CN112083822A - Method for manufacturing pointing device - Google Patents
Method for manufacturing pointing device Download PDFInfo
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- CN112083822A CN112083822A CN201911200801.1A CN201911200801A CN112083822A CN 112083822 A CN112083822 A CN 112083822A CN 201911200801 A CN201911200801 A CN 201911200801A CN 112083822 A CN112083822 A CN 112083822A
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000004793 Polystyrene Substances 0.000 claims description 2
- 238000005304 joining Methods 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- 229920002223 polystyrene Polymers 0.000 claims description 2
- 229920013638 modified polyphenyl ether Polymers 0.000 claims 1
- 229920013636 polyphenyl ether polymer Polymers 0.000 claims 1
- 238000001514 detection method Methods 0.000 abstract description 17
- 238000012545 processing Methods 0.000 abstract description 14
- 230000006872 improvement Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 12
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- 238000004590 computer program Methods 0.000 description 7
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- 229920001955 polyphenylene ether Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
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- 238000006073 displacement reaction Methods 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0414—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04105—Pressure sensors for measuring the pressure or force exerted on the touch surface without providing the touch position
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
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- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
Abstract
A method of manufacturing a pointing device, comprising: the bottom of the stress strain deformation part is provided with a binding surface positioning groove structure; bonding the stress strain deformation part provided with the bonding surface positioning groove structure and the flexible circuit substrate together through a bondable bonding layer with high stress conductivity; and in the curing process of bonding the stress strain deformation part provided with the binding surface positioning groove structure with the flexible circuit substrate, bonding and curing the stress strain deformation part and the flexible circuit substrate in a pressure maintaining jig mode. The invention solves the problems that the characteristics of each part before and after tabling are possibly changed by adopting a tabling mode, the detection procedures are more and the subsequent adjustment cannot be carried out; and the sensor has extremely high requirements on production equipment and has a large number of detection and fine adjustment processes on the detection assembly, so that the problems of product discreteness and processing cost improvement are caused.
Description
Technical Field
The present application relates to the field of resistive strain gauge sensor technology, and more particularly, to a method of manufacturing a pointing device.
Background
Currently, the resistive strain gauge sensor has been gradually applied to various electronic devices as a pointing device, and relates to electronic devices such as a notebook computer, a mouse, a keyboard, a handheld device or a joystick, and the application of the resistive strain gauge sensor in the electronic devices can be seen. In a relatively common keyboard of a notebook computer, a resistance-type strain gauge sensor is usually arranged between keys of the keyboard, and the keys are close to a central position, so that a user can sense the shifting force and the shifting direction of the user only by touching the shifting sensor with fingers, and a cursor on a screen generates corresponding displacement action.
The existing resistance type strain gauge sensor mainly comprises: the detection device includes a housing, an operating portion housed in the housing, and a detection unit for detecting deformation of the operating portion, wherein the operating portion is formed integrally by an operating portion, a fixed portion, and a deformable portion deformable by an operating force applied to the operating portion, the detection unit is provided in the deformable portion, the fixed portion is fixed in the housing, and the operating portion and the deformable portion are movable in the housing. The operating portion of the input device is fixed inside a housing that is mounted on a substrate or the like of the keyboard apparatus. Therefore, when the operating force acts on the operating portion of the operating portion and the deformation portion is deformed, the case is less likely to fall off the substrate or the like. The design of the resistance type strain gauge sensor is mainly that the deformation part is combined with the detection component in a jogged mode or the detection component is directly arranged on the deformation part. However, the fitting method may cause the characteristics of the components before and after fitting to change, and the detection process is multiple and cannot be adjusted subsequently; because a plurality of quality variables occur simultaneously during embedding, including inconsistent stress of the deformation part, micro deformation caused by the embedding process, and mutual influence generated in the embedding process of the detection assembly and the deformation part; the embedding mode has multiple processing steps due to the processing characteristics, the calibration action is difficult to be continuously realized after the assembly, and the cost is high, so that the application and popularization of the product are not facilitated; moreover, the sensor has extremely high requirements on production equipment and has a large number of detection and fine adjustment processes on the detection assembly, so that the product discreteness and the processing cost are improved.
