WO2021112142A1 - Resin composition for sealing, electronic device, and method for producing electronic device - Google Patents
Resin composition for sealing, electronic device, and method for producing electronic device Download PDFInfo
- Publication number
- WO2021112142A1 WO2021112142A1 PCT/JP2020/044931 JP2020044931W WO2021112142A1 WO 2021112142 A1 WO2021112142 A1 WO 2021112142A1 JP 2020044931 W JP2020044931 W JP 2020044931W WO 2021112142 A1 WO2021112142 A1 WO 2021112142A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin composition
- mass
- sealing resin
- epoxy resin
- sealing
- Prior art date
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 105
- 239000011342 resin composition Substances 0.000 title claims abstract description 103
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- -1 ester compound Chemical class 0.000 claims abstract description 102
- 239000003822 epoxy resin Substances 0.000 claims abstract description 81
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 81
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 77
- 229920001577 copolymer Polymers 0.000 claims abstract description 61
- 239000004711 α-olefin Substances 0.000 claims abstract description 20
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000011256 inorganic filler Substances 0.000 claims description 31
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 31
- 239000001993 wax Substances 0.000 claims description 27
- 125000004432 carbon atom Chemical group C* 0.000 claims description 20
- 150000002148 esters Chemical class 0.000 claims description 16
- 229920000098 polyolefin Polymers 0.000 claims description 13
- 238000007334 copolymerization reaction Methods 0.000 claims description 5
- 239000003566 sealing material Substances 0.000 claims 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 46
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 42
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 35
- 150000001875 compounds Chemical class 0.000 description 29
- 238000000034 method Methods 0.000 description 28
- 229920005989 resin Polymers 0.000 description 24
- 239000011347 resin Substances 0.000 description 24
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 19
- 239000005011 phenolic resin Substances 0.000 description 17
- 150000002989 phenols Chemical class 0.000 description 16
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 15
- 238000006243 chemical reaction Methods 0.000 description 15
- 238000002844 melting Methods 0.000 description 15
- 230000008018 melting Effects 0.000 description 15
- 239000006082 mold release agent Substances 0.000 description 14
- 239000002245 particle Substances 0.000 description 14
- 239000007822 coupling agent Substances 0.000 description 12
- 239000003063 flame retardant Substances 0.000 description 12
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 11
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 10
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 10
- 125000000524 functional group Chemical group 0.000 description 10
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 10
- 150000002500 ions Chemical class 0.000 description 10
- 239000007983 Tris buffer Substances 0.000 description 9
- 125000000217 alkyl group Chemical group 0.000 description 9
- 229920003986 novolac Polymers 0.000 description 9
- 239000004593 Epoxy Substances 0.000 description 8
- 150000001412 amines Chemical class 0.000 description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 8
- 239000003086 colorant Substances 0.000 description 8
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 8
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 125000003118 aryl group Chemical group 0.000 description 7
- 239000002270 dispersing agent Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 6
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 238000004891 communication Methods 0.000 description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 239000003960 organic solvent Substances 0.000 description 6
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 125000003700 epoxy group Chemical group 0.000 description 5
- 125000004185 ester group Chemical group 0.000 description 5
- 238000005227 gel permeation chromatography Methods 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 4
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical compound CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 4
- NADHCXOXVRHBHC-UHFFFAOYSA-N 2,3-dimethoxycyclohexa-2,5-diene-1,4-dione Chemical compound COC1=C(OC)C(=O)C=CC1=O NADHCXOXVRHBHC-UHFFFAOYSA-N 0.000 description 4
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 4
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 4
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 4
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 4
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical compound CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000005350 fused silica glass Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 125000001038 naphthoyl group Chemical group C1(=CC=CC2=CC=CC=C12)C(=O)* 0.000 description 4
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 150000004714 phosphonium salts Chemical class 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 230000001629 suppression Effects 0.000 description 4
- 229940005561 1,4-benzoquinone Drugs 0.000 description 3
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 3
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000003377 acid catalyst Substances 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000004305 biphenyl Substances 0.000 description 3
- 235000010290 biphenyl Nutrition 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 3
- XPFVYQJUAUNWIW-UHFFFAOYSA-N furfuryl alcohol Chemical compound OCC1=CC=CO1 XPFVYQJUAUNWIW-UHFFFAOYSA-N 0.000 description 3
- 238000007429 general method Methods 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- GOQYKNQRPGWPLP-UHFFFAOYSA-N heptadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 235000013872 montan acid ester Nutrition 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 125000001624 naphthyl group Chemical group 0.000 description 3
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000001721 transfer moulding Methods 0.000 description 3
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- OOCCDEMITAIZTP-QPJJXVBHSA-N (E)-cinnamyl alcohol Chemical compound OC\C=C\C1=CC=CC=C1 OOCCDEMITAIZTP-QPJJXVBHSA-N 0.000 description 2
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N 1-Heptene Chemical compound CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 2
- OMXANELYEWRDAW-UHFFFAOYSA-N 1-Hexacosene Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCC=C OMXANELYEWRDAW-UHFFFAOYSA-N 0.000 description 2
- BVOSSZSHBZQJOI-UHFFFAOYSA-N 1-Hexen-3-ol Chemical compound CCCC(O)C=C BVOSSZSHBZQJOI-UHFFFAOYSA-N 0.000 description 2
- VQOXUMQBYILCKR-UHFFFAOYSA-N 1-Tridecene Chemical compound CCCCCCCCCCCC=C VQOXUMQBYILCKR-UHFFFAOYSA-N 0.000 description 2
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
- 229940106006 1-eicosene Drugs 0.000 description 2
- ADOBXTDBFNCOBN-UHFFFAOYSA-N 1-heptadecene Chemical compound CCCCCCCCCCCCCCCC=C ADOBXTDBFNCOBN-UHFFFAOYSA-N 0.000 description 2
- BBMCTIGTTCKYKF-UHFFFAOYSA-N 1-heptanol Chemical compound CCCCCCCO BBMCTIGTTCKYKF-UHFFFAOYSA-N 0.000 description 2
- GQEZCXVZFLOKMC-UHFFFAOYSA-N 1-hexadecene Chemical compound CCCCCCCCCCCCCCC=C GQEZCXVZFLOKMC-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- PJLHTVIBELQURV-UHFFFAOYSA-N 1-pentadecene Chemical compound CCCCCCCCCCCCCC=C PJLHTVIBELQURV-UHFFFAOYSA-N 0.000 description 2
- HFDVRLIODXPAHB-UHFFFAOYSA-N 1-tetradecene Chemical compound CCCCCCCCCCCCC=C HFDVRLIODXPAHB-UHFFFAOYSA-N 0.000 description 2
- DCTOHCCUXLBQMS-UHFFFAOYSA-N 1-undecene Chemical compound CCCCCCCCCC=C DCTOHCCUXLBQMS-UHFFFAOYSA-N 0.000 description 2
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 2
- ZEGDFCCYTFPECB-UHFFFAOYSA-N 2,3-dimethoxy-1,4-benzoquinone Natural products C1=CC=C2C(=O)C(OC)=C(OC)C(=O)C2=C1 ZEGDFCCYTFPECB-UHFFFAOYSA-N 0.000 description 2
- AIACLXROWHONEE-UHFFFAOYSA-N 2,3-dimethylcyclohexa-2,5-diene-1,4-dione Chemical compound CC1=C(C)C(=O)C=CC1=O AIACLXROWHONEE-UHFFFAOYSA-N 0.000 description 2
- SENUUPBBLQWHMF-UHFFFAOYSA-N 2,6-dimethylcyclohexa-2,5-diene-1,4-dione Chemical compound CC1=CC(=O)C=C(C)C1=O SENUUPBBLQWHMF-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- RLQZIECDMISZHS-UHFFFAOYSA-N 2-phenylcyclohexa-2,5-diene-1,4-dione Chemical compound O=C1C=CC(=O)C(C=2C=CC=CC=2)=C1 RLQZIECDMISZHS-UHFFFAOYSA-N 0.000 description 2
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 2
- 125000002252 acyl group Chemical group 0.000 description 2
- 239000005456 alcohol based solvent Substances 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000007809 chemical reaction catalyst Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical class [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 2
- CRGRWBQSZSQVIE-UHFFFAOYSA-N diazomethylbenzene Chemical compound [N-]=[N+]=CC1=CC=CC=C1 CRGRWBQSZSQVIE-UHFFFAOYSA-N 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 2
- 229940069096 dodecene Drugs 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000004210 ether based solvent Substances 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- YYLACZAXCCJCJO-UHFFFAOYSA-N heptacos-1-ene Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCC=C YYLACZAXCCJCJO-UHFFFAOYSA-N 0.000 description 2
- BXWNKGSJHAJOGX-UHFFFAOYSA-N hexadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCO BXWNKGSJHAJOGX-UHFFFAOYSA-N 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- PHTQWCKDNZKARW-UHFFFAOYSA-N isoamylol Chemical compound CC(C)CCO PHTQWCKDNZKARW-UHFFFAOYSA-N 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 229910000000 metal hydroxide Inorganic materials 0.000 description 2
- 150000004692 metal hydroxides Chemical class 0.000 description 2
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 2
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 2
- VAMFXQBUQXONLZ-UHFFFAOYSA-N n-alpha-eicosene Natural products CCCCCCCCCCCCCCCCCCC=C VAMFXQBUQXONLZ-UHFFFAOYSA-N 0.000 description 2
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 2
- 150000002790 naphthalenes Chemical group 0.000 description 2
- 150000004780 naphthols Chemical class 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 description 2
- ZWRUINPWMLAQRD-UHFFFAOYSA-N nonan-1-ol Chemical compound CCCCCCCCCO ZWRUINPWMLAQRD-UHFFFAOYSA-N 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 2
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- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical compound NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 239000003826 tablet Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 125000005497 tetraalkylphosphonium group Chemical class 0.000 description 1
- MCZDHTKJGDCTAE-UHFFFAOYSA-M tetrabutylazanium;acetate Chemical compound CC([O-])=O.CCCC[N+](CCCC)(CCCC)CCCC MCZDHTKJGDCTAE-UHFFFAOYSA-M 0.000 description 1
- ZDLBWMYNYNATIW-UHFFFAOYSA-N tetracos-1-ene Chemical compound CCCCCCCCCCCCCCCCCCCCCCC=C ZDLBWMYNYNATIW-UHFFFAOYSA-N 0.000 description 1
- GTCDARUMAMVCRO-UHFFFAOYSA-M tetraethylazanium;acetate Chemical compound CC([O-])=O.CC[N+](CC)(CC)CC GTCDARUMAMVCRO-UHFFFAOYSA-M 0.000 description 1
- PSEQWFPWQRZBOO-UHFFFAOYSA-M tetrahexylazanium;benzoate Chemical compound [O-]C(=O)C1=CC=CC=C1.CCCCCC[N+](CCCCCC)(CCCCCC)CCCCCC PSEQWFPWQRZBOO-UHFFFAOYSA-M 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- DGQOCLATAPFASR-UHFFFAOYSA-N tetrahydroxy-1,4-benzoquinone Chemical compound OC1=C(O)C(=O)C(O)=C(O)C1=O DGQOCLATAPFASR-UHFFFAOYSA-N 0.000 description 1
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- IFXORIIYQORRMJ-UHFFFAOYSA-N tribenzylphosphane Chemical compound C=1C=CC=CC=1CP(CC=1C=CC=CC=1)CC1=CC=CC=C1 IFXORIIYQORRMJ-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- 229940087291 tridecyl alcohol Drugs 0.000 description 1
- DMEUUKUNSVFYAA-UHFFFAOYSA-N trinaphthalen-1-ylphosphane Chemical compound C1=CC=C2C(P(C=3C4=CC=CC=C4C=CC=3)C=3C4=CC=CC=C4C=CC=3)=CC=CC2=C1 DMEUUKUNSVFYAA-UHFFFAOYSA-N 0.000 description 1
- WXAZIUYTQHYBFW-UHFFFAOYSA-N tris(4-methylphenyl)phosphane Chemical compound C1=CC(C)=CC=C1P(C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 WXAZIUYTQHYBFW-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 150000003755 zirconium compounds Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Definitions
- the present disclosure relates to a sealing resin composition, an electronic component device, and a method for manufacturing the electronic component device.
- the amount of transmission loss generated by heat conversion of radio waves transmitted for communication in a dielectric is expressed as the product of the square root of frequency and relative permittivity and the dielectric loss tangent. That is, since the transmission signal is easily converted into heat in proportion to the frequency, the material of the communication member is required to have low dielectric properties in the high frequency band in order to suppress the transmission loss.
- Patent Documents 1 and 2 disclose a thermosetting resin composition containing an active ester resin as a curing agent for an epoxy resin, and it is said that the dielectric loss tangent of the cured product can be suppressed to a low level.
- Patent Document 1 Japanese Patent Application Laid-Open No. 2012-246367
- Patent Document 2 Japanese Patent Application Laid-Open No. 2014-114352
- the frequency of radio waves is increasing as the number of channels increases and the amount of information transmitted increases.
- studies on 5th generation mobile communication systems are underway worldwide, and some of the frequency band candidates to be used are in the range of about 30 GHz to 70 GHz.
- the mainstream of wireless communication will be communication in such a high frequency band, so that the material of the communication member is required to have a lower dielectric loss tangent.
- An active ester compound as a curing agent for an epoxy resin is advantageous in that the dielectric property of a cured product is suppressed to be lower than that of a phenol curing agent or an amine curing agent.
- the sealing resin composition containing an active ester compound as a curing agent for the epoxy resin tends to be inferior in the releasability of the cured product.
- a sealing resin composition that reduces the dielectric loss tangent of a cured product and has excellent releasability of the cured product, an electronic component device sealed using the same, and sealing using the same.
- An object of the present invention is to provide a method for manufacturing an electronic component device.
- ⁇ 4> The sealing resin composition according to any one of ⁇ 1> to ⁇ 3>, wherein the content of the copolymer is 0.25 parts by mass to 5 parts by mass with respect to 100 parts by mass of the epoxy resin.
- ⁇ 5> The sealing resin composition according to any one of ⁇ 1> to ⁇ 4>, wherein the weight average molecular weight of the copolymer is 5000 to 100,000.
- ⁇ 6> The sealing resin composition according to any one of ⁇ 1> to ⁇ 5>, which further contains at least one selected from the group consisting of polyolefin waxes and ester waxes.
- ⁇ 7> The sealing content according to ⁇ 6>, wherein the content of at least one selected from the group consisting of the polyolefin-based wax and the ester-based wax is 0.5 parts by mass to 10 parts by mass with respect to 100 parts by mass of the epoxy resin.
