WO2021147649A1 - 一种电子设备外罩及电子设备组件 - Google Patents

一种电子设备外罩及电子设备组件 Download PDF

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Publication number
WO2021147649A1
WO2021147649A1 PCT/CN2020/142419 CN2020142419W WO2021147649A1 WO 2021147649 A1 WO2021147649 A1 WO 2021147649A1 CN 2020142419 W CN2020142419 W CN 2020142419W WO 2021147649 A1 WO2021147649 A1 WO 2021147649A1
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WO
WIPO (PCT)
Prior art keywords
electronic device
air inlet
baffle
air
channel
Prior art date
Application number
PCT/CN2020/142419
Other languages
English (en)
French (fr)
Inventor
唐银中
王娜
池善久
王政权
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP20915330.3A priority Critical patent/EP4075931A4/en
Priority to JP2022544810A priority patent/JP7451726B2/ja
Publication of WO2021147649A1 publication Critical patent/WO2021147649A1/zh
Priority to US17/871,404 priority patent/US20220361346A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0213—Venting apertures; Constructional details thereof

Definitions

  • This application relates to the field of information technology, and in particular to an electronic device cover and an electronic device component.
  • the present application provides an electronic device outer cover and an electronic device component, which are used to improve the anti-corrosion performance of the electronic device without affecting the heat dissipation performance of the electronic device.
  • the present application provides an electronic device cover, which can be used to house an electronic device.
  • the electronic device outer cover is provided with a first air inlet window and a first air outlet window, wherein the first air inlet window can be used to communicate with the air inlet of the electronic device to form an air inlet channel, and the first air outlet window can be used to connect to the electronic device
  • the air outlet is connected to form an air outlet channel;
  • the electronic equipment cover also has a return air channel, which can be used to connect the air outlet channel with the air inlet channel, so that part of the hot return air from the air outlet channel can enter the air inlet aisle.
  • the air inlet temperature of the chassis can be slightly increased without affecting the heat dissipation performance of the electronic equipment, thereby eliminating the area near the air inlet in the chassis
  • the cold air zone reduces the relative humidity of the air in the chassis, thereby reducing the risk of corrosion of electronic components such as single boards.
  • the electronic device housing may include a top plate, a first side plate, and a bottom plate, wherein the first side plate is connected between the top plate and the bottom plate; the inner wall of the first side plate is provided with a baffle plate, and the baffle plate and the bottom plate are arranged obliquely
  • the air inlet channel and the air outlet channel are respectively located on both sides of the baffle, and the gap between the baffle and the bottom plate can be formed as a part of the return air channel.
  • the hot return air on the side of the baffle close to the air outlet channel mainly enters the side close to the air inlet channel through the gap between the baffle and the bottom plate, so that the hot return air supplied to the lower area of the air inlet channel is relatively opposite. More sufficient, which helps to make the temperature of the mixed air formed in the air inlet channel more balanced.
  • the specific location of the first air inlet window and the first air outlet window is not limited.
  • the first air inlet window and the first air outlet window can be respectively arranged on the first side panel.
  • the return air channel is formed between the first side plate and the panel of the electronic device, thereby reducing the difficulty of setting the return air channel and simplifying the structure of the outer cover of the electronic device.
  • the baffle is located between the first air inlet window and the first air outlet window.
  • the baffle may include a first end, a second end, a third end, and a fourth end.
  • the first end is opposite to the second end, and the third end is the end of the baffle close to the top plate.
  • the four ends are the end of the baffle close to the bottom plate.
  • the baffle can be a straight plate structure, and the baffle and the top plate can be arranged orthogonally, or the baffle can also be inclined to one side of the air inlet channel. , That is, the angle between the side of the baffle close to the air inlet channel and the top plate is an acute angle.
  • the third end of the baffle can be connected to the top plate, so that in the return air channel, the hot return air from the side of the baffle close to the air outlet channel can only enter the side close to the air inlet channel through the gap between the baffle and the bottom plate.
  • the electronic equipment housing is also provided with a diversion member, which can be specifically arranged in the return air channel to pass the hot return air through the baffle.
  • the guide member includes a plurality of guide plates, and the plurality of guide plates can be arranged on the inner wall of the first side plate at intervals, so that adjacent The first guide groove can be formed between the two guide plates.
  • the number of baffles can be multiple, and the multiple baffles can be arranged on the inner wall of the first side plate at intervals, and the multiple baffles
  • the third end of the air inlet is away from the top plate in turn, so that the second diversion groove of the return air channel can be formed between the two adjacent baffles.
  • the end of the second diversion groove communicating with the air inlet channel is set close to the bottom plate, so that The hot return air from the air outlet channel is regularly guided to the lower area of the air inlet channel close to the bottom plate, which is beneficial to make the temperature of the mixed air formed in the air inlet channel more balanced.
  • the baffle may also adopt a bent plate structure, and in this case, the number of the baffle is one or more.
  • the third end of the baffle can be connected to the top plate, and the fourth end of the baffle can be bent toward the side of the air inlet channel.
  • the baffle is close to the heat on the side of the air outlet channel.
  • the return air can only enter the side close to the air inlet channel through the gap between the baffle and the bottom plate to improve the temperature balance of the mixed air formed in the air inlet channel; in addition, the curved shape of the baffle can also be used for diversion Function to direct the hot return air to the lower area of the air inlet channel near the bottom plate.
  • the multiple baffles are arranged on the inner wall of the first side plate at intervals, and the third ends of the multiple baffles are sequentially away from the top plate, so that two adjacent baffles can be formed back
  • the second diversion groove of the wind channel, the end of the second diversion groove communicating with the air inlet channel is arranged close to the bottom plate, so that the hot return air from the air outlet channel can be regularly guided to the lower area of the air inlet channel close to the bottom plate, which is beneficial to The temperature of the mixed air formed in the air inlet channel is more balanced.
  • the baffle may be a curved plate, a combined plate formed by connecting a plurality of straight plates, or a combined plate formed by connecting a straight plate and an arc plate, or the like.
  • the inner wall of the outer cover of the electronic device is provided with sound-absorbing cotton, so that the noise generated by the electronic device during operation can be isolated inside the outer cover of the electronic device by the sound-absorbing cotton.
  • the sound-absorbing cotton and the inner wall of the outer cover of the electronic device may be glued and fixed by glue to ensure the connection between the two.
  • the first air inlet window and the first air outlet window may be louvers, respectively.
  • the blades of the louvers may be bent blades.
  • the blades include a first bending portion and a second bending portion, and the first bending portion is bent relative to the second bending portion.
  • the part is located close to the inside of the electronic equipment cover, and the angle between the first bending part and the second bending part is less than 180 degrees.
  • the air inlet formed between two adjacent blades is Bending holes, when the sound inside the housing of the electronic device travels outwards through the air inlet, it will undergo multiple reflections or refractions. In the process of multiple reflections or refractions, part of the sound energy will be absorbed by the air, so that it can be reduced Finally, the sound that is transmitted to the outside of the electronic device cover realizes further noise reduction.
  • the electronic device includes a case, and the air inlet and the air outlet are respectively opened on two side panels of the case opposite to each other; the electronic device cover also includes a second side panel and a third side panel that are positioned opposite each other.
  • the two side panels and the third side panel are respectively connected to both sides of the first side panel, and the second side panel is arranged opposite to the side panel provided with the air inlet on the chassis.
  • the air inlet channel can be composed of two parts, namely the first part formed between the area of the first side plate close to the second side plate and the panel of the chassis, and the second part formed between the second side plate and the panel of the chassis.
  • the second part; the air outlet channel can also be composed of two parts, which are the third part formed between the area of the first side plate close to the third side plate and the panel of the chassis, and between the third side plate and the panel of the chassis The fourth part of the formation.
  • a second air inlet window is provided on the side of the top plate close to the second side plate, and the second air inlet window is in communication with the air inlet channel; and the side of the top plate close to the third side plate is provided with a second air inlet window.
  • the air outlet window, the second air outlet window is in communication with the air outlet channel, so that the air inlet and outlet paths can be increased, which is beneficial to improve the heat dissipation efficiency of the electronic device.
  • a third air inlet window is provided on the second side panel, and the third air inlet window is in communication with the air inlet channel, and the third air inlet window is a switch window.
  • the on or off state allows the electronic device components to be used in different scenarios.
  • the electronic device housing can be used in an outdoor environment. Due to the low relative humidity of the air in electronic equipment, even if highly corrosive substances such as sodium chloride and potassium chloride from the outside enter the electronic equipment, it will not deliquesce, so it will not cause corrosion to electronic components.