There is therefore a need for a new solution for manufacturing a pointing device to solve the above problems.
Disclosure of Invention
The embodiment of the application provides a method for manufacturing a pointing device, which solves the problems that in the current manufacturing process of the pointing device, characteristics of all parts before and after embedding are possibly changed by adopting an embedding mode, the detection procedures are more, and subsequent adjustment cannot be performed; a plurality of quality variables occur simultaneously during embedding, including inconsistent stress of the deformation part, micro deformation caused by the embedding process, and mutual influence generated in the embedding process of the detection assembly and the deformation part; meanwhile, the embedding mode has the processing characteristics of multiple processing steps, the calibration action is difficult to achieve continuously after the assembly, and the cost is high, so that the product application and popularization are not facilitated; and the sensor has extremely high requirements on production equipment and has a large number of detection and fine adjustment processes on the detection assembly, so that the problems of product discreteness and processing cost improvement are caused.
In order to solve the above problem, an embodiment of the present application provides a method of manufacturing a pointing device, including: the bottom of the stress strain deformation part is provided with a binding surface positioning groove structure;
bonding the stress strain deformation part provided with the bonding surface positioning groove structure and the flexible circuit substrate together through a bondable bonding layer with high stress conductivity;
in the curing process of bonding the stress strain deformation part provided with the binding face positioning groove structure with the flexible circuit substrate, bonding and curing the stress strain deformation part and the flexible circuit substrate in a pressure maintaining jig mode, wherein the temperature is set to be more than or equal to 20 ℃ and less than or equal to 30 ℃, the relative humidity is set to be more than or equal to 30% and less than or equal to 70%, the curing pressure maintaining acting force is set to be more than or equal to 5.0 newtons, and the pressure maintaining fixing time is not less than 5 minutes;
after the stress strain deformation part with the jointing surface positioning groove structure and the flexible circuit substrate are bonded and cured, the jointing surface of the flexible circuit substrate and the stress strain deformation part is completely embedded into the jointing surface positioning groove structure of the stress strain deformation part.
Compared with the prior art, the invention has the advantages that the stress strain deformation part with the binding surface positioning groove structure is bonded and solidified with the flexible circuit substrate through the adhesive binding layer with high stress conductivity, so that the defects of the prior embedding process are avoided, the working procedures are reduced, the discreteness of the product is reduced, the components are stable after being bound, the production efficiency is improved, and the processing cost is reduced.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
fig. 1 is a schematic flow chart of an embodiment of a method for manufacturing a pointing device according to an embodiment of the present disclosure;
fig. 2 and 3 are schematic structural diagrams of an upright arrangement and an inverted arrangement of the stress strain deformation part provided by the embodiment of the application;
FIGS. 4, 5 and 6 are schematic diagrams of a front cross section, a side cross section and a bottom cross section of a force-strain deformation provided by an embodiment of the present application;
fig. 7 is a schematic structural diagram of a flexible circuit substrate according to an embodiment of the present disclosure;
fig. 8 and 9 are schematic diagrams of a front cross section and a bottom cross section of a flexible circuit substrate provided in an embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Fig. 1 is a method for manufacturing a pointing device according to an exemplary embodiment, which includes the following steps:
as shown in fig. 2 and 3, the method further includes: the stress strain deformation part 10 is set to be a cylindrical boss type structure, the attaching surface positioning groove 11 is structurally arranged at the bottom of the cylinder of the stress strain deformation part, the boss is arranged at the center of the cylinder, and the boss can be in a cubic shape or in a shape similar to a cube, for example: the corners are provided as cubes in the form of arcs, which is not limited in this application.
