WO2021129837A1 - 电路板装置及电子设备 - Google Patents

电路板装置及电子设备 Download PDF

Info

Publication number
WO2021129837A1
WO2021129837A1 PCT/CN2020/139616 CN2020139616W WO2021129837A1 WO 2021129837 A1 WO2021129837 A1 WO 2021129837A1 CN 2020139616 W CN2020139616 W CN 2020139616W WO 2021129837 A1 WO2021129837 A1 WO 2021129837A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
fan blade
conductive coils
heat dissipation
conductive
Prior art date
Application number
PCT/CN2020/139616
Other languages
English (en)
French (fr)
Inventor
吴会兰
Original Assignee
维沃移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Publication of WO2021129837A1 publication Critical patent/WO2021129837A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]

Definitions

  • the present invention relates to the technical field of electronic equipment, in particular to a circuit board device and electronic equipment.
  • a plurality of stacked circuit boards can be provided in the circuit board device, and two adjacent circuit boards can be electrically connected through an adapter board.
  • an accommodating cavity may be formed between two adjacent circuit boards, and the accommodating cavity may be used for accommodating electronic components, so as to place as many electronic components as possible in the circuit board device.
  • the heat generated by the electronic components on the circuit board can easily accumulate in the accommodating cavity, causing the temperature in the accommodating cavity to rise, thereby affecting the use of the electronic device and reducing the user experience.
  • the embodiments of the present invention provide a circuit board device and an electronic device to solve the problem that the temperature in the accommodating cavity in the circuit board device of the electronic device is increased, which affects the use of the electronic device.
  • an embodiment of the present invention provides a circuit board device, which includes a first circuit board, a second circuit board, and a heat dissipation component;
  • the first circuit board and the second circuit board are electrically connected, and a receiving cavity is formed between the first circuit board and the second circuit board;
  • a heat dissipation hole is provided on the first circuit board and/or the second circuit board, and the heat dissipation hole is in communication with the accommodating cavity;
  • the heat dissipation assembly includes a magnetic fan blade and at least one set of conductive coils, and each set of the conductive coils includes two conductive coils;
  • the magnetic fan blade is arranged in the containing cavity and is arranged on the second circuit board;
  • the conductive coil is fixed on the second circuit board and is opposite to the magnetic fan blade;
  • the magnetic fan blade rotates in the electromagnetic field generated by the conductive coil.
  • an embodiment of the present invention provides an electronic device that includes the circuit board device described in the first aspect.
  • the heat dissipation assembly since the heat dissipation assembly includes a magnetic fan blade and at least one set of conductive coils, the conductive coil is fixed on the second circuit board and is opposite to the magnetic fan blade. Therefore, when the conductive coil is energized, the magnetic fan blade is Rotation in the electromagnetic field generated by the conductive coil, the rotation of the magnetic fan blade will cause the air in the containing cavity to flow.
  • the heat dissipation component is arranged in the containing cavity formed between the first circuit board and the second circuit board, and the first circuit board and/or the second circuit board are provided with heat dissipation holes, the air in the containing cavity After the flow, the heat generated by the electronic components in the receiving cavity can be discharged from the heat dissipation hole along with the air flow, so that the heat no longer collects in the receiving cavity, thereby improving the performance of the electronic device and improving the user experience.
  • FIG. 1 is a schematic diagram of a circuit board device provided by an embodiment of the present invention.
  • FIG. 2 is a schematic diagram of a layout of two sets of conductive coils according to an embodiment of the present invention
  • Fig. 3 is a energization timing diagram of the two sets of conductive coils in Fig. 2;
  • FIG. 4 is a schematic diagram of a conductive coil provided by an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of another circuit board device provided by an embodiment of the present invention.
  • FIG. 6 is a schematic diagram of another circuit board device provided by an embodiment of the present invention.
  • Fig. 7 is a schematic diagram of another circuit board device provided by an embodiment of the present invention.
  • FIG. 1 is a schematic diagram of a circuit board device provided by an embodiment of the present invention.
  • the circuit board device may include a first circuit board 10, a second circuit board 20 and a heat dissipation component 30.
  • the first circuit board 10 and the second circuit board 20 are electrically connected, and a receiving cavity is formed between the first circuit board 10 and the second circuit board 20.
  • a heat dissipation hole 11 is provided on the first circuit board 10 and/or the second circuit board 20, and the heat dissipation hole 11 communicates with the receiving cavity.
  • the heat dissipation assembly 30 includes a magnetic fan blade 31 and at least one set of conductive coils 32, and each set of conductive coils 32 includes two conductive coils 32.
  • the magnetic fan blade 31 is arranged in the accommodating cavity and is arranged on the second circuit board 20, and the conductive coil 32 is fixed on the second circuit board 20 and is opposite to the magnetic fan blade 31. When the conductive coil 32 is energized, the magnetic fan blade 31 rotates in the electromagnetic field generated by the conductive coil 32. .
  • the heat dissipation assembly 30 since the heat dissipation assembly 30 includes a magnetic fan blade 31 and at least one set of conductive coils 32, the conductive coil 32 is fixed on the second circuit board 20 and is opposite to the magnetic fan blade 31. Therefore, the conductive coil 32 When energized, the magnetic fan blade 31 rotates in the electromagnetic field generated by the conductive coil 31, and the rotation of the magnetic fan blade 31 causes the air in the accommodating cavity to flow.
  • the heat dissipation assembly 30 is disposed in the accommodating cavity formed between the first circuit board 10 and the second circuit board 20, and the first circuit board 10 and/or the second circuit board 20 are provided with heat dissipation holes 11, therefore, After the air in the accommodating cavity flows, the heat generated by the electronic component 40 in the accommodating cavity can be discharged from the heat dissipation hole 11 along with the air flow, so that the heat no longer accumulates in the accommodating cavity, thereby improving the performance of the electronic device and improving user experience.
  • both ends of the conductive coil can be connected to the power supply in the electronic device, and the power supply is connected to the controller.
  • the controller can control the power supply to supply power to the conductive coil so that the conductive coil is energized.
  • the magnetic fan blade 31 when the conductive coil 32 is energized, in order to facilitate the rotation of the magnetic fan blade 31 in the electromagnetic field generated by the conductive coil 32, as shown in FIG. 1, the magnetic fan blade 31 may include a first fan blade 311. As with the second fan blade 312, the first fan blade 311 is connected to the second fan blade 312, and the magnetic poles of the first fan blade 311 and the second fan blade 312 are opposite.