- Resin composition. ⁇ 8> The sealing resin composition according to any one of ⁇ 1> to ⁇ 7>, which further contains an inorganic filler.
- Electronic component device equipped with ⁇ 10> Placing the element on the support member and Sealing the element with the sealing resin composition according to any one of ⁇ 1> to ⁇ 8>. Manufacturing method of electronic component equipment including.
- a sealing resin composition that reduces the dielectric loss tangent of the cured product and has excellent releasability of the cured product, an electronic component device sealed using the same, and sealing using the same. A method of manufacturing an electronic component device to be stopped is provided.
- the term "process” includes not only a process independent of other processes but also the process if the purpose of the process is achieved even if the process cannot be clearly distinguished from the other process. ..
- the numerical range indicated by using "-" in the present disclosure includes the numerical values before and after "-" as the minimum value and the maximum value, respectively.
- the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value of another numerical range described stepwise. ..
- the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples.
- each component may contain a plurality of applicable substances.
- the content or content of each component is the total content or content of the plurality of substances present in the composition unless otherwise specified.
- a plurality of types of particles corresponding to each component may be contained.
- the particle size of each component means a value for a mixture of the plurality of particles present in the composition unless otherwise specified.
- the sealing resin composition according to the embodiment of the present disclosure is a copolymer of an epoxy resin, a curing agent containing an active ester compound, an ⁇ -olefin having 5 to 30 carbon atoms, and maleic anhydride (hereinafter, "" Also referred to as “specific copolymer”).
- the active ester compound in the present disclosure refers to a compound having one or more ester groups that react with an epoxy group in one molecule and having a curing action of an epoxy resin.
- a phenol curing agent, an amine curing agent, or the like is generally used as a curing agent for an epoxy resin, but a secondary hydroxyl group is generated in the reaction between the epoxy resin and the phenol curing agent or the amine curing agent.
- an ester group is generated instead of the secondary hydroxyl group. Since the ester group has a lower polarity than the secondary hydroxyl group, the sealing resin composition of the present disclosure is compared with the sealing resin composition containing only a curing agent that generates a secondary hydroxyl group as a curing agent. The dielectric positive contact of the cured product can be kept low.
- the polar groups in the cured product enhance the water absorption of the cured product, and by using an active ester compound as the curing agent, the concentration of polar groups in the cured product can be suppressed, and the water absorption of the cured product can be suppressed. it can. Then, suppressing the water absorption of the cured product, that is, by suppressing the H 2 O content is a polar molecule, it is possible to suppress even lower dielectric loss tangent of a cured product.
- a sealing resin composition containing an active ester compound as a curing agent for an epoxy resin may be inferior in releasability of the cured product, although the dielectric loss tangent of the cured product is reduced.
- the unreacted active ester compound contained in the cured product is the cause of the decrease in releasability.
- the sealing resin composition of the present embodiment by further containing a specific copolymer in addition to the epoxy resin and the active ester compound, the dielectric loss tangent of the cured product can be reduced and the releasability of the cured product can be improved. Are compatible. The reason is not clear, but it is presumed as follows.
- the specific copolymer has a long-chain alkyl group
- the structure derived from maleic anhydride in the specific copolymer is compatible with the active ester compound, so that the dispersibility of the active ester compound is improved. Therefore, it is considered that the reaction efficiency of the active ester compound is improved and the unreacted active ester compound is less likely to remain in the cured product, thereby suppressing the decrease in releasability due to the unreacted active ester compound.
- the sealing resin composition of the present embodiment reduces the dielectric loss tangent of the cured product and is excellent in the releasability of the cured product.
- each component contained in the sealing resin composition according to the present embodiment will be described.
- epoxy resin The type of epoxy resin is not particularly limited as long as it has an epoxy group in the molecule.
- the epoxy resin is at least one selected from the group consisting of phenol compounds such as phenol, cresol, xylenol, resorcin, catechol, bisphenol A and bisphenol F, and naphthol compounds such as ⁇ -naphthol, ⁇ -naphthol and dihydroxynaphthalene.
- a novolak type epoxy resin (phenol novolak) which is an epoxidized novolak resin obtained by condensing or cocondensing a kind of phenolic compound and an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, propionaldehyde, etc. under an acidic catalyst.
- Diphenylmethane type epoxy resin which is a diglycidyl ether such as bisphenol A and bisphenol F
- Biphenyl type epoxy resin which is an alkyl-substituted or unsubstituted biphenol diglycidyl ether
- Stilben-type epoxy which is a diglycidyl ether of a stelvene-based phenol compound.
- Sulfur atom-containing epoxy resin that is a diglycidyl ether such as bisphenol S
- Epoxide resin that is an alcoholic glycidyl ether such as butanediol, polyethylene glycol, polypropylene glycol
- Glysidyl ester type epoxy resin which is a glycidyl ester of a carboxylic acid compound
- Glysidylamine type epoxy resin which is obtained by substituting an active hydrogen bonded to a nitrogen atom such as aniline, diaminodiphenylmethane, or isocyanuric acid with a glycidyl group
- dicyclopentadiene and phenol Sulfur atom-containing epoxy resin that is a diglycidyl ether such as bisphenol S
- Epoxide resin that is an alcoholic glycidyl ether such as butanediol, polyethylene glycol, polypropylene glycol
- Glysidyl ester type epoxy resin
- Dicyclopentadiene-type epoxy resin obtained by epoxidizing a cocondensation resin of a compound; vinylcyclohexene epoxide obtained by epoxidizing an olefin bond in a molecule, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane Carboxylate, 2- (3,4-epoxide) cyclohexy
- An alicyclic epoxy resin such as Lu-5,5-spiro (3,4-epoxy) cyclohexane-m-dioxane; a paraxylylene-modified epoxy resin which is a glycidyl ether of a paraxylylene-modified phenol resin; a glycidyl ether of a metaxylylene-modified phenol resin.
- Metaxylylene-modified epoxy resin Terpen-modified epoxy resin, which is a glycidyl ether of terpen-modified phenol resin; Dicyclopentadiene-modified epoxy resin, which is a glycidyl ether of dicyclopentadiene-modified phenol resin; Cyclopentadiene-modified, which is a glycidyl ether of cyclopentadiene-modified phenol resin.
- Epoxy resin Polycyclic aromatic ring-modified epoxy resin which is a glycidyl ether of a polycyclic aromatic ring-modified phenol resin; Naphthalene type epoxy resin which is a glycidyl ether of a naphthalene ring-containing phenol resin; Halogenated phenol novolac type epoxy resin; Hydroquinone type epoxy resin Trimethylol propane type epoxy resin; Linear aliphatic epoxy resin obtained by oxidizing an olefin bond with a peracid such as peracetic acid; Epoxy aralkyl type phenol resin such as phenol aralkyl resin and naphthol aralkyl resin. Aralkill type epoxy resin; etc. Further, an epoxy resin such as an acrylic resin is also mentioned as an epoxy resin. These epoxy resins may be used alone or in combination of two or more.
- the epoxy equivalent (molecular weight / number of epoxy groups) of the epoxy resin is not particularly limited. From the viewpoint of balancing various characteristics such as moldability, reflow resistance, and electrical reliability, the epoxy equivalent of the epoxy resin is preferably 100 g / eq to 1000 g / eq, and is 150 g / eq to 500 g / eq. Is more preferable.
- the epoxy equivalent of the epoxy resin shall be a value measured by a method according to JIS K 7236: 2009.
- the softening point or melting point of the epoxy resin is not particularly limited.
- the softening point or melting point of the epoxy resin is preferably 40 ° C. to 180 ° C. from the viewpoint of moldability and reflow resistance, and 50 ° C. to 180 ° C. from the viewpoint of handleability when preparing the sealing resin composition. More preferably, it is 130 ° C.
- the softening point or melting point of the epoxy resin shall be a value measured by differential scanning calorimetry (DSC) or a method according to JIS K 7234: 1986 (ring ball method).
- the mass ratio of the epoxy resin to the total amount of the sealing resin composition is preferably 0.5% by mass to 50% by mass from the viewpoint of strength, fluidity, heat resistance, moldability, etc., and is preferably 2% by mass to 50% by mass. It is more preferably 30% by mass.
- the sealing resin composition of the present embodiment contains at least an active ester compound as a curing agent.
- the sealing resin composition may contain a curing agent other than the active ester compound. As described above, by using the active ester compound as the curing agent, the dielectric loss tangent of the cured product can be suppressed to a low level.
- the type of the active ester compound is not particularly limited as long as it is a compound having one or more ester groups in the molecule that react with the epoxy group.
- Examples of the active ester compound include a phenol ester compound, a thiophenol ester compound, an N-hydroxyamine ester compound, and an esterified product of a heterocyclic hydroxy compound.
- Examples of the active ester compound include at least one selected from the group consisting of an aliphatic carboxylic acid and an aromatic carboxylic acid, and at least one selected from the group consisting of an aliphatic hydroxy compound and an aromatic hydroxy compound.
- Examples thereof include ester compounds obtained from. Ester compounds containing an aliphatic compound as a component of polycondensation tend to have excellent compatibility with an epoxy resin because they have an aliphatic chain. Ester compounds containing an aromatic compound as a component of polycondensation tend to have excellent heat resistance due to having an aromatic ring.
- the active ester compound examples include aromatic esters obtained by a condensation reaction between an aromatic carboxylic acid and a phenolic hydroxyl group.
- the active ester compound is an aromatic carboxylic acid component in which 2 to 4 hydrogen atoms of an aromatic ring such as benzene, naphthalene, biphenyl, diphenylpropane, diphenylmethane, diphenyl ether, and diphenylsulfonic acid are substituted with a carboxy group.
- the active ester compound examples include a phenol resin having a molecular structure in which a phenol compound is knotted via an aliphatic cyclic hydrocarbon group described in JP2012-246367, and an aromatic dicarboxylic acid or Examples thereof include an active ester resin having a structure obtained by reacting the halide with an aromatic monohydroxy compound.
- the active ester resin a compound represented by the following structural formula (1) is preferable.
- R 1 is an alkyl group having 1 to 4 carbon atoms
- X is a benzene ring, a naphthalene ring, a benzene ring or a naphthalene ring substituted with an alkyl group having 1 to 4 carbon atoms, or a biphenyl group
- Y is a benzene ring, a naphthalene ring, or a benzene ring or a naphthalene ring substituted with an alkyl group having 1 to 4 carbon atoms
- k is 0 or 1
- n represents the average number of repetitions. It is 25 to 1.5.
- T-Bu in the structural formula is a tert-butyl group.
- the compound represented by the following structural formula (2) and the compound represented by the following structural formula (3) described in JP-A-2014-114352 can be used. Can be mentioned.
- R 1 and R 2 are independently hydrogen atoms, alkyl groups having 1 to 4 carbon atoms, or alkoxy groups having 1 to 4 carbon atoms
- Z is a benzoyl group, a naphthoyl group, and carbon.
- R 1 and R 2 are independently hydrogen atoms, alkyl groups having 1 to 4 carbon atoms, or alkoxy groups having 1 to 4 carbon atoms
- Z is a benzoyl group, a naphthoyl group, and carbon.
- Specific examples of the compound represented by the structural formula (2) include the following exemplified compounds (2-1) to (2-6).
- Specific examples of the compound represented by the structural formula (3) include the following exemplified compounds (3-1) to (3-6).
- active ester compound a commercially available product may be used.
- Commercially available active ester compounds include “EXB9451”, “EXB9460”, “EXB9460S”, “HPC-8000-65T” (manufactured by DIC Co., Ltd.) as active ester compounds containing a dicyclopentadiene-type diphenol structure; aromatics.
- EXB9416-70BK”, “EXB-8”, “EXB-9425” manufactured by DIC Co., Ltd.
- DC808 Mitsubishi Chemical Co., Ltd.
- Examples of the active ester compound containing a benzoylated product of phenol novolac include "YLH1026" (manufactured by Mitsubishi Chemical Co., Ltd.).
- the active ester compound may be used alone or in combination of two or more.
- the ester equivalent of the active ester compound is not particularly limited. From the viewpoint of balancing various properties such as moldability, reflow resistance, and electrical reliability, the ester equivalent of the active ester compound is preferably 150 g / eq to 400 g / eq, more preferably 170 g / eq to 300 g / eq, and 200 g. / Eq to 250 g / eq is more preferable.
- the ester equivalent of the active ester compound shall be a value measured by a method according to JIS K 0070: 1992.
- the equivalent ratio of the epoxy resin to the active ester compound that is, the value of the number of ester groups / the number of epoxy groups is preferably 0.9 or more, more preferably 0.95 or more, and 0, from the viewpoint of suppressing the dielectric loss tangent of the cured product to be low. .97 or more is more preferable.
- the equivalent ratio of the epoxy resin to the active ester compound is preferably 1.1 or less, more preferably 1.05 or less, still more preferably 1.03 or less, from the viewpoint of suppressing the unreacted content of the active ester compound to be small.
- the curing agent may contain other curing agents other than the active ester compound.
- the type of other curing agent is not particularly limited and can be selected according to the desired properties of the sealing resin composition and the like.
- examples of other curing agents include phenol curing agents, amine curing agents, acid anhydride curing agents, polymercaptan curing agents, polyaminoamide curing agents, isocyanate curing agents, blocked isocyanate curing agents and the like.
- the phenol curing agent is a polyhydric phenol compound such as resorsin, catecor, bisphenol A, bisphenol F, substituted or unsubstituted biphenol; phenol, cresol, xylenol, resorsin, catecol, bisphenol A, bisphenol F, phenylphenol.
- At least one phenolic compound selected from the group consisting of phenol compounds such as aminophenols and naphthol compounds such as ⁇ -naphthol, ⁇ -naphthol and dihydroxynaphthalene, and aldehydes such as formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde and salicylaldehyde.
- Aralkyl-type phenolic resin such as resin; paraxylylene-modified phenolic resin, metaxylylene-modified phenolic resin; melamine-modified phenolic resin; terpen-modified phenolic resin; dicyclopentadiene-type synthesized from the above phenolic compound and dicyclopentadiene by copolymerization.
- Phenol resin and dicyclopentadiene type naphthol resin; cyclopentadiene-modified phenol resin; polycyclic aromatic ring-modified phenol resin; biphenyl-type phenol resin; the above phenolic compound and aromatic aldehyde compound such as benzaldehyde and salicylaldehyde are acid catalysts.
- examples thereof include a triphenylmethane-type phenol resin obtained by condensing or co-condensing below; a phenol resin obtained by copolymerizing two or more of these.
- These phenol curing agents may be used alone or in combination of two or more.