Further comprising: the middle part of the boss is also provided with a hollow structure hole 14 (the hollow structure can reduce the rigidity strength of the stress strain deformation part, bring better touch pressure effect, improve the control accuracy and improve the use experience of users, and when acting force is applied to the stress strain deformation part, the acting force can be dispersed to each part of the boss of the stress strain deformation part due to the hollow structure, the stress strain deformation part is not easy to fatigue, and the probability of breakage of the stress strain deformation part can be reduced); the hollow structure hole is a cylindrical hollow structure hole.
As shown in fig. 2 and 3, the method further includes: the column of the stress strain deformation portion is provided with a plurality of through holes 13 (through holes for mounting the assembling screws), the plurality of through holes 13 are uniformly arranged on the column (the uniform stress of the assembled screws after mounting can be ensured), and the number of the through holes can be 4.
As shown in fig. 4, 5, and 6, the diameter of the cross section of the column of the force-receiving strain-deformed portion is set to 7.0mm or more and 25.0mm or less.
The four through holes 1404 arranged on the stress strain deformation part can use screws with M1.8P0.2 specifications, and the four through holes are arranged to be more than or equal to 1.2mm and less than or equal to 10.0mm corresponding to the horizontal pitches 1401, 1402, 1406 and 1407, so that the stress strain deformation part can be well jointed; the stressed columnar structure 1403 in the stressed strain deformation part is set to be 1.2mm or more and 5.0mm or less of one side; the diameter of the bore 1409 of the hollow structure of the stressed columnar structure in the stressed strain deformation part is more than or equal to 0.2mm and less than or equal to 4.0 mm; the R angles 1411 and 1412 of the edges of the stressed columnar structure hollow structure in the stressed strain deformation part are set to be more than or equal to 0.02mm and less than or equal to 2.20mm in diameter; the depth of the hollow structure of the stress columnar structure in the stress strain deformation part is set to be 1413 mm or more and 8.2mm or less.
The size and the shape of the binding surface positioning groove arranged on the bottom surface of the stress strain deformation part are formed by 1414,1415,1416,1417,1418,1419,1421,1422,1423 in figure 6, the size and the shape of the binding surface positioning groove are matched with the external dimension of the flexible circuit substrate, the depth of the binding surface positioning groove is set to be more than or equal to 0.02mm and less than or equal to 4.20mm, the depth can ensure that the narrow end of the flexible circuit substrate is placed in the stress strain deformation part well, the processing is easy, the assembly is convenient, the assembly error can be reduced, and the production efficiency is improved.
The above arrangement mode is easy to process and convenient to assemble, can reduce assembly errors and improves production efficiency.
as shown in fig. 3, the method further includes: the shape of the binding face positioning groove of the stress strain deformation part is matched with the shape of the binding face of the flexible circuit substrate, the binding face of the flexible circuit substrate is provided with a positioning hole, and the binding face positioning groove 11 of the stress strain deformation part is correspondingly provided with a positioning column 12 matched with the positioning hole.
Further comprising: the number of the positioning columns is at least 2, and the positioning columns are uniformly arranged in the binding face positioning groove 11 of the stress strain deformation part.
The bottom surface of the stress strain deformation part can be positioned by using the two positioning columns when being jointed with the flexible circuit substrate, the flexible circuit substrate can be conveniently arranged in the jointing surface positioning groove of the stress strain deformation part through the positioning columns, and the stress strain deformation part is jointed with the flexible circuit substrate. The positioning column is set to be larger than or equal to 0.3mm and smaller than or equal to 5.0mm in diameter, and the positioning column and the base are convenient to position and use with the flexible circuit board in actual operation.
In an actual test, the material of the bondable bonding layer with high stress conductivity may be a bonding material with high density, high hardness and high modulus (for example, the material may have a stress conductivity at least greater than 2 pa), so that when an acting force is applied to the stressed strain deformation portion, the acting force applied through the bondable bonding layer with high stress conductivity is transmitted to the flexible circuit substrate as far as possible under the condition of reducing loss, and the sensor on the flexible circuit substrate may correspondingly acquire a feedback signal by acquiring a change in resistance value, so that the sensor acquiring the deformation amount through the change in resistance has high accuracy and high response speed, thereby bringing better user experience.
