CN211123997U - Pointing device based on resistance type strain gauge sensing mode - Google Patents
Pointing device based on resistance type strain gauge sensing mode Download PDFInfo
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- CN211123997U CN211123997U CN201922114028.9U CN201922114028U CN211123997U CN 211123997 U CN211123997 U CN 211123997U CN 201922114028 U CN201922114028 U CN 201922114028U CN 211123997 U CN211123997 U CN 211123997U
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Abstract
A pointing device based on a resistance type strain gauge sensing mode comprises: the flexible circuit substrate is provided with a plurality of resistance type detection strain parts, and the bottom of the stress strain deformation part is provided with a binding surface positioning groove structure; the stress strain deformation part is of a cylindrical boss type structure, the stress strain deformation part is jointed with the flexible circuit substrate through the adhesive jointing layer, the stress strain deformation part is jointed with the rigid support base through a plurality of screws, and a gap layer space is formed between the resistance type detection strain part and the rigid support base. The utility model solves the problem that the characteristics of the prior pointing device before and after the jogging of each part are possibly changed by adopting the jogging mode in the manufacturing process of the prior pointing device; and the current conventional stress sensor needs a large number of components, has a complex structure and a large volume, cannot realize miniaturization, further influences the use of an application environment, reduces the assembly efficiency and causes the cost to rise.
Description
Technical Field
The application relates to a pointing device based on a sensing mode of a resistance type strain gauge.
Background
Currently, the resistive strain gauge sensor has been gradually applied to various electronic devices as a pointing device, and relates to electronic devices such as a notebook computer, a mouse, a keyboard, a handheld device or a joystick, and the application of the resistive strain gauge sensor in the electronic devices can be seen. In a relatively common keyboard of a notebook computer, a resistance-type strain gauge sensor is usually arranged between keys of the keyboard, and the keys are close to a central position, so that a user can sense the shifting force and shifting direction of the user only by touching the shifting sensor with fingers, and then a cursor on a screen generates corresponding speed and displacement action.
The existing resistance type strain gauge sensor mainly comprises: the detection device includes a housing, an operating portion housed in the housing, and a detection unit for detecting deformation of the operating portion, wherein the operating portion is formed integrally by an operating portion, a fixed portion, and a deformable portion deformable by an operating force applied to the operating portion, the detection unit is provided in the deformable portion, the fixed portion is fixed in the housing, and the operating portion and the deformable portion are movable in the housing. The operating portion of the input device is fixed inside a housing that is mounted on a substrate or the like of the keyboard apparatus. Therefore, when the operating force acts on the operating portion of the operating portion and the deformation portion is deformed, the case is less likely to fall off the substrate or the like.
The resistance type strain gauge sensor is mainly designed by combining the deformation part and the detection component in a jogged mode or directly arranging the detection component on the deformation part and connecting the deformation part and the fixing part in a jogged mode. However, the fitting method may cause the characteristics of each part to change before and after fitting, and the detection process is multiple and cannot be adjusted subsequently; because a plurality of quality variables occur simultaneously during the embedding, including inconsistent stress of the deformation part, micro deformation caused by the embedding process, and mutual influence generated in the embedding process of the detection assembly and the deformation part as well as the deformation part and the fixing part; the embedding mode has multiple processing steps due to the processing characteristics, the calibration action is difficult to be continuously realized after the assembly, and the cost is high, so that the application and popularization of the product are not facilitated; the sensor has extremely high requirements on production equipment and a large number of detection and fine adjustment procedures on detection components, so that the product discreteness or the processing cost is increased; and the conventional stress sensor at present needs a large number of assemblies, and has a complex structure and a large volume, and can not be miniaturized, so that the application environment is influenced, the assembly efficiency is reduced, and the cost is increased.
