WO2021109210A1 - 显示面板及其制作方法 - Google Patents

显示面板及其制作方法 Download PDF

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Publication number
WO2021109210A1
WO2021109210A1 PCT/CN2019/125159 CN2019125159W WO2021109210A1 WO 2021109210 A1 WO2021109210 A1 WO 2021109210A1 CN 2019125159 W CN2019125159 W CN 2019125159W WO 2021109210 A1 WO2021109210 A1 WO 2021109210A1
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WO
WIPO (PCT)
Prior art keywords
layer
display panel
packaging
substrate
annular groove
Prior art date
Application number
PCT/CN2019/125159
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English (en)
French (fr)
Inventor
魏锋
李金川
Original Assignee
深圳市华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 深圳市华星光电半导体显示技术有限公司 filed Critical 深圳市华星光电半导体显示技术有限公司
Priority to US16/625,778 priority Critical patent/US20220310739A1/en
Publication of WO2021109210A1 publication Critical patent/WO2021109210A1/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • This application relates to the technical field of display panels, and in particular to a display panel and a manufacturing method thereof.
  • OLED Organic Light Emitting Display
  • liquid crystal displays it has many advantages such as self-luminescence, fast response, wide viewing angle, and color saturation.
  • OLED devices are sensitive to water and oxygen in the air and are easy to absorb water and oxidize, causing the life of the OLED device to decrease or the pixel failure. Therefore, effective packaging of the OLED device to fully isolate the OLED device from water and oxygen is useful for extending the life of the OLED device to Important.
  • the embodiments of the present application provide a display panel and a manufacturing method thereof, so as to solve the problem that the existing package structure cannot have water and oxygen barrier and high package structure strength at the same time.
  • An embodiment of the present application provides a display panel, including:
  • the light-emitting function layer is provided on the substrate;
  • a thin-film encapsulation layer is provided on the substrate and the light-emitting function layer, and covers the light-emitting function layer;
  • a drying layer located on the substrate and arranged around the thin film encapsulation layer
  • An encapsulation cover plate which is arranged on the drying layer and the film encapsulation layer;
  • a cured adhesive layer is located between the substrate and the packaging cover plate and arranged around the drying layer, the curing adhesive layer fixes the substrate and the packaging cover plate, the drying layer and the curing adhesive An annular groove surrounding the drying layer is provided between the layers;
  • the packaging glue layer is arranged in the annular groove.
  • the display panel further includes a transparent filling layer adjacent to the drying layer, and the transparent filling layer is provided between the thin film encapsulation layer and the encapsulation cover plate.
  • the material of the transparent filling layer is a resin material.
  • the encapsulant layer is filled in the annular groove in a ring shape and is arranged around the drying layer.
  • the packaging glue layer includes a plurality of packaging glue blocks, and each of the packaging glue blocks is arranged in the annular groove at intervals.
  • the packaging cover plate is provided with a plurality of printing holes communicating with the annular groove, and each of the printing holes surrounds the corresponding film packaging layer and the drying layer. Regional intervals are arranged above the annular groove.
  • the diameter of each of the printing holes is 0.2 mm-1 mm.
  • the material of the drying layer is a mixture of resin and barium carbonate or a mixture of resin and calcium carbonate.
  • the material of the encapsulation glue layer is glass glue.
  • a manufacturing method of a display panel including the following steps:
  • a packaging cover is provided on which a drying layer and a cured adhesive layer are formed, wherein the drying layer includes an opening for accommodating the thin film packaging layer; the curing adhesive layer surrounds the drying layer Provided, and an annular groove surrounding the drying layer is formed between the drying layer and the cured adhesive layer;
  • a packaging glue layer is formed in the annular groove.
  • the forming an encapsulant layer in the annular groove includes:
  • a plurality of printing holes communicating with the annular groove are formed on the packaging cover plate, and each of the printing holes is arranged at intervals in the annular groove around the area corresponding to the film packaging layer and the drying layer.