Wherein, the joint of the stress strain deformation part with the joint surface positioning groove structure and the flexible circuit substrate is a step of jointing the stress strain deformation part and the flexible circuit substrate together through an adhesive joint layer with high stress conductivity, and the joint method comprises the following steps: the stress strain deformation part with the binding surface positioning groove structure is jointed with the flexible circuit substrate by a glue with high stress conductivity in a dispensing way (for example, the glue is dispensed by using VIHAY M-bond 200kit quick-drying glue, which is a silica gel-based quick-drying glue), or by a sheet type double-sided adhesive with high stress conductivity.
The step of joining together the stress strain deformation portion provided with the attaching face positioning groove structure and the flexible circuit substrate is performed by a sheet type double-sided adhesive tape with high stress conductivity, and includes: the shape of the sheet type double-faced adhesive tape is matched with the shape of the binding face positioning groove of the stress strain deformation part, and the sheet type double-faced adhesive tape is provided with the positioning hole matched with the positioning column.
The flexible circuit substrate can be conveniently arranged in the jointing surface positioning groove of the stress strain deformation part through the positioning hole of the sheet type double-sided adhesive tape, and the stress strain deformation part is jointed with the flexible circuit substrate.
As shown in fig. 7, 8 and 9, the present invention further includes: set up the shape of flexible line base plate 41 is the heterotypic structure of a rectangular shape, and it has width and length, and this heterotypic structure sets up to both ends broad, the centre is connected through narrower walking line, reduces the binding face positioning groove edge flexible line base plate position width of being qualified for the next round of competitions of atress strain deformation portion, and broad one end sets up a plurality of pins, is connected with the interface that external device corresponds, its upper surface that does not set up the other end of pin with atress strain deformation portion joints.
The length 4116 of the flexible circuit substrate is set to be 50.0mm or more and 150.0mm or less.
The width 4223 of the flexible circuit board is set to be not less than 5mm and not more than 10 mm.
The flexible circuit substrate has a special-shaped structure, the front part is thin, the rear part is wide, and the angles of edge lead angles 4113 and 4114 at the position of width change are set to 135 degrees.
The front end of the flexible circuit board is designed as a printed resistance type strain detecting member region, and the widths 4105, 4112 are set to 0.5mm or more and 7.0mm or less. The smaller size makes the module compact, which helps to achieve module miniaturization of the pointing device.
The front end of the flexible circuit substrate is tightly attached in the attaching surface positioning groove of the stress strain deformation part, and the positioning hole interval 4102 is consistent with the positioning column size of the stress strain deformation part. The design mode can ensure that the installation angle of the pointing device is accurate, the stress is uniform, and the detection precision can be improved.
The flexible circuit substrate is connected with the interface corresponding to the external device through a plurality of pins, and the flexible circuit substrate is convenient and fast to assemble with proper length and width, so that the reliability of the product is ensured.
A plurality of a plurality of pins extend along the axial direction with the flexible circuit substrate to stretch out the edge of the broad one end of flexible circuit substrate, and the interface connection corresponding with external device is convenient for to this kind of setting. The inner portion of the pin is constrained within the flexible circuit substrate.
130, in the curing process of bonding the stress strain deformation part with the binding surface positioning groove structure and the flexible circuit substrate, bonding and curing the stress strain deformation part and the flexible circuit substrate in a pressure maintaining jig mode, wherein the temperature is set to be more than or equal to 20 ℃ and less than or equal to 30 ℃, the relative humidity is set to be more than or equal to 30% and less than or equal to 70%, the curing pressure maintaining acting force is set to be more than or equal to 5.0 newtons, and the pressure maintaining fixing time is not less than 5 minutes;
the pressure maintaining jig mode arranged by the method is used for bonding and curing, so that the contact surfaces of the pressure maintaining jig and the pressure maintaining jig can be ensured to be even and flat, the phenomena of bubbles, warping and degumming can not be generated, and the generated yield is greatly improved.
