WO2021136067A1 - 一种基板及显示面板 - Google Patents

一种基板及显示面板 Download PDF

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Publication number
WO2021136067A1
WO2021136067A1 PCT/CN2020/139084 CN2020139084W WO2021136067A1 WO 2021136067 A1 WO2021136067 A1 WO 2021136067A1 CN 2020139084 W CN2020139084 W CN 2020139084W WO 2021136067 A1 WO2021136067 A1 WO 2021136067A1
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WIPO (PCT)
Prior art keywords
substrate
lead
edge
metal layer
electrode
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PCT/CN2020/139084
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English (en)
French (fr)
Inventor
徐旭
徐姗姗
王文超
方鑫
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京东方科技集团股份有限公司
福州京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 福州京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US17/281,586 priority Critical patent/US11487169B2/en
Publication of WO2021136067A1 publication Critical patent/WO2021136067A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13458—Terminal pads
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306—Details
    • G02F1/1309—Repairing; Testing
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing

Definitions

  • the embodiments of the present disclosure relate to, but are not limited to, the technical field of display devices, and in particular to a substrate and a display panel.
  • the detection leads of the bonded electrodes of the array substrate are designed to be straight.
  • the electrode leads of this design have less adhesion area to the substrate, and the corresponding adhesion is weak. At the edge of the array substrate, the electrode leads are damaged. To make its adhesion lower, it is easy to cause the bonding electrode to fall off when performing operations such as chip-on film and anisotropic conductive film (COF&ACF) removal (high incidence in non-cutting products).
  • COF&ACF anisotropic conductive film
  • the electrode lead In order to improve the poor shedding of the bonded electrode, the electrode lead usually adopts a zigzag design, that is, by bending the wiring, the adhesion area of the electrode lead and the substrate is increased, and the adhesion is improved.
  • the number of data lines arranged by a single chip on film (COF) has increased, and the corresponding bonding electrode spacing has become smaller and smaller, that is, the electrode lead spacing has become smaller, and the use of Zigzag will further reduce the number of electrodes
  • the distance between the leads, after cutting and grinding processes, is very easy to cause short circuit of the adjacent electrode leads, and the data line short circuit (DDS) defect occurs.
  • DDS data line short circuit
  • the present disclosure provides a substrate including a display area and a binding area located outside the display area and close to the edge of the substrate, wherein the binding area is provided with a binding electrode, and the binding electrode faces the
  • a first lead extending toward the edge of the substrate is connected to one side of the edge of the substrate, and the first lead includes a bent section close to the binding electrode and a straight section close to the edge of the substrate.
  • the distance between the bent section of the first lead and the edge of the substrate is greater than 0.2 mm.
  • the first lead is arranged perpendicular to the edge of the substrate, and the straight section of the first lead extends to the edge of the substrate.
  • the distance between the binding electrode and the edge of the substrate is L
  • the length of the bent section of the first lead in a direction perpendicular to the edge of the substrate is a
  • the width of the bent section of the first lead is less than or equal to the width of the binding electrode.
  • the binding electrode includes a first metal layer, an insulating layer, and a second metal layer sequentially stacked on a substrate, and the second metal layer passes through the overpass provided on the insulating layer.
  • the hole is connected to the first metal layer, the second metal layer is used for bonding and connection with an external circuit board, and the first lead is connected to the first metal layer.
  • a second lead is connected to a side of the bonding electrode away from the first lead, and the second lead is connected to the first metal layer and is connected to the display area.
  • the signal wires inside are connected; the first lead, the first metal layer and the second lead are arranged in the same layer.
  • the material of the second metal layer includes a transparent material.
  • the binding electrodes there are a plurality of the binding electrodes, and the first leads of the plurality of binding electrodes are arranged in parallel.
  • the present disclosure also provides a display panel, including any of the above-mentioned substrates.
  • FIG. 1 is a schematic diagram of a top view structure of a display panel
  • FIG. 2 is a schematic diagram of the structure of the bonding electrode of the substrate and the detection lead connected to it in the display panel of FIG. 1;
  • FIG. 3 is a schematic diagram of the structure of the binding electrode of the substrate and the detection lead connected thereto;
  • FIG. 4 is a partial top view structural diagram of a binding area of a substrate according to an embodiment of the disclosure.
  • Fig. 5 is a cross-sectional view taken along line A-A in Fig. 4.
