JP7396290B2 - Encapsulating resin composition, electronic component device, and method for manufacturing electronic component device - Google Patents
Encapsulating resin composition, electronic component device, and method for manufacturing electronic component device Download PDFInfo
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- JP7396290B2 JP7396290B2 JP2020549216A JP2020549216A JP7396290B2 JP 7396290 B2 JP7396290 B2 JP 7396290B2 JP 2020549216 A JP2020549216 A JP 2020549216A JP 2020549216 A JP2020549216 A JP 2020549216A JP 7396290 B2 JP7396290 B2 JP 7396290B2
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- resin composition
- mass
- sealing resin
- electronic component
- compounds
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- 239000011342 resin composition Substances 0.000 title claims description 76
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000000034 method Methods 0.000 title description 21
- -1 ester compound Chemical class 0.000 claims description 80
- 238000007789 sealing Methods 0.000 claims description 74
- 239000003822 epoxy resin Substances 0.000 claims description 61
- 229920000647 polyepoxide Polymers 0.000 claims description 61
- 239000003795 chemical substances by application Substances 0.000 claims description 54
- 239000011256 inorganic filler Substances 0.000 claims description 37
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 37
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 15
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 34
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 26
- 239000005011 phenolic resin Substances 0.000 description 19
- 150000002989 phenols Chemical class 0.000 description 19
- 229920005989 resin Polymers 0.000 description 19
- 239000011347 resin Substances 0.000 description 19
- 150000001875 compounds Chemical class 0.000 description 18
- 239000002245 particle Substances 0.000 description 14
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 14
- 239000007822 coupling agent Substances 0.000 description 12
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 12
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 10
- 239000003063 flame retardant Substances 0.000 description 10
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- 239000007983 Tris buffer Substances 0.000 description 9
- 125000004432 carbon atom Chemical group C* 0.000 description 9
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 9
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 8
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 8
- 125000003118 aryl group Chemical group 0.000 description 8
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 8
- 239000003086 colorant Substances 0.000 description 8
- 150000002500 ions Chemical class 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 7
- 125000000217 alkyl group Chemical group 0.000 description 7
- 238000004891 communication Methods 0.000 description 7
- 125000000524 functional group Chemical group 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 6
- 125000004185 ester group Chemical group 0.000 description 6
- 150000002148 esters Chemical class 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000006082 mold release agent Substances 0.000 description 6
- 229920003986 novolac Polymers 0.000 description 6
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 6
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 125000003700 epoxy group Chemical group 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 4
- NADHCXOXVRHBHC-UHFFFAOYSA-N 2,3-dimethoxycyclohexa-2,5-diene-1,4-dione Chemical compound COC1=C(OC)C(=O)C=CC1=O NADHCXOXVRHBHC-UHFFFAOYSA-N 0.000 description 4
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 4
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 4
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 125000001038 naphthoyl group Chemical group C1(=CC=CC2=CC=CC=C12)C(=O)* 0.000 description 4
- 229920001568 phenolic resin Polymers 0.000 description 4
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 4
- 238000001721 transfer moulding Methods 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000004305 biphenyl Substances 0.000 description 3
- 235000010290 biphenyl Nutrition 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- CRGRWBQSZSQVIE-UHFFFAOYSA-N diazomethylbenzene Chemical compound [N-]=[N+]=CC1=CC=CC=C1 CRGRWBQSZSQVIE-UHFFFAOYSA-N 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 150000004780 naphthols Chemical class 0.000 description 3
- 125000001624 naphthyl group Chemical group 0.000 description 3
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 3
- 230000010287 polarization Effects 0.000 description 3
- 235000013824 polyphenols Nutrition 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 3
- 239000001993 wax Substances 0.000 description 3
- 229940005561 1,4-benzoquinone Drugs 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical group C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 2
- ZEGDFCCYTFPECB-UHFFFAOYSA-N 2,3-dimethoxy-1,4-benzoquinone Natural products C1=CC=C2C(=O)C(OC)=C(OC)C(=O)C2=C1 ZEGDFCCYTFPECB-UHFFFAOYSA-N 0.000 description 2
- AIACLXROWHONEE-UHFFFAOYSA-N 2,3-dimethylcyclohexa-2,5-diene-1,4-dione Chemical compound CC1=C(C)C(=O)C=CC1=O AIACLXROWHONEE-UHFFFAOYSA-N 0.000 description 2
- SENUUPBBLQWHMF-UHFFFAOYSA-N 2,6-dimethylcyclohexa-2,5-diene-1,4-dione Chemical compound CC1=CC(=O)C=C(C)C1=O SENUUPBBLQWHMF-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- RLQZIECDMISZHS-UHFFFAOYSA-N 2-phenylcyclohexa-2,5-diene-1,4-dione Chemical compound O=C1C=CC(=O)C(C=2C=CC=CC=2)=C1 RLQZIECDMISZHS-UHFFFAOYSA-N 0.000 description 2
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 2
- 125000002252 acyl group Chemical group 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- MIHINWMALJZIBX-UHFFFAOYSA-N cyclohexa-2,4-dien-1-ol Chemical compound OC1CC=CC=C1 MIHINWMALJZIBX-UHFFFAOYSA-N 0.000 description 2
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical class [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- 238000007429 general method Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910000000 metal hydroxide Inorganic materials 0.000 description 2
- 150000004692 metal hydroxides Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 235000013872 montan acid ester Nutrition 0.000 description 2
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 2
- 150000002790 naphthalenes Chemical group 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 2
- RMVRSNDYEFQCLF-UHFFFAOYSA-N phenyl mercaptan Natural products SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 2
- 150000003003 phosphines Chemical group 0.000 description 2
- 150000004714 phosphonium salts Chemical class 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 2
- 235000021286 stilbenes Nutrition 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- USFPINLPPFWTJW-UHFFFAOYSA-N tetraphenylphosphonium Chemical compound C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 USFPINLPPFWTJW-UHFFFAOYSA-N 0.000 description 2
- UIXPTCZPFCVOQF-UHFFFAOYSA-N ubiquinone-0 Chemical compound COC1=C(OC)C(=O)C(C)=CC1=O UIXPTCZPFCVOQF-UHFFFAOYSA-N 0.000 description 2
- 150000003739 xylenols Chemical class 0.000 description 2
- QJIMTLTYXBDJFC-UHFFFAOYSA-N (4-methylphenyl)-diphenylphosphane Chemical compound C1=CC(C)=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 QJIMTLTYXBDJFC-UHFFFAOYSA-N 0.000 description 1
- MODAACUAXYPNJH-UHFFFAOYSA-N 1-(methoxymethyl)-4-[4-(methoxymethyl)phenyl]benzene Chemical group C1=CC(COC)=CC=C1C1=CC=C(COC)C=C1 MODAACUAXYPNJH-UHFFFAOYSA-N 0.000 description 1
- FQJZPYXGPYJJIH-UHFFFAOYSA-N 1-bromonaphthalen-2-ol Chemical compound C1=CC=CC2=C(Br)C(O)=CC=C21 FQJZPYXGPYJJIH-UHFFFAOYSA-N 0.000 description 1
- BUZMJVBOGDBMGI-UHFFFAOYSA-N 1-phenylpropylbenzene Chemical compound C=1C=CC=CC=1C(CC)C1=CC=CC=C1 BUZMJVBOGDBMGI-UHFFFAOYSA-N 0.000 description 1
- BLBVJHVRECUXKP-UHFFFAOYSA-N 2,3-dimethoxy-1,4-dimethylbenzene Chemical group COC1=C(C)C=CC(C)=C1OC BLBVJHVRECUXKP-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- DKCPKDPYUFEZCP-UHFFFAOYSA-N 2,6-di-tert-butylphenol Chemical compound CC(C)(C)C1=CC=CC(C(C)(C)C)=C1O DKCPKDPYUFEZCP-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
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- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- MNOJRWOWILAHAV-UHFFFAOYSA-N 3-bromophenol Chemical compound OC1=CC=CC(Br)=C1 MNOJRWOWILAHAV-UHFFFAOYSA-N 0.000 description 1
- HORNXRXVQWOLPJ-UHFFFAOYSA-N 3-chlorophenol Chemical compound OC1=CC=CC(Cl)=C1 HORNXRXVQWOLPJ-UHFFFAOYSA-N 0.000 description 1
- ARUBXNBYMCVENE-UHFFFAOYSA-N 4-(4-bromophenyl)phenol Chemical group C1=CC(O)=CC=C1C1=CC=C(Br)C=C1 ARUBXNBYMCVENE-UHFFFAOYSA-N 0.000 description 1
- ZLVFYUORUHNMBO-UHFFFAOYSA-N 4-bromo-2,6-dimethylphenol Chemical compound CC1=CC(Br)=CC(C)=C1O ZLVFYUORUHNMBO-UHFFFAOYSA-N 0.000 description 1
- IWJGMJHAIUBWKT-UHFFFAOYSA-N 4-bromo-2-methylphenol Chemical compound CC1=CC(Br)=CC=C1O IWJGMJHAIUBWKT-UHFFFAOYSA-N 0.000 description 1
- WMUWDPLTTLJNPE-UHFFFAOYSA-N 4-bromo-3,5-dimethylphenol Chemical compound CC1=CC(O)=CC(C)=C1Br WMUWDPLTTLJNPE-UHFFFAOYSA-N 0.000 description 1
- GPOQODYGMUTOQL-UHFFFAOYSA-N 4-bromo-3-methylphenol Chemical compound CC1=CC(O)=CC=C1Br GPOQODYGMUTOQL-UHFFFAOYSA-N 0.000 description 1
- GZFGOTFRPZRKDS-UHFFFAOYSA-N 4-bromophenol Chemical compound OC1=CC=C(Br)C=C1 GZFGOTFRPZRKDS-UHFFFAOYSA-N 0.000 description 1
- LVSPDZAGCBEQAV-UHFFFAOYSA-N 4-chloronaphthalen-1-ol Chemical compound C1=CC=C2C(O)=CC=C(Cl)C2=C1 LVSPDZAGCBEQAV-UHFFFAOYSA-N 0.000 description 1
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- YLDFTMJPQJXGSS-UHFFFAOYSA-N 6-bromo-2-naphthol Chemical compound C1=C(Br)C=CC2=CC(O)=CC=C21 YLDFTMJPQJXGSS-UHFFFAOYSA-N 0.000 description 1
- NHJIDZUQMHKGRE-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-yl 2-(7-oxabicyclo[4.1.0]heptan-4-yl)acetate Chemical compound C1CC2OC2CC1OC(=O)CC1CC2OC2CC1 NHJIDZUQMHKGRE-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 1
- 150000007824 aliphatic compounds Chemical class 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000005036 alkoxyphenyl group Chemical group 0.000 description 1
- 150000001343 alkyl silanes Chemical class 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical group [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- HQABUPZFAYXKJW-UHFFFAOYSA-O butylazanium Chemical compound CCCC[NH3+] HQABUPZFAYXKJW-UHFFFAOYSA-O 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
- 238000006704 dehydrohalogenation reaction Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229960001545 hydrotalcite Drugs 0.000 description 1
- 229910001701 hydrotalcite Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 239000004206 montan acid ester Substances 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 150000004965 peroxy acids Chemical class 0.000 description 1
- CGEXUOTXYSGBLV-UHFFFAOYSA-N phenyl benzenesulfonate Chemical compound C=1C=CC=CC=1S(=O)(=O)OC1=CC=CC=C1 CGEXUOTXYSGBLV-UHFFFAOYSA-N 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical compound NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000003826 tablet Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 125000005497 tetraalkylphosphonium group Chemical class 0.000 description 1
- MCZDHTKJGDCTAE-UHFFFAOYSA-M tetrabutylazanium;acetate Chemical compound CC([O-])=O.CCCC[N+](CCCC)(CCCC)CCCC MCZDHTKJGDCTAE-UHFFFAOYSA-M 0.000 description 1
- GTCDARUMAMVCRO-UHFFFAOYSA-M tetraethylazanium;acetate Chemical compound CC([O-])=O.CC[N+](CC)(CC)CC GTCDARUMAMVCRO-UHFFFAOYSA-M 0.000 description 1
- PSEQWFPWQRZBOO-UHFFFAOYSA-M tetrahexylazanium;benzoate Chemical compound [O-]C(=O)C1=CC=CC=C1.CCCCCC[N+](CCCCCC)(CCCCCC)CCCCCC PSEQWFPWQRZBOO-UHFFFAOYSA-M 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- FIQMHBFVRAXMOP-UHFFFAOYSA-N triphenylphosphane oxide Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)(=O)C1=CC=CC=C1 FIQMHBFVRAXMOP-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Description
本発明は、封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法に関する。 The present invention relates to a sealing resin composition, an electronic component device, and a method for manufacturing an electronic component device.
