-order mode occurs.
  • a low sound velocity film 4 and a high sound velocity film 5 are provided so as to reduce the higher-order mode even if the thickness of the piezoelectric layer 3 is 3.5 ⁇ or less.
  • the mode of the elastic wave propagating in the piezoelectric layer 3 there is a longitudinal wave, an SH wave, an SV wave, or a mode in which these are combined.
  • a mode containing SH waves as a main component is used as a main mode.
  • the higher-order mode is a spurious mode generated on the higher frequency side than the main mode of the elastic wave propagating in the piezoelectric layer 3.
  • the mode of the elastic wave propagating in the piezoelectric layer 3 is "the mode mainly composed of SH waves is the main mode" is determined by, for example, the parameters of the piezoelectric layer 3 (material, oiler angle, thickness, etc.).
  • the material of the piezoelectric layer 3 is not limited to lithium tantalate (LiTaO 3 ), and is, for example, lithium niobate (LiNbO 3 ), zinc oxide (ZnO), aluminum nitride (AlN), or lead zirconate titanate (lead zirconate titanate). It may be PZT).
  • the piezoelectric layer 3 is made of, for example, a Y-cut X-propagated LiNbO 3 piezoelectric single crystal or a piezoelectric ceramic
  • the elastic wave device 1 uses a love wave as an elastic wave to set a mode in which an SH wave is the main component. It can be used as the main mode.
  • the single crystal material and cut angle of the piezoelectric layer 3 may be appropriately determined according to, for example, the required specifications of the filter (passing characteristics, attenuation characteristics, temperature characteristics, filter characteristics such as bandwidth) and the like. ..
  • bass velocity film 4 is provided on the support substrate 2 as shown in FIG. "The bass velocity film 4 is provided on the support substrate 2" means that the bass velocity film 4 is directly provided on the support substrate 2 without interposing another layer, and that the bass velocity film 4 is provided on the support substrate 2 via another layer.
  • the case where the bass sound film 4 is indirectly provided on the support substrate 2 includes the case where the sound velocity film 4 is indirectly provided on the support substrate 2.
  • the bass velocity film 4 is provided between the support substrate 2 and the piezoelectric layer 3 in the thickness direction of the support substrate 2 (first direction D1). More specifically, the low sound velocity film 4 is formed on the first main surface 21 side of the support substrate 2 via the high sound velocity film 5.
  • the bass velocity film 4 is a film in which the sound velocity of the bulk wave propagating in the bass velocity film 4 is lower than the sound velocity of the bulk wave propagating in the piezoelectric layer 3.
  • the bass sound film 4 is provided between the support substrate 2 and the piezoelectric layer 3, the sound velocity of the elastic wave is lowered.
  • Elastic waves have the property that energy is concentrated in a medium that is essentially low sound velocity. Therefore, it is possible to enhance the effect of confining the energy of the elastic wave in the piezoelectric layer 3 and in the IDT electrode 6 in which the elastic wave is excited. As a result, the loss can be reduced and the Q value of the elastic wave device 1 can be increased as compared with the case where the bass velocity film 4 is not provided.
  • the material of the bass velocity film 4 is, for example, silicon oxide.
  • the material of the bass velocity film 4 is not limited to silicon oxide, and is, for example, glass, silicon nitride, tantalum oxide, a compound obtained by adding fluorine, carbon, or boron to silicon oxide, or each of the above materials as a main component. It may be a material to be used.
  • the temperature characteristics can be improved.
  • the elastic constant of lithium tantalate has a negative temperature characteristic, and silicon oxide has a positive temperature characteristic. Therefore, in the elastic wave device 1, the absolute value of TCF can be reduced.
  • the thickness of the bass velocity film 4 is preferably 2.0 ⁇ or less, where ⁇ is the wavelength of the elastic wave determined by the above-mentioned electrode finger pitch P1.
  • ⁇ is the wavelength of the elastic wave determined by the above-mentioned electrode finger pitch P1.
  • the thickness of the bass velocity film 4 is 0.2 ⁇ (400 nm).
  • the elastic wave device 1 may include, for example, an adhesion layer interposed between the bass velocity film 4 and the piezoelectric layer 3.
  • the adhesion layer is made of, for example, a resin (epoxy resin, polyimide resin, etc.), a metal, or the like.