  • Figure 1 shows a top view of a display panel.
  • a liquid crystal display panel as an example. It includes an array substrate and a color filter substrate that are arranged opposite to each other. The two sides of the array substrate ( Or one side) is arranged protruding from the color filter substrate, and the portion of the array substrate protruding from the edge 4 of the color filter substrate forms a binding area 3 (that is, a Pad area, also called a pad area).
  • the part of the array substrate that overlaps the color filter substrate includes the middle display area 1 (namely Active Area, AA area for short) and the frame sealing area 2 (namely Sealing Area) located at the periphery of the display area 1.
  • the frame sealing area 2 is used for color
  • the circumferential edge of the film substrate is bonded and fixed to the array substrate.
  • the bonding area 3 of the array substrate is provided with bonding electrodes (Bonding LEAD) for electrical connection with the external circuit board bonding (Bonding) to provide signals to the display panel.
  • FIG. 2 shows a schematic structural diagram of the bonding electrode 6 in the bonding area 3 of the array substrate in the large-size (such as 110-inch, etc.) display panel of FIG. 1 and the detection leads connected thereto.
  • the bonding electrode 6 is connected with a first lead 7, and the first lead 7 is a detection lead for introducing a test signal into the array substrate.
  • the entire detection lead is designed to be straightened. In this way, the adhesion between the detection lead and the array substrate is weak, which easily drives the bonding electrode 6 to fall off, causing external signals to fail to enter the display panel through the bonding electrode 6.
  • Fig. 3 shows the structure of at least one binding electrode 6 and the detection lead connected to it.
  • the detection lead ie the first lead 7
  • adopts a zigzag wiring design that is, the detection lead and the array substrate are enlarged by bending the wiring.
  • Adhesion area improve adhesion, such as 82, 86 inches and other products.
  • the number of data lines arranged by a single chip on film (COF) increases, that is, the spacing between signals (the width w of the bonding electrode 6 and the spacing s of the electrode 6) decrease, and the corresponding bonding
  • the distance between the electrodes 6 is getting smaller and smaller, that is, the distance between the detection leads becomes smaller.
  • the use of Zigzag will further reduce the distance between the detection leads. After cutting and grinding (the substrate mother board is cut to form multiple substrates, the cutting surface is After forming the end face of the substrate, it is generally necessary to grind the end face of the substrate after cutting), etc., it is very easy to cause a short circuit of the adjacent detection leads, resulting in poor DDS.
  • an embodiment of the present disclosure provides a substrate, including a display area 1 and a binding area 3 located outside the display area 1 and close to the edge 5 of the substrate, as shown in FIG.
  • a binding electrode 6 is provided in the binding area 3, and a side of the binding electrode 6 facing the substrate edge 5 is connected with a first lead 7 extending toward the substrate edge 5, and the first lead 7 includes The curved section (which may be a Zigzag shape, etc.) close to the binding electrode 6 and the straight section close to the edge 5 of the substrate.
  • the bonding electrode 6 is used for electrical connection with an external circuit board bonding (bonding) to provide a driving signal to the inside of the substrate.
  • the first lead 7 can be used as a detection lead for introducing a test signal into the substrate through the bonding electrode 6.
  • the first lead 7 of the binding electrode 6 facing the edge 5 of the substrate is designed to include a curved section 71 close to the binding electrode 6 and a straight section close to the edge 5 of the substrate. 72.
  • the adhesion between the first lead 7 and the substrate is improved by the bent section 71 of the first lead 7 to improve the failure of the bonding electrode 6 to fall off, and the straight section 72 of the first lead 7 improves the adjacent first lead caused by cutting and grinding.
  • the short circuit (DDS) of 7 is poor, and the two complement each other, which improves the reliability of the bonding electrode 6 and is suitable for large-size display panels.
  • the cutting fluctuation range is ⁇ 0.1mm, and the grinding accuracy is 0.1mm. Therefore, in order to prevent poor DDS of the substrate during the cutting and grinding process, an example is In the embodiment, the distance between the bent section 71 of the first lead 7 and the edge 5 of the substrate is greater than 0.2 mm.
  • the first lead 7 may be arranged perpendicular to the edge 5 of the substrate, and the straight section 72 of the first lead 7 extends to the edge 5 of the substrate.