- the functional group equivalents of other curing agents are not particularly limited. From the viewpoint of balancing various properties such as moldability, reflow resistance, and electrical reliability, the functional group equivalent of other curing agents is preferably 70 g / eq to 1000 g / eq, and is preferably 80 g / eq to 500 g / eq. Is more preferable.
- the functional group equivalent of the other curing agent is a phenol curing agent
- the functional group equivalent of the other curing agent means the hydroxyl group equivalent.
- the functional group equivalent of the other curing agent shall be a value measured by a method according to JIS K 0070: 1992.
- the softening point or melting point of the curing agent is not particularly limited.
- the softening point or melting point of the curing agent is preferably 40 ° C. to 180 ° C. from the viewpoint of moldability and reflow resistance, and 50 ° C. from the viewpoint of handleability during production of the sealing resin composition. More preferably, it is at ⁇ 130 ° C.
- the melting point or softening point of the curing agent shall be a value measured in the same manner as the melting point or softening point of the epoxy resin.
- the equivalent ratio of the epoxy resin to all the curing agents that is, the ratio of the number of functional groups in the curing agent to the number of functional groups in the epoxy resin, that is, the value of the number of functional groups in the curing agent / the number of functional groups in the epoxy resin is particularly limited. Not done. From the viewpoint of suppressing each unreacted component to a small value, the value of the number of functional groups in the curing agent / the number of functional groups in the epoxy resin is preferably set in the range of 0.5 to 2.0, and is preferably 0.6 to 2.0. It is more preferable to set it in the range of 1.3. From the viewpoint of moldability and reflow resistance, it is more preferable to set the range from 0.8 to 1.2. When the curing agent contains other curing agents, all the above-mentioned curing agents include both an active ester compound and other curing agents.
- the mass ratio of the active ester compound to the total amount of the active ester compound and other curing agents is preferably 80% by mass or more, preferably 85% by mass or more, from the viewpoint of suppressing the dielectric adjacency of the cured product to be low. More preferably, it is 90% by mass or more.
- the total mass ratio of the epoxy resin and the active ester compound to the total amount of the epoxy resin, the active ester compound and other curing agents is preferably 80% by mass or more from the viewpoint of suppressing the dielectric loss tangent of the cured product to be low. It is more preferably mass% or more, and further preferably 90 mass% or more.
- the specific copolymer is not particularly limited as long as it is a copolymer of an ⁇ -olefin having 5 to 30 carbon atoms and maleic anhydride.
- the specific copolymer functions as, for example, an epoxy resin and a dispersant for a specific mold release agent described later.
- the carbon number of the ⁇ -olefin is 5 to 30, preferably 10 to 25, and more preferably 15 to 25, from the viewpoint of exhibiting the function of the epoxy resin and the specific release agent as a dispersant.
- the ⁇ -olefin may be a linear type or a branched type.
- the specific copolymer one type may be used alone or two or more types may be used in combination.
- ⁇ -olefin examples include 1-pentene, 1-hexene, 1-heptene, 1-octene, 1-nonene, 1-decene, 1-undecene, 1-dodecene, 1-tridecene, 1-Tetradecene, 1-Pentadecene, 1-Hexadecene, 1-Heptadecene, 1-Ocdecene, 1-Nonedecene, 1-Eikosen, 1-Dodecene, 1-Tricosene, 1-Tetracosen, 1-Pentacosene, 1-Hexacosene, 1- Linear ⁇ -olefins such as heptacosene; 3-methyl-1-butene, 3,4-dimethyl-pentene, 3-methyl-1-nonene, 3,4-dimethyl-octene, 3-ethyl-1-dodecene, Examples thereof include branched ⁇
- the ⁇ -olefin these may be used alone, or two or more kinds may be used in combination.
- the ⁇ -olefin is preferably an ⁇ -olefin having 10 to 25 carbon atoms, and more preferably an ⁇ -olefin having 15 to 25 carbon atoms.
- Specific examples of the specific copolymer are not particularly limited, and examples thereof include a compound represented by the following general formula (VI), a compound represented by the following general formula (VII), and the like.
- a compound represented by the following general formula (VI) As commercially available products of the specific copolymer, Nissan Electol WPB-1 (NOF CORPORATION, trade name) and the like using 1-eicosene, 1-dococene, and 1-trichothecene as raw materials are available.
- R represents a monovalent aliphatic hydrocarbon group having 3 to 28 carbon atoms
- n represents an integer of 1 or more
- m is 1/2 to 10 on a molar basis. Indicates / 1.
- the copolymerization molar ratio of the ⁇ -olefin and the maleic anhydride in the specific copolymer functions as a dispersant. From the viewpoint of achieving both the expression of the above and the affinity for the active ester compound, the ratio is preferably 20: 1 to 1: 2, more preferably 15: 1 to 1: 1.5, and 10: 1 to 1. It is more preferably 1: 1.
- the weight average molecular weight of the specific copolymer is preferably 5,000 to 100,000, more preferably 10,000 to 70,000, and even more preferably 15,000 to 50,000, from the viewpoint of mold stain suppression and moldability.
- the weight average molecular weight of the specific copolymer is 5000 or more, the mold stain suppressing effect can be easily obtained.
- the weight average molecular weight of the specific copolymer is 100,000 or less, the decrease in kneadability due to the increase in the softening point of the specific copolymer is suppressed.
- the weight average molecular weight refers to a value measured by gel permeation chromatography (GPC).
- the weight average molecular weight by GPC for example, G2000HXL, 3000HXL of Tosoh Corporation is used for the GPC column for analysis, tetrahydrofuran etc. is used for the mobile phase, the sample concentration is 0.2% by mass, and the flow velocity is 1. Measure at 0.0 mL / min.
- a calibration curve is prepared using a polystyrene standard sample, and the weight average molecular weight is calculated using polystyrene-equivalent values.
- the content of the specific copolymer is preferably 0.01% by mass to 1.00% by mass, preferably 0.02, based on the entire sealing resin composition, from the viewpoint of improving the releasability of the cured product. It is more preferably from mass% to 0.50 mass%, and even more preferably from 0.05 mass% to 0.10 mass%.
- the content of the specific copolymer is preferably 0.25 parts by mass to 5 parts by mass, and 0.5 parts by mass with respect to 100 parts by mass of the epoxy resin, from the viewpoint of improving the releasability of the cured product. It is more preferably about 2 parts by mass.
- the method for producing the specific copolymer is not particularly limited, and a general copolymer method such as reacting raw materials can be used.
- An organic solvent or the like capable of dissolving ⁇ -olefin and maleic anhydride may be used for the reaction.
- the organic solvent is not particularly limited, and among them, toluene is preferable, and alcohol solvents, ether solvents, amine solvents and the like can also be used.
- the reaction temperature varies depending on the type of organic solvent used, but is preferably 50 to 200 ° C., more preferably 80 to 120 ° C. from the viewpoint of reactivity and productivity.
- the reaction time is not particularly limited as long as the copolymer can be obtained, but is preferably 1 to 30 hours, more preferably 2 to 15 hours, still more preferably 4 to 10 hours from the viewpoint of productivity.
- unreacted components, solvents and the like can be removed, if necessary, under heating and reduced pressure.
- the conditions for removing unreacted components, solvents, etc. are as follows: temperature is 100 to 220 ° C., more preferably 120 to 180 ° C., pressure is 13.3 ⁇ 10 3 Pa or less, more preferably 8 ⁇ 10 3 Pa or less, time. It is preferably 0.5 to 10 hours.
- a reaction catalyst such as an amine catalyst or an acid catalyst may be added to the reaction, if necessary.
- the pH of the reaction system is preferably about 1 to 10.
- the sealing resin composition may further contain at least one selected from the group consisting of polyolefin-based waxes and ester-based waxes (hereinafter, also referred to as "specific mold release agent"). That is, the sealing resin composition may contain an epoxy resin, an active ester compound, a specific copolymer, and a specific mold release agent.
- the long-chain alkyl group of the specific copolymer is compatible with the specific mold release agent, and the structure derived from maleic anhydride of the specific copolymer is compatible with the active ester compound, so that the specific mold release agent and the active ester compound are compatible. It is considered that the dispersibility in both of these is improved.
- the specific mold release agent is not particularly limited as long as it contains at least one selected from the group consisting of polyolefin waxes and ester waxes.
- the polyolefin-based wax may be an oxidized polyolefin-based wax or a non-oxidized polyolefin-based wax.
- examples of the polyolefin-based wax include polyethylene oxide, non-oxidized polyethylene, polypropylene oxide, non-oxidized polypropylene, polybutene oxide, and non-oxidized polybutene.
- the ester wax include montanic acid ester, saponified montanic acid ester, glycerin ester, carbana wax, rice wax and the like.
- the specific mold release agent preferably contains a polyolefin wax, and more preferably contains polyethylene oxide.
- the polyethylene oxide may be a linear polyethylene oxide or a branched polyethylene oxide.
- the specific release agent one of these may be used alone, or two or more thereof may be combined.
- the weight average molecular weight of the polyolefin wax is preferably 2000 or more from the viewpoint of mold releasability, preferably 30,000 or less from the viewpoint of adhesiveness and mold stain suppression, more preferably 5000 to 20000, and 7000. ⁇ 15000 is more preferable.
- the weight average molecular weight refers to a value measured by high-temperature GPC.
- the acid value of the polyolefin wax is not particularly limited, and is preferably 0 mg / KOH to 100 mg / KOH, more preferably 10 mg / KOH to 60 mg / KOH, from the viewpoint of releasability and adhesiveness.
- the acid value is the number of moles of potassium hydroxide required to neutralize 1 g of the measurement target, and is determined by the measurement method according to JIS K0070: 1992.
- the saponification value of the ester wax is not particularly limited, and is preferably 1 mg / KOH to 200 mg / KOH, and more preferably 30 mg / KOH to 100 mg / KOH from the viewpoint of releasability and adhesiveness. ..
- the saponification value is the number of moles of potassium hydroxide required to saponify 1 g of the measurement target, and is determined by the measurement method according to JIS K0070: 1992.
- the melting point of the specific mold release agent is not particularly limited, and is preferably 40 ° C. to 180 ° C., more preferably 60 ° C. to 140 ° C. from the viewpoint of kneadability and moldability.
- the melting point is a value measured in the same manner as the melting point of the epoxy resin.
- the content of the specific mold release agent is not particularly limited, and may be 0.5 parts by mass to 10 parts by mass with respect to 100 parts by mass of the epoxy resin from the viewpoint of mold releasability of the cured product and suppression of mold stains. It is preferably 1 part by mass to 5 parts by mass, more preferably.
- the sealing resin composition may contain a curing accelerator, if necessary.
- the type of the curing accelerator is not particularly limited, and can be selected according to the type of the epoxy resin or the curing agent, the desired properties of the sealing resin composition, and the like.
- curing accelerator examples include diazabicycloalkenes such as 1,5-diazabicyclo [4.3.0] nonen-5 (DBN) and 1,8-diazabicyclo [5.4.0] undecene-7 (DBU).
- Cyclic amidin compounds such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-heptadecylimidazole; derivatives of the cyclic amidin compound; phenol novolac salt of the cyclic amidin compound or a derivative thereof; Maleic anhydride, 1,4-benzoquinone, 2,5-turquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1 , 4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone and other qui
- Cyclic amidinium compounds such as DBU tetraphenylborate salt, DBN tetraphenylborate salt, 2-ethyl-4-methylimidazole tetraphenylborate salt, N-methylmorpholin tetraphenylborate salt; pyridine, triethylamine, tri Tertiary amine compounds such as ethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol; derivatives of the tertiary amine compound; tetra-n-butylammonium acetate, tetra-n-phosphate Ammonium salt compounds such as butylammonium, tetraethylammonium acetate, tetra-n-hexylammonium benzoate, tetrapropylammonium hydroxide; first phosphine such as ethylphosphin
- maleic anhydride 1,4-benzoquinone, 2,5-turquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1
- a quinone compound such as 4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone, anthraquinone, or a compound having a ⁇ bond such as diazophenylmethane.
- Tetra-substituted phosphonium compounds such as tetraphenylborate salts, salts of tetra-substituted phosphoniums and phenolic compounds; salts of tetraalkylphosphoniums and partial hydrolysates of aromatic carboxylic acid anhydrides; phosphobetaine compounds; phosphonium compounds and silanes. Additives with compounds; etc.
- the curing accelerator may be used alone or in combination of two or more.
- particularly suitable curing accelerators include triphenylphosphine, an adduct of triphenylphosphine and a quinone compound, an adduct of tributylphosphine and a quinone compound, and an adduct of tri-p-tolylphosphine and a quinone compound. Things etc. can be mentioned.
- the amount thereof is preferably 0.1 part by mass to 30 parts by mass, and 1 part by mass to 15 parts by mass with respect to 100 parts by mass of the resin component. Is more preferable.
- the amount of the curing accelerator is 0.1 part by mass or more with respect to 100 parts by mass of the resin component, it tends to be cured well in a short time.
- the amount of the curing accelerator is 30 parts by mass or less with respect to 100 parts by mass of the resin component, the curing rate is not too fast and a good molded product tends to be obtained.
- a resin component means an epoxy resin and a curing agent.
- 100 parts by mass of the resin component means that the total amount of the epoxy resin and the curing agent is 100 parts by mass.
- the sealing resin composition may contain an inorganic filler, if necessary.
- the type of inorganic filler is not particularly limited. Specific examples of the inorganic filler include fused silica, crystalline silica, glass, alumina, calcium carbonate, zirconium silicate, calcium silicate, silicon nitride, aluminum nitride, boron nitride, beryllia, zirconia, zircon, fosterite, and steer. Examples include inorganic materials such as tight, spinel, mulite, titania, talc, clay and mica. An inorganic filler having a flame-retardant effect may be used. Examples of the inorganic filler having a flame-retardant effect include aluminum hydroxide, magnesium hydroxide, composite metal hydroxide such as a composite hydroxide of magnesium and zinc, and zinc borate.
- silica such as fused silica is preferable from the viewpoint of reducing the coefficient of linear expansion, and alumina is preferable from the viewpoint of high thermal conductivity.
- the inorganic filler may be used alone or in combination of two or more. Examples of the form of the inorganic filler include powder, beads obtained by spheroidizing the powder, fibers and the like.
- the inorganic filler When the inorganic filler is in the form of particles, its average particle size is not particularly limited.
- the average particle size of the inorganic filler is preferably 0.2 ⁇ m to 100 ⁇ m, and more preferably 0.5 ⁇ m to 50 ⁇ m.
- the average particle size of the inorganic filler is 0.2 ⁇ m or more, the increase in viscosity of the sealing resin composition tends to be further suppressed.
