WO2021134334A1 - 一种mems麦克风 - Google Patents

一种mems麦克风 Download PDF

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Publication number
WO2021134334A1
WO2021134334A1 PCT/CN2019/130164 CN2019130164W WO2021134334A1 WO 2021134334 A1 WO2021134334 A1 WO 2021134334A1 CN 2019130164 W CN2019130164 W CN 2019130164W WO 2021134334 A1 WO2021134334 A1 WO 2021134334A1
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WIPO (PCT)
Prior art keywords
cavity
mems microphone
diaphragm
support frame
back plate
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PCT/CN2019/130164
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English (en)
French (fr)
Inventor
王琳琳
钟晓辉
张睿
孟珍奎
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瑞声声学科技(深圳)有限公司
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Priority to PCT/CN2019/130164 priority Critical patent/WO2021134334A1/zh
Publication of WO2021134334A1 publication Critical patent/WO2021134334A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Definitions

  • the utility model relates to a microphone, in particular to a MEMS microphone.
  • a MEMS microphone For a MEMS microphone, it generally includes a substrate and a capacitor system provided on the substrate.
  • the capacitor system includes a back plate and a back plate that is spaced apart from the diaphragm and forms a cavity with the diaphragm.
  • the diaphragm and the back plate are charged with opposite polarities.
  • a support frame is provided between the back plate and the diaphragm to support the back plate. Due to the existence of the support frame, the support frame divides the cavity formed between the back plate and the diaphragm into a second cavity at the edge and a first cavity at the middle.
  • oxide materials are first injected into the cavity formed between the back plate and the diaphragm, and then an etchant is injected into the cavity through the sound reinforcement hole on the back plate to make the cavity
  • the oxide inside is corroded away.
  • the etchant can only corrode the oxide material in the first cavity in the middle, and the oxide in the second cavity on the edge cannot be corroded away, causing it to remain in the microphone product, affecting The use of MEMS microphones.
  • the purpose of the present invention is to provide a MEMS microphone, which can solve the influence of the residual oxide between the back plate and the diaphragm on the operation of the microphone in the prior art.
  • the MEMS microphone includes a substrate with a back cavity and a capacitor system provided on the substrate.
  • the capacitor system includes a diaphragm and a back that is spaced from the diaphragm and forms a cavity with the diaphragm.
  • the MEMS microphone is also provided with a support frame located between the back plate and the diaphragm, one end of the support frame is connected to the back plate, the other end is connected to the diaphragm, the support frame will The cavity is divided into a first cavity located in the middle and a second cavity located at the periphery, and the support frame is provided with a communication channel that connects the first cavity and the second cavity.
  • the support frame is a hollow ring structure.
  • the support frame is provided with a through hole, and the through hole allows the first cavity to communicate with the second cavity.
  • the support frame includes a plurality of support columns, and a gap is formed between adjacent support columns, and the gap is a communication channel connecting the first cavity and the second cavity.
  • cross section of the support column is square, circular, triangular or hexagonal.
  • the support frame includes a ring-shaped support column array, the support column array includes a plurality of support columns, and a gap is formed between adjacent support columns in the support column array.
  • the support frame includes an array of n+1 support columns arranged at annular intervals, and the i+1th support column array is arranged around the i-th support column; wherein, n is a natural number greater than or equal to 1, The value range of i is [1, n].
  • the support frame is made of conductive material.
  • the support frame is made of insulating material.
  • the vibrating membrane is arranged on the base and spaced apart from the base, and the back plate is arranged above the vibrating membrane.
  • the beneficial effect of the utility model is that the utility model improves the support frame between the diaphragm and the back plate in the capacitance system of the MEMS microphone, that is, the support frame is provided with a corresponding communication channel, and the communication channel can be The two cavities divided by the support frame between the diaphragm and the back plate are connected. In this way, during the production process, the oxide in the cavity formed between the diaphragm and the back plate can be completely removed through the passage, so as to prevent the oxide from remaining in the MEMS microphone product and affecting the use of the microphone.
  • Figure 1 is a vertical cross-sectional view of a top view of a MEMS microphone provided by the utility model
  • Fig. 2 is a schematic diagram of the support frame in Fig. 1 when a through hole is provided;
