WO2021104328A1

WO2021104328A1 - Method for manufacturing pointing device

Info

Publication number: WO2021104328A1
Application number: PCT/CN2020/131568
Authority: WO
Inventors: 李明; 许文龙; 林懋瑜; 郝瑶
Original assignee: 深圳市汇创达科技股份有限公司
Priority date: 2019-11-29
Filing date: 2020-11-25
Publication date: 2021-06-03
Also published as: CN112083822A; CN112083822B

Abstract

A method for manufacturing a pointing device, comprising: providing a fitting surface positioning groove structure at the bottom of a stress-strain-deformation portion (110); and binding the stress-strain-deformation portion provided with the fitting surface positioning groove structure with a flexible circuit substrate by means of an adhesive fitting layer having high stress conductivity (120); in the curing process of binding the stress-strain-deformation portion provided with the fitting surface positioning groove structure with the flexible circuit substrate, the stress-strain-deformation portion is bound and cured with the flexible circuit substrate by means of a pressure maintaining fixture. The present invention solves the problem that changes of characteristics of components before and after embedding may be caused by the usage of an embedding manner, so that there are many test processes and subsequent adjustment cannot be made; furthermore, the present invention solves the problem that production apparatuses of such sensors are highly demanding and such sensors have a large number of test processes and test component fine-adjustment processes, resulting in the dispersion of products and increased processing costs.

Description

Method for manufacturing pointing device

Technical field

The invention relates to the technical field of resistance strain gauge sensors, and in particular to a method of manufacturing a pointing device.

Background technique

At present, resistive strain gauge sensors have been gradually applied to various electronic devices as pointing devices, involving electronic devices such as notebook computers, mice, keyboards, handheld devices or joysticks. You can see the resistive strain gauge sensors in the above An application that can provide an input function in an electronic device. A resistance strain gauge sensor is often installed between the keyboard keys of a common notebook computer near the center. The user only needs to touch the sensor with a finger, and it can sense the user's dial force and dial force. The direction of movement, which in turn causes the cursor on the screen to produce a corresponding displacement action.

The existing resistive strain gauge sensor mainly includes: a housing, an action part housed in the shell, and a detection assembly that detects the deformation of the action part. The action part is formed by an operation part, a fixing part and a deformation part. , And the deforming portion is deformable due to the operating force acting on the operating portion, and the detecting assembly is provided on the deforming portion, the fixing portion is fixed in the housing, and the operating portion and the deforming portion can be Activities in the above shell. The action part of the input device is fixed inside the housing, and the housing is mounted on the board of the keyboard device or the like. Therefore, when the operating force acts on the operating portion of the action portion and deformation is applied to the deformed portion, the housing is unlikely to fall off the substrate or the like. The design of this type of resistance strain gauge sensor is mainly to combine the deformed part with the detecting component in a fitting manner or to directly set the detecting component on the deformed part. However, the mating method will cause the characteristics of each component before and after mating to be changed, and there are many inspection procedures and subsequent adjustments cannot be made; due to the simultaneous occurrence of multiple quality variables during the mating, including the inconsistent force of the deformed part, the mating The micro-deformation caused by the process, the mutual influence generated during the mating process of the detection component and the deformed part; due to the processing characteristics of the mating method, the processing steps are too many, it is difficult to continue the calibration after the assembly, and the high cost is not conducive to product application and promotion. ; Moreover, this type of sensor has extremely high requirements for production equipment and has a large number of detection and fine-tuning procedures for detection components, resulting in product discreteness and increased processing costs.

Therefore, a new technical solution for manufacturing pointing devices is currently needed to solve the above-mentioned problems.

Summary of the invention

The main purpose of this application is to provide a method of manufacturing a pointing device, which solves the problem that in the current manufacturing process of the pointing device, the characteristics of each component before and after the fitting may change due to the use of the fitting method, and there are many inspection procedures and Subsequent adjustments cannot be made; and multiple quality variables appear at the same time during mating, including inconsistent forces on the deformed part, micro-deformation caused by the mating process, and mutual influence during the mating process of the detection component and the deformed part; simultaneous mating method processing Due to its characteristics, there are many processing steps, and it is difficult to perform calibration after assembly. The high cost is not conducive to product application and promotion; and this type of sensor has extremely high requirements on production equipment and has a large number of inspections and fine-tuning procedures for the detection components, resulting in products Discreteness and increased processing costs.