Therefore, a new technical solution of a pointing device based on a resistive strain gauge sensing method is needed to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a pointing device based on a resistance type strain gauge sensing mode, and solves the problems that in the manufacturing process of the current pointing device, characteristics of all parts before and after embedding are possibly changed due to an embedding mode, the detection procedures are multiple, and subsequent adjustment cannot be performed; and a plurality of quality variables occur simultaneously during the embedding, including inconsistent stress of the deformation part, micro deformation caused by the embedding process and mutual influence generated by each part in the embedding process; meanwhile, the embedding mode has the processing characteristics of multiple processing steps, the calibration action is difficult to achieve continuously after the assembly, and the cost is high, so that the product application and popularization are not facilitated; the sensor has extremely high requirements on production equipment and a large number of detection and fine adjustment procedures on detection components, so that the product discreteness or the processing cost is increased; and the current conventional stress sensor needs a large number of components, has a complex structure and a large volume, cannot realize miniaturization, further influences the use of an application environment, reduces the assembly efficiency and causes the cost to rise.
In order to solve the above problem, an embodiment of the present application provides a pointing device based on a sensing method of a resistance type strain gauge, including: the flexible circuit substrate is provided with a plurality of resistance type detection strain parts, and the bottom of the stress strain deformation part is provided with a binding surface positioning groove structure; the stress strain deformation part is of a cylindrical boss type structure, the stress strain deformation part is jointed with the flexible circuit substrate through the adhesive jointing layer, the stress strain deformation part with the flexible circuit substrate is jointed with the rigid support base through a plurality of screws, and a clearance layer space is formed between the resistance type detection strain part and the rigid support base.
Compared with the prior art, use the utility model discloses, but through the high bonding laminating layer that adheres of stress conductivity nature will be equipped with binding face positioning groove structure the atress strain deformation portion with flexible line base plate bonding solidification back joint together to the perforating hole that sets up on atress strain deformation portion, through a plurality of screws with the rigid support base joint, the shortcoming of gomphosis flow before having avoided, the process is reduced, the discreteness of product is reduced, the quantity of part and whole volume have been reduced, make pointing device miniaturation, can all use in various scenes; after all parts are jointed, the stability is realized, the production efficiency is improved, and the processing cost is reduced.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
fig. 1 is a schematic flowchart illustrating a specific implementation of a setting method of a pointing device according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a flexible circuit substrate provided with the resistance-type strain detection portion according to an embodiment of the present disclosure;
fig. 3 and 4 are schematic structural diagrams of an upright arrangement and an inverted arrangement of the stress strain deformation part provided by the embodiment of the application;
FIGS. 5, 6 and 7 are schematic diagrams of a front cross section, a side cross section and a bottom cross section of a force-strain deformation provided by an embodiment of the present application;
FIG. 8 is a schematic view of a rigid support base provided in accordance with an embodiment of the present application;
FIGS. 9 and 10 are schematic views of screws provided in embodiments of the present application;
fig. 11 is a schematic structural diagram of a flexible circuit substrate according to an embodiment of the present disclosure;
fig. 12 and 13 are schematic diagrams of a front cross-section and a bottom cross-section of a flexible circuit substrate provided by an embodiment of the present application;
fig. 14 is a disassembly schematic view of an arrangement of parts before a pointing device based on a resistive strain gauge sensing method according to an embodiment of the present application is mounted;
fig. 15 is a schematic cross-sectional view of the stacked structures of the pointing device based on the resistive strain gauge sensing method according to the embodiment of the present application after the pointing device is mounted.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Fig. 1 is a setting method of a pointing device based on a resistive strain gauge sensing method according to an exemplary embodiment, including the following steps:
as shown in fig. 2, the method further comprises: the resistance type strain detection parts 71 are arranged in at least 3, at least 3 resistance type strain detection parts 71 are orderly arranged on the flexible circuit substrate 41, and the arranged surface is the opposite surface of the joint surface of the flexible circuit substrate and the stress strain deformation part. When applying the effort to atress strain deformation portion, the effort transmits the flexible line base plate on, a plurality of resistance-type on the flexible line base plate detect strain portion can be corresponding through gathering the change of resistance value and obtain feedback signal, a plurality of resistance-type that the range was arranged in order detect strain portion and gather the deformation volume of atress strain deformation portion through resistance-type change, such setting can improve the precision of gathering and improve response speed simultaneously, brings better user and uses experience. Require in this application that the quantity of resistance-type detection strain portion is no less than 3, can improve the precision and the response speed of gathering greatly like this, set up 4 resistance-type detection strain portions in figure 2, but the position and the specific quantity of the resistance-type detection strain portion that set up, this application does not limit to this.