  • each group of conductive coils 32 After each group of conductive coils 32 is energized, each group of conductive coils 32 will generate two magnetic fields after being energized. At this time, since the magnetic poles of the first fan blade 311 and the second fan blade 312 are opposite, one of the two magnetic fields The magnetic field of the magnetic field may be opposite to the magnetic pole of the first fan blade 311, and the magnetic field of the other magnetic field may be opposite to the magnetic pole of the second fan blade 312. Due to the attractive force between the opposite magnetism, one magnetic field attracts the first fan blade 311, and the other magnetic field attracts the second fan blade 312.
  • the first fan blade 311 and the second fan blade 312 are attracted
  • One fan blade 311 and the second fan blade 312 will rotate.
  • the magnetic field of one of the two magnetic fields may be the same as the magnetic field of the first fan blade 311, and the magnetic field of the other magnetic field may be the same as the magnetic field of the second fan blade 312.
  • One magnetic field repels the first fan blade 311, and the other magnetic field repels the second fan blade 312.
  • the first fan blade 311 and the second fan blade 312 Will rotate.
  • the magnetic fan blade 31 is located between the two conductive coils 32 of each group of conductive coils 32.
  • the two conductive coils 32 in each group of conductive coils 32 have opposite current directions at the same time, and are powered off or energized at the same time.
  • the magnetic fan blade 31 may be located on the connection line of the two conductive coils 32.
  • the magnetic fan blade 31 is located between the two conductive coils 32 of each group of conductive coils 32 and on the connection line of the two conductive coils 32, when the two conductive coils 32 in each group of conductive coils 32 are in the same direction of current
  • the magnetic field generated by one conductive coil 32 of the two conductive coils 32 is opposite to the magnetic field generated by the other conductive coil 32.
  • the conductive coils 32 can both drive the first fan blade 311 and the second fan.
  • the leaf 312 rotates.
  • the multiple sets of conductive coils 32 may be alternately energized.
  • the alternate energization of the multiple sets of conductive coils 32 means that when the first pair of conductive coils 32 is energized, the other pairs of conductive coils 32 are not energized, and when the second pair of conductive coils 32 are energized, the other pairs of conductive coils 32 are not energized. Electricity is applied, and so on, until electricity is passed through each group of conductive coils 32 in the plurality of groups of conductive coils 32.
  • FIG. 2 is a schematic diagram of a layout of two sets of conductive coils according to an embodiment of the present invention.
  • Fig. 3 is a energization timing diagram of the two sets of conductive coils in Fig. 2.
  • the deployment positions of the first pair of conductive coils 32 are position 1 and position 3
  • the deployment positions of the second pair of conductive coils 32 are position 2 and position 4.
  • the magnetic fan blade 31 is located on the connecting line of the two sets of conductive coils 32.
  • the magnetism of the first fan blade 311 is N
  • the magnetism of the second fan blade 312 is S.
  • the two conductive coils 32 in the position 1 and the position 3 are energized at the same time, and the current directions of the two conductive coils 32 in the position 1 and the position 3 are opposite. At this time, the two conductive coils 32 in position 2 and position 4 are not energized.
  • the magnetic field of the electromagnetic field generated by the conductive coil 32 in position 3 is S.
  • the conductive coil 32 in position 1 and the conductive coil 32 in position 3 can drive the second One fan blade 311 and the second fan blade 312 rotate.
  • the conductive coil 32 in position 2 and the conductive coil 32 in position 4 are energized, the conductive coil 32 in position 1 and the conductive coil 32 in position 3 are de-energized, and the current direction in the conductive coil 32 in position 2 is the same as that in position 1.
  • the direction of current in the conductive coil 32 is the same when it is energized.
  • the direction of current in the conductive coil 32 in position 4 is the same as the direction of current in the conductive coil 32 in position 3.
  • the magnetic field generated by the conductive coil 32 in position 2 is the same as the magnetic field.
  • the magnetic field generated when the conductive coil 32 is energized in position 1 has the same magnetic field, and the magnetic field generated by the conductive coil 32 in position 4 is the same as the magnetic field generated when the conductive coil 32 in position 3 is energized.
  • the conductive coil 32 in position 2 The conductive coil 32 in position 4 can continuously drive the first fan blade 311 and the second fan blade 312 to rotate, and can ensure that the rotation direction of the first fan blade 311 and the second fan blade 312 remains unchanged.
  • the electricity supplied to the conductive coil 32 is alternating current.
  • At least a pair of through holes 22 may be provided on the second circuit board 20, and the conductive coil 32 is provided in the through holes 22.
  • the conductive coil 32 can be arranged in the through hole 22, and there is no need to deploy other components in the accommodating cavity to fix the conductive coil 32.
  • the magnetic field generated by the conductive coil 32 after being energized can facilitate the rotation of the magnetic fan blade 31.
  • the axial direction of the through hole 22 may be the same as that of the magnetic fan.
  • the rotating surface of the leaf 31 when rotating is vertical.
  • the conductive coil 32 When the axial direction of the through hole 22 is perpendicular to the rotating surface of the magnetic fan blade 31 when it rotates, it means that the conductive coil 32 will also be perpendicular to the rotating surface of the magnetic fan blade 31 when it rotates. Therefore, the magnetic field generated by the conductive coil 32 The magnetic fan blade 31 can be driven to rotate better.
  • the conductive coil 32 can be arranged in the via hole 22 as follows: as shown in FIG. 4, the second circuit board 20 can include a multilayer circuit board, and each via hole 22 penetrates each layer of circuit. In the board, the hole wall of each via hole 22 forms a non-closed coil on each layer of the circuit board, and two adjacent non-closed coils are electrically connected to form a conductive coil 32.
  • the hole wall of the through hole 22 can be directly used to form a non-closed coil on each layer of circuit board. At this time, there is no need to use additional materials to form the conductive coil 32. , You can save material.
  • the conductive coil 22 can also be fixed in the through hole 22 without forming a non-closed coil on each layer of the circuit board on the hole wall of the through hole 22.
  • the heat dissipation assembly 30 may further include a rotating shaft 33.
  • the rotating shaft 33 can be arranged on the second circuit board 20.
  • the rotating shaft 33 is located between the two conductive coils 32 of each group of conductive coils 32 and on the connecting line of the two conductive coils 32.
  • the magnetic fan blade 31 is provided with a rotating shaft hole. , The magnetic fan blade 31 is nested on the rotating shaft 33 through the rotating shaft hole.
  • the magnetic fan blade 31 Since the magnetic fan blade 31 is provided with a shaft hole, the magnetic fan blade 31 can be nested on the shaft 33 through the shaft hole. Then, when the conductive coil 32 generates an electromagnetic field, the magnetic fan blade 31 can rotate around the shaft 33, and, During the rotation of the magnetic fan blade 31, the rotating shaft can also play a role of fixing the magnetic fan blade 31, so that the magnetic fan blade 31 will not be shifted in position due to the rotation.
  • connection between the two conductive coils 32 is a connection between the axis of one conductive coil 32 and the axis of the other conductive coil 32.
  • the rotating shaft 33 may be located at the midpoint of the connecting line of the two conductive coils 32 of each group of conductive coils 32.