電子通信機器の高密度化、高出力化等に伴って、半導体装置の発熱量が増大する傾向にある。そこで、半導体装置の封止に用いられる材料の放熱性を高めるために熱伝導性の向上が検討されている。例えば、特許文献１には、熱伝導性を高めるために無機充填材の６０体積％以上をアルミナとした封止用エポキシ樹脂組成物が記載されている。 2. Description of the Related Art As electronic communication equipment becomes more dense and output, the amount of heat generated by semiconductor devices tends to increase. Therefore, improvements in thermal conductivity are being considered in order to enhance the heat dissipation properties of materials used for sealing semiconductor devices. For example, Patent Document 1 describes an epoxy resin composition for sealing in which 60% by volume or more of an inorganic filler is alumina in order to improve thermal conductivity.
一方、通信のために発信された電波が誘電体において熱変換されることで発生する伝送損失の量は、周波数と比誘電率の平方根と誘電正接との積として表される。つまり伝送信号は周波数に比例して熱に変わりやすいので、伝送損失を抑制するために高周波帯ほど通信部材の材料に低誘電特性が要求される。 On the other hand, the amount of transmission loss that occurs when radio waves transmitted for communication are thermally converted in a dielectric material is expressed as the product of the frequency, the square root of the dielectric constant, and the dielectric loss tangent. In other words, transmission signals are easily converted into heat in proportion to frequency, so in order to suppress transmission loss, the materials of communication members are required to have lower dielectric properties at higher frequencies.
情報通信分野においては、チャンネル数の増加と伝送される情報量の増加にともなって電波の高周波化が進行している。現在、第５世代移動通信システムの検討が世界的に進められており、使用する周波帯の候補に約３０ＧＨｚ～７０ＧＨｚの範囲の幾つかが挙げられている。今後は無線通信の主流がこれほどの高周波帯での通信になるため、通信部材の材料にはさらなる誘電特性の向上が求められている。 In the field of information and communications, the frequency of radio waves is increasing as the number of channels and the amount of information being transmitted increases. Currently, studies on fifth generation mobile communication systems are underway worldwide, and several frequency bands in the range of about 30 GHz to 70 GHz have been listed as candidates for use. In the future, the mainstream of wireless communication will be communication in such a high frequency band, so materials for communication components will be required to further improve their dielectric properties.
封止用樹脂組成物の無機充填材としてアルミナを用いた場合、熱伝導性が高く放熱性が向上する一方で、比誘電率が上昇して伝送損失が増大するおそれがある。 When alumina is used as an inorganic filler in a sealing resin composition, although it has high thermal conductivity and improves heat dissipation, the dielectric constant may increase and transmission loss may increase.
本開示は上記事情に鑑み、硬化物の放熱性と誘電特性のバランスに優れる封止用樹脂組成物、これを用いて封止された電子部品装置、及びこれを用いて封止する電子部品装置の製造方法を提供することを課題とする。 In view of the above circumstances, the present disclosure provides a sealing resin composition having an excellent balance between heat dissipation and dielectric properties of a cured product, an electronic component device sealed using the same, and an electronic component device sealed using the same. The objective is to provide a manufacturing method for.
前記課題を解決するための具体的手段には、以下の態様が含まれる。
＜１＞エポキシ樹脂と、活性エステル化合物を含む硬化剤と、アルミナを含む無機充填材とを含有する封止用樹脂組成物。
＜２＞前記無機充填材全体に占めるアルミナの割合が５０質量％以上である、＜１＞に記載の封止用樹脂組成物。
＜３＞支持部材と、前記支持部材上に配置された素子と、前記素子を封止している＜１＞又は＜２＞に記載の封止用樹脂組成物の硬化物と、を備える電子部品装置。
＜４＞素子を支持部材上に配置する工程と、前記素子を＜１＞又は＜２＞に記載の封止用樹脂組成物で封止する工程と、を含む電子部品装置の製造方法。Specific means for solving the above problem include the following aspects.
<1> A sealing resin composition containing an epoxy resin, a curing agent containing an active ester compound, and an inorganic filler containing alumina.
<2> The sealing resin composition according to <1>, wherein the proportion of alumina in the entire inorganic filler is 50% by mass or more.
<3> An electronic device comprising a support member, an element disposed on the support member, and a cured product of the sealing resin composition according to <1> or <2>, which seals the element. Parts equipment.
<4> A method for manufacturing an electronic component device, including the steps of arranging an element on a support member, and sealing the element with the sealing resin composition according to <1> or <2>.
本開示によれば、硬化物の放熱性と誘電特性のバランスに優れる封止用樹脂組成物、これを用いて封止された電子部品装置、及びこれを用いて封止する電子部品装置の製造方法が提供される。 According to the present disclosure, a sealing resin composition having an excellent balance between heat dissipation and dielectric properties of a cured product, an electronic component device sealed using the same, and an electronic component device sealed using the same are manufactured. A method is provided.
本開示において「工程」との語には、他の工程から独立した工程に加え、他の工程と明確に区別できない場合であってもその工程の目的が達成されれば、当該工程も含まれる。
本開示において「～」を用いて示された数値範囲には、「～」の前後に記載される数値がそれぞれ最小値及び最大値として含まれる。
本開示中に段階的に記載されている数値範囲において、一つの数値範囲で記載された上限値又は下限値は、他の段階的な記載の数値範囲の上限値又は下限値に置き換えてもよい。また、本開示中に記載されている数値範囲において、その数値範囲の上限値又は下限値は、実施例に示されている値に置き換えてもよい。
本開示において各成分は該当する物質を複数種含んでいてもよい。組成物中に各成分に該当する物質が複数種存在する場合、各成分の含有率又は含有量は、特に断らない限り、組成物中に存在する当該複数種の物質の合計の含有率又は含有量を意味する。
本開示において各成分に該当する粒子は複数種含んでいてもよい。組成物中に各成分に該当する粒子が複数種存在する場合、各成分の粒子径は、特に断らない限り、組成物中に存在する当該複数種の粒子の混合物についての値を意味する。In this disclosure, the term "step" includes not only a step that is independent from other steps, but also a step that cannot be clearly distinguished from other steps, as long as the purpose of the step is achieved. .
In the present disclosure, numerical ranges indicated using "~" include the numerical values written before and after "~" as minimum and maximum values, respectively.
In the numerical ranges described step by step in this disclosure, the upper limit or lower limit described in one numerical range may be replaced with the upper limit or lower limit of another numerical range described step by step. . Furthermore, in the numerical ranges described in this disclosure, the upper limit or lower limit of the numerical range may be replaced with the values shown in the Examples.
In the present disclosure, each component may contain multiple types of corresponding substances. If there are multiple types of substances corresponding to each component in the composition, the content rate or content of each component is the total content rate or content of the multiple types of substances present in the composition, unless otherwise specified. means quantity.
In the present disclosure, each component may include a plurality of types of particles. When a plurality of types of particles corresponding to each component are present in the composition, the particle diameter of each component means a value for a mixture of the plurality of types of particles present in the composition, unless otherwise specified.
＜封止用樹脂組成物＞
本開示の封止用樹脂組成物は、エポキシ樹脂と、活性エステル化合物を含む硬化剤と、アルミナを含む無機充填材とを含有する封止用樹脂組成物である。<Sealing resin composition>
The sealing resin composition of the present disclosure is a sealing resin composition containing an epoxy resin, a curing agent containing an active ester compound, and an inorganic filler containing alumina.
本発明者らの検討の結果、上記構成を有する封止用樹脂組成物を硬化して得られる硬化物は、従来のエポキシ樹脂と硬化剤を用いた封止用樹脂組成物の硬化物に比べて硬化物の放熱性と誘電特性のバランスに優れることがわかった。その理由は必ずしも明らかではないが、以下のように考えられる。 As a result of the studies conducted by the present inventors, the cured product obtained by curing the encapsulating resin composition having the above structure is compared to the cured product of a encapsulating resin composition using a conventional epoxy resin and a curing agent. It was found that the cured product has an excellent balance of heat dissipation and dielectric properties. Although the reason is not necessarily clear, it is thought to be as follows.
まず、本開示の封止用樹脂組成物は、無機充填材としてアルミナを含んでいる。これにより、封止用樹脂組成物がシリカ等の他の無機充填材を含む場合に比べて高い熱伝導率を達成している。
さらに、本開示の封止用樹脂組成物は、硬化剤として活性エステル化合物を含んでいる。エポキシ樹脂の硬化剤として一般的に用いられるフェノール硬化剤、アミン硬化剤等は、エポキシ樹脂との反応において２級水酸基を生じる。これに対して、エポキシ樹脂と活性エステル化合物との反応においては２級水酸基のかわりにエステル基が生じる。エステル基は２級水酸基に比べて極性が低い故、本開示の封止用樹脂組成物は、硬化剤として２級水酸基を発生させる硬化剤のみを含有する封止用樹脂組成物に比べて、硬化物の誘電正接を低く抑えることができる。その結果、無機充填材としてアルミナを用いることで比誘電率が上昇しても伝送損失の増大を抑えることができる。First, the sealing resin composition of the present disclosure contains alumina as an inorganic filler. This achieves higher thermal conductivity than when the sealing resin composition contains other inorganic fillers such as silica.
Furthermore, the sealing resin composition of the present disclosure contains an active ester compound as a curing agent. Phenol curing agents, amine curing agents, etc. that are commonly used as curing agents for epoxy resins produce secondary hydroxyl groups when reacting with epoxy resins. On the other hand, in the reaction between an epoxy resin and an active ester compound, an ester group is generated instead of a secondary hydroxyl group. Since ester groups have lower polarity than secondary hydroxyl groups, the encapsulating resin composition of the present disclosure has lower polarity than encapsulating resin compositions containing only a curing agent that generates secondary hydroxyl groups as a curing agent. The dielectric loss tangent of the cured product can be kept low. As a result, by using alumina as an inorganic filler, it is possible to suppress an increase in transmission loss even if the dielectric constant increases.
（エポキシ樹脂）
本開示の封止用樹脂組成物に含まれるエポキシ樹脂の種類は、特に制限されない。
エポキシ樹脂として具体的には、フェノール、クレゾール、キシレノール、レゾルシン、カテコール、ビスフェノールＡ、ビスフェノールＦ等のフェノール化合物及びα－ナフトール、β－ナフトール、ジヒドロキシナフタレン等のナフトール化合物からなる群より選ばれる少なくとも１種のフェノール性化合物と、ホルムアルデヒド、アセトアルデヒド、プロピオンアルデヒド等の脂肪族アルデヒド化合物とを酸性触媒下で縮合又は共縮合させて得られるノボラック樹脂をエポキシ化したものであるノボラック型エポキシ樹脂（フェノールノボラック型エポキシ樹脂、オルソクレゾールノボラック型エポキシ樹脂等）；上記フェノール性化合物と、ベンズアルデヒド、サリチルアルデヒド等の芳香族アルデヒド化合物とを酸性触媒下で縮合又は共縮合させて得られるトリフェニルメタン型フェノール樹脂をエポキシ化したものであるトリフェニルメタン型エポキシ樹脂；上記フェノール化合物及びナフトール化合物と、アルデヒド化合物とを酸性触媒下で共縮合させて得られるノボラック樹脂をエポキシ化したものである共重合型エポキシ樹脂；ビスフェノールＡ、ビスフェノールＦ等のジグリシジルエーテルであるジフェニルメタン型エポキシ樹脂；アルキル置換又は非置換のビフェノールのジグリシジルエーテルであるビフェニル型エポキシ樹脂；スチルベン系フェノール化合物のジグリシジルエーテルであるスチルベン型エポキシ樹脂；ビスフェノールＳ等のジグリシジルエーテルである硫黄原子含有エポキシ樹脂；ブタンジオール、ポリエチレングリコール、ポリプロピレングリコール等のアルコール類のグリシジルエーテルであるエポキシ樹脂；フタル酸、イソフタル酸、テトラヒドロフタル酸等の多価カルボン酸化合物のグリシジルエステルであるグリシジルエステル型エポキシ樹脂；アニリン、ジアミノジフェニルメタン、イソシアヌル酸等の窒素原子に結合した活性水素をグリシジル基で置換したものであるグリシジルアミン型エポキシ樹脂；ジシクロペンタジエンとフェノール化合物の共縮合樹脂をエポキシ化したものであるジシクロペンタジエン型エポキシ樹脂；分子内のオレフィン結合をエポキシ化したものであるビニルシクロヘキセンジエポキシド、３，４－エポキシシクロヘキシルメチル－３，４－エポキシシクロヘキサンカルボキシレート、２－（３，４－エポキシ）シクロヘキシル－５，５－スピロ（３，４－エポキシ）シクロヘキサン－ｍ－ジオキサン等の脂環型エポキシ樹脂；パラキシリレン変性フェノール樹脂のグリシジルエーテルであるパラキシリレン変性エポキシ樹脂；メタキシリレン変性フェノール樹脂のグリシジルエーテルであるメタキシリレン変性エポキシ樹脂；テルペン変性フェノール樹脂のグリシジルエーテルであるテルペン変性エポキシ樹脂；ジシクロペンタジエン変性フェノール樹脂のグリシジルエーテルであるジシクロペンタジエン変性エポキシ樹脂；シクロペンタジエン変性フェノール樹脂のグリシジルエーテルであるシクロペンタジエン変性エポキシ樹脂；多環芳香環変性フェノール樹脂のグリシジルエーテルである多環芳香環変性エポキシ樹脂；ナフタレン環含有フェノール樹脂のグリシジルエーテルであるナフタレン型エポキシ樹脂；ハロゲン化フェノールノボラック型エポキシ樹脂；ハイドロキノン型エポキシ樹脂；トリメチロールプロパン型エポキシ樹脂；オレフィン結合を過酢酸等の過酸で酸化して得られる線状脂肪族エポキシ樹脂；フェノールアラルキル樹脂、ナフトールアラルキル樹脂等のアラルキル型フェノール樹脂をエポキシ化したものであるアラルキル型エポキシ樹脂；などが挙げられる。さらにはアクリル樹脂のエポキシ化物等もエポキシ樹脂として挙げられる。これらのエポキシ樹脂は、１種を単独で用いても２種以上を組み合わせて用いてもよい。(Epoxy resin)
The type of epoxy resin contained in the sealing resin composition of the present disclosure is not particularly limited.
