WO2021147403A1 - 中间串联层、叠层光伏器件及生产方法 - Google Patents
中间串联层、叠层光伏器件及生产方法 Download PDFInfo
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- WO2021147403A1 WO2021147403A1 PCT/CN2020/122769 CN2020122769W WO2021147403A1 WO 2021147403 A1 WO2021147403 A1 WO 2021147403A1 CN 2020122769 W CN2020122769 W CN 2020122769W WO 2021147403 A1 WO2021147403 A1 WO 2021147403A1
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- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/072—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type
- H01L31/0725—Multiple junction or tandem solar cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/078—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers including different types of potential barriers provided for in two or more of groups H01L31/062 - H01L31/075
Definitions
- the present invention relates to the field of solar photovoltaic technology, in particular to an intermediate tandem layer of a laminated photovoltaic device, a laminated photovoltaic device and a production method.
- Stacked photovoltaic devices can divide sunlight into multiple wavelength bands. From front to back, battery cells with gradually decreasing band gaps are used to absorb sunlight of different energy in order to broaden the spectral response band to sunlight and reduce energy loss, so , Stacked photovoltaic devices have a wide range of application prospects.
- an intermediate series layer is required to connect each battery cell in series.
- one is metal
- one is transparent conductive film
- the other is tunnel junction.
- the invention provides an intermediate series layer of a laminated photovoltaic device, a laminated photovoltaic device and a production method, and aims to solve the problem of power loss of the laminated photovoltaic device caused by the intermediate series layer.
- an intermediate tandem layer of a stacked photovoltaic device having light transmittance
- the intermediate tandem layer includes a longitudinal conductive layer
- the longitudinal conductive layer is composed of longitudinally grown nano conductive pillars
- the vertical conductive layer includes nano conductive units spaced apart from each other and an insulating barrier located between adjacent nano conductive units; the insulating barrier insulates each of the nano conductive units in the lateral direction.
- the nano conductive column is one of columnar crystals, nano columns, nano rods, and nano tubes;
- the lateral size of the nano conductive column is 0.5-500 nm
- the material of the nano conductive column is selected from at least one of oxide semiconductor, selenide semiconductor, carbide, carbon, and conductive polymer.
- the included angle between the nano conductive column and the longitudinal direction is less than or equal to 10°.
- the shape of the nano conductive unit is: one of a linear shape, a column shape, a cone shape, or a rod shape;
- the lateral dimension of the nano conductive unit is 0.5-500 nm
- the material of the nano conductive unit is selected from at least one of metals, metal oxides, metal selenides, metal sulfides, carbon, and conductive polymers;
- the material of the insulating barrier is selected from at least one of organic silicon, inorganic silicon, oxide dielectric, and polymer.
- the metal is selected from at least one of gold, silver, platinum, aluminum, copper, tin, and titanium;
- the metal oxide is selected from zinc oxide, tin oxide, titanium oxide, molybdenum oxide, copper oxide, vanadium oxide, thallium oxide, hafnium oxide, nickel oxide, tungsten oxide, indium oxide, gallium oxide, indium-doped tin oxide, and fluorine-doped At least one of tin oxide, aluminum-doped zinc oxide, and gallium-doped zinc oxide.
- the included angle between the nano conductive unit and the longitudinal direction is less than or equal to 10°.
- the average roughness of the light-facing surface of the intermediate tandem layer is less than or equal to 100 nm.
- the intermediate tandem layer further includes a modification film on the backlight surface of the longitudinal conductive layer;
- the material of the modified film is selected from the group consisting of metals, metal oxides, metal selenides, carbon, and carbides that have a catalytic effect, and the modified film serves as the seed layer of the nano conductive pillars or the nano conductive units;
- the material of the modified film is selected from: electron selective contact materials.
- the thickness of the modified film is 0.5-10 nm; the modified film is a continuous layer, or the modified film is densely packed with a plurality of lattice structures, and the lateral dimension of the lattice structure is 0.5-10nm.
- the electron selective contact material is selected from at least one of fullerene, graphene, graphyne, calcium, lithium fluoride, and magnesium fluoride.
- the average transmittance of the intermediate tandem layer in the 500-1300 nm band is greater than or equal to 85%.
- the longitudinal dimension of the intermediate tandem layer is 10-1000 nm.
- a stacked photovoltaic device comprising: at least two battery cells with different band gaps and the intermediate tandem layer as described above;
- Each of the battery cells is sequentially stacked from top to bottom in the order of the band gap width energy of the absorption layer from top to bottom, and the intermediate series layer is located between adjacent battery cells.
- the surface of the lower battery cell in contact with the middle tandem layer has a light trapping structure; the lower battery cell is a battery cell located on the backlight surface of the middle tandem layer.
- a production method of a stacked photovoltaic device including:
- a second battery cell is deposited on the light-receiving surface of the intermediate series layer; the band gap width of the second battery cell is greater than the band gap width of the first battery cell; the intermediate series layer is used to electrically interconnect the first battery cell A battery unit and the second battery unit.
- the step of depositing an intermediate tandem layer includes:
- each nano-conductive unit and insulating barrier using one of vacuum deposition, chemical method, chemical vapor deposition, and hot filament chemical vapor deposition to form each nano-conductive unit and insulating barrier.
- the intermediate tandem layer includes a vertical conductive layer, and the vertical conductive layer is composed of vertically grown nano-conductive pillars.
- the vertical conductive layer is composed of vertically grown nano-conductive pillars.
- the conductivity is very strong, and further, the carriers are mainly transmitted vertically, and there is basically no lateral current, which is beneficial to reduce the power loss of the stacked photovoltaic device.