  • the rotating shaft 33 is located at the midpoint of the connection of the two conductive coils 32 of each group of conductive coils 32, after each group of conductive coils 32 is energized, in each group of conductive coils 32, one conductive coil 32 is generated.
  • the force exerted by the electromagnetic field on the magnetic fan blade 31 is equal to the force exerted by the electromagnetic field generated by another conductive coil 32 on the magnetic fan blade 31.
  • the force on the magnetic fan blade 31 is uniform, so that the magnetic fan blade 31 is During the rotation, the magnetic fan blade 31 will not wear out with the rotating shaft 33 due to uneven force.
  • the heat dissipation assembly 30 may face the heat dissipation hole 11. Since the heat dissipation assembly 30 can make the air in the accommodating cavity flow, so that the flowing air takes the heat in the accommodating cavity out of the accommodating cavity.
  • the heat dissipation assembly 30 faces the heat dissipation hole 11
  • the heat dissipation assembly 30 makes the accommodating cavity After the air flows, the flowing air can flow out from the heat dissipation hole 11 to the outside of the accommodating cavity for the first time, so that the heat in the accommodating cavity can be transferred to the outside of the accommodating cavity at a faster speed, ensuring that the heat in the accommodating cavity is reduced .
  • the realization of the accommodating cavity formed between the first circuit board 10 and the second circuit board 20 may be: as shown in FIG. 6, the first circuit board 10 and the second circuit board 20 are adjacent to each other. The surface is provided with a first groove, and the first groove and the second circuit board 20 form an accommodating cavity.
  • the accommodating cavity can be directly formed by the first circuit board 10 and the second circuit board 20.
  • an adapter board is added between two adjacent circuit boards, so that the adjacent An accommodating cavity is formed between the two circuit boards.
  • the method of forming an accommodating cavity between the first circuit board 10 and the second circuit board 20 in the embodiment of the present invention can save materials.
  • a second groove may be opened at the bottom of the first groove, and the heat dissipation component 30 may be disposed in the second groove.
  • the heat dissipation assembly 30 can facilitate the heat dissipation assembly 30 to pass the heat emitted by the electronic component 40 at the bottom of the first groove through the heat dissipation hole 11 discharge.
  • the surface of the first circuit board 10 adjacent to the second circuit board 20 is provided with a third groove, and the second circuit board 20 is adjacent to the first circuit board 10.
  • the surface is provided with a fourth groove, and the third groove and the fourth groove form an accommodating cavity.
  • the electrical connection of the first circuit board 10 and the second circuit board 20 may be: soldering the first circuit board 10 and the second circuit board 20 through solder paste, so that the first circuit board 10 and the second circuit board 20 are electrically connected.
  • the electrical connection of the first circuit board 10 and the second circuit board 20 can also be as follows: one end of the elastic sheet is fixed to the first circuit board 10 by a screw, and the other end of the elastic sheet is used with a screw. It is fixed on the second circuit board 20, and the first circuit board 10 and the second circuit board 20 are electrically connected by elastic pieces.
  • a groove may be opened on one surface of the second circuit board 20, the first circuit board 10 remains unchanged, and then the two surfaces of the first circuit board 10
  • the electronic component 40 is disposed on the upper surface, and the electronic component 40 is disposed in the groove on the second circuit board 20 and on the other surface of the second circuit board 20.
  • a heat dissipation hole 11 is opened on the first circuit board 10, a rotating shaft 33 is arranged in a groove on the second circuit board 20, and the magnetic fan blade 31 is nested on the rotating shaft 33, and on the second circuit board 20
  • a plurality of groups of via holes 22 are provided, and a conductive coil 32 is provided in each via hole 22.
  • the first circuit board 10 and the second circuit board 20 are soldered by solder paste, and a receiving cavity is formed between the first circuit board 10 and the second circuit board 20.
  • Alternating current is applied to the conductive coils 32 in each via 22, and it is ensured that the current directions of the two conductive coils 32 in each group of conductive coils 32 are opposite at the same time.
  • multiple sets of conductive coils 32 may be alternately energized. After the conductive coil 32 is energized, the conductive coil 32 can generate an electromagnetic field, and the magnetic fan blade 31 can rotate in the electromagnetic field. After the magnetic fan blade 31 rotates, the magnetic fan blade 31 drives the heat generated by the electronic component 40 in the accommodating cavity to be discharged from the heat dissipation hole 11 to the outside of the accommodating cavity, so that the heat in the accommodating cavity is reduced.
  • the beneficial effects of the circuit board device may include at least:
  • the heat dissipation assembly since the heat dissipation assembly includes a magnetic fan blade and at least one set of conductive coils, the conductive coil is fixed on the second circuit board and is opposite to the magnetic fan blade. Therefore, when the conductive coil is energized, the magnetic fan blade is Rotation in the electromagnetic field generated by the conductive coil, the rotation of the magnetic fan blade will cause the air in the accommodating cavity to flow.
  • the heat dissipation component is arranged in the containing cavity formed between the first circuit board and the second circuit board, and the first circuit board and/or the second circuit board are provided with heat dissipation holes, the air in the containing cavity After the flow, the heat generated by the electronic components in the receiving cavity can be discharged from the heat dissipation hole along with the air flow, so that the heat no longer collects in the receiving cavity, thereby improving the performance of the electronic device and improving the user experience.
  • An embodiment of the present invention provides an electronic device, which includes the circuit board device provided in any one of the foregoing embodiments.
  • This electronic device includes, but is not limited to, smart phones, tablets, laptops, etc.
  • the heat dissipation assembly since the heat dissipation assembly includes a magnetic fan blade and at least one set of conductive coils, the conductive coil is fixed on the second circuit board and is opposite to the magnetic fan blade. Therefore, when the conductive coil is energized, the magnetic fan blade is Rotation in the electromagnetic field generated by the conductive coil, the rotation of the magnetic fan blade will cause the air in the accommodating cavity to flow.
  • the heat dissipation component is arranged in the containing cavity formed between the first circuit board and the second circuit board, and the first circuit board and/or the second circuit board are provided with heat dissipation holes, the air in the containing cavity After the flow, the heat generated by the electronic components in the receiving cavity can be discharged from the heat dissipation hole along with the air flow, so that the heat no longer collects in the receiving cavity, thereby improving the performance of the electronic device and improving the user experience.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本发明实施例提供了一种电路板装置及电子设备。电路板装置包括第一电路板、第二电路板和散热组件；第一电路板和第二电路板电连接，第一电路板与第二电路板之间形成容纳腔；第一电路板和/或第二电路板上设置有散热孔，散热孔与容纳腔连通；散热组件包括磁性扇叶和至少一组导电线圈，每组导电线圈包括两个导电线圈；磁性扇叶设置在容纳腔内，且设置在第二电路板上；导电线圈固定在第二电路板上，且与磁性扇叶相对；在导电线圈通电的情况下，磁性扇叶在导电线圈产生的电磁场内转动。