  • the elastic wave device 1 is not limited to the close contact layer, and is provided with a dielectric film either between the low sound velocity film 4 and the piezoelectric layer 3, above the piezoelectric layer 3, or below the low sound velocity film 4. May be good.
  • the hypersonic film 5 is provided between the support substrate 2 and the low sound velocity film 4 in the thickness direction (first direction D1) of the support substrate 2. ing.
  • the hypersonic film 5 is provided on the support substrate 2.
  • the hypersonic film 5 is provided on the support substrate 2 means that the hypersonic film 5 is directly provided on the support substrate 2 without interposing another layer, and that the hypersonic film 5 is provided on the support substrate 2 via another layer. Including the case where the hypersonic film 5 is indirectly provided on the support substrate 2.
  • the hypersonic film 5 is a film in which the sound velocity of the bulk wave propagating in the hypersonic film 5 is higher than the sound velocity of the elastic wave propagating in the piezoelectric layer 3.
  • the thickness of the hypersonic film 5 is, for example, 200 nm, 300 nm, 400 nm, and 600 nm.
  • the thickness of the hypersonic film 5 is 0.3 ⁇ (600 nm).
  • the thicker the treble speed film 5 is, the more desirable it is.
  • the hypersonic film 5 functions to prevent the energy of the elastic wave in the main mode from leaking to the structure below the hypersonic film 5.
  • the energy of the elastic wave in the main mode is distributed throughout the piezoelectric layer 3 and the bass film 4, and the bass film of the treble film 5 is distributed. It is also distributed on a part of the 4 side, and is not distributed on the support substrate 2.
  • the mechanism by which the elastic wave is confined by the high-pitched sound film 5 is the same as that of the love wave type surface wave, which is a non-leakage SH wave. Realize, p. 26-28.
  • the above mechanism is different from the mechanism of confining elastic waves using a Bragg reflector with an acoustic multilayer film.
  • the material of the hypersonic film 5 is, for example, silicon nitride.
  • the material of the treble speed film 5 is not limited to silicon nitride, but is diamond-like carbon, aluminum nitride, aluminum oxide, silicon carbide, silicon, sapphire, piezoelectric material (lithium tantalate, lithium niobate, or crystal), alumina. , Zirconia, Cojilite, Murite, Steatite, Forsterite, Magnesia, and Diamond may be at least one material selected from the group.
  • the material of the hypersonic film 5 may be a material containing any of the above-mentioned materials as a main component, or a material containing a mixture containing any of the above-mentioned materials as a main component.
  • the IDT electrode 6 is provided on the piezoelectric layer 3 as shown in FIGS. 1 and 2. More specifically, the IDT electrode 6 is formed on the first main surface 31 of the piezoelectric layer 3 in the thickness direction (first direction D1) of the support substrate 2.
  • the IDT electrode 6 has two electrodes 61 as shown in FIG. In other words, the IDT electrode 6 has two bus bars 62 and two sets of electrode fingers 63. More specifically, the IDT electrode 6 has a first electrode 61A and a second electrode 61B. Each of the first electrode 61A and the second electrode 61B has conductivity. The first electrode 61A and the second electrode 61B are separated from each other and are electrically insulated from each other.
  • the first electrode 61A has a comb shape in a plan view from the thickness direction (first direction D1) of the support substrate 2.
  • the first electrode 61A has a first bus bar 62A and a plurality of first electrode fingers 63A.
  • the first bus bar 62A is a conductor portion for making a plurality of first electrode fingers 63A have the same potential (equal potential).
  • the second electrode 61B has a comb shape in a plan view from the thickness direction (first direction D1) of the support substrate 2.
  • the second electrode 61B has a second bus bar 62B and a plurality of second electrode fingers 63B.
  • the second bus bar 62B is a conductor portion for making a plurality of second electrode fingers 63B have the same potential (equal potential).
  • the first bus bar 62A and the second bus bar 62B face each other in the third direction D3.
  • the plurality of first electrode fingers 63A are connected to the first bus bar 62A and extend to the second bus bar 62B side.
  • the plurality of first electrode fingers 63A are formed integrally with the first bus bar 62A and are separated from the second bus bar 62B.
  • the plurality of second electrode fingers 63B are connected to the second bus bar 62B and extend to the first bus bar 62A side.
  • the plurality of second electrode fingers 63B are formed integrally with the second bus bar 62B and are separated from the first bus bar 62A.