- each nano-conductive unit breaks the conductive path in the lateral direction, so that the vertical conductive layer can basically only carry out the longitudinal transmission of carriers, and there is basically no lateral current, which is beneficial to reduce the stacking. Power loss of photovoltaic devices.
- Figure 1 shows a schematic structural diagram of an intermediate tandem layer in an embodiment of the present invention
- Figure 2 shows a schematic structural diagram of another intermediate tandem layer in an embodiment of the present invention
- FIG. 3 shows a schematic diagram of the structure of an intermediate tandem layer and a lower-layer battery in an embodiment of the present invention
- Figure 4 shows a schematic structural diagram of the first type of stacked photovoltaic device in an embodiment of the present invention
- Figure 5 shows a schematic structural diagram of a second type of stacked photovoltaic device in an embodiment of the present invention
- FIG. 6 shows a schematic structural diagram of a third type of laminated photovoltaic device in an embodiment of the present invention.
- Fig. 7 shows a schematic structural diagram of a fourth type of stacked photovoltaic device in an embodiment of the present invention.
- 1-Middle tandem layer 10-longitudinal conductive layer, 11-nanometer conductive column, 12-insulating barrier, 13-nanometer conductive unit, 21-upper battery cell, 22-lower battery cell, 14-modified film, 23-top layer Electrode, 24-bottom electrode.
- the inventor of the present invention discovered during the process of studying the above-mentioned intermediate tandem layer that the reason for the power loss of the tandem photovoltaic device caused by the intermediate tandem layer lies in the fact that in the process of manufacturing the tandem photovoltaic device, the upper and lower battery cells are often in the lateral space area When the material properties appear uneven, the open circuit voltage or photocurrent in different regions will have a certain difference, and the existing intermediate series layer will have a lateral current, and the above-mentioned lateral current will eventually lead to the power loss of the laminated photovoltaic device.
- the existing intermediate tandem layer will cause the carrier transport of the lower battery cell to concentrate on the leakage or invalidity.
- the lateral position of the position is equivalent to reducing the overall parallel resistance of the device, which seriously causes the overall efficiency of the device to drop.
- the intermediate series layer can be used to connect individual battery cells in series to form a stacked photovoltaic device.
- each battery cell has a different band gap, and each battery cell is stacked from top to bottom in the order of band gap width energy from high to low.
- the battery cell with the largest band gap is on the front, and the battery cell with the smallest band gap is on the back.
- the middle tandem layer is light-transmissive and is used to pass through the upper battery cell to absorb the remaining waveband.
- the light-transmitting wavelength band can be determined according to the wavelength band remaining after the upper-layer battery cell adjacent to it absorbs the wavelength band.
- the light-transmitting light-transmitting waveband can be the waveband remaining after the upper-layer battery cell adjacent to it absorbs the waveband.
- the average transmittance of the intermediate tandem layer in the 500-1300 nm band is greater than or equal to 85%. That is, the average transmittance of the intermediate tandem layer to the 500-1300nm wavelength band is greater than or equal to 85%, and furthermore, the light of the 500-1300nm wavelength band greater than or equal to 85% can be transmitted to the battery cells located on the backlight surface of the intermediate tandem layer , Which helps reduce optical loss.
- FIG. 1 shows a schematic structural diagram of an intermediate tandem layer in an embodiment of the present invention.
- the intermediate tandem layer includes a vertical conductive layer 10, and the vertical conductive layer 10 is composed of vertically grown nano conductive pillars 11.
- the longitudinal direction refers to the direction perpendicular to the layer, that is, in the stacked photovoltaic device, the longitudinal direction is the direction in which each battery cell is stacked in the order of the band gap width energy from high to low, and from top to bottom. .
- the nano-sized conductive pillars included in the vertical conductive layer are of nanometer scale and are evenly distributed in the entire vertical conductive layer.
- each nano-conductive pillar is closely arranged, there are a large number of grain boundaries or interfaces between the nano-conductive pillars, or the lateral cross-linking between the nano-conductive pillars is less, making the lateral conductivity poorer, and further, the longitudinal
- the conductive layer has weaker lateral conductivity.
- the carriers are mainly transmitted longitudinally, and there is basically no lateral current, which is beneficial to reduce the power loss of the laminated photovoltaic device.
- the shape of the nano conductive column is: one of columnar crystals, nano columns, nano rods, and nano tubes.
- the lateral dimension of the nano conductive pillars is 0.5-500 nm.
- the lateral dimension may be the width or diameter of the nano conductive pillars.
- the lateral size of each nano-conductive column is smaller, and the distribution density of nano-conductive columns is higher.
- the range of a single nano-conductive column to collect carriers is very small, which can be greatly improved.
- the upper layer reduces the accumulation of carriers and can improve the longitudinal conductivity of the intermediate tandem layer.
- the material of the nano conductive column is selected from at least one of oxide semiconductor, selenide semiconductor, carbide, carbon, and conductive polymer.
- the intermediate tandem layer has better longitudinal conductivity.
- carbide, carbon, and conductive polymers if the band gap of the intermediate tandem layer formed by oxide semiconductors and selenide semiconductors is generally greater than the band gap of the battery cells on the back side, the battery cells on the back side The light has almost no optical absorption.
- the material of the nano conductive pillars may be: metal oxide materials such as copper oxide, molybdenum oxide, and related electrical doping materials.
- the electrical doping materials may include: aluminum (Al), calcium (Ga) and other group III Metal doping.
- the electrical doping material may also include halides such as fluorine (F) and bromine (Br)).
