WO2021117435A1 - Manufacturing method for absorbent article - Google Patents

Manufacturing method for absorbent article Download PDF

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Publication number
WO2021117435A1
WO2021117435A1 PCT/JP2020/042949 JP2020042949W WO2021117435A1 WO 2021117435 A1 WO2021117435 A1 WO 2021117435A1 JP 2020042949 W JP2020042949 W JP 2020042949W WO 2021117435 A1 WO2021117435 A1 WO 2021117435A1
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WO
WIPO (PCT)
Prior art keywords
wiping
absorbent article
coating device
deposits
producing
Prior art date
Application number
PCT/JP2020/042949
Other languages
French (fr)
Japanese (ja)
Inventor
智康 山南
誠司 村上
正裕 下津
Original Assignee
ユニ・チャーム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ユニ・チャーム株式会社 filed Critical ユニ・チャーム株式会社
Publication of WO2021117435A1 publication Critical patent/WO2021117435A1/en

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Classifications

    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F13/00Bandages or dressings; Absorbent pads
    • A61F13/15Absorbent pads, e.g. sanitary towels, swabs or tampons for external or internal application to the body; Supporting or fastening means therefor; Tampon applicators
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/26Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/12Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials

Definitions

  • the present invention relates to a method for producing an absorbent article, which comprises a wiping step of wiping off the deposits adhering to the coating device during the stop period when the transportation of the material is stopped.
  • a hot melt adhesive is placed on the material by using a coating device during transportation of the material for the absorbent article (for example, Patent Document). 1).
  • An absorbent article was manufactured by joining a material on which a hot melt adhesive was placed to another material via a hot melt adhesive.
  • the hot melt adhesive solidified due to the cooling of the hot melt adhesive may adhere to the coating device, or the fibers contained in the material may adhere to the coating device via the hot melt adhesive. If the deposits continue to adhere to the coating device, there is a risk that the hot melt adhesive cannot be evenly placed on the material. Therefore, the operator wipes off the deposits adhering to the coating device to remove the deposits from the coating device and suppresses the occurrence of defective products.
  • the operation of the worker wiping off the deposits is performed during the stop period when the transportation of materials is stopped for the safety of the worker.
  • the time required for the operator to actually wipe off the deposits adhering to the coating device varies depending on the physical condition of the operator and individual differences of the operator. If the outage period is too short, material transport may start (restart) before the operator wipes off the deposits. In this case, the safety of the operator may not be sufficiently ensured, or the coating device may start (restart) the arrangement of the hot melt adhesive before the wiping of the deposits is completed.
  • a stop period was set, including a preliminary time, so that the wipe could be completed with a margin.
  • this is a method for manufacturing an absorbent article having a wiping step of wiping off the deposits adhering to the coating device during the stop period when the transportation of the material is stopped, and is absorbent while suppressing an increase in operating cost.
  • a method for producing an absorbent article that can increase the productivity of the article is desired.
  • the hot melt adhesive is applied to the material by using a coating device having a discharge port for discharging the hot melt adhesive during transportation of the material for the absorbent article. It is a method for producing an absorbent article having a step of arranging the material and a step of wiping off the deposits adhering to the coating device during the stop period during which the transportation of the material is stopped. In the wiping step, the front adhering matter is automatically wiped off in the area including the discharge port by using a wiping device having a wiping portion for wiping off the adhering matter during the stopping period.
  • FIG. 1 is a side view showing an example of the production line apparatus 10.
  • FIG. 2A is a top view showing an example of a place where the production line device 10 is arranged.
  • FIG. 2B is a system configuration diagram for explaining a part of the absorbent article manufacturing apparatus 1.
  • FIG. 3A is an exploded perspective view for explaining an example of the absorbent article 2.
  • FIG. 3B is a cross-sectional view taken along the line F3B-F3B in FIG. 3A.
  • FIG. 4 is a diagram showing an example of the first wiping device.
  • FIG. 5 is a diagram for explaining the wiping operation of the first wiping device.
  • FIG. 6 is a diagram for explaining the wiping operation of the first wiping device.
  • FIG. 7 is a diagram showing an example of the second wiping device.
  • FIG. 8 is a diagram for explaining the wiping operation of the second wiping device.
  • FIG. 9 is a sequence diagram for explaining a method for producing an absorbent article.
  • FIG. 10
  • the hot melt adhesive is applied to the material by using a coating device having a discharge port for discharging the hot melt adhesive during transportation of the material for the absorbent article. It is a method for producing an absorbent article having a step of arranging the material and a step of wiping off the deposits adhering to the coating device during the stop period during which the transportation of the material is stopped. In the wiping step, the deposits are automatically wiped off in the region including the discharge port by using a wiping device having a wiping portion for wiping the deposits during the stop period.
  • the productivity of the absorbent article can be increased by shortening the suspension period of the transportation of the material while suppressing the increase in the operating cost.
  • the wiping portion in the method of manufacturing the absorbent article, is automatically operated after the wiping step to a safe position where an operator can maintain the wiping portion during transportation of the material after the wiping step. It has a step of moving in a target manner. After the wiping process, the wiping part automatically moves to a safe position, so that the wiping part can be maintained without stopping the transportation of materials. As a result, it is possible to reduce the suspension of material transportation due to inadequate maintenance of the wiping portion and suppress the occurrence of defective products.
  • a safety cover is provided between the transport path for transporting the material and the passage area through which the worker passes to prevent contact with the material during transport of the material.
  • the wiping portion automatically moves toward the safety cover.
  • the safety cover since the safety cover is provided between the transport path and the aisle area, the wiped portion moves toward the safety cover, so that the wiped portion separates from the transport path and approaches the aisle area. Therefore, it becomes easier for the operator to access a safe position from the aisle area, and the time for performing maintenance of the wiping portion can be reduced. As a result, the labor cost for the maintenance of the wiping part can be reduced, and the increase in the operating cost can be suppressed.
  • the wiping portion automatically wipes off the deposits while moving toward the safety cover.
  • the distance that the wiping section automatically moves toward the safety cover after wiping can be shortened.
  • the time for the wiping portion to move to a safe position can be shortened, and the stop period can be shortened.
  • the suspension period includes a scheduled suspension period scheduled in advance and an emergency suspension period determined to be suspended during the transportation of the material. Since the deposits can be wiped off during the scheduled stop period and the emergency stop period, it is possible to suppress the generation of defective products due to the deposits adhering to the coating device and increase the productivity of the absorbent article.
  • the coating device is composed of a plurality of coating devices in which at least one of the hot melt adhesive arranging method and the hot melt adhesive arranging pattern is different, and the wiping device is the wiping device. It is composed of a plurality of wiping devices for wiping the deposits from each of the plurality of coating devices, and in the wiping step, the operating times of the plurality of wiping devices for wiping the deposits overlap.
  • the time from the start to the end of wiping of a plurality of coating devices can be shortened as compared with the case where another wiping device starts wiping after the wiping of one wiping device is completed, and the operation is stopped. The period can be shortened.
  • the wiping device is selected according to the degree of contamination of the coating device due to at least one of the arrangement method and the arrangement pattern of the hot melt adhesive.
  • the degree of contamination of the coating device varies depending on the arrangement method and arrangement pattern of the hot melt adhesive.
  • the wiping device is selected according to the elapsed time from the last wiping for each coating device. As time passes after wiping, deposits adhere to the coating device. By selecting according to the elapsed time from the last wiping, it is possible to appropriately select the coating device that requires wiping.
  • the stop period is adjusted according to the wiping time from the start to the end of the wiping by the selected wiping device.
  • the suspension period can be shortened according to the wiping time, so that the productivity of the absorbent article can be increased.
  • the adhered matter in the wiping step, is automatically wiped off with the solidified hot melt adhesive adhering to the wiping portion.
  • the adhesion of the solidified hot melt adhesive makes it easier for the deposits adhering to the coating device to adhere to the wiping portion. As a result, the deposits can be firmly wiped off from the coating device. By reducing the deposits left on the wipe, the occurrence of defective products can be further suppressed.
  • the wiping step includes, in addition to the discharge port, a portion upstream of the discharge port and a portion downstream of the discharge port in the transport direction in which the material is transported. Wipe off the deposits in the area. Not only does the hot melt adhesive adhere to the discharge port where the hot melt adhesive is discharged, but also the hot melt adhesive bounces off the material when the hot melt adhesive is placed, and the hot melt adhesive drips. Therefore, it may adhere to the periphery of the discharge port. By wiping off the deposits adhering to the upstream portion and the downstream portion around the discharge port, the occurrence of defective products can be further suppressed.
  • the wiping device automatically wipes off the deposits using the plate-shaped wiping portion.
  • the plate-shaped wiping portion can be wiped off so as to scrape off the deposits adhering to the coating device, as compared with the case where the wiping portion is a cloth such as a waste cloth.
  • the amount of deposits left after wiping can be reduced, and the occurrence of defective products can be further suppressed.
  • At least one of the coating device and the material transport path is moved so that the coating device is separated from the material transport path before the wiping step. Has.
  • at least one of the coating device and the material transport path moves, so that the material transport path and the coating device move.
  • the wiping device can be wiped off, so that the occurrence of defective products can be further suppressed.
  • the coating device may not be able to stably place the hot melt adhesive until a predetermined period of time has passed after wiping.
  • FIG. 1 is a side view showing an example of the production line apparatus 10.
  • the transport path and the coating device 40 are mainly shown, and other devices, for example, the wiping device (first wiping device and the second wiping device) described later, the device for cutting the material, and the material are squeezed.
  • the equipment to be used is omitted.
  • FIG. 2A is a top view showing an example of a place where the production line device 10 is arranged.
  • FIG. 2B is a system configuration diagram for explaining a part of the absorbent article manufacturing apparatus 1.
  • FIG. 3A is an exploded perspective view for explaining an example of the absorbent article 2.
  • FIG. 3B is a cross-sectional view taken along the line F3B-F3B in FIG. 3A.
  • FIG. 4 is a diagram showing an example of the first wiping device.
  • FIG. 5 is a diagram for explaining the wiping operation of the first wiping device.
  • FIG. 6 is a diagram for explaining the wiping operation of the first wiping device.
  • FIG. 7 is a diagram showing an example of the second wiping device.
  • FIG. 8 is a diagram for explaining the wiping operation of the second wiping device.
  • the manufacturing apparatus 1 may have a manufacturing line apparatus 10 and a control unit 20.
  • the production line device 10 is a device for processing while transporting the material 5 for the absorbent article 2.
  • the production line device 10 has a length direction X indicating the length direction of the production line device 10, a width direction Y indicating the width direction of the production line device 10, and a height direction Z indicating the height direction of the production line device 10. You can do it.
  • the production line apparatus 10 may have, for example, a length of the production line apparatus 10 in the length direction X of 20 m or more, a width of the production line apparatus 10 in the width direction Y of 2 m or more, and a height.
  • the height of the production line device 10 in the direction Z may be 2 m or more.
  • a safety cover 100 may be provided to prevent contact with the material 5 during transportation of the material 5.
  • the safety cover 100 may be provided between the transport path 35, which will be described later, and the passage area PA through which the operator passes.
  • At least a part of the production line device 10 may be arranged in the device area 10A surrounded by the safety cover 100 and the wall portion 8.
  • a safety area SA may be provided between the device area 10A and the safety cover 100.
  • the safety area SA is an area where the operator can safely maintain the wiping portion 55, which will be described later, during the transportation of the material 5.
  • the safety area SA is, for example, an area separated from the material 5 (transport path 35) and the production line device 10 (excluding the wiping device) being transported by a predetermined distance D (for example, 50 cm) or more.
  • the operator may be able to enter the safety area SA through a door (not shown) provided on the safety cover 100. Further, the operator may be able to access the safety area SA through a window (not shown) provided on the safety cover 100. As a result, the operator can maintain the wiping portion 55 during the transportation of the material 5.
  • the production line device 10 (manufacturing device 1) includes an input port 30 into which the material 5 is input, a transport path 35 in which the material 5 is transported, and a hot melt adhesive (hereinafter, appropriately referred to as an adhesive HM) during the transfer of the material 5. ) May be provided on the material 5, and a wiping device 50 for automatically wiping off deposits may be provided.
  • the input port 30 is an entrance into which the material 5 for the absorbent article 2 is input.
  • the insertion port 30 may be provided, for example, in the wall portion 8 extending in the length direction X and the height direction Z.
  • the wall portion 8 may be referred to as a mirror plate.
  • the manufacturing apparatus 1 may have a plurality of input ports 30.
  • the material 5 may be input from each of the plurality of input ports 30.
  • the material 5 is a material for the absorbent article 2.
  • the material 5 for the absorbent article 2 is, for example, a continuous body in which the absorber 2A described later, a continuous body in which the top sheet 2B described later is continuous, a continuous body in which the back sheet 2C described later is continuous, and a continuous body in which the exterior sheet 2D described later is continuous. And so on.
  • the material 5 may be an elastic member.
  • the material 5 may form an absorbent article 2 by being cut.
  • the absorbent article 2 is, for example, one of a pants-type disposable diaper, a tape-type disposable diaper, a shorts-type sanitary napkin, a liner-type sanitary napkin, and the like. As shown in FIG. 3, the absorbent article 2 is arranged, for example, on the absorber 2A, the top sheet 2B arranged on the skin surface side T1 of the absorber 2A, and on the non-skin surface side T2 of the absorber 2A. It may have a back sheet 2C and an exterior sheet 2D arranged on the non-skin surface side T2 of the back sheet 2C.
  • the absorber 2A has an absorbent material that absorbs the liquid, such as ground pulp or a highly absorbent polymer (SAP), or a mixture thereof.
  • SAP highly absorbent polymer
  • Absorber 2A may have a core wrap covering the absorbing core.
  • the core wrap may be composed of, for example, tissue and / or non-woven fabric.
  • the top sheet 2B and the exterior sheet 2D may be made of a non-woven fabric, and the back sheet 2C may be made of a film. As shown in FIG. 3B, the constituent members constituting the absorbent article 2 are adhered by a hot melt adhesive.
  • the transport path 35 is a path for the material 5 for the absorbent article 2.
  • the transport path 35 may be defined by, for example, a transport belt on which the material 5 is placed, a transport belt, a transport roller that moves the material 5, or the like.
  • the coating device 40 has a discharge port 45 for discharging the adhesive HM.
  • the coating device 40 may have one discharge port 45 or may have a plurality of discharge ports 45.
  • the coating device 40 may include, for example, a contact type first coating device 41 and a non-contact type second coating device 42. At least the method of arranging the adhesive HM is different between the first coating device 41 and the second coating device 42.
  • the first coating device 41 arranges the adhesive HM on the material 5 while contacting the material 5.
  • the discharge port 45 may come into contact with the material 5, or the region near the discharge port 45 may come into contact with the material 5.
  • the first coating device 41 is a device for arranging the adhesive HM on the material 5 by, for example, coating with a coater or coating with a roll coater.
  • the second coating device 42 arranges the adhesive HM on the material 5 without contacting the material 5.
  • the second coating device 42 is a device for arranging the adhesive HM on the material 5 by, for example, omega coating or spiral coating.
  • the discharge port 45 may be separated from the material 5 by, for example, 5 mm or more.
  • the discharge port 45 does not have to be separated from the material 5 by 50 mm or more so as not to reduce the accuracy of the position where the adhesive HM is applied.
  • the coating device 40 may be composed of a plurality of coating devices 40 in which at least one of the method of arranging the adhesive HM and the pattern of arranging the adhesive HM is different. Therefore, the production line device 10 may have a plurality of coating devices 40.
  • the production line device 10 may have a plurality of first coating devices 41, or may have a plurality of second coating devices 42.
  • the production line device 10 shown in FIG. 1 includes five first coating devices 41 and four second coating devices 42.
  • the shape of the arrangement area where the adhesive HM is arranged is different.