  • the IDT electrode 6 is, for example, a normal type IDT electrode. Hereinafter, the IDT electrode 6 will be described in more detail.
  • the first bus bar 62A and the second bus bar 62B of the IDT electrode 6 have a long shape with the second direction D2 as the longitudinal direction.
  • the first bus bar 62A and the second bus bar 62B face each other in the third direction D3.
  • the second direction D2 is a direction orthogonal to the thickness direction (first direction D1) of the support substrate 2.
  • the third direction D3 is a direction orthogonal to both the thickness direction (first direction D1) of the support substrate 2 and the second direction D2.
  • the plurality of first electrode fingers 63A are connected to the first bus bar 62A and extend toward the second bus bar 62B.
  • the plurality of first electrode fingers 63A extend from the first bus bar 62A along the third direction D3.
  • the tips of the plurality of first electrode fingers 63A and the second bus bar 62B are separated from each other.
  • the plurality of first electrode fingers 63A have the same length and crossing width W1.
  • the plurality of second electrode fingers 63B are connected to the second bus bar 62B and extend toward the first bus bar 62A.
  • the plurality of second electrode fingers 63B extend from the second bus bar 62B along the third direction D3.
  • the tips of the plurality of second electrode fingers 63B and the first bus bar 62A are separated from each other.
  • the plurality of second electrode fingers 63B have the same length and crossing width W1.
  • the length and the crossing width W1 of the plurality of second electrode fingers 63B are the same as the length and the crossing width W1 of the plurality of first electrode fingers 63A, respectively.
  • a plurality of first electrode fingers 63A and a plurality of second electrode fingers 63B are alternately arranged one by one in the second direction D2 so as to be separated from each other. Therefore, the adjacent first electrode finger 63A and the second electrode finger 63B are separated by a distance S1.
  • a plurality of first electrode fingers 63A and a plurality of second electrode fingers 63B are separated from each other in the second direction D2.
  • the configuration may be such that the plurality of first electrode fingers 63A and the plurality of second electrode fingers 63B are not alternately arranged at a distance from each other.
  • the plurality of first electrode fingers 63A and the plurality of second electrode fingers 63B are interleaved with each other.
  • the "crossing width" means the length at which the first electrode finger 63A and the second electrode finger 63B overlap when viewed from the elastic wave propagation direction. That is, the IDT electrode 6 has an intersecting region defined by the plurality of first electrode fingers 63A and the plurality of second electrode fingers 63B.
  • the intersecting region is the region between the envelope at the tips of the plurality of first electrode fingers 63A and the envelope at the tips of the plurality of second electrode fingers 63B.
  • the IDT electrode 6 excites an elastic wave in the piezoelectric layer 3 in the intersecting region.
  • the IDT electrode 6 is not limited to a normal IDT electrode, and may be, for example, an IDT electrode to which apodization weighting is applied, or an inclined IDT electrode.
  • the crossing width increases from one end in the propagation direction of the elastic wave toward the center, and decreases as the crossing width approaches from the center to the other end in the propagation direction of the elastic wave.
  • the electrode finger pitch P1 of the IDT electrode 6 is the distance between the center lines of two adjacent first electrode fingers 63A among the plurality of first electrode fingers 63A, or the plurality of second electrode fingers. It is defined by the distance between the center lines of two adjacent second electrode fingers 63B of 63B. The distance between the center lines of two adjacent second electrode fingers 63B is the same as the distance between the center lines of two adjacent first electrode fingers 63A.
  • the logarithm of the first electrode finger 63A and the second electrode finger 63B is 100 as an example. That is, the IDT electrode 6 has 100 first electrode fingers 63A and 100 second electrode fingers 63B as an example.
  • the material of the IDT electrode 6 is aluminum (Al), copper (Cu), platinum (Pt), gold (Au), silver (Ag), titanium (Ti), nickel (Ni), chromium (Cr), molybdenum (Mo). ), Tungsten (W), or an appropriate metal material such as an alloy mainly composed of any of these metals. Further, the IDT electrode 6 may have a structure in which a plurality of metal films made of these metals or alloys are laminated.
  • the two reflectors 7 are provided on the piezoelectric layer 3 as shown in FIG. More specifically, the two reflectors 7 are formed on the first main surface 31 of the piezoelectric layer 3 in the thickness direction (first direction D1) of the support substrate 2. Each of the two reflectors 7 is conductive.