The resistance type strain detection part is arranged on the flexible circuit substrate in a Printing mode or a Coating mode. The above-mentioned mode can ensure that resistance-type detection strain portion sets up on flexible line base plate, can not very increase the thickness of flexible line base plate, and above-mentioned technology is mature, and the cost is lower, has improved the yields of product greatly, and is very suitable for extensive commercial application.
Wherein, the bottom of the stress strain deformation part is provided with a binding surface positioning groove structure; jointing the stress strain deformation part with the jointing surface positioning groove structure and the flexible circuit substrate with the resistance type strain detection part together through an adhesive jointing layer with high stress conductivity;
as shown in fig. 3 and 4, the method further includes: the stress strain deformation part 10 is set to be a cylindrical boss type structure, the attaching surface positioning groove 11 is structurally arranged at the bottom of the cylinder of the stress strain deformation part, the boss is arranged at the center of the cylinder, and the boss can be in a cubic shape or in a shape similar to a cube, for example: the corners are provided as cubes in the form of arcs, which is not limited in this application.
Further comprising: the middle part of the boss is also provided with a hollow structure hole 14 (the hollow structure can reduce the rigidity strength of the stress strain deformation part, bring better touch pressure effect, improve the control accuracy and improve the use experience of users, and when acting force is applied to the stress strain deformation part, the acting force can be dispersed to each part of the boss of the stress strain deformation part due to the hollow structure, the stress strain deformation part is not easy to fatigue, and the probability of breakage of the stress strain deformation part can be reduced); the hollow structure hole is a cylindrical hollow structure hole.
As shown in fig. 3 and 4, the method further includes: the cylinder of the stress strain deformation part is provided with a plurality of through holes 13 (the through holes are used for installing the through holes of the assembling screws), the through holes 13 are uniformly arranged on the cylinder (the stress on the assembling screws after installation can be ensured to be uniform), and the stress strain deformation part penetrates through the corresponding through holes through the screws to be jointed with the rigid support base. The number of the through holes on the cylinder provided with the stress strain deformation part is 4, the through holes are not limited in the application, the 4 through holes are uniformly arranged on the cylinder, connecting lines of any 2 opposite through holes form two intersecting lines, 4 included angles formed by the intersecting lines are right angles, and the intersecting points of the 2 intersecting lines are on the axis of the cylinder. The arrangement mode can ensure that the stress borne by the assembled screw after installation is uniform.
As shown in fig. 5, 6 and 7, the diameter of the cross section of the column of the force-receiving strain-deformed portion is set to 7.0mm or more and 25.0mm or less.
The four through holes 1404 arranged on the stress strain deformation part can use screws with M1.8P0.2 specifications, and the four through holes are arranged to be more than or equal to 1.2mm and less than or equal to 10.0mm corresponding to the horizontal pitches 1401, 1402, 1406 and 1407, so that the stress strain deformation part can be well jointed; the stressed columnar structure 1403 in the stressed strain deformation part is set to be 1.2mm or more and 5.0mm or less of one side; the diameter of the bore 1409 of the hollow structure of the stressed columnar structure in the stressed strain deformation part is more than or equal to 0.2mm and less than or equal to 4.0 mm; the R angles 1411 and 1412 of the edges of the stressed columnar structure hollow structure in the stressed strain deformation part are set to be more than or equal to 0.02mm and less than or equal to 2.20mm in diameter; the depth of the hollow structure of the stress columnar structure in the stress strain deformation part is set to be 1413 mm or more and 8.2mm or less.