  • Fig. 3 is a top view of the support frame in Fig. 1.
  • the present invention provides a MEMS microphone, which includes a substrate 1 with a back cavity 7 and a capacitor system provided on the substrate 1.
  • the capacitor system includes a diaphragm 2 and a back plate 3 that is spaced apart from the diaphragm 2 and forms a cavity with the diaphragm 2.
  • the diaphragm 2 and the back plate 3 are charged with opposite polarities to form a capacitive system.
  • the diaphragm 2 vibrates under the action of the sound wave, so that the separation distance between the diaphragm 2 and the back plate 3 changes, which in turn causes the capacitance in the capacitor system to change , Realizes the conversion of sound waves into electrical signals, and realizes the corresponding functions of MEMS microphones.
  • a support frame 5 is provided between the diaphragm 2 and the back plate 3. One end of the support frame 5 is connected to the back plate 3 and one end is connected to the diaphragm 2.
  • the support frame 5 divides the cavity formed between the back plate 3 and the diaphragm 2 into a first cavity 4 in the middle and a second cavity 6 on the periphery.
  • the present invention provides a communication channel on the support frame 5, the communication channel
  • the first cavity 4 and the second cavity 6 can be connected.
  • the support frame 5 is a hollow ring structure.
  • the support frame 5 is provided with a through hole 53, and the through hole 53 makes the first cavity 4 and the second cavity 6 communicate.
  • the support frame 5 includes a plurality of support columns 51, a gap 52 is formed between adjacent support columns 51, and the gap 52 is the communication between the first cavity 4 and the second cavity 6 aisle.
  • cross section of the support column 51 is in other shapes such as a square, a circle, a triangle, or a hexagon.
  • the support frame 5 further includes one or more arrays of support columns arranged in a ring shape.
  • each support column array includes a plurality of support columns 51, and a gap 52 is formed between adjacent support columns 51 in each support column array.
  • the support frame 5 includes a plurality of support column arrays
  • the plurality of support column arrays are arranged at an annular interval.
  • the support column arrays of adjacent circles are arranged around.
  • the support frame 5 includes n+1 support column arrays arranged at an annular interval, the (i+1)th support column array is arranged around the i-th support column array.
  • n is a natural number greater than or equal to 1, and the value range of i is [1, n].
  • the support frame 5 includes two support column arrays, which are respectively denoted as a first support column array and a second support column array.
  • the first support column array surrounds the second support column array.
  • the supporting column 51 is made of conductive material or insulating material.
  • the back plate 3 of the MEMS microphone in this embodiment further includes a first insulating layer 32, an electrode layer 33, and a second insulating layer 34 stacked in sequence.
  • the second insulating layer 34 is disposed opposite to the diaphragm 2.
  • the electrode layer 33 is provided between the first insulating layer 32 and the second insulating layer 34 to avoid the occurrence of short circuits due to contact between the diaphragm 2 and the electrode layer 33 of the back plate 3 during the vibration of the diaphragm 2.
  • the periphery of the first insulating layer 32 is stepped and connected to the substrate 1.
  • the back plate 3 is further provided with a metal layer 31 covering the periphery of the first insulating layer 32.
  • the diaphragm 2 is arranged between the back plate 3 and the substrate 1, and a cavity is formed between the diaphragm 2 and the back plate 3.
  • the diaphragm 2 is arranged on the base 1 and is spaced apart from the base 1.
  • its base 1 is a ring structure
  • the corresponding diaphragm 2 is also a ring structure.
  • FIG. 1 or FIG. 2 in this embodiment only shows a vertical cross-sectional structure diagram of the top view of the MEMS microphone.
  • the utility model is improved by the support frame 5 provided between the diaphragm 2 and the back plate 3.
  • the support frame 5 is provided with a communication channel connecting the first cavity 4 and the second cavity 6, thereby enabling the product
  • the etchant enters the second cavity 6 from the first cavity 4 to corrode the oxide in the second cavity 6 and completely remove the oxide in the second cavity 6 to avoid Oxide remains in MEMS microphone products, which affects the use of the microphone.
  • the present invention only improves the support frame 5 without removing the support frame 5, and at the same time ensures the strength of the back plate 3.
  • the improvement of the support frame 5 in the present invention will not change due to changes in the positions of the diaphragm 2 and the back plate 3.
  • the back plate 3 shown in FIG. 1 is located above the diaphragm 2.
  • the structure of the support frame 5 is also applicable.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Pressure Sensors (AREA)