- the material of the nano conductive column can also be metal selenide materials such as copper selenide and molybdenum selenide.
- the material of the nano conductive column can also be: polyacetylene, polythiophene, polypyrrole, polyaniline, polyphenylene, polyphenylene vinylene, polydiacetylene and other intrinsically conductive conductive polymers and doped materials thereof.
- the included angle between the nano conductive column and the longitudinal direction is less than or equal to 10°. That is, the angle between the nano-conductive pillar and the stacking direction of each layer of battery cells is less than or equal to 10°, which ensures a good vertical light transmittance.
- the nano-conductive pillars in the intermediate tandem layer have refraction, scattering, etc., which increase the optical path.
- the surface reflection of the lower battery unit is reduced, and it has a certain anti-reflection function.
- FIG. 2 shows a schematic structural diagram of another intermediate tandem layer in an embodiment of the present invention.
- the intermediate series layer includes a vertical conductive layer 10, and the vertical conductive layer 10 includes nano conductive units 13 spaced apart from each other, and an insulating barrier 12 located between adjacent nano conductive units 13.
- the insulating barrier 12 insulates each nano-conductive unit 13 in the lateral direction. Since each nano-conductive unit 13 is insulated by the insulating barrier 12 in the lateral direction, the lateral conductivity of each nano-conductive unit 13 in the vertical conductive layer is interrupted by the insulating barrier 12, and further, the carriers are mainly transmitted longitudinally. There is basically no lateral current, which helps to reduce the power loss of stacked photovoltaic devices.
- the shape of the nano-conductive unit is one of linear, columnar, cone-shaped, or rod-shaped.
- the lateral size of the nano conductive unit is 0.5-500 nm.
- the lateral dimension may be the width or diameter of the nano-conductive unit.
- the lateral size of each nano-conductive unit is smaller, and the distribution density of the nano-conductive unit is higher, which is conducive to the collection of carriers.
- the material of the nano conductive unit is selected from at least one of metal, metal oxide, metal selenide, metal sulfide, carbon, and conductive polymer.
- the intermediate tandem layer has better vertical conductivity and light transmittance.
- the above-mentioned semiconductor materials are used to form the intermediate layer.
- the band gap of the tandem layer is generally larger than the band gap of the battery cell on the backlight side, and there is almost no optical absorption of the light from the battery cell on the backlight side.
- the material of the insulating barrier is selected from at least one of organic silicon, inorganic silicon, oxide dielectric, and polymer.
- the insulating barrier formed by the above-mentioned materials has a good insulating effect, and further reduces the lateral conductivity of the intermediate tandem layer. At the same time, the insulating barrier formed of the above-mentioned materials has good adhesion to the light-facing surface of the underlying battery cell.
- metal can be selected from materials with low resistivity such as gold, silver, platinum, aluminum, copper, tin, and titanium.
- the metal oxide can be selected from: zinc oxide, tin oxide, titanium oxide, molybdenum oxide, copper oxide, vanadium oxide, thallium oxide, hafnium oxide, nickel oxide, tungsten oxide, indium oxide, gallium oxide, and indium-doped tin oxide, doped Oxide conductive materials such as fluorine tin oxide, aluminum-doped zinc oxide, and gallium-doped zinc oxide. With the above materials, the intermediate conductive layer has good longitudinal conductivity.
- the nano-conductive unit may be a graphene sheet that is vertically grown or arranged.
- the material of the insulating barrier may be selected from: intrinsic amorphous silicon, silicon nitride, silicon carbide, silica gel, silica gel, alumina, epoxy resin, ethylene-vinyl acetate copolymer, and the like.
- the included angle between the nano conductive unit and the longitudinal direction is less than or equal to 10°. That is, the angle between the stacking direction of the nano-conductive unit and each layer of battery unit is less than or equal to 10°, which ensures a good vertical light transmittance.
- the nano-conductive units in the intermediate tandem layer have refraction, scattering, etc., which increase the optical path.
- the surface reflection of the lower battery unit is reduced, and it has a certain anti-reflection function.
- the average roughness of the light-facing surface of the intermediate tandem layer is less than or equal to 100 nm, and the light-facing surface of the intermediate tandem layer has better flatness, which is created for the deposition of battery cells located on the light-facing surface of the intermediate tandem layer.
- the plane contact surface Specifically, ion etching or chemical etching can be used to planarize the light-facing surface of the intermediate tandem layer. For example, etch away excess insulating barriers, on the one hand, provide a relatively flat light-facing surface, and on the other hand, expose the nano-conductive unit, which facilitates subsequent electrical contact with the battery cell on the light-facing surface.
- the intermediate tandem layer further includes a modification film on the backlight surface of the vertical conductive layer.
- the material of the modified film is selected from the group consisting of metals, metal oxides, metal selenides, carbons, carbides with catalytic effect, and the modified film serves as the seed layer of the above-mentioned nano-conductive pillars or the above-mentioned nano-conductive unit.
- the material of the modified film is selected from: electron selective contact materials.
- the modified film can play the role of modifying the light-facing surface of the lower battery cell in contact with the intermediate tandem layer, and can reduce the contact resistance between the vertical conductive layer and the lower battery cell, or serve as a nano conductive column or nanometer in the vertical conductive layer.
- the modified film and the lower battery cell in contact with the intermediate tandem layer have good adhesion to the light-facing surface.
- the material of the modified film can be selected according to the material of the aforementioned nano-conductive pillar or the aforementioned nano-conductive unit.