In order to solve the above-mentioned problems, the present application provides a method for manufacturing a pointing device, which includes: arranging a fitting surface positioning groove structure at the bottom of the strained and deformed portion;

Join the stress and strain deformation part provided with the positioning groove structure of the bonding surface and the flexible circuit substrate through the bonding layer with high stress conductivity;

During the curing process of bonding the stressed and deformed part with the positioning groove structure of the bonding surface to the flexible circuit board, the pressure-holding jig is used to bond and solidify the stressed and strained part and the flexible circuit substrate. , Where the temperature is set to be greater than or equal to 20 degrees Celsius and less than or equal to 30 degrees Celsius, the relative humidity is set to be greater than or equal to 30% and less than or equal to 70%, and the curing pressure holding force is set to be greater than or equal to 5.0 Newtons, and the pressure is fixed The time is not less than 5 minutes;

When the stress and strain deformation part with the bonding surface positioning groove structure completes the bonding and curing operation of the flexible circuit board, the bonding surface of the flexible circuit substrate and the force and strain deformation part is completely embedded in the bonding surface of the force and strain deformation part Positioning in the groove structure.

Compared with the prior art, using the present invention, the stress-strained deformation portion provided with the positioning groove structure of the bonding surface is bonded and solidified with the flexible circuit substrate through the bondable bonding layer with high stress conductivity. It avoids the shortcomings of the previous fitting process, reduces the process, reduces the discreteness of the product, and stabilizes the components after joining, improves the production efficiency, and reduces the processing cost at the same time.

Brief description of the drawings

FIG. 1 is a schematic flowchart of a specific implementation of a method for manufacturing a pointing device according to an embodiment of the application;

2 and 3 are structural schematic diagrams of the upright arrangement and the inverted arrangement of the force-strained deformation part provided by the embodiments of the application;

4, 5, and 6 are schematic diagrams of the front cross-section, the side cross-section, and the bottom cross-section of the force-strained deformation portion provided by the embodiments of the application;

FIG. 7 is a schematic structural diagram of a flexible circuit substrate provided by an embodiment of the application;

8 and 9 are schematic diagrams of the front cross-section and the bottom cross-section of the flexible circuit substrate provided by the embodiments of the application.

Preferred embodiment of the present invention

The present invention will be further described below in conjunction with the drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of this application.

Fig. 1 is a method for manufacturing a pointing device provided by an exemplary embodiment, which specifically includes the following steps:

Step 110: A fitting surface positioning groove structure is provided at the bottom of the force-strained deformation part;

As shown in Figures 2 and 3, it also includes: the force-strained deformation portion 10 is configured as a cylindrical convex table structure, the bonding surface positioning groove 11 structure is provided at the bottom of the cylinder of the force-strained deformation portion, and the convex The platform is set at the center of the cylinder, and the boss can be a cube shape, of course, it can also be an approximate cube shape, for example: each corner is set to a cube in the form of radians, which is not limited in this application.

It also includes: a hollow structure hole 14 is also provided in the middle of the boss (the hollow structure can reduce the rigidity of the stress-strained deformation part, bring better contact pressure effect, and can improve the accuracy of control, and improve the user's Use experience; and due to the hollow structure, when a force is applied to the force-strained deformed part, the force will be dispersed to each part of the boss of the force-strained deformed part, the force-strained deformed part is not easy to fatigue, and can reduce the stress. The probability that the force-strain deformed part will be damaged); the hollow structure hole is a cylindrical hollow structure hole.

As shown in Figures 2 and 3, it also includes: a plurality of through holes 13 are provided on the cylinder of the force-strained deformation portion (the through holes are used to install through holes for assembling screws), and the multiple through holes 13 are evenly arranged On the cylinder (which can ensure the uniform stress of the assembled screws after installation), there can be 4 through holes, which are not limited in this application.

As shown in Figure 4, Figure 5 and Figure 6, the diameter of the cross section of the cylinder of the force-strained deformation portion is set to be greater than or equal to 7.0 mm and less than or equal to 25.0 mm.

The four through holes 1404 set on the stress and strain deformation part can use M1.8P0.2 screws. The four through holes correspond to the

horizontal spacing

1401, 1402, 1406, and 1407 to be set to be greater than or equal to 1.2mm and less than or equal to 10.0mm. It is convenient for the joint operation of the stressed and strained deformation part; the stressed columnar structure 1403 in the stressed and strained deformation part is set to a single side length greater than or equal to 1.2mm and less than or equal to 5.0mm; the stressed columnar structure in the stressed and strained deformation part Hollow structure aperture 1409 is set to a diameter greater than or equal to 0.2mm and less than or equal to 4.0mm; the

edge R angles

1411 and 1412 of the hollow structure in the force-bearing strain deformation part are set to be greater than or equal to 0.02mm and less than or equal to 2.20mm; The depth of the hollow structure of the stressed columnar structure in the strain-deformed part is set to 1413 greater than or equal to 0.3 mm and less than or equal to 8.2 mm.

