WO2021135379A1 - 一种石墨烯基有机硅多孔纳米材料及制备方法 - Google Patents

一种石墨烯基有机硅多孔纳米材料及制备方法 Download PDF

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WO2021135379A1
WO2021135379A1 PCT/CN2020/114658 CN2020114658W WO2021135379A1 WO 2021135379 A1 WO2021135379 A1 WO 2021135379A1 CN 2020114658 W CN2020114658 W CN 2020114658W WO 2021135379 A1 WO2021135379 A1 WO 2021135379A1
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graphene
parts
sio
general formula
group
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蒋路谣
华永军
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苏州桐力光电股份有限公司
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Definitions

  • the invention belongs to the technical field of organic silicon materials, and relates to a graphene-based organic silicon porous nano material and a preparation method.
  • Graphene is a two-dimensional planar nano frontier material with excellent performance. It was first discovered by Konstantin Novoserov and Andrei Geim and made by microcomputer exfoliation. Two-dimensional graphene is the basic carbon material. The constituent unit can be crimped into zero-dimensional fullerenes and one-dimensional carbon nanotubes, or it can be stacked to form three-dimensional graphite. Graphene contains the following characteristics: First, the thinnest material found so far, the thickness of a single-layer graphene is only 0.335nm, which is equivalent to the diameter of carbon atoms; Second, the specific surface area is huge, and the specific surface area of graphene reaches more than 2600m 2 /g.
  • the thermal conductivity of graphene is more than 5000W/mk, which exceeds that of metal materials such as gold, silver, copper and aluminum, and can be used as an ideal thermal conductive material.
  • a compound containing a silicon-carbon bond (Si-C) and at least one organic group connected to a silicon atom is called an organosilicon compound, and a compound that connects an organic group to a silicon atom through oxygen, sulfur, and nitrogen atoms is also called an organosilicon compound.
  • polysiloxanes with silicon-oxygen bonds (-Si-O-Si-) as the main chain have the most types and are most widely used.
  • Graphene and silicone a revolutionary emerging material, and a traditional material with unique properties, are both very important in the material industry.
  • the graphene/silicone composite material itself has certain technical problems that need a long time to overcome, such as graphene self-generating and easy agglomeration, graphene Poor compatibility with organic silicon and the structure and intrinsic defects of graphene.
  • Graphene/silicone composite materials have attracted more and more researchers to join in due to their unparalleled performance advantages. It is hoped that domestic researchers can make technological breakthroughs in this field and broaden graphene/silicone composite materials. Application in different fields will enhance my country's competitiveness and influence in the field of materials.
  • the purpose of the present invention is to provide a graphene-based organic silicon porous nano material and a preparation method.
  • a graphene-based organic silicon porous nano material which is composed of component A and component B mixed in a mass ratio of 1-2:1;
  • the component A includes the following raw materials in parts by weight:
  • the component B includes the following raw materials in parts by weight:
  • methyl vinyl polysiloxane is at least one of the compounds conforming to the general formula A, the general formula B and the general formula C:
  • Me is a methyl group
  • Vi is a vinyl group
  • the kinematic viscosity of the compound conforming to the general formula A is 500-10000 centipoise
  • the mass fraction of the vinyl functional group is 0.01%-1%
  • Me is methyl
  • Vi is vinyl
  • the kinematic viscosity of the compound conforming to formula B is 5000-10000 centipoise
  • the mass fraction of vinyl functional group is 0.5%-5% ;
  • Me is a methyl group
  • Vi is a vinyl group
  • d 50-500.
  • the kinematic viscosity of the compound conforming to the general formula C is 100-100000, and the mass fraction of vinyl functional group is 0.05%-2%.
  • methyl hydrogen-containing polysiloxane is at least one of the compounds conforming to the general formula D, the general formula E and the general formula F:
  • x 1-5
  • y 1-5
  • m 1-5
  • n 1-5;
  • x 1-5
  • y 1-5
  • m 1-5
  • n 1-5;
  • R1, R2 and R3 each independently represent ⁇ -glycidoxypropyl, ⁇ -methacryloxypropyl, ⁇ -mercaptopropyl triethoxy, hydrogen group, and hydrogen-containing active functional groups.
  • the chain extender is a compound conforming to the following general formula:
  • Me is a methyl group
  • x 1-10
  • y 1-10
  • y/x 1-5
  • the kinematic viscosity is 100-10000 at 25°C.
  • the release agent is at least one of talc, fullerene, carbon nanotube, vapor-phase method white carbon black and precipitation method white carbon black.
  • the graphene monolayer graphene, at least one bilayer graphene and graphene multilayer is within 0.01-0.05g / cm 3, a tap The density is 0.05 ⁇ 0.1g/cm 3 .
  • the structuring control agent is a low molar mass hydroxyl-terminated polydimethylsiloxane, diphenylsiliconediol, dimethyldialkoxysilane, hexamethyldisilazane At least one of them.
  • the silane coupling agent is a compound conforming to the following general formula:
  • Y represents a mercapto group, a long-chain alkyl group, an epoxy group or a methyl acryloxy group
  • R represents an alkylene group
  • X represents a hydrolyzable group
  • n 0 or 1.
  • the alkylene group is a substituted or unsubstituted alkylene group having 2 to 20 carbon atoms.
  • the hydrolyzable group refers to a group that can be separated from the main skeleton of the compound by a hydrolysis reaction.
  • R represents a substituted or unsubstituted alkyl group having 1 to 4 carbon atoms, etc., preferably -OR( Namely alkoxy).
  • R include unsubstituted alkyl groups such as methyl, ethyl, propyl, isopropyl, n-butyl, and isobutyl; substituted alkyl groups such as chloromethyl.
  • an alkyl group, particularly an unsubstituted alkyl group is preferable, and a methyl group or an ethyl group is more preferable.
  • the hydroxyl group is not particularly limited, and may be a hydroxyl group generated by hydrolyzing a hydrolyzable group.
  • the silicone-based inhibitor is selected from MVC, DVS, 3-(trimethylsilyl)propynol, 1-ethynyl-1-cyclohexanol and 1-ethynylcyclohexanol At least one.
  • the blowing agent is sodium bicarbonate, ammonium bicarbonate, azodicarbonamide, N,N-dinitrosopentamethylenetetramine, diphenylsulfonyl hydrazide ether, diazo At least one of azaaminobenzene, p-toluenesulfonyl hydrazide, and azobisisobutyronitrile.
  • the structure of the methyl vinyl MQ silicone resin is as follows:
  • [Si0 4/2 ]c is the Q structure
  • M Q value It is 0.5-1, at 25°C, the kinematic viscosity is 1000-100000, and the mass fraction of vinyl functional groups is 0.1%-5%.
  • the platinum catalyst is at least one of Castel platinum catalyst and chloroplatinic acid-ketone, alkene, ester, alcohol, ether or polysiloxane complex platinum catalyst, wherein platinum metal The concentration is 100 ⁇ 10000ppm.
  • the activator is at least one of zinc oxide, magnesium oxide, alum, stearic acid, zinc acetate, urea, benzoic acid, salicylic acid, glycol, ethylenediamine and diphenylguanidinekind.
  • the technical solution provided by the present invention is: a method for preparing ink-based organosilicon porous nanomaterials, characterized in that: the preparation method of component A and the preparation method of component B are included;
  • the preparation method of the component A includes: dispersing the release agent, graphene and foaming agent in methyl vinyl polysiloxane, methyl hydrogen-containing polysiloxane, chain extender, structuring control agent, silane In the mixed system composed of coupling agent and silicone-based inhibitor, make component A;
  • the preparation method of the component B includes: dispersing the release agent, graphene and activator in a mixed system composed of methyl vinyl polysiloxane, methyl vinyl MQ silicone resin, structuring control agent and catalyst , Make component B.
  • the vacuum negative pressure during dispersion is -0.08 ⁇ -0.1Mpa
  • the rotation speed of the stirring paddle is 30 ⁇ 50r/min
  • the rotation speed of the dispersing disc is 800 ⁇ 1200r/min.
  • the graphene-based organic silicon porous nano material prepared by the invention has the advantages of light weight, viscoelasticity, and fine and uniform cross-sectional cells.
  • the graphene nano film interacts with the organic silicon material matrix, and the substrate is firmly bonded, with excellent compression resistance, impact resistance and thermal stability. It is suitable for lightweight applications such as sealing and shock absorption, microwave absorption, electromagnetic shielding, and heat dissipation protection.
  • Example 1 A graphene-based organic silicon porous nano material and its preparation method
  • a graphene-based organic silicon porous nano material composed of component A and component B in a weight ratio of 1.5:1.