  • the arrangement pattern of the adhesive HM may be different due to the difference in length in the transport direction MD and / or the cross direction CD intersecting the transport direction MD in which the material 5 is transported. Therefore, even if the same arrangement method is used, for example, the width of the arrangement area, that is, the arrangement pattern may be different due to the difference in the width of the coating device 40. Further, for example, the length of the arrangement region, that is, the arrangement pattern may be different depending on the time for the coating device 40 to continuously arrange the adhesive HM.
  • the coating device 40 may be arranged at an upstream point in the transport direction MD before the confluence point of the material 5. At the confluence of the materials 5, the materials 5 are joined together by the adhesive HM.
  • the coating device 40 may be fixed to the wall portion 8.
  • the plurality of coating devices 40 may be arranged scattered on the production line device 10. In the length direction X, the distance from the coating device 40 located on the onemost end side in the length direction X of the production line device 10 to the coating device 40 located on the one end side is 15 m or more. It's okay. Further, the distance from the coating device 40 located on the uppermost side of the production line device 10 to the floor may be 2 m or more. The distance from the coating device 40 located on the uppermost side of the production line device 10 to the coating device 40 located on the lowermost side may be 1 m or more.
  • the coating device 40 may be movable away from the transport path 35 of the material 5.
  • the coating device 40 may be rotated 90 degrees around a support shaft 41C extending in the width direction Y so as to be separated from the transport path 35.
  • the transport path 35 may be moved so that the coating device 40 is separated from the transport path 35.
  • the transport roller may move away from the coating device 40.
  • both the coating device 40 and the transport path 35 may move. Even if there is no space for the wiping device 50 to enter between the transport path 35 and the coating device 40 during the transfer of the material 5, at least one of the coating device 40 and the transport path 35 moves to wipe the material 5. It is possible to generate a space for 50 to enter.
  • the wiping device 50 has a wiping portion 55 that wipes off the deposits adhering to the coating device 40, and a support portion 56 that supports the wiping portion 55.
  • the deposits are adhesive HM, fibers generated from the material, and the like. Since the fibers are adhered by the adhesive HM, deposits are likely to adhere to the coating device 40, particularly around the discharge port 45.
  • the wiping unit 55 automatically wipes off the deposits by moving while contacting the coating device 40.
  • the wiping portion 55 automatically wipes off the adhered matter by moving on a predetermined area (hereinafter, wiping area WA) in the coating device 40.
  • the wiping area WA is, for example, an area including at least the discharge port 45.
  • the wiping area WA may include a portion on the upstream side of the transport direction MD from the discharge port 45 and a portion on the downstream side of the discharge port 45.
  • the portion on the upstream side of the transport direction MD from the discharge port 45 and the portion on the downstream side from the discharge port 45 may be a part of the coating device 40. That is, the wiping portion 55 wipes off the deposits adhering to the coating device 40, and the wiping target area is a certain range on the coating device 40 including not only the discharge port 45 but also the periphery of the discharge port 45.
  • the wiping portion 55 may be any as long as it can wipe off the adhered matter, and may be, for example, a plate shape (that is, a scraper), a columnar shape, a cloth shape (waste), a brush shape, or the like.
  • a plate shape that is, a scraper
  • the plate-shaped wiping portion moves along the flat surface to wipe off the deposits.
  • the non-contact type second coating device 42 has a nozzle-shaped discharge port 45
  • the wiping portion 55 may be cloth-shaped or brush-shaped so as not to damage the nozzle.
  • a wiping portion 55 is fixed to the support portion 56.
  • the wiping portion 55 is fixed to the supporting portion by, for example, a fastening member such as a bolt and a nut.
  • the wiping portion 55 automatically moves with the movement of the support portion 56.
  • the movement of the support unit 56 is controlled by the control unit 20.
  • the wiping device 50 may be composed of a plurality of wiping devices 50 in order to wipe off deposits from each of the plurality of coating devices 40. As shown in FIG. 2B, the number of wiping devices 50 may correspond to the number of coating devices 40.
  • the wiping device 50 may have a first wiping device 51 and a second wiping device 52.
  • the first wiping device 51 is a device that wipes off the deposits adhering to the contact type first coating device 41.
  • the second wiping device 52 is a device that wipes off the deposits adhering to the non-contact type second coating device 42.
  • the number of the first coating device 41 and the number of the first wiping device 51 may correspond to each other, and the number of the second coating device 42 and the number of the second wiping device 52 may correspond to each other.
  • one wiping device 50 may wipe off the deposits of one coating device 40, and the wiping device 50 does not need to wipe a plurality of coating devices 40.
  • the first wiping device 51 has a plate-shaped wiping portion 55.
  • the wiping portion 55 may have a shape that matches the wiping area WA.
  • the wiping portion 55 may have a concave portion in contact with the coating device 40.
  • the wiping portion 55 may be located in the safety area SA during the transportation of the material 5.
  • the predetermined distance D from the first coating device 41 to the safety area SA may be, for example, 50 cm or more.
  • the width direction Y the direction from the center of the production line device 10 toward the wall portion 8 is referred to as the first width direction Y1
  • the direction from the center of the production line device 10 toward the safety cover 100 is referred to as the second width direction Y2.
  • the wiping portion 55 moves in the first width direction Y1 during the stop period during which the transportation of the material 5 is stopped.
  • the wiping portion 55 moves to one end of the wiping region WA in the width direction Y (specifically, the end on the wall 8 side).
  • the wiping portion 55 moves downward in the height direction Z and comes into contact with the first coating device 41.
  • the wiping portion 55 moves in the second width direction Y2 while being in contact with the first coating device 41.
  • the wiping portion 55 moves to the other end of the wiping region WA in the width direction Y (specifically, the end on the safety cover 100 side).
  • the wiping unit 55 can automatically wipe off the deposits adhering to the first coating device 41.
  • the wiping portion 55 moves upward in the height direction Z and separates from the first coating device 41. After wiping off the deposits, the wiping portion 55 moves toward the second width direction Y2, that is, the safety cover 100.
  • the wiping section 55 moves to the safety area SA.
  • the second wiping device 52 has a columnar wiping portion 55.
  • the wiping portion 55 may rotate about an axis C orthogonal to the moving direction (width direction Y in FIG. 8) while being in contact with the second coating device 42.
  • the axis C may be parallel to the length direction X.
  • the wiping portion 55 may be located in the safety area SA during the transportation of the material 5.
  • the predetermined distance D from the second coating device 42 to the safety area SA may be, for example, 50 cm or more.
  • the wiping portion 55 moves in the first width direction Y1 during the stop period during which the transportation of the material 5 is stopped.
  • the wiping portion 55 moves upward in the height direction Z.
  • the wiping portion 55 moves to one end of the wiping region WA in the width direction Y (specifically, the end on the safety cover 100 side).
  • the wiping portion 55 moves in the first width direction Y1 while contacting the second coating device 42.
  • the wiping unit 55 can automatically wipe off the deposits adhering to the second coating device 42.
  • the wiping portion 55 may further wipe off the deposits by moving while rotating around the shaft C.
  • the wiping portion 55 moves downward in the height direction Z and separates from the second coating device 42. After wiping off the deposits, the wiping portion 55 moves toward the second width direction Y2, that is, the safety cover 100. The wiping section 55 moves to the safety area SA.
  • the wiping portion 55 may be wiped a plurality of times without moving to the safety area SA after wiping once. That is, the wiping portion 55 may move to the position shown in FIG. 6B and repeat the wiping operation a plurality of times (for example, three times).
  • the control unit 20 is a control device that controls the wiping device 50.
  • the control unit 20 includes a processor and a memory.
  • the memory stores a program executed by the processor and information used for processing by the processor.
  • the processor includes a CPU (Central Processing Unit).
  • the CPU performs various processes described later by executing a program stored in the memory.
  • the control unit 20 may include a user interface.
  • the user interface is an interface with the operator and includes, for example, a display, a microphone, a speaker, and various buttons. The user interface can accept an operation from the user and output a signal indicating the content of the operation to the processor.
  • control unit 20 may control devices other than the wiping device 51 constituting the manufacturing device 1.
  • the control unit 20 may be able to control the manufacturing method of the absorbent article 2 described later by, for example, an operator's input and / or a program.
  • the manufacturing method of the absorbent article 2 may be controlled by a control unit different from the control unit 20 that controls the wiping device 51. In the following manufacturing method of the absorbent article 2, the control unit 20 will be described as controlling various operations.
  • FIGS. 9 and 10 are sequence diagrams for explaining a method for producing an absorbent article. As shown in FIG. 9, the method for producing an absorbent article according to the embodiment may include steps S10 to S80.
  • Step S10 is a step of producing the absorbent article 2.
  • Step S10 includes, for example, a step of transporting the material 5, a step of arranging the adhesive HM on the material 5, a step of joining the materials 5, a step of cutting the material 5, a step of assembling an absorbent article, and the like. It's okay.
  • Step S10 may include other steps necessary for producing the absorbent article 2.
  • the adhesive HM is arranged by using the coating device 40 during the transportation of the material 5.
  • Step S20 is a step of stopping the production of the absorbent article 2.
  • the suspension period in which the transportation of the material 5 is suspended begins.
  • the suspension period may be a scheduled suspension period scheduled in advance, or may be an emergency suspension period in which suspension is determined during transportation of the material 5.
  • the suspension period may include a scheduled suspension period and an emergency suspension period.
  • the scheduled suspension period may be a period during which production is suspended even though no trouble has occurred in each process in the production process S10.
  • the emergency stop period may be a period during which production is stopped due to a trouble in at least one of the steps in the production step S10.
  • the emergency stop period may be a period during which the production of the absorbent article 2 is stopped because the wiping step S40 has not been performed for a certain period (for example, 4 hours or more).
  • Step S30 is a step in which at least one of the coating device 40 and the transport path 35 moves.
  • Step S40 is a step of automatically wiping off the deposits (wiping step S40) using the wiping device 50 during the stop period.
  • the wiping portion 55 may automatically wipe off the deposits while moving toward the safety cover 100.
  • the deposit may be wiped off in the wiping area WA including the portion on the upstream side of the discharge port and the portion on the downstream side of the discharge port 45 in the transport direction MD. Further, the adhered matter may be automatically wiped off in a state where the solidified adhesive HM is attached to the wiping portion 55.
  • the adhesive HM fixed to the wiping portion 55 may be adhered by not removing the adhering matter adhering to the wiping portion 55.
  • the adhesive HM may be attached to the wiping portion 55 by maintenance of the wiping portion 55.
  • the wiping device 51 may automatically wipe off the deposits using the plate-shaped wiping portion 55.
  • the wiping device 51 may automatically wipe off the deposits using a cloth-like or brush-like wiping portion 55 having low rigidity.
  • the operating times for wiping the deposits may overlap.
  • a plurality of wiping devices 50 may start wiping at the same time.
  • the wiping start times of the plurality of wiping devices 50 may be staggered so that the wiping ends of the plurality of wiping devices 50 are at the same time.
  • the wiping device 50 having a long wiping time may have an early wiping start time
  • the wiping device 50 having a short wiping time may have a late wiping start time. From the plurality of wiping devices 50, the wiping device 50 that wipes off the deposits during the stop period may be selected. The method of selecting the wiping device 50 will be described later.
  • the step S50 is a step in which the wiping portion 55 is automatically moved after the wiping step S40 to a position where the operator can maintain the wiping portion 55 during the transportation of the material 5 after the wiping step S40 (moving step S50).
  • the wiping section 55 may automatically move the deposits toward the safety cover 100.
  • the safe location may be the safety area SA.
  • the safe position may be, for example, a position separated from the production line device 10 by a predetermined distance D or more. The operator can maintain the wiping portion 55 from above the production line device 10.
  • Step S60 is a step of restarting the production of the absorbent article 2.
  • Step S60 may have the following steps in addition to each step of step S10.
  • Step S60 may include a step of maintaining the wiping device 50. As maintenance of the wiping device 50, for example, the deposits may be removed from the wiping portion 55, or the wiping portion 55 may be replaced.
  • Step S60 may include a step of assembling a predetermined absorbent article 2 and a step of discarding the predetermined absorbent article 2.
  • the predetermined absorbent article 2 is assembled using a predetermined material in which the adhesive HM is arranged between the end of the suspension period and the elapse of the predetermined period. Therefore, the absorbent article 2 assembled after the predetermined period has elapsed using the predetermined material on which the adhesive HM is arranged by the coating device 40 during the predetermined period is also the predetermined absorbent article 2.
  • the predetermined period is a period until the application of the adhesive HM stabilizes after wiping, for example, about 30 seconds.
  • All the absorbent articles 2 assembled during a certain period of time from a predetermined period may be discarded, or a material in which the adhesive HM is arranged during the predetermined period from the assembled absorbent articles 2 may be used.
  • the predetermined absorbent article 2 assembled in the process may be selected and discarded.
  • the predetermined absorbent article 2 may be selected from the position of the coating device 40 and the transport speed.
  • Step S70 is a step of stopping the production of the absorbent article 2.
  • Step S70 is the same step as step S20.
  • the production of the absorbent article 2 is terminated in the step S80.
  • the step S30 is executed.
  • the wiping device 50 by automatically wiping off the deposits using the wiping device 50, fluctuations in the wiping time of the deposits can be suppressed as compared with the case where the operator wipes off the deposits. As a result, the preliminary time included in the suspension period can be shortened, and the suspension period can be shortened. Since the wiping device 50 wipes off the deposits instead of the workers, it is not necessary to hire many workers for wiping, and the increase in operating cost can be suppressed. Therefore, according to the method for manufacturing the absorbent article 2 according to the embodiment, it is possible to increase the productivity of the absorbent article 2 by shortening the suspension period of the transportation of the material 5 while suppressing the increase in the operating cost. it can.
  • the wiping portion 55 automatically moves to a safe position after the wiping step S40, the wiping portion can be maintained without stopping the transportation of the material 5.
  • the maintenance of the wiping portion 55 is inadequate (for example, the wiping portion 55 cannot be wiped well due to wear, or the wiping portion 55 has too much deposit, and the wiped deposit adheres to the coating device 40 again). It is possible to reduce the resulting stoppage of transportation of the material 5 and suppress the occurrence of defective products.
  • the wiping portion 55 automatically moves toward the safety cover 100. This makes it easier for the operator to access a safe position from the passage area PA, and can reduce the time required for maintenance of the wiping portion 55. For example, the operator does not have to perform maintenance on the wiping unit 55 during the stop period. As a result, the labor cost for the maintenance of the wiping unit 55 can be reduced, and the increase in the operating cost can be suppressed.
  • the wiping portion 55 moves toward the safety cover 100 and automatically wipes off the adhered matter.
  • the distance that the wiping portion 55 automatically moves toward the safety cover 100 after wiping can be shortened.
  • the time for the wiping portion 55 to move to a safe position can be shortened, and the stop period can be shortened.
  • the suspension period includes a scheduled suspension period scheduled in advance and an emergency suspension period in which suspension is determined during transportation of the material. Since the deposits can be wiped off during the planned stop period and the emergency stop period, it is possible to suppress the generation of defective products due to the deposits adhering to the coating device 40 and increase the productivity of the absorbent article 2. it can.
  • the operating times of the plurality of wiping devices 50 overlap.
  • the time from the start to the end of wiping of the plurality of coating devices 40 can be shortened as compared with the case where another wiping device 50 starts wiping after the wiping of one wiping device 50 is completed. It can be done and the suspension period can be shortened.
  • the adhered matter is automatically wiped off with the solidified adhesive HM adhering to the wiping portion 55.
  • the adhesion of the solidified hot melt adhesive makes it easier for the deposits adhering to the coating device to adhere to the wiping portion 55.
  • the deposits can be firmly wiped off from the coating device 40.
  • the deposits are wiped off in the region including the discharge port 45, the portion on the upstream side of the discharge port 45 in the transport direction MD, and the portion on the downstream side of the discharge port.
  • the adhesive HM adhere to the discharge port 45 from which the adhesive HM is discharged, but also the adhesive HM bounces off the material 5 when the adhesive HM is placed, or the adhesive HM drips, causing the adhesive HM to be discharged. It may adhere around the outlet 45.