- the average particle size of the inorganic filler When the average particle size of the inorganic filler is 100 ⁇ m or less, the filler tends to be further improved.
- the average particle size of the inorganic filler is determined as the volume average particle size (D50) by a laser scattering diffraction method particle size distribution measuring device.
- the content of the inorganic filler contained in the sealing resin composition of the present disclosure is 70% by volume or more of the entire sealing resin composition from the viewpoint of controlling the elasticity of the cured product of the sealing resin composition. It is preferably 90% by volume, more preferably 78% by volume to 88% by volume, and even more preferably 80% by volume to 85% by volume.
- the volume ratio of the inorganic filler in the sealing resin composition can be determined by the following method.
- a flaky sample of the cured resin composition for encapsulation is imaged with a scanning electron microscope (SEM).
- SEM scanning electron microscope
- An arbitrary area S is specified in the SEM image, and the total area A of the inorganic filler contained in the area S is obtained.
- the value obtained by dividing the total area A of the inorganic filler by the area S is converted into a percentage (%), and this value is taken as the volume ratio of the inorganic filler in the sealing resin composition.
- the area S is a sufficiently large area with respect to the size of the inorganic filler.
- the size may include 100 or more inorganic fillers.
- the area S may be the sum of a plurality of cut surfaces.
- the presence ratio of the inorganic filler may be biased in the direction of gravity during curing of the sealing resin composition. In that case, when the image is taken by the SEM, the entire gravity direction of the cured product is imaged, and the area S including the entire gravity direction of the cured product is specified.
- the sealing resin composition includes a coupling agent, an ion exchanger, a dispersant other than the specific copolymer, a release agent other than the specific release agent, a flame retardant, and a coloring agent, in addition to the above-mentioned components.
- Various additives such as agents may be contained.
- the sealing resin composition may contain various additives well known in the art, if necessary, in addition to the additives exemplified below.
- the sealing resin composition may contain a coupling agent.
- the sealing resin composition preferably contains a coupling agent.
- the coupling agent include known coupling agents such as silane compounds such as epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane, vinylsilane and disilazane, titanium compounds, aluminum chelate compounds and aluminum / zirconium compounds. Can be mentioned.
- the amount of the coupling agent is preferably 0.05 parts by mass to 5 parts by mass, and 0.1 parts by mass with respect to 100 parts by mass of the inorganic filler. It is more preferably about 2.5 parts by mass.
- the amount of the coupling agent is 0.05 parts by mass or more with respect to 100 parts by mass of the inorganic filler, the adhesiveness with the frame tends to be further improved.
- the amount of the coupling agent is 5 parts by mass or less with respect to 100 parts by mass of the inorganic filler, the moldability of the package tends to be further improved.
- the sealing resin composition may contain an ion exchanger.
- the sealing resin composition preferably contains an ion exchanger from the viewpoint of improving the moisture resistance and high temperature standing characteristics of the electronic component device including the element to be sealed.
- the ion exchanger is not particularly limited, and conventionally known ones can be used.
- Specific examples of the ion exchanger include hydrotalcite compounds and hydrous oxides of at least one element selected from the group consisting of magnesium, aluminum, titanium, zirconium, and bismuth.
- the ion exchanger one type may be used alone or two or more types may be used in combination. Of these, hydrotalcite represented by the following general formula (A) is preferable.
- the content thereof is not particularly limited as long as it is an amount sufficient to capture ions such as halogen ions.
- the content of the ion exchanger is, for example, preferably 0.1 part by mass to 30 parts by mass, and more preferably 1 part by mass to 10 parts by mass with respect to 100 parts by mass of the resin component.
- the sealing resin composition may further contain a dispersant other than the specific copolymer.
- a dispersant other than the specific copolymer include esterified products of the specific copolymer.
- esterified product of the specific copolymer examples include a compound obtained by esterifying the above-mentioned specific copolymer with a monohydric alcohol.
- the monohydric alcohol that esterifies the specific copolymer is not particularly limited, and for example, amyl alcohol, isoamyl alcohol, hexyl alcohol, heptyl alcohol, octyl alcohol, capryl alcohol, nonyl alcohol, decyl alcohol, and un.
- Linear or branched aliphatic saturated alcohols such as decyl alcohol, lauryl alcohol, tridecyl alcohol, myristyl alcohol, pentadecyl alcohol, cetyl alcohol, heptadecyl alcohol, stearyl alcohol, nonadecil alcohol, eikosyl alcohol; hexenol, Linear or branched aliphatic unsaturated alcohols such as 2-hexen-1-ol, 1-hexen-3-ol, pentenol, 2-methyl-1-pentenol; cyclopentanol, cyclohexanol, etc.
- Alicyclic alcohols aromatic alcohols such as benzyl alcohol and cinnamyl alcohol; heterocyclic alcohols such as furfuryl alcohol; and the like can be mentioned, and these may be used alone or in combination of two or more.
- the monohydric alcohol is preferably a monohydric alcohol having 5 to 25 carbon atoms, more preferably a linear alcohol having 10 to 20 carbon atoms, and a linear fat having 15 to 20 carbon atoms. It is more preferably a group saturated alcohol.
- the method for esterifying the specific copolymer with a monohydric alcohol is not particularly limited, and general methods such as addition reaction of a monohydric alcohol to the specific copolymer can be mentioned.
- the reaction molar ratio of the specific copolymer and the monohydric alcohol is not particularly limited and can be set arbitrarily.
- An organic solvent or the like may be used for the reaction.
- the organic solvent is not particularly limited, and examples thereof include toluene, alcohol-based solvent, ether-based solvent, and amine-based solvent.
- the reaction temperature varies depending on the type of organic solvent used, but is preferably 50 to 200 ° C., more preferably 80 to 120 ° C. from the viewpoint of reactivity and productivity.
- the reaction time is preferably 1 to 30 hours, more preferably 2 to 15 hours, still more preferably 4 to 10 hours from the viewpoint of productivity.
- a reaction catalyst such as an amine catalyst or an acid catalyst may be added to the reaction, if necessary.
- the pH of the reaction system is preferably about 1 to 10.
- the weight average molecular weight of the esterified product of the specific copolymer is preferably 3000 to 100,000, more preferably 10,000 to 70,000, still more preferably 15,000 to 50,000, from the viewpoint of mold stain suppression and moldability.
- the sealing resin composition contains a specific copolymer and an esterified product of the specific copolymer
- the total content of the specific copolymer and the esterified product of the specific copolymer is determined by the sealing resin composition. It is preferably 0.01% by mass to 1.00% by mass, more preferably 0.02% by mass to 0.50% by mass, and 0.05% by mass to 0.10% by mass with respect to the whole. It is more preferable to have.
- the sealing resin composition contains the specific copolymer and the esterified product of the specific copolymer
- the total content of the specific copolymer and the esterified product of the specific copolymer is 100 mass of epoxy resin. It is preferably 0.25 parts by mass to 5 parts by mass, and more preferably 0.5 parts by mass to 2 parts by mass.
- the sealing resin composition may contain a release agent other than the specific release agent, if necessary.
- the release agent other than the specific release agent is not particularly limited, and conventionally known release agents can be used. Specific examples thereof include higher fatty acids such as montanic acid and stearic acid, and higher fatty acid metal salts.
- As the release agent other than the specific release agent one type may be used alone or two or more types may be used in combination.
- the sealing resin composition contains a specific mold release agent and a mold release agent other than the specific mold release agent
- the total content thereof is preferably 0.01 part by mass to 10 parts by mass with respect to 100 parts by mass of the resin component. , 0.1 part by mass to 5 parts by mass is more preferable.
- the total content of the release agent is 0.01 part by mass or more with respect to 100 parts by mass of the resin component, the releasability tends to be sufficiently obtained.
- the total content of the release agent is 10 parts by mass or less, better adhesiveness tends to be obtained.
- the sealing resin composition may contain a flame retardant.
- the flame retardant is not particularly limited, and conventionally known flame retardants can be used. Specific examples of the flame retardant include an organic or inorganic compound containing a halogen atom, an antimony atom, a nitrogen atom or a phosphorus atom, and a metal hydroxide. The flame retardant may be used alone or in combination of two or more.
- the amount thereof is not particularly limited as long as it is sufficient to obtain the desired flame retardant effect.
- the amount of the flame retardant is, for example, preferably 1 part by mass to 30 parts by mass, and more preferably 2 parts by mass to 20 parts by mass with respect to 100 parts by mass of the resin component.
- the sealing resin composition may contain a colorant.
- the colorant include known colorants such as carbon black, organic dyes, organic pigments, titanium oxide, lead tan, and red iron oxide.
- the content of the colorant can be appropriately selected according to the purpose and the like.
- the colorant one type may be used alone or two or more types may be used in combination.
- the method for preparing the sealing resin composition is not particularly limited.
- a general method for preparing a resin composition for sealing a method in which a predetermined amount of components are sufficiently mixed by a mixer or the like, then melt-kneaded by a mixing roll, an extruder or the like, cooled and pulverized.
- a method for preparing the sealing resin composition for example, a kneader, a roll, or an extruder in which a predetermined amount of the above-mentioned components is uniformly stirred and mixed and preheated to 70 ° C. to 140 ° C.
- Examples thereof include a method of kneading with, cooling, and crushing.
- a part or all of the epoxy resin and the specific copolymer may be premixed.
- the sealing resin composition contains a specific release agent, a part or all of the epoxy resin, the specific copolymer, and the specific release agent may be premixed.
- the sealing resin composition is preferably solid under normal temperature and pressure (for example, 25 ° C. and atmospheric pressure).
- the shape is not particularly limited, and examples thereof include powder, granules, and tablets.
- the sealing resin composition is in the shape of a tablet, it is preferable that the dimensions and mass are suitable for the molding conditions of the package from the viewpoint of handleability.
- the electronic component device includes a support member, an element arranged on the support member, and a cured product of the sealing resin composition of the present disclosure that seals the element. To be equipped.
- Electronic component devices include lead frames, pre-wired tape carriers, wiring boards, glass, silicon wafers, organic substrates, and other support members, as well as elements (for example, semiconductor chips, transistors, diodes, active elements such as thyristors, capacitors, etc.). Examples thereof include those in which an element portion obtained by mounting a resistor, a passive element such as a coil, etc.) is sealed with a sealing resin composition. More specifically, after fixing the element on the lead frame and connecting the terminal part and the lead part of the element such as a bonding pad by wire bonding, bumps, etc., transfer molding or the like using a sealing resin composition or the like.
- DIP Device Inline Package
- PLCC Physical Leaded Chip Carrier
- QFP Quad Flat Package
- SOP Small Outline Package
- SOJ SmallOdlinePack
- TCP Teape Carrier Package having a structure in which an element connected to a tape carrier with a bump is sealed with a sealing resin composition.
- a COB Chip On Board
- hybrid IC or multi having a structure in which an element connected by wire bonding, flip chip bonding, solder, or the like is sealed to a wiring formed on a support member with a sealing resin composition.
- Chip module etc .
- An element is mounted on the front surface of a support member having terminals for connecting a wiring plate on the back surface, and after connecting the element and the wiring formed on the support member by bump or wire bonding, a resin composition for sealing is provided.
- a resin composition for sealing examples thereof include BGA (Ball Grid Array), CSP (Chip Size Package), and MCP (Multi Chip Package) having a structure in which an element is sealed with an object.
- the sealing resin composition can also be preferably used in the printed wiring board.
- a method for manufacturing an electronic component device includes arranging an element on a support member and sealing the element with the sealing resin composition of the present disclosure.
- the method for carrying out the above arrangement and sealing is not particularly limited, and can be carried out by a general method. Further, the types of support members and elements used in the manufacture of electronic component devices are not particularly limited, and support members and elements generally used in the manufacture of electronic component devices can be used.
- Examples of the method for sealing the element using the sealing resin composition of the present disclosure include a low-pressure transfer molding method, an injection molding method, a compression molding method, and the like. Among these, the low-pressure transfer molding method is common.
- -Epoxy resin 1 Triphenylmethane type epoxy resin, epoxy equivalent 167 g / eq (Mitsubishi Chemical Corporation, product name "1032H60”)
- -Epoxy resin 2 Biphenyl type epoxy resin, epoxy equivalent 192 g / eq (Mitsubishi Chemical Corporation, product name "YX-4000”)
- -Specific copolymer 1 Copolymer of ⁇ -olefin having 20 carbon atoms and maleic anhydride, copolymerization molar ratio (X: Y) 1: 1, weight average molecular weight 20,800
- -Polyethylene oxide 1 Polyethylene oxide, weight average molecular weight 2600, acid value 17 mg / KOH, melting point 100 ° C. (Mitsui Chemicals Co., Ltd., product name "High Wax 4202E”)
- -Polyethylene oxide 2 Polyethylene oxide, weight average molecular weight 8800, acid value 24.5 mg / KOH, melting point 140 ° C. (Clariant Japan Co., Ltd., product name "Ricowax PED153”)
- -Polyethylene oxide 3 Polyethylene oxide, weight average molecular weight 3000, acid value 1 mg / KOH, melting point 114 ° C.
- -Curing accelerator 1 Triphenylphosphine / 1,4-benzoquinone adduct-Inorganic filler 1: Fused silica 1 (volume average particle size 4.5 ⁇ m) -Inorganic filler 2: Fused silica 2 (volume average particle size 0.6 ⁇ m) -Coupling agent 1: N-phenyl-3-aminopropyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd., product name "KBM-573”) -Coupling agent 2: 3-mercaptopropyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd., product name "KBM-803”) -Colorant: Carbon black (Mitsubishi Chemical Corporation, product name "MA600”)
- the sealing resin composition of the example has a reduced dielectric loss tangent of the cured product and is excellent in releasability of the cured product as compared with the sealing resin composition of the comparative example.
Abstract
Description
特許文献2:特開2014-114352号公報 Patent Document 1: Japanese Patent Application Laid-Open No. 2012-246367 Patent Document 2: Japanese Patent Application Laid-Open No. 2014-114352
本開示は、硬化物の誘電正接を低減し、かつ、硬化物の離型性に優れる封止用樹脂組成物、これを用いて封止された電子部品装置、及びこれを用いて封止する電子部品装置の製造方法を提供することを課題とする。 The embodiments of the present disclosure have been made under the above circumstances.
In the present disclosure, a sealing resin composition that reduces the dielectric loss tangent of a cured product and has excellent releasability of the cured product, an electronic component device sealed using the same, and sealing using the same. An object of the present invention is to provide a method for manufacturing an electronic component device.