  • the two reflectors 7 are located on one side and the other side of the IDT electrode 6 in the direction along the propagation direction of the elastic wave of the elastic wave device 1 (second direction D2). In other words, in the second direction D2, the IDT electrode 6 is located between the two reflectors 7.
  • Each reflector 7 is, for example, a short-circuit grating. Each reflector 7 reflects elastic waves.
  • Each of the two reflectors 7 has a plurality of electrode fingers 71, one ends of the plurality of electrode fingers 71 are short-circuited, and the other ends are short-circuited.
  • the number of electrode fingers is 20 as an example.
  • each reflector 7 is aluminum (Al), copper (Cu), platinum (Pt), gold (Au), silver (Ag), titanium (Ti), nickel (Ni), chromium (Cr), molybdenum ( It is an appropriate metal material such as Mo), tungsten (W), or an alloy mainly composed of any of these metals. Further, each reflector 7 may have a structure in which a plurality of metal films made of these metals or alloys are laminated.
  • each reflector 7 and the IDT electrode 6 are set to the same material and the same thickness, each reflector 7 and the IDT electrode 6 are formed in the same process at the time of manufacturing the elastic wave device 1. can do.
  • each reflector 7 is a short-circuit grating, but each reflector 7 is not limited to a short-circuit grading, and is, for example, an open grating, a positive / negative reflection type grating, or It may be a grating in which a short-circuit grating and an open grating are combined.
  • the wiring section 8 is provided on the piezoelectric layer 3 as shown in FIG. More specifically, the wiring portion 8 is formed on the first main surface 31 of the piezoelectric layer 3 in the thickness direction (first direction D1) of the support substrate 2.
  • the wiring portion 8 has conductivity.
  • the wiring unit 8 includes a first wiring unit 81 and a second wiring unit 82.
  • the first wiring portion 81 is connected to the first bus bar 62A of the IDT electrode 6.
  • the second wiring portion 82 is connected to the second bus bar 62B of the IDT electrode 6.
  • the first wiring portion 81 and the second wiring portion 82 are separated from each other and are electrically insulated from each other.
  • the first wiring portion 81 extends from the first bus bar 62A to the side opposite to the side of the plurality of first electrode fingers 63A.
  • the first wiring portion 81 may be formed so as to partially overlap with the first bus bar 62A in the thickness direction of the support substrate 2 (first direction D1), or may be formed of the same material and the same thickness as the first bus bar 62A.
  • the bus bar 62A may be formed integrally with the first bus bar 62A.
  • the second wiring portion 82 extends from the second bus bar 62B to the side opposite to the side of the plurality of second electrode fingers 63B.
  • the second wiring portion 82 may be formed so as to partially overlap the second bus bar 62B in the thickness direction of the support substrate 2 (first direction D1), or may be formed of the same material and the same thickness as the second bus bar 62B. Now, it may be formed integrally with the second bus bar 62B.
  • the material of the wiring portion 8 is aluminum (Al), copper (Cu), platinum (Pt), gold (Au), silver (Ag), titanium (Ti), nickel (Ni), chromium (Cr), molybdenum (Mo). ), Titanium (W), or an appropriate metal material such as an alloy mainly composed of any of these metals. Further, the wiring portion 8 may have a structure in which a plurality of metal films made of these metals or alloys are laminated.
  • Protective film A protective film (not shown) is formed on the piezoelectric layer 3.
  • the protective film covers the IDT electrode 6, each reflector 7, and the wiring portion 8 on the first main surface 31 of the piezoelectric layer 3, and a part of the first main surface 31 of the piezoelectric layer 3.
  • the material of the protective film is, for example, silicon oxide.
  • the material of the protective layer is not limited to silicon oxide, and may be, for example, silicon nitride.
  • the protective film is not limited to a single-layer structure, and may have, for example, a multi-layer structure having two or more layers.
  • the elastic wave device of the comparative example will be described.
  • the higher-order mode does not occur as shown in the characteristic A2 of FIG.
  • the piezoelectric layer is thinner than the piezoelectric substrate and the structure is such that the support substrate and the piezoelectric layer are laminated, a higher-order mode is generated as shown in the characteristic A1 of FIG.
