WO2021104329A1

WO2021104329A1 - Setting method of pointing device based on resistance type strain gauge sensing manner

Info

Publication number: WO2021104329A1
Application number: PCT/CN2020/131569
Authority: WO
Inventors: 林懋瑜; 许文龙; 李明; 付红兵
Original assignee: 深圳市汇创达科技股份有限公司
Priority date: 2019-11-29
Filing date: 2020-11-25
Publication date: 2021-06-03
Also published as: CN112068723B; CN112068723A

Abstract

A setting method of a pointing device based on a resistance type strain gauge sensing manner, and the method comprises: arranging a plurality of resistance type detection strain parts (71) on a flexible circuit substrate (41), and arranging a binding face positioning groove (11) structure at the bottom of a stress strain deformation part (10); enabling the stress strain deformation part (10) and the flexible circuit substrate (41) to be jointed in a pressure-maintaining jig manner; and enabling the stress strain deformation part (10) to be jointed with a rigid support base (21) by means of a plurality of screws (30). The invention solves the problems that in an existing pointing device manufacturing process, an embedding manner is adopted, such that characteristics of all parts before and after embedding possibly change, the number of detection procedures is great, and follow-up adjustment cannot be carried out; meanwhile, due to the embedding manner, the number of process steps is great, calibration action is difficult to continue after assembly, cost is high, and product application and popularization are not facilitated; and a current conventional stress sensor needs a large number of assemblies, is complex in structure and large in size, and cannot be miniaturized, such that the use of an application environment is influenced, the assembly efficiency is reduced, and the cost is increased.

Description

Setting method of pointing device based on resistive strain gauge sensing method

Technical field

The invention relates to the technical field of resistance strain gauge sensors, in particular to a method for setting a pointing device based on a resistance strain gauge sensing method.

Background technique

At present, resistive strain gauge sensors have been gradually applied to various electronic devices as pointing devices, involving electronic devices such as notebook computers, mice, keyboards, handheld devices or joysticks. You can see the resistive strain gauge sensors in The above-mentioned electronic device can provide an application with an input function. A resistance strain gauge sensor is often installed between the keyboard keys of a common notebook computer near the center. The user only needs to touch the sensor with a finger, and it can sense the user's dial force and dial force. The direction of movement, which in turn causes the cursor on the screen to produce corresponding speed and displacement actions.

The existing resistive strain gauge sensor mainly includes: a housing, an action part housed in the shell, and a detection assembly that detects the deformation of the action part. The action part is formed by an operation part, a fixing part and a deformation part. , And the deforming portion is deformable due to the operating force acting on the operating portion, and the detecting assembly is provided on the deforming portion, the fixing portion is fixed in the housing, and the operating portion and the deforming portion can be Activities in the above shell. The action part of the input device is fixed inside the housing, and the housing is mounted on the board of the keyboard device or the like. Therefore, when the operating force acts on the operating portion of the action portion and deformation is applied to the deformed portion, the housing is unlikely to fall off the substrate or the like.

The design of this type of resistance strain gauge sensor is mainly to combine the deformed part with the detection component in a fitting manner or to directly set the detection component on the deformed part, and to connect the deformed part and the fixed part by fitting. However, the mating method may cause changes in the characteristics of each part before and after mating, and there are many inspection procedures and subsequent adjustments cannot be made; due to the simultaneous occurrence of multiple quality variables during mating, including inconsistent forces on the deformed part, the mating process The micro-deformation caused by the detection component and the deformation part and the interaction between the deformation part and the fixed part during the mating process; due to the processing characteristics of the mating method, the processing steps are too many, it is difficult to continue the calibration after the assembly, and the cost is high It is not conducive to product application and promotion; and this type of sensor requires extremely high production equipment and has a large number of detection and fine-tuning procedures for detection components, resulting in product discreteness or increased processing costs; and current conventional stress sensors require a large number of components and have complex structures. It is large in size and cannot be miniaturized, thereby affecting the use of the application environment, reducing assembly efficiency and increasing costs.

Therefore, a new technical solution for a pointing device based on a resistive strain gauge sensing method is currently needed to solve the above-mentioned problems.