Specifically, the epoxy resin includes at least one selected from the group consisting of phenol compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, and bisphenol F, and naphthol compounds such as α-naphthol, β-naphthol, and dihydroxynaphthalene. Novolak-type epoxy resin (phenol novolak-type epoxy resin, orthocresol novolak type epoxy resin, etc.); triphenylmethane type phenol resin obtained by condensing or co-condensing the above phenolic compound with an aromatic aldehyde compound such as benzaldehyde or salicylaldehyde under an acidic catalyst. triphenylmethane type epoxy resin, which is obtained by epoxidizing a novolak resin obtained by cocondensing the above phenol compounds and naphthol compounds with an aldehyde compound under an acidic catalyst; A, diphenylmethane type epoxy resin which is diglycidyl ether such as bisphenol F; biphenyl type epoxy resin which is diglycidyl ether of alkyl-substituted or unsubstituted biphenol; stilbene type epoxy resin which is diglycidyl ether of stilbene type phenol compound; bisphenol Sulfur atom-containing epoxy resins that are diglycidyl ethers such as S; epoxy resins that are glycidyl ethers of alcohols such as butanediol, polyethylene glycol, and polypropylene glycol; polyhydric carboxylic acid compounds such as phthalic acid, isophthalic acid, and tetrahydrophthalic acid. Glycidyl ester type epoxy resin, which is the glycidyl ester of aniline, diaminodiphenylmethane, isocyanuric acid, etc., in which the active hydrogen bonded to the nitrogen atom is replaced with a glycidyl group; Dicyclopentadiene type epoxy resin, which is an epoxidized condensation resin; vinylcyclohexene diepoxide, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate, which is an epoxidized olefin bond in the molecule; Alicyclic epoxy resins such as 2-(3,4-epoxy)cyclohexyl-5,5-spiro(3,4-epoxy)cyclohexane-m-dioxane; paraxylylene-modified epoxy resins that are glycidyl ethers of paraxylylene-modified phenol resins; Metaxylylene-modified epoxy resin, which is the glycidyl ether of meta-xylylene-modified phenol resin; Terpene-modified epoxy resin, which is the glycidyl ether of terpene-modified phenol resin; Dicyclopentadiene-modified epoxy resin, which is the glycidyl ether of dicyclopentadiene-modified phenol resin; Cyclopentadiene-modified phenol Cyclopentadiene-modified epoxy resin which is glycidyl ether of resin; Polycyclic aromatic ring-modified epoxy resin which is glycidyl ether of polycyclic aromatic ring-modified phenol resin; Naphthalene-type epoxy resin which is glycidyl ether of naphthalene ring-containing phenol resin; Halogenated phenol Novolak type epoxy resin; Hydroquinone type epoxy resin; Trimethylolpropane type epoxy resin; Linear aliphatic epoxy resin obtained by oxidizing olefin bonds with peracid such as peracetic acid; Aralkyl type such as phenol aralkyl resin and naphthol aralkyl resin Aralkyl-type epoxy resins, which are epoxidized phenolic resins, are included. Furthermore, epoxidized products of acrylic resins are also included as epoxy resins. These epoxy resins may be used alone or in combination of two or more.
エポキシ樹脂のエポキシ当量（分子量／エポキシ基数）は、特に制限されない。成形性、耐リフロー性及び電気的信頼等の各種特性バランスの観点からは、１００ｇ／ｅｑ～１０００ｇ／ｅｑであることが好ましく、１５０ｇ／ｅｑ～５００ｇ／ｅｑであることがより好ましい。 The epoxy equivalent (molecular weight/number of epoxy groups) of the epoxy resin is not particularly limited. From the viewpoint of the balance of various properties such as moldability, reflow resistance, and electrical reliability, it is preferably 100 g/eq to 1000 g/eq, more preferably 150 g/eq to 500 g/eq.
エポキシ樹脂のエポキシ当量は、ＪＩＳ Ｋ ７２３６：２００９に準じた方法で測定される値とする。 The epoxy equivalent of the epoxy resin is a value measured by a method according to JIS K 7236:2009.
エポキシ樹脂が固体である場合、その軟化点又は融点は特に制限されない。成形性と耐リフロー性の観点からは４０℃～１８０℃であることが好ましく、封止用樹脂組成物の調製の際の取扱い性の観点からは５０℃～１３０℃であることがより好ましい。 When the epoxy resin is solid, its softening point or melting point is not particularly limited. The temperature is preferably 40°C to 180°C from the viewpoint of moldability and reflow resistance, and more preferably 50°C to 130°C from the viewpoint of handleability during preparation of the sealing resin composition.
エポキシ樹脂の融点又は軟化点は、示差走査熱量測定（ＤＳＣ）又はＪＩＳ Ｋ ７２３４：１９８６に準じた方法（環球法）で測定される値とする。 The melting point or softening point of the epoxy resin is a value measured by differential scanning calorimetry (DSC) or a method according to JIS K 7234:1986 (ring and ball method).
封止用樹脂組成物中のエポキシ樹脂の含有率は、強度、流動性、耐熱性、成形性等の観点から０．５質量％～５０質量％であることが好ましく、２質量％～３０質量％であることがより好ましい。 The content of the epoxy resin in the sealing resin composition is preferably 0.5% by mass to 50% by mass from the viewpoint of strength, fluidity, heat resistance, moldability, etc., and preferably 2% by mass to 30% by mass. % is more preferable.
（硬化剤）
本開示の封止用樹脂組成物は、硬化剤として少なくとも活性エステル化合物を含む。本開示の封止用樹脂組成物は、活性エステル化合物以外の硬化剤を含んでもよい。(hardening agent)
The sealing resin composition of the present disclosure contains at least an active ester compound as a curing agent. The sealing resin composition of the present disclosure may contain a curing agent other than the active ester compound.
本開示における活性エステル化合物とは、エポキシ基と反応するエステル基を１分子中に１個以上有し、エポキシ樹脂の硬化作用を有する化合物をいう。 The active ester compound in the present disclosure refers to a compound that has one or more ester groups in one molecule that react with an epoxy group and has an effect of curing an epoxy resin.
本開示の封止用樹脂組成物は、先述のとおり、硬化剤として活性エステル化合物を用いることによって、硬化物の誘電正接を低く抑えることができる。
また、硬化物中の極性基は硬化物の吸水性を高めるところ、硬化剤として活性エステル化合物を用いることによって硬化物の極性基濃度を抑えることができ、硬化物の吸水性を抑制することができる。そして、硬化物の吸水性を抑制すること、つまりは極性分子であるＨ２Ｏの含有量を抑制することにより、硬化物の誘電正接をさらに低く抑えることができる。硬化物の吸水率は、０％～０．３５％が好ましく、０％～０．３０％がより好ましく、０％～０．２５％がさらに好ましい。ここで硬化物の吸水率は、プレッシャークッカー試験（１２１℃、２．１気圧、２４時間）によって求める質量増加率である。As mentioned above, the sealing resin composition of the present disclosure can suppress the dielectric loss tangent of the cured product by using an active ester compound as a curing agent.
In addition, polar groups in the cured product increase the water absorption of the cured product, and by using an active ester compound as a curing agent, the concentration of polar groups in the cured product can be suppressed, and the water absorption of the cured product can be suppressed. can. By suppressing the water absorption of the cured product, that is, by suppressing the content of H 2 O, which is a polar molecule, the dielectric loss tangent of the cured product can be further suppressed. The water absorption rate of the cured product is preferably 0% to 0.35%, more preferably 0% to 0.30%, even more preferably 0% to 0.25%. Here, the water absorption rate of the cured product is the mass increase rate determined by a pressure cooker test (121° C., 2.1 atm, 24 hours).
活性エステル化合物は、エポキシ基と反応するエステル基を分子中に１個以上有する化合物であればその種類は特に制限されない。 The type of active ester compound is not particularly limited as long as it is a compound having one or more ester groups in its molecule that reacts with an epoxy group.
活性エステル化合物としては、フェノールエステル化合物、チオフェノールエステル化合物、Ｎ－ヒドロキシアミンエステル化合物、複素環ヒドロキシ化合物のエステル化物等が挙げられる。 Examples of the active ester compound include phenol ester compounds, thiophenol ester compounds, N-hydroxyamine ester compounds, and esterified products of heterocyclic hydroxy compounds.
活性エステル化合物としては、例えば、脂肪族カルボン酸及び芳香族カルボン酸の少なくとも１種と脂肪族ヒドロキシ化合物及び芳香族ヒドロキシ化合物の少なくとも１種とから得られるエステル化合物が挙げられる。脂肪族化合物を重縮合の成分とするエステル化合物は、脂肪族鎖を有することによりエポキシ樹脂との相溶性に優れる傾向にある。芳香族化合物を重縮合の成分とするエステル化合物は、芳香環を有することにより耐熱性に優れる傾向にある。 Examples of the active ester compound include ester compounds obtained from at least one of aliphatic carboxylic acids and aromatic carboxylic acids and at least one of aliphatic hydroxy compounds and aromatic hydroxy compounds. Ester compounds containing an aliphatic compound as a component for polycondensation tend to have excellent compatibility with epoxy resins because they have an aliphatic chain. Ester compounds containing an aromatic compound as a component for polycondensation tend to have excellent heat resistance because they have an aromatic ring.
活性エステル化合物の具体例としては、芳香族カルボン酸とフェノール性水酸基との縮合反応にて得られる芳香族エステルが挙げられる。中でも、ベンゼン、ナフタレン、ビフェニル、ジフェニルプロパン、ジフェニルメタン、ジフェニルエーテル、ジフェニルスルホン酸等の芳香環の水素原子の２～４個をカルボキシ基で置換した芳香族カルボン酸成分と、前記した芳香環の水素原子の１個を水酸基で置換した１価フェノールと、前記した芳香環の水素原子の２～４個を水酸基で置換した多価フェノールとの混合物を原材料として、芳香族カルボン酸とフェノール性水酸基との縮合反応にて得られる芳香族エステルが好ましい。すなわち、上記芳香族カルボン酸成分由来の構造単位と上記１価フェノール由来の構造単位と上記多価フェノール由来の構造単位とを有する芳香族エステルが好ましい。 Specific examples of active ester compounds include aromatic esters obtained by a condensation reaction between an aromatic carboxylic acid and a phenolic hydroxyl group. Among them, aromatic carboxylic acid components such as benzene, naphthalene, biphenyl, diphenylpropane, diphenylmethane, diphenyl ether, diphenyl sulfonic acid, etc. in which 2 to 4 hydrogen atoms in the aromatic ring are substituted with carboxy groups, and the hydrogen atoms in the aromatic ring described above. Using a mixture of a monohydric phenol in which one of the hydrogen atoms is substituted with a hydroxyl group and a polyhydric phenol in which 2 to 4 hydrogen atoms of the aromatic ring are substituted with a hydroxyl group as raw materials, aromatic carboxylic acid and phenolic hydroxyl group are combined. Aromatic esters obtained by condensation reactions are preferred. That is, an aromatic ester having a structural unit derived from the aromatic carboxylic acid component, a structural unit derived from the monohydric phenol, and a structural unit derived from the polyhydric phenol is preferable.
