WO2021136432A1

WO2021136432A1 - Shielding assembly, vehicle-mounted device and communication device

Info

Publication number: WO2021136432A1
Application number: PCT/CN2020/141646
Authority: WO
Inventors: 彭小权; 彭杰; 周琴; 伍磊
Original assignee: 华为技术有限公司
Priority date: 2019-12-30
Filing date: 2020-12-30
Publication date: 2021-07-08
Also published as: CN113130423B; CN113130423A

Abstract

Provided in the present application are a shielding assembly, a vehicle-mounted device and a communication device. The shielding assembly comprises a wave-absorbing shielding structure and an insulating heat-conducting adhesive layer, wherein the wave-absorbing shielding structure is a housing structure, and the insulating heat-conducting adhesive layer fills the housing structure; and the shielding assembly further comprises an anti-adhesion layer wrapped around the insulating heat-conducting adhesive layer, wherein the anti-adhesion layer is an elastic layer, the insulating heat-conducting adhesive layer is provided with a coverage area for covering a peripheral area of a chip, some areas are reserved in the coverage area to be applied with a conductive adhesive layer, and the conductive adhesive layer is used for isolating a plurality of communication wires connected to the chip. The chip is shielded by absorbing or reflecting electromagnetic waves through the wave-absorbing shielding structure, and meanwhile, the communication wires connected to adjacent transmitting pins and receiving pins are electromagnetically isolated through the conductive adhesive layer, so that crosstalk among the communication wires is reduced. The heat dissipation and shielding effects of the chip are well balanced, and the effect of the chip when working is improved.

Description

Shielding component, vehicle-mounted equipment and communication equipment

Cross-references to related applications

This application claims the priority of a Chinese patent application filed with the Chinese Patent Office, the application number is 201911398528.8, and the application name is "a shielding assembly, vehicle-mounted equipment, and communication equipment" on December 30, 2019. The entire content is incorporated by reference. In this application.

Technical field

This application relates to the field of communication technology, and in particular to a shielding component, a vehicle-mounted device, and a communication device.

Background technique

For high frequency (such as ICT wireless products) and ultra-high frequency (such as vehicle millimeter wave radar) products, the antenna is driven by a radio frequency chip. Among them, the integration of radio frequency chips of vehicle-mounted millimeter wave radars is getting higher and higher. Some types of transmitting antennas and receiving antennas are driven by a single radio frequency chip, and some types of transmitting antennas and receiving antennas are driven by different radio frequency chips that are relatively close. In order to prevent the radio frequency chip from being interfered by the external millimeter wave, it is necessary to isolate the radio frequency chip from the external millimeter wave radio frequency signal; in order to prevent the crosstalk between the transceiver of the radio frequency chip, it is necessary to isolate the radio frequency chip transmitting pin and the receiving pin (including the extension circuit) Millimeter wave radio frequency signal. However, the radio frequency chip cannot be shielded well in the prior art.

Summary of the invention

The present application provides a shielding component, a vehicle-mounted device, and a communication device to improve the heat dissipation and shielding effect of the shielding component on the chip.

In a first aspect, a shielding assembly is provided, which is applied to protect the chip. The shielding assembly specifically includes: a wave-absorbing shielding structure and an insulating and thermally conductive adhesive layer; wherein the wave-absorbing shielding structure is a shell structure, so The insulating and thermally conductive adhesive layer is filled in the housing structure; it also includes an anti-adhesion layer that wraps the insulating and thermally conductive adhesive layer, the anti-adhesion layer is an elastic layer; wherein, the insulating and thermally conductive adhesive layer is used for A coverage area covering the peripheral area of the chip; wherein some areas are reserved in the coverage area for coating a conductive adhesive layer, and the conductive adhesive layer is used to isolate a plurality of communication wires connected to the chip. When the shielding component is matched with the chip, the peripheral area of the chip includes the chip and the communication wires connected to the chip. The covering area covers the chip, the insulating and thermally conductive adhesive layer extrudes a groove to accommodate the chip, and the corresponding covering area extrudes a groove for accommodating communication wires. The chip is in contact with the insulating and thermally conductive adhesive layer through the anti-adhesive layer, and the heat generated by the chip is transferred through the insulating and thermally conductive adhesive layer for heat dissipation. The wave-absorbing shielding structure surrounds the containing groove and is used to shield the chip. Some areas are reserved in the coverage area for coating a conductive adhesive layer, and the conductive adhesive layer is used to isolate a plurality of communication wires connected to the chip. That is, the communication wires connected to the receiving pins and the transmitting pins of the chip are separated by a conductive adhesive layer, so as to avoid crosstalk between the communication wires. In use, the surrounding wave-absorbing shielding structure realizes the shielding of the chip by absorbing or reflecting electromagnetic waves. At the same time, the adjacent transmitting pins and the communication wires connected to the receiving pins are electromagnetically separated by the conductive adhesive layer to reduce the communication wires. The crosstalk between the two improves the working effect of the chip. In addition, the conductive adhesive layer electromagnetically isolates the chip and the communication wire covered by the insulating and thermally conductive adhesive layer from the outside of the shielding assembly, thereby improving the working environment of the chip, thereby improving the working effect of the chip.

In a specific implementation, the chip is a radio frequency chip; the communication wire includes a bus connected to the radio frequency chip, and at least two branch lines connected to the bus, each branch line is connected with an antenna The covered area of the insulating and thermally conductive adhesive covers the radio frequency chip, and the insulating and thermally conductive adhesive layer extrudes a receiving groove corresponding to the radio frequency chip; the covered area of the insulating and thermally conductive adhesive covers the bus and the At least two branch lines, and the insulating and thermally conductive adhesive layer extrudes a wire groove corresponding to the bus and the at least two branch lines. The crosstalk between the communication wires connected to the chip is reduced, and the working effect of the chip is improved.