Summary of the invention

The main purpose of this application is to provide a method for setting up a pointing device based on the resistance-type strain gauge sensing method, which solves the problem of the current manufacturing process of the pointing device, which causes each part to be fitted before and after the fitting method is used. The characteristics may change, the detection process is too many and subsequent adjustments cannot be made; and multiple quality variables appear at the same time during the mating, including the inconsistent force of the deformed part, the micro deformation caused by the mating process, and the mutual interaction between each part during the mating process. At the same time, the processing characteristics of the mosaic method lead to many processing steps, and it is difficult to perform calibration after assembly. The high cost is not conducive to product application and promotion; and this type of sensor has extremely high requirements for production equipment and has a large number of inspections and inspections. The fine-tuning process of the components leads to product discreteness or increased processing costs; and the current conventional stress sensors require a large number of components, which are complex in structure, large in size, and unable to be miniaturized, which affects the use of the application environment, reduces assembly efficiency and increases costs. problem.

In order to solve the above-mentioned problems, the present application provides a method for setting a pointing device based on a resistive strain gauge sensing method, which includes: a flexible circuit substrate is provided with a multi-piece resistive strain detection section, and the bottom of the stressed strain deformation section is provided with a bonding Surface positioning groove structure;

Join the strain-bearing deformation part provided with the positioning groove structure of the bonding surface and the flexible circuit substrate provided with the resistance-type strain detection part through an adhesive bonding layer with high stress conductivity;

During the curing process of bonding the force-strained deformation part with the positioning groove structure of the bonding surface and the flexible circuit board equipped with the resistance-type strain detection part, the pressure-holding jig is used to connect the force-strained deformation part to the flexible circuit board. The flexible circuit substrate is bonded and cured, wherein the temperature is set to be greater than or equal to 20 degrees Celsius and less than or equal to 30 degrees Celsius, the relative humidity is set to be greater than or equal to 30% and less than or equal to 70%, and the curing pressure holding force is set to 5.0 Newtons or more, and the pressure holding time is not less than 5 minutes;

After bonding and curing the flexible circuit board with the resistive strain detection part, the stressed strain deformation part is connected to the rigid support base with a plurality of screws, and a torque of 20cN·m is preset for each screw ,Fix the strain-bearing deformation part on the rigid support base, and make the strain-bearing deformation part produce a preset amount of deformation; collect the sampling data of each piece of resistive detection strain part, according to the different sampling of each resistive detection strain part Data, screw in or unscrew the screw at the corresponding position of the resistive sensing strain part, so that the sampling data value of each resistive sensing strain part is controlled between 2000 ohms and 3200 ohms to complete the pointing device Setup process.

Compared with the prior art, using the present invention, the stress-strained deformation portion provided with the positioning groove structure of the bonding surface is bonded and solidified with the flexible circuit substrate through the bondable bonding layer with high stress conductivity. , And the through holes provided on the strain-bearing deformation part are joined with the rigid support base through a plurality of screws, which avoids the shortcomings of the previous fitting process, reduces the process, reduces the discreteness of the product, and reduces the number of parts As well as the overall volume, the pointing device can be miniaturized and can be applied in various scenarios; the components are stable after being joined, which improves production efficiency and reduces processing costs.

Brief description of the drawings

FIG. 1 is a schematic flowchart of a specific implementation manner of a method for setting a pointing device according to an embodiment of the application;

2 is a schematic structural diagram of a flexible circuit substrate provided with the resistive strain detection section provided by an embodiment of the application;

3 and 4 are schematic structural diagrams of the upright and inverted settings of the force-strained deformation portion provided by the embodiments of the application;

5, 6 and 7 are schematic diagrams of the front cross-section, side cross-section, and bottom cross-section of the force-strained deformation part provided by the embodiments of the application;

FIG. 8 is a schematic diagram of a rigid support base provided by an embodiment of the application;

9 and 10 are schematic diagrams of screws provided by embodiments of the application;

FIG. 11 is a schematic diagram of the structure of a flexible circuit substrate provided by an embodiment of the application;

12 and 13 are schematic diagrams of a front cross section and a bottom cross section of a flexible circuit substrate provided by an embodiment of the application;

14 is a schematic diagram of disassembling the component arrangement before installation of the pointing device based on the resistance strain gauge sensing method provided by the embodiment of the application;

15 is a schematic cross-sectional view of the superimposed structure of the pointing device based on the resistance strain gauge sensing method provided by the embodiment of the application after the installation is completed.