  • the distance between the binding electrode 6 and the edge 5 of the substrate is L, that is, the length of the first lead 7 in the direction perpendicular to the edge 5 of the substrate is L, and the bending of the first lead 7
  • the length of the section 71 in the direction perpendicular to the edge 5 of the substrate is a
  • b L/3 ⁇ L/2, which not only guarantees the adhesion, but also avoids DDS failure occurred.
  • the width c of the bent section 71 of the first lead 7 may be less than or equal to the width w of the bonding electrode 6, that is, c ⁇ w. If c is too large, it will cause DDS. If it is too small, it is not conducive to improving the first lead 7 and the substrate. Of adhesion.
  • the width w of the bonding electrode 6 23um
  • the spacing s of the bonding electrode 6 20um
  • the total length of the first lead 7 L 0.7mm
  • the length b of the straight section 72 of the first lead 7 is 0.34 mm
  • the bonding electrode 6 may include a first metal layer 9, an insulating layer 10, and a second metal layer 11 sequentially stacked on the substrate 13 (the first metal layer 9 is compared with the second metal layer 9).
  • the second metal layer 11 is disposed close to the substrate 13), and the second metal layer 11 is connected to the first metal layer 9 through a via 12 provided on the insulating layer 10.
  • the second metal layer 11 is used for bonding and connecting with an external circuit board to provide driving signals to the inside of the substrate.
  • the end of the bent section 71 of the first lead 7 is connected to the side of the first metal layer 9 facing the edge 5 of the substrate, and the straight section 72 of the first lead 7 extends to the edge 5 of the substrate.
  • the first lead 7 can be used to introduce a test signal into the substrate through the first metal layer 9.
  • a second lead 8 is connected to the side of the binding electrode 6 away from the first lead 7, and the end of the second lead 8 is connected to the first metal layer 9.
  • the side away from the first lead 7 is connected, and the second lead 8 is also connected to the signal line in the display area 1.
  • the second lead 8 is used to transmit the electrical signals (including external test signals or driving signals, etc.) obtained by the bonding electrode 6 to the signal lines inside the substrate.
  • the signal lines may be gate lines, data lines, and the like.
  • the first lead 7, the first metal layer 9 and the second lead 8 may be arranged in the same layer, and may be the same material and arranged in the same layer as the gate or data lines of the substrate.
  • the insulating layer 10 may include The gate insulating layer 101 and the passivation layer 102 are stacked, and the gate insulating layer 101 covers the first metal layer 9.
  • the material of the second metal layer 11 may include a transparent material, such as indium tin oxide (ITO).
  • ITO indium tin oxide
  • each binding electrode 6 can be connected to a corresponding signal line (such as a gate line or a data line) in the display area 1 through a second lead 8 connected to it.
  • the first leads 7 of the plurality of binding electrodes 6 may be arranged in parallel.
  • the embodiment of the present disclosure also provides a display panel including the substrate.
  • the display panel of this exemplary embodiment may be a liquid crystal display panel or an OLED panel, etc.
  • the substrate is a driving substrate, and in the case of a liquid crystal display panel, an array substrate.
  • the first lead of the binding electrode facing the edge of the substrate is designed to include a curved section close to the binding electrode and a straight section close to the edge of the substrate.
  • the straight section of the first lead is used to improve the short circuit (DDS) of adjacent first leads caused by cutting and grinding. Poor, the two complement each other and enhance the reliability of the bonded electrode.