Abstract

本申请提供了一种MEMS麦克风，包括具有背腔的基底以及设于基底上的电容系统，电容系统包括振膜和与所述振膜间隔设置并与所述振膜形成空腔的背板；所述MEMS麦克风还设有位于所述背板与振膜之间的支撑架，所述支撑架的一端与所述背板连接，另一端与所述振膜连接；所述支撑架将所述空腔分为位于中间的第一腔体和位于周缘的第二腔体；所述支撑架设有使所述第一腔体和第二腔体连通的连通通道。在MEMS麦克风生产过程中，可将蚀刻剂通过背板上的扩音孔进入第一腔体后，再经过连通通道进入第二腔体，实现背板与振膜之间所形成的空腔内的氧化物完全腐蚀，避免氧化物残留在麦克风的产品中而影响MEMS麦克风的使用。

Description

一种MEMS麦克风 技术领域
本实用新型涉及麦克风，尤其涉及到一种MEMS麦克风。
背景技术
对于MEMS麦克风来说，其一般包括基底以及设于基底上的电容系统，电容系统包括背板和与所述振膜间隔设置并与所述振膜形成空腔的背板。当MEMS麦克风通电工作时，振膜与背板分别带有极性相反的电荷。同时，背板与振膜之间还设有支撑架，用于支撑背板。由于支撑架的存在，支撑架使得背板与振膜之间形成的空腔划分为处于边缘的第二腔体以及处于中间的第一腔体。在MEMS麦克风生产的过程中，首先在背板与振膜之间形成的空腔内注入氧化物材料，然后再通过从背板上的扩音孔向空腔内注入蚀刻剂等，使得空腔内的氧化物腐蚀掉。但是由于支撑架的存在，蚀刻剂只能将处于中间的第一腔体的氧化物材料腐蚀掉，而处于边缘的第二腔体内的氧化物无法腐蚀掉导致其残留于麦克风的产品中，影响MEMS麦克风的使用。
发明概述
技术问题
本实用新型的目的在于提供一种MEMS麦克风，其能够解决现有技术中背板与振膜之间的氧化物残留对麦克风的工作影响。
问题的解决方案
技术解决方案
本实用新型的技术方案如下：
一种MEMS麦克风，所述MEMS麦克风包括具有背腔的基底以及设于基底上的电容系统，所述电容系统包括振膜和与所述振膜间隔设置并与所述振膜形成空腔的背板；所述MEMS麦克风还设有位于所述背板和振膜之间的支撑架，所述支撑架的一端与所述背板连接，另一端与所述振膜连接，所述支撑架将所述空腔分为位于中间的第一腔体和位于周缘的第二腔体，所述支撑架设有使所述第一 腔体和第二腔体连通的连通通道。
进一步地，所述支撑架为中空的环状结构。
进一步地，所述支撑架设有通孔，所述通孔使得所述第一腔体与第二腔体连通。
进一步地，所述支撑架包括多个支撑柱，相邻所述支撑柱之间形成间隙，所述间隙即为连通所述第一腔体和第二腔体的连通通道。
进一步地，所述支撑柱的横截面为方形、圆形、三角形或六边形。
进一步地，所述支撑架包括环形设置的支撑柱阵列，所述支撑柱阵列包括多个支撑柱，并且所述支撑柱阵列中相邻支撑柱之间形成间隙。
进一步地，所述支撑架包括环形间隔设置的n+1个支撑柱阵列，所述第i+1个支撑柱阵列环绕所述第i个支撑柱设置；其中，n为大于等于1的自然数，i的取值范围为[1，n]。
进一步地，所述支撑架由导电材料制成。
进一步地，所述支撑架由绝缘材料制成。
进一步地，所述振膜设于基底之上并与基底间隔，所述背板设于振膜上方。
发明的有益效果
有益效果
本实用新型的有益效果在于：本实用新型通过对MEMS麦克风的电容系统中振膜与背板之间的支撑架进行改进，也即是在支撑架上设置相应的连通通道，所述连通通道可使得振膜与背板之间由支撑架所划分的两个空腔连通。这样在生产过程中，通过该通路可使得振膜与背板之间形成的空腔内的氧化物完全去除，避免氧化物残留在MEMS麦克风的产品中而影响麦克风的使用。
对附图的简要说明
附图说明
图1为本实用新型提供的MEMS麦克风的俯视图的竖直截面图；
图2为图1中支撑架上设有通孔时的示意图；
图3为图1中支撑架的俯视图。
图中：1、基底；2、振膜；3、背板；4、第一腔体；5、支撑架；6、第二腔体 ；7、背腔；31、金属层；32、第一绝缘层；33、电极层；34、第二绝缘层；51、支撑柱；52、间隙；53、通孔。