  • the packaging glue is ink-jet printed in the annular groove through the printing hole and cured to form a packaging glue layer.
  • a plurality of printing holes communicating with the annular groove are formed on the packaging cover by means of laser drilling.
  • the method before the assembling the substrate and the packaging cover plate, the method further includes:
  • a transparent filling layer is formed on the thin film packaging layer.
  • the transparent filling layer is formed on the thin film encapsulation layer by inkjet printing or coating.
  • the light-emitting function layer is formed on the substrate by means of vacuum evaporation or inkjet printing.
  • a thin film encapsulation layer covering the light-emitting functional layer is formed on the substrate and the light-emitting functional layer by means of chemical vapor deposition.
  • the embodiment of the present application provides a display panel and a manufacturing method thereof.
  • the structure of the encapsulation cover plate and the glass glue is combined with the structure of the film encapsulation layer, the drying layer and the cured glue layer to realize the hybrid encapsulation of the light-emitting function layer. It can not only ensure good water and oxygen barrier properties, but also have good packaging strength; in addition, by forming a manufacturing method of a packaging adhesive layer between the drying layer and the cured adhesive layer, the passage of water vapor into the display panel can be effectively controlled
  • the size can be adapted to the packaging of OLED display panels of different sizes.
  • FIG. 1 is a schematic structural diagram of a display panel provided by an embodiment of the application.
  • FIG. 2 is a side view of a packaging cover in a display panel provided by an embodiment of the application
  • FIG. 3 is a top view of an encapsulation adhesive layer according to an embodiment of the application.
  • FIG. 4 is a top view of another packaging adhesive layer provided by an embodiment of the application.
  • FIG. 5 is a schematic block diagram of the flow of a method for manufacturing a display panel according to an embodiment of the application.
  • FIGS. 6-9 are diagrams of the structure formation process of a method for manufacturing a display panel provided by an embodiment of the present application.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” may explicitly or implicitly include one or more of the features. In the description of the present application, “multiple” means two or more than two, unless otherwise specifically defined.
  • connection should be understood in a broad sense, unless otherwise clearly specified and limited.
  • it can be a fixed connection or a detachable connection.
  • Connected or integrally connected it can be mechanically connected, or electrically connected or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication of two components or the interaction of two components relationship.
  • connection should be understood according to specific circumstances.
  • the "on" or “under” of the first feature of the second feature may include direct contact between the first and second features, or may include the first and second features Not in direct contact but through other features between them.
  • the "above”, “above” and “above” of the first feature on the second feature include the first feature directly above and obliquely above the second feature, or it simply means that the first feature is higher in level than the second feature.
  • the “below”, “below” and “below” of the second feature of the first feature include the first feature directly below and obliquely below the second feature, or it simply means that the level of the first feature is smaller than the second feature.
  • an embodiment of the present application provides a display panel, including:
  • the light-emitting function layer 200 is disposed on the substrate 100;
  • the thin-film encapsulation layer 300 is provided on the substrate 100 and the light-emitting function layer 200, and covers the light-emitting function layer 200;
  • the drying layer 400 is located on the substrate 100 and arranged around the thin film encapsulation layer 300;
  • the packaging cover plate 500 is arranged on the drying layer 400 and the thin film packaging layer 300;
  • the cured adhesive layer 600 is located between the substrate 100 and the package cover plate 500 and is arranged around the drying layer 400.
  • the cured adhesive layer 600 fixes the substrate 100 and the package cover plate 500.
  • An annular groove 10 surrounding the drying layer 400 is provided between the drying layer 400 and the cured adhesive layer 600;
  • the packaging glue layer 700 is disposed in the annular groove 10.
  • the substrate 100 may be a substrate 100 with a TFT function layer
  • the light-emitting function layer 200 may include an anode layer, an electron blocking layer, a light-emitting layer, and an air-emitting layer which are sequentially disposed on the substrate 100.