  • the component A includes the following raw materials and parts by weight: methyl vinyl polysiloxane 30 Part; 12.5 parts of methyl hydrogen-containing polysiloxane; 2.55 parts of chain extender; 5 parts of release agent; 18 parts of graphene; 1 part of structure control agent; 1 part of silane coupling agent; 0.5 part of silicone-based inhibitor ; 2.6 parts of foaming agent.
  • the component B includes the following raw materials and parts by weight: 15 parts of methyl vinyl polysiloxane; 20 parts of methyl vinyl MQ silicone resin; 5 parts of release agent; 18 parts of graphene; 1.02 parts of structured control agent Parts; 0.5 parts of catalyst; 2.75 parts of activator.
  • methyl vinyl polysiloxane is at least one of the compounds conforming to the general formula A, the general formula B and the general formula C:
  • Me is a methyl group
  • Vi is a vinyl group
  • the kinematic viscosity of the compound conforming to the general formula A is 500-10000 centipoise
  • the mass fraction of the vinyl functional group is 0.01%-1%
  • Me is methyl
  • Vi is vinyl
  • the kinematic viscosity of the compound conforming to formula B is 5000-10000 centipoise
  • the mass fraction of vinyl functional group is 0.5%-5% ;
  • Me is a methyl group
  • Vi is a vinyl group
  • d 50-500.
  • the kinematic viscosity of the compound conforming to the general formula B is 100-100000
  • the mass fraction of the vinyl functional group is 0.05%-2%.
  • methyl hydrogen-containing polysiloxane is at least one of the compounds conforming to the general formula D, the general formula E and the general formula F:
  • x 1-5
  • y 1-5
  • m 1-5
  • n 1-5;
  • x 1-5
  • y 1-5
  • m 1-5
  • n 1-5;
  • R1, R2 and R3 each independently represent a ⁇ -glycidoxypropyl group, a ⁇ -methacryloxypropyl group, a ⁇ -mercaptopropyl triethoxy group, a hydrogen group, and a hydrogen-containing active functional group.
  • the chain extender is a compound conforming to the following general formula:
  • Me is a methyl group
  • x 1-10
  • y 1-10
  • y/x 1-5
  • the kinematic viscosity is 100-10000 at 25°C.
  • the release agent is at least one of talc, fullerene, carbon nanotube, vapor-phase method white carbon black and precipitation method white carbon black.
  • the graphene monolayer graphene, at least one bilayer graphene and graphene multilayer is within 0.01-0.05g / cm 3, a tap The density is 0.05 ⁇ 0.1g/cm 3 .
  • the structuring control agent is a low molar mass hydroxyl-terminated polydimethylsiloxane, diphenylsiliconediol, dimethyldialkoxysilane, hexamethyldisilazane At least one of them.
  • the silane coupling agent is a compound conforming to the following general formula:
  • Y represents a mercapto group, a long-chain alkyl group, an epoxy group or a methyl acryloxy group
  • R represents an alkylene group
  • X represents a hydrolyzable group
  • n 0 or 1.
  • the alkylene group is a substituted or unsubstituted alkylene group having 2 to 20 carbon atoms.
  • the hydrolyzable group refers to a group that can be separated from the main skeleton of the compound by a hydrolysis reaction.
  • R represents a substituted or unsubstituted alkyl group having 1 to 4 carbon atoms, etc., preferably -OR( Namely alkoxy).
  • R include unsubstituted alkyl groups such as methyl, ethyl, propyl, isopropyl, n-butyl, and isobutyl; substituted alkyl groups such as chloromethyl.
  • an alkyl group, especially an unsubstituted alkyl group is preferable, and a methyl group or an ethyl group is more preferable.
  • the hydroxyl group is not particularly limited, and may be a hydroxyl group generated by hydrolyzing a hydrolyzable group.
  • the silicone-based inhibitor is selected from MVC, DVS, 3-(trimethylsilyl)propynol, 1-ethynyl-1-cyclohexanol and 1-ethynylcyclohexanol At least one.
  • the blowing agent is sodium bicarbonate, ammonium bicarbonate, azodicarbonamide, N,N-dinitrosopentamethylenetetramine, diphenylsulfonyl hydrazide ether, diazo At least one of azaaminobenzene, p-toluenesulfonyl hydrazide, and azobisisobutyronitrile.
  • the structure of the methyl vinyl MQ silicone resin is as follows:
  • [Si0 4/2 ]c is the Q structure
  • M Q value It is 0.5-1, at 25°C, the kinematic viscosity is 1000-100000, and the mass fraction of vinyl functional groups is 0.1%-5%.
  • the platinum catalyst is at least one of a castel platinum catalyst and a chloroplatinic acid-ketone, alkene, ester, alcohol, ether or polysiloxane complex platinum catalyst, wherein the platinum metal The concentration is 100 ⁇ 10000ppm.
  • the activator is at least one of zinc oxide, magnesium oxide, alum, stearic acid, zinc acetate, urea, benzoic acid, salicylic acid, glycol, ethylenediamine and diphenylguanidinekind.
  • Preparation method including the preparation method of component A and the preparation method of component B, wherein the preparation method of component A is as follows: 5 parts of release agent, 18 parts of graphene and 2.6 parts of blowing agent are under vacuum negative pressure And under the condition of circulating water cooling, it is dispersed in 10-50 parts of methyl vinyl polysiloxane, 12.5 parts of methyl hydrogen-containing polysiloxane, 2.55 parts of chain extender, 1 part of structuring control agent, Component A is made into a mixed system of 1 part of silane coupling agent and 0.5 part of silicone-based inhibitor.
  • component B The preparation method of component B is as follows: disperse 5 parts of isolating agent, 18 parts of graphene and 2.75 parts of activator under vacuum negative pressure and circulating water cooling conditions under high-speed stirring and dispersing in methyl vinyl polysilicon.
  • Component B is made into a mixed system of 15 parts of oxane, 20 parts of methyl vinyl MQ silicone resin, 1.02 parts of structuring control agent and 0.5 parts of catalyst.
  • the vacuum negative pressure is -0.09MPa, the rotating speed of the stirring paddle is 40r/min; the rotating speed of the dispersing disc is 1000r/min.
  • Embodiment 2 A graphene-based organic silicon porous nano material and its preparation method
  • a graphene-based organic silicon porous nano material which is composed of component A and component B mixed in a mass ratio of 1:1;
  • the component A includes the following raw materials in parts by weight:
  • the component B includes the following raw materials in parts by weight:
  • methyl vinyl polysiloxane is a compound conforming to the general formula A:
  • Me is a methyl group
  • Vi is a vinyl group
  • a 2.
  • the kinematic viscosity of the compound conforming to the general formula A is 8000 centipoise
  • the mass fraction of the vinyl functional group is 0.02%.
  • R1 ⁇ -glycidoxypropyl, R2 hydrogen group R1 ⁇ -glycidoxypropyl, R2 hydrogen group.
  • the chain extender is a compound conforming to the following general formula:
  • Me is a methyl group
  • x 2
  • y 6
  • the kinematic viscosity is 5000 at 25°C.
  • the release agent is talc.
  • the graphene is a single-layer graphene; the graphene has a loose packing density of 0.01 g/cm 3 or less, and a tap density of 0.05 g/cm 3 .
  • the structuring control agent is diphenyl silicon diol.
  • the silane coupling agent is a compound conforming to the following general formula:
  • the alkylene group is a substituted or unsubstituted alkylene group having 2 to 20 carbon atoms.
  • R examples include unsubstituted alkyl groups such as methyl, ethyl, propyl, isopropyl, n-butyl, and isobutyl; substituted alkyl groups such as chloromethyl.
  • an alkyl group, especially an unsubstituted alkyl group is preferable, and a methyl group or an ethyl group is more preferable.
  • the hydroxyl group is not particularly limited, and may be a hydroxyl group generated by the hydrolysis of a hydrolyzable group.
  • the silicone-based inhibitor is 3-(trimethylsilyl)propynol.
  • the foaming agent is sodium bicarbonate.
  • the structure of the methyl vinyl MQ silicone resin is as follows:
  • [Si0 4/2 ]c is the Q structure
  • M Q value It is 0.6, at 25°C, the kinematic viscosity is 40,000, and the mass fraction of vinyl functional groups is 0.2%.
  • the platinum catalyst is castor platinum catalyst and chloroplatinic acid-ketone, wherein the concentration of platinum metal is 5000 ppm.
  • the activator is zinc oxide.
  • Method for preparing ink-based organosilicon porous nanomaterial It is characterized in that it includes the preparation method of component A and the preparation method of component B; the preparation method of component A includes: separating agent, graphene and foaming The agent is dispersed in a mixed system composed of methyl vinyl polysiloxane, methyl hydrogen-containing polysiloxane, chain extender, structuring control agent, silane coupling agent and silicone-based inhibitor to form a group Part A;
  • the preparation method of the component B includes: dispersing the release agent, graphene and activator in a mixed system composed of methyl vinyl polysiloxane, methyl vinyl MQ silicone resin, structuring control agent and catalyst , Make component B.