发明实施例
具体实施方式
下面结合附图和实施方式对本实用新型作进一步说明。
如图1-3所示，本实用新型提供了一种MEMS麦克风，包括具有背腔7的基底1以及设于基底1上的电容系统。
所述电容系统包括振膜2和与所述振膜2间隔设置并与所述振膜2形成空腔的背板3。当MEMS麦克风通电工作时，振膜2与背板3分别带有极性相反的电荷，形成电容系统。此时，当声波从背腔7中到达振膜2，振膜2在声波的作用下振动，使得振膜2与背板3之间的间隔距离发生变化，进而使得电容系统中的电容发生变化，实现了声波转换为了电信号，实现了MEMS麦克风的相应功能。
进一步地，振膜2与背板3之间设有支撑架5。所述支撑架5的一端与背板3连接，一端与振膜2连接。所述支撑架5将背板3与振膜2之间所形成的空腔划分为处于中间的第一腔体4和位于周缘的第二腔体6。
为了保证在MEMS麦克风生产过程中，使得位于周缘的第二腔体6中的氧化物去除，避免残留于MEMS麦克风的产品中时，本实用新型通过在支撑架5设置连通通道，所述连通通道能够使得第一腔体4与第二腔体6连通。
优选地，支撑架5为中空的环状结构。
如图2所示，所述支撑架5上设有通孔53，通孔53使得第一腔体4与第二腔体6连通。
进一步地，所述支撑架5包括多个支撑柱51，相邻所述支撑柱51之间形成间隙52，所述间隙52即为连通所述第一腔体4与第二腔体6的连通通道。
进一步地，支撑柱51的横截面为方形、圆形、三角形或六边形等其他形状。
进一步地，依据多个支撑柱51的排列不同，所述支撑架5还包括一个或多个环形设置的支撑柱阵列。
其中，每个支撑柱阵列包括多个支撑柱51，并且每个支撑柱阵列中相邻支撑柱51之间形成间隙52。
优选地，当支撑架5包括多个支撑柱阵列时，多个支撑柱阵列环形间隔设置。相邻圈的支撑柱阵列环绕设置。
也即是，当所述支撑架5包括环形间隔设置的n+1个支撑柱阵列时，第i+1个支撑柱阵列环绕所述第i个支撑柱阵列设置。n为大于等于1的自然数，i的取值范围为[1，n]。
比如，如图3所示，支撑架5包括两个支撑柱阵列，分别记为第一支撑柱阵列、第二支撑柱阵列。第一支撑柱阵列环绕第二支撑柱阵列。
进一步地，支撑柱51为导电材料制成或绝缘材料制成。
优选地，如图1和2所示，本实施例中MEMS麦克风的背板3还包括依次叠设的第一绝缘层32、电极层33和第二绝缘层34。第二绝缘层34与振膜2相对设置。
其中，电极层33设于第一绝缘层32与第二绝缘层34之间，避免在振膜2振动过程中振膜2与背板3的电极层33接触导致短路的情况发生。
优选地，所述第一绝缘层32的周缘呈台阶状，并与所述基底1连接。
优选地，所述背板3还设有覆盖所述第一绝缘层32的周缘的金属层31。
本实施例中MEMS麦克风，振膜2设于背板3与基底1之间，并且振膜2与背板3之间形成空腔。振膜2设于基底1之上，并与基底1间隔设置。一般来说，MEMS麦克风来说，其基底1为环状结构，相对应的振膜2也为环形结构。本实施例中的图1或图2只是给出了MEMS麦克风俯视图的竖直截面结构示意图。
本实用新型通过在振膜2与背板3之间设置的支撑架5进行改进，在支撑架5上设置连接第一腔体4与第二腔体6的连通通道，进而可使得在产品的生产过程中，将蚀刻剂等从第一腔体4进入到第二腔体6，对第二腔体6中的氧化物进行腐蚀，将第二腔体6内的氧化物完全去除，可避免氧化物残留于MEMS麦克风的产品中，影响麦克风的使用。
另外，本实用新型只是对支撑架5进行改进，并没有将支撑架5去除，也同时保证背板3的强度。
另外，本实用新型中的支撑架5的改进不会因为振膜2与背板3的位置发生改变而变化。本实施例中的图1中所给出的背板3处于振膜2的上方。而当背板3处于振膜2的下方时，支撑架5的结构同样适用。
以上所述的仅是本实用新型的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本实用新型创造构思的前提下，还可以做出改进，但这些均属于本实用新型的保护范围。