In practice, the pressure maintaining parameters and the curing time during dispensing are different according to the glue or the glue film, for example, the M-bond 200kit quick-drying glue of VISHAY, under the operating environment of a temperature of 20 to 30 ℃, the relative humidity range is 30 to 70 percent, 5.0 newton is used as the curing pressure maintaining acting force, and the curing step is completed after 5 minutes of pressure maintaining. When other jointing materials are used, the pressure maintaining time and the curing condition can be slightly adjusted according to the individual material characteristics according to individual different characteristics, but the curing pressure maintaining acting force is set to be more than or equal to 5.0 newton, and the pressure maintaining fixed time is not less than 5 minutes, so that the bonding and curing effect can be ensured, the joint contact surface of the flexible circuit substrate and the stress strain deformation part can be ensured to be even and flat, and the phenomena of air bubbles, warping and degumming can not be generated; the method is characterized in that a peristaltic glue dispenser or a sheet type double-sided adhesive tape in a sheet form is used as a jointing layer, the step of setting the jointing layer can be implemented on the back surface of the flexible circuit substrate and then jointed with the jointing surface positioning groove area plane arranged on the stress strain deformation part, or the step of setting the jointing layer is implemented on the jointing surface positioning groove area plane arranged on the stress strain deformation part and then jointed with the back surface of the flexible circuit substrate, and the set steps can realize the jointing operation of the flexible circuit substrate and the stress strain deformation part, so that the method is not limited in any way.
The stress strain deformation part is made of modified polyphenylene ether (MPPE) which is formed by blending polyphenylene ether and polystyrene into a material with the heat deformation temperature of 90-175 ℃, small dielectric constant and dielectric loss tangent value and good water resistance and heat resistance. MPPE has low melt viscosity, is easy to be injected and molded during processing, is not easy to generate stress cracking phenomenon after molding, has good water resistance and heat resistance and low price, is very suitable to be used as a component of the stress strain deformation part for long-time contact pressure operation, and is very suitable for large-scale commercial application.
As will be appreciated by one skilled in the art, embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present application is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the application. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
It should be noted that all the embodiments in the present application are described in a related manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, as for the apparatus embodiment, since it is substantially similar to the method embodiment, the description is relatively simple, and for the relevant points, reference may be made to the partial description of the method embodiment.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in the process, method, article, or apparatus that comprises the element.
The above are merely examples of the present application and are not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims (10)
1. A method of manufacturing a pointing device, comprising:
the bottom of the stress strain deformation part is provided with a binding surface positioning groove structure;
bonding the stress strain deformation part provided with the bonding surface positioning groove structure and the flexible circuit substrate together through a bondable bonding layer with high stress conductivity;
in the curing process of bonding the stress strain deformation part provided with the binding face positioning groove structure with the flexible circuit substrate, bonding and curing the stress strain deformation part and the flexible circuit substrate in a pressure maintaining jig mode, wherein the temperature is set to be more than or equal to 20 ℃ and less than or equal to 30 ℃, the relative humidity is set to be more than or equal to 30% and less than or equal to 70%, the curing pressure maintaining acting force is set to be more than or equal to 5.0 newtons, and the pressure maintaining fixing time is not less than 5 minutes;
after the stress strain deformation part with the jointing surface positioning groove structure and the flexible circuit substrate are bonded and cured, the jointing surface of the flexible circuit substrate and the stress strain deformation part is completely embedded into the jointing surface positioning groove structure of the stress strain deformation part.
2. The method of claim 1,
further comprising: the stress strain deformation part is of a cylindrical boss structure, the binding face positioning groove structure is arranged at the cylindrical bottom of the stress strain deformation part, the boss is arranged at the central position of the cylinder, and the boss is of a cubic shape.