  • the higher-order mode is a spurious mode generated on the higher frequency side than the main mode of the elastic wave propagating in the piezoelectric layer 3.
  • the higher-order mode is small in the range where the thickness of the piezoelectric layer is larger than 10 ⁇ .
  • the higher-order mode occurs in the range where the thickness of the piezoelectric layer is 10 ⁇ or less.
  • the thickness of the piezoelectric layer is 5 ⁇ or less, the higher-order mode becomes larger.
  • the thickness of the piezoelectric layer is 1 ⁇ or less, the phase approaches 90 ° and the characteristics of the elastic wave device are significantly deteriorated.
  • the crossing width W1 of the plurality of electrode fingers 63 is set to 5 ⁇ or less. ing.
  • the phase characteristics of the higher-order mode can be improved as shown in FIG.
  • FIG. 3 is a graph showing the phase characteristics of the higher-order mode with respect to the intersection width W1. In the range where the intersection width W1 is 5 ⁇ or less, the higher-order mode becomes smaller as the intersection width W1 becomes smaller.
  • the conditions of the elastic wave device 1 for obtaining the characteristics of FIG. 3 are as follows.
  • the thickness of the IDT electrode 6 is 0.05 ⁇
  • the thickness of the piezoelectric layer 3 is 0.2 ⁇
  • the thickness of the hypersonic film 4 is 0.2 ⁇
  • the thickness of the hypersonic film 5 is 0.3 ⁇ .
  • the material of the IDT electrode 6 is aluminum
  • the material of the piezoelectric layer 3 is lithium tantalate
  • the material of the low sound velocity film 4 is silicon oxide
  • the material of the high sound velocity film 5 is silicon nitride
  • the material of the support substrate 2 is silicon.
  • the crossing width W1 of the plurality of electrode fingers 63 is preferably 2 ⁇ or less.
  • the spurious in the transverse mode can be reduced as shown in FIGS. 5A and 5B. That is, the transverse mode can be suppressed.
  • FIG. 5A shows the impedance when the intersection width W1 is 2 ⁇ .
  • FIG. 5B shows the impedance when the intersection width W1 is 1 ⁇ .
  • intersection width W1 when the intersection width W1 is larger than 2 ⁇ , a peak due to the transverse mode occurs in the frequency band between the antiresonance frequency and the resonance frequency, as shown in FIGS. 4A to 4C. Further, even when the intersection width W1 is larger than 5 ⁇ , a peak due to the transverse mode occurs in the frequency band between the antiresonance frequency and the resonance frequency, as shown in FIG.
  • the cross width W1 of the plurality of electrode fingers 63 of the IDT electrode 6 is 5 ⁇ or less.
  • the cross width W1 of the plurality of electrode fingers 63 of the IDT electrode 6 is 2 ⁇ or less. As a result, the transverse mode can be suppressed.
  • a bass velocity film 4 is provided between the support substrate 2 and the piezoelectric layer 3 in the thickness direction of the support substrate 2 (first direction D1). Thereby, the Q value of the elastic wave device 1 can be improved.
  • a hypersonic film 5 is provided between the support substrate 2 and the low sound velocity film 4 in the thickness direction of the support substrate 2 (first direction D1). Thereby, the Q value of the elastic wave device 1 can be further improved.
  • the elastic wave device 1a does not have to include the hypersonic film 5.
  • the elastic wave device 1a includes a support substrate 2, a piezoelectric layer 3, a bass velocity film 4, and an IDT electrode 6 as in the elastic wave device 1 according to the embodiment.
  • the support substrate 2 is a hypersonic support substrate. Thereby, the Q value of the elastic wave device 1 can be further improved.
  • the piezoelectric layer 3 may be provided directly on the support substrate 2. That is, the elastic wave device 1b does not have to include the low sound velocity film 4 and the high sound velocity film 5.
  • the elastic wave device 1b includes a support substrate 2, a piezoelectric layer 3, and an IDT electrode 6 as in the elastic wave device 1 according to the embodiment.
  • the elastic wave device 1a according to the modification 1 and the elastic wave device 1b according to the modification 2 also have the same effect as the elastic wave device 1 according to the embodiment.
  • the elastic wave device 1 may include an adhesion layer, a dielectric film, and the like as films other than the hypersonic film 5, the low sound velocity film 4, and the piezoelectric layer 3.