- the material of the modified film is selected from: catalytic metals, metal oxides, metal selenides, carbon, carbides ,
- the modified film can be used as a seed layer of nano conductive pillars or nano conductive units.
- a layer of silver nano-particles can be vapor-deposited on the smooth surface of the lower battery unit as a modified film in advance.
- catalytic metal particles such as gold or zinc oxide nanoparticles can be deposited on the smooth surface of the lower battery unit in advance as a modified film.
- carbon nanotubes are grown by chemical vapor deposition
- catalytic metal particles such as platinum can be deposited on the smooth surface of the lower battery cell in advance as the modified film.
- a thin layer of titanium oxide is used as a modified film on the smooth surface of the lower battery cell, which can play a role in surface field passivation, and at the same time, the thin layer of titanium oxide can play a role in reducing contact resistance.
- the material of the modified film is selected from: electron selective contact materials.
- the work function is the minimum energy required to move an electron from the inside of the solid to the surface of the object.
- the low work function material may be a material whose minimum energy is less than or equal to 3.0 eV.
- modified silver nanowires, zinc oxide nanowires, and carbon nanotubes can be low work function materials.
- the electron selective contact material is usually a high work function material, and the high work function modified film can reduce the contact resistance with the light-facing surface of the underlying battery cell.
- the high work function material may be the material with the minimum energy above 3.0 eV.
- the thickness of the modified film is 0.5-10 nm.
- the modified film is a continuous layer, or, the modified film is densely formed by a plurality of lattice structures, and the lateral dimension of the lattice structure is 0.5-10 nm.
- a single lattice structure can be spherical or hemispherical, and the lateral dimension can be a diameter.
- the electron selective contact material is selected from at least one of fullerene, graphene, graphyne, calcium, lithium fluoride, and magnesium fluoride.
- the modified film formed of the above-mentioned materials can further reduce the contact resistance with the light-facing surface of the lower battery cell.
- the longitudinal dimension of the intermediate tandem layer is 10-1000 nm.
- the longitudinal dimension of the middle tandem layer is small and has good light transmittance. Specifically, if the light-facing surface of the lower battery cell is a plane, the longitudinal dimension of the middle tandem layer is 10-1000 nm. If the light-facing surface of the lower battery cell has a light-trapping structure, the middle tandem layer fills the light-trapping structure of the light-facing surface of the lower battery cell, and the remaining longitudinal dimension of the middle tandem layer is 10-1000 nm.
- FIG. 3 shows a schematic structural diagram of an intermediate tandem layer and a lower-layer battery in an embodiment of the present invention.
- the light-facing surface of the lower battery cell 22 is a light-trapping structure, excluding the thickness of the light-trapping structure of the intermediate tandem layer 1 filling the light-facing surface of the lower battery cell 22, on the light-facing surface of the lower battery cell 22
- the longitudinal dimension d of the intermediate tandem layer 1 is 10-1000 nm.
- the longitudinal dimension of the nano conductive pillars in the longitudinal conductive layer is consistent with the thickness of the longitudinal conductive layer, that is, the longitudinal direction of the nano conductive pillars penetrates the entire longitudinal conductive layer, that is, the two ends of the nano conductive pillars are respectively located in the longitudinal conductive layer The two sides of the.
- the direct longitudinal dimension of the nano-conductive unit in the longitudinal conductive layer or the longitudinal dimension after internal cross-linking is consistent with the thickness of the longitudinal conductive layer, that is, the nanowires in the nano-conductive unit directly penetrate the entire longitudinal conductive layer longitudinally.
- the nanowires in the nano conductive unit can penetrate the longitudinal conductive layer longitudinally after cross-linking. That is, the two longitudinal ends of the nanowire and the like in the nano conductive unit are respectively located on both sides of the longitudinal conductive layer, or the two ends of the nanowire and the like in the nano conductive unit after cross-linking are respectively located on both sides of the longitudinal conductive layer.
- the thickness of the intermediate tandem layer is greater than the size of the light-trapping structure of the lower battery unit toward the light side to fill the light-trapping structure.
- the use of metal series connection will cause serious optical shielding of the lower battery cell.
- Using a thicker transparent conductive film to realize series connection will introduce a certain optical loss and the transparent conductive film has a relatively high resistivity, and has a certain lateral conductivity, which will introduce additional series resistance in the device.
- the open circuit voltage or photocurrent in different areas may have certain differences. If the middle series layer has strong lateral conductivity, there will be lateral currents, resulting in power loss .
- the middle tandem layer when the upper battery cell area is poorly prepared and invalid or leakage occurs, if the middle tandem layer has a strong lateral conductivity, it will cause the lower layer carrier lateral transport to concentrate on the leakage or invalid position, resulting in a decrease in the overall efficiency of the device. More, resulting in greater overall electrical loss, manifested by higher series resistance and lower parallel resistance. If the passivation layer is opened and filled with metal for electrical series connection, the optical shielding loss caused by the series metal is reduced to a certain extent and the series resistance is reduced, but there is still a certain optical shielding, and reducing the shielding requires less The number of openings and the smaller pore size will cause carriers to accumulate at the openings of the underlying battery, resulting in an increase in the series resistance of the overall device. Alleviating the accumulation of carriers requires more openings or larger apertures, which will further increase the optical shielding.
- the intermediate tandem layer includes a vertical conductive layer, and the vertical conductive layer is composed of vertically grown nano-conductive pillars.
- the longitudinal conductive layer has weaker lateral conductivity.
- the carriers are mainly transmitted longitudinally, and there is basically no lateral current, which minimizes the electrical internal consumption problems caused by the uneven material characteristics of the upper and lower battery cells, which is beneficial to reduce stacking.