Claims (10)

  1. 一种MEMS麦克风，所述MEMS麦克风包括具有背腔的基底以及设于基底上的电容系统，所述电容系统包括振膜和与所述振膜间隔设置并与所述振膜形成空腔的背板；其特征在于，所述MEMS麦克风还设有位于所述背板和振膜之间的支撑架，所述支撑架的一端与所述背板连接，另一端与所述振膜连接，所述支撑架将所述空腔分为位于中间的第一腔体和位于周缘的第二腔体，所述支撑架设有使所述第一腔体和第二腔体连通的连通通道。
  2. 根据权利要求1所述的一种MEMS麦克风，其特征在于，所述支撑架为中空的环状结构。
  3. 根据权利要求1所述的一种MEMS麦克风，其特征在于，所述支撑架设有通孔，所述通孔使得所述第一腔体与第二腔体连通。
  4. 根据权利要求1所述的一种MEMS麦克风，其特征在于，所述支撑架包括多个支撑柱，相邻所述支撑柱之间形成间隙，所述间隙即为连通所述第一腔体和第二腔体的连通通道。
  5. 根据权利要求4所述的一种MEMS麦克风，其特征在于，所述支撑柱的横截面为方形、圆形、三角形或六边形。
  6. 根据权利要求4所述的一种MEMS麦克风，其特征在于，所述支撑架包括环形设置的支撑柱阵列，所述支撑柱阵列包括多个支撑柱，并且所述支撑柱阵列中相邻支撑柱之间形成所述间隙。
  7. 根据权利要求6所述的一种MEMS麦克风，其特征在于，所述支撑架包括环形间隔设置的n+1个支撑柱阵列，所述第i+1个支撑柱阵列环绕所述第i个支撑柱设置；其中，n为大于等于1的自然数，i的取值范围为[1，n]。
  8. 根据权利要求1所述的一种MEMS麦克风，其特征在于，所述支撑架由导电材料制成。
  9. 根据权利要求1所述的一种MEMS麦克风，其特征在于，所述支撑架由绝缘材料制成。
  10. 根据权利要求1所述的一种MEMS麦克风，其特征在于，所述振膜设于基底之上并与基底间隔设置，所述背板设于振膜上方。
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