活性エステル化合物の具体例としては、特開２０１２－２４６３６７号公報に記載されている、脂肪族環状炭化水素基を介してフェノール化合物が結節された分子構造を有するフェノール樹脂と、芳香族ジカルボン酸又はそのハライドと、芳香族モノヒドロキシ化合物とを反応させて得られる構造を有する活性エステル樹脂が挙げられる。当該活性エステル樹脂としては、下記の構造式（１）で表される化合物が好ましい。 Specific examples of active ester compounds include phenol resins that have a molecular structure in which phenolic compounds are linked via aliphatic cyclic hydrocarbon groups, and aromatic dicarboxylic acids or Examples include active ester resins having a structure obtained by reacting the halide with an aromatic monohydroxy compound. As the active ester resin, a compound represented by the following structural formula (1) is preferable.
構造式（１）中、Ｒ１は炭素数１～４のアルキル基であり、Ｘはベンゼン環、ナフタレン環、炭素数１～４のアルキル基で置換されたベンゼン環若しくはナフタレン環、又はビフェニル基であり、Ｙはベンゼン環、ナフタレン環、又は炭素数１～４のアルキル基で置換されたベンゼン環若しくはナフタレン環であり、ｋは０又は１であり、ｎは繰り返し数の平均を表し０．２５～１．５である。In structural formula (1), R 1 is an alkyl group having 1 to 4 carbon atoms, and X is a benzene ring, a naphthalene ring, a benzene ring or naphthalene ring substituted with an alkyl group having 1 to 4 carbon atoms, or a biphenyl group. , Y is a benzene ring, a naphthalene ring, or a benzene ring or naphthalene ring substituted with an alkyl group having 1 to 4 carbon atoms, k is 0 or 1, and n represents the average number of repeats, and 0. 25 to 1.5.
構造式（１）で表される化合物の具体例としては、例えば、下記の例示化合物（１－１）～（１－１０）が挙げられる。構造式中のｔ－Ｂｕは、ｔｅｒｔ－ブチル基である。 Specific examples of the compound represented by structural formula (1) include the following exemplary compounds (1-1) to (1-10). t-Bu in the structural formula is a tert-butyl group.
活性エステル化合物の別の具体例としては、特開２０１４－１１４３５２号公報に記載されている、下記の構造式（２）で表される化合物及び下記の構造式（３）で表される化合物が挙げられる。 Other specific examples of active ester compounds include a compound represented by the following structural formula (2) and a compound represented by the following structural formula (3), which are described in JP-A No. 2014-114352. Can be mentioned.
構造式（２）中、Ｒ１及びＲ２はそれぞれ独立に、水素原子、炭素数１～４のアルキル基、又は炭素数１～４のアルコキシ基であり、Ｚはベンゾイル基、ナフトイル基、炭素数１～４のアルキル基で置換されたベンゾイル基又はナフトイル基、及び炭素数２～６のアシル基からなる群から選ばれるエステル形成構造部位（ｚ１）、又は水素原子（ｚ２）であり、Ｚのうち少なくとも１個はエステル形成構造部位（ｚ１）である。In structural formula (2), R 1 and R 2 are each independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms, and Z is a benzoyl group, a naphthoyl group, a carbon An ester-forming structural moiety (z1) selected from the group consisting of a benzoyl group or naphthoyl group substituted with a number of 1 to 4 alkyl groups, and an acyl group having 2 to 6 carbon atoms, or a hydrogen atom (z2), and Z At least one of them is an ester-forming structural site (z1).
構造式（３）中、Ｒ１及びＲ２はそれぞれ独立に、水素原子、炭素数１～４のアルキル基、又は炭素数１～４のアルコキシ基であり、Ｚはベンゾイル基、ナフトイル基、炭素数１～４のアルキル基で置換されたベンゾイル基又はナフトイル基、及び炭素数２～６のアシル基からなる群から選ばれるエステル形成構造部位（ｚ１）、又は水素原子（ｚ２）であり、Ｚのうち少なくとも１個はエステル形成構造部位（ｚ１）である。In structural formula (3), R 1 and R 2 are each independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms, and Z is a benzoyl group, a naphthoyl group, a carbon An ester-forming structural moiety (z1) selected from the group consisting of a benzoyl group or naphthoyl group substituted with a number of 1 to 4 alkyl groups, and an acyl group having 2 to 6 carbon atoms, or a hydrogen atom (z2), and Z At least one of them is an ester-forming structural site (z1).
構造式（２）で表される化合物の具体例としては、例えば、下記の例示化合物（２－１）～（２－６）が挙げられる。 Specific examples of the compound represented by structural formula (2) include the following exemplary compounds (2-1) to (2-6).
構造式（３）で表される化合物の具体例としては、例えば、下記の例示化合物（３－１）～（３－６）が挙げられる。 Specific examples of the compound represented by structural formula (3) include the following exemplary compounds (3-1) to (3-6).
活性エステル化合物としては、市販品を用いてもよい。活性エステル化合物の市販品としては、ジシクロペンタジエン型ジフェノール構造を含む活性エステル化合物として「ＥＸＢ９４５１」、「ＥＸＢ９４６０」、「ＥＸＢ９４６０Ｓ」、「ＨＰＣ－８０００－６５Ｔ」（ＤＩＣ株式会社製）；芳香族構造を含む活性エステル化合物として「ＥＸＢ９４１６－７０ＢＫ」、「ＥＸＢ－８」、「ＥＸＢ－９４２５」（ＤＩＣ株式会社製）；フェノールノボラックのアセチル化物を含む活性エステル化合物として「ＤＣ８０８」（三菱ケミカル株式会社製）；フェノールノボラックのベンゾイル化物を含む活性エステル化合物として「ＹＬＨ１０２６」（三菱ケミカル株式会社製）等が挙げられる。 As the active ester compound, commercially available products may be used. Commercially available active ester compounds include "EXB9451," "EXB9460," "EXB9460S," and "HPC-8000-65T" (manufactured by DIC Corporation) as active ester compounds containing a dicyclopentadiene diphenol structure; aromatic "EXB9416-70BK", "EXB-8", "EXB-9425" (manufactured by DIC Corporation) as active ester compounds containing the structure; "DC808" (manufactured by Mitsubishi Chemical Corporation) as an active ester compound containing an acetylated product of phenol novolak YLH1026 (manufactured by Mitsubishi Chemical Corporation) is an active ester compound containing a benzoylated phenol novolac.
活性エステル化合物は、１種を単独で用いても２種以上を組み合わせて用いてもよい。 The active ester compounds may be used alone or in combination of two or more.
活性エステル化合物のエステル当量は、特に制限されない。成形性、耐リフロー性、電気的信頼性等の各種特性バランスの観点からは、１５０ｇ／ｅｑ～４００ｇ／ｅｑが好ましく、１７０ｇ／ｅｑ～３００ｇ／ｅｑがより好ましく、２００ｇ／ｅｑ～２５０ｇ／ｅｑがさらに好ましい。 The ester equivalent of the active ester compound is not particularly limited. From the viewpoint of the balance of various properties such as moldability, reflow resistance, and electrical reliability, 150 g/eq to 400 g/eq is preferable, 170 g/eq to 300 g/eq is more preferable, and 200 g/eq to 250 g/eq is preferable. More preferred.
活性エステル化合物のエステル当量は、ＪＩＳ Ｋ ００７０：１９９２に準じた方法により測定される値とする。 The ester equivalent of the active ester compound is a value measured by a method according to JIS K 0070:1992.
エポキシ樹脂と活性エステル化合物との当量比（エステル基／エポキシ基）は、硬化物の誘電正接を低く抑える観点からは、０．９以上が好ましく、０．９５以上がより好ましく、０．９７以上がさらに好ましい。
エポキシ樹脂と活性エステル化合物との当量比（エステル基／エポキシ基）は、活性エステル化合物の未反応分を少なく抑える観点からは、１．１以下が好ましく、１．０５以下がより好ましく、１．０３以下がさらに好ましい。From the viewpoint of keeping the dielectric loss tangent of the cured product low, the equivalent ratio (ester group/epoxy group) between the epoxy resin and the active ester compound is preferably 0.9 or more, more preferably 0.95 or more, and 0.97 or more. is even more preferable.
The equivalent ratio (ester group/epoxy group) between the epoxy resin and the active ester compound is preferably 1.1 or less, more preferably 1.05 or less, from the viewpoint of suppressing the unreacted portion of the active ester compound. 03 or less is more preferable.
硬化剤は、活性エステル化合物以外のその他の硬化剤を含んでもよい。この場合、その他の硬化剤の種類は特に制限されず、封止用樹脂組成物の所望の特性等に応じて選択できる。その他の硬化剤としては、フェノール硬化剤、アミン硬化剤、酸無水物硬化剤、ポリメルカプタン硬化剤、ポリアミノアミド硬化剤、イソシアネート硬化剤、ブロックイソシアネート硬化剤等が挙げられる。 The curing agent may include other curing agents other than the active ester compound. In this case, the type of other curing agent is not particularly limited and can be selected depending on the desired characteristics of the encapsulating resin composition. Other curing agents include phenol curing agents, amine curing agents, acid anhydride curing agents, polymercaptan curing agents, polyaminoamide curing agents, isocyanate curing agents, blocked isocyanate curing agents, and the like.
フェノール硬化剤として具体的には、レゾルシン、カテコール、ビスフェノールＡ、ビスフェノールＦ、置換又は非置換のビフェノール等の多価フェノール化合物；フェノール、クレゾール、キシレノール、レゾルシン、カテコール、ビスフェノールＡ、ビスフェノールＦ、フェニルフェノール、アミノフェノール等のフェノール化合物及びα－ナフトール、β－ナフトール、ジヒドロキシナフタレン等のナフトール化合物からなる群より選ばれる少なくとも一種のフェノール性化合物と、ホルムアルデヒド、アセトアルデヒド、プロピオンアルデヒド等のアルデヒド化合物とを酸性触媒下で縮合又は共縮合させて得られるノボラック型フェノール樹脂；上記フェノール性化合物と、ジメトキシパラキシレン、ビス（メトキシメチル）ビフェニル等とから合成されるフェノールアラルキル樹脂、ナフトールアラルキル樹脂等のアラルキル型フェノール樹脂；パラキシリレン変性フェノール樹脂、メタキシリレン変性フェノール樹脂；メラミン変性フェノール樹脂；テルペン変性フェノール樹脂；上記フェノール性化合物と、ジシクロペンタジエンとから共重合により合成されるジシクロペンタジエン型フェノール樹脂及びジシクロペンタジエン型ナフトール樹脂；シクロペンタジエン変性フェノール樹脂；多環芳香環変性フェノール樹脂；ビフェニル型フェノール樹脂；上記フェノール性化合物と、ベンズアルデヒド、サリチルアルデヒド等の芳香族アルデヒド化合物とを酸性触媒下で縮合又は共縮合させて得られるトリフェニルメタン型フェノール樹脂；これら２種以上を共重合して得たフェノール樹脂などが挙げられる。これらのフェノール硬化剤は、１種を単独で用いても２種以上を組み合わせて用いてもよい。 Specifically, the phenol curing agent includes polyphenol compounds such as resorcinol, catechol, bisphenol A, bisphenol F, and substituted or unsubstituted biphenols; phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, and phenylphenol. , at least one phenolic compound selected from the group consisting of phenolic compounds such as aminophenol, and naphthol compounds such as α-naphthol, β-naphthol, and dihydroxynaphthalene, and aldehyde compounds such as formaldehyde, acetaldehyde, and propionaldehyde, using an acidic catalyst. Novolac-type phenolic resin obtained by condensation or co-condensation with the above; aralkyl-type phenolic resin such as phenol aralkyl resin and naphthol aralkyl resin synthesized from the above phenolic compound and dimethoxyparaxylene, bis(methoxymethyl)biphenyl, etc. ; Paraxylylene-modified phenolic resin, metaxylylene-modified phenolic resin; Melamine-modified phenolic resin; Terpene-modified phenolic resin; Dicyclopentadiene-type phenolic resin and dicyclopentadiene-type naphthol synthesized by copolymerization from the above phenolic compound and dicyclopentadiene. Resin; cyclopentadiene-modified phenolic resin; polycyclic aromatic ring-modified phenolic resin; biphenyl-type phenolic resin; obtained by condensing or co-condensing the above phenolic compound with an aromatic aldehyde compound such as benzaldehyde or salicylaldehyde under an acidic catalyst. and triphenylmethane type phenol resins; and phenol resins obtained by copolymerizing two or more of these types. These phenol curing agents may be used alone or in combination of two or more.