The size and the shape of the positioning groove of the binding surface arranged on the bottom surface of the stress strain deformation part are formed by 1414, 1415,1416,1417,1418,1419,1421,1422 and 1423 in figure 7, the size and the shape of the positioning groove of the binding surface are matched with the external dimension of the flexible circuit substrate, the depth of the positioning groove of the binding surface is set to be more than or equal to 0.02mm and less than or equal to 4.20mm, the depth can ensure that the narrower end of the flexible circuit substrate is placed in the stress strain deformation part, the processing is easy, the assembly is convenient, the assembly error can be reduced, and the production efficiency is improved.
The above arrangement mode is easy to process and convenient to assemble, can reduce assembly errors and improves production efficiency.
as shown in fig. 4, the method further includes: the shape of the binding face positioning groove of the stress strain deformation part is matched with the shape of the binding face of the flexible circuit substrate, the binding face of the flexible circuit substrate is provided with a positioning hole, and the binding face positioning groove 11 of the stress strain deformation part is correspondingly provided with a positioning column 12 matched with the positioning hole.
Further comprising: the number of the positioning columns is at least 2, and the positioning columns are uniformly arranged in the binding face positioning groove 11 of the stress strain deformation part.
The bottom surface of the stress strain deformation part can be positioned by using the two positioning columns when being jointed with the flexible circuit substrate, the flexible circuit substrate can be conveniently arranged in the jointing surface positioning groove of the stress strain deformation part through the positioning columns, and the stress strain deformation part is jointed with the flexible circuit substrate. The positioning column is set to be larger than or equal to 0.3mm and smaller than or equal to 5.0mm in diameter, and the positioning column and the base are convenient to position and use with the flexible circuit board in actual operation.
130, in the curing process of bonding the stress strain deformation part with the bonding surface positioning groove structure and the flexible circuit substrate with the resistance type strain detection part, bonding and curing the stress strain deformation part and the flexible circuit substrate in a pressure maintaining jig mode, wherein the temperature is set to be more than or equal to 20 ℃ and less than or equal to 30 ℃, the relative humidity is set to be more than or equal to 30% and less than or equal to 70%, the curing pressure maintaining acting force is set to be more than or equal to 5.0 newtons, and the pressure maintaining fixing time is not less than 5 minutes;
in an actual test, the bondable bonding layer is an adhesive with high stress conductivity and is a sheet-type double-sided adhesive with high stress conductivity, wherein the material of the bondable bonding layer with high stress conductivity can be a bonding material with high density, high hardness and high modulus (for example, the bonding material can be a material with stress conductivity at least larger than 2 Pa), so that when an acting force is applied to the stress strain deformation part, the acting force applied through the bondable bonding layer with high stress conductivity is transmitted to the flexible circuit substrate under the condition of reducing loss as much as possible, a sensor on the flexible circuit substrate can correspondingly acquire a feedback signal through acquiring the change of the resistance value, and the sensor acquiring the deformation amount through the resistance change has high precision and high response speed, so that better user experience is brought.
Wherein, the joint of the stress strain deformation part with the joint surface positioning groove structure and the flexible circuit substrate is a step of jointing the stress strain deformation part and the flexible circuit substrate together through an adhesive joint layer with high stress conductivity, and the joint method comprises the following steps: the stress strain deformation part with the binding surface positioning groove structure is jointed with the flexible circuit substrate by a glue with high stress conductivity in a dispensing way (for example, the glue is dispensed by using VIHAY M-bond 200kit quick-drying glue, which is a silica gel-based quick-drying glue), or by a sheet type double-sided adhesive with high stress conductivity.
The step of joining together the stress strain deformation portion provided with the attaching face positioning groove structure and the flexible circuit substrate is performed by a sheet type double-sided adhesive tape with high stress conductivity, and includes: the shape of the sheet type double-faced adhesive tape is matched with the shape of the binding face positioning groove of the stress strain deformation part, and the sheet type double-faced adhesive tape is provided with the positioning hole matched with the positioning column.