  • the thin film encapsulation layer 300 can be a structure in which organic layers and inorganic layers are alternately stacked, and the material can be SiO, SiON, SiN, etc.;
  • the material of the drying layer 400 may be a resin mixed with barium carbonate or calcium carbonate, which has a certain water absorption and drying performance, the material of the encapsulating glue layer 700 is glass glue, and the material of the curing glue layer 600 is UV glue; as a whole, the composite packaging form of the film packaging layer 300, packaging cover 500, drying layer 400, packaging glue layer 700 and other structures strengthens the reliability of the packaging and also improves the service life of the display panel.
  • it further includes a transparent filling layer 800 adjacent to the drying layer 400, and the transparent filling layer 800 is provided between the thin film packaging layer 300 and the packaging cover plate 500; obviously, the transparent filling layer
  • the layer 800 is arranged between the thin film encapsulation layer 300 and the encapsulation cover 500 to have a certain buffer effect.
  • the material of the transparent filling layer 800 may be a resin material.
  • the packaging cover plate 500 is provided with a plurality of printing holes 510 communicating with the annular groove 10, and each printing hole 510 surrounds the film packaging layer 300 and The regions corresponding to the drying layer 400 are arranged above the annular groove 10 at intervals.
  • the printing holes 510 are used to subsequently print the packaging glue layer 700 into the annular groove 10, for example.
  • the size of the printing hole 510 must be larger than the size of the inkjet printing nozzle to facilitate normal printing; specifically, the distance between any two adjacent printing holes 510 Equally, the diameter of each of the printing holes 510 is 0.2 mm-1 mm.
  • the encapsulant layer 700 is filled in the annular groove 10 in a ring shape and is arranged around the drying layer 400. Obviously, when two adjacent printing holes 510 are adjacent to each other, When the distance between them is small, the encapsulating glue layer 700 is easy to connect in the annular groove 10 to form a whole, so that the encapsulating glue layer 700 is completely filled in the annular groove 10, and the sealing of the annular groove 10 is realized. The entire space of the groove 10 is completely sealed.
  • the encapsulant layer 700 includes a plurality of encapsulant blocks 710, and each encapsulant block 710 is arranged in the annular groove 10 at intervals. It is understood that this When the distance between two adjacent printing holes 510 is relatively large, the packaging glue layer 700 cannot be connected as a whole in the annular groove 10 by printing, so that the packaging glue blocks 710 are formed as a whole.
  • each of the encapsulating glue blocks 710 corresponds to each of the printing holes 510 one-to-one, and each printing hole 510 is printed with one encapsulating glue block 710 for sealing.
  • the width of the encapsulation adhesive layer 700 is determined by the width of the annular groove 10, and the encapsulation adhesive layer can be controlled by controlling the distance between the drying layer 400 and the cured adhesive layer 600
  • the width of 700 can be adjusted according to the size of the panel to be packaged, and has good adaptability to the package of different types of panels; specifically, the width of the annular groove 10 is 0.3 mm to 0.8 mm.
  • a method for manufacturing a display panel is also provided, as shown in FIG. 5, including the following steps:
  • Step S10 As shown in FIG. 6, a substrate 100 is provided, and a light-emitting function layer 200 is formed on the substrate 100;
  • Step S20 forming a thin-film encapsulation layer 300 covering the light-emitting functional layer 200 on the substrate 100 and the light-emitting functional layer 200; specifically, the light-emitting functional layer can be formed by vacuum evaporation or inkjet printing. 200. At the same time, the thin film encapsulation layer 300 can be formed by chemical vapor deposition.
  • Step S30 As shown in FIG. 7, a packaging cover plate 500 is provided, and a drying layer 400 and a cured adhesive layer 600 are formed on the packaging cover plate 500, wherein the drying layer 400 includes a package for accommodating the thin film package.
  • the opening 410 of the layer 300; the cured adhesive layer 600 is arranged around the drying layer 400, and an annular groove 10 surrounding the drying layer 400 is formed between the drying layer 400 and the cured adhesive layer 600; specifically Yes, the drying layer 400 and the cured adhesive layer 600 can be formed separately by inkjet printing or coating.