その他の硬化剤の官能基当量（フェノール硬化剤の場合は水酸基当量）は、特に制限されない。成形性、耐リフロー性、電気的信頼性等の各種特性バランスの観点からは、７０ｇ／ｅｑ～１０００ｇ／ｅｑであることが好ましく、８０ｇ／ｅｑ～５００ｇ／ｅｑであることがより好ましい。 The functional group equivalents (hydroxyl group equivalents in the case of phenol curing agents) of other curing agents are not particularly limited. From the viewpoint of the balance of various properties such as moldability, reflow resistance, and electrical reliability, it is preferably 70 g/eq to 1000 g/eq, more preferably 80 g/eq to 500 g/eq.
その他の硬化剤の官能基当量（フェノール硬化剤の場合は水酸基当量）は、ＪＩＳ Ｋ ００７０：１９９２に準じた方法により測定される値とする。 The functional group equivalents (hydroxyl group equivalents in the case of phenol curing agents) of other curing agents are values measured by a method according to JIS K 0070:1992.
硬化剤が固体である場合、その軟化点又は融点は、特に制限されない。成形性と耐リフロー性の観点からは、４０℃～１８０℃であることが好ましく、封止用樹脂組成物の製造時における取扱い性の観点からは、５０℃～１３０℃であることがより好ましい。 When the curing agent is solid, its softening point or melting point is not particularly limited. From the viewpoint of moldability and reflow resistance, the temperature is preferably 40°C to 180°C, and from the viewpoint of handleability during production of the encapsulating resin composition, it is more preferably 50°C to 130°C. .
硬化剤の融点又は軟化点は、エポキシ樹脂の融点又は軟化点と同様にして測定される値とする。 The melting point or softening point of the curing agent is a value measured in the same manner as the melting point or softening point of the epoxy resin.
エポキシ樹脂とすべての硬化剤（活性エステル化合物及びその他の硬化剤）との当量比、すなわちエポキシ樹脂中の官能基数に対する硬化剤中の官能基数の比（硬化剤中の官能基数／エポキシ樹脂中の官能基数）は、特に制限されない。それぞれの未反応分を少なく抑える観点からは、０．５～２．０の範囲に設定されることが好ましく、０．６～１．３の範囲に設定されることがより好ましい。成形性と耐リフロー性の観点からは、０．８～１．２の範囲に設定されることがさらに好ましい。 The equivalent ratio of the epoxy resin to all the curing agents (active ester compounds and other curing agents), i.e. the ratio of the number of functional groups in the curing agent to the number of functional groups in the epoxy resin (number of functional groups in the curing agent/number of functional groups in the epoxy resin). The number of functional groups) is not particularly limited. From the viewpoint of suppressing each unreacted component, it is preferably set in the range of 0.5 to 2.0, and more preferably set in the range of 0.6 to 1.3. From the viewpoint of moldability and reflow resistance, it is more preferable to set it in the range of 0.8 to 1.2.
活性エステル化合物及びその他の硬化剤の全質量に対する活性エステル化合物の含有率は、硬化物の誘電正接を低く抑える観点から、８０質量％以上であることが好ましく、８５質量％以上であることがより好ましく、９０質量％以上であることがさらに好ましい。 The content of the active ester compound relative to the total mass of the active ester compound and other curing agents is preferably 80% by mass or more, more preferably 85% by mass or more, from the viewpoint of keeping the dielectric loss tangent of the cured product low. It is preferably 90% by mass or more, and more preferably 90% by mass or more.
エポキシ樹脂、活性エステル化合物及びその他の硬化剤の全質量に対するエポキシ樹脂及び活性エステル化合物の合計含有率は、硬化物の誘電正接を低く抑える観点から、８０質量％以上であることが好ましく、８５質量％以上であることがより好ましく、９０質量％以上であることがさらに好ましい。 The total content of the epoxy resin and active ester compound based on the total mass of the epoxy resin, active ester compound, and other curing agents is preferably 80% by mass or more, and 85% by mass from the viewpoint of keeping the dielectric loss tangent of the cured product low. % or more, and even more preferably 90% by mass or more.
（硬化促進剤）
封止用樹脂組成物は、硬化促進剤を含んでもよい。硬化促進剤の種類は特に制限されず、エポキシ樹脂又は硬化剤の種類、封止用樹脂組成物の所望の特性等に応じて選択できる。(hardening accelerator)
The sealing resin composition may also contain a curing accelerator. The type of curing accelerator is not particularly limited, and can be selected depending on the type of epoxy resin or curing agent, desired characteristics of the sealing resin composition, and the like.
硬化促進剤としては、１，５－ジアザビシクロ［４．３．０］ノネン－５（ＤＢＮ）、１，８－ジアザビシクロ［５．４．０］ウンデセン－７（ＤＢＵ）等のジアザビシクロアルケン、２－メチルイミダゾール、２－フェニルイミダゾール、２－フェニル－４－メチルイミダゾール、２－ヘプタデシルイミダゾール等の環状アミジン化合物；前記環状アミジン化合物の誘導体；前記環状アミジン化合物又はその誘導体のフェノールノボラック塩；これらの化合物に無水マレイン酸、１，４－ベンゾキノン、２，５－トルキノン、１，４－ナフトキノン、２，３－ジメチルベンゾキノン、２，６－ジメチルベンゾキノン、２，３－ジメトキシ－５－メチル－１，４－ベンゾキノン、２，３－ジメトキシ－１，４－ベンゾキノン、フェニル－１，４－ベンゾキノン等のキノン化合物、ジアゾフェニルメタンなどの、π結合をもつ化合物を付加してなる分子内分極を有する化合物；ＤＢＵのテトラフェニルボレート塩、ＤＢＮのテトラフェニルボレート塩、２－エチル－４－メチルイミダゾールのテトラフェニルボレート塩、Ｎ－メチルモルホリンのテトラフェニルボレート塩等の環状アミジニウム化合物；ピリジン、トリエチルアミン、トリエチレンジアミン、ベンジルジメチルアミン、トリエタノールアミン、ジメチルアミノエタノール、トリス（ジメチルアミノメチル）フェノール等の三級アミン化合物；前記三級アミン化合物の誘導体；酢酸テトラ－ｎ－ブチルアンモニウム、リン酸テトラ－ｎ－ブチルアンモニウム、酢酸テトラエチルアンモニウム、安息香酸テトラ－ｎ－ヘキシルアンモニウム、水酸化テトラプロピルアンモニウム等のアンモニウム塩化合物；トリフェニルホスフィン、ジフェニル（ｐ－トリル）ホスフィン、トリス（アルキルフェニル）ホスフィン、トリス（アルコキシフェニル）ホスフィン、トリス（アルキル・アルコキシフェニル）ホスフィン、トリス（ジアルキルフェニル）ホスフィン、トリス（トリアルキルフェニル）ホスフィン、トリス（テトラアルキルフェニル）ホスフィン、トリス（ジアルコキシフェニル）ホスフィン、トリス（トリアルコキシフェニル）ホスフィン、トリス（テトラアルコキシフェニル）ホスフィン、トリアルキルホスフィン、ジアルキルアリールホスフィン、アルキルジアリールホスフィン等の三級ホスフィン；前記三級ホスフィンと有機ボロン類との錯体等のホスフィン化合物；前記三級ホスフィン又は前記ホスフィン化合物と無水マレイン酸、１，４－ベンゾキノン、２，５－トルキノン、１，４－ナフトキノン、２，３－ジメチルベンゾキノン、２，６－ジメチルベンゾキノン、２，３－ジメトキシ－５－メチル－１，４－ベンゾキノン、２，３－ジメトキシ－１，４－ベンゾキノン、フェニル－１，４－ベンゾキノン等のキノン化合物、ジアゾフェニルメタンなどの、π結合をもつ化合物を付加してなる分子内分極を有する化合物；前記三級ホスフィン又は前記ホスフィン化合物と４－ブロモフェノール、３－ブロモフェノール、２－ブロモフェノール、４－クロロフェノール、３－クロロフェノール、２－クロロフェノール、４－ヨウ化フェノール、３－ヨウ化フェノール、２－ヨウ化フェノール、４－ブロモ－２－メチルフェノール、４－ブロモ－３－メチルフェノール、４－ブロモ－２，６－ジメチルフェノール、４－ブロモ－３，５－ジメチルフェノール、４－ブロモ－２，６－ジ－ｔｅｒｔ－ブチルフェノール、４－クロロ－１－ナフトール、１－ブロモ－２－ナフトール、６－ブロモ－２－ナフトール、４－ブロモ－４’－ヒドロキシビフェニル等のハロゲン化フェノール化合物を反応させた後に、脱ハロゲン化水素の工程を経て得られる、分子内分極を有する化合物；テトラフェニルホスホニウム等のテトラ置換ホスホニウム、テトラ－ｐ－トリルボレート等のホウ素原子に結合したフェニル基がないテトラ置換ホスホニウム及びテトラ置換ボレート；テトラフェニルホスホニウムとフェノール化合物、テトラアルキルホスホニウムと芳香族カルボン酸無水物の部分加水分解物との塩などが挙げられる。 As curing accelerators, diazabicycloalkenes such as 1,5-diazabicyclo[4.3.0]nonene-5 (DBN) and 1,8-diazabicyclo[5.4.0]undecene-7 (DBU); Cyclic amidine compounds such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, and 2-heptadecyl imidazole; derivatives of the cyclic amidine compounds; phenol novolac salts of the cyclic amidine compounds or derivatives thereof; Compounds include maleic anhydride, 1,4-benzoquinone, 2,5-torquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1 , 4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone, and other quinone compounds, and diazophenylmethane, which have intramolecular polarization by adding a compound with a π bond, such as diazophenylmethane. Compounds: Cyclic amidinium compounds such as DBU tetraphenylborate salt, DBN tetraphenylborate salt, 2-ethyl-4-methylimidazole tetraphenylborate salt, N-methylmorpholine tetraphenylborate salt; pyridine, triethylamine, Tertiary amine compounds such as ethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris(dimethylaminomethyl)phenol; derivatives of the above tertiary amine compounds; tetra-n-butylammonium acetate, tetra-n-phosphate Ammonium salt compounds such as butylammonium, tetraethylammonium acetate, tetra-n-hexylammonium benzoate, and tetrapropylammonium hydroxide; triphenylphosphine, diphenyl(p-tolyl)phosphine, tris(alkylphenyl)phosphine, tris(alkoxyphenyl) ) phosphine, tris(alkyl alkoxyphenyl)phosphine, tris(dialkylphenyl)phosphine, tris(trialkylphenyl)phosphine, tris(tetraalkylphenyl)phosphine, tris(dialkoxyphenyl)phosphine, tris(trialkoxyphenyl)phosphine , tris(tetraalkoxyphenyl)phosphine, trialkylphosphine, dialkylarylphosphine, alkyldiarylphosphine, and other tertiary phosphines; phosphine compounds such as complexes of the tertiary phosphine and organic borons; the tertiary phosphine or the phosphine compound and maleic anhydride, 1,4-benzoquinone, 2,5-torquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4 - A compound having intramolecular polarization obtained by adding a compound with a π bond, such as a quinone compound such as benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, or phenyl-1,4-benzoquinone, or diazophenylmethane; The tertiary phosphine or the phosphine compound and 4-bromophenol, 3-bromophenol, 2-bromophenol, 4-chlorophenol, 3-chlorophenol, 2-chlorophenol, 4-iodinated phenol, 3-iodinated phenol , 2-iodinated phenol, 4-bromo-2-methylphenol, 4-bromo-3-methylphenol, 4-bromo-2,6-dimethylphenol, 4-bromo-3,5-dimethylphenol, 4-bromo -Halogenated phenol compounds such as 2,6-di-tert-butylphenol, 4-chloro-1-naphthol, 1-bromo-2-naphthol, 6-bromo-2-naphthol, 4-bromo-4'-hydroxybiphenyl Compounds with intramolecular polarization obtained through the dehydrohalogenation process after reacting; tetra-substituted phosphonium such as tetraphenylphosphonium, and no phenyl group bonded to a boron atom such as tetra-p-tolylborate. Tetra-substituted phosphonium and tetra-substituted borate; salts of tetraphenylphosphonium and phenol compounds, tetraalkylphosphonium and partial hydrolysates of aromatic carboxylic acid anhydrides, and the like.