Description

电路板装置及电子设备
相关申请的交叉引用
本申请主张在2019年12月27日在中国提交的中国专利申请号No.201911381055.0的优先权，其全部内容通过引用包含于此。
技术领域
本发明涉及电子设备技术领域，特别是涉及一种电路板装置及电子设备。
背景技术
随着对于使用体验的极致追求，用户对于智能手机、平板电脑等电子设备的性能要求也越来越高，电子设备的电路板上需要放置的电子元件也越来越多。
相关技术中，为了在电路板装置中放置较多的电子元件，电路板装置中可以设置多个叠放的电路板，相邻的两个电路板之间可以通过转接板电连接。具体地，相邻的两个电路板之间可以形成容纳腔，该容纳腔可以用于容纳电子元件，以在该电路板装置中放置尽可能多的电子元件。
然而，在电子设备运行的过程中，电路板上的电子元件产生的热量很容易聚集在该容纳腔中，使得容纳腔中的温度升高，从而影响电子设备的使用，降低用户的体验。
发明内容
有鉴于此，本发明实施例提供了一种电路板装置和电子设备，以解决电子设备中电路板装置中容纳腔中的温度升高，影响电子设备使用的问题。
第一方面，本发明实施例提供了一种电路板装置，所述电路板装置包括第一电路板、第二电路板和散热组件；
所述第一电路板和所述第二电路板电连接，所述第一电路板与所述第二电路板之间形成容纳腔；
所述第一电路板和/或所述第二电路板上设置有散热孔，所述散热孔与所 述容纳腔连通；
所述散热组件包括磁性扇叶和至少一组导电线圈，每组所述导电线圈包括两个所述导电线圈；
所述磁性扇叶设置在所述容纳腔内，且设置在所述第二电路板上；
所述导电线圈固定在所述第二电路板上，且与所述磁性扇叶相对；
在所述导电线圈通电的情况下，所述磁性扇叶在所述导电线圈产生的电磁场内转动。
第二方面，本发明实施例提供了一种电子设备，所述电子设备包括上述第一方面中所述的电路板装置。
本发明实施例提供的技术方案的有益效果至少可以包括：
在本发明中，由于散热组件包括磁性扇叶和至少一组导电线圈，导电线圈固定在第二电路板上，且与磁性扇叶相对，因此，在导电线圈通电的情况下，磁性扇叶在导电线圈产生的电磁场内转动，磁性扇叶转动之后会使得容纳腔中的空气流动。另外，由于散热组件设置在第一电路板和第二电路板之间形成的容纳腔中，且第一电路板和/或第二电路板上设置有散热孔，因此，在容纳腔中的空气流动之后，容纳腔中的电子元件产生的热量可以随着空气流动从散热孔中排出，使得热量不再聚集在容纳腔中，因而可以提高电子设备的性能，提高用户体验。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对本发明实施例的描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1是本发明实施例提供的一种电路板装置的示意图；
图2是本发明实施例提供的一种两组导电线圈布局示意图；
图3是图2中的两组导电线圈的通电时序图；
图4是本发明实施例提供的一种导电线圈的示意图；
图5是本发明实施例提供的另一种电路板装置的示意图；
图6是本发明实施例提供的另一种电路板装置的示意图；
图7是本发明实施例提供的另一种电路板装置的示意图。
附图标记：
10：第一电路板；20：第二电路板；11：散热孔；22：导通孔；30：散热组件；31：磁性扇叶；32：导电线圈；33：转轴；311：第一扇叶；312：第二扇叶；40：电子元件。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
图1是本发明实施例提供的一种电路板装置的示意图。如图1所示，该电路板装置可以包括第一电路板10、第二电路板20和散热组件30。
第一电路板10和第二电路板20电连接，第一电路板10与第二电路板20之间形成容纳腔。第一电路板10和/或第二电路板20上设置有散热孔11，散热孔11与容纳腔连通。散热组件30包括磁性扇叶31和至少一组导电线圈32，每组导电线圈32包括两个导电线圈32。磁性扇叶31设置在容纳腔内，且设置在第二电路板20上，导电线圈32固定在第二电路板20上，且与磁性扇叶31相对。在导电线圈32通电的情况下，磁性扇叶31在导电线圈32产生的电磁场内转动。。
在本发明实施例中，由于散热组件30包括磁性扇叶31和至少一组导电线圈32，导电线圈32固定在第二电路板20上，且与磁性扇叶31相对，因此，在导电线圈32通电的情况下，磁性扇叶31在导电线圈31产生的电磁场内转动，磁性扇叶31转动之后会使得容纳腔中的空气流动。另外，由于散热组件30设置在第一电路板10和第二电路板20之间形成的容纳腔中，且第一 电路板10和/或第二电路板20上设置有散热孔11，因此，在容纳腔中的空气流动之后，容纳腔中的电子元件40产生的热量可以随着空气流动从散热孔11中排出，使得热量不再聚集在容纳腔中，因而可以提高电子设备的性能，提高用户体验。
需要说明的是，在本发明实施例中，导电线圈的两端可以与电子设备中的电源连接，电源与控制器连接，控制器可以控制电源向导电线圈中供电，以使导电线圈中通电。
另外，在一些实施例中，在导电线圈32通电的情况下，为了便于磁性扇叶31在导电线圈32产生的电磁场内转动，如图1所示，磁性扇叶31可以包括第一扇叶311和第二扇叶312，第一扇叶311与第二扇叶312连接，第一扇叶311与第二扇叶312的磁极相反。
在每组导电线圈32通电之后，每组导电线圈32在通电之后会产生两个磁场，此时，由于第一扇叶311和第二扇叶312的磁极相反，因此，该两个磁场中一个磁场的磁性可能与第一扇叶311的磁极相反，另一个磁场的磁性可能与第二扇叶312的磁极相反。由于相反的磁性之间存在吸引力，使得一个磁场吸引第一扇叶311，另一个磁场吸引第二扇叶312，在第一扇叶311和第二扇叶312均被吸引的过程中，第一扇叶311和第二扇叶312便会转动。或者，该两个磁场中一个磁场的磁性可能与第一扇叶311的磁性相同，另一个磁场的磁性可能与第二扇叶312的磁性相同，此时，由于相通磁性之间存在排斥力，使得一个磁场排斥第一扇叶311，另一个磁场排斥第二扇叶312，在第一扇叶311和第二扇叶312均被排斥的过程中，第一扇叶311和第二扇叶312便会转动。