  • Step S40 As shown in FIG. 8, the substrate 100 and the packaging cover plate 500 are aligned, so that the thin-film packaging layer 300 is located in the opening 410, and the substrate is fixed by the cured adhesive layer 600 100 and the packaging cover 500; and
  • Step S50 As shown in FIG. 9, a packaging glue layer 700 is formed in the annular groove 10.
  • the material of the curing adhesive layer 600 is UV adhesive, and the UV adhesive can be cured by light to fix the substrate 100 and the packaging cover 500.
  • the forming the encapsulant layer 700 in the annular groove 10 includes:
  • a plurality of printing holes 510 communicating with the annular groove 10 are formed on the packaging cover plate 500, and each printing hole 510 is arranged at intervals around the area corresponding to the thin film packaging layer 300 and the drying layer 400. Above the annular groove 10; and
  • the packaging glue is ink-jet printed in the annular groove 10 through the printing hole 510 and cured to form the packaging glue layer 700.
  • the packaging glue is glass glue, and the specific curing method to form the packaging glue layer 700 may be laser curing.
  • a plurality of printing holes 510 communicating with the annular groove 10 are formed on the packaging cover plate 500 by means of laser drilling.
  • the step S20 before the assembling the substrate 100 and the packaging cover 500, the step S20 further includes:
  • a transparent filling layer 800 is formed on the thin film packaging layer 300.
  • the transparent filling layer 800 may be formed on the thin film packaging layer 300 by inkjet printing or coating.
  • the curing adhesive layer 600 and the drying layer 400 can be manufactured by adjusting the distance between the curing adhesive layer 600 and the drying layer 400 to control the
  • the width of the annular groove 10 is to limit the width of the encapsulation layer 700 to adapt to the encapsulation of panels of different sizes, and by setting a printing hole 510 on the encapsulation cover 500, the packaging method is used to print the encapsulation layer 700.