  • the present application also provides an electronic device assembly, which includes an electronic device and the electronic device housing in any of the foregoing possible embodiments.
  • the electronic device can be set in the electronic device housing.
  • the relative humidity inside the electronic device can be reduced by adjusting the air inlet temperature of the electronic device, thereby reducing the risk of corrosion of the electronic components inside the electronic device and improving the anti-corrosion performance of the electronic device.
  • the electronic device is a server.
  • the electronic device is a network device.
  • the electronic device is a storage device.
  • FIG. 1 is a schematic diagram of a partial structure of an electronic device component provided by an embodiment of the application
  • FIG. 2 is a schematic diagram of a partial structure of an electronic device housing provided by an embodiment of the application.
  • FIG. 3 is a schematic diagram of the air flow direction inside the housing of the electronic device provided by the embodiment of the application;
  • FIG. 4 is a schematic diagram of a partial structure of a first side plate provided by an embodiment of the application.
  • FIG. 5 is a schematic diagram of a partial structure of the first side plate provided by another embodiment of the application.
  • FIG. 6 is a schematic diagram of a partial structure of the first side plate provided by another embodiment of the application.
  • FIG. 7 is a schematic diagram of a partial structure of the first side plate according to another embodiment of the application.
  • FIG. 8 is a schematic diagram of a partial structure of the first side plate according to another embodiment of the application.
  • FIG. 9 is a schematic diagram of a partial structure of the first side plate provided by another embodiment of the application.
  • FIG. 10 is a schematic diagram of a partial structure of a first side plate provided by another embodiment of the application.
  • FIG. 11 is a schematic diagram of a partial structure of a first air inlet window provided by an embodiment of the application.
  • the camera module provided in the embodiments of the present application can be used to house electronic equipment, where the electronic equipment can be servers, communication equipment, network equipment, storage equipment or routers, switches and other equipment in the prior art.
  • the electronic equipment can be servers, communication equipment, network equipment, storage equipment or routers, switches and other equipment in the prior art.
  • the electronic equipment can be servers, communication equipment, network equipment, storage equipment or routers, switches and other equipment in the prior art.
  • the electronic equipment can be servers, communication equipment, network equipment, storage equipment or routers, switches and other equipment in the prior art.
  • the advantage of this solution is that the dust-proof effect is better, but the disadvantage is that the installation of the dust-proof net will increase the heat dissipation wind resistance and affect the electronics.
  • the heat dissipation performance of the equipment, and the dust screen is also easy to be blocked by dust, and it needs to be cleaned and maintained regularly. If the maintenance is not timely, dust will enter the inside of the chassis.
  • the corrosive and harmful impurities in the dust adhere to the board, Under certain humidity conditions, deliquescence will occur, which will corrode the veneer, and even cause a short circuit in the veneer in severe cases.
  • the internal electronic components such as the veneer are also more susceptible The temperature and humidity of the environment cause corrosion of itself, which affects the performance of electronic equipment.
  • the present application provides an electronic device cover and an electronic device component using the electronic device cover.
  • the electronic device cover can improve the anti-corrosion performance of the electronic device without affecting the heat dissipation performance of the electronic device.
  • the electronic device housing 10 provided by the embodiment of the present application can be used to house an electronic device 20.
  • the electronic device 20 can include a chassis 21 and components such as a board and a fan provided in the chassis 21.
  • An air inlet 22 and an air outlet 23 are provided.
  • the air inlet 22 and the air outlet 23 can be opened on the opposite side panels of the chassis 21.
  • the air inlet side of the fan can be set toward the air inlet 22, and the outlet of the fan The air side is set toward the air outlet 23, so that the cold air outside the chassis 21 can enter the chassis 21 from the air inlet 22 under the suction action of the fan.
  • the cold air entering the chassis 21 heats up after exchanging heat with the electronic components, and then passes through The exhaust function of the fan is discharged from the chassis 21 through the air outlet 23 to realize the heat dissipation of the electronic device 20.
  • the relative humidity of the air in the chassis 21 is an important indicator that affects the corrosion of related electronic components.
  • the wiring on the single board is mostly made of metal copper, and the relative humidity of copper corrosion in the air
  • the critical value is 60%.
  • the corrosion rate of copper will continue to accelerate with the increase of the relative humidity; and the insulation resistance of the surface of the veneer will also increase with The increase in relative humidity shows a downward trend, and the relative humidity between 60% and 65% is the inflection point of the decrease in the resistance of the insulation resistance.
  • highly corrosive substances such as sodium chloride and potassium chloride in the air will not deliquesce, and will not cause corrosion to electronic components.
  • the embodiment of the present application is to increase the air inlet temperature of the chassis 21 by setting the electronic device cover 10.
  • the electronic device housing 10 is provided with a first air inlet window 11 and a first air outlet window 12, wherein the first air inlet window 11 can be used to connect to the air inlet of the chassis 21 22 is connected, and an air inlet channel is formed between the two.
  • the first air outlet window 12 can be used to communicate with the air outlet 23 of the chassis 21 and form an air outlet channel between the two.
  • the electronic device housing 10 also has a return air channel, which can be respectively connected to the air outlet channel and the air inlet channel. Part of the hot air in the air outlet channel can enter the air inlet channel through the return air channel, and pass through the first air inlet channel.
  • the fresh air entering the air inlet channel of the window 11 is mixed to form a mixed air whose temperature is slightly higher than that of the fresh air.
  • the mixed air enters the chassis 21 from the air inlet 22 to increase the air inlet temperature of the air inlet 22, thereby Eliminates the cold air zone in the enclosure 21 near the air inlet 22, reduces the relative humidity of the air in the enclosure 21, thereby reducing the risk of corrosion of electronic components such as single boards; and, even in application scenarios with poor air quality, such as outdoors In the environment, due to the low relative humidity of the air in the case, the highly corrosive substances such as sodium chloride and potassium chloride entering the case will not be deliquescence and will not cause corrosion to electronic components.
  • the electronic device housing 10 may be a hexahedron structure, including a top plate 101, a bottom plate 102, a first side plate 103, a second side plate 104, a third side plate 105, and a fourth side plate (not shown in the figure). (Shown), where the top plate 101 is opposite to the bottom plate 102, the first side plate 103 is opposite to the fourth side plate, and the second side plate 104 is opposite to the third side plate 105.
  • the second side plate 104 can be arranged opposite to the side panel on the chassis where the air inlet is provided, and the third side panel 105 is opposite to the side panel on the chassis where the air outlet is provided. Relative panel setting.
  • the above-mentioned first air inlet window 11 and the first air outlet window 12 may be respectively arranged on the first side plate 103, and when specifically arranged, the first air inlet window 11 is located on the first side plate 103 On the side close to the second side plate 104, the first air outlet window 12 is located on the side of the first side plate 103 close to the third side plate 105. It is understandable that the first air inlet window 11 and the first air outlet window 12 may also be respectively arranged on the fourth side panel. When specifically arranged, the first air inlet window 11 is located on the fourth side panel and is close to the second side panel 104. The first air outlet window 12 is located on the side of the fourth side panel close to the third side panel 105.
  • both the third side plate 105 and the fourth side plate may be provided with the first air inlet window 11 and the first air outlet window 12, so that Increase the air inlet and outlet paths to improve heat dissipation efficiency.
  • first air inlet window 11 and the first air outlet window 12 are respectively arranged on the first side plate 103 as an example, the structure of the first side plate 103 and the arrangement of the air inlet channel, the air outlet channel, and the return air channel will be described in detail. form.
  • the air inlet channel 30 may be composed of two parts, respectively, the first part formed between the area of the first side plate 103 near the second side plate 104 and the panel of the chassis 21 31, and the second part 32 formed between the second side plate 103 and the panel of the chassis 21;
  • the air outlet channel 40 can also be composed of two parts, which are the area of the first side plate 103 close to the third side plate 103 and the chassis
  • the third part 41 formed between the panels of 21, and the fourth part 42 formed between the third side plate 105 and the panel of the chassis 21;
  • the return air channel 50 is also formed between the first side plate 105 and the panel of the chassis 21
  • the return air passage 50 is located between the first part 31 and the third part 41, and communicates with the first part 31 and the third part 41 respectively. In this way, the difficulty of setting the return air passage 50 can be reduced, and the housing of the electronic device can be simplified. 10's structure.