- the power loss of a layered photovoltaic device or, due to the insulation effect of the insulating barrier in the lateral direction of each nano-conductive unit, the longitudinal conductive layer has a weaker lateral conductivity.
- the carriers are mainly transmitted longitudinally, and there is basically no lateral current, which minimizes the upper layer and
- the electrical internal consumption problem of the lower battery unit due to the uneven material properties of the area is beneficial to reduce the power loss of the stacked photovoltaic device.
- the intermediate tandem layer has good light transmittance, high conductivity and high recombination rate, and achieves high longitudinal conductivity. Under the condition of ensuring reduced or no carrier accumulation in the intermediate tandem layer, it minimizes Blocking of incident light.
- Fig. 4 shows a schematic structural diagram of the first type of stacked photovoltaic device in an embodiment of the present invention.
- the laminated photovoltaic device includes at least two battery cells with different band gaps and any of the above-mentioned intermediate series layers.
- the number of battery cells included in the stacked photovoltaic device is not specifically limited.
- the stacked photovoltaic device includes two battery cells.
- each battery cell is stacked from top to bottom in the order of the band gap energy of the absorber layer from high to low, the middle series layer is located between adjacent battery cells, and the middle series layer is used for conductive interconnection Each battery unit.
- the battery cell 21 located above may be a wide band gap battery cell.
- the battery cell 22 located below may be a narrow band gap battery cell.
- the band gap of the narrow band gap battery cell 22 is smaller than the band gap of the wide band gap battery cell 21.
- the wide band gap battery cell 21 and the narrow band gap battery cell 22 are stacked from top to bottom in the order of the band gap width energy of the absorption layer, and the middle series layer 1 is arranged on the wide band gap battery cell 21 and the narrow band gap battery cell 22 In between, the intermediate series layer 1 is used to electrically interconnect the wide band gap battery cell 21 and the narrow band gap battery cell 22.
- the light-facing surface of the lower battery unit may be a flat surface or a light-trapping structure, and the backlight surface of the middle tandem layer is adapted to the light-facing surface of the lower battery unit.
- the light-facing surface of the lower battery cell 22 is flat
- the backlight surface of the middle tandem layer 1 is also flat
- the light-facing surface of the middle tandem layer 1 is flat, creating a plane for the deposition of the upper battery cell 21 Contact surfaces.
- FIG. 5 shows a schematic structural diagram of a second type of stacked photovoltaic device in an embodiment of the present invention.
- the light-facing surface of the lower battery unit 22 may be flat, and the middle tandem layer 1 includes a modified film 14.
- the backlight surface of the modification film 14 is a flat surface adapted to it.
- the light-facing surface of the modification film 14 is a plane
- the backlight surface of the longitudinal conductive layer 10 is a plane that matches the light-facing surface of the modification film 14
- the light-facing surface of the intermediate tandem layer 1 is a plane, which is created for the deposition of the upper battery cell 21 Plane contact surface.
- the surface of the lower battery cell in contact with the middle tandem layer has a light trapping structure
- the lower battery cell is a battery cell located on the backlight surface of the middle tandem layer.
- the light-facing surface of the lower battery cell has a light-trapping structure
- the light-trapping structure may be a nano-optical structure, a suede structure, or the like.
- the nano optical structure is a regular nano light trapping structure.
- the suede structure is a pyramid, an inverted pyramid and other structures.
- the light-facing surface of the lower battery unit has a light-trapping structure, which is beneficial to increase the optical path.
- the light-trapping structure of the lower battery cell has a light-trapping structure
- chemical coating methods such as spraying, spin coating, and solution methods can be used to prepare the intermediate tandem layer on the light-facing surface of the lower battery cell, and the intermediate tandem layer can be filled in.
- the light-trapping structure of the light-facing surface of the lower battery unit also creates a plane contact surface for the upper battery unit.
- FIG. 6 shows a schematic structural diagram of a third type of laminated photovoltaic device in an embodiment of the present invention.
- the light-facing surface of the lower battery cell 22 has a light-trapping structure
- the middle tandem layer 1 fills the light-trapping structure of the light-facing surface of the lower battery cell 22
- the light-facing surface of the middle tandem layer 1 is flat, which is the upper battery cell.
- the deposition of 21 creates a flat contact surface.
- FIG. 7 shows a schematic structural diagram of a fourth type of stacked photovoltaic device in an embodiment of the present invention.
- the light-facing surface of the lower battery unit 22 has a light-trapping structure
- the middle tandem layer 1 includes a modified film 14.
- the modified film 14 of the middle tandem layer 1 and the longitudinal conductive layer 10 fill the light-trapping structure of the light-facing surface of the lower battery cell 22, and the light-facing surface of the middle tandem layer 1 is a flat surface, creating a creation for the deposition of the upper battery cell 21 Plane contact surface.
- the thickness of the upper battery cell absorption layer located on the light-facing side of the intermediate tandem layer is adjusted according to its material bandwidth to enhance its absorption capacity in the short-wavelength range of visible light and reduce ineffective absorption in the long-wavelength range of visible light. Keep the output current as consistent as possible to reduce the overall current loss.
- the upper battery cell and the lower battery cell on the backlight surface of the middle series layer need to be current-adapted.
- the upper battery cells on the light-facing side of the middle tandem layer and the lower battery cells on the back light side of the middle tandem layer need to be electrically polarized to keep the majority carrier flowing in the same direction.
- the upper layer of the lower battery cell is n-type
- the lower layer of the upper battery cell is the hole transport layer
- the upper layer is the electron transport layer.