  • the wiping device 50 automatically wipes off the adhered matter by using the plate-shaped wiping portion 55.
  • the plate-shaped wiping portion 55 can be wiped off so as to scrape off the deposits adhering to the coating device 40, as compared with the case where the wiping portion is a cloth such as a waste cloth.
  • the amount of deposits left after wiping can be reduced, and the occurrence of defective products can be further suppressed.
  • At least one of the coating device 40 and the transport path 35 is moved so that the coating device 40 is separated from the transport path 35 of the material 5 before the wiping step S40.
  • the coating device 40 and the material 5 By moving at least one of the transport paths 35, a space is generated between the transport path 35 and the coating device 40.
  • the wiping device 50 can be used for wiping, so that the occurrence of defective products can be further suppressed.
  • the coating device 40 may not be able to stably arrange the adhesive HM until a predetermined period has elapsed after wiping.
  • the predetermined absorbent article 2 produced by arranging the adhesive HM during the predetermined period the occurrence of defective products can be suppressed.
  • the method for producing the absorbent article 2 may include steps S110 to S140.
  • step S110 the control unit 20 determines whether or not the production of the absorbent article 2 has been stopped. If the production is not stopped, that is, if the process of step S10 or step S60 is being performed, the step S110 is repeated. On the other hand, when the production of the absorbent article 2 is stopped, the step S120 is performed.
  • step S120 the wiping device 50 that wipes off the deposits during the stop period is selected.
  • the control unit 20 can select the wiping device 50 according to the following criteria. Since the selected wiping device 50 wipes, the operating cost can be reduced as compared with the case where all the wiping devices 50 are operated for each stop period.
  • the wiping device 50 may be selected according to the elapsed time from the last wiping for each coating device 40. For example, the wiping device 50 in which the elapsed time from the last wiping is equal to or longer than a predetermined value may be selected. It is not necessary to select the wiping device 50 in which the elapsed time from the last wiping is less than a predetermined value. As time elapses from wiping, deposits adhere to the coating device 40. By selecting according to the elapsed time from the last wiping, the coating device 40 that requires wiping can be appropriately selected.
  • the wiping device 50 may be selected according to the degree of dirt on the coating device 40 due to at least one of the arrangement method and the arrangement pattern of the adhesive HM.
  • the degree of contamination of the coating device 40 varies depending on the arrangement method and arrangement pattern of the adhesive HM.
  • the frequency of selecting the first wiping device 51 may be higher than the frequency of selecting the second wiping device 52.
  • the longer the time for the coating device 40 to discharge the adhesive HM the easier it is to get dirty. Therefore, the wiping device 50 that wipes off the coating device 40 that takes a long time to discharge the adhesive HM may be preferentially selected.
  • step S30 to step S50 may be omitted.
  • all wiping devices 50 may be selected. For example, during the scheduled outage period, all wiping devices 50 may be selected.
  • step S130 the stop period is adjusted according to the wiping time from the start to the end of wiping by the selected wiping device 50.
  • the suspension period can be shortened according to the wiping time, so that the productivity of the absorbent article can be increased.
  • the total time of the longest wiping time and the preliminary time may be set as the stop period.
  • the optimum stop period can be set for each stop period.
  • automatic wiping is performed using the selected wiping device 50.
  • step S140 the selected wiping device 50 executes the operation of step S30.

Abstract

Provided is a manufacturing method for an absorbent article, the method including a wiping step for, during a stop period in which transport of a material is stopped, wiping off an adhered substance adhered to an application device, wherein the method is capable of increasing the production efficiency of the absorbent article while suppressing an increase in the operating costs. The present invention provides a method for manufacturing an absorbent article (1), the method including: a step for placing, while transporting a material (5) for the absorbent article (1), an adhesive (HM) on the material (5) by using an application device (40) having a discharge port (45) from which the adhesive (HM) is discharged; and a step (S40) for wiping off, during a stop period in which transport of the material (5) is stopped, an adhered substance adhered to the application device (40). In the wiping step (S40), the adhered substance is automatically wiped off during the stop period by using a wiping device (50) that has a wiping part (55) for wiping off the adhered substance.

Description

吸収性物品の製造方法Manufacturing method of absorbent articles
 本発明は、資材の搬送が停止されている停止期間中に塗布装置に付着した付着物を拭き取る拭取工程を備えた吸収性物品の製造方法に関する。 The present invention relates to a method for producing an absorbent article, which comprises a wiping step of wiping off the deposits adhering to the coating device during the stop period when the transportation of the material is stopped.
 従来、吸収性物品を製造するために、吸収性物品用の資材の搬送中に、塗布装置を用いて、当該資材にホットメルト接着剤を配置することが広く知られている(例えば、特許文献1参照)。ホットメルト接着剤が配置された資材を別の資材とホットメルト接着剤を介して接合することで、吸収性物品を製造していた。 Conventionally, in order to produce an absorbent article, it is widely known that a hot melt adhesive is placed on the material by using a coating device during transportation of the material for the absorbent article (for example, Patent Document). 1). An absorbent article was manufactured by joining a material on which a hot melt adhesive was placed to another material via a hot melt adhesive.
 塗布装置には、ホットメルト接着剤が冷えることによって固化したホットメルト接着剤が付着したり、ホットメルト接着剤を介して資材に含まれる繊維等が付着したりすることがある。塗布装置に付着物が付着し続けていると、ホットメルト接着剤を資材にムラなく配置できなくなる虞があった。そこで、作業者が、塗布装置に付着した付着物を拭き取ることで、塗布装置から付着物を除去して、不良品の発生を抑制していた。 The hot melt adhesive solidified due to the cooling of the hot melt adhesive may adhere to the coating device, or the fibers contained in the material may adhere to the coating device via the hot melt adhesive. If the deposits continue to adhere to the coating device, there is a risk that the hot melt adhesive cannot be evenly placed on the material. Therefore, the operator wipes off the deposits adhering to the coating device to remove the deposits from the coating device and suppresses the occurrence of defective products.
 作業者が付着物を拭き取る操作は、作業者の安全のために、資材の搬送が停止されている停止期間中に行われている。作業者が塗布装置に付着した付着物を実際に拭き取るために必要な時間は、作業者の体調及び作業者の個人差によって変わってくる。停止期間を短くしすぎると、作業者が付着物を拭き取る前に、資材の搬送が開始(再開)することがある。この場合、作業者の安全性を十分に確保できないおそれがあったり、付着物の拭き取りが完了していない状態で塗布装置がホットメルト接着剤の配置を開始(再開)したりするため、作業者が余裕を持って拭き取りを完了できるように、予備的な時間を含む停止期間を設定していた。 The operation of the worker wiping off the deposits is performed during the stop period when the transportation of materials is stopped for the safety of the worker. The time required for the operator to actually wipe off the deposits adhering to the coating device varies depending on the physical condition of the operator and individual differences of the operator. If the outage period is too short, material transport may start (restart) before the operator wipes off the deposits. In this case, the safety of the operator may not be sufficiently ensured, or the coating device may start (restart) the arrangement of the hot melt adhesive before the wiping of the deposits is completed. A stop period was set, including a preliminary time, so that the wipe could be completed with a margin.
特開2018-94852号公報Japanese Unexamined Patent Publication No. 2018-94852
 しかしながら、予備的な時間を考慮して停止期間を長く設定した場合、吸収性物品の生産性が低下してしまう。吸収性物品の生産性を高めるために、多くの作業者によって短時間に拭き取りを行うことで、停止期間を短くすることができるものの、吸収性物品を製造するための運用コストが人件費によって増加するという問題があった。 However, if the suspension period is set long in consideration of the preliminary time, the productivity of the absorbent article will decrease. Although the downtime can be shortened by wiping in a short time by many workers in order to increase the productivity of absorbent goods, the operating cost for manufacturing absorbent goods increases due to labor costs. There was a problem of doing.
 そこで、資材の搬送が停止されている停止期間中に塗布装置に付着した付着物を拭き取る拭取工程を備えた吸収性物品の製造方法であって、運用コストの増加を抑制しつつ、吸収性物品の生産性を高めることが可能である吸収性物品の製造方法が望まれている。 Therefore, this is a method for manufacturing an absorbent article having a wiping step of wiping off the deposits adhering to the coating device during the stop period when the transportation of the material is stopped, and is absorbent while suppressing an increase in operating cost. A method for producing an absorbent article that can increase the productivity of the article is desired.
 一態様に係る吸収性物品の製造方法では、吸収性物品用の資材の搬送中に、前記ホットメルト接着剤を吐出する吐出口を有する塗布装置を用いて、前記ホットメルト接着剤を前記資材に配置する工程と、前記資材の搬送が停止されている停止期間中に、前記塗布装置に付着した付着物を拭き取る工程と、を有する吸収性物品の製造方法である。前記拭き取る工程では、前記停止期間中に、前記付着物を拭き取る拭き取り部を有する拭き取り装置を用いて、前記吐出口を含む領域において前前記付着物を自動的に拭き取る。 In the method for producing an absorbent article according to one aspect, the hot melt adhesive is applied to the material by using a coating device having a discharge port for discharging the hot melt adhesive during transportation of the material for the absorbent article. It is a method for producing an absorbent article having a step of arranging the material and a step of wiping off the deposits adhering to the coating device during the stop period during which the transportation of the material is stopped. In the wiping step, the front adhering matter is automatically wiped off in the area including the discharge port by using a wiping device having a wiping portion for wiping off the adhering matter during the stopping period.
図1は、製造ライン装置10の一例を示す側面図である。FIG. 1 is a side view showing an example of the production line apparatus 10. 図2Aは、製造ライン装置10が配置される場所の一例を示す上面図である。図2Bは、吸収性物品の製造装置1の一部を説明するためのシステム構成図である。FIG. 2A is a top view showing an example of a place where the production line device 10 is arranged. FIG. 2B is a system configuration diagram for explaining a part of the absorbent article manufacturing apparatus 1. 図3Aは、吸収性物品2の一例を説明するための分解斜視図である。図3Bは、図3AにおけるF3B-F3B線における断面図である。FIG. 3A is an exploded perspective view for explaining an example of the absorbent article 2. FIG. 3B is a cross-sectional view taken along the line F3B-F3B in FIG. 3A. 図4は、第1拭き取り装置の一例を示す図である。FIG. 4 is a diagram showing an example of the first wiping device. 図5は、第1拭き取り装置の拭き取りの動作を説明するための図である。FIG. 5 is a diagram for explaining the wiping operation of the first wiping device. 図6は、第1拭き取り装置の拭き取りの動作を説明するための図である。FIG. 6 is a diagram for explaining the wiping operation of the first wiping device. 図7は、第2拭き取り装置の一例を示す図である。FIG. 7 is a diagram showing an example of the second wiping device. 図8は、第2拭き取り装置の拭き取りの動作を説明するための図である。FIG. 8 is a diagram for explaining the wiping operation of the second wiping device. 図9は、吸収性物品の製造方法を説明するためのシーケンス図である。FIG. 9 is a sequence diagram for explaining a method for producing an absorbent article. 図10は、吸収性物品の製造方法を説明するためのシーケンス図である。FIG. 10 is a sequence diagram for explaining a method for producing an absorbent article.
 (1)実施形態の概要
 本明細書及び添付図面の記載により、少なくとも以下の事項が明らかとなる。
 一態様に係る吸収性物品の製造方法では、吸収性物品用の資材の搬送中に、前記ホットメルト接着剤を吐出する吐出口を有する塗布装置を用いて、前記ホットメルト接着剤を前記資材に配置する工程と、前記資材の搬送が停止されている停止期間中に、前記塗布装置に付着した付着物を拭き取る工程と、を有する吸収性物品の製造方法である。前記拭き取る工程では、前記停止期間中に、前記付着物を拭き取る拭き取り部を有する拭き取り装置を用いて、前記吐出口を含む領域において前記付着物を自動的に拭き取る。本態様によれば、拭き取り装置を用いて付着物を自動的に拭き取ることで、作業者が拭き取る場合と比較して、付着物の拭き取り時間の変動が抑えられる。これにより、停止期間に含まれる予備的な時間を短くすることができ、停止期間を短縮することができる。作業者の代わりに拭き取り装置が付着物を拭き取るため、拭き取りのために多くの作業者を雇う必要がなく、運用コストの増加を抑制できる。以上より、本態様に係る吸収性物品の製造方法によれば、運用コストの増加を抑制しつつ、資材の搬送の停止期間を短くすることで、吸収性物品の生産性を高めることができる。
(1) Outline of Embodiment At least the following matters will be clarified by the description of this specification and the accompanying drawings.
In the method for producing an absorbent article according to one aspect, the hot melt adhesive is applied to the material by using a coating device having a discharge port for discharging the hot melt adhesive during transportation of the material for the absorbent article. It is a method for producing an absorbent article having a step of arranging the material and a step of wiping off the deposits adhering to the coating device during the stop period during which the transportation of the material is stopped. In the wiping step, the deposits are automatically wiped off in the region including the discharge port by using a wiping device having a wiping portion for wiping the deposits during the stop period. According to this aspect, by automatically wiping off the deposits using the wiping device, fluctuations in the wiping time of the deposits can be suppressed as compared with the case where the operator wipes off the deposits. As a result, the preliminary time included in the suspension period can be shortened, and the suspension period can be shortened. Since the wiping device wipes off the deposits instead of the workers, it is not necessary to hire many workers for wiping, and the increase in operating cost can be suppressed. From the above, according to the method for producing an absorbent article according to this aspect, the productivity of the absorbent article can be increased by shortening the suspension period of the transportation of the material while suppressing the increase in the operating cost.
 好ましい一態様によれば、前記吸収性物品の製造方法は、前記拭き取り工程後の前記資材の搬送中に前記拭き取り部を作業者がメンテナンスできる安全な位置まで、前記拭き取る工程後に前記拭き取り部が自動的に移動する工程を有する。拭き取り工程後に、拭き取り部が自動的に安全な位置まで移動するため、資材の搬送を停止せずに、拭き取り部をメンテナンスすることができる。その結果、拭き取り部のメンテナンス不備に起因した資材の搬送の停止を低減したり、不良品の発生を抑制したりすることができる。 According to a preferred embodiment, in the method of manufacturing the absorbent article, the wiping portion is automatically operated after the wiping step to a safe position where an operator can maintain the wiping portion during transportation of the material after the wiping step. It has a step of moving in a target manner. After the wiping process, the wiping part automatically moves to a safe position, so that the wiping part can be maintained without stopping the transportation of materials. As a result, it is possible to reduce the suspension of material transportation due to inadequate maintenance of the wiping portion and suppress the occurrence of defective products.
 好ましい一態様によれば、前記資材を搬送する搬送路と前記作業者が通る通路エリアとの間には、前記資材の搬送中に前記資材への接触を防ぐための安全カバーが設けられており、前記移動する工程では、前記付着物を拭き取った後に、前記拭き取り部が前記安全カバーの方へ自動的に移動する。これにより、搬送路と通路エリアとの間に安全カバーが設けられているため、拭き取り部が安全カバーの方へ近づくことで、拭き取り部が搬送路から離れて通路エリアに近づく。従って、作業者が、通路エリアから安全な位置へアクセスし易くなり、拭き取り部のメンテナンスを行うための時間を低減することができる。その結果、拭き取り部のメンテナンスにかける人件費を減少でき、運用コストの増加を抑制できる。 According to a preferred embodiment, a safety cover is provided between the transport path for transporting the material and the passage area through which the worker passes to prevent contact with the material during transport of the material. In the moving step, after wiping the deposits, the wiping portion automatically moves toward the safety cover. As a result, since the safety cover is provided between the transport path and the aisle area, the wiped portion moves toward the safety cover, so that the wiped portion separates from the transport path and approaches the aisle area. Therefore, it becomes easier for the operator to access a safe position from the aisle area, and the time for performing maintenance of the wiping portion can be reduced. As a result, the labor cost for the maintenance of the wiping part can be reduced, and the increase in the operating cost can be suppressed.