  • the number and density of printing holes 510 can be adjusted according to different needs, and the overall manufacturing process is mature and suitable for mass production.
  • the embodiment of the present application provides a display panel and a method for manufacturing the same.
  • the structure of the cover plate 500 and the glass glue is combined with the structure of the film encapsulation layer 300, the drying layer 400 and the cured glue layer 600 at the same time.
  • it can not only ensure good water and oxygen barrier properties, but also have good packaging strength; in addition, by forming the packaging adhesive layer 700 between the drying layer 400 and the cured adhesive layer 600
  • the manufacturing method can effectively control the size of the channel through which water vapor enters the display panel, and can be adapted to the packaging of OLED display panels of different sizes.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种显示面板及其制作方法，该显示面板包括基板、设于基板上的发光功能层、设于基板和发光功能层上并覆盖发光功能层的薄膜封装层、位于基板上且围绕薄膜封装层设置的干燥层、设置于干燥层和薄膜封装层上的封装盖板、固定基板与封装盖板的固化胶层，干燥层与固化胶层之间设有围绕干燥层的环形凹槽；环形凹槽内设有封装胶层。

Description

显示面板及其制作方法 技术领域
本申请涉及显示面板技术领域，尤其涉及一种显示面板及其制作方法。
 背景技术
有机电致发光显示器(Organic Light Emitting Display，OLED)是新一代的显示器，相对于液晶显示器具有自发光、响应快、视角广、色彩饱和等许多优点。 但OLED器件对空气中的水氧敏感容易吸水氧化，引起OLED器件寿命下降或像素失效，因此，对OLED器件进行有效的封装，使OLED器件与水氧充分隔离，对延长OLED器件的使用寿命至关重要。
 技术问题
随着OLED显示技术的发展，目前单一的OLED封装结构已不能同时满足OLED器件对于水氧阻隔和封装结构强度等多方面需求。
 技术解决方案
本申请实施例提供一种显示面板及其制作方法，以解决现有封装结构不能同时具备水氧阻隔和较高的封装结构强度的问题。
本申请实施例提供一种显示面板，包括：
基板；
发光功能层，设于所述基板上；
薄膜封装层，设于所述基板和所述发光功能层上，并覆盖所述发光功能层；
干燥层，位于所述基板上，且围绕所述薄膜封装层设置；
封装盖板，设置于所述干燥层和所述薄膜封装层上；
固化胶层，位于所述基板与所述封装盖板之间，且绕所述干燥层设置，所述固化胶层固定所述基板与所述封装盖板，所述干燥层与所述固化胶层之间设有围绕所述干燥层的环形凹槽；及
封装胶层，设置于所述环形凹槽内。
在本申请实施例的显示面板中，还包括邻接所述干燥层的透明填充层，所述透明填充层设于所述薄膜封装层与所述封装盖板之间。
在本申请实施例的显示面板中，所述透明填充层的材料为树脂材料。
在本申请实施例的显示面板中，所述封装胶层呈环型填充于所述环形凹槽内并围绕所述干燥层设置。