Preferred embodiment of the present invention

The present invention will be further described below in conjunction with the drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of this application.

Fig. 1 is a method for setting a pointing device based on a resistive strain gauge sensing method provided by an exemplary embodiment, including the following steps:

Step 110: The flexible circuit substrate is provided with a multi-piece resistance-type strain detection part, and a bonding surface positioning groove structure is provided at the bottom of the stressed strain deformation part;

As shown in FIG. 2, it also includes: setting the resistive detection strain parts 71 to no less than 3, and no less than 3 resistive detection strain parts 71 are arranged in an orderly manner according to the sensor acquisition rule algorithm. On the flexible circuit substrate 41, the surface provided is the opposite surface of the joint surface of the flexible circuit substrate and the strained and deformed portion. When a force is applied to the strain deformation part, the force is transmitted to the flexible circuit substrate, and the multiple resistive detection strain parts on the flexible circuit substrate will obtain feedback signals by collecting the changes in resistance value accordingly, and arrange them in an orderly manner. The multiple resistive detection strain parts collect the deformation amount of the force strain deformation part through resistive changes. Such a setting will improve the accuracy of the collection and increase the response speed, bringing a better user experience. In this application, the number of resistive detection strain parts is required to be no less than 3, which will greatly improve the accuracy and response speed of collection. In Figure 2 there are 4 resistance detection strain parts, but the set resistance detection strain parts The location and specific number of the, this application does not limit it.

The resistive strain detection part is arranged on the flexible circuit substrate by a printing method or a coating method. The above method can ensure that the resistive sensing strain part is set on the flexible circuit substrate without greatly increasing the thickness of the flexible circuit substrate. The above-mentioned technology is mature and low in cost, which greatly improves the yield of the product and is very suitable for large-scale commercial applications. .

Wherein, a bonding surface positioning groove structure is provided at the bottom of the force-strained deformation part; the force-straining deformation part provided with the bonding surface positioning groove structure is joined to the flexible circuit substrate provided with the resistive strain detection part, Bonded together by an adhesive layer with high stress conductivity;

As shown in Figures 3 and 4, it further includes: the force-strained deformation portion 10 is configured as a cylindrical convex table structure, and the bonding surface positioning groove 11 structure is provided at the bottom of the cylinder of the force-strained deformation portion, and the convex The platform is set at the center of the cylinder, and the boss can be a cube shape, of course, it can also be an approximate cube shape, for example: each corner is set to a cube in the form of radians, which is not limited in this application.

It also includes: the middle of the boss is also provided with a hollow structure hole 14 (the hollow structure can reduce the rigidity of the strained and deformed part, bring better contact pressure effect, and can improve the accuracy of control, and improve the user's Use experience; and due to the hollow structure, when a force is applied to the force-strained deformed part, the force will be dispersed to each part of the boss of the force-strained deformed part, the force-strained deformed part is not easy to fatigue, and can reduce the stress. The probability that the force-strain deformed part will be damaged); the hollow structure hole is a cylindrical hollow structure hole.

As shown in Figs. 3 and 4, it further includes: a plurality of through holes 13 (the through holes are used to install the through holes of the assembly screw) are arranged on the cylinder of the force-strained deformation part, and the plurality of through holes 13 are evenly arranged On the cylinder (which can ensure the uniform stress of the assembled screws after installation), the stressed strain deformation portion is joined with the rigid support base through a plurality of screws passing through the corresponding through holes. There are four through holes on the cylinder where the force-strained deformation portion is provided, and this application does not make any limitation on this. The four through holes are evenly arranged on the cylinder, and the connecting line of any two through-holes opposite to each other is formed Two intersecting lines, the four included angles formed by the intersecting lines are all right angles, and the intersection point of the two intersecting lines is on the axis of the cylinder. Such a setting method can ensure uniform stress on the assembled screws after installation.