  • connection means fixed connection or Removable connection, or integral connection
  • installation means fixed connection or Removable connection, or integral connection
  • installation can be direct connection, indirect connection through an intermediate medium, or internal communication between two components.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract

一种基板及显示面板，涉及显示装置技术领域，基板包括显示区（1）和位于显示区（1）外并靠近基板的边缘（5）的绑定区（3），绑定区（3）内设有绑定电极（6），绑定电极（6）的朝向基板边缘（5）的一侧连接有朝向基板边缘（5）延伸的第一引线（7），第一引线（7）包括靠近绑定电极（6）的弯曲段（71）和靠近基板边缘（5）的直线段（72）。

Description

一种基板及显示面板
本申请要求于2020年1月2日提交中国专利局、申请号为202020007390.6、发明名称为“一种基板及显示面板”的中国专利申请的优先权，其内容应理解为通过引用的方式并入本申请中。
技术领域
本公开实施例涉及但不限于显示装置技术领域，具体涉及一种基板及显示面板。
背景技术
一些大尺寸显示面板产品中阵列基板的绑定电极的检测引线设计成直线，此种设计的电极引线与基板粘附面积较少，相应粘附力较弱，在阵列基板边缘，由于电极引线破损使其附着力更低，进行覆晶薄膜和各向异性导电膜(COF&ACF)去除等操作时容易发生(无切削产品中高发)绑定电极脱落现象。
为了改善绑定电极脱落不良，电极引线通常采用锯齿形(Zigzag)设计，即通过弯曲走线，增大电极引线与基板粘附面积，提升粘附力。然而随着技术提升及低成本化，单个覆晶薄膜(COF)排布的数据线增多，相应的绑定电极的间距越来越小，即电极引线间距变小，采用Zigzag会进一步减小电极引线之间的间距，经过切割和研磨等工序后，极易造成相邻电极引线短路，发生数据线短接(DDS)不良。
发明内容
以下是对本公开详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。
本公开提供了一种基板，包括显示区和位于所述显示区外并靠近所述基板的边缘的绑定区，所述绑定区内设有绑定电极，所述绑定电极的朝向所述 基板边缘的一侧连接有朝向所述基板边缘延伸的第一引线，所述第一引线包括靠近所述绑定电极的弯曲段和靠近所述基板边缘的直线段。
在一示例性的实施方式中，所述第一引线的弯曲段与所述基板边缘之间的距离大于0.2mm。
在一示例性的实施方式中，所述第一引线垂直于所述基板边缘设置，所述第一引线的直线段延伸至所述基板边缘。
在一示例性的实施方式中，所述绑定电极与所述基板边缘之间的距离为L，所述第一引线的弯曲段在垂直于所述基板边缘方向上的长度为a，所述第一引线的直线段的长度为b，其中，L＝a+b，b＝L/3～L/2。
在一示例性的实施方式中，所述第一引线的弯曲段的宽度小于等于所述绑定电极的宽度。
在一示例性的实施方式中，所述绑定电极包括依次叠设在基底上的第一金属层、绝缘层和第二金属层，所述第二金属层通过所述绝缘层上设置的过孔与所述第一金属层连接，所述第二金属层用于与外接电路板绑定连接，所述第一引线与所述第一金属层连接。
在一示例性的实施方式中，所述绑定电极的远离所述第一引线的一侧连接有第二引线，所述第二引线与所述第一金属层连接，并与所述显示区内的信号线连接；所述第一引线、所述第一金属层和所述第二引线同层设置。
在一示例性的实施方式中，所述第二金属层的材料包括透明材料。
在一示例性的实施方式中，所述绑定电极设置有多个，所述多个绑定电极的第一引线平行设置。
本公开还提供了一种显示面板，包括任一所述的基板。
在阅读并理解了附图和详细描述后，可以明白其他方面。
附图说明
附图用来提供对本公开技术方案的进一步理解，并且构成说明书的一部分，与本公开的实施例一起用于解释本公开的技术方案，并不构成对本公开 技术方案的限制。
图1为一种显示面板的俯视结构示意图；
图2为图1的显示面板中基板的绑定电极及其连接的检测引线的结构示意图；
图3为基板的绑定电极及其连接的检测引线的结构示意图；