In a specific implementation, the housing structure is provided with an escape groove for avoiding the communication wire. It is convenient for communication wires to pass through the wave-absorbing shielding structure.

In a specific implementation, the wave-absorbing shielding structure is provided with a plurality of reflecting surfaces for reflecting electromagnetic waves on the side facing the containing groove; or,

A plurality of wave-absorbing surfaces for absorbing electromagnetic waves are provided on one side of the wave-absorbing shielding structure close to the setting surface of the containing groove;

A plurality of reflecting surfaces for reflecting electromagnetic waves and a plurality of absorbing surfaces for absorbing electromagnetic waves are provided on the side of the wave-absorbing shielding structure close to the installation surface of the containing groove. The wave-absorbing shielding structure adopts the method of reflecting or absorbing electromagnetic waves to realize the isolation between the chip and the millimeter wave radio frequency signal.

In a specific implementation, the wave-absorbing shielding structure is provided with a plurality of raised structures at intervals, and the wave-absorbing surfaces are arranged on the raised structures in a one-to-one correspondence; or,

The reflecting surfaces are arranged on the protruding structure in a one-to-one correspondence; or,

The wave absorbing surface is arranged on a part of the convex structure, and the reflecting surface is arranged on another part of the convex structure. The above-mentioned wave absorbing surface and reflecting surface are carried by the convex structure.

In a specific implementation, the plurality of protrusions are spirally arranged on the side of the wave-absorbing shielding structure facing the receiving groove. Improve the shielding effect.

In a specific implementation, the wave absorbing and shielding structure is a wave absorbing and shielding structure made of a wave absorbing resin. Has a good absorbing effect.

In a specific implementation, the conductive adhesive layer is disposed around at least a part of the insulating and thermally conductive adhesive layer. The conductive adhesive layer surrounds part of the insulating and thermal conductive adhesive layer to achieve electromagnetic isolation between the chip and the connected communication wire and the shielding assembly.

In a specific implementation, the shielding assembly further includes a heat sink; the heat sink is arranged on a side of the wave-absorbing shielding structure facing away from the receiving groove. The chip is shielded by the heat sink.

In a specific implementation, the heat dissipating device is thermally connected to the wave-absorbing shielding structure. And the heat dissipation of the chip.

In a specific implementation, the heat sink element is provided with a plurality of heat dissipation protrusions; or, the heat sink element is rib-shaped or wave-shaped. Improve the heat dissipation surface of the radiator, thereby improving the heat dissipation effect.

In a specific implementation, the heat sink is embedded in the wave-absorbing shielding structure. Ensure the thermal contact effect between the radiator and the insulating and thermal conductive adhesive layer.

In a specific implementation, the distance between the heat sink device and the edge of the wave-absorbing shielding structure is not less than 0.8 mm. Ensure that the heat sink can be reliably fixed in the insulating and thermally conductive adhesive layer.

In a specific implementation, the anti-adhesion layer is a highly elastic film layer. Exemplarily, the anti-adhesion layer is an anti-adhesion layer having a three-fold stretch and a six-fold stretch.

In a specific implementation, the anti-adhesion layer is an organic silicon thin film layer. Has a good isolation effect.

In a second aspect, a communication device is provided. The communication device includes a substrate, a chip disposed on the substrate, and the shielding assembly according to any one of the above; wherein the shielding assembly is adhesively connected to the substrate , And the chip is located in the containing groove; the chip is thermally connected to the insulating and thermally conductive adhesive layer. When in use, the surrounding wave-absorbing shielding structure realizes the shielding of the chip by absorbing or reflecting electromagnetic waves. At the same time, the conductive adhesive layer electromagnetically isolates the adjacent transmitting pins and the wires connected to the receiving pins, reducing the distance between the wires. The crosstalk improves the working effect of the chip.

In a third aspect, an in-vehicle device is provided. The in-vehicle device includes a substrate, a chip provided on the substrate, and the shielding assembly according to any one of the above; wherein the shielding assembly is adhesively connected to the substrate , And the chip is located in the containing groove; the chip is thermally connected to the insulating and thermally conductive adhesive layer. When in use, the surrounding wave-absorbing shielding structure realizes the shielding of the chip by absorbing or reflecting electromagnetic waves. At the same time, the conductive adhesive layer electromagnetically isolates the adjacent transmitting pins and the wires connected to the receiving pins, reducing the distance between the wires. The crosstalk improves the working effect of the chip.

Description of the drawings

FIG. 1 is a structural block diagram of a radio frequency chip provided by an embodiment of the application;

Figure 2 is a schematic diagram provided by an embodiment of the application;

3 is a schematic diagram of the structure of the inner wave-absorbing shielding component in the shielding component provided by the embodiment of the application;

4 is a schematic cross-sectional view of a wave absorbing and shielding structure provided by an embodiment of the application;

FIG. 5 is a schematic structural diagram of the insulating and thermally conductive adhesive layer provided by the embodiment of the application after being taken out from the thin shielding structure;

FIG. 6 is an exploded schematic diagram of another shielding component provided by an embodiment of the application;

FIG. 7 is an exploded schematic diagram of another shielding component provided by an embodiment of the application;

FIG. 8 is an exploded schematic diagram of another shielding component provided by an embodiment of the application;

FIG. 9 is a schematic diagram of the internal structure of a communication device provided by an embodiment of the application.