另外，在一些实施例中，磁性扇叶31位于每组导电线圈32的两个导电线圈32之间。每组导电线圈32中两个导电线圈32在同一时间的电流方向相反，且同时断电或同时通电。其中，磁性扇叶31可以位于两个导电线圈32的连线上。
由于磁性扇叶31位于每组导电线圈32的两个导电线圈32之间，且位于两个导电线圈32的连线上，当每组导电线圈32中两个导电线圈32在同一时间的电流方向相反，且同时通电时，两个导电线圈32中一个导电线圈32产 生的磁场与另一个导电线圈32产生的磁场的磁性相反，此时，无论磁性扇叶31中第一扇叶311的磁性与一个导电线圈32产生的磁场的磁性相同或相反，第二扇叶312的磁性与另一个导电线圈32产生的磁场的磁性相同或相反，导电线圈32均能够驱动第一扇叶311和第二扇叶312转动。
另外，在散热组件30包括多组导电线圈32的情况下，多组导电线圈32可以交替通电。多组导电线圈32交替通电指的是在多组导电线圈32中第一对导电线圈32通电时，其它对导电线圈32不通电，在第二对导电线圈32通电时，其它对导电线圈32不通电，依次类推，直到多组导电线圈32中每组导电线圈32中均通过电。
例如，图2是本发明实施例提供的一种两组导电线圈布局示意图。图3是图2中的两组导电线圈的通电时序图。如图2所示，该两组导电线圈32中第一对导电线圈32的部署位置为位置1和位置3，第二对导电线圈32部署位置为位置2和位置4。磁性扇叶31位于该两组导电线圈32的连线上。磁性扇叶31中第一扇叶311的磁性为N，第二扇叶312的磁性为S。如图3所示，在位置1和位置3中两个导电线圈32中同时通电，且位置1和位置3中两个导电线圈32的电流方向相反。此时，在位置2和位置4中两个导电线圈32中不通电。
若位置1中导电线圈32产生的电磁场的磁性为N，则位置3中导电线圈32产生的电磁场的磁性为S，此时，位置1中导电线圈32和位置3中导电线圈32便可以驱动第一扇叶311和第二扇叶312转动。之后在位置2中导电线圈32和位置4中导电线圈32中通电，将位置1中导电线圈32和位置3中导电线圈32断电，且位置2中导电线圈32中的电流方向与位置1中导电线圈32中通电时的电流方向相同，位置4中导电线圈32中的电流方向与位置3中导电线圈32中通电时的电流方向相同，位置2中导电线圈32便可以产生的磁场的磁性与位置1中导电线圈32通电时产生的磁场的磁性相同，位置4中导电线圈32便可以产生的磁场的磁性与位置3中导电线圈32通电时产生的磁场的磁性相同，位置2中导电线圈32和位置4中导电线圈32便可以持续驱动第一扇叶311和第二扇叶312转动，并且，可以确保第一扇叶311和第二扇叶312的转动方向不变。即，当第一扇叶311和第二扇叶312在位置 1中导电线圈32和位置3中导电线圈32的作用下沿顺时针方向转动时，第一扇叶311和第二扇叶312在导位置2中导电线圈32和位置4中导电线圈32的作用下依然沿顺时针方向转动。
需要说明的是，在本发明实施例中，导电线圈32通电的情况下，导电线圈32中通入的电为交流电。
另外，为了便于固定导电线圈32，在一些实施例中，如图1所示，第二电路板20上可以设置至少一对导通孔22，导电线圈32设置于导通孔22中。
当第二电路板20上设置至少一对导通孔22时，导电线圈32便可以设置在导通孔22中，无需在容纳腔中另外部署其它部件来固定导电线圈32。
另外，为了使得导电线圈32部署在导通孔22中之后，导电线圈32在通电之后产生的磁场能够便于磁性扇叶31转动，在一些实施例中，导通孔22的轴线方向可以与磁性扇叶31在转动时的转动面垂直。
当导通孔22的轴线方向与磁性扇叶31在转动时的转动面垂直时，表明导电线圈32的也会与磁性扇叶31在转动时的转动面垂直，因此，导电线圈32产生的磁场可以较好地驱动磁性扇叶31转动。
另外，在一些实施例中，导通孔22中设置导电线圈32的方式可以为：如图4所示，第二电路板20可以包括多层线路板，每个导通孔22贯穿每层线路板，每个导通孔22的孔壁在每层线路板上形成非封闭线圈，相邻的两个非封闭线圈之间电连接，以形成导电线圈32。
其中，在第二电路板20包括多层线路板的情况下，可以直接用导通孔22的孔壁在每层线路板上形成非封闭线圈，此时，无需额外使用其他材料形成导电线圈32，可以节省材料。
需要说明的是，也可以将导电线圈22固定在导通孔22中，不在导通孔22的孔壁上的每层线路板上形成非封闭线圈。
另外，当磁性扇叶31在导电线圈32产生的电磁场中转动时，为了便于磁性扇叶31转动，在一些实施例中，如图1所示，散热组件30还可以包括转轴33。转轴33可以设置在第二电路板20上，转轴33位于每组导电线圈32的两个导电线圈32之间，且位于两个导电线圈32的连线上，磁性扇叶31上设置有转轴孔，磁性扇叶31通过转轴孔嵌套在转轴33上。
由于磁性扇叶31上设置转轴孔，磁性扇叶31便可以通过转轴孔嵌套在转轴33上，之后，当导电线圈32产生电磁场时，磁性扇叶31便可以绕着转轴33转动，并且，磁性扇叶31在转动的过程中，转轴还可以起到固定磁性扇叶31的作用，使得磁性扇叶31不会由于转动而产生位置偏移。
需要说明的是，两个导电线圈32的连线为一个导电线圈32的轴线的与另一个导电线圈32的轴线之间的连线。
另外，为了使得磁性扇叶31在导电线圈32产生的电磁场中受到的驱动力大小是均匀的，确保磁性扇叶31在转动过程中不会发生偏斜而与转轴之间相互磨损，在一些实施例中，转轴33可以位于每组导电线圈32的两个导电线圈32的连线的中点上。
此时，由于转轴33位于每组导电线圈32的两个导电线圈32的连线的中点上，因此，每组导电线圈32在通电之后，在每组导电线圈32中，一个导电线圈32产生的电磁场向磁性扇叶31施加的力的大小与另一个导电线圈32产生的电磁场向磁性扇叶31施加的力的大小相等，磁性扇叶31的受力是均匀的，使得磁性扇叶31在转动过程中，磁性扇叶31不会由于受力不均而与转轴33之间相互磨损。
