WO2021106644A1 - Ｒｆｉｄタグ - Google Patents

Ｒｆｉｄタグ Download PDF

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Publication number
WO2021106644A1
WO2021106644A1 PCT/JP2020/042556 JP2020042556W WO2021106644A1 WO 2021106644 A1 WO2021106644 A1 WO 2021106644A1 JP 2020042556 W JP2020042556 W JP 2020042556W WO 2021106644 A1 WO2021106644 A1 WO 2021106644A1
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WO
WIPO (PCT)
Prior art keywords
substrate
conductor
rfid tag
wiring
rfid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2020/042556
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
周一 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to US17/779,621 priority Critical patent/US11748591B2/en
Priority to CN202080081649.4A priority patent/CN114730365A/zh
Priority to EP20894566.7A priority patent/EP4068159A4/en
Priority to JP2021561310A priority patent/JP7366148B2/ja
Publication of WO2021106644A1 publication Critical patent/WO2021106644A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07756—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being non-galvanic, e.g. capacitive
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07788—Antenna details the antenna being of the capacitive type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0421—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with a shorting wall or a shorting pin at one end of the element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/055—Folded back on itself
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment

Definitions

  • This disclosure relates to RFID (radio frequency identifier) tags.
  • an RFID tag in which an RFID IC (Integrated Circuit) is mounted on a ceramic sintered substrate including an antenna conductor (see International Publication No. 2018/016624).
  • the antenna conductor includes a plurality of laminated conductors.
  • the RFID tag of the present disclosure is RFID IC and A flexible substrate containing the first wiring conductor, A rigid substrate including the second wiring conductor, With The substrate surface of the flexible substrate includes a first region coupled to the rigid substrate and a second region including the opposite surface that is not coupled to the rigid substrate.
  • the first conductor portion and the second conductor portion included in the first wiring conductor are electrically connected via the second wiring conductor, and the first conductor portion and the second conductor portion are electrically connected via the second wiring conductor.
  • the RFID IC is connected to the first wiring conductor, the second wiring conductor, or both.
  • FIG. 1 is an exploded perspective view showing an RFID tag according to the first embodiment of the present disclosure.
  • FIG. 2 is an exploded perspective view of the RFID tag of FIG. 1 as viewed from diagonally below.
  • FIG. 3 is a schematic view showing a cross section taken along the line AA of FIG.
  • FIG. 4 is a diagram showing an equivalent circuit of the RFID tag of FIG.
  • the RFID tag 1 of the first embodiment of the present disclosure includes a first substrate 10 including wiring conductors (11, 12, 13a to 13d, 14a to 14d) and having flexibility, and wiring conductors (21, 21n, 22, 23a).
  • the third substrate 30 and the fourth substrate 40 are arranged between the first substrate 10 and the second substrate 20, and the third substrate 30 and the fourth substrate 40 are separated from each other.
  • the third substrate 30 and the fourth substrate 40 may be arranged on one side and the other side in one of the directions along the substrate surface 10A of the first substrate 10.
  • the side on which the third substrate 30 is arranged is referred to as a short-circuit side
  • the side on which the fourth substrate 40 is arranged is referred to as an anti-short-circuit side.
  • the direction from the second substrate 20 side to the first substrate 10 side is the height direction
  • the direction along the short-circuit side and the anti-short-circuit side is the first direction
  • the short-circuit side to the anti-short circuit side is the first direction. It will be described as two directions.
  • the third substrate 30 and the fourth substrate 40 are separated from each other in the second direction, and are arranged on one side (which may be one end) and the other (which may be the other end) in the second direction, respectively. ..
  • the first substrate 10 and the second substrate 20 and the wiring conductors included therein correspond to examples of the "flexible substrate” and the “first wiring conductor” according to the present disclosure, respectively.
  • the third substrate 30 and the fourth substrate 40 and the wiring conductors included therein correspond to an example of the "rigid substrate” and the "second wiring conductor” according to the present disclosure.
  • the first substrate 10 and the second substrate 20 are, for example, FPCs (Flexible Printed Circuits), and may be in the form of a film or a strip. Polyimide or the like may be applied as the substrate of the FPC.