- the upper layer of the lower battery cell is p-type
- the lower layer of the upper battery cell is the electron transport layer
- the upper layer is the hole transport layer.
- the band gap width of the lower battery cell located on the backlight surface of the intermediate tandem layer is smaller than the band gap width of the upper battery cell located on the light-facing surface of the intermediate tandem layer.
- the lower battery cell can be a crystalline silicon solar cell, a crystalline silicon/non-silicon heterojunction cell, and the substrate silicon material doping type is not limited, and it can be amorphous silicon, copper indium gallium selenium, cadmium telluride, Thin film solar cells such as gallium arsenide.
- the light-facing surface of the lower battery unit can be a planar structure, a nano-optical structure or a suede structure, and the top layer has no insulating material or dielectric material.
- the upper battery unit can be exciton solar cells such as perovskite materials, organic materials, quantum dot materials, or wide band gap semiconductors such as amorphous silicon, amorphous silicon carbide, copper indium gallium selenium, cadmium telluride, gallium arsenide, etc.
- the band gap width of the absorbing material can be 1.5eV-2.3eV, and it can include one or more buffer layers or matching layers required for contact with the middle series layer to reduce the resistance between the middle series layer and the upper battery cell. complex.
- the light-facing surface of the top battery cell is also provided with an anti-reflection film.
- the anti-reflection film is used to reduce the overall optical loss of the stacked photovoltaic device.
- the top battery cell is the battery cell with the largest band gap in the stacked photovoltaic device. Referring to FIG. 4, FIG. 5, FIG. 6 or FIG. 7, the stacked photovoltaic device may further include a top electrode 23 and a bottom electrode 24. Electrodes are used to collect and export carriers
- the lower battery cell can also be a homojunction silicon solar cell, which uses p-type silicon wafers to prepare an n-type layer through thermal diffusion or ion implantation to form a pn junction, and the pn junction is located on the light-facing surface of the lower battery cell.
- a passivation layer and a perforated electrical derivation structure can be made on the backlight surface of the lower battery unit, and full or local redoping (PERT, PERL) can be further used on the backlight surface.
- the shining surface can be a polished surface. In order to reduce optical loss, nano-optical structures or suede structures can be made on the shining surface.
- An oxide tunneling passivation layer and an intermediate tandem layer can be deposited on its smooth surface.
- No dielectric material or anti-reflection film is deposited on the light-facing surface of the lower battery unit, so as to make electrical contact with the middle in series.
- the lower battery cell is made into an inverted pyramid suede structure facing the smooth surface.
- the average side length of the structure can be 500nm, the average side distance is 5nm, and the structure depth is 250-500nm.
- the inverted pyramid structure can be obtained by metal ion-assisted anisotropic etching. .
- the lower battery unit can also be a narrow band gap thin film solar cell, and the material of the absorption layer can be a narrow band gap or adjustable band gap material such as CIGS, amorphous silicon, CdTe, GaAs, perovskite.
- the lower battery cell is a CIGS thin film solar cell with a conventional structure, a substrate, a molybdenum back electrode, a CIGS absorber layer, a CdS buffer layer, a ZnO window layer, and AZO transparent conductive film.
- the longitudinal surface roughness is about 20nm.
- the intermediate tandem layer of the battery cell in the stacked photovoltaic device can refer to the relevant description in the foregoing embodiment, and can achieve the same or similar beneficial effects. In order to avoid repetition, details are not described herein again.
- the embodiment of the present invention also provides a method for producing a stacked photovoltaic device.
- the method includes the following steps:
- Step 101 Provide a first battery unit.
- the first battery cell may be the above-mentioned lower battery cell with a relatively narrow band gap.
- Step 102 deposit any of the intermediate tandem layers on the light-receiving surface of the first battery unit.
- Step 103 deposit a second battery cell on the light-receiving surface of the intermediate series layer; the band gap width of the second battery cell is greater than the band gap width of the first battery cell; the intermediate series layer is used for conductive interconnection.
- the first battery unit and the second battery unit deposit a second battery cell on the light-receiving surface of the intermediate series layer; the band gap width of the second battery cell is greater than the band gap width of the first battery cell; the intermediate series layer is used for conductive interconnection.
- the first battery unit and the second battery unit is used for conductive interconnection.
- the foregoing step 102 may include: using one of vacuum deposition, chemical method, chemical vapor deposition, and hot filament chemical vapor deposition to form each nano-conductive pillar; or, using vacuum deposition, chemical method, or chemical vapor deposition , A type of hot filament chemical vapor deposition, which deposits to form various nano-conductive units and insulating barriers.
- one of vacuum deposition, chemical method, chemical vapor deposition, and hot filament chemical vapor deposition is used to deposit and form a plurality of nano conductive pillars on the light-facing surface of the lower battery unit to form a longitudinal conductive layer.
- one of vacuum deposition, chemical method, chemical vapor deposition, and hot filament chemical vapor deposition is to form a plurality of nano conductive units and insulating barriers on the smooth surface of the lower battery unit.
- a plurality of nano-conductive units and insulating barriers are simultaneously deposited on the smooth surface of the lower battery unit to form a longitudinal conductive layer .
- deposit an insulating barrier on the smooth surface of the lower battery cell and then use vacuum deposition, chemical method, or chemical vapor deposition.
- the deposition sequence of the insulating barrier and the nano-conductive unit is not specifically limited.
- vacuum deposition may be: PECVD (Plasma Enhanced Chemical Vapor Deposition), LPCVD (Low Pressure Chemical Vapor Deposition), PVD (Physical Vapor Deposition) , Physical Vapor Deposition) and so on.