 好ましい一態様によれば、前記拭き取る工程では、前記拭き取り部が、前記安全カバーの方へ移動しながら、前記付着物を自動的に拭き取る。拭き取り部が、拭き取った後に安全カバーの方へ自動的に移動する距離を短くすることができる。これにより、拭き取り部が安全な位置まで移動する時間を短縮することができ、停止期間を短縮することができる。 According to a preferred embodiment, in the wiping step, the wiping portion automatically wipes off the deposits while moving toward the safety cover. The distance that the wiping section automatically moves toward the safety cover after wiping can be shortened. As a result, the time for the wiping portion to move to a safe position can be shortened, and the stop period can be shortened.
 好ましい一態様によれば、前記停止期間は、事前にスケジュールされている予定停止期間と、前記資材の搬送中に停止が決定された緊急停止期間と、を含む。予定停止期間と、緊急停止期間とで、付着物を拭き取ることができるため、塗布装置に付着した付着物に起因した不良品の発生を抑制し、吸収性物品の生産性を高めることができる。 According to a preferred embodiment, the suspension period includes a scheduled suspension period scheduled in advance and an emergency suspension period determined to be suspended during the transportation of the material. Since the deposits can be wiped off during the scheduled stop period and the emergency stop period, it is possible to suppress the generation of defective products due to the deposits adhering to the coating device and increase the productivity of the absorbent article.
 好ましい一態様によれば、前記塗布装置は、前記ホットメルト接着剤の配置方法及び前記ホットメルト接着剤の配置パターンの少なくとも一方が異なる複数の塗布装置により構成されており、前記拭き取り装置は、前記複数の塗布装置のそれぞれから前記付着物を拭き取るために複数の拭き取り装置により構成されており、前記拭き取る工程では、前記複数の拭き取り装置が前記付着物を拭き取る稼働時間が重複している。これにより、1つの拭き取り装置の拭き取りが終了した後に、別の拭き取り装置が拭き取りを開始する場合と比べると、複数の塗布装置の拭き取りを開始から終了するまでの時間を短くすることができ、停止期間を短縮することができる。 According to a preferred embodiment, the coating device is composed of a plurality of coating devices in which at least one of the hot melt adhesive arranging method and the hot melt adhesive arranging pattern is different, and the wiping device is the wiping device. It is composed of a plurality of wiping devices for wiping the deposits from each of the plurality of coating devices, and in the wiping step, the operating times of the plurality of wiping devices for wiping the deposits overlap. As a result, the time from the start to the end of wiping of a plurality of coating devices can be shortened as compared with the case where another wiping device starts wiping after the wiping of one wiping device is completed, and the operation is stopped. The period can be shortened.
 好ましい一態様によれば、前記複数の拭き取り装置の中から、前記停止期間中に前記付着物を拭き取る拭き取り装置を選択する工程を有する。選択された拭き取り装置が拭き取るため、停止期間毎に全ての拭き取り装置を稼働する場合と比較して、運用コストを低減することができる。 According to a preferred embodiment, there is a step of selecting a wiping device that wipes off the deposits during the stop period from the plurality of wiping devices. Since the selected wiping device wipes, the operating cost can be reduced as compared with the case where all the wiping devices are operated for each stop period.
 好ましい一態様によれば、前記選択する工程では、前記ホットメルト接着剤の前記配置方法及び前記配置パターンの少なくとも一方に起因した前記塗布装置の汚れ具合に応じて、前記拭き取り装置を選択する。ホットメルト接着剤の配置方法及び配置パターンによって、塗布装置の汚れ具合が変わってくる。塗布装置の汚れ具合に応じて選択することで、拭き取りが必要な塗布装置を適切に選択することができる。 According to a preferred embodiment, in the selection step, the wiping device is selected according to the degree of contamination of the coating device due to at least one of the arrangement method and the arrangement pattern of the hot melt adhesive. The degree of contamination of the coating device varies depending on the arrangement method and arrangement pattern of the hot melt adhesive. By selecting according to the degree of dirt on the coating device, it is possible to appropriately select the coating device that needs to be wiped off.
 好ましい一態様によれば、前記選択する工程では、前記塗布装置毎の最後の拭き取りからの経過時間に応じて、前記拭き取り装置を選択する。拭き取りから時間が経過するほど、塗布装置に付着物が付着する。最後の拭き取りからの経過時間に応じて選択することで、拭き取りが必要な塗布装置を適切に選択することができる。 According to a preferred embodiment, in the selection step, the wiping device is selected according to the elapsed time from the last wiping for each coating device. As time passes after wiping, deposits adhere to the coating device. By selecting according to the elapsed time from the last wiping, it is possible to appropriately select the coating device that requires wiping.
 好ましい一態様によれば、前記選択された拭き取り装置が拭き取りを開始してから終了するまでの拭き取り時間に応じて、前記停止期間を調整する。これにより、拭き取り時間に応じて停止期間を短縮することも可能であるため、吸収性物品の生産性を高めることができる。 According to a preferred embodiment, the stop period is adjusted according to the wiping time from the start to the end of the wiping by the selected wiping device. As a result, the suspension period can be shortened according to the wiping time, so that the productivity of the absorbent article can be increased.
 好ましい一態様によれば、前記拭き取る工程では、固化したホットメルト接着剤が前記拭き取り部に付着した状態で、前記付着物を自動的に拭き取る。固化したホットメルト接着剤の粘着によって、塗布装置に付着した付着物が拭き取り部に付着し易くなる。これにより、塗布装置から付着物をしっかりと拭き取ることができる。拭き残された付着物を減少することで、不良品の発生をさらに抑制できる。 According to a preferred embodiment, in the wiping step, the adhered matter is automatically wiped off with the solidified hot melt adhesive adhering to the wiping portion. The adhesion of the solidified hot melt adhesive makes it easier for the deposits adhering to the coating device to adhere to the wiping portion. As a result, the deposits can be firmly wiped off from the coating device. By reducing the deposits left on the wipe, the occurrence of defective products can be further suppressed.
 好ましい一態様によれば、前記拭き取る工程では、前記吐出口に加えて、前記資材が搬送される搬送方向における前記吐出口よりも上流側の部分及び前記吐出口よりも下流側の部分を含む前記領域において、前記付着物を拭き取る。ホットメルト接着剤が吐出される吐出口にホットメルト接着剤が付着するだけでなく、ホットメルト接着剤を配置する際に資材からホットメルト接着剤が跳ね返ったり、ホットメルト接着剤が垂れたりするなどにより、吐出口の周囲に付着することがある。吐出口の周囲である上流側の部分及び下流側の部分に付着した付着物も拭き取ることで、不良品の発生をさらに抑制できる。 According to a preferred embodiment, the wiping step includes, in addition to the discharge port, a portion upstream of the discharge port and a portion downstream of the discharge port in the transport direction in which the material is transported. Wipe off the deposits in the area. Not only does the hot melt adhesive adhere to the discharge port where the hot melt adhesive is discharged, but also the hot melt adhesive bounces off the material when the hot melt adhesive is placed, and the hot melt adhesive drips. Therefore, it may adhere to the periphery of the discharge port. By wiping off the deposits adhering to the upstream portion and the downstream portion around the discharge port, the occurrence of defective products can be further suppressed.
 好ましい一態様によれば、前記塗布装置が接触式の塗布装置である場合、前記拭き取り装置は、板状の前記拭き取り部を用いて、前記付着物を自動的に拭き取る。これにより、拭き取り部がウェスなどの布である場合と比較して、板状の拭き取り部は、塗布装置に付着している付着物をこそぎ取るように拭き取ることができる。拭き残された付着物を減少することができ、不良品の発生をさらに抑制できる。 According to a preferred embodiment, when the coating device is a contact-type coating device, the wiping device automatically wipes off the deposits using the plate-shaped wiping portion. As a result, the plate-shaped wiping portion can be wiped off so as to scrape off the deposits adhering to the coating device, as compared with the case where the wiping portion is a cloth such as a waste cloth. The amount of deposits left after wiping can be reduced, and the occurrence of defective products can be further suppressed.
 好ましい一態様によれば、前記停止期間中に、前記拭き取る工程の前に、前記塗布装置が前記資材の搬送路から離れるように、前記塗布装置及び前記資材の搬送路の少なくとも一方が移動する工程を有する。これにより、資材の搬送中に資材の搬送路によって、拭き取り部が拭き取るスペースがない場合であっても、塗布装置及び資材の搬送路の少なくとも一方が移動することで、資材の搬送路と塗布装置との間にスペースが発生する。これにより、拭き取り装置が拭き取ることができるため、不良品の発生をさらに抑制できる。 According to a preferred embodiment, during the stop period, at least one of the coating device and the material transport path is moved so that the coating device is separated from the material transport path before the wiping step. Has. As a result, even if there is no space for the wiping portion to wipe off due to the material transport path during material transport, at least one of the coating device and the material transport path moves, so that the material transport path and the coating device move. There is a space between and. As a result, the wiping device can be wiped off, so that the occurrence of defective products can be further suppressed.
 好ましい一態様によれば、前記停止期間が終了してから所定期間が経過するまでの間に、前記ホットメルト接着剤が配置された所定の資材を用いて、所定の吸収性物品を組み立てる工程と、前記所定の吸収性物品を廃棄する工程と、を有する。拭き取りしてから所定期間が経過するまで、塗布装置がホットメルト接着剤を安定的に配置できないことがある。所定期間中にホットメルト接着剤が配置されることで製造された所定の吸収性物品を廃棄することで、不良品の発生を抑制することができる。 According to a preferred embodiment, a step of assembling a predetermined absorbent article using a predetermined material on which the hot melt adhesive is arranged between the end of the suspension period and the elapse of the predetermined period. , A step of disposing of the predetermined absorbent article. The coating device may not be able to stably place the hot melt adhesive until a predetermined period of time has passed after wiping. By disposing of the predetermined absorbent article produced by arranging the hot melt adhesive during the predetermined period, the occurrence of defective products can be suppressed.
 (2)吸収性物品の製造装置の概略構成
 以下、図面を参照して、実施形態に係る吸収性物品の製造方法に用いられる製造装置の一例について説明する。なお、以下の図面の記載において、同一又は類似の部分には、同一又は類似の符号を付している。ただし、図面は模式的なものであり、各寸法の比率等は現実のものとは異なることに留意すべきである。したがって、具体的な寸法等は、以下の説明を参酌して判断すべきである。また、図面相互間においても互いの寸法の関係や比率が異なる部分が含まれ得る。
(2) Schematic Configuration of Absorbent Article Manufacturing Equipment Hereinafter, an example of the manufacturing equipment used in the method for producing an absorbent article according to the embodiment will be described with reference to the drawings. In the description of the drawings below, the same or similar parts are designated by the same or similar reference numerals. However, it should be noted that the drawings are schematic and the ratio of each dimension is different from the actual one. Therefore, the specific dimensions, etc. should be determined in consideration of the following explanation. In addition, there may be parts in which the relations and ratios of the dimensions of the drawings are different from each other.
 図1は、製造ライン装置10の一例を示す側面図である。なお、図1では、搬送路及び塗布装置40を中心に示しており、その他の装置、例えば、後述の拭き取り装置(第1拭き取り装置及び第2拭き取りうち)、資材を切断する装置、資材を圧搾する装置等は省略している。図2Aは、製造ライン装置10が配置される場所の一例を示す上面図である。図2Bは、吸収性物品の製造装置1の一部を説明するためのシステム構成図である。図3Aは、吸収性物品2の一例を説明するための分解斜視図である。図3Bは、図3AにおけるF3B-F3B線における断面図である。図4は、第1拭き取り装置の一例を示す図である。図5は、第1拭き取り装置の拭き取りの動作を説明するための図である。図6は、第1拭き取り装置の拭き取りの動作を説明するための図である。図7は、第2拭き取り装置の一例を示す図である。図8は、第2拭き取り装置の拭き取りの動作を説明するための図である。 FIG. 1 is a side view showing an example of the production line apparatus 10. In FIG. 1, the transport path and the coating device 40 are mainly shown, and other devices, for example, the wiping device (first wiping device and the second wiping device) described later, the device for cutting the material, and the material are squeezed. The equipment to be used is omitted. FIG. 2A is a top view showing an example of a place where the production line device 10 is arranged. FIG. 2B is a system configuration diagram for explaining a part of the absorbent article manufacturing apparatus 1. FIG. 3A is an exploded perspective view for explaining an example of the absorbent article 2. FIG. 3B is a cross-sectional view taken along the line F3B-F3B in FIG. 3A. FIG. 4 is a diagram showing an example of the first wiping device. FIG. 5 is a diagram for explaining the wiping operation of the first wiping device. FIG. 6 is a diagram for explaining the wiping operation of the first wiping device. FIG. 7 is a diagram showing an example of the second wiping device. FIG. 8 is a diagram for explaining the wiping operation of the second wiping device.
 製造装置1は、製造ライン装置10と制御部20とを有してよい。製造ライン装置10は、吸収性物品2用の資材5を搬送しながら加工する装置である。製造ライン装置10は、製造ライン装置10の長さ方向を示す長さ方向X、製造ライン装置10の幅方向を示す幅方向Y、製造ライン装置10の高さ方向を示す高さ方向Zを有してよい。製造ライン装置10は、例えば、長さ方向Xにおける製造ライン装置10の長さが20m以上であってよいし、幅方向Yにおける製造ライン装置10の幅が2m以上であってよいし、高さ方向Zにおける製造ライン装置10の高さが2m以上であってよい。 The manufacturing apparatus 1 may have a manufacturing line apparatus 10 and a control unit 20. The production line device 10 is a device for processing while transporting the material 5 for the absorbent article 2. The production line device 10 has a length direction X indicating the length direction of the production line device 10, a width direction Y indicating the width direction of the production line device 10, and a height direction Z indicating the height direction of the production line device 10. You can do it. The production line apparatus 10 may have, for example, a length of the production line apparatus 10 in the length direction X of 20 m or more, a width of the production line apparatus 10 in the width direction Y of 2 m or more, and a height. The height of the production line device 10 in the direction Z may be 2 m or more.
 図2Aに示すように、資材5の搬送中に資材5への接触を防ぐための安全カバー100が設けられてよい。安全カバー100は、後述の搬送路35と作業者が通る通路エリアPAとの間に設けられてよい。製造ライン装置10の少なくとも一部は、安全カバー100と壁部8とに囲まれた装置エリア10Aに配置されてよい。幅方向Yにおいて、装置エリア10Aと安全カバー100との間には、安全エリアSAが設けられてよい。 As shown in FIG. 2A, a safety cover 100 may be provided to prevent contact with the material 5 during transportation of the material 5. The safety cover 100 may be provided between the transport path 35, which will be described later, and the passage area PA through which the operator passes. At least a part of the production line device 10 may be arranged in the device area 10A surrounded by the safety cover 100 and the wall portion 8. In the width direction Y, a safety area SA may be provided between the device area 10A and the safety cover 100.
 安全エリアSAは、資材5の搬送中に作業者が後述する拭き取り部55を安全にメンテナンスできるエリアである。安全エリアSAは、例えば、搬送中の資材5(搬送路35)及び製造ライン装置10(ただし、拭き取り装置を除く)から所定距離D(例えば、50cm)以上離れたエリアである。作業者は、安全カバー100に設けられたドア(不図示)を通じて安全エリアSA内に入ることができてもよい。また、作業者は、安全カバー100に設けられた窓(不図示)を通じて安全エリアSAに手を入れることができてもよい。これにより、作業者は、資材5の搬送中に拭き取り部55をメンテナンスすることができる。 The safety area SA is an area where the operator can safely maintain the wiping portion 55, which will be described later, during the transportation of the material 5. The safety area SA is, for example, an area separated from the material 5 (transport path 35) and the production line device 10 (excluding the wiping device) being transported by a predetermined distance D (for example, 50 cm) or more. The operator may be able to enter the safety area SA through a door (not shown) provided on the safety cover 100. Further, the operator may be able to access the safety area SA through a window (not shown) provided on the safety cover 100. As a result, the operator can maintain the wiping portion 55 during the transportation of the material 5.