  • the substrate has outer substrate surfaces 10A and 20A and inner substrate surfaces 10B and 20B, respectively. The inside means the side where the first substrate 10 and the second substrate 20 face each other, and the outside means the side opposite to the opposite side.
  • Membrane-like wiring conductors (11, 12, 21, 21n, 22) are located on the inner and outer substrate surfaces 10A, 10B, 20A, and 20B.
  • the wiring conductors (11, 12, 21, 21n, 22) may be covered with an insulating protective film except for a portion connected to other wiring.
  • the wiring conductor of the first substrate 10 includes an outer planar conductor 11, an inner wiring conductor 12, and via conductors 13a to 13d and 14a to 14d located in through holes between the substrate surfaces 10A and 10B.
  • One of the via conductors 13a to 13d is located on the short-circuit side of the center of the planar conductor 11.
  • the other via conductors 14a to 14d are located on the anti-short circuit side of the center of the planar conductor 11.
  • the planar conductor 11 and the wiring conductor 12 extend from the short-circuit side to the anti-short-circuit side.
  • the width of the wiring conductor 12 is narrower in the lateral direction than that of the planar conductor 11.
  • the wiring conductor 12 is divided at the center, and one of the divided wiring conductors 12 and the other are connected to two terminals of the RFID IC80, respectively.
  • the wiring conductors of the second substrate 20 include an outer planar conductor 22, a planar capacitive conductor 21 located inside, and a capacitive wiring portion 21n continuous with the capacitive conductor 21 on the inner substrate surface 20B.
  • the via conductors 23a to 23d located in the through holes between the substrate surfaces 20A and 20B and 24n are included.
  • the via conductors 23a to 23d are located on the short-circuit side of the center of the second substrate 20.
  • the via conductor 24n is located on the anti-short circuit side of the center of the second substrate 20.
  • the capacitive conductor 21 extends from the anti-short circuit side of the substrate surface 20B to the vicinity of the via conductors 23a to 23d.
  • the capacitive conductor 21 has substantially the same width as the planar conductors 11 and 22.
  • the capacitance wiring portion 21n has a width narrower than that of the capacitance conductor 21, and extends from a part of the short-circuit side of the capacitance conductor 21 to the short-circuit side of the substrate surface 20B.
  • the third substrate 30 and the fourth substrate 40 have a substrate that is harder than the first substrate 10 and the second substrate 20.
  • the third substrate 30 and the fourth substrate 40 may be, for example, a printed wiring board in which a wiring conductor is provided on a substrate containing an epoxy resin.
  • the third substrate 30 may be long in the first direction, and the length in the first direction may substantially coincide with the side of the first substrate 10 and the second substrate 20 on the anti-short circuit side.
  • the fourth substrate 40 may be long in the first direction, and the length in the first direction may substantially coincide with the short-circuited side of the first substrate 10 and the second substrate 20.
  • the wiring conductor of the third substrate 30 is located at the substrate surface 30A (corresponding to the first surface), the substrate surface 30B on the opposite side (corresponding to the second surface), and the through hole between the two substrate surfaces 30A and 30B. It has via conductors 31a to 31d and 31n. The plurality of via conductors 31a to 31d and 31n may be arranged in the first direction.
  • the wiring conductor of the fourth substrate 40 is located at the substrate surface 40A (corresponding to the first surface), the substrate surface 40B (corresponding to the second surface) on the opposite side, and the through hole between the two substrate surfaces 40A and 40B. It has via conductors 41a to 41d and 41n. The plurality of via conductors 41a to 41d and 41n may be arranged in the first direction.
  • the upper substrate surfaces 30A and 40A are coupled to the first substrate 10, and the lower substrate surfaces 30B and 40B are coupled to the second substrate 20.
  • the connection may be a method in which the wiring conductors are fixed to each other via solder or a conductive adhesive, or a method in which the wiring conductors are electrically connected to each other and the surrounding insulating portions are joined.
  • the third substrate 30 may be coupled along the short-circuit side side of the first substrate 10 and the second substrate 20.
  • the fourth substrate 40 may be coupled along the anti-short-circuit side side of the first substrate 10 and the second substrate 20.
