WO2021136031A1 - Multi-layer circuit board, electronic device and method for machining the multi-layer circuit board - Google Patents

Multi-layer circuit board, electronic device and method for machining the multi-layer circuit board Download PDF

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Publication number
WO2021136031A1
WO2021136031A1 PCT/CN2020/138550 CN2020138550W WO2021136031A1 WO 2021136031 A1 WO2021136031 A1 WO 2021136031A1 CN 2020138550 W CN2020138550 W CN 2020138550W WO 2021136031 A1 WO2021136031 A1 WO 2021136031A1
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WO
WIPO (PCT)
Prior art keywords
hole
core board
surface layer
circuit board
multilayer circuit
Prior art date
Application number
PCT/CN2020/138550
Other languages
French (fr)
Chinese (zh)
Inventor
朱福建
丁海幸
乔吉涛
Original Assignee
华为技术有限公司
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Filing date
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Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2021136031A1 publication Critical patent/WO2021136031A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Definitions

  • This application relates to the technical field of electronic equipment, and in particular to a multilayer circuit board, electronic equipment, and a method for processing the multilayer circuit board.
  • Multi-layer circuit boards can reduce the area of the circuit board, thereby reducing the volume of the electronic device.
  • the multi-layer circuit board is composed of a plurality of stacked core boards. Wiring layers are provided between adjacent core boards and on the outer surface of the outermost core board.
  • the electrical connection between the two is generally provided with conductive holes on the circuit board; specifically, a hole is opened on the core board where the first wiring layer is located, and the hole extends in a direction perpendicular to the circuit board, and the hole penetrates the second wiring layer, and then passes through A metal ring is formed on the sidewall of the hole by electroplating, and the metal ring can realize the electrical connection between the first wiring layer and the second wiring layer.
  • the embodiments of the present application provide a multilayer circuit board, electronic equipment, and a multilayer circuit board processing method to solve the limited space on the circuit board in the prior art and strictly limit the number of conductive holes, resulting in the circuit board
  • the wiring density is difficult to further improve the technical problem.
  • the embodiment of the present application provides a multilayer circuit board, including: a core board and wiring layers arranged on both outer sides of the core board, the core board is provided with holes, and the sidewalls of the holes have a metal layer, which is removed by mechanical processing In part of the metal layer, a plurality of connecting lines are formed at intervals on the sidewall of the hole, and each connecting line is connected to a different wiring layer.
  • the multi-layer circuit board as described above wherein the core board includes a first surface layer core board and a second surface layer core board that are stacked, and the outer sides of the first surface layer core board and the second surface layer core board are both provided with a wiring layer, A wiring layer is also arranged between the first surface layer core board and the second surface layer core board; the holes are arranged on the first surface layer core board and the second surface layer core board; or the holes are arranged on the first surface layer core board or the second surface layer core board On the board.
  • This arrangement increases the number of wiring layers and further improves the wiring density of the multilayer circuit board.
  • the hole penetrates the first surface layer core board and the second surface layer core board, and the wiring layers connected by the two connecting wires in the same hole are the same or not completely the same.
  • the wiring layers connected by the two connecting wires in the same hole are the same or not completely the same, and the wiring density of the multilayer circuit board can be improved.
  • the first hole on the core board, the connecting line includes a plurality of first connecting lines arranged on the side wall of the first hole, and each first connecting line connects at least two wiring layers.
  • the provision of the middle core board can further increase the number of wiring layers in the multilayer circuit board and increase the wiring density of the multilayer circuit board.
  • the wiring layers connected by the two first connecting wires in the same first hole are the same or not completely the same, and the wiring density of the multilayer circuit board can be improved.
  • the multi-layer circuit board as described above wherein there are a plurality of intermediate core boards, and the plurality of intermediate core boards are stacked and arranged between the first surface layer core board and the second surface layer core board, and the adjacent intermediate core boards are all arranged There is a wiring layer.
  • the number of wiring layers is further increased to further increase the wiring density of the multilayer circuit board.
  • the first hole sequentially penetrates the plurality of middle core boards.
  • the first hole also penetrates the first surface layer core board and the second surface layer core board; or, the first hole also penetrates the first surface layer core board or the second surface layer core board.
  • the wiring layers connected by the two first connecting wires in the same first hole are the same, or not completely the same, or different.
  • the hole further includes a second hole provided on the first surface layer core board and the second surface layer core board, or the hole further includes a second hole provided on the first surface layer core board or the second surface layer core board A second hole on the board; a plurality of second connecting lines spaced apart are formed on the sidewall of the second hole, and each second connecting line connects at least two wiring layers.
  • the first connection line in the first hole and the second connection line in the second hole are both connected to different wiring layers, which further improves the wiring density of the multilayer circuit board.
  • the second hole is a blind hole.
  • the second hole also penetrates the middle core board.
  • the embodiment of the present application also provides an electronic device, including a multilayer circuit board, wherein the multilayer circuit board includes a core board and wiring layers arranged on both outer sides of the core board.
  • the core board is provided with holes and the side walls of the holes There is a metal layer on it, and a part of the metal layer is removed by mechanical processing to form a plurality of connecting lines arranged at intervals on the sidewall of the hole, and each connecting line is connected to a different wiring layer.
  • the core board includes a first surface layer core board and a second surface layer core board that are stacked, and the first surface layer core board and the second surface layer core board are both provided with a wiring layer on their outer surfaces, and the first A wiring layer is also arranged between the surface layer core board and the second surface layer core board; the holes are arranged on the first surface layer core board and the second surface layer core board; or the holes are arranged on the first surface layer core board or the second surface layer core board .
  • This arrangement increases the number of wiring layers and further improves the wiring density of the multilayer circuit board.
  • the hole penetrates the first surface layer core board and the second surface layer core board, and the wiring layers connected by the two connecting wires in the same hole are the same or not completely the same.
  • the wiring layers connected by the two connecting wires in the same hole are the same or not completely the same, and the wiring density of the multilayer circuit board can be improved.
  • the core board includes a first surface layer core board, a second surface layer core board, and an intermediate core board that are stacked, and the intermediate core board is arranged between the first surface layer core board and the second surface layer core board,
  • a wiring layer is provided between the middle core board and the first surface core board and the second surface core board, and the outer sides of the first surface core board and the second surface core board are provided with a wiring layer;
  • the holes are arranged on the middle core board
  • the upper first hole, the connecting line includes a plurality of spaced first connecting lines formed on the sidewall of the first hole, and each first connecting line connects at least two wiring layers.
  • the provision of the middle core board can further increase the number of wiring layers in the multilayer circuit board and increase the wiring density of the multilayer circuit board.
  • the first hole also penetrates the first surface layer core board or the second surface layer core board, and the wiring layers connected by the two first connecting wires in the same first hole are the same or not completely the same.
  • the wiring layers connected by the two first connecting wires in the same first hole are the same or not completely the same, and the wiring density of the multilayer circuit board can be improved.
  • the first hole also penetrates the first surface layer core board and the second surface layer core board, and the wiring layers connected by the two connecting wires in the same first hole are the same, or not completely the same, or different.
  • Floor there are a plurality of intermediate core boards, and the plurality of intermediate core boards are stacked and arranged between the first surface layer core board and the second surface layer core board, and wirings are arranged between adjacent intermediate core boards.
  • the number of wiring layers is further increased to further increase the wiring density of the multilayer circuit board.
  • the first hole sequentially penetrates the plurality of middle core boards.
  • the first hole further penetrates the first surface layer core board and the second surface layer core board; or, the first hole further penetrates the first surface layer core board or the second surface layer core board.
  • the wiring layers connected by the two first connecting wires in the same first hole are the same, or not completely the same, or different.
  • the hole further includes a second hole arranged on the first surface layer core board and the second surface layer core board, or the hole further includes a second hole arranged on the first surface layer core board or the second surface layer core board
  • the second hole; the sidewall of the second hole is formed with a plurality of second connecting lines arranged at intervals, and each second connecting line connects at least two wiring layers.
  • the first connection line in the first hole and the second connection line in the second hole are both connected to different wiring layers, which further improves the wiring density of the multilayer circuit board.
  • the second hole is a blind hole.
  • the second hole also penetrates the middle core board.
  • the embodiment of the present application also provides a method for processing a multilayer circuit board, including: forming a core board; forming a hole on the core board; forming a metal layer on the two outer sides of the core board and the sidewall of the hole; The metal layers on the two outer sides are patterned to form a wiring layer on each side of the core board; part of the metal layer is removed by mechanical processing to form multiple connections on the sidewall of the hole One end of the connecting line is connected to the wiring layer on one side of the core board, and the other end of the connecting line is connected to the wiring layer on the other side of the core board.
  • the method for processing a multilayer circuit board as described above, wherein removing part of the metal layer by mechanical processing includes: removing the metal layer in the hole with a drill or a knife to form a plurality of connecting lines in the hole; or, The metal layer in the hole is irradiated with a laser to remove part of the metal layer to form a plurality of connecting lines in the hole.
  • the multilayer circuit board processing method as described above wherein part of the metal layer is removed by mechanical processing to form a plurality of connecting lines spaced on the sidewall of the hole, and one end of the connecting line is connected to the core board side wiring Layer connection, after the other end of the connecting wire is connected to the wiring layer on the other side of the core board, the method further includes: removing the metal wire remaining in the hole.
  • the insulating filler can block the hole, thereby preventing foreign dust and other impurities from entering the hole.
  • the insulating filler can further separate the connecting wires in the hole to avoid contact between the connecting wires.
  • An embodiment of the present application also provides a method for processing a multilayer circuit board, including: forming a middle core board; forming a first hole on the middle core board; forming on two outer sides of the middle core board and the sidewall of the first hole Metal layer; the metal layers on the two outer sides of the middle core board are patterned to form a wiring layer on each outer side of the middle core board; part of the metal layer is removed by mechanical processing, so as to A plurality of first connecting lines are formed on the sidewall of a hole, and each first connecting line is connected to at least two wiring layers.
  • first connecting lines are formed on the sidewall of the first hole, and each first connecting line is connected to a different wiring layer; a plurality of first connections are arranged in the first hole Wires can reduce the number of first holes, increase the wiring density of the multilayer circuit board, and reduce the area of the multilayer circuit board.
  • removing part of the metal layer by mechanical processing includes: removing the metal layer in the first hole by a drill or a knife to form a plurality of spaced second holes in the first hole. A connection line; or, by irradiating the metal layer in the first hole with a laser, a part of the metal layer is removed, so as to form a plurality of first connection lines spaced apart in the first hole.
  • the insulating filler can block the first hole, thereby preventing foreign dust and other impurities from entering the first hole.
  • the insulating filler can further separate the first connecting lines in the first hole to avoid the first connecting line. Contact each other.
  • the method further includes: forming a first surface layer core plate on the outer side of the middle core plate; forming a second hole on the first surface layer core plate; the second hole penetrates at least the first surface layer core plate; A metal layer is formed on the core board and the sidewall of the second hole; the metal layer on the first surface layer core board is patterned to form a wiring layer on the first surface layer core board; part of the second hole is removed by mechanical processing
  • the metal layer of the sidewall is used to form a plurality of second connection lines spaced apart on the sidewall of the second hole; and each second connection line connects at least two wiring layers.
  • the first connection line in the first hole and the second connection line in the second hole are both connected to different wiring layers, which further improves the wiring density of the multilayer circuit board.
  • the insulating filler can block the second hole, thereby preventing foreign dust and other impurities from entering the second hole.
  • the insulating filler can further separate the second connecting lines in the second hole to avoid the second hole. The connecting wires are in contact with each other.
  • Figure 1 is a schematic diagram of the structure of a double-layer board in an embodiment of the application
  • FIG. 2 is a schematic diagram of the structure of a multilayer board in an embodiment of the application.
  • FIG. 3 is a schematic diagram of a structure in which holes are provided on a double-layer board in an embodiment of the application;
  • FIG. 4 is a top view of a multilayer circuit board when there are two connecting wires in an embodiment of the application;
  • FIG. 5 is a top view of a multilayer circuit board when there are three connecting wires in an embodiment of the application.
  • FIG. 6 is a top view of a multilayer circuit board when there are four connecting wires in an embodiment of the application.
  • FIG. 7 is a schematic diagram 1 of the structure when the holes are provided on the multilayer board in the embodiment of the application.
  • FIG. 8 is a second schematic diagram of the structure when the holes are provided on the multilayer board in the embodiment of the application.
  • Fig. 9 is a structural schematic diagram 1 of an intermediate core plate provided between the first surface layer core plate and the second surface layer core plate in an embodiment of the application;
  • Fig. 10 is a second structural schematic diagram of an intermediate core plate provided between the first surface layer core plate and the second surface layer core plate in the embodiment of the application;
  • FIG. 11 is a third structural schematic diagram of an intermediate core board provided between the first surface layer core board and the second surface layer core board in an embodiment of the application;
  • FIG. 12 is a schematic diagram 1 of a structure in which a plurality of intermediate core plates are arranged between the first surface layer core plate and the second surface layer core plate in an embodiment of the application;
  • FIG. 13 is a second structural schematic diagram of a plurality of intermediate core boards arranged between the first surface layer core board and the second surface layer core board in the embodiment of the application;
  • Fig. 14 is a third structural schematic diagram of a plurality of intermediate core plates arranged between the first surface layer core plate and the second surface layer core plate in an embodiment of the application;
  • 15 is a fourth structural schematic diagram of a plurality of intermediate core boards arranged between the first surface layer core board and the second surface layer core board in the embodiment of the application;
  • 16 is a schematic diagram 1 of the structure in which the second hole is provided on the first surface layer core plate in the embodiment of the application;
  • FIG. 17 is a schematic diagram 2 of the structure in which the second hole is provided on the first surface layer core plate in the embodiment of the application;
  • FIG. 18 is a schematic diagram of the structure in which second holes are provided on both the first surface layer core plate and the second surface layer core plate in an embodiment of the application;
  • 19 is a schematic diagram of the second hole penetrating through a plurality of middle core plates in an embodiment of the application.
  • FIG. 20 is a schematic diagram of a structure in which the second hole is a through hole in an embodiment of the application.
  • FIG. 21 is a first flowchart of a method for processing a multilayer circuit board in an embodiment of the application.
  • FIG. 22 is a schematic diagram of a core board after drilling a hole in a multilayer circuit board processing method in an embodiment of the application;
  • FIG. 23 is a schematic diagram of forming a metal layer in a method for processing a multilayer circuit board in an embodiment of the application.
  • FIG. 24 is a schematic diagram of patterning the metal layers on both sides of the core board in the processing method of the multilayer circuit board in the embodiment of the application;
  • 25 is a schematic diagram of forming a plurality of connecting lines on the sidewall of the hole in the method for processing a multilayer circuit board in an embodiment of the application;
  • FIG. 26 is a second flowchart of a method for processing a multilayer circuit board in an embodiment of the application.
  • FIG. 27 is a schematic diagram after the intermediate core board is formed in the multilayer circuit board processing method in the embodiment of the application.
  • FIG. 28 is a schematic diagram after drilling a hole in the middle core board in the method for processing a multilayer circuit board in an embodiment of the application;
  • FIG. 29 is a schematic diagram of forming a metal layer in a method for processing a multilayer circuit board in an embodiment of the application.
  • FIG. 30 is a schematic diagram of patterning the metal layers on both outer sides of the middle core board in the processing method of the multilayer circuit board in the embodiment of the application;
  • 31 is a schematic diagram of forming a plurality of first connecting lines on the sidewall of the first hole in the method for processing a multilayer circuit board in an embodiment of the application;
  • FIG. 32 is a third flowchart of a method for processing a multilayer circuit board in an embodiment of the application.
  • FIG. 33 is a schematic diagram after the first surface layer core board is formed in the multilayer circuit board processing method in the embodiment of the application;
  • FIG. 34 is a schematic diagram of forming a second hole on the first surface layer core board in the method for processing a multilayer circuit board in an embodiment of the application;
  • 35 is a schematic diagram of forming a metal layer on the first surface layer core board and the sidewall of the second hole in the method for processing a multilayer circuit board in an embodiment of the application;
  • 36 is a schematic diagram of the metal layer on the first surface layer core board after patterning processing in the multilayer circuit board processing method in the embodiment of the application;
  • FIG. 37 is a schematic diagram of forming a plurality of second connecting lines on the sidewall of the second hole in the method for processing a multilayer circuit board in an embodiment of the application;
  • FIG. 38 is a schematic diagram of providing second holes on both the first surface layer core board and the second surface layer core board in the multilayer circuit board processing method in the embodiment of the application.
  • the embodiments of this application provide an electronic device, which includes but is not limited to mobile phones, tablet computers, notebook computers, ultra-mobile personal computers (UMPC), handheld computers, walkie-talkies, netbooks, POS machines, and personal digital devices.
  • Mobile or fixed terminals with circuit boards such as personal digital assistant (PDA), driving recorder, wearable device, virtual reality device, wireless USB flash drive, Bluetooth audio/headset, or car front-mounted device.
  • the electronic device has a circuit board, the circuit board has a wiring layer with a certain pattern, and the electronic component is arranged on the circuit board and is electrically connected to the wiring layer;
  • the electronic component may be a capacitor, an inductor, a resistor, and the like.
  • the multilayer circuit board may be a rigid board (for example, Printed Circuit Board, PCB), of course, the multilayer circuit board may also be a flexible circuit board (for example, Flexible Printed Circuit, FPC).
  • PCB Printed Circuit Board
  • FPC Flexible Printed Circuit
  • the multilayer circuit board includes a core board, and a wiring layer is arranged on the side or inside of the core board, or a wiring layer is arranged on both sides and inside of the core board; as shown in FIG. 1, the multilayer circuit board can be It is a double-layer board, with wiring layers 20 provided on both sides of the core board 10, and no wiring layers 20 are provided inside the core board 10; as shown in FIG.
  • the multilayer circuit board in this embodiment can also be A multilayer board including no less than three wiring layers 20, wherein the core board 10 includes a first surface layer core board 101 and a second surface layer core board 102 located on the surface layer, and a first surface layer core board 101 and a second surface layer core board
  • the middle core board 103 between 102, the first surface layer core board 101 and the second surface layer core board 102 are provided with a wiring layer 20 on the outer side facing away from the middle core board 103, and the middle core board 103 and the first surface layer core
  • the wiring layer 20 is also provided between the boards 101 and between the middle core board 103 and the second surface layer core board 102.
  • the wiring layer 20 may be composed of a metal layer with a certain pattern, so that the wiring layer 20 constitutes a circuit.
  • the metal layer may be formed by electroplating, and then the metal layer may be patterned to form a certain pattern on the metal layer, thereby forming the wiring layer 20; wherein the patterning processing may include: on the metal layer A protective layer is formed, and then a mask is placed on the protective layer.
  • the mask is provided with holes with the same shape as the circuit pattern, and then the mask is exposed so that the protective layer corresponding to the holes is exposed and is
  • the shape of the exposed protective layer is the same as the shape of the circuit pattern, and then the unexposed protective layer and the metal layer under the unexposed protective layer are removed by acid or lye. Because the exposed protective layer will not be affected by the acid And the lye is corroded, so the exposed protective layer and the metal layer under the exposed protective layer are retained, thereby forming a circuit with a certain pattern.
  • the multilayer circuit board may be a double-layer board having two wiring layers 20.
  • holes 40 may be provided on the core board 10, and the holes 40 penetrate the core board 10 and are located on the wiring layers on both sides of the core board 10.
  • Each 20 has a pad 30 surrounding the hole 40, and then a metal layer is formed on the sidewall of the hole 40, the metal layer covers the entire sidewall of the hole 40, and the metal layer is tubular; one end of the metal layer is the same as the core board 10 The land 30 on the side is connected, and the other end of the metal layer is connected to the land 30 on the other side of the core board 10.
  • Part of the metal layer on the side wall of the hole 40 is removed to form a plurality of connecting wires 50 on the side wall of the hole 40.
  • One end of the connecting wire 50 is connected to the pad 30 on one side of the core board 10, and the other end of the connecting wire 50 is connected to the core.
  • the pad 30 on the other side of the board 10 is connected; the pad 30 on one side of the core board 10 includes a plurality of first contact portions arranged at intervals, and each first contact portion is connected to one end of a connecting wire 50.
  • the core The pad 30 on the other side of the board 10 includes a plurality of second contact portions arranged at intervals, and each second contact portion is connected to the other end of a connecting wire 50.
  • the metal layer can be removed by mechanical processing, for example, the metal layer can be removed by grinding.
  • a drill or a gong knife can be inserted into the hole 40, and then the sidewall of the hole 40 can be cut to remove the hole.
  • the metal layer on the sidewall of the hole 40 forms a plurality of connecting lines 50 at intervals; of course, a part of the metal layer on the sidewall of the hole 40 can also be removed by laser to form a plurality of connecting lines 50 at intervals.
  • the connecting line 50 may extend linearly on the side wall of the hole 40, of course, the connecting line 50 may also extend curved on the side wall of the hole 40; in this embodiment, the extension of the connecting line 50 in the hole 40
  • the shape is not limited, as long as it can ensure that the connecting wires 50 do not touch each other. Part of the metal layer on the sidewall of the hole 40 is removed by mechanical processing, which simplifies the processing difficulty and also improves the processing speed.
  • This embodiment does not limit the number of connecting wires 50.
  • the two first contact portions of the pad 30 arranged on one wiring layer 20 are arranged symmetrically, and the two second contact portions of the pad 30 arranged on the other wiring layer 20 are also arranged symmetrically.
  • the three first contacts of the pad 30 are arranged symmetrically, and the three second contacts of the pad 30 arranged on the other wiring layer 20 are also arranged symmetrically. As shown in FIG.
  • each connecting wire 50 arranged in the hole 40 there may be four connecting wires 50 arranged in the hole 40, and the four connecting wires 50 are arranged symmetrically with respect to the center line of the hole 40; correspondingly arranged on a wiring layer 20
  • the four first contacts of the pad 30 are arranged symmetrically, and the four second contacts of the pad 30 arranged on the other wiring layer 20 are also arranged symmetrically.
  • the number of connecting wires 50 arranged in the hole 40 in this embodiment can also be eight, ten, etc. It is worth noting that the shape and size of each connecting wire 50 arranged in the hole 40 can also be different, and the shape and size of each connecting wire 50 can be reasonably set according to actual use requirements.
  • a plurality of connecting lines 50 are formed on the sidewalls of the holes 40, and each connecting line 50 is connected to a different wiring layer 20; a plurality of connections are arranged in the hole 40
  • the line 50 can reduce the number of holes 40, increase the wiring density of the multilayer circuit board, and thereby reduce the area of the multilayer circuit board.
  • the multilayer circuit board may be a multilayer board having no less than three wiring layers 20.
  • the core board 10 includes a first surface layer core board 101 and a second surface layer core board 102.
  • the outer surfaces of the first surface layer core board 101 and the second surface layer core board 102 are both provided with wiring.
  • a wiring layer 20 is also provided between the first surface layer core board 101 and the second surface layer core board 102.
  • the hole 40 can penetrate the entire multi-layer circuit board.
  • the hole 40 can also only penetrate the first surface layer core board 101 or the second surface layer core board 102; for example, referring to FIG. 7, when the hole 40 penetrates the entire multi-layer circuit board,
  • the wiring layer 20 connected to the connecting wires 50 in the same hole 40 may be the same.
  • each connecting wire 50 in the hole 40 may all be connected to the wiring layer 20 outside the first surface layer core board 101, and the hole 40
  • the other end of each connecting wire 50 inside is connected to the wiring layer 20 outside the second surface layer core board 102; it is worth noting that the connecting wire 50 can also be connected to the first surface layer core board 101 and the second surface layer core board 102.
  • the wiring layer 20 is connected.
  • This arrangement increases the number of wiring layers 20 and further improves the wiring density of the multilayer circuit board.
  • the wiring layer 20 connected by the connecting wires 50 in the same hole 40 may not be completely the same.
  • one end of a part of the connecting wires 50 in the same hole 40 is connected to The wiring layer 20 outside the first surface layer core board 101 is connected, the other end of a part of the connecting wire 50 in the hole 40 is connected to the wiring layer 20 between the first surface layer core board 101 and the second surface layer core board 102, and the other part in the hole 40
  • One end of the connecting wire 50 is connected to the wiring layer 20 outside the first surface layer core board 101, and the other end of the other part of the connecting wire 50 in the hole 40 is connected to the wiring layer 20 outside the second surface layer core board 102.
  • one end of a part of the connecting wire 50 in the same hole 40 is connected to the wiring layer 20 outside the second surface layer core board 102, and the other end of a part of the connecting wire 50 in the hole 40 is connected to the first surface layer core board 101 and the second surface layer core board 102.
  • the wiring layer 20 is connected between, and one end of the other part of the connection line 50 in the hole 40 is connected to the wiring layer 20 outside the first surface layer core board 101, and the other end of the other part of the connection line 50 in the hole 40 is connected to the outside of the second surface layer core board 102
  • the wiring layer 20 is connected.
  • the hole 40 may only penetrate the first surface layer core board 101.