  • the temperature of the hot return air near the top plate 101 in the return air duct 50 is generally higher than the temperature of the hot return air near the bottom plate 102, in order to prevent the hot return air in the return air duct 50 from entering the air inlet duct 30 After that, the temperature of the upper and lower parts of the mixed air formed by mixing with fresh air is not balanced, which affects the effect of adjusting the relative humidity of the air in the cabinet.
  • the inner wall of the side wall 105 may be provided with a baffle 13, which is arranged obliquely to the bottom plate, and specifically may be located between the first air inlet window 11 and the first air outlet window 12, at this time, the air inlet channel and the air outlet channel are respectively Located on both sides of the baffle, the gap between the baffle and the bottom plate can be formed as a part of the return air channel.
  • a baffle 13 which is arranged obliquely to the bottom plate, and specifically may be located between the first air inlet window 11 and the first air outlet window 12, at this time, the air inlet channel and the air outlet channel are respectively Located on both sides of the baffle, the gap between the baffle and the bottom plate can be formed as a part of the return air channel.
  • the hot return air located on the side of the baffle close to the air outlet duct 40 mainly enters the side close to the air inlet duct 30 through the gap between the baffle 13 and the bottom plate 102, so that even in the The hot return air near the air inlet channel 30 still has the phenomenon of hot air rising, but because the gap between the lower baffle 13 and the bottom plate 102 continuously supplies hot return air, the lower hot return air is relatively more sufficient. Therefore, after entering the air inlet channel 30 to mix with the fresh air, a mixed air with a more balanced temperature can be obtained.
  • the oblique arrangement of the baffle and the bottom plate in the embodiment of the present application includes but is not limited to the vertical setting of the baffle and the bottom plate.
  • the baffle and the bottom plate are not parallel, so that the hot return air on the side of the baffle near the air outlet channel 40 mainly passes through the baffle 13
  • the gap between the bottom plate 102 and the bottom plate 102 enters the side close to the air inlet channel 30, so that the hot return air at the lower part is relatively more sufficient. Therefore, after entering the air inlet channel 30 and mixed with the fresh air, a mixed air with a more balanced temperature can be obtained.
  • the baffle 13 may include a first end, a second end, a third end, and a fourth end.
  • the first end is opposite to the second end, and the third end is the baffle 13 close to the top plate 101.
  • the fourth end is the end of the baffle 13 close to the bottom plate 102.
  • the baffle 13 is not limited.
  • the baffle 13 is specifically a straight plate structure, and the baffle 13 and the top plate 101 can be arranged orthogonally, or, as shown in FIG. 4, It can also be inclined toward one side of the air inlet channel 30, that is, the angle between the side of the baffle 13 close to the air inlet channel 30 and the top plate 101 is an acute angle.
  • the third end of the baffle 13 can be connected to the top plate 101, so that the hot return air from the side of the baffle 13 close to the air outlet channel 30 can only enter the side close to the air inlet channel 30 through the gap between the baffle 13 and the bottom plate 102 , To improve the temperature balance of the mixed air formed in the air inlet channel 30.
  • the baffle 13 is specifically a straight plate structure. As shown in FIG. 4, it can also be inclined to one side of the air inlet channel 30, that is, the baffle 13 is close to the air inlet channel 30.
  • the angle between the side of and the top plate 101 is an acute angle.
  • the third end of the baffle 13 and the top plate 101 are spaced apart, and the fourth end and the bottom plate 102 are spaced apart.
  • the electronic device housing 10 can also be provided with a guide member 14 which can be specifically arranged in the return air channel 50, and the guide member 14 can pass the hot return air through the baffle
  • the gap between the bottom plate and the bottom plate guides the air inlet channel 30 to ensure that the hot return air can enter the air inlet channel 30 more regularly and efficiently, and the efficiency of forming mixed air is improved.
  • the guide member 14 may include a plurality of guide plates 141 arranged in parallel, and the plurality of guide plates 141 may be fixed to the first at intervals.
  • the inner wall of the three-side plate 105 so that the first guide groove 14 can be formed between the two adjacent guide plates 141.
  • the number of the first diversion grooves 142 can be set according to the specific application scenarios of the electronic device components. For example, when the ambient temperature of the application scenario is relatively high, the number of the diversion grooves 142 can be relatively small. When the ambient temperature is relatively low, the number of diversion grooves 142 can be relatively large.
  • the number of the baffle 13 can be multiple, and the multiple baffles 13 can be fixed at intervals.
  • the third end of the two is away from the top plate 101 in turn, so that the second diversion groove 131 of the return air channel 50 can be formed between the two adjacent baffles 13, and it can be seen that the second diversion groove 131 and the air outlet channel
  • the connected end of the air outlet channel 40 is set close to the top plate 101, and the end connected to the second diversion groove 131 and the air inlet channel 30 is set close to the bottom plate 102, so that the hot return air of the air outlet channel 40 can be regularly guided to the air inlet channel 30 close to the bottom plate 102.
  • the lower area is beneficial to make the temperature of the mixed air formed in the air inlet channel 30 more balanced.
  • a plurality of baffles 13 are spaced apart from the top plate 101, and the third end of each baffle 13 is sequentially away from the top plate 101, so that a return air channel can be formed between two adjacent baffles 13 50 of the second diversion slot 131.
  • the above-mentioned baffle may also adopt a bent plate structure.
  • the specific structure of the bent plate is not limited.
  • it may be a composite plate formed by connecting a plurality of straight plates, an arc-shaped plate, or a straight plate. Combined board formed by connecting with curved board, etc.
  • the number of baffles can be one or more. As shown in FIGS. 3 and 6, when the number of baffles 13 is one, the third end of the baffle 13 can be connected to the top plate 101. The fourth end of the baffle 13 can be bent toward one side of the air inlet duct 30.
  • the hot return air from the side of the baffle 13 close to the air outlet 40 can only enter the approaching area through the gap between the baffle 13 and the bottom plate 102.
  • the baffle 13 can also play a role of diversion and guide the hot return air into the air.
  • the wind channel 30 is close to the lower area of the bottom plate 102.
  • the third end of the baffle 13 and the top plate 101 are spaced apart, and the fourth end and the bottom plate 102 are spaced apart.
  • the multiple baffles 13 can be fixed to the inner wall of the first side plate 103 at intervals, and when specifically arranged, the closest to the plurality of baffles 13
  • the baffle 13 of the top plate 101, the third end of the baffle 13 can be connected to the top plate 101, and the third ends of the remaining baffles 13 are sequentially away from the top plate 101, so that it can be placed between two adjacent baffles 13
  • the second diversion groove 131 of the return air passage 50 is formed.
  • the end of the second diversion groove 131 that communicates with the air outlet channel 40 is set close to the top plate 101, and the end of the second diversion groove 131 that communicates with the air inlet channel 30 is set close to the bottom plate 102, so that the heat of the air outlet channel 40 can be removed.
  • the return air is regularly guided to the lower area of the air inlet channel 30 close to the bottom plate 102, which is beneficial to make the temperature of the mixed air formed in the air inlet channel 30 more balanced.
  • the third ends of the plurality of baffles 13 are spaced apart from the top plate 101, and the third ends of each baffle 13 are sequentially away from the top plate 101.
  • the embodiment shown in FIG. 7 is a baffle 13 with an obtuse angle structure formed by a combination of two straight plates.
  • the straight plate close to the bottom plate 102 is inclined to one side of the air inlet channel, and the straight plate close to the top plate 101 can be connected to
  • the top plate 101 is arranged orthogonally, or can also be arranged obliquely toward one side of the air inlet channel as shown in FIG. 8, which is not limited in this application.
  • the straight plate close to the top plate 101 may be connected to the top plate 101 or may be spaced apart from the top plate 101.
  • the baffle 13 may also be an arc-shaped plate as shown in FIGS. 9 and 10.
  • the baffle 13 may be directed toward the air inlet channel as shown in FIG.
  • the side bulge may also bulge toward the side of the air outlet channel as shown in FIG. 10, which is also not limited in this application.
  • the number of arc-shaped plates can also be one, and one arc-shaped plate can be connected to the top plate 101 or can be spaced apart from the top plate 101.
  • the fourth side panel can adopt a structural design symmetrical to the first side panel 103, and there will be no more Go into details.
  • the air inlet temperature of the air inlet of the chassis can be increased by about 3°C, which can eliminate the closeness of the air inlet in the chassis.
  • the cold air area in the air vent area reduces the relative humidity of the air in the chassis to below 60%, reducing the risk of corrosion of electronic components such as single boards.