  • the first substrate 10 and the second substrate 20 include regions A1 and A2 (corresponding to the first region according to the present disclosure) to which the third substrate 30 and the fourth substrate 40 are bonded, and the third substrate 30 and the fourth substrate 40.
  • the flexibility of the regions A1 and A2 is limited by the third substrate 30 and the fourth substrate 40, but the flexibility of the region B is maintained.
  • the via conductors 13a to 13d of the first substrate 10 pass through the via conductors 31a to 31d of the third substrate 30 and the via conductors 23a of the second substrate 20. It is electrically connected to ⁇ 23d. Further, the via conductors 14a to 14d of the first substrate 10 are connected to the via conductors 41a to 41d of the fourth substrate 40, and the via conductor 24n of the second substrate 20 is connected to the via conductor 41n of the fourth substrate 40.
  • the planar conductor 11 and the planar conductor 22 are short-circuited via the via conductors 13a to 13d, 31a to 31d, and 23a to 23d on the short-circuit side.
  • one end of the wiring conductor 12 and one end of the capacitance wiring portion 21n of the capacitance conductor 21 are electrically connected via the via conductor 31n.
  • the planar conductor 11 and the capacitive conductor 21 are electrically connected via the via conductors 14a to 14d and 41a to 41d, and one end of the wiring conductor 12 and the planar conductor 22 are via conductors. It is electrically connected via 41n and 24n.
  • the planar conductor 11 or the wiring conductor 12 corresponds to an example of the "first conductor portion" according to the present disclosure
  • the capacitive conductor 21 or the planar conductor 22 corresponds to an example of the "second conductor portion" according to the present disclosure. ..
  • the RFID IC80 uses the wiring conductors of the first substrate 10 to the fourth substrate 40 as an antenna, and performs wireless communication and power reception with a reader / writer using radio waves in the UHF (Ultra High Frequency) band, for example.
  • the RFID IC80 is joined to the inside in the region B of the first substrate 10 and is protected from impact from the outside world and the like.
  • the outer surface of the second substrate 20 is a surface to be attached to the mating member to which the RFID tag 1 is attached, and an adhesive sheet may be attached thereto.
  • planar conductors 11 and 22 and the planar capacitive conductor 21 are formed on the substrate surface 10A by the connection of the first substrate 10 to the fourth substrate 40 and the connection of the wiring conductors as described above. They are laminated in an arrangement that overlaps 10B, 20A, and 20B when viewed from the direction perpendicular to the direction.
  • the wiring conductors of the first substrate 10 to the fourth substrate 40 are connected to the RFID IC80 to form a plate-shaped inverted-F antenna including the capacitance C1.
  • the planar conductor 11 and the planar conductor 22 function as a radiation conductor and a ground conductor of a plate-shaped inverted F-type antenna, and the planar conductor 11 which is a radiation conductor is a via conductor 13a to 13d, 23a to 23d, 31a to 31d. Is short-circuited to the planar conductor 22 which is a ground conductor.
  • the capacitance conductor 21 and the planar conductor 22 function as the capacitance C1.
  • the signal terminal of the RFID IC80 is connected to the feeding point N1 of the planar conductor 11 which is a radiating conductor via the wiring conductor 12 and the capacitive conductor 21.
  • the mounting surface of the RFID tag 1 (the outer surface of the second substrate 20) maintains flexibility in the region B, the surface to which the RFID tag 1 is mounted does not have a constant bending object, curved surface, or shape. Even so, the RFID tag 1 can be flexed and attached along the mating surface. Further, when the second substrate 20 bends along the mating surface, the deforming force may be transmitted to the first substrate 10 on the side opposite to the mounting surface. However, even in this case, since the first substrate 10 has flexibility in the region B, the first substrate 10 is appropriately deformed in response to this force, so that a large stress is generated in any part of the RFID tag 1. The RFID tag 1 can be stably fixed to the mating surface without the need for it.