  • one end of each connection line 50 in the hole 40 is connected to the wiring layer 20 outside the first surface layer core board 101, and each of the holes 40 The other end of the connecting wire 50 is connected to the wiring layer 20 between the first surface layer core board 101 and the second surface layer core board 102; of course, the hole 40 can also only penetrate the second surface layer core board 102.
  • the hole 40 One end of each connecting line 50 is connected to the wiring layer 20 outside the second surface layer core board 102, and the other end of each connecting line 50 in the hole 40 is connected to the wiring layer between the first surface layer core board 101 and the second surface layer core board 102 20 connections.
  • the core board 10 may further include an intermediate core board arranged between the first surface layer core board 101 and the second surface layer core board 102.
  • the middle core board 103 and the first surface layer core board 101 and the second surface layer core board 102 are provided with a wiring layer 20
  • the hole 40 includes a first hole 401 provided on the middle core board 103
  • the connecting line 50 includes a space
  • the first connection line 501 arranged in the first hole 401, the first hole 401 is provided with a metal layer, and part of the metal layer is removed to form a plurality of spaced first connection lines 501 on the sidewall of the first hole 401 ,
  • Each first connecting line 501 is connected to a different wiring layer 20.
  • the intermediate core board 103 By providing the intermediate core board 103, the number of wiring layers 20 can be increased, thereby increasing the wiring area of the multilayer circuit board, further increasing the wiring density of the multilayer circuit board, and reducing the area of the multilayer circuit board.
  • the first hole 401 penetrates the middle core board 103.
  • one end of the first connection line 501 in the first hole 401 is connected to the wiring layer 20 on one side of the middle core board 103, and the first connection line in the first hole 401 The other end of 501 is connected to the wiring layer 20 on the other side of the middle core board 103.
  • the metal layer can be removed by mechanical processing, for example, the metal layer can be removed by grinding.
  • a drill or a gong knife can be inserted into the first hole 401, and then the sidewall of the first hole 401 can be processed. Cutting to remove the metal layer on the side wall of the first hole 401 to form a plurality of first connecting lines 501 at intervals; of course, a part of the metal layer on the side wall of the first hole 401 can also be removed by laser, thereby forming a plurality of spaced first connecting lines A connection line 501.
  • the first hole 401 is provided on the multilayer circuit board, and the first hole 401 has a plurality of first connecting lines 501, and each first connecting line 501 is connected to a different wiring layer 20, so as to achieve The connection between the wiring layers 20; and there are multiple first connection lines 501 in each first hole 401, which can increase the wiring density of the multilayer circuit board, thereby reducing the area of the multilayer circuit board.
  • the hole 40 may also include a second hole 402 provided on the first surface layer core plate 101 or the second surface layer core plate 102, or the hole 40 may also include a second hole provided on the first surface layer core plate.
  • the second hole 402 may be a blind hole, the second hole 402 penetrates the first surface layer core plate 101 and then extends to the middle core plate 103, and each second connection line 502 in the second hole 402 One end is connected to the wiring layer 20 outside the first surface layer core board 101, and the other end of each second connection line 502 in the second hole 402 is connected to the wiring layer 20 between the middle core board 103 and the first surface layer core board 101;
  • the second hole 402 can also penetrate the second surface layer core plate 102.
  • the second hole 402 penetrates the second surface layer core plate 102 and then extends to the middle core plate 103.
  • each second connection line 502 in the second hole 402 One end of is connected to the wiring layer 20 outside the second surface layer core board 102, and the other end of each second connection line 502 in the second hole 402 is connected to the wiring layer 20 between the second surface layer core board 102 and the middle core board 103 .
  • first connection line 501 in the first hole 401 and the second connection line 502 in the second hole 402 are both connected to different wiring layers 20, which further improves the wiring density of the multilayer circuit board.
  • the metal layer can be removed by mechanical processing, for example, the metal layer can be removed by grinding.
  • a drill or a gong knife can be inserted into the second hole 402, and then the sidewall of the second hole 402 can be processed. Cutting to remove the metal layer on the sidewall of the second hole 402 to form a plurality of second connecting lines 502 at intervals; of course, it is also possible to remove part of the metal layer on the sidewall of the second hole 402 by laser to form a plurality of spaced second connecting lines.
  • the second hole 402 is provided, and a plurality of second connecting lines 502 are arranged at intervals in the second hole 402, and each second connecting line 502 is connected to a different wiring layer 20, which can further improve the multilayer circuit board.
  • the wiring density further reduces the area of the multilayer circuit board.
  • the second hole 402 may also penetrate the first surface layer core board 101 and the second surface layer core board 102, and the wiring layer 20 connected by each second connecting line 502 in the same second hole 402 may be the same; of course, The wiring layer 20 connected to each second connecting line 502 in the two holes 402 may not be completely the same.
  • one end of a part of the second connecting line 502 in the same second hole 402 and one end of another part of the second connecting line 502 are Connected to the same wiring layer 20, the other end of part of the second connecting line 502 and the other end of another part of the second connecting line 502 are connected to a different wiring layer 20; of course, each second connecting line 502 in the second hole 402
  • the connected wiring layers 20 may also be different.
  • the two ends of a part of the second connecting line 502 of the same second hole 402 and the two ends of another part of the second connecting line 502 are connected to different wiring layers 20.
  • the second hole 402 penetrates the first surface layer core board 101 and the second surface layer core board 102.
  • the wiring layer 20 connected by the second connecting line 502 in the second hole 402 is not completely the same.
  • One end of part of the second connecting line 502 is connected to the wiring layer 20 outside the first surface layer core board 101, and the other end of the part of the second connecting line 502 is connected to the wiring layer 20 between the first surface layer core board 101 and the middle core board 103 Connection, one end of another part of the second connection line 502 in the same second hole 402 is connected to the wiring layer 20 outside the first surface layer core board 101, and the other end of the other part of the second connection line 502 is connected to the outside of the second surface layer core board 102 The wiring layer 20 is connected.
  • the second connecting line 502 when the second connecting line 502 passes through a plurality of wiring layers 20, the second connecting line 502 may also be connected to one or more wiring layers 20 passing through.
  • the first hole 401 and the second hole 402 can be provided on the multilayer circuit board at the same time.
  • the first hole 401 or only the second hole 402 can be provided on the multilayer circuit board. No restrictions.
  • each first connecting wire 501 in the first hole 401 is connected to the wiring layer 20 on the side of the penetrated middle core board 103, and the other of each first connecting wire 501 One end is connected to the wiring layer 20 on the other side of the penetrated middle core board 103;
  • the penetrated middle core board 103 may be one of the middle core boards 103 that is close to the first surface layer core board 101, which of course is penetrated
  • the middle core board 103 may also be one of the middle core boards 103 that is close to the second surface layer core board 102; or the penetrated middle core board 103 may also be located near the middle core board 103 of the first surface layer core board 101 and close to The middle core board 103 between the middle core boards 103 of the second surface layer core board 102.
  • There are multiple intermediate core boards 103 which further increases the number of wiring layers 20 to further increase the wiring density of the multilayer circuit board.
  • the first hole 401 and the second hole 402 are provided on the multilayer circuit board, and the first hole 401 has a plurality of first connection lines 501, and the second hole 402 has a plurality of second connection lines. 502, each of the first connecting lines 501 and the second connecting lines 502 are connected to different wiring layers 20, realizing the connection between the wiring layers 20; and there are multiple first connecting lines 501 in each first hole 401 There are multiple second connecting lines 502 in each second hole 402, which can increase the wiring density of the multilayer circuit board, reduce the number of first holes 401 and second holes 402, and thereby reduce the area of the multilayer circuit board . In addition, as the wiring density of the multilayer circuit board increases, the number of intermediate core boards 103 can also be reduced, thereby reducing the volume of the multilayer circuit board.
  • the first holes 401 can penetrate all the middle core plates 103, and the first connecting lines 501 in the first holes 401 are connected
  • the wiring layer 20 may be the same.
  • one end of all the first connecting wires 501 in the first hole 401 may be connected to the wiring layer 20 close to the first surface layer core board 101.
  • all the first holes 401 The other end of the first connection line 501 can be connected to the wiring layer 20 close to the second surface layer core board 102; it is worth noting that the first connection line 501 can also be connected to one or more wiring lines passing through the first hole 401.
  • the layers 20 are connected, and different first connection lines 501 can be connected to different wiring layers 20 that are passed through. Of course, different first connection lines 501 can also be connected to the same wiring layer 20 that is passed through.
  • the wiring layer 20 connected by the first connecting wires 501 in the first hole 401 may not be completely the same; take the orientation shown in FIG. 14 as an example
  • One end of the part of the first connection line 501 located in the first hole 401 is connected to the wiring layer 20 close to the first surface layer core board 101, and the other end of the part of the first connection line 501 located in the first hole 401 is connected to The lower third wiring layer 20 is connected; one end of the other part of the first connection line 501 located in the same hole 40 is connected to the wiring layer 20 close to the first surface layer core board 101, and the other part of the first connection located in the first hole 401 is connected The other end of the wire 501 is connected to the wiring layer 20 close to the second surface layer core board 102.
  • this embodiment is not limited in sequence, as long as it is ensured that the wiring layer 20 connected to a part of the first connecting line 501 and another part of the first connecting line 501 is not completely the same.
  • the wiring layer 20 connected to each first connection line 501 in the first hole 401 may be different.
  • one end of a part of the first connection line 501 located in the first hole 401 is close to the first surface layer core board 101.
  • the wiring layer 20 is connected, and the other end of the part of the first connection line 501 located in the first hole 401 is connected to the third wiring layer 20 from above and below; one end of the other part of the first connection line 501 located in the same hole 40 is connected to The fourth wiring layer 20 is connected from above and below, and the other end of another part of the first connection line 501 located in the first hole 401 is connected to the wiring layer 20 close to the second surface layer core board 102.
  • the first hole 401 may sequentially penetrate through a plurality of middle core plates 103, but the first hole 401 does not penetrate all the middle core plates 103.
  • the continuity of the first hole 401 can be ensured, so that the first connecting line 501 can be arranged on the side wall of the first hole 401.
  • the first hole 401 may extend from the middle core plate 103 close to the first surface layer core plate 101 to the second surface layer core plate 102, or the first hole 401 may extend from the middle core plate 103 close to the second surface layer core plate 102 to the second surface layer core plate 102.
  • the first surface layer core board 101 extends.
  • a plurality of middle core boards 103 are stacked one after another, and the first hole 401 may also penetrate one or more middle core boards 103 located in the middle of the plurality of middle core boards 103.
  • the wiring layers 20 connected to the first connecting lines 501 located in the first holes 401 may be the same, not completely the same or different; in addition, the first connecting lines 501 may also be connected to one or more of the wiring layers 20 through which they pass. connection.
  • the second hole 402 can also be provided on the first surface layer core plate 101 or the second surface layer core plate 102, or to form the first surface layer core plate 101 and the second surface layer core plate 102.
  • a second hole 402 is provided on the second surface layer core plate 102; a metal layer is provided on the sidewall of the second hole 402, and part of the metal layer is removed to form a plurality of second connecting lines spaced on the sidewall of the second hole 402 502, the second connecting line 502 connects different wiring layers 20.
  • a drill bit or a gong knife can be inserted into the second hole 402, and then a part of the metal layer can be removed by the drill bit or a gong knife to form a plurality of spaced second connecting lines 502 on the sidewall of the second hole 402; A part of the metal layer can be removed by laser to form a plurality of spaced second connecting lines 502 on the sidewall of the second hole 402.
  • the first hole 401 may only penetrate one or more middle core plates 103 in the middle of the plurality of middle core plates 103
  • the second hole 402 may be a blind hole
  • the second hole 402 may Only through the first surface layer core board 101, at this time, one end of each second connecting wire 502 is connected to the wiring layer 20 outside the first surface layer core board 101, and the other end of each second connecting wire 502 is connected to the middle core board 103 and the first The wiring layers 20 between the surface layer core boards 101 are connected.
  • the first hole 401 penetrates all the middle core plates 103, and the second hole 402 only penetrates the first surface layer core plate 101.
  • a second hole 402 can also be provided on the second surface layer core plate 102.
  • the second hole 402 when the second hole 402 is a blind hole, the second hole 402 may extend to the middle of the multilayer circuit board and penetrate through one or more middle core boards 103; for example, as shown in FIG. 19, The second hole 402 penetrates the first surface layer core plate 101 and then extends to the second surface layer core plate 102, and passes through the two middle core plates 103 in sequence. One end of the second connecting line 502 in the second hole 402 is connected to the first surface layer core plate.
  • the wiring layer 20 outside 101 is connected, and the other end of the second connection line 502 in the second hole 402 can be connected to the same or different wiring layer 20; it is worth noting that the second hole 402 penetrates the first surface layer core board 101 Afterwards, one or more middle core boards 103 may be penetrated.
  • the number of middle core boards 103 through which the second hole 402 penetrates is not limited; in addition, the wiring layer connected by each second connecting line 502 in the second hole 402 is not limited. 20 can be the same, not exactly the same, or different.
  • the second hole 402 can extend to the first surface core plate 101 after passing through the second surface layer core plate 102, and sequentially pass through one or more middle core plates 103, and each second connecting line 502 in the second hole 402 is connected
  • the wiring layers 20 may be the same, not completely the same, or different.
  • the second hole 402 sequentially penetrates the plurality of intermediate core plates 103, which can ensure the continuity of the second hole 402, so that the second connecting line 502 is formed on the sidewall of the second hole 402.
  • the second hole 402 can also be a through hole, that is, the second hole 402 penetrates the first surface layer core plate 101, the second surface layer core plate 102, and the first surface layer core plate 101 and the second surface layer core plate 102.
  • the middle core boards 103 between the surface core boards 102; correspondingly, the wiring layers 20 connected to the second connecting wires 502 arranged in the second holes 402 can be the same, for example, one end of each second connecting wire 502 Both are connected to the wiring layer 20 outside the first surface layer core board 101, and the other end of each second connection line 502 is connected to the wiring layer 20 outside the second surface layer core board 102.
  • each second connecting line 502 may also be different; in the same second hole 402, the wiring layer 20 connected to a part of the second connecting line 502 and another part of the second connecting line 502 may be completely different, and part of the second connecting line 502 may be completely different.
  • One end of the connecting line 502 can be connected to the wiring layer 20 outside the first surface layer core board 101, the other end of a part of the second connecting line 502 is connected to the wiring layer 20 outside the second surface layer core board 102, and the other part of the second connecting line 502
  • One end of the second connecting line 502 may be connected to one wiring layer 20 between adjacent middle core boards 103, and the other end of the second connecting line 502 may be connected to another wiring layer 20 between the middle core boards 103.
  • the wiring layer 20 connected to a part of the second connecting line 502 and another part of the second connecting line 502 may not be completely the same.
  • one end of all the second connecting lines 502 in the second hole 402 is connected to the first surface layer core board.
  • the wiring layer 20 outside 101 is connected, and the other end of part of the second connecting line 502 is connected to the wiring layer 20 outside of the second surface layer core board 102, and the other end of the second connecting line 502 is connected to the adjacent middle core board 103.
  • Inter-wiring layers 20 are connected.
  • the first connection line 501 in the first hole 401 may be connected to one or more of the wiring layers 20 passed through, the same,
  • the second connection line 502 in the second hole 402 may be connected to one or more of the wiring layers 20 passed through.
  • the first hole 401 and the second hole 402 are provided on the multilayer circuit board, and the first hole 401 has a plurality of first connection lines 501, and the second hole 402 has a plurality of second connection lines. 502, each of the first connecting lines 501 and the second connecting lines 502 are connected to different wiring layers 20, realizing the connection between the wiring layers 20; and there are multiple first connecting lines 501 in each first hole 401 There are multiple second connecting lines 502 in each second hole 402, which can increase the wiring density of the multilayer circuit board, reduce the number of first holes 401 and second holes 402, and thereby reduce the area of the multilayer circuit board .
  • the number of intermediate core boards 103 can be reduced, the thickness of the multilayer circuit board can be reduced, and the volume of the multilayer circuit board can be reduced, and the cost of the multilayer circuit board can also be reduced.
  • the embodiment of the present application also provides a method for processing a multilayer circuit board. As shown in FIG. 21, the method for processing a multilayer circuit board includes the following steps:
  • the core board 10 can be made of insulating material; after the core board 10 is formed, a hole 40 can be formed on the core board 10 by a drill or a gong knife. Of course, it can also be formed on the core board 10 by laser drilling. The hole 40 penetrates the core board 10.
  • the method further includes: S103: forming a metal layer on the two sides of the core board and the sidewall of the hole.
  • a metal layer can be formed on both sides of the core board 10 and the side wall of the hole 40 by electroplating.
  • the metal layer can also be directly attached to the side of the core board 10 and the side of the hole 40. On the wall.
  • the method further includes: S104: patterning the metal layers on the two sides of the core board to form a wiring layer on each side of the core board.
  • the metal layer is patterned to form a wiring layer 20 with a certain pattern on each side of the core board 10; for example, it is formed on the metal layer on one side of the core board 10.
  • Protective layer then the mask is placed on the protective layer, the mask has holes with the same shape as the pattern, and then the mask is exposed to expose the protective layer directly opposite to the holes on the mask Afterwards, the unexposed protective layer and the metal layer corresponding to the unexposed protective layer are removed by acid or lye. Since the exposed protective layer will not react with acid and lye, the exposed protective layer and The exposed protective layer is retained corresponding to the metal layer, thereby forming a wiring layer 20 with a certain pattern.
  • a pad can be formed on the surface of the core board 10 around the hole 40, so that when the connecting wire 50 is formed, the connecting wire 50 is connected to the wiring layer 20 through the pad 30;
  • the connecting wire 50 is connected to the wiring layer 20 through the pad 30;
  • the corresponding pads may include a plurality of contact portions arranged around the hole 40 at intervals.
  • the method further includes: S105: removing part of the metal layer on the sidewall of the hole to form a plurality of connecting lines spaced apart on the sidewall of the hole; and one end of each connecting line is connected to one side of the core board The wiring layer is connected, and the other end of the connecting wire is connected to the wiring layer on the other side of the core board.
  • part of the metal layer may be removed by mechanical processing to form a plurality of spaced connecting lines 50; in an achievable way, The metal layer is removed by grinding, and the drill bit or the gong knife can be inserted into the hole 40, and the drill bit or the gong knife can be moved in a direction parallel to the center line of the hole 40, thereby forming a parallel line on the metal layer.
  • the metal layer on the sidewall of the hole 40 can be irradiated with a laser, and then an opening extending in a direction parallel to the center line of the hole 40 is formed on the metal layer, and a plurality of openings are formed on the metal layer.
  • a connecting line 50 is formed between the openings.
  • the metal layer on the sidewall of the hole 40 is removed by mechanical processing, which is simple to operate and improves the processing speed of the multilayer circuit board.
  • a plurality of connecting lines 50 are formed on the sidewalls of the holes 40, and each connecting line 50 is connected to a different wiring layer 20; a plurality of connections are arranged in the hole 40
  • the line 50 can reduce the number of holes 40, increase the wiring density of the multilayer circuit board, and reduce the area of the multilayer circuit board.
  • the method may further include: S106: removing the metal remaining in the hole wire.
  • the method further includes: S107: filling the hole with an insulating filler.
  • the insulating filler can block the hole 40, thereby preventing foreign dust, water vapor and other impurities from entering the hole 40.
  • the insulating filler can further separate the connecting lines 50 in the hole 40 and avoid the hole wall behind the hole 40. The lines of the components are short-circuited or the connecting lines 50 are in contact with each other.
  • the method further includes: pressing and bonding a multilayer circuit board.
  • pressing and bonding a multilayer circuit board Through the pressing process, each layer in the multilayer circuit board is well connected, and the strength of the multilayer circuit board is improved; for example, the multilayer circuit board can be heated during the pressing process to further improve the entire multilayer circuit board. The strength of the layer circuit board.
  • the insulating filler may be made of insulating resin, insulating ink or other insulating materials.
  • the insulating filler may be in a liquid state before filling, and a vacuum environment is created in the hole 40 during the filling process, and then the liquid insulating filler is dropped into the hole 40 in the vacuum environment, the vacuum environment can be avoided After the insulating filler is dropped, air bubbles are formed in the hole 40; after the insulating filler is dropped, the insulating filler in the hole 40 can be solidified by heating or cooling.
  • a plurality of connecting wires 50 are formed on the side walls of the holes 40, and two ends of each connecting wire 50 are connected to the wiring layers 20 on both sides of the core board 10;
  • a plurality of connecting wires 50 are arranged in the holes 40, which can reduce the number of holes 40, increase the wiring density of the multilayer circuit board, and thereby reduce the area of the multilayer circuit board.
  • the embodiment of the present application also provides a method for processing a multilayer circuit board. As shown in FIG. 26, the method for processing a multilayer circuit board includes:
  • S201 Form an intermediate core board.
  • the middle core board 103 may be one or more, and the middle core board 103 is made of insulating material.
  • forming the middle core board 103 may include forming a metal layer on one middle core board 103 first, and then patterning the metal layer to form a wiring layer 20 with a certain pattern; Another intermediate core board 103 is formed on the upper layer of the wiring layer 20, and the above-mentioned operation is repeated, so that a plurality of intermediate core boards 103 are stacked, and there is a wiring layer 20 between two adjacent intermediate core boards 103.
  • the method further includes: S202: drilling a hole in the middle core board to form a first hole.
  • a hole is drilled on the outermost middle core board 103 to form a first hole 401, and the first hole 401 may penetrate one or more middle core boards 103.
  • the method further includes: S203: forming a metal layer on the two outer sides of the middle core board and the sidewall of the hole.
  • a metal layer can be formed on the outer side of the two outermost intermediate core plates 103 and the hole 40 by electroplating; of course, the metal layer can also be directly attached to The two outermost middle core plates 103 are on the outer side surface.
  • the method further includes: S204: patterning the metal layers on the two outer sides of the middle core board to form a wiring layer on each outer side of the middle core board.
  • the metal layer is patterned to form a wiring layer 20 with a certain pattern on the outer surfaces of the two outermost middle core boards 103; for example, it is formed on the metal layer on the side of the middle core board 103
  • Protective layer then the mask is placed on the protective layer, the mask has holes with the same shape as the pattern, and then the mask is exposed to expose the protective layer directly opposite to the holes on the mask Afterwards, the unexposed protective layer and the metal layer corresponding to the unexposed protective layer are removed by acid or lye. Since the exposed protective layer will not react with acid and lye, the exposed protective layer and The exposed protective layer is retained corresponding to the metal layer, thereby forming a wiring layer 20 with a certain pattern.
  • the method further includes: S205: removing a part of the metal layer on the sidewall of the first hole to form a plurality of first connecting lines spaced apart on the sidewall of the first hole; and Connecting wires connect different wiring layers.
  • a part of the metal layer on the sidewall of the first hole 401 can be removed by mechanical processing to form a plurality of spaced first connecting lines 501.
  • the metal layer can be removed by grinding.
  • a drill or a gong knife can be inserted into the first hole 401, so that the edge of the drill or gong knife is parallel to the center of the first hole 401 The direction of the wire is moved, and an opening extending in the direction parallel to the center line of the first hole 401 is formed on the metal layer. Repeat the above process to form a plurality of openings on the metal layer, and a first opening is formed between two adjacent openings.
  • Connection line 501 a laser can also be used to remove part of the metal layer.
  • a laser can be used to irradiate the metal layer on the sidewall of the first hole 401 to form an edge parallel to the first hole 401 on the metal layer.
  • the opening extending in the direction of the center line forms a plurality of openings on the metal layer, and a first connecting line 50 is formed between two adjacent openings.
  • Part of the metal layer on the sidewall of the first hole 401 is removed by mechanical processing, which is simple to operate and improves the processing speed of the multilayer circuit board.
  • the wiring layer 20 connected by each first connecting line 501 in the first hole 401 may be the same, not completely the same, or different, which is not limited in this example.
  • first connecting lines 501 are formed on the sidewall of the first hole 401, and each first connecting line 501 is connected to a different wiring layer 20.
  • the first hole 401 is provided with a plurality of first connecting lines 501, which can reduce the number of first holes 401, increase the wiring density of the multilayer circuit board, and reduce the area of the multilayer circuit board.
  • part of the metal layer on the sidewall of the first hole 401 is removed by mechanical processing to form a plurality of first connecting lines 501 spaced apart on the sidewall of the first hole 401; and After each first connecting line 501 is connected to different wiring layers 20, the method further includes: S206: removing the metal wire remaining in the first hole.
  • connection between the lines 501 further affects the use of the multilayer circuit board.
  • an acid or lye is dropped into the first hole 401 to corrode the remaining metal wire; it is worth noting Yes, a reasonable setting of the acid and lye concentration can prevent the acid or lye from damaging the first connecting line 501 while ensuring that the metal wire can be corroded.
  • the method further includes: S207: filling the first hole with an insulating filler.
  • the insulating filler can block the first hole 401, so as to prevent foreign dust and other impurities from entering the first hole 401.
  • the insulating filler can further separate the first connecting lines 501 in the first hole 401 to avoid the first hole 401.
  • a connecting line 501 is in contact with each other.
  • the method further includes: pressing the middle core board 103.