图4为本公开一实施例的基板的绑定区的局部俯视结构示意图；
图5为图4中的A-A剖视图。
具体实施方式
下面结合附图并通过具体实施方式来进一步说明本公开的技术方案。可以理解的是，此处所描述的具体实施例仅仅用于解释本公开，而非对本公开的限定。在不冲突的情况下，本公开中的实施例及实施例中的特征可以相互任意组合。
如图1所示，图1示出了一种显示面板的俯视结构图，以液晶显示面板为例说明，其包括相对贴合设置的阵列基板和彩膜基板，阵列基板的两个侧边(或者一个侧边)凸出于彩膜基板设置，阵列基板的凸出于彩膜基板边缘4的部分形成绑定区3(即Pad区，也称衬垫区)。阵列基板的与彩膜基板重叠的部分包括中间的显示区1(即Active Area，简称AA区)和位于显示区1周边的封框区2(即Sealing Area)，封框区2用于将彩膜基板的周向边缘与阵列基板粘结固定。阵列基板的绑定区3内设有绑定电极(Bonding LEAD)，用于与外接电路板绑定(Bonding)电连接，以向显示面板提供信号。
如图2所示，图2示出了图1的大尺寸(比如110寸等)显示面板中阵列基板的绑定区3内绑定电极6及与其连接的检测引线的结构示意图。图2中绑定电极6连接有第一引线7，第一引线7为检测引线，用于向阵列基板内部引入测试信号。检测引线整个为拉直设计，这样，检测引线与阵列基板之间的粘附力弱，容易带动绑定电极6脱落，导致外界信号无法通过绑定电极6进入显示面板。
如图3所示，图3示出了至少一个绑定电极6及与其连接的检测引线的 结构。此设计中，为了改善图2设计中绑定电极6脱落不良，检测引线(即第一引线7)整个采用锯齿形(Zigzag)走线设计，即通过弯曲走线，增大检测引线与阵列基板的粘附面积，提升粘附力，如82、86寸等产品。而随着技术提升及低成本化，单个覆晶薄膜(COF)排布的数据线增多，即信号间的间距(绑定电极6的宽度w和电极6间距s)减小，相应的绑定电极6的间距越来越小，即检测引线之间的间距变小，采用Zigzag会进一步减小检测引线之间的间距，经过切割和研磨(基板母板经切割形成多个基板，切割面即形成基板的端面，切割后一般需对基板的端面进行研磨)等工序后，极易造成相邻检测引线短路，发生DDS不良。
继续参见图1，本公开的实施例提供了一种基板，包括显示区1和位于所述显示区1外并靠近所述基板的边缘5的绑定区3，如图4所示，所述绑定区3内设有绑定电极6，所述绑定电极6的朝向所述基板边缘5的一侧连接有朝向所述基板边缘5延伸的第一引线7，所述第一引线7包括靠近所述绑定电极6的弯曲段(可以为Zigzag形等)和靠近所述基板边缘5的直线段。
在一示例性的实施方式中，绑定电极6用于与外接电路板绑定(Bonding)电连接，以向基板内部提供驱动信号。第一引线7可用作检测引线，用于通过绑定电极6向所述基板内部引入测试信号。
如图4所示，本示例性实施例的基板，将绑定电极6的朝向基板边缘5侧的第一引线7设计为包括靠近绑定电极6的弯曲段71和靠近基板边缘5的直线段72。这样，通过第一引线7的弯曲段71提升第一引线7与基板的粘附力，改善绑定电极6脱落不良，通过第一引线7的直线段72改善切割研磨造成的相邻第一引线7的短接(DDS)不良，两者相辅相成，提升绑定电极6的使用信赖性，适用于大尺寸显示面板。
考虑到目前G8.5代线玻璃切割及研磨工艺能力，其中切割波动范围为±0.1mm，研磨精度为0.1mm，因此，为防止在切割及研磨过程中造成基板的DDS不良，在一示例性的实施方式中，所述第一引线7的弯曲段71与所述基板边缘5之间的距离大于0.2mm。
如图4所示，所述第一引线7可以垂直于所述基板边缘5设置，所述第一引线7的直线段72延伸至所述基板边缘5。其中，所述绑定电极6与所述 基板边缘5之间的距离为L，也即第一引线7在垂直于所述基板边缘5方向上的长度为L，所述第一引线7的弯曲段71在垂直于所述基板边缘5方向上的长度为a，所述第一引线7的直线段72的长度为b，其中，L＝a+b，b大于0.2mm，随着b值增大，a值减小，不利于第一引线7与基板粘附力的提升，因此，在一示例性的实施方式中，b＝L/3～L/2，既保证粘附力，又避免发生DDS不良。以L＝0.6mm(即a+b＝0.6mm)为例，可以是b＝0.2～0.3mm，相应地a＝0.3～0.4mm。
所述第一引线7的弯曲段71的宽度c可以小于等于所述绑定电极6的宽度w，即c≤w，c过大亦会造成DDS，过小不利于提升第一引线7与基板的粘附力。