- Hot Wire Chemical Vapor Deposition is Hot Wire Chemical Vapor Deposition, or HWCVD.
- Chemical vapor deposition is Chemical Vapor Deposition, or CVD.
- intrinsic amorphous silicon silicon nitride, silicon carbide, aluminum oxide and other insulating barriers
- sol-gel and other liquid treatment processes using the first coating and then curing program, which can be used to deposit organic Materials such as silicon, polymer, epoxy resin, ethylene-vinyl acetate copolymer.
- a modified film can be deposited by vapor deposition, and the modified film can be a seed layer lattice structure.
- the seed material can be zinc oxide ZnO, and the average diameter of the seed layer lattice can be 10 nm.
- the seed point plane spacing is 200nm.
- the background vacuum of the evaporation chamber is not more than 5 ⁇ 10-4Pa, and the evaporation rate is 0.1-0.5nm/s.
- ZnO nanowires can be grown on the seed layer by CVD (Chemical Vapor Deposition), with an average length of 600nm, a wire diameter of 10-50nm, and an angle of 0° between the nanowire and the longitudinal direction.
- CVD Chemical Vapor Deposition
- argon can be used as a carrier gas to control the transport rate of the gas flow and the source, so that the growth rate of ZnO is about 2-3nm/s or 1-2nm/s.
- LPCVD can be used to deposit an insulating barrier.
- the material of the insulating barrier is intrinsic amorphous silicon, and the thickness is filled and covered with the inverted pyramid structure of the underlying solar cell and ZnO nanowires, and the deposition thickness is 600-800 nm.
- Argon can be used as the carrier gas, the background vacuum of the evaporation chamber is not more than 5 ⁇ 10-5Pa, the system pressure is 100-1000Pa, and the deposition rate is about 10-20nm/min or 5-10nm/min.
- the intermediate tandem layer can be deposited by the sol-gel method, and the precursor solution contains uniformly dispersed magnetic silver nanowires with an average wire diameter of 10-20 nm and an average length of 50 nm.
- the precursor solution is coated on the surface of the lower battery cell, it is cured in a magnetic field to form a SiO2 mesoporous film.
- the silver nanowires are arranged in a consistent longitudinal direction and are in contact with AZO, and the deviation of the average angle from the longitudinal direction is not more than 3 °.
- the intermediate tandem layer is etched with an alkaline solution to expose Ag nanowires on the surface, and the thickness of the intermediate tandem layer is about 40-50 nm.
- a modified film can be deposited by vapor deposition.
- the modified film has a seed layer lattice structure, the seed material is a titanium oxide lattice, the average diameter of the seed layer lattice is 5nm, and the seed points are densely packed.
- the close-packed titanium oxide nanowires are grown hydrothermally on the seed layer, with an average length of 50nm, a wire diameter of 5-10nm, and the deviation of the nanowire from the longitudinal angle of no more than 3°.
- the organic titanium source is used in the precursor solution of the hydrothermal method, the hydrothermal temperature does not exceed 200°C, and the crystal growth is carried out in a neutral environment, and the growth rate is about 3-4nm/min.
- the shape, size, material, etc. of the nano conductive column, the nano conductive unit, the insulating barrier, the longitudinal conductive layer, etc. can be referred to the aforementioned related content, and in order to avoid repetition, it will not be repeated here.
- the production method of the intermediate tandem layer of the above-mentioned laminated photovoltaic device can also achieve the above-mentioned similar beneficial effects, and in order to avoid repetition, it will not be repeated here.
- the second battery cell can be deposited in a non-vacuum manner.
- the second battery unit may be the upper battery unit with the above-mentioned wide band gap.
- the deposition for the above-mentioned second solar cell can be as follows:
- spin-coating nano-conductive pillar material on the smooth surface of the upper battery cell to form a longitudinal conductive layer, and the average thickness of the nano-conductive pillar may be 50 nm. Then spin-coating and curing the perovskite material on the smooth surface of the longitudinal conductive layer, the curing temperature does not exceed 150 °C, the thickness of the perovskite material is 500-1000nm; deposit the hole transport layer and TCO film on the surface of the perovskite absorption layer .
- the hole transport layer material Spiro-OMeTAD
- the curing temperature does not exceed 150 °C, the thickness of the perovskite material It is 500-1000nm; the electron transport layer and TCO film are deposited on the surface of the perovskite absorption layer.
- the first battery cell, the second battery cell, the intermediate series layer, etc. of the method can refer to the relevant records in the foregoing embodiment, and can achieve the same or similar beneficial effects. In order to avoid repetition, here No longer.
- each device can be referred to each other.