エポキシ樹脂と、
活性エステル化合物を含む硬化剤と、
炭素数5~30のα-オレフィンと無水マレイン酸との共重合物と、
を含有する封止用樹脂組成物。
<2>
前記共重合物における前記α-オレフィンと前記無水マレイン酸との共重合モル比は、20:1~1:2である<1>に記載の封止用樹脂組成物。
<3>
前記共重合物の含有率は、封止用樹脂組成物全体に対し0.01質量%~1.00質量%である<1>又は<2>に記載の封止用樹脂組成物。
<4>
前記共重合物の含有量は、前記エポキシ樹脂100質量部に対し0.25質量部~5質量部である<1>~<3>のいずれか1つに記載の封止用樹脂組成物。
<5>
前記共重合物の重量平均分子量は、5000~100000である<1>~<4>のいずれか1つに記載の封止用樹脂組成物。
<6>
さらに、ポリオレフィン系ワックス及びエステル系ワックスからなる群より選択される少なくとも一種を含有する<1>~<5>のいずれか1つに記載の封止用樹脂組成物。
<7>
前記ポリオレフィン系ワックス及びエステル系ワックスからなる群より選択される少なくとも一種の含有量は、前記エポキシ樹脂100質量部に対し0.5質量部~10質量部である<6>に記載の封止用樹脂組成物。
<8>
さらに、無機充填材を含有する<1>~<7>のいずれか1つに記載の封止用樹脂組成物。
<9>
支持部材と、
前記支持部材上に配置された素子と、
前記素子を封止している<1>~<8>のいずれか1つに記載の封止用樹脂組成物の硬化物と、
を備える電子部品装置。
<10>
素子を支持部材上に配置すること
と、
前記素子を<1>~<8>のいずれか1つに記載の封止用樹脂組成物で封止することと、
を含む電子部品装置の製造方法。 <1>
Epoxy resin and
A curing agent containing an active ester compound and
A copolymer of α-olefin having 5 to 30 carbon atoms and maleic anhydride,
A resin composition for sealing containing.
<2>
The sealing resin composition according to <1>, wherein the copolymerization molar ratio of the α-olefin and the maleic anhydride in the copolymer is 20: 1 to 1: 2.
<3>
The sealing resin composition according to <1> or <2>, wherein the content of the copolymer is 0.01% by mass to 1.00% by mass with respect to the entire sealing resin composition.
<4>
The sealing resin composition according to any one of <1> to <3>, wherein the content of the copolymer is 0.25 parts by mass to 5 parts by mass with respect to 100 parts by mass of the epoxy resin.
<5>
The sealing resin composition according to any one of <1> to <4>, wherein the weight average molecular weight of the copolymer is 5000 to 100,000.
<6>
The sealing resin composition according to any one of <1> to <5>, which further contains at least one selected from the group consisting of polyolefin waxes and ester waxes.
<7>
The sealing content according to <6>, wherein the content of at least one selected from the group consisting of the polyolefin-based wax and the ester-based wax is 0.5 parts by mass to 10 parts by mass with respect to 100 parts by mass of the epoxy resin. Resin composition.
<8>
The sealing resin composition according to any one of <1> to <7>, which further contains an inorganic filler.
<9>
Support members and
The element arranged on the support member and
The cured product of the sealing resin composition according to any one of <1> to <8>, which seals the element, and the cured product.
Electronic component device equipped with.
<10>
Placing the element on the support member and
Sealing the element with the sealing resin composition according to any one of <1> to <8>.
Manufacturing method of electronic component equipment including.
本開示において「~」を用いて示された数値範囲には、「~」の前後に記載される数値がそれぞれ最小値及び最大値として含まれる。
本開示中に段階的に記載されている数値範囲において、一つの数値範囲で記載された上限値又は下限値は、他の段階的な記載の数値範囲の上限値又は下限値に置き換えてもよい。また、本開示中に記載されている数値範囲において、その数値範囲の上限値又は下限値は、実施例に示されている値に置き換えてもよい。
本開示において各成分は該当する物質を複数種含んでいてもよい。組成物中に各成分に該当する物質が複数種存在する場合、各成分の含有率又は含有量は、特に断らない限り、組成物中に存在する当該複数種の物質の合計の含有率又は含有量を意味する。
本開示において各成分に該当する粒子は複数種含んでいてもよい。組成物中に各成分に該当する粒子が複数種存在する場合、各成分の粒子径は、特に断らない限り、組成物中に存在する当該複数種の粒子の混合物についての値を意味する。 In the present disclosure, the term "process" includes not only a process independent of other processes but also the process if the purpose of the process is achieved even if the process cannot be clearly distinguished from the other process. ..
The numerical range indicated by using "-" in the present disclosure includes the numerical values before and after "-" as the minimum value and the maximum value, respectively.
In the numerical range described stepwise in the present disclosure, the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value of another numerical range described stepwise. .. Further, in the numerical range described in the present disclosure, the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples.
In the present disclosure, each component may contain a plurality of applicable substances. When a plurality of substances corresponding to each component are present in the composition, the content or content of each component is the total content or content of the plurality of substances present in the composition unless otherwise specified. Means quantity.
In the present disclosure, a plurality of types of particles corresponding to each component may be contained. When a plurality of particles corresponding to each component are present in the composition, the particle size of each component means a value for a mixture of the plurality of particles present in the composition unless otherwise specified.
本開示の一実施形態に係る封止用樹脂組成物は、エポキシ樹脂と、活性エステル化合物を含む硬化剤と、炭素数5~30のα-オレフィンと無水マレイン酸との共重合物(以下「特定共重合物」ともいう)と、を含有する。 <Resin composition for sealing>
The sealing resin composition according to the embodiment of the present disclosure is a copolymer of an epoxy resin, a curing agent containing an active ester compound, an α-olefin having 5 to 30 carbon atoms, and maleic anhydride (hereinafter, "" Also referred to as "specific copolymer").
また、硬化物中の極性基は硬化物の吸水性を高めるところ、硬化剤として活性エステル化合物を用いることによって硬化物の極性基濃度を抑えることができ、硬化物の吸水性を抑制することができる。そして、硬化物の吸水性を抑制すること、つまりは極性分子であるH2Oの含有量を抑制することにより、硬化物の誘電正接をさらに低く抑えることができる。 Conventionally, a phenol curing agent, an amine curing agent, or the like is generally used as a curing agent for an epoxy resin, but a secondary hydroxyl group is generated in the reaction between the epoxy resin and the phenol curing agent or the amine curing agent. On the other hand, in the reaction between the epoxy resin and the active ester compound, an ester group is generated instead of the secondary hydroxyl group. Since the ester group has a lower polarity than the secondary hydroxyl group, the sealing resin composition of the present disclosure is compared with the sealing resin composition containing only a curing agent that generates a secondary hydroxyl group as a curing agent. The dielectric positive contact of the cured product can be kept low.
Further, the polar groups in the cured product enhance the water absorption of the cured product, and by using an active ester compound as the curing agent, the concentration of polar groups in the cured product can be suppressed, and the water absorption of the cured product can be suppressed. it can. Then, suppressing the water absorption of the cured product, that is, by suppressing the H 2 O content is a polar molecule, it is possible to suppress even lower dielectric loss tangent of a cured product.
一方、本実施形態の封止用樹脂組成物では、エポキシ樹脂及び活性エステル化合物に加えて、さらに特定共重合物を含有することにより、硬化物の誘電正接の低減と硬化物の離型性とを両立する。その理由は定かではないが、以下のように推測される。
特定共重合物は、長鎖アルキル基を有する一方で、特定共重合物における無水マレイン酸に由来する構造が活性エステル化合物と親和することで、活性エステル化合物の分散性が向上する。そのため、活性エステル化合物の反応効率が向上し、未反応の活性エステル化合物が硬化物に残りにくくなることにより、未反応の活性エステル化合物による離型性の低下を抑制すると考えられる。
以上のことから、本実施形態の封止用樹脂組成物は、硬化物の誘電正接を低減し、かつ、硬化物の離型性に優れると推測される。
以下、本実施形態に係る封止用樹脂組成物に含まれる各成分について説明する。 However, a sealing resin composition containing an active ester compound as a curing agent for an epoxy resin may be inferior in releasability of the cured product, although the dielectric loss tangent of the cured product is reduced. The reason is not clear, but it is presumed that the unreacted active ester compound contained in the cured product is the cause of the decrease in releasability.
On the other hand, in the sealing resin composition of the present embodiment, by further containing a specific copolymer in addition to the epoxy resin and the active ester compound, the dielectric loss tangent of the cured product can be reduced and the releasability of the cured product can be improved. Are compatible. The reason is not clear, but it is presumed as follows.
While the specific copolymer has a long-chain alkyl group, the structure derived from maleic anhydride in the specific copolymer is compatible with the active ester compound, so that the dispersibility of the active ester compound is improved. Therefore, it is considered that the reaction efficiency of the active ester compound is improved and the unreacted active ester compound is less likely to remain in the cured product, thereby suppressing the decrease in releasability due to the unreacted active ester compound.
From the above, it is presumed that the sealing resin composition of the present embodiment reduces the dielectric loss tangent of the cured product and is excellent in the releasability of the cured product.
Hereinafter, each component contained in the sealing resin composition according to the present embodiment will be described.
エポキシ樹脂は、分子中にエポキシ基を有するものであればその種類は特に制限されない。 (Epoxy resin)
The type of epoxy resin is not particularly limited as long as it has an epoxy group in the molecule.
エポキシ樹脂のエポキシ当量は、JIS K 7236:2009に準じた方法で測定される値とする。 The epoxy equivalent (molecular weight / number of epoxy groups) of the epoxy resin is not particularly limited. From the viewpoint of balancing various characteristics such as moldability, reflow resistance, and electrical reliability, the epoxy equivalent of the epoxy resin is preferably 100 g / eq to 1000 g / eq, and is 150 g / eq to 500 g / eq. Is more preferable.
The epoxy equivalent of the epoxy resin shall be a value measured by a method according to JIS K 7236: 2009.
エポキシ樹脂の軟化点又は融点は、示差走査熱量測定(DSC)又はJIS K 7234:1986に準じた方法(環球法)で測定される値とする。 When the epoxy resin is a solid, the softening point or melting point of the epoxy resin is not particularly limited. The softening point or melting point of the epoxy resin is preferably 40 ° C. to 180 ° C. from the viewpoint of moldability and reflow resistance, and 50 ° C. to 180 ° C. from the viewpoint of handleability when preparing the sealing resin composition. More preferably, it is 130 ° C.
The softening point or melting point of the epoxy resin shall be a value measured by differential scanning calorimetry (DSC) or a method according to JIS K 7234: 1986 (ring ball method).
本実施形態の封止用樹脂組成物は、硬化剤として少なくとも活性エステル化合物を含む。封止用樹脂組成物は、活性エステル化合物以外の硬化剤を含んでもよい。
先述のとおり、硬化剤として活性エステル化合物を用いることによって、硬化物の誘電正接を低く抑えることができる。 (Hardener)
The sealing resin composition of the present embodiment contains at least an active ester compound as a curing agent. The sealing resin composition may contain a curing agent other than the active ester compound.
As described above, by using the active ester compound as the curing agent, the dielectric loss tangent of the cured product can be suppressed to a low level.
活性エステル化合物のエステル当量は、JIS K 0070:1992に準じた方法により測定される値とする。 The ester equivalent of the active ester compound is not particularly limited. From the viewpoint of balancing various properties such as moldability, reflow resistance, and electrical reliability, the ester equivalent of the active ester compound is preferably 150 g / eq to 400 g / eq, more preferably 170 g / eq to 300 g / eq, and 200 g. / Eq to 250 g / eq is more preferable.
The ester equivalent of the active ester compound shall be a value measured by a method according to JIS K 0070: 1992.
エポキシ樹脂と活性エステル化合物との当量比は、活性エステル化合物の未反応分を少なく抑える観点からは、1.1以下が好ましく、1.05以下がより好ましく、1.03以下がさらに好ましい。 The equivalent ratio of the epoxy resin to the active ester compound, that is, the value of the number of ester groups / the number of epoxy groups is preferably 0.9 or more, more preferably 0.95 or more, and 0, from the viewpoint of suppressing the dielectric loss tangent of the cured product to be low. .97 or more is more preferable.
The equivalent ratio of the epoxy resin to the active ester compound is preferably 1.1 or less, more preferably 1.05 or less, still more preferably 1.03 or less, from the viewpoint of suppressing the unreacted content of the active ester compound to be small.
その他の硬化剤の官能基当量は、JIS K 0070:1992に準じた方法により測定される値とする。 The functional group equivalents of other curing agents are not particularly limited. From the viewpoint of balancing various properties such as moldability, reflow resistance, and electrical reliability, the functional group equivalent of other curing agents is preferably 70 g / eq to 1000 g / eq, and is preferably 80 g / eq to 500 g / eq. Is more preferable. When the other curing agent is a phenol curing agent, the functional group equivalent of the other curing agent means the hydroxyl group equivalent.
The functional group equivalent of the other curing agent shall be a value measured by a method according to JIS K 0070: 1992.
特定共重合物は、炭素数5~30のα-オレフィンと無水マレイン酸との共重合物であれば特に限定されるものではない。特定共重合物は、封止用樹脂組成物に含有されることにより、例えば、エポキシ樹脂及び後述する特定離型剤の分散剤として機能する。
α-オレフィンの炭素数は、エポキシ樹脂及び特定離型剤の分散剤としての機能を発現させる観点から、5~30であり、好ましくは10~25であり、より好ましくは15~25である。
α-オレフィンは、直鎖型であってもよく、分岐型であってもよい。
特定共重合物は、1種を単独で用いても2種以上を組み合わせて用いてもよい。 (Specific copolymer)
The specific copolymer is not particularly limited as long as it is a copolymer of an α-olefin having 5 to 30 carbon atoms and maleic anhydride. When the specific copolymer is contained in the sealing resin composition, it functions as, for example, an epoxy resin and a dispersant for a specific mold release agent described later.
The carbon number of the α-olefin is 5 to 30, preferably 10 to 25, and more preferably 15 to 25, from the viewpoint of exhibiting the function of the epoxy resin and the specific release agent as a dispersant.
The α-olefin may be a linear type or a branched type.
As the specific copolymer, one type may be used alone or two or more types may be used in combination.
特定共重合物の重量平均分子量が5000以上であることにより、金型汚れ抑制効果が得られやすくなる。特定共重合物の重量平均分子量が100000以下であることにより、特定共重合物の軟化点上昇による混練性低下が抑制される。
ここで、重量平均分子量は、ゲルパーミエーションクロマトグラフィー(GPC)で測定した値をいう。GPCによる重量平均分子量の測定は、例えば、分析用GPCカラムに東ソー株式会社のG2000HXL、3000HXL等を使用し、移動相にはテトラヒドロフラン等を用い、試料濃度を0.2質量%とし、流速を1.0mL/minとして測定を行う。ポリスチレン標準サンプルを用いて検量線を作成し、ポリスチレン換算値で重量平均分子量を計算する。 The weight average molecular weight of the specific copolymer is preferably 5,000 to 100,000, more preferably 10,000 to 70,000, and even more preferably 15,000 to 50,000, from the viewpoint of mold stain suppression and moldability.