  • a second air inlet window 15 may be further provided on the side of the top plate 101 close to the second side plate 104, and the second air inlet window 15 may be communicated with the air inlet channel.
  • the external fresh air can enter the air inlet channel through the first air inlet window 11 and the second air inlet window 15 together, so that the air inlet path can be increased; similarly, the top plate 101 can also be provided on the side close to the third side plate 105
  • the second air outlet window 16 can communicate with the air outlet channel, so that the hot air in the air outlet channel can be discharged to the outside through the first air outlet window 12 and the second air outlet window 16 together, Thereby, the air outlet path can be increased.
  • a third air inlet window 17 may be provided on the second side plate 104.
  • the third air inlet window 17 is also in communication with the air inlet channel, and when installed, the third air inlet window 17 Specifically, it may be a switch window.
  • the electronic device component can be applied to different scenarios. Specifically, when the third air inlet window 17 is in the open state, the electronic device assembly can be applied to a scene with good air quality and relatively sufficient cooling air.
  • the opening of the third air inlet window 17 can increase the air inlet path.
  • the temperature of the fresh air in the air inlet channel is relatively low, and the proportion of the hot return air is relatively small.
  • the fans of electronic equipment can meet the heat dissipation requirements even at low speeds, so the noise generated is also small.
  • the outside air is relatively clean, There are also relatively few highly corrosive substances entering the case, which is less corrosive to electronic components; when the third air inlet window 17 is closed, the electronic device components can be used in scenes with poor air quality, such as outdoors Environment, at this time, the proportion of hot return air in the air inlet channel is relatively increased, so that the air inlet temperature of the air inlet into the chassis is increased slightly, thereby reducing the relative humidity of the air in the chassis, that is, it is also possible in this scenario Reduce the risk of corrosion of electronic components. Therefore, the electronic device housing and the electronic device provided in the embodiments of the present application can be used in an outdoor environment.
  • the specific structure of the third air inlet window 17 is not limited.
  • it may be a revolving door pivotally mounted on the first side panel through a hinge, or the third air inlet window 17 may also be a rotating shutter, etc. Wait.
  • the inner wall of the electronic device housing 10 can be provided with sound-absorbing cotton, so that the noise generated by the electronic device during operation can be isolated inside the electronic device housing 10 by the sound-absorbing cotton.
  • the specific type of sound-absorbing cotton is not limited. For example, it can be glass fiber sound-absorbing cotton or polyester fiber sound-absorbing cotton.
  • the sound-absorbing cotton can be combined with the electronic device cover 10 through viscose.
  • the inner wall is glued and fixed to ensure the reliability of the connection between the two.
  • each of the aforementioned air inlet windows and outlet windows may be shutters.
  • the blades 111 of the first air inlet window 11 may be In order to bend the blade, the blade 111 includes a first bending portion 112 and a second bending portion 113.
  • the first bending portion 111 is disposed close to the inside of the housing of the electronic device relative to the second bending portion 113, and the first bending portion 112
  • the angle between the second bending portion 113 and the second bending portion 113 is less than 180 degrees.
  • the air inlet 114 formed between the two adjacent blades 111 is a bending hole, and the sound in the outer cover of the electronic device passes through When the air inlet 114 propagates outwards, it will undergo multiple reflections or refractions. During the multiple reflections or refractions, part of the sound energy will be absorbed by the air, which can reduce the sound that is finally transmitted to the outside of the electronic device housing. Further noise reduction.