在本申请实施例的显示面板中，所述封装胶层包括多个封装胶块，各所述封装胶块间隔设置于所述环形凹槽内。
在本申请实施例的显示面板中，所述封装盖板上设有多个与所述环形凹槽连通的打印孔，各所述打印孔围绕所述薄膜封装层和所述干燥层所对应的区域间隔设置于所述环形凹槽的上方。
在本申请实施例的显示面板中，各所述打印孔的直径为0.2 mm～1mm。
在本申请实施例的显示面板中，所述干燥层的材料的树脂与碳酸钡的混合物或树脂与碳酸钙的混合物。
在本申请实施例的显示面板中，所述封装胶层的材料为玻璃胶。
根据本申请的上述目的，还提供一种显示面板的制作方法，包括以下步骤：
提供一基板，在所述基板上形成发光功能层；
在所述基板和所述发光功能层上形成覆盖所述发光功能层的薄膜封装层；
提供一封装盖板，在所述封装盖板上形成干燥层和固化胶层，其中，所述干燥层包括一用于容纳所述薄膜封装层的开口；所述固化胶层绕所述干燥层设置，且所述干燥层与所述固化胶层之间形成有围绕所述干燥层的环形凹槽；
将所述基板与所述封装盖板对合，使所述薄膜封装层位于所述开口内，并通过所述固化胶层固定所述基板与所述封装盖板；及
在所述环形凹槽内形成封装胶层。
在本申请实施例显示面板的制作方法中，所述在所述环形凹槽内形成封装胶层包括：
在所述封装盖板上形成多个与所述环形凹槽连通的打印孔，各所述打印孔围绕所述薄膜封装层和所述干燥层所对应的区域间隔设置于所述环形凹槽的上方；
通过所述打印孔在所述环形凹槽内喷墨打印封装胶并固化形成封装胶层。
在本申请实施例显示面板的制作方法中，采用激光打孔的方式在所述封装盖板上形成多个与所述环形凹槽连通的打印孔。
在本申请实施例显示面板的制作方法中，在所述将所述基板与所述封装盖板对合之前，还包括：
在所述薄膜封装层上形成透明填充层。
在本申请实施例显示面板的制作方法中，通过喷墨打印或涂布的方式在所述薄膜封装层上形成所述透明填充层。
在本申请实施例显示面板的制作方法中，采用真空蒸镀或喷墨打印的方式在所述基板上形成所述发光功能层。
在本申请实施例显示面板的制作方法中，采用化学气相沉积的方式在所述基板和所述发光功能层上形成覆盖所述发光功能层的薄膜封装层。
 有益效果
本申请实施例提供的一种显示面板及其制作方法，通过封装盖板和玻璃胶的结构形式，同时结合薄膜封装层、干燥层和固化胶层的结构，实现对发光功能层的混合封装，既能保证良好的水氧阻隔性，又具备很好的封装强度；此外，通过在干燥层与所述固化胶层之间形成封装胶层的制作方法，可有效控制水汽进入显示面板内的通道大小，可适应不同尺寸的OLED显示面板的封装。
 附图说明
下面结合附图，通过对本申请的具体实施方式详细描述，将使本申请的技术方案及其它有益效果显而易见。
图1为本申请实施例提供一种显示面板的结构示意图；
图2为本申请实施例提供一种显示面板中封装盖板的侧视图；
图3为本申请实施例提供一种封装胶层处的俯视图；
图4为本申请实施例提供另一种封装胶层处的俯视图；
图5为本申请实施例提供一种显示面板制作方法的流程示意框图；及
图6-图9为本申请实施例提供一种显示面板制作方法的结构形成过程图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本申请。此外，本申请可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本申请提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
具体的，请参阅图1至图4，本申请实施例提供一种显示面板，包括：
基板100；
发光功能层200，设于所述基板100上；
薄膜封装层300，设于所述基板100和所述发光功能层200上，并覆盖所述发光功能层200；
干燥层400，位于所述基板100上，且围绕所述薄膜封装层300设置；
封装盖板500，设置于所述干燥层400和所述薄膜封装层300上；
固化胶层600，位于所述基板100与所述封装盖板500之间，且绕所述干燥层400设置，所述固化胶层600固定所述基板100与所述封装盖板500，所述干燥层400与所述固化胶层600之间设有围绕所述干燥层400的环形凹槽10；及
封装胶层700，设置于所述环形凹槽10内。
可以理解的是，所述基板100可以是带有TFT功能层的基板100，并且，所述发光功能层200可以包括依次设置于所述基板100上的阳极层、电子阻挡层、发光层、空穴阻挡层、电子传输层、电子注入层、阴极层等功能层，其中，所述薄膜封装层300可以是有机层和无机层交替层叠设置的结构，材料可以是由SiO、SiON和SiN等；具体的，所述干燥层400的材料可以是混合有碳酸钡或碳酸钙的树脂，具备一定的吸水干燥性能，所述封装胶层700的材料为玻璃胶，所述固化胶层600的材料为UV胶；整体上通过薄膜封装层300、封装盖板500、干燥层400、封装胶层700等结构的复合封装形式，加强了封装的可靠性，也提高了显示面板的使用寿命。