另外，当容纳腔中产生热量之后，为了便于散热组件30将热量通过散热孔11排出容纳腔，在一些实施例中，如图5所示，散热组件30可以朝向散热孔11。由于散热组件30可以使得容纳腔中的空气流动，使得流动的空气将容纳腔中的热量从容纳腔中带出，因此，当散热组件30朝向散热孔11时，在散热组件30使得容纳腔中的空气流动之后，流动的空气可以第一时间从散热孔11中流出至容纳腔外，使得容纳腔中的热量可以以较快的速度被传输至容纳腔之外，确保容纳腔中的热量减少。
另外，在一些实施例中，第一电路板10和第二电路板20之间形成容纳腔的实现方式可以为：如图6所示，第一电路板10与第二电路板20相邻的表面设置有第一凹槽，第一凹槽与第二电路板20形成容纳腔。
在这种情况下，可以直接通过第一电路板10和第二电路板20形成容纳腔，相比于相关技术中，在相邻的两个电路板之间增加转接板，使得相邻的两个电路板之间形成容纳腔，本发明实施例中第一电路板10与第二电路板 20之间形成容纳腔的方式，可以节省材料。
另外，在一些实施例中，如图1所示，第一凹槽的底部可以开有第二凹槽，散热组件30可以设置在第二凹槽中。此时，由于散热组件30的位置比第一凹槽底上的电子元件40的位置低，此时，可以便于散热组件30将第一凹槽槽底的电子元件40散发的热量通过散热孔11排出。
另外，在一些实施例中，如图7所示，第一电路板10与第二电路板20相邻的表面设置有第三凹槽，第二电路板20与第一电路板10相邻的表面设置有第四凹槽，第三凹槽与第四凹槽形成容纳腔。
另外，在一些实施例中，第一电路板10与第二电路板20电连接的连接方式可以为：将第一电路板10和第二电路板20通过锡膏进行焊接，使得第一电路板10与第二电路板20之间电连接。
在另一些实施例中，第一电路板10与第二电路板20电连接的连接方式还可以为：将弹片的一端通过螺钉固定在第一电路板10上，将弹片的另一端用过螺钉固定在第二电路板20上，通过弹片将第一电路板10与第二电路板20电连接。
下面结合图1对本发明实施例提供的电路板装置的使用过程进行说明：
在使用本发明实施例提供的电路板装置时，可以在第二电路板20上的一个表面上开有凹槽，第一电路板10保持不变，之后在第一电路板10的两个表面上部署电子元件40，并在第二电路板20上的凹槽中以及第二电路板20的另一个表面上部署电子元件40。在第一电路板10上开有散热孔11，在第二电路板20上的凹槽中设置转轴33，并将磁性扇叶31嵌套在转轴33上，并且，在第二电路板20上设置多组导通孔22，每个导通孔22中设置导电线圈32。之后将第一电路板10与第二电路板20通过锡膏焊接，第一电路板10便与第二电路板20之间形成容纳腔。向每个导通孔22中的导电线圈32中通交流电，并且，确保每组导电线圈32中两个导电线圈32的电流方向在同一时刻是相反的。另外，可以向多组导电线圈32交替通电。在导电线圈32中通电之后，导电线圈32便可以产生电磁场，磁性扇叶31在电磁场中便可以转动。在磁性扇叶31转动之后，磁性扇叶31带动容纳腔中电子元件40产生的热量从散热孔11中排出至容纳腔外，使得容纳腔中的热量减少。
综上，本发明实施例提供的电路板装置的有益效果至少可以包括：
在本发明中，由于散热组件包括磁性扇叶和至少一组导电线圈，导电线圈固定在第二电路板上，且与磁性扇叶相对，因此，在导电线圈通电的情况下，磁性扇叶在导电线圈产生的电磁场内转动，磁性扇叶转动之后会使得容纳腔中的空气流动。另外，由于散热组件设置在第一电路板和第二电路板之间形成的容纳腔中，且第一电路板和/或第二电路板上设置有散热孔，因此，在容纳腔中的空气流动之后，容纳腔中的电子元件产生的热量可以随着空气流动从散热孔中排出，使得热量不再聚集在容纳腔中，因而可以提高电子设备的性能，提高用户体验。
本发明实施例提供了一种电子设备，该电子设备包括上述实施例中任一实施例提供的电路板装置。该电子设备包括但不局限于智能手机、平板电脑、笔记本电脑等。
在本发明中，由于散热组件包括磁性扇叶和至少一组导电线圈，导电线圈固定在第二电路板上，且与磁性扇叶相对，因此，在导电线圈通电的情况下，磁性扇叶在导电线圈产生的电磁场内转动，磁性扇叶转动之后会使得容纳腔中的空气流动。另外，由于散热组件设置在第一电路板和第二电路板之间形成的容纳腔中，且第一电路板和/或第二电路板上设置有散热孔，因此，在容纳腔中的空气流动之后，容纳腔中的电子元件产生的热量可以随着空气流动从散热孔中排出，使得热量不再聚集在容纳腔中，因而可以提高电子设备的性能，提高用户体验。
需要说明的是，本说明书中的各个实施例均采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似的部分互相参见即可。
尽管已描述了本发明实施例的优选实施例，但本领域内的技术人员一旦得知了基本创造性概念，则可对这些实施例做出另外的变更和修改。所以，所附权利要求意欲解释为包括优选实施例以及落入本发明实施例范围的所有变更和修改。
最后，还需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者终端设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者终端设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括要素的过程、方法、物品或者终端设备中还存在另外的相同要素。
以上对本发明所提供的技术方案进行了详细介绍，本文中应用了具体个例对本发明的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本发明的方法及其核心思想；同时，对于本领域的一般技术人员，依据本发明的思想，在具体实施方式及应用范围上均会有改变之处，综上，本说明书内容不应理解为对本发明的限制。