  • the noise can be reduced by about 3 decibels, making the electronic equipment meet the 55 decibel noise standard of office scenes.
  • each air inlet window and air outlet window may also adopt a labyrinth shutter to reduce noise.
  • the structure of the labyrinth shutter may be similar to that in the prior art, and this application will not be repeated here.
  • the electronic device enclosure provided by the embodiments of the present application is provided with a return air channel to return part of the hot air to the air inlet channel, which can slightly increase the inlet air temperature of the chassis without affecting the heat dissipation performance of the electronic device, thereby It can eliminate the cold air zone in the chassis near the air inlet area, reduce the relative humidity of the air in the chassis, and thereby reduce the risk of corrosion of electronic components such as single boards.
  • an embodiment of the present application also provides an electronic device component, which includes an electronic device 20 and the electronic device housing 10 in any of the foregoing embodiments, wherein the electronic device 20 may be a prior art
  • the electronic equipment can be set in the electronic equipment housing 10, and the electronic equipment housing 10 can reduce the internal temperature of the electronic equipment 20 by adjusting the air inlet temperature of the electronic equipment.
  • the relative humidity can reduce the risk of corrosion of electronic components inside the electronic device 20 and improve the corrosion resistance of the electronic device.

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Abstract

本申请提供了一种电子设备外罩及电子设备组件，用以在不影响电子设备的散热性能的前提下，提高电子设备的防腐蚀性能。电子设备外罩用于容置电子设备，电子设备外罩上设置有第一进风窗和第一出风窗，第一进风窗用于与电子设备的进风口连通形成进风通道，第一出风窗用于与电子设备的出风口连通形成出风通道；电子设备外罩内具有回风通道，回风通道用于将出风通道与进风通道连通。

Description

一种电子设备外罩及电子设备组件
相关申请的交叉引用
本申请要求在2020年01月23日提交中国专利局、申请号为202010076923.0、申请名称为“一种罩体及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中；本申请要求在2020年02月12日提交中国专利局、申请号为202010089378.9、申请名称为“一种电子设备外罩及电子设备组件”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及信息技术领域，尤其涉及到一种电子设备外罩及电子设备组件。
背景技术
随着信息技术的快速发展，电子设备在高温且空气质量较差的边缘场景中的应用越来越广泛，为了适应边缘场景相对恶劣的环境，电子设备的防尘、散热及耐腐蚀性等性能成为影响其市场竞争力的关键因素。现有技术中，电子设备一般通过在其机箱的进风口设置防尘网来进行防尘，这种方案尽管可以达到比较好的防尘效果，但是防尘网的设置会增加散热风阻，影响电子设备的散热性能，并且防尘网也容易被灰尘堵塞，需要定期清理维护，如若维护不及时，就不可避免地会有灰尘进入机箱内部，灰尘中的有害杂质附着在单板上后，在一定的湿度条件下就会发生潮解，对单板产生腐蚀作用；此外，电子设备在运行过程中，其内部的诸如单板等电子部件也较易受到环境的温湿度影响而自身发生腐蚀，影响电子设备的性能。
发明内容
本申请提供了一种电子设备外罩及电子设备组件，用以在不影响电子设备的散热性能的前提下，提高电子设备的防腐蚀性能。
第一方面，本申请提供了一种电子设备外罩，该电子设备外罩可用于容置电子设备。电子设备外罩上设置有第一进风窗和第一出风窗，其中，第一进风窗可用于与电子设备的进风口连通形成进风通道，第一出风窗可用于与电子设备的出风口连通形成出风通道；此外，电子设备外罩内还具有回风通道，该回风通道可用于将出风通道与进风通道连通，以使出风通道的部分热回风可进入进风通道。
在上述方案中，通过设置回风通道将部分热风回流至进风通道，可在不影响电子设备的散热性能的前提下，小幅度提高机箱的进风温度，从而可消除机箱内靠近进风口区域的冷风区，降低机箱内空气的相对湿度，进而可以减小单板等电子部件发生腐蚀的风险。
具体设置时，电子设备外罩可包括顶板、第一侧板和底板，其中，第一侧板连接于顶板与底板之间；第一侧板的内壁设置有挡板，该挡板与底板倾斜设置，进风通道与出风通道分别位于挡板的两侧，挡板与底板之间的间隙可形成为回风通道的一部分。这样，在回风通道内，挡板靠近出风通道侧的热回风主要通过挡板与底板之间的间隙进入靠近进风通 道侧，从而供向进风通道内下部区域的热回风相对更加充足，有利于使形成于进风通道内的混风的温度更加均衡。
第一进风窗与第一出风窗的具体设置位置不限，在一个可能的实施方案中，第一进风窗与第一出风窗可分别设置于第一侧板上，这时，回风通道即形成于第一侧板与电子设备的面板之间，从而可以降低回风通道的设置难度，简化电子设备外罩的结构。
在一个具体的实施方案中，挡板位于第一进风窗与第一出风窗之间。
具体设置挡板时，挡板可包括第一端、第二端、第三端和第四端，其中，第一端与第二端位置相对，第三端为挡板靠近顶板的一端，第四端为挡板靠近底板的一端，当电子设备设置于电子设备外罩内时，第一端可与机箱的面板抵接，第二端与第一侧板连接，第三端与顶板之间可连接设置或者间隔设置，第四端与底板之间间隔设置。
挡板的具体结构形式不限，在一个具体的实施方案中，挡板可以为直板结构，挡板与顶板之间可以正交设置，或者，挡板也可以朝向进风通道的一侧倾斜设置，即挡板靠近进风通道的一面与顶板之间的夹角为锐角。
具体实施时，挡板的第三端可与顶板连接，这样在回风通道内，挡板靠近出风通道侧的热回风只能通过挡板与底板之间的间隙进入靠近进风通道侧，提高进风通道内形成的混风的温度的均衡度；此外，电子设备外罩内还设置有导流构件，该导流构件具体可设置于回风通道内，用于将热回风经过挡板与底板之间的间隙导向进风通道，使热回风可以更加规律且高效地进入进风通道内，提高形成混风的效率。
导流构件的具体结构形式不限，例如在一个具体的实施方案中，导流构件包括多个导流板，该多个导流板可间隔设置于第一侧板的内壁，这样在相邻的两个导流板之间就可形成第一导流槽。
当挡板靠近进风通道的一面与顶板之间的夹角为锐角时，挡板的数量可以为多个，该多各挡板可间隔设置于第一侧板的内壁，且多个挡板的第三端依次远离顶板，这样在相邻的两个挡板之间就可形成回风通道的第二导流槽，第二导流槽与进风通道连通的一端靠近底板设置，从而可以将出风通道的热回风规律地导向进风通道靠近底板的下部区域，有利于使进风通道内形成的混风的温度更加均衡。
在另一个具体的实施方案中，挡板还可以采用弯板结构，这时挡板的数量为一个或者多个。当挡板的数量为一个时，挡板的第三端可与顶板连接设置，挡板的第四端则可朝向进风通道的一侧弯曲，此时，挡板靠近出风通道侧的热回风只能通过挡板与底板之间的间隙进入靠近进风通道侧，以提高进风通道内形成的混风的温度的均衡度；此外，利用挡板的弯曲形状还可以起到导流作用，以将热回风导向进风通道靠近底板的下部区域。
当挡板的数量为多个时，多个挡板间隔设置于第一侧板的内壁，且多个挡板的第三端依次远离顶板，这样在相邻的两个挡板就可形成回风通道的第二导流槽，该第二导流槽与进风通道连通的一端靠近底板设置，从而可以将出风通道的热回风规律地导向进风通道靠近底板的下部区域，有利于使进风通道内形成的混风的温度更加均衡。
在采用弯板结构时，挡板具体可以为弧形板、多个直板连接形成的组合板、或者直板与弧形板连接形成的组合板等结构形式。