在一实施例中，还包括邻接所述干燥层400的透明填充层800，所述透明填充层800设于所述薄膜封装层300与所述封装盖板500之间；显然，所述透明填充层800设置于所述薄膜封装层300与所述封装盖板500之间可以起到一定的缓冲作用，具体的，所述透明填充层800的材料可以是树脂材料。
在一实施例中，如图2所示，所述封装盖板500上设有多个与所述环形凹槽10连通的打印孔510，各所述打印孔510围绕所述薄膜封装层300和所述干燥层400所对应的区域间隔设置于所述环形凹槽10的上方，值得注意的是，所述打印孔510用于后续向所述环形凹槽10内打印封装胶层700，例如，在采用喷墨打印的前提下，所述打印孔510的大小必须大于所述喷墨打印喷头的大小，以便于打印的正常进行；具体的，任意相邻两所述打印孔510之间的距离相等，各所述打印孔510的直径为0.2 mm～1mm。
在一实施例中，如图3所示，所述封装胶层700呈环型填充于所述环形凹槽10内并围绕所述干燥层400设置，显然，当相邻两所述打印孔510之间的间距较小时，所述封装胶层700易于在所述环形凹槽10内连接形成一整体，使得所述封装胶层700完全填充于所述环形凹槽10内，实现对所述环形凹槽10整体空间的完全密封。
在一实施例中，如图4所示，所述封装胶层700包括多个封装胶块710，各所述封装胶块710间隔设置于所述环形凹槽10内，可以理解的是，此时，相邻两所述打印孔510之间的间距较大，所述封装胶层700无法在所述环形凹槽10内通过打印连接呈一整体，从而呈多个所述封装胶块710的形式，各所述封装胶块710与各所述打印孔510一一对应，每一打印孔510处均打印一所述封装胶块710进行密封。
可以理解的是，所述封装胶层700的宽度由所述环形凹槽10的宽度决定，可以通过控制所述干燥层400与所述固化胶层600之间的间距来控制所述封装胶层700的宽度，以便于根据所需封装的面板尺寸的大小进行调整，对不同型号面板的封装具有较好的适应性；具体的，所述环形凹槽10的宽度为0.3 mm～0.8mm。
根据本申请的上述目的，还提供一种显示面板的制作方法，如图5所示，包括以下步骤：
步骤S10：如图6所示，提供一基板100，在所述基板100上形成发光功能层200；
步骤S20：在所述基板100和所述发光功能层200上形成覆盖所述发光功能层200的薄膜封装层300；具体的，可以采用真空蒸镀或喷墨打印的方式形成所述发光功能层200，同时，可采用化学气相沉积的方式形成所述薄膜封装层300。
步骤S30：如图7所示，提供一封装盖板500，在所述封装盖板500上形成干燥层400和固化胶层600，其中，所述干燥层400包括一用于容纳所述薄膜封装层300的开口410；所述固化胶层600绕所述干燥层400设置，且所述干燥层400与所述固化胶层600之间形成有围绕所述干燥层400的环形凹槽10；具体的，可采用喷墨打印或涂布的方式分别形成所述干燥层400和固化胶层600。
步骤S40：如图8所示，将所述基板100与所述封装盖板500对合，使所述薄膜封装层300位于所述开口410内，并通过所述固化胶层600固定所述基板100与所述封装盖板500；及
步骤S50：如图9所示，在所述环形凹槽10内形成封装胶层700。
其中，所述固化胶层600的材料为UV胶，可以通过光照的方式固化所述UV胶，以固定所述基板100与所述封装盖板500。
在一实施例中，在所述步骤S50中，所述在所述环形凹槽10内形成封装胶层700包括：
在所述封装盖板500上形成多个与所述环形凹槽10连通的打印孔510，各所述打印孔510围绕所述薄膜封装层300和所述干燥层400所对应的区域间隔设置于所述环形凹槽10的上方；及
通过所述打印孔510在所述环形凹槽10内喷墨打印封装胶并固化形成封装胶层700。其中，所述封装胶为玻璃胶，具体固化形成封装胶层700的方式可以是通过激光固化的方式。
在一实施例中，采用激光打孔的方式在所述封装盖板500上形成多个与所述环形凹槽10连通的打印孔510。
在一实施例中，如图6所示，在所述将所述基板100与所述封装盖板500对合之前，所述步骤S20还包括：
在所述薄膜封装层300上形成透明填充层800，具体的，可以通过喷墨打印或涂布的方式在所述薄膜封装层300上形成透明填充层800。