Detailed ways

In order to facilitate the understanding of the shielding components provided in the embodiments of this application, first explain its application scenarios. The shielding components provided in the embodiments of this application are used for high-frequency (such as ICT wireless products) and ultra-high-frequency (such as vehicle millimeter wave radar) products. , Used to shield the radio frequency chip. To facilitate understanding, first explain the structure of the radio frequency chip. As shown in FIG. 1, the existing radio frequency chip is arranged on a substrate 100. The radio frequency chip 100 is provided with receiving pins and transmitting pins. The radio frequency chip 100 is assembled to In a high-frequency product or an ultra-high frequency product, the receiving pin of the radio frequency chip 100 is connected to the receiving antenna 202 through a communication wire 201, wherein the communication wire 201 includes a bus 201a connected to the radio frequency chip 100, and two buses connected to the bus 201a. There are two branch lines 201b, and each branch line 201b is connected to one receiving antenna 202. Of course, the number of branch lines 201b can also be set to three or four. In the two radio frequency chips 100 shown in FIG. 1, the upper radio frequency chip 100 (taking the placement position of the radio frequency chip 100 in FIG. 1 as the reference direction) is connected to four groups of receiving antennas 202, and each group of receiving antennas 202 includes two Antennas. The radio frequency chip 100 located below is connected to five groups of receiving antennas 202 through communication wires 201, and each group of receiving antennas 202 includes two antennas. Continuing to refer to FIG. 1, the radio frequency chip 100 located below is also connected to a transmitting antenna 203 through a communication wire 201. In FIG. 1, the transmitting antenna 203 is a group, and the group of transmitting antennas 203 includes two antennas. The communication antenna system of the entire product is formed by the above-mentioned transmitting antenna 203 and receiving antenna 202. When the shielding component in the prior art shields the radio frequency chip 100, it only shields the radio frequency chip 100, but there will still be crosstalk between the communication wires 201 connected to the radio frequency chip 100, as shown in area A in FIG. 1. For this reason, the embodiment of the present application provides a shielding component to improve the working environment of the radio frequency chip 100 and improve the working effect of the radio frequency chip 100.

First, it is explained that the chip in the following in this application refers to a radio frequency chip. In this application, the shielding component shields one radio frequency chip as an example. However, it should be understood that the shielding component provided in the embodiment of this application can also shield two or three different radio frequency chips, and its structure is similar to that of the shielding component. The structure of shielding a radio frequency chip is similar, except that the size change is not visible. Therefore, the following describes an example of shielding a radio frequency chip by a shielding component with reference to the accompanying drawings.

As shown in FIG. 2, FIG. 2 illustrates a schematic structural diagram of a shielding assembly provided by an embodiment of the present application. The shielding assembly shown in FIG. 2 includes a wave-absorbing shielding structure 30 and an insulating and thermally conductive adhesive layer 10. The wave-absorbing and shielding structure 30 is a shell structure, in which is a cavity for accommodating the insulating and thermally conductive adhesive layer 10. The insulating and thermally conductive adhesive layer 10 has a first surface. The first surface in FIG. 2 is a rectangular surface with four The two opposite sides are named the first side, the second side, the third side, and the fourth side for the aspect description. The first surface has a covering area for covering the peripheral area of the chip (the area shown by the dashed frame a in FIG. 1 ), and the covering area may also be the first surface of the insulating and thermally conductive adhesive layer 10. Among them, the chip peripheral area is the area containing the chip and the communication wires connected to the chip. When there are other electronic devices around the chip, such as capacitors or inductors, the coverage area a will also cover them. When the covered area of the insulating and thermally conductive adhesive layer 10 covers the chip, the insulating and thermally conductive adhesive layer 10 is extruded out of the receiving groove 11 corresponding to the chip. The shape of the receiving groove 11 is illustrated in FIG. 2, and the receiving groove 11 is located on the first surface. A middle position or a position close to the middle. In FIG. 2 the containing groove 11 is a rectangular parallelepiped containing groove, but the shape of the containing groove 11 is not limited in the embodiment of the present application. The shape of the containing groove 11 can be determined according to the shape of the chip, for example, the chip is circular or elliptical. Or other shapes, the containing groove 11 is correspondingly set to a shape matching the chip, or other shapes that ensure that the chip can be placed in the containing groove 11.

In order to avoid adhesion between the insulating and thermally conductive adhesive layer 10 and the substrate, an anti-adhesion layer (not shown in the figure) is wrapped around the insulating and thermally conductive adhesive layer 10 to prevent the insulating and thermally conductive adhesive layer 10 from adhering to the substrate and facilitate the disassembly of the shielding components. . The anti-adhesive layer is an elastic layer to ensure that the anti-adhesive layer can be more deformed with the insulating and thermally conductive adhesive layer 10 to form the receiving groove 11 described in Figure 2. Exemplarily, a highly elastic elastic layer is used for the adhesive layer For example, the bonding layer has twice the stretching amount, three times the stretching amount, or six times the stretching amount, so that the bonding layer has enough deformation to match the device in the peripheral area of the chip. The adhesive layer can be made of different materials, for example, the adhesive layer is a silicone film layer, specifically it can be a dimethylsiloxane (PDMS) breathable film, the thickness of the breathable film is not greater than 0.05mm, such as the thickness It is 0.02mm, 0.03mm, 0.04mm, 0.05mm.