The size and shape of the locating groove on the bonding surface provided on the bottom surface of the force-strained deformation part are composed of 1414, 1415, 1416, 1417, 1418, 1419, 1421, 1422, and 1423 in Figure 6, and the size of the locating groove on the bonding surface Compatible with the shape and size of the flexible circuit board, the depth of the positioning groove on the bonding surface is set to be greater than or equal to 0.02mm and less than or equal to 4.20mm. This depth can ensure that the narrow end of the flexible circuit board is placed on the receiving surface. The force-strain deformation part is easy to process and easy to assemble, which can reduce assembly errors and improve production efficiency.

The above-mentioned setting method is easy to process and convenient for assembly, which can reduce assembly errors and improve production efficiency.

Step 120: Join the stress-strained deformation portion provided with the bonding surface positioning groove structure and the flexible circuit substrate by bonding together through an adhesive bonding layer with high stress conductivity;

As shown in FIG. 3, the method further includes: setting the shape of the positioning groove of the bonding surface of the force-strained deformation portion to be adapted to the shape of the bonding surface of the flexible circuit substrate, and positioning holes are provided on the bonding surface of the flexible circuit substrate , The positioning groove 11 of the bonding surface of the force-strained deformation portion is correspondingly provided with a positioning column 12 that matches with the positioning hole.

It also includes: arranging at least two positioning pillars, and arranging a plurality of positioning pillars evenly arranged in the positioning groove 11 of the fitting surface of the force-strained deformation portion.

When the bottom surface of the deformed portion under stress and strain is joined to the flexible circuit substrate, it can be positioned by using two positioning posts. The positioning posts can easily set the flexible circuit substrate in the positioning groove of the bonding surface of the deformed part under stress and strain. Perform the bonding between the strain-deformed part and the flexible circuit board. The size of the positioning column is set to a diameter greater than or equal to 0.3 mm and less than or equal to 5.0 mm. In actual operation, the aforementioned size is convenient for positioning with the base and positioning of the flexible circuit board.

In actual tests, the material of the bondable layer with high stress conductivity can be a high-density, high-hardness, and high-modulus bonding material (for example: it can be a material with a stress conductivity of at least more than 2 Pa). Ensure that when the force is applied to the strain-deformed part, the force applied by the adhesive layer with high stress conductivity is transmitted to the flexible circuit board and the sensor on the flexible circuit board while reducing the loss as much as possible. Correspondingly, the feedback signal is obtained by collecting the change of the resistance value, and the sensor that collects the deformation amount through the resistance change has high accuracy and fast response speed, which brings a better user experience.

Wherein, the bonding of the stress and strain deformation portion provided with the bonding surface positioning groove structure and the flexible circuit substrate is a step of bonding the two together through an adhesive bonding layer with high stress conductivity, including: The stress and strain deformation part with the structure of the bonding surface positioning groove and the flexible circuit substrate are joined by a glue with high stress conductivity and a dispensing method (for example, using VISHAY's M-bond 200kit quick-drying glue for dispensing, This is a quick-drying glue based on silica gel), or a sheet-type double-sided tape with high stress conductivity to join the two together.

The step of joining the stress-strained deformation portion with the positioning groove structure on the bonding surface and the flexible circuit substrate is through a sheet-type double-sided tape with high stress conductivity, and the step of joining the two together includes: setting The shape of the sheet-type double-sided tape is compatible with the shape of the positioning groove on the bonding surface of the force-strained deformation portion, and the sheet-type double-sided tape is provided with positioning that matches the positioning column hole.

Through the positioning holes of the sheet-type double-sided tape, the flexible circuit substrate can be conveniently arranged in the positioning groove of the bonding surface of the force-strained deformation part, and the force-strained deformation part and the flexible circuit substrate can be joined.

As shown in Figs. 7, 8 and 9, the method further includes: setting the flexible circuit substrate 41 to a strip shaped special-shaped structure, which has a width and a length, and the special-shaped structure is set to be wider at both ends and in the middle. Through the narrower wiring connection, the width of the flexible circuit board outlet position on the edge of the locating groove on the bonding surface of the stress and strain deformation part is reduced, and the wider end is provided with multiple pins, which are connected to the corresponding interface of the external device, which is not provided The upper surface of the other end of the pin is joined to the stressed and deformed portion.