  • the middle core boards 103 are well connected and the strength of the multilayer circuit board is improved; for example, each middle core board 103 can be heated during the pressing process to further improve the entire multilayer circuit board. The strength of the circuit board.
  • the insulating filler may be made of insulating resin, insulating ink or other insulating materials.
  • the insulating filler may be in a liquid state before filling, and a vacuum environment is created in the first hole 401 during the filling process, and then the liquid insulating filler is dropped into the first hole 401 in the vacuum environment, The vacuum environment can avoid the formation of bubbles in the first hole 401 after the insulating filler is dropped; the insulating filler in the first hole 401 can be solidified by heating or cooling after the insulating filler is dropped.
  • an intermediate core board 103 may be formed on the outer side of the outermost intermediate core board 103, so that the first holes 401 are provided in the plurality of intermediate core boards 103.
  • the middle is located on one or more middle core boards 103 in the middle.
  • the method further includes: S208: forming a first surface layer core board on the outer side of the middle core board.
  • a first surface layer core plate 101 made of an insulating material is formed on the outer surface of the middle core plate 103; the material of the first surface layer core plate 101 can be the same as the material of the middle core plate 103.
  • the method further includes: S209: forming a second hole on the first surface layer core plate; the second hole penetrates at least the first surface layer core plate.
  • the second hole 402 may be formed on the first surface layer core plate 101 by a drill, a gong knife or a laser; the second hole 402 may be a blind hole, and the exemplary second hole 402 may only penetrate the first surface layer.
  • the second hole 402 may extend to the middle core board 103 after passing through the first surface layer core board 101, and penetrate through one or more middle core boards 103; of course, the second hole 402 may also penetrate the entire multilayer circuit board Through holes.
  • the method further includes: S210: forming a metal layer on the first surface layer core plate and the sidewall of the second hole.
  • a metal layer can be formed on the outer side surface of the first surface layer core board 101 and the side wall of the second hole 402 by electroplating; of course, the metal can also be attached.
  • the metal can also be attached on the outer side surface of the first surface layer core board 101 and the side wall of the second hole 402.
  • the method further includes: S211: patterning the metal layer on the first surface layer core board to form the first surface layer core board A wiring layer is formed on the board.
  • the wiring layer 20 is formed on the outer surface of the first surface layer core board 101 through patterning; exemplary, a protective layer is formed on the metal layer on the outer surface of the first surface layer core board 101, and then The mask is placed on the protective layer, and the mask has holes with the same shape as the pattern. Then the mask is exposed to expose the protective layer directly opposite to the holes on the mask. Liquid or lye removes the unexposed protective layer and the metal layer corresponding to the unexposed protective layer. Because the exposed protective layer will not react with acid and lye, the exposed protective layer and the exposed protective layer The corresponding metal layer is retained to form a wiring layer 20 with a certain pattern
  • S212 Remove part of the metal layer on the sidewall of the second hole to form a plurality of second connection lines spaced apart on the sidewall of the second hole; and each second connection line is connected to a different wiring layer.
  • a part of the metal layer on the sidewall of the second hole 402 can be removed by mechanical processing to form a plurality of spaced second connecting lines 502; in an achievable way, it can be done by grinding.
  • an exemplary drill bit or a gong knife can be extended into the second hole 402, and then the drill bit or a gong knife can move in a direction parallel to the center line of the second hole 402, thereby forming an edge parallel to the second hole 402 on the metal layer.
  • wiring layers 20 connected by the second connecting lines 502 in the same second hole 402 may be the same, not completely the same, or different, which is not limited in this embodiment.
  • part of the metal layer on the sidewall of the second hole 402 is removed by mechanical processing to form a plurality of second connecting lines 502 spaced apart on the sidewall of the second hole 402; and each second After the connecting wire 502 is connected to the different wiring layers 20, the method further includes: S213: removing the metal wire remaining in the second hole.
  • the connection between the lines 502 affects the use of the multilayer circuit board.
  • acid or lye is dripped into the second hole 402 to corrode the remaining metal wire; It is explained that the concentration of acid and lye is set reasonably to ensure that the metal wire can be corroded away while avoiding the acid or lye from damaging the second connecting line 502.
  • the method further includes: S214: filling the second hole with an insulating filler.
  • the insulating filler can block the second hole 402, so as to prevent foreign dust and other impurities from entering the second hole 402.
  • the insulating filler can further separate the second connecting lines 502 in the second hole 402 to avoid the second hole 402.
  • the two connecting wires 502 are in contact with each other.
  • the method further includes: pressing the circuit.
  • the first surface layer core board 101 and the intermediate core boards 103 are well connected, and the strength of the multilayer circuit board is improved; for example, the first surface layer core board 101 and the middle core board 103 can be connected to each other during the pressing process.
  • Each middle core board 103 is heated to further increase the strength of the entire multilayer circuit board.
  • the insulating filler may be composed of insulating resin, insulating ink, or other insulating materials.
  • the insulating filler may be in a liquid state before filling, and a vacuum environment is created in the second hole 402 during the filling process, and then the liquid insulating filler is dropped into the second hole 402 in the vacuum environment, The vacuum environment can avoid the formation of bubbles in the second hole 402 after the insulating filler is dropped; the insulating filler in the second hole 402 can be solidified by heating or cooling after the insulating filler is dropped.
  • the first surface layer core board 101 is formed on one outer surface of the middle core board 103, and the second surface layer core board 102 may also be formed on the other outer surface of the middle core board 103;
  • a second hole 402 is formed on the second surface layer core plate 102, and a metal layer is formed on the outer side surface of the second surface layer core plate 102 and the side wall of the second hole;
  • the patterning process is performed to form a wiring layer 20 with a certain pattern; then a part of the metal layer on the sidewall of the second hole 402 is removed by mechanical processing to form a plurality of spaced second connecting lines 502, each second The connecting wires 502 connect different wiring layers 20.
  • the second hole 402 provided on the second surface layer core plate 102 may be a blind hole or a through hole.
  • the exemplary second hole 402 may only penetrate the second surface layer core plate 102, and each of the corresponding second hole 402 sidewalls
  • One end of the second connection line 502 is connected to the wiring layer 20 outside the second surface layer core board 102, and the other end of each second connection line 502 is connected to the second surface layer core board 102 and the middle core board 103 close to the second surface layer core board 102
  • the wiring layer 20 is connected between.
  • the second hole 402 may also penetrate through one or more middle core boards 103.
  • the wiring layers 20 connected by the second connecting lines 502 may be the same, not completely the same, or different, which is not limited in this embodiment.
  • the first hole 401 and the second hole 402 are provided on the multilayer circuit board, and the first hole 401 has a plurality of first connection lines 501, and the second hole 402 has a plurality of second connection lines. 502, each of the first connecting lines 501 and the second connecting lines 502 are connected to different wiring layers 20, realizing the connection between the wiring layers 20; and there are multiple first connecting lines 501 in each first hole 401 There are multiple second connecting lines 502 in each second hole 402, which can increase the wiring density of the multilayer circuit board, thereby reducing the area of the multilayer circuit board.
  • the number of intermediate core boards 103 can be reduced, the thickness of the multilayer circuit board can be reduced, and the volume of the multilayer circuit board can be reduced, and the cost of the multilayer circuit board can also be reduced.

Abstract

A multi-layer circuit board, an electronic device and a method for machining the multi-layer circuit board. The present invention relates to the technical field of electronic devices. The present invention aims to solve the problem that in the related art, the wiring density of a circuit board is difficult to be further improved due to the number of conductive holes strictly restricted by the limited space on the circuit board. The multi-layer circuit board, the electronic device and the method for machining the multi-layer circuit board. The multi-layer circuit board comprises: a core board (10) and wiring layers (20) arranged on two outer side surfaces of the core board (10). Holes (40) are provided on the core board (10), metal layers are arranged on the side walls of the holes (40), part of the metal layers is removed by mechanical processing so as to form a plurality of connecting wires (501, 502) arranged at intervals on the side walls of the holes (40), and the various connecting wires (501, 502) are connected with different wiring layers (20). The holes (40) are provided with the plurality of connecting wires (501, 502) therein, thus reducing the number of the holes (40), improving the wiring density of the multi-layer circuit board, and thereby reducing the area of the multi-layer circuit board.

Description

多层电路板、电子设备及多层电路板加工方法Multilayer circuit board, electronic equipment and method for processing multilayer circuit board
本申请要求于2019年12月31日提交中国专利局、申请号为201911413573.6、申请名称为“多层电路板、电子设备及多层电路板加工方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。This application claims the priority of a Chinese patent application filed with the Chinese Patent Office, the application number is 201911413573.6, and the application name is "Multilayer Circuit Boards, Electronic Equipment and Multilayer Circuit Board Processing Methods" on December 31, 2019, and its entire contents Incorporated in this application by reference.
技术领域Technical field
本申请涉及电子设备技术领域，尤其涉及一种多层电路板、电子设备及多层电路板加工方法。This application relates to the technical field of electronic equipment, and in particular to a multilayer circuit board, electronic equipment, and a method for processing the multilayer circuit board.
背景技术Background technique
随着电子设备技术的逐渐发展，多层电路板已经逐渐应用在各种电子设备中，多层电路板可以减小电路板的面积，进而缩小电子设备的体积。With the gradual development of electronic device technology, multi-layer circuit boards have been gradually applied in various electronic devices. Multi-layer circuit boards can reduce the area of the circuit board, thereby reducing the volume of the electronic device.
相关技术中，多层电路板由层叠设置的多个芯板构成，在相邻的芯板之间、以及位于最外层芯板的外侧面上均设置有布线层，为了实现不同布线层之间的电连接，一般在电路板上设置导电孔；具体地，在第一布线层所在的芯板上开设孔洞，孔洞沿垂直于电路板的方向延伸，且孔洞贯穿第二布线层，之后通过电镀的方式在孔洞的侧壁形成金属环，金属环可以实现第一布线层和第二布线层之间的电连接。In the related art, the multi-layer circuit board is composed of a plurality of stacked core boards. Wiring layers are provided between adjacent core boards and on the outer surface of the outermost core board. In order to realize the interconnection of different wiring layers The electrical connection between the two is generally provided with conductive holes on the circuit board; specifically, a hole is opened on the core board where the first wiring layer is located, and the hole extends in a direction perpendicular to the circuit board, and the hole penetrates the second wiring layer, and then passes through A metal ring is formed on the sidewall of the hole by electroplating, and the metal ring can realize the electrical connection between the first wiring layer and the second wiring layer.
然而，相关技术中，由于电路板上的空间有限，严格限制了导电孔的数量，导致电路板的布线密度难以进一步提升。However, in the related art, due to the limited space on the circuit board, the number of conductive holes is strictly limited, which makes it difficult to further increase the wiring density of the circuit board.
发明内容Summary of the invention
有鉴于此，本申请实施例提供一种多层电路板、电子设备及多层电路板加工方法，以解决现有技术中电路板上的空间有限，严格限制了导电孔的数量，导致电路板的布线密度难以进一步提升的技术问题。In view of this, the embodiments of the present application provide a multilayer circuit board, electronic equipment, and a multilayer circuit board processing method to solve the limited space on the circuit board in the prior art and strictly limit the number of conductive holes, resulting in the circuit board The wiring density is difficult to further improve the technical problem.
本申请实施例提供一种多层电路板，包括：芯板以及设置在芯板两外侧面的布线层，芯板上设置有孔洞，孔洞的侧壁上具有金属层，通过机械加工的方式去除部分金属层，以在孔洞的侧壁上形成多个间隔设置的连接线，每一连接线连接不同的布线层。The embodiment of the present application provides a multilayer circuit board, including: a core board and wiring layers arranged on both outer sides of the core board, the core board is provided with holes, and the sidewalls of the holes have a metal layer, which is removed by mechanical processing In part of the metal layer, a plurality of connecting lines are formed at intervals on the sidewall of the hole, and each connecting line is connected to a different wiring layer.
基于上述技术内容，通过在芯板上设置孔洞，孔洞的侧壁上形成间隔的多个连接线，每一连接线与不同的布线层连接；孔洞内设置多个连接线，可以减少孔洞的数量，提高多层电路板的布线密度，减小多层电路板的面积。Based on the above technical content, by arranging holes on the core board, multiple connecting lines are formed on the sidewalls of the holes, and each connecting line is connected to a different wiring layer; multiple connecting lines are arranged in the hole, which can reduce the number of holes , Improve the wiring density of the multilayer circuit board and reduce the area of the multilayer circuit board.
如上所述的多层电路板，其中，芯板包括层叠设置的第一表层芯板和第二表层芯板，第一表层芯板和第二表层芯板的外侧面上均设置有布线层，第一表层芯板和第二表层芯板之间也设置有布线层；孔洞设置在第一表层芯板和第二表层芯板上；或者，孔洞设置在第一表层芯板或第二表层芯板上。The multi-layer circuit board as described above, wherein the core board includes a first surface layer core board and a second surface layer core board that are stacked, and the outer sides of the first surface layer core board and the second surface layer core board are both provided with a wiring layer, A wiring layer is also arranged between the first surface layer core board and the second surface layer core board; the holes are arranged on the first surface layer core board and the second surface layer core board; or the holes are arranged on the first surface layer core board or the second surface layer core board On the board.
如此设置，增加了布线层的数量，进一步提高了多层电路板的布线密度。This arrangement increases the number of wiring layers and further improves the wiring density of the multilayer circuit board.
如上所述的多层电路板，其中，孔洞贯穿第一表层芯板和第二表层芯板，同一孔洞内的两个连接线连接的布线层相同或者不完全相同。In the multi-layer circuit board as described above, the hole penetrates the first surface layer core board and the second surface layer core board, and the wiring layers connected by the two connecting wires in the same hole are the same or not completely the same.
如此设置，同一孔洞内的两个连接线连接的布线层相同或者不完全相同，可以提高多层电路板的布线密度。With this arrangement, the wiring layers connected by the two connecting wires in the same hole are the same or not completely the same, and the wiring density of the multilayer circuit board can be improved.
如上所述的多层电路板，其中，芯板包括层叠设置的第一表层芯板、第二表层芯板以及中间芯板，中间芯板设置在第一表层芯板和第二表层芯板之间，中间芯板与第一表层芯板和第二表层芯板之间均设置有布线层，第一表层芯板和第二表层芯板的外侧面上设置有布线层；孔洞包括设置在中间芯板上第一孔洞，连接线包括在第一孔洞的侧壁上形成的多个间隔设置的第一连接线，每一第一连接线连接至少两个布线层。The multi-layer circuit board as described above, wherein the core board includes a first surface layer core board, a second surface layer core board, and an intermediate core board arranged in a stack, and the intermediate core board is arranged between the first surface layer core board and the second surface layer core board. Between the middle core board and the first surface layer core board and the second surface layer core board are both provided with a wiring layer, the first surface layer core board and the second surface layer core board are provided with a wiring layer on the outer surface; The first hole on the core board, the connecting line includes a plurality of first connecting lines arranged on the side wall of the first hole, and each first connecting line connects at least two wiring layers.
设置中间芯板可以进一步增大多层电路板中布线层的数量，提高多层电路板的布线密度。The provision of the middle core board can further increase the number of wiring layers in the multilayer circuit board and increase the wiring density of the multilayer circuit board.
如上所述的多层电路板，其中，第一孔洞还贯穿第一表层芯板或第二表层芯板,同一第一孔洞内的两个第一连接线连接的布线层相同、或者不完全相同。The multilayer circuit board as described above, wherein the first hole also penetrates the first surface layer core board or the second surface layer core board, and the wiring layers connected by the two first connecting wires in the same first hole are the same or not completely the same .
如此设置，同一第一孔洞内的两个第一连接线连接的布线层相同或者不完全相同，可以提高多层电路板的布线密度。With this arrangement, the wiring layers connected by the two first connecting wires in the same first hole are the same or not completely the same, and the wiring density of the multilayer circuit board can be improved.
如上所述的多层电路板，其中，第一孔洞还贯穿第一表层芯板和第二表层芯板,同一第一孔洞内的两个连接线连接的布线层相同、或者不完全相同、或者不同。The multi-layer circuit board as described above, wherein the first hole also penetrates the first surface layer core board and the second surface layer core board, and the wiring layers connected by the two connecting wires in the same first hole are the same or not completely the same, or different.
如上所述的多层电路板，其中，中间芯板为多个，多个中间芯板层叠的设置在第一表层芯板和第二表层芯板之间，相邻中间芯板之间均设置有布线层。The multi-layer circuit board as described above, wherein there are a plurality of intermediate core boards, and the plurality of intermediate core boards are stacked and arranged between the first surface layer core board and the second surface layer core board, and the adjacent intermediate core boards are all arranged There is a wiring layer.
进一步增大了布线层的数量，以进一步提高多层电路板的布线密度。The number of wiring layers is further increased to further increase the wiring density of the multilayer circuit board.
如上所述的多层电路板，其中，第一孔洞依次贯穿多个中间芯板。In the multi-layer circuit board as described above, the first hole sequentially penetrates the plurality of middle core boards.
如上所述的多层电路板，其中，第一孔洞还贯穿第一表层芯板和第二表层芯板；或者，第一孔洞还贯穿第一表层芯板或第二表层芯板。In the multilayer circuit board as described above, the first hole also penetrates the first surface layer core board and the second surface layer core board; or, the first hole also penetrates the first surface layer core board or the second surface layer core board.
如上所述的多层电路板，其中，同一第一孔洞内的两个第一连接线连接的布线层相同、或者不完全相同、或者不同。In the multilayer circuit board as described above, the wiring layers connected by the two first connecting wires in the same first hole are the same, or not completely the same, or different.
如上所述的多层电路板，其中，孔洞还包括设置在第一表层芯板和第二表层芯板上的第二孔洞，或者，孔洞还包括设置在第一表层芯板或第二表层芯板上的第二孔洞；第二孔洞的侧壁上形成有间隔设置的多个第二连接线，每一第二连接线连接至少两个布线层。The multilayer circuit board as described above, wherein the hole further includes a second hole provided on the first surface layer core board and the second surface layer core board, or the hole further includes a second hole provided on the first surface layer core board or the second surface layer core board A second hole on the board; a plurality of second connecting lines spaced apart are formed on the sidewall of the second hole, and each second connecting line connects at least two wiring layers.
如此设置，第一孔洞内的第一连接线和第二孔洞内的第二连接线均连接不同的布线层，进一步提高了多层电路板的布线密度。With this arrangement, the first connection line in the first hole and the second connection line in the second hole are both connected to different wiring layers, which further improves the wiring density of the multilayer circuit board.
如上所述的多层电路板，其中，第二孔洞为盲孔。In the multilayer circuit board as described above, the second hole is a blind hole.
如上所述的多层电路板，其中，第二孔洞还贯穿中间芯板。In the multilayer circuit board as described above, the second hole also penetrates the middle core board.
本申请实施例还提供一种电子设备，包括多层电路板，其中多层电路板，包括：芯板以及设置在芯板两外侧面的布线层，芯板上设置有孔洞，孔洞的侧壁上具有金属层，通过机械加工的方式去除部分金属层，以在孔洞的侧壁上形成多个间隔设置的连接线，每一连接线连接不同的布线层。The embodiment of the present application also provides an electronic device, including a multilayer circuit board, wherein the multilayer circuit board includes a core board and wiring layers arranged on both outer sides of the core board. The core board is provided with holes and the side walls of the holes There is a metal layer on it, and a part of the metal layer is removed by mechanical processing to form a plurality of connecting lines arranged at intervals on the sidewall of the hole, and each connecting line is connected to a different wiring layer.
基于上述技术内容，通过在芯板上设置孔洞，孔洞的侧壁上形成间隔的多个连接线，每一连接线与不同的布线层连接；孔洞内设置多个连接线，可以减少孔洞的数量，提高多层电路板的布线密度，减小多层电路板的面积。Based on the above technical content, by arranging holes on the core board, multiple connecting lines are formed on the sidewalls of the holes, and each connecting line is connected to a different wiring layer; multiple connecting lines are arranged in the hole, which can reduce the number of holes , Improve the wiring density of the multilayer circuit board and reduce the area of the multilayer circuit board.
如上所述的电子设备，其中，芯板包括层叠设置的第一表层芯板和第二表层芯板， 第一表层芯板和第二表层芯板的外侧面上均设置有布线层，第一表层芯板和第二表层芯板之间也设置有布线层；孔洞设置在第一表层芯板和第二表层芯板上；或者，孔洞设置在第一表层芯板或第二表层芯板上。The electronic device as described above, wherein the core board includes a first surface layer core board and a second surface layer core board that are stacked, and the first surface layer core board and the second surface layer core board are both provided with a wiring layer on their outer surfaces, and the first A wiring layer is also arranged between the surface layer core board and the second surface layer core board; the holes are arranged on the first surface layer core board and the second surface layer core board; or the holes are arranged on the first surface layer core board or the second surface layer core board .
如此设置，增加了布线层的数量，进一步提高了多层电路板的布线密度。This arrangement increases the number of wiring layers and further improves the wiring density of the multilayer circuit board.
如上所述的电子设备，其中，孔洞贯穿第一表层芯板和第二表层芯板，同一孔洞内的两个连接线连接的布线层相同或者不完全相同。In the electronic device as described above, the hole penetrates the first surface layer core board and the second surface layer core board, and the wiring layers connected by the two connecting wires in the same hole are the same or not completely the same.
如此设置，同一孔洞内的两个连接线连接的布线层相同或者不完全相同，可以提高多层电路板的布线密度。With this arrangement, the wiring layers connected by the two connecting wires in the same hole are the same or not completely the same, and the wiring density of the multilayer circuit board can be improved.
如上所述的电子设备，其中，芯板包括层叠设置的第一表层芯板、第二表层芯板以及中间芯板，中间芯板设置在第一表层芯板和第二表层芯板之间，中间芯板与第一表层芯板和第二表层芯板之间均设置有布线层，第一表层芯板和第二表层芯板的外侧面上设置有布线层；孔洞包括设置在中间芯板上第一孔洞，连接线包括在第一孔洞的侧壁上形成的多个间隔设置的第一连接线，每一第一连接线连接至少两个布线层。The electronic device as described above, wherein the core board includes a first surface layer core board, a second surface layer core board, and an intermediate core board that are stacked, and the intermediate core board is arranged between the first surface layer core board and the second surface layer core board, A wiring layer is provided between the middle core board and the first surface core board and the second surface core board, and the outer sides of the first surface core board and the second surface core board are provided with a wiring layer; the holes are arranged on the middle core board The upper first hole, the connecting line includes a plurality of spaced first connecting lines formed on the sidewall of the first hole, and each first connecting line connects at least two wiring layers.
设置中间芯板可以进一步增大多层电路板中布线层的数量，提高多层电路板的布线密度。The provision of the middle core board can further increase the number of wiring layers in the multilayer circuit board and increase the wiring density of the multilayer circuit board.
如上所述的电子设备，其中，第一孔洞还贯穿第一表层芯板或第二表层芯板,同一第一孔洞内的两个第一连接线连接的布线层相同、或者不完全相同。In the electronic device as described above, the first hole also penetrates the first surface layer core board or the second surface layer core board, and the wiring layers connected by the two first connecting wires in the same first hole are the same or not completely the same.
如此设置，同一第一孔洞内的两个第一连接线连接的布线层相同或者不完全相同，可以提高多层电路板的布线密度。With this arrangement, the wiring layers connected by the two first connecting wires in the same first hole are the same or not completely the same, and the wiring density of the multilayer circuit board can be improved.
如上所述的电子设备，其中，第一孔洞还贯穿第一表层芯板和第二表层芯板,同一第一孔洞内的两个连接线连接的布线层相同、或者不完全相同、或者不同。In the electronic device as described above, the first hole also penetrates the first surface layer core board and the second surface layer core board, and the wiring layers connected by the two connecting wires in the same first hole are the same, or not completely the same, or different.
如上所述的电子设备，其中，中间芯板为多个，多个中间芯板层叠的设置在第一表层芯板和第二表层芯板之间，相邻中间芯板之间均设置有布线层。The electronic device as described above, wherein there are a plurality of intermediate core boards, and the plurality of intermediate core boards are stacked and arranged between the first surface layer core board and the second surface layer core board, and wirings are arranged between adjacent intermediate core boards. Floor.
进一步增大了布线层的数量，以进一步提高多层电路板的布线密度。The number of wiring layers is further increased to further increase the wiring density of the multilayer circuit board.
如上所述的电子设备，其中，第一孔洞依次贯穿多个中间芯板。In the electronic device as described above, the first hole sequentially penetrates the plurality of middle core boards.
如上所述的电子设备，其中，第一孔洞还贯穿第一表层芯板和第二表层芯板；或者，第一孔洞还贯穿第一表层芯板或第二表层芯板。In the electronic device as described above, the first hole further penetrates the first surface layer core board and the second surface layer core board; or, the first hole further penetrates the first surface layer core board or the second surface layer core board.
如上所述的电子设备，其中，同一第一孔洞内的两个第一连接线连接的布线层相同、或者不完全相同、或者不同。In the electronic device as described above, the wiring layers connected by the two first connecting wires in the same first hole are the same, or not completely the same, or different.