 製造ライン装置10(製造装置1)は、資材5が投入される投入口30、資材5が搬送される搬送路35、資材5の搬送中にホットメルト接着剤(以下、接着剤HMと適宜称する)を資材5に配置する塗布装置40、及び付着物を自動的に拭き取る拭き取り装置50を有してよい。投入口30は、吸収性物品2用の資材5が投入される入り口である。投入口30は、例えば、長さ方向X及び高さ方向Zに延びる壁部8に設けられてよい。なお、壁部8は、鏡板と称されてよい。図1に示すように、製造装置1は、複数の投入口30を有してよい。複数の投入口30のそれぞれから資材5が投入されてよい。資材5は、吸収性物品2用の資材である。吸収性物品2用の資材5は、例えば、後述する吸収体2A、後述するトップシート2Bが連続する連続体、後述するバックシート2Cが連続する連続体、後述する外装シート2Dが連続する連続体などである。資材5は、弾性部材であってもよい。資材5は、切断されることによって吸収性物品2を構成してもよい。 The production line device 10 (manufacturing device 1) includes an input port 30 into which the material 5 is input, a transport path 35 in which the material 5 is transported, and a hot melt adhesive (hereinafter, appropriately referred to as an adhesive HM) during the transfer of the material 5. ) May be provided on the material 5, and a wiping device 50 for automatically wiping off deposits may be provided. The input port 30 is an entrance into which the material 5 for the absorbent article 2 is input. The insertion port 30 may be provided, for example, in the wall portion 8 extending in the length direction X and the height direction Z. The wall portion 8 may be referred to as a mirror plate. As shown in FIG. 1, the manufacturing apparatus 1 may have a plurality of input ports 30. The material 5 may be input from each of the plurality of input ports 30. The material 5 is a material for the absorbent article 2. The material 5 for the absorbent article 2 is, for example, a continuous body in which the absorber 2A described later, a continuous body in which the top sheet 2B described later is continuous, a continuous body in which the back sheet 2C described later is continuous, and a continuous body in which the exterior sheet 2D described later is continuous. And so on. The material 5 may be an elastic member. The material 5 may form an absorbent article 2 by being cut.
 吸収性物品2は、例えば、パンツ型の使い捨ておむつ、テープ型の使い捨ておむつ、ショーツ型の生理用ナプキン、ライナー型の生理用ナプキンなどのいずれかである。図3に示すように、吸収性物品2は、例えば、吸収体2A、吸収体2Aよりも肌面側T1に配置されるトップシート2B、吸収体2Aよりも非肌面側T2に配置されるバックシート2C、及びバックシート2Cよりも非肌面側T2に配置される外装シート2Dを有してよい。吸収体2Aは、液体を吸収する吸収材料(例えば、粉砕パルプもしくは高吸収性ポリマー(SAP)、又はこれらの混合物など)を有する。吸収体2Aは、吸収コアを覆うコアラップを有してよい。コアラップは、例えば、ティッシュ及び/又は不織布によって構成されてよい。トップシート2B及び外装シート2Dは、不織布によって構成されてよく、バックシート2Cは、フィルムによって構成されてよい。図3Bに示すように、吸収性物品2を構成する構成部材は、ホットメルト接着剤によって接着される。 The absorbent article 2 is, for example, one of a pants-type disposable diaper, a tape-type disposable diaper, a shorts-type sanitary napkin, a liner-type sanitary napkin, and the like. As shown in FIG. 3, the absorbent article 2 is arranged, for example, on the absorber 2A, the top sheet 2B arranged on the skin surface side T1 of the absorber 2A, and on the non-skin surface side T2 of the absorber 2A. It may have a back sheet 2C and an exterior sheet 2D arranged on the non-skin surface side T2 of the back sheet 2C. The absorber 2A has an absorbent material that absorbs the liquid, such as ground pulp or a highly absorbent polymer (SAP), or a mixture thereof. Absorber 2A may have a core wrap covering the absorbing core. The core wrap may be composed of, for example, tissue and / or non-woven fabric. The top sheet 2B and the exterior sheet 2D may be made of a non-woven fabric, and the back sheet 2C may be made of a film. As shown in FIG. 3B, the constituent members constituting the absorbent article 2 are adhered by a hot melt adhesive.
 搬送路35は、吸収性物品2用の資材5の通り道である。搬送路35では、吸収性物品2用の資材5が搬送される。搬送路35は、例えば、資材5が載せられる搬送ベルト、搬送ベルト又は資材5を動かす搬送ローラーなどによって規定されてよい。 The transport path 35 is a path for the material 5 for the absorbent article 2. In the transport path 35, the material 5 for the absorbent article 2 is transported. The transport path 35 may be defined by, for example, a transport belt on which the material 5 is placed, a transport belt, a transport roller that moves the material 5, or the like.
 塗布装置40は、接着剤HMを吐出する吐出口45を有する。塗布装置40は、1つの吐出口45を有してもよいし、複数の吐出口45を有してもよい。塗布装置40は、例えば、接触式の第1塗布装置41と非接触式の第2塗布装置42とを有してよい。第1塗布装置41と第2塗布装置42とは、少なくとも接着剤HMを配置する方法が異なる。第1塗布装置41は、資材5に接触しながら接着剤HMを資材5に配置する。吐出口45が資材5に接触してもよいし、吐出口45付近の領域が資材5に接触してもよい。第1塗布装置41は、例えば、コータ塗布、又はロールコータ塗布によって、接着剤HMを資材5に配置する装置である。第2塗布装置42は、資材5に接触せずに接着剤HMを資材5に配置する。第2塗布装置42は、例えば、オメガ塗布又はスパイラル塗布によって、接着剤HMを資材5に配置する装置である。吐出口45は、例えば、資材5から5mm以上離れていてよい。接着剤HMを塗布する位置の精度を低下させないために、吐出口45は、資材5から50mm以上離れていなくてよい。 The coating device 40 has a discharge port 45 for discharging the adhesive HM. The coating device 40 may have one discharge port 45 or may have a plurality of discharge ports 45. The coating device 40 may include, for example, a contact type first coating device 41 and a non-contact type second coating device 42. At least the method of arranging the adhesive HM is different between the first coating device 41 and the second coating device 42. The first coating device 41 arranges the adhesive HM on the material 5 while contacting the material 5. The discharge port 45 may come into contact with the material 5, or the region near the discharge port 45 may come into contact with the material 5. The first coating device 41 is a device for arranging the adhesive HM on the material 5 by, for example, coating with a coater or coating with a roll coater. The second coating device 42 arranges the adhesive HM on the material 5 without contacting the material 5. The second coating device 42 is a device for arranging the adhesive HM on the material 5 by, for example, omega coating or spiral coating. The discharge port 45 may be separated from the material 5 by, for example, 5 mm or more. The discharge port 45 does not have to be separated from the material 5 by 50 mm or more so as not to reduce the accuracy of the position where the adhesive HM is applied.
 塗布装置40は、接着剤HMの配置方法及び接着剤HMの配置パターンの少なくとも一方が異なる複数の塗布装置40により構成されてよい。従って、製造ライン装置10は、複数の塗布装置40を有してよい。製造ライン装置10は、複数の第1塗布装置41を有してよいし、複数の第2塗布装置42を有してよい。図1に示す製造ライン装置10は、5個の第1塗布装置41と、4個の第2塗布装置42と、を有する。 The coating device 40 may be composed of a plurality of coating devices 40 in which at least one of the method of arranging the adhesive HM and the pattern of arranging the adhesive HM is different. Therefore, the production line device 10 may have a plurality of coating devices 40. The production line device 10 may have a plurality of first coating devices 41, or may have a plurality of second coating devices 42. The production line device 10 shown in FIG. 1 includes five first coating devices 41 and four second coating devices 42.
 接着剤HMの配置パターンが異なる場合、接着剤HMが配置された配置領域の形状が異なる。例えば、資材5が搬送される搬送方向MD及び/又は搬送方向MDに交差する交差方向CDにおける長さが異なることによって、接着剤HMの配置パターンが異なってよい。従って、同じ配置方法であったとしても、例えば、塗布装置40の幅が異なることによって、配置領域の幅、すなわち、配置パターンが異なってよい。また、例えば、塗布装置40が接着剤HMを連続的に配置する時間が異なることによって、配置領域の長さ、すなわち、配置パターンが異なってよい。 When the arrangement pattern of the adhesive HM is different, the shape of the arrangement area where the adhesive HM is arranged is different. For example, the arrangement pattern of the adhesive HM may be different due to the difference in length in the transport direction MD and / or the cross direction CD intersecting the transport direction MD in which the material 5 is transported. Therefore, even if the same arrangement method is used, for example, the width of the arrangement area, that is, the arrangement pattern may be different due to the difference in the width of the coating device 40. Further, for example, the length of the arrangement region, that is, the arrangement pattern may be different depending on the time for the coating device 40 to continuously arrange the adhesive HM.
 塗布装置40は、資材5の合流地点よりも手前の搬送方向MDの上流地点に配置されてよい。資材5の合流地点では、接着剤HMによって資材5どうしが接合される。塗布装置40は、壁部8に固定されてもよい。複数の塗布装置40は、製造ライン装置10に点在して配置されてよい。長さ方向Xにおいて、製造ライン装置10の長さ方向Xにおいて最も一方の端部側に位置する塗布装置40から最も一方の端部側に位置する塗布装置40までの距離は、15m以上であってよい。また、製造ライン装置10の最も上方側に位置する塗布装置40から床までの距離は、2m以上であってよい。製造ライン装置10の最も上方側に位置する塗布装置40から最も下方側に位置する塗布装置40までの距離は、1m以上であってよい。 The coating device 40 may be arranged at an upstream point in the transport direction MD before the confluence point of the material 5. At the confluence of the materials 5, the materials 5 are joined together by the adhesive HM. The coating device 40 may be fixed to the wall portion 8. The plurality of coating devices 40 may be arranged scattered on the production line device 10. In the length direction X, the distance from the coating device 40 located on the onemost end side in the length direction X of the production line device 10 to the coating device 40 located on the one end side is 15 m or more. It's okay. Further, the distance from the coating device 40 located on the uppermost side of the production line device 10 to the floor may be 2 m or more. The distance from the coating device 40 located on the uppermost side of the production line device 10 to the coating device 40 located on the lowermost side may be 1 m or more.
 図5A及び図5Bに示すように、塗布装置40は、資材5の搬送路35から離れるように移動できてよい。塗布装置40は、搬送路35から離れるように幅方向Yに延びる支軸41Cを中心に90度回転できてよい。これにより、塗布装置40と拭き取り装置50との間にスペースが発生する。なお、塗布装置40が搬送路35から離れるように、搬送路35が移動してもよい。例えば、搬送ローラーが、塗布装置40から離れるように移動してもよい。また、塗布装置40と搬送路35との両方が移動してもよい。資材5の搬送中に搬送路35と塗布装置40との間に、拭き取り装置50が入り込むスペースがない場合であっても、塗布装置40及び搬送路35の少なくとも一方が移動することで、拭き取り装置50が入り込むスペースを発生することができる。 As shown in FIGS. 5A and 5B, the coating device 40 may be movable away from the transport path 35 of the material 5. The coating device 40 may be rotated 90 degrees around a support shaft 41C extending in the width direction Y so as to be separated from the transport path 35. As a result, a space is generated between the coating device 40 and the wiping device 50. The transport path 35 may be moved so that the coating device 40 is separated from the transport path 35. For example, the transport roller may move away from the coating device 40. Further, both the coating device 40 and the transport path 35 may move. Even if there is no space for the wiping device 50 to enter between the transport path 35 and the coating device 40 during the transfer of the material 5, at least one of the coating device 40 and the transport path 35 moves to wipe the material 5. It is possible to generate a space for 50 to enter.
 拭き取り装置50は、塗布装置40に付着した付着物を拭き取る拭き取り部55と、拭き取り部55を支持する支持部56とを有する。付着物は、接着剤HM、及び資材から生じた繊維などである。接着剤HMによって繊維が接着されることで、塗布装置40、特に、吐出口45の周囲には、付着物が付着し易い。拭き取り部55は、塗布装置40に接触しながら移動することで付着物を自動的に拭き取る。拭き取り部55は、塗布装置40における所定の領域(以下、拭き取り領域WA)上を移動することによって、付着物を自動的に拭き取る。拭き取り領域WAは、例えば、少なくとも吐出口45を含む領域である。拭き取り領域WAは、吐出口45よりも搬送方向MDの上流側の部分、吐出口45よりも下流側の部分を含んでよい。吐出口45よりも搬送方向MDの上流側の部分及び吐出口45よりも下流側の部分は、塗布装置40の一部であってよい。すなわち、拭き取り部55は、塗布装置40に付着した付着物を拭き取り、その拭き取り対象領域は、吐出口45のみならず、吐出口45の周囲を含んだ塗布装置40上の一定範囲である。 The wiping device 50 has a wiping portion 55 that wipes off the deposits adhering to the coating device 40, and a support portion 56 that supports the wiping portion 55. The deposits are adhesive HM, fibers generated from the material, and the like. Since the fibers are adhered by the adhesive HM, deposits are likely to adhere to the coating device 40, particularly around the discharge port 45. The wiping unit 55 automatically wipes off the deposits by moving while contacting the coating device 40. The wiping portion 55 automatically wipes off the adhered matter by moving on a predetermined area (hereinafter, wiping area WA) in the coating device 40. The wiping area WA is, for example, an area including at least the discharge port 45. The wiping area WA may include a portion on the upstream side of the transport direction MD from the discharge port 45 and a portion on the downstream side of the discharge port 45. The portion on the upstream side of the transport direction MD from the discharge port 45 and the portion on the downstream side from the discharge port 45 may be a part of the coating device 40. That is, the wiping portion 55 wipes off the deposits adhering to the coating device 40, and the wiping target area is a certain range on the coating device 40 including not only the discharge port 45 but also the periphery of the discharge port 45.
 拭き取り部55は、付着物を拭き取れるものであればよく、例えば、板状(すなわち、スクレーパ)、円柱状、布状(ウェス)、ブラシ状などであってよい。例えば、塗布装置40の拭き取る部分が平面を有する場合、板状の拭き取り部が平面に沿って移動することで、付着物をこそぎ取るように拭き取ることができる。接触式の第1塗布装置41は、吐出口45付近の領域が平面であるため、板状の拭き取り部55を用いて付着物を拭き取ることができる。一方で、非接触式の第2塗布装置42がノズル状の吐出口45を有する場合、拭き取り部55は、ノズルを傷つけないように、布状又はブラシ状であってよい。支持部56は、拭き取り部55が固定される。拭き取り部55は、例えば、ボルト及びナットなどの締結部材によって支持部に固定される。支持部56の移動と共に拭き取り部55が自動的に移動する。支持部56の移動は、制御部20によって制御されている。 The wiping portion 55 may be any as long as it can wipe off the adhered matter, and may be, for example, a plate shape (that is, a scraper), a columnar shape, a cloth shape (waste), a brush shape, or the like. For example, when the wiping portion of the coating device 40 has a flat surface, the plate-shaped wiping portion moves along the flat surface to wipe off the deposits. In the contact-type first coating device 41, since the region near the discharge port 45 is flat, the deposits can be wiped off by using the plate-shaped wiping portion 55. On the other hand, when the non-contact type second coating device 42 has a nozzle-shaped discharge port 45, the wiping portion 55 may be cloth-shaped or brush-shaped so as not to damage the nozzle. A wiping portion 55 is fixed to the support portion 56. The wiping portion 55 is fixed to the supporting portion by, for example, a fastening member such as a bolt and a nut. The wiping portion 55 automatically moves with the movement of the support portion 56. The movement of the support unit 56 is controlled by the control unit 20.