  • the vacuum negative pressure during dispersion is -0.08Mpa
  • the rotating speed of the stirring paddle is 30r/min
  • the rotating speed of the dispersing disc is 800r/min.
  • Embodiment 3 A graphene-based organic silicon porous nano material and its preparation method
  • a graphene-based organic silicon porous nano material which is composed of component A and component B mixed in a mass ratio of 2:1;
  • the component A includes the following raw materials in parts by weight:
  • the component B includes the following raw materials in parts by weight:
  • methyl vinyl polysiloxane is a mixture of compounds conforming to the general formula A, the general formula B and the general formula C in a mass ratio of 1:1:1:
  • Me is a methyl group
  • Vi is a vinyl group
  • a 5.
  • the kinematic viscosity of the compound conforming to the general formula A is 10000 centipoise, and the mass fraction of vinyl functional group is 1%;
  • Me is a methyl group
  • Vi is a vinyl group
  • the kinematic viscosity of the compound conforming to the general formula B is 10,000 cps
  • the mass fraction of vinyl functional group is 5%
  • Me is a methyl group
  • Vi is a vinyl group
  • d 500.
  • the kinematic viscosity of the compound conforming to the general formula B is 100,000
  • the mass fraction of the vinyl functional group is 2%.
  • methyl hydrogen-containing polysiloxane is a mixture of compounds conforming to general formula D, general formula E and general formula F in a mass ratio of 1:1:3:
  • R1 represents ⁇ -glycidoxypropyl
  • R2 represents hydrogen
  • R3 represents ⁇ -methacryloxypropyl
  • the chain extender is a compound conforming to the following general formula:
  • Me is a methyl group
  • the kinematic viscosity is 5000 at 25°C.
  • the release agent is a mixture of talc gas phase method white carbon black in a mass ratio of 1:1.
  • the graphene is a mixture of single-layer graphene and double-layer graphene in a mass ratio of 1:1; the graphene loose packing density is within 0.03 g/cm 3 and the tap density is 0.08g/cm 3 .
  • the structuring control agent is a mixture of low molar mass hydroxyl-terminated polydimethylsiloxane and diphenyl silicon glycol in a mass ratio of 1:1.
  • the hydrolyzable group refers to a group that can be separated from the main skeleton of the compound by a hydrolysis reaction.
  • R represents a substituted or unsubstituted alkyl group having 1 to 4 carbon atoms, etc., preferably -OR( Namely alkoxy).
  • R include unsubstituted alkyl groups such as methyl, ethyl, propyl, isopropyl, n-butyl, and isobutyl; substituted alkyl groups such as chloromethyl.
  • an alkyl group, especially an unsubstituted alkyl group is preferable, and a methyl group or an ethyl group is more preferable.
  • the hydroxyl group is not particularly limited, and may be a hydroxyl group generated by hydrolyzing a hydrolyzable group. This embodiment is specifically propyl.
  • the silicone-based inhibitor is DVS.
  • the blowing agent is azobisisobutyronitrile.
  • the structure of the methyl vinyl MQ silicone resin is as follows:
  • [Si0 4/2 ]c is the Q structure
  • M Q value It is 1, at 25°C, the kinematic viscosity is 1,000 to 100,000, and the mass fraction of vinyl functional groups is 5%.
  • the platinum catalyst is a mixture of Castel platinum catalyst and chloroplatinic acid-ketone in a mass ratio of 1:1, wherein the concentration of platinum metal is 10000 ppm.
  • the activator is alum.
  • Method for preparing ink-based organosilicon porous nanomaterial It is characterized in that it includes the preparation method of component A and the preparation method of component B; the preparation method of component A includes: separating agent, graphene and foaming The agent is dispersed in a mixed system composed of methyl vinyl polysiloxane, methyl hydrogen-containing polysiloxane, chain extender, structuring control agent, silane coupling agent and silicone-based inhibitor to form a group Part A;
  • the preparation method of the component B includes: dispersing the release agent, graphene and activator in a mixed system composed of methyl vinyl polysiloxane, methyl vinyl MQ silicone resin, structuring control agent and catalyst , Make component B.
  • the vacuum negative pressure during dispersion is -0.1Mpa
  • the rotation speed of the stirring paddle is 50r/min
  • the rotation speed of the dispersing disc is 1200r/min.
  • Embodiment 4 A graphene-based organic silicon porous nano material and preparation method
  • methyl vinyl polysiloxane is a compound conforming to the general formula B:
  • Me is a methyl group
  • Vi is a vinyl group
  • b/c 5.
  • the kinematic viscosity of the compound conforming to the general formula B is 5000-10000 centipoise
  • the mass fraction of vinyl functional group is 0.5%-5%.
  • R1, R2 and R3 represent hydrogen.
  • the chain extender is a compound conforming to the following general formula:
  • Me is a methyl group
  • the release agent is a mixture of talc and precipitation white carbon black in a mass ratio of 1:1.
  • the graphene is at least one of multilayer graphene; the graphene has a loose packing density of 0.01-0.05 g/cm 3 and a tap density of 0.05 to 0.1 g/cm 3 .
  • the structuring control agent is diphenyl silicon diol with low molar mass.
  • the silane coupling agent is a compound conforming to the following general formula:
  • Y represents a mercapto group
  • R represents a butylene group
  • X represents a propyl group
  • n 1.
  • the alkylene group is a substituted or unsubstituted alkylene group having 2 to 20 carbon atoms.
  • the hydrolyzable group refers to a group that can be released from the main skeleton of the compound by a hydrolysis reaction.
  • R examples include unsubstituted alkyl groups such as methyl, ethyl, propyl, isopropyl, n-butyl, and isobutyl; substituted alkyl groups such as chloromethyl.
  • an alkyl group, especially an unsubstituted alkyl group is preferable, and a methyl group or an ethyl group is more preferable.
  • the hydroxyl group is not particularly limited, and may be a hydroxyl group generated by hydrolyzing a hydrolyzable group.
  • the silicone-based inhibitor is a mixture of 1-ethynyl-1-cyclohexanol and 1-ethynylcyclohexanol in a mass ratio of 1:1.
  • the blowing agent is a mixture of diphenylsulfonyl hydrazide ether and diazoaminobenzene in a mass ratio of 1:1.
  • the structure of the methyl vinyl MQ silicone resin is as follows:
  • [Si0 4/2 ]c is the Q structure
  • M Q value It is 0.7, at 25°C, the kinematic viscosity is 4000, and the mass fraction of vinyl functional groups is 0.8%.
  • the platinum catalyst is a Castel platinum catalyst, wherein the concentration of platinum metal is 80,000 ppm.
  • the activator is a mixture of zinc oxide and magnesium oxide in a mass ratio of 1:1.
  • Embodiment 5 A graphene-based organic silicon porous nano material and preparation method
  • methyl vinyl polysiloxane is a compound conforming to the general formula C:
  • Me is a methyl group
  • Vi is a vinyl group
  • d 100.
  • the kinematic viscosity of the compound conforming to the general formula C is 65000, and the mass fraction of vinyl functional groups is 1.5%.
  • R1 represents ⁇ -glycidoxypropyl
  • R2 represents ⁇ -mercaptopropyl triethoxy
  • R3 represents hydrogen
  • the chain extender is a compound conforming to the following general formula:
  • Me is a methyl group
  • the preferred technical solution is that the release agent is fullerene.
  • the graphene is a single-layer graphene; the graphene has a loose packing density of 0.01 g/cm 3 or less, and a tap density of 0.05 g/cm 3 .
  • the structuring control agent is dimethyldialkoxysilane.
  • the silane coupling agent is a compound conforming to the following general formula:
  • the alkylene group is a substituted or unsubstituted alkylene group having 2 to 20 carbon atoms.
  • R examples include unsubstituted alkyl groups such as methyl, ethyl, propyl, isopropyl, n-butyl, and isobutyl; substituted alkyl groups such as chloromethyl.
  • an alkyl group, especially an unsubstituted alkyl group is preferable, and a methyl group or an ethyl group is more preferable.
  • the hydroxyl group is not particularly limited, and may be a hydroxyl group generated by hydrolyzing a hydrolyzable group.
  • the silicone-based inhibitor is MVC.
  • the foaming agent is a mixture of sodium bicarbonate and ammonium bicarbonate in a mass ratio of 1:1.
  • the structure of the methyl vinyl MQ silicone resin is as follows:
  • [Si0 4/2 ]c is the Q structure
  • M Q value It is 0.5, at 25°C, the kinematic viscosity is 1000, and the mass fraction of vinyl functional groups is 0.1%%.
  • the platinum catalyst is a mixture of Castel platinum catalyst and chloroplatinic acid-ester in a mass ratio of 1:1, wherein the concentration of platinum metal is 5000 ppm.