The heat generated when the chip is working is transferred to the radiator through the heat dissipation path. The heat dissipation path of the chip includes but is not limited to the substrate, the housing, and the pins. The intermediate path includes but is not limited to the direct contact between the heat sink and the chip or the filling of thermally conductive material. The end path is the heat sink body. The insulating and thermally conductive adhesive layer 10 provided by the embodiment of the present application is used as an intermediate path for dissipating heat to the chip. When the shielding component is connected to the substrate, the chip is located in the receiving groove 11 and thermally connected to the bottom of the receiving groove 11, such as the chip and The bottom of the accommodating groove 11 is directly connected, or the chip is thermally connected to the bottom of the accommodating groove 11 through thermally conductive silicone grease. Exemplarily, the thermal conductivity of the insulating and thermally conductive adhesive layer 10 is not less than 1.5w/mk, such as different thermal conductivity such as 1.5w/mk, 1.8w/mk, 2.0w/mk, 2.5w/mk, 3w/mk, etc. rate. The resistivity of the insulating and thermal conductive adhesive is not less than 1000v/mm, such as the resistivity of 1000v/mm, 1200v/mm, 1500v/mm, 1800v/mm, 2000v/mm and other different resistivities. The material of the insulating and thermally conductive adhesive layer 10 can be thermally conductive silicone grease that changes phase with temperature, but the phase transition temperature of the thermally conductive silicone grease from liquid to solid is not less than 45°C.

Continuing to refer to FIG. 2, when the coverage area of the insulating and thermally conductive adhesive layer 10 covers the bus and at least two branch lines (refer to the corresponding description in FIG. 1), the insulating and thermally conductive adhesive layer is extruded to correspond to the bus and the at least two branch lines. Wire trough. Wherein, the receiving slot 11 is connected to a wire slot, and the wire slot is used to accommodate communication wires connected to pins connected to the chip, such as communication wires connected to receiving pins, transmitting pins, or pins with other functions. The shielding component provided in the embodiment of the present application does not specifically limit the number of wire slots. The specific number of wire slots can correspond to the pins connected to the chip, for example, the number of pins connected to the chip is two, four, or five. When the number is different, the number of corresponding wire guides is also the corresponding number of two, four, five, etc.

Continuing to refer to FIG. 2, taking three wire grooves as an example, the three wire grooves are named as the first wire groove 12 b, the second wire groove 12 a, and the third wire groove 12 c for the description. The first wire groove 12b, the second wire groove 12a, and the third wire groove 12c are located on the same side of the receiving groove 11 and extend to the first side. The first wire groove 12b is located in the middle of the three wire grooves, and the second wire groove 12a and the third wire groove 12c are arranged on both sides of the first wire groove 12b. The first wire groove 12b is a straight wire groove, the second wire groove 12a and the third wire groove 12c are arc-shaped wire grooves, and the second wire groove 12a and the second wire groove 12a are connected to the avoidance groove 33 (set in the housing structure). The upper part of the structure used to avoid the communication wire) is far away from the first wire groove 12b, thereby increasing the separation distance between the first wire groove 12b and the second wire groove 12a and the third wire groove 12c, and reduces the three wires Crosstalk between the communication wires connected to the pins contained in the slot. The arrangement of the wire grooves in the embodiment of the present application is not limited to the way shown in FIG. 2, and other ways can also be used to increase the separation distance between the wire grooves, for example, the wire grooves are located on different side walls of the receiving groove 11, Or the wire grooves extend to different sides of the insulating and thermally conductive adhesive layer 10 to improve the separation distance between the wire grooves.

Continuing to refer to Figure 2, there are some areas reserved for coating the conductive adhesive layer in the coverage area. Since some of the reserved areas are laminated with the conductive adhesive, they are not marked in Figure 2. The shape of some reserved areas can be referred to below The description of the shape of the conductive adhesive in the text. The conductive adhesive layer can be adhered to the shielding component when the shielding component is connected to the substrate. As shown in FIG. 2, the conductive adhesive layer is arranged on the side of the insulating and thermally conductive adhesive layer 10 where the receiving groove 11 is arranged, and is arranged at intervals from the wire groove. In Figure 2, three wire grooves and four conductive adhesive layers are arranged alternately, and any two adjacent wire grooves are separated by a conductive adhesive layer; for the convenience of description, the four conductive adhesive layers are named the first The conductive adhesive layer 20d, the second conductive adhesive layer 20c, the third conductive adhesive layer 20b, and the fourth conductive adhesive layer 20a. A first conductive adhesive layer 20d and a second conductive adhesive layer 20c are respectively provided on both sides of the second wire groove 12a. The first conductive adhesive layer 20d is a T-shaped conductive adhesive layer, and the vertical portion of the first conductive adhesive layer 20d is along the first conductive adhesive layer 20d. The horizontal part of the first conductive adhesive layer 20d extends toward the receiving groove 11; the second conductive adhesive layer 20c is an L-shaped conductive adhesive layer, and the horizontal part of the second conductive adhesive layer 20c is arranged along the first side. The vertical portion of the second conductive adhesive layer 20c is located on one side of the first conductive adhesive layer 12b and extends along the length of the first conductive adhesive layer 12b, and the second conductive adhesive layer 12a is located around the first conductive adhesive layer 20d and the second conductive adhesive layer 20c. Into a rectangular space. A second conductive adhesive layer 20c and a third conductive adhesive layer 20b are respectively provided on both sides of the first wire groove 12b. The third conductive adhesive layer 20b and the second conductive adhesive layer 20c are symmetrically arranged along the axis of the first wire groove 12b. The vertical portion of the conductive adhesive layer 20b is located on one side of the first wire groove 12b and extends along the length of the first wire groove 12b, and the horizontal portion of the third conductive adhesive layer 20b is arranged along the first side; the first wire groove 12b It is located in the space enclosed by the vertical portions of the second conductive adhesive layer 20c and the third conductive adhesive layer 20b. A third conductive adhesive layer 20b and a fourth conductive adhesive layer 20a are respectively provided on both sides of the third wire groove 12c, and the fourth conductive adhesive layer 20a and the first conductive adhesive layer 20d are symmetrically arranged along the axis of the first wire groove 12b. The horizontal portion of the fourth conductive adhesive layer 20a is arranged along the third side of the first surface, the vertical portion of the fourth conductive adhesive layer 20a extends toward the receiving groove 11, and the third wire groove 12c is located between the third conductive adhesive layer 20b and the third conductive adhesive layer 20b. In the rectangular space enclosed by the four conductive adhesive layers 20a. It can be seen from this that any adjacent wire grooves are separated by a conductive adhesive layer, and the conductive adhesive layer is attached to both sides of each wire groove. When the first conductive adhesive layer 20d, the second conductive adhesive layer 20c, the third conductive adhesive layer 20b, and the fourth conductive adhesive layer 20a are specifically arranged, the insulating and thermally conductive adhesive layer 10 is provided with a groove matching each conductive adhesive layer , The shape of the groove is similar to the shape of the corresponding conductive adhesive layer. The conductive adhesive layer passes through the insulating and thermally conductive adhesive layer 10 and is attached to the wave-absorbing and shielding structure 30. When the shielding component is assembled on the substrate, the conductive adhesive layer is connected to the ground on the substrate, thereby achieving electrical isolation of the communication wires and avoiding crosstalk between adjacent communication wires.