3. The method of claim 2,
further comprising: the middle part of the boss is also provided with a hollow structure hole; the hollow structure hole is a cylindrical hollow structure hole.
4. The method of claim 2,
further comprising: the column of the stress strain deformation part is provided with a plurality of through holes which are uniformly arranged on the column.
5. The method of claim 2,
further comprising: the shape of the binding face positioning groove of the stress strain deformation part is matched with the shape of the binding face of the flexible circuit substrate, the binding face of the flexible circuit substrate is provided with a positioning hole, and the binding face positioning groove of the stress strain deformation part is correspondingly provided with a positioning column matched with the positioning hole.
6. The method of claim 5, comprising:
further comprising: the number of the positioning columns is at least 2, and the positioning columns are uniformly arranged in the binding face positioning groove of the stress strain deformation part.
7. The method of claim 6,
the jointing of the stress strain deformation part with the jointing surface positioning groove structure and the flexible circuit substrate is a step of jointing the stress strain deformation part and the flexible circuit substrate together through an adhesive jointing layer with high stress conductivity, and the jointing method comprises the following steps of: the stress strain deformation part with the jointing surface positioning groove structure is jointed with the flexible circuit substrate by adopting a dispensing mode through an adhesive with high stress conductivity or a sheet type double-sided adhesive with high stress conductivity.
8. The method of claim 7,
the step of joining together the stress strain deformation portion provided with the attaching face positioning groove structure and the flexible circuit substrate is performed by a sheet type double-sided adhesive tape with high stress conductivity, and includes: the shape of the sheet type double-faced adhesive tape is matched with the shape of the binding face positioning groove of the stress strain deformation part, and the sheet type double-faced adhesive tape is provided with the positioning hole matched with the positioning column.
9. The method of claim 6,
further comprising: the flexible circuit substrate is arranged in a strip-shaped special-shaped structure, the special-shaped structure is arranged in a manner that two ends are wide, the middle of the special-shaped structure is connected through narrow wiring, a plurality of pins are arranged at one end of the wide end and are connected with interfaces corresponding to external devices, and the upper surface of the other end, which is not provided with the pins, is jointed with the stress strain deformation part.
10. The method of claim 6,
the stress strain deformation part is made of modified polyphenyl ether material which is formed by blending polyphenyl ether and polystyrene, has the heat deformation temperature of 90-175 ℃, small dielectric constant and dielectric loss tangent value and good water resistance and heat resistance.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911200801.1A CN112083822B (en) | 2019-11-29 | 2019-11-29 | Method for manufacturing pointing device |
| PCT/CN2020/131568 WO2021104328A1 (en) | 2019-11-29 | 2020-11-25 | Method for manufacturing pointing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911200801.1A CN112083822B (en) | 2019-11-29 | 2019-11-29 | Method for manufacturing pointing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112083822A true CN112083822A (en) | 2020-12-15 |
| CN112083822B CN112083822B (en) | 2024-02-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911200801.1A Active CN112083822B (en) | 2019-11-29 | 2019-11-29 | Method for manufacturing pointing device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112083822B (en) |
| WO (1) | WO2021104328A1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6693624B1 (en) * | 1999-07-02 | 2004-02-17 | Hosiden Corporation | Joystick operated positioning device for a computer |
| CN101551712A (en) * | 2008-03-31 | 2009-10-07 | 义隆电子股份有限公司 | Stress inductor and electronic device with same |
| CN101943618A (en) * | 2009-07-09 | 2011-01-12 | 义隆电子股份有限公司 | Stress inductor and assembly method thereof |
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| CN211123997U (en) * | 2019-11-29 | 2020-07-28 | 深圳市汇创达科技股份有限公司 | Pointing device based on resistance type strain gauge sensing mode |
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| WO2021104328A1 (en) | 2021-06-03 |
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