 拭き取り装置50は、複数の塗布装置40のそれぞれから付着物を拭き取るために複数の拭き取り装置50により構成されてよい。図2Bに示すように、拭き取り装置50の数は、塗布装置40の数に対応してもよい。拭き取り装置50は、第1拭き取り装置51と第2拭き取り装置52とを有してよい。第1拭き取り装置51は、接触式の第1塗布装置41に付着した付着物を拭き取る装置である。第2拭き取り装置52は、非接触式の第2塗布装置42に付着した付着物を拭き取る装置である。第1塗布装置41の数と第1拭き取り装置51の数が対応してよく、第2塗布装置42の数と第2拭き取り装置52の数が対応してよい。これにより、1つの拭き取り装置50が1つの塗布装置40の付着物を拭き取ればよく、拭き取り装置50が複数の塗布装置40を拭き取る必要がなくなる。 The wiping device 50 may be composed of a plurality of wiping devices 50 in order to wipe off deposits from each of the plurality of coating devices 40. As shown in FIG. 2B, the number of wiping devices 50 may correspond to the number of coating devices 40. The wiping device 50 may have a first wiping device 51 and a second wiping device 52. The first wiping device 51 is a device that wipes off the deposits adhering to the contact type first coating device 41. The second wiping device 52 is a device that wipes off the deposits adhering to the non-contact type second coating device 42. The number of the first coating device 41 and the number of the first wiping device 51 may correspond to each other, and the number of the second coating device 42 and the number of the second wiping device 52 may correspond to each other. As a result, one wiping device 50 may wipe off the deposits of one coating device 40, and the wiping device 50 does not need to wipe a plurality of coating devices 40.
 第1拭き取り装置51により、第1塗布装置41に付着した付着物を自動的に拭き取る一例を図4から図6を用いて説明する。図4に示すように、第1拭き取り装置51は、板状の拭き取り部55を有する。拭き取り部55は、拭き取り領域WAに合わせた形状であってよい。例えば、図5Cに示すように、幅方向Yから見て、拭き取り領域WAが凸状であるため、拭き取り部55は、塗布装置40に接触する部分が凹状であってよい。 An example of automatically wiping off the deposits adhering to the first coating device 41 by the first wiping device 51 will be described with reference to FIGS. 4 to 6. As shown in FIG. 4, the first wiping device 51 has a plate-shaped wiping portion 55. The wiping portion 55 may have a shape that matches the wiping area WA. For example, as shown in FIG. 5C, since the wiping region WA is convex when viewed from the width direction Y, the wiping portion 55 may have a concave portion in contact with the coating device 40.
 図6Aに示すように、資材5の搬送中において、拭き取り部55は、安全エリアSAに位置してよい。第1塗布装置41から安全エリアSAまでの所定距離Dが、例えば50cm以上であってよい。幅方向Yにおいて製造ライン装置10の中心から壁部8へ向かう方向を第1幅方向Y1と称し、製造ライン装置10の中心から安全カバー100へ向かう方向を第2幅方向Y2と称する。図6Bに示すように、資材5の搬送が停止されている停止期間中に、拭き取り部55は、第1幅方向Y1へ移動する。拭き取り部55は、幅方向Yにおける拭き取り領域WAの一方の端部(具体的には、壁部8側の端部)まで移動する。 As shown in FIG. 6A, the wiping portion 55 may be located in the safety area SA during the transportation of the material 5. The predetermined distance D from the first coating device 41 to the safety area SA may be, for example, 50 cm or more. In the width direction Y, the direction from the center of the production line device 10 toward the wall portion 8 is referred to as the first width direction Y1, and the direction from the center of the production line device 10 toward the safety cover 100 is referred to as the second width direction Y2. As shown in FIG. 6B, the wiping portion 55 moves in the first width direction Y1 during the stop period during which the transportation of the material 5 is stopped. The wiping portion 55 moves to one end of the wiping region WA in the width direction Y (specifically, the end on the wall 8 side).
 図6C(及び図5C)に示すように、拭き取り部55は、高さ方向Zの下方に移動して、第1塗布装置41に接触する。拭き取り部55は、第1塗布装置41に接触しながら第2幅方向Y2に移動する。拭き取り部55は、幅方向Yにおける拭き取り領域WAの他方の端部(具体的には、安全カバー100側の端部)まで移動する。これにより、拭き取り部55は、第1塗布装置41に付着した付着物を自動的に拭き取ることができる。図6Dに示すように、拭き取り部55は、高さ方向Zの上方に移動して、第1塗布装置41から離れる。拭き取り部55は、付着物を拭き取った後に、第2幅方向Y2、すなわち安全カバー100の方へ移動する。拭き取り部55は、安全エリアSAまで移動する。 As shown in FIG. 6C (and FIG. 5C), the wiping portion 55 moves downward in the height direction Z and comes into contact with the first coating device 41. The wiping portion 55 moves in the second width direction Y2 while being in contact with the first coating device 41. The wiping portion 55 moves to the other end of the wiping region WA in the width direction Y (specifically, the end on the safety cover 100 side). As a result, the wiping unit 55 can automatically wipe off the deposits adhering to the first coating device 41. As shown in FIG. 6D, the wiping portion 55 moves upward in the height direction Z and separates from the first coating device 41. After wiping off the deposits, the wiping portion 55 moves toward the second width direction Y2, that is, the safety cover 100. The wiping section 55 moves to the safety area SA.
 次に、第2拭き取り装置52により、第2塗布装置42に付着した付着物を自動的に拭き取る一例を図7から図8を用いて説明する。図7に示すように、第2拭き取り装置52は、円柱状の拭き取り部55を有する。拭き取り部55は、第2塗布装置42に接触しながら移動方向(図8では、幅方向Y)に対して直行する軸Cを中心として回転してもよい。軸Cは、長さ方向Xに平行であってよい。 Next, an example of automatically wiping off the deposits adhering to the second coating device 42 by the second wiping device 52 will be described with reference to FIGS. 7 to 8. As shown in FIG. 7, the second wiping device 52 has a columnar wiping portion 55. The wiping portion 55 may rotate about an axis C orthogonal to the moving direction (width direction Y in FIG. 8) while being in contact with the second coating device 42. The axis C may be parallel to the length direction X.
 図8Aに示すように、資材5の搬送中において、拭き取り部55は、安全エリアSAに位置してよい。第2塗布装置42から安全エリアSAまでの所定距離Dが、例えば50cm以上であってよい。図8A及び図8Bに示すように、資材5の搬送が停止されている停止期間中に、拭き取り部55は、第1幅方向Y1へ移動する。拭き取り部55は、高さ方向Zの上方に移動する。拭き取り部55は、幅方向Yにおける拭き取り領域WAの一方の端部(具体的には、安全カバー100側の端部)まで移動する。 As shown in FIG. 8A, the wiping portion 55 may be located in the safety area SA during the transportation of the material 5. The predetermined distance D from the second coating device 42 to the safety area SA may be, for example, 50 cm or more. As shown in FIGS. 8A and 8B, the wiping portion 55 moves in the first width direction Y1 during the stop period during which the transportation of the material 5 is stopped. The wiping portion 55 moves upward in the height direction Z. The wiping portion 55 moves to one end of the wiping region WA in the width direction Y (specifically, the end on the safety cover 100 side).
 図8Cに示すように、拭き取り部55は、第2塗布装置42に接触しながら第1幅方向Y1に移動する。これにより、拭き取り部55は、第2塗布装置42に付着した付着物を自動的に拭き取ることができる。拭き取り部55は、軸Cを中心に回転しながら移動することにより、付着物をさらに拭き取ってよい。 As shown in FIG. 8C, the wiping portion 55 moves in the first width direction Y1 while contacting the second coating device 42. As a result, the wiping unit 55 can automatically wipe off the deposits adhering to the second coating device 42. The wiping portion 55 may further wipe off the deposits by moving while rotating around the shaft C.
 図6Dに示すように、拭き取り部55は、高さ方向Zの下方に移動して、第2塗布装置42から離れる。拭き取り部55は、付着物を拭き取った後に、第2幅方向Y2、すなわち安全カバー100の方へ移動する。拭き取り部55は、安全エリアSAまで移動する。 As shown in FIG. 6D, the wiping portion 55 moves downward in the height direction Z and separates from the second coating device 42. After wiping off the deposits, the wiping portion 55 moves toward the second width direction Y2, that is, the safety cover 100. The wiping section 55 moves to the safety area SA.
 なお、拭き取り部55は、1回拭き取った後に安全エリアSAまで移動せずに、複数回拭き取ってもよい。すなわち、拭き取り部55は、図6Bの位置まで移動して、拭き取る動作を複数回(例えば、3回)繰り返してよい。 The wiping portion 55 may be wiped a plurality of times without moving to the safety area SA after wiping once. That is, the wiping portion 55 may move to the position shown in FIG. 6B and repeat the wiping operation a plurality of times (for example, three times).
 制御部20は、拭き取り装置50を制御する制御装置である。制御部20は、プロセッサ及びメモリを含む。メモリは、プロセッサにより実行されるプログラム、及びプロセッサによる処理に使用される情報を記憶する。プロセッサは、CPU(Central Processing Unit)を含む。CPUは、メモリに記憶されるプログラムを実行することにより、後述する各種の処理を行う。制御部20は、ユーザインターフェイスを備えていてもよい。ユーザインターフェイスは、作業者とのインターフェイスであり、例えば、ディスプレイ、マイク、スピーカ、及び各種ボタンなどを含む。ユーザインターフェイスは、ユーザからの操作を受け付けて、該操作の内容を示す信号をプロセッサに出力できる。 The control unit 20 is a control device that controls the wiping device 50. The control unit 20 includes a processor and a memory. The memory stores a program executed by the processor and information used for processing by the processor. The processor includes a CPU (Central Processing Unit). The CPU performs various processes described later by executing a program stored in the memory. The control unit 20 may include a user interface. The user interface is an interface with the operator and includes, for example, a display, a microphone, a speaker, and various buttons. The user interface can accept an operation from the user and output a signal indicating the content of the operation to the processor.
 なお、制御部20は、製造装置1を構成する拭き取り装置51以外の装置を制御してもよい。制御部20は、例えば、作業者の入力及び/又はプログラムによって後述する吸収性物品2の製造方法を制御できてよい。或いは、拭き取り装置51を制御する制御部20とは、別の制御部によって、吸収性物品2の製造方法が制御されてもよい。以下の吸収性物品2の製造方法では、制御部20が各種の動作を制御するとして説明する。 Note that the control unit 20 may control devices other than the wiping device 51 constituting the manufacturing device 1. The control unit 20 may be able to control the manufacturing method of the absorbent article 2 described later by, for example, an operator's input and / or a program. Alternatively, the manufacturing method of the absorbent article 2 may be controlled by a control unit different from the control unit 20 that controls the wiping device 51. In the following manufacturing method of the absorbent article 2, the control unit 20 will be described as controlling various operations.
 (3)吸収性物品の製造方法
 次に、吸収性物品の製造方法について、図9及び図10を中心に用いて説明する。図9及び図10は、吸収性物品の製造方法を説明するためのシーケンス図である。図9に示すように、実施形態に係る吸収性物品の製造方法は、工程S10から工程S80を有してよい。
(3) Method for Producing Absorbent Articles Next, a method for producing an absorbent article will be described with reference to FIGS. 9 and 10. 9 and 10 are sequence diagrams for explaining a method for producing an absorbent article. As shown in FIG. 9, the method for producing an absorbent article according to the embodiment may include steps S10 to S80.
 工程S10は、吸収性物品2を生産する工程である。工程S10は、例えば、資材5を搬送する工程、接着剤HMを資材5に配置する工程、資材5どうしを接合する工程、及び資材5を切断する工程、吸収性物品を組み立てる工程などを有してよい。工程S10は、その他、吸収性物品2を製造するために必要な工程を有してよい。接着剤HMを資材5に配置する工程では、資材5の搬送中に塗布装置40を用いて接着剤HMを配置する。 Step S10 is a step of producing the absorbent article 2. Step S10 includes, for example, a step of transporting the material 5, a step of arranging the adhesive HM on the material 5, a step of joining the materials 5, a step of cutting the material 5, a step of assembling an absorbent article, and the like. It's okay. Step S10 may include other steps necessary for producing the absorbent article 2. In the step of arranging the adhesive HM on the material 5, the adhesive HM is arranged by using the coating device 40 during the transportation of the material 5.
 工程S20は、吸収性物品2の生産を停止する工程である。上述の工程S10における各工程が停止されてよい。資材5の搬送が停止されている停止期間が開始する。停止期間は、事前にスケジュールされている予定停止期間であってもよいし、資材5の搬送中に停止が決定された緊急停止期間であってもよい。停止期間は、予定停止期間と緊急停止期間とを含んでよい。予定停止期間は、生産工程S10における各工程にトラブルが発生していないにもかかわらず生産が停止される期間であってよい。緊急停止期間は、生産工程S10における各工程の少なくともいずれかのトラブルに起因して生産が停止される期間であってよい。緊急停止期間は、拭き取る工程S40が一定の期間(例えば、4時間以上)行われていないことにより吸収性物品2の生産が停止される期間であってよい。 Step S20 is a step of stopping the production of the absorbent article 2. Each step in the above-mentioned step S10 may be stopped. The suspension period in which the transportation of the material 5 is suspended begins. The suspension period may be a scheduled suspension period scheduled in advance, or may be an emergency suspension period in which suspension is determined during transportation of the material 5. The suspension period may include a scheduled suspension period and an emergency suspension period. The scheduled suspension period may be a period during which production is suspended even though no trouble has occurred in each process in the production process S10. The emergency stop period may be a period during which production is stopped due to a trouble in at least one of the steps in the production step S10. The emergency stop period may be a period during which the production of the absorbent article 2 is stopped because the wiping step S40 has not been performed for a certain period (for example, 4 hours or more).
 工程S30は、塗布装置40及び搬送路35の少なくとも一方が移動する工程である。工程S40は、停止期間中に、拭き取り装置50を用いて、付着物を自動的に拭き取る工程(拭き取る工程S40)である。拭き取り部55は、安全カバー100の方へ移動しながら、付着物を自動的に拭き取ってよい。吐出口45に加えて、搬送方向MDにおける吐出口よりも上流側の部分と、吐出口45よりも下流側の部分とを含む拭き取り領域WAにおいて、付着物を拭き取ってよい。また、固化した接着剤HMが拭き取り部55に付着した状態で、付着物を自動的に拭き取ってよい。例えば、拭き取り部55が付着物としての接着剤HMを拭き取った後に、拭き取り部55に付着した付着物を除去しないことにより、拭き取り部55に固定した接着剤HMが付着していてよい。或いは、拭き取り部55のメンテナンスにより、拭き取り部55に接着剤HMを付着させてもよい。 Step S30 is a step in which at least one of the coating device 40 and the transport path 35 moves. Step S40 is a step of automatically wiping off the deposits (wiping step S40) using the wiping device 50 during the stop period. The wiping portion 55 may automatically wipe off the deposits while moving toward the safety cover 100. In addition to the discharge port 45, the deposit may be wiped off in the wiping area WA including the portion on the upstream side of the discharge port and the portion on the downstream side of the discharge port 45 in the transport direction MD. Further, the adhered matter may be automatically wiped off in a state where the solidified adhesive HM is attached to the wiping portion 55. For example, after the wiping portion 55 wipes off the adhesive HM as an adhering matter, the adhesive HM fixed to the wiping portion 55 may be adhered by not removing the adhering matter adhering to the wiping portion 55. Alternatively, the adhesive HM may be attached to the wiping portion 55 by maintenance of the wiping portion 55.
 塗布装置40が接触式の第1塗布装置41である場合、拭き取り装置51は、板状の拭き取り部55を用いて付着物を自動的に拭き取ってよい。また、塗布装置40が非接触式の第2塗布装置42である場合、拭き取り装置51は、剛性の低い布状又はブラシ状の拭き取り部55を用いて付着物を自動的に拭き取ってよい。 When the coating device 40 is the contact type first coating device 41, the wiping device 51 may automatically wipe off the deposits using the plate-shaped wiping portion 55. When the coating device 40 is a non-contact type second coating device 42, the wiping device 51 may automatically wipe off the deposits using a cloth-like or brush-like wiping portion 55 having low rigidity.