  • the activator is stearic acid.

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Abstract

一种石墨烯基有机硅多孔纳米材料及其制备方法，由重量比1-2:1的组份A和组份B构成，组份A包括下列重量份的原料：甲基乙烯基聚硅氧烷10-50份；甲基含氢聚硅氧烷5-20份；扩链剂0.1-5份；隔离剂0.1-10份；石墨烯5-30份；结构化控制剂0.05-2份；硅烷偶联剂0.05-2份；硅酮基抑制剂0.01-1份；发泡剂0.5-5份。组份B包括下列重量份的原料：甲基乙烯基聚硅氧烷10-20份；甲基乙烯基MQ硅树脂10-30份；隔离剂0.1-10份；石墨烯5-30份；结构化控制剂0.05-2份；催化剂0.01-1份；活化剂0.5-5份。该石墨烯基有机硅多孔纳米材料质轻粘弹，截面泡孔细密均匀，石墨烯纳米薄膜和有机硅材料基体相互作用，粘结基材牢固，耐压缩、耐冲击和热稳定性能优异，适用于密封减震、微波吸收、电磁屏蔽和散热保护等轻量化应用场景。

Description

一种石墨烯基有机硅多孔纳米材料及制备方法 技术领域
本发明属于有机硅材料技术领域，涉及一种石墨烯基有机硅多孔纳米材料及制备方法。
背景技术
石墨烯是一种性能卓越的二维平面纳米前沿材料，由康斯坦丁·诺沃肖罗夫和安德烈·盖姆最早发现和微机剥离制成，二维石墨烯是碳质材料的基本组成单元，可以将它卷曲成零维的富勒烯和一维的碳纳米管，也可以将它重叠堆积成三维的石墨。石墨烯包含以下特性：一，目前发现最薄的材料，单层石墨烯厚度只有0.335nm，相当于碳原子的直径；二，比表面积庞大，石墨烯的比表面积达到2600m 2/g以上，是一种性能优异的储能材料；三，导电性强，石墨烯中电子几乎没有质量，电子运动速度大大超过金属导体和其他半导体中电子运动速度，可作为理想的导电材料；四，导热性强，石墨烯的热导率达到5000W/mk以上，超过金、银、铜和铝等金属材料，可作为理想的导热材料。含硅碳键(Si-C)且至少一个有机基与硅原子相连的化合物称为有机硅化合物，通过氧、硫和氮等原子使有机基与硅原子相连的化合物也称为有机硅化合物，其中以硅氧键(-Si-O-Si-)为主链的聚硅氧烷种类最多，应用最为广泛。石墨烯和有机硅，一个革命性的新兴材料，一个性能独特的传统材料，均在材料行业中举足轻重。
近年来，结合石墨烯和有机硅的研究以及围绕石墨烯/有机硅的新兴产品、工艺和应用炙手可热，经过科研工作者的不断探索和努力奋斗，石墨烯/有机硅复合材料层出不穷，石墨烯/有机硅复合材料的应用也越来越广泛。但是，石墨烯/有机硅在人们日常生活中应用的深度和广度还未达到该领域科研工作者的预期，主要原因有以下两点：1，石墨烯/有机硅复合材料作为前沿材料，在被开发出来之后，需要经过长时间的可靠性测试才能被大规模应用；2，石墨烯/有机硅复合材料本身还存在一定的技术难题需要较长时间去攻克，例如石墨烯自生容易团聚、石墨烯和有机硅相容性差和石墨烯的结构和本征缺陷等问题。石墨烯/有机硅复合材料因其无可比拟的性能优势，使越来越多的科研工作者投身其中，希望国内的科研工作者能够在该领域取得技术突破，拓宽石墨烯/有机硅复合材料在不同领域的应用，提升我国在材料领域的竞争力和影响力。
发明内容
本发明的目的在于提供一种石墨烯基有机硅多孔纳米材料及制备方法。
为实现上述目的及其他相关目的，本发明提供的技术方案是：一种石墨烯基有机硅多孔纳米材料，由组份A和组份B按照1-2:1的质量比例混合后构成；
所述组份A包括下列重量份的原料：
Figure PCTCN2020114658-appb-000001
所述组份B包括下列重量份的原料：
Figure PCTCN2020114658-appb-000002
优选的技术方案为：所述甲基乙烯基聚硅氧烷为符合通式A、通式B和通式C的化合物中的至少一种：
(ViMe 2SiO 1/2)(MeSiO 3/2)a                    通式A；
其中Me为甲基，Vi为乙烯基，a＝1～5，在25℃时，符合通式A的化合物运动粘度为500-10000厘泊，乙烯基官能团质量分数为0.01％-1％；
(ViMe2SiO 1/2)(Me 2SiO)b(MeSiO 3/2)c          通式B；
其中Me为甲基，Vi为乙烯基，b/c＝1～10，在25℃时，符合通式B的化合物运动粘度为5000-10000厘泊，乙烯基官能团质量分数为0.5％-5％；
ViMe 3SiO 1/2)2(Me 2SiO)d
其中Me为甲基，Vi为乙烯基，d＝50～500，在25℃时，符合通式C的化合 物运动粘度为100-100000，乙烯基官能团质量分数为0.05％-2％。
优选的技术方案为：所述甲基含氢聚硅氧烷为符合通式D、通式E和通式F的化合物中的至少一种：
[(CH 3) 3SiO 1/2]x[(CH 3)R 1SiO 2/2]y[R 2SiO 3/2]m[SiO 4/2]n          通式D；
其中，x＝1-5，y＝1-5，m＝1-5，n＝1-5；
[(CH 3) 2R 1SiO 1/2]x[(CH 3)R 2SiO 2/2]y[R 3SiO 3/2]m[SiO 4/2]n        通式E；
其中，x＝1-5，y＝1-5，m＝1-5，n＝1-5；
[(CH 3)2R 1SiO 1/2][(CH 3) 2SiO 2/2]x[R 2SiO 3/2]y                   通式F；
其中，x＝1-5，y＝1-5；
其中，R1、R2和R3分别独立地代表γ-缩水甘油醚氧丙基、γ-甲基丙烯酰氧基丙基、γ-巯丙基三乙氧基、氢基、含氢基活泼官能团。
优选的技术方案为：所述扩链剂为符合下列通式的化合物：
(HMe 2SiO 1/2)x(MeSiO 3/2)y
其中，Me为甲基，x＝1～10，y＝1～10，y/x＝1～5，在25℃时，运动粘度为100-10000。
优选的技术方案为：所述隔离剂为滑石粉、富勒烯、碳纳米管、气相法白炭黑和沉淀法白炭黑中的至少一种。
优选的技术方案为：所述石墨烯为单层石墨烯、双层石墨烯和多层石墨烯中的至少一种；所述石墨烯松装密度为0.01-0.05g/cm 3以内，振实密度为0.05～0.1g/cm 3。
优选的技术方案为：所述结构化控制剂为低摩尔质量的端羟基聚二甲基硅氧烷、二苯基硅二醇、二甲基二烷氧基硅烷、六甲基二硅氮烷中的至少一种。
优选的技术方案为：所述硅烷偶联剂为符合通式下列通式的化合物：
YR nSiX 3-n
其中Y代表巯基、长链烷基、环氧基或甲基丙乙烯酰氧基，R代表亚烷基，X代表能够水解的基团，n＝0或1。亚烷基为碳原子数2～20的取代或非取代的亚烷基。能够水解的基团是指能够通过水解反应从化合物的主骨架上脱离的基团。例如：-OR、-OCOR、-O－N＝CR2、-NR2、－NHR、卤素，这些式中，R表示取代或非取代的碳原子数1～4的烷基等，优选为-OR(即烷氧基)。R的例子包括甲基、乙基、丙基、异丙基、正丁基、异丁基等非取代烷基；氯甲基等取代烷基。这些之中，优选烷基、特别是非取代烷基，更优选为甲基或 乙基。羟基没有特别限定，可以为能够水解的基团发生水解而生成的羟基。
优选的技术方案为：所述硅酮基抑制剂为MVC、DVS、3-(三甲基硅基)丙炔醇、1‐乙炔基‐1‐环己醇和1-乙炔基环己醇中的至少一种。
优选的技术方案为：所述发泡剂为碳酸氢钠、碳酸氢铵、偶氮二甲酰胺、N,N-二亚硝基五次甲基四胺，二苯磺酰肼醚、二偶氮氨基苯、对甲苯磺酰肼和偶氮二异丁腈中的至少一种。
优选的技术方案为：所述的甲基乙烯基MQ硅树脂的结式如下:
[(CH 3) 2(CH 2＝CH)Si0 1/2]a[(CH 3) 3Si0 1/2]b[Si0 4/2]c
其中[(CH 3) 2(CH 2＝CH)Si0 1/2]a[(CH 3) 3Si0 1/2]b为M结构，[Si0 4/2]c为Q结构，M:Q值为0.5～1，在25℃时，运动粘度为1000-100000，乙烯基官能团质量分数为0.1％-5％。