As shown in Fig. 5, Fig. 6 and Fig. 7, the diameter of the cross section of the cylinder of the force-strained deformation portion is set to be greater than or equal to 7.0 mm and less than or equal to 25.0 mm.

The four through holes 1404 set on the stress and strain deformation part can use M1.8P0.2 screws. The four through holes correspond to the

horizontal spacing

1401, 1402, 1406, and 1407 to be set to be greater than or equal to 1.2mm and less than or equal to 10.0mm. It is convenient for the joint operation of the stressed and strained deformation part; the stressed columnar structure 1403 in the stressed and strained deformation part is set to a single side length greater than or equal to 1.2mm and less than or equal to 5.0mm; the stressed columnar structure in the stressed and strained deformation part Hollow structure aperture 1409 is set to a diameter greater than or equal to 0.2mm and less than or equal to 4.0mm; the edge R angles 1411 and 1412 of the hollow structure in the force-bearing strain deformation part are set to be greater than or equal to 0.02mm and less than or equal to 2.20mm; The depth of the hollow structure of the stressed columnar structure in the strain-deformed part is set to 1413 greater than or equal to 0.3 mm and less than or equal to 8.2 mm.

The size and shape of the locating groove on the bonding surface provided on the bottom surface of the force-strained deformation part are composed of 1414, 1415, 1416, 1417, 1418, 1419, 1421, 1422, and 1423 in Figure 7. The size of the locating groove on the bonding surface Compatible with the shape and size of the flexible circuit board, the depth of the positioning groove on the bonding surface is set to be greater than or equal to 0.02mm and less than or equal to 4.20mm. This depth can ensure that the narrow end of the flexible circuit board is placed on the receiving surface. The force-strain deformation part is easy to process and easy to assemble, which can reduce assembly errors and improve production efficiency.

The above-mentioned setting method is easy to process and convenient for assembly, which can reduce assembly errors and improve production efficiency.

Step 120: Through the adhesive layer with high stress conductivity, the stress and strain deformation part provided with the positioning groove structure of the bonding surface and the flexible circuit substrate provided with the resistive strain detection part are joined into one body;

As shown in FIG. 4, it further includes: setting the shape of the positioning groove of the bonding surface of the force-strained deformation portion to be adapted to the shape of the bonding surface of the flexible circuit substrate, and positioning holes are provided on the bonding surface of the flexible circuit substrate , The positioning groove 11 of the bonding surface of the force-strained deformation portion is correspondingly provided with a positioning column 12 that matches with the positioning hole.

It also includes: arranging at least two positioning pillars, and arranging a plurality of positioning pillars evenly arranged in the positioning groove 11 of the fitting surface of the force-strained deformation portion.

When the bottom surface of the deformed portion under stress and strain is joined to the flexible circuit substrate, it can be positioned by using two positioning posts. The positioning posts can easily set the flexible circuit substrate in the positioning groove of the bonding surface of the deformed part under stress and strain. Perform the bonding between the strain-deformed part and the flexible circuit board. The size of the positioning column is set to a diameter greater than or equal to 0.3 mm and less than or equal to 5.0 mm. In actual operation, the aforementioned size is convenient for positioning with the base and positioning of the flexible circuit board.

Step 130. During the curing process of bonding the stressed strain deformation part provided with the bonding surface positioning groove structure and the flexible circuit substrate provided with the resistive strain detection part, the stressed strain is reduced by a pressure holding jig. The deformed part and the flexible circuit board are bonded and cured, wherein the temperature is set to be greater than or equal to 20 degrees Celsius and less than or equal to 30 degrees Celsius, and the relative humidity is set to be greater than or equal to 30% and less than or equal to 70%, and the curing pressure is maintained. Set to be greater than or equal to 5.0 Newtons, and the pressure holding time is not less than 5 minutes;

In actual tests, the material of the bondable layer with high stress conductivity can be a high-density, high-hardness, and high-modulus bonding material (for example: it can be a material with a stress conductivity of at least more than 2 Pa). Ensure that when the force is applied to the strain-deformed part, the force applied by the adhesive layer with high stress conductivity is transmitted to the flexible circuit board and the sensor on the flexible circuit board while reducing the loss as much as possible. Correspondingly, the feedback signal is obtained by collecting the change of the resistance value, and the sensor that collects the deformation amount through the resistance change has high accuracy and fast response speed, which brings a better user experience.