The flexible circuit substrate can be conveniently arranged in the jointing surface positioning groove of the stress strain deformation part through the positioning hole of the sheet type double-sided adhesive tape, and the stress strain deformation part is jointed with the flexible circuit substrate.
Further, in the curing process of bonding the stress strain deformation part provided with the binding face positioning groove structure with the flexible circuit substrate, bonding and curing the stress strain deformation part and the flexible circuit substrate in a pressure maintaining jig mode, wherein the temperature is set to be more than or equal to 20 ℃ and less than or equal to 30 ℃, the relative humidity is set to be more than or equal to 30% and less than or equal to 70%, the curing and pressure maintaining acting force is set to be more than or equal to 5.0 newtons, and the pressure maintaining fixed time is not less than 5 minutes;
the pressure maintaining jig mode arranged by the method is used for bonding and curing, so that the contact surfaces of the pressure maintaining jig and the pressure maintaining jig can be ensured to be even and flat, the phenomena of bubbles, warping and degumming can not be generated, and the generated yield is greatly improved.
In practice, the pressure maintaining parameters and the curing time during dispensing are different according to the glue or the glue film, for example, the M-bond 200kit quick-drying glue of VISHAY, under the operating environment of a temperature of 20 to 30 ℃, the relative humidity range is 30 to 70 percent, 5.0 newton is used as the curing pressure maintaining acting force, and the curing step is completed after 5 minutes of pressure maintaining. When other jointing materials are used, the pressure maintaining time and the curing condition can be slightly adjusted according to the individual material characteristics according to individual different characteristics, but the curing pressure maintaining acting force is set to be more than or equal to 5.0 newton, and the pressure maintaining fixed time is not less than 5 minutes, so that the bonding and curing effect can be ensured, the joint contact surface of the flexible circuit substrate and the stress strain deformation part can be ensured to be even and flat, and the phenomena of air bubbles, warping and degumming can not be generated; the method is characterized in that a peristaltic glue dispenser or a sheet type double-sided adhesive tape in a sheet form is used as a jointing layer, the step of setting the jointing layer can be implemented on the back surface of the flexible circuit substrate and then jointed with the jointing surface positioning groove area plane arranged on the stress strain deformation part, or the step of setting the jointing layer is implemented on the jointing surface positioning groove area plane arranged on the stress strain deformation part and then jointed with the back surface of the flexible circuit substrate, and the set steps can realize the jointing operation of the flexible circuit substrate and the stress strain deformation part, so that the method is not limited in any way.
The rigid supporting base can be made of metal materials, in practice, 304 stainless steel can be adopted, the materials are strong in environmental adaptation capability, good in water resistance and moisture resistance, good in heat dissipation effect, low in cost, high in strength and convenient to process, and are very suitable for large-scale commercial application; while copper, aluminum, etc. may be used herein, this is not a limitation.
As shown in fig. 8, a distance 2102 between centers of two positioning holes used when the rigid support base is assembled with the finished product may be set to be greater than or equal to 8.0mm and less than or equal to 30.0 mm; the aperture 2108 may be set to be 0.3mm or more and 5.0mm or less, which facilitates assembly of the product.
The two alignment holes 2107 of the rigid support base can be assembled by using M1.8P0.2-sized screws, so that the rigid support base can be accurately assembled on a product.
When the rigid support base is connected with the stress strain deformation part, the aperture of the two positioning holes 2109 can be set to be more than or equal to 0.2mm and less than or equal to 5.0 mm; thus, the positioning and the installation are convenient.
Four screw holes 2104 are used when the rigid supporting base and the stress strain deformation part are connected through screws, M1.8P0.2-specification screws (M is the outer diameter of the screw thread is 1.8mm, P is the thread pitch of the general finger screw thread is 0.2mm) are used, and the arrangement is convenient for accurately assembling the product.