  • the flexible first substrate 10 and the second substrate 20 are coupled to the third substrate 30 and the fourth substrate 40 including the outer surface. Includes the non-existing area B. Therefore, the flexibility of the RFID tag 1 is obtained in the region B, and the RFID 1 can be attached to an object, a curved surface, or a surface whose shape is not constant through the region B. Further, by providing the third substrate 30 and the fourth substrate 40 having rigidity, it is possible to prevent the distance between the radial conductor and the planar conductors 11 and 22 functioning as the ground conductor from being significantly changed. Therefore, even if it is flexible, the structure of the antenna in which a plurality of conductors are laminated is maintained. The antenna on which the conductors are laminated makes it possible to reduce the size of the RFID tag 1 including the antenna, and the antenna characteristics can be improved by maintaining the structure of the antenna.
  • a means for stacking a large number of flexible sheet wiring boards and forming an antenna with wiring conductors of each sheet wiring board is provided on each of a large number of sheet wiring boards, and wiring extending in the height direction is configured by connecting the via conductors of a plurality of sheet wiring boards. With such a via conductor, when the sheet wiring board is bent, stress is applied to each part of the via conductor.
  • the wiring conductor extending in the height direction is included in the rigid third substrate 30 and the fourth substrate 40.
  • the first substrate 10 and the second substrate 20 having two flexibility and the third substrate 30 and the fourth substrate 40 having two rigidity are provided.
  • the third substrate 30 is located between the first substrate 10 and the second substrate 20
  • the fourth substrate 40 is located between the first substrate 10 and the second substrate 20 apart from the third substrate. To do. Therefore, the third substrate 30 and the fourth substrate 40 make it easy to maintain the distance between the first substrate 10 and the second substrate 20.
  • the flexibility of the first substrate 10 and the second substrate 20 is exhibited in the region B where the third substrate 30 and the fourth substrate 40 are not bonded. Stable attachment of the RFID tag 1 can be realized even on a curved surface.
  • the RFID IC80 is joined to the inner surface (the surface on the second substrate 20 side) of the first substrate 10. According to this configuration, the RFID IC80 can be protected against impacts from the outside world, and the reliability of the RFID tag 1 can be further improved.
  • the planar conductors 11 and 22 included in the first substrate 10 and the second substrate 20 constitute a radiation conductor and a ground conductor of the plate-shaped inverted F antenna.
  • the planar conductors 11 and 22 overlap each other when viewed from the direction (height direction) from the substrate surface 30A of the third substrate 30 toward the opposite substrate surface 30B, and the via conductors 31a to the third substrate 30 It is short-circuited via 31d.
  • the plate-shaped inverted-F antenna having such a structure, it is possible to reduce the size of the RFID tag 1 and improve the antenna characteristics.
  • the second substrate 20 includes the capacitive conductor 21, and when viewed from the height direction, the radial conductor (plane conductor 11) and the ground conductor (plane conductor 22) The capacitive conductor 21 overlaps with the capacitance conductor 21.
  • the capacitive plate-shaped inverted-F antenna having such a structure makes it possible to further reduce the size of the RFID tag 1 and improve the antenna characteristics.
  • FIG. 5 is a cross-sectional view showing an RFID tag according to the second embodiment of the present disclosure. Since the RFID tag 1A of the second embodiment has flexibility in the region B as in the first embodiment, it can be attached to a flexible object, a curved surface, or a surface having a non-constant shape.
  • the RFID tag 1A of the second embodiment is an example in which the second substrate 20 is thicker than the first substrate 10. Specifically, the substrate 28 of the second substrate 20 may be thicker than the substrate 18 of the first substrate 10. When the second substrate 20 is attached to a curved surface, the relative angle between the third substrate 30 and the fourth substrate 40 opens and closes. Therefore, the amount of deflection of the first substrate 10 may be larger than that of the second substrate 20. According to the RFID tag 1A of the second embodiment, the substrate 18 of the first substrate 10 is thinned, and the first substrate 10 is more easily bent than the second substrate 20, so that the RFID tag is stable even in the above case. 1 can be attached.
  • FIG. 6 is a cross-sectional view showing an RFID tag according to the third embodiment of the present disclosure. Since the RFID tag 1B of the third embodiment has flexibility in the region B as in the first embodiment, it can be attached to a flexible object, a curved surface, or a surface having a non-constant shape.