  • the elastic wave device 1 is connected to the first terminal connected to the first bus bar 62A via the first wiring portion 81 of the wiring portion 8 and to the second bus bar 62B via the second wiring portion 82 of the wiring portion 8. It may further include a connected second terminal. Further, the elastic wave device 1 may further include two third wiring portions connected to each of the two reflectors 7. In this case, each of the two reflectors 7 may be connected to the third terminal via at least the third wiring portion.
  • a plurality of external connection terminals including the first terminal, the second terminal, and the third terminal are electrodes for electrically connecting the circuit board, the mounting board for the package (submount board), and the like in the elastic wave device 1. Is.
  • the elastic wave device 1 may further include a plurality of dummy terminals that are not electrically connected to the IDT electrode 6.
  • the plurality of dummy terminals are terminals for increasing the parallelism of the elastic wave device 1 with respect to a circuit board, a mounting board, or the like, and are different from terminals intended for electrical connection. That is, the dummy terminal is a terminal for suppressing the elastic wave device 1 from being mounted at an angle with respect to the circuit board, the mounting board, etc., and the number and arrangement of external connection terminals and the outer peripheral shape of the elastic wave device 1. It is not always necessary to provide it depending on the situation.
  • the first terminal is formed integrally with the first wiring portion 81, for example, with the same material and the same thickness as the first wiring portion 81.
  • the second terminal is formed integrally with the second wiring portion 82, for example, with the same material and the same thickness as the second wiring portion 82.
  • the third terminal is formed integrally with the third wiring portion, for example, with the same material and the same thickness as the third wiring portion.
  • the third wiring portion is formed of, for example, the same material and the same thickness as the first wiring portion 81 and the second wiring portion 82.
  • the elastic wave device (1; 1a; 1b) includes a support substrate (2), a piezoelectric layer (3), and an IDT electrode (6).
  • the piezoelectric layer (3) is provided on the support substrate (2) in the thickness direction (first direction D1) of the support substrate (2).
  • the IDT electrode (6) is provided on the piezoelectric layer (3).
  • the IDT electrode (6) has a plurality of electrode fingers (63).
  • the crossing width (W1) of the plurality of electrode fingers (63) is 5 ⁇ or less.
  • the cross width (W1) of the plurality of electrode fingers (63) of the IDT electrode (6) is 5 ⁇ or less.
  • the crossing width (W1) of the plurality of electrode fingers (63) is 2 ⁇ or less.
  • the cross width (W1) of the plurality of electrode fingers (63) of the IDT electrode (6) is 2 ⁇ or less. As a result, the transverse mode can be suppressed.
  • the elastic wave device (1; 1a) according to the third aspect further includes a bass velocity film (4) in the first or second aspect.
  • the sound velocity of the bulk wave propagating in the bass velocity film (4) is lower than the sound velocity of the bulk wave propagating in the piezoelectric layer (3).
  • the bass velocity film (4) is provided between the support substrate (2) and the piezoelectric layer (3) in the thickness direction (first direction D1) of the support substrate (2).
  • the Q value of the elastic wave device (1; 1a) can be improved.
  • the elastic wave device (1) according to the fourth aspect further includes a hypersonic film (5) in the third aspect.
  • the sound velocity of the bulk wave propagating in the hypersonic film (5) is higher than the sound velocity of the elastic wave propagating in the piezoelectric layer (3).
  • the hypersonic film (5) is provided between the support substrate (2) and the low sound velocity film (4) in the thickness direction (first direction D1) of the support substrate (2).
  • the Q value of the elastic wave device (1) can be further improved.
  • the support substrate (2) is a hypersonic support substrate.
  • the sound velocity of the bulk wave propagating in the hypersonic support substrate is higher than the sound velocity of the elastic wave propagating in the piezoelectric layer (3).
  • the Q value of the elastic wave device (1a) can be further improved.
  • the piezoelectric layer (3) is lithium tantalate.

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
PCT/JP2021/004392 2020-02-06 2021-02-05 弾性波装置 Ceased WO2021157714A1 (ja)

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CN114731147A (zh) * 2019-12-09 2022-07-08 株式会社村田制作所 弹性波装置
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JP3587354B2 (ja) 1999-03-08 2004-11-10 株式会社村田製作所 横結合共振子型表面波フィルタ及び縦結合共振子型表面波フィルタ
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