As shown in fig. 9 and 10, the size 3001 of the cross structure in the screw for connecting the rigid support base and the stressed strain deformation part may be greater than or equal to 0.9mm and less than or equal to 3.2 mm. The top dimension 3002 of the screw and thread engaging slope may be set to 0.8mm or more and 3.2mm or less. The screw and nut diameter 3003 may be sized to be greater than or equal to 1.2mm and less than or equal to 5.0 mm. The screw thread 3004 in the example is designed to be M1.0P0.2 gauge fine gauge screw. The screw and nut thickness 3005 may be set to 1.5mm or less and 0.2mm or more, and the screw thread portion length 3006 may be set to 5.2mm or less and 1.0mm or more. The length of the portion 3007 which is deformed by the stress strain and extends beyond the screw and the nut may be set to 0.8mm or more and 10.0mm or less. The screw design mode is convenient to install, assembly errors can be reduced, and production efficiency is improved.
The distance 2105 between the four screw holes used when the center of the positioning hole used when the rigid support base is used for assembling finished products is connected with the stress strain deformation structure can be set to be more than or equal to 0.8mm and less than or equal to 18.0 mm; the above arrangement facilitates accurate assembly of products
The distance 2106 between the four screw holes used when the center of the positioning hole used when the rigid support base is assembled with a finished product is connected with the stress strain deformation structure can be set to be more than or equal to 1.8mm and less than or equal to 20.0 mm; the arrangement facilitates accurate assembly of the product.
The design mode can enable the processing to be easy and convenient to install, and meanwhile, the assembly error is reduced, the precision of the product is improved, and good user experience is brought.
The step of collecting the sampling data of each resistance type detection strain part comprises the following steps: and connecting the signal contact of each resistance type detection strain part of the flexible circuit substrate with a testing device, and acquiring sampling data of each resistance type detection strain part.
As shown in fig. 11, 12, and 13, the present invention further includes: set up the heterotypic structure of shape for a rectangular shape of flexible line base plate 41, it has width and length, sets up the heterotypic structure of shape for a rectangular shape of flexible line base plate, and this heterotypic structure sets up to both ends broad, the centre is connected with narrower walking line, reduces the binding face positioning groove edge flexible line base plate position width of being qualified for the next round of competitions of atress strain deformation portion, and broad one end sets up a plurality of pins, is connected with the interface that external device corresponds, its upper surface that does not set up the other end of pin with atress strain deformation portion joints.
The length 4116 of the flexible circuit substrate is set to be 50.0mm or more and 150.0mm or less.
The width 4223 of the flexible circuit board is set to be not less than 5mm and not more than 10 mm.
The flexible circuit substrate has a special-shaped structure, the front part is thin, the rear part is wide, and the angles of edge lead angles 4113 and 4114 at the position of width change are set to 135 degrees.
The front end of the flexible circuit board is designed as a printed resistance type strain detecting member region, and the widths 4105, 4112 are set to 0.5mm or more and 7.0mm or less. The smaller size makes the module compact, which helps to achieve module miniaturization of the pointing device.
The front end of the flexible circuit substrate is tightly attached in the attaching surface positioning groove of the stress strain deformation part, and the positioning hole interval 4102 is consistent with the positioning column size of the stress strain deformation part. The design mode can ensure that the installation angle of the pointing device is accurate, the stress is uniform, and the detection precision can be improved.
The flexible circuit substrate is connected with the interface corresponding to the external device through a plurality of pins, and the flexible circuit substrate is convenient and fast to assemble with proper length and width, so that the reliability of the product is ensured.
A plurality of a plurality of pins extend along the axial direction with the flexible circuit substrate to stretch out the edge of the broad one end of flexible circuit substrate, and the interface connection corresponding with external device is convenient for to this kind of setting. The inner portion of the pin is constrained within the flexible circuit substrate.
As shown in fig. 14, the pointing device based on the resistive strain gauge sensing method according to the present invention is schematically disassembled in the arrangement of parts before mounting. The sequence from top to bottom is: the flexible circuit board 41 includes a screw 30, a stress strain deformation part 10, an adhesive layer 50 (which may be a silicone adhesive or a double-sided sheet adhesive) with high stress conductivity, and a rigid support base 21.