优选的技术方案为：所述铂金催化剂为卡斯特铂金催化剂和氯铂酸-酮、烯、酯、醇、醚或者聚硅氧烷络合物铂金催化剂中的至少一种，其中铂金属的浓度为100～10000ppm。
优选的技术方案为：所述活化剂为氧化锌、氧化镁、明矾、硬脂酸、醋酸锌、尿素、苯甲酸、水杨酸、二元醇、乙二胺和二苯胍中的至少一种。
为实现上述目的及其他相关目的，本发明提供的技术方案是：一种制备墨烯基有机硅多孔纳米材料的方法：其特征在于：包括组分A的制备方法和组分B的制备方法；所述组份A的制备方法包括：将隔离剂、石墨烯和发泡剂分散在甲基乙烯基聚硅氧烷、甲基含氢聚硅氧烷、扩链剂、结构化控制剂、硅烷偶联剂和硅酮基抑制剂所组成的混合体系中，制成组份A；
所述组份B的制备方法包括：将隔离剂、石墨烯和活化剂分散在甲基乙烯基聚硅氧烷、甲基乙烯基MQ硅树脂、结构化控制剂和催化剂所组成的混合体系中，制成组份B。
优选的技术方案为：分散时的真空负压为-0.08～-0.1Mpa，搅拌桨转速为30～50r/min；分散盘转速为800～1200r/min。
由于上述技术方案运用，本发明与现有技术相比具有的优点是：
本发明制得的石墨烯基有机硅多孔纳米材料具有质轻粘弹、截面泡孔细密均匀优点。石墨烯纳米薄膜和有机硅材料基体相互作用，粘结基材牢固，耐压缩、耐冲击和热稳定性能优异，适用于密封减震、微波吸收、电磁屏蔽和散热保护等轻量化应用场景。
具体实施方式
以下由特定的具体实施例说明本发明的实施方式，熟悉此技术的人士可由本说明书所揭露的内容轻易地了解本发明的其他优点及功效。
实施例1：一种石墨烯基有机硅多孔纳米材料及制备方法
一种石墨烯基有机硅多孔纳米材料，由重量比1.5:1的组份A和组份B构成.所述的组份A包括下列各原料和重量份：甲基乙烯基聚硅氧烷30份；甲基含氢聚硅氧烷12.5份；扩链剂2.55份；隔离剂5份；石墨烯18份；结构化控制剂1份；硅烷偶联剂1份；硅酮基抑制剂0.5份；发泡剂2.6份。
所述的组份B包括下列各原料和重量份：甲基乙烯基聚硅氧烷15份；甲基乙烯基MQ硅树脂20份；隔离剂5份；石墨烯18份；结构化控制剂1.02份；催化剂0.5份；活化剂2.75份。
优选的技术方案为：所述甲基乙烯基聚硅氧烷为符合通式A、通式B和通式C的化合物中的至少一种：
(ViMe 2SiO 1/2)(MeSiO 3/2)a                     通式A；
其中Me为甲基，Vi为乙烯基，a＝1～5，在25℃时，符合通式A的化合物运动粘度为500-10000厘泊，乙烯基官能团质量分数为0.01％-1％；
(ViMe2SiO 1/2)(Me 2SiO)b(MeSiO 3/2)c           通式B；
其中Me为甲基，Vi为乙烯基，b/c＝1～10，在25℃时，符合通式B的化合物运动粘度为5000-10000厘泊，乙烯基官能团质量分数为0.5％-5％；
ViMe 3SiO 1/2)2(Me 2SiO)d
其中Me为甲基，Vi为乙烯基，d＝50～500，在25℃时，符合通式B的化合物运动粘度为100-100000，乙烯基官能团质量分数为0.05％-2％。
优选的技术方案为：所述甲基含氢聚硅氧烷为符合通式D、通式E和通式F的化合物中的至少一种：
[(CH 3) 3SiO 1/2]x[(CH 3)R 1SiO 2/2]y[R 2SiO 3/2]m[SiO 4/2]n          通式D；
其中，x＝1-5，y＝1-5，m＝1-5，n＝1-5；
[(CH 3) 2R 1SiO 1/2]x[(CH 3)R 2SiO 2/2]y[R 3SiO 3/2]m[SiO 4/2]n        通式E；
其中，x＝1-5，y＝1-5，m＝1-5，n＝1-5；
[(CH 3)2R 1SiO 1/2][(CH 3) 2SiO 2/2]x[R 2SiO 3/2]y                   通式F；
其中，x＝1-5，y＝1-5；
其中，R1、R2和R3分别独立地代表γ-缩水甘油醚氧丙基、γ-甲基丙烯酰 氧基丙基、γ-巯丙基三乙氧基、氢基、含氢基活泼官能团。
优选的技术方案为：所述扩链剂为符合下列通式的化合物：
(HMe 2SiO 1/2)x(MeSiO 3/2)y
其中，Me为甲基，x＝1～10，y＝1～10，y/x＝1～5，在25℃时，运动粘度为100-10000。
优选的技术方案为：所述隔离剂为滑石粉、富勒烯、碳纳米管、气相法白炭黑和沉淀法白炭黑中的至少一种。
优选的技术方案为：所述石墨烯为单层石墨烯、双层石墨烯和多层石墨烯中的至少一种；所述石墨烯松装密度为0.01-0.05g/cm 3以内，振实密度为0.05～0.1g/cm 3。
优选的技术方案为：所述结构化控制剂为低摩尔质量的端羟基聚二甲基硅氧烷、二苯基硅二醇、二甲基二烷氧基硅烷、六甲基二硅氮烷中的至少一种。
优选的技术方案为：所述硅烷偶联剂为符合通式下列通式的化合物：
YR nSiX 3-n
其中Y代表巯基、长链烷基、环氧基或甲基丙乙烯酰氧基，R代表亚烷基，X代表能够水解的基团，n＝0或1。亚烷基为碳原子数2～20的取代或非取代的亚烷基。能够水解的基团是指能够通过水解反应从化合物的主骨架上脱离的基团。例如：-OR、-OCOR、-O－N＝CR2、-NR2、－NHR、卤素，这些式中，R表示取代或非取代的碳原子数1～4的烷基等，优选为-OR(即烷氧基)。R的例子包括甲基、乙基、丙基、异丙基、正丁基、异丁基等非取代烷基；氯甲基等取代烷基。这些之中，优选烷基、特别是非取代烷基，更优选为甲基或乙基。羟基没有特别限定，可以为能够水解的基团发生水解而生成的羟基。
优选的技术方案为：所述硅酮基抑制剂为MVC、DVS、3-(三甲基硅基)丙炔醇、1‐乙炔基‐1‐环己醇和1-乙炔基环己醇中的至少一种。
优选的技术方案为：所述发泡剂为碳酸氢钠、碳酸氢铵、偶氮二甲酰胺、N,N-二亚硝基五次甲基四胺，二苯磺酰肼醚、二偶氮氨基苯、对甲苯磺酰肼和偶氮二异丁腈中的至少一种。
优选的技术方案为：所述的甲基乙烯基MQ硅树脂的结式如下:
[(CH 3) 2(CH 2＝CH)Si0 1/2]a[(CH 3) 3Si0 1/2]b[Si0 4/2]c
其中[(CH 3) 2(CH 2＝CH)Si0 1/2]a[(CH 3) 3Si0 1/2]b为M结构，[Si0 4/2]c为Q结构，M:Q值为0.5～1，在25℃时，运动粘度为1000-100000，乙烯基官能团质量分数 为0.1％-5％。
优选的技术方案为：所述铂金催化剂为卡斯特铂金催化剂和氯铂酸-酮、烯、酯、醇、醚或者聚硅氧烷络合物铂金催化剂中的至少一种，其中铂金属的浓度为100～10000ppm。
优选的技术方案为：所述活化剂为氧化锌、氧化镁、明矾、硬脂酸、醋酸锌、尿素、苯甲酸、水杨酸、二元醇、乙二胺和二苯胍中的至少一种。
制备方法：包括组分A的制备方法和组分B的制备方法,其中组份A的制备方法如下：将隔离剂5份、石墨烯18份和发泡剂2.6份在真空负压的条件下和在循环水冷却条件下分次高速搅拌分散在甲基乙烯基聚硅氧烷10-50份、甲基含氢聚硅氧烷12.5份、扩链剂2.55份、结构化控制剂1份、硅烷偶联剂1份、硅酮基抑制剂0.5份混合体系中，制成组份A。
其中组份B的制备方法如下：将隔离剂5份、石墨烯18份和活化剂2.75份在真空负压的条件下和在循环水冷却条件下分次高速搅拌分散在甲基乙烯基聚硅氧烷15份、甲基乙烯基MQ硅树脂20份、结构化控制剂1.02份和催化剂0.5份混合体系中，制成组份B。
所述的真空负压为-0.09MPa,搅拌桨转速为40r/min；分散盘转速为1000r/min。
实施例2：一种石墨烯基有机硅多孔纳米材料及制备方法
一种石墨烯基有机硅多孔纳米材料，由组份A和组份B按照1:1的质量比例混合后构成；
所述组份A包括下列重量份的原料：
Figure PCTCN2020114658-appb-000003