如上所述的电子设备，其中，孔洞还包括设置在第一表层芯板和第二表层芯板上的第二孔洞，或者，孔洞还包括设置在第一表层芯板或第二表层芯板上的第二孔洞；第二孔洞的侧壁上形成有间隔设置的多个第二连接线，每一第二连接线连接至少两个布线层。The electronic device as described above, wherein the hole further includes a second hole arranged on the first surface layer core board and the second surface layer core board, or the hole further includes a second hole arranged on the first surface layer core board or the second surface layer core board The second hole; the sidewall of the second hole is formed with a plurality of second connecting lines arranged at intervals, and each second connecting line connects at least two wiring layers.
如此设置，第一孔洞内的第一连接线和第二孔洞内的第二连接线均连接不同的布线层，进一步提高了多层电路板的布线密度。With this arrangement, the first connection line in the first hole and the second connection line in the second hole are both connected to different wiring layers, which further improves the wiring density of the multilayer circuit board.
如上所述的电子设备，其中，第二孔洞为盲孔。In the electronic device as described above, the second hole is a blind hole.
如上所述的电子设备，其中，第二孔洞还贯穿中间芯板。In the electronic device as described above, the second hole also penetrates the middle core board.
本申请实施例还提供一种多层电路板加工方法，包括：形成芯板；在芯板上形成孔洞；在芯板的两个外侧面以及孔洞的侧壁上形成金属层；对芯板的两个外侧面上的 金属层进行图形化处理，以在芯板的每一侧面上均形成布线层；通过机械加工的方式去除部分金属层，以在孔洞的侧壁上形成间隔的多个连接线，且连接线的一端与芯板一侧的布线层连接，连接线的另一端与芯板另一侧的布线层连接。The embodiment of the present application also provides a method for processing a multilayer circuit board, including: forming a core board; forming a hole on the core board; forming a metal layer on the two outer sides of the core board and the sidewall of the hole; The metal layers on the two outer sides are patterned to form a wiring layer on each side of the core board; part of the metal layer is removed by mechanical processing to form multiple connections on the sidewall of the hole One end of the connecting line is connected to the wiring layer on one side of the core board, and the other end of the connecting line is connected to the wiring layer on the other side of the core board.
基于上述技术内容，通过在芯板上设置孔洞，孔洞的侧壁上形成间隔的多个连接线，每一连接线与不同的布线层连接；孔洞内设置多个连接线，可以减少孔洞的数量，提高多层电路板的布线密度，减小多层电路板的面积。Based on the above technical content, by arranging holes on the core board, multiple connecting lines are formed on the sidewalls of the holes, and each connecting line is connected to a different wiring layer; multiple connecting lines are arranged in the hole, which can reduce the number of holes , Improve the wiring density of the multilayer circuit board and reduce the area of the multilayer circuit board.
如上所述的多层电路板加工方法，其中，通过机械加工的方式去除部分金属层包括：通过钻头或者锣刀去除孔洞内的金属层，以在孔洞内形成间隔的多个连接线；或者，通过激光照射孔洞内的金属层，去除部分金属层，以在孔洞内形成间隔的多个连接线。如此设置，操作简单，提高了多层电路板的加工速率。The method for processing a multilayer circuit board as described above, wherein removing part of the metal layer by mechanical processing includes: removing the metal layer in the hole with a drill or a knife to form a plurality of connecting lines in the hole; or, The metal layer in the hole is irradiated with a laser to remove part of the metal layer to form a plurality of connecting lines in the hole. With this arrangement, the operation is simple, and the processing speed of the multilayer circuit board is improved.
如上所述的多层电路板加工方法，其中，通过机械加工的方式去除部分金属层，以在孔洞的侧壁上形成间隔的多个连接线，且连接线的一端与芯板一侧的布线层连接，连接线的另一端与芯板另一侧的布线层连接之后还包括：去除残留在孔洞内的金属丝。如此设置，可以避免金属丝导致部分连接线之间连接，进而影响多层电路板使用。The multilayer circuit board processing method as described above, wherein part of the metal layer is removed by mechanical processing to form a plurality of connecting lines spaced on the sidewall of the hole, and one end of the connecting line is connected to the core board side wiring Layer connection, after the other end of the connecting wire is connected to the wiring layer on the other side of the core board, the method further includes: removing the metal wire remaining in the hole. With this arrangement, it is possible to prevent the metal wires from causing the connection between some connecting wires, thereby affecting the use of the multilayer circuit board.
如上所述的多层电路板加工方法，其中，去除残留在孔洞内的金属丝之后还包括：在孔洞内填充绝缘填充物。The method for processing a multilayer circuit board as described above, wherein after removing the metal wire remaining in the hole, the method further includes: filling the hole with an insulating filler.
绝缘填充物可以实现对孔洞封堵，进而避免外界的灰尘等杂质进入到孔洞，另外绝缘填充物还可以进一步分隔孔洞内的各连接线，避免连接线之间互相接触。The insulating filler can block the hole, thereby preventing foreign dust and other impurities from entering the hole. In addition, the insulating filler can further separate the connecting wires in the hole to avoid contact between the connecting wires.
本申请实施例还提供一种多层电路板加工方法，包括：形成中间芯板；在中间芯板上形成第一孔洞；在中间芯板的两个外侧面以及第一孔洞的侧壁上形成金属层；对中间芯板的两个外侧面上的金属层进行图形化处理，以在中间芯板的每一外侧面上均形成布线层；通过机械加工的方式去除部分金属层，以在第一孔洞的侧壁上形成间隔的多个第一连接线，且每一第一连接线连接至少两个布线层。An embodiment of the present application also provides a method for processing a multilayer circuit board, including: forming a middle core board; forming a first hole on the middle core board; forming on two outer sides of the middle core board and the sidewall of the first hole Metal layer; the metal layers on the two outer sides of the middle core board are patterned to form a wiring layer on each outer side of the middle core board; part of the metal layer is removed by mechanical processing, so as to A plurality of first connecting lines are formed on the sidewall of a hole, and each first connecting line is connected to at least two wiring layers.
通过在芯板上设置第一孔洞，第一孔洞的侧壁上形成间隔的多个第一连接线，每一第一连接线与不同的布线层连接；第一孔洞内设置多个第一连接线，可以减少第一孔洞的数量，提高多层电路板的布线密度，减小多层电路板的面积。By arranging the first hole on the core board, a plurality of first connecting lines are formed on the sidewall of the first hole, and each first connecting line is connected to a different wiring layer; a plurality of first connections are arranged in the first hole Wires can reduce the number of first holes, increase the wiring density of the multilayer circuit board, and reduce the area of the multilayer circuit board.
如上所述的多层电路板加工方法，其中，通过机械加工的方式去除部分金属层包括：通过钻头或者锣刀去除第一孔洞内的金属层，以在第一孔洞内形成间隔的多个第一连接线；或者，通过激光照射第一孔洞内的金属层，去除部分金属层，以在第一孔洞内形成间隔的多个第一连接线。如此设置，操作简单，提高了多层电路板加工速率。The method for processing a multilayer circuit board as described above, wherein removing part of the metal layer by mechanical processing includes: removing the metal layer in the first hole by a drill or a knife to form a plurality of spaced second holes in the first hole. A connection line; or, by irradiating the metal layer in the first hole with a laser, a part of the metal layer is removed, so as to form a plurality of first connection lines spaced apart in the first hole. With this arrangement, the operation is simple, and the processing speed of the multilayer circuit board is improved.
如上所述的多层电路板加工方法，其中，通过机械加工的方式去除部分金属层，以在第一孔洞的侧壁上形成间隔的多个第一连接线，且每一第一连接线连接至少两个布线层之后还包括：去除残留在第一孔洞内的金属丝。如此设置，可以避免金属丝导致部分第一连接线之间连接，进而影响多层电路板使用。The method for processing a multilayer circuit board as described above, wherein part of the metal layer is removed by mechanical processing to form a plurality of first connecting lines spaced apart on the sidewall of the first hole, and each first connecting line is connected After the at least two wiring layers, the method further includes: removing the metal wire remaining in the first hole. This arrangement can prevent the metal wires from causing the connection between part of the first connecting wires, thereby affecting the use of the multilayer circuit board.
如上所述的多层电路板加工方法，其中，去除残留在第一孔洞内的金属丝之后还包括：在第一孔洞内填充绝缘填充物。The method for processing a multilayer circuit board as described above, wherein after removing the metal wire remaining in the first hole, the method further includes: filling the first hole with an insulating filler.
绝缘填充物可以实现对第一孔洞封堵，进而避免外界的灰尘等杂质进入到第一孔洞，另外绝缘填充物还可以进一步分隔第一孔洞内的各第一连接线，避免第一连接线之间互相接触。The insulating filler can block the first hole, thereby preventing foreign dust and other impurities from entering the first hole. In addition, the insulating filler can further separate the first connecting lines in the first hole to avoid the first connecting line. Contact each other.
如上所述的多层电路板加工方法，其中，通过机械加工的方式去除部分金属层，以在第一孔洞的侧壁上形成间隔的多个第一连接线，且每一第一连接线连接至少两个布线层之后还包括：在中间芯板的外侧面形成第一表层芯板；在第一表层芯板上形成第二孔洞；第二孔洞至少贯穿第一表层芯板；在第一表层芯板以及第二孔洞侧壁上形成金属层；对第一表层芯板上的金属层进行图形化处理，以在第一表层芯板上形成布线层；通过机械加工的方式去除部分第二孔洞侧壁的金属层，以在第二孔洞的侧壁上形成间隔的多个第二连接线；且每一第二连接线连接至少两个布线层。The method for processing a multilayer circuit board as described above, wherein part of the metal layer is removed by mechanical processing to form a plurality of first connecting lines spaced apart on the sidewall of the first hole, and each first connecting line is connected After the at least two wiring layers, the method further includes: forming a first surface layer core plate on the outer side of the middle core plate; forming a second hole on the first surface layer core plate; the second hole penetrates at least the first surface layer core plate; A metal layer is formed on the core board and the sidewall of the second hole; the metal layer on the first surface layer core board is patterned to form a wiring layer on the first surface layer core board; part of the second hole is removed by mechanical processing The metal layer of the sidewall is used to form a plurality of second connection lines spaced apart on the sidewall of the second hole; and each second connection line connects at least two wiring layers.
如此设置，第一孔洞内的第一连接线和第二孔洞内的第二连接线均与不同的布线层连接，进一步提高了多层电路板的布线密度。With this arrangement, the first connection line in the first hole and the second connection line in the second hole are both connected to different wiring layers, which further improves the wiring density of the multilayer circuit board.
如上所述的多层电路板加工方法，其中，通过机械加工的方式去除部分第二孔洞侧壁的金属层，以在第二孔洞的侧壁上形成间隔的多个第二连接线；且每一第二连接线连接至少两个布线层之后还包括：去除残留在第二孔洞内的金属丝。如此设置，去除残留的金属丝，可以避免金属丝导致部分第二连接线之间连接，进而影响多层电路板使用。The method for processing a multilayer circuit board as described above, wherein a part of the metal layer on the sidewall of the second hole is removed by mechanical processing to form a plurality of second connecting lines spaced apart on the sidewall of the second hole; and After a second connecting wire connects at least two wiring layers, the method further includes: removing the metal wire remaining in the second hole. With this arrangement, the remaining metal wires are removed, which can prevent the metal wires from causing connections between part of the second connecting wires, thereby affecting the use of the multilayer circuit board.
如上所述的多层电路板加工方法，其中，去除残留在第二孔洞内的金属丝之后还包括：在第二孔洞内填充绝缘填充物。The method for processing a multilayer circuit board as described above, wherein after removing the metal wire remaining in the second hole, the method further includes: filling the second hole with an insulating filler.
如此设置，绝缘填充物可以实现对第二孔洞封堵，进而避免外界的灰尘等杂质进入到第二孔洞，另外绝缘填充物还可以进一步分隔第二孔洞内的各第二连接线，避免第二连接线之间互相接触。With this arrangement, the insulating filler can block the second hole, thereby preventing foreign dust and other impurities from entering the second hole. In addition, the insulating filler can further separate the second connecting lines in the second hole to avoid the second hole. The connecting wires are in contact with each other.
附图说明Description of the drawings
图1为本申请实施例中双层板的结构示意图；Figure 1 is a schematic diagram of the structure of a double-layer board in an embodiment of the application;
图2为本申请实施例中多层板的结构示意图；2 is a schematic diagram of the structure of a multilayer board in an embodiment of the application;
图3为本申请实施例中孔洞设置在双层板上的结构示意图；FIG. 3 is a schematic diagram of a structure in which holes are provided on a double-layer board in an embodiment of the application;
图4为本申请实施例中连接线为两个时的多层电路板的俯视图；4 is a top view of a multilayer circuit board when there are two connecting wires in an embodiment of the application;
图5为本申请实施例中连接线为三个时的多层电路板的俯视图；FIG. 5 is a top view of a multilayer circuit board when there are three connecting wires in an embodiment of the application; FIG.
图6为本申请实施例中连接线为四个时的多层电路板的俯视图；FIG. 6 is a top view of a multilayer circuit board when there are four connecting wires in an embodiment of the application; FIG.
图7为本申请实施例中孔洞设置在多层板上时的结构示意图一；FIG. 7 is a schematic diagram 1 of the structure when the holes are provided on the multilayer board in the embodiment of the application; FIG.
图8为本申请实施例中孔洞设置在多层板上时的结构示意图二；FIG. 8 is a second schematic diagram of the structure when the holes are provided on the multilayer board in the embodiment of the application; FIG.
图9为本申请实施例中第一表层芯板和第二表层芯板之间设置有中间芯板的结构示意图一；Fig. 9 is a structural schematic diagram 1 of an intermediate core plate provided between the first surface layer core plate and the second surface layer core plate in an embodiment of the application;
图10为本申请实施例中第一表层芯板和第二表层芯板之间设置有中间芯板的结构示意图二；Fig. 10 is a second structural schematic diagram of an intermediate core plate provided between the first surface layer core plate and the second surface layer core plate in the embodiment of the application;
图11为本申请实施例中第一表层芯板和第二表层芯板之间设置有中间芯板的结构示意图三；FIG. 11 is a third structural schematic diagram of an intermediate core board provided between the first surface layer core board and the second surface layer core board in an embodiment of the application;
图12为本申请实施例中第一表层芯板和第二表层芯板之间设置多个中间芯板的结构示意图一；FIG. 12 is a schematic diagram 1 of a structure in which a plurality of intermediate core plates are arranged between the first surface layer core plate and the second surface layer core plate in an embodiment of the application;
图13为本申请实施例中第一表层芯板和第二表层芯板之间设置多个中间芯板的结构示意图二；FIG. 13 is a second structural schematic diagram of a plurality of intermediate core boards arranged between the first surface layer core board and the second surface layer core board in the embodiment of the application;
图14为本申请实施例中第一表层芯板和第二表层芯板之间设置多个中间芯板的结构 示意图三；Fig. 14 is a third structural schematic diagram of a plurality of intermediate core plates arranged between the first surface layer core plate and the second surface layer core plate in an embodiment of the application;
图15为本申请实施例中第一表层芯板和第二表层芯板之间设置多个中间芯板的结构示意图四；15 is a fourth structural schematic diagram of a plurality of intermediate core boards arranged between the first surface layer core board and the second surface layer core board in the embodiment of the application;
图16为本申请实施例中第二孔洞设置在第一表层芯板上的结构示意图一；16 is a schematic diagram 1 of the structure in which the second hole is provided on the first surface layer core plate in the embodiment of the application;
图17为本申请实施例中第二孔洞设置在第一表层芯板上的结构示意图二；FIG. 17 is a schematic diagram 2 of the structure in which the second hole is provided on the first surface layer core plate in the embodiment of the application; FIG.
图18为本申请实施例中在第一表层芯板和第二表层芯板上均设置有第二孔洞的结构示意图；18 is a schematic diagram of the structure in which second holes are provided on both the first surface layer core plate and the second surface layer core plate in an embodiment of the application;
图19为本申请实施例中第二孔洞贯穿多个中间芯板的示意图；19 is a schematic diagram of the second hole penetrating through a plurality of middle core plates in an embodiment of the application;
图20为本申请实施例中第二孔洞为通孔的结构示意图；FIG. 20 is a schematic diagram of a structure in which the second hole is a through hole in an embodiment of the application;
图21为本申请实施例中多层电路板加工方法的流程图一；FIG. 21 is a first flowchart of a method for processing a multilayer circuit board in an embodiment of the application;
图22为本申请实施例中多层电路板加工方法中在芯板上钻孔后的示意图；FIG. 22 is a schematic diagram of a core board after drilling a hole in a multilayer circuit board processing method in an embodiment of the application; FIG.
图23为本申请实施例中多层电路板加工方法中形成金属层的示意图；FIG. 23 is a schematic diagram of forming a metal layer in a method for processing a multilayer circuit board in an embodiment of the application; FIG.
图24为本申请实施例中多层电路板加工方法中对芯板两侧面上金属层进行图形化后的示意图；FIG. 24 is a schematic diagram of patterning the metal layers on both sides of the core board in the processing method of the multilayer circuit board in the embodiment of the application; FIG.
图25为本申请实施例中多层电路板加工方法中在孔洞的侧壁上形成多个连接线的示意图；25 is a schematic diagram of forming a plurality of connecting lines on the sidewall of the hole in the method for processing a multilayer circuit board in an embodiment of the application;
图26为本申请实施例中多层电路板加工方法的流程图二；FIG. 26 is a second flowchart of a method for processing a multilayer circuit board in an embodiment of the application;
图27为本申请实施例中多层电路板加工方法中形成中间芯板后的示意图；FIG. 27 is a schematic diagram after the intermediate core board is formed in the multilayer circuit board processing method in the embodiment of the application; FIG.
图28为本申请实施例中多层电路板加工方法中在中间芯板上钻孔后的示意图；FIG. 28 is a schematic diagram after drilling a hole in the middle core board in the method for processing a multilayer circuit board in an embodiment of the application; FIG.
图29为本申请实施例中多层电路板加工方法中形成金属层的示意图；FIG. 29 is a schematic diagram of forming a metal layer in a method for processing a multilayer circuit board in an embodiment of the application; FIG.
图30为本申请实施例中多层电路板加工方法中对中间芯板两外侧面上金属层进行图形化后的示意图；FIG. 30 is a schematic diagram of patterning the metal layers on both outer sides of the middle core board in the processing method of the multilayer circuit board in the embodiment of the application; FIG.
图31为本申请实施例中多层电路板加工方法中在第一孔洞的侧壁上形成多个第一连接线的示意图；31 is a schematic diagram of forming a plurality of first connecting lines on the sidewall of the first hole in the method for processing a multilayer circuit board in an embodiment of the application;
图32为本申请实施例中多层电路板加工方法的流程图三；FIG. 32 is a third flowchart of a method for processing a multilayer circuit board in an embodiment of the application;
图33为本申请实施例中多层电路板加工方法中形成第一表层芯板后的示意图；FIG. 33 is a schematic diagram after the first surface layer core board is formed in the multilayer circuit board processing method in the embodiment of the application; FIG.
图34为本申请实施例中多层电路板加工方法中在第一表层芯板上形成第二孔洞的示意图；FIG. 34 is a schematic diagram of forming a second hole on the first surface layer core board in the method for processing a multilayer circuit board in an embodiment of the application; FIG.
图35为本申请明实施例中多层电路板加工方法中在第一表层芯板以及第二孔洞侧壁形成金属层的示意图；35 is a schematic diagram of forming a metal layer on the first surface layer core board and the sidewall of the second hole in the method for processing a multilayer circuit board in an embodiment of the application;
图36为本申请实施例中多层电路板加工方法中对第一表层芯板上的金属层进行图形化处理后的示意图；36 is a schematic diagram of the metal layer on the first surface layer core board after patterning processing in the multilayer circuit board processing method in the embodiment of the application;
图37为本申请实施例中多层电路板加工方法中在第二孔洞侧壁上形成多个第二连接线的示意图；FIG. 37 is a schematic diagram of forming a plurality of second connecting lines on the sidewall of the second hole in the method for processing a multilayer circuit board in an embodiment of the application; FIG.
图38为本申请实施例中多层电路板加工方法中在第一表层芯板和第二表层芯板上均设置第二孔洞的示意图。FIG. 38 is a schematic diagram of providing second holes on both the first surface layer core board and the second surface layer core board in the multilayer circuit board processing method in the embodiment of the application.
附图标记说明：Description of reference signs:
10：芯板；10: Core board;
20：布线层；20: Wiring layer;
30：焊盘；30: pad;
40：孔洞；40: Hole;
50：连接线；50: connecting line;
101：第一表层芯板；101: The first surface layer core board;
102：第二表层芯板；102: The second surface layer core board;
103：中间芯板；103: Middle core board;
401：第一孔洞；401: The first hole;
402：第二孔洞；402: The second hole;
501：第一连接线；501: the first connection line;
502：第二连接线。502: The second connection line.
具体实施方式Detailed ways
本申请的实施方式部分使用的术语仅用于对本申请的具体实施例进行解释，而非旨在限定本申请，下面将结合附图对本申请实施例的实施方式进行详细描述。The terminology used in the implementation mode part of this application is only used to explain the specific embodiments of the application, and is not intended to limit the application. The implementation manners of the embodiments of the application will be described in detail below with reference to the accompanying drawings.
本申请实施例提供一种电子设备，电子设备包括但不限于手机、平板电脑、笔记本电脑、超级移动个人计算机(ultra-mobile personal computer，UMPC)、手持计算机、对讲机、上网本、POS机、个人数字助理(personal digital assistant，PDA)、行车记录仪、可穿戴设备、虚拟现实设备、无线U盘、蓝牙音响/耳机、或车载前装等具有电路板的移动或固定终端。The embodiments of this application provide an electronic device, which includes but is not limited to mobile phones, tablet computers, notebook computers, ultra-mobile personal computers (UMPC), handheld computers, walkie-talkies, netbooks, POS machines, and personal digital devices. Mobile or fixed terminals with circuit boards such as personal digital assistant (PDA), driving recorder, wearable device, virtual reality device, wireless USB flash drive, Bluetooth audio/headset, or car front-mounted device.
其中、电子设备具有电路板，电路板上具有一定图形的布线层，电子元件设置在电路板上并且与布线层电连接；示例性的，电子元件可以为电容、电感、电阻等。Among them, the electronic device has a circuit board, the circuit board has a wiring layer with a certain pattern, and the electronic component is arranged on the circuit board and is electrically connected to the wiring layer; for example, the electronic component may be a capacitor, an inductor, a resistor, and the like.
本申请实施例中，多层电路板可以为硬板(如：Printed Circuit Board，PCB)，当然多层电路板还可以为柔性电路板(如：Flexible Printed Circuit，FPC)。In the embodiment of the present application, the multilayer circuit board may be a rigid board (for example, Printed Circuit Board, PCB), of course, the multilayer circuit board may also be a flexible circuit board (for example, Flexible Printed Circuit, FPC).
本申请实施例中，多层电路板包括芯板，在芯板的侧面或内部设置有布线层，或者在芯板的侧面和内部均设置布线层；如图1所示，多层电路板可以为双层板，在芯板10的两个侧面上均设置有布线层20，芯板10的内部不设置布线层20；如图2所示，当然本实施例中多层电路板还可以为包括不少于三个布线层20的多层板，其中芯板10包括位于表层的第一表层芯板101和第二表层芯板102，以及位于第一表层芯板101和第二表层芯板102之间的中间芯板103，在第一表层芯板101和第二表层芯板102背离中间芯板103的外侧面上均设置有布线层20，并且在中间芯板103与第一表层芯板101之间、以及中间芯板103与第二表层芯板102之间也设置有布线层20。In the embodiment of the present application, the multilayer circuit board includes a core board, and a wiring layer is arranged on the side or inside of the core board, or a wiring layer is arranged on both sides and inside of the core board; as shown in FIG. 1, the multilayer circuit board can be It is a double-layer board, with wiring layers 20 provided on both sides of the core board 10, and no wiring layers 20 are provided inside the core board 10; as shown in FIG. 2, of course, the multilayer circuit board in this embodiment can also be A multilayer board including no less than three wiring layers 20, wherein the core board 10 includes a first surface layer core board 101 and a second surface layer core board 102 located on the surface layer, and a first surface layer core board 101 and a second surface layer core board The middle core board 103 between 102, the first surface layer core board 101 and the second surface layer core board 102 are provided with a wiring layer 20 on the outer side facing away from the middle core board 103, and the middle core board 103 and the first surface layer core The wiring layer 20 is also provided between the boards 101 and between the middle core board 103 and the second surface layer core board 102.