封止用樹脂組成物が硬化促進剤を含む場合、その量は、樹脂成分１００質量部（エポキシ樹脂と硬化剤の合計量）に対して０．１質量部～３０質量部であることが好ましく、１質量部～１５重量部であることがより好ましい。硬化促進剤の量が樹脂成分１００質量部に対して０．１質量部以上であると、短時間で良好に硬化する傾向にある。硬化促進剤の量が樹脂成分１００質量部に対して３０質量部以下であると、硬化速度が速すぎず良好な成形品が得られる傾向にある。 When the sealing resin composition contains a curing accelerator, the amount thereof is preferably 0.1 parts by mass to 30 parts by mass based on 100 parts by mass of the resin component (total amount of epoxy resin and curing agent). , more preferably 1 part by weight to 15 parts by weight. When the amount of the curing accelerator is 0.1 part by mass or more based on 100 parts by mass of the resin component, the resin tends to be cured well in a short time. When the amount of the curing accelerator is 30 parts by mass or less per 100 parts by mass of the resin component, the curing speed is not too fast and a good molded product tends to be obtained.
（無機充填材）
本開示の封止用樹脂組成物は、無機充填材としてアルミナを含む。アルミナを含むことで、硬化物の熱伝導率の向上が期待できる。一方、硬化物の線膨張係数、誘電特性等の他の特性とのバランスの観点からは、アルミナと、アルミナ以外の無機充填材を併用することが好ましい。(Inorganic filler)
The sealing resin composition of the present disclosure includes alumina as an inorganic filler. Including alumina can be expected to improve the thermal conductivity of the cured product. On the other hand, from the viewpoint of balance with other properties such as linear expansion coefficient and dielectric properties of the cured product, it is preferable to use alumina and an inorganic filler other than alumina in combination.
アルミナ以外の無機充填材として具体的には、溶融シリカ、結晶シリカ、ガラス、タルク、クレー、マイカ等の無機材料が挙げられる。難燃効果を有する無機充填材を用いてもよい。難燃効果を有する無機充填材としては、水酸化アルミニウム、水酸化マグネシウム、マグネシウムと亜鉛の複合水酸化物等の複合金属水酸化物、硼酸亜鉛などが挙げられる。 Specific examples of inorganic fillers other than alumina include inorganic materials such as fused silica, crystalline silica, glass, talc, clay, and mica. An inorganic filler having a flame retardant effect may also be used. Examples of the inorganic filler having a flame retardant effect include aluminum hydroxide, magnesium hydroxide, composite metal hydroxides such as composite hydroxide of magnesium and zinc, zinc borate, and the like.
無機充填材の中でも、線膨張係数低減の観点からは溶融シリカ等のシリカが好ましい。無機充填材は１種を単独で用いても２種以上を組み合わせて用いてもよい。無機充填材の形態としては粉末、粉末を球形化したビーズ、繊維等が挙げられる。 Among the inorganic fillers, silica such as fused silica is preferred from the viewpoint of reducing the coefficient of linear expansion. The inorganic fillers may be used alone or in combination of two or more. Examples of the form of the inorganic filler include powder, beads made of spherical powder, fibers, and the like.
無機充填材が粒子状である場合、その平均粒径は、特に制限されない。例えば、平均粒径が０．２μｍ～１００μｍであることが好ましく、０．５μｍ～５０μｍであることがより好ましい。平均粒径が０．２μｍ以上であると、封止用樹脂組成物の粘度の上昇がより抑制される傾向がある。平均粒径が１００μｍ以下であると、充填性がより向上する傾向にある。無機充填材の平均粒径は、レーザー散乱回折法粒度分布測定装置により、体積平均粒径（Ｄ５０）として求める。 When the inorganic filler is particulate, the average particle size is not particularly limited. For example, the average particle size is preferably 0.2 μm to 100 μm, more preferably 0.5 μm to 50 μm. When the average particle size is 0.2 μm or more, the increase in viscosity of the sealing resin composition tends to be further suppressed. When the average particle diameter is 100 μm or less, the filling property tends to be further improved. The average particle size of the inorganic filler is determined as a volume average particle size (D50) using a laser scattering diffraction particle size distribution analyzer.
封止用樹脂組成物に含まれる無機充填材のうちアルミナが占める割合は特に制限されない。硬化物の熱伝導率向上の観点からは、例えば、５０質量％以上であることが好ましく、６０質量％以上であることがより好ましく、７０質量％以上であることがさらに好ましい。硬化物の他の特性とのバランスの観点からは、例えば、９０質量％以下であることが好ましい。 The proportion of alumina in the inorganic filler contained in the sealing resin composition is not particularly limited. From the viewpoint of improving the thermal conductivity of the cured product, the content is preferably 50% by mass or more, more preferably 60% by mass or more, and even more preferably 70% by mass or more. From the viewpoint of balance with other properties of the cured product, the content is preferably 90% by mass or less, for example.
封止用樹脂組成物に含まれる無機充填材の含有率は特に制限されない。流動性及び強度の観点からは、封止用樹脂組成物全体の３０体積％～９０体積％であることが好ましく、３５体積％～８０体積％であることがより好ましく、４０体積％～７０体積％であることがさらに好ましい。無機充填材の含有率が封止用樹脂組成物全体の３０体積％以上であると、硬化物の熱膨張係数、熱伝導率、弾性率等の特性がより向上する傾向にある。無機充填材の含有率が封止用樹脂組成物全体の９０体積％以下であると、封止用樹脂組成物の粘度の上昇が抑制され、流動性がより向上して成形性がより良好になる傾向にある。 The content of the inorganic filler contained in the sealing resin composition is not particularly limited. From the viewpoint of fluidity and strength, it is preferably 30% to 90% by volume of the entire sealing resin composition, more preferably 35% to 80% by volume, and 40% to 70% by volume. % is more preferable. When the content of the inorganic filler is 30% by volume or more of the entire sealing resin composition, the properties such as the coefficient of thermal expansion, thermal conductivity, and modulus of elasticity of the cured product tend to be further improved. When the content of the inorganic filler is 90% by volume or less of the entire encapsulating resin composition, the increase in viscosity of the encapsulating resin composition is suppressed, the fluidity is further improved, and the moldability is better. There is a tendency to
［各種添加剤］
封止用樹脂組成物は、上述の成分に加えて、以下に例示するカップリング剤、イオン交換体、離型剤、難燃剤、着色剤等の各種添加剤を含んでもよい。封止用樹脂組成物は、以下に例示する添加剤以外にも必要に応じて当技術分野で周知の各種添加剤を含んでもよい。[Various additives]
In addition to the above-mentioned components, the sealing resin composition may also contain various additives such as a coupling agent, an ion exchanger, a mold release agent, a flame retardant, and a coloring agent, as exemplified below. In addition to the additives exemplified below, the sealing resin composition may also contain various additives known in the art as necessary.
（カップリング剤）
封止用樹脂組成物は、カップリング剤を含んでもよい。樹脂成分と無機充填材との接着性を高める観点からは、封止用樹脂組成物はカップリング剤を含むことが好ましい。カップリング剤としては、エポキシシラン、メルカプトシラン、アミノシラン、アルキルシラン、ウレイドシラン、ビニルシラン等のシラン系化合物、チタン系化合物、アルミニウムキレート化合物、アルミニウム／ジルコニウム系化合物などの公知のカップリング剤が挙げられる。(coupling agent)
The sealing resin composition may also contain a coupling agent. From the viewpoint of improving the adhesiveness between the resin component and the inorganic filler, the sealing resin composition preferably contains a coupling agent. Examples of the coupling agent include known coupling agents such as silane compounds such as epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane, and vinylsilane, titanium compounds, aluminum chelate compounds, and aluminum/zirconium compounds. .
封止用樹脂組成物がカップリング剤を含む場合、カップリング剤の量は、無機充填材１００質量部に対して０．０５質量部～５質量部であることが好ましく、０．１質量部～２．５質量部であることがより好ましい。カップリング剤の量が無機充填材１００質量部に対して０．０５質量部以上であると、フレームとの接着性がより向上する傾向にある。カップリング剤の量が無機充填材１００質量部に対して５質量部以下であると、パッケージの成形性がより向上する傾向にある。 When the sealing resin composition contains a coupling agent, the amount of the coupling agent is preferably 0.05 parts by mass to 5 parts by mass, and 0.1 parts by mass based on 100 parts by mass of the inorganic filler. More preferably, the amount is 2.5 parts by mass. When the amount of the coupling agent is 0.05 parts by mass or more based on 100 parts by mass of the inorganic filler, the adhesiveness with the frame tends to be further improved. When the amount of the coupling agent is 5 parts by mass or less based on 100 parts by mass of the inorganic filler, the moldability of the package tends to be further improved.
（イオン交換体）
封止用樹脂組成物は、イオン交換体を含んでもよい。封止用樹脂組成物は、封止される素子を備える電子部品装置の耐湿性及び高温放置特性を向上させる観点から、イオン交換体を含むことが好ましい。イオン交換体は特に制限されず、従来公知のものを用いることができる。具体的には、ハイドロタルサイト化合物、並びにマグネシウム、アルミニウム、チタン、ジルコニウム及びビスマスからなる群より選ばれる少なくとも１種の元素の含水酸化物等が挙げられる。イオン交換体は、１種を単独で用いても２種以上を組み合わせて用いてもよい。中でも、下記一般式（Ａ）で表されるハイドロタルサイトが好ましい。(ion exchanger)
The sealing resin composition may include an ion exchanger. The encapsulating resin composition preferably contains an ion exchanger from the viewpoint of improving the moisture resistance and high-temperature storage characteristics of an electronic component device including an element to be encapsulated. The ion exchanger is not particularly limited, and conventionally known ones can be used. Specific examples include hydrotalcite compounds, and hydrous oxides of at least one element selected from the group consisting of magnesium, aluminum, titanium, zirconium, and bismuth. The ion exchangers may be used singly or in combination of two or more. Among them, hydrotalcite represented by the following general formula (A) is preferred.
Ｍｇ（１－Ｘ）ＡｌＸ（ＯＨ）２（ＣＯ３）Ｘ／２・ｍＨ２Ｏ ……（Ａ）
（０＜Ｘ≦０．５、ｍは正の数）Mg (1-X) Al X (OH) 2 (CO 3 ) X/2・mH 2 O ... (A)
(0<X≦0.5, m is a positive number)
封止用樹脂組成物がイオン交換体を含む場合、その含有量は、ハロゲンイオン等のイオンを捕捉するのに充分な量であれば特に制限はない。例えば、樹脂成分１００質量部（エポキシ樹脂と硬化剤の合計量）に対して０．１質量部～３０質量部であることが好ましく、１質量部～１０質量部であることがより好ましい。 When the sealing resin composition contains an ion exchanger, its content is not particularly limited as long as it is sufficient to trap ions such as halogen ions. For example, it is preferably 0.1 parts by mass to 30 parts by mass, more preferably 1 part by mass to 10 parts by mass, based on 100 parts by mass of the resin component (total amount of epoxy resin and curing agent).
（離型剤）
封止用樹脂組成物は、成形時における金型との良好な離型性を得る観点から、離型剤を含んでもよい。離型剤は特に制限されず、従来公知のものを用いることができる。具体的には、カルナバワックス、モンタン酸、ステアリン酸等の高級脂肪酸、高級脂肪酸金属塩、モンタン酸エステル等のエステル系ワックス、酸化ポリエチレン、非酸化ポリエチレン等のポリオレフィン系ワックスなどが挙げられる。離型剤は、１種を単独で用いても２種以上を組み合わせて用いてもよい。(Release agent)
The sealing resin composition may contain a mold release agent from the viewpoint of obtaining good mold release properties from a mold during molding. The mold release agent is not particularly limited, and conventionally known ones can be used. Specific examples include carnauba wax, higher fatty acids such as montanic acid and stearic acid, higher fatty acid metal salts, ester waxes such as montanic acid esters, and polyolefin waxes such as oxidized polyethylene and non-oxidized polyethylene. The mold release agents may be used alone or in combination of two or more.