所述组份B包括下列重量份的原料：
Figure PCTCN2020114658-appb-000004
优选的技术方案为：所述甲基乙烯基聚硅氧烷为符合通式A的化合物：
(ViMe 2SiO 1/2)(MeSiO 3/2)a                    通式A；
其中Me为甲基，Vi为乙烯基，a＝2，在25℃时，符合通式A的化合物运动粘度为8000厘泊，乙烯基官能团质量分数为0.02％。
优选的技术方案为：所述甲基含氢聚硅氧烷为符合通式D的化合物：
[(CH 3) 3SiO 1/2]x[(CH 3)R 1SiO 2/2]y[R 2SiO 3/2]m[SiO 4/2]n         通式D；
其中，x＝2，y＝1，m＝2，n＝3；
其中，R1γ-缩水甘油醚氧丙基，R2氢基。
优选的技术方案为：所述扩链剂为符合下列通式的化合物：
(HMe 2SiO 1/2)x(MeSiO 3/2)y
其中，Me为甲基，x＝2，y＝6在25℃时，运动粘度为5000。
优选的技术方案为：所述隔离剂为滑石粉。
优选的技术方案为：所述石墨烯为单层石墨烯；所述石墨烯松装密度为0.01g/cm 3以内，振实密度为0.05g/cm 3。
优选的技术方案为：所述结构化控制剂为二苯基硅二醇。
优选的技术方案为：所述硅烷偶联剂为符合通式下列通式的化合物：
YR nSiX 3-n
其中Y代表巯基、，R代表甲基，X代表丙基，n＝1。亚烷基为碳原子数2～20的取代或非取代的亚烷基。能够水解的基团是指能够通过水解反应从化合物的主骨架上脱离的基团。例如：-OR、-OCOR、-O－N＝CR2、-NR2、－NHR、卤素，这些式中，R表示取代或非取代的碳原子数1～4的烷基等，优选为-OR(即烷氧基)。R的例子包括甲基、乙基、丙基、异丙基、正丁基、异丁基等非取代烷基；氯甲基等取代烷基。这些之中，优选烷基、特别是非取代烷基，更优选为甲基或乙基。羟基没有特别限定，可以为能够水解的基团发生水 解而生成的羟基。
优选的技术方案为：所述硅酮基抑制剂为3-(三甲基硅基)丙炔醇。
优选的技术方案为：所述发泡剂为碳酸氢钠。
优选的技术方案为：所述的甲基乙烯基MQ硅树脂的结式如下:
[(CH 3) 2(CH 2＝CH)Si0 1/2]a[(CH 3) 3Si0 1/2]b[Si0 4/2]c
其中[(CH 3) 2(CH 2＝CH)Si0 1/2]a[(CH 3) 3Si0 1/2]b为M结构，[Si0 4/2]c为Q结构，M:Q值为0.6，在25℃时，运动粘度为40000，乙烯基官能团质量分数为0.2％。
优选的技术方案为：所述铂金催化剂为卡斯特铂金催化剂和氯铂酸-酮，其中铂金属的浓度为5000ppm。
优选的技术方案为：所述活化剂为氧化锌。
制备墨烯基有机硅多孔纳米材料的方法：其特征在于：包括组分A的制备方法和组分B的制备方法；所述组份A的制备方法包括：将隔离剂、石墨烯和发泡剂分散在甲基乙烯基聚硅氧烷、甲基含氢聚硅氧烷、扩链剂、结构化控制剂、硅烷偶联剂和硅酮基抑制剂所组成的混合体系中，制成组份A；
所述组份B的制备方法包括：将隔离剂、石墨烯和活化剂分散在甲基乙烯基聚硅氧烷、甲基乙烯基MQ硅树脂、结构化控制剂和催化剂所组成的混合体系中，制成组份B。
使用时，将组份A和组份B混合即可
优选的技术方案为：分散时的真空负压为-0.08Mpa，搅拌桨转速为30r/min；分散盘转速为800r/min。
实施例3：一种石墨烯基有机硅多孔纳米材料及制备方法
一种石墨烯基有机硅多孔纳米材料，由组份A和组份B按照2:1的质量比例混合后构成；
所述组份A包括下列重量份的原料：
Figure PCTCN2020114658-appb-000005
Figure PCTCN2020114658-appb-000006
所述组份B包括下列重量份的原料：
Figure PCTCN2020114658-appb-000007
优选的技术方案为：所述甲基乙烯基聚硅氧烷为符合通式A、通式B和通式C的化合物按照1：1：1的质量比例构成的混合物：
(ViMe 2SiO 1/2)(MeSiO 3/2)a                     通式A；
其中Me为甲基，Vi为乙烯基，a＝5，在25℃时，符合通式A的化合物运动粘度为10000厘泊，乙烯基官能团质量分数为1％；
(ViMe2SiO 1/2)(Me 2SiO)b(MeSiO 3/2)c           通式B；
其中Me为甲基，Vi为乙烯基，b/c＝10，在25℃时，符合通式B的化合物运动粘度为10000厘泊，乙烯基官能团质量分数为5％；
ViMe 3SiO 1/2)2(Me 2SiO)d
其中Me为甲基，Vi为乙烯基，d＝500，在25℃时，符合通式B的化合物运动粘度为100000，乙烯基官能团质量分数为2％。
优选的技术方案为：所述甲基含氢聚硅氧烷为符合通式D、通式E和通式F的化合物按照1：1：3的质量比例构成的混合物：
[(CH 3) 3SiO 1/2]x[(CH 3)R 1SiO 2/2]y[R 2SiO 3/2]m[SiO 4/2]n          通式D；
其中，x＝5，y＝5，m＝1，n＝1；
[(CH 3) 2R 1SiO 1/2]x[(CH 3)R 2SiO 2/2]y[R 3SiO 3/2]m[SiO 4/2]n        通式E；
其中，x＝5，y＝5，m＝1，n＝1；
[(CH 3)2R 1SiO 1/2][(CH 3) 2SiO 2/2]x[R 2SiO 3/2]y                   通式F；
其中，x＝1，y＝2；
其中，R1代表γ-缩水甘油醚氧丙基、R2代表氢基、R3代表γ-甲基丙烯酰 氧基丙基。
优选的技术方案为：所述扩链剂为符合下列通式的化合物：
(HMe 2SiO 1/2)x(MeSiO 3/2)y
其中，Me为甲基，x＝5，y＝5，y/x＝1，在25℃时，运动粘度为5000。
优选的技术方案为：所述隔离剂为滑石粉气相法白炭黑按照1：1的质量比例构成的混合物。
优选的技术方案为：所述石墨烯为单层石墨烯、双层石墨烯按照1：1的质量比例构成的混合物；所述石墨烯松装密度为0.03g/cm 3以内，振实密度为0.08g/cm 3。
优选的技术方案为：所述结构化控制剂为低摩尔质量的端羟基聚二甲基硅氧烷、二苯基硅二醇按照1：1的质量比例构成的混合物。
优选的技术方案为：所述的硅烷偶联剂符合结构通式YR nSiX 3-n其中Y代表有机官能团，R代表亚烷基，X代表能够水解的基团，n＝0～3；的功能性添加剂；n＝1，Y为氨基；亚烷基为碳原子数2～20的取代或非取代的亚烷基，本实施例具体为亚甲基。能够水解的基团是指能够通过水解反应从化合物的主骨架上脱离的基团。例如：-OR、-OCOR、-O－N＝CR2、-NR2、－NHR、卤素，这些式中，R表示取代或非取代的碳原子数1～4的烷基等，优选为-OR(即烷氧基)。R的例子包括甲基、乙基、丙基、异丙基、正丁基、异丁基等非取代烷基；氯甲基等取代烷基。这些之中，优选烷基、特别是非取代烷基，更优选为甲基或乙基。羟基没有特别限定，可以为能够水解的基团发生水解而生成的羟基。本实施例具体为丙基。
优选的技术方案为：所述硅酮基抑制剂为DVS。
优选的技术方案为：所述发泡剂为偶氮二异丁腈。
优选的技术方案为：所述的甲基乙烯基MQ硅树脂的结式如下:
[(CH 3) 2(CH 2＝CH)Si0 1/2]a[(CH 3) 3Si0 1/2]b[Si0 4/2]c
其中[(CH 3) 2(CH 2＝CH)Si0 1/2]a[(CH 3) 3Si0 1/2]b为M结构，[Si0 4/2]c为Q结构，M:Q值为1，在25℃时，运动粘度为1000-100000，乙烯基官能团质量分数为5％。
优选的技术方案为：所述铂金催化剂为卡斯特铂金催化剂和氯铂酸-酮按照1：1的质量比例构成的混合物，其中铂金属的浓度为10000ppm。
优选的技术方案为：所述活化剂为明矾。