In addition, the conductive adhesive layer cooperates with the wave-absorbing shielding structure to electromagnetically isolate the components (chips and communication wires) covered in the shielding assembly from the components outside the shielding assembly (such as the antenna in FIG. 1). As shown in FIG. 2, each conductive adhesive layer (the first conductive adhesive layer 20d, the second conductive adhesive layer 20c, the third conductive adhesive layer 20b, and the fourth conductive adhesive layer 20a) has an edge extending along the edge of the wave-absorbing shielding structure. Structure, and this part of the structure is arranged around at least part of the 10 layers of insulating and thermally conductive glue, thereby isolating the chip and the communication wire from the antenna connected to it (refer to the structure of the radio frequency antenna A and A in Figure 1), improving the chip and The shielding effect of communication wires.

Continuing to refer to FIG. 2, the conductive adhesive layer provided by the embodiment of the present application is not only used to isolate the communication wires connected to the pins, but also used to connect to the substrate where the chip is located. When the shielding component is matched with the chip, the shielding component is adhesively connected to the substrate through the conductive adhesive layer. It can be seen from FIG. 2 that the conductive adhesive layer provided by the embodiment of the present application is located on the three sides of the first surface and is bonded to the substrate. When connecting, it can be firmly bonded to the substrate to ensure the reliability of the connection with the substrate.

It should be understood that what the embodiments of this application provide is that the structural shape of the thermally conductive adhesive layer provided in the embodiments of this application is not limited to the shape shown in Figure 2 above, and can also be based on the shielding of the communication wires and the adhesion of the shielding component to the substrate. Choose conductive adhesive layers of different shapes for the connection effect. Exemplarily, two conductive adhesive layers may be arranged between any two wire grooves for electromagnetic isolation, and at the same time, the bonding effect with the substrate is enhanced.

Referring to FIG. 3 together, FIG. 3 shows a schematic diagram of the structure of the shielding assembly removing part of the insulating and thermally conductive adhesive layer 10. The shielding assembly shown in FIG. 3 includes a wave-absorbing shielding structure 30. The wave-absorbing shielding structure 30 is a shell structure with a cavity in the middle for accommodating the insulating and thermally conductive adhesive layer. When in use, the insulating and thermally conductive adhesive layer is filled in The structure shown in Figure 2 is formed in the middle cavity. 2 and 3 together, it can be seen that the wave-absorbing shielding structure 30 is arranged around the receiving groove 11. The wave absorbing and shielding structure 30 can be made of different materials, and only need to be capable of absorbing or reflecting waves. For example, the wave absorbing and shielding structure 30 uses a wave absorbing resin. Continuing to refer to FIG. 3, the side of the wave absorbing shielding structure 30 facing the receiving groove 11 is provided with a plurality of protrusions, and the multiple protrusions are arranged in a spiral shape on the side of the wave absorbing shielding structure 30 facing the receiving groove 11.

Refer also to FIG. 4, which shows a partial cross-sectional view of the wave-absorbing shield structure 30. It can be seen from FIG. 4 that the direction of the convex structure 33 of each convex structure 33 faces one side of the receiving groove 11. Continuing to refer to FIG. 4, a plurality of protruding structures 33 are arranged at intervals to form a structure similar to a battlement. The side surface on each convex structure 33 is a reflective surface 32 or a wave absorbing surface 31, and the reflective surface 32 and the wave absorbing surface 31 are alternately arranged. As shown in FIG. 4, the reflecting surface 32 and the wave absorbing surface 31 are surfaces inclined outwardly relative to the receiving groove 11, wherein the included angle between the reflecting surface 32 and the axis of the receiving groove 11 is not greater than 10°, for example, the included angle It is 2°, 5°, 8°, 10°, etc. The included angle between the wave-absorbing surface 31 and the axis of the containing groove 11 is not greater than 60°, and exemplary, the included angle is 20°, 30°, 40°, 50°, 60°, and so on. When the chip is shielded, the electromagnetic wave is reflected by the reflective surface 32 of the protrusion structure 33, and the electromagnetic wave is absorbed by the absorption surface to achieve the shielding of the chip. Referring to FIG. 5 together, FIG. 5 shows a schematic structural diagram of the insulating and thermally conductive adhesive layer 10 after being taken out from the wave-absorbing shielding structure 30. It can be seen from FIG. 5 that when there are multiple convex structures in the wave-absorbing shielding structure 30, the corresponding insulating and thermally conductive adhesive layer 10 has a concave structure 13 that matches the convex structure.