Claims (12)

  1. 一种电路板装置，包括第一电路板(10)、第二电路板(20)和散热组件(30)；
    所述第一电路板(10)和所述第二电路板(20)电连接，所述第一电路板(10)与所述第二电路板(20)之间形成容纳腔；
    所述第一电路板(10)和/或所述第二电路板(20)上设置有散热孔(11)，所述散热孔(11)与所述容纳腔连通；
    所述散热组件(30)包括磁性扇叶(31)和至少一组导电线圈(32)，每组所述导电线圈(32)包括两个所述导电线圈(32)；
    所述磁性扇叶(31)设置在所述容纳腔内，且设置在所述第二电路板(20)上；
    所述导电线圈(32)固定在所述第二电路板(20)上，且与所述磁性扇叶(31)相对；
    在所述导电线圈(32)通电的情况下，所述磁性扇叶(31)在所述导电线圈(32)产生的电磁场内转动。
  2. 根据权利要求1所述的电路板装置，其中，所述磁性扇叶(31)包括第一扇叶(311)和第二扇叶(312)；
    所述第一扇叶(311)与所述第二扇叶(312)连接，所述第一扇叶(311)与所述第二扇叶(312)的磁极相反。
  3. 根据权利要求1所述的电路板装置，其中，所述磁性扇叶(31)位于每组所述导电线圈(32)的两个所述导电线圈(32)之间；
    每组所述导电线圈(32)中两个所述导电线圈(32)在同一时间的电流方向相反，且同时断电或同时通电。
  4. 根据权利要求1所述的电路板装置，其中，在所述散热组件(30)包括多组所述导电线圈(32)的情况下，所述多组所述导电线圈(32)交替通 电。
  5. 根据权利要求1所述的电路板装置，其中，所述第二电路板(20)上设置至少一对导通孔(22)，所述导电线圈(32)设置于所述导通孔(22)中。
  6. 根据权利要求5所述的电路板装置，其中，所述第二电路板(20)包括多层线路板，每个所述导通孔(22)贯穿每层所述线路板，每个所述导通孔(22)的孔壁在每层所述线路板上形成非封闭线圈，相邻的两个所述非封闭线圈之间电连接，以形成所述导电线圈(32)。
  7. 根据权利要求1所述的电路板装置，其中，所述散热组件(30)还包括转轴(33)；
    所述转轴(33)设置在所述第二电路板(20)上，所述转轴(33)位于每组所述导电线圈(32)的两个所述导电线圈(32)之间，且位于两个所述导电线圈(32)的连线上，所述磁性扇叶(31)上设置有转轴孔，所述磁性扇叶(31)通过所述转轴孔嵌套在所述转轴(33)上。
  8. 根据权利要求7所述的电路板装置，其中，所述转轴(33)位于每组导电线圈(32)的两个所述导电线圈(32)的连线的中点上。
  9. 根据权利要求1所述的电路板装置，其中，所述散热组件(30)朝向所述散热孔(11)设置。
  10. 根据权利要求1所述的电路板装置，其中，所述第一电路板(10)与所述第二电路板(20)相邻的表面设置有第一凹槽，所述第一凹槽与所述第二电路板(20)形成所述容纳腔。
  11. 根据权利要求10所述的电路板装置，其中，所述第一凹槽的底部开有第二凹槽，所述散热组件(30)设置在所述第二凹槽中。
  12. 一种电子设备，包括权利要求1-13中任一项所述的电路板装置。
PCT/CN2020/139616 2019-12-27 2020-12-25 电路板装置及电子设备 WO2021129837A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201911381055.0 2019-12-27
CN201911381055.0A CN111132515B (zh) 2019-12-27 2019-12-27 电路板装置及电子设备