Wherein, the bonding of the stress and strain deformation portion provided with the bonding surface positioning groove structure and the flexible circuit substrate is a step of bonding the two together through an adhesive bonding layer with high stress conductivity, including: The stress and strain deformation part with the structure of the bonding surface positioning groove and the flexible circuit substrate are joined by a glue with high stress conductivity and a dispensing method (for example, using VISHAY's M-bond 200kit quick-drying glue for dispensing, This is a quick-drying glue based on silica gel), or a sheet-type double-sided tape with high stress conductivity to join the two together.

The step of joining the stress and strain deformation part with the positioning groove structure on the bonding surface and the flexible circuit substrate is through a sheet-type double-sided tape with high stress conductivity, and the step of joining the two together includes: setting The shape of the sheet-type double-sided tape is compatible with the shape of the positioning groove on the bonding surface of the force-strained deformation portion, and the sheet-type double-sided tape is provided with positioning that matches the positioning column hole.

Through the positioning holes of the sheet-type double-sided tape, the flexible circuit substrate can be conveniently arranged in the positioning groove of the bonding surface of the force-strained deformation part, and the force-strained deformation part and the flexible circuit substrate can be joined.

Further, during the curing process of bonding the stressed and strained portion with the positioning groove structure of the bonding surface to the flexible circuit board, the stressed and strained portion and the flexible circuit board are bonded by means of a pressure holding jig. Combined curing operation, where the temperature is set to be greater than or equal to 20 degrees Celsius and less than or equal to 30 degrees Celsius, the relative humidity is set to be greater than or equal to 30% and less than or equal to 70%, and the curing pressure holding force is set to be greater than or equal to 5.0 Newtons, The pressure holding time is not less than 5 minutes;

The bonding and curing operation through the pressure holding fixture set above can ensure that the contact surface of the two is even and flat, and there will be no bubbles, warping and degumming, which greatly improves the yield of products.

In practice, the holding pressure parameters and curing time during dispensing are different according to the glue or film used. Take VISHAY's M-bond 200kit quick-drying glue as an example, in a working environment at a temperature of 20 degrees Celsius to 30 degrees Celsius When the relative humidity ranges from 30% to 70%, use 5.0 Newtons as the curing pressure holding force, and hold the pressure for 5 minutes to complete the curing step. When other bonding materials are used, the holding time and curing conditions can be slightly adjusted according to the characteristics of individual materials, but the curing holding force is set to be greater than or equal to 5.0 Newtons, and the holding time is not less than 5 minutes. , This can ensure the effect of bonding and curing, and ensure that the contact surface of the flexible circuit substrate and the stress and strain deformation part is even and flat, without bubbles, warping and degumming; use a creeping glue dispenser or The sheet-type double-sided tape in the form of a sheet is the bonding layer. The process of setting the bonding layer can be implemented on the back of the flexible circuit substrate, and then it is bonded with the positioning groove area of the bonding surface provided by the stress and strain deformation part, or The bonding layer setting process is implemented on the plane of the positioning groove area of the bonding surface provided in the strained and deformed part, and then bonded with the back of the flexible circuit board. These setting processes can realize the bonding of the flexible circuit board and the strained and strained part. Operation, this application does not make any restrictions on this.

Step 140. Put the strain-bearing deformation part after the bonding and curing operation with the flexible circuit substrate provided with the resistance-type detection strain part through a plurality of screws and the rigid support base. In the process of joining each screw with 20cN· m torsion force, fix the strain-bearing deformation part on the rigid support base, and make the strain-bearing deformation part produce a preset amount of deformation; collect the sampling data of each piece of resistive detection strain part, and detect the strain part according to each resistance type For different sampling data, screw in or unscrew the screw at the corresponding position of the resistive sensing strain part, so that the sampled data value of each resistive sensing strain part is controlled between 2000 ohms and 3200 ohms. The setup process of the pointing device.

The rigid support base can be made of metal materials. In practice, 304 stainless steel can be used. This material has strong adaptability to the environment, good resistance to water and humidity, good heat dissipation, low cost, high strength, and convenient processing, which is very suitable for large-scale commerce. Application; Of course, materials such as copper and aluminum can also be used for this application, which is not limited in this application.