 複数の拭き取り装置50により付着物を拭き取る場合、付着物を拭き取る稼働時間が重複してよい。例えば、複数の拭き取り装置50が同じ時間に拭き取りを開始してもよい。複数の拭き取り装置50の拭き取りが終了する時刻が同じになるように、複数の拭き取り装置50が拭き取り開始時間をずらしてよい。例えば、拭き取り時間が長い拭き取り装置50は、拭き取り開始時刻が早く、拭き取り時間が短い拭き取り装置50は、拭き取り開始時刻が遅くてもよい。複数の拭き取り装置50の中から、停止期間中に付着物を拭き取る拭き取り装置50を選択してもよい。拭き取り装置50を選択方法は、後述する。 When wiping the deposits with a plurality of wiping devices 50, the operating times for wiping the deposits may overlap. For example, a plurality of wiping devices 50 may start wiping at the same time. The wiping start times of the plurality of wiping devices 50 may be staggered so that the wiping ends of the plurality of wiping devices 50 are at the same time. For example, the wiping device 50 having a long wiping time may have an early wiping start time, and the wiping device 50 having a short wiping time may have a late wiping start time. From the plurality of wiping devices 50, the wiping device 50 that wipes off the deposits during the stop period may be selected. The method of selecting the wiping device 50 will be described later.
 工程S50は、拭き取る工程S40後の資材5の搬送中に拭き取り部55を作業者がメンテナンスできる位置まで、拭き取る工程S40後に拭き取り部55が自動的に移動する工程である(移動する工程S50)。拭き取り部55は、付着物を安全カバー100の方へ自動的に移動してよい。安全な位置は、安全エリアSAであってよい。或いは、安全な位置は、例えば、製造ライン装置10から上方に所定距離D以上離れた位置であってよい。作業者は、製造ライン装置10の上方から拭き取り部55をメンテナンスすることができる。 The step S50 is a step in which the wiping portion 55 is automatically moved after the wiping step S40 to a position where the operator can maintain the wiping portion 55 during the transportation of the material 5 after the wiping step S40 (moving step S50). The wiping section 55 may automatically move the deposits toward the safety cover 100. The safe location may be the safety area SA. Alternatively, the safe position may be, for example, a position separated from the production line device 10 by a predetermined distance D or more. The operator can maintain the wiping portion 55 from above the production line device 10.
 工程S60は、吸収性物品2の生産を再開する工程である。工程S60は、工程S10の各工程に加えて、以下の工程を有してよい。工程S60は、拭き取り装置50をメンテナンスする工程を有してよい。拭き取り装置50のメンテナンスとして、例えば、拭き取り部55から付着物を除去してよいし、拭き取り部55を交換してもよい。 Step S60 is a step of restarting the production of the absorbent article 2. Step S60 may have the following steps in addition to each step of step S10. Step S60 may include a step of maintaining the wiping device 50. As maintenance of the wiping device 50, for example, the deposits may be removed from the wiping portion 55, or the wiping portion 55 may be replaced.
 工程S60は、所定の吸収性物品2を組み立てる工程と、所定の吸収性物品2を破棄する工程と、を有してよい。所定の吸収性物品2は、停止期間が終了してから所定期間が経過するまでの間に接着剤HMが配置された所定の資材を用いて組み立てられたものである。従って、所定期間中に塗布装置40によって接着剤HMが配置された所定の資材を用いて、所定期間が経過した後に組み立てられた吸収性物品2も所定の吸収性物品2である。なお、所定期間は、拭き取り後に接着剤HMの塗布が安定するまでの期間であり、例えば、30秒程度である。所定期間から一定期間が経過する間に組み立てられた吸収性物品2を全て廃棄してもよいし、組み立てられた吸収性物品2の中から所定期間中に接着剤HMが配置された資材を用いて組み立てられた所定の吸収性物品2を選択して廃棄してもよい。所定の吸収性物品2は、塗布装置40の位置及び搬送速度から選択してよい。 Step S60 may include a step of assembling a predetermined absorbent article 2 and a step of discarding the predetermined absorbent article 2. The predetermined absorbent article 2 is assembled using a predetermined material in which the adhesive HM is arranged between the end of the suspension period and the elapse of the predetermined period. Therefore, the absorbent article 2 assembled after the predetermined period has elapsed using the predetermined material on which the adhesive HM is arranged by the coating device 40 during the predetermined period is also the predetermined absorbent article 2. The predetermined period is a period until the application of the adhesive HM stabilizes after wiping, for example, about 30 seconds. All the absorbent articles 2 assembled during a certain period of time from a predetermined period may be discarded, or a material in which the adhesive HM is arranged during the predetermined period from the assembled absorbent articles 2 may be used. The predetermined absorbent article 2 assembled in the process may be selected and discarded. The predetermined absorbent article 2 may be selected from the position of the coating device 40 and the transport speed.
 工程S70は、吸収性物品2の生産を停止する工程である。工程S70は、工程S20と同様の工程である。工程S80において、吸収性物品2の生産を終了する場合、吸収性物品2の製造を終了する。一方で、吸収性物品2の生産を終了しない場合、工程S30を実行する。 Step S70 is a step of stopping the production of the absorbent article 2. Step S70 is the same step as step S20. When the production of the absorbent article 2 is terminated in the step S80, the production of the absorbent article 2 is terminated. On the other hand, if the production of the absorbent article 2 is not terminated, the step S30 is executed.
 以上の方法によれば、拭き取り装置50を用いて付着物を自動的に拭き取ることで、作業者が拭き取る場合と比較して、付着物の拭き取り時間の変動が抑えられる。これにより、停止期間に含まれる予備的な時間を短くすることができ、停止期間を短縮することができる。作業者の代わりに拭き取り装置50が付着物を拭き取るため、拭き取りのために多くの作業者を雇う必要がなく、運用コストの増加を抑制できる。従って、実施形態に係る吸収性物品2の製造方法によれば、運用コストの増加を抑制しつつ、資材5の搬送の停止期間を短くすることで、吸収性物品2の生産性を高めることができる。特に、大型の製造ライン装置10は、複数の塗布装置40が製造ライン装置10に広く点在するため、作業者が拭き取る場合には、所定の塗布装置40から別の塗布装置40まで移動するのに時間が掛かる。また、高い位置(例えば、床から2m以上の位置)及び/又は低い位置(例えば、床から1m未満の位置)にある塗布装置40は、作業員が拭き取り作業を行い難いため、拭き取りに時間が掛かる。作業者の代わりに、複数の拭き取り装置50が付着物を拭き取ることで、拭き取り時間を短縮することができる。 According to the above method, by automatically wiping off the deposits using the wiping device 50, fluctuations in the wiping time of the deposits can be suppressed as compared with the case where the operator wipes off the deposits. As a result, the preliminary time included in the suspension period can be shortened, and the suspension period can be shortened. Since the wiping device 50 wipes off the deposits instead of the workers, it is not necessary to hire many workers for wiping, and the increase in operating cost can be suppressed. Therefore, according to the method for manufacturing the absorbent article 2 according to the embodiment, it is possible to increase the productivity of the absorbent article 2 by shortening the suspension period of the transportation of the material 5 while suppressing the increase in the operating cost. it can. In particular, in the large production line device 10, since a plurality of coating devices 40 are widely scattered in the production line device 10, when the operator wipes them off, they move from the predetermined coating device 40 to another coating device 40. It takes time. Further, since it is difficult for the worker to wipe the coating device 40 at a high position (for example, a position of 2 m or more from the floor) and / or a low position (for example, a position of less than 1 m from the floor), it takes time to wipe. It hangs. By wiping the deposits with a plurality of wiping devices 50 on behalf of the operator, the wiping time can be shortened.
 また、拭き取る工程S40の後に、拭き取り部55が自動的に安全な位置まで移動するため、資材5の搬送を停止せずに、拭き取り部をメンテナンスすることができる。その結果、拭き取り部55のメンテナンス不備(例えば、拭き取り部55の摩耗によりうまく拭き取れなかったり、拭き取り部55に付着物が付きすぎることによって拭き取った付着物が塗布装置40に再度付着したりする)に起因した資材5の搬送の停止を低減したり、不良品の発生を抑制したりすることができる。 Further, since the wiping portion 55 automatically moves to a safe position after the wiping step S40, the wiping portion can be maintained without stopping the transportation of the material 5. As a result, the maintenance of the wiping portion 55 is inadequate (for example, the wiping portion 55 cannot be wiped well due to wear, or the wiping portion 55 has too much deposit, and the wiped deposit adheres to the coating device 40 again). It is possible to reduce the resulting stoppage of transportation of the material 5 and suppress the occurrence of defective products.
 また、移動する工程S50では、付着物を拭き取った後に、拭き取り部55が安全カバー100の方へ自動的に移動する。これにより、作業者が、通路エリアPAから安全な位置へアクセスし易くなり、拭き取り部55のメンテナンスを行うための時間を低減することができる。例えば、作業者が、停止期間中に拭き取り部55のメンテナンスを行わなくてすむ。その結果、拭き取り部55のメンテナンスにかける人件費を減少でき、運用コストの増加を抑制できる。 Further, in the moving step S50, after wiping off the adhered matter, the wiping portion 55 automatically moves toward the safety cover 100. This makes it easier for the operator to access a safe position from the passage area PA, and can reduce the time required for maintenance of the wiping portion 55. For example, the operator does not have to perform maintenance on the wiping unit 55 during the stop period. As a result, the labor cost for the maintenance of the wiping unit 55 can be reduced, and the increase in the operating cost can be suppressed.
 また、拭き取る工程S40では、拭き取り部55が安全カバー100の方へ移動しながら、付着物を自動的に拭き取る。これにより、拭き取り部55が、拭き取った後に安全カバー100の方へ自動的に移動する距離を短くすることができる。これにより、拭き取り部55が安全な位置まで移動する時間を短縮することができ、停止期間を短縮することができる。 Further, in the wiping step S40, the wiping portion 55 moves toward the safety cover 100 and automatically wipes off the adhered matter. As a result, the distance that the wiping portion 55 automatically moves toward the safety cover 100 after wiping can be shortened. As a result, the time for the wiping portion 55 to move to a safe position can be shortened, and the stop period can be shortened.
 また、停止期間は、事前にスケジュールされている予定停止期間と、前記資材の搬送中に停止が決定された緊急停止期間と、を含む。予定停止期間と、緊急停止期間とで、付着物を拭き取ることができるため、塗布装置40に付着した付着物に起因した不良品の発生を抑制し、吸収性物品2の生産性を高めることができる。 In addition, the suspension period includes a scheduled suspension period scheduled in advance and an emergency suspension period in which suspension is determined during transportation of the material. Since the deposits can be wiped off during the planned stop period and the emergency stop period, it is possible to suppress the generation of defective products due to the deposits adhering to the coating device 40 and increase the productivity of the absorbent article 2. it can.
 また、拭き取る工程S40では、複数の拭き取り装置50の稼働時間が重複している。これにより、1つの拭き取り装置50の拭き取りが終了した後に、別の拭き取り装置50が拭き取りを開始する場合と比べると、複数の塗布装置40の拭き取りを開始から終了するまでの時間を短くすることができ、停止期間を短縮することができる。 Further, in the wiping step S40, the operating times of the plurality of wiping devices 50 overlap. As a result, the time from the start to the end of wiping of the plurality of coating devices 40 can be shortened as compared with the case where another wiping device 50 starts wiping after the wiping of one wiping device 50 is completed. It can be done and the suspension period can be shortened.
 また、拭き取る工程S40では、固化した接着剤HMが拭き取り部55に付着した状態で、付着物を自動的に拭き取る。これにより、固化したホットメルト接着剤の粘着によって、塗布装置に付着した付着物が拭き取り部55に付着し易くなる。これにより、塗布装置40から付着物をしっかりと拭き取ることができる。拭き残された付着物を減少することで、不良品の発生をさらに抑制できる。 Further, in the wiping step S40, the adhered matter is automatically wiped off with the solidified adhesive HM adhering to the wiping portion 55. As a result, the adhesion of the solidified hot melt adhesive makes it easier for the deposits adhering to the coating device to adhere to the wiping portion 55. As a result, the deposits can be firmly wiped off from the coating device 40. By reducing the deposits left on the wipe, the occurrence of defective products can be further suppressed.
 また、拭き取る工程S40では、吐出口45と、搬送方向MDにおける吐出口45よりも上流側の部分と、前記吐出口よりも下流側の部分と、を含む領域において、付着物を拭き取る。接着剤HMが吐出される吐出口45に接着剤HMが付着するだけでなく、接着剤HMを配置する際に資材5から接着剤HMが跳ね返ったり、接着剤HMが垂れたりするなどにより、吐出口45の周囲に付着することがある。吐出口45の周囲である上流側の部分及び下流側の部分に付着した付着物も拭き取ることで、不良品の発生をさらに抑制できる。 Further, in the wiping step S40, the deposits are wiped off in the region including the discharge port 45, the portion on the upstream side of the discharge port 45 in the transport direction MD, and the portion on the downstream side of the discharge port. Not only does the adhesive HM adhere to the discharge port 45 from which the adhesive HM is discharged, but also the adhesive HM bounces off the material 5 when the adhesive HM is placed, or the adhesive HM drips, causing the adhesive HM to be discharged. It may adhere around the outlet 45. By wiping off the deposits adhering to the upstream portion and the downstream portion around the discharge port 45, the occurrence of defective products can be further suppressed.
 また、塗布装置40が接触式の第1塗布装置41である場合、拭き取り装置50は、板状の拭き取り部55を用いて、付着物を自動的に拭き取る。これにより、拭き取り部がウェスなどの布である場合と比較して、板状の拭き取り部55は、塗布装置40に付着している付着物をこそぎ取るように拭き取ることができる。拭き残された付着物を減少することができ、不良品の発生をさらに抑制できる。 Further, when the coating device 40 is the contact type first coating device 41, the wiping device 50 automatically wipes off the adhered matter by using the plate-shaped wiping portion 55. As a result, the plate-shaped wiping portion 55 can be wiped off so as to scrape off the deposits adhering to the coating device 40, as compared with the case where the wiping portion is a cloth such as a waste cloth. The amount of deposits left after wiping can be reduced, and the occurrence of defective products can be further suppressed.
 また、停止期間中に、拭き取る工程S40の前に、塗布装置40が資材5の搬送路35から離れるように、塗布装置40及び搬送路35の少なくとも一方が移動する。これにより、資材5の搬送中に資材5の搬送路35によって、拭き取り部55が塗布装置40と搬送路35との間に入り込んで拭き取るスペースがない場合であっても、塗布装置40及び資材5の搬送路35の少なくとも一方が移動することで、搬送路35と塗布装置40との間にスペースが発生する。これにより、拭き取り装置50を用いて拭き取ることができるため、不良品の発生をさらに抑制できる。 Further, during the stop period, at least one of the coating device 40 and the transport path 35 is moved so that the coating device 40 is separated from the transport path 35 of the material 5 before the wiping step S40. As a result, even when the wiping portion 55 enters between the coating device 40 and the transport path 35 by the transport path 35 of the material 5 during the transport of the material 5 and there is no space for wiping, the coating device 40 and the material 5 By moving at least one of the transport paths 35, a space is generated between the transport path 35 and the coating device 40. As a result, the wiping device 50 can be used for wiping, so that the occurrence of defective products can be further suppressed.
 また、拭き取りしてから所定期間が経過するまで、塗布装置40が接着剤HMを安定的に配置できないことがある。所定期間中に接着剤HMが配置されることで製造された所定の吸収性物品2を廃棄することで、不良品の発生を抑制することができる。 In addition, the coating device 40 may not be able to stably arrange the adhesive HM until a predetermined period has elapsed after wiping. By disposing of the predetermined absorbent article 2 produced by arranging the adhesive HM during the predetermined period, the occurrence of defective products can be suppressed.