以98寸产品设计版图为例，绑定电极6的宽度w＝23um，绑定电极6的间距s＝20um，第一引线7的总长L＝0.7mm，其中，第一引线7的弯曲段71的垂直长度a＝0.36mm，第一引线7的直线段72的长度b＝0.34mm，第一引线7的弯曲段71的宽度c＝w＝23um。
如图4和图5所示，所述绑定电极6可以包括依次叠设在基底13上的第一金属层9、绝缘层10和第二金属层11(第一金属层9相较于第二金属层11靠近基底13设置)，所述第二金属层11通过所述绝缘层10上设置的过孔12与所述第一金属层9连接。所述第二金属层11用于与外接电路板绑定连接，以向基板内部提供驱动信号。如图4所示，所述第一引线7的弯曲段71的端部与所述第一金属层9的朝向基板边缘5的一侧连接，第一引线7的直线段72延伸至基板边缘5，第一引线7可用于通过第一金属层9向所述基板内部引入测试信号。
如图4和图5所示，所述绑定电极6的远离所述第一引线7的一侧连接有第二引线8，所述第二引线8的端部与所述第一金属层9的远离第一引线7的一侧连接，第二引线8还与所述显示区1内的信号线连接。其中，第二引线8用于将绑定电极6获得的电信号(包括外界的测试信号或驱动信号等)传输至基板内部的信号线，所述的信号线可以是栅线、数据线等。所述第一引线7、所述第一金属层9和所述第二引线8可以同层设置，并可以与基板的栅线或数据线采用相同材料且同层设置，绝缘层10可以包括依次叠设的栅 绝缘层101和钝化层102，栅绝缘层101将第一金属层9覆盖。
所述第二金属层11的材料可以包括透明材料，比如可以为氧化铟锡(ITO)。
如图4所示，所述绑定电极6设置有多个，每个绑定电极6可以通过其连接的第二引线8与显示区1内相应的信号线(比如栅线或数据线)连接。所述多个绑定电极6的第一引线7可以平行设置。
本公开的实施例还提供一种显示面板，包括所述的基板。本示例性实施例的显示面板可以是液晶显示面板或者OLED面板等，所述的基板为驱动基板，在液晶显示面板中为阵列基板。
本公开的基板，将绑定电极的朝向基板边缘侧的第一引线设计为包括靠近绑定电极的弯曲段和靠近基板边缘的直线段。这样，通过第一引线的弯曲段提升第一引线与基板的粘附力，改善绑定电极脱落不良，通过第一引线的直线段改善切割研磨造成的相邻第一引线的短接(DDS)不良，两者相辅相成，提升绑定电极的使用信赖性。
在本公开实施例的描述中，除非另有明确的规定和限定，术语“连接”、“固定连接”、“安装”、“装配”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；术语“安装”、“连接”、“固定连接”可以是直接相连，也可以通过中间媒介间接相连，或是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本公开实施例中的具体含义。

Claims (10)

  1. 一种基板，包括显示区和位于所述显示区外并靠近所述基板的边缘的绑定区，其中，所述绑定区内设有绑定电极，所述绑定电极的朝向所述基板边缘的一侧连接有朝向所述基板边缘延伸的第一引线，所述第一引线包括靠近所述绑定电极的弯曲段和靠近所述基板边缘的直线段。
  2. 如权利要求1所述的基板，其中，所述第一引线的弯曲段与所述基板边缘之间的距离大于0.2mm。
  3. 如权利要求2所述的基板，其中，所述第一引线垂直于所述基板边缘设置，所述第一引线的直线段延伸至所述基板边缘。
  4. 如权利要求3所述的基板，其中，所述绑定电极与所述基板边缘之间的距离为L，所述第一引线的弯曲段在垂直于所述基板边缘方向上的长度为a，所述第一引线的直线段的长度为b，其中，L＝a+b，b＝L/3～L/2。
  5. 如权利要求2所述的基板，其中，所述第一引线的弯曲段的宽度小于等于所述绑定电极的宽度。
  6. 如权利要求1所述的基板，其中，所述绑定电极包括依次叠设在基底上的第一金属层、绝缘层和第二金属层，所述第二金属层通过所述绝缘层上设置的过孔与所述第一金属层连接，所述第二金属层用于与外接电路板绑定连接，所述第一引线与所述第一金属层连接。
  7. 如权利要求6所述的基板，其中，所述绑定电极的远离所述第一引线的一侧连接有第二引线，所述第二引线与所述第一金属层连接，并与所述显示区内的信号线连接；所述第一引线、所述第一金属层和所述第二引线同层设置。
  8. 如权利要求6所述的基板，其中，所述第二金属层的材料包括透明材料。
  9. 如权利要求1所述的基板，其中，所述绑定电极设置有多个，所述多个绑定电极的第一引线平行设置。
  10. 一种显示面板，包括权利要求1-9中任一项所述的基板。
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