  • the RFID tag 1B according to the third embodiment is an example in which the second substrate 20 is thinner than the first substrate 10. Specifically, the substrate 28 of the second substrate 20 may be thinner than the substrate 18 of the first substrate 10.
  • the base 28 of the second substrate 20 is an insulator (dielectric) arranged between the planar conductor 22 that functions as a ground conductor and the inner capacitive conductor 21, and by making the base 28 thinner, these The volume component between can be increased. Therefore, according to the RFID tag 1B of the third embodiment, the capacitance component of the antenna is increased by selecting different thicknesses of the substrate 18 of the first substrate 10 and the substrate 28 of the second substrate 20, and the RFID tag 1B is used. The antenna can be made smaller without deteriorating the antenna characteristics.
  • the bases 18 are included in the interposition without changing the thicknesses of the bases 18 and 28.
  • the value of the volume component can be changed.
  • the capacitance component can be increased and the plate-shaped inverted-F antenna with capacitance can be miniaturized.
  • the relative permittivity of the substrate can be appropriately adjusted by selecting the material of the substrate or increasing or decreasing the material density of the substrate.
  • FIG. 7 is a cross-sectional view showing an RFID tag according to the fourth embodiment of the present disclosure. Since the RFID tag 1C of the fourth embodiment has flexibility in the region B as in the first embodiment, it can be attached to a flexible object, a curved surface, or a surface having a non-constant shape.
  • the RFID tag 1C according to the fourth embodiment is an example in which the widths (lengths along the second direction) of the third substrate 30 and the fourth substrate 40 are different. Since the substrate 38 of the third substrate 30 and the substrate 48 of the fourth substrate 40 have a large relative permittivity, the electric charges appearing on the wiring conductors of the first substrate 10 and the second substrate 20 can be made constant by changing their widths. Even if this is the case, the strength of the electric field emitted to the outside changes. Therefore, the degree of freedom in designing the antenna characteristics of the RFID tag 1C can be improved by selecting different widths of the third substrate 30 and the fourth substrate 40.
  • the electric field strength radiated to the outside is increased by increasing the width of the fourth substrate 40 on the anti-short circuit side in which a large amount of electric charge appears among the planar conductors 11 and 22 and the capacitive conductor 21. Can be increased to improve the antenna gain. Further, by increasing the dielectric constant on the anti-short circuit side, the effect of shortening the wavelength of the radio wave can be obtained, and the RFID tag 1C can be further miniaturized.
  • the anti-short circuit side may be referred to as the open end side of the planar conductor (radiating conductor) 11.
  • the relative permittivity of the substrate 48 of the fourth substrate 40 By making the relative permittivity of the substrate 48 of the fourth substrate 40 larger than the relative permittivity of the substrate 38 of the third substrate 30, the electric field strength radiated to the outside without changing the widths of the substrates 38 and 48.
  • the antenna gain can be improved, and the RFID tag can be further miniaturized.
  • the flexible region B By not increasing the width of the substrate 48 as in the above configuration, the flexible region B does not become small and the overall flexibility does not decrease.
  • FIG. 8 is an exploded perspective view showing the RFID tag according to the fifth embodiment of the present disclosure.
  • the RFID tag 1D according to the fifth embodiment has notches 16a to 16d (corresponding to the first notch) at the four corners of the first substrate 10.
  • the third substrate 30 and the fourth substrate 40 have engaging portions (for example, protrusions) 35a, 35b, 45c, 45d that engage with the notches 16a to 16d at positions corresponding to the notches 16a to 16d.
  • the notches 16a to 16d are engaged with the engaging portions 35a, 35b, 45c, 45d.
  • the first substrate 10 can be easily positioned. Further, since the four corners of the flexible first substrate 10 are removed, the first substrate 10 is turned up from the corners during use of the RFID tag 1D, and the first substrate 10 is bonded. Can be suppressed from being unraveled. Further, in the dicing process included in the manufacturing process described later, it is possible to prevent the first substrate 10 from being turned up from the corners and breaking the bond between the first substrate 10 and the third substrate 30 and the fourth substrate 40. it can.