Publications (1)

Publication Number Publication Date
WO2021129837A1 true WO2021129837A1 (zh) 2021-07-01

Family

ID=70504737

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/139616 WO2021129837A1 (zh) 2019-12-27 2020-12-25 电路板装置及电子设备

Country Status (2)

Country Link
CN (1) CN111132515B (zh)
WO (1) WO2021129837A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114945258A (zh) * 2022-04-02 2022-08-26 陈潘潘 一种地理信息查询网络信息采集安全装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111132515B (zh) * 2019-12-27 2021-11-30 维沃移动通信有限公司 电路板装置及电子设备
CN112496435A (zh) * 2020-11-14 2021-03-16 刘杰 一种用于轨道交通的作业工装
CN116916633B (zh) * 2023-09-11 2023-12-29 深圳市德兰明海新能源股份有限公司 谐振变换器和储能电源

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030030348A1 (en) * 2001-08-10 2003-02-13 Lopatinsky Edward L. Ring stator motor device
CN201039635Y (zh) * 2006-11-02 2008-03-19 华为技术有限公司 一种散热结构
CN203788063U (zh) * 2014-01-28 2014-08-20 捷美美实业有限公司 薄型风扇的印刷式布线线圈绕组改良结构
US20190075680A1 (en) * 2016-05-05 2019-03-07 Huawei Technologies Co., Ltd. Heat dissipation apparatus and communications device
CN109688778A (zh) * 2019-02-27 2019-04-26 维沃移动通信有限公司 电路板装置及终端设备
CN111132515A (zh) * 2019-12-27 2020-05-08 维沃移动通信有限公司 电路板装置及电子设备

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101060766A (zh) * 2006-04-17 2007-10-24 建准电机工业股份有限公司 薄型散热机构

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030030348A1 (en) * 2001-08-10 2003-02-13 Lopatinsky Edward L. Ring stator motor device
CN201039635Y (zh) * 2006-11-02 2008-03-19 华为技术有限公司 一种散热结构
CN203788063U (zh) * 2014-01-28 2014-08-20 捷美美实业有限公司 薄型风扇的印刷式布线线圈绕组改良结构
US20190075680A1 (en) * 2016-05-05 2019-03-07 Huawei Technologies Co., Ltd. Heat dissipation apparatus and communications device
CN109688778A (zh) * 2019-02-27 2019-04-26 维沃移动通信有限公司 电路板装置及终端设备
CN111132515A (zh) * 2019-12-27 2020-05-08 维沃移动通信有限公司 电路板装置及电子设备

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114945258A (zh) * 2022-04-02 2022-08-26 陈潘潘 一种地理信息查询网络信息采集安全装置
CN114945258B (zh) * 2022-04-02 2024-03-08 陈潘潘 一种地理信息查询网络信息采集安全装置

Also Published As

Publication number Publication date
CN111132515A (zh) 2020-05-08
CN111132515B (zh) 2021-11-30

Similar Documents

Publication Publication Date Title
WO2021129837A1 (zh) 电路板装置及电子设备
US6809925B2 (en) Dual-purpose computer having gravity-actuated fan speed control
US20120315168A1 (en) Heat dissipation fan and stator thereof
KR20170028265A (ko) 주변 구동 원심 팬
JP2017537442A (ja) 薄膜型磁気コネクタモジュール
US20110290456A1 (en) Micro cooling fan
WO2011100201A2 (en) Spark resistant ion wind fan
CN202065212U (zh) 超薄形计算机风扇
WO2007050533A2 (en) Piezoelectric fan
WO2015101005A1 (zh) 侧立磁场电机及应用其的散热风扇
CN108668425A (zh) 信号传输线本体及其制作方法、USBTypeC连接器
JP5018791B2 (ja) 気体搬送装置および冷却装置取り付け構造
WO2016063396A1 (ja) 配線板、電動機、電気機器及び空気調和機
JP2009153362A (ja) モーターの駆動回路板
TWI334975B (en) Heat dissipation device
JP2002134975A (ja) 冷却ファン
JP2006066527A (ja) 積層コイルおよびこれを用いたモータ
US20120104874A1 (en) Vibrating-type electromagnetic generator
CN110556997A (zh) 一种单相无刷高速电机
JP2017085718A (ja) モータ
US10128034B2 (en) Heat dissipation device
JP2017110593A (ja) 電動ポンプ
TWI776521B (zh) 磁吸式風扇組
TWI775700B (zh) 磁吸式風扇組
KR20170111260A (ko) 다층 인쇄회로기판을 이용한 적층형 스테이터, 이를 이용한 단상 모터와 쿨링 팬

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20905583

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20905583

Country of ref document: EP

Kind code of ref document: A1

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 09.01.2023)

122 Ep: pct application non-entry in european phase

Ref document number: 20905583

Country of ref document: EP

Kind code of ref document: A1