本申请实施例中，布线层20可以由具有一定图形的金属层构成，以使布线层20构成电路。示例性的，可以通过电镀的方式形成金属层，之后对金属层进行图形化处理，以在金属层上形成一定的图形，进而形成布线层20；其中图形化处理，可以包括：在金属层上形成保护层，之后在保护层上罩设掩膜版，掩膜版上设置有与电路图形形状相同的孔，之后对掩膜版进行曝光，以使与孔对应的保护层被曝光，并且被曝光的保护层的形状与电路图形的形状相同，之后通过酸液或者碱液去除未被曝光的保护层以及未被曝光的保护层下的金属层，由于曝光后的保护层不会被酸液和碱液腐蚀，因此被曝光的保护层以及被曝光的保护层下的金属层被保留，进而形成具有一定图形的电路。In the embodiment of the present application, the wiring layer 20 may be composed of a metal layer with a certain pattern, so that the wiring layer 20 constitutes a circuit. Exemplarily, the metal layer may be formed by electroplating, and then the metal layer may be patterned to form a certain pattern on the metal layer, thereby forming the wiring layer 20; wherein the patterning processing may include: on the metal layer A protective layer is formed, and then a mask is placed on the protective layer. The mask is provided with holes with the same shape as the circuit pattern, and then the mask is exposed so that the protective layer corresponding to the holes is exposed and is The shape of the exposed protective layer is the same as the shape of the circuit pattern, and then the unexposed protective layer and the metal layer under the unexposed protective layer are removed by acid or lye. Because the exposed protective layer will not be affected by the acid And the lye is corroded, so the exposed protective layer and the metal layer under the exposed protective layer are retained, thereby forming a circuit with a certain pattern.
本申请实施例中，多层电路板可以为具有两个布线层20的双层板。In the embodiment of the present application, the multilayer circuit board may be a double-layer board having two wiring layers 20.
如图3-图6所示，为了实现芯板10两侧布线层20之间的连接，可以在芯板10上设置孔洞40，孔洞40贯穿芯板10，位于芯板10两侧的布线层20均具有围设在孔洞40周围的焊盘30，之后在孔洞40的侧壁上形成金属层，金属层覆盖整个孔洞40的侧壁，金属层呈管状；金属层的一端与芯板10一侧的焊盘30连接，金属层的另一端与芯板10另一侧的焊盘30连接。去除孔洞40侧壁的部分金属层，以在孔洞40的侧壁上形成多个连接线50，连接线50的一端与芯板10一侧的焊盘30连接，连接线50的另一端与芯板10另一侧的焊盘30连接；芯板10一侧的焊盘30包括间隔设置的多个第一接触部，每一第一接触部与一个连接线50的一端连接，相同的，芯板10另一侧的焊盘30包括间隔设置的多个第二接触部，每一第二接触部与一个连接线50的另一端连接。As shown in FIGS. 3-6, in order to realize the connection between the wiring layers 20 on both sides of the core board 10, holes 40 may be provided on the core board 10, and the holes 40 penetrate the core board 10 and are located on the wiring layers on both sides of the core board 10. Each 20 has a pad 30 surrounding the hole 40, and then a metal layer is formed on the sidewall of the hole 40, the metal layer covers the entire sidewall of the hole 40, and the metal layer is tubular; one end of the metal layer is the same as the core board 10 The land 30 on the side is connected, and the other end of the metal layer is connected to the land 30 on the other side of the core board 10. Part of the metal layer on the side wall of the hole 40 is removed to form a plurality of connecting wires 50 on the side wall of the hole 40. One end of the connecting wire 50 is connected to the pad 30 on one side of the core board 10, and the other end of the connecting wire 50 is connected to the core. The pad 30 on the other side of the board 10 is connected; the pad 30 on one side of the core board 10 includes a plurality of first contact portions arranged at intervals, and each first contact portion is connected to one end of a connecting wire 50. The same, the core The pad 30 on the other side of the board 10 includes a plurality of second contact portions arranged at intervals, and each second contact portion is connected to the other end of a connecting wire 50.
可以通过机械加工的方式去除金属层，例如可以通过磨削的方式去除金属层，示例性的可以将钻头或者锣刀伸入到孔洞40内，进而对孔洞40的侧壁进行切削，以去除孔洞40侧壁的金属层，形成间隔的多个连接线50；当然，还可以通过激光去除部分孔洞40侧壁的金属层，进而形成间隔的多个连接线50。值得说明的是，连接线50在孔洞40侧壁上可以呈直线状延伸，当然连接线50在孔洞40的侧壁上还可以弯曲的延伸；本实施例对连接线50在孔洞40内的延伸形状不作限制，只要能够保证各连接线50互不接触即可。通过机械加工的方式去除孔洞40侧壁的部分金属层，简化了加工难度，同时也提高了加工速率。The metal layer can be removed by mechanical processing, for example, the metal layer can be removed by grinding. Illustratively, a drill or a gong knife can be inserted into the hole 40, and then the sidewall of the hole 40 can be cut to remove the hole. The metal layer on the sidewall of the hole 40 forms a plurality of connecting lines 50 at intervals; of course, a part of the metal layer on the sidewall of the hole 40 can also be removed by laser to form a plurality of connecting lines 50 at intervals. It is worth noting that the connecting line 50 may extend linearly on the side wall of the hole 40, of course, the connecting line 50 may also extend curved on the side wall of the hole 40; in this embodiment, the extension of the connecting line 50 in the hole 40 The shape is not limited, as long as it can ensure that the connecting wires 50 do not touch each other. Part of the metal layer on the sidewall of the hole 40 is removed by mechanical processing, which simplifies the processing difficulty and also improves the processing speed.
本实施例对连接线50的数量不做限制，如图4所示，设置在孔洞40内的连接线50可以为两个，两个连接线50相对于孔洞40的中心线对称的设置；相应的设置在一个布线层20上的焊盘30的两个第一接触部对称设置，设置在另一布线层20上的焊盘30的两个第二接触部也对称的设置。如图5所示，本实施例中，设置在孔洞40内的连接线50也可以为三个，三个连接线50相对于孔洞40中心线中心对称设置；相应的设置在一个布线层20上的焊盘30的三个第一接触对称设置，设置在另一布线层20上的焊盘30的三个第二接触部也对称的设置。如图6所示，本实施例中，设置在孔洞40内的连接线50也可以为四个，四个连接线50相对于孔洞40中心线中心对称设置；相应的设置在一个布线层20上焊盘30的四个第一接触对称设置，设置在另一布线层20上的焊盘30的四个第二接触部也对称的设置。当然本实施例中设置在孔洞40内的连接线50的个数还可以为八个、十个等。值得说明的是，设置在孔洞40的内的各连接线50的形状也可以不同，可以根据实际使用需求合理的设置每一连接线50的形状和尺寸。This embodiment does not limit the number of connecting wires 50. As shown in FIG. 4, there may be two connecting wires 50 arranged in the hole 40, and the two connecting wires 50 are arranged symmetrically with respect to the center line of the hole 40; correspondingly; The two first contact portions of the pad 30 arranged on one wiring layer 20 are arranged symmetrically, and the two second contact portions of the pad 30 arranged on the other wiring layer 20 are also arranged symmetrically. As shown in FIG. 5, in this embodiment, there may be three connecting wires 50 arranged in the hole 40, and the three connecting wires 50 are arranged symmetrically with respect to the center line of the hole 40; correspondingly arranged on a wiring layer 20 The three first contacts of the pad 30 are arranged symmetrically, and the three second contacts of the pad 30 arranged on the other wiring layer 20 are also arranged symmetrically. As shown in FIG. 6, in this embodiment, there may be four connecting wires 50 arranged in the hole 40, and the four connecting wires 50 are arranged symmetrically with respect to the center line of the hole 40; correspondingly arranged on a wiring layer 20 The four first contacts of the pad 30 are arranged symmetrically, and the four second contacts of the pad 30 arranged on the other wiring layer 20 are also arranged symmetrically. Of course, the number of connecting wires 50 arranged in the hole 40 in this embodiment can also be eight, ten, etc. It is worth noting that the shape and size of each connecting wire 50 arranged in the hole 40 can also be different, and the shape and size of each connecting wire 50 can be reasonably set according to actual use requirements.
本实施例中，通过在芯板10上设置孔洞40，孔洞40的侧壁上形成间隔的多个连接线50，每一连接线50与不同的布线层20连接；孔洞40内设置多个连接线50，可以减少孔洞40的数量，提高多层电路板的布线密度，进而减小多层电路板的面积。In this embodiment, by arranging holes 40 on the core board 10, a plurality of connecting lines 50 are formed on the sidewalls of the holes 40, and each connecting line 50 is connected to a different wiring layer 20; a plurality of connections are arranged in the hole 40 The line 50 can reduce the number of holes 40, increase the wiring density of the multilayer circuit board, and thereby reduce the area of the multilayer circuit board.
本申请实施例中，多层电路板可以为具有不少于三个布线层20的多层板。In the embodiment of the present application, the multilayer circuit board may be a multilayer board having no less than three wiring layers 20.
如图7所示，在一些实施例中，芯板10包括第一表层芯板101以及第二表层芯板102，第一表层芯板101和第二表层芯板102外侧面上均设置有布线层20，第一表层芯板101与第二表层芯板102之间也设置有布线层20。孔洞40可以贯穿整个多层电路板，当然孔洞40也可以只贯穿第一表层芯板101或者第二表层芯板102；示例性，继续参照图7，当孔洞40贯穿整个多层电路板时，同一孔洞40内的各连接线50连接的布线层20可以相同， 示例性的，孔洞40内的各连接线50的一端可以均与第一表层芯板101外侧的布线层20连接，同时孔洞40内的各连接线50的另一端均与第二表层芯板102外侧的布线层20连接；值得说明的是，连接线50还可以与第一表层芯板101和第二表层芯板102之间的布线层20连接。As shown in FIG. 7, in some embodiments, the core board 10 includes a first surface layer core board 101 and a second surface layer core board 102. The outer surfaces of the first surface layer core board 101 and the second surface layer core board 102 are both provided with wiring. In the layer 20, a wiring layer 20 is also provided between the first surface layer core board 101 and the second surface layer core board 102. The hole 40 can penetrate the entire multi-layer circuit board. Of course, the hole 40 can also only penetrate the first surface layer core board 101 or the second surface layer core board 102; for example, referring to FIG. 7, when the hole 40 penetrates the entire multi-layer circuit board, The wiring layer 20 connected to the connecting wires 50 in the same hole 40 may be the same. For example, one end of each connecting wire 50 in the hole 40 may all be connected to the wiring layer 20 outside the first surface layer core board 101, and the hole 40 The other end of each connecting wire 50 inside is connected to the wiring layer 20 outside the second surface layer core board 102; it is worth noting that the connecting wire 50 can also be connected to the first surface layer core board 101 and the second surface layer core board 102. The wiring layer 20 is connected.
如此设置，增加了布线层20的数量，进一步提高了多层电路板的布线密度。This arrangement increases the number of wiring layers 20 and further improves the wiring density of the multilayer circuit board.
继续参照图8，当孔洞40贯穿整个多层电路板时，同一孔洞40内的各连接线50连接的布线层20可以不完全相同，示例性的，同一孔洞40内一部分连接线50的一端与第一表层芯板101外侧的布线层20连接，孔洞40内一部分连接线50的另一端与第一表层芯板101和第二表层芯板102之间的布线层20连接，孔洞40内另一部分连接线50的一端与第一表层芯板101外侧的布线层20连接，孔洞40内另一部分连接线50的另一端与第二表层芯板102外侧的布线层20连接。或者，同一孔洞40一部分连接线50的一端与第二表层芯板102外侧的布线层20连接，孔洞40内一部分连接线50的另一端与第一表层芯板101和第二表层芯板102之间的布线层20连接，孔洞40内另一部分连接线50的一端与第一表层芯板101外侧的布线层20连接，孔洞40内另一部分连接线50的另一端与第二表层芯板102外侧的布线层20连接。如此设置，同一孔洞40内的不同连接线50连接的布线层20不同，可以提高电路板的布线密度。Continuing to refer to FIG. 8, when the hole 40 penetrates the entire multi-layer circuit board, the wiring layer 20 connected by the connecting wires 50 in the same hole 40 may not be completely the same. For example, one end of a part of the connecting wires 50 in the same hole 40 is connected to The wiring layer 20 outside the first surface layer core board 101 is connected, the other end of a part of the connecting wire 50 in the hole 40 is connected to the wiring layer 20 between the first surface layer core board 101 and the second surface layer core board 102, and the other part in the hole 40 One end of the connecting wire 50 is connected to the wiring layer 20 outside the first surface layer core board 101, and the other end of the other part of the connecting wire 50 in the hole 40 is connected to the wiring layer 20 outside the second surface layer core board 102. Alternatively, one end of a part of the connecting wire 50 in the same hole 40 is connected to the wiring layer 20 outside the second surface layer core board 102, and the other end of a part of the connecting wire 50 in the hole 40 is connected to the first surface layer core board 101 and the second surface layer core board 102. The wiring layer 20 is connected between, and one end of the other part of the connection line 50 in the hole 40 is connected to the wiring layer 20 outside the first surface layer core board 101, and the other end of the other part of the connection line 50 in the hole 40 is connected to the outside of the second surface layer core board 102 The wiring layer 20 is connected. With this arrangement, the wiring layers 20 connected by different connecting wires 50 in the same hole 40 are different, which can increase the wiring density of the circuit board.
在一些实施例中，孔洞40可以只贯穿第一表层芯板101，相应的，孔洞40内的各连接线50的一端与第一表层芯板101外侧的布线层20连接，孔洞40内的各连接线50的另一端与第一表层芯板101和第二表层芯板102之间的布线层20连接；当然，孔洞40也可以只贯穿第二表层芯板102，相应的，孔洞40内的各连接线50的一端与第二表层芯板102外侧的布线层20连接，孔洞40内的各连接线50的另一端与第一表层芯板101和第二表层芯板102之间的布线层20连接。In some embodiments, the hole 40 may only penetrate the first surface layer core board 101. Correspondingly, one end of each connection line 50 in the hole 40 is connected to the wiring layer 20 outside the first surface layer core board 101, and each of the holes 40 The other end of the connecting wire 50 is connected to the wiring layer 20 between the first surface layer core board 101 and the second surface layer core board 102; of course, the hole 40 can also only penetrate the second surface layer core board 102. Correspondingly, the hole 40 One end of each connecting line 50 is connected to the wiring layer 20 outside the second surface layer core board 102, and the other end of each connecting line 50 in the hole 40 is connected to the wiring layer between the first surface layer core board 101 and the second surface layer core board 102 20 connections.
在一些实施例中，如图9所示，当多层电路板为多层板时，芯板10还可以包括设置在第一表层芯板101和第二表层芯板102之间的中间芯板103，中间芯板103与第一表层芯板101和第二表层芯板102之间均设置有布线层20，孔洞40包括设置在中间芯板103上的第一孔洞401，连接线50包括间隔的设置在第一孔洞401内的第一连接线501，第一孔洞401内设置有金属层，去除部分金属层，以在第一孔洞401的侧壁上形成间隔的多个第一连接线501，每一第一连接线501连接不同的布线层20。通过设置中间芯板103可以增加布线层20的数量，进而增大多层电路板的布线面积，进一步提高多层电路板的布线密度，减小多层电路板的面积。第一孔洞401贯穿中间芯板103，相应的，第一孔洞401内的第一连接线501的一端与中间芯板103的一侧的布线层20连接，第一孔洞401内的第一连接线501的另一端与中间芯板103另一侧的布线层20连接。In some embodiments, as shown in FIG. 9, when the multi-layer circuit board is a multi-layer board, the core board 10 may further include an intermediate core board arranged between the first surface layer core board 101 and the second surface layer core board 102. 103, the middle core board 103 and the first surface layer core board 101 and the second surface layer core board 102 are provided with a wiring layer 20, the hole 40 includes a first hole 401 provided on the middle core board 103, and the connecting line 50 includes a space The first connection line 501 arranged in the first hole 401, the first hole 401 is provided with a metal layer, and part of the metal layer is removed to form a plurality of spaced first connection lines 501 on the sidewall of the first hole 401 , Each first connecting line 501 is connected to a different wiring layer 20. By providing the intermediate core board 103, the number of wiring layers 20 can be increased, thereby increasing the wiring area of the multilayer circuit board, further increasing the wiring density of the multilayer circuit board, and reducing the area of the multilayer circuit board. The first hole 401 penetrates the middle core board 103. Correspondingly, one end of the first connection line 501 in the first hole 401 is connected to the wiring layer 20 on one side of the middle core board 103, and the first connection line in the first hole 401 The other end of 501 is connected to the wiring layer 20 on the other side of the middle core board 103.
其中，可以通过机械加工的方式去除金属层，例如可以通过磨削的方式去除金属层，示例性的可以将钻头或者锣刀伸入到第一孔洞401内，进而第一孔洞401的侧壁进行切削，以去除第一孔洞401侧壁的金属层，形成间隔的多个第一连接线501；当然，还可以通过激光去除部分第一孔洞401侧壁的金属层，进而形成间隔的多个第一连接线501。Wherein, the metal layer can be removed by mechanical processing, for example, the metal layer can be removed by grinding. Exemplarily, a drill or a gong knife can be inserted into the first hole 401, and then the sidewall of the first hole 401 can be processed. Cutting to remove the metal layer on the side wall of the first hole 401 to form a plurality of first connecting lines 501 at intervals; of course, a part of the metal layer on the side wall of the first hole 401 can also be removed by laser, thereby forming a plurality of spaced first connecting lines A connection line 501.
本实施例中，通过在多层电路板上设置第一孔洞401，并且第一孔洞401内具有多个第一连接线501，每一第一连接线501和不同的布线层20连接，实现了布线层20之间的连接；并且每一第一孔洞401内的第一连接线501为多个，可以提高多层电路板的布线密 度，进而减小多层电路板的面积。In this embodiment, the first hole 401 is provided on the multilayer circuit board, and the first hole 401 has a plurality of first connecting lines 501, and each first connecting line 501 is connected to a different wiring layer 20, so as to achieve The connection between the wiring layers 20; and there are multiple first connection lines 501 in each first hole 401, which can increase the wiring density of the multilayer circuit board, thereby reducing the area of the multilayer circuit board.
本实施例中，如图10所示，孔洞40还可以包括设置在第一表层芯板101或第二表层芯板102上的第二孔洞402，或者，孔洞40还包括设置在第一表层芯板101和第二表层芯板102上的第二孔洞402；第二孔洞402内设置有金属层，去除部分金属层，以在第二孔洞402的侧壁上形成间隔的多个第二连接线502，每一第二连接线502连接不同的布线层20。示例性的，继续参照图10，第二孔洞402可以为盲孔，第二孔洞402贯穿第一表层芯板101后延伸至中间芯板103，第二孔洞402内的各第二连接线502的一端与第一表层芯板101外侧的布线层20连接，第二孔洞402内的各第二连接线502的另一端与中间芯板103和第一表层芯板101之间的布线层20连接；当然，第二孔洞402还可以贯穿第二表层芯板102，第二孔洞402贯穿第二表层芯板102后延伸至中间芯板103，相应的，第二孔洞402内的各第二连接线502的一端与第二表层芯板102外侧的布线层20连接，第二孔洞402内的各第二连接线502的另一端与第二表层芯板102和中间芯板103之间的布线层20连接。In this embodiment, as shown in FIG. 10, the hole 40 may also include a second hole 402 provided on the first surface layer core plate 101 or the second surface layer core plate 102, or the hole 40 may also include a second hole provided on the first surface layer core plate. The second hole 402 on the board 101 and the second surface layer core board 102; the second hole 402 is provided with a metal layer, and part of the metal layer is removed to form a plurality of second connecting lines spaced on the sidewall of the second hole 402 502, each second connecting line 502 is connected to a different wiring layer 20. Exemplarily, with continued reference to FIG. 10, the second hole 402 may be a blind hole, the second hole 402 penetrates the first surface layer core plate 101 and then extends to the middle core plate 103, and each second connection line 502 in the second hole 402 One end is connected to the wiring layer 20 outside the first surface layer core board 101, and the other end of each second connection line 502 in the second hole 402 is connected to the wiring layer 20 between the middle core board 103 and the first surface layer core board 101; Of course, the second hole 402 can also penetrate the second surface layer core plate 102. The second hole 402 penetrates the second surface layer core plate 102 and then extends to the middle core plate 103. Correspondingly, each second connection line 502 in the second hole 402 One end of is connected to the wiring layer 20 outside the second surface layer core board 102, and the other end of each second connection line 502 in the second hole 402 is connected to the wiring layer 20 between the second surface layer core board 102 and the middle core board 103 .
如此设置，第一孔洞401内的第一连接线501和第二孔洞402内的第二连接线502均连接不同的布线层20，进一步提高了多层电路板的布线密度。With this arrangement, the first connection line 501 in the first hole 401 and the second connection line 502 in the second hole 402 are both connected to different wiring layers 20, which further improves the wiring density of the multilayer circuit board.
其中，可以通过机械加工的方式去除金属层，例如可以通过磨削的方式去除金属层，示例性的可以将钻头或者锣刀伸入到第二孔洞402内，进而第二孔洞402的侧壁进行切削，以去除第二孔洞402侧壁的金属层，形成间隔的多个第二连接线502；当然，还可以通过激光去除部分第二孔洞402侧壁的金属层，进而形成间隔的多个第二连接线502。Wherein, the metal layer can be removed by mechanical processing, for example, the metal layer can be removed by grinding. Exemplarily, a drill or a gong knife can be inserted into the second hole 402, and then the sidewall of the second hole 402 can be processed. Cutting to remove the metal layer on the sidewall of the second hole 402 to form a plurality of second connecting lines 502 at intervals; of course, it is also possible to remove part of the metal layer on the sidewall of the second hole 402 by laser to form a plurality of spaced second connecting lines. Two connection line 502.
本实施例中，通过设置第二孔洞402，并且第二孔洞402内间隔的设置多个第二连接线502，每一第二连接线502连接不同的布线层20，可以进一步提高多层电路板的布线密度，进一步减小多层电路板的面积。In this embodiment, the second hole 402 is provided, and a plurality of second connecting lines 502 are arranged at intervals in the second hole 402, and each second connecting line 502 is connected to a different wiring layer 20, which can further improve the multilayer circuit board. The wiring density further reduces the area of the multilayer circuit board.
本实施例中，第二孔洞402还可以贯穿第一表层芯板101和第二表层芯板102，并且同一第二孔洞402内的各第二连接线502连接的布线层20可以相同；当然第二孔洞402内的各第二连接线502连接的布线层20也可以不完全相同，示例性的同一第二孔洞402内的部分第二连接线502的一端与另一部分第二连接线502的一端与相同的布线层20连接，部分第二连接线502的另一端与另一部分第二连接线502的另一端与不同的布线层20连接；当然，第二孔洞402内的各第二连接线502连接的布线层20也可以不同，示例性的同一第二孔洞402的部分第二连接线502的两端与另一部分第二连接线502的两端连接的布线层20均不同。In this embodiment, the second hole 402 may also penetrate the first surface layer core board 101 and the second surface layer core board 102, and the wiring layer 20 connected by each second connecting line 502 in the same second hole 402 may be the same; of course, The wiring layer 20 connected to each second connecting line 502 in the two holes 402 may not be completely the same. Exemplarily, one end of a part of the second connecting line 502 in the same second hole 402 and one end of another part of the second connecting line 502 are Connected to the same wiring layer 20, the other end of part of the second connecting line 502 and the other end of another part of the second connecting line 502 are connected to a different wiring layer 20; of course, each second connecting line 502 in the second hole 402 The connected wiring layers 20 may also be different. For example, the two ends of a part of the second connecting line 502 of the same second hole 402 and the two ends of another part of the second connecting line 502 are connected to different wiring layers 20.
如图11所示，第二孔洞402贯穿第一表层芯板101和第二表层芯板102，第二孔洞402内的第二连接线502连接的布线层20不完全相同，第二孔洞402内的部分第二连接线502的一端与第一表层芯板101外的布线层20连接，部分第二连接线502的另一端与第一表层芯板101和中间芯板103之间的布线层20连接，同一第二孔洞402内另一部分第二连接线502的一端与第一表层芯板101外侧的布线层20连接，另一部分第二连接线502的另一端与第二表层芯板102外侧的布线层20连接。As shown in FIG. 11, the second hole 402 penetrates the first surface layer core board 101 and the second surface layer core board 102. The wiring layer 20 connected by the second connecting line 502 in the second hole 402 is not completely the same. One end of part of the second connecting line 502 is connected to the wiring layer 20 outside the first surface layer core board 101, and the other end of the part of the second connecting line 502 is connected to the wiring layer 20 between the first surface layer core board 101 and the middle core board 103 Connection, one end of another part of the second connection line 502 in the same second hole 402 is connected to the wiring layer 20 outside the first surface layer core board 101, and the other end of the other part of the second connection line 502 is connected to the outside of the second surface layer core board 102 The wiring layer 20 is connected.
在本实施例中，当第二连接线502经过多个布线层20时，第二连接线502还可以与经过的一个或者多个布线层20连接。In this embodiment, when the second connecting line 502 passes through a plurality of wiring layers 20, the second connecting line 502 may also be connected to one or more wiring layers 20 passing through.
本实施例中，多层电路板上可以同时设置第一孔洞401和第二孔洞402，当然多层电 路板上还可以只设置第一孔洞401或者只设置第二孔洞402，本实施例对此不作限制。In this embodiment, the first hole 401 and the second hole 402 can be provided on the multilayer circuit board at the same time. Of course, only the first hole 401 or only the second hole 402 can be provided on the multilayer circuit board. No restrictions.