  • the four corners of the second substrate 20 also have notches (corresponding to the first notches), and the third substrate 30 and the fourth substrate 40 have engaging portions that engage with the notches of the second substrate 20. You may be doing it. With this configuration, the second substrate 20 can be easily positioned when the second substrate 20 is coupled to the third substrate 30 and the fourth substrate 40, and it is possible to prevent the corners of the second substrate 20 from being turned up in a dicing process or the like. it can.
  • FIG. 9 is an exploded perspective view showing the RFID tag according to the sixth embodiment of the present disclosure.
  • the first substrate 10 and the second substrate 20 have notches 16a to 16d and 26a to 26d (corresponding to the first notch) at the four corners.
  • the third substrate 30 and the fourth substrate 40 have notches 36a, 36b, 46c, 46d (second notches) extending in the height direction at locations corresponding to the four corners of the first substrate 10 and the second substrate 20. Equivalent to).
  • the notches 16a to 16d, 36a, 36b, 46c, 46d, and 26a to 26d may be arranged so that the edges of the notches have the same shape and the same size when viewed from the height direction.
  • an alignment jig is arranged in the notch portion to align the first substrate 10. It can be carried out. Further, when the joining step of the second substrate 20 is included, the alignment of the second substrate 20 can be performed in the same manner.
  • the first substrate 10 and the second substrate 20 are turned up from the corners during use of the RFID tag 1E or the like. Therefore, it is possible to prevent the first substrate 10 and the second substrate 20 from being unbonded. Further, in the dicing step included in the manufacturing process described later, the first substrate 10 and the second substrate 20 are turned up from the corners to form the first substrate 10, the second substrate 20, the third substrate 30, and the fourth substrate 40. It is possible to prevent the bond between the two from being broken.
  • FIG. 10 is a diagram illustrating a part of the RFID tag manufacturing process according to the embodiment. Subsequently, an example of the manufacturing method of the RFID tag 1 of the first embodiment will be described, but the following manufacturing method can be similarly adopted for the RFID tags 1A to 1F of the seventh embodiment described later from the second embodiment.
  • the method for manufacturing the RFID tag 1 according to the first embodiment is joined to the step J1 for joining the array substrates 110R and 120R in which the components of the plurality of RFID tags 1 are arranged in a matrix.
  • the dicing step J2 for cutting the array substrates 110R and 120R is included.
  • the array substrate 110R is a flexible substrate in which a plurality of first substrates 10 are arranged vertically and horizontally (for example, 3 rows and 3 columns). A plurality of RFID ICs 80 are mounted on the array substrate 110R.
  • the array substrate 120R is a hybrid substrate in which a rigid substrate 122 is integrally formed on a flexible substrate 121 in which a plurality of second substrates 20 are arranged vertically and horizontally.
  • the rigid substrate 122 has a plurality of penetrations corresponding to a portion including a plurality of sets of portions to be the third substrate 30 and the fourth substrate 40, a margin portion, and a gap portion between the third substrate 30 and the fourth substrate 40.
  • the through hole 122h may be formed so as to be continuous over a plurality of sets of parts arranged in the lateral direction.
  • the array board 110R and the array board 120R are joined.
  • the joining points are the upper surface of the portion to be the third substrate 30 and the fourth substrate 40 included in the array substrate 120R, and the lower surface of the corresponding portion of the array substrate 110R.
  • the joining may be a method in which the wiring conductors are fixed to each other via solder or a conductive adhesive, or a method in which the wiring conductors are electrically connected to each other and the surrounding insulating portions are joined.
  • the joined array substrates 110R and 120R are cut along the dividing lines D1 and D2.
  • the dividing line D1 is a line along the short-circuited edge and the anti-short-circuited edge of each RFID tag 1.
  • the dividing line D2 is a line along the edge extending in the longitudinal direction of the wiring conductor 12 of the RFID tag 1, and is a line passing through the through hole 122h.
  • a plurality of RFID tags 1 are divided and manufactured by the dicing step J2.
  • the configurations of the fifth and sixth embodiments are adopted.
  • the turning up can be suppressed.