As shown in Figure 8, the distance 2102 between the centers of the two positioning holes used in the assembly of the rigid support base and the finished product can be set to be greater than or equal to 8.0mm and less than or equal to 30.0mm; the aperture 2108 can be set to be greater than or equal to 0.3mm and less than or equal to 5.0mm , The above settings are convenient for assembling products.

The two positioning holes 2107 of the rigid support base can be assembled with M1.8P0.2 screws to facilitate accurate assembly on the product.

When the rigid support base is connected to the strain-bearing deformation part, the diameter of the two positioning holes 2109 can be set to be greater than or equal to 0.2mm and less than or equal to 5.0mm; this is convenient for positioning and installation.

When the rigid support base and the strain deformation part are connected by screws, use four screw holes 2104, and use M1.8P0.2 screws (M is the outer diameter of the thread is 1.8mm, P: generally refers to the pitch of the thread is 0.2mm ), the above settings facilitate precise assembly of products.

As shown in Fig. 9 and Fig. 10, for the screw connecting the rigid support base and the strain-bearing deformation part, the cross structure size 3001 in the screw can be set to be greater than or equal to 0.9mm and less than or equal to 3.2mm. The size 3002 of the top of the inclined surface of the screw-thread engagement surface can be set to be greater than or equal to 0.8 mm and less than or equal to 3.2 mm. The size of the screw nut diameter 3003 can be set to be greater than or equal to 1.2mm and less than or equal to 5.0mm. In the example, the screw thread 3004 design specification M1.0P0.2 fine pitch screw. The thickness of the screw nut 3005 can be set to be less than or equal to 1.5mm and greater than or equal to 0.2mm, and the length of the screw thread 3006 can be set to be less than or equal to 5.2mm and greater than or equal to 1.0mm. The length of the force-strained deformation part 3007 beyond the screw nut can be set to be greater than or equal to 0.8mm and less than or equal to 10.0mm. This screw design is easy to install, can reduce assembly errors and improve production efficiency.

The center of the positioning hole used when the rigid support base is assembled for the finished product assembly is connected with the force-strained deformation structure. The spacing of the four screw holes 2105 can be set to be greater than or equal to 0.8mm and less than or equal to 18.0mm; the above settings facilitate accurate assembly of products

When the rigid support base is used in the assembly of the finished product, the center of the positioning hole and the force-strained deformation structure are used to connect the four screw holes. The spacing 2106 can be set to be greater than or equal to 1.8mm and less than or equal to 20.0mm; the above setting facilitates accurate assembly of products.

The above-mentioned design method can make the processing easy and convenient to install, at the same time reduce the assembly error, improve the accuracy of the product, and bring a good user experience.

Wherein, the step of collecting sampling data of each piece of resistively detecting strain part includes: connecting the signal contacts of each resistive detecting strain part of the flexible circuit substrate with a testing device, and collecting samples of each piece of resistive detecting strain part data.

As shown in FIGS. 11, 12, and 13, the method further includes: setting the flexible circuit substrate 41 to a strip-shaped special-shaped structure, which has a width and a length, and setting the flexible circuit substrate to have a long shape Strip-shaped special-shaped structure, which is set to have wider ends and narrower traces in the middle to reduce the width of the flexible circuit substrate outlet position on the bonding surface of the stress and strain deformation part, and the wider end is set A plurality of pins are connected to the corresponding interfaces of the external device, and the upper surface of the other end of the pin not provided with the pins is connected with the stress and strain deformation part.

The length 4116 of the flexible circuit board is set to be greater than or equal to 50.0 mm and less than or equal to 150.0 mm.

The width 4223 of the flexible circuit board is set to be greater than or equal to 5 mm and less than or equal to 10 mm.

The flexible circuit board is a special-shaped structure, with a thin front and a wide rear, and the angles of the edge chamfers 4113 and 4114 at the change in width are set to 135 degrees.