综上，本申请一种显示面板的制作方法，可以通过在制作固化胶层600和所述干燥层400时，通过调整固化胶层600与所述干燥层400之间的距离，从而控制所述环形凹槽10的宽度，以限制所述封装胶层700的宽度，适应不同尺寸面板的封装，并且，通过在封装盖板500上设置打印孔510的方式，采用打印封装胶层700的工艺封装，打印孔510的数量和密度可根据不同需求调整，整体制作工艺成熟，适于批量生产。
综上所述，本申请实施例提供的一种显示面板及其制作方法，通过封装盖板500和玻璃胶的结构形式，同时结合薄膜封装层300、干燥层400和固化胶层600的结构，实现对发光功能层200的混合封装，既能保证良好的水氧阻隔性，又具备很好的封装强度；此外，通过在干燥层400与所述固化胶层600之间形成封装胶层700的制作方法，可有效控制水汽进入显示面板内的通道大小，可适应不同尺寸的OLED显示面板的封装。
可以理解的是，对本领域普通技术人员来说，可以根据本申请的技术方案及其发明构思加以等同替换或改变，而所有这些改变或替换都应属于本申请所附的权利要求的保护范围。

Claims (16)

  1. 一种显示面板，其中包括：
    基板；
    发光功能层，设于所述基板上；
    薄膜封装层，设于所述基板和所述发光功能层上，并覆盖所述发光功能层；
    干燥层，位于所述基板上，且围绕所述薄膜封装层设置；
    封装盖板，设置于所述干燥层和所述薄膜封装层上；
    固化胶层，位于所述基板与所述封装盖板之间，且绕所述干燥层设置，所述固化胶层固定所述基板与所述封装盖板，所述干燥层与所述固化胶层之间设有围绕所述干燥层的环形凹槽；及
    封装胶层，设置于所述环形凹槽内。
  2. 如权利要求1所述的显示面板，其中，还包括邻接所述干燥层的透明填充层，所述透明填充层设于所述薄膜封装层与所述封装盖板之间。
  3. 如权利要求2所述的显示面板，其中，所述透明填充层的材料为树脂材料。
  4. 如权利要求1所述的显示面板，其中，所述封装胶层呈环型填充于所述环形凹槽内并围绕所述干燥层设置。
  5. 如权利要求1所述的显示面板，其中，所述封装胶层包括多个封装胶块，各所述封装胶块间隔设置于所述环形凹槽内。
  6. 如权利要求1所述的显示面板，其中，所述封装盖板上设有多个与所述环形凹槽连通的打印孔，各所述打印孔围绕所述薄膜封装层和所述干燥层所对应的区域间隔设置于所述环形凹槽的上方。
  7. 如权利要求6所述的显示面板，其中，各所述打印孔的直径为0.2 mm～1mm。
  8. 如权利要求1所述的显示面板，其中，所述干燥层的材料的树脂与碳酸钡的混合物或树脂与碳酸钙的混合物。
  9. 如权利要求1所述的显示面板，其中，所述封装胶层的材料为玻璃胶。
  10. 一种显示面板的制作方法，包括以下步骤：
    提供一基板，在所述基板上形成发光功能层；
    在所述基板和所述发光功能层上形成覆盖所述发光功能层的薄膜封装层；
    提供一封装盖板，在所述封装盖板上形成干燥层和固化胶层，其中，所述干燥层包括一用于容纳所述薄膜封装层的开口；所述固化胶层绕所述干燥层设置，且所述干燥层与所述固化胶层之间形成有围绕所述干燥层的环形凹槽；
    将所述基板与所述封装盖板对合，使所述薄膜封装层位于所述开口内，并通过所述固化胶层固定所述基板与所述封装盖板；及
    在所述环形凹槽内形成封装胶层。
  11. 如权利要求10所述显示面板的制作方法，其中，所述在所述环形凹槽内形成封装胶层包括：
    在所述封装盖板上形成多个与所述环形凹槽连通的打印孔，各所述打印孔围绕所述薄膜封装层和所述干燥层所对应的区域间隔设置于所述环形凹槽的上方；
    通过所述打印孔在所述环形凹槽内喷墨打印封装胶并固化形成封装胶层。
  12. 如权利要求11所述显示面板的制作方法，其中，采用激光打孔的方式在所述封装盖板上形成多个与所述环形凹槽连通的打印孔。
  13. 如权利要求10所述显示面板的制作方法，其中，在所述将所述基板与所述封装盖板对合之前，还包括：
    在所述薄膜封装层上形成透明填充层。
  14. 如权利要求13所述显示面板的制作方法，其中，通过喷墨打印或涂布的方式在所述薄膜封装层上形成所述透明填充层。
  15. 如权利要求10所述显示面板的制作方法，其中，采用真空蒸镀或喷墨打印的方式在所述基板上形成所述发光功能层。
  16. 如权利要求10所述显示面板的制作方法，其中，采用化学气相沉积的方式在所述基板和所述发光功能层上形成覆盖所述发光功能层的薄膜封装层。
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