在一些实施例中，如图12所示，中间芯板103可以为多个，并且相邻的中间芯板103之间设置有布线层20，第一孔洞401贯穿至少一个中间板；第一孔洞401可以只贯穿一个中间芯板103，此时第一孔洞401内的各第一连接线501的一端与被贯穿的中间芯板103一侧的布线层20连接，各第一连接线501的另一端与被贯穿的中间芯板103另一侧的布线层20连接；示例性的，被贯穿的中间芯板103可以为各中间芯板103中靠近第一表层芯板101的一个，当然被贯穿的中间芯板103还可以为各中间芯板103中靠近第二表层芯板102的一个；或者，被贯穿的中间芯板103还可以位于靠近第一表层芯板101的中间芯板103以及靠近第二表层芯板102的中间芯板103之间的中间芯板103。中间芯板103为多个，进一步增大了布线层20的数量，以进一步提高多层电路板的布线密度。In some embodiments, as shown in FIG. 12, there may be a plurality of middle core boards 103, and a wiring layer 20 is provided between adjacent middle core boards 103, and the first hole 401 penetrates at least one middle board; 401 may only penetrate through one middle core board 103. At this time, one end of each first connecting wire 501 in the first hole 401 is connected to the wiring layer 20 on the side of the penetrated middle core board 103, and the other of each first connecting wire 501 One end is connected to the wiring layer 20 on the other side of the penetrated middle core board 103; for example, the penetrated middle core board 103 may be one of the middle core boards 103 that is close to the first surface layer core board 101, which of course is penetrated The middle core board 103 may also be one of the middle core boards 103 that is close to the second surface layer core board 102; or the penetrated middle core board 103 may also be located near the middle core board 103 of the first surface layer core board 101 and close to The middle core board 103 between the middle core boards 103 of the second surface layer core board 102. There are multiple intermediate core boards 103, which further increases the number of wiring layers 20 to further increase the wiring density of the multilayer circuit board.
本实施例中，通过在多层电路板上设置第一孔洞401和第二孔洞402，并且第一孔洞401内具有多个第一连接线501，第二孔洞402内具有多个第二连接线502，每一第一连接线501和第二连接线502均连接不同的布线层20，实现了布线层20之间的连接；并且每一第一孔洞401内的第一连接线501为多个，每一第二孔洞402内的第二连接线502为多个，可以提高多层电路板的布线密度，减少第一孔洞401和第二孔洞402的数量，进而减小多层电路板的面积。另外由于多层电路板的布线密度增加，还可以减少中间芯板103的数量，进而减小多层电路板的体积。In this embodiment, the first hole 401 and the second hole 402 are provided on the multilayer circuit board, and the first hole 401 has a plurality of first connection lines 501, and the second hole 402 has a plurality of second connection lines. 502, each of the first connecting lines 501 and the second connecting lines 502 are connected to different wiring layers 20, realizing the connection between the wiring layers 20; and there are multiple first connecting lines 501 in each first hole 401 There are multiple second connecting lines 502 in each second hole 402, which can increase the wiring density of the multilayer circuit board, reduce the number of first holes 401 and second holes 402, and thereby reduce the area of the multilayer circuit board . In addition, as the wiring density of the multilayer circuit board increases, the number of intermediate core boards 103 can also be reduced, thereby reducing the volume of the multilayer circuit board.
在一个可实现的方式中，如图13所示，当中间芯板103为多个时，第一孔洞401可以贯穿所有的中间芯板103，第一孔洞401内的各第一连接线501连接的布线层20可以相同，示例性的，第一孔洞401内所有的第一连接线501一端均可以与靠近第一表层芯板101的布线层20连接，相应的，第一孔洞401内所有的第一连接线501的另一端均可以与靠近第二表层芯板102的布线层20连接；值得说明的是，第一连接线501还可以与一个或者多个被第一孔洞401穿过的布线层20连接，不同的第一连接线501可以与不同的被穿过的布线层20连接，当然不同的第一连接线501还可以与相同的被穿过的布线层20连接。In an achievable manner, as shown in FIG. 13, when there are multiple middle core plates 103, the first holes 401 can penetrate all the middle core plates 103, and the first connecting lines 501 in the first holes 401 are connected The wiring layer 20 may be the same. For example, one end of all the first connecting wires 501 in the first hole 401 may be connected to the wiring layer 20 close to the first surface layer core board 101. Correspondingly, all the first holes 401 The other end of the first connection line 501 can be connected to the wiring layer 20 close to the second surface layer core board 102; it is worth noting that the first connection line 501 can also be connected to one or more wiring lines passing through the first hole 401. The layers 20 are connected, and different first connection lines 501 can be connected to different wiring layers 20 that are passed through. Of course, different first connection lines 501 can also be connected to the same wiring layer 20 that is passed through.
如图14所示，当第一孔洞401贯穿所有的中间芯板103时，第一孔洞401内的各第一连接线501连接的布线层20可以不完全相同；以图14所示方位为例，位于第一孔洞401内的部分第一连接线501的一端与靠近第一表层芯板101的布线层20连接，位于第一孔洞401内的部分第一连接线501的另一端与由上之下第三个布线层20连接；位于同一孔洞40内的另一部分第一连接线501的一端与靠近第一表层芯板101的布线层20连接，位于第一孔洞401内的另一部分第一连接线501的另一端与靠近第二表层芯板102的布线层20连接。当然本实施例并不依次为限，只要保证一部分第一连接线501与另一部分第一连接线501连接的布线层20不完全相同即可。当然，第一孔洞401内的各第一连接线501连接的布线层20可以不同，示例性的，位于第一孔洞401内的部分第一连接线501的一端与靠近第一表层芯板101的布线层20连接，位于第一孔洞401内的部分第一连接线501的另一端与由上之下第三个布线层20连接；位于同一孔洞40内的另一部分第一连接线501的一端与由上之下第四个布线层20连接，位于第一孔洞401内的另一部分第一连接线501的另一端与靠近第二表层芯板102的布线层20连接。As shown in FIG. 14, when the first hole 401 penetrates all the middle core boards 103, the wiring layer 20 connected by the first connecting wires 501 in the first hole 401 may not be completely the same; take the orientation shown in FIG. 14 as an example One end of the part of the first connection line 501 located in the first hole 401 is connected to the wiring layer 20 close to the first surface layer core board 101, and the other end of the part of the first connection line 501 located in the first hole 401 is connected to The lower third wiring layer 20 is connected; one end of the other part of the first connection line 501 located in the same hole 40 is connected to the wiring layer 20 close to the first surface layer core board 101, and the other part of the first connection located in the first hole 401 is connected The other end of the wire 501 is connected to the wiring layer 20 close to the second surface layer core board 102. Of course, this embodiment is not limited in sequence, as long as it is ensured that the wiring layer 20 connected to a part of the first connecting line 501 and another part of the first connecting line 501 is not completely the same. Of course, the wiring layer 20 connected to each first connection line 501 in the first hole 401 may be different. For example, one end of a part of the first connection line 501 located in the first hole 401 is close to the first surface layer core board 101. The wiring layer 20 is connected, and the other end of the part of the first connection line 501 located in the first hole 401 is connected to the third wiring layer 20 from above and below; one end of the other part of the first connection line 501 located in the same hole 40 is connected to The fourth wiring layer 20 is connected from above and below, and the other end of another part of the first connection line 501 located in the first hole 401 is connected to the wiring layer 20 close to the second surface layer core board 102.
在一个可实现的方式中，如图15所示，第一孔洞401可以依次贯穿多个中间芯板103，但第一孔洞401并不贯穿所有的中间芯板103。依次贯穿多个中间芯板103，可以保证第 一孔洞401的连续性，以便于在第一孔洞401的侧壁上设置第一连接线501。示例性的，第一孔洞401可以由靠近第一表层芯板101的中间芯板103向第二表层芯板102延伸，或者第一孔洞401由靠近第二表层芯板102的中间芯板103向第一表层芯板101延伸，当然本实施例中，多个中间芯板103依次层叠设置，第一孔洞401还可以贯穿位于多个中间芯板103中部的一个或几个中间芯板103。位于第一孔洞401内的各第一连接线501连接的布线层20可以相同、不完全相同或者不同；另外第一连接线501还可以与被其穿过的布线层20中的一个或者几个连接。In an achievable manner, as shown in FIG. 15, the first hole 401 may sequentially penetrate through a plurality of middle core plates 103, but the first hole 401 does not penetrate all the middle core plates 103. By sequentially penetrating through the plurality of middle core plates 103, the continuity of the first hole 401 can be ensured, so that the first connecting line 501 can be arranged on the side wall of the first hole 401. Exemplarily, the first hole 401 may extend from the middle core plate 103 close to the first surface layer core plate 101 to the second surface layer core plate 102, or the first hole 401 may extend from the middle core plate 103 close to the second surface layer core plate 102 to the second surface layer core plate 102. The first surface layer core board 101 extends. Of course, in this embodiment, a plurality of middle core boards 103 are stacked one after another, and the first hole 401 may also penetrate one or more middle core boards 103 located in the middle of the plurality of middle core boards 103. The wiring layers 20 connected to the first connecting lines 501 located in the first holes 401 may be the same, not completely the same or different; in addition, the first connecting lines 501 may also be connected to one or more of the wiring layers 20 through which they pass. connection.
在上述实现方式中，当中间芯板103为多个时，还可以在第一表层芯板101或第二表层芯板102上设置第二孔洞402，或者，以在第一表层芯板101和第二表层芯板102上设置第二孔洞402；在第二孔洞402侧壁上设置有金属层，去除部分金属层，以在第二孔洞402的侧壁上形成间隔的多个第二连接线502，第二连接线502连接不同的布线层20。其中可以通将钻头或者锣刀伸入到第二孔洞402内，之后通过钻头或者锣刀去除部分金属层，以在第二孔洞402的侧壁上形成多个间隔的第二连接线502；还可以通过激光去除部分金属层，以在第二孔洞402侧壁上形成多个间隔的第二连接线502。In the foregoing implementation manner, when there are multiple intermediate core plates 103, the second hole 402 can also be provided on the first surface layer core plate 101 or the second surface layer core plate 102, or to form the first surface layer core plate 101 and the second surface layer core plate 102. A second hole 402 is provided on the second surface layer core plate 102; a metal layer is provided on the sidewall of the second hole 402, and part of the metal layer is removed to form a plurality of second connecting lines spaced on the sidewall of the second hole 402 502, the second connecting line 502 connects different wiring layers 20. A drill bit or a gong knife can be inserted into the second hole 402, and then a part of the metal layer can be removed by the drill bit or a gong knife to form a plurality of spaced second connecting lines 502 on the sidewall of the second hole 402; A part of the metal layer can be removed by laser to form a plurality of spaced second connecting lines 502 on the sidewall of the second hole 402.
如图16所示，示例性的，第一孔洞401可以仅贯穿多个中间芯板103中位于中部的一个或者多个中间芯板103，第二孔洞402可以为盲孔，第二孔洞402可以只贯穿第一表层芯板101，此时各第二连接线502的一端与第一表层芯板101外侧的布线层20连接，各第二连接线502的另一端与中间芯板103与第一表层芯板101之间的布线层20连接。如图17所示，第一孔洞401贯穿所有的中间芯板103，第二孔洞402只贯穿第一表层芯板101。如图18所示，当然，也可以在第二表层芯板102上设置第二孔洞402。As shown in FIG. 16, for example, the first hole 401 may only penetrate one or more middle core plates 103 in the middle of the plurality of middle core plates 103, the second hole 402 may be a blind hole, and the second hole 402 may Only through the first surface layer core board 101, at this time, one end of each second connecting wire 502 is connected to the wiring layer 20 outside the first surface layer core board 101, and the other end of each second connecting wire 502 is connected to the middle core board 103 and the first The wiring layers 20 between the surface layer core boards 101 are connected. As shown in FIG. 17, the first hole 401 penetrates all the middle core plates 103, and the second hole 402 only penetrates the first surface layer core plate 101. As shown in FIG. 18, of course, a second hole 402 can also be provided on the second surface layer core plate 102.
本实施例中，当第二孔洞402为盲孔时，第二孔洞402可以向多层电路板的中部延伸，并且贯穿一个或者多个中间芯板103；示例性的，如图19所示，第二孔洞402贯穿第一表层芯板101之后向第二表层芯板102延伸，并且依次贯穿两个中间芯板103，第二孔洞402内的第二连接线502的一端与第一表层芯板101外侧的布线层20连接，第二孔洞402内的第二连接线502的另一端可以与相同或者不同的布线层20连接；值得说明的是，第二孔洞402在贯穿第一表层芯板101之后还可以贯穿一个或多个中间芯板103，本实施例对第二孔洞402贯穿的中间芯板103的数量不限制；另外，第二孔洞402内的各第二连接线502连接的布线层20可以相同、不完全相同或者不同。当然，第二孔洞402可以在贯穿第二表层芯板102后向第一表层芯板101延伸，并且依次贯穿一个或者多个中间芯板103，第二孔洞402内的各第二连接线502连接的布线层20可以相同、不完全相同或者不同。在上述实现方式中，第二孔洞402依次贯穿多个中间芯板103，可以保证第二孔洞402的连续性，以便在第二孔洞402的侧壁上形成第二连接线502。In this embodiment, when the second hole 402 is a blind hole, the second hole 402 may extend to the middle of the multilayer circuit board and penetrate through one or more middle core boards 103; for example, as shown in FIG. 19, The second hole 402 penetrates the first surface layer core plate 101 and then extends to the second surface layer core plate 102, and passes through the two middle core plates 103 in sequence. One end of the second connecting line 502 in the second hole 402 is connected to the first surface layer core plate. The wiring layer 20 outside 101 is connected, and the other end of the second connection line 502 in the second hole 402 can be connected to the same or different wiring layer 20; it is worth noting that the second hole 402 penetrates the first surface layer core board 101 Afterwards, one or more middle core boards 103 may be penetrated. In this embodiment, the number of middle core boards 103 through which the second hole 402 penetrates is not limited; in addition, the wiring layer connected by each second connecting line 502 in the second hole 402 is not limited. 20 can be the same, not exactly the same, or different. Of course, the second hole 402 can extend to the first surface core plate 101 after passing through the second surface layer core plate 102, and sequentially pass through one or more middle core plates 103, and each second connecting line 502 in the second hole 402 is connected The wiring layers 20 may be the same, not completely the same, or different. In the foregoing implementation manner, the second hole 402 sequentially penetrates the plurality of intermediate core plates 103, which can ensure the continuity of the second hole 402, so that the second connecting line 502 is formed on the sidewall of the second hole 402.
本实施例中，如图20所示，第二孔洞402还可以为通孔，即第二孔洞402贯穿第一表层芯板101、第二表层芯板102以及第一表层芯板101和第二表层芯板102之间的各中间芯板103；相应的，设置在第二孔洞402内的各第二连接线502连接的布线层20可以相同，示例性的，各第二连接线502的一端均与第一表层芯板101外侧的布线层20连接，各第二连接线502的另一端均与第二表层芯板102外侧的布线层20连接。In this embodiment, as shown in FIG. 20, the second hole 402 can also be a through hole, that is, the second hole 402 penetrates the first surface layer core plate 101, the second surface layer core plate 102, and the first surface layer core plate 101 and the second surface layer core plate 102. The middle core boards 103 between the surface core boards 102; correspondingly, the wiring layers 20 connected to the second connecting wires 502 arranged in the second holes 402 can be the same, for example, one end of each second connecting wire 502 Both are connected to the wiring layer 20 outside the first surface layer core board 101, and the other end of each second connection line 502 is connected to the wiring layer 20 outside the second surface layer core board 102.
当然，各第二连接线502连接的布线层20也可以不同；同一第二孔洞402内，部分第二连接线502与另一部分第二连接线502连接的布线层20可以完全不同，部分第二连 接线502的一端可以与第一表层芯板101外侧的布线层20连接，部分第二连接线502的另一端与第二表层芯板102外侧的布线层20连接，另一部分第二连接线502的一端可以与相邻中间芯板103之间的一个布线层20连接，另一部分第二连接线502的另一端可以与中间芯板103之间的另一布线层20连接。当然，部分第二连接线502与另一部分第二连接线502连接的布线层20可以不完全相同，示例性的，第二孔洞402内所有的第二连接线502的一端与第一表层芯板101外侧的布线层20连接，其中部分第二连接线502的另一端与第二表层芯板102外侧的布线层20连接，另一部分第二连接线502的另一端与相邻中间芯板103之间的布线层20连接。Of course, the wiring layer 20 connected by each second connecting line 502 may also be different; in the same second hole 402, the wiring layer 20 connected to a part of the second connecting line 502 and another part of the second connecting line 502 may be completely different, and part of the second connecting line 502 may be completely different. One end of the connecting line 502 can be connected to the wiring layer 20 outside the first surface layer core board 101, the other end of a part of the second connecting line 502 is connected to the wiring layer 20 outside the second surface layer core board 102, and the other part of the second connecting line 502 One end of the second connecting line 502 may be connected to one wiring layer 20 between adjacent middle core boards 103, and the other end of the second connecting line 502 may be connected to another wiring layer 20 between the middle core boards 103. Of course, the wiring layer 20 connected to a part of the second connecting line 502 and another part of the second connecting line 502 may not be completely the same. For example, one end of all the second connecting lines 502 in the second hole 402 is connected to the first surface layer core board. The wiring layer 20 outside 101 is connected, and the other end of part of the second connecting line 502 is connected to the wiring layer 20 outside of the second surface layer core board 102, and the other end of the second connecting line 502 is connected to the adjacent middle core board 103. Inter-wiring layers 20 are connected.
在上述实施例中，当第一孔洞401贯穿多个布线层20时，第一孔洞401内的第一连接线501可以与被穿过的布线层20中的一个或者多个连接，相同的，当第二孔洞402贯穿多个布线层20时，第二孔洞402内的第二连接线502可以与被穿过的布线层20中的一个或者多个连接。In the above-mentioned embodiment, when the first hole 401 penetrates through the multiple wiring layers 20, the first connection line 501 in the first hole 401 may be connected to one or more of the wiring layers 20 passed through, the same, When the second hole 402 penetrates the plurality of wiring layers 20, the second connection line 502 in the second hole 402 may be connected to one or more of the wiring layers 20 passed through.
本实施例中，通过在多层电路板上设置第一孔洞401和第二孔洞402，并且第一孔洞401内具有多个第一连接线501，第二孔洞402内具有多个第二连接线502，每一第一连接线501和第二连接线502均连接不同的布线层20，实现了布线层20之间的连接；并且每一第一孔洞401内的第一连接线501为多个，每一第二孔洞402内的第二连接线502为多个，可以提高多层电路板的布线密度，减少第一孔洞401和第二孔洞402的数量，进而减小多层电路板的面积。另外由于多层电路板的布线密度增加，还可以减少中间芯板103的数量，减小多层电路板的厚度，进而减小多层电路板的体积，也可以减小多层电路板的成本。In this embodiment, the first hole 401 and the second hole 402 are provided on the multilayer circuit board, and the first hole 401 has a plurality of first connection lines 501, and the second hole 402 has a plurality of second connection lines. 502, each of the first connecting lines 501 and the second connecting lines 502 are connected to different wiring layers 20, realizing the connection between the wiring layers 20; and there are multiple first connecting lines 501 in each first hole 401 There are multiple second connecting lines 502 in each second hole 402, which can increase the wiring density of the multilayer circuit board, reduce the number of first holes 401 and second holes 402, and thereby reduce the area of the multilayer circuit board . In addition, due to the increase in the wiring density of the multilayer circuit board, the number of intermediate core boards 103 can be reduced, the thickness of the multilayer circuit board can be reduced, and the volume of the multilayer circuit board can be reduced, and the cost of the multilayer circuit board can also be reduced. .
本申请实施例还提供一种多层电路板加工方法，如图21所示，多层电路板加工方法包括如下步骤：The embodiment of the present application also provides a method for processing a multilayer circuit board. As shown in FIG. 21, the method for processing a multilayer circuit board includes the following steps:
S101：形成芯板。S101: Form the core board.
S102：在芯板上钻孔，以形成孔洞。S102: Drill a hole in the core plate to form a hole.
如图22所示，芯板10可以由绝缘材质构成；形成芯板10之后可以通过钻头或者锣刀在芯板10上形成孔洞40，当然还可以通过激光钻孔的方式在芯板10上形成孔洞40，并且孔洞40贯穿芯板10。As shown in Figure 22, the core board 10 can be made of insulating material; after the core board 10 is formed, a hole 40 can be formed on the core board 10 by a drill or a gong knife. Of course, it can also be formed on the core board 10 by laser drilling. The hole 40 penetrates the core board 10.
本实施例中在形成孔洞之后还包括：S103：在芯板的两个侧面以及孔洞的侧壁上形成金属层。In this embodiment, after the hole is formed, the method further includes: S103: forming a metal layer on the two sides of the core board and the sidewall of the hole.
如图23所示，可以通过电镀的方式在芯板10的两侧侧面以及孔洞40的侧壁上形成金属层，当然还可以将金属层直接贴附在芯板10的侧面和孔洞40的侧壁上。As shown in FIG. 23, a metal layer can be formed on both sides of the core board 10 and the side wall of the hole 40 by electroplating. Of course, the metal layer can also be directly attached to the side of the core board 10 and the side of the hole 40. On the wall.
本实施例中，在形成金属层之后还包括：S104：对芯板两个侧面上的金属层进行图形化处理，以在芯板的每一侧面上均形成布线层。In this embodiment, after forming the metal layer, the method further includes: S104: patterning the metal layers on the two sides of the core board to form a wiring layer on each side of the core board.
如图24所示，对金属层进行图形化处理，以在芯板10的每一侧面上均形成具有一定图形的布线层20；示例性的，在芯板10的一侧的金属层上形成保护层，之后将掩膜版罩设在保护层上，掩膜版上具有与图形形状相同的孔，之后对掩膜版进行曝光，以使与掩膜版上孔正对的保护层被曝光，之后通过酸液或者碱液去除未被曝光的保护层以及未被曝光的保护层对应的金属层，由于被曝光的保护层不会与酸液和碱液反应，使得被曝光的保护层以及被曝光的保护层对应金属层被保留，进而形成具有一定图形的布线层20。值得说明 的是，在对金属层进行图形化处理时可以在孔洞40周围芯板10的表面形成焊盘，使得在形成连接线50时，连接线50通过焊盘30与布线层20连接；由于连接线50为多个，相应的焊盘可以包括环绕孔洞40间隔设置的多个接触部。As shown in FIG. 24, the metal layer is patterned to form a wiring layer 20 with a certain pattern on each side of the core board 10; for example, it is formed on the metal layer on one side of the core board 10. Protective layer, then the mask is placed on the protective layer, the mask has holes with the same shape as the pattern, and then the mask is exposed to expose the protective layer directly opposite to the holes on the mask Afterwards, the unexposed protective layer and the metal layer corresponding to the unexposed protective layer are removed by acid or lye. Since the exposed protective layer will not react with acid and lye, the exposed protective layer and The exposed protective layer is retained corresponding to the metal layer, thereby forming a wiring layer 20 with a certain pattern. It is worth noting that when the metal layer is patterned, a pad can be formed on the surface of the core board 10 around the hole 40, so that when the connecting wire 50 is formed, the connecting wire 50 is connected to the wiring layer 20 through the pad 30; There are a plurality of connecting wires 50, and the corresponding pads may include a plurality of contact portions arranged around the hole 40 at intervals.
本实施例中，在形成布线层之后还包括：S105：去除部分孔洞侧壁的金属层，以在孔洞侧壁上形成间隔的多个连接线；且每一连接线的一端与芯板一侧的布线层连接，连接线的另一端与芯板的另一侧的布线层连接。In this embodiment, after the wiring layer is formed, the method further includes: S105: removing part of the metal layer on the sidewall of the hole to form a plurality of connecting lines spaced apart on the sidewall of the hole; and one end of each connecting line is connected to one side of the core board The wiring layer is connected, and the other end of the connecting wire is connected to the wiring layer on the other side of the core board.
如图25所示，在孔洞40的侧壁上形成金属层之后，可以通过机械加工的方式去除部分金属层，以形成多个间隔的多个连接线50；在一个可实现的方式中，可以通过磨削的方式去除金属层，示例性的可以将钻头或者锣刀伸入到孔洞40内，进而使钻头或者锣刀沿平行于孔洞40中心线的方向移动，进而在金属层上形成沿平行于孔洞40中心线方向延伸的开口，重复上述过程，可以在金属层上形成多个开口，相邻的两个开口之间形成连接线50；在其他实现方式中，还可以通过激光去除部分金属层，示例性的，可以用激光照射孔洞40侧壁的金属层，进而在金属层上形成沿平行于孔洞40中心线方向延伸的开口，在金属层上形成多个开口，相邻的两个开口之间形成连接线50。通过机械加工的方式去除部分孔洞40侧壁的金属层，操作简单，提高了多层电路板加工速率。As shown in FIG. 25, after the metal layer is formed on the sidewall of the hole 40, part of the metal layer may be removed by mechanical processing to form a plurality of spaced connecting lines 50; in an achievable way, The metal layer is removed by grinding, and the drill bit or the gong knife can be inserted into the hole 40, and the drill bit or the gong knife can be moved in a direction parallel to the center line of the hole 40, thereby forming a parallel line on the metal layer. Repeating the above process for the opening extending in the direction of the center line of the hole 40, multiple openings can be formed on the metal layer, and a connecting line 50 can be formed between two adjacent openings; in other implementations, part of the metal can also be removed by laser For example, the metal layer on the sidewall of the hole 40 can be irradiated with a laser, and then an opening extending in a direction parallel to the center line of the hole 40 is formed on the metal layer, and a plurality of openings are formed on the metal layer. A connecting line 50 is formed between the openings. The metal layer on the sidewall of the hole 40 is removed by mechanical processing, which is simple to operate and improves the processing speed of the multilayer circuit board.