The front end of the flexible circuit substrate is designed as a printed resistance-type strain detection area, and its

widths

4105 and 4112 are set to be greater than or equal to 0.5 mm and less than or equal to 7.0 mm. The smaller size can make the module structure compact, which helps to realize the miniaturization of the module of the pointing device.

The front end of the flexible circuit board closely fits in the positioning groove of the bonding surface of the force-strained deformation part, and the positioning hole spacing 4102 is consistent with the size of the positioning post of the force-strained deformation part. This design method can ensure that the installation angle of the pointing device is accurate, the force is uniform, and the detection accuracy can be improved.

The flexible circuit board is connected to the corresponding interface of the external device through a plurality of pins, and the appropriate length and width are convenient for quick assembly and ensure the reliability of the product.

The plurality of pins extend along the axis direction of the flexible circuit substrate and extend out of the edge of the wider end of the flexible circuit substrate. This arrangement facilitates the connection with the corresponding interface of the external device. The inner part of the pin is constrained inside the flexible circuit substrate.

As shown in FIG. 14, the disassembly schematic diagram of the component arrangement before installation of the pointing device based on the resistance strain gauge sensing method of the present application. The order from top to bottom is: screw 30, strain-deformed portion 10, highly conductive adhesive layer 50 (can be silicone glue or sheet double-sided tape), flexible circuit board 41, and rigid Support base 21.

As shown in FIG. 15, a cross-sectional schematic diagram of the superimposed structure of the pointing device based on the resistance strain gauge sensing method of the present application after the installation is completed. Among them, the arrangement from top to next is: strain deformation part 10, high stress conductive adhesive layer 50 (can be silicone glue or sheet double-sided tape), flexible circuit substrate 41, resistive type Detecting strain part 71, the gap layer space 61 between the resistance type detecting strain part and the rigid support base (the gap layer space 61 can ensure that the resistance type detecting strain part provided on the flexible circuit board does not contact the rigid support base; due to the rigid support The base is made of metal material, the resistive sensing strain part is not connected to the rigid support base made of metal material, and will not generate misoperation signals, and the height of the gap layer space only needs to ensure that there is no contact, which is not limited in this application) and rigid support Base 21.

The stress strain deformation part is modified by blending polyphenylene ether and polystyrene to a heat distortion temperature of 90°C to 175°C, a small dielectric constant and a dielectric loss tangent value, and good water resistance and heat resistance. Made of polyphenylene ether (MPPE) material. MPPE has low melt viscosity, easy injection molding during processing, and less stress cracking after molding. It has good water resistance and heat resistance and is not expensive. It is very suitable for the long-term stress and strain deformation part of this application. Components for contact pressure operation are very suitable for large-scale commercial applications.

The above are only the preferred specific embodiments of the present invention, but the protection scope of the present invention is not limited to this. Anyone familiar with the technology can easily think of changes or substitutions within the technical scope disclosed in the present invention. , Should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Industrial applicability

Through the above-mentioned structure, the adhesive layer with high stress conductivity connects the strained and deformed part provided with the positioning groove structure of the fitting surface to the flexible circuit board after being glued and solidified, and deforms under stress and strain. The through hole provided on the part is joined with the rigid support base through a plurality of screws, which avoids the shortcomings of the previous fitting process, reduces the process, reduces the discreteness of the product, reduces the number of parts and the overall volume, and makes the direction The device is miniaturized and can be applied in various scenarios; at the same time, the components are stable after being joined, which improves production efficiency and reduces processing costs, and has strong practicability.

Claims

A method for setting a pointing device based on a resistive strain gauge sensing method, which is characterized in that it includes:

The flexible circuit substrate is provided with a multi-piece resistance-type strain detection part, and a bonding surface positioning groove structure is provided at the bottom of the strain-bearing deformation part;

Through the adhesive layer with high stress conductivity, the stress and strain deformation part provided with the positioning groove structure of the bonding surface and the flexible circuit substrate provided with the resistive strain detection part are joined into one body;

During the curing process of bonding the force-strained deformation part with the positioning groove structure of the bonding surface and the flexible circuit board equipped with the resistance-type strain detection part, the pressure-holding jig is used to connect the force-strained deformation part to the flexible circuit board. The flexible circuit substrate is bonded and cured, wherein the temperature is set to be greater than or equal to 20 degrees Celsius and less than or equal to 30 degrees Celsius, the relative humidity is set to be greater than or equal to 30% and less than or equal to 70%, and the curing pressure holding force is set to 5.0 Newtons or more, and the pressure holding time is not less than 5 minutes;