When the weight average molecular weight of the specific copolymer is 5000 or more, the mold stain suppressing effect can be easily obtained. When the weight average molecular weight of the specific copolymer is 100,000 or less, the decrease in kneadability due to the increase in the softening point of the specific copolymer is suppressed.
Here, the weight average molecular weight refers to a value measured by gel permeation chromatography (GPC). For the measurement of the weight average molecular weight by GPC, for example, G2000HXL, 3000HXL of Tosoh Corporation is used for the GPC column for analysis, tetrahydrofuran etc. is used for the mobile phase, the sample concentration is 0.2% by mass, and the flow velocity is 1. Measure at 0.0 mL / min. A calibration curve is prepared using a polystyrene standard sample, and the weight average molecular weight is calculated using polystyrene-equivalent values.
また、特定共重合物の含有量は、硬化物の離型性を向上させる観点から、エポキシ樹脂100質量部に対し0.25質量部~5質量部であることが好ましく、0.5質量部~2質量部であることがより好ましい。 The content of the specific copolymer is preferably 0.01% by mass to 1.00% by mass, preferably 0.02, based on the entire sealing resin composition, from the viewpoint of improving the releasability of the cured product. It is more preferably from mass% to 0.50 mass%, and even more preferably from 0.05 mass% to 0.10 mass%.
The content of the specific copolymer is preferably 0.25 parts by mass to 5 parts by mass, and 0.5 parts by mass with respect to 100 parts by mass of the epoxy resin, from the viewpoint of improving the releasability of the cured product. It is more preferably about 2 parts by mass.
反応終了後、必要に応じて、加熱減圧下等で未反応成分、溶剤等を除去することができる。未反応成分、溶剤等の除去における条件は、温度を100~220℃、より好ましくは120~180℃、圧力を13.3×103Pa以下、より好ましくは8×103Pa以下、時間を0.5~10時間とすることが好ましい。
また、反応には、必要に応じてアミン系触媒、酸触媒等の反応触媒を加えてもよい。反応系のpHは、1~10程度とするのが好ましい。 The method for producing the specific copolymer is not particularly limited, and a general copolymer method such as reacting raw materials can be used. An organic solvent or the like capable of dissolving α-olefin and maleic anhydride may be used for the reaction. The organic solvent is not particularly limited, and among them, toluene is preferable, and alcohol solvents, ether solvents, amine solvents and the like can also be used. The reaction temperature varies depending on the type of organic solvent used, but is preferably 50 to 200 ° C., more preferably 80 to 120 ° C. from the viewpoint of reactivity and productivity. The reaction time is not particularly limited as long as the copolymer can be obtained, but is preferably 1 to 30 hours, more preferably 2 to 15 hours, still more preferably 4 to 10 hours from the viewpoint of productivity.
After completion of the reaction, unreacted components, solvents and the like can be removed, if necessary, under heating and reduced pressure. The conditions for removing unreacted components, solvents, etc. are as follows: temperature is 100 to 220 ° C., more preferably 120 to 180 ° C., pressure is 13.3 × 10 3 Pa or less, more preferably 8 × 10 3 Pa or less, time. It is preferably 0.5 to 10 hours.
Further, a reaction catalyst such as an amine catalyst or an acid catalyst may be added to the reaction, if necessary. The pH of the reaction system is preferably about 1 to 10.
封止用樹脂組成物は、さらに、ポリオレフィン系ワックス及びエステル系ワックスからなる群より選択される少なくとも一種(以下「特定離型剤」ともいう)を含有してもよい。つまり、封止用樹脂組成物は、エポキシ樹脂と、活性エステル化合物と、特定共重合物と、特定離型剤と、を含有してもよい。特定共重合物の長鎖アルキル基が特定離型剤と親和し、かつ、特定共重合物の無水マレイン酸に由来する構造が活性エステル化合物と親和することで、特定離型剤及び活性エステル化合物の両方における分散性が向上すると考えられる。そのため、封止用樹脂組成物がエポキシ樹脂と活性エステル化合物と特定共重合物と特定離型剤とを含有することで、硬化物の誘電正接の低減と硬化物の離型性とが両立されると推測される。 (Specific mold release agent)
The sealing resin composition may further contain at least one selected from the group consisting of polyolefin-based waxes and ester-based waxes (hereinafter, also referred to as "specific mold release agent"). That is, the sealing resin composition may contain an epoxy resin, an active ester compound, a specific copolymer, and a specific mold release agent. The long-chain alkyl group of the specific copolymer is compatible with the specific mold release agent, and the structure derived from maleic anhydride of the specific copolymer is compatible with the active ester compound, so that the specific mold release agent and the active ester compound are compatible. It is considered that the dispersibility in both of these is improved. Therefore, by containing the epoxy resin, the active ester compound, the specific copolymer, and the specific mold release agent in the sealing resin composition, both the reduction of the dielectric loss tangent of the cured product and the releasability of the cured product are achieved. It is presumed that.
ポリオレフィン系ワックスは、酸化型ポリオレフィン系ワックスでもよく、非酸化型ポリオレフィン系ワックスでもよい。ポリオレフィン系ワックスとしては、例えば、酸化ポリエチレン、非酸化ポリエチレン、酸化ポリプロピレン、非酸化ポリプロピレン、酸化ポリブテン、非酸化ポリブテン等が挙げられる。
エステル系ワックスとしては、例えば、モンタン酸エステル、ケン化モンタン酸エステル、グリセリンエステル、カルバナワックス、ライスワックス等が挙げられる。
特定離型剤は、これらの中でも、ポリオレフィン系ワックスを含むことが好ましく、その中でも酸化ポリエチレンを含むことがより好ましい。酸化ポリエチレンは、直鎖型酸化ポリエチレンであってもよく、分岐型酸化ポリエチレンであってもよい。
なお、特定離型剤は、これらのうち1種を単独で用いてもよく、2種以上を組み合わせてもよい。 The specific mold release agent is not particularly limited as long as it contains at least one selected from the group consisting of polyolefin waxes and ester waxes.
The polyolefin-based wax may be an oxidized polyolefin-based wax or a non-oxidized polyolefin-based wax. Examples of the polyolefin-based wax include polyethylene oxide, non-oxidized polyethylene, polypropylene oxide, non-oxidized polypropylene, polybutene oxide, and non-oxidized polybutene.
Examples of the ester wax include montanic acid ester, saponified montanic acid ester, glycerin ester, carbana wax, rice wax and the like.
Among these, the specific mold release agent preferably contains a polyolefin wax, and more preferably contains polyethylene oxide. The polyethylene oxide may be a linear polyethylene oxide or a branched polyethylene oxide.
As the specific release agent, one of these may be used alone, or two or more thereof may be combined.
なお、上記酸価は、測定対象1gを中和するのに必要な水酸化カリウムのモル数であり、JIS K0070:1992による測定法で求められる。 The acid value of the polyolefin wax is not particularly limited, and is preferably 0 mg / KOH to 100 mg / KOH, more preferably 10 mg / KOH to 60 mg / KOH, from the viewpoint of releasability and adhesiveness.
The acid value is the number of moles of potassium hydroxide required to neutralize 1 g of the measurement target, and is determined by the measurement method according to JIS K0070: 1992.
なお、上記ケン化価は、測定対象1gをケン化するのに必要な水酸化カリウムのモル数であり、JIS K0070:1992による測定法で求められる。 The saponification value of the ester wax is not particularly limited, and is preferably 1 mg / KOH to 200 mg / KOH, and more preferably 30 mg / KOH to 100 mg / KOH from the viewpoint of releasability and adhesiveness. ..
The saponification value is the number of moles of potassium hydroxide required to saponify 1 g of the measurement target, and is determined by the measurement method according to JIS K0070: 1992.
なお、上記融点は、エポキシ樹脂の融点と同様にして測定される値とする。 The melting point of the specific mold release agent is not particularly limited, and is preferably 40 ° C. to 180 ° C., more preferably 60 ° C. to 140 ° C. from the viewpoint of kneadability and moldability.
The melting point is a value measured in the same manner as the melting point of the epoxy resin.
封止用樹脂組成物は、必要に応じて硬化促進剤を含んでもよい。硬化促進剤の種類は特に制限されず、エポキシ樹脂又は硬化剤の種類、封止用樹脂組成物の所望の特性等に応じて選択できる。 (Curing accelerator)
The sealing resin composition may contain a curing accelerator, if necessary. The type of the curing accelerator is not particularly limited, and can be selected according to the type of the epoxy resin or the curing agent, the desired properties of the sealing resin composition, and the like.
硬化促進剤は1種を単独で用いても2種以上を組み合わせて用いてもよい。
これらの中でも、特に好適な硬化促進剤としては、トリフェニルホスフィン、トリフェニルホスフィンとキノン化合物との付加物、トリブチルホスフィンとキノン化合物との付加物、トリ-p-トリルホスフィンとキノン化合物との付加物等が挙げられる。 Examples of the curing accelerator include diazabicycloalkenes such as 1,5-diazabicyclo [4.3.0] nonen-5 (DBN) and 1,8-diazabicyclo [5.4.0] undecene-7 (DBU). Cyclic amidin compounds such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-heptadecylimidazole; derivatives of the cyclic amidin compound; phenol novolac salt of the cyclic amidin compound or a derivative thereof; Maleic anhydride, 1,4-benzoquinone, 2,5-turquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1 , 4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone and other quinone compounds, and diazophenylmethane and other quinone compounds with π-bonded compounds added. Compounds; Cyclic amidinium compounds such as DBU tetraphenylborate salt, DBN tetraphenylborate salt, 2-ethyl-4-methylimidazole tetraphenylborate salt, N-methylmorpholin tetraphenylborate salt; pyridine, triethylamine, tri Tertiary amine compounds such as ethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol; derivatives of the tertiary amine compound; tetra-n-butylammonium acetate, tetra-n-phosphate Ammonium salt compounds such as butylammonium, tetraethylammonium acetate, tetra-n-hexylammonium benzoate, tetrapropylammonium hydroxide; first phosphine such as ethylphosphine and phenylphosphine, second phosphine such as dimethylphosphine and diphenylphosphine, tri Phenylphosphine, diphenyl (p-tolyl) phosphine, tris (alkylphenyl) phosphine, tris (alkoxyphenyl) phosphine, tris (alkyl alkoxyphenyl) phosphine, tris (dialkylphenyl) phosphine, tris (trialkylphenyl) phosphine, tris (Tetraalkylphenyl) phosphine, tris (dialkoxyphenyl) phosphine, tris (trialkoxyphenyl) phosphine, tris (tetraalkoxyphenyl) phosphine, trialkylphosphine, dial Organic phosphine such as tertiary phosphine such as killarylphosphine, alkyldiarylphosphine, trinaphthylphosphine, tris (benzyl) phosphine; phosphine compound such as a complex of the organic phosphine and organic borons; the organic phosphine or the phosphine compound. In addition, maleic anhydride, 1,4-benzoquinone, 2,5-turquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1, Intramolecular polarization by adding a quinone compound such as 4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone, anthraquinone, or a compound having a π bond such as diazophenylmethane. Compounds; The organic phosphine or the phosphine compound and 4-bromophenol, 3-bromophenol, 2-bromophenol, 4-chlorophenol, 3-chlorophenol, 2-chlorophenol, 4-iodide phenol, 3-iow Compound, 2-iodide, 4-bromo-2-methylphenol, 4-bromo-3-methylphenol, 4-bromo-2,6-dimethylphenol, 4-bromo-3,5-dimethylphenol, 4 Halogenization of -bromo-2,6-di-tert-butylphenol, 4-chloro-1-naphthol, 1-bromo-2-naphthol, 6-bromo-2-naphthol, 4-bromo-4'-hydroxybiphenyl, etc. A compound having intramolecular polarization obtained through a step of hydrogen dehalogenation after reacting with a phenol compound; tetra-substituted phosphonium such as tetraphenylphosphonium, tetra-substituted phosphonium such as tetraphenylphosphonium tetra-p-tolylbolate. Tetra-substituted phosphonium compounds, such as tetraphenylborate salts, salts of tetra-substituted phosphoniums and phenolic compounds; salts of tetraalkylphosphoniums and partial hydrolysates of aromatic carboxylic acid anhydrides; phosphobetaine compounds; phosphonium compounds and silanes. Additives with compounds; etc.
The curing accelerator may be used alone or in combination of two or more.
Among these, particularly suitable curing accelerators include triphenylphosphine, an adduct of triphenylphosphine and a quinone compound, an adduct of tributylphosphine and a quinone compound, and an adduct of tri-p-tolylphosphine and a quinone compound. Things etc. can be mentioned.
封止用樹脂組成物は、必要に応じて無機充填材を含んでもよい。無機充填材の種類は、特に制限されない。無機充填材として、具体的には、溶融シリカ、結晶シリカ、ガラス、アルミナ、炭酸カルシウム、ケイ酸ジルコニウム、ケイ酸カルシウム、窒化珪素、窒化アルミニウム、窒化ホウ素、ベリリア、ジルコニア、ジルコン、フォステライト、ステアタイト、スピネル、ムライト、チタニア、タルク、クレー、マイカ等の無機材料が挙げられる。難燃効果を有する無機充填材を用いてもよい。難燃効果を有する無機充填材としては、水酸化アルミニウム、水酸化マグネシウム、マグネシウムと亜鉛の複合水酸化物等の複合金属水酸化物、硼酸亜鉛などが挙げられる。 (Inorganic filler)
The sealing resin composition may contain an inorganic filler, if necessary. The type of inorganic filler is not particularly limited. Specific examples of the inorganic filler include fused silica, crystalline silica, glass, alumina, calcium carbonate, zirconium silicate, calcium silicate, silicon nitride, aluminum nitride, boron nitride, beryllia, zirconia, zircon, fosterite, and steer. Examples include inorganic materials such as tight, spinel, mulite, titania, talc, clay and mica. An inorganic filler having a flame-retardant effect may be used. Examples of the inorganic filler having a flame-retardant effect include aluminum hydroxide, magnesium hydroxide, composite metal hydroxide such as a composite hydroxide of magnesium and zinc, and zinc borate.