本实施例中，通过在芯板10上设置孔洞40，孔洞40的侧壁上形成间隔的多个连接线50，每一连接线50与不同的布线层20连接；孔洞40内设置多个连接线50，可以减少孔洞40的数量，提高多层电路板的布线密度，减小多层电路板的面积。In this embodiment, by arranging holes 40 on the core board 10, a plurality of connecting lines 50 are formed on the sidewalls of the holes 40, and each connecting line 50 is connected to a different wiring layer 20; a plurality of connections are arranged in the hole 40 The line 50 can reduce the number of holes 40, increase the wiring density of the multilayer circuit board, and reduce the area of the multilayer circuit board.
本实施例中，在通过机械加工的方式去除部分孔洞40侧壁的金属层，以在孔洞40侧壁上形成间隔的多个连接线50之后还可以包括：S106：去除残留在孔洞内的金属丝。In this embodiment, after removing part of the metal layer on the sidewall of the hole 40 by mechanical processing to form a plurality of spaced connection lines 50 on the sidewall of the hole 40, the method may further include: S106: removing the metal remaining in the hole wire.
由于机械加工的方式去除孔洞40侧壁上的部分金属层后，会在孔洞40侧壁上残留金属丝(毛刺)，去除残留的金属丝，可以避免金属丝导致部分连接线50之间连接，进而影响多层电路板使用。示例性的，在通过机械加工的方式去除部分孔洞40侧壁的金属层之后，向孔洞40内滴入酸液或者碱液，以将残留的金属丝腐蚀掉；值得说明的是，合理的设置酸液和碱液的浓度，可以在保证能够将金属丝腐蚀掉的同时避免酸液或碱液破坏连接线50。After the part of the metal layer on the side wall of the hole 40 is removed by mechanical processing, there will be residual metal wires (burrs) on the side wall of the hole 40. The removal of the residual metal wires can prevent the metal wires from causing the connection between part of the connecting lines 50. This affects the use of multilayer circuit boards. Exemplarily, after removing part of the metal layer on the side wall of the hole 40 by mechanical processing, an acid or lye is dropped into the hole 40 to corrode the remaining metal wire; it is worth noting that the setting is reasonable The concentration of the acid solution and the lye solution can ensure that the metal wire can be corroded away while preventing the acid solution or the lye solution from damaging the connecting line 50.
本实施例中，如图21所示在去除残留在孔洞40内的金属丝之后还包括：S107：在孔洞内填充绝缘填充物。In this embodiment, as shown in FIG. 21, after removing the metal wire remaining in the hole 40, the method further includes: S107: filling the hole with an insulating filler.
绝缘填充物可以实现对孔洞40封堵，进而避免外界的灰尘、水汽等杂质进入到孔洞40，另外绝缘填充物还可以进一步分隔孔洞40内的各连接线50，避免分隔孔洞40后的孔壁件的线路短路或者连接线50之间互相接触。The insulating filler can block the hole 40, thereby preventing foreign dust, water vapor and other impurities from entering the hole 40. In addition, the insulating filler can further separate the connecting lines 50 in the hole 40 and avoid the hole wall behind the hole 40. The lines of the components are short-circuited or the connecting lines 50 are in contact with each other.
本实施例中，在孔洞40内填充绝缘填充物之后，还包括：压合多层电路板。通过压合的工艺以使多层电路板中的各层连接良好，提高了多层电路板的强度；示例性的在压合的过程中可以对多层电路板进行加热，以进一步提高整个多层电路板的强度。In this embodiment, after filling the insulating filler in the hole 40, the method further includes: pressing and bonding a multilayer circuit board. Through the pressing process, each layer in the multilayer circuit board is well connected, and the strength of the multilayer circuit board is improved; for example, the multilayer circuit board can be heated during the pressing process to further improve the entire multilayer circuit board. The strength of the layer circuit board.
本实施例中，绝缘填充物可以由绝缘树脂、绝缘油墨或者其他的绝缘材料构成。示例性的，绝缘填充物在填充之前可以呈液态，并且在填充的过程中在孔洞40内制造真空环境，之后在真空环境中将液态的绝缘填充物滴入到孔洞40内，真空环境可以避免滴入绝缘填充物后在孔洞40内形成气泡；在滴入绝缘填充物后可以通过加热或者冷却等方式使孔洞40内的绝缘填充物固化。In this embodiment, the insulating filler may be made of insulating resin, insulating ink or other insulating materials. Exemplarily, the insulating filler may be in a liquid state before filling, and a vacuum environment is created in the hole 40 during the filling process, and then the liquid insulating filler is dropped into the hole 40 in the vacuum environment, the vacuum environment can be avoided After the insulating filler is dropped, air bubbles are formed in the hole 40; after the insulating filler is dropped, the insulating filler in the hole 40 can be solidified by heating or cooling.
本申请实施例，通过在芯板10上设置孔洞40，孔洞40的侧壁上形成间隔的多个连接线50，每一连接线50的两端与芯板10两侧的布线层20连接；孔洞40内设置多个连接线50，可以减少孔洞40的数量，提高多层电路板的布线密度，进而减小多层电路板的面积。In the embodiment of the present application, by providing holes 40 on the core board 10, a plurality of connecting wires 50 are formed on the side walls of the holes 40, and two ends of each connecting wire 50 are connected to the wiring layers 20 on both sides of the core board 10; A plurality of connecting wires 50 are arranged in the holes 40, which can reduce the number of holes 40, increase the wiring density of the multilayer circuit board, and thereby reduce the area of the multilayer circuit board.
本申请实施例还提供了一种多层电路板加工方法，如图26所示，多层电路板加工方法包括：The embodiment of the present application also provides a method for processing a multilayer circuit board. As shown in FIG. 26, the method for processing a multilayer circuit board includes:
S201：形成中间芯板。S201: Form an intermediate core board.
如图27所示，中间芯板103可以为一个或者多个，中间芯板103由绝缘材质构成。As shown in FIG. 27, the middle core board 103 may be one or more, and the middle core board 103 is made of insulating material.
当中间芯板103为多个是，形成中间芯板103可以包括先在一个中间芯板103上形成金属层，之后通过图形化处理，以使该金属层形成具有一定图形的布线层20；之后在该布线层20上层上形成另一中间芯板103，重复上述操作，以使多个中间芯板103层叠的设置，并且相邻的两个中间芯板103之间具有布线层20。When there are multiple middle core boards 103, forming the middle core board 103 may include forming a metal layer on one middle core board 103 first, and then patterning the metal layer to form a wiring layer 20 with a certain pattern; Another intermediate core board 103 is formed on the upper layer of the wiring layer 20, and the above-mentioned operation is repeated, so that a plurality of intermediate core boards 103 are stacked, and there is a wiring layer 20 between two adjacent intermediate core boards 103.
本实施例中，在形成中间芯板103之后还包括：S202：在中间芯板上钻孔，以形成第一孔洞。In this embodiment, after the middle core board 103 is formed, the method further includes: S202: drilling a hole in the middle core board to form a first hole.
如图28所示，形成中间芯板103之后，在最外侧的中间芯板103上钻孔，以形成第一孔洞401，第一孔洞401可以贯穿一个或者多个中间芯板103。As shown in FIG. 28, after the middle core board 103 is formed, a hole is drilled on the outermost middle core board 103 to form a first hole 401, and the first hole 401 may penetrate one or more middle core boards 103.
本实施例中，在形成第一孔洞401之后还包括：S203：在中间芯板的两个外侧面以及孔洞的侧壁上形成金属层。In this embodiment, after forming the first hole 401, the method further includes: S203: forming a metal layer on the two outer sides of the middle core board and the sidewall of the hole.
如图29所示，在形成第一孔洞401之后，可以通过电镀的方式在两个最外层的中间芯板103外侧面以及孔洞40内形成金属层；当然还可以将金属层直接贴附在两个最外层的中间芯板103的外侧面上。As shown in FIG. 29, after the first hole 401 is formed, a metal layer can be formed on the outer side of the two outermost intermediate core plates 103 and the hole 40 by electroplating; of course, the metal layer can also be directly attached to The two outermost middle core plates 103 are on the outer side surface.
本实施例中，在形成金属层之后还包括：S204：对中间芯板两个外侧面上的金属层进行图形化处理，以在中间芯板的每一外侧面上均形成布线层。In this embodiment, after forming the metal layer, the method further includes: S204: patterning the metal layers on the two outer sides of the middle core board to form a wiring layer on each outer side of the middle core board.
对金属层进行图形化处理，以在两个最外层的中间芯板103的外侧面上均形成具有一定图形的布线层20；示例性的，在中间芯板103一侧的金属层上形成保护层，之后将掩膜版罩设在保护层上，掩膜版上具有与图形形状相同的孔，之后对掩膜版进行曝光，以使与掩膜版上孔正对的保护层被曝光，之后通过酸液或者碱液去除未被曝光的保护层以及未被曝光的保护层对应的金属层，由于被曝光的保护层不会与酸液和碱液反应，使得被曝光的保护层以及被曝光的保护层对应金属层被保留，进而形成具有一定图形的布线层20。The metal layer is patterned to form a wiring layer 20 with a certain pattern on the outer surfaces of the two outermost middle core boards 103; for example, it is formed on the metal layer on the side of the middle core board 103 Protective layer, then the mask is placed on the protective layer, the mask has holes with the same shape as the pattern, and then the mask is exposed to expose the protective layer directly opposite to the holes on the mask Afterwards, the unexposed protective layer and the metal layer corresponding to the unexposed protective layer are removed by acid or lye. Since the exposed protective layer will not react with acid and lye, the exposed protective layer and The exposed protective layer is retained corresponding to the metal layer, thereby forming a wiring layer 20 with a certain pattern.
本实施例中，形成布线层20之后还包括：S205：去除部分第一孔洞侧壁的金属层，以在第一孔洞的侧壁上形成间隔的多个第一连接线；且每一第一连接线连接不同的布线层。In this embodiment, after the wiring layer 20 is formed, the method further includes: S205: removing a part of the metal layer on the sidewall of the first hole to form a plurality of first connecting lines spaced apart on the sidewall of the first hole; and Connecting wires connect different wiring layers.
如图31所示，可以通过机械加工的方式去除部分第一孔洞401侧壁上的金属层以形成多个间隔的第一连接线501。在一个可实现的方式中，可以通过磨削的方式去除金属层，示例性的可以将钻头或者锣刀伸入到第一孔洞401内，进而使钻头或者锣刀沿平行于第一孔洞401中心线的方向移动，进而在金属层上形成沿平行于第一孔洞401中心线方向延伸的开口，重复上述过程，可以在金属层上形成多个开口，相邻的两个开口之间形成第一连接线501；在其他实现方式中，还可以通过激光去除部分金属层，示例性的，可以用激光照射第一孔洞401侧壁的金属层，进而在金属层上形成沿平行于第一孔洞401中心线方向延伸的开口，在金属层上形成多个开口，相邻的两个开口之间形成第一连接线50。通过机械加工的方式去除部分第一孔洞401侧壁的金属层，操作简单，提高了多层电路板加工速 率。示例性的，第一孔洞401内的各第一连接线501连接的布线层20可以相同、不完全相同或者不同，本实例对此不作限制。As shown in FIG. 31, a part of the metal layer on the sidewall of the first hole 401 can be removed by mechanical processing to form a plurality of spaced first connecting lines 501. In an achievable manner, the metal layer can be removed by grinding. Illustratively, a drill or a gong knife can be inserted into the first hole 401, so that the edge of the drill or gong knife is parallel to the center of the first hole 401 The direction of the wire is moved, and an opening extending in the direction parallel to the center line of the first hole 401 is formed on the metal layer. Repeat the above process to form a plurality of openings on the metal layer, and a first opening is formed between two adjacent openings. Connection line 501; In other implementations, a laser can also be used to remove part of the metal layer. For example, a laser can be used to irradiate the metal layer on the sidewall of the first hole 401 to form an edge parallel to the first hole 401 on the metal layer. The opening extending in the direction of the center line forms a plurality of openings on the metal layer, and a first connecting line 50 is formed between two adjacent openings. Part of the metal layer on the sidewall of the first hole 401 is removed by mechanical processing, which is simple to operate and improves the processing speed of the multilayer circuit board. Exemplarily, the wiring layer 20 connected by each first connecting line 501 in the first hole 401 may be the same, not completely the same, or different, which is not limited in this example.
本实施例中，通过在芯板10上设置第一孔洞401，第一孔洞401的侧壁上形成间隔的多个第一连接线501，每一第一连接线501与不同的布线层20连接；第一孔洞401内设置多个第一连接线501，可以减少第一孔洞401的数量，提高多层电路板的布线密度，减小多层电路板的面积。In this embodiment, by providing a first hole 401 on the core board 10, a plurality of first connecting lines 501 are formed on the sidewall of the first hole 401, and each first connecting line 501 is connected to a different wiring layer 20. The first hole 401 is provided with a plurality of first connecting lines 501, which can reduce the number of first holes 401, increase the wiring density of the multilayer circuit board, and reduce the area of the multilayer circuit board.
本实施例中，继续参照图26，在通过机械加工的方式去除部分第一孔洞401侧壁的金属层，以在第一孔洞401的侧壁上形成间隔的多个第一连接线501；且每一第一连接线501连接不同的布线层20之后还包括：S206：去除残留在第一孔洞孔内的金属丝。In this embodiment, continuing to refer to FIG. 26, part of the metal layer on the sidewall of the first hole 401 is removed by mechanical processing to form a plurality of first connecting lines 501 spaced apart on the sidewall of the first hole 401; and After each first connecting line 501 is connected to different wiring layers 20, the method further includes: S206: removing the metal wire remaining in the first hole.
由于机械加工的方式去除第一孔洞401侧壁上的部分金属层后，会在第一孔洞401侧壁上残留金属丝(毛刺)，去除残留的金属丝，可以避免金属丝导致部分第一连接线501之间连接，进而影响多层电路板使用。示例性的，在通过机械加工的方式去除部分第一孔洞401侧壁的部分金属层之后，向第一孔洞401内滴入酸液或者碱液，以将残留的金属丝腐蚀掉；值得说明的是，合理的设置酸液和碱液的浓度，可以在保证能够将金属丝腐蚀掉的同时避免酸液或碱液破坏第一连接线501。After the part of the metal layer on the side wall of the first hole 401 is removed by mechanical processing, there will be residual metal wires (burrs) on the side wall of the first hole 401. The residual metal wires are removed, which can prevent the metal wires from causing part of the first connection The connection between the lines 501 further affects the use of the multilayer circuit board. Exemplarily, after part of the metal layer on the sidewall of the first hole 401 is removed by mechanical processing, an acid or lye is dropped into the first hole 401 to corrode the remaining metal wire; it is worth noting Yes, a reasonable setting of the acid and lye concentration can prevent the acid or lye from damaging the first connecting line 501 while ensuring that the metal wire can be corroded.
本实施例中，继续参照图26，在去除残留在第一孔洞401内的金属丝之后还包括：S207：在第一孔洞内填充绝缘填充物。In this embodiment, referring to FIG. 26 continuously, after removing the metal wire remaining in the first hole 401, the method further includes: S207: filling the first hole with an insulating filler.
绝缘填充物可以实现对第一孔洞401封堵，进而避免外界的灰尘等杂质进入到第一孔洞401，另外绝缘填充物还可以进一步分隔第一孔洞401内的各第一连接线501，避免第一连接线501之间互相接触。The insulating filler can block the first hole 401, so as to prevent foreign dust and other impurities from entering the first hole 401. In addition, the insulating filler can further separate the first connecting lines 501 in the first hole 401 to avoid the first hole 401. A connecting line 501 is in contact with each other.
本申请实施例中，在第一孔洞401内填充绝缘填充物之后，还包括：对所中间芯板103进行压合。通过压合的工艺以使各中间芯板103之间连接良好，提高多层电路板的强度；示例性的在压合的过程中可以对各中间芯板103进行加热，以进一步提高整个多层电路板的强度。In the embodiment of the present application, after the insulating filler is filled in the first hole 401, the method further includes: pressing the middle core board 103. Through the pressing process, the middle core boards 103 are well connected and the strength of the multilayer circuit board is improved; for example, each middle core board 103 can be heated during the pressing process to further improve the entire multilayer circuit board. The strength of the circuit board.
本实施例中，绝缘填充物可以由绝缘树脂、绝缘油墨或者其他的绝缘材料构成。示例性的，绝缘填充物在填充之前可以呈液态，并且在填充的过程中在第一孔洞401内制造真空环境，之后在真空环境中将液态的绝缘填充物滴入到第一孔洞401内，真空环境可以避免滴入绝缘填充物后再第一孔洞401内形成气泡；在滴入绝缘填充物后可以通过加热或者冷却等方式使第一孔洞401内的绝缘填充物固化。In this embodiment, the insulating filler may be made of insulating resin, insulating ink or other insulating materials. Exemplarily, the insulating filler may be in a liquid state before filling, and a vacuum environment is created in the first hole 401 during the filling process, and then the liquid insulating filler is dropped into the first hole 401 in the vacuum environment, The vacuum environment can avoid the formation of bubbles in the first hole 401 after the insulating filler is dropped; the insulating filler in the first hole 401 can be solidified by heating or cooling after the insulating filler is dropped.
本实施例中，在第一孔洞401内填充绝缘填充物之后，还可以在最外层中间芯板103的外侧继续形成中间芯板103，以使第一孔洞401设置在多个中间芯板103中位于中部的一个或者多个中间芯板103上。In this embodiment, after the insulating filler is filled in the first hole 401, an intermediate core board 103 may be formed on the outer side of the outermost intermediate core board 103, so that the first holes 401 are provided in the plurality of intermediate core boards 103. The middle is located on one or more middle core boards 103 in the middle.
本申请实施例中，如图32所示，在通过机械加工的方式去除部分第一孔洞401侧壁的金属层，以在第一孔洞401的侧壁上形成间隔的多个第一连接线501；且每一第一连接线501连接不同的布线层20之后还包括：S208：在中间芯板的外侧面形成第一表层芯板。In the embodiment of the present application, as shown in FIG. 32, a part of the metal layer on the sidewall of the first hole 401 is removed by mechanical processing to form a plurality of first connecting lines 501 spaced apart on the sidewall of the first hole 401 And after each first connecting line 501 is connected to different wiring layers 20, the method further includes: S208: forming a first surface layer core board on the outer side of the middle core board.
如图33所示，在中间芯板103的外侧面上形成由绝缘材质构成的第一表层芯板101；第表层芯板101的材质可以与中间芯板103的材质相同。As shown in FIG. 33, a first surface layer core plate 101 made of an insulating material is formed on the outer surface of the middle core plate 103; the material of the first surface layer core plate 101 can be the same as the material of the middle core plate 103.
本实施例中，在形成第一表层芯板101之后还包括：S209：在第一表层芯板上形成第二孔洞；第二孔洞至少贯穿第一表层芯板。In this embodiment, after forming the first surface layer core plate 101, the method further includes: S209: forming a second hole on the first surface layer core plate; the second hole penetrates at least the first surface layer core plate.
如图34所示，可以通过钻头、锣刀或者激光在第一表层芯板101上形成第二孔洞402；第二孔洞402可以为盲孔，示例性的第二孔洞402可以仅贯穿第一表层芯板101，第二孔洞402可以在贯穿第一表层芯板101后向中间芯板103延伸，并且贯穿一个或者多个中间芯板103；当然第二孔洞402也可以为贯穿整个多层电路板的通孔。As shown in FIG. 34, the second hole 402 may be formed on the first surface layer core plate 101 by a drill, a gong knife or a laser; the second hole 402 may be a blind hole, and the exemplary second hole 402 may only penetrate the first surface layer. For the core board 101, the second hole 402 may extend to the middle core board 103 after passing through the first surface layer core board 101, and penetrate through one or more middle core boards 103; of course, the second hole 402 may also penetrate the entire multilayer circuit board Through holes.
本实施例中，在形成第二孔洞402之后还包括：S210：在第一表层芯板以及第二孔洞侧壁上形成金属层。In this embodiment, after forming the second hole 402, the method further includes: S210: forming a metal layer on the first surface layer core plate and the sidewall of the second hole.
如图35所示，在形成第二孔洞402之后，可以通过电镀的方式在第一表层芯板101的外侧面和第二孔洞402的侧壁上形成金属层；当然还可以将金属呈贴附在第一表层芯板101的外侧面和第二孔洞402的侧壁上。As shown in FIG. 35, after the second hole 402 is formed, a metal layer can be formed on the outer side surface of the first surface layer core board 101 and the side wall of the second hole 402 by electroplating; of course, the metal can also be attached. On the outer side surface of the first surface layer core board 101 and the side wall of the second hole 402.
本实施例中，在第一表层芯板101以及第二孔洞402侧壁上形成金属层之后还包括：S211：对第一表层芯板上的金属层进行图形化处理，以在第一表层芯板上形成布线层。In this embodiment, after forming the metal layer on the first surface layer core board 101 and the sidewalls of the second hole 402, the method further includes: S211: patterning the metal layer on the first surface layer core board to form the first surface layer core board A wiring layer is formed on the board.
如图36所示，通过图形化处理，以在第一表层芯板101的外侧面上形成布线层20；示例性的，在第一表层芯板101外侧面的金属层上形成保护层，之后将掩膜版罩设在保护层上，掩膜版上具有与图形形状相同的孔，之后对掩膜版进行曝光，以使与掩膜版上孔正对的保护层被曝光，之后通过酸液或者碱液去除未被曝光的保护层以及未被曝光的保护层对应的金属层，由于被曝光的保护层不会与酸液和碱液反应，使得被曝光的保护层以及被曝光的保护层对应金属层被保留，进而形成具有一定图形的布线层20As shown in FIG. 36, the wiring layer 20 is formed on the outer surface of the first surface layer core board 101 through patterning; exemplary, a protective layer is formed on the metal layer on the outer surface of the first surface layer core board 101, and then The mask is placed on the protective layer, and the mask has holes with the same shape as the pattern. Then the mask is exposed to expose the protective layer directly opposite to the holes on the mask. Liquid or lye removes the unexposed protective layer and the metal layer corresponding to the unexposed protective layer. Because the exposed protective layer will not react with acid and lye, the exposed protective layer and the exposed protective layer The corresponding metal layer is retained to form a wiring layer 20 with a certain pattern
S212：去除部分第二孔洞侧壁的金属层，以在第二孔洞的侧壁上形成间隔的多个第二连接线；且每一第二连接线连接不同的布线层。S212: Remove part of the metal layer on the sidewall of the second hole to form a plurality of second connection lines spaced apart on the sidewall of the second hole; and each second connection line is connected to a different wiring layer.
如图37所示，可以通过机械加工的方式去除部分第二孔洞402侧壁上的金属层以形成多个间隔的第二连接线502；在一个可实现的方式中，可以通过磨削的方式去除金属层，示例性的可以将钻头或者锣刀伸入到第二孔洞402内，进而使钻头或者锣刀沿平行于第二孔洞402中心线的方向移动，进而在金属层上形成沿平行于第二孔洞402中心线方向延伸的开口，重复上述过程，可以在金属层上形成多个开口，相邻的两个开口之间形成第二连接线502；在其他实现方式中，还可以通过激光去除部分金属层，示例性的，可以用激光照射第二孔洞402侧壁的金属层，进而在金属层上形成沿平行于第二孔洞402中心线方向延伸的开口，在金属层上形成多个开口，相邻的两个开口之间形成第二连接线502。通过机械加工的方式去除部分第二孔洞402侧壁的金属层，操作简单，提高了多层电路板加工速率。As shown in FIG. 37, a part of the metal layer on the sidewall of the second hole 402 can be removed by mechanical processing to form a plurality of spaced second connecting lines 502; in an achievable way, it can be done by grinding. To remove the metal layer, an exemplary drill bit or a gong knife can be extended into the second hole 402, and then the drill bit or a gong knife can move in a direction parallel to the center line of the second hole 402, thereby forming an edge parallel to the second hole 402 on the metal layer. The opening extending in the direction of the center line of the second hole 402, repeating the above process, a plurality of openings can be formed in the metal layer, and a second connecting line 502 is formed between two adjacent openings; in other implementations, a laser can also be used Part of the metal layer is removed. For example, a laser can be used to irradiate the metal layer on the sidewall of the second hole 402, and then an opening extending parallel to the center line of the second hole 402 is formed on the metal layer, and a plurality of openings are formed on the metal layer. An opening, a second connecting line 502 is formed between two adjacent openings. Part of the metal layer on the sidewall of the second hole 402 is removed by mechanical processing, which is simple to operate and improves the processing speed of the multilayer circuit board.