It should be understood that the wave absorbing and shielding structure 30 in the embodiments of the present application is not limited to the structure shown in FIG. 4, and other structures may also be used. For example, the wave absorbing and shielding structure 30 only includes a reflective surface 32. 32 are arranged on the convex structure in a one-to-one correspondence; the absorbing and shielding structure 30 only includes the absorbing surface 31, and the absorbing surface 31 is arranged on the convex structure in one-to-one correspondence; the absorbing and shielding structure 30 includes a reflecting surface 32 and an absorbing surface 31, and the absorbing surface 31 It is arranged in a part of the raised structure, and the reflecting surface 32 is arranged in another part of the raised structure, such as a plurality of reflecting surfaces 32 and a plurality of wave absorbing surfaces 31 alternately arranged, as shown in Fig. 4 in a one-to-one alternate arrangement, Or two reflective surfaces 32 and two wave-absorbing surfaces 31 are alternately arranged, and two or more reflective surfaces 32 and two or more wave-absorbing surfaces 31 are alternately arranged in different ways.

The above-mentioned reflecting surface 32, wave absorbing surface 31 or wave absorbing reflecting surface disposed on the convex structure is only an example. The wave absorbing shielding structure 30 provided in the embodiment of the present application can also carry the reflecting surface 32 and the wave absorbing surface 31 through other structures, such as An inclined surface is formed in the wave-absorbing and shielding structure 30, and the reflecting surface 32, the wave-absorbing surface 31 or the wave-absorbing and reflecting surface are arranged on the inclined surface, or a discontinuous inclined surface is formed in the wave-absorbing and shielding structure 30 as the reflecting surface 32 or the wave-absorbing surface 31. It can achieve the effect of absorption or reflection of electromagnetic waves. Therefore, in the embodiment of the present application, only the side of the absorbing and shielding structure 30 facing the receiving groove 11 is provided with a plurality of reflecting surfaces 32 for reflecting electromagnetic waves, or the side of the absorbing and shielding structure 30 close to the setting surface of the receiving groove 11 A plurality of absorbing surfaces 31 for reflecting and absorbing electromagnetic waves are provided, or a side of the absorbing shielding structure 30 close to the installation surface of the containing groove 11 is provided with a plurality of reflecting surfaces 32 for reflecting electromagnetic waves and a plurality of reflecting surfaces 32 for reflecting and absorbing electromagnetic waves. The electromagnetic wave absorbing surface 31 can realize the shielding of the chip, and the specific bearing structure of the absorbing surface 31 and the reflecting surface 32 is not specifically limited in this application.

As shown in FIG. 6, FIG. 6 shows a shielding assembly provided by an embodiment of the present application. The shielding assembly shown in FIG. 6 includes the wave-absorbing shielding structure 30 shown in FIGS. 2 and 3 and the insulating and thermally conductive adhesive layer 10 . The difference between the shielding assembly shown in FIG. 6 and FIG. 2 is that the shielding assembly in FIG. 6 is provided with a layer of radiator element 40a, and the radiator element 40a is provided on the side of the wave-absorbing shielding structure 30 away from the receiving groove. The heat sink 40a is thermally connected to the wave-absorbing shielding structure 30, and the heat transferred from the chip to the insulating and thermally conductive adhesive layer 10 is transmitted to the heat sink 40a through the wave-absorbing shielding structure 30 to be dissipated. The heat sink 40a can be made of copper, aluminum, iron, stainless steel, etc. Made of metals with higher coefficients. Continuing to refer to FIG. 6, the heat sink 40a shown in FIG. 6 is provided with a plurality of heat dissipation protrusions 41, and the plurality of heat dissipation protrusions 41 are arranged in an array on the heat sink 40a. The heat dissipation protrusions 41 are hollow structures, which are formed by stamping or die-casting. One surface of the heat sink 40a is convex, and the other surface is concave. A projection 34a is formed on the mating surface of the insulating and thermally conductive adhesive layer 10 and the heat sink 40a corresponding to each recessed structure.

Continuing to refer to FIG. 6, when the heat sink 40a is embedded in the wave absorbing shield structure 30, the heat sink 40a is directly bonded to the wave absorbing shield structure 30, and the distance between the heat sink 40a and the edge of the wave absorbing shield structure 30 is not less than 0.8 mm, such as Different distances such as 0.8mm, 0.9mm, 1mm, etc., are used to improve the reliability of the connection between the heat sink 40a and the wave-absorbing shielding structure 30. The protrusion 34a of the wave-absorbing shielding structure 30 is inserted into the recessed structure of the heat sink 40a and is attached to the recessed structure to increase the contact area between the wave-absorbing shielding structure 30 and the heat sink 40a, thereby increasing the heat dissipation area. It can be seen from the above description that the heat sink 40a can increase the heat dissipation area of the heat sink 40a by providing the heat dissipation protrusion 41, and at the same time increase the contact area between the heat sink 40a and the wave-absorbing shielding structure 30, thereby improving the heat dissipation effect. . In addition to being used as the heat dissipation structure of the shielding component, the heat sink 40a can also be used as a shielding structure. It can be seen from FIG. 6 that when the heat sink 40a is disposed in the wave-absorbing shielding structure 30, it covers the receiving groove 11, and the metal itself has the ability to reflect electromagnetic waves. Therefore, the heat sink 40a provided can also achieve a shielding effect on the chip and improve the working environment of the chip.