As shown in fig. 15, the pointing device based on the resistive strain gauge sensing method according to the present application has a cross-sectional view after stacking the structures after the installation. Wherein, the arrangement is from top to bottom: the flexible circuit board comprises a stress strain deformation part 10, an adhesive bonding layer 50 (which can be silica gel glue or sheet double-sided adhesive), a flexible circuit board 41, a resistance type strain detection part 71, a gap layer space 61 between the resistance type strain detection part and the rigid support base 21 (the gap layer space 61 can ensure that the resistance type strain detection part arranged on the flexible circuit board does not contact with the rigid support base, due to the metal material of the rigid support base, the resistance type strain detection part does not contact with the rigid support base made of the metal material, no misoperation signal can be generated, and the height of the gap layer space is only required to ensure that the gap layer space does not contact, so the application does not limit the structure) and the rigid support base 21.
As shown in fig. 15, the pointing device of the present application, which is a resistive strain gauge sensing type, includes: the flexible circuit board comprises a flexible circuit board 41, a stress strain deformation part 10, a plurality of screws and a rigid support base 21, wherein the flexible circuit board 41 is provided with a plurality of resistance type detection strain parts 71, and the bottom of the stress strain deformation part 21 is provided with a binding surface positioning groove structure; the force-receiving strain deformation portion 212150 is a cylindrical boss structure, the force-receiving strain deformation portion 10 is bonded to the flexible circuit substrate 41 through an adhesive layer, the force-receiving strain deformation portion 10 with the flexible circuit substrate 41 is bonded to the rigid support base 21 through a plurality of screws, and a gap layer space 61 is formed between the resistance-type strain detection portion 71 and the rigid support base 21.
The stress strain deformation part is made of modified polyphenylene ether (MPPE) which is formed by blending polyphenylene ether and polystyrene into a material with the heat deformation temperature of 90-175 ℃, small dielectric constant and dielectric loss tangent value and good water resistance and heat resistance. MPPE has low melt viscosity, is easy to be injected and molded during processing, is not easy to generate stress cracking phenomenon after molding, has good water resistance and heat resistance and low price, is very suitable to be used as a component of the stress strain deformation part for long-time contact pressure operation, and is very suitable for large-scale commercial application.
As will be appreciated by one skilled in the art, embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present application is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the application. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
It should be noted that all the embodiments in the present application are described in a related manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, as for the apparatus embodiment, since it is substantially similar to the method embodiment, the description is relatively simple, and for the relevant points, reference may be made to the partial description of the method embodiment.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in the process, method, article, or apparatus that comprises the element.
The above are merely examples of the present application and are not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims (10)
1. A pointing device based on a resistance type strain gauge sensing mode is characterized by comprising: the flexible circuit substrate is provided with a plurality of resistance type detection strain parts, and the bottom of the stress strain deformation part is provided with a binding surface positioning groove structure; the stress strain deformation part is of a cylindrical boss type structure, the stress strain deformation part is jointed with the flexible circuit substrate through the adhesive jointing layer, the stress strain deformation part with the flexible circuit substrate is jointed with the rigid support base through a plurality of screws, and a clearance layer space is formed between the resistance type detection strain part and the rigid support base.
2. The apparatus of claim 1, further comprising: the number of the resistance-type detection strain parts is not less than 3, and the not less than 3 resistance-type detection strain parts are orderly arranged on the flexible circuit substrate, wherein the arranged surface is the opposite surface of the joint surface of the flexible circuit substrate and the stress strain deformation part; the resistance type strain detection part is arranged on the flexible circuit substrate in a Printing mode or a Coating mode.
3. The apparatus of claim 2, further comprising: the stress strain deformation part is of a cylindrical boss structure, the binding surface positioning groove structure is arranged at the bottom of a cylinder of the stress strain deformation part, the boss is arranged at the center of the cylinder, and the boss is in a cube shape; wherein, the middle part of the boss is also provided with a hollow structure hole; the hollow structure hole is a cylindrical hollow structure hole.