封止用樹脂組成物の硬化物の薄片試料を走査型電子顕微鏡(SEM)にて撮像する。SEM画像において任意の面積Sを特定し、面積Sに含まれる無機充填材の総面積Aを求める。無機充填材の総面積Aを面積Sで除算した値を百分率(%)に換算し、この値を封止用樹脂組成物に占める無機充填材の体積割合とする。
面積Sは、無機充填材の大きさに対して十分大きい面積とする。例えば、無機充填材が100個以上含まれる大きさとする。面積Sは、複数個の切断面の合計でもよい。
無機充填材は、封止用樹脂組成物の硬化時の重力方向において存在割合に偏りが生じることがある。その場合、SEMにて撮像する際、硬化物の重力方向全体を撮像し、硬化物の重力方向全体が含まれる面積Sを特定する。 The volume ratio of the inorganic filler in the sealing resin composition can be determined by the following method.
A flaky sample of the cured resin composition for encapsulation is imaged with a scanning electron microscope (SEM). An arbitrary area S is specified in the SEM image, and the total area A of the inorganic filler contained in the area S is obtained. The value obtained by dividing the total area A of the inorganic filler by the area S is converted into a percentage (%), and this value is taken as the volume ratio of the inorganic filler in the sealing resin composition.
The area S is a sufficiently large area with respect to the size of the inorganic filler. For example, the size may include 100 or more inorganic fillers. The area S may be the sum of a plurality of cut surfaces.
The presence ratio of the inorganic filler may be biased in the direction of gravity during curing of the sealing resin composition. In that case, when the image is taken by the SEM, the entire gravity direction of the cured product is imaged, and the area S including the entire gravity direction of the cured product is specified.
封止用樹脂組成物は、上述の成分に加えて、以下に例示するカップリング剤、イオン交換体、特定共重合物以外の分散剤、特定離型剤以外の離型剤、難燃剤、着色剤等の各種添加剤を含んでもよい。封止用樹脂組成物は、以下に例示する添加剤以外にも必要に応じて当技術分野で周知の各種添加剤を含んでもよい。 [Various additives]
In addition to the above-mentioned components, the sealing resin composition includes a coupling agent, an ion exchanger, a dispersant other than the specific copolymer, a release agent other than the specific release agent, a flame retardant, and a coloring agent, in addition to the above-mentioned components. Various additives such as agents may be contained. The sealing resin composition may contain various additives well known in the art, if necessary, in addition to the additives exemplified below.
封止用樹脂組成物は、カップリング剤を含んでもよい。樹脂成分と無機充填材との接着性を高める観点からは、封止用樹脂組成物はカップリング剤を含むことが好ましい。カップリング剤としては、エポキシシラン、メルカプトシラン、アミノシラン、アルキルシラン、ウレイドシラン、ビニルシラン、ジシラザン等のシラン系化合物、チタン系化合物、アルミニウムキレート化合物、アルミニウム/ジルコニウム系化合物などの公知のカップリング剤が挙げられる。 (Coupling agent)
The sealing resin composition may contain a coupling agent. From the viewpoint of enhancing the adhesiveness between the resin component and the inorganic filler, the sealing resin composition preferably contains a coupling agent. Examples of the coupling agent include known coupling agents such as silane compounds such as epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane, vinylsilane and disilazane, titanium compounds, aluminum chelate compounds and aluminum / zirconium compounds. Can be mentioned.
封止用樹脂組成物は、イオン交換体を含んでもよい。封止用樹脂組成物は、封止される素子を備える電子部品装置の耐湿性及び高温放置特性を向上させる観点から、イオン交換体を含むことが好ましい。イオン交換体は特に制限されず、従来公知のものを用いることができる。イオン交換体として、具体的には、ハイドロタルサイト化合物、並びにマグネシウム、アルミニウム、チタン、ジルコニウム、及びビスマスからなる群より選ばれる少なくとも1種の元素の含水酸化物等が挙げられる。イオン交換体は、1種を単独で用いても2種以上を組み合わせて用いてもよい。中でも、下記一般式(A)で表されるハイドロタルサイトが好ましい。 (Ion exchanger)
The sealing resin composition may contain an ion exchanger. The sealing resin composition preferably contains an ion exchanger from the viewpoint of improving the moisture resistance and high temperature standing characteristics of the electronic component device including the element to be sealed. The ion exchanger is not particularly limited, and conventionally known ones can be used. Specific examples of the ion exchanger include hydrotalcite compounds and hydrous oxides of at least one element selected from the group consisting of magnesium, aluminum, titanium, zirconium, and bismuth. As the ion exchanger, one type may be used alone or two or more types may be used in combination. Of these, hydrotalcite represented by the following general formula (A) is preferable.
(0<X≦0.5、mは正の数) Mg (1-X) Al X (OH) 2 (CO 3 ) X / 2・ mH 2 O …… (A)
(0 <X ≤ 0.5, m is a positive number)
封止用樹脂組成物は、特定共重合物以外の分散剤をさらに含有してもよい。特定共重合物以外の分散剤としては、例えば、特定共重合物のエステル化物が挙げられる。 (Dispersants other than specific copolymers)
The sealing resin composition may further contain a dispersant other than the specific copolymer. Examples of the dispersant other than the specific copolymer include esterified products of the specific copolymer.
上記一価のアルコールは、炭素数5~25の一価のアルコールであることが好ましく、炭素数10~20の直鎖型アルコールであることがより好ましく、炭素数15~20の直鎖型脂肪族飽和アルコールであることがさらに好ましい。 Examples of the esterified product of the specific copolymer include a compound obtained by esterifying the above-mentioned specific copolymer with a monohydric alcohol. The monohydric alcohol that esterifies the specific copolymer is not particularly limited, and for example, amyl alcohol, isoamyl alcohol, hexyl alcohol, heptyl alcohol, octyl alcohol, capryl alcohol, nonyl alcohol, decyl alcohol, and un. Linear or branched aliphatic saturated alcohols such as decyl alcohol, lauryl alcohol, tridecyl alcohol, myristyl alcohol, pentadecyl alcohol, cetyl alcohol, heptadecyl alcohol, stearyl alcohol, nonadecil alcohol, eikosyl alcohol; hexenol, Linear or branched aliphatic unsaturated alcohols such as 2-hexen-1-ol, 1-hexen-3-ol, pentenol, 2-methyl-1-pentenol; cyclopentanol, cyclohexanol, etc. Alicyclic alcohols; aromatic alcohols such as benzyl alcohol and cinnamyl alcohol; heterocyclic alcohols such as furfuryl alcohol; and the like can be mentioned, and these may be used alone or in combination of two or more.
The monohydric alcohol is preferably a monohydric alcohol having 5 to 25 carbon atoms, more preferably a linear alcohol having 10 to 20 carbon atoms, and a linear fat having 15 to 20 carbon atoms. It is more preferably a group saturated alcohol.
ことが好ましく、80~120℃がより好ましい。反応時間は、生産性の観点から1~30時間とするのが好ましく、より好ましくは2~15時間、さらに好ましくは4~10時間である。反応終了後、必要に応じて、加熱減圧下等で未反応成分、溶剤等を除去することができる。また、反応には、必要に応じてアミン系触媒、酸触媒等の反応触媒を加えてもよい。反応系のpHは、1~10程度とするのが好ましい。 The method for esterifying the specific copolymer with a monohydric alcohol is not particularly limited, and general methods such as addition reaction of a monohydric alcohol to the specific copolymer can be mentioned. The reaction molar ratio of the specific copolymer and the monohydric alcohol is not particularly limited and can be set arbitrarily. An organic solvent or the like may be used for the reaction. The organic solvent is not particularly limited, and examples thereof include toluene, alcohol-based solvent, ether-based solvent, and amine-based solvent. The reaction temperature varies depending on the type of organic solvent used, but is preferably 50 to 200 ° C., more preferably 80 to 120 ° C. from the viewpoint of reactivity and productivity. The reaction time is preferably 1 to 30 hours, more preferably 2 to 15 hours, still more preferably 4 to 10 hours from the viewpoint of productivity. After completion of the reaction, unreacted components, solvents and the like can be removed, if necessary, under heating and reduced pressure. Further, a reaction catalyst such as an amine catalyst or an acid catalyst may be added to the reaction, if necessary. The pH of the reaction system is preferably about 1 to 10.
封止用樹脂組成物が特定共重合物と特定共重合物のエステル化物とを含有する場合、特定共重合物と特定共重合物のエステル化物との合計含有率は、封止用樹脂組成物全体に対し0.01質量%~1.00質量%であることが好ましく、0.02質量%~0.50質量%であることがより好ましく、0.05質量%~0.10質量%であることがさらに好ましい。
また、封止用樹脂組成物が特定共重合物と特定共重合物のエステル化物とを含有する場合、特定共重合物と特定共重合物のエステル化物との合計含有量は、エポキシ樹脂100質量部に対し0.25質量部~5質量部であることが好ましく、0.5質量部~2質量部であることがより好ましい。 The weight average molecular weight of the esterified product of the specific copolymer is preferably 3000 to 100,000, more preferably 10,000 to 70,000, still more preferably 15,000 to 50,000, from the viewpoint of mold stain suppression and moldability.
When the sealing resin composition contains a specific copolymer and an esterified product of the specific copolymer, the total content of the specific copolymer and the esterified product of the specific copolymer is determined by the sealing resin composition. It is preferably 0.01% by mass to 1.00% by mass, more preferably 0.02% by mass to 0.50% by mass, and 0.05% by mass to 0.10% by mass with respect to the whole. It is more preferable to have.
When the sealing resin composition contains the specific copolymer and the esterified product of the specific copolymer, the total content of the specific copolymer and the esterified product of the specific copolymer is 100 mass of epoxy resin. It is preferably 0.25 parts by mass to 5 parts by mass, and more preferably 0.5 parts by mass to 2 parts by mass.
封止用樹脂組成物は、必要に応じて特定離型剤以外の離型剤を含んでもよい。特定離型剤以外の離型剤は特に制限されず、従来公知のものを用いることができる。具体的には、モンタン酸、ステアリン酸等の高級脂肪酸、高級脂肪酸金属塩、などが挙げられる。特定離型剤以外の離型剤は、1種を単独で用いても2種以上を組み合わせて用いてもよい。 (Release agents other than specific release agents)
The sealing resin composition may contain a release agent other than the specific release agent, if necessary. The release agent other than the specific release agent is not particularly limited, and conventionally known release agents can be used. Specific examples thereof include higher fatty acids such as montanic acid and stearic acid, and higher fatty acid metal salts. As the release agent other than the specific release agent, one type may be used alone or two or more types may be used in combination.
封止用樹脂組成物は、難燃剤を含んでもよい。難燃剤は特に制限されず、従来公知のものを用いることができる。難燃剤として、具体的には、ハロゲン原子、アンチモン原子、窒素原子又はリン原子を含む有機又は無機の化合物、金属水酸化物等が挙げられる。難燃剤は、1種を単独で用いても2種以上を組み合わせて用いてもよい。 (Flame retardants)
The sealing resin composition may contain a flame retardant. The flame retardant is not particularly limited, and conventionally known flame retardants can be used. Specific examples of the flame retardant include an organic or inorganic compound containing a halogen atom, an antimony atom, a nitrogen atom or a phosphorus atom, and a metal hydroxide. The flame retardant may be used alone or in combination of two or more.
封止用樹脂組成物は、着色剤を含んでもよい。着色剤としてはカーボンブラック、有機染料、有機顔料、酸化チタン、鉛丹、ベンガラ等の公知の着色剤を挙げることができる。着色剤の含有量は目的等に応じて適宜選択できる。着色剤は、1種を単独で用いても2種以上を組み合わせて用いてもよい。 (Colorant)
The sealing resin composition may contain a colorant. Examples of the colorant include known colorants such as carbon black, organic dyes, organic pigments, titanium oxide, lead tan, and red iron oxide. The content of the colorant can be appropriately selected according to the purpose and the like. As the colorant, one type may be used alone or two or more types may be used in combination.
封止用樹脂組成物の調製方法は、特に制限されない。封止用樹脂組成物を調製するための一般的な手法としては、所定の配合量の成分をミキサー等によって十分混合した後、ミキシングロール、押出機等によって溶融混練し、冷却し、粉砕する方法を挙げることができる。封止用樹脂組成物の調製方法として、より具体的には、例えば、上述した成分の所定量を均一に攪拌及び混合し、予め70℃~140℃に加熱してあるニーダー、ロール、エクストルーダー等で混練し、冷却し、粉砕する方法を挙げることができる。
なお、所定の配合量の成分を混合するにあたり、エポキシ樹脂の一部又は全部と特定共重合物とを予備混合してもよい。また、封止用樹脂組成物が特定離型剤を含む場合、エポキシ樹脂の一部又は全部と特定共重合物と特定離型剤とを予備混合してもよい。 (Method for preparing resin composition for sealing)
The method for preparing the sealing resin composition is not particularly limited. As a general method for preparing a resin composition for sealing, a method in which a predetermined amount of components are sufficiently mixed by a mixer or the like, then melt-kneaded by a mixing roll, an extruder or the like, cooled and pulverized. Can be mentioned. More specifically, as a method for preparing the sealing resin composition, for example, a kneader, a roll, or an extruder in which a predetermined amount of the above-mentioned components is uniformly stirred and mixed and preheated to 70 ° C. to 140 ° C. Examples thereof include a method of kneading with, cooling, and crushing.
When mixing the components in a predetermined blending amount, a part or all of the epoxy resin and the specific copolymer may be premixed. When the sealing resin composition contains a specific release agent, a part or all of the epoxy resin, the specific copolymer, and the specific release agent may be premixed.
本開示の一実施形態である電子部品装置は、支持部材と、前記支持部材上に配置された素子と、前記素子を封止している本開示の封止用樹脂組成物の硬化物と、を備える。 <Electronic component equipment>
The electronic component device according to the embodiment of the present disclosure includes a support member, an element arranged on the support member, and a cured product of the sealing resin composition of the present disclosure that seals the element. To be equipped.