  • the array substrate 110R has through holes as notches 16a to 16d at the intersections of the dividing lines D1 and D2, that is, at the corners of the individual RFID tags 1.
  • the flexible substrate 121 of the array substrate 120R may have the same through holes in the same arrangement.
  • the rigid substrate 122 of the array substrate 120R has protrusions that serve as engaging portions 35a, 35b, 45c, and 45d at the intersections of the dividing lines D1 and D2, that is, at the corners of the individual RFID tags 1.
  • the array substrate 110R and the array substrate 120R have notches 16a to 16d, 26a to 26d, 36a, 36b at the intersections of the dividing lines D1 and D2, that is, the corners of the individual RFID tags 1. , 46c, 46d.
  • FIG. 11 is an exploded perspective view showing the RFID tag according to the seventh embodiment of the present disclosure.
  • the rigid third substrate 30 or the fourth substrate 40 has one or more slits 34 and 44.
  • the slits 34 and 44 extend in the lateral direction of the regions A1 and A2.
  • the slits 34 and 44 have an open side end on the surface facing the first substrate 10, but may have an open side end on the surface facing the second substrate 20. Both sides may have open ends.
  • the slits on one surface and the slits on the other surface may be offset in the first direction, or may be in the same positions in the first direction.
  • the total depth (length in the height direction) of the slits on one surface and the slits on the other surface is greater than the height of the third substrate 30 or the fourth substrate 40. Is also shortened.
  • the depth of the slit on one surface and the slit on the other surface may both be less than half the height of the third substrate 30 or the fourth substrate 40.
  • the third substrate 30 or the fourth substrate 40 is divided into a plurality of portions at the slit portion, that is, the third substrate 30 or the fourth substrate 40 is formed in the longitudinal direction of the regions A1 and A2. A configuration that is divided into a plurality of parts may be adopted.
  • the RFID tag 1F of the seventh embodiment it is possible to bend the third substrate 30 or the fourth substrate 40 along a surface having a curvature in the longitudinal direction. Therefore, even if the mating surface to which the RFID tag 1F is attached is a curved surface having curvatures in two directions orthogonal to each other, the RFID tag 1F can be attached stably.
  • FIG. 12 is a cross-sectional view showing an RFID tag according to the eighth embodiment of the present disclosure.
  • the RFID tag 1G of the eighth embodiment includes a fifth substrate 50 including wiring conductors 51, 52, 53, 54, 55a to 55d and having flexibility, and a sixth substrate including wiring conductors 61a to 61d and 61n and having rigidity. 60 and. The direction from one substrate surface 60B (corresponding to the first surface) to the other substrate surface 60A (corresponding to the second surface) of the sixth substrate 60 will be described as upward.
  • the fifth substrate 50 corresponds to an example of the "flexible substrate” according to the present disclosure.
  • the sixth substrate 60 corresponds to an example of the “rigid substrate” according to the present disclosure.
  • the fifth substrate 50 is bent in a C shape, the region A11 at one end in the longitudinal direction is coupled to the substrate surface 60A of the sixth substrate 60, and the region A12 at the other end in the longitudinal direction is on the opposite side of the sixth substrate 60. It is coupled to the substrate surface 60B of.
  • the region B10 other than one end and the other end in the longitudinal direction of the fifth substrate 50 is not coupled to the sixth substrate 60, and the flexibility is maintained.
  • Areas A11 and A12 correspond to the first area according to the present disclosure
  • area B10 corresponds to the second area according to the present disclosure.
  • the wiring conductor of the upper portion 50U of the fifth substrate 50 bent in a C shape may have the same pattern as the wiring conductor included in the first substrate 10 of FIG.
  • An RFID IC80 is mounted inside the upper 50U.
  • the wiring conductor of the lower portion 50D of the fifth substrate 50 may have the same pattern as the wiring conductor included in the second substrate 20 of FIG.
  • the wiring conductor of the side portion 50S connecting the upper portion 50U and the lower portion 50D of the fifth substrate 50 may have the same pattern as the wiring conductor included in the fourth substrate 40 of FIG.