在一个可能的实施方案中，所述电子设备外罩的内壁设置有吸音棉，这样，电子设备在工作时产生的噪声就可通过吸音棉隔绝在电子设备外罩内部。
在将吸音棉设置于电子设备外罩的内壁时，具体可通过粘胶将吸音棉与电子设备外罩 的内壁粘接固定，以保证两者的连接牢靠性。
第一进风窗与第一出风窗可分别为百叶窗，百叶窗的叶片具体可以为折弯叶片，叶片包括第一折弯部和第二折弯部，第一折弯部相对第二折弯部靠近电子设备外罩的内部设置，且第一折弯部和第二折弯部之间的夹角小于180度，采用这种设计，相邻的两个叶片之间所形成的进风孔为折弯孔，电子设备外罩内的声音在通过进风孔向外传播时，会经过多次反射或折射，在多次反射或折射的过程中部分声能会被空气吸收，这样就可以减小最后传播到电子设备外罩外部的声音，实现进一步的降噪。
在一个可能的实施方案中，电子设备包括机箱，进风口与出风口分别开设于机箱的位置相对的两侧面板上；电子设备外罩还包括位置相对的第二侧板与第三侧板，第二侧板与第三侧板分别连接于第一侧板的两侧，且第二侧板与机箱上设置有进风口的一侧面板相对设置。
采用上述方案，进风通道可由两部分组成，分别为由第一侧板靠近第二侧板的区域与机箱的面板之间形成的第一部分，以及第二侧板与机箱的面板之间形成的第二部分；出风通道也可由两部分组成，分别为由第一侧板靠近第三侧板的区域与机箱的面板之间形成的第三部分，以及第三侧板与机箱的面板之间形成的第四部分。
在一个可能的实施方案中，顶板靠近第二侧板的一侧设置有第二进风窗，该第二进风窗与进风通道连通；顶板靠近第三侧板的一侧设置有第二出风窗，该第二出风窗与出风通道连通，这样可以增加进风与出风路径，有利于提高电子设备的散热效率。
在一个可能的实施方案中，第二侧板上设置有第三进风窗，第三进风窗与进风通道连通，且第三进风窗为开关窗，通过调整第三进风窗的开启或者关闭状态，可以使电子设备组件应用于不同的场景中。
在一个可能的实施方案中，所述电子设备外罩可以用于户外环境。由于电子设备内空气的相对湿度较低，即使外界的氯化钠和氯化钾等高腐蚀性物质进入电子设备内，也不会发生潮解，因此不会对电子部件产生腐蚀作用。
第二方面，本申请还提供了一种电子设备组件，该电子设备组件包括电子设备以及前述任一可能的实施方案中的电子设备外罩，该电子设备可设置于电子设备外罩内，电子设备外罩可通过调节电子设备的进风温度来降低电子设备内部的相对湿度，从而可以减小电子设备内部电子部件发生腐蚀的风险，提高电子设备的防腐蚀性能。
在一个可能的实施方案中，所述电子设备为服务器。
在一个可能的实施方案中，所述电子设备为网络设备。
在一个可能的实施方案中，所述电子设备为存储设备。
在一个可能的实施方案中，所述电子设备为可用于户外环境的电子设备。
附图说明
图1为本申请实施例提供的电子设备组件的局部结构示意图；
图2为本申请实施例提供的电子设备外罩的局部结构示意图；
图3为本申请实施例提供的电子设备外罩内部的气流流动方向示意图；
图4为本申请一实施例提供的第一侧板局部结构示意图；
图5为本申请另一实施例提供的第一侧板局部结构示意图；
图6为本申请又一实施例提供的第一侧板局部结构示意图；
图7为本申请又一实施例提供的第一侧板局部结构示意图；
图8为本申请又一实施例提供的第一侧板局部结构示意图；
图9为本申请又一实施例提供的第一侧板局部结构示意图；
图10为本申请又一实施例提供的第一侧板局部结构示意图；
图11为本申请实施例提供的第一进风窗的局部结构示意图。
附图标记：
10-电子设备外罩；20-电子设备；21-机箱；22-进风口；23-出风口；11-第一进风窗；
12-第一出风窗；101-顶板；102-底板；103-第一侧板；104-第二侧板；105-第三侧板；
30-进风通道；31-第一部分；32-第二部分；40-出风通道；41-第三部分；42-第四部分；
50-回风通道；13-挡板；14-导流构件；141-导流板；142-第一导流槽；
131-第二导流槽；15-第二进风窗；16-第二出风窗；17-第三进风窗；111-第三进风窗；
112-第一折弯部；113-第二折弯部；114-进风孔。
具体实施方式
为了使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请作进一步地详细描述。
为了方便理解本申请实施例提供的电子设备外罩，下面首先说明一下其应用场景。本申请实施例提供的摄像头模组可用于容置电子设备，其中，电子设备可以为现有技术中的服务器、通讯设备、网络设备、存储设备或者路由器、交换机等设备。随着互联网技术和5G技术的快速发展，电子设备在环境相对恶劣的边缘场景的应用越来越广泛，为了适应边缘场景的高温、空气质量较差以及低噪声要求等条件，电子设备的散热、防尘、降噪以及耐腐蚀等特性也需要不断提高。现有技术中，一般通过在电子设备的机箱的进风口设置防尘网来进行防尘，这种方案的优势是防尘效果比较好，弊端在于防尘网的设置会增加散热风阻，影响电子设备的散热性能，并且防尘网也容易被灰尘堵塞，需要定期清理维护，如若维护不及时，就会有灰尘进入到机箱内部，当灰尘中具有腐蚀性的有害杂质附着在单板上后，在一定的湿度条件下会发生潮解，对单板产生腐蚀作用，严重时甚至会导致单板发生短路现象；此外，电子设备在运行过程中，其内部的诸如单板等电子部件也较易受到环境的温湿度影响而自身发生腐蚀，影响电子设备的性能。
基于此，本申请提供了一种电子设备外罩及应用该电子设备外罩的电子设备组件，该电子设备外罩可以在不影响电子设备的散热性能的前提下，提高电子设备的防腐蚀性能。
参考图1所示，本申请实施例提供的电子设备外罩10可用于容置电子设备20，电子设备20可包括机箱21以及设置于机箱21内的单板、风扇等部件，其中，机箱21上开设有进风口22和出风口23，具体设置时，进风口22和出风口23可开设于机箱21的位置相对的两侧面板上，风扇的进风侧可朝向进风口22设置，风扇的出风侧则朝向出风口23设置，从而可使机箱21外部的冷风在风扇的吸风作用下由进风口22进入机箱21内，进入机箱21内的冷风在与电子部件换热后升温，之后通过风扇的排风作用由出风口23排出机箱21，实现对电子设备20的散热。
需要说明的是，机箱21内空气的相对湿度是影响相关电子部件发生腐蚀的重要指标，以单板为例，单板上的布线多为金属铜材质，而铜在空气中发生腐蚀的相对湿度临界值为60％，当在相对湿度在该临界值以上的环境中，铜的腐蚀速度会随着相对湿度值的增加而 不断加速；以及，单板表面的绝缘电阻的阻值也会随着相对湿度的增加呈现下降趋势，相对湿度在60％～65％是绝缘电阻的阻值下降的拐点所在。此外，相对湿度在60％以下时，空气中的氯化钠和氯化钾等高腐蚀性物质也不会发生潮解，不会对电子部件产生腐蚀作用。
因此，通过控制机箱21内空气的相对湿度，可达到减小单板发生腐蚀的风险的目的。可以理解的，在绝对湿度不变时，温度越高相对湿度也就越低，基于此原理，可在不影响电子设备20的正常散热的情况下，通过小幅度提升机箱21的进风温度来降低相对湿度，本申请实施例即是通过设置电子设备外罩10来提高机箱21的进风温度。
具体实施时，请一并参考图2所示，电子设备外罩10上设置有第一进风窗11和第一出风窗12，其中，第一进风窗11可用于与机箱21的进风口22连通，并在两者间形成进风通道，第一出风窗12可用于与机箱21的出风口23连通，并在两者间形成出风通道。在对电子设备20进行散热时，电子设备外罩10外部的新风可通过第一进风窗11进入电子设备外罩10内部，流经进风通道并由进风口22送入机箱21内，在与机箱21内的电子部件换热后，通过出风口23排出机箱，流经出风通道并可由第一出风窗12排出至电子设备外罩10外部，完成一次换热循环。
电子设备外罩10内还具有回风通道，该回风通道可分别与出风通道以及进风通道连通，出风通道内的部分热风可通过回风通道进入进风通道，与通过第一进风窗11进入进风通道的新风混合，形成温度稍高于新风的混风，在风扇的作用下，混风由进风口22进入机箱21内，实现进风口22的进风温度的提高，从而可消除机箱21内靠近进风口22区域的冷风区，降低机箱21内空气的相对湿度，进而可以减小单板等电子部件发生腐蚀的风险；并且，即使在空气质量较差的应用场景，例如户外环境，由于机箱内空气的相对湿度较低，进入机箱内的氯化钠和氯化钾等高腐蚀性物质也不会发生潮解，不会对电子部件产生腐蚀作用。
继续参考图2所示，电子设备外罩10具体可以为六面体结构，包括顶板101、底板102、第一侧板103、第二侧板104、第三侧板105和第四侧板(图中未示出)，其中，顶板101与底板102位置相对，第一侧板103与第四侧板位置相对，第二侧板104与第三侧板105位置相对。在将电子设备设置于该电子设备外罩10内时，第二侧板104可与机箱上设置有进风口的一侧面板相对设置，第三侧板105则与机箱上设置有出风口的一侧面板相对设置。
在本申请实施例中，上述第一进风窗11和第一出风窗12可分别设置于第一侧板103上，并且具体设置时，第一进风窗11位于第一侧板103上靠近第二侧板104的一侧，第一出风窗12位于第一侧板103上靠近第三侧板105的一侧。可以理解的，第一进风窗11和第一出风窗12也可分别设置于第四侧板上，具体设置时，第一进风窗11位于第四侧板上靠近第二侧板104的一侧，第一出风窗12位于第四侧板上靠近第三侧板105的一侧。当然，为了提高对电子设备的散热效果，在本申请的其它实施例中，第三侧板105与第四侧板上均可设置上述第一进风窗11和第一出风窗12，从而增加进风与出风路径，提升散热效率。
下面以第一进风窗11与第一出风窗12分别设置在第一侧板103时为例，具体说明第一侧板103的结构以及进风通道、出风通道、回风通道的设置形式。
请结合图3所示，在本申请实施例中，进风通道30可由两部分组成，分别为由第一侧板103靠近第二侧板104的区域与机箱21的面板之间形成的第一部分31，以及第二侧 板103与机箱21的面板之间形成的第二部分32；出风通道40也可由两部分组成，分别为由第一侧板103靠近第三侧板103的区域与机箱21的面板之间形成的第三部分41，以及第三侧板105与机箱21的面板之间形成的第四部分42；回风通道50同样形成于第一侧板105与机箱21的面板之间，该回风通道50位于第一部分31与第三部分41之间，并分别与第一部分31和第三部分41连通，采用这种方式可以降低回风通道50的设置难度，简化电子设备外罩10的结构。