制备墨烯基有机硅多孔纳米材料的方法：其特征在于：包括组分A的制备方法和组分B的制备方法；所述组份A的制备方法包括：将隔离剂、石墨烯和发泡剂分散在甲基乙烯基聚硅氧烷、甲基含氢聚硅氧烷、扩链剂、结构化控制剂、硅烷偶联剂和硅酮基抑制剂所组成的混合体系中，制成组份A；
所述组份B的制备方法包括：将隔离剂、石墨烯和活化剂分散在甲基乙烯基聚硅氧烷、甲基乙烯基MQ硅树脂、结构化控制剂和催化剂所组成的混合体系中，制成组份B。
优选的技术方案为：分散时的真空负压为-0.1Mpa，搅拌桨转速为50r/min；分散盘转速为1200r/min。
实施例4：一种石墨烯基有机硅多孔纳米材料及制备方法
其它实施方式同实施例2，不同之处在于：
优选的技术方案为：所述甲基乙烯基聚硅氧烷为符合通式B的化合物：
(ViMe2SiO 1/2)(Me 2SiO)b(MeSiO 3/2)c          通式B；
其中Me为甲基，Vi为乙烯基，b/c＝5，在25℃时，符合通式B的化合物运动粘度为5000-10000厘泊，乙烯基官能团质量分数为0.5％-5％。
优选的技术方案为：所述甲基含氢聚硅氧烷为符合通式E的化合物中：
[(CH 3) 2R 1SiO 1/2]x[(CH 3)R 2SiO 2/2]y[R 3SiO 3/2]m[SiO 4/2]n       通式E；
其中，x＝1，y＝1，m＝2，n＝3；
其中，R1、R2和R3代表氢。
优选的技术方案为：所述扩链剂为符合下列通式的化合物：
(HMe 2SiO 1/2)x(MeSiO 3/2)y
其中，Me为甲基，x＝5，y＝10，y/x＝2，在25℃时，运动粘度为16000。
优选的技术方案为：所述隔离剂为滑石粉和沉淀法白炭黑按照1：1的质量比例构成的混合物。
优选的技术方案为：所述石墨烯为多层石墨烯中的至少一种；所述石墨烯松装密度为0.01-0.05g/cm 3以内，振实密度为0.05～0.1g/cm 3。
优选的技术方案为：所述结构化控制剂为低摩尔质量的二苯基硅二醇。
优选的技术方案为：所述硅烷偶联剂为符合通式下列通式的化合物：
YR nSiX 3-n
其中Y代表巯基，R代表亚丁基，X代表丙基，n＝1。亚烷基为碳原子数2～20的取代或非取代的亚烷基。能够水解的基团是指能够通过水解反应从化 合物的主骨架上脱离的基团。例如：-OR、-OCOR、-O－N＝CR2、-NR2、－NHR、卤素，这些式中，R表示取代或非取代的碳原子数1～4的烷基等，优选为-OR(即烷氧基)。R的例子包括甲基、乙基、丙基、异丙基、正丁基、异丁基等非取代烷基；氯甲基等取代烷基。这些之中，优选烷基、特别是非取代烷基，更优选为甲基或乙基。羟基没有特别限定，可以为能够水解的基团发生水解而生成的羟基。
优选的技术方案为：所述硅酮基抑制剂为1‐乙炔基‐1‐环己醇和1-乙炔基环己醇按照1：1的质量比例构成的混合物。
优选的技术方案为：所述发泡剂为二苯磺酰肼醚、二偶氮氨基苯按照1：1的质量比例构成的混合物。
优选的技术方案为：所述的甲基乙烯基MQ硅树脂的结式如下:
[(CH 3) 2(CH 2＝CH)Si0 1/2]a[(CH 3) 3Si0 1/2]b[Si0 4/2]c
其中[(CH 3) 2(CH 2＝CH)Si0 1/2]a[(CH 3) 3Si0 1/2]b为M结构，[Si0 4/2]c为Q结构，M:Q值为0.7，在25℃时，运动粘度为4000，乙烯基官能团质量分数为0.8％。
优选的技术方案为：所述铂金催化剂为卡斯特铂金催化剂，其中铂金属的浓度为80000ppm。
优选的技术方案为：所述活化剂为氧化锌、氧化镁按照1：1的质量比例构成的混合物。
实施例5：一种石墨烯基有机硅多孔纳米材料及制备方法
其它实施方式同实施例3，不同之处在于：
优选的技术方案为：所述甲基乙烯基聚硅氧烷为符合通式C的化合物：
ViMe 3SiO 1/2)2(Me 2SiO)d                              通式C；
其中Me为甲基，Vi为乙烯基，d＝100，在25℃时，符合通式C的化合物运动粘度为65000，乙烯基官能团质量分数为1.5％。
优选的技术方案为：所述甲基含氢聚硅氧烷为符合通式F的化合物：
[(CH 3)2R 1SiO 1/2][(CH 3) 2SiO 2/2]x[R 2SiO 3/2]y                  通式F；
其中，x＝5，y＝5；
其中，R1代表γ-缩水甘油醚氧丙基、R2代表γ-巯丙基三乙氧基和R3代表氢基。
优选的技术方案为：所述扩链剂为符合下列通式的化合物：
(HMe 2SiO 1/2)x(MeSiO 3/2)y
其中，Me为甲基，x＝2，y＝6，y/x＝3，在25℃时，运动粘度为1000。
优选的技术方案为：所述隔离剂为富勒烯。
优选的技术方案为：所述石墨烯为单层石墨烯；所述石墨烯松装密度为0.01g/cm 3以内，振实密度为0.05g/cm 3。
优选的技术方案为：所述结构化控制剂为二甲基二烷氧基硅烷。
优选的技术方案为：所述硅烷偶联剂为符合通式下列通式的化合物：
YR nSiX 3-n
其中Y代表环氧基，R代表亚戊基，X代表Cl，n＝1。亚烷基为碳原子数2～20的取代或非取代的亚烷基。能够水解的基团是指能够通过水解反应从化合物的主骨架上脱离的基团。例如：-OR、-OCOR、-O－N＝CR2、-NR2、－NHR、卤素，这些式中，R表示取代或非取代的碳原子数1～4的烷基等，优选为-OR(即烷氧基)。R的例子包括甲基、乙基、丙基、异丙基、正丁基、异丁基等非取代烷基；氯甲基等取代烷基。这些之中，优选烷基、特别是非取代烷基，更优选为甲基或乙基。羟基没有特别限定，可以为能够水解的基团发生水解而生成的羟基。
优选的技术方案为：所述硅酮基抑制剂为MVC。
优选的技术方案为：所述发泡剂为碳酸氢钠、碳酸氢铵按照1：1的质量比例构成的混合物。
优选的技术方案为：所述的甲基乙烯基MQ硅树脂的结式如下:
[(CH 3) 2(CH 2＝CH)Si0 1/2]a[(CH 3) 3Si0 1/2]b[Si0 4/2]c
其中[(CH 3) 2(CH 2＝CH)Si0 1/2]a[(CH 3) 3Si0 1/2]b为M结构，[Si0 4/2]c为Q结构，M:Q值为0.5，在25℃时，运动粘度为1000，乙烯基官能团质量分数为0.1％％。
优选的技术方案为：所述铂金催化剂为卡斯特铂金催化剂和氯铂酸-酯按照1：1的质量比例构成的混合物，其中铂金属的浓度为5000ppm。
优选的技术方案为：所述活化剂为硬脂酸。
以上所述者仅为用以解释本发明之较佳实施例，并非企图具以对本发明做任何形式上之限制，是以，凡有在相同之发明精神下所作有关本发明之任何修饰或变更，皆仍应包括在本发明意图保护之范畴。

Claims (15)

  1. 一种石墨烯基有机硅多孔纳米材料，其特征在于：由组份A和组份B按照1-2:1的质量比例混合后构成；
    所述组份A包括下列重量份的原料：
    Figure PCTCN2020114658-appb-100001
    所述组份B包括下列重量份的原料：
    Figure PCTCN2020114658-appb-100002
  2. 根据权利要求1所述的石墨烯基有机硅多孔纳米材料，其特征在于：所述甲基乙烯基聚硅氧烷为符合通式A、通式B和通式C的化合物中的至少一种：
    (ViMe 2SiO 1/2)(MeSiO 3/2)a  通式A；
    其中Me为甲基，Vi为乙烯基，a＝1～5，在25℃时，符合通式A的化合物运动粘度为500-10000厘泊，乙烯基官能团质量分数为0.01％-1％；
    (ViMe2SiO 1/2)(Me 2SiO)b(MeSiO 3/2)c  通式B；
    其中Me为甲基，Vi为乙烯基，b/c＝1～10，在25℃时，符合通式B的化合物运动粘度为5000-10000厘泊，乙烯基官能团质量分数为0.5％-5％；
    ViMe 3SiO 1/2)2(Me 2SiO)d  通式C；