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Abstract
Description
Claims (16)
- 一种叠层光伏器件的中间串联层,其特征在于,所述中间串联层具有透光性;所述中间串联层包括纵向导电层;所述纵向导电层由纵向生长的纳米导电柱构成;或,所述纵向导电层包括相互间隔分布的纳米导电单元、以及位于相邻的纳米导电单元之间的绝缘阻隔体;所述绝缘阻隔体在横向上绝缘各个所述纳米导电单元。
- 根据权利要求1所述的中间串联层,其特征在于,所述纳米导电柱为柱状晶体、纳米柱、纳米棒、纳米管中的一种;所述纳米导电柱的横向尺寸为0.5-500nm;所述纳米导电柱的材料选自:氧化物半导体、硒化物半导体、碳化物、碳、导电聚合物中的至少一种。
- 根据权利要求1所述的中间串联层,其特征在于,所述纳米导电柱与纵向的夹角小于或等于10°。
- 根据权利要求1所述的中间串联层,其特征在于,所述纳米导电单元的形状为:线状、柱状、锥状或棒状中的一种;所述纳米导电单元的横向尺寸为0.5-500nm;所述纳米导电单元的材料选自:金属、金属氧化物、金属硒化物、金属硫化物、碳、导电聚合物中的至少一种;所述绝缘阻隔体的材料选自:有机硅、无机硅、氧化物电介质、聚合物中的至少一种。
- 根据权利要求4所述的中间串联层,其特征在于,所述金属选自:金、银、铂、铝、铜、锡、钛中的至少一种;所述金属氧化物选自氧化锌、氧化锡、氧化钛、氧化钼、氧化铜、氧化钒、氧化铊、氧化铪、氧化镍、氧化钨、氧化铟、氧化镓、掺铟氧化锡、掺氟氧化锡、掺铝氧化锌、掺镓氧化锌中的至少一种。
- 根据权利要求1所述的中间串联层,其特征在于,所述纳米导电单元与纵向的夹角小于或等于10°。
- 根据权利要求1所述的中间串联层,其特征在于,所述中间串联层的向光面的平均粗糙度小于或等于100nm。
- 根据权利要求1所述的中间串联层,其特征在于,所述中间串联层还包括位于所述纵向导电层的背光面上的修饰膜;所述修饰膜的材料选自:具有催化作用的金属、金属氧化物、金属硒化物,碳、碳化物,所述修饰膜作为所述纳米导电柱或所述纳米导电单元的种子层;和/或,在所述纳米导电柱或所述纳米导电单元为低功函数材料的情况下,所述修饰膜的材料选自:电子选择性接触材料。
- 根据权利要求8所述的中间串联层,其特征在于,所述修饰膜的厚度为0.5-10nm;所述修饰膜为连续的一层,或,所述修饰膜由若干个点阵结构密布而成,所述点阵结构的横向尺寸为0.5-10nm。
- 根据权利要求8所述的中间串联层,其特征在于,所述电子选择性接触材料选自:富勒烯、石墨烯、石墨炔、钙、氟化锂、氟化镁中的至少一种。
- 根据权利要求1所述的中间串联层,其特征在于,所述中间串联层在500-1300nm波段的平均透过率大于或等于85%。
- 根据权利要求1所述的中间串联层,其特征在于,所述中间串联层的纵向尺寸为10-1000nm。
- 一种叠层光伏器件,其特征在于,包括:至少两个带隙不同的电池单元以及权利要求1至12中任一所述的中间串联层;各个所述电池单元按照吸收层带隙宽度能量由高到低的顺序从上到下依次叠放,所述中间串联层位于相邻的电池单元之间。
- 根据权利要求13所述的叠层光伏器件,其特征在于,下层电池单元与所述中间串联层接触的表面具有陷光结构;所述下层电池单元为位于所述中间串联层的背光面的电池单元。
- 一种叠层光伏器件的生产方法,其特征在于,包括:提供第一电池单元;在所述第一电池单元的受光面沉积权利要求1至12中任一所述的中间串联层;在所述中间串联层的受光面沉积第二电池单元;所述第二电池单元的带隙宽带大于所述第一电池单元的带隙宽度;所述中间串联层用于导电互联所述第一电池单元和所述第二电池单元。
- 根据权利要求15所述的方法,其特征在于,沉积中间串联层的步骤包括:采用真空沉积、化学法、化学气相沉积、热丝化学气相沉积中的一种,沉积形成各个纳米导电柱;或,采用真空沉积、化学法、化学气相沉积、热丝化学气相沉积中的一种,沉积形成各个纳米导电单元和绝缘阻隔体。
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102171836A (zh) * | 2008-08-14 | 2011-08-31 | 布鲁克哈文科学协会 | 结构化柱电极 |
US20130160825A1 (en) * | 2011-12-22 | 2013-06-27 | E I Du Pont De Nemours And Company | Back contact photovoltaic module with glass back-sheet |
US20150053261A1 (en) * | 2011-08-29 | 2015-02-26 | Hitachi, Ltd. | Solar cell |
CN107078151A (zh) * | 2014-01-31 | 2017-08-18 | 凯姆控股有限公司 | 包括金属纳米结构复合层的串联有机光伏器件 |
CN110521008A (zh) * | 2017-02-20 | 2019-11-29 | 牛津光伏有限公司 | 多结光伏设备 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109256431A (zh) * | 2018-08-09 | 2019-01-22 | 暨南大学 | 一种用于非掺杂异质n型单抛硅太阳电池的纳米双金属层背接触及其制备方法和应用 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102171836A (zh) * | 2008-08-14 | 2011-08-31 | 布鲁克哈文科学协会 | 结构化柱电极 |
US20150053261A1 (en) * | 2011-08-29 | 2015-02-26 | Hitachi, Ltd. | Solar cell |
US20130160825A1 (en) * | 2011-12-22 | 2013-06-27 | E I Du Pont De Nemours And Company | Back contact photovoltaic module with glass back-sheet |
CN107078151A (zh) * | 2014-01-31 | 2017-08-18 | 凯姆控股有限公司 | 包括金属纳米结构复合层的串联有机光伏器件 |
CN110521008A (zh) * | 2017-02-20 | 2019-11-29 | 牛津光伏有限公司 | 多结光伏设备 |
Non-Patent Citations (1)
Title |
---|
See also references of EP4095929A4 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024038701A1 (ja) * | 2022-08-17 | 2024-02-22 | 株式会社ダイセル | 積層体および積層体の製造方法 |
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