The length 4116 of the flexible circuit board is set to be greater than or equal to 50.0 mm and less than or equal to 150.0 mm.

The width 4223 of the flexible circuit board is set to be greater than or equal to 5 mm and less than or equal to 10 mm.

The flexible circuit board is a special-shaped structure, with a thin front and a wide rear, and the angles of the edge chamfers 4113 and 4114 at the change in width are set to 135 degrees.

The front end of the flexible circuit substrate is designed as a printed resistance-type strain detection area, and its

widths

4105 and 4112 are set to be greater than or equal to 0.5 mm and less than or equal to 7.0 mm. The smaller size can make the module structure compact, which helps to realize the miniaturization of the module of the pointing device.

The front end of the flexible circuit board closely fits in the positioning groove of the bonding surface of the force-strained deformation part, and the positioning hole spacing 4102 is consistent with the size of the positioning post of the force-strained deformation part. This design method can ensure that the installation angle of the pointing device is accurate, the force is uniform, and the detection accuracy can be improved.

The flexible circuit board is connected to the corresponding interface of the external device through a plurality of pins, and the appropriate length and width are convenient for quick assembly and ensure the reliability of the product.

The plurality of pins extend along the axis direction of the flexible circuit substrate and extend out of the edge of the wider end of the flexible circuit substrate. This arrangement facilitates the connection with the corresponding interface of the external device. The inner part of the pin is constrained inside the flexible circuit substrate.

Step 130: During the curing process of bonding the stressed and strained part with the locating groove structure on the bonding surface to the flexible circuit substrate, the stressed and strained part is bonded to the flexible circuit substrate by means of a pressure holding jig. Combined curing operation, where the temperature is set to be greater than or equal to 20 degrees Celsius and less than or equal to 30 degrees Celsius, the relative humidity is set to be greater than or equal to 30% and less than or equal to 70%, and the curing pressure holding force is set to be greater than or equal to 5.0 Newtons, The pressure holding time is not less than 5 minutes;

The bonding and curing operation through the pressure holding fixture set above can ensure that the contact surface of the two is even and flat, and there will be no bubbles, warping and degumming, which greatly improves the yield of products.

In practice, the holding pressure parameters and curing time during dispensing are different according to the glue or film used. Take VISHAY's M-bond 200kit quick-drying glue as an example, in a working environment at a temperature of 20 degrees Celsius to 30 degrees Celsius When the relative humidity ranges from 30% to 70%, use 5.0 Newtons as the curing pressure holding force, and hold the pressure for 5 minutes to complete the curing step. When other bonding materials are used, the holding time and curing conditions can be slightly adjusted according to the characteristics of individual materials, but the curing holding force is set to be greater than or equal to 5.0 Newtons, and the holding time is not less than 5 minutes. , This can ensure the effect of bonding and curing, and ensure that the contact surface of the flexible circuit substrate and the stress and strain deformation part is even and flat, without bubbles, warping and degumming; use a creeping glue dispenser or The sheet-type double-sided tape in the form of a sheet is the bonding layer. The process of setting the bonding layer can be implemented on the back of the flexible circuit substrate, and then it is bonded with the positioning groove area of the bonding surface provided by the stress and strain deformation part, or The bonding layer setting process is implemented on the plane of the positioning groove area of the bonding surface provided in the strained and deformed part, and then bonded with the back of the flexible circuit board. These setting processes can realize the bonding of the flexible circuit board and the strained and strained part. Operation, this application does not make any restrictions on this.

Step 140. After the force and strain deformation part provided with the bonding surface positioning groove structure and the flexible circuit substrate have completed the bonding and curing operation, the joint surface of the flexible circuit substrate and the force and strain deformation part is completely embedded in the force and strain deformation part. The fitting surface is positioned in the groove structure.

The stress strain deformation part is modified by blending polyphenylene ether and polystyrene to a heat distortion temperature of 90°C to 175°C, a small dielectric constant and a dielectric loss tangent value, and good water resistance and heat resistance. Made of polyphenylene ether (MPPE) material. MPPE has low melt viscosity, easy injection molding during processing, and less stress cracking after molding. It has good water resistance and heat resistance and is not expensive. It is very suitable for the long-term stress and strain deformation part of this application. Components for contact pressure operation are very suitable for large-scale commercial applications.