As shown in FIG. 7, the shielding assembly shown in FIG. 7 includes the wave-absorbing shielding structure 30 and the insulating and thermally conductive adhesive layer 10 shown in FIGS. 2 and 3. The difference between the shielding assembly shown in FIG. 7 and FIG. 6 is that the structure of the heat sink device 40 b in FIG. 7 is different from that of the heat sink device 40 b shown in FIG. 6. As shown in FIG. 7, the heat sink 40b is arranged on the side of the wave-absorbing shielding structure 30 away from the receiving groove 11 and is thermally connected to the wave-absorbing shielding structure 30. For details, please refer to the related description in FIG. 6. The radiator element 40b shown in FIG. 7 is a rib-shaped structure 42. The radiator element 40b is composed of a plurality of bent structures with a trapezoidal cross section. The wave-absorbing and shielding structure 30 is provided with a rib-shaped structure corresponding to the radiator element 40b. 34b. During assembly, the radiator element 40b is embedded in the wave-absorbing shielding structure 30, and the rib-shaped structure 42 of the radiator element 40b is matched with the rib-shaped structure 34b (groove and protrusion structure) corresponding to the radiator element 40b in a one-to-one correspondence. The contact area between the wave-absorbing shielding structure 30 and the heat sink 40b is increased, thereby increasing the heat dissipation area. The heat sink 40b in FIG. 7 also covers the receiving groove 11, and the metal itself has the effect of reflecting electromagnetic waves. Therefore, the heat sink 40b provided can also achieve the shielding effect of the chip and improve the working environment of the chip.

As shown in FIG. 8, the shielding assembly shown in FIG. 8 includes the wave absorbing shield structure 30 and the wave absorbing shield structure 30 shown in FIGS. 2 and 3. The difference between the shielding assembly shown in FIG. 8 and FIG. 6 is that the structure of the heat sink device 40c in FIG. 8 is different from that of the heat sink device 40c shown in FIG. 6. As shown in FIG. 8, the heat sink 40c is disposed on the side of the wave-absorbing shielding structure 30 away from the receiving groove 11 and is thermally connected to the wave-absorbing shielding structure 30. For details, please refer to the related description in FIG. 6. The radiator element 40c shown in FIG. 8 is a wave-shaped structure 43. The radiator element 40c is composed of a plurality of bent structures with a trapezoidal cross-section. The wave-absorbing and shielding structure 30 is provided with a wave-shaped structure 34c corresponding to the radiator element 40c. Groove and convex structure). When assembling, the radiator element 40c is embedded in the wave absorbing shield structure 30, and the wave-shaped structure 43 of the radiator element 40c and the wave-shaped structure 34c corresponding to the radiator element 40c are matched in one-to-one correspondence to enlarge the wave-absorbing shield structure 30 and the radiator element. The contact area of 40c increases the heat dissipation area. The heat sink 40c in FIG. 8 also covers the wave-absorbing shielding structure 30 and the receiving groove 11, and the metal itself has the effect of reflecting electromagnetic waves. Therefore, the heat sink 40c provided can also achieve the shielding effect of the chip and improve the working environment of the chip.

It should be understood that the above-mentioned Figures 6 to 8 only illustrate several specific structural forms of the heat sink. In the shielding assembly provided in the embodiment of the present application, the structure of the heat sink is not limited to the structural forms of Figures 6 to 8 Other structural forms can also be adopted, for example, a rectangular plate is used for the heat sink, and no other structure is provided, or the heat sink is provided with protrusions such as cylindrical protrusions, triangular protrusions, etc., which improve the heat dissipation effect.

The electromagnetic wave shielding method mainly includes shielding and absorption. The shielding is the skin effect on the surface of the shielding structure, which converts electromagnetic energy into heat energy. There are two main types of electromagnetic wave shielding materials: metal materials and wave absorbing materials. Among them, the metal shielding structure has the best blocking effect, but there is relatively strong electromagnetic wave reflection, which is prone to the problem of saturation of the shielding cavity. However, the blocking effect of the absorbing material structure is better, the reflection of electromagnetic waves is relatively weak, and there is no problem of saturation of the shielding cavity. In the embodiment of the present application, the heat sink and the wave-absorbing shielding structure 30 are used to improve the shielding performance of the chip, and the working environment of the chip is improved. At the same time, the heat sink and the wave-absorbing shielding structure 30 also cover The wiring groove is avoided, the external electromagnetic waves are prevented from affecting the pins in the wiring groove, and the communication effect of the entire chip is improved.

As shown in FIG. 9, FIG. 9 shows a schematic diagram of the internal structure of a communication device provided by an embodiment of the present application. The communication device shown in FIG. 9 includes a substrate 100, and components such as a chip 200 and an antenna disposed on the substrate 100, wherein the chip 200 and the antenna are connected through a pin and a communication wire 201 connected thereto. And the chip 200 is shielded by the shielding assembly 300. During assembly, the shielding assembly 300 is adhesively connected to the substrate 100, specifically connected to the substrate 100 through a conductive adhesive layer, and the chip 200 is located in the receiving groove 11 and thermally connected to the insulating and thermally conductive adhesive layer 10. The surrounding wave-absorbing shielding structure realizes the shielding of the chip 200 by absorbing or reflecting electromagnetic waves, and at the same time electromagnetically isolates the communication wires 201 connected to the adjacent pins (transmitting and receiving pins) by the conductive adhesive layer, reducing The crosstalk between the communication wires improves the working effect of the chip.