    其中Me为甲基，Vi为乙烯基，d＝50～500，在25℃时，符合通式C的化合物运动粘度为100-100000，乙烯基官能团质量分数为0.05％-2％。
  3. 根据权利要求1所述的石墨烯基有机硅多孔纳米材料，其特征在于：所述甲基含氢 聚硅氧烷为符合通式D、通式E和通式F的化合物中的至少一种：
    [(CH 3) 3SiO 1/2]x[(CH 3)R 1SiO 2/2]y[R 2SiO 3/2]m[SiO 4/2]n  通式D；
    其中，x＝1-5，y＝1-5，m＝1-5，n＝1-5；
    [(CH 3) 2R 1SiO 1/2]x[(CH 3)R 2SiO 2/2]y[R 3SiO 3/2]m[SiO 4/2]n  通式E；
    其中，x＝1-5，y＝1-5，m＝1-5，n＝1-5；
    [(CH 3)2R 1SiO 1/2][(CH 3) 2SiO 2/2]x[R 2SiO 3/2]y  通式F；
    其中，x＝1-5，y＝1-5；
    其中，R1、R2和R3分别独立地代表γ-缩水甘油醚氧丙基、γ-甲基丙烯酰氧基丙基、γ-巯丙基三乙氧基、氢基、含氢基活泼官能团。
  4. 根据权利要求1所述的石墨烯基有机硅多孔纳米材料，其特征在于：所述扩链剂为符合下列通式的化合物：
    (HMe 2SiO 1/2)x(MeSiO 3/2)y
    其中，Me为甲基，x＝1～10，y＝1～10，y/x＝1～5，在25℃时，运动粘度为100-10000。
  5. 根据权利要求1所述的石墨烯基有机硅多孔纳米材料，其特征在于：所述隔离剂为滑石粉、富勒烯、碳纳米管、气相法白炭黑和沉淀法白炭黑中的至少一种。
  6. 根据权利要求1所述的石墨烯基有机硅多孔纳米材料，其特征在于：所述石墨烯为单层石墨烯、双层石墨烯和多层石墨烯中的至少一种；所述石墨烯松装密度为0.01-0.05g/cm 3以内，振实密度为0.05～0.1g/cm 3。
  7. 根据权利要求1所述的石墨烯基有机硅多孔纳米材料，其特征在于：所述结构化控制剂为低摩尔质量的端羟基聚二甲基硅氧烷、二苯基硅二醇、二甲基二烷氧基硅烷、六甲基二硅氮烷中的至少一种。
  8. 根据权利要求1所述的石墨烯基有机硅多孔纳米材料，其特征在于：所述硅烷偶联剂为符合通式下列通式的化合物：
    YR nSiX 3-n
    其中Y代表巯基、长链烷基、环氧基或甲基丙乙烯酰氧基，R代表亚烷基，X代表能够水解的基团，n＝0或1。
  9. 根据权利要求1所述的石墨烯基有机硅多孔纳米材料，其特征在于：所述硅酮基抑制剂为MVC、DVS、3-(三甲基硅基)丙炔醇、1‐乙炔基‐1‐环己醇和1-乙炔基环己醇中的至少一种。
  10. 根据权利要求1所述的石墨烯基有机硅多孔纳米材料，其特征在于：所述发泡剂为碳酸氢钠、碳酸氢铵、偶氮二甲酰胺、N,N-二亚硝基五次甲基四胺，二苯磺酰肼醚、二偶氮氨基苯、对甲苯磺酰肼和偶氮二异丁腈中的至少一种。
  11. 根据权利要求1所述的石墨烯基有机硅多孔纳米材料，其特征在于：所述甲基乙烯基MQ硅树脂的结式如下:
    [(CH 3) 2(CH 2＝CH)Si0 1/2]a[(CH 3) 3Si0 1/2]b[Si0 4/2]c
    其中[(CH 3) 2(CH 2＝CH)Si0 1/2]a[(CH 3) 3Si0 1/2]b为M结构，[Si0 4/2]c为Q结构，M:Q值为0.5～1，在25℃时，运动粘度为1000-100000，乙烯基官能团质量分数为0.1％-5％。
  12. 根据权利要求1所述的石墨烯基有机硅多孔纳米材料，其特征在于：所述铂金催化剂为卡斯特铂金催化剂和氯铂酸-酮、烯、酯、醇、醚或者聚硅氧烷络合物铂金催化剂中的至少一种，其中铂金属的浓度为100～10000ppm。
  13. 根据权利要求1所述的石墨烯基有机硅多孔纳米材料，其特征在于：所述活化剂为氧化锌、氧化镁、明矾、硬脂酸、醋酸锌、尿素、苯甲酸、水杨酸、二元醇、乙二胺和二苯胍中的至少一种。
  14. 一种制备权利要求1-13任一所述的石墨烯基有机硅多孔纳米材料的方法：其特征在于：包括组分A的制备方法和组分B的制备方法；所述组份A的制备方法包括：将隔离剂、石墨烯和发泡剂分散在甲基乙烯基聚硅氧烷、甲基含氢聚硅氧烷、扩链剂、结构化控制剂、硅烷偶联剂和硅酮基抑制剂所组成的混合体系中，制成组份A；
    所述组份B的制备方法包括：将隔离剂、石墨烯和活化剂分散在甲基乙烯基聚硅氧烷、甲基乙烯基MQ硅树脂、结构化控制剂和催化剂所组成的混合体系中，制成组份B。
  15. 根据权利要求14所述的方法，其特征在于：分散时的真空负压为-0.08～-0.1Mpa，搅拌桨转速为30～50r/min；分散盘转速为800～1200r/min。
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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105238069A (zh) * 2015-11-17 2016-01-13 江苏天辰新材料股份有限公司 一种无卤不滴落双组份加成型阻燃硅橡胶及其制备方法
CN105331112A (zh) * 2015-11-26 2016-02-17 四川大学 一种石墨烯-硅橡胶复合泡沫材料及其制备方法
CN105860537A (zh) * 2016-04-18 2016-08-17 山东船舶技术研究院 一种高阻燃有机硅海绵体材料及其制备方法
CN106084796A (zh) * 2016-06-21 2016-11-09 山东船舶技术研究院 一种高阻燃有机硅海绵体材料及其制备方法
CN106905705A (zh) * 2017-03-17 2017-06-30 深圳市维西科技有限公司 一种有机硅密封凝胶及其制备方法
JP2019065079A (ja) * 2017-09-28 2019-04-25 日東電工株式会社 仮固定シート
CN109762342A (zh) * 2019-01-03 2019-05-17 株洲时代新材料科技股份有限公司 一种双组份液体发泡硅胶材料及其制备方法
CN111138861A (zh) * 2019-12-31 2020-05-12 苏州桐力光电股份有限公司 一种石墨烯基有机硅多孔纳米材料及制备方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105238069A (zh) * 2015-11-17 2016-01-13 江苏天辰新材料股份有限公司 一种无卤不滴落双组份加成型阻燃硅橡胶及其制备方法
CN105331112A (zh) * 2015-11-26 2016-02-17 四川大学 一种石墨烯-硅橡胶复合泡沫材料及其制备方法
CN105860537A (zh) * 2016-04-18 2016-08-17 山东船舶技术研究院 一种高阻燃有机硅海绵体材料及其制备方法
CN106084796A (zh) * 2016-06-21 2016-11-09 山东船舶技术研究院 一种高阻燃有机硅海绵体材料及其制备方法
CN106905705A (zh) * 2017-03-17 2017-06-30 深圳市维西科技有限公司 一种有机硅密封凝胶及其制备方法
JP2019065079A (ja) * 2017-09-28 2019-04-25 日東電工株式会社 仮固定シート
CN109762342A (zh) * 2019-01-03 2019-05-17 株洲时代新材料科技股份有限公司 一种双组份液体发泡硅胶材料及其制备方法
CN111138861A (zh) * 2019-12-31 2020-05-12 苏州桐力光电股份有限公司 一种石墨烯基有机硅多孔纳米材料及制备方法

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