より具体的には、リードフレーム上に素子を固定し、ボンディングパッド等の素子の端子部とリード部とをワイヤボンディング、バンプ等で接続した後、封止用樹脂組成物を用いてトランスファ成形等によって封止した構造を有するDIP(Dual Inline Package)、PLCC(Plastic Leaded Chip Carrier)、QFP(Quad Flat Package)、SOP(Small Outline Package)、SOJ(Small Outline J-lead package)、TSOP(Thin Small Outline Package)、TQFP(Thin Quad Flat Package)等の一般的な樹脂封止型IC;テープキャリアにバンプで接続した素子を封止用樹脂組成物で封止した構造を有するTCP(Tape Carrier Package);支持部材上に形成した配線に、ワイヤボンディング、フリップチップボンディング、はんだ等で接続した素子を、封止用樹脂組成物で封止した構造を有するCOB(Chip On Board)モジュール、ハイブリッドIC、マルチチップモジュール等;裏面に配線板接続用の端子を形成した支持部材の表面に素子を搭載し、バンプ又はワイヤボンディングにより素子と支持部材に形成された配線とを接続した後、封止用樹脂組成物で素子を封止した構造を有するBGA(Ball Grid Array)、CSP(Chip Size Package)、MCP(Multi Chip Package)などが挙げられる。また、プリント配線板においても封止用樹脂組成物を好適に使用することができる。 Electronic component devices include lead frames, pre-wired tape carriers, wiring boards, glass, silicon wafers, organic substrates, and other support members, as well as elements (for example, semiconductor chips, transistors, diodes, active elements such as thyristors, capacitors, etc.). Examples thereof include those in which an element portion obtained by mounting a resistor, a passive element such as a coil, etc.) is sealed with a sealing resin composition.
More specifically, after fixing the element on the lead frame and connecting the terminal part and the lead part of the element such as a bonding pad by wire bonding, bumps, etc., transfer molding or the like using a sealing resin composition or the like. DIP (Dual Inline Package), PLCC (Plastic Leaded Chip Carrier), QFP (Quad Flat Package), SOP (Small Outline Package), SOJ (SmallOdlinePack) General resin-sealed ICs such as Outline Package) and TQFP (Thin Quad Flat Package); TCP (Tape Carrier Package) having a structure in which an element connected to a tape carrier with a bump is sealed with a sealing resin composition. A COB (Chip On Board) module, hybrid IC, or multi having a structure in which an element connected by wire bonding, flip chip bonding, solder, or the like is sealed to a wiring formed on a support member with a sealing resin composition. Chip module, etc .; An element is mounted on the front surface of a support member having terminals for connecting a wiring plate on the back surface, and after connecting the element and the wiring formed on the support member by bump or wire bonding, a resin composition for sealing is provided. Examples thereof include BGA (Ball Grid Array), CSP (Chip Size Package), and MCP (Multi Chip Package) having a structure in which an element is sealed with an object. Further, the sealing resin composition can also be preferably used in the printed wiring board.
本開示の一実施形態に係る電子部品装置の製造方法は、素子を支持部材上に配置することと、前記素子を本開示の封止用樹脂組成物で封止することと、を含む。 <Manufacturing method of electronic component equipment>
A method for manufacturing an electronic component device according to an embodiment of the present disclosure includes arranging an element on a support member and sealing the element with the sealing resin composition of the present disclosure.
下記に示す成分を表1に示す配合割合(質量部)で混合し、実施例と比較例の封止用樹脂組成物を調製した。この封止用樹脂組成物は、常温常圧下において固体であった。また、得られた封止用樹脂組成物全体に対する無機充填材の含有量は、実施例及び比較例のいずれにおいても、83.1体積%であった。 <Preparation of resin composition for sealing>
The components shown below were mixed at the blending ratios (parts by mass) shown in Table 1 to prepare resin compositions for encapsulation of Examples and Comparative Examples. This sealing resin composition was a solid under normal temperature and pressure. The content of the inorganic filler in the obtained sealing resin composition as a whole was 83.1% by volume in both Examples and Comparative Examples.
・エポキシ樹脂2:ビフェニル型エポキシ樹脂、エポキシ当量192g/eq(三菱ケミカル株式会社、品名「YX-4000」) -Epoxy resin 1: Triphenylmethane type epoxy resin, epoxy equivalent 167 g / eq (Mitsubishi Chemical Corporation, product name "1032H60")
-Epoxy resin 2: Biphenyl type epoxy resin, epoxy equivalent 192 g / eq (Mitsubishi Chemical Corporation, product name "YX-4000")
・フェノール硬化剤1:フェノールアラルキル樹脂、水酸基当量202g/eq(明和化成株式会社、品名「MEH7851SS」) -Active ester compound 1: DIC Corporation, product name "EXB-8"
-Phenol curing agent 1: Phenol aralkyl resin, hydroxyl group equivalent 202 g / eq (Meiwa Kasei Co., Ltd., product name "MEH7851SS")
・酸化ポリエチレン2:酸化ポリエチレン、重量平均分子量8800、酸価24.5mg/KOH、融点140℃、(クラリアントジャパン株式会社、品名「リコワックスPED153」)
・酸化ポリエチレン3:酸化ポリエチレン、重量平均分子量3000、酸価1mg/KOH、融点114℃、(三井化学株式会社、品名「ハイワックス310MP」)
・エステル系ワックス1:モンタン酸エステルワックス(クラリアントジャパン株式会社、品名「HW-E」)
・酸化ポリエチレン4:酸化ポリエチレン、重量平均分子量3100、酸価25mg/KOH、融点101℃、(クラリアントジャパン株式会社、品名「リコワックスPED522」)
・酸化ポリエチレン5:酸化ポリエチレン、融点138℃、大日化学工業株式会社、品名「PE-A」) -Polyethylene oxide 1: Polyethylene oxide, weight average molecular weight 2600, acid value 17 mg / KOH, melting point 100 ° C. (Mitsui Chemicals Co., Ltd., product name "High Wax 4202E")
-Polyethylene oxide 2: Polyethylene oxide, weight average molecular weight 8800, acid value 24.5 mg / KOH, melting point 140 ° C. (Clariant Japan Co., Ltd., product name "Ricowax PED153")
-Polyethylene oxide 3: Polyethylene oxide, weight average molecular weight 3000, acid value 1 mg / KOH, melting point 114 ° C. (Mitsui Chemicals Co., Ltd., product name "High Wax 310MP")
-Ester wax 1: Montanic acid ester wax (Clariant Japan Co., Ltd., product name "HW-E")
-Polyethylene oxide 4: Polyethylene oxide, weight average molecular weight 3100, acid value 25 mg / KOH, melting point 101 ° C. (Clariant Japan Co., Ltd., product name "Ricowax PED522")
-Polyethylene oxide 5: Polyethylene oxide, melting point 138 ° C, Dainichi Kagaku Kogyo Co., Ltd., product name "PE-A")
・無機充填材1:溶融シリカ1(体積平均粒径4.5μm)
・無機充填材2:溶融シリカ2(体積平均粒径0.6μm)
・カップリング剤1:N-フェニル-3-アミノプロピルトリメトキシシラン(信越化学工業社、品名「KBM-573」)
・カップリング剤2:3-メルカプトプロピルトリメトキシシラン(信越化学工業社、品名「KBM-803」)
・着色剤:カーボンブラック(三菱ケミカル株式会社、品名「MA600」) -Curing accelerator 1: Triphenylphosphine / 1,4-benzoquinone adduct-Inorganic filler 1: Fused silica 1 (volume average particle size 4.5 μm)
-Inorganic filler 2: Fused silica 2 (volume average particle size 0.6 μm)
-Coupling agent 1: N-phenyl-3-aminopropyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd., product name "KBM-573")
-Coupling agent 2: 3-mercaptopropyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd., product name "KBM-803")
-Colorant: Carbon black (Mitsubishi Chemical Corporation, product name "MA600")
(比誘電率及び誘電正接)
封止用樹脂組成物を真空ハンドプレス機に仕込み、金型温度175℃、成形圧力6.9MPa、硬化時間600秒の条件で成形し、後硬化を180℃で6時間行い、板状の硬化物(縦12.5mm、横25mm、厚さ0.2mm)を得た。この板状の硬化物を試験片として、誘電率測定装置(アジレント・テクノロジー社、品名「ネットワークアナライザN5227A」)を用いて、温度25±3℃下、60GHzでの比誘電率と誘電正接を測定した。結果を表1に示す。 <Performance evaluation of sealing resin composition>
(Relative permittivity and dielectric loss tangent)
The sealing resin composition is charged into a vacuum hand press machine, molded under the conditions of a mold temperature of 175 ° C., a molding pressure of 6.9 MPa, and a curing time of 600 seconds, and post-curing is performed at 180 ° C. for 6 hours to cure the plate. An article (length 12.5 mm, width 25 mm, thickness 0.2 mm) was obtained. Using this plate-shaped cured product as a test piece, measure the relative permittivity and dielectric loss tangent at 60 GHz at a temperature of 25 ± 3 ° C. using a dielectric constant measuring device (Agilent Technologies, Inc., product name “Network Analyzer N5227A”). did. The results are shown in Table 1.
上下4枚組みの金型(外径100mm×合計厚63mm)を用いて、180℃、6.9MPa、180秒の条件で封止用樹脂組成物を、上径10.2mm×下径12.5mm×厚さ20mm寸法の空洞部分に充填された成形品に成形した直後に、プッシュ-プルゲージ(株式会社イマダ製)を用いて、成形品を上から突つき、成形品が抜けた時の荷重(抜き荷重:N)を測定した。離型回復材を使わずに4ショット成形し、4ショット目の成形品について測定を行った結果(抜き荷重:N)で評価した。結果を表1に示す。 (Releasability)
Using a four-piece set of upper and lower molds (outer diameter 100 mm x total thickness 63 mm), the sealing resin composition was applied under the conditions of 180 ° C., 6.9 MPa, and 180 seconds, with an upper diameter of 10.2 mm and a lower diameter of 12. Immediately after molding into a molded product filled in a cavity with a size of 5 mm x 20 mm in thickness, a push-pull gauge (manufactured by Imada Co., Ltd.) is used to poke the molded product from above, and the load when the molded product comes off. (Pulling load: N) was measured. Four shots were molded without using a mold release recovery material, and the results of measurement (pulling load: N) of the molded product on the fourth shot were evaluated. The results are shown in Table 1.
本明細書に記載された全ての文献、特許出願、および技術規格は、個々の文献、特許出願、および技術規格が参照により取り込まれることが具体的かつ個々に記された場合と同程度に、本明細書中に取り込まれる。 The disclosure of Japanese Patent Application No. 2019-221333, filed December 6, 2019, is incorporated herein by reference in its entirety.
All documents, patent applications, and technical standards described herein are to the same extent as if the individual documents, patent applications, and technical standards were specifically and individually stated to be incorporated by reference. Incorporated herein.
Claims (10)
- エポキシ樹脂と、
活性エステル化合物を含む硬化剤と、
炭素数5~30のα-オレフィンと無水マレイン酸との共重合物と、
を含有する封止用樹脂組成物。 Epoxy resin and
A curing agent containing an active ester compound and
A copolymer of α-olefin having 5 to 30 carbon atoms and maleic anhydride,
A resin composition for sealing containing. - 前記共重合物における前記α-オレフィンと前記無水マレイン酸との共重合モル比は、20:1~1:2である請求項1に記載の封止用樹脂組成物。 The sealing resin composition according to claim 1, wherein the copolymerization molar ratio of the α-olefin and the maleic anhydride in the copolymer is 20: 1 to 1: 2.
- 前記共重合物の含有率は、封止用樹脂組成物全体に対し0.01質量%~1.00質量%である請求項1又は請求項2に記載の封止用樹脂組成物。 The sealing resin composition according to claim 1 or 2, wherein the content of the copolymer is 0.01% by mass to 1.00% by mass with respect to the entire sealing resin composition.
- 前記共重合物の含有量は、前記エポキシ樹脂100質量部に対し0.25質量部~5質量部である請求項1~請求項3のいずれか1項に記載の封止用樹脂組成物。 The sealing resin composition according to any one of claims 1 to 3, wherein the content of the copolymer is 0.25 parts by mass to 5 parts by mass with respect to 100 parts by mass of the epoxy resin.
- 前記共重合物の重量平均分子量は、5000~100000である請求項1~請求項4のいずれか1項に記載の封止用樹脂組成物。 The sealing resin composition according to any one of claims 1 to 4, wherein the copolymer has a weight average molecular weight of 5000 to 100,000.
- さらに、ポリオレフィン系ワックス及びエステル系ワックスからなる群より選択される少なくとも一種を含有する請求項1~請求項5のいずれか1項に記載の封止用樹脂組成物。 The sealing resin composition according to any one of claims 1 to 5, further comprising at least one selected from the group consisting of polyolefin waxes and ester waxes.
- 前記ポリオレフィン系ワックス及びエステル系ワックスからなる群より選択される少なくとも一種の含有量は、前記エポキシ樹脂100質量部に対し0.5質量部~10質量部である請求項6に記載の封止用樹脂組成物。 The sealing material according to claim 6, wherein the content of at least one selected from the group consisting of the polyolefin-based wax and the ester-based wax is 0.5 parts by mass to 10 parts by mass with respect to 100 parts by mass of the epoxy resin. Resin composition.
- さらに、無機充填材を含有する請求項1~請求項7のいずれか1項に記載の封止用樹脂組成物。 The sealing resin composition according to any one of claims 1 to 7, further comprising an inorganic filler.
- 支持部材と、
前記支持部材上に配置された素子と、
前記素子を封止している請求項1~請求項8のいずれか1項に記載の封止用樹脂組成物の硬化物と、
を備える電子部品装置。 Support members and
The element arranged on the support member and
The cured product of the sealing resin composition according to any one of claims 1 to 8, which seals the element, and the cured product.
Electronic component device equipped with. - 素子を支持部材上に配置することと、
前記素子を請求項1~請求項8のいずれか1項に記載の封止用樹脂組成物で封止することと、
を含む電子部品装置の製造方法。 Placing the element on the support member and
The element is sealed with the sealing resin composition according to any one of claims 1 to 8.
Manufacturing method of electronic component equipment including.
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1036486A (en) * | 1996-07-24 | 1998-02-10 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for semiconductor sealing |
JP2012246367A (en) * | 2011-05-26 | 2012-12-13 | Dic Corp | Thermosetting resin composition, cured product thereof, semiconductor sealing material, prepreg, circuit board and buildup film |
JP2014114352A (en) * | 2012-12-07 | 2014-06-26 | Dic Corp | Active ester resin, curable resin composition, cured product thereof, and printed wiring board |
-
2020
- 2020-12-02 WO PCT/JP2020/044931 patent/WO2021112142A1/en active Application Filing
- 2020-12-02 JP JP2021562693A patent/JPWO2021112142A1/ja active Pending
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1036486A (en) * | 1996-07-24 | 1998-02-10 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for semiconductor sealing |
JP2012246367A (en) * | 2011-05-26 | 2012-12-13 | Dic Corp | Thermosetting resin composition, cured product thereof, semiconductor sealing material, prepreg, circuit board and buildup film |
JP2014114352A (en) * | 2012-12-07 | 2014-06-26 | Dic Corp | Active ester resin, curable resin composition, cured product thereof, and printed wiring board |
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