值得说明的是，同一第二孔洞402内的各第二连接线502连接的布线层20可以相同、不完全相同或者不同，本实施例对此不作限制。It is worth noting that the wiring layers 20 connected by the second connecting lines 502 in the same second hole 402 may be the same, not completely the same, or different, which is not limited in this embodiment.
本申请实施例中，在通过机械加工的方式去除部分第二孔洞402侧壁的金属层，以在第二孔洞402的侧壁上形成间隔的多个第二连接线502；且每一第二连接线502连接不同的布线层20之后还包括：S213：去除残留在第二孔洞内的金属丝。In the embodiment of the present application, part of the metal layer on the sidewall of the second hole 402 is removed by mechanical processing to form a plurality of second connecting lines 502 spaced apart on the sidewall of the second hole 402; and each second After the connecting wire 502 is connected to the different wiring layers 20, the method further includes: S213: removing the metal wire remaining in the second hole.
由于机械加工的方式去除第二孔洞402侧壁上的部分金属层后，会在第二孔洞402侧壁上残留金属丝(毛刺)，去除残留的金属丝，可以避免金属丝导致部分第二连接线502之间连接，进而影响多层电路板使用。在一些实施例中，在通过机械加工的方式去除部分第二孔洞402侧壁的部分金属层之后，向第二孔洞402内滴入酸液或者碱液，以将残留的金属丝腐蚀掉；值得说明的是，合理的设置酸液和碱液的浓度，可以在保证能够将金属丝 腐蚀掉的同时避免酸液或碱液破坏第二连接线502。After the part of the metal layer on the side wall of the second hole 402 is removed by mechanical processing, there will be residual metal wires (burrs) on the side wall of the second hole 402. The residual metal wires are removed, which can prevent the metal wires from causing part of the second connection The connection between the lines 502 affects the use of the multilayer circuit board. In some embodiments, after part of the metal layer on the sidewall of the second hole 402 is removed by mechanical processing, acid or lye is dripped into the second hole 402 to corrode the remaining metal wire; It is explained that the concentration of acid and lye is set reasonably to ensure that the metal wire can be corroded away while avoiding the acid or lye from damaging the second connecting line 502.
本申请实例中，在去除残留在第二孔洞402内的金属丝之后还包括：S214：在第二孔洞内填充绝缘填充物。In the example of the present application, after removing the metal wire remaining in the second hole 402, the method further includes: S214: filling the second hole with an insulating filler.
绝缘填充物可以实现对第二孔洞402封堵，进而避免外界的灰尘等杂质进入到第二孔洞402，另外绝缘填充物还可以进一步分隔第二孔洞402内的各第二连接线502，避免第二连接线502之间互相接触。The insulating filler can block the second hole 402, so as to prevent foreign dust and other impurities from entering the second hole 402. In addition, the insulating filler can further separate the second connecting lines 502 in the second hole 402 to avoid the second hole 402. The two connecting wires 502 are in contact with each other.
本申请实施例中，在第二孔洞402内填充绝缘填充物之后，还包括：对电路进行压合。通过压合的工艺以使第一表层芯板101和各中间芯板103之间连接良好，提高多层电路板的强度；示例性的在压合的过程中可以对第一表层芯板101和各中间芯板103进行加热，以进一步提高整个多层电路板的强度。In the embodiment of the present application, after the insulating filler is filled in the second hole 402, the method further includes: pressing the circuit. Through the pressing process, the first surface layer core board 101 and the intermediate core boards 103 are well connected, and the strength of the multilayer circuit board is improved; for example, the first surface layer core board 101 and the middle core board 103 can be connected to each other during the pressing process. Each middle core board 103 is heated to further increase the strength of the entire multilayer circuit board.
示例性的，绝缘填充物可以由绝缘树脂、绝缘油墨或者其他的绝缘材料构成。示例性的，绝缘填充物在填充之前可以呈液态，并且在填充的过程中在第二孔洞402内制造真空环境，之后在真空环境中将液态的绝缘填充物滴入到第二孔洞402内，真空环境可以避免滴入绝缘填充物后再第二孔洞402内形成气泡；在滴入绝缘填充物后可以通过加热或者冷却等方式使第二孔洞402内的绝缘填充物固化。Exemplarily, the insulating filler may be composed of insulating resin, insulating ink, or other insulating materials. Exemplarily, the insulating filler may be in a liquid state before filling, and a vacuum environment is created in the second hole 402 during the filling process, and then the liquid insulating filler is dropped into the second hole 402 in the vacuum environment, The vacuum environment can avoid the formation of bubbles in the second hole 402 after the insulating filler is dropped; the insulating filler in the second hole 402 can be solidified by heating or cooling after the insulating filler is dropped.
在一些实施例中，如图38所示，第一表层芯板101形成在中间芯板103一个外侧面上，还可以在中间芯板103的另一外侧面上形成第二表层芯板102；在第二表层芯板102上形成第二孔洞402，并且在第二表层芯板102的外侧面以及第二孔洞的侧壁上上形成金属层；之后对第二表层芯板102外侧的金属层进行图形化处理，以形成具有一定图形的布线层20；之后通过机械加工的方式去除部分第二孔洞402侧壁上的金属层，以形成多个间隔的第二连接线502，每一第二连接线502连接不同的布线层20。In some embodiments, as shown in FIG. 38, the first surface layer core board 101 is formed on one outer surface of the middle core board 103, and the second surface layer core board 102 may also be formed on the other outer surface of the middle core board 103; A second hole 402 is formed on the second surface layer core plate 102, and a metal layer is formed on the outer side surface of the second surface layer core plate 102 and the side wall of the second hole; The patterning process is performed to form a wiring layer 20 with a certain pattern; then a part of the metal layer on the sidewall of the second hole 402 is removed by mechanical processing to form a plurality of spaced second connecting lines 502, each second The connecting wires 502 connect different wiring layers 20.
设置在第二表层芯板102上的第二孔洞402可以为盲孔或者通孔，示例性的第二孔洞402可以仅贯穿第二表层芯板102，相应的第二孔洞402侧壁上的各第二连接线502的一端与第二表层芯板102外侧的布线层20连接，各第二连接线502的另一端与第二表层芯板102和靠近第二表层芯板102的中间芯板103之间的布线层20连接。当然，第二孔洞402也可以贯穿一个或者多个中间芯板103，此时各第二连接线502连接的布线层20可以相同、不完全相同或者不同，本实施例对此不作限制。The second hole 402 provided on the second surface layer core plate 102 may be a blind hole or a through hole. The exemplary second hole 402 may only penetrate the second surface layer core plate 102, and each of the corresponding second hole 402 sidewalls One end of the second connection line 502 is connected to the wiring layer 20 outside the second surface layer core board 102, and the other end of each second connection line 502 is connected to the second surface layer core board 102 and the middle core board 103 close to the second surface layer core board 102 The wiring layer 20 is connected between. Of course, the second hole 402 may also penetrate through one or more middle core boards 103. In this case, the wiring layers 20 connected by the second connecting lines 502 may be the same, not completely the same, or different, which is not limited in this embodiment.
本申请实施例，通过在多层电路板上设置第一孔洞401和第二孔洞402，并且第一孔洞401内具有多个第一连接线501，第二孔洞402内具有多个第二连接线502，每一第一连接线501和第二连接线502均连接不同的布线层20，实现了布线层20之间的连接；并且每一第一孔洞401内的第一连接线501为多个，每一第二孔洞402内的第二连接线502为多个，可以提高多层电路板的布线密度，进而减小多层电路板的面积。另外由于多层电路板的布线密度增加，还可以减少中间芯板103的数量，减小多层电路板的厚度，进而减小多层电路板的体积，也可以减小多层电路板的成本。In the embodiment of the present application, the first hole 401 and the second hole 402 are provided on the multilayer circuit board, and the first hole 401 has a plurality of first connection lines 501, and the second hole 402 has a plurality of second connection lines. 502, each of the first connecting lines 501 and the second connecting lines 502 are connected to different wiring layers 20, realizing the connection between the wiring layers 20; and there are multiple first connecting lines 501 in each first hole 401 There are multiple second connecting lines 502 in each second hole 402, which can increase the wiring density of the multilayer circuit board, thereby reducing the area of the multilayer circuit board. In addition, due to the increase in the wiring density of the multilayer circuit board, the number of intermediate core boards 103 can be reduced, the thickness of the multilayer circuit board can be reduced, and the volume of the multilayer circuit board can be reduced, and the cost of the multilayer circuit board can also be reduced. .
最后应说明的是：以上各实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述各实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The technical solutions recorded in the foregoing embodiments can still be modified, or some or all of the technical features can be equivalently replaced; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the technical solutions of the embodiments of the present invention. range.

Claims (26)

  1. 一种多层电路板，其特征在于，包括：芯板以及设置在所述芯板两外侧面的布线层，所述芯板上设置有孔洞，所述孔洞的侧壁上具有金属层，通过机械加工的方式去除部分所述金属层，以在所述孔洞的侧壁上形成多个间隔设置的连接线，每一所述连接线连接不同的所述布线层。A multilayer circuit board is characterized by comprising: a core board and wiring layers arranged on both outer sides of the core board, the core board is provided with a hole, and the side wall of the hole has a metal layer through A part of the metal layer is removed by mechanical processing to form a plurality of connecting lines arranged at intervals on the sidewall of the hole, and each of the connecting lines is connected to a different wiring layer.
  2. 根据权利要求1所述的多层电路板，其特征在于，所述芯板包括层叠设置的第一表层芯板和第二表层芯板，所述第一表层芯板和所述第二表层芯板的外侧面上均设置有所述布线层，所述第一表层芯板和所述第二表层芯板之间也设置有所述布线层；所述孔洞设置在所述第一表层芯板和所述第二表层芯板上；The multilayer circuit board according to claim 1, wherein the core board comprises a first surface layer core board and a second surface layer core board that are stacked, and the first surface layer core board and the second surface layer core board are stacked. The wiring layer is provided on the outer surface of the board, and the wiring layer is also provided between the first surface layer core board and the second surface layer core board; the holes are provided in the first surface layer core board And the second surface layer core board;
    或者，所述孔洞设置在所述第一表层芯板或所述第二表层芯板上。Alternatively, the holes are provided on the first surface layer core plate or the second surface layer core plate.
  3. 根据权利要求2所述的多层电路板，其特征在于，所述孔洞贯穿所述第一表层芯板和所述第二表层芯板，同一所述孔洞内的两个所述连接线连接的所述布线层相同或者不完全相同。The multilayer circuit board according to claim 2, wherein the hole penetrates the first surface layer core board and the second surface layer core board, and the two connecting wires in the same hole are connected The wiring layers are the same or not completely the same.
  4. 根据权利要求1-3任一项所述的多层电路板，其特征在于，所述芯板包括层叠设置的第一表层芯板、第二表层芯板以及中间芯板，所述中间芯板设置在所述第一表层芯板和所述第二表层芯板之间，所述中间芯板与所述第一表层芯板和所述第二表层芯板之间均设置有所述布线层，所述第一表层芯板和所述第二表层芯板的外侧面上设置有所述布线层；所述孔洞包括设置在所述中间芯板上第一孔洞，所述连接线包括在所述第一孔洞的侧壁上形成的多个间隔设置的第一连接线，每一所述第一连接线连接至少两个所述布线层。The multilayer circuit board according to any one of claims 1-3, wherein the core board comprises a first surface layer core board, a second surface layer core board, and an intermediate core board that are stacked and arranged, and the intermediate core board Arranged between the first surface layer core board and the second surface layer core board, and the wiring layer is arranged between the middle core board and the first surface layer core board and the second surface layer core board , The wiring layer is provided on the outer side of the first surface layer core board and the second surface layer core board; the hole includes a first hole provided on the middle core board, and the connecting wire is included in the A plurality of spaced first connecting lines are formed on the sidewall of the first hole, and each of the first connecting lines connects at least two of the wiring layers.
  5. 根据权利要求4所述的多层电路板，其特征在于，所述第一孔洞还贯穿所述第一表层芯板或所述第二表层芯板,同一所述第一孔洞内的两个所述第一连接线连接的所述布线层相同、或者不完全相同。The multilayer circuit board according to claim 4, wherein the first hole further penetrates the first surface layer core board or the second surface layer core board, and the two holes in the same first hole The wiring layers connected by the first connecting line are the same or not completely the same.
  6. 根据权利要求4或5所述的多层电路板，其特征在于，所述第一孔洞还贯穿所述第一表层芯板和所述第二表层芯板,同一所述第一孔洞内的两个所述第一连接线连接的所述布线层相同、或者不完全相同、或者不同。The multilayer circuit board according to claim 4 or 5, wherein the first hole further penetrates the first surface layer core board and the second surface layer core board, and two of the same first hole The wiring layers connected by the first connecting lines are the same, or not completely the same, or different.
  7. 根据权利要求4-6任一项所述的多层电路板，其特征在于，所述中间芯板为多个，多个所述中间芯板层叠的设置在所述第一表层芯板和所述第二表层芯板之间，相邻所述中间芯板之间均设置有所述布线层。The multilayer circuit board according to any one of claims 4-6, wherein there are multiple intermediate core boards, and a plurality of the intermediate core boards are stacked on the first surface layer core board and the The wiring layer is provided between the second surface layer core boards and between the adjacent middle core boards.
  8. 根据权利要求7所述的多层电路板，其特征在于，所述第一孔洞依次贯穿多个所述中间芯板。8. The multilayer circuit board according to claim 7, wherein the first hole sequentially penetrates a plurality of the intermediate core boards.
  9. 根据权利要求8所述的多层电路板，其特征在于，所述第一孔洞还贯穿所述第一表层芯板和所述第二表层芯板；或者，所述第一孔洞还贯穿所述第一表层芯板或所述第二表层芯板。The multilayer circuit board according to claim 8, wherein the first hole further penetrates the first surface layer core board and the second surface layer core board; or, the first hole further penetrates the The first surface layer core board or the second surface layer core board.
  10. 根据权利要求9所述的多层电路板，其特征在于，同一所述第一孔洞内的两个所述第一连接线连接的所述布线层相同、或者不完全相同、或者不同。9. The multilayer circuit board according to claim 9, wherein the wiring layers connected by the two first connecting wires in the same first hole are the same, or not completely the same, or different.
  11. 根据权利要求4-10任一项所述的多层电路板，其特征在于，所述孔洞还包括设置在所述第一表层芯板和所述第二表层芯板上的第二孔洞，或者，所述孔洞还包括设置在所述第一表层芯板或所述第二表层芯板上的第二孔洞；所述第二孔洞的侧壁上 形成有间隔设置的多个第二连接线，每一所述第二连接线连接至少两个所述布线层。The multilayer circuit board according to any one of claims 4-10, wherein the hole further comprises a second hole provided on the first surface layer core board and the second surface layer core board, or , The hole further includes a second hole arranged on the first surface layer core plate or the second surface layer core plate; a plurality of second connecting lines arranged at intervals are formed on the sidewall of the second hole, Each of the second connecting lines connects at least two of the wiring layers.
  12. 根据权利要求11所述的多层电路板，其特征在于，所述第二孔洞为盲孔。The multilayer circuit board according to claim 11, wherein the second hole is a blind hole.
  13. 根据权利要求12所述的多层电路板，其特征在于，所述第二孔洞还贯穿所述中间芯板。The multilayer circuit board according to claim 12, wherein the second hole further penetrates the middle core board.
  14. 一种电子设备，其特征在于，包括权利要求1-13任一项所述多层电路板。An electronic device, characterized by comprising the multilayer circuit board according to any one of claims 1-13.
  15. 一种多层电路板加工方法，其特征在于，包括：A method for processing a multilayer circuit board is characterized in that it comprises:
    形成芯板；Form a core board;
    在所述芯板上形成孔洞；Forming a hole in the core plate;
    在所述芯板的两个外侧面以及所述孔洞的侧壁上形成金属层；Forming a metal layer on the two outer sides of the core board and the side wall of the hole;
    对所述芯板的两个外侧面上的所述金属层进行图形化处理，以在所述芯板的每一侧面上均形成布线层；Patterning the metal layers on the two outer sides of the core board to form a wiring layer on each side of the core board;
    通过机械加工的方式去除部分所述金属层，以在所述孔洞的侧壁上形成间隔的多个连接线，且所述连接线的一端与所述芯板一侧的所述布线层连接，所述连接线的另一端与所述芯板另一侧的所述布线层连接。Part of the metal layer is removed by mechanical processing to form a plurality of connecting lines spaced apart on the sidewall of the hole, and one end of the connecting line is connected to the wiring layer on the side of the core board, The other end of the connecting wire is connected to the wiring layer on the other side of the core board.
  16. 根据权利要求15所述的多层电路板加工方法，其特征在于，所述通过机械加工的方式去除部分所述金属层包括：15. The method for processing a multilayer circuit board according to claim 15, wherein said removing part of said metal layer by means of mechanical processing comprises:
    通过钻头或者锣刀去除所述孔洞内的所述金属层，以在所述孔洞内形成间隔的多个连接线；Removing the metal layer in the hole by using a drill or a gong knife to form a plurality of connecting lines in the hole;
    或者，通过激光照射所述孔洞内的所述金属层，去除部分所述金属层，以在所述孔洞内形成间隔的多个连接线。Alternatively, a laser is used to irradiate the metal layer in the hole to remove part of the metal layer to form a plurality of connection lines in the hole at intervals.
  17. 根据权利要求15或16所述的多层电路板加工方法，其特征在于，所述通过机械加工的方式去除部分所述金属层，以在所述孔洞的侧壁上形成间隔的多个连接线，且所述连接线的一端与所述芯板一侧的所述布线层连接，所述连接线的另一端与所述芯板另一侧的所述布线层连接之后还包括：The method for processing a multilayer circuit board according to claim 15 or 16, wherein the metal layer is removed by mechanical processing to form a plurality of spaced connection lines on the sidewall of the hole , And one end of the connecting wire is connected to the wiring layer on one side of the core board, and the other end of the connecting wire is connected to the wiring layer on the other side of the core board after connecting:
    去除残留在所述孔洞内的金属丝。Remove the metal wire remaining in the hole.
  18. 根据权利要求17所述的多层电路板加工方法，其特征在于，所述去除残留在所述孔洞内的金属丝之后还包括：18. The method for processing a multilayer circuit board according to claim 17, wherein after removing the metal wire remaining in the hole, the method further comprises:
    在所述孔洞内填充绝缘填充物。An insulating filler is filled in the hole.
  19. 一种多层电路板加工方法，其特征在于，包括：A method for processing a multilayer circuit board is characterized in that it comprises:
    形成中间芯板；Form the middle core board;
    在所述中间芯板上形成第一孔洞；Forming a first hole in the middle core plate;
    在所述中间芯板的两个外侧面以及所述第一孔洞的侧壁上形成金属层；Forming a metal layer on the two outer side surfaces of the middle core board and the side wall of the first hole;
    对所述中间芯板的两个外侧面上的所述金属层进行图形化处理，以在所述中间芯板的每一外侧面上均形成布线层；Patterning the metal layers on the two outer sides of the middle core board to form a wiring layer on each outer side of the middle core board;
    通过机械加工的方式去除部分所述金属层，以在所述第一孔洞的侧壁上形成间隔的多个第一连接线，且每一所述第一连接线连接至少两个所述布线层。Part of the metal layer is removed by mechanical processing to form a plurality of first connection lines spaced apart on the sidewall of the first hole, and each of the first connection lines connects at least two of the wiring layers .
  20. 根据权利要求19所述的多层电路板加工方法，其特征在于，所述通过机械加工的方式去除部分所述金属层包括：18. The method for processing a multilayer circuit board according to claim 19, wherein said removing part of said metal layer by means of mechanical processing comprises:
    通过钻头或者锣刀去除所述第一孔洞内的所述金属层，以在所述第一孔洞内形成 间隔的多个所述第一连接线；Removing the metal layer in the first hole by a drill bit or a gong knife to form a plurality of the first connecting lines in the first hole;
    或者，通过激光照射所述第一孔洞内的所述金属层，去除部分所述金属层，以在所述第一孔洞内形成间隔的多个所述第一连接线。Alternatively, a laser is used to irradiate the metal layer in the first hole to remove part of the metal layer to form a plurality of the first connecting lines in the first hole at intervals.
  21. 根据权利要求19或20所述的多层电路板加工方法，其特征在于，所述通过机械加工的方式去除部分所述金属层，以在所述第一孔洞的侧壁上形成间隔的多个第一连接线，且每一所述第一连接线连接至少两个所述布线层之后还包括：The method for processing a multilayer circuit board according to claim 19 or 20, wherein a part of the metal layer is removed by mechanical processing to form a plurality of spaced holes on the sidewall of the first hole. The first connecting line, and each of the first connecting lines after connecting at least two of the wiring layers further includes:
    去除残留在所述第一孔洞内的金属丝。The metal wire remaining in the first hole is removed.
  22. 根据权利要求21所述的多层电路板加工方法，其特征在于，所述去除残留在所述第一孔洞内的金属丝之后还包括：22. The method for processing a multilayer circuit board according to claim 21, wherein after removing the metal wire remaining in the first hole, the method further comprises:
    在所述第一孔洞内填充绝缘填充物。An insulating filler is filled in the first hole.
  23. 根据权利要求19-22任一项所述的多层电路板加工方法，其特征在于，所述通过机械加工的方式去除部分所述金属层，以在所述第一孔洞的侧壁上形成间隔的多个第一连接线，且每一所述第一连接线连接至少两个所述布线层之后还包括：The method for processing a multilayer circuit board according to any one of claims 19-22, wherein part of the metal layer is removed by mechanical processing to form a gap on the sidewall of the first hole A plurality of first connecting lines, and each of the first connecting lines after connecting at least two wiring layers further includes:
    在所述中间芯板的外侧面形成第一表层芯板；Forming a first surface layer core plate on the outer side of the middle core plate;
    在所述第一表层芯板上形成第二孔洞；所述第二孔洞至少贯穿所述第一表层芯板；Forming a second hole in the first surface layer core plate; the second hole penetrates at least the first surface layer core plate;
    在所述第一表层芯板以及所述第二孔洞侧壁上形成金属层；Forming a metal layer on the first surface layer core plate and the sidewall of the second hole;
    对所述第一表层芯板上的金属层进行图形化处理，以在所述第一表层芯板上形成布线层；Performing patterning processing on the metal layer on the first surface layer core board to form a wiring layer on the first surface layer core board;
    通过机械加工的方式去除部分所述第二孔洞侧壁的所述金属层，以在所述第二孔洞的侧壁上形成间隔的多个第二连接线；且每一所述第二连接线连接至少两个所述布线层。A part of the metal layer on the side wall of the second hole is removed by mechanical processing to form a plurality of second connecting lines spaced apart on the side wall of the second hole; and each of the second connecting lines At least two of the wiring layers are connected.
  24. 根据权利要求23所述的多层电路板加工方法，其特征在于，所述通过机械加工的方式去除部分所述第二孔洞侧壁的所述金属层，以在所述第二孔洞的侧壁上形成间隔的多个第二连接线；且每一所述第二连接线连接至少两个所述布线层之后还包括：23. The method for processing a multilayer circuit board according to claim 23, wherein the metal layer on the sidewall of the second hole is removed by mechanical processing, so that the sidewall of the second hole is removed. A plurality of second connecting lines are formed at intervals; and after each second connecting line is connected to at least two of the wiring layers, the method further includes:
    去除残留在所述第二孔洞内的金属丝。The metal wire remaining in the second hole is removed.
  25. 根据权利要求24所述的多层电路板加工方法，其特征在于，所述去除残留在所述第二孔洞内的金属丝之后还包括：22. The method for processing a multilayer circuit board according to claim 24, wherein after removing the metal wire remaining in the second hole, the method further comprises:
    在所述第二孔洞内填充绝缘填充物。An insulating filler is filled in the second hole.
  26. 一种程序产品，其特征在于，所述程序产品包括计算机程序，所述计算机程序存储在可读存储介质中，通信装置的至少一个处理器可以从所述可读存储介质读取所述计算机程序，所述至少一个处理器执行所述计算机程序使得通信装置实施如权利要求15-18任意一项所述的方法或者如权利要求19-25任意一项所述的方法。A program product, characterized in that the program product includes a computer program, the computer program is stored in a readable storage medium, and at least one processor of a communication device can read the computer program from the readable storage medium The execution of the computer program by the at least one processor causes the communication device to implement the method according to any one of claims 15-18 or the method according to any one of claims 19-25.
PCT/CN2020/138550 2019-12-31 2020-12-23 Multi-layer circuit board, electronic device and method for machining the multi-layer circuit board WO2021136031A1 (en)

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CN1993017A (en) * 2005-12-26 2007-07-04 宏达国际电子股份有限公司 Via architecture of printed circuit board
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