4. The apparatus of claim 2, further comprising: the stress strain deformation part is connected with the rigid support base through a plurality of screws penetrating through the corresponding through holes.
5. The apparatus of claim 2, further comprising: the shape of the binding face positioning groove of the stress strain deformation part is adapted to the shape of the binding face of the flexible circuit substrate, the binding face of the flexible circuit substrate is provided with a positioning hole, and the binding face positioning groove of the stress strain deformation part is correspondingly provided with a positioning column matched with the positioning hole.
6. The apparatus of claim 5, comprising: further comprising: the number of the positioning columns is at least 2, and the positioning columns are uniformly arranged in the binding face positioning groove of the stress strain deformation part.
7. The apparatus of claim 6, further comprising: the adhesive bonding layer is an adhesive with high stress conductivity, and is a sheet type double-sided adhesive with high stress conductivity.
8. The apparatus of claim 7, further comprising: the shape of the sheet type double-faced adhesive tape is matched with the shape of the binding face positioning groove of the stress strain deformation part, and the sheet type double-faced adhesive tape is provided with a positioning hole matched with the positioning column.
9. The apparatus of claim 6, further comprising: the flexible circuit substrate is in a strip-shaped special-shaped structure, the special-shaped structure is arranged to be wide at two ends and connected with the middle through narrow wiring, a plurality of pins are arranged at one wide end and connected with an interface corresponding to an external device, and the upper surface of the other end, which is not provided with the pins, is jointed with the stress strain deformation part.
10. The apparatus of claim 6, further comprising: the stress strain deformation part is a modified polyphenylene ether material which is formed by blending polyphenylene ether and polystyrene and has a heat deformation temperature of 90-175 ℃, a small dielectric constant and a small dielectric loss tangent value, and good water resistance and heat resistance.
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| CN201922114028.9U CN211123997U (en) | 2019-11-29 | 2019-11-29 | Pointing device based on resistance type strain gauge sensing mode |
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| CN201922114028.9U CN211123997U (en) | 2019-11-29 | 2019-11-29 | Pointing device based on resistance type strain gauge sensing mode |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021104331A1 (en) * | 2019-11-29 | 2021-06-03 | 深圳市汇创达科技股份有限公司 | Method for providing pointing device |
| WO2021104329A1 (en) * | 2019-11-29 | 2021-06-03 | 深圳市汇创达科技股份有限公司 | Setting method of pointing device based on resistance type strain gauge sensing manner |
| WO2021104328A1 (en) * | 2019-11-29 | 2021-06-03 | 深圳市汇创达科技股份有限公司 | Method for manufacturing pointing device |
| CN114994891A (en) * | 2022-06-10 | 2022-09-02 | 昆明北方红外技术股份有限公司 | Method for assembling reflecting mirror assembly of reflection type optical imaging system |
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2019
- 2019-11-29 CN CN201922114028.9U patent/CN211123997U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021104331A1 (en) * | 2019-11-29 | 2021-06-03 | 深圳市汇创达科技股份有限公司 | Method for providing pointing device |
| WO2021104329A1 (en) * | 2019-11-29 | 2021-06-03 | 深圳市汇创达科技股份有限公司 | Setting method of pointing device based on resistance type strain gauge sensing manner |
| WO2021104328A1 (en) * | 2019-11-29 | 2021-06-03 | 深圳市汇创达科技股份有限公司 | Method for manufacturing pointing device |
| CN114994891A (en) * | 2022-06-10 | 2022-09-02 | 昆明北方红外技术股份有限公司 | Method for assembling reflecting mirror assembly of reflection type optical imaging system |
| CN114994891B (en) * | 2022-06-10 | 2023-07-25 | 昆明北方红外技术股份有限公司 | Method for assembling reflecting mirror assembly of reflecting optical imaging system |
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