封止用樹脂組成物が離型剤を含む場合、その量は樹脂成分１００質量部（エポキシ樹脂と硬化剤の合計量）に対して０．０１質量部～１０質量部が好ましく、０．１質量部～５質量部がより好ましい。離型剤の量が樹脂成分１００質量部に対して０．０１質量部以上であると、離型性が充分に得られる傾向にある。１０質量部以下であると、より良好な接着性が得られる傾向にある。 When the sealing resin composition contains a mold release agent, the amount thereof is preferably 0.01 parts by mass to 10 parts by mass, and 0.1 parts by mass based on 100 parts by mass of the resin component (total amount of epoxy resin and curing agent). More preferably from 5 parts by weight. When the amount of the mold release agent is 0.01 part by mass or more based on 100 parts by mass of the resin component, sufficient mold release properties tend to be obtained. When the amount is 10 parts by mass or less, better adhesiveness tends to be obtained.
（難燃剤）
封止用樹脂組成物は、難燃剤を含んでもよい。難燃剤は特に制限されず、従来公知のものを用いることができる。具体的には、ハロゲン原子、アンチモン原子、窒素原子又はリン原子を含む有機又は無機の化合物、金属水酸化物等が挙げられる。難燃剤は、１種を単独で用いても２種以上を組み合わせて用いてもよい。(Flame retardants)
The sealing resin composition may also contain a flame retardant. The flame retardant is not particularly limited, and conventionally known flame retardants can be used. Specifically, organic or inorganic compounds containing a halogen atom, an antimony atom, a nitrogen atom, or a phosphorus atom, metal hydroxides, and the like can be mentioned. The flame retardants may be used alone or in combination of two or more.
封止用樹脂組成物が難燃剤を含む場合、その量は、所望の難燃効果を得るのに充分な量であれば特に制限されない。例えば、樹脂成分１００質量部（エポキシ樹脂と硬化剤の合計量）に対して１質量部～３０質量部であることが好ましく、２質量部～２０質量部であることがより好ましい。 When the sealing resin composition contains a flame retardant, the amount thereof is not particularly limited as long as it is sufficient to obtain the desired flame retardant effect. For example, it is preferably 1 part by mass to 30 parts by mass, more preferably 2 parts by mass to 20 parts by mass, based on 100 parts by mass of the resin component (total amount of epoxy resin and curing agent).
（着色剤）
封止用樹脂組成物は、着色剤を含んでもよい。着色剤としてはカーボンブラック、有機染料、有機顔料、酸化チタン、鉛丹、ベンガラ等の公知の着色剤を挙げることができる。着色剤の含有量は目的等に応じて適宜選択できる。着色剤は、１種を単独で用いても２種以上を組み合わせて用いてもよい。(colorant)
The sealing resin composition may also contain a colorant. Examples of the coloring agent include known coloring agents such as carbon black, organic dyes, organic pigments, titanium oxide, red lead, and red iron. The content of the colorant can be appropriately selected depending on the purpose and the like. The coloring agents may be used alone or in combination of two or more.
（封止用樹脂組成物の調製方法）
封止用樹脂組成物の調製方法は、特に制限されない。一般的な手法としては、所定の配合量の成分をミキサー等によって十分混合した後、ミキシングロール、押出機等によって溶融混練し、冷却し、粉砕する方法を挙げることができる。より具体的には、例えば、上述した成分の所定量を均一に攪拌及び混合し、予め７０℃～１４０℃に加熱してあるニーダー、ロール、エクストルーダー等で混練し、冷却し、粉砕する方法を挙げることができる。(Method for preparing sealing resin composition)
The method for preparing the sealing resin composition is not particularly limited. A general method includes a method in which components in a predetermined amount are thoroughly mixed using a mixer or the like, then melt-kneaded using a mixing roll, extruder, etc., cooled, and pulverized. More specifically, for example, a method in which predetermined amounts of the above-mentioned components are uniformly stirred and mixed, kneaded using a kneader, roll, extruder, etc. that has been heated to 70°C to 140°C, cooled, and pulverized. can be mentioned.
封止用樹脂組成物は、常温常圧下（例えば、２５℃、大気圧下）において固体であることが好ましい。封止用樹脂組成物が固体である場合の形状は特に制限されず、粉状、粒状、タブレット状等が挙げられる。封止用樹脂組成物がタブレット状である場合の寸法及び質量は、パッケージの成形条件に合うような寸法及び質量となるようにすることが取り扱い性の観点から好ましい。 The sealing resin composition is preferably solid at room temperature and pressure (for example, 25° C. and atmospheric pressure). When the resin composition for sealing is solid, the shape is not particularly limited, and examples thereof include powder, granule, tablet, and the like. In the case where the sealing resin composition is in the form of a tablet, it is preferable from the viewpoint of handleability that the dimensions and mass are such that they match the molding conditions of the package.
＜電子部品装置＞
本開示の一実施形態である電子部品装置は、素子と、前記素子を封止している本開示の封止用樹脂組成物の硬化物と、を備える。<Electronic component equipment>
An electronic component device that is an embodiment of the present disclosure includes an element and a cured product of the sealing resin composition of the present disclosure that seals the element.
電子部品装置としては、リードフレーム、配線済みのテープキャリア、配線板、ガラス、シリコンウエハ、有機基板等の支持部材に、素子（半導体チップ、トランジスタ、ダイオード、サイリスタ等の能動素子、コンデンサ、抵抗体、コイル等の受動素子など）を搭載して得られた素子部を封止用樹脂組成物で封止したものが挙げられる。
より具体的には、リードフレーム上に素子を固定し、ボンディングパッド等の素子の端子部とリード部とをワイヤボンディング、バンプ等で接続した後、封止用樹脂組成物を用いてトランスファ成形等によって封止した構造を有するＤＩＰ（Ｄｕａｌ Ｉｎｌｉｎｅ Ｐａｃｋａｇｅ）、ＰＬＣＣ（Ｐｌａｓｔｉｃ Ｌｅａｄｅｄ Ｃｈｉｐ Ｃａｒｒｉｅｒ）、ＱＦＰ（Ｑｕａｄ Ｆｌａｔ Ｐａｃｋａｇｅ）、ＳＯＰ（Ｓｍａｌｌ Ｏｕｔｌｉｎｅ Ｐａｃｋａｇｅ）、ＳＯＪ（Ｓｍａｌｌ Ｏｕｔｌｉｎｅ Ｊ－ｌｅａｄ ｐａｃｋａｇｅ）、ＴＳＯＰ（Ｔｈｉｎ Ｓｍａｌｌ Ｏｕｔｌｉｎｅ Ｐａｃｋａｇｅ）、ＴＱＦＰ（Ｔｈｉｎ Ｑｕａｄ Ｆｌａｔ Ｐａｃｋａｇｅ）等の一般的な樹脂封止型ＩＣ；テープキャリアにバンプで接続した素子を封止用樹脂組成物で封止した構造を有するＴＣＰ（Ｔａｐｅ Ｃａｒｒｉｅｒ Ｐａｃｋａｇｅ）；支持部材上に形成した配線に、ワイヤボンディング、フリップチップボンディング、はんだ等で接続した素子を、封止用樹脂組成物で封止した構造を有するＣＯＢ（Ｃｈｉｐ Ｏｎ Ｂｏａｒｄ）モジュール、ハイブリッドＩＣ、マルチチップモジュール等；裏面に配線板接続用の端子を形成した支持部材の表面に素子を搭載し、バンプ又はワイヤボンディングにより素子と支持部材に形成された配線とを接続した後、封止用樹脂組成物で素子を封止した構造を有するＢＧＡ（Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙ）、ＣＳＰ（Ｃｈｉｐ Ｓｉｚｅ Ｐａｃｋａｇｅ）、ＭＣＰ（Ｍｕｌｔｉ Ｃｈｉｐ Ｐａｃｋａｇｅ）などが挙げられる。また、プリント配線板においても封止用樹脂組成物を好適に使用することができる。Electronic component devices include lead frames, pre-wired tape carriers, wiring boards, glass, silicon wafers, organic substrates, and other supporting members, as well as elements (semiconductor chips, active elements such as transistors, diodes, and thyristors, capacitors, and resistors). , a passive element such as a coil, etc.) and the obtained element part is sealed with a sealing resin composition.
More specifically, after fixing the element on a lead frame and connecting the terminal part of the element such as a bonding pad and the lead part with wire bonding, bumps, etc., transfer molding etc. are performed using a sealing resin composition. DIP (Dual Inline Package), PLCC (Plastic Leaded Chip Carrier), QFP (Quad Flat Package), SOP (Small Outline Package), SOJ (S mall Outline J-lead package), TSOP (Thin Small General resin-sealed ICs such as Outline Package) and TQFP (Thin Quad Flat Package); TCP (Tape Carrier Package), which has a structure in which an element is connected to a tape carrier with bumps and sealed with a sealing resin composition. COB (Chip On Board) module, hybrid IC, multi-chip, which has a structure in which an element is connected to wiring formed on a support member by wire bonding, flip chip bonding, soldering, etc. and sealed with a sealing resin composition. Chip module, etc.: After mounting an element on the surface of a support member with terminals for wiring board connection formed on the back side and connecting the element and wiring formed on the support member by bumps or wire bonding, the resin composition for sealing is applied. Examples include BGA (Ball Grid Array), CSP (Chip Size Package), MCP (Multi Chip Package), etc., which have a structure in which elements are sealed with a material. Moreover, the sealing resin composition can also be suitably used in printed wiring boards.
＜電子部品装置の製造方法＞
本開示の電子部品装置の製造方法は、素子を支持部材上に配置する工程と、前記素子を本開示の封止用樹脂組成物で封止する工程と、を含む。<Method for manufacturing electronic component devices>
The method for manufacturing an electronic component device of the present disclosure includes the steps of arranging an element on a support member, and sealing the element with the sealing resin composition of the present disclosure.
上記各工程を実施する方法は特に制限されず、一般的な手法により行うことができる。また、電子部品装置の製造に使用する支持部材及び素子の種類は特に制限されず、電子部品装置の製造に一般的に用いられる支持部材及び素子を使用できる。 The method for carrying out each of the above steps is not particularly limited, and can be carried out by a general method. Furthermore, the types of support members and elements used in the manufacture of electronic component devices are not particularly limited, and support members and elements commonly used in the manufacture of electronic component devices can be used.
本開示の封止用樹脂組成物を用いて素子を封止する方法としては、低圧トランスファ成形法、インジェクション成形法、圧縮成形法等が挙げられる。これらの中では、低圧トランスファ成形法が一般的である。 Examples of the method for sealing an element using the sealing resin composition of the present disclosure include a low-pressure transfer molding method, an injection molding method, a compression molding method, and the like. Among these, low pressure transfer molding is common.
以下、上記実施形態を実施例により具体的に説明するが、上記実施形態の範囲はこれらの実施例に限定されるものではない。 Hereinafter, the above-mentioned embodiment will be explained in detail using Examples, but the scope of the above-mentioned embodiment is not limited to these Examples.
＜封止用樹脂組成物の調製＞
下記に示す成分を表１に示す配合（質量部）で混合し、実施例と比較例の封止用樹脂組成物を調製した。<Preparation of sealing resin composition>
The components shown below were mixed in the proportions (parts by mass) shown in Table 1 to prepare sealing resin compositions of Examples and Comparative Examples.