 次に、拭き取り装置50を選択する工程について、説明する。図10に示すように、吸収性物品2の製造方法は、工程S110から工程S140の工程を有してよい。工程S110において、制御部20は、吸収性物品2の生産が停止されているか否かを判定する。生産が停止されていない場合、すなわち、工程S10又は工程S60の工程が行われている場合、工程S110を繰り返す。一方で、吸収性物品2の生産が停止されている場合、工程S120を行う。 Next, the process of selecting the wiping device 50 will be described. As shown in FIG. 10, the method for producing the absorbent article 2 may include steps S110 to S140. In step S110, the control unit 20 determines whether or not the production of the absorbent article 2 has been stopped. If the production is not stopped, that is, if the process of step S10 or step S60 is being performed, the step S110 is repeated. On the other hand, when the production of the absorbent article 2 is stopped, the step S120 is performed.
 工程S120において、停止期間中に付着物を拭き取る拭き取り装置50を選択する。制御部20は、以下の基準により拭き取り装置50を選択することができる。選択された拭き取り装置50が拭き取るため、停止期間毎に全ての拭き取り装置50を稼働する場合と比較して、運用コストを低減することができる。 In step S120, the wiping device 50 that wipes off the deposits during the stop period is selected. The control unit 20 can select the wiping device 50 according to the following criteria. Since the selected wiping device 50 wipes, the operating cost can be reduced as compared with the case where all the wiping devices 50 are operated for each stop period.
 塗布装置40毎の最後の拭き取りからの経過時間に応じて、拭き取り装置50を選択してよい。例えば、最後の拭き取りからの経過時間が所定値以上である拭き取り装置50を選択してよい。最後の拭き取りからの経過時間が所定値未満である拭き取り装置50を選択しなくてよい。拭き取りから時間が経過するほど、塗布装置40に付着物が付着する。最後の拭き取りからの経過時間に応じて選択することで、拭き取りが必要な塗布装置40を適切に選択することができる。 The wiping device 50 may be selected according to the elapsed time from the last wiping for each coating device 40. For example, the wiping device 50 in which the elapsed time from the last wiping is equal to or longer than a predetermined value may be selected. It is not necessary to select the wiping device 50 in which the elapsed time from the last wiping is less than a predetermined value. As time elapses from wiping, deposits adhere to the coating device 40. By selecting according to the elapsed time from the last wiping, the coating device 40 that requires wiping can be appropriately selected.
 接着剤HMの配置方法及び配置パターンの少なくとも一方に起因した塗布装置40の汚れ具合に応じて拭き取り装置50を選択してよい。接着剤HMの配置方法及び配置パターンによって、塗布装置40の汚れ具合が変わってくる。塗布装置40の汚れ具合に応じて選択することで、拭き取りが必要な塗布装置40を適切に選択することができる。例えば、第1塗布装置41の方が、第2塗布装置42よりも汚れやすいため、第1拭き取り装置51を選択する頻度を第2拭き取り装置52を選択する頻度よりも多くしてもよい。また、塗布装置40が接着剤HMを吐出する時間が長いほど汚れやすい。従って、接着剤HMを吐出する時間が長い塗布装置40を拭き取る拭き取り装置50を優先的に選択してもよい。 The wiping device 50 may be selected according to the degree of dirt on the coating device 40 due to at least one of the arrangement method and the arrangement pattern of the adhesive HM. The degree of contamination of the coating device 40 varies depending on the arrangement method and arrangement pattern of the adhesive HM. By selecting according to the degree of dirt on the coating device 40, it is possible to appropriately select the coating device 40 that needs to be wiped off. For example, since the first coating device 41 is more likely to get dirty than the second coating device 42, the frequency of selecting the first wiping device 51 may be higher than the frequency of selecting the second wiping device 52. Further, the longer the time for the coating device 40 to discharge the adhesive HM, the easier it is to get dirty. Therefore, the wiping device 50 that wipes off the coating device 40 that takes a long time to discharge the adhesive HM may be preferentially selected.
 なお、ある停止期間において、全ての拭き取り装置50が選択されなくてもよい。この場合、工程S30から工程S50の工程は、省略されてもよい。また、ある停止期間において、全ての拭き取り装置50が選択されてもよい。例えば、予定停止期間では、全ての拭き取り装置50が選択されてもよい。 Note that not all wiping devices 50 need to be selected during a certain stop period. In this case, the steps from step S30 to step S50 may be omitted. Also, during a certain stop period, all wiping devices 50 may be selected. For example, during the scheduled outage period, all wiping devices 50 may be selected.
 工程S130では、選択された拭き取り装置50が拭き取りを開始してから終了するまでの拭き取り時間に応じて、停止期間を調整する。これにより、拭き取り時間に応じて停止期間を短縮することも可能であるため、吸収性物品の生産性を高めることができる。例えば、最も長い拭き取り時間と予備的な時間との合計時間を停止期間として設定してよい。これにより、停止期間毎に最適な停止期間を設定することができる。工程S140では、選択された拭き取り装置50を用いて自動的な拭き取りを行う。工程S140では、選択された拭き取り装置50が工程S30の動作を実行する。 In step S130, the stop period is adjusted according to the wiping time from the start to the end of wiping by the selected wiping device 50. As a result, the suspension period can be shortened according to the wiping time, so that the productivity of the absorbent article can be increased. For example, the total time of the longest wiping time and the preliminary time may be set as the stop period. As a result, the optimum stop period can be set for each stop period. In step S140, automatic wiping is performed using the selected wiping device 50. In step S140, the selected wiping device 50 executes the operation of step S30.
 (4)その他実施形態
 以上、上述の実施形態を用いて本発明について詳細に説明したが、当業者にとっては、本発明が本明細書中に説明した実施形態に限定されるものではないということは明らかである。本発明は、特許請求の範囲の記載により定まる本発明の趣旨及び範囲を逸脱することなく修正及び変更態様として実施することができる。したがって、本明細書の記載は、例示説明を目的とするものであり、本発明に対して何ら制限的な意味を有するものではない。上述の実施形態、及びその他実施形態に係る吸収性物品の製造方法に係る構成は、適宜組み合わせることが可能である。
(4) Other Embodiments Although the present invention has been described in detail using the above-described embodiments, the present invention is not limited to the embodiments described in the present specification for those skilled in the art. Is clear. The present invention can be implemented as modifications and modifications without departing from the spirit and scope of the invention as defined by the claims. Therefore, the description of the present specification is for the purpose of exemplification and does not have any limiting meaning to the present invention. The above-described embodiment and other configurations according to the method for producing an absorbent article according to the other embodiment can be appropriately combined.
 なお、2019年12月13日に出願された日本国特許出願第2019-225522号の全内容が、参照により、本明細書に組み込まれる。 The entire contents of Japanese Patent Application No. 2019-225522 filed on December 13, 2019 are incorporated herein by reference.
 資材の搬送が停止されている停止期間中に塗布装置に付着した付着物を拭き取る拭取工程を備えた吸収性物品の製造方法であって、運用コストの増加を抑制しつつ、吸収性物品の生産性を高めることが可能である吸収性物品の製造方法を提供できる。 This is a method for manufacturing an absorbent article having a wiping step of wiping off the deposits adhering to the coating device during the suspension period when the transportation of the material is stopped. It is possible to provide a method for producing an absorbent article that can increase productivity.
 1:製造装置、2:吸収性物品、2A:吸収体、2B:トップシート、2C:バックシート、2D:外装シート、5:資材、8:壁部、10:製造ライン装置、10A:装置エリア、20:制御部、30:投入口、35:搬送路、40:塗布装置、45:吐出口、50:拭き取り装置、55:拭き取り部、100:安全カバー、HM:接着剤(ホットメルト接着剤)、MD:搬送方向、PA:通路エリア、SA:安全エリア 1: Manufacturing equipment 2: Absorbent article, 2A: Absorber, 2B: Top sheet, 2C: Back sheet, 2D: Exterior sheet, 5: Material, 8: Wall part, 10: Manufacturing line equipment, 10A: Equipment area , 20: Control unit, 30: Input port, 35: Transport path, 40: Coating device, 45: Discharge port, 50: Wiping device, 55: Wiping part, 100: Safety cover, HM: Adhesive (hot melt adhesive) ), MD: Transport direction, PA: Aisle area, SA: Safety area

Claims (15)

  1.  吸収性物品用の資材の搬送中に、ホットメルト接着剤を吐出する吐出口を有する塗布装置を用いて、前記ホットメルト接着剤を前記資材に配置する工程と、
     前記資材の搬送が停止されている停止期間中に、前記塗布装置に付着した付着物を拭き取る工程と、を有する吸収性物品の製造方法であって、
     前記拭き取る工程では、前記停止期間中に、前記付着物を拭き取る拭き取り部を有する拭き取り装置を用いて、前記吐出口を含む領域において前記付着物を自動的に拭き取る吸収性物品の製造方法。
    A step of arranging the hot melt adhesive on the material by using a coating device having a discharge port for discharging the hot melt adhesive during transportation of the material for the absorbent article.
    A method for producing an absorbent article, which comprises a step of wiping off deposits adhering to the coating device during a stop period during which the transportation of the material is stopped.
    In the wiping step, a method for producing an absorbent article that automatically wipes off the deposits in a region including the discharge port by using a wiping device having a wiping portion for wiping the deposits during the stop period.
  2.  前記吸収性物品の製造方法は、前記拭き取り工程後の前記資材の搬送中に前記拭き取り部を作業者がメンテナンスできる安全な位置まで、前記拭き取る工程後に前記拭き取り部が自動的に移動する工程を有する請求項1に記載の吸収性物品の製造方法。 The method for manufacturing an absorbent article includes a step of automatically moving the wiping portion to a safe position where an operator can maintain the wiping portion during transportation of the material after the wiping step. The method for producing an absorbent article according to claim 1.
  3.  前記資材を搬送する搬送路と前記作業者が通る通路エリアとの間には、前記資材の搬送中に前記資材への接触を防ぐための安全カバーが設けられており、
     前記移動する工程では、前記付着物を拭き取った後に、前記拭き取り部が前記安全カバーの方へ自動的に移動する請求項2に記載の吸収性物品の製造方法。
    A safety cover is provided between the transport path for transporting the material and the passage area through which the worker passes to prevent contact with the material during transport of the material.
    The method for producing an absorbent article according to claim 2, wherein in the moving step, after the deposits are wiped off, the wiping portion automatically moves toward the safety cover.
  4.  前記拭き取る工程では、前記拭き取り部が、前記安全カバーの方へ移動しながら、前記付着物を自動的に拭き取る請求項3に記載の吸収性物品の製造方法。 The method for manufacturing an absorbent article according to claim 3, wherein in the wiping step, the wiping portion moves toward the safety cover and automatically wipes off the deposits.
  5.  前記停止期間は、事前にスケジュールされている予定停止期間と、前記資材の搬送中に停止が決定された緊急停止期間と、を含む請求項1から4のいずれか1項に記載の吸収性物品の製造方法。 The absorbent article according to any one of claims 1 to 4, wherein the suspension period includes a scheduled suspension period scheduled in advance and an emergency suspension period determined to be suspended during transportation of the material. Manufacturing method.
  6.  前記塗布装置は、前記ホットメルト接着剤の配置方法及び前記ホットメルト接着剤の配置パターンの少なくとも一方が異なる複数の塗布装置により構成されており、
     前記拭き取り装置は、前記複数の塗布装置のそれぞれから前記付着物を拭き取るために複数の拭き取り装置により構成されており、
     前記拭き取る工程では、前記複数の拭き取り装置が前記付着物を拭き取る稼働時間が重複している請求項1から5のいずれか1項に記載の吸収性物品の製造方法。
    The coating device is composed of a plurality of coating devices in which at least one of the hot melt adhesive arrangement method and the hot melt adhesive arrangement pattern is different.
    The wiping device is composed of a plurality of wiping devices for wiping the deposits from each of the plurality of coating devices.
    The method for producing an absorbent article according to any one of claims 1 to 5, wherein in the wiping step, the operating times of the plurality of wiping devices for wiping the deposits overlap.
  7.  前記複数の拭き取り装置の中から、前記停止期間中に前記付着物を拭き取る拭き取り装置を選択する工程を有する請求項6に記載の吸収性物品の製造方法。 The method for producing an absorbent article according to claim 6, further comprising a step of selecting a wiping device for wiping the deposits from the plurality of wiping devices during the stop period.
  8.  前記選択する工程では、前記ホットメルト接着剤の前記配置方法及び前記配置パターンの少なくとも一方に起因した前記塗布装置の汚れ具合に応じて、前記拭き取り装置を選択する請求項7に記載の吸収性物品の製造方法。 The absorbent article according to claim 7, wherein in the selecting step, the wiping device is selected according to the degree of contamination of the coating device due to at least one of the arrangement method and the arrangement pattern of the hot melt adhesive. Manufacturing method.
  9.  前記選択する工程では、前記塗布装置毎の最後の拭き取りからの経過時間に応じて、前記拭き取り装置を選択する請求項7又は8に記載の吸収性物品の製造方法。 The method for producing an absorbent article according to claim 7 or 8, wherein in the selection step, the wiping device is selected according to the elapsed time from the last wiping for each coating device.
  10.  前記選択された拭き取り装置が拭き取りを開始してから終了するまでの拭き取り時間に応じて、前記停止期間を調整する請求項7から9のいずれか1項に記載の吸収性物品の製造方法。 The method for producing an absorbent article according to any one of claims 7 to 9, wherein the stop period is adjusted according to the wiping time from the start to the end of wiping by the selected wiping device.
  11.  前記拭き取る工程では、固化したホットメルト接着剤が前記拭き取り部に付着した状態で、前記付着物を自動的に拭き取る請求項1から10のいずれか1項に記載の吸収性物品の製造方法。 The method for producing an absorbent article according to any one of claims 1 to 10, wherein in the wiping step, the adhered matter is automatically wiped off in a state where the solidified hot melt adhesive is attached to the wiping portion.
  12.  前記拭き取る工程では、前記吐出口に加えて、前記資材が搬送される搬送方向における前記吐出口よりも上流側の部分及び前記吐出口よりも下流側の部分を含む前記領域において、前記付着物を拭き取る請求項1から11のいずれか1項に記載の吸収性物品の製造方法。 In the wiping step, in addition to the discharge port, the deposit is removed in the region including a portion upstream of the discharge port and a portion downstream of the discharge port in the transport direction in which the material is transported. The method for producing an absorbent article according to any one of claims 1 to 11.
  13.  前記塗布装置が接触式の塗布装置である場合、前記拭き取り装置は、板状の前記拭き取り部を用いて、前記付着物を自動的に拭き取る請求項1から12のいずれか1項に記載の吸収性物品の製造方法。 The absorption according to any one of claims 1 to 12, wherein when the coating device is a contact-type coating device, the wiping device automatically wipes off the deposits by using the plate-shaped wiping portion. Manufacturing method of sex goods.
  14.  前記停止期間中に、前記拭き取る工程の前に、前記塗布装置が前記資材の搬送路から離れるように、前記塗布装置及び前記資材の搬送路の少なくとも一方が移動する工程を有する請求項1から13のいずれか1項に記載の吸収性物品の製造方法。 Claims 1 to 13 include a step of moving at least one of the coating device and the material transport path so that the coating device is separated from the material transport path before the wiping step during the stop period. The method for producing an absorbent article according to any one of the above items.
  15.  前記停止期間が終了してから所定期間が経過するまでの間に、前記ホットメルト接着剤が配置された所定の資材を用いて、所定の吸収性物品を組み立てる工程と、
     前記所定の吸収性物品を廃棄する工程と、を有する請求項1から14のいずれか1項に記載の吸収性物品の製造方法。
    A step of assembling a predetermined absorbent article using a predetermined material on which the hot melt adhesive is arranged between the end of the suspension period and the elapse of the predetermined period.
    The method for producing an absorbent article according to any one of claims 1 to 14, further comprising a step of discarding the predetermined absorbent article.
PCT/JP2020/042949 2019-12-13 2020-11-18 Manufacturing method for absorbent article WO2021117435A1 (en)

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