由于热空气会上升，因此回风通道50内靠近顶板101的热回风温度一般要高于靠近底板102的热回风温度，为避免回风通道50内的热回风在进入进风通道30后，与新风混合后形成的混风上部与下部的温度不均衡，影响对机箱内空气的相对湿度的调节效果，在本申请实施例中，一并参考图2和图3所示，第三侧壁105的内壁可设置有挡板13，该挡板13与底板倾斜设置，具体可位于第一进风窗11与第一出风窗12之间，此时进风通道与出风通道分别位于挡板的两侧，挡板与底板之间的间隙即可形成为回风通道的一部分。通过设置挡板13，在回风通道50内，位于挡板靠近出风通道40侧的热回风主要通过挡板13与底板102之间的间隙进入靠近进风通道30侧，这样，即使在靠近进风通道30侧的热回风依然存在热空气上升的现象，但是由于下部挡板13与底板102之间的间隙在源源不断地供应热回风，使下部的热回风相对更加充足，因此在进入进风通道30与新风混合后，可以获得温度较为均衡的混风。
本申请实施例中挡板与底板倾斜设置包含但不限于挡板与底板垂直设置，具体是指挡板与底板不平行，从而挡板靠近出风通道40侧的热回风主要通过挡板13与底板102之间的间隙进入靠近进风通道30侧，使下部的热回风相对更加充足，因此在进入进风通道30与新风混合后，可以获得温度较为均衡的混风。
具体设置挡板时13，挡板13可包括第一端、第二端、第三端和第四端，其中，第一端与第二端位置相对，第三端为挡板13靠近顶板101的一端，第四端为挡板13靠近底板102的一端，当电子设备设置于电子设备外罩10内时，第一端可与机箱的面板抵接，第二端与第一侧板连接，第三端与顶板101之间可连接设置或者间隔设置，第四端与底板102之间间隔设置。
挡板13的具体结构形式不限，在本申请的一个具体实施例中，该挡板13具体为直板结构，挡板13与顶板101之间可以正交设置，或者，结合图4所示，也可以使其朝向进风通道30的一侧倾斜设置，即挡板13靠近进风通道30的一面与顶板101之间的夹角为锐角。这时，挡板13的第三端可与顶板101连接，使挡板13靠近出风通道30侧的热回风只能通过挡板13与底板102之间的间隙进入靠近进风通道30侧，提高进风通道30内形成的混风的温度的均衡度。在本申请的另一个具体实施例中，该挡板13具体为直板结构，结合图4所示，也可以使其朝向进风通道30的一侧倾斜设置，即挡板13靠近进风通道30的一面与顶板101之间的夹角为锐角。但挡板13的第三端与顶板101之间间隔设置，第四端与底板102之间间隔设置。
参考图2和图3所示，电子设备外罩10内还可设置有导流构件14，该导流构件14具体可设置于回风通道50内，导流构件14可以将热回风经过挡板与底板之间的间隙导向进风通道30，保证热回风可以更加规律且高效地进入进风通道30内，提高形成混风的效率。
导流构件14的结构形式不限，例如在本申请的一个具体的实施例中，导流构件14可包括平行设置的多个导流板141，该多个导流板141可间隔固定于第三侧板105的内壁， 这样在相邻的两个导流板141之间就可形成第一导流槽14。具体实施时，第一导流槽142的数量可根据电子设备组件的具体应用场景设置，例如，当应用场景的环境温度相对较高时，导流槽142的数量可以相对较少，当应用场景的环境温度相对较低时，导流槽142的数量则可以相对较多。
请结合图3和图5所示，当挡板13的第四端朝向进风通道30的一侧倾斜设置时，挡板13的数量可以为多个，该多个挡板13可间隔固定于第一侧板103的内壁，且在具体设置时，对于多个挡板13中最靠近顶板101的挡板13，该挡板13的第三端可与顶板101连接设置，其余各挡板13的第三端依次远离顶板101，这样在相邻的两个挡板13之间就可形成回风通道50的第二导流槽131，可以看出，第二导流槽131与出风通道40连通的一端靠近顶板101设置，第二导流槽131与进风通道30连通的一端靠近底板102设置，从而可以将出风通道40的热回风规律地导向进风通道30靠近底板102的下部区域，有利于使进风通道30内形成的混风的温度更加均衡。另一种实现中，多个挡板13均与顶板101间隔设置，并且各挡板13的第三端依次远离顶板101，这样在相邻的两个挡板13之间就可形成回风通道50的第二导流槽131。
此外，在本申请的另外一些可能的实施例中，上述挡板还可以采用弯板结构，弯板的具体结构形式不限，例如可以为多个直板连接形成的组合板、弧形板或者直板与弧形板连接形成的组合板等。在采用弯板时，挡板的数量可以为一个或者多个，结合图3和图6所示，当挡板13的数量为一个时，挡板13的第三端可与顶板101连接设置，挡板13的第四端则可朝向进风通道30的一侧弯曲，此时，挡板13靠近出风通道40侧的热回风只能通过挡板13与底板102之间的间隙进入靠近进风通道30侧，以提高进风通道30内形成的混风的温度的均衡度；并且，依靠挡板13的弯曲形状，挡板13还可以起到导流作用，将热回风导向进风通道30靠近底板102的下部区域。另一种可能的实施例，挡板13的第三端与顶板101之间间隔设置，第四端与底板102之间间隔设置。
当挡板13的数量为多个时，参考图7所示，多个挡板13可间隔地固定于第一侧板103的内壁，且在具体设置时，对于多个挡板13中最靠近顶板101的挡板13，该挡板13的第三端可与顶板101连接设置，其余各挡板13的第三端依次远离顶板101，这样在相邻的两个挡板13之间就可形成回风通道50的第二导流槽131。类似的，第二导流槽131与出风通道40连通的一端靠近顶板101设置，第二导流槽131与进风通道30连通的一端靠近底板102设置，从而可以将出风通道40的热回风规律地导向进风通道30靠近底板102的下部区域，有利于使进风通道30内形成的混风的温度更加均衡。另一种可能的实施例，多个挡板13的第三端均与顶板101之间间隔设置，并且各挡板13的第三端依次远离顶板101。
图7所示的实施例为采用两个直板组合形成的钝角结构的挡板13，该两个直板中，靠近底板102的直板朝向进风通道的一侧倾斜设置，靠近顶板101的直板可与顶板101正交设置，或者也可以如图8中所示的朝向进风通道的一侧倾斜设置，本申请对此不做限制。此外，靠近顶板101的直板可与顶板101连接，也可以与顶板101间隔设置。
当然，在本申请的其它实施例中，挡板13还可以采用图9和图10中所示的弧形板，具体设置时，挡板13既可以如图9中所示的朝向进风通道侧凸出，也可以如图10中所示的朝向出风通道侧凸出，本申请同样对此不做限制。弧形板的数量也可以为一个，一个弧形板可以与顶板101连接，也可以与顶板101间隔设置。
可以理解的，当第一进风窗11和第一出风窗12分别设置于第四侧板时，第四侧板可 采用与第一侧板103对称的结构设计，此处不再过多赘述。
前述实施例中，通过回风通道50的设计，配合挡板13的均匀混风作用以及导流作用，可使机箱的进风口的进风温度提升3℃左右，这样即可消除机箱内靠近进风口区域的冷风区，将机箱内空气的相对湿度降低至60％以下，减小单板等电子部件发生腐蚀的风险。
参考图2所示，在本申请实施例中，顶板101靠近第二侧板104的一侧还可设置第二进风窗15，该第二进风窗15可与进风通道连通，这样，外部的新风可一并通过第一进风窗11和第二进风窗15进入进风通道内，从而可以增加进风路径；类似地，顶板101靠近第三侧板105的一侧还可设置第二出风窗16，该第二出风窗16可与出风通道连通，这样，出风通道内的热风可一并通过第一出风窗12和第二出风窗16排至外部，从而可以增加出风路径。
此外，继续参考图2所示，第二侧板104上可设置有第三进风窗17，该第三进风窗17同样与进风通道连通，且在设置时，第三进风窗17具体可以为开关窗，通过调整第三进风窗17的开启或者关闭状态，可以使电子设备组件应用于不同的场景中。具体来说，当第三进风窗17处于开启状态时，电子设备组件可应用于空气质量较好、冷气相对充足的场景中，第三进风窗17的开启可以增加进风路径，这时进风通道内新风的温度较低，并且热回风占比相对较小，电子设备的风扇即使低速运行也可满足散热需求，因此产生的噪声也较小，此外，由于外部空气较为洁净，因此进入机箱内的高腐蚀性物质也相对较少，对电子部件的腐蚀性较小；当第三进风窗17处于关闭状态时，电子设备组件可应用于空气质量较差的场景中，例如户外环境，这时进风通道内的热回风占比相对增加，使进入机箱内的进风口的进风温度小幅度升高，从而可以降低机箱内空气的相对湿度，即在该场景中同样可以减小电子部件发生腐蚀的风险。因此，本申请实施例提供的电子设备外罩和电子设备可以用于外户环境。
上述实施例中，第三进风窗17的具体结构形式不限，例如可以为通过铰链枢装于第一侧板上的旋转门，或者，第三进风窗17还可以为旋转百叶窗，等等。
为了降低电子设备对周围环境的噪声影响，电子设备外罩10的内壁可设置吸音棉，这样，电子设备在工作时产生的噪声就可通过吸音棉隔绝在电子设备外罩10内部。吸音棉的具体类型不限，例如可以为玻璃纤维吸音棉或者聚酯纤维吸音棉等，在将吸音棉设置于电子设备外罩10的内壁时，具体可通过粘胶将吸音棉与电子设备外罩10的内壁粘接固定，以保证两者的连接牢靠性。
需要说明的是，在设置吸音棉时，需避开电子设备外罩10上各个进风窗以及出风窗的位置，以保证电子设备外罩10进风与出风通畅。
此外，在本申请实施例中，前述各个进风窗与出风窗可分别为百叶窗，以第一进风窗11为例，参考图11所示，第一进风窗11的叶片111具体可以为折弯叶片，叶片111包括第一折弯部112和第二折弯部113，第一折弯部111相对第二折弯部113靠近电子设备外罩的内部设置，且第一折弯部112和第二折弯部113之间的夹角小于180度，采用这种设计，相邻的两个叶片111之间所形成的进风孔114为折弯孔，电子设备外罩内的声音在通过进风孔114向外传播时，会经过多次反射或折射，在多次反射或折射的过程中部分声能会被空气吸收，这样就可以减小最后传播到电子设备外罩外部的声音，实现进一步的降噪。实验表明，通过百叶窗的设计，配合电子设备外罩内壁粘贴的吸音棉，可实现降噪3分贝左右，使电子设备满足办公室场景的55分贝的噪声标准。