The embodiment of the application also provides a vehicle-mounted device, such as a vehicle-mounted millimeter wave radar. The vehicle-mounted equipment includes a substrate, a chip provided on the substrate, and the shielding assembly of any one of the above; wherein the shielding assembly is adhesively connected to the substrate, and the chip is located in the receiving groove ; The chip is thermally connected to the insulating and thermally conductive adhesive layer. In use, the surrounding wave-absorbing shielding structure realizes the shielding of the chip by absorbing or reflecting electromagnetic waves. At the same time, the adjacent transmitting pins and the communication wires connected to the receiving pins are electromagnetically separated by the conductive adhesive layer to reduce the communication wires. The crosstalk between the two improves the working effect of the chip.

The above are only specific implementations of this application, but the scope of protection of this application is not limited to this. Any person skilled in the art can easily conceive of changes or substitutions within the technical scope disclosed in this application, which shall cover Within the scope of protection of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims

A shielding assembly, characterized by comprising: a wave-absorbing shielding structure and an insulating and thermally conductive adhesive layer; the wave-absorbing and shielding structure is a shell structure, and the insulating and thermally conductive adhesive layer is filled in the shell structure; and further comprising a package The anti-adhesion layer of the insulating and thermally conductive adhesive layer, the anti-adhesion layer is an elastic layer; wherein,

The insulating and thermally conductive adhesive layer has a covering area for covering the peripheral area of the chip; wherein, some areas are reserved in the covering area for coating a conductive adhesive layer, and the conductive adhesive layer is used to isolate the chip connection Multiple communication wires.
The shielding assembly according to claim 1, wherein the chip is a radio frequency chip; the communication wire comprises a bus connected to the radio frequency chip, and at least two branch wires connected to the bus, each Antenna is connected to the branch line;

The covering area of the insulating and thermally conductive adhesive covers the radio frequency chip, and the insulating and thermally conductive adhesive layer is extruded to form a receiving groove corresponding to the radio frequency chip;

The covering area of the insulating and thermally conductive adhesive covers the bus and the at least two branch lines, and the insulating and thermally conductive adhesive layer extrudes a wire groove corresponding to the bus and the at least two branch lines.
The shielding assembly according to claim 1 or 2, wherein the housing structure is provided with an escape groove for avoiding the communication wire.
The shielding assembly according to any one of claims 1 to 3, wherein the side of the wave-absorbing shielding structure facing the coverage area is provided with a plurality of reflecting surfaces for reflecting electromagnetic waves; or,

A plurality of wave-absorbing surfaces for absorbing electromagnetic waves are provided on the side of the wave-absorbing shielding structure close to the setting surface of the coverage area;

A plurality of reflecting surfaces for reflecting electromagnetic waves and a plurality of absorbing surfaces for absorbing electromagnetic waves are arranged on a side of the wave-absorbing shielding structure close to the covering area setting surface.
The shielding assembly according to claim 4, wherein the wave-absorbing shielding structure is provided with a plurality of raised structures at intervals, and the wave-absorbing surfaces are arranged on the raised structures in a one-to-one correspondence; or,

The reflecting surfaces are arranged on the protruding structure in a one-to-one correspondence; or,

The wave absorbing surface is arranged on a part of the convex structure, and the reflecting surface is arranged on another part of the convex structure.
The shield assembly according to claim 5, wherein the plurality of protrusions are arranged in a spiral shape on a side of the wave-absorbing shielding structure facing the coverage area.
The shielding assembly according to claim 5 or 6, wherein the wave-absorbing shielding structure is a wave-absorbing shielding structure made of a wave-absorbing resin.
8. The shielding assembly according to any one of claims 1 to 7, wherein the conductive adhesive layer is provided around at least a part of the insulating and thermally conductive adhesive layer.
8. The shielding assembly according to any one of claims 1 to 8, wherein the shielding assembly further comprises a heat sink; the heat sink is arranged on a side of the wave-absorbing shielding structure facing away from the coverage area.
9. The shielding assembly according to claim 9, wherein the heat sink is thermally connected to the wave-absorbing shielding structure.
The shield assembly according to claim 10, wherein the heat sink is provided with a plurality of heat dissipation protrusions; or, the heat sink is rib-shaped or wave-shaped.
The shielding assembly according to claim 10 or 11, wherein the heat sink is embedded in the wave-absorbing shielding structure.
The shielding assembly according to claim 12, wherein the distance between the heat sink and the edge of the wave-absorbing shielding structure is not less than 0.8 mm.
The shielding assembly according to any one of claims 1 to 13, wherein the anti-adhesion layer is an organic silicon thin film layer.
A communication device, characterized by comprising a substrate, a chip arranged on the substrate, and the shielding assembly according to any one of claims 1 to 14; wherein,

The shielding component is adhesively connected to the substrate, and the chip is located in the covering area; the chip is thermally connected to the insulating and thermally conductive adhesive layer.
An in-vehicle device, characterized by comprising a substrate, a chip arranged on the substrate, and the shielding assembly according to any one of claims 1 to 14; wherein,

The shielding component is adhesively connected to the substrate, and the chip is located in the covering area; the chip is thermally connected to the insulating and thermally conductive adhesive layer.