After bonding and curing the flexible circuit board with the resistive strain detection part, the stressed strain deformation part is connected to the rigid support base with a plurality of screws, and a torque of 20cN·m is preset for each screw ,Fix the strain-bearing deformation part on the rigid support base, and make the strain-bearing deformation part produce a preset amount of deformation; collect the sampling data of each piece of resistive detection strain part, according to the different sampling of each resistive detection strain part Data, screw in or unscrew the screw at the corresponding position of the resistive sensing strain part, so that the sampling data value of each resistive sensing strain part is controlled between 2000 ohms and 3200 ohms to complete the pointing device Setup process.
The method of claim 1, wherein:

It also includes: setting the resistive detection strain parts to no less than 3, and no less than 3 resistive detection strain parts are arranged on the flexible circuit substrate in an orderly manner according to the sensor acquisition rule algorithm, wherein The surface of is the opposite surface of the joint surface of the flexible circuit substrate and the strained and deformed part; wherein the resistive strain detection part is arranged on the flexible circuit substrate by printing or coating.
The method of claim 2, wherein:

It also includes: the force-strained deformation portion is arranged as a cylindrical convex table structure, the bonding surface positioning groove structure is arranged at the bottom of the cylinder of the force-strained deformation portion, the boss is arranged at the center of the cylinder, and the boss It is a cubic shape; wherein, a hollow structure hole is also provided in the middle of the boss; the hollow structure hole is a cylindrical hollow structure hole.
The method of claim 3, wherein:

It also includes: a plurality of through holes are arranged on the cylinder of the force-strained and deformed part, the plurality of through-holes are evenly arranged on the cylinder, and the force-strained and deformed part passes through the corresponding through-holes through a plurality of screws and is rigid. The support base is joined.
The method of claim 4, wherein:

It also includes: the shape of the positioning groove on the bonding surface of the force-strained deformation portion is adapted to the shape of the bonding surface of the flexible circuit substrate, the bonding surface of the flexible circuit substrate is provided with positioning holes, and the force-strained deformation The locating groove of the fitting surface of the part is correspondingly provided with a locating post matched with the locating hole.
The method of claim 5, wherein:

It also includes: arranging at least two positioning pillars, and arranging a plurality of positioning pillars evenly arranged in the positioning groove of the bonding surface of the force-strained deformation portion.
The method of claim 6, wherein:

The step of joining the stress and strain deformation part provided with the positioning groove structure of the bonding surface and the flexible circuit substrate provided with the resistive strain detection part through the adhesive layer with high stress conductivity, specifically Including: the bonding of the strained deformation part with the locating groove structure of the bonding surface and the flexible circuit substrate with the resistive strain detection part is through the adhesive with high stress conductivity and the dispensing method, or through the stress High-conductivity sheet-type double-sided tape that joins the two together.
The method according to claim 7, wherein:

When the bonding surface is provided with a positioning groove structure, the stress and strain deformation part and the flexible circuit substrate provided with the resistance-type strain detection part are joined by a sheet-type double-sided tape with high stress conductivity to join the two Together, wherein the shape of the sheet-type double-sided tape is adapted to the shape of the positioning groove on the bonding surface of the force-strained deformation portion, and the sheet-type double-sided tape is provided with the positioning column Matching positioning holes.
The method of claim 8, wherein:

It also includes: setting the shape of the flexible circuit substrate to be a long profiled structure, the profiled structure is set to be wider at both ends, the middle is connected by a narrower wiring, and the wider end is provided with a plurality of pins, which are connected to the external The corresponding interface of the device is connected, and the upper surface of the other end of which is not provided with a pin is connected with the stress and strain deformation part.
The method of claim 8, wherein:

The stress strain deformation part is modified by blending polyphenylene ether and polystyrene to a heat distortion temperature of 90°C to 175°C, a small dielectric constant and a dielectric loss tangent value, and good water resistance and heat resistance. Made of polyphenylene ether material.