在一些其它的实施例中，各个进风窗与出风窗还可以采用迷宫式百叶窗来实现降噪，迷宫式百叶窗的结构可与现有技术中类似，本申请对此不再过多赘述。
另外值得一提的是，通过设置电子设备外罩，还可以使电子设备组件在办公室等非机柜场景实现立式安装，提高电子设备组件的外观高品质工业设计。
综上，本申请实施例提供的电子设备外罩，通过设置回风通道将部分热风回流至进风通道，可在不影响电子设备的散热性能的前提下，小幅度提高机箱的进风温度，从而可消除机箱内靠近进风口区域的冷风区，降低机箱内空气的相对湿度，进而可以减小单板等电子部件发生腐蚀的风险。
参考图1所示，本申请实施例还提供了一种电子设备组件，该电子设备组件包括电子设备20以及前述任一实施例中的电子设备外罩10，其中，电子设备20可以为现有技术中的服务器、通讯设备、网络设备、存储设备或者路由器、交换机等，该电子设备可设置于电子设备外罩10内，电子设备外罩10可通过调节电子设备的进风温度来降低电子设备20内部的相对湿度，从而可以减小电子设备20内部电子部件发生腐蚀的风险，提高电子设备的防腐蚀性能。
以上，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (22)

  1. 一种电子设备外罩，其特征在于，所述电子设备外罩用于容置电子设备；
    所述电子设备外罩上设置有第一进风窗和第一出风窗，所述第一进风窗用于与所述电子设备的进风口连通形成进风通道，所述第一出风窗用于与所述电子设备的出风口连通形成出风通道；
    所述电子设备外罩内具有回风通道，所述回风通道用于将所述出风通道与所述进风通道连通。
  2. 如权利要求1所述的电子设备外罩，其特征在于，所述电子设备外罩还包括顶板、第一侧板和底板，所述第一侧板连接所述顶板和所述底板；
    所述第一侧板的内壁设置有挡板，所述挡板与所述底板倾斜设置；
    所述进风通道与所述出风通道分别位于所述挡板的两侧，所述挡板与所述底板之间的间隙形成所述回风通道的一部分。
  3. 如权利要求2所述的电子设备外罩，其特征在于，所述第一进风窗与所述第一出风窗设置于所述第一侧板上。
  4. 如权利要求3所述的电子设备外罩，其特征在于，所述挡板位于所述第一进风窗与所述第一出风窗之间。
  5. 根据权利要求2～4任一项所述的电子设备外罩，其特征在于，所述挡板的第一端用于与所述电子设备抵接，所述挡板的第二端与所述第一侧板连接，所述挡板的第三端与所述顶板连接或者间隔设置，所述挡板的第四端与所述底板间隔设置；
    其中，所述第一端与所述第二端位置相对，所述第三端为所述挡板靠近所述顶板的一端，所述第四端为所述挡板靠近所述底板的一端。
  6. 如权利要求5所述的电子设备外罩，其特征在于，所述挡板为直板结构，所述挡板与所述顶板正交设置；或者，所述挡板靠近所述进风通道的一面与所述顶板之间的夹角为锐角。
  7. 如权利要求6所述的电子设备外罩，其特征在于，所述第三端与所述顶板连接；
    所述电子设备外罩内设置有导流构件，所述导流构件设置于所述回风通道，用于将出风通道的部分回风经过所述挡板与所述底板之间的间隙导向所述进风通道。
  8. 如权利要求7所述的电子设备外罩，其特征在于，所述导流构件包括多个导流板，多个所述导流板间隔设置于所述第一侧板的内壁，相邻的两个所述导流板形成第一导流槽。
  9. 如权利要求6所述的电子设备外罩，其特征在于，当所述挡板靠近所述进风通道的一面与所述顶板之间的夹角为锐角时，
    所述挡板的数量为多个，多个挡板间隔设置于所述第一侧板的内壁，且多个所述挡板的第三端依次远离所述顶板，相邻的两个所述挡板形成所述回风通道的第二导流槽，所述第二导流槽与所述进风通道连通的一端靠近所述底板设置。
  10. 如权利要求5所述的电子设备外罩，其特征在于，所述挡板为弯板结构，所述挡板的数量为一个或多个。
  11. 如权利要求10所述的电子设备外罩，其特征在于，所述挡板的数量为多个；所述多个挡板间隔设置于所述第一侧板的内壁，且多个所述挡板的第三端依次远离所述顶板，相邻的两个所述挡板形成所述回风通道的第二导流槽，所述第二导流槽与所述进风通道连 通的一端靠近所述底板设置。
  12. 如权利要求1所述的电子设备外罩，其特征在于，所述电子设备外罩的内壁设置有吸音棉。
  13. 如权利要求1所述的电子设备外罩，其特征在于，所述第一进风窗和所述第一出风窗分别为百叶窗，所述百叶窗的叶片包括第一折弯部和第二折弯部，所述第一折弯部靠近所述电子设备外罩的内部设置，且所述第一折弯部与所述第二折弯部之间的夹角小于180度。
  14. 如权利要2～13任一项所述的电子设备外罩，其特征在于，所述电子设备包括机箱，所述进风口和所述出风口分别开设于所述机箱的位置相对的两侧面板上；
    所述电子设备外罩还包括位置相对的第二侧板与第三侧板，所述第二侧板与所述第三侧板分别连接于所述第一侧板的两侧，且所述第二侧板与所述机箱上设置有进风口的一侧面板相对设置。
  15. 如权利要求14所述的电子设备外罩，其特征在于，所述顶板靠近所述第二侧板的一侧设置有第二进风窗，所述第二进风窗与所述进风通道连通；
    所述顶板靠近所述第三侧板的一侧设置有第二出风窗，所述第二出风窗与所述出风通道连通。
  16. 如权利要求14或15所述的电子设备外罩，其特征在于，所述第二侧板上设置有第三进风窗，所述第三进风窗与所述进风通道连通，且所述第三进风窗为开关窗。
  17. 如权利要求1～16任一所述的电子设备外罩，其特征在于，所述电子设备外罩可以用于户外环境。
  18. 一种电子设备组件，其特征在于，包括电子设备和如权利要求1～17任一项所述的电子设备外罩，所述电子设备设置于所述电子设备外罩内。
  19. 如权利要求18所述的电子设备组件，其特征在于，所述电子设备为服务器。
  20. 如权利要求18所述的电子设备组件，其特征在于，所述电子设备为网络设备。
  21. 如权利要求18所述的电子设备组件，其特征在于，所述电子设备为存储设备。
  22. 如权利要求18～21任一所述的电子设备组件，其特征在于，所述电子设备为可用于户外环境的电子设备。
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Families Citing this family (2)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101965120A (zh) * 2010-09-27 2011-02-02 同辉佳视(北京)信息技术有限公司 一种室外显示器的散热设备和室外显示机柜
US20110235273A1 (en) * 2010-03-29 2011-09-29 Hon Hai Precision Industry Co., Ltd. Case and electronic device having the same
CN105578813A (zh) * 2015-12-14 2016-05-11 深圳市英威腾电气股份有限公司 一种防水防尘机箱
CN106817864A (zh) * 2015-11-30 2017-06-09 宁波司普瑞茵通信技术有限公司 户外通信机柜
CN108882656A (zh) * 2018-08-31 2018-11-23 苏州圆能动力科技有限公司 一种便携式储能电站的冷却结构

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52151001U (zh) * 1976-05-13 1977-11-16
US20070159791A1 (en) * 2006-01-11 2007-07-12 Lucent Technologies Inc. Low-profile articulated electronics enclosure with improved air coolant system
JP2008171078A (ja) * 2007-01-09 2008-07-24 Nec Computertechno Ltd ラックキャビネット及び冷却方法
CN102510704B (zh) * 2011-10-27 2014-09-03 华为技术有限公司 盒式机箱通讯设备的散热系统、盒式机箱及通讯设备
CN103596391B (zh) * 2012-08-17 2016-04-06 珠海格力电器股份有限公司 电源适配器壳体组件、电源适配器、空调器及除湿机
JP2014049515A (ja) * 2012-08-30 2014-03-17 Hitachi Ltd 冷却装置を備えた電子機器装置
JP6007802B2 (ja) * 2013-01-28 2016-10-12 富士通株式会社 冷却装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110235273A1 (en) * 2010-03-29 2011-09-29 Hon Hai Precision Industry Co., Ltd. Case and electronic device having the same
CN101965120A (zh) * 2010-09-27 2011-02-02 同辉佳视(北京)信息技术有限公司 一种室外显示器的散热设备和室外显示机柜
CN106817864A (zh) * 2015-11-30 2017-06-09 宁波司普瑞茵通信技术有限公司 户外通信机柜
CN105578813A (zh) * 2015-12-14 2016-05-11 深圳市英威腾电气股份有限公司 一种防水防尘机箱
CN108882656A (zh) * 2018-08-31 2018-11-23 苏州圆能动力科技有限公司 一种便携式储能电站的冷却结构

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