  • As the wiring conductor of the side portion 50S a linear or band-shaped conductor located on one surface and the other surface of the flexible substrate 58 may be adopted instead of the form of a via conductor.
  • the flexible fifth substrate 50 and the rigid sixth substrate 60 have notches 16a and 16b and engaging portions 35a and 35b shown in the fifth embodiment.
  • the same components as in may be applied.
  • the same components as the notches 16a, 16b, 36a, 36b, 26a, 26b shown in the sixth embodiment may be applied.
  • elements similar to the slit 34 or division configuration shown in the seventh embodiment may be applied.
  • a spacer having no wiring conductor may be arranged inside the side portion 50S of the fifth substrate 50, and a configuration may be adopted in which the gap between the upper portion 50U and the lower portion 50D is maintained also in the side portion 50S. ..
  • the fifth substrate 50 since the fifth substrate 50 has flexibility, the fifth substrate 50 is attached even if the object to which the RFID tag 1G is attached is a flexible object, a curved surface, or a surface whose shape is not constant. By bending and attaching the lower part 50D along the mating surface, stable attachment of the RFID tag 1G can be realized. Further, the rigid sixth substrate 60 is coupled to the fifth substrate 50, and the wiring conductor of the sixth substrate 60 and the wiring conductor of the fifth substrate 50 are connected to form an antenna, whereby the sixth substrate 60 is formed. As a result, two or more wiring conductors included in the antenna can be separated from each other at regular intervals. With this configuration, for example, a plate-shaped inverted-F antenna or a capacitive plate-shaped inverted-F antenna can be configured, and the antenna can be miniaturized and its characteristics can be improved.
  • the RFID tag of the present disclosure is not limited to the above embodiment.
  • a capacitive plate-shaped inverted-F antenna is applied as the antenna included in the RFID tag is shown, but the type of the antenna is not limited to this.
  • a plate-shaped inverted-F antenna having no capacitance may be applied, or the capacitance conductor may be arranged on the substrate surface 10B inside the first substrate 10.
  • the RFID IC 80 may be arranged on the substrate surface 20B inside the second substrate 20, or may be arranged on the third substrate 30 or the fourth substrate 40, and is included in the third substrate 30 or the fourth substrate 40. It may be connected to a wiring conductor.
  • the details shown in the embodiment can be appropriately changed without departing from the spirit of the invention.
  • This disclosure can be used for RFID tags.
  • 1, 1A to 1G RFID tag 10 1st substrate (flexible substrate) 20 Second substrate (flexible substrate) 30 Third substrate (rigid substrate) 40 Fourth substrate (rigid substrate) 10A, 10B, 20A, 20B, 30A, 30B, 40A, 40B Substrate surface A1, A2 area (first area) Area B (2nd area) 11, 22 Planar conductors 12 Wiring conductors 13a to 13d, 14a to 14d Via conductors 16a to 16d, 26a to 26d Notches 18, 28, 38, 48, 58 Base 21 Capacitive conductors 31a to 31d, 31n, 41a to 41d , 41n Via conductors 34, 44 Slits 35a, 35b, 45c, 45d Engagement parts 36a, 36b, 46c, 46d Notch 80 RFID IC 50 Fifth substrate (flexible substrate) 60 6th substrate (rigid substrate) 60A, 60B Substrate surface 51-54, 55a-55d, 61a-61d, 61n Wiring

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  • General Physics & Mathematics (AREA)
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PCT/JP2020/042556 2019-11-26 2020-11-16 Ｒｆｉｄタグ Ceased WO2021106644A1 (ja)

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US17/779,621 US11748591B2 (en) 2019-11-26 2020-11-16 RFID tag
CN202080081649.4A CN114730365A (zh) 2019-11-26 2020-11-16 Rfid标签
EP20894566.7A EP4068159A4 (en) 2019-11-26 2020-11-16 Rfid tag
JP2021561310A JP7366148B2 (ja) 2019-11-26 2020-11-16 Ｒｆｉｄタグ

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US11748591B2 (en) 2023-09-05
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EP4068159A1 (en) 2022-10-05
JPWO2021106644A1 (https=) 2021-06-03
JP7366148B2 (ja) 2023-10-20

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