The above are only the preferred specific embodiments of the present invention, but the protection scope of the present invention is not limited to this. Anyone familiar with the technology can easily think of changes or substitutions within the technical scope disclosed in the present invention. , Should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Industrial applicability

Through the above-mentioned structure, the stress-conducting adhesive layer is used to bond the strained and deformed part provided with the positioning groove structure of the bonding surface to the flexible circuit board after bonding and curing, avoiding the previous interlocking The shortcomings of the process reduce the number of processes, reduce the discreteness of the product, and stabilize the components after joining, improve the production efficiency, and reduce the processing cost at the same time, which has strong practicability.

Claims

A method of manufacturing a pointing device, characterized in that it comprises:

A bonding surface positioning groove structure is provided at the bottom of the force-strained deformation part;

Join the stress and strain deformation part provided with the positioning groove structure of the bonding surface and the flexible circuit substrate through the bonding layer with high stress conductivity;

During the curing process of bonding the stressed and deformed part with the positioning groove structure of the bonding surface to the flexible circuit board, the pressure-holding jig is used to bond and solidify the stressed and strained part and the flexible circuit substrate. , Where the temperature is set to be greater than or equal to 20 degrees Celsius and less than or equal to 30 degrees Celsius, the relative humidity is set to be greater than or equal to 30% and less than or equal to 70%, and the curing pressure holding force is set to be greater than or equal to 5.0 Newtons, and the pressure is fixed The time is not less than 5 minutes;

When the stress and strain deformation part with the bonding surface positioning groove structure completes the bonding and curing operation of the flexible circuit board, the bonding surface of the flexible circuit substrate and the force and strain deformation part is completely embedded in the bonding surface of the force and strain deformation part Positioning in the groove structure.
The method of claim 1, wherein:

It also includes: the force-strained deformation portion is arranged as a cylindrical convex table structure, the bonding surface positioning groove structure is arranged at the bottom of the cylinder of the force-strained deformation portion, the boss is arranged at the center of the cylinder, and the boss It is a cube shape.
The method of claim 2, wherein:

It also includes: a hollow structure hole is further provided in the middle of the boss; the hollow structure hole is a cylindrical hollow structure hole.
The method of claim 2, wherein:

It also includes: a plurality of through holes are arranged on the cylinder of the force-strained deformation part, and the plurality of through holes are evenly arranged on the cylinder.
The method of claim 2, wherein:

The method further includes: setting the shape of the positioning groove of the bonding surface of the force-strained deformation portion to be adapted to the shape of the bonding surface of the flexible circuit substrate, the bonding surface of the flexible circuit substrate is provided with positioning holes, and the force-straining The locating groove of the fitting surface of the deforming part is correspondingly provided with a locating post matching the locating hole.
The method of claim 5, wherein:

It also includes: arranging at least two positioning pillars, and arranging a plurality of positioning pillars evenly arranged in the positioning groove of the bonding surface of the force-strained deformation portion.
The method of claim 6, wherein:

The bonding of the stress-strained deformation portion provided with the bonding surface positioning groove structure and the flexible circuit substrate is a step of bonding the two together through an adhesive bonding layer with high stress conductivity, including: The stress and strain deformation part of the joint positioning groove structure and the flexible circuit board are joined by a dispensing method with a high stress conductivity adhesive, or a sheet type double-sided tape with a high stress conductivity. Are joined together.
The method according to claim 7, wherein:

The step of joining the stress and strain deformation part with the positioning groove structure on the bonding surface and the flexible circuit substrate is through a sheet-type double-sided tape with high stress conductivity, and the step of joining the two together includes: setting The shape of the sheet-type double-sided tape is compatible with the shape of the positioning groove on the bonding surface of the force-strained deformation portion, and the sheet-type double-sided tape is provided with positioning that matches the positioning column hole.
The method of claim 6, wherein:

It also includes: setting the shape of the flexible circuit substrate to be a long profiled structure, the profiled structure is set to be wider at both ends, the middle is connected by a narrower wiring, and the wider end is provided with a plurality of pins, which are connected to the external The corresponding interface of the device is connected, and the upper surface of the other end of which is not provided with a pin is connected with the stress and strain deformation part.
The method of claim 6, wherein:

The stress strain deformation part is modified by blending polyphenylene ether and polystyrene to a heat distortion temperature of 90°C to 175°C, a small dielectric constant and a dielectric loss tangent value, and good water resistance and heat resistance. Made of polyphenylene ether material.