・エポキシ樹脂１：ビフェニルアラルキル型エポキシ樹脂、エポキシ当量２７５ｇ／ｅｑ（日本化薬株式会社、品名「ＮＣ-３０００」）
・エポキシ樹脂２：ビフェニル型エポキシ樹脂、エポキシ当量１９２ｇ／ｅｑ（三菱ケミカル株式会社、品名「ＹＸ－４０００」）・Epoxy resin 1: Biphenylaralkyl epoxy resin, epoxy equivalent weight 275 g/eq (Nippon Kayaku Co., Ltd., product name "NC-3000")
・Epoxy resin 2: biphenyl type epoxy resin, epoxy equivalent weight 192 g/eq (Mitsubishi Chemical Corporation, product name "YX-4000")
・硬化剤１：ビフェニルアラルキル型フェノール樹脂、水酸基当量１９９ｇ／ｅｑ（エア・ウォーター株式会社、品名「ＨＥ２００Ｃ－１０」）
・硬化剤２：活性エステル化合物（ＤＩＣ株式会社）・Curing agent 1: Biphenylaralkyl phenol resin, hydroxyl equivalent weight 199 g/eq (Air Water Co., Ltd., product name "HE200C-10")
・Curing agent 2: Active ester compound (DIC Corporation)
・硬化促進剤１：トリフェニルホスフィンのｐ－ベンゾキノン付加物 ・Curing accelerator 1: p-benzoquinone adduct of triphenylphosphine
・カップリング剤１：３－メタクリロキシプロピルトリメトキシシラン（信越化学工業株式会社、品名「ＫＢＭ－５０３」）
・カップリング剤２：３－メルカプトプロピルトリメトキシシラン（信越化学工業株式会社、品名「ＫＢＭ－８０３」）・Coupling agent 1: 3-methacryloxypropyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd., product name "KBM-503")
・Coupling agent 2: 3-mercaptopropyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd., product name "KBM-803")
・離型剤：モンタン酸エステルワックス（クラリアントジャパン株式会社、品名「ＨＷ－Ｅ」）
・着色剤：カーボンブラック（三菱ケミカル株式会社、品名「ＭＡ６００」）
・添加剤：トリフェニルホスフィンオキシド(北興化学工業株式会社、品名「ＴＰ－５０」)・Release agent: Montanic acid ester wax (Clariant Japan Co., Ltd., product name “HW-E”)
・Coloring agent: Carbon black (Mitsubishi Chemical Corporation, product name "MA600")
・Additive: Triphenylphosphine oxide (Hokuko Chemical Industry Co., Ltd., product name "TP-50")
・無機充填材１：シリカフィラ（デンカ株式会社、品名「ＦＢ－９４５４ＦＣ」、平均粒径１８μｍ）
・無機充填材２：シリカフィラ（デンカ株式会社、品名「ＦＢ－９４５４」、平均粒径１９μｍ）
・無機充填材３：アルミナ／シリカ＝９／１の混合物（デンカ株式会社、品名「ＤＡＢ－１０ＦＣ」、平均粒径１０μｍ）・Inorganic filler 1: Silica filler (Denka Co., Ltd., product name "FB-9454FC", average particle size 18 μm)
・Inorganic filler 2: Silica filler (Denka Co., Ltd., product name "FB-9454", average particle size 19 μm)
・Inorganic filler 3: Alumina/silica = 9/1 mixture (Denka Co., Ltd., product name "DAB-10FC", average particle size 10 μm)
＜封止用樹脂組成物の性能評価＞
（スパイラルフロー）
ＥＭＭＩ－１－６６に準じたスパイラルフロー測定用金型を用いて、封止用樹脂組成物を金型温度１８０℃、成形圧力６．９ＭＰａ、硬化時間９０秒の条件で成形し、流動距離（ｃｍ）を求めた。<Performance evaluation of sealing resin composition>
(Spiral flow)
Using a spiral flow measurement mold conforming to EMMI-1-66, the sealing resin composition was molded under the conditions of mold temperature 180°C, molding pressure 6.9 MPa, and curing time 90 seconds, and the flow distance ( cm) was calculated.
（ゲルタイム）
封止用樹脂組成物０．５ｇを１７５℃に熱した熱板上に乗せ、治具を用いて２０回転／分～２５回転／分の回転速度で、試料を２．０ｃｍ～２．５ｃｍの円状に均一に広げた。試料を熱板に乗せてから、試料の粘性がなくなり、ゲル状態となって熱板から剥がれるようになるまでの時間を計測し、これをゲルタイム（ｓｅｃ）として測定した。(gel time)
Place 0.5 g of the sealing resin composition on a hot plate heated to 175°C, and use a jig to rotate the sample at a rotation speed of 20 to 25 revolutions/minute to a thickness of 2.0 to 2.5 cm. Spread it out evenly in a circle. The time from when the sample was placed on the hot plate until the sample lost its viscosity, turned into a gel state, and peeled off from the hot plate was measured, and this time was measured as gel time (sec).
（熱伝導率）
封止組成物を用いて、真空ハンドプレス成形機により、金型温度１７５℃～１８０℃、成形圧力２５０ｋＰａ、硬化時間６００秒の条件で熱伝導率評価用の試験片（縦１０ｍｍ×横１０ｍｍ×厚み０．８ｍｍ）を作製した。次いで、成形した試験片について、厚さ方向の熱拡散率を測定した。熱拡散率の測定はレーザーフラッシュ法（装置：ＬＦＡ４６７ ｎａｎｏｆｌａｓｈ、ＮＥＴＺＳＣＨ社製）にて行った。パルス光照射は、パルス幅０．３１（ｍｓ）、印加電圧２４７Ｖの条件で行った。測定は雰囲気温度２５℃±１℃で行った。また上記試験片の密度は電子比重計（ＡＵＸ２２０、株式会社島津製作所）を用いて測定した。比熱は各材料の比熱の文献値と配合比率より封止組成物の理論比熱を算出した。
次いで、式（１）を用いて比熱及び密度を熱拡散率に乗算することによって，熱伝導率の値を得た。
λ＝α×Ｃｐ×ρ・・・式（１）
（式（１）中、λは熱伝導率（Ｗ／（ｍ・Ｋ））、αは熱拡散率（ｍ２／ｓ）、Ｃｐは比熱（Ｊ／（ｋｇ・Ｋ））、ρは密度（ｄ：ｋｇ／ｍ３）をそれぞれ示す。）(Thermal conductivity)
Using the sealing composition, a test piece (length 10 mm x width 10 mm x A thickness of 0.8 mm) was produced. Next, the thermal diffusivity in the thickness direction of the molded test piece was measured. The thermal diffusivity was measured by a laser flash method (device: LFA467 nanoflash, manufactured by NETZSCH). The pulsed light irradiation was performed under the conditions of a pulse width of 0.31 (ms) and an applied voltage of 247V. The measurement was performed at an ambient temperature of 25°C±1°C. Further, the density of the above test piece was measured using an electronic hydrometer (AUX220, Shimadzu Corporation). The theoretical specific heat of the sealing composition was calculated from the literature values of the specific heat of each material and the blending ratio.
Thermal conductivity values were then obtained by multiplying the thermal diffusivity by the specific heat and density using equation (1).
λ=α×Cp×ρ...Formula (1)
(In formula (1), λ is thermal conductivity (W/(m・K)), α is thermal diffusivity (m 2 /s), Cp is specific heat (J/(kg・K)), and ρ is density (d: kg/m 3 ).)
（比誘電率及び誘電正接）
封止用樹脂組成物をトランスファ成形機に仕込み、金型温度１８０℃、成形圧力６．９ＭＰａ、硬化時間９０秒の条件で成形し、後硬化を１７５℃で６時間行い、棒状の硬化物（縦０．８ｍｍ、横０．６ｍｍ、厚さ９０ｍｍ）を得た。この硬化物を試験片として、空洞共振器（株式会社関東電子応用開発、「ＣＰ５６１」）およびネットワーク・アナライザー（キーサイトテクノロジー社、「ＰＮＡ Ｅ８３６４Ｂ」）を用いて、温度２５±１℃下、２０ＧＨｚでの比誘電率と誘電正接を測定した。(Relative permittivity and dielectric loss tangent)
The sealing resin composition was charged into a transfer molding machine and molded under the conditions of a mold temperature of 180°C, a molding pressure of 6.9 MPa, and a curing time of 90 seconds. Post-curing was performed at 175°C for 6 hours to form a rod-shaped cured product ( 0.8 mm in length, 0.6 mm in width, and 90 mm in thickness) was obtained. This cured product was used as a test piece, using a cavity resonator (Kanto Denshi Application Development Co., Ltd., "CP561") and a network analyzer (Keysight Technologies, "PNA E8364B") at a temperature of 25 ± 1 °C and 20 GHz. The relative permittivity and dielectric loss tangent were measured.
表１に示すように、無機充填材としてアルミナを使用した実施例１、比較例３の封止用樹脂組成物は、無機充填材としてアルミナを使用していない比較例１、２に比べて硬化物の熱伝導率が高かった。一方、実施例１、比較例３の比誘電率は比較例１、２に比べて上昇した。しかしながら、硬化剤として活性エステル化合物を使用した実施例１は、硬化剤としてフェノール樹脂を使用した比較例３に比べて誘電正接が低いために伝送損失の増大が抑えられ、結果として放熱性と誘電特性のバランスに優れていた。
また、実施例１、比較例２では硬化剤としてフェノール樹脂よりも低粘度の活性エステルを使用することで、硬化剤としてフェノール樹脂を使用した比較例１、３に比べて流動性が向上しているが、無機充填材としてアルミナを併用した実施例１の方が、無機充填材としてアルミナを併用しない比較例３より流動性向上効果が大きくなっている。
さらに、実施例１では比較例１～３に比べてゲルタイムが短い。アルミナは一般に硬化反応の遅延を引き起こすが、活性エステル化合物とエポキシ樹脂の反応性がフェノール樹脂とエポキシ樹脂の反応性に比べて高いために、硬化性が向上すると考えられる。As shown in Table 1, the sealing resin compositions of Example 1 and Comparative Example 3, which used alumina as an inorganic filler, were harder than Comparative Examples 1 and 2, which did not use alumina as an inorganic filler. The material's thermal conductivity was high. On the other hand, the dielectric constants of Example 1 and Comparative Example 3 increased compared to Comparative Examples 1 and 2. However, in Example 1, which used an active ester compound as a curing agent, the increase in transmission loss was suppressed due to the lower dielectric loss tangent compared to Comparative Example 3, which used a phenol resin as a curing agent, and as a result, the heat dissipation and dielectric It had an excellent balance of characteristics.
In addition, in Example 1 and Comparative Example 2, by using an active ester with a lower viscosity than phenol resin as a curing agent, the fluidity was improved compared to Comparative Examples 1 and 3, which used phenol resin as a curing agent. However, Example 1 in which alumina was used in combination as an inorganic filler had a greater fluidity improvement effect than Comparative Example 3 in which alumina was not used in combination as an inorganic filler.
Furthermore, the gel time in Example 1 is shorter than in Comparative Examples 1 to 3. Although alumina generally causes a delay in the curing reaction, it is thought that curability is improved because the reactivity between the active ester compound and the epoxy resin is higher than that between the phenol resin and the epoxy resin.
Claims (3)
前記無機充填材の含有率は封止用樹脂組成物全体の４０体積％～９０体積％であり、
前記無機充填材のうちアルミナが占める割合が５０質量％～９０質量％であり、
前記硬化剤のうち活性エステル化合物の占める割合が８０質量％以上であり、
２５℃、大気圧下において固体である、封止用樹脂組成物。 Contains an epoxy resin, a curing agent containing an active ester compound, and an inorganic filler containing alumina and silica,
The content of the inorganic filler is 40% to 90% by volume of the entire sealing resin composition,
The proportion of alumina in the inorganic filler is 50% by mass to 90% by mass,
The proportion of the active ester compound in the curing agent is 80% by mass or more,
A sealing resin composition that is solid at 25°C and atmospheric pressure.
前記支持部材上に配置された素子と、
前記素子を封止している請求項１に記載の封止用樹脂組成物の硬化物と、
を備える電子部品装置。 a support member;
an element disposed on the support member;
A cured product of the sealing resin composition according to claim 1, which seals the element;
An electronic component device comprising:
前記素子を請求項１に記載の封止用樹脂組成物で封止する工程と、
を含む電子部品装置の製造方法。 arranging the element on the support member;
A step of sealing the element with the sealing resin composition according to claim 1;
A method of manufacturing an electronic component device including:
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010184993A (en) | 2009-02-12 | 2010-08-26 | Nippon Steel Chem Co Ltd | Epoxy resin composition and cured article |
| JP2017103329A (en) | 2015-12-01 | 2017-06-08 | 味の素株式会社 | Resin sheet |
| WO2018008416A1 (en) | 2016-07-06 | 2018-01-11 | Dic株式会社 | Active ester composition and cured product thereof |
| JP2018058959A (en) | 2016-10-03 | 2018-04-12 | 味の素株式会社 | Resin composition |
| JP2018159028A (en) | 2017-03-23 | 2018-10-11 | 味の素株式会社 | Resin composition |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010184993A (en) | 2009-02-12 | 2010-08-26 | Nippon Steel Chem Co Ltd | Epoxy resin composition and cured article |
| JP2017103329A (en) | 2015-12-01 | 2017-06-08 | 味の素株式会社 | Resin sheet |
| WO2018008416A1 (en) | 2016-07-06 | 2018-01-11 | Dic株式会社 | Active ester composition and cured product thereof |
| JP2018058959A (en) | 2016-10-03 | 2018-04-12 | 